TW201830750A - Package structure, preparation method thereof and organic electroluminescence device capable of increasing water and oxygen barrier capability of the package structure without increasing the thickness of the package structure - Google Patents

Abstract

The present invention relates to a field of display technology, which discloses a package structure, a preparation method thereof and an organic electroluminescence device. The package structure includes a first substrate and a second substrate disposed opposite to each other; an a body to be packaged which is formed between the first substrate and the second substrate; a package layer which is formed on the first substrate and continuously covers an exposed surface of the body to be packaged; and a desiccant layer which is interposed between the package layer and the second substrate, wherein the desiccant layer is a gel-state desiccant layer. The invention forms a gel state desiccant layer between the encapsulation layer and the second substrate by curing the liquid desiccant, and there is no requirement for the thickness of the desiccant layer, so the water-oxygen barrier capability of the package structure can be increased without increasing the thickness of the package structure.

Description

Packaging structure, preparation method and organic electroluminescence device

The present invention relates to the field of display technology, and in particular, to a packaging structure, a method for manufacturing the same, and an organic electroluminescence device.

Compared with liquid crystal display devices, Organic Light-Emitting Display (OLED for short) has the advantages of self-luminous, fast response, wide viewing angle, high brightness, colorful, thin, etc., and is considered as the next generation display technology.

The organic material of the organic electroluminescent device is very sensitive to water and oxygen. A small amount of water and oxygen will cause oxidation, crystallization, or electrode degradation of the organic material in the display device, affect the life of the display device, or directly cause damage to the display device.

In the prior art, a solid dry sheet is generally attached to a packaging sheet to achieve the purpose of absorbing water and oxygen. As shown in FIG. 1, the organic electroluminescent device includes a substrate 1, an OLED device layer 3 disposed on the substrate 1, and a package cover 2. By making a slot in the package cover 2, a solid dry sheet 5 is attached. In order to ensure the packaging effect of the organic electroluminescence device, there are certain requirements on the thickness of the attached drying sheet 5, that is, there is a minimum thickness limitation on the thickness of the packaging cover 2.

However, in the above technical solution, due to the thickness limitation of the packaging cover plate 2, the thickness of the packaging cover plate 2 cannot be reduced, which further limits the thickness of the organic electroluminescent device, which is not conducive to reducing the thickness and flexibility of the product.

The invention provides a packaging structure and a preparation method thereof, and an organic electroluminescence device, which solves the problem of a large thickness of the organic electroluminescence device.

The packaging structure of the present invention includes: a first substrate and a second substrate opposite to each other; a body to be packaged disposed between the first substrate and the second substrate; a packaging layer formed on the first substrate; And continuously cover the bare surface of the body to be packaged; and a desiccant layer sandwiched between the packaging layer and the second substrate, and the desiccant layer is a gelled desiccant layer.

The manufacturing method of the packaging structure of the present invention includes: providing a first substrate, a body to be packaged is formed on a surface of the first substrate; and forming a continuous packaging layer on the first substrate to cover the exposed surface of the body to be packaged; A packaging ring is provided on the first substrate or the packaging layer to surround the outer peripheral edge of the body to be packaged, so as to form a drying on the packaging layer and the optional first substrate with the packaging ring as a sidewall. Filling the cavity with a desiccant; loading a liquid desiccant into the desiccant filling cavity; pressing the second substrate so that the second substrate seals the desiccant filling cavity to form a closed cavity; and curing the cavity The liquid desiccant is made into a gel desiccant.

The organic electroluminescent device of the present invention includes the aforementioned packaging structure, and the body to be packaged is an organic light emitting array layer.

In an embodiment of the present invention, the viscosity of the gelled desiccant layer of the packaging structure is 50000-800000 mPa · s.

In an embodiment of the present invention, the packaging structure further includes a packaging ring disposed around the outer peripheral edge of the to-be-packaged package, and the packaging ring is disposed on the first substrate or the packaging layer and the second substrate. A closed cavity is enclosed between the two, and the desiccant layer is disposed in the closed cavity.

In an embodiment of the present invention, the desiccant layer of the packaging structure completely fills the closed cavity.

In an embodiment of the present invention, the packaging layer of the packaging structure is an inorganic material layer; or the packaging layer includes at least one inorganic thin film layer, and each of the inorganic thin film layers is independently selected from nitride Silicon film or silicon oxide film.

In an embodiment of the present invention, in the method for preparing a packaging structure, the viscosity of the gel-like desiccant is 50000-800000 mPa · s.

According to an embodiment of the present invention, the organic light emitting array layer includes: a first electrode layer and an isolation pillar disposed on the first electrode layer, and the first electrode layer includes a plurality of first electrode layers disposed in parallel with each other. An electrode bar, wherein the extension direction of the separation column is perpendicular to the extension direction of the first electrode bar; wherein the separation column has an inverted trapezoidal cross section along the extension direction of the first electrode bar, the The acute angle between each side in the cross section and the first electrode layer is 45 ° -70 °.

In an embodiment of the present invention, the first electrode layer further includes a plurality of insulating strips, and the insulating strips are disposed below the isolation pillars in a one-to-one correspondence with the isolation pillars. The first electrode strip is separated into a plurality of sub-first electrodes distributed along an extending direction of the first electrode strip.

Based on the above, the packaging structure and the preparation method thereof and the organic electroluminescent device provided by the present invention have the following advantages:

The package structure provided by the embodiment of the present invention can form a package for the package by forming a package layer for covering the package to be packaged, and avoid the influence of water and oxygen in the cavity formed by the package layer and the second substrate on the package; A method of curing a liquid desiccant is used to form a desiccant layer between the packaging layer and the second substrate for blocking water vapor and oxygen in the external environment and the cavity. There is no requirement for the thickness of the desiccant layer, that is, the package can be increased without increasing. Based on the structure thickness, the water-oxygen barrier capacity of the package structure is increased.

The encapsulation structure provided by the embodiment of the present invention can be relatively uniformly distributed between the encapsulation layer and the second substrate by selecting a gel-like desiccant layer and utilizing a certain ductility of the gel-like desiccant. All parties achieve the same degree of encapsulation to better absorb the external environment and the water vapor and oxygen in the cavity, which can more effectively prevent water and oxygen from invading the body to be encapsulated, and has a simple structure and easy industrial preparation. During the process of being impacted by an external force, the shape can be changed, stress can be released, and it can act as a buffer for the package to be packaged to simplify the process difficulty of subsequent operations and improve the impact resistance of the corresponding product.

In the packaging structure provided by the embodiment of the present invention, a sealing ring is preferably provided as a side wall to form a closed cavity between the packaging layer and the second substrate without etching the sealing layer, which not only simplifies the process but also helps to reduce The thickness of the packaging structure is adapted to the needs of product miniaturization and miniaturization.

In the packaging structure provided by the embodiment of the present invention, preferably, the packaging layer is at least one inorganic thin film layer, that is, the packaging layer is formed by an inorganic material, which is used to isolate water vapor and oxygen, and to prevent external water vapor from affecting the package body.

In the method for preparing an organic electroluminescence device provided by the embodiment of the present invention, a liquid sealant is filled in the sealant filling cavity, and then solidified to form a gel state or a solid sealant, which does not need to etch the encapsulation layer and simplifies the operation steps And operation difficulties, and the liquid sealant has a certain fluidity, can be relatively uniformly distributed in the sealant filling cavity; and during the liquid sealant curing process, with the change of the liquid sealant volume, it can be more complete Filled in the closed cavity to form a better closed environment. It can be seen that the method is beneficial to improve the water-oxygen insulation ability without increasing the thickness of the packaging structure, and it is easy to realize the ultra-thinning of the corresponding organic electroluminescent device.

The organic electroluminescence device provided by the embodiment of the present invention can form an encapsulation layer for an organic electroluminescence device layer by forming an encapsulation layer for covering the organic electroluminescence device layer, and avoid the cavity formed by the encapsulation layer and the second substrate. The effect of water and oxygen on the organic light-emitting array layer; in addition, by forming a desiccant layer between the packaging layer and the second substrate to block moisture and oxygen from the external environment and the cavity, there is no requirement for the thickness of the desiccant layer. That is, without increasing the thickness of the organic electroluminescent device, the water-oxygen barrier ability of the organic electroluminescent device can be increased.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are part of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "vertical", "level", "inner", "outer" and the like are based on the drawings The orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, structure and operation in a specific orientation, so it cannot be understood as a limitation on the present invention. . In addition, the terms "first," "second," and "third" are used for descriptive purposes only, and should not be construed to indicate or imply relative importance.

The invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art, and the invention will be limited only by the claims. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. It should be understood that when an element such as a layer, region, or substrate is referred to as being "formed on" or "disposed on" another element, or "stacked", the element can be directly disposed on the other element, Alternatively, intermediate elements may be present. In contrast, when an element is referred to as being "directly formed" or "directly disposed" on another element or "directly stacked", there are no intervening elements present.

In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

Example 1

An embodiment of the present invention provides a packaging structure, as shown in FIG. 2, including a first substrate 10 and a second substrate 20 opposite to each other; a body 30 to be packaged disposed between the first substrate 10 and the second substrate 20, and forming An encapsulation layer 60 on the first substrate 10 and continuously covering the exposed surface of the body 30 to be packaged; wherein the body 30 to be packaged is formed on the first substrate 10 and the body 30 to be packaged 30 The exposed surface is formed opposite to the outside of the first substrate 10; In addition, a packaging ring 40 is further provided on the first substrate 10 or the encapsulation layer 60 around the peripheral edge of the body 30 to be packaged. A closed cavity is enclosed between the first substrate 10 (or the encapsulation layer 60) and the second substrate 20. A desiccant layer 50 is interposed between the encapsulation layer 60 and the second substrate 20. This desiccant layer is a gelled desiccant layer.

By forming an encapsulation layer 60 for covering the body 30 to be encapsulated, it is possible to form an encapsulation of the to-be-encapsulated body 30 to avoid the influence of water and oxygen in the cavity formed by the encapsulation layer 60 and the second substrate 20 on the to-be-encapsulated body 30; The desiccant method forms a desiccant layer between the packaging layer and the second substrate for blocking water vapor and oxygen in the external environment and the cavity. There is no requirement for the thickness of the desiccant layer, so it can be used without increasing the thickness of the packaging structure. On the basis of this, the water and oxygen barrier ability of the package structure is increased.

As shown in FIG. 2, the encapsulation layer 60 covers the body 30 to be packaged and extends to the surface of the first substrate 10; that is, the encapsulation layer 60 forms a closed cavity with the first substrate 10, and the body 30 to be packaged is disposed in the closed cavity, and Opposite two surfaces of the body 30 to be packaged are respectively attached to the packaging layer 60 or the first substrate 10. In addition, the direction indicated by the arrow x in FIG. 2 is the length direction of the first substrate 10, and the direction indicated by the arrow y is the thickness direction of the encapsulation layer 60.

In this embodiment, preferably, the viscosity of the gelled desiccant is 50000-800000 mPa · s. Controlling the viscosity of the desiccant is beneficial to maintain the gel state of the desiccant, so that it has a changeable three-dimensional structure. It can change the shape and release stress during the impact of external force, and it acts as a buffer for the package to simplify the follow-up. Difficult to operate and improve the impact resistance of the corresponding product.

In this embodiment, the encapsulation layer 60 is an inorganic material layer, which may include at least one inorganic thin film layer, for example, it may be a stepless cladding layer, or a stacked structure of two or three inorganic thin film layers; each of the inorganic thin films The layers are independently selected from a silicon nitride film or a silicon oxide film. In this embodiment, the encapsulation layer 60 is an inorganic thin film layer. For example, it may be a SiN _x thin film layer or a SiO ₂ thin film layer.

In this embodiment, there is no special requirement on the thickness of the encapsulation layer 60. However, in order to meet the development needs of miniaturization and flexibility, the thickness of the encapsulation layer 60 is 0.5 μm to 3 μm. In this embodiment, the encapsulation layer 60 It is an inorganic thin film layer with a thickness of 1 μm.

In this embodiment, the packaging ring 40 is a closed ring structure that is disposed on the first substrate 10 and surrounds the peripheral edge of the body 30 to be packaged. The encapsulation ring 40 is a glass frit cured by laser, and can also be expressed as the encapsulation ring 40 being an inorganic encapsulation ring.

As shown in FIG. 2, the first substrate 10, the encapsulation layer 60, the encapsulation ring 40 and the second substrate 20 form a closed cavity, and a desiccant layer 50 is provided in the formed closed cavity. The desiccant layer 50 is a gel desiccant layer. Preferably, the gelled desiccant layer 50 is completely filled and evenly distributed in the closed cavity. By avoiding the generation of voids, it can greatly absorb the external environment and the water vapor and oxygen in the closed cavity, and avoid water and oxygen. Intrusion into the package.

The gelled desiccant layer 50 may be OleDry F-type desiccant from Futaba Company, or other liquid desiccant materials with the ability to block water and oxygen, and is formed after curing. It is only necessary to ensure the final coagulation formed in the desiccant layer. The viscosity of the colloidal desiccant may be 80,000-500000 mPa · s.

As an optional implementation manner of this embodiment, the encapsulation layer 60 covers the body 30 to be packaged, and also extends along the length direction of the first substrate 10 until it reaches the edge of the first substrate 10. That is, the encapsulation layer 60 covers the body 30 to be encapsulated and extends along the edge of the first substrate 10. At this time, the packaging ring 40 is disposed on the packaging layer 60, and forms a closed cavity with the packaging layer 60 and the second substrate 20. A desiccant layer 50 is provided in the closed cavity.

As an alternative implementation of the packaging ring 40 in this embodiment, the packaging ring may be an organic (UV-cured epoxy) ring.

As an optional implementation manner of the body 30 to be packaged in this embodiment, the body 30 to be packaged may be an organic electroluminescent device layer, or other structures that need to be packaged.

Example 2

The embodiment of the present invention provides an organic electroluminescence device, which is different from Embodiment 1 in that the body 30 to be packaged is an organic light emitting array layer.

As shown in FIG. 3, the organic light-emitting array layer includes: a first electrode layer and a separation column 72; the first electrode layer includes a plurality of first electrode strips arranged in parallel with each other (as shown in the figure, the first electrode layer is an anode). Layer, such as an ITO layer), the extension direction of the isolation pillar 72 is perpendicular to the extension direction of the first electrode strip; wherein the isolation pillar 72 has an inverted trapezoidal shape along the extension direction of the first electrode strip. In a cross section, an acute angle between each side of the cross section and the first electrode layer is 45 ° -70 °. In the present invention, the arrangement of the isolation pillar 72 with such a structure is favorable for a good separation effect on the corresponding second electrode, and it is not easy to collapse, and can effectively prevent a short circuit between the corresponding second electrode and the first electrode, or an adjacent first electrode. The problem of electrical connection between two electrodes.

Further, the first electrode layer further includes a plurality of insulating strips 71. The insulating strips 71 are disposed below the isolation pillars 72 in a one-to-one correspondence with the isolation pillars 72. The first electrode strip is separated into a plurality of sub-first electrodes distributed along an extending direction of the first electrode strip. By providing the double-layer structure of the insulating strip 71 and the isolation column, pixels in the organic light emitting array layer can be more effectively separated from each other to improve the display effect. The insulating strip 71 may be made of polyimide material; the isolation pillar 72 may be made of conventional isolation pillar material.

Further, the first electrode layer is an anode layer, and the second electrode layer is a cathode layer.

The organic light emitting array layer includes a functional layer and a second electrode layer in addition to the first electrode layer and the isolation pillar 72. The first electrode layer includes a plurality of first electrode strips arranged in parallel. There are a plurality of isolation pillars 72 disposed on the first electrode layer in parallel with each other, and an extension direction of the isolation pillars 72 is perpendicular to an extension direction of the first electrode strip, and the functional layer is formed on the first electrode layer. The second electrode layer is formed on the electrode layer and is located between the isolation pillars 72. The second electrode layer is formed on the functional layer and is located between the isolation pillars 72. Preferably, the surface of the isolation column 72 far from the side of the first electrode layer is higher than the surface of the second electrode layer far from the side of the first electrode layer.

The functional layer includes an optional electron injection layer, an optional electron transport layer, an optional hole blocking layer, a light emitting layer, an optional electron blocking layer, and an optional electron injection layer, which are sequentially stacked in the direction of the first electrode from the second electrode. Optional hole transport layer, optional hole injection layer.

The encapsulation layer 60 is continuously covered on the organic light emitting array layer (continuously covered on the surface of the second electrode and the barrier layer). Preferably, the desiccant layer 50 fills the closed cavity between the encapsulation layer 60 and the second substrate 20 .

In addition, the height of the packaging ring 40 is higher than the height of the isolation pillar, that is, the distance between the first substrate 10 and the second substrate 20 depends on the height of the packaging ring 40.

In this embodiment, the first substrate 10 and the second substrate 20 may be rigid substrates, such as glass. The first substrate 10 is a glass substrate, and the second substrate 20 is a glass cover. As an alternative embodiment of the first substrate 10 and the second substrate 20, a flexible substrate may be used. The flexible substrate may be made of a polyester-based, polyimide-based compound material, or a thin metal sheet.

In this embodiment, by forming an encapsulation layer 60 for covering the organic electroluminescent device layer, it is possible to form an encapsulation of the organic electroluminescence device layer, avoiding water and oxygen in the cavity formed by the encapsulation layer 60 and the second substrate 20. The effect of the organic light-emitting array layer; in addition, a gel-like desiccant layer for blocking water vapor and oxygen in the external environment and the cavity is formed between the encapsulation layer and the second substrate by a method of curing a liquid desiccant. The thickness of the layer is not required, that is, the water and oxygen barrier ability of the packaging structure can be increased without increasing the thickness of the packaging structure.

It should be noted that the isolation pillars in this embodiment are not limited to the isolation pillars shown in FIG. 3, and may be other shapes, as long as the isolation pillars can isolate adjacent organic light emitting diodes.

For structural details of the packaging structure that are not described in detail in this embodiment, please refer to Embodiment 1, and details are not described herein again.

Example 3

An embodiment of the present invention provides a method for preparing an organic electroluminescent device, including the following steps:

In step S11, an organic light emitting array layer is prepared on the first substrate. For the structure of the organic light emitting array layer, refer to the foregoing description.

In step S12, a continuous encapsulation layer is formed on the first substrate to cover the exposed surface of the organic light emitting array layer (the surface away from the first substrate).

An encapsulation layer 60 is formed to continuously cover the organic light emitting array layer away from the surface of the first substrate. The encapsulation layer 60 extends to the surface of the first substrate 10 so that it forms a closed cavity with the first substrate 10, and the organic light emitting array layer is encapsulated in the encapsulation layer 60. Airtight cavity.

In step S13, a packaging ring is provided around the outer peripheral edge of the organic light emitting array layer on the packaging layer to form a desiccant-filled cavity on the packaging layer with the packaging ring as a sidewall.

A laser-cured glass paste (frit) is formed on the encapsulation layer 60 to form an encapsulation ring 40 that surrounds the peripheral edge of the organic light-emitting array layer. A desiccant-filled cavity is formed with the upper surface of the encapsulation layer 60 as a bottom surface and the encapsulation ring 40 as a sidewall. .

In step S14, a liquid desiccant layer is filled in the desiccant filling cavity.

A liquid desiccant layer is filled into the desiccant filling cavity, and the amount of the applied liquid desiccant can be calculated according to the volume of the closed cavity to be formed later, so that the liquid desiccant can be completely filled after it expands during the curing process. The closed cavity is sufficient.

In addition, the coating pattern of the liquid desiccant formed on the surface of the first substrate 10 or the encapsulation layer 60 is selected from, but not limited to, a "back" shape or an "S" shape. The coating in this shape can ensure that in the case where the liquid desiccant layer 50 completely fills the closed cavity, the required amount of liquid desiccant is minimal, thereby achieving the purpose of saving costs.

Optionally, when the desiccant layer 50 is coated on the surface of the second substrate 20, the coating pattern of the desiccant layer 50 may be set according to the surface pattern of the organic light emitting array layer, so as to ensure that the desiccant layer is applied in the subsequent pressing step. 50 can completely fill the cavity between the second substrate 20 and the organic light emitting array layer.

In step S15, the second substrate is pressed so that the second substrate closes the desiccant-filled cavity to form a closed cavity.

The package is pressed against the second substrate 20 so that the second substrate 20 is in contact with the top surface of the packaging ring 40 and closely adheres to each other, thereby achieving that the second substrate 20 closes the desiccant filling cavity to form a closed cavity.

In step S16, the liquid desiccant is cured to form a gel desiccant and fill the closed cavity.

The liquid desiccant is subjected to a curing treatment. By controlling the curing conditions, the liquid desiccant is formed into a gel-like desiccant and fills the sealed cavity. The curing conditions can be selected according to the curing reaction of the liquid desiccant to control the volume of the gelled desiccant formed. While the closed cavity is completely filled, the viscosity of the gelled desiccant is 50000-800000 mPa · s range. For example, when the coating thickness of the OleDry F liquid desiccant is between 20 and 40 μm, it can be baked at 80 ° C. for 1 hour, so that the liquid desiccant achieves a perfect filling effect.

For a specific device structure not described in this embodiment, please refer to Embodiment 1 or Embodiment 2, and details are not described herein again. Obviously, the foregoing embodiment is merely an example for clear description, and is not a limitation on the implementation. For those of ordinary skill in the art, other different forms of changes or modifications can be made on the basis of the above description. There is no need and cannot be exhaustive for all implementations. However, the obvious changes or variations introduced thereby are still within the protection scope created by the present invention.

In summary, the present invention has no requirement for the thickness of the desiccant layer, and therefore can increase the water and oxygen barrier capability of the packaging structure without increasing the thickness of the packaging structure.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

1‧‧‧ substrate

2‧‧‧Packing cover

3‧‧‧OLED device layer

4‧‧‧UV package

5‧‧‧ Dry tablets

10‧‧‧ the first substrate

20‧‧‧ second substrate

30‧‧‧To be packaged

40‧‧‧Packing ring

50‧‧‧ desiccant layer

60‧‧‧Encapsulation layer

71‧‧‧insulation strip

72‧‧‧ isolation column

In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the specific embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are Some embodiments of the present invention, for those skilled in the art, can obtain other drawings according to these drawings without paying creative labor. FIG. 1 is a specific schematic structural diagram of a display device in the prior art. FIG. 2 is a specific schematic structural diagram of a packaging structure in Embodiment 1 of the present invention. FIG. 3 is a detailed schematic structural diagram of an organic electroluminescence device in Embodiment 2 of the present invention.

Claims (10)

A packaging structure includes: a first substrate and a second substrate disposed opposite to each other; a body to be packaged disposed between the first substrate and the second substrate; a packaging layer formed on the first substrate, and The bare surface of the body to be packaged is continuously covered; and a desiccant layer is sandwiched between the packaging layer and the second substrate, and the desiccant layer is a gel-like desiccant layer. The package structure according to item 1 of the scope of application patent, wherein the viscosity of the gelled desiccant layer is 50000-800000 mPa · s. The package structure according to item 1 of the scope of patent application, further comprising a packaging ring provided around the outer peripheral edge of the to-be-packaged package, the packaging ring being disposed on the first substrate or the packaging layer and the first A closed cavity is enclosed between the two substrates, and the desiccant layer is disposed in the closed cavity. The packaging structure according to item 3 of the scope of patent application, wherein the desiccant layer completely fills the closed cavity. The packaging structure according to any one of claims 1 to 4, wherein the packaging layer is an inorganic material layer; or the packaging layer includes at least one inorganic thin film layer, and each of the inorganic thin film layers Each is independently selected from a silicon nitride film or a silicon oxide film. A method for manufacturing a packaging structure, wherein the method includes: providing a first substrate, a body to be packaged is formed on a surface of the first substrate; and forming a continuous cover on the first substrate to cover the exposed surface of the body to be packaged An encapsulation layer is provided on the first substrate or the encapsulation layer to surround the peripheral edge of the body to be encapsulated, so as to form the encapsulation ring on the encapsulation layer and the optional first substrate. Fill the cavity with a desiccant on the sidewall; load a liquid desiccant into the desiccant-filled cavity; press the second substrate so that the second substrate seals the desiccant-filled cavity to form a sealed cavity And curing the liquid desiccant to form a gel desiccant. The method for preparing a packaging structure according to item 6 of the scope of the patent application, wherein the viscosity of the gel desiccant is 50000-800000 mPa · s. An organic electroluminescence device, wherein the device includes the packaging structure according to any one of claims 1 to 4, and the body to be packaged is an organic light emitting array layer. The organic electroluminescence device according to item 8 of the scope of application for a patent, wherein the organic light-emitting array layer includes a first electrode layer and a separation column disposed on the first electrode layer, and the first electrode layer It includes a plurality of first electrode strips arranged in parallel with each other, and the extension direction of the isolation pillar is perpendicular to the extension direction of the first electrode strip; wherein the isolation pillar has an inverted shape along the extension direction of the first electrode strip. A trapezoid-shaped cross section, the acute angle between each side of the cross section and the first electrode layer is 45 ° -70 °. The organic electroluminescence device according to item 9 of the scope of patent application, wherein the first electrode layer further includes a plurality of insulating strips, and the insulating strips are provided on the isolation one-to-one corresponding to the isolation pillars. Below the pillar, the insulating strip separates the first electrode strip into a plurality of sub-first electrodes distributed along the extending direction of the first electrode strip.