TW201830088A - Pattern drawing apparatus - Google Patents

Abstract

A pattern drawing apparatus (EX) is provided with: a beam switching unit that has a plurality of selective optical members (OSn) for directing beams toward drawing units (Un) under electrical control and the optical members being arranged so as to sequentially pass the beams from a light source device (LS) in order to selectively supply the beams from the light source device (LS) to one of the drawing units; and a control unit (250) that, when the intensity of a beam projected to a substrate (P) from a specific drawing unit (Un) among the drawing units (Un) is to be adjusted, adjusts the intensity of the beam projected to the substrate (P) from one of beam intensity adjustment units corresponding to the specific drawing unit (Un), within an adjustable range, and controls the beam intensity adjustment units corresponding to the other drawing units (Un) so as to match the intensities of the beams projected to the substrate (P) from the other drawing units (Un) than the specific drawing unit (Un) with the intensity of the beam projected to the substrate (P) from the specific drawing unit (Un).

Description

   Pattern drawing device   

The present invention relates to a pattern drawing device that scans a beam spot on a substrate as an irradiated body to draw a predetermined pattern on the substrate.

In the past, in order to project the spot light of a laser beam onto an irradiated body (object to be processed), and to perform a main scan in a one-dimensional direction by a scanning mirror (polygonal mirror) while letting the irradiated body along Moving in the sub-scanning direction orthogonal to the main scanning line direction to form a desired pattern or image (text, graphics, etc.) on the object to be irradiated, for example, an image described in Japanese Patent Application Laid-Open No. 2008-195019 Forming device (drawing device).

In Japanese Patent Application Laid-Open No. 2008-195019, it has been disclosed that, in each of a plurality of scanning areas (distribution areas) set on a photo paper, that is, a photosensitive material, the exposure light beams emitted by the laser exposure section are distributed for scanning to be sensitive When forming (drawing) an image on a material, in order to prevent the exposure amount of the exposure beam from changing due to the temperature change of the plurality of laser exposure sections, based on the relationship between the temperature change of the laser exposure section required in advance and the intensity change of the exposure beam, The intensity of the exposure light beam emitted by the laser exposure section is adjusted to suppress the uneven density of the scanning area that each laser exposure section is responsible for at the interface. In the image forming apparatus of Japanese Patent Application Laid-Open No. 2008-195019, three laser exposure sections are provided, and each of the three laser exposure sections includes a laser that emits red, green, and blue wavelength bands corresponding to the three primary colors of light. The intensity of the three laser light sources that emit light, and the red laser light, green laser light, and blue laser light intensity of each of the three laser light sources correspond to three acousto-optic modulation elements (AOM: Acousto-Optic Modulator), a half mirror that superimposes the three laser beams of each of the three acousto-optic modulation elements (AOM) into one, a rotating polygon mirror that scans the laser beams that overlap, and a The laser light scanned by the rotating polygon mirror is an fθ lens or the like that is scanned at a constant speed on the photosensitive material.

In Japanese Patent Application Laid-Open No. 2008-195019, although the temperature control of the laser light source or the acousto-optic modulation element (AOM) is performed by the temperature adjustment section, if the temperature is assumed to change by more than 0.1 ° C from the set temperature, the exposure amount will vary with Before the change is mentioned, the modulation level of the acousto-optic modulation element (AOM) corresponding to the laser light emitted by the laser light source modulated by the image data is modified according to the temperature change measured by the temperature sensor. In other words, in Japanese Patent Application Laid-Open No. 2008-195019, even if the temperature inside the housing slightly deviates from the set temperature, there may be a delay or overshoot in the temperature control that may occur before returning to the set temperature. The exposure amount variation of each laser exposure section is corrected through the adjustment of the modulation level by the acousto-optic modulation element (AOM) to suppress the uneven density caused by the discontinuous exposure difference on the boundary of the distribution area on the photosensitive material. .

A first aspect of the present invention relates to a pattern drawing device that scans a light beam emitted by a light source device on a substrate by a scanning member, and draws a pattern on the substrate by a plurality of drawing units that draw the pattern, and includes: The light beam switching unit includes a plurality of selection optical members. In order to selectively supply a light beam emitted by the light source device to one of the plurality of drawing units, the plurality of selection optical members are provided to be guided in order. The light beam emitted by the light source device passes through, and the light beam is directed toward the drawing unit by electric control; and the control unit adjusts the intensity of the light beam projected from a specific drawing unit of the plurality of drawing units to the substrate, The intensity of the light beam projected onto the substrate is adjusted within an adjustable range of the beam intensity adjustment section corresponding to the specific drawing unit, so that the intensity of the light beam projected onto the substrate from each of the drawing units other than the specific drawing unit is adjusted. Intensity and the intensity of the light beam projected onto the substrate from the specific drawing unit In a manner in which the intensity is the same, the beam intensity adjustment section corresponding to each of the other drawing units is controlled.

A second aspect of the present invention relates to a pattern drawing device that scans a light beam emitted by a light source device on a substrate by a scanning member, and draws a pattern on the substrate by a plurality of drawing units that draw the pattern. The device includes: The light beam switching unit includes a plurality of selection optical members. In order to selectively supply a light beam emitted by the light source device to one of the plurality of drawing units, the plurality of selection optical members are provided to be guided in order. The light beam emitted by the light source device passes through, and the light beam is directed toward the drawing unit by electric control; a plurality of beam intensity adjustment sections are provided corresponding to each of the plurality of drawing units, and can adjust the projection to a predetermined range to The intensity of the light beam of the substrate; and the control unit, based on the selection of the plurality of selection optical members, the selection optical member that finally made the light beam emitted from the light source device incident and selects the light beam projected onto the substrate via the drawing unit Adjustable range of intensity to control the aforementioned multiple beam intensities Adjusting portion, so that a uniform intensity to each of the plurality of the substrate projected beam drawing unit.

A third aspect of the present invention relates to a pattern drawing device that uses a scanning member to scan a substrate on a substrate with a light beam emitted from a light source device to draw a plurality of drawing units, and draws a pattern on the substrate. The device includes: beam switching An electro-optical selection optical member is provided corresponding to each of the plurality of drawing units in order to deflect a light beam emitted from the light source device toward the drawing unit, and further includes a light beam emitted from the light source device in order to pass the plurality of A plurality of optical elements that guide the light by each of the methods of selecting the optical member; a switching control unit that supplies the light beam emitted by the light source device to one of the plurality of drawing units selectively to the plurality of optical elements One of the selection optical members provides a driving signal for deflection; and a beam intensity measuring section detects a non-biased state of the selection optical member that penetrates the plurality of selection optical members and is provided with the driving signal. The intensity of the beam of light The intensity of each of the aforementioned beams of the cell.

A fourth aspect of the present invention relates to a pattern drawing device that uses a scanning member to scan a light beam emitted from a light source device on a substrate to draw a pattern on a plurality of drawing units to draw a pattern on the substrate, and includes a beam switching unit. An acousto-optic modulation element is provided corresponding to each of the plurality of drawing units in order to deflect the light beam emitted by the light source device toward the drawing unit, and has a light beam emitted by the light source device that can pass through the plurality of sounds in order. A plurality of optical elements that guide light in each of the modes of the light modulation element; the control unit supplies the light beams emitted by the light source device to one of the plurality of drawing units in order to sequentially supply the plurality of sounds One of the light modulation elements is switched to a deflected state; and a beam intensity measuring section detects the intensity of a light beam that penetrates the acousto-optic modulation element in the deflected state among the plurality of acousto-optic modulation elements into a deflected state, The intensity of the light beam supplied to each of the plurality of drawing units is measured.

200‧‧‧Drawing control device

250‧‧‧ control section, intensity adjustment control section

251a ~ 251f‧‧‧Drive circuit

252a ~ 252f‧‧‧Gain adjustment circuit

60a‧‧‧Beam sending light system

60b‧‧‧Beam receiving system

BS1‧‧‧polarized beam splitter

CCa‧‧‧ Variation Characteristics of Diffraction Efficiency

CKa, CKb‧‧‧ detection circuit

CLK‧‧‧clock signal

CYa‧‧‧The first cylindrical lens

CYb‧‧‧Second cylindrical lens

DFn‧‧‧Drive signal

DTa, DTb, DT1 ~ DT6

DR‧‧‧ rotating tube

EX‧‧‧ pattern drawing device, exposure device

Ga‧‧‧ condenser lens

Gb, Gc‧‧‧ collimating lens

FT‧‧‧fθ lens system

IFD‧‧‧Control Information

IMn‧‧‧incident mirror

LB, LBn ‧‧‧ Beam

LBnz‧‧‧0th order beam

LP1 ~ LP6‧‧‧Switch signal

LS‧‧‧Light source device

M1 ~ M12, M20 ~ M24, M20a‧‧‧Mirror

Mb‧‧‧partial mirror

OSn‧‧‧Selection optical element, selection optical member

P‧‧‧ substrate

PM‧‧‧ polygon mirror

Ps‧‧‧face

Pwn‧‧‧ adjust signal

RF‧‧‧Oscillation circuit

RM‧‧‧rotating motor

RP‧‧‧Reflective surface

Sa, Sb‧‧‧test signal

SDn‧‧‧Description data

SLn‧‧‧Drawing Line

Smn‧‧‧Photoelectric signal

SZn‧‧‧ origin signal

TR‧‧‧ Absorber

Un‧‧‧ Drawing Unit

△ Kn‧‧‧Adjustable range

βn‧‧‧ Efficiency

εn‧‧‧ Penetration

FIG. 1 is a perspective view showing a schematic overall configuration of a pattern drawing device according to a first embodiment.

FIG. 2 is a perspective view showing a specific configuration of a drawing unit mounted on the pattern drawing device shown in FIG. 1.

FIG. 3 is a diagram showing a specific optical arrangement between the selection optical element and the incident mirror shown in FIG. 1.

FIG. 4 is a schematic configuration diagram of a light beam switching unit and a drawing control device for selectively distributing a light beam emitted from a light source device to any one of six drawing units.

FIG. 5 is a diagram illustrating a connection relationship between an intensity adjustment control unit, a drive circuit, and the like provided in the drawing control device shown in FIG. 4.

FIG. 6 is a diagram showing an example of a change characteristic of a diffraction efficiency caused by a change in RF power of a driving signal applied to a selection optical element.

7 is a diagram schematically showing an example of the relationship between the intensity of each light beam supplied to the drawing unit and the adjustable range on the selection optical element for adjusting the intensity of the light beam.

FIG. 8 is a diagram schematically illustrating the influence of the efficiency and transmittance of each of a plurality of selection optical elements arranged in line along the traveling direction of the light beam emitted from the light source device.

With regard to the pattern drawing device according to aspects of the present invention, preferred implementation modes are given. The detailed description will be described below with reference to the accompanying drawings. In addition, the aspects of the present invention are not limited to these implementation types, and also include a variety of changes or improvements. That is, the constituent elements described below include those that can be easily imagined by those with ordinary knowledge in the technical field to which the invention belongs, and those that are substantially the same, and the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the constituent elements can be made without departing from the gist of the present invention.

[First embodiment]

FIG. 1 is a perspective view showing a schematic configuration of a pattern drawing device (hereinafter, also referred to as an exposure device) EX that performs exposure processing on a substrate (irradiated body) P of a first embodiment. In addition, in the following description, unless otherwise specified, an XYZ orthogonal coordinate system in which the direction of gravity is the Z direction is set, and the X direction, the Y direction, and the Z direction are described according to the arrows shown in the figure.

The pattern drawing device EX is a substrate processing device that performs a predetermined process (exposure process, etc.) on the substrate P and is used in a component manufacturing system for manufacturing electronic components. The device manufacturing system is constructed by manufacturing, for example, a flexible display as an electronic component, a film-shaped touch panel, a film-shaped color filter for a liquid crystal display panel, flexible wiring, or a flexible sensor. Manufacturing system of the production line. The following description is based on the premise that a flexible display is used as an electronic component. Examples of the flexible display include an organic EL display and a liquid crystal display. The component manufacturing system has a so-called roll-to-roll production method, that is, feeding from a supply roll (not shown) that rolls a flexible sheet-like substrate (sheet substrate) P into a roll shape The substrate P is continuously subjected to various processes on the substrate P that is sent out, and then the various processed substrates P are taken up by a recycling roller (not shown). Therefore, the substrate P after various processes becomes a multi-cutting substrate in which a plurality of elements (display panels) are arranged in the transport direction of the substrate P. The substrate P sent out from the supply roller passes through a processing device in a previous step, a pattern drawing device EX, and a processing device in a subsequent step in order to perform various processes, and is then taken up by a recovery roller. The substrate P has a belt-like shape in which the moving direction (conveying direction) of the substrate P becomes the long side direction (long strip) and the width direction becomes the short side direction (short strip).

As the substrate P, for example, a resin film or a foil (film) made of a metal or an alloy such as stainless steel is used. As a material of the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene-vinyl ester copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, At least one of polycarbonate resin, polystyrene resin, and vinyl acetate resin. In addition, as long as the thickness or rigidity (Young's modulus) of the substrate P is in a transport path through the element manufacturing system or the pattern drawing device EX, the substrate P does not have a crease due to buckling or an irreversible wrinkle. Just fine. As the base material of the substrate P, a thin film substrate such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 μm to 200 μm is typical.

The substrate P may be subjected to heat during each process performed in the element manufacturing system, so it is preferable to select a substrate P having a material with a relatively small thermal expansion coefficient. For example, a thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, or silicon oxide. In addition, the substrate P may be a single-layer body of ultra-thin glass having a thickness of about 100 μm produced by a float method or the like, or may be a laminated body in which the resin film, foil, and the like are bonded to the ultra-thin glass.

In addition, the flexibility of the substrate P refers to a property that the substrate P can be bent without being sheared or broken even when a force of a self-weight is applied to the substrate P. In addition, the property of bending due to the force of the degree of self-weight is also included in the flexibility. In addition, the degree of flexibility varies depending on the material, size, thickness of the substrate P, the layer structure formed on the substrate P, the temperature, and the humidity and the like. In short, as long as the substrate P is correctly wound around various conveying direction changing members such as a conveying roller and a rotating cylinder provided on a conveying path in a component manufacturing system (pattern drawing device EX), it is possible to avoid the buckling. It can be said that the substrate P is smoothly conveyed with creases or breakages (cracks or cracks occur).

The processing device (including a single processing unit or a plurality of processing units) in the previous step is to transport the substrate P sent from the supply roller toward the pattern drawing device EX along the long side at a predetermined speed, and send it to the other side. The substrate P of the pattern drawing device EX performs the processing of the previous step. Through the processing in the previous step, the substrate P sent to the pattern drawing device EX becomes a substrate (photosensitive substrate) having a photosensitive functional layer (photosensitive layer) formed on the surface.

This photosensitive functional layer is first applied as a solution on the substrate P, and is then dried to form a layer (film). Although the typical form of the photosensitive functional layer is a photoresist (liquid or dry film), as a material that does not require development treatment, there is a photosensitive silane couple whose hydrophilic and hydrophobic properties have been modified in the part exposed to ultraviolet rays. Mixture (SAM), or a photosensitive reducing agent that exposes a plated reducing group on the part exposed to ultraviolet rays. When a photosensitive silane coupling agent is used as a photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate P is modified from hydrophobic to hydrophilic. Therefore, it is possible to form a thin film transistor (TFT) by selectively coating a liquid containing a conductive ink (an ink containing conductive nano-particles such as silver or copper) or a semiconductor material by selectively coating a hydrophilic portion. And other electrode, semiconductor, insulation or wiring pattern layer for connection. When a photosensitive reducing agent is used as a photosensitive functional layer, a plated reducing group is exposed on a pattern portion of the substrate P exposed to ultraviolet light. Therefore, immediately after exposure, the substrate P is immersed in a plating solution containing palladium ions and the like for a fixed time, thereby forming (precipitating) a patterned layer of palladium. Such a plating process is an additive process, but in addition, it can also be used as an etching process for a subtractive process. In this case, the substrate P sent to the pattern drawing device EX may be made of PET or PEN, and the surface of the substrate P may be entirely or selectively vapor-deposited with metallic properties such as aluminum (Al) or copper (Cu). A thin film, and a photoresist layer is laminated thereon.

The pattern drawing device EX is a process in which the substrate P transferred from the pre-step processing device is directed toward the post-step processing device (including a single processing section or a plurality of processing sections) at a predetermined speed, and the substrate P is subjected to exposure processing. Device. The pattern drawing device EX irradiates the surface of the substrate P (the surface of the photosensitive functional layer, that is, the photosensitive surface) with a light pattern corresponding to a pattern for an electronic element (for example, a pattern of electrodes or wirings of a TFT constituting the electronic element). Thereby, a latent image (modified portion) corresponding to the above pattern is formed on the photosensitive functional layer.

In this embodiment, the pattern drawing device EX shown in FIG. 1 is an exposure device of a direct imaging method without using a mask, and an exposure device (drawing device) of a so-called light spot scanning method. The exposure device EX includes a rotating cylinder DR that supports the substrate P and conveys the substrate P in the longitudinal direction for sub-scanning, and pattern exposure of each portion of the substrate P that is supported in a cylindrical shape on the rotating cylinder DR. A plurality of (in this case, six) drawing units Un (U1 to U6), and each of the plurality of drawing units Un (U1 to U6) has a spot light SP of a pulsed light beam LB (pulse light beam) for exposure on one side On the illuminated surface (photosensitive surface) of the substrate P, the polygon mirror (scanning member) is scanned one-dimensionally (main scan) along the predetermined scanning direction (Y direction), and the intensity of the spot light SP is measured according to the pattern data (drawing data, (Pattern information) High-speed modulation (ON / OFF). Thereby, a light pattern corresponding to a predetermined pattern of an electronic component, a circuit, or a wiring is exposed on the illuminated surface of the substrate P. That is, by the sub-scanning of the substrate P and the main scanning of the spot light SP, the spot light SP is relatively two-dimensionally scanned on the illuminated surface (the surface of the photosensitive functional layer) of the substrate P, and A predetermined pattern of exposure is drawn on the illuminated surface. In addition, since the substrate P is transported in the longitudinal direction, a plurality of exposed areas are exposed at a predetermined interval along the longitudinal direction of the substrate P by the exposure pattern of the exposure device EX. Since the electronic element is formed in the exposed region, the exposed region is also an element formation region.

As shown in FIG. 1, the rotating cylinder DR has a central axis AXo extending in the Y direction and extending in a direction crossing the direction in which gravity acts, and a cylindrical outer peripheral surface having a fixed radius from the central axis AXo. The rotating cylinder DR supports (holds) a portion of the substrate P in a cylindrical shape while being curved along the outer peripheral surface (circumferential surface) along its outer peripheral surface, and rotates the substrate P in the longitudinal direction around the central axis AXo. Transport. The rotating tube DR is supported by an area (portion) on the substrate P on which the light beam LB (point light SP) from each of the plurality of drawing units Un (U1 to U6) is projected on its outer periphery. The rotating tube DR supports (closely holds) the substrate P from the surface (back surface) side opposite to the surface (the surface on which the photosensitive surface is formed) on which the electronic component is formed. In addition, on both sides in the Y direction of the rotating cylinder DR, shafts (not shown) that support the rotating cylinder DR by a bearing so as to rotate about a central axis AXo are provided. This shaft obtains a rotational torque from a rotational drive source (such as a motor or a reduction mechanism), which is not shown, and the rotating cylinder DR rotates around the central axis AXo at a fixed rotational speed.

The light source device (pulse light source device) LS generates and emits a pulsed light beam (pulse light beam, pulse light, laser) LB. The light beam LB has sensitivity to the photosensitive layer of the substrate P, and is an ultraviolet light having a peak wavelength in a wavelength band below 370 nm. Here, the light source device LS emits a pulsed light beam LB at a light emission frequency (oscillation frequency, predetermined frequency) Fa according to the control (illustrated in FIG. 4) of the drawing control device 200 (not shown). The light source device LS uses a fiber amplifier laser light source, which consists of a semiconductor laser element that generates pulsed light in the infrared wavelength region, a fiber amplifier, and converts the pulsed light in the amplified infrared wavelength region into pulsed light in the ultraviolet wavelength region. A wavelength conversion element (harmonic generating element) and the like. By constituting the light source device LS as described above, it is possible to obtain pulsed light of high-brightness ultraviolet light having an oscillation frequency Fa of several hundred MHz and a light emission time of one pulsed light of tens of picoseconds or less. In addition, the light beam LB emitted from the light source device LS has a beam diameter of about 1 mm or a thinner parallel light beam. A configuration in which a fiber amplifier laser light source is used as the light source device LS and the pulses of the light beam LB are turned on and off at high speed in accordance with the states (logic value "0" or "1") of the pixels constituting the drawing data is disclosed in, for example, International Publication No. WO2015 / 166910 brochure.

The light beam LB emitted from the light source device LS is supplied (selected) to each of the plurality of drawing units Un (U1 to U6) through the light beam switching unit, and the light beam switching unit includes a plurality of switching elements as switching elements. The selection includes optical elements OSn (OS1 to OS6), a plurality of mirrors M1 to M12, a plurality of incident mirrors IMn (IM1 to IM6), and an absorber TR. The selection optical element OSn (OS1 to OS6) is transparent to the light beam LB, and is driven by ultrasonic waves. The primary diffracted light of the incident light beam LB is used as the sound for the drawing light beam LBn to deviate backward at a predetermined angle. An optical modulation element (acousto-optic deflection element) (AOM: Acousto-Optic Modulator). The plurality of selection optical elements OSn and the plurality of incident mirrors IMn are provided corresponding to each of the plurality of drawing units Un. For example, the selection optical element OS1 and the incident mirror IM1 are provided corresponding to the drawing unit U1, and similarly, the selection optical elements OS2 to OS6 and the incident mirror IM2 to IM6 are provided corresponding to the drawing units U2 to U6, respectively.

The light beam LB emitted from the light source device LS passes through the mirrors M1 to M12, and its optical path is bent in a hairpin shape on the XY plane and a plane parallel to the XY plane, and is guided to the absorber TR. Hereinafter, a case where any of the selection optical elements OSn (OS1 to OS6) is in an Off state (a state where no ultrasonic signal is applied and no diffraction light is generated) will be described in detail. Although not shown in FIG. 1, a plurality of lenses (optical elements) are provided in the optical path from the mirror M1 to the absorber TR. The plurality of lenses converge the light beam LB from a parallel light beam or converge. The divergent light beam LB returns to a parallel light beam. Its structure will be described later using FIG. 3.

In FIG. 1, the light beam LB emitted from the light source device LS travels in the −X direction parallel to the X-axis direction and enters the mirror M1. The light beam LB reflected in the -Y direction by the mirror M1 is incident on the mirror M2. The light beam LB reflected in the + X direction by the mirror M2 passes straight through the selection optical element OS5 and reaches the mirror M3. The light beam LB reflected in the -Y direction by the mirror M3 enters the mirror M4. The light beam LB reflected in the -X direction by the mirror M4 passes straight through the selection optical element OS6 and reaches the mirror M5. The light beam LB reflected in the -Y direction by the mirror M5 enters the mirror M6. The light beam LB reflected in the + X direction by the mirror M6 passes straight through the selection optical element OS3 and reaches the mirror M7. The light beam LB reflected in the -Y direction by the mirror M7 is incident on the mirror M8. The light beam LB reflected in the -X direction by the mirror M8 passes straight through the selection optical element OS4 and reaches the mirror M9. The light beam LB reflected in the -Y direction by the mirror M9 is incident on the mirror M10. The light beam LB reflected in the + X direction by the mirror M10 passes straight through the selection optical element OS1 and reaches the mirror M11. The light beam LB reflected in the -Y direction by the mirror M11 enters the mirror M12. The light beam LB reflected in the -X direction by the mirror M12 passes straight through the selection optical element OS2 and is guided to the absorber TR. The absorber TR is a light trap that suppresses the light beam LB from escaping to the outside and absorbs the light beam LB.

Each selection optical element OSn refers to the application of an ultrasonic signal (high-frequency signal), and the incident light beam (0th order light) LB is diffracted by the first-order diffracted light that is diffracted according to the diffraction angle of the high-frequency frequency. The light beam (beam LBn for drawing). Therefore, the light beam emitted from the self-selecting optical element OS1 as the primary diffraction light will be represented by LB1, and the light beam emitted from the same self-selection optical element OS2 to OS6 as the primary diffraction light will be represented by LB2 to LB6. As described above, each of the selection optical elements OSn (OS1 to OS6) functions to deflect the optical path of the light beam LB emitted from the light source device LS. In this embodiment, the selection optical element OSn (OS1 to OS6) is set to the ON state and a light beam LBn (LB1 to LB6) is generated as the primary diffracted light. As the selection optical element OSn ( (OS1 to OS6) A mode in which the light beam LB emitted from the light source device LS is deflected (or selected) will be described. However, since the maximum generation efficiency of the first-order diffracted light of the acousto-optic modulation element is about 80% of the zero-order light, the beams LBn (LB1 to LB6) deflected by each of the selection optical elements OSn The intensity is lower than that of the original light beam LB. In the present embodiment, the drawing control device 200 (see FIG. 4) is configured so that only a selected one of the selection optical elements OSn (OS1 to OS6) is turned on within a fixed time. Way to control. When the selected optical element OSn is in the ON state, although 20% of the 0th-order light that has not been diffracted by the optical element OSn is passed through, it will eventually pass through the absorber. TR absorbs it.

Each system of the selection optical element OSn is provided so that the first-order diffracted light, that is, the drawing light beam LBn (LB1 to LB6) is deflected in the -Z direction with respect to the incident light beam LB. The light beams LBn (LB1 to LB6) deflected from each of the selection optical elements OSn are projected onto the incident mirrors IMn (IM1 to IM6) provided at positions separated by a predetermined distance from each of the selection optical elements OSn. Each incident mirror IMn reflects the incident light beams LBn (LB1 to LB6) in the -Z direction, and guides the light beams LBn (LB1 to LB6) to their corresponding drawing units Un (U1 to U6).

Each of the selection optical elements OSn may be the same in structure, function, function, and the like. Each of the plurality of selection optical elements OSn turns ON / OFF the diffraction light (light beam LBn) generated by diffracting the incident light beam LB in accordance with the ON / OFF of a driving signal (ultrasonic signal) sent from the drawing control device 200. OFF. For example, when the drawing control device 200 does not apply a driving signal (high-frequency signal) to the selection optical element OS5 to form an OFF state, the light beam LB incident from the light source device LS is not deflected (diffracted) and passed through. The light beam LB of the element OS5 is incident on the mirror M3. On the other hand, when the drawing control device 200 is turned on, the incident light beam LB is deflected (diffracted) toward the incident mirror IM5. That is, the switching (beam selection) operation of the selection optical element OS5 is controlled by ON / OFF of the drive signal. In this way, by the switching operation of each selection optical element OSn, the light beam LB emitted from the light source device LS can be guided to any one of the selection optical elements OSn, and the drawing unit Un into which the light beam LBn is incident can be switched. As described above, the plurality of selection optical elements OSn are arranged in series (in series) so that the light beams LB emitted from the light source device LS are sequentially passed through. The structure has been disclosed, for example, in the pamphlet of International Publication No. WO2015 / 166910.

Each of the selection optical elements OSn constituting the beam switching section is turned on in a fixed time order, for example, OS1 → OS2 → OS3 → OS4 → OS5 → OS6 → OS1 →. ． ． The way is preset. This order is determined based on the order of the timing of starting scanning using the spot light in each of the drawing units Un (U1 to U6). That is, in the form of this embodiment, by synchronizing the rotation speeds between the polygon mirrors provided in the six drawing units U1 to U6, the phases of the rotation angles are also synchronized, and the drawing unit can be used. One of the polygon mirrors of any one of U1 to U6 performs a light spot scanning method on the substrate P to perform time-sharing switching. Therefore, as long as the phases of the rotation angles between the polygon mirrors of the drawing unit Un have been synchronized in accordance with a predetermined relationship, the order of the light spot scanning of the drawing unit Un is not particularly limited. In the configuration of FIG. 1, three drawing units U1, U3, and U5 are arranged upstream of the substrate P in the conveying direction (the direction in which the outer peripheral surface of the rotating cylinder DR moves in the circumferential direction) along the Y direction, and the conveying direction of the substrate P On the downstream side, there are three drawing units U2, U4, U6 arranged along the Y direction.

In this case, the pattern drawing of the substrate P starts from the odd-numbered drawing units U1, U3, and U5 on the upstream side. After the substrate P is transported for a fixed length, the even-numbered drawing units U2, U4, and U6 measured downstream. Pattern drawing is also started, so the order of light spot scanning of the drawing unit Un can be set to U1 → U3 → U5 → U2 → U4 → U6 → U1 →. ． ． The way. Therefore, the order of each of the selection optical elements OSn (OS1 to OS6) to be in the ON state within a fixed time is OS1 → OS3 → OS5 → OS2 → OS4 → OS6 → OS1 →. ． ． The way is preset. In addition, even when the selection optical element OSn corresponding to the drawing unit Un lacking a pattern to be drawn is turned on, the ON / OFF state switching control of the selection optical element OSn is based on The data is drawn, and the selection optical element OSn is forcibly maintained in the OFF state, and a spot scan using the selection optical element OSn is not performed.

As shown in FIG. 1, each of the drawing units U1 to U6 is provided with a polygon mirror PM for performing main scanning of the incident light beams LB1 to LB6. In this embodiment, each of the polygon mirrors PM of each drawing unit Un is precisely controlled at the same rotation speed while being controlled synchronously so as to maintain a fixed rotation phase angle with each other. Thereby, the timing of the main scanning (main scanning period of the spot light SP) of each of the light beams LB1 to LB6 emitted from the drawing units U1 to U6 to the substrate P can be set so as not to overlap each other. Therefore, the ON / OFF switching of each of the selection optical elements OSn (OS1 to OS6) provided in the beam switching section is controlled by synchronizing the rotation angle positions of each of the six polygon mirrors PM, and can be controlled. Efficient exposure processing for time-sharing distribution of the light beam LB emitted from the light source device LS to each of the plurality of drawing units Un is achieved.

The phase matching of the rotation angles of each of the six polygonal mirrors PM and the synchronous control of the ON / OFF switching timing of each of the selection optical elements OSn (OS1 to OS6) are disclosed in the pamphlet of International Publication No. WO2015 / 166910. However, in the case of an 8-sided polygonal mirror PM, in terms of scanning efficiency, because one third of the rotation angle (45 degrees) of a reflecting surface corresponds to one scan of the spot light SP on the substrate P, Therefore, as the six polygonal mirrors PM are rotated by 15 degrees in phase relative to each other, each polygonal mirror PM controls the selection optical element OSn by skipping one of the eight reflecting surfaces and scanning the light beam LBn. OS1 to OS6). As described above, a drawing method for skipping one of the reflecting surfaces of the polygon mirror PM has also been disclosed in, for example, International Publication No. WO2015 / 166910.

As shown in FIG. 1, the exposure apparatus EX is formed by arranging a plurality of drawing apparatuses Un (U1 to U6) having the same structure to form a so-called multi-head type direct scan exposure apparatus. Each line of the drawing device Un draws a pattern on a partial area of the substrate P supported in the Y direction of the substrate P supported by the outer peripheral surface (circumferential surface) of the rotating tube DR. Each of the drawing devices Un projects the light beam LBn emitted from the beam switching unit onto the substrate P (the illuminated surface of the substrate P) while condensing (converging) the light beam LBn on the substrate P. Thereby, the light beams LBn (LB1 to LB6) projected onto the substrate P will become the spot light SP. In addition, by the rotation of the polygon mirror PM of each drawing unit Un, the spot light SP of the light beam LBn (LB1 to LB6) projected on the substrate P is scanned in the main scanning direction (Y direction). By scanning the spot light SP, a linear drawing line (scanning line) SLn (where n = 1, 2, ..., 6) for drawing a single-line pattern is defined on the substrate P. The drawing line SLn is also a scanning trace of the spot light SP of the light beam LBn on the substrate P.

The drawing unit U1 scans the spot light SP along the drawing line SL1. Similarly, the drawing units U2 ~ U6 scan the spot light SP along the drawing line SL2 ~ SL6. As shown in FIG. 1, the drawing lines SLn (SL1 to SL6) of the plurality of drawing units Un (U1 to U6) are located at the center of the rotating cylinder DR via a central plane parallel to the YZ plane including the central axis AXo of the rotating cylinder DR. They are arranged in two rows in the circumferential direction in an offset arrangement. The odd-numbered drawing lines SL1, SL3, and SL5 are located on the irradiated surface of the substrate P on the upstream side (-X direction side) of the substrate P in the conveying direction with respect to the center plane, and are arranged at predetermined intervals along the Y direction. Into a line. The even-numbered drawing lines SL2, SL4, and SL6 are located on the irradiated surface of the substrate P on the downstream side (+ X direction side) of the substrate P in the transport direction with respect to the center plane, and are arranged at predetermined intervals along the Y direction. Into a line. Therefore, the plurality of drawing units Un (U1 to U6) are also arranged in two rows in a shifted direction in the substrate P conveying direction across the center plane, and the odd-numbered drawing units U1, U3, U5, and even-numbered drawing are arranged. The units U2, U4, and U6 are symmetrically arranged with respect to the center plane when viewed from the XZ plane.

Although the odd-numbered drawing lines SL1, SL3, and SL5 and the even-numbered drawing lines SL2, SL4, and SL6 are set to be separated from each other in the X direction (the conveying direction of the substrate P or the sub-scanning direction), but in Y The directions (width direction of the substrate P, the main scanning direction) are set to be connected to each other without being separated. The drawing lines SL1 to SL6 are substantially parallel to the wide side direction of the base material P, that is, to the central axis AXo of the rotating cylinder DR. In addition, connecting the drawing lines SLn to each other in the Y direction means that each end portion of the drawing line SLn is connected so that the drawn patterns of the drawing lines SLn adjacent to each other in the Y direction are connected in the Y direction of the substrate P. The positions in the Y direction form an adjacent or partially overlapping relationship. When the ends of the drawing line SLn are overlapped, for example, the length of each drawing line SLn may include the drawing start point or the drawing end point in a range of several percentages or less in the Y direction. .

As described above, the plurality of drawing units Un (U1 to U6) share the scanning area in the Y direction (the division of the main scanning range) in such a manner that the width of the exposed area on the substrate P is covered by all the drawing units. ). For example, considering that the main scanning range (length of the drawing line SLn) of one drawing unit Un in the Y direction is 30 to 60 mm, by arranging a total of six drawing units U1 to U6 in the Y direction, the exposure area can be drawn. The width in the Y direction can be expanded to 180 ~ 360mm. In addition, the length (length of the drawing range) of each drawing line SLn (SL1 to SL6) is unified in principle. That is, in principle, the scanning distance of the spot light SP of the light beam LBn scanned along each of the drawing lines SL1 to SL6 will be unified.

In the case of this embodiment, when the light beam LB emitted from the light source device LS is a pulsed light having a light emission time of tens of picoseconds or less, the point light SP projected onto the drawing line SLn between the main scans will respond. It varies depending on the oscillation frequency Fa (for example, 400 MHz) of the light beam LB. Therefore, it is necessary to overlap the spot light SP projected by one pulse of light beam LB and the spot light SP projected by next pulse of light in the main scanning direction. The amount of overlap is set according to the size φ of the spot light SP, the scanning speed (speed of the main scan) Vs of the spot light SP, and the oscillation frequency Fa of the light beam LB. The effective size (diameter) φ of the spot light SP, when the intensity of the spot light SP is approximated by a Gaussian distribution, the width of the intensity of the spot light SP at 1 / e ² (or 1/2) of the peak intensity Size decision. In the case of this embodiment mode, the scanning speed Vs (the rotation speed of the polygon mirror PM) of the point light SP is set in such a manner that the point light SP of φ × 1/2 is overlapped with respect to the effective size (size) φ. ) And the oscillation frequency Fa. Therefore, the projection interval along the main scanning direction of the pulsed spot light SP is φ / 2. Therefore, as for the sub-scanning direction (the direction intersecting with the drawing line SLn), it is preferable that the substrate P uses only the The effective size φ is set by a distance of approximately 1/2. Further, in a case where the drawing lines SLn adjacent to each other in the Y direction are connected in the main scanning direction, it is preferable to overlap only φ / 2. In the embodiment, the size (size) φ of the spot light SP is 3 to 4 μm.

Each of the drawing units Un (U1 to U6) is set so that each light beam LBn advances toward the central axis AXo of the rotating tube DR when viewed from the XZ plane. As a result, the optical path (main beam of light beam) of the light beam LBn that is emitted toward the substrate P from each of the drawing units Un (U1 to U6) is parallel to the normal line of the illuminated surface of the substrate P in the XZ plane. In addition, the light beam LBn emitted from each drawing unit Un (U1 to U6) and irradiated to the drawing line SLn (SL1 to SL6) is tangent to the drawing line SLn on the surface of the substrate P that is curved into a cylindrical surface, It is projected on the substrate P so as to be kept vertically. In other words, regarding the main scanning direction of the spot light SP, the light beams LBn (LB1 to LB6) projected onto the substrate P are scanned in a telecentric state.

Since the drawing unit (beam scanning device) Un shown in FIG. 1 has the same configuration, only the drawing unit U1 will be briefly described as a representative. The detailed structure of the drawing unit U1 will be described later with reference to FIG. 2. The drawing unit U1 includes at least a mirror M20 to M24, a polygon mirror PM, and an fθ lens system (scanning lens for drawing) FT. Although not shown in FIG. 1, the first cylindrical lens CYa is provided in front of the polygon mirror PM from the traveling direction of the light beam LB1 (see FIG. 2). A second cylindrical lens CYb (see FIG. 2) is provided behind the fθ lens system (f-θ lens system) FT. With the first cylindrical lens CYa and the second cylindrical lens CYb, it is possible to correct the position variation of the spot light SP (the drawing line SL1) in the sub-scanning direction caused by the tilt error of each reflecting surface of the polygon mirror PM.

The light beam LB1 reflected in the -Z direction by the incident mirror IM1 is incident on the reflection mirror M20 provided in the drawing unit U1, and the light beam LB1 reflected by the reflection mirror M20 advances in the -X direction and is incident on the reflection mirror M21. The light beam LB1 reflected in the -Z direction by the mirror M21 is incident on the mirror M22, and the light beam LB1 reflected by the mirror M22 is advanced in the + X direction and incident on the mirror M23. The reflecting mirror M23 directs the incident light beam LB1 toward the reflecting surface RP of the polygon mirror PM and reflects it in a curved manner in a plane parallel to the XY plane.

The polygon mirror PM reflects the incident light beam LB1 toward the fθ lens system FT toward the + X direction side. The polygon mirror PM deflects (reflects) the incident light beam LB1 in a plane parallel to the XY plane, so that the spot light SP of the light beam LB1 is scanned on the illuminated surface of the substrate P. Specifically, the polygon mirror (rotating polygon mirror, scanning member) PM is a plurality of reflecting surfaces RP (rotation polygon mirror, scanning member) having a rotation axis AXp extending in the Z-axis direction and formed in parallel with the rotation axis AXp (this embodiment type) Rotating polygon mirror with the number Np of reflecting surfaces RP being 8). By rotating the polygon mirror PM according to a predetermined rotation direction around the rotation axis AXp, the reflection angle of the pulsed light beam LB1 irradiated on the reflection surface can be continuously changed. Thereby, the light beam LB1 can be deflected by one reflection surface RP, and the spot light SP of the light beam LB1 irradiated on the irradiated surface of the substrate P can be scanned along the main scanning direction (the width direction of the substrate P, the Y direction). Therefore, by making one revolution of the polygon mirror PM, the number of drawing lines SL1 that can be scanned by the spot light SP on the irradiated surface of the substrate P is the same as the number of the reflective surfaces RP at most, which is eight.

The fθ lens system (scanning lens, scanning optical system) FT is a telecentric scanning lens that projects the light beam LB1 reflected by the polygon mirror PM onto the mirror M24. The light beam LB1 passing through the fθ lens system FT is projected onto the substrate P by the spot light SP through the mirror M24. At this time, on the XZ plane, the mirror M24 reflects the light beam LB1 toward the substrate P so that the light beam LB1 advances toward the central axis AXo of the rotating tube DR. The incident angle θ of the light beam LB1 toward the fθ lens system FT changes according to the rotation angle (θ / 2) of the polygon mirror PM. The fθ lens system FT projects the light beam LB1 through the mirror M24 to an image height position on the illuminated surface of the substrate P that is proportional to the incident angle θ. If the focal point distance of the fθ lens system FT is set to fo and the image height position is set to yo, the fθ lens system FT is designed to satisfy the relationship (distortion aberration) of y = fo × θ. Therefore, with the fθ lens system FT, the light beam LB1 can be accurately scanned at a constant velocity in the Y direction. In addition, the plane (parallel to the XY plane) where the light beam LB1 incident on the fθ lens system FT is one-dimensionally deflected by the polygon mirror PM is a plane including the optical axis AXf of the fθ lens system FT.

Next, the optical configuration of the drawing units Un (U1 to U6) will be described with reference to FIG. 2. As shown in FIG. 2, in the drawing unit Un, along the traveling direction of the light beam LBn from the incident position of the light beam LBn to the illuminated surface (substrate P), a reflecting mirror M20, a reflecting mirror M20a, and a polarized light beam separation are provided. The reflector BS1, the mirror M21, the mirror M22, the first cylindrical lens CYa, the mirror M23, the polygon mirror PM, the fθ lens system FT, the mirror M24, and the second cylindrical lens CYb. Further, the drawing unit Un is provided with a light beam transmitting system 60a and a light beam receiving system 60b as an origin sensor (origin detector) for detecting the angular position of each reflecting surface of the polygon mirror PM to detect the drawing unit. Un's may start drawing timing (scanning timing of the spot light SP). In addition, a photodetector (photoinductor) DTc is provided in the drawing unit Un to detect the illuminated surface (or the substrate P) of the substrate P through the fθ lens system FT, the polygon mirror PM, and the polarized beam splitter BS1. Reflected light from the light beam LBn reflected by the surface of the rotating drum DR).

The light beam LBn incident on the drawing unit Un advances in the -Z direction along the optical axis AX1 parallel to the Z axis, and enters the mirror M20 inclined at an angle of 45 degrees with respect to the XY plane. The light beam LBn reflected by the mirror M20 advances from the mirror M20 toward the -X direction toward the mirror M20a farther away in the -X direction. The mirror M20a is set to be inclined at an angle of 45 degrees with respect to the YZ plane, and reflects the incident light beam LBn toward the -Y direction toward the polarized light beam splitter BS1. The polarized light splitting surface of the polarized light beam splitter BS1 is set to be inclined at an angle of 45 degrees with respect to the YZ plane to reflect the P-polarized light beam and to linearly polarize the light polarized in a direction orthogonal to the P-polarized light (S Polarized light). When the light beam LBn incident on the drawing unit Un is used as the P-polarized light beam, the polarized light beam splitter BS1 reflects the light beam LBn from the mirror M20a in the -X direction and guides it toward the mirror M21. The reflecting mirror M21 is set to be inclined at an angle of 45 degrees with respect to the XY plane, and reflects the incident light beam LBn from the reflecting mirror M21 toward the -Z direction toward the reflecting mirror M22 away from the -Z direction. The light beam LBn reflected by the mirror M21 is incident on the mirror M22. The reflecting mirror M22 is arranged to be inclined at an angle of 45 degrees with respect to the XY plane, and reflects the incident light beam LBn toward the reflecting mirror M23 in the + X direction. The light beam LBn reflected by the mirror M22 passes through a λ / 4 wavelength plate and a cylindrical lens CYa (not shown) and enters the mirror M23. The mirror M23 reflects the incident light beam LBn toward the polygon mirror PM.

The polygon mirror PM reflects the incident light beam LBn toward the + X direction toward an fθ lens system FT having an optical axis AXf parallel to the X axis. The polygon mirror PM deflects (reflects) the incident light beam LBn in a plane parallel to the XY plane, so that the spot light SP of the light beam LBn is scanned on the illuminated surface of the substrate P. The polygon mirror PM has a plurality of reflecting surfaces (each side of a regular octagon in this embodiment) formed around a rotation axis AXp extending in the Z-axis direction, and is rotated by a rotation motor RM coaxial with the rotation axis AXp. The rotation motor RM is rotated at a constant rotation speed (for example, about 30,000 to 40,000 rpm) by a polygon rotation control unit provided in the drawing control device 200 (see FIG. 4). As described above, the effective length (for example, 50 mm) of the drawing line SLn (SL1 to SL6) is set to a length that can be less than the maximum scanning length (for example, 52 mm) of the spot light SP scanned by the polygon mirror PM, and is initially set. In the design, the center point of the drawing line SLn (the point at which the optical axis AXf of the fθ lens system FT passes) is set at the center of the maximum scanning length.

The cylindrical lens CYa converges the incident light beam LBn on the reflecting surface RP of the polygon mirror PM in a sub-scanning direction (Z direction) orthogonal to the main scanning direction (rotation direction) of the polygon mirror PM. That is, the cylindrical lens CYa converges the light beam LBn on the reflection surface RP into a slit shape (oblong shape) extending in a direction parallel to the XY plane on the reflection surface of the polygon mirror PM. With the cylindrical lens CYa whose bus bar is parallel to the Y direction and the cylindrical lens CYb described below, even if the reflection surface of the polygon mirror PM is inclined from a state parallel to the Z axis (rotation axis AXp), it is possible to suppress irradiation to Influence of the irradiation position of the light beam LBn (drawing line SLn) on the irradiated surface of the substrate P to the sub-scanning direction.

The incident angle θ (angle relative to the optical axis AXf) of the light beam LBn to the fθ lens system FT changes according to the rotation angle (θ / 2) of the polygon mirror PM. When the incident angle θ of the light beam LBn to the fθ lens system FT is a 0 degree angle, the light beam LBn incident on the fθ lens system FT advances along the optical axis AXf. The light beam LBn from the fθ lens system FT is reflected by the mirror M24 in the -Z direction, and is projected onto the substrate P through the cylindrical lens CYb. With the fθ lens system FT and the cylindrical lens CYb whose bus bar is parallel to the Y direction, the light beam LBn projected onto the substrate P is converged to a small point of about several μm in diameter (for example, 2 to 3 μm) on the illuminated surface of the substrate P. Light SP. As described above, when the light beam LBn incident on the drawing unit Un is viewed from the XZ plane, the light beam LBn is formed along the path from the mirror M20 to the substrate P. The light path that is bent in a zigzag shape is bent, advances in the -Z direction, and is projected onto the substrate P. The spot light SP of the light beams LB1 to LB6 is scanned one-dimensionally in the main scanning direction (Y direction) by each of the six drawing units U1 to U6, and the substrate P is transported along the long side. The irradiated surface of the substrate P is scanned two-dimensionally relative to each other by the spot light SP, and each of the drawn patterns on the drawn lines SL1 to SL6 on the substrate P is exposed in a bonded state in the Y direction.

As an example, the effective scanning length LT of the drawing lines SLn (SL1 to SL6) is set to 50 mm, the effective diameter φ of the spot light SP is set to 4 μm, and the oscillation frequency Fa of the pulse light emission of the light beam LBn from the light source device LS is set to 400 MHz. When the spot light SP along the drawing line SLn (the main scanning direction) is pulsed to emit light in a manner that each overlaps 1/2 of the diameter φ, the interval in the main scanning direction of the pulse light emission of the spot light SP on the substrate P is: 2 μm, which is a period Tf (= 1 / Fa) corresponding to the oscillation frequency Fa, that is, 2.5 ns (1/400 MHz). In this case, the pixel size Pxy specified in the drawing data is set to an angle of 4 μm on the substrate P, and one pixel is exposed to two pulses of the spot light SP in each of the main scanning direction and the sub scanning direction. Therefore, the scanning speed Vsp in the main scanning direction of the spot light SP and the oscillation frequency Fa are set to Vsp = (φ / 2) / Tf = (φ / 2). Fa. On the other hand, the scanning speed Vsp is based on the rotation speed VR (rpm) of the polygon mirror PM, the effective scanning length LT, the number of reflection surfaces Np (= 8) of the polygon mirror PM, and the scanning based on one reflection surface RP of the polygon mirror PM. The rate 1 / α is determined by the following method.

Vsp = (8.α.VR.LT) / 60 [mm / second] Then, the following relationship is set between the oscillation frequency Fa (period Tf) and the rotation speed VR (rpm).

(φ / 2) / Tf = (8.α.VR.LT) / 60. ． ． ． ． ． Formula A

When the oscillation frequency Fa is set to 400 MHz (Tf = 2.5ns) and the diameter φ of the spot light SP is set to 4 μm, the scanning speed Vsp specified by the oscillation frequency Fa becomes 0.8 μm / ns (= 2 μm / 2.5ns). To correspond to this scanning speed Vsp, if the scanning rate 1 / α is set to 0.3 (α33.33) and the scanning length LT is set to 50 mm, the rotation speed VR of the 8-sided polygon mirror PM is set to 36000 rpm according to the relationship of Formula A. Just fine. In addition, the scanning speed Vsp = 0.8 μm / ns at this time is converted into a speed of 2880 Km / h.

When the rotation position of the reflecting surface RP of the polygon mirror PM is reached, the spot light SP of the beam receiving system 60b constituting the origin sensor shown in FIG. 2 is about to start scanning. At the moment of a predetermined position (predetermined angular position, origin angular position), an origin signal SZn that changes the waveform is generated. Since the polygon mirror PM has eight reflecting surfaces RP, the light beam receiving system 60b outputs the origin signal SZn eight times during one revolution of the polygon mirror. The origin signal SZn is sent to the drawing control device 200 (see FIG. 4). After the origin signal SZn is generated, after a predetermined delay time Tdn elapses, scanning of the spot light SP along the drawing line SLn is started.

FIG. 3 is a diagram showing a specific configuration around the selection optical elements OSn (OS1 to OS6) and the incident mirrors IMn (IM1 to IM6). The light beam LB emitted from the light source device LS is incident on the selection optical element OSn as a parallel light beam with a small diameter (first diameter) of 1 mm or less in diameter. While the driving signal DFn, which is a high-frequency signal (ultrasonic signal), is not input (the driving signal DFn is OFF), the incident light beam LB is directly passed without being diffracted in the selection optical element OSn. The passing light beam LB passes through the condenser lens Ga and the collimator lens Gb provided along the optical axis AXb on its optical path, and enters the selection optical element OSn at the subsequent stage. At this time, the selection optical element OSn, the light beam LB passing through the condenser lens Ga, and the collimator lens Gb are coaxial with the optical axis AXb. The condenser lens Ga condenses the light beam LB (parallel beam) of the selection optical element OSn so that the beam waist is located on the plane Ps between the condenser lens Ga and the collimator lens Gb. The collimating lens Gb forms a collimated light beam LB diverging from the plane Ps. The diameter of the light beam LB that becomes a parallel light beam by the collimating lens Gb becomes the first diameter. The rear focal position of the condenser lens Ga and the front focal position of the collimator lens Gb are consistent with the plane Ps within a predetermined allowable range. The front focal position of the condenser lens Ga corresponds to the diffraction point in the selection optical element OSn. Set in a consistent manner within a given tolerance.

On the other hand, during a period in which the high-frequency signal, that is, the drive signal DFn is applied to the ON state of the selection optical element OSn, a light beam LBn (primary diffracted light) is generated by the incident optical beam LB by the selection optical element OSn, And the undiffracted 0th order light beam LBnz. When the intensity of the incident light beam LB is 100% and the low intensity due to the transmittance of the selection optical element OSn is ignored, the intensity of the diffracted light beam LBn is about 80% at most, and the remaining 20% is 0 times The intensity of the light beam LBnz. The zero-order light beam LBnz passes through the condenser lens Ga and the collimator lens Gb, and further passes through the selection optical element OSn at the rear stage, and is absorbed by the absorber TR. The light beam LBn (parallel light beam) deflected in the -Z direction at a diffraction angle corresponding to a high frequency frequency of the drive signal DFn passes through the condenser lens Ga toward the incident mirror IMn provided on the surface Ps. Since the front focal position of the condenser lens Ga is optically conjugate with the diffraction point in the selection optical element OSn, the light beam LBn advancing from the condenser lens Ga toward the incident mirror IMn is at a position eccentric from the optical axis AXb. The optical axis AXb advances in parallel and is focused (converged) at the position of the plane Ps so as to become a beam waist. The position of the beam waist (Beam Waist) is set so as to be optically conjugate to the spot light SP projected onto the substrate P via the drawing unit Un.

By setting the reflecting surface of the incident mirror IMn or the adjacent part on the position of the plane Ps, the light beam LBn deflected (diffracted) by the optical element OSn is selected and reflected by the incident mirror IMn in the -Z direction through the collimating lens. Gc is incident on the drawing unit Un along the optical axis AX1. The collimating lens Gc forms a parallel light beam coaxial with the optical axis (AX1) of the collimating lens Gc by the light beam LBn converged / divergent by the condenser lens Ga. The diameter of the light beam LBn, which becomes a parallel light beam by the collimating lens Gc, is almost equal to the first diameter. The rear focal point of the condenser lens Ga and the front focal point of the collimator lens Gc are arranged within a predetermined allowable range on the reflecting surface of the incident mirror IMn or at an adjacent position.

As described above, if the front focal position of the condenser lens Ga and the diffraction point in the selection optical element OSn are optically conjugated, and the surface Ps serving as the rear focal position of the condenser lens Ga is arranged on the incident mirror IMn If the frequency of the driving signal DFn of the selection optical element OSn is changed by a predetermined frequency only by ± ΔFs, the eccentricity (displacement) of the optical axis AXb of the condensing point of the light beam LBn on the plane Ps can be changed. ) Changed. As a result, the spot light SP of the light beam LBn projected from the drawing unit Un onto the substrate P can be shifted by only ± ΔSFp in the sub-scanning direction. This amount of displacement (| △ SFp |) depends on the optical system (relay system) up to the maximum range of the deflection angle of the selection optical element OSn itself, the size of the reflecting surface of the incident mirror IMn, and the polygon mirror PM in the drawing unit Un. Limitations such as the magnification, the width in the Z direction of the reflecting surface RP of the polygon mirror PM, the magnification from the polygon mirror PM to the substrate P (the magnification of the fθ lens system FT), etc., but the effective size of the spot light SP on the substrate P (Diameter), or within the range of the pixel size (Pxy) defined on the drawing data. Then, the overlap error between the new pattern drawn on the substrate P by each of the drawing units Un and the pattern already formed on the substrate P, or between the new patterns drawn on the substrate P by each of the drawing units Un The overlap error can be corrected with high accuracy and high speed.

FIG. 4 is a schematic configuration diagram of a beam switching unit including a selection optical element OSn (OS1 to OS6) for selectively distributing the light beam LB emitted from the light source device LS to any one of the six drawing units U1 to U6. . Although the symbols of the components in FIG. 4 are the same as those shown in FIG. 1, the mirrors M1 to M12 shown in FIG. 1 are omitted for convenience of explanation. The light source device LS composed of a fiber amplifier laser is connected to the drawing control device 200 and performs various types of control information JS processing. The light source device LS is internally provided with a clock circuit that generates a clock signal CLK of an oscillation frequency Fa (for example, 400 MHz) when the light beam LB is emitted in pulses, based on the drawing data of each drawing unit Un transmitted from the drawing control device 200. SDn (continuous data from a bitmap with 1 pixel as a bit), let the light beam LBn respond to the burst mode (burst mode) of the clock signal CLK (a predetermined number of clock pulses of light emission and a predetermined time Pulse light emission is stopped for a few minutes). As described above, in this embodiment, the light source device LS itself adjusts the intensity of the light beam LB (pattern light emission ON / OFF switching) for pattern drawing.

The drawing control device 200 receives the origin signal of the light beam receiving section (beam receiving system, light receiving system) 60b of the origin sensor output from each of the drawing units U1 to U6, and includes a polygon rotation control unit for controlling the polygon mirror PM. The rotating motor RM and the beam switching control unit (described later in detail in Fig. 5) control the driving signals DF1 ~, which are supplied to the selection optical elements OSn (OS1 ~ OS6) as ultrasonic signals based on the origin signal SZn (SZ1 ~ SZ6). DF6 is turned ON / OFF (applied / non-applied) so that the rotation speed and the rotation angle phase of the polygon mirror PM of each of the drawing units U1 to U6 are in a specified state. In addition, in FIG. 4, in order to match the configuration of FIG. 1, the light beam LB emitted from the light source device LS passes through the selection optical elements OS5 → OS6 → OS3 → OS4 → OS1 → OS2 in order. In addition, in FIG. 4, the selection optical element OS4 among the six selection optical elements OS1 to OS6 is turned on, and the light beam LB emitted by the light source device LS (the drawing data SDn of the pattern already drawn by the drawing unit U4 is shown). (Intensity modulation) is deflected toward the incident mirror IM4, and the light beam LB4 is supplied to the drawing unit U4.

As described above, if the selection optical elements OS1 to OS6 are arranged in line on the optical path of the light beam LB, the transmission and diffraction rates of each of the selection optical elements OSn correspond to the slave light source device LS. The order of the starting selection optical element OSn, the intensity (peak intensity of the pulsed light) of the selected light beams LB1 to LB6 will differ. For this reason, it is necessary to adjust the relative difference between the intensities of the light beams LB1 to LB6 that are incident on each of the drawing units U1 to U6 (that is, the exposure amounts of the photosensitive layers of the drawing units U1 to U6 to the substrate P) to a predetermined value. Within the allowable range (for example, within ± 5%, preferably within ± 2%). In this embodiment, the intensity of the light beams LB1 to LB6 incident on each of the drawing units U1 to U6 is changed to the respective levels (high-frequency signals) of the drive signals DF1 to DF6 of the drive selection optical elements OS1 to OS6. Amplitude, or power) to adjust.

For this reason, as shown in FIG. 4, as shown in FIG. 4, at a plurality of positions in the optical path through which the light beam LB emitted from the light source device LS passes, photodetectors DTa, DTb, and DT1 for detecting the intensity of the light beam are provided. ~ DT6 to monitor the intensity of each of the light beams LB1 to LB6 supplied to each of the drawing units U1 to U6. In FIG. 4, the photodetector DTa (the first photodetector) is a certain ratio (for example, several% or less) when the light beam LB emitted from the light source device LS is reflected by the reflector M1 in FIG. 1. The penetrating overflow light is received, and a photoelectric signal corresponding to its intensity is output. The photoelectric signal from the photodetector DTa is input to a detection circuit CKa including an amplifier, a sampling and holding circuit, and an analog / digital converter. The detection circuit CKa outputs a detection signal Sa corresponding to the intensity of the light beam LB emitted from the light source device LS. . In addition, when the light source device LS has a wavelength conversion element, the light beam in the long wavelength region before the wavelength conversion is overlapped with the light beam LB in the ultraviolet wavelength region and output. A wavelength filter that passes the light beam LB in the ultraviolet wavelength range.

The photo-sensor DTb (second photo-sensor) is a light beam LB received from the light source device LS and passes through the six selection optical elements OS5, OS6, OS3, OS4, OS1, and OS2 in order, and is incident on the The light beam (0th order light) that passes through the partial mirror Mb provided before the absorber TR. The partial mirror Mb is used as the amplitude of the absorber TR and the photodetector DTb among the six selection optical elements OS1 to OS6 through the light beam (0th order light) of the last selection optical element OS2. The split beam splitter works. The photoelectric signal output from the photodetector DTb is input to a detection circuit CKb including an amplifier, a sampling and holding circuit, an analog / digital converter, etc., and the detection circuit CKb outputs a light beam corresponding to the selection optical element OS2 passing through the last stage ( 0th light) detection signal Sb. Here, the detection signals Sa, Sb output from the detection circuits CKa, CKb are adjusted so that the intensity of the light beams received by each of the photodetector DTa and the photodetector DTb becomes the same value at the same time ( Correction).

In this embodiment, the reflection of the reflection mirror M22 reflected by each of the incident mirrors IMn (IM1 to IM6) and incident on the respective beams LBn (LB1 to LB6) of the drawing unit Un (U1 to U6) is reflected. On the back side, photodetectors DT1 to DT6 that receive the spilled light of the light beam LBn in the mirror M22 are arranged. The reflecting surface of the reflector M22 reflects a large portion (for example, about 98%) of the incident light beam LBn, and the remaining intensity portion passes through as diffused light. Although omitted in FIG. 4, the photoelectric signals Sm1 to Sm6 emitted from each of the photosensors DT1 to DT6 are individually amplified by the same detection circuits as the detection circuits CKa and CKb, and corresponding to the photoelectric signals Sm1 to Measurement signal (digital value) of each intensity of Sm6. In actual exposure control, although these measurement signals are used, for the convenience of explanation, the exposure controller is based on each intensity of the photoelectric signals Sm1 to Sm6. The respective intensities of the photoelectric signals Sm1 to Sm6 (enlarged measurement signals) correspond to the absolute intensities of the spot light SP (beams LB1 to LB6) that are projected onto the substrate P through each of the drawing units U1 to U6. The magnification in the detection circuit is corrected. Therefore, in order to make the intensity of each of the photoelectric signals Sm1 to Sm6 within a predetermined allowable range (for example, within ± 2%) for exposure control (intensity correction), the patterns drawn by each of the drawing units U1 to U6 will be exposed at the same exposure. The amount (dose) is exposed.

FIG. 5 shows an intensity adjustment control unit 250 provided in the drawing control device 200 of FIG. 4 to control the exposure amount of each drawing unit Un, and generates a drive signal for each of the selection optical elements OS1 to OS6. Diagrams of the structures of the drive circuits 251a to 251f of DF1 to DF6. In addition to the intensity adjustment control section 250, the photoelectric signals Sm1 to Sm6 (amplified measurement signals) shown in FIG. 4 and the detection signals Sa and Sb from the detection circuits CKa and CKb are input, and the processing and drawing control device 200 is input. Various control information IFD between main control CPU. Each of the driving circuits 251a to 251f receives a high-frequency signal from the oscillation circuit RF, and outputs a driving signal DF1 to an over-amplitude (electricity) adjustment signal corresponding to the adjustment signals Pw1 to Pw6 issued by the gain adjustment circuits 252a to 252f. DF6. The intensity adjustment control unit (beam intensity measurement unit) 250 is based on the photoelectric signals Sm1 to Sm6 and the control information IFD, and changes the instruction information (digital target value) of each of the adjustment signals Pw1 to Pw6 of the gain adjustment circuits 252a to 252f. Calculated and sent out after the solution. In this embodiment, the intensity adjustment control unit 250 adjusts the intensity of each of the light beams LB1 to LB6 so that the exposure amount of each of the drawing units Un is consistent with the target value specified by the control information IFD.

Further, the intensity adjustment control unit 250 responds to each of the origin signals SZ1 to SZ6, and outputs the driving circuits 251a to 251f so that each of the selection optical elements OS1 to OS6 is only at a predetermined time (the light beam LBn is a reflective surface of the polygon mirror PM). During the scan) Switching signals LP1 to LP6 are switched to the OFF state after the ON state. Each of the driving circuits 251a to 251f switches the response signals LP1 to LP6, so that the driving signals DF1 to DF6 switch between the applied state and the non-applied state to the selection optical elements OS1 to OS6.

FIG. 6 is a diagram showing an example of changes in the diffraction efficiency CCa as a function of the RF power (amplitude) of the drive signal DFn applied to the acousto-optic modulation element used as the selection optical element OSn. In FIG. 6, the horizontal axis represents the RF power of the driving signal DFn, and the vertical axis represents the diffraction efficiency (the ratio between the intensity of the incident light beam LB and the intensity of the deflected light beam LBn) β of the acousto-optic modulation element. The diffraction efficiency β tends to increase with the increase of the RF power input in the adjustment possible range ΔKn, and gradually decreases after reaching the maximum diffraction efficiency (the upper limit of the adjustment possible range ΔKn) at a certain power value Pwm. Although the maximum efficiency varies depending on the crystalline medium of the acousto-optic modulation element, it is 80% or less. The lower limit of the adjustment possible range ΔKn of the efficiency β is widely selected to a relatively low value, and the power value corresponding to the lower limit is set to Pwo. In FIG. 3 shown previously, the intensity of the light beam LB incident on the selection optical element OSn is set to Eo (100%), the efficiency of the selection optical element OSn is set to βn (%), and the transmittance is set to εn ( %), The intensity Ed of the light beam LBn to which the optical element OSn is deflected is expressed as Ed = εn. βn. Eo, the intensity Es of the light beam LBnz passing without being deflected is expressed as Es = εn. (1-βn). Eo. The change characteristic CCa of the efficiency β changes when the incident angle of the light beam LB incident on the selection optical element OSn changes slightly, or when the temperature of the crystalline medium (or quartz) of the selection optical element OSn changes significantly. Therefore, even if the same RF power is not applied to the selection optical element OSn, the intensity of the deflected light beam LBn will change. In addition, the transmittance εn is determined by the absorption characteristics of the crystalline medium (or quartz) of the selection optical element OSn or the characteristics of the antireflection film covering the incident surface or the outgoing surface, and is generally a fixed value that does not change. (E.g. 95%). However, when the light beam in the ultraviolet region is passed for a long time, the transmittance gradually changes (lower) due to aging and other factors.

In this embodiment, the values of the photoelectric signals Sm1 to Sm6 corresponding to the intensity of each of the light beams LB1 to LB6 measured by the photosensors DT1 to DT6 shown in FIG. 4 correspond to the corresponding exposure amounts. The set target value is, for example, suppressed to within ± 2%. In the pattern exposure operation, the power supply (amplitude) of each of the drive signals DF1 to DF6 can be adjusted (corrected) by the intensity adjustment control unit 250 using feedback. However, when it is necessary to change the appropriate exposure amount, although the efficiency β of the selection optical element OSn is changed to adjust the intensity of each of the light beams LBn, this adjustment causes other restrictions. These restrictions will be described using FIG. 7.

FIG. 7 schematically shows the intensity of each of the light beams LB1 to LB6 supplied to the drawing units U1 to U6 and the adjustment possible range of the selection optical elements OS1 to OS6 for adjusting the intensity of each of the light beams LB1 to LB △ K1 to △ K6 illustration. In FIG. 7, the horizontal axis corresponds to the sequence of the light beam LB supplied from the light source device LS. From the left, the intensity and possible adjustment range of each pair of light beams LBn of the drawing units U5, U6, U3, U4, U1, and U2 are ΔKn. (△ K1 ~ △ K6). As shown in FIG. 4 (FIG. 1), when the six selection optical elements OS1 to OS6 are arranged in series along the optical path of the light beam LB, the degree of transmittance εn of the selection optical elements OS1 to OS6 or each of them The difference in the transmittance εn also varies depending on the adjustment state of the efficiency βn based on each of the selection optical elements OS1 to OS6.

For example, among the intensity E5 of the light beam LB5 (the value detected by the photodetector DT5) deflected by the selection optical element OS5 closest to the foremost stage of the light source device LS, if the light beam LB is emitted from the light source device LS The intensity is set to Eo (the value detected by the photodetector DTa). By selecting the optical element OS5's transmittance ε5 and efficiency β5, E5 can be expressed as E5 = ε5. β5. Eo. On the other hand, the intensity E2 of the light beam LB2 deflected by the selection optical element OS2 furthest from the final stage of the light source device LS is the product of all the transmittances of the six selection optical elements OS1 to OS6 and the efficiency β2, E2 can be expressed as E2 = ε5. ε6. ε3. ε4. ε1. ε2. β2. Eo. If the transmittance of each of the six selection optical elements OS1 to OS6 is 95%, the intensity E5 of the light beam LB5 is E5 = 0.95. β5. Eo, the intensity E2 of the light beam LB2 is E5 = 0.735. β2. Eo. In order to make the intensity E5 of the light beam LB5 equal to the intensity E2 of the light beam LB2, it is necessary to set the efficiency β5 of the selection optical element OS5 low and set the efficiency β2 of the selection optical element OS2 high.

Setting the efficiency β5 of the selection optical element OS5 lower means that the power value is lowered on the efficiency change characteristic CCa shown in FIG. 6 and the efficiency β2 of the selection optical element OS2 is set higher. Refers to increasing the value of electricity. In the case of the setting shown in FIG. 7, when the intensity of each of the light beams LB1 to LB6 is set within the allowable range based on the target value (for example, ± 2%), the efficiency β5 of the selection optical element OS5 in the foremost stage is set to The lower side of the adjustment range of efficiency (electricity) ΔK5, and the efficiency β2 of the final selection optical element OS2 is set to the upper side of the adjustment range of efficiency (electricity) ΔK2. In the case of FIG. 7, the final selection optical element OS2 is close to the upper limit of the adjustment possible range ΔK2 (corresponding to the power value Pwm), and the first selection optical element OS5 is close to the lower limit of the adjustment possible range ΔK5. (Corresponds to the power value Pwo). Therefore, in FIG. 7, when the target value of the intensity of the light beams LB1 to LB6 is changed, the possible setting range of the intensity (exposure amount) is limited to the upper limit of the possible adjustment range ΔK2 of the efficiency of the selection optical element OS2 and the efficiency of OS5 The possible adjustment range is between the lower limit of △ K5.

In an actual device, the intensity of the light beam LB2 deflected by the selection optical element OS2, which is the most attenuated final stage, is the maximum value of the light beam LB emitted from the light source device LS in order to achieve an appropriate exposure amount to the photosensitive layer of the substrate P The intensity (power) is set to leave some margin. Therefore, when the appropriate exposure amount is adjusted based on the difference in sensitivity of the photosensitive layer of the substrate P or the thickness of the photosensitive layer, can the target value of the intensity be changed within the possible range of the intensity (exposure amount) setting in FIG. The drawing control device 200 or the intensity adjustment control unit 250 determines. In order to set a new target value of the intensity of the light beams LB1 to LB6 corresponding to the appropriate exposure amount to be adjusted, when the intensity (exposure amount) setting range in FIG. 7 is within the range, the efficiency βn of each of the optical elements OS1 to OS6 is selected. The current values are corrected, and the RF power of each of the drive signals DF1 to DF6 is corrected based on the efficiency change characteristics of FIG. 6.

When the new target value of the intensity of the light beams LB1 to LB6 corresponding to the appropriate exposure amount to be adjusted is deviated above the possible range of the intensity (exposure amount) setting in FIG. 7, even if it is adjusted (corrected) as such, it is finalized. The exposure amount of the light beam LB2 (drawing unit U2) deflected by the selection optical element OS2 will be insufficient. When the target value deviates below the possible range of the intensity (exposure amount) setting in FIG. 7, even if it is adjusted (corrected) , The exposure amount of the light beam LB5 (drawing unit U5) deflected by the front-end selection optical element OS5 will be excessive. As in this embodiment, when the plurality of selection optical elements OSn are arranged in line along the optical path of the light beam LB emitted from the light source device LS, the intensity of the light beam LB is slow due to changes or aging of internal components of the light source device LS. In the case of a slow decrease, in order to maintain the intensity of each of the light beams LBn at a target value, the efficiency βn of each of the selection optical elements OSn will be individually increased. For this reason, the adjustment possible range ΔKn of the efficiency βn of each of the selection optical elements OSn shown in FIG. 7 is shifted relatively downward based on the target value. At this time, if the efficiency βn and the transmittance εn of each of the selection optical elements OSn are the same, the adjustment range ΔK2 of the efficiency β2 of the selection optical element OS2 located in the final stage reaches the upper limit from the beginning, and cannot be changed. Adjust upwards.

Therefore, in the present embodiment, the intensity of the light beam LB emitted from the light source device LS is changed by the detection signal Sa sent from the detection circuit CKa shown in FIG. 4 through the drawing control device 200 or the intensity adjustment control unit 250 to sequentially monitor In order to maintain an appropriate exposure amount (the target value in FIG. 7) without relying on its intensity change, in particular, confirm that the efficiency β2 (RF power) of the selection optical element OS2 in the final stage of the selection optical element OSn may be adjusted. Whether the range △ K2 is possible. If possible, in order to adjust the efficiency βn of all the selection optical elements OSn including the selection optical element OS2, the RF power (amplitude) of each of the drive signals DFn is controlled by the intensity adjustment control unit 250. As described above, in order to confirm the relationship between the efficiency β2 (RF power) in the final selection optical element OS2 and the adjustment possible range ΔK2, it is assumed that the efficiency βn and the transmittance εn of all the selection optical elements OSn are Similarly, as in the first embodiment, the measurement efficiency βn and the transmittance εn specify the selection optical element OSn that exhibits a change in the effective efficiency βn or a change in the transmittance εn from the allowable range, and confirms the selection. The relationship between the efficiency βn (RF power) in the optical element OSn and the adjustment possible range ΔKn is used to adjust the intensity of each light beam LBn based on the drawing unit Un to be consistent.

As described above, in this embodiment mode, each of the plurality of selection optical elements (acousto-optic modulation elements) OSn provided in such a manner that the light beam LB emitted from the light source device LS passes through in order is selected. In the case where it is supplied to any one of the corresponding drawing units Un, even if the intensity of the light beam LB from the light source device LS is low, the adjustment range of the efficiency (change in beam intensity) of each of the plurality of selection optical elements OSn is possible ΔKn Since the intensity of each of the light beams LBn supplied to the drawing unit Un is adjusted, the drawn pattern of each of the drawing unit Un is exposed with the same exposure amount (for example, within a tolerance range of ± 2%). Then, the uniformity of the line widths on the continuous portions of the exposed patterns of each of the drawing units Un is maintained.

[Second embodiment]

In the above-mentioned embodiment, the efficiency β2 (RF power) and the adjustment possible range ΔK2 in the selection optical element OSn, particularly in the selection optical element OS2 located at the final stage, are focused on each of the transmission drawing units Un It is judged whether the appropriate exposure amount of the image is consistent with the pattern drawing. However, when there is a large difference in the efficiency βn (RF power) of each of the optical elements OSn for selection, as shown in FIG. 7, the adjustment range of the efficiency β2 (RF power) of the efficiency of the optical element OS2 for selection in the final stage is not focused. ΔK2 is based on the adjustment possible range ΔKn of the efficiency βn of all the selection optical elements OSn, and it is better to determine whether or not a specified appropriate exposure amount (target value of the intensity of the light beam LBn) can be obtained. For this reason, it is necessary to grasp the state of fluctuations in the efficiency βn of each of the selection optical elements OSn at appropriate time intervals, and to reset the adjustment possible range ΔKn. Therefore, in the present embodiment, the variation in the efficiency βn of each of the optical elements for selection OSn is measured using the detection signals Sa and Sb from each of the photodetectors DTa and DTb shown in FIG. 4.

FIG. 8 is a diagram schematically showing that among the six selection optical elements OS1 to OS6 arranged in line along the traveling direction of the light beam LB emitted from the light source device LS, the third selection optical element OS3 is turned on, and the other five selections are turned on. A diagram showing the state of occurrence of each light beam when the optical elements OS5, OS6, OS4, OS1, and OS2 are turned off. In FIG. 8, since the selection optical element OS3 is turned on, the selection optical element OS3 advances in a non-biased state as a light beam LB3z of 0th order, and is received by the photodetector DTb, and is detected as the detection signal Sb. Output. Here, the intensity of the detection signal Sa corresponding to the intensity of the light beam LB received by the photodetector DTa is set to Ea, and the photoinductor DTb is turned off when all of the selection optical elements OSn (OS1 to OS6) are turned OFF. When the intensity of the detection signal Sb corresponding to the intensity of the 0th-order light of the received light beam LB is set to Eb0, the intensity Eb0 can be expressed by the following formula 1 using the transmittance εn.

Eb0 = ε5. ε6. ε3. ε4. ε1. ε2. Ea. ． ． ． (1) Here, the product of the six transmittances ε1 to ε6 is represented by Kε. In order to obtain the intensity Ea and the intensity Eb0, the light source device LS uses a light beam when all the selection optical elements OSn are OFF, that is, during a period when all the selection optical elements OSn are not patterned. The LB performs pulse light emission only for a short time by selecting each of the optical elements OSn.

Next, only when the front-end selection optical element OS5 is turned on, the intensity Eb5 of the detection signal Sb corresponding to the intensity of the 0th light received by the photodetector DTb will select the efficiency β5 of the selection optical element OS5. After the addition, it can be expressed as the following formula 2.

Eb5 = Kε. (1-β5). Ea. ． ． ． ． ． ． ． ． ． (2)

Similarly, when the selection optical elements OS6, OS3, OS4, OS1, and OS2 are sequentially turned ON, the intensity of the detection signal Sb corresponding to the intensity of the 0th light received by the photodetector DTb is Eb6, Eb3, Eb4, Eb1, and Eb2 can be expressed by the following formulas 3 to 7, respectively.

Eb6 = Kε. (1-β6). Ea. ． ． ． ． ． ． ． ． ． (3)

Eb3 = Kε. (1-β3). Ea. ． ． ． ． ． ． ． ． ． (4)

Eb4 = Kε. (1-β4). Ea. ． ． ． ． ． ． ． ． ． (5)

Eb1 = Kε. (1-β1). Ea. ． ． ． ． ． ． ． ． ． (6)

Eb2 = Kε. (1-β2). Ea. ． ． ． ． ． ． ． ． ． (7)

From the above equations 1 to 7, the intensity adjustment control unit 250 having the function of the beam intensity measurement unit is based on the intensity Ea of the detection signal Sa corresponding to the light beam LB received by the photodetector DTa, and the photodetector The intensity Ebn (Eb1 to Eb6) of the detection signal Sb corresponding to the 0th order light beam LBnz received by DTb, the efficiency βn of each of the selection optical elements OSn at the time of measurement (in the pattern exposure operation) is determined by the following Equation 8 is obtained.

βn = 1- (Ebn / Eb0). ． ． ． ． ． ． ． ． ． ． ． (8).

In addition, in the pattern exposure operation, each intensity (corresponding to the magnitude of the photoelectric signals Sm1 to Sm6) of each of the deflected light beams LB1 to LB6 detected by the photosensors DT1 to DT6 shown in FIG. 4 is set to Es1. In the case of ~ Es6, based on the measured respective efficiency βn, the transmittance ε5 of the front-end selection optical element OS5 is based on Es5 = ε5. β5. The relationship of Ea will become ε5 = Es5 / (β5.Ea). ． ． ． ． ． ． ． ． ． ． (9).

The transmission rate ε6 of the optical element OS6 for selection in the next paragraph is based on Es6 = ε6. ε5. β6. The relationship of Ea will become ε6 = Es6 / (ε5.β5.Ea). ． ． ． ． ． ． ． ． (10).

Because the transmittance ε5 can be obtained by formula 9, if it is brought into formula 10, the transmittance ε6 will become ε6 = (β5.Es6) / (β6.Es5). ． ． ． ． ． (11).

Further, the transmittance ε3 of the selection optical element OS3 in the next paragraph is based on Es3 = ε3. ε6. ε5. β3. The relationship of Ea will become ε3 = Es3 / (ε6.ε5.β3.Ea). ． ． ． ． ． ． (12).

Because the transmittance ε5, ε6 can be obtained by formulas 9 and 11, ε6. ε5 will become ε6. ε5 = Es6 / (β6.Ea), if we put it into Equation 12, the transmittance ε3 will become ε3 = (β6.Es3) / (β3.Es6). ． ． ． ． ． (13).

In the same way, the transmittance ε4 of the optical element OS4 is selected, the transmittance ε of the optical element OS1 is selected, and the transmittance ε2 of the optical element OS2 is selected, from Es4 = ε4. ε3. ε5. ε6. β4. Ea, Es1 = ε1. ε4. ε3. ε5. ε6. β1. Ea, Es2 = ε2. ε1. ε4. ε3. ε5. ε6. β2. Ea, relationship becomes.

ε4 = (β3.Es4) / (β4.Es3). ． ． ． ． ． (14)

ε1 = (β4.Es1) / (β1.Es4). ． ． ． ． ． (15)

ε2 = (β1.Es2) / (β2.Es1). ． ． ． ． ． (16)

In addition, in order to perform the above calculations correctly, the values of the signals measured by the photodetectors DTa, DTb, and DT1 to DT6 are calibrated in advance with absolute values that accurately correspond to the intensity of the received beam. .

The intensity of each light beam LBn from the drawing unit Un is adjusted to an appropriate exposure amount. When the pattern exposure is performed, as described above, in an appropriate time interval, for example, when each exposure area on the substrate P is exposed, it is sequentially By measuring the efficiency βn and the transmittance εn of each of the six selection optical elements OSn, it is possible to specify a drawing unit where the exposure amount may vary. In order to correct this variation, the intensity shown in FIG. 5 is used. The adjustment control unit 250 can adjust a drive signal DTn corresponding to the selection optical element OSn of the drawing unit Un. In this embodiment mode, in addition to the photodetector DTa that detects the intensity of the light beam LB emitted from the light source device LS, the zero-order light of the light beam LB that passes through the six selection optical elements OS1 to OS6 is also provided by detection. The light intensity measuring unit of the photodetector DTb and the detection circuit CKb of the high-intensity can easily measure the current efficiency β1 to β6 or the variation of each of the selection optical elements OS1 to OS6. Therefore, it is possible to make a slight deflection of the optical path of the light beam caused by changes in the refractive index of each of the selection optical elements OS1 to OS6 due to the influence of heat and changes in other optical elements (condensing lenses or collimating lenses). The selection optical element OSn has a variation in the specific efficiency βn. Further, from the variation in the measured efficiency βn, the adjustment possible range ΔKn shown in FIG. 7 for correcting the intensity of the light beam LBn can be confirmed and set again.

In addition, the photodetectors DT1 to DT6 that detect the intensity of the deflected light beams LB1 to LB6 in each of the selection optical elements OS1 to OS6 are provided in each of the drawing units U1 to U6, because it can be simple The transmittances ε1 to ε6 of the optical elements for measurement selection OS1 to OS6, or variations thereof, can accurately maintain and expose the appropriate exposure amount of the pattern drawn by each of the drawing units U1 to U6. In addition, according to this embodiment, even if the intensity Ea of the light beam LB emitted from the light source device LS measured by the photodetector DTa has changed, the efficiency βn and the penetration of each of the optical elements OSn for selection can be obtained. The rate εn can be calculated (measured) and supplied to the drawing unit Un with high accuracy through the drawing control device 200 or the intensity adjustment control unit 250 without using each of the photodetectors DT1 to DT6 provided in the drawing unit Un. The intensity of each light beam LBn.

[Modification 1]

In the above-mentioned embodiment, although each of the plurality of selection optical elements OSn is used as an acousto-optic modulation element (AOM), the light beam LBn is deflected in each of the drawing units Un by a diffraction effect, but a photoelectric element may also be used. A polarized light beam splitter (polarized light separating element) is used to deflect the light beam LBn. Photoelectric elements are KDP (KH ₂ PO ₄ ), ADP (NH ₄ H ₂ PO ₄ ), KD * P (KD ₂ PO ₄ ), KDA (KH ₂ AsO ₄ ), BaTiO ₃ , SrTiO ₃ , LiNbO ₃ , LiTaO The materials listed in ₃ etc. are used as the chemical composition. The photoelectric element changes the refractive index according to an applied electric field, and rotates an incident linearly polarized light beam by 90 °. Therefore, when the light beam emitted from the photoelectric element is incident on the polarized light beam splitter, it is possible to switch between the state in which the polarization direction is reflected toward the drawing unit Un and the state in which it passes without being deflected. In the case of this modification, in a state where the light beam emitted from the photoelectric element is reflected toward the drawing unit Un by the polarized light beam splitter, the overflow light passing through the polarized light beam splitter passes through the selection optical element in the subsequent stage. Each optical element of the OSn and the polarized light beam splitter can be detected in the same manner as shown in FIG. 4 by the photo sensor DTb. However, in order to ensure the intensity of the stray light, it is not allowed for the photoelectric element to accurately rotate the polarization direction of the linearly polarized light beam incident on the photoelectric element by 90 °, and it is preferable to intentionally make a slight angle from 90 ° The bias mode sets the applied electric field.

[Modification 2]

In the above-mentioned embodiment, although the light beam LB emitted from the light source device LS is selectively supplied to any one of the plurality of drawing units Un, the selection optical element OSn for switching is also used to adjust the orientation drawing unit. The intensity of each of the light beams LBn of Un, but the switching function and the function of intensity adjustment may also be implemented by individual optical elements. For example, it is better to let the selection optical element OSn of the foregoing embodiment only be used for switching, and the intensity adjustment may be made by other polarization adjustment members that control the polarization state of the light beam LBn and correct the intensity of the light beam. As the polarization adjusting member, a photoelectric element (a device that changes the direction of polarized light by a Pockels effect or a Kerr effect that changes the refractive index by passing through an electric field) that is incident with a linearly polarized light beam, and a device that emits light from the photoelectric element is used. A composition such as a polarizing plate through which a polarized light component in a predetermined direction in a light beam passes. The polarization adjusting member described above may be provided inside each of the drawing units Un, or only one light source device LS and the front-end selection optical element OS5 may be provided.

[Modification 3]

In addition, in the case where the intensity adjustment members are individually provided, if the change in the efficiency βn or the transmittance εn of each of the selection optical elements OSn for switching tends to slow down, it may be provided in the drawing unit Un in FIG. 2. In the optical path of the light beam LBn enlarged by a beam expander (not shown) between the mirror M20 and the mirror M20a, a glass plate (variable neutral gray filter) imparting a concentration distribution is provided so that the transmittance gradually changes. On the glass plate, the glass plate is moved in such a manner that the penetration positions of the light beams LBn are staggered from each other to adjust the intensity.

[Other Modifications]

In each of the above embodiments, the configuration in which the light beam LB emitted from the light source device LS is selectively supplied to any one of the plurality of drawing units U1 to U6 has been disclosed. However, according to the scanning efficiency of the polygon mirror PM 1 / α may be to prepare two light source devices LS, and the light beam LB emitted from one of the light source devices LS may be selectively supplied to any one of the three odd-numbered drawing units U1, U3, and U5, for example. The light beam LB emitted from the other light source device LS is controlled to be selectively supplied to any one of the even-numbered three drawing units U2, U4, and U6. In addition, the number of light beams LB emitted from one light source device LS to be switched and supplied to the drawing unit in a time-division multiplexing manner is not limited to six or three, as long as it is two or more. In addition, although the rendering unit of each implementation state uses a rotating polygon mirror PM to perform beam scanning, a scanning galvanometer (Galvanometer Mirror, scanning member) vibrating around the rotation axis APx in a certain angular range may be used instead. The light beam LBn incident on the fθ lens system FT is scanned.

Claims (20)

    A pattern drawing device that scans a light beam emitted from a light source device on a substrate by a scanning member, and draws a pattern on the substrate by a plurality of drawing units that draw a pattern. The pattern drawing device includes a beam switching unit and a plurality of selection optics. Means for selectively supplying a light beam emitted by the light source device to one of the plurality of drawing units, the plurality of selection optical members are arranged to guide the light beam emitted by the light source device in order to pass through, and The light beam is directed toward the drawing unit by electric control; and the control unit adjusts the intensity of the light beam projected from a specific drawing unit of the plurality of drawing units to the substrate in a case corresponding to the specific drawing unit. The intensity of the light beam projected onto the substrate is adjusted within an adjustable range of the beam intensity adjustment unit so that the intensity of the light beam projected onto the substrate from each of the drawing units other than the specific drawing unit is the same as that of the specific drawing unit. Control the way that the intensity of the light beam projected onto the substrate is uniform The intensity of the beam corresponding to the respective adjusting portions other drawing units.         For example, the pattern drawing device of the first patent application range, wherein the selection optical component is an acousto-optic modulation element that deflects a light beam emitted from the light source device toward the drawing unit through a diffraction effect.         For example, the pattern drawing device of the second scope of the patent application, wherein the beam intensity adjusting section includes a driving signal for the acousto-optic modulation element in a manner of adjusting the efficiency of the acoustooptical modulation element used as the selection optical member. Drive circuit for adjustment.         For example, in the pattern drawing device of claim 3, the control unit compares the adjustable range of the efficiency of the acousto-optic modulation element constituting each of the plurality of selection optical members to draw from the plurality of The intensity of each light beam projected by each of the units onto the substrate is adjusted in such a manner that the intensity is the same.         For example, the pattern drawing device according to item 4 of the scope of patent application, wherein the control unit measures the efficiency of the acousto-optic modulation element constituting each of the plurality of selection optical members, and uses detection to penetrate the plurality of acousto-optic tones. A signal output from the photodetector of the variable element at the intensity of the 0th light of the light beam emitted from the light source device.         For example, the pattern drawing device according to item 1 of the patent application range, wherein the selection optical member is an electro-optic element that changes a polarization state of a light beam emitted from the light source device by a change in refractive index, and uses the polarization state to The polarized light separating element that the light beam is deflected toward the drawing unit is configured.         A pattern drawing device that scans a light beam emitted from a light source device on a substrate by a scanning member, and draws a pattern on the substrate by a plurality of drawing units that draw a pattern. The pattern drawing device includes a beam switching unit and a plurality of selection optics. A means for selectively supplying a light beam emitted by the light source device to one of the plurality of drawing units, the plurality of selection optical members are arranged to pass the light beam emitted by the light source device in order, and The light beam is directed toward the drawing unit by electric control; a plurality of light beam intensity adjusting sections are provided corresponding to each of the plurality of drawing units, and can adjust the intensity of the light beam projected onto the substrate within a predetermined range; and control And controlling the plurality based on the adjustable range of the intensity of the light beam selected by the selection optical member that finally entered the light beam emitted by the light source device from the plurality of selection optical members and projected to the substrate via the drawing unit. Beam intensity adjusting sections Each of the substrate to the consistent projection beam intensity plotted unit.         For example, the pattern drawing device according to item 7 of the application, wherein the selection optical member is an acousto-optic modulation element that deflects a light beam emitted from the light source device toward the drawing unit through a diffraction effect.         For example, the pattern drawing device of the eighth aspect of the patent application, wherein the beam intensity adjusting section includes a driving signal for the acousto-optic modulation element in a manner of adjusting the efficiency of the acoustooptical modulation element used as the optical member for selection. Drive circuit for adjustment.         For example, in the pattern drawing device according to item 9 of the scope of patent application, the control unit compares the adjustable ranges of the efficiency of the acousto-optic modulation elements constituting each of the plurality of selection optical members to draw from the plurality of The intensity of each light beam projected by each of the units onto the substrate is adjusted in such a manner that the intensity is the same.         For example, in the pattern drawing device of the tenth aspect of the patent application, in order to measure the efficiency of the acousto-optic modulation element constituting each of the plurality of selection optical members, the control unit penetrates the plurality of acousto-optic tones by detecting. A signal output from the photodetector of the variable element at the intensity of the 0th light of the light beam emitted from the light source device.         For example, the pattern drawing device according to item 7 of the patent application, wherein the selection optical member is an electro-optic element that changes a polarization state of a light beam emitted from the light source device by a change in refractive index, and uses the polarization state to The polarized light separating element that the light beam is deflected toward the drawing unit is configured.         A pattern drawing device that uses a scanning member to scan a light beam emitted by a light source device on a substrate to draw a pattern of a plurality of drawing units. The pattern is drawn on the substrate, and includes a beam switching unit corresponding to the drawing unit of the plurality of drawing units. Each is provided with an electro-optical selection optical member for deflection of the light beam emitted from the light source device toward the drawing unit, and each has a method of allowing the light beam emitted from the light source device to pass through the plurality of selection optical members in order. A plurality of optical elements for guiding light; a switching control unit for supplying one of the plurality of drawing units with a light beam emitted by the light source device selectively to one of the plurality of selection optical members Providing a driving signal for deflection; and a beam intensity measuring section that detects the intensity of a light beam that has penetrated the selection optical member provided with the driving signal among the plurality of selection optical members, and measures the supply The light beam to each of the plurality of drawing units Strength of.         For example, the pattern drawing device according to item 13 of the patent application, wherein the selection optical member is configured to deflect the light beam in the non-biased state and the light beam emitted by the light source device toward the drawing unit in response to the driving signal. Acousto-optic modulation element produced by the light beam.         For example, the pattern drawing device according to item 13 of the patent application, wherein the selection optical component includes a method of deflecting the light beam in the non-biased state and the light beam emitted by the light source device toward the drawing unit in response to the driving signal. An electro-optic element that is generated by the beam.         A pattern drawing device that uses a scanning member to scan a light beam emitted by a light source device on a substrate to draw a pattern on the substrate, and draws a pattern on the substrate. The pattern drawing device includes a beam switching unit corresponding to each of the plurality of drawing units. An acousto-optic modulation element is provided for deflection of the light beam emitted by the light source device toward the drawing unit, and the light-emitting device has a method of guiding the light beam emitted by the light source device through each of the plurality of acousto-optic modulation elements in order. A plurality of optical elements of light; the control unit switches one of the plurality of acousto-optic modulation elements to one of the plurality of drawing units in order to sequentially supply the light beam emitted by the light source device to one of the plurality of drawing units to A deflection state; and a beam intensity measuring unit that detects the intensity of a light beam that penetrates the acousto-optic modulation element in the deflected state among the plurality of acousto-optic modulation elements in a non-biased state, and measures the amount of light supplied to the plurality of drawing units. The intensity of each of the aforementioned beams.         For example, the pattern drawing device of the 16th aspect of the patent application, wherein the beam intensity measuring unit is provided with a light beam emitted from the light source device, which is incident on the acousto-optic modulation element that is incident on the foremost stage of the plurality of acousto-optic modulation elements. A first photoinductor for detecting the intensity; and a second photoinductor for detecting the intensity of the light beam passing through the non-biased state of each of the plurality of acousto-optic modulation elements.         For example, the pattern drawing device of the 17th scope of the patent application, in which the aforementioned beam intensity measuring section is switched to a biased state by one of the plurality of acousto-optic modulation elements each time by the aforementioned control section, based on The photoelectric signals outputted by the first photoinductor and the second photoinductor calculate information about the efficiency of each of the plurality of acousto-optic modulation elements.         For example, the pattern drawing device of claim 18, wherein the beam intensity measuring unit is provided with a plurality of first light beams that are supplied to each of the drawing units after being biased by each of the plurality of acousto-optic modulation elements. 3 photosensor.         For example, the pattern drawing device according to item 19 of the patent application range, wherein the beam intensity measuring unit is based on the photoelectric signals output from the second photo-sensor and the plurality of third photo-sensors, and the calculated value. Information about the efficiency of each of the plurality of acousto-optic modulation elements is used to calculate information about the transmittance of the plurality of acousto-optic modulation elements.