TW201827874A - Optical module including silicon photonics chip and coupler chip - Google Patents

Abstract

An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.

Description

 Optical module including a calender wafer and a coupler wafer  

The invention is related to an optical module. More specifically, the invention relates to an optical module having a neon device.

 Related application  

This application claims the benefit of the following application in the specification of 35 USC § 119(e): US Application No. 62/131,971, filed on March 12, 2015; US application filed on March 12, 2015 US Patent Application No. 62/132,739, filed on March 13, 2015; U.S. Application Serial No. 62/134,173, filed on March 17, 2015, and U.S. Application Serial No. 62/ 134, 229, filed on May 17, 2015; U.S. Application No. 62/215,932, filed on September 9. US Application Nos. 62/131,971, 62/131,989, 62/131,739, 62/134,166, 62/134,173, 62/134,229, 62/158,029 And the full content of each of the cases in No. 62/215,932 is incorporated.

The use of optical interconnects to replace electrical interconnects can achieve significant gain bandwidth and bandwidth density (Gb/s/m ² of the surface area occupied by the receiver); however, optical interconnects already exist in telecommunications networks (cross In the heart of the sea network, metropolitan network, etc., they do not reach the level of integration, and the cost and energy efficiency are not enough to replace the electrical interconnection on the short-range link. For example, optical interconnects based on Vertical Cavity Surface Emitting Laser (VCSEL) are still ten times more expensive than electrical interconnects. The use of mass manufacturing techniques and the concept of low-cost electronic processes has enabled the integration of optical functions into germanium substrates. The infrastructure used to make electronic integrated circuits and the enthalpy can also be used in opto-integrator circuits, significantly reducing their cost.

Much of the development effort has focused on integrating light into the ,, but less on coupling light from the illuminating element to the fiber. Many prior art optical modules that utilize discrete or integrated circuits are equipped with fiber pigtails and use an active alignment process to align the fibers with a laser source or photodetector. However, this active alignment process often relies on the use of multi-axis robots for dynamic or active alignment (for example, using power or photocurrent feedback). Once the best coupling signal is obtained, the fiber is fixed by laser welding or UV (ultraviolet light induced) curing. The fiber is butt coupled to a device or fixed in a focal plane having a microlens that is used to couple light into/outside the fiber.

Active movement has several shortcomings. It is a one-piece process with a process time of about 1 minute/minute (part/part) and cannot be expanded to a large number of optical defects. The cost associated with coupling light into the neon light element and outside is limited in commercial survival for light-based short-range links. Therefore, there is a need for a durable, low cost method for coupling light into and out of the phosphor elements.

Similar to the situation in long-distance telecommunications, Wavelength Division Multiplexing (WDM) for optical interconnects is very attractive because it reduces the number of fibers, reduces fiber alignment, and reduces the associated fiber routing. cost. WDM technology multiplexes several optical signals at different wavelengths on a single fiber. For example, a loose WDM system in the O-band would use four channels with wavelengths of about 1271 nm, 1291 nm, 1311 nm, and 1331 nm. WDM allows each of the four channels to be simultaneously transmitted on a bundle of fibers, thereby increasing the bandwidth of each fiber available. In order to use WDM, multiplex/demultiplexing must be provided at the end of the optical link to combine/separate the channels of different wavelengths. Therefore, there is a need for a durable, low cost method for integrating multiplex/demultiplexing functions and calendering components.

To overcome the above-described problems, a preferred embodiment of the present invention provides an optical module including one or more of the following: (1) a kinematic alignment including a first alignment protrusion, a second alignment protrusion, a third alignment protrusion, and corresponding point contacts, line contacts, and plane contacts; (2) a coupler chip that changes a beam defined by the optical signals Section size; (3) a coupler chip comprising a multiplexer, a demultiplexer, or a multiplexer and a demultiplexer; (4) a separator attached to a lithographic wafer, wherein the spacer is anodically soldered to the lithographic wafer; (5) an arrangement in which a cross-sectional dimension of a beam defined by the optical signals is preferably located at the dawn The interface between the wafer and the coupler wafer is maximum; (6) an arrangement in which a beam defined by the optical signals has a cross-sectional dimension at the first surface and the second surface of the coupler wafer Not identical; (7) an interconnected waveguide comprising a spot size converter zone; (8) one a waveguide that forms an oblique angle with the calendering wafer; (9) a coupler wafer and a calender wafer that are anodically bonded together; and (10) a photodetector that is surface mounted to The calendering wafer. The preferred embodiment of the present invention also provides a transceiver having a latch for allowing the interconnecting waveguide to be detached; a preferred embodiment of the present invention also provides for utilizing two positions that are not facing each other A method of aligning the two substrates with a reference point in the surface of the bulk substrate; and a preferred embodiment of the present invention also provides a method of fabricating the optical module.

According to a preferred embodiment of the present invention, an optical module includes: an interconnecting waveguide that transmits an optical signal; and a dimming chip that modulates the optical signals and detects the optical signals Or modulating and detecting the optical signals; a coupler chip attached to the fluorescent wafer and the interconnecting waveguide, such that the optical signals are along an optical wafer and A light path between the interconnected waveguides is transmitted; and one of the phosphor wafer and the coupler wafer includes a first alignment tab, a second alignment tab, and a third alignment tab. The coupler wafer and the other of the phosphor wafers include a point contact, a line contact, and a planar contact. The point contact does not provide any movement of the first alignment tab. The line contact provides linear movement of the second alignment tab. The planar contact provides a planar movement of the third alignment tab.

Preferably, the first alignment protrusions, the second alignment protrusions, and the third alignment protrusions are spheres made of glass, which are located in one of the silicon wafer and the coupler wafer. Among the chamfer cones among them. Preferably, the optical module further includes a separator attached to the calendering wafer. Preferably, the separator and the calendering wafer are anodically welded together.

The cross-sectional dimension of a beam defined by the optical signals is preferably at a maximum at the interface between the calender wafer and the coupler wafer. Preferably, the cross-sectional dimension of a beam defined by the optical signals begins to increase along the optical path and then decreases along the optical path.

Preferably, at least one of the phosphor wafer and the coupler wafer comprises a focusing element. The focusing element is preferably a collimating lens. Preferably, the interconnecting waveguide can be detached from the optical module. The interconnected waveguide includes a spot size converter zone. Preferably, the phosphor wafer comprises a photodetector mounted to the surface of the calender wafer. Preferably, the lithographic wafer and the coupler wafer comprise a plurality of fiducials located on surfaces that are not facing each other.

In accordance with a preferred embodiment of the present invention, a transceiver is provided that includes an optical module and a printed circuit board in accordance with various preferred embodiments of the present invention. The calender wafer is connected to the printed circuit board.

Preferably, the transceiver further includes a housing for enclosing the phosphor wafer and the coupler wafer. Preferably, the transceiver further includes a latch that secures the coupler wafer within the housing, wherein the coupler wafer can be detached from the housing by unlocking the latch.

According to a preferred embodiment of the present invention, an optical module includes: a silicon wafer including a waveguide that transmits an optical signal; and a coupler chip attached to the optical device The optical wafer, such that the optical signals are transmitted along an optical path between the phosphor wafer and the coupler wafer. The coupler chip changes a cross-sectional dimension of a beam defined by the optical signals, and the coupler chip includes a multiplexer, a demultiplexer, or a multiplexer and a demultiplexer .

Preferably, the multiplexer, the demultiplexer, or the multiplexer and the demultiplexer comprise an Echelle grating, an array of waveguide gratings, and a directional coupling. , a dichroic filter, or a resonant interference filter. The cross-sectional dimension of the beam is preferably greatest at the interface between the calender wafer and the coupler wafer. Preferably, the beam has a cross-sectional dimension that initially increases along the optical path and then decreases along the optical path. Preferably, a photodetector is surface mounted to the phosphor wafer or incorporated into the calender wafer. A light source is preferably incorporated into the calender wafer. Preferably, the optical module further includes a light source located outside the calendering wafer, wherein light from the light source is supplied to the calendering wafer. Preferably, the phosphor wafer includes a via located in the optical path. Preferably, the calendering wafer and the coupler wafer are anodically welded to each other.

According to a preferred embodiment of the present invention, an optical module includes: a silicon wafer including a waveguide that transmits an optical signal; and a coupler chip attached to the optical device The optical wafer, such that the optical signals are transmitted along an optical path between the phosphor wafer and the coupler wafer. The optical path includes a first surface of the coupler wafer and a second surface of the coupler wafer. The cross-sectional dimension of a beam defined by the optical signals is not the same at the first surface and the second surface.

Preferably, at least one of the phosphor wafer and the coupler wafer comprises a focusing element. The focusing element is preferably a collimating lens.

According to a preferred embodiment of the present invention, a method for aligning two substrates includes: providing a first substrate having a first reference point and a second substrate having a second reference point, the first The reference point and the second reference point are on a surface of the first substrate and the surface of the second substrate that are not opposite to each other; providing a first camera and a second camera that are opposite to each other, such that the first camera sees the first reference point And the second camera sees the second reference point; and aligns the first substrate and the second substrate by aligning the first reference point and the second reference point by using the first camera and the second camera.

According to a preferred embodiment of the present invention, an optical module includes: a silicon wafer including a waveguide that transmits an optical signal; and a coupler chip attached to the optical device The optical wafer, such that the optical signals are transmitted along an optical path between the phosphor wafer and the coupler wafer. The coupler wafer changes the cross-sectional dimension of a beam defined by the optical signals. The cross-sectional dimension of the beam is greatest at the interface between the calender wafer and the coupler wafer.

According to a preferred embodiment of the present invention, an optical module includes: an interconnecting waveguide that transmits an optical signal; and a dimming chip that modulates the optical signals and detects the optical signals Or modulating and detecting the optical signals; and a coupler wafer attached to the lithographic wafer and the interconnecting waveguide such that the optical signals are along a wadding wafer The optical path between the interconnected waveguide and the interconnect is transmitted. The interconnected waveguide includes a spot size converter region in which the cross-sectional dimensions of a beam defined by the optical signals are varied.

According to a preferred embodiment of the present invention, an optical module includes: a silicon wafer including a waveguide that transmits an optical signal; and a coupler chip attached to the optical device The optical wafer, such that the optical signals are transmitted along an optical path between the phosphor wafer and the coupler wafer. The coupler wafer changes the cross-sectional dimension of a beam defined by the optical signals. The coupler wafer and the calendering wafer are anodically welded together.

According to a preferred embodiment of the present invention, an optical module includes: an interconnecting waveguide that transmits an optical signal; and a dimming chip that modulates the optical signals and detects the optical signals Or modulating and detecting the optical signals; and a coupler wafer attached to the lithographic wafer and the interconnecting waveguide such that the optical signals are along a wadding wafer The optical path between the interconnected waveguide and the interconnect is transmitted. The interconnecting waveguide will form an oblique angle with the calendering wafer.

According to a preferred embodiment of the present invention, a transceiver includes: a printed circuit board; an optical module including an interconnecting waveguide that transmits optical signals; and a silicon wafer Connected to the printed circuit board and modulate the optical signals, detect the optical signals, or modulate and detect the optical signals; a coupler chip attached to the light The wafer and the interconnecting waveguide, such that the optical signals are transmitted along an optical path between the fluorescent wafer and the interconnecting waveguide; and a housing for enclosing the fluorescent wafer And the coupler wafer. The coupler wafer is secured within the housing using a latch. The coupler wafer can be detached from the housing by unlocking the latch.

According to a preferred embodiment of the present invention, an optical module includes: a silicon wafer including a waveguide that transmits an optical signal; and a coupler wafer attached to the light The wafer, such that the optical signals are transmitted along a light path between the phosphor wafer and the coupler wafer; and a photodetector that is surface mounted to the phosphor wafer.

According to a preferred embodiment of the present invention, a method of fabricating an optical module includes: providing a wafer having a light layer; cutting the wafer to form a silicon wafer; and mating the light a wafer and a printed circuit board; a coupler wafer and the silicon wafer; and an interconnecting waveguide mounted to the coupler wafer.

According to a preferred embodiment of the present invention, a method of fabricating an optical module includes: providing a wafer composed of a plurality of phosphor wafers; mating a plurality of coupler wafers with the germanium on the wafer An optical wafer; the wafer is cut to form a plurality of phosphor wafer/coupler wafer assemblies; the silicon wafer/coupler wafer assembly and the plurality of printed circuit boards are coupled; and the plurality of interconnects are interconnected A waveguide is embedded in the coupler wafers.

The above as well as other features, elements, features, steps and advantages of the present invention will become more apparent from the description of the appended claims.

10‧‧‧Acceptor

11‧‧‧Microcontroller

12‧‧‧Laser driver

13‧‧‧Transformer driver

14‧‧‧Transistor Amplifier (TIA)

15‧‧‧Lighting wafer

16‧‧‧Transformers 1 to 4

17‧‧‧Receivers 1 to 4

18‧‧‧Laser A, B

19‧‧‧ Coupler Wafer

20‧‧‧Mode converter

21‧‧‧Transmission (Tx) interconnected waveguide

22‧‧‧Receiving (Rx) interconnected waveguides

23‧‧‧Transfer (Tx) input

24‧‧‧Receive (Rx) output

25‧‧‧Connector

26‧‧‧Multiplexer (MUX)

27‧‧‧Demultiplexer (DEMUX)

28‧‧‧Transfer (Tx) steering structure

29‧‧‧Receiving (Rx) steering structure

30‧‧‧Small shell

31‧‧‧ core

32‧‧‧Channel waveguide

33‧‧‧Channel grille

34‧‧‧Channel detector

35‧‧‧Channel beam

36‧‧‧directional coupler

37‧‧‧Grid coupler

38‧‧‧ Coupler Light Layer

39‧‧‧矽光光层

40‧‧‧Printed circuit board (PCB)

41‧‧‧Ball Grid Array (BGA)

42‧‧‧ Coupler lens

43‧‧‧Digital lens

44‧‧‧ Notch

45‧‧‧Hot compounds

46‧‧‧ Land Department

51‧‧‧ point contact

52‧‧‧ wire joints

53‧‧‧Flat joints

54‧‧‧channel laser

55‧‧‧Aligning the sphere

56‧‧‧Separator

57‧‧‧Mixed fluorescent wafer

58‧‧‧through hole

59‧‧‧through holes

60‧‧‧First waveguide

61‧‧‧First Gradual Department

62‧‧‧second waveguide

63‧‧‧Second Gradual Department

64‧‧‧Substrate

65‧‧‧Intermediate

66‧‧‧Top layer

70‧‧‧shell

71‧‧‧ Heat sink

72‧‧‧Latch

73‧‧‧ Notch

74‧‧‧ trench

75‧‧‧ holes

76‧‧‧ Groove

77‧‧‧Electronic layer

78‧‧‧ spot size converter area

79‧‧‧ Heat sink

81‧‧‧First connector

82‧‧‧Second connector

100‧‧‧ Coupler reference point

101‧‧‧ Twilight reference point

102‧‧‧ bottom camera

103‧‧‧ top camera

104‧‧‧ platform

105‧‧‧ chuck

1 is a block diagram of a calendering system in accordance with a preferred embodiment of the present invention.

2 is a block diagram of another glazing system in accordance with a preferred embodiment of the present invention.

Figures 3 and 4 have a coupler wafer that can be used in the calendering system shown in Figure 2, having an Echeler grid.

Figure 5 shows a coupler wafer that can be used in the calendering system shown in Figure 2, having an arrayed waveguide grille.

Figure 6 shows a coupler wafer that can be used in the calendering system shown in Figure 2, having a dichroic filter with a surface grid and directional coupler.

The system shown in Figure 7 is coupled to a coupler wafer of a silicon wafer.

Figures 8 through 10, 32, and 33 are used for various possible optical arrangements of the coupler wafer and the calendering wafer.

11 and 12 are hybrid calendered wafers having a separator.

Figure 13 shows a silicon wafer with a via.

14 and 15 are coupler wafers having two waveguide layers.

An example of a transfer side beam model for the hybrid calender wafer and the coupler wafer is shown in FIG.

Figures 17 and 18 show a dynamic alignment arrangement.

Figures 19 and 20 show a visually assisted alignment.

An example of a transceiver shown in Figures 21 and 22 is shown.

Another example of a transceiver shown in Figures 23 and 24 is shown.

An example of a coupler chip shown in Figures 25 and 26.

An example of a twilight wafer shown in FIG.

The steps of manufacturing the transceiver shown in Figures 28 and 29 are shown.

Figure 30 shows an optical fiber having a spot size converter region.

The unit shown in Fig. 31 is connected to a transceiver of two connectors.

Another example of a transceiver is shown in FIG.

Figure 1 shows a calendering system in accordance with a preferred embodiment of the present invention. The transceiver 10 includes a microcontroller 11 that is coupled to the laser driver 12, the modulator driver 13, and a Transimpedance Amplifier (TIA) 14. The microcontroller 11 will receive an electrical assistance signal from one or more devices located outside of the light system as indicated by the arrow on the right hand side of the microcontroller 11 and transmit an electrical assistance signal to the exterior of the light system. One or more devices, for example, include electrical control and monitoring signals. The modulator driver 13 receives the electrical profile signal via the transmit (Tx) input 23, and the TIA 14 outputs the electrical profile signal via the receive (Rx) output 24. The Tx inputs 23 and the Rx outputs 24 are preferably incorporated into the connector 25. Lasers A, B (labeled as component symbol 18 in the figure) are connected to the laser driver 12. The transceiver 10 also includes a calender wafer 15 and a coupler wafer 19. The coupler wafer 19 is connected to a Tx interconnect waveguide 21 and an Rx interconnect waveguide 22.

A channel is defined by a single path along which signals are transmitted, that is, transmitted and/or received. For example, one of the transmission channels is defined by the modulator driver 13 from the electrical data signal received at the topmost Tx input 23, which causes the modulator 4 to modulate the light from the laser B, and The modulated light from the modulator 4 enters the topmost Tx interconnected waveguide 21 via the coupler wafer 19. In the example of the transfer channel, the transfer channel includes both an electrical data signal and an optical data signal. A corresponding receiving channel is defined by the optical data signal received by the coupler chip 19 on the bottommost Rx interconnecting waveguide 22, which causes the bottom receiver 1 to generate an electrical data signal from the bottom receiving A corresponding electrical data signal of the device 1 is supplied by the TIA 14 to the bottommost Rx output 24, wherein the corresponding electrical data signal is based on the generated electrical data signal received by the TIA 14.

The microcontroller 11 can be any suitable microcontroller, microprocessor, central processing unit, field programmable gate array, application specific integrated circuit, etc. More than one microcontroller 11 will be used. The microcontroller 11 can be a discrete component or it can also be integrated with the calender wafer 15. Integrating the microcontroller 11 and the calendering wafer 15 may increase the cost, complexity, and size of the calendering wafer 15.

Although two lasers 18 are shown in Figure 1, any suitable number of lasers can be used. In Figure 1, the laser A is connected to the modulator 1, 2 (for the sake of clarity, only the modulator 1 is labeled as the component symbol 16), and the laser B is connected to the modulator 3, 4. However, if a laser 18 has sufficient power for each of the channels to be used, the laser 18 can also be connected to each of the modulators; or, four lasers 18 can It is connected to the modulators 1 to 4 so that each channel has a laser that can be used. If more than one laser 18 is used, the lasers 18 are capable of providing different wavelengths of light, such that different channels use different wavelengths of light.

For example, laser 18 can emit a laser (VCSEL) for an edge emitter or vertical cavity surface. The lasers 18 can: 1) be mounted outside the transceiver 10, wherein light from the laser can be supplied to the calender wafer 15 using an interconnecting waveguide and possibly using a coupler wafer 19; 2) being mounted on a printed circuit board (PCB) having other components of the transceiver 10, for example, the other devices including the microcontroller 11, the laser driver 12, the modulator driver 13, the TIA 14. A calender wafer 15, a coupler wafer 19, etc., wherein light from the lasers 18 is coupled to the calender wafer 15 by a buried organic waveguide in the PCB; or 3) integrated with the calender wafer 15, an example of which includes: a miniature package laser, which is usually made of a MEMS housing having a distributed feedback laser (DFB) Laser), an optical ball lens, and an isolator; a flip-chip p-down, which is an SOA (semiconductor optical amplifier), DFB, or Fabry-Perot semiconductor laser chip that can be mounted using flip chip technology Or a heterogeneously integrated laser that often contains a III-V quantum gain junction , Which creates and is coupled to the bottom is confined to silicon light waveguide. Because the performance of the laser 18 is temperature sensitive, in some applications, it is advantageous to have the laser 18 embedded in the exterior of the calender wafer 15, which can be mounted on a PCB with other devices or It is embedded outside the transceiver 10.

The laser driver 12 is embedded in the transceiver 10, for example, it is embedded adjacent to the calender wafer 15 or embedded on the calender wafer 15; or the laser driver 12 can be embedded in the transmission The outside of the receiver 10, for example, is mounted on a main PCB (not shown in Figure 1).

The modulator driver 13 receives the electrical data signal from the Tx input 23 and generates a corresponding amplified electrical signal by turning off and turning on a corresponding modulator 16, which produces a high level signal and a low level signal. Optical data signal. The modulator driver 13 can be a single device as shown in FIG. 1 that is provided for use by all channels; alternatively, the modulator driver 13 can also be a group of devices, one for each channel can use. Since the speeds of the modulators 16 being turned off and on are faster than the speed at which the lasers are turned on and off, the modulators 16 can be used to achieve high frequency.

The TIA 14 is controlled by the microcontroller 11 and receives signals from the photodetectors 1 to 4 (receivers 1 to 4 are designated by the symbol 17 for clarity). Typically, the signal is a current signal based on the amount of light detected by the receivers 17, and the TIA 14 converts the current signal into a voltage signal. The TIA 14 can be a single device as shown in Figure 1, which is provided for use by all channels; alternatively, the TIA 14 can also be a group of devices, one for each channel.

The calender wafer 15 is preferably an optical device made of tantalum; however, other suitable materials can be used, for example, InP or lithium niobate. The calender wafer 15 includes any portion of a wafer that is capable of transmitting light, controlling light, and/or detecting light. Such functions of the silicon wafer 15 include modulation, detection, booting, MUX/DEMUX, and the like. The calender wafer 15 can also be a hybrid wafer made of tantalum and glass that are welded together as shown in Figures 11 and 12. The calender wafer 15 typically includes a waveguide that manipulates light (not shown) and a driver 16 that is used to generate the optical signal. The cross-sectional dimension of a typical waveguide in the calender wafer 15 is currently about 0.3 μm x 0.3 μm; however, other suitable dimensions can be used. In certain preferred embodiments of the invention, the calendering wafer 15 will comprise a waveguide formed in a tantalum nitride strip embedded in a ceria matrix. Due to the small refractive index difference between tantalum nitride and ruthenium dioxide, such waveguides typically have a larger mode size.

The coupler wafer 19 is a device that transmits an optical signal between the calender wafer 15 and the interconnected waveguides 21, 22. The coupler wafer 19 can be any device that provides an optical path between the calender wafer 15 and the interconnecting waveguides 21, 22. The coupler die 19 will have passive optical functionality, for example, which includes a MUX/DEMUX. The coupler wafer 19 is capable of changing the direction of light and is capable of changing the modal dimensions of the light. For example, if the calender wafer 15 is illuminated in a vertical or near vertical manner, the coupler wafer 19 will redirect the vertical light such that it will conduct in a horizontal or near horizontal direction. The modal converter 20 changes the modal size of the light, which provides effective coupling at various optical interfaces while maintaining alignment tolerances at the interfaces. For example, light emitted from the calender wafer 15 will have a cross-sectional modal size of about 0.3 μm x 0.3 μm, and the cross-sectional modal size of the interconnected waveguide can be 9 μm in a single-mode optical fiber. The modal converter 20 changes the transmitted light profile size to match or closely match the cross-sectional dimensions of the interconnected waveguides 21, 22. The modal converter 20 may not necessarily be needed in the Rx channel because the light does not need to be modally matched to the photodetector, that is, even if the cross-sectional size of the light is smaller than the photodetector, the photodetection The device is still able to effectively detect the light. The coupler wafer 19 can be made of tantalum, glass, or both tantalum and glass, wherein the tantalum and the glass are anodically welded together. The coupler wafer 19 is preferably made of a material having a coefficient of thermal expansion that is identical to the coefficient of thermal expansion of the calender wafer 15, such that during operation, the two devices remain aligned as the temperature of the collector 10 increases. And it won't bend or twist (or bends and twists are greatly reduced or minimized).

In Figure 1, the transceiver 10 includes four transmission channels having four corresponding Tx interconnecting waveguides 21 and four receiving channels having four corresponding Rx interconnecting waveguides 22; however, any suitable number of channels can be included. For example, the transceiver 10 can include one, six, eight, or twelve Tx interconnecting waveguides 21 and corresponding one, six, eight, or twelve Rx interconnecting waveguides twenty two. In addition to the transceiver 10, instead of a transmitter having only one or more Tx interconnecting waveguides 21, it is also possible to use only one or more Rx interconnected waves. The receiver of the catheter 22.

The interconnecting waveguides 21, 22 are preferably optical fibers. The fibers can be individual fibers or can be an array of fibers arranged in a bundle or ribbon. The interconnecting waveguides 21, 22 can also be a flexible polymer based waveguide tape or an interposer wafer made of tantalum or certain other suitable materials. The fiber typically includes a core 31 surrounded by a shell 30, for example, as shown in FIG. The fibers can be single mode or multimodal. For example, the core of a single mode fiber will have a cross-sectional dimension of about 9 [mu]m, while the core of a multimode fiber will have a cross-sectional dimension of about 50 [mu]m or about 62.5 [mu]m. The fibers can be permanently attached to the transceiver 10 (i.e., pigtail fiber) as shown in Figures 21 and 22, or can be detached as shown in Figures 23 and 24. Transmitter (ie, connector fiber).

Connector 25 can be any suitable connector, for example, which includes a UEC5 connector sold by Samtec, Inc. of New Albany, Indiana, USA. More than one connector 25 may be used. A single connector 25 can be used to house the Tx inputs 23 and the Rx outputs 24; alternatively, one of the connectors can be used for the Tx input 23 and the other connector can be used for the Rx output 24.

The receiver 10 of the preferred embodiment of the present invention can be exemplified in U.S. Application Nos. 13/539,173, 13/758,464, 13/895,571, 13/950,628, and 14/295,367. The transceiver of the transceiver disclosed in the number is incorporated herein by reference in its entirety. In addition to using the optical engine disclosed in these applications, instead of the system, the transceiver 10 can also use a twilight-based optical engine that can be smaller in size, higher in speed, larger. Bandwidth, higher efficiency, and longer signal travel distance. Although not shown in FIG. 1; however, the transceiver 10 will include one or more heat sinks connected to the various components of the transceiver 10 for heat dissipation.

2 is a block diagram of another glazing system in accordance with a preferred embodiment of the present invention. The calendering system of Fig. 2 is identical to the calendering system of Fig. 1, and the same components are denoted by the same reference numerals. The transceiver 10 of Figure 2 contains four lasers 1 through 4 (for clarity only laser 1 is indicated by component symbol 18), each of which has a different wavelength. The coupler chip 19 of Figure 2 preferably utilizes a multiplexer (MUX) 26 and a demultiplexer (DEMUX) 27 to provide wavelength division. The coupler die 19 of FIG. 2, although not shown, modal converter 20; however, the modal converters 20 will be placed in the coupler die 19, possibly in the different channels of the MUX 26 and Front or back of the DEMUX 27. MUX 26 and/or DEMUX 27 are preferably formed on glass having a low coefficient of thermal expansion, and the refractive index of the glass does not vary greatly with temperature.

The MUX 26 combines the optical signals of the transmission channels such that all of the optical signals of the transmission channels are carried down in the same Tx interconnecting waveguide 21. The DEMUX 27 separates the optical signals received from a single interconnected waveguide 22 in all receive channels. Since the channels correspond to light of different wavelengths, this combination and separation of the optical signals can be performed. The combination ratio in Figure 2 is 4:1 and the separation ratio is 1:4; however, other ratios can also be used. For example, if the transceiver 10 has 12 transmission channels and 12 reception channels, the combination ratio can be 12:3 or 12:1, and the separation ratio can be 3:12 or 1:12. 12: A ratio of 3 or 3:12 requires three interconnected waveguides instead of one.

In Figure 2, the channels are preferably operated in an O-band with a 20 nm wavelength spacing between the channels; however, different frequency bands and different wavelength spacings may be employed.

The series shown in Figures 3 and 4 can be used for the coupler wafer 19 in the calendering system shown in Figure 2. As shown in FIG. 3, the coupler wafer 19 is embedded in the top end of the calender wafer 15. Typical dimensions of the coupler wafer 19 and the calendered wafer 15 are from about 0.5 mm to about 1 mm, a width of about 5 mm, and a length of about 5 mm. Other sizes are also possible.

The coupler chip 19 shown in Figures 3 and 4 includes a MUX 26 and a DEMUX 27. A single Tx interconnect waveguide 21 and a single Rx interconnect waveguide 22 are connected to the coupler wafers 19. The coupler wafers 19 may include more than one interconnected waveguide 21, 22 and more than one corresponding MUX 26 and DEMUX 27. In Figures 3 and 4, the coupler wafers 19 include six Tx steering structures 28 and six Rx steering structures 29 that turn to receive vertical light from the calendering wafer 15, and the Rx The steering structure 29 will turn to the horizontal light received from the DEMUX 27. Each of the six steering structures 28, 29 is used in a corresponding wavelength λ _{1 -} λ ₆ . The coupler wafer 19 of Figure 3 includes six transfer channels and six receive channels; however, any number of transfer channels and receive channels can be used. The Tx steering structures 28 are coupled to the MUX 26 such that the optical signals are combined and transmitted via the Tx interconnecting waveguide 21. The Rx interconnect waveguide 22 is coupled to the DEMUX 27 such that the optical signals are separated and transmitted via the Rx steering structure 29. The MUX 26 and DEMUX 27 shown in Figure 3 are part of an Echelle grid. The use of an Echelle grid is preferred because of its small size and temperature sensitivity compared to other MUX/DEMUX elements.

If the coupler wafer 19 is to be used in the transmitter instead of being used in the transceiver 10, then only the MUX 26 and the Tx interconnecting waveguide 21 are required. If the coupler wafer 19 is to be used in a receiver rather than in the transceiver 10, then only the DEMUX 27 and the Rx interconnected waveguide 22 are required.

The one-wavelength selection grid shown in FIG. 5 is used as the DEMUX 27. The wavelength selective grid of Figure 5 provides four channels; however, any other number of channels can be used. The wavelength selective grid includes four channel gratings in the channel waveguide 32 of the coupler wafer 19. For the sake of clarity, only one of the channel grids is designated 33. One of the channels in the wavelength selective grid includes an Rx interconnecting waveguide 22, a channel grid 33, and a channel detector 34. A channel beam 35 (which includes the optical signals) is transmitted through the Rx interconnecting waveguide 22, the channel grid 33, and the channel detector 34. The channel beam 35 is preferably perpendicular to the surface of the coupler wafer 19 and the calender wafer 15 in the gap between the coupler wafer 19 and the calender wafer 15. The arrangement shown in Figure 5 is for the arrangement of the DEMUX 27. The same arrangement can also be considered as MUX 26.

Shown in Figure 6 is a dichroic filter having a directional coupler 36 and a grid coupler 37 that can be considered as a DEMUX 27. Directional coupler 36 and grid coupler 37 have wavelength sensitivity which reduces channel crosstalk. Directional coupler 36 is preferably a lossless device capable of splitting optical power into two optical channels. The grid couplers 37 can be replaced by micromachined mirrors. Directional coupler 36 and grid coupler 37 are typically polarization sensitive. Each channel includes a separate directional coupler 36 and a grid coupler 37 for transverse electrical (TE) polarization and for transverse magnetic (TM) polarization. The two polarizations are spatially combined at a photodetector (not shown in Figure 6), enabling the use of a single photodetector in each channel. Alternatively, the polarizations can also be angularly combined or a polarized beam bonded structure. Although Figure 6 shows an arrangement for the DEMUX 27; however, the same arrangement can also be considered as the MUX 26, but it is not necessary to consider different polarizations because the polarization of the laser source is generally well defined.

Instead of using the Echeler grid, wavelength selective grid, and dichroic filter shown in Figures 3 through 6, an arrayed waveguide grille, other dichroic filters, or It is a resonant interference filter as MUX 26 and/or DEMUX 27.

The series shown in FIG. 7 is connected to the coupler wafer 19 of the calender wafer 15. The receive channel includes an Rx interconnect waveguide 22 and a channel detector 34. Instead of the Rx interconnecting waveguide 22, a Tx interconnecting waveguide 21 is used in a transfer channel and a channel of lasers 54 is used instead of the channel detector 34. The receiving channel provides a light path between the Rx interconnecting waveguide 22 and the channel detector 34, and the transmitting channel provides a path between the Tx interconnecting waveguide 21 and the channel laser 54 Light path. The coupler wafer 19 and the calender wafer 15 will contain various structures for manipulating the channel beam 35. The coupler wafer 19 will contain a lens 42 and the calender wafer 15 will contain a lens 43. The coupler wafer 19 includes an optical layer 38 comprising a passive waveguide that includes an Rx steering structure 29. The Rx steering structure 29 will include a micromachined surface or a surface grid. The micromachined surface will use complete internal reflection or will contain a reflective coating. The micromachined surface can be flat or can be curved to focus the channel beam 35 as shown in Figures 8 through 10, 32, and 33. The end surfaces of the interconnecting waveguides 21, 22 can also be bent to replace the steering structure 29. In the transfer channel, the calendering wafer 15 comprises an optical layer 39 comprising an active waveguide, although not shown in FIG. 7; however, it comprises a modulator 16. In the receiving channel, the optical layer 39 of the calendering wafer 15 does not require an active waveguide. In FIG. 7, the optical layer 38 of the coupler wafer 19 is located on the top surface; however, the optical layer 38 can also be located on the bottom surface of the coupler wafer 19. Similarly, the light layer 39 of the calender wafer 15 is located on the bottom surface; however, the light layer 39 can also be located on the top surface of the calender wafer 15. Both the coupler wafer 19 and the calender wafer 15 may include a coating (for example, a dielectric such as tantalum nitride or hafnium oxide) to reduce back reflection in the transfer channel and the receive channel.

The various possible optical arrangements for the coupler wafer 19 and the calendering wafer 15 are shown in Figures 8 through 10, 32, and 33. Figure 8 shows an arrangement having a single curved surface and comprising a flat Rx turning structure 29, a flat calendering wafer 15 without a lens 43, and a lens 42 on the coupler wafer 19, with the advantage that only one curved surface is required. Figure 9 shows an arrangement having three curved surfaces and comprising a curved Rx steering structure 29, a lens 43 on the calender wafer 15, and a lens 42 on the coupler wafer 19 on the calender wafer 15 and the coupler wafer 19 A collimated beam is provided in the gap between them. Figure 10 shows an arrangement having two curved surfaces and a flat surface and comprising a curved Rx turning structure 29, a flat calendering wafer 15 without a lens 43, and a lens 42 on the coupler wafer 19, the benefit of which is The top end of the optical wafer 15 provides a flat surface so that no processing is required on this surface of the calender wafer 15 or only minimal processing is required. In Figs. 32 and 33, the surfaces of the calender wafer 15 facing each other and the surface of the coupler wafer 19 are flat, and there is no space between the calender wafer 15 and the coupler wafer 19. 32 shows an arrangement having a single curved surface and comprising a flat Rx turning structure 29, a flat calendering wafer 15 without a lens 43, and a lens 42 positioned on the coupler wafer 19 but without facing the calendering wafer 15, The advantage is that only one curved surface is required. Figure 33 shows an arrangement having a single curved surface and comprising a curved Rx turning structure 29, a flat calendering wafer 15, and a flat coupler wafer 19, the advantage of which is only one curved surface.

The channel beam 35 will be collimated (Fig. 9) or not collimated (Figs. 8, 10, 32, and 33). The channel beam 35 may be located at an oblique angle, that is, without vertical, as shown in Figures 8 through 10, 32, and 33. Preferably, the channel beam 35 is collimated or nearly collimated in the region of the gap between the calender wafer 15 and the coupler wafer 19. The relatively large beam size in this region (i.e., from about 20 [mu]m to about 100 [mu]m) relaxes the alignment tolerance between the calender wafer 15 and the coupler wafer 19. Figures 8, 10, 32, and 33 having a flat calender wafer 15 need not provide surface features on one side of the calender wafer 15. Depending on the optical layout, for example, the necessary alignment between the feature elements located on the top end surface of the calender wafer 15 and the feature elements located on the bottom surface of the calender wafer 15 is ±1 μm. It can be very difficult and expensive to achieve this level of precision. In an ideal system with a collimated beam, the position alignment error between the calender wafer 15 and the coupler wafer 19 does not cause any displacement at the focus. Although there may be an angular offset; however, the angular sensitivity of the interconnecting waveguides 21, 22 and the channel detector 34 is less than positional sensitivity.

The various curved surfaces shown in Figures 8 through 10, 32, and 33 and the lens shown in Figure 7 can be fabricated using laser processing, wherein an ultra-fast laser (for example, pico second) Or a femto second pulse width) moves over a surface to create the curved surface. Ablative material removal using laser processing leaves an optically rough surface that requires post processing in some applications. Laser processing can be performed under the surface of coupler wafer 19 and/or separator 56 (discussed below) to significantly reduce or minimize the amount of material that needs to be removed by ablation. Laser processing removes only the material at the location where the laser is focused; however, laser processing cuts down a large portion of the material that can then be removed by another process. Laser processing provides a great deal of freedom in forming the structure, for example, it includes lenses with different curvatures and alignments and mirrors. A thermal polishing process can be used to smooth any residual roughness in the laser processing. The waveguide in the coupler wafer can also be formed by locally correcting the index of refraction within the coupler wafer 19 using an ultra-fast laser.

The calender wafer 15 includes one or more channel detectors 34 and/or one or more channel lasers 54. The channel detectors 34 are integrated into the calender wafer 15 in an integrally formed manner or may be surface mounted to the calender wafer 15. The integrally formed channel detector 34 will include a Ge/Si device having a response value of about 0.4 A/W (at @1310 nm); and the surface-mounted channel detector 34 will contain about 0.9 A/W (@ The InGaAs device with a response value at 1310 nm has a response value that is approximately twice that of an integrally formed integrated channel detector. The channel detector 34 can be a resonant cavity enhanced detector that provides wavelength filtering, or can be a ring resonator. An example of a stroboscopic wafer 15 is shown in Figure 27, wherein the channel detector 34 and the TAI 14 are surface mounted to the optical layer 39, preferably in close proximity to one another. The diameter of the channel detector 34 will vary depending on the desired bandwidth. A higher bandwidth system will have a small diameter channel detector 34. For example, a 10 Gbps system can have a detector diameter of about 70 μm, while a 28 Gbps system can have a detector diameter of about 22 μm.

The phosphor wafer 15 is preferably connected to the PCB 40 by flip chip technology (which includes, for example, a Ball Grid Array (BGA) 41). Other devices (for example, including laser driver 12, modulator driver 13, and TIA 14, etc.) can also use short pillar bump flip chip technology. The PCB 40 preferably includes a recess 44 that includes a thermal compound 45 that contacts the channel detector 34 or the channel laser 54.

The coupler wafer 19 and the calender wafer 15 are separated by a gap such that heat generated by the calender wafer 15 has a poor thermal path from the calender wafer 15 to the coupler wafer 19. This gap is filled with UV curable adhesive provided that UV light can be transmitted through the coupler wafer 19. For example, the gap can be from about 20 [mu]m to about 50 [mu]m. Using the gap between the coupler wafer 19 and the calender wafer 15, the coupler wafer 19 and the calender wafer 15 are aligned with one another to ensure proper operation of all channels. These alignment features have different degrees of freedom. For example, the fixed alignment balls 55 on the calender wafer 15 will snap up the point contacts 51, the line contacts 52, and the planar contacts 53 in the coupler wafer 19, as shown in FIGS. 17 and 18. This arrangement can be inverted such that the alignment balls 55 are on the coupler wafer 19 and the contacts 51, 52, 53 are on the calender wafer 15. The contacts 51, 52, 53 are micromachined, can be formed by photolithography and anisotropic etching, or can be formed by a laser processing process. The alignment balls 55 are fixed in the recesses. Alternatively, the alignment balls 55 can be replaced with alignment protrusions formed on the surface of the calender wafer 15 (or the coupler wafer 19). The alignment spheres can be made of glass.

In Fig. 17, the calendering wafer 15 comprises an anisotropically etched chamfer, and the alignment spheres 55 are fixed therein. In Figure 18, the coupler wafer 19 includes a plurality of matching notches that define contacts 51, 52, 53. The alignment balls 55 provide a rigid connection, and the contacts 51, 52, 53 are arranged to prevent bending and twisting caused by the difference in thermal expansion coefficient between the calender wafer 15 and the coupler wafer 19. . It is desirable in the art to avoid or minimize bending and torsion because bending and torsion can result in reduced coupling efficiency and render the transceiver 10 inoperable. Avoiding or minimizing thermally induced bending and torsion increases the operating temperature range of the transceiver 10.

The calender wafer 15 and the coupler wafer 19 are secured together by a compliant adhesive that shrinks during curing. The compliant adhesive can be supplied by injecting the compliant adhesive into the through holes 59 in the coupler wafer 19. The compliant adhesive can be UV cured; however, this must not be a necessary condition.

In addition to the lens arrangement shown in Figures 8 through 10, 32, and 33, various other techniques can be used to correct the size of the channel beam as shown in Figures 11-15. These techniques, as well as lens arrangements, can be used separately and in combination.

11 and 12 are a hybrid calender wafer 57 that includes a separator 56 that is attached to a calender wafer 15. The separator 56 can have a thickness of about 0.5 mm to several mm. The separator 56 may allow for greater beam expansion between the hybrid calender wafer 57 and the coupler wafer 19, which relaxes the alignment tolerance and allows for passive alignment. The separator 56 may include fiducial marks or micromachined structures to assist in aligning the coupler wafer 19 with the hybrid calender wafer 57.

The separator 56 can be made of glass or tantalum, and the calendering wafer 15 is the same material. The separator 56 matches or substantially matches the coefficient of thermal expansion of the calendered wafer 15 to avoid excess stress buildup. The separator 56 is anodically soldered to the calender wafer 15. The separator 56 is first soldered to a wafer of a plurality of phosphorescent wafers, for example, 8 inch or 12 inch wafers, and then cut after soldering. Assuming 75% wafer utilization and 5mm x 5mm wafers, 972 devices will be taken from a 8-inch wafer and 2188 devices will be obtained from a 12-inch wafer. The coupler wafer 19 will be attached at the wafer level or will be attached after cutting.

Figure 11 shows the gap between the hybrid calender wafer 57 and the coupler wafer 19; and Figure 12 shows that the hybrid calender wafer 57 and the coupler wafer 19 are anodically bonded together, which is capable of The wafer level is implemented and the number of parts can be reduced.

A calendering wafer 15 having a through hole 58 is shown in FIG. The through hole 58 will have a tapered wall as shown in Fig. 13, or will have a straight wall portion (not shown). The through hole 58 is oversized to relax the alignment tolerance as long as the channel detector 34 is fully exposed. The oversized through hole 58 does not require a high position tolerance in the backside calendering process. The vias 58 are metallized to provide a reflective surface in which no lenses may be required or the alignment tolerances may be relaxed. As shown in FIG. 13, the via 58 terminates at the optical layer 39 provided an integrated channel detector 34 is used. Alternatively, the vias 58 can also extend through the optical layer 39.

14 and 15 are coupler wafers 19 having a first waveguide 60 and a second waveguide 62 among the optical layers 38. The first waveguide 60 is located on the substrate 64 (which is preferably a tie glass) and includes a first tapered portion 61. A second waveguide 62 is located above the first waveguide 60 and includes a second tapered portion 63. The first waveguide 60 and the second waveguide 62 are arranged such that optical energy is coupled through the first tapered portion 61 and the second tapered portion 63 by an evanescent field.

Preferably, the first waveguide 60 and the second waveguide 62 have different optical and physical properties. For example, the first waveguide 60 and the second waveguide 62 are of different sizes to support different modal dimensions. The larger modal size can help couple light from a channel of laser 54 to the interconnecting waveguide 21, while the smaller modal size can aid in MUX/DEMUX operation and modulation.

Light layer 38 preferably comprises at least one of the following: PMMA (polymethyl methacrylate), SU8 photoresist, ruthenium, ruthenium dioxide, and tantalum nitride. The first waveguide 60 and the second waveguide 62 can be made of materials different from each other. The first waveguide 60 can be made of SiN because the SiN waveguide is typically smaller; the second waveguide 62 can be made of SiO ₂ because the dimensions of the SiO ₂ waveguide will properly match the mode of the single mode fiber. State size. This allows the first waveguide 60 to be connected to the MUX 26 and the second waveguide 62 to be connected to the Tx interconnecting waveguide 21.

The first waveguide 60 and the second waveguide 62 can be fabricated by different processes, including photolithography combined with doping, etching, or material deposition and laser processing, which is removed or borrowed by material. The refractive index and/or density of the material is altered by the modified material properties. Laser processing thickens and/or increases the refractive index by focusing a short pulse of laser light into a material. The focused spot will locally change the refractive index in a small volume (for example, 10 to 100 μm ³ in size). The focused spot is scanned along a material at high speed (for example, 100 mm/sec).

As shown in FIG. 14, the light layer 38 comprises, from top to bottom, 1) a top layer 66 having a refractive index n ₂ ; 2) a second waveguide 62 having a refractive index n ₁ ; 3) a refractive index An intermediate layer 65 of n ₂ ; and 4) a first waveguide 60 having a refractive index n ₃ . The light layer 38 is located at the top end of the substrate 64 having a refractive index _nsub . The first waveguide 60 and the second waveguide 62 have different optical characteristics, and therefore, n ₁ ≠n ₃ . Refractive index n ₁ of the second waveguide 62 is greater than the top layer 66 and an intermediate layer 65 of refractive index n _2, i.e., n _1> n _2. The refractive index n _{3 of the} first waveguide 60 is greater than the refractive index n _{2 of the} intermediate layer 65 and the refractive index n _{sub of the} substrate 64, that is, n ₃ > n ₂ and n ₃ > n _sub . Other arrangements are also possible as long as the refractive index of the waveguide is higher than the refractive index of the material surrounding the waveguide.

14 and 15 show a coupler wafer 19; however, the same structure can be formed in the optical layer 39 of the calender wafer 15.

In addition to the arrangements and techniques shown in Figures 8 through 15, 32, and 33, interconnected waveguides 21, 22 including the spot size converter regions as shown in Figure 30 can also be used. The modal dimensions of the channel waveguides 32 in the coupler wafer 19 will match or substantially match (fall within the manufacturing tolerances) the ends of the spot size converter regions 78 of the interconnected waveguides 21, 22. Modal size. Interconnected waveguides 21, 22 having spot size converter regions 78 can be used in place of the arrangements and techniques shown in Figures 8 through 15, 32, and 33; or, in addition to Figures 8 through 15, 32, and 33 In addition to the arrangement and technique shown, interconnected waveguides 21, 22 having spot size converter regions 78 may additionally be used.

The spot size converter zone 78 can be provided by an adiabatic taper at the end of the interconnecting waveguides 21, 22. Increasing the modal size reduces the alignment tolerance between the channel waveguide 32 in the coupler wafer 19 and the core 31 of the interconnected waveguides 21, 22. If the interconnecting waveguides 21, 22 are an optical fiber, the spot size converter region 78 can be created by locally heating the interconnecting waveguides 21, 22, resulting in the formation of doping of the core 31. The spread of things. Ultra-short laser processing can be used to locally heat the fiber. The ultrashort laser processing creates the spot size converter region 78 by focusing the laser in a 3D pattern in the fiber to change the index of refraction of the fiber. The modal size of a single mode fiber will increase from about 9 [mu]m to about 20 microns. The standard single mode fiber has an optical loss of 1 dB in a 1 μm alignment error between the core 31 and the channel waveguide 32. Multiplying this modal size increases the 1dB alignment tolerance to greater than 2μm.

An example of a transfer side beam model for the hybrid calender wafer 57 and the coupler wafer 19 is shown in FIG. Figure 16 does not include or display any steering structures in the light path and does not include or display any of the techniques illustrated in Figures 11-15. Figure 16 contains two curved surfaces as shown in Figure 9. First, it is assumed that the channel beam 35 is a Gaussian beam of a size of 0.5 μm. The hybrid calender wafer 57 comprises a 0.7 mm thick calender wafer for use as a calender wafer 15 having a refractive index n = 3.5; and comprising a 0.5 mm thick layer of bismuth borate glass for use as a separator 56, Its refractive index n = 1.45. The borosilicate glass layer can be Borofloat®, which is made by a microfloat process, which produces a glass having a low coefficient of thermal expansion and has good surface quality, visible light transmission characteristics, and mechanical strength. . The lens 43 in the separator 56 has a radius of curvature of 351 μm. There is a gap of 15 μm between the hybrid calender wafer 57 and the coupler wafer 19. The lens 42 in the coupler wafer 19 has a radius of curvature of 343 μm. The coupler wafer 19 comprises a Borofloat® glass layer having a thickness of 0.7 mm and having a refractive index n = 1.45. In this example, the channel beam 35 is collimated in the gap with a beam size of 66 μm and coupled into a standard single-mode fiber with 85% coupling efficiency.

Figures 19 and 20 are a visually assisted alignment arrangement that can be used in place of the power alignment arrangement shown in Figures 17 and 18. In the visual aid arrangement, the coupler wafer 19 includes a reference point 100 and the calender wafer 15 includes a reference point 101. The reference points 100, 101 will be aligned as shown in FIG. As shown in FIG. 19, to align the calender wafer 15 and the coupler wafer 19, the calender wafer 15 will be placed on the platform 104, and the chuck 105 is used to move the coupling from the calender wafer 15 as a reference. Wafer 19. The chuck 105 will be moved in the x-direction, the y-direction, and the z-direction and may also be rotated. The platform 104 will be moved in the x and y directions and may also be rotated. The top camera 103 is used to view the fiducials 100 on the coupler wafer 19, while the bottom camera 102 is used to view the fiducials 101 on the calender wafer 15. The coupler wafer 19 and the calender wafer 15 will be aligned with one another until the cameras 102, 103 (which will be precisely aligned in the x and y directions) can be used to visually confirm the fiducials 100, 101 as shown in FIG. It is normally aligned. Since the two cameras 102, 103 are used and the cameras 102, 103 will see the relationship of the reference points 100, 101 on the surface facing the cameras 102, 103, the cameras 102, 103 do not need to see through the The calender wafer 15 is either a coupler wafer 19. However, a wavelength of light transmitted through the coupler wafer 19 and/or the calender wafer 15 can also be used, which allows the visual aid alignment system to align the coupler wafer 19 and/or the calender wafer 15 in the A mark on the opposite side of the camera 102 or 103. The waveguides in the coupler wafer 19 and/or the calendering wafer 15 transmit optical radiation that is visible to the visual aid alignment system for active alignment.

The coupler wafer 19 and the calender wafer 15 use the contacts 51, 52, 53 as zero to three alignment features. In the zero alignment feature (i.e., without any of the contacts 51, 52, 53), the coupler wafer 19 and the calender wafer 15 are aligned using only the reference points 100, 101. In the three alignment features (i.e., using all of the contacts 51, 52, 53), while it may be helpful to use visually assisted alignment, visual assisted alignment may not be used. In one or two alignment features, some degree of freedom between the coupler wafer 19 and the calender wafer 15 will depend on the alignment features, and some degrees of freedom will depend on the use of reference points. Visual aid alignment of 100, 101.

In Figures 17 through 20, the alignment features are used to align the coupler wafer 19 and the calender wafer 15. In addition, similar alignment features can be used to align the phosphor wafer 15 and the separator 56.

An example of a transceiver 10 shown in Figures 21, 22, and 34. The transceiver 10 shown in Figures 21 and 22 includes a PCB 40. The microcontroller 11 and the calender wafer 15 are mounted to the PCB 40. The coupler wafer 19 and the calender wafer 15 are enclosed in a housing 70. The heat sink 71 is optional and may be used to dissipate thermal energy from the calender wafer 15 or thermal energy from devices mounted on the calender wafer 15. As shown in FIG. 21, a heat sink 71 is attached to the bottom of the calender wafer 15. As shown in FIG. 34, in addition to the heat sink 71 attached to the bottom of the calender wafer 15, a heat sink 79 can be attached to the top end of the calender wafer 15. The interconnecting waveguides 21, 22 will be permanently attached to the transceiver 10. That is, the interconnecting waveguides 21, 22 will be pigtailed fibers. The PCB 40 includes a plurality of land portions 46 in one of the edges that can be inserted into a connector (not shown in Figures 21 and 22). The connector can be located in an IC package, in the middle of a main PCB (not shown in Figures 21 and 22), or an interposer. FIG. 31 shows the PCB 40 inserted into the first connector 81. As shown in FIG. 31, the PCB 40 can also be connected to a second connector 82 in synchronization with the first connector 81; however, this is not a requirement. If the transceiver 10 is connected to the first connector 81 and the second connector 82 as shown in FIG. 31, then the high speed signal can be transmitted via the first connector 81, and the low speed signal can pass through the first The two connectors 82 are transmitted. Preferably, the interconnecting waveguides 21, 22 form an angle with respect to the transceiver 10 such that when the transceiver 10 is inserted into a connector intermediate the PCB, the The interconnecting waveguides 21, 22 will extend over any other device on the PCB without interfering with the devices. Although a plurality of interconnect lines 21, 22 are shown in Figs. 21 and 22; however, a single interconnected waveguide 21 or 22 can also be used.

An example of a transceiver 10 having a latch 72 is shown in FIGS. 23 and 24. 21 and 22 are the same as the transceiver 10 of Figs. 23 and 24; differently, the transceiver 10 of Figs. 23 and 24 includes a latch 72. Because the interconnecting waveguides 21, 22 can be detached from the transceiver 10, the interconnecting waveguides 21, 22 can be connectorized optical fibers. In the transceiver 10 of FIGS. 23 and 24, the calender wafer 15 and the housing 70 having the latch 72 are arranged such that after the coupler wafer 19 is inserted into the housing 70, The coupler wafer 19 will be secured within the housing 70 and aligned with the calender wafer 15. The transceiver 10 will include coarse alignment features that will substantially align the coupler wafer 19 and the calender wafer 15. The alignment sphere 55 and the contacts 51, 52, 53 will precisely align the coupler wafer 19 and the calender wafer 15. The coarse alignment features will be placed in any convenient location including any one of the coupler wafer 19, the calender wafer 15, the housing 70, or the heat sink. For example, the coarse alignment feature can include an etched guide post on the coupler wafer 19 or the calender wafer 15 that is aligned on the calender wafer 15 or the coupler wafer 19. Etched lead holes. A heat sink (not shown) will be integrated into the latch 72 or placed on the housing 70 with a cutout that does not cover the latch 72.

An example of a coupler chip 19 shown in Figures 25 and 26. The coupler wafer 19 includes an array of trenches 74 for the interconnected waveguides 21, 22 and a recess 73. Each of the interconnected waveguides 21, 22 will be inserted into a corresponding aperture 75 that will precisely align the interconnected waveguides 21, 22 within the coupler wafer 19. The aperture 75 can be fabricated with a laser that utilizes ultrashort laser pulses. The coupler wafer 19 includes a recess 76 that is filled with an adhesive to permanently secure the interconnecting waveguides 21, 22 in the correct position. An adhesive is also applied to the recess 73 to provide a strain relief. In Figures 25 and 26, the steering structures 28, 29 provide a fully internal reflective surface on the sides of adjacent interconnecting waveguides 21, 22 such that light from the interconnected waveguides 21, 22 Being guided down.

The steps of manufacturing the transceiver shown in Figures 28 and 29 are shown. In the method shown in Figure 28, a silicon wafer will be attached to a PCB. A coupler wafer is then mated to the calender wafer. Then, a plurality of optical fibers are attached to the coupler wafer 1.

In step S10, the calendering wafer will be fabricated. The calendering wafer includes a light layer on the first side. The calendering wafer includes a lens and/or alignment features on the second side. The lenses and/or alignment features are directly etched on the second side of the wafer; or they are first etched onto a different wafer (which may be tantalum or glass) and then soldered to The wafer (wafer to wafer or wafer to wafer). In step S11, the active devices (including, for example, a flip-chip photodetector, a flip chip TIA, and a flip chip modulator driver) are attached to the phosphor wafer. The calendered wafer is then tested in step S12. In step S13, the wafer having the calendering wafer is cut. In step S14, the PCB will be assembled. In step S15, the coupler wafer will be fabricated. The coupler wafer includes a light layer and a plurality of trenches on the first side. The coupler wafer will include lenses and/or alignment features on the second side. In step S16, the wafer with the coupler wafer is cut.

In step S17, the calendering wafer will be connected to the PCB. In step S18, the separated alignment features are added as appropriate. In step S19, the calender wafer and the coupler wafer are mated. In step S20, the calender wafer and the coupler wafer are soldered together using an adhesive. In step S21, the fibers are embedded into the trenches in the coupler wafer. In step S22, a heat sink, an optical fiber strain canceling agent, etc. are added as appropriate. The final test is performed on the transceiver in step S23.

The method illustrated in Figure 29 relies on fabricating the coupler wafers on the calendered wafer in a wafer level fabrication manner. A plurality of individual coupler wafers are embedded into the calender wafer on the calendered wafer. The calender/coupler wafer is then cut. The fiber is then attached to the coupler wafer.

In step S30, the calendering wafer will be fabricated. The calendering wafer includes a light layer on the first side. The calendering wafer will include lenses and/or alignment features on the second side. The lenses and/or alignment features are directly etched on the second side of the wafer; or they are first etched onto a different wafer (which may be tantalum or glass) and then soldered to The wafer (wafer to wafer or wafer to wafer). In step S31, the active devices (including, for example, a flip-chip photodetector, a flip chip TIA, and a flip chip modulator driver) are attached to the phosphor wafer. The calendered wafer is then tested in step S32. In step S34, the coupler wafer will be fabricated. The coupler wafer includes a light layer and a plurality of trenches on the first side. The coupler wafer will include lenses and/or alignment features on the second side. In step S35, the wafer with the coupler wafer is cut.

In step S36, the separated alignment features are added as appropriate. In step S37, the silicon wafers and the coupler wafers are coupled to the phosphor wafer on the wafer. In step S38, the calender wafer and the coupler wafer are soldered. In step S39, the wafers having the calender wafers and the coupler wafers are cut. In step S40, the PCB will be assembled. In step S41, the calendering wafer will be connected to the PCB. In step S42, the fibers are embedded into the trenches in the coupler wafer. In step S43, a heat sink, an optical fiber strain relief, etc. are added as appropriate. The final test is performed on the transceiver in step S44.

It is to be understood that the foregoing description is merely illustrative of the invention. Those skilled in the art will appreciate that various alternatives and modifications can be devised without departing from the invention. Accordingly, the invention is intended to cover all such alternatives, modifications, and variations in the scope of the appended claims.

Claims (8)

 An optical module comprising: a silicon wafer comprising a waveguide, the waveguide transmits an optical signal; and a coupler wafer attached to the fluorescent wafer, such that the optical signals are Transmitting along a light path between the wafer and the coupler wafer; wherein the light path includes a first surface of the coupler wafer and a second surface of the coupler wafer; The cross-sectional dimensions of a beam defined by the optical signals are not the same at the first surface and the second surface.    The optical module of claim 1, wherein at least one of the phosphor wafer and the coupler wafer comprises a focusing element.    The optical module of claim 2, wherein the focusing element is a collimating lens.    A method of aligning two substrates, comprising: providing a first substrate having a first reference point and a second substrate having a second reference point, the first reference point and the second reference point being in each other a surface of the first substrate that is not opposite to the surface of the second substrate; a first camera and a second camera that are opposite to each other are provided, such that the first camera sees the first reference point and the second camera sees the second reference And aligning the first substrate and the second substrate by aligning the first reference point and the second reference point by using the first camera and the second camera.    An optical module includes: an interconnecting waveguide that transmits an optical signal; and a dimming chip that modulates the optical signals, detects the optical signals, or modulates and detects the optical signals An optical signal; and a coupler wafer attached to the fluorescent wafer and the interconnecting waveguide such that the optical signals are along a path between the fluorescent wafer and the interconnecting waveguide The optical path is transmitted; wherein the interconnected waveguide forms an oblique angle with the calendering wafer.    An optical module comprising: a fluorescent wafer comprising a waveguide, the waveguide transmitting an optical signal; a coupler wafer attached to the fluorescent wafer, such that the optical signals are along A light path between the wafer and the coupler wafer is transferred; and a photodetector is surface-mounted to the calender wafer.    A method of manufacturing an optical module, comprising: providing a wafer having a light layer; cutting the wafer to form a silicon wafer; mating the silicon wafer with a printed circuit board; mating one a coupler wafer and the calendering wafer; and an interconnecting waveguide is inlaid to the coupler wafer.    A method of manufacturing an optical module, comprising: providing a wafer composed of a plurality of phosphorescent wafers; mating a plurality of coupler wafers with the phosphor wafers on the wafer; cutting the wafer, using Forming a plurality of calender wafer/coupler wafer assemblies; mating the phosphor wafer/coupler wafer assemblies and the plurality of printed circuit boards; and embedding the plurality of interconnected waveguides into the coupler wafers.