TW201819932A - Testing device for testing electrical property of probe head and testing method thereof - Google Patents

Abstract

A testing device and a testing method are provided. The testing device includes: a circuit board having a plurality of contacting pads and a plurality of conducting channels, and one of the conducting channels is electrically connected with one of the contacting pads, a positioning jig for positioning a probe head on the circuit board to make a plurality of pins of the probe head are contacted with corresponding contacting pad, a conductive block disposed on the probe head, and an electrical property testing instrument having a first detecting terminal and a second detecting terminal, where the first detecting terminal is contacted with the conductive block and the second detecting terminal is contacted with one of the conducting channels, so as to determine whether the pin corresponding the one of conducting channels and the corresponding contacting pad are conducted or not.

Description

 Electric measuring device for electric probe head and electric measuring method thereof  

The present invention relates to an electrical measuring device and an electrical measuring method thereof, and more particularly to an electrical measuring device for an electrical probe head and an electrical measuring method thereof.

In recent years, as electronic products have advanced toward precision and multi-functionality, the wafer structure of integrated circuits applied in electronic products has also become complicated. In order to ensure the electrical quality of the wafer during fabrication, wafer level measurement is performed prior to packaging the wafer. Today's wafer measurement methods use a probe card to test the wafer, and can be classified into a cantilever probe card and a vertical probe card depending on the type of the probe. . In use, by electrically contacting the probe of the probe card directly with a pad or bump of the wafer, the electrical signal is connected to the tester via the circuit board of the probe card. The test machine transmits the test signal to the chip or receives the output signal from the chip, thereby measuring the electrical characteristics of the wafer, and the user can reject the defective wafer according to the measurement result, thereby saving unnecessary packaging cost.

Furthermore, as the structure of the wafer is complicated, the number of probes in the probe head of the probe card can be as high as thousands or tens of thousands, and the size of the probe also tends to be small. When the probes are individually detected by the probe detecting instrument, although a highly accurate detection result can be obtained, it takes tens of hours or more. In addition, when the probes of the probe head are manually detected, although the speed is fast and the time is short, the accuracy of the detection is low, and the probe is easily damaged. For example, please refer to FIG. 1 and FIG. 2 , which shows a top view of a conventional probe head of the electrical measuring device 10 , and FIG. 2 shows a schematic view of the electrical measuring device 10 of FIG. 1 . Side view. The electrical testing device 10 includes a circuit board 110 and an electrical detecting instrument 120. The circuit board 110 includes a plurality of contact pads 111 and a plurality of conductive channels 112 arranged on one side, wherein each of the conductive channels 112 is electrically connected to one of the contact pads 111 by a trace in the circuit board 110. Sexual connection. In the measurement, the probe head 20 is first placed on the circuit board 110, and the first end 211 of the plurality of probes of the probe head 20 is aligned and contacted with the corresponding contact pad 111. Then, the first detecting end 121 of the electrical detecting instrument 120 is brought into contact with the second end 212 of one of the probes 21, and the second detecting end 122 of the electrical detecting instrument 120 is connected to one of the probe terminals 120. The probe 21 is in contact with the conductive channel 112 to determine whether the probe 21 is electrically connected to the corresponding contact pad 111. If the detection result is non-conducting, the probe 21 is further inspected or replaced.

However, in the above-described electrical probe device 10 of the probe head, since the electrical detecting device 120 directly contacts the first detecting end 121 with the second end 212 of the probe 21, when applied If the angle or force is not correct, the surface of the second end 212 of the probe 21 is easily damaged or the probe 21 is bent to cause the needle position to shift. On the other hand, if the probes 21 are assembled, the needle surface levels of the probes 21 are inconsistent, which tends to cause the first probe 21 to be partially placed when the probe head 20 is placed on the circuit board 110. The end 211 is not in contact with the corresponding contact pad 111, so that the measurement result is non-conducting, thereby causing the probe 21 to be misjudged as a defective product.

In view of the above, it is necessary to provide an improved probe head electrical measuring device and electrical measuring method to solve the problems of the prior art.

In order to solve the above technical problems, it is an object of the present invention to provide an electrical measuring device for a probe head, and in which a conductive block is placed on the probe head to be measured. A vertical downward pressure is applied to the plurality of probes of the probe head by the weight of the conductive block to ensure that the probes are in contact with corresponding contact pads on the circuit board. Furthermore, the conductive block is used as a signal transmission medium at one end of the probe, so that only one end of the electrical detecting instrument is in contact with the conductive block, and the other end corresponds to each probe on the circuit board. The conductive channel is in contact to achieve fast detection of each probe.

To achieve the above object, the present invention provides an electrical measuring device for a probe head, comprising: a circuit board having a plurality of contact pads and a plurality of conductive channels arranged on one side, wherein each of the conductive channels and one of the conductive channels The contact pad is electrically connected; a positioning fixture is assembled on the circuit board for positioning a probe head on the circuit board such that one end of the plurality of probes of the probe head is in contact with the corresponding one a conductive contact; a conductive block disposed on the probe head such that the other end of the plurality of probes of the probe head is in electrical contact with the conductive block; and an electrical detecting instrument having a first detecting end And the second detecting end, wherein the first detecting end is in contact with the conductive block, and the second detecting end is in contact with one of the conductive channels, so that the current of the first detecting end is transmitted to the plurality of probes via the conductive block a pin, and by contacting the second detecting end with one of the conductive paths, to determine whether the probe corresponding to one of the conductive paths in the probe head is abnormal.

In one preferred embodiment of the invention, the surface of the conductive block that contacts the plurality of probes of the probe head has a flatness of less than 4 microns.

In a preferred embodiment of the present invention, the conductive block has a pair of bit screws, and the positioning fixture has at least one positioning point, wherein when the conductive block is placed on the probe head, the conductive block The alignment screw is aligned with the at least one positioning point of the positioning fixture.

In one preferred embodiment of the invention, the conductive block has at least one handle member.

The invention also provides an electrical measuring method for a probe head, comprising: providing a circuit board, a plurality of matrix arrayed contact pads; and a plurality of conductive channels arranged on one side, wherein each of the conductive channels and one of the conductive channels The contact pad is electrically connected; a probe head is placed on the circuit board such that one end of the plurality of probes of the probe head is in electrical contact with the corresponding contact pad; and a conductive block is placed on the probe a head, the other end of the plurality of probes of the probe head is in electrical contact with the conductive block; a first detecting end of an electrical detecting device is in contact with the conductive block, and the electrical detecting device is The second detecting end is in contact with one of the conductive paths, so that current of the first detecting end is transmitted to the plurality of probes via the conductive block, and by contacting the second detecting end with one of the conductive paths, Measure whether the probe corresponding to one of the conductive paths in the probe head is abnormal.

In a preferred embodiment of the present invention, before placing a probe head on the circuit board, the method further comprises: assembling a positioning fixture on the circuit board; and placing a probe head in the positioning In the fixture.

In a preferred embodiment of the present invention, when the electrical detecting device determines that the probe is non-conductive with the corresponding contact pad, the method further comprises: applying a pressure perpendicular to the probe head to the conductive block And measuring the step of whether the probe is turned on again.

Compared to the prior art, the present invention places a conductive block on the probe head to be measured in the electrical measuring device. Applying a vertical downward pressure to the plurality of probes of the probe head by the weight of the conductive block to avoid misalignment of the needle surface level of the probes in the prior art, when the probe head is placed in the circuit When the plate is in use, part of the probe is not in contact with the corresponding contact pad, so that the measurement result is non-conducting, thereby causing the probe to be misjudged as a defective product. Furthermore, the conductive block is used as a signal transmission medium at one end of the probe, so that only one end of the electrical detecting instrument is in contact with the conductive block, and the other end corresponds to each probe on the circuit board. The conductive channel is in contact, thereby avoiding the direct contact between the detecting end of the electrical detecting instrument and the probe in the prior art. When the applied angle or force is not proper, the surface of the probe is easily damaged or the probe is bent. The fold causes the needle position to shift.

10, 30‧‧‧Electrical measuring device

110, 310‧‧‧ circuit board

111, 311‧‧‧ contact pads

112, 312‧‧‧ conductive channels

120, 320‧‧‧Electrical testing equipment

121, 321‧‧‧ first detection end

122, 322‧‧‧ second detection end

330‧‧‧Electrical block

331‧‧‧ first surface

332‧‧‧ second surface

333‧‧‧Hands

334‧‧‧ alignment screw

340‧‧‧ positioning fixture

341‧‧‧First anchor point

342‧‧‧Second anchor point

20‧‧‧Probe head

21‧‧‧ probe

211‧‧‧ first end

212‧‧‧ second end

F‧‧‧ Pressure

S11~S14‧‧‧Steps

1 is a top plan view of an electrical measuring device of a conventional probe head; FIG. 2 is a side view of the electrical measuring device of FIG. 1; and FIG. 3 is a view showing a preferred embodiment of the present invention. Schematic diagram of the electrical measuring device of the probe head; FIG. 4 is a top view of the electrical measuring device of FIG. 3; FIG. 5 is a perspective view showing the conductive block of the electrical measuring device of FIG. 3; A flow chart of an electrical test method for a probe head in accordance with a preferred embodiment of the present invention.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Please refer to FIG. 3 and FIG. 4, FIG. 3 is a schematic diagram of an electrical measuring device 30 of a probe head according to a preferred embodiment of the present invention, and FIG. 4 is a view showing the electrical measuring device 30 of FIG. Top view. The electrical measuring device 30 includes a circuit board 310, an electrical detecting device 320, a conductive block 330 and a positioning fixture 340. The circuit board 110 includes a plurality of matrix-arranged contact pads 311 and a plurality of conductive channels 312 arranged on one side, wherein each of the conductive channels 312 is in contact with one of the traces in the circuit board 310. The pad 311 is electrically connected. In use, the positioning fixture 340 is first assembled to the circuit board 310, and then a probe head 20 is placed in the positioning fixture 340. The probe head 340 is positioned at a specific position on the circuit board 310 by the positioning fixture 340 to connect the first end 211 of the plurality of probes 21 of the probe head 20 with the corresponding contact pad. 311 is aligned and electrically in contact. Then, the conductive block 330 is pressed onto the probe head 20 such that the second end 212 of the plurality of probes 21 of the probe head 20 is in electrical contact with the conductive block 330. A vertical downward pressure F is applied to the plurality of probes 21 of the probe head 20 by the weight of the conductive block 330 to achieve the effect of leveling the needle faces of the probes, thereby ensuring the probes 21 The first end 211 can be in contact with a corresponding contact pad 311 on the circuit board 310. In addition, since the conductive block 330 is made of a conductive material and the conductive block 330 is in contact with the probes 21, the conductive block 330 can serve as a signal transmission medium for the probes 21 during measurement. In detail, when the electrical detecting device 320 is used to detect whether the probes 21 are turned on, the first detecting end 321 of the electrical detecting device 320 contacts the conductive block 330, and the electrical detecting device 320 The second detecting end 322 is in contact with one of the conductive channels 312, so that the current of the first detecting end 321 is transmitted to the probes 21 via the conductive block 330, and then transmitted to the circuit via the probes 21 Board 310. Therefore, it is only necessary to move the position of the second detecting end 322 to achieve the function of quickly detecting each probe. More specifically, since one of the conductive paths 312 corresponds to the contact pad 311 which is in contact with one of the probes 21. Therefore, whether the probe 21 in the probe head 20 is abnormal in the probe head 20 can be determined by the measurement result. If the detection result is non-conducting, it indicates that one of the probes 21 is abnormal, and one of the probes 21 needs to be detected. Needle 21 is further inspected or replaced.

Referring to FIG. 3 and FIG. 5, FIG. 5 is a perspective view showing the conductive block 330 of the electrical measuring device 30 of FIG. The conductive block 330 has a first surface 331 and a second surface 332 opposite the first surface 331. Preferably, the flatness of the first surface 331 of the conductive block 330 is controlled to be less than 4 micrometers. Therefore, when the conductive block 330 is pressed onto the probe head 20, the flat first surface 331 contacts the plurality of probes 21 of the probe head 20 to level the probes. The effect of the needle of 21. In addition, the conductive block 330 further includes a pair of handle members 333 assembled on the second surface 332 for the user to grasp.

As shown in FIG. 4 and FIG. 5, the conductive block 330 has a pair of position screws 334, and the positioning fixture 340 has a first positioning point 341 and a second positioning point 342, wherein the first positioning point The second positioning point 341 and the second positioning point 342 correspond to the center position of the probe head 20. When the conductive block 330 is placed on the probe head 20, the alignment screw 334 of the conductive block 330 is aligned with the first positioning point 341 and the second positioning point 342 of the positioning fixture 340, so that the The conductive block 330 is evenly pressed against the probe head 20. It should be noted that the first positioning point 341 and the second positioning point 342 can be a lock, a bump, a hole, etc., without being limited thereto.

Referring to Figure 6, there is shown a flow chart of an electrical measurement method for a probe head in accordance with a preferred embodiment of the present invention. The electrical measurement method is implemented by the electrical measuring device 30 of the present invention. The electrical measurement method comprises the following steps: First, step S11 is performed to provide a circuit board 310. The circuit board 310 has a plurality of matrix-arranged contact pads 311 and a plurality of conductive channels 312 arranged on one side, wherein each of the conductive channels 312 has a contact pad in the circuit board 310 and one of the contact pads. 311 electrical connection. Next, in step S12, a probe head 20 is placed on the circuit board 310. Preferably, a positioning fixture 340 is assembled on the circuit board 310, and the probe head 20 is placed in the positioning fixture 340 such that the first end 211 of the plurality of probes 21 of the probe head 20 corresponds to The contact pad 311 is in electrical contact. Next, in step S13, a conductive block 330 is placed on the probe head 20 such that the second end 212 of the plurality of probes 21 of the probe head 20 is in electrical contact with the conductive block 330. A vertical downward pressure F is applied to the plurality of probes 21 of the probe head 20 by the weight of the conductive block 330 to achieve the effect of leveling the needle faces of the probes, thereby ensuring the probes 21 The first end 211 can be in contact with a corresponding contact pad 311 on the circuit board 310. In addition, since the conductive block 330 is made of a conductive material and the conductive block 330 is in contact with the probes 21, the conductive block 330 can serve as a signal transmission medium for the probes 21 during measurement. In detail, after the conductive block 330 is placed on the second end 212 of the plurality of probes 21 of the probe head 20, step S14 is performed to connect the first detecting end 321 of the electrical detecting device 320 with the The conductive block 330 is in contact, and the second detecting end 322 of the electrical detecting device 320 is in contact with one of the conductive channels 312, so that the current of the first detecting end 321 is transmitted to the probes 21 via the conductive block 330. The probe 21 is further transmitted to the circuit board 310 to measure whether the probe 21 corresponding to the one of the conductive paths 312 in the probe head 20 is abnormal. That is to say, in the electrical measuring method of the present invention, the position of the second detecting end 322 can be moved only to achieve the function of quickly detecting each probe. Also, since one of the conductive paths 312 corresponds to the contact pad 311 that is in contact with one of the probes 21. Therefore, whether the one of the probes 21 in the probe head 20 is electrically connected to the corresponding contact pad 311 can be determined by the measurement result. If the detection result is non-conducting, it indicates that one of the probes 21 is abnormal. One of the probes 21 needs to be further inspected or replaced. It should be noted that since the probe 21 may not be completely in contact with the contact pad 311, the detection result may be misjudged, so when the electrical detecting instrument 320 determines the probe 21 and the corresponding contact pad. When the 311 is not conducting, the step of applying the pressure perpendicular to the probe head 20 to the conductive block 330 and measuring whether the probe 32 is turned on again can be performed to avoid the occurrence of a false positive.

In the electrical testing method of the present invention, the conductive block 330 has a first surface 331 and a second surface 332 opposite the first surface 331. Preferably, the flatness of the first surface 331 of the conductive block 330 is controlled to be less than 4 micrometers. Therefore, when the conductive block 330 is pressed onto the probe head 20, the flat first surface 331 contacts the plurality of probes 21 of the probe head 20 to level the probes. The effect of the needle of 21. In addition, the conductive block 330 further includes a pair of handle members 333 assembled on the second surface 332 for the user to grasp.

In the electrical measurement method of the present invention, the conductive block 330 has a pair of position screws 334, and the positioning fixture 340 has a first positioning point 341 and a second positioning point 342, wherein the first positioning point 341 and The second positioning point 342 corresponds to the center position of the probe head 20. When the conductive block 330 is placed on the probe head 20, the alignment screw 334 of the conductive block 330 is aligned with the first positioning point 341 and the second positioning point 342 of the positioning fixture 340, so that the The conductive block 330 is evenly pressed against the probe head 20. It should be noted that the first positioning point 341 and the second positioning point 342 can be a lock, a bump, a hole, etc., without being limited thereto.

In summary, in the electrical measuring device and the electrical measuring method of the present invention, a conductive block is placed on the probe head to be measured to apply a plurality of probes to the probe head by the weight of the conductive block. a vertically downward pressure to avoid inconsistencies in the pinhole level of the probes in the prior art, such that when the probe head is placed on the circuit board, part of the probes are not in contact with the corresponding contact pads, such that the amount The result of the measurement is non-conducting, which in turn causes the probe to be misjudged as a defective product. Furthermore, the conductive block is used as a signal transmission medium at one end of the probe, so that only one end of the electrical detecting instrument is in contact with the conductive block, and the other end corresponds to each probe on the circuit board. The conductive channel is in contact, thereby avoiding the direct contact between the detecting end of the electrical detecting instrument and the probe in the prior art. When the applied angle or force is not proper, the surface of the probe is easily damaged or the probe is bent. The fold causes the needle position to shift.

While the invention has been described above in terms of the preferred embodiments, the invention is not intended to limit the invention, and the invention may be practiced without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

Claims (10)

 An electrical measuring device for a probe head, comprising: a circuit board having a plurality of contact pads and a plurality of conductive channels arranged on one side, wherein each of the conductive channels is electrically connected to one of the contact pads; Locating a fixture on the circuit board for positioning a probe head on the circuit board such that one end of the plurality of probes of the probe head is in electrical contact with the corresponding contact pad; Placed on the probe head such that the other end of the plurality of probes of the probe head is in electrical contact with the conductive block; and an electrical detecting instrument having a first detecting end and a second detecting end, wherein the The first detecting end is in contact with the conductive block, and the second detecting end is in contact with one of the conductive channels, so that current of the first detecting end is transmitted to the plurality of probes via the conductive block, and by using the first The second detecting end is in contact with one of the conductive paths to determine whether the probe corresponding to one of the conductive paths in the probe head is abnormal.    The electrical measuring device of the probe head according to claim 1, wherein the surface of the conductive block contacting the plurality of probes of the probe head has a flatness of less than 4 micrometers.    The electrical measuring device of the probe head according to claim 1, wherein the conductive block has a pair of position screws, and the positioning fixture has at least one positioning point, wherein the conductive block is placed on the probe The alignment screw of the conductive block is aligned with the at least one positioning point of the positioning fixture.    The electrical measuring device of the probe head according to claim 1, wherein the conductive block has at least one handle member.    An electrical test method for a probe head, comprising: providing a circuit board having a plurality of matrix-arranged contact pads and a plurality of conductive channels arranged on one side, wherein each of the conductive channels and one of the contact pads is electrically connected a probe; placing a probe head on the circuit board such that one end of the plurality of probes of the probe head is in electrical contact with the corresponding contact pad; placing a conductive block on the probe head, so that The other end of the plurality of probes of the probe head is in electrical contact with the conductive block; the first detecting end of an electrical detecting device is in contact with the conductive block, and the second detecting end of the electrical detecting device is One of the conductive channels is in contact such that current of the first detecting end is transmitted to the plurality of probes via the conductive block, and is measured by contacting the second detecting end with one of the conductive paths Whether the probe corresponding to one of the conductive paths in the probe head is abnormal.    The method of electrical testing of the probe head according to claim 5, wherein before placing a probe head on the circuit board, the method further comprises: assembling a positioning fixture on the circuit board; and The probe head is placed in the positioning fixture.    The method of electrical testing of the probe head according to claim 6, wherein the conductive block has a pair of position screws, and the positioning fixture has at least one positioning point, wherein the conductive block is placed on the probe The alignment screw of the conductive block is aligned with the at least one positioning point of the positioning fixture.    The method of electrical testing of the probe head according to claim 5, wherein when the electrical detecting device determines that the probe is non-conductive with the corresponding contact pad, the method further comprises: applying a vertical to the conductive block The pressure of the probe head is measured again, and the step of measuring whether the probe is turned on is performed again.    The method of electrical testing of the probe head according to claim 5, wherein the surface of the conductive block contacting the plurality of probes of the probe head has a flatness of less than 4 micrometers.    The method of electrical testing of the probe head of claim 5, wherein the conductive block has at least one handle.