TW201819815A - Illuminating device characterized by suppressing the decrease of light emission from a lens cover plate to a diffusion cover plate, thereby having a high illuminating efficiency - Google Patents

Illuminating device characterized by suppressing the decrease of light emission from a lens cover plate to a diffusion cover plate, thereby having a high illuminating efficiency Download PDF

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Publication number
TW201819815A
TW201819815A TW106113132A TW106113132A TW201819815A TW 201819815 A TW201819815 A TW 201819815A TW 106113132 A TW106113132 A TW 106113132A TW 106113132 A TW106113132 A TW 106113132A TW 201819815 A TW201819815 A TW 201819815A
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Taiwan
Prior art keywords
lens
led
cover plate
light source
light
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TW106113132A
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Chinese (zh)
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TWI640719B (en
Inventor
Kosuke Sumiyoshi
Yoshifumi Sekiguchi
Hironao Mitsugi
masataka Sakiyama
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Hitachi Appliances Inc
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/04Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02Combinations of only two kinds of elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/104Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction

Abstract

To provide a highly efficient illuminating device that suppresses the decrease of light emission from the lens cover plate to the diffusion cover plate. An illuminating device includes a substrate on which an LED light source is mounted, a lens portion covered with the LED light source and a lens cover plate connected to the connecting portion of the lens portion, and a diffusion cover plate having a curved surface and covered with the LED light source and the lens cover plate. The connecting portion has a flat portion and a concave portion, and the concave portion is located at the end of the lens.

Description

照明裝置    Lighting device   

本發明係有關照明裝置。 The present invention relates to a lighting device.

近年,作為照明裝置之光源,LED(Light Emitting Diode、發光二極體)之使用則變多。作為安裝於天頂形式之室內照明裝置用的光源,亦取代於螢光管而加以開始用LED。更且,作為LED照明裝置,對於來自LED之出射光賦予指向性。於專利文獻1至專利文獻4,關於對於來自LED之出射光賦予指向性之光學系統而加以揭示。 In recent years, LEDs (Light Emitting Diodes) have been increasingly used as light sources for lighting devices. As a light source for indoor lighting devices installed in the form of a zenith, LEDs are also used instead of fluorescent tubes. Furthermore, as the LED lighting device, directivity is given to the light emitted from the LED. Patent Documents 1 to 4 disclose optical systems that provide directivity to outgoing light from LEDs.

[先前技術文獻]     [Prior technical literature]     [專利文獻]     [Patent Literature]    

[專利文獻1]日本特開2014-154461號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2014-154461

[專利文獻2]日本特開2014-135233號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2014-135233

[專利文獻3]日本特開2011-204397號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2011-204397

[專利文獻4]日本特開2013-145685號公報 [Patent Document 4] Japanese Patent Laid-Open No. 2013-145685

作為擴散自LED所出射的光,效率佳地明亮照射擴散蓋板全體之手段,有使用具有對應於配置在光源基板之複數的LED之透鏡形狀之透鏡蓋板的照明裝置。但必須有連接對應於複數LED之透鏡形狀於透鏡蓋板之連接部,另外,為了確保成形材料的流動性,對於連接部係必須有某種程度之厚度。因此,自LED所出射的光之一部分係未有自透鏡加以出射至擴散蓋板情況而導光至連接部,而成為自透鏡蓋板至擴散蓋板的光之出射量降低。 As a means for diffusing the light emitted from the LED to efficiently and brightly illuminate the entire diffusion cover, there is an illumination device using a lens cover having a lens shape corresponding to a plurality of LEDs arranged on a light source substrate. However, there must be a connection portion connecting the lens shape corresponding to the plurality of LEDs to the lens cover. In addition, in order to ensure the fluidity of the molding material, the connection portion must have a certain thickness. Therefore, a part of the light emitted from the LED is guided to the connection portion without being emitted from the lens to the diffusion cover, and the amount of light emitted from the lens cover to the diffusion cover is reduced.

本發明係其目的為提供:抑制自透鏡蓋板至擴散蓋板的光之出射量降低之照明裝置。 An object of the present invention is to provide a lighting device that suppresses a reduction in the amount of light emitted from a lens cover to a diffusion cover.

為了解決上述課題,其特徵為具有:安裝LED光源之基板,和具有被覆前述LED光源之透鏡部與連接該透鏡部之連接部的透鏡蓋板,和被覆前述LED光源與前述透鏡蓋板,而具有曲面的擴散蓋板;前述連接部係具有平坦部和凹狀部;前述凹狀部係位置於前述透鏡的端部者。 In order to solve the above-mentioned problems, it is characterized by having a substrate on which an LED light source is mounted, a lens cover having a lens portion covering the LED light source and a connection portion connecting the lens portion, and covering the LED light source and the lens cover, and A diffusion cover plate having a curved surface; the connecting portion has a flat portion and a concave portion; the concave portion is located at an end of the lens.

如根據本發明,可提供:抑制自透鏡蓋板至擴散蓋板的光之出射量降低之高效率的照明裝置。 According to the present invention, it is possible to provide a highly efficient lighting device that suppresses a reduction in the amount of light emitted from the lens cover to the diffusion cover.

1‧‧‧LED照明裝置 1‧‧‧LED lighting device

11‧‧‧骨幹 11‧‧‧ Backbone

11a‧‧‧配接器安裝孔 11a‧‧‧ adapter mounting hole

12‧‧‧配接器承受具(絕緣板) 12‧‧‧ adapter holder (insulation plate)

12a‧‧‧固定部 12a‧‧‧Fixed section

12b‧‧‧圓筒部 12b‧‧‧Cylinder

13‧‧‧電源基板 13‧‧‧Power supply substrate

13a‧‧‧電源連接頭 13a‧‧‧Power connector

13b‧‧‧光源連接頭 13b‧‧‧light source connector

14‧‧‧散熱板 14‧‧‧ heat sink

14a‧‧‧基板支持部 14a‧‧‧ Substrate Support Department

14b‧‧‧貫通孔 14b‧‧‧through hole

14c‧‧‧環狀部 14c‧‧‧Ring

14d‧‧‧立壁部 14d‧‧‧ standing wall

14e‧‧‧電線貫通孔 14e‧‧‧Wire through hole

14f‧‧‧收納凹部 14f‧‧‧Storage recess

14g‧‧‧外周壁 14g‧‧‧outer wall

15‧‧‧LED光源基板 15‧‧‧LED light source substrate

15a‧‧‧配線基板 15a‧‧‧wiring board

15b‧‧‧LED元件群(LED元件) 15b‧‧‧LED element group (LED element)

15b1‧‧‧白光色LED 15b1‧‧‧White LED

15b2‧‧‧燈泡色LED 15b2‧‧‧bulb color LED

15b3‧‧‧藍色LED 15b3‧‧‧Blue LED

15b4‧‧‧保安燈LED 15b4‧‧‧Security Light LED

15c‧‧‧突出片 15c‧‧‧ prominence

15d‧‧‧連接頭部 15d‧‧‧Connect the head

15e‧‧‧遙控器受光部 15e‧‧‧Remote receiver

16‧‧‧透鏡蓋板 16‧‧‧ lens cover

16a‧‧‧透鏡部 16a‧‧‧Lens section

16a1‧‧‧圓頂形狀部 16a1‧‧‧ dome shaped part

16a2‧‧‧透鏡表面部 16a2‧‧‧ lens surface

16a3‧‧‧凹狀部 16a3‧‧‧ concave

16a4‧‧‧凸狀部 16a4‧‧‧ convex

16b‧‧‧連接部 16b‧‧‧Connecting section

16b1‧‧‧貫通孔 16b1‧‧‧through hole

16c‧‧‧壁部 16c‧‧‧Wall

16c1‧‧‧端部 16c1‧‧‧End

17‧‧‧中心蓋板 17‧‧‧ center cover

18‧‧‧燈罩 18‧‧‧ Lampshade

19‧‧‧反射板 19‧‧‧Reflector

19a‧‧‧穴形狀 19a‧‧‧hole shape

20‧‧‧電源鎧甲 20‧‧‧ Power Armor

21‧‧‧光源鎧甲 21‧‧‧Light Armor

22‧‧‧承受具 22‧‧‧ Bearing

23‧‧‧裝飾框 23‧‧‧Decorative frame

24‧‧‧感測器單元 24‧‧‧ Sensor Unit

圖1係顯示有關本發明之實施形態的LED照明裝置的圖,自斜下方向而視時之顯示的外觀斜視圖。 FIG. 1 is a diagram showing an LED lighting device according to an embodiment of the present invention, and is an external perspective view of the display when viewed from an obliquely downward direction.

圖2係顯示自斜上方向而視LED照明裝置時之狀態的外觀斜視圖。 FIG. 2 is an external perspective view showing a state when the LED lighting device is viewed from an oblique upward direction.

圖3係顯示自斜下方向而視LED照明裝置時之狀態的分解觀斜視圖。 3 is an exploded perspective view showing a state when the LED lighting device is viewed from an obliquely downward direction.

圖4係顯示取下燈罩而將LED蓋板的一部分作為剖面的LED照明裝置之斜視圖。 FIG. 4 is a perspective view showing the LED lighting device with the lamp cover removed and a part of the LED cover as a cross section.

圖5係取下燈罩之LED照明裝置的中央縱剖面圖之一部分。 Fig. 5 is a part of a central longitudinal sectional view of the LED lighting device with the lamp cover removed.

圖6係顯示LED光源基板之一例的圖。 FIG. 6 is a diagram showing an example of an LED light source substrate.

圖7係圖5的A部擴大圖。 FIG. 7 is an enlarged view of part A of FIG. 5.

圖8係圖5的A部擴大圖,顯示本實施形態的圖。 FIG. 8 is an enlarged view of part A of FIG. 5 and is a view showing the present embodiment.

對於有關本發明之實施形態的LED照明裝置(LED吸頂燈),適宜參照圖面的同時,加以詳細說明。然而,在本實施形態中,作為LED照明裝置1的一例,舉例說明平面視圓形之構成,但形狀係未加以限定於此,例如,亦可適用於四角形,六角形,八角形等之多角形的構成者。另外,在本實施形態中,以下,加以說明作為主光 源而使用發光二極體(LED)之LED照明裝置1,但主光源係並未加以限定於LED之構成。 The LED lighting device (LED ceiling lamp) according to the embodiment of the present invention will be described in detail while referring to the drawings as appropriate. However, in this embodiment, as an example of the LED lighting device 1, the structure of a circular shape in plan view is exemplified, but the shape is not limited to this. For example, it can be applied to many shapes such as a quadrangle, a hexagon, and an octagon. Angled Constructor. In this embodiment, an LED lighting device 1 using a light emitting diode (LED) as a main light source will be described below, but the main light source is not limited to the configuration of the LED.

圖1及圖2所示之LED照明裝置1係例如,經由藉由卡合於設置在家屋的天頂面之懸掛接線盒與懸掛密封件等之屋內配線器具(圖示省略)之安裝配接器(圖示省略),加以連接於外部電源之同時,加以固定於天頂面之特定位置而供予利用者。LED照明裝置1係例如,由九型或角型等之構成所成(在本實施形態中係為九型)。然而,在以下的說明中,將加以安裝LED照明裝置1於天頂面之狀態,作為基準,紙面上側則為天頂側(上面側),紙面下側則為地面側(下面側)。 The LED lighting device 1 shown in FIG. 1 and FIG. 2 is, for example, an installation and connection of an indoor wiring device (not shown) such as a suspension junction box and a suspension seal provided on a ceiling surface of a home. The device (not shown) is connected to an external power source and fixed to a specific position on the zenith surface for the user. The LED lighting device 1 is made of, for example, a nine-type or a corner type (it is a nine-type in this embodiment). However, in the following description, the state in which the LED lighting device 1 is mounted on the zenith surface will be used as a reference, and the upper side of the paper surface is the zenith side (upper side), and the lower side of the paper surface is the ground side (lower side).

如圖3所示,LED照明裝置1係由具備:骨幹11,配接器接受部12(絕緣板),電源基板13,散熱版14,LED光源基板15,透鏡蓋板16,中心蓋板17,燈罩18,裝飾框23,感測器單元24等而加以構成。 As shown in FIG. 3, the LED lighting device 1 includes: a backbone 11, an adapter receiving portion 12 (insulating plate), a power supply substrate 13, a heat sink 14, an LED light source substrate 15, a lens cover 16, and a center cover 17. , A lampshade 18, a decorative frame 23, a sensor unit 24, and the like.

骨幹11係將鋼板(例如,SECC(電鍍鋅鋼板))加工成形為略圓形狀之基底構件,而凹面則呈朝向地面側地加以形成為略凹狀(碟狀)。另外,對於骨幹11之中央,係加以形成卡合安裝配接器(圖示省略)之配接器安裝孔11a。 The backbone 11 is a base member in which a steel plate (for example, SECC (Electro-galvanized steel plate)) is formed into a substantially circular shape, and the concave surface is formed into a slightly concave shape (disc) toward the ground side. In addition, the center of the backbone 11 is formed with an adapter mounting hole 11a for engaging and mounting an adapter (not shown).

配接器接受部12(絕緣板)係由具有難燃性及電性絕緣性之合成樹脂(例如,PP:聚丙烯樹脂等)而加以形成,具有螺栓固定於骨幹11下面之環形狀的固定部12a,和自此固定部12a之內周緣部延伸出於地面側(下方) 之圓筒部12b。 The adapter receiving portion 12 (insulating plate) is formed of a synthetic resin (for example, PP: polypropylene resin) having flame retardance and electrical insulation, and has a ring-shaped fixing fixed to the bottom of the backbone 11 A portion 12a and a cylindrical portion 12b extending from the ground side (below) from the inner peripheral edge portion of the fixed portion 12a.

如圖3所示,電源基板13係具有包含控制部之點燈電路等,隔著配接器接受部12(絕緣板)而加以栓合於骨幹11。經由此,電源基板13係於由骨幹11,和後述之散熱版14所圍繞之散熱空間內,在維持電性絕緣性之狀態加以配置。 As shown in FIG. 3, the power source board 13 includes a lighting circuit including a control unit, and is bolted to the backbone 11 via the adapter receiving unit 12 (insulating plate). As a result, the power supply substrate 13 is arranged in a heat radiation space surrounded by the backbone 11 and a heat radiation plate 14 described later, while maintaining electrical insulation.

另外,電源基板13係藉由連接於固定在此電源基板13下面之電源連接頭13a之電源鎧甲20,與安裝配接器(圖示省略)加以電性連接。 In addition, the power substrate 13 is electrically connected to a mounting adapter (not shown) through a power armor 20 connected to a power connector 13a fixed below the power substrate 13.

光源連接頭13b係為了由光源鎧甲21而連結電源基板13與LED光源基板15之構成。 The light source connector 13 b is configured to connect the power source substrate 13 and the LED light source substrate 15 by the light source armor 21.

經由此,LED照明裝置1係呈各藉由屋內配線器具(圖示省略),安裝配接器(圖示省略),電源鎧甲20,光源鎧甲21,電源基板13,而加以供電地加以構成。 As a result, the LED lighting device 1 is constituted by supplying power to the indoor wiring apparatus (not shown), mounting adapters (not shown), a power source armor 20, a light source armor 21, and a power source substrate 13, respectively. .

散熱板14係達成散熱在作動時發熱的電源基板13,及安裝有複數LED之LED光源基板15的熱而進行冷卻作用的金屬製構件。後述之LED元件群15b之LED係有著對於熱為弱之性質。另外,LED係在使用時,因流動低電壓之大電流而進行高亮度發光之故,經由伴隨著此發光的發熱而LED本身,或周圍的構件產生劣化之故,而對於抑制此劣化而實現長壽命.高信賴性,加以要求進行適當之散熱。 The heat radiating plate 14 is a metal member that cools the heat of the power supply substrate 13 that emits heat during operation, and the LED light source substrate 15 on which a plurality of LEDs are mounted to perform cooling. The LEDs of the LED element group 15b described later have a property of being weak against heat. In addition, when LEDs are used, high-intensity light emission is caused by a large current flowing at a low voltage, and the LED itself or surrounding components are degraded due to the heat generated by this light emission. This is achieved by suppressing this degradation. long life. High reliability requires proper heat dissipation.

散熱板14係將鋼板加工成形為略圓形狀之構成,而加以形成有突出於地面側之圓錐台形狀的基板支持 部14a。另外,散熱板14係例如,由使用鍍鋅鋼板等之熱傳導性良好之金屬而加以構成,經由施以引伸加工,無縫地加以一體成形,加以謀求強度提升。另外,散熱板14係加以形成為較骨幹11為大口徑,作為呈較骨幹11突出於徑方向外側而加以安裝於骨幹11。散熱板14係於此散熱板14下面側,主光源之複數的LED元件(LED元件群15b)則呈照射光於下方向地,配置LED光源基板15。作為補足,LED光源基板15係於散熱板14之下面側,呈添加於該下面地加以配置。 The heat radiating plate 14 has a structure in which a steel plate is formed into a substantially circular shape, and a truncated cone-shaped substrate supporting portion 14a is formed so as to protrude from the ground side. In addition, the heat radiation plate 14 is made of, for example, a metal having good thermal conductivity such as a galvanized steel sheet, and is seamlessly integrally formed through extension processing to improve strength. In addition, the heat dissipation plate 14 is formed to have a larger diameter than the backbone 11, and is attached to the backbone 11 so as to protrude outward from the radial direction than the backbone 11. The heat radiating plate 14 is located on the lower side of the heat radiating plate 14, and the LED light source substrate 15 is disposed with a plurality of LED elements (LED element group 15 b) of the main light source irradiating light in a downward direction. As a complement, the LED light source substrate 15 is arranged on the lower surface side of the heat sink 14 and is added to the lower surface.

然而,對於散熱板14之徑方向的中心,係於與配接器接受部12之圓筒部12b對應之位置,加以形成圓形的貫通孔14b。另外,對於散熱板14之外周部,係具有形成為水平之圓形的環狀部14c,和加以形成於環狀部14c之外周部的立壁部14d。對於環狀部14c之下面係以120°間隔而加以安裝為了掛上後述之燈罩18之承受具22(參照圖3)於3處。 However, the radial center of the heat dissipation plate 14 is formed at a position corresponding to the cylindrical portion 12 b of the adapter receiving portion 12, and a circular through hole 14 b is formed. In addition, the outer peripheral portion of the heat radiating plate 14 includes an annular portion 14 c formed into a horizontal circular shape, and a standing wall portion 14 d formed on the outer peripheral portion of the annular portion 14 c. The lower surface of the annular portion 14c is mounted at three intervals at intervals of 120 ° so as to hang the holders 22 (see FIG. 3) of the lamp cover 18 described later.

如圖4所示,電線插通孔14e係呈朝向於散熱板14上側方向而擴開地,加以穿孔於形成為傾斜之凹陷狀的收納凹部14f之外周壁14g的貫通孔所成。對於電線插通孔14e係加以配線有複數之光源鎧甲21。 As shown in FIG. 4, the electric wire insertion hole 14 e is formed as a through hole that is opened toward the upper side of the heat dissipation plate 14 and is perforated in an outer peripheral wall 14 g of the storage recessed portion 14 f formed in an inclined recessed shape. A plurality of light source armors 21 are wired to the wire insertion hole 14e.

收納凹部14f係加以內設有加以連接電源鎧甲20,光源鎧甲21之電源基板13的收納空間(參照圖5)。 The storage recess 14f is provided with a storage space for connecting the power source armor 20 and the light source armor 21 to the power source substrate 13 (see FIG. 5).

LED光源基板15係具備:介入存在散熱板14於骨幹11之下面側而加以配置之環形狀的配線基板 15a,和經由焊接等而加以和接配置成同心圓狀於此配線基板15a之一面側(地面側)的複數之LED的主光源之LED元件群15b而加以構成(參照圖3)。然而,對於LED元件群15b之詳細係後述之。 The LED light source substrate 15 includes a ring-shaped wiring substrate 15a which is disposed by interposing the heat dissipation plate 14 on the lower side of the backbone 11 and is concentrically arranged in a concentric circle shape by soldering on one side of the wiring substrate 15a. The (ground-side) LED element group 15b of the plurality of LEDs as the main light source is configured (see FIG. 3). However, the details of the LED element group 15b will be described later.

配線基板15a係例如,由形成絕緣層及銅箔圖案等於鋁合金製之略環狀的金屬板而加以構成,或者由形成銅箔圖案,抗焊劑等於熱傳導性良好之樹脂之平板上(例如,聚醯亞胺樹脂等)而加以構成。 The wiring substrate 15a is, for example, formed by forming an insulating layer and a metal plate having a substantially annular shape made of aluminum alloy with a copper foil pattern, or by forming a copper foil pattern with a solder resist equal to a resin having good thermal conductivity (for example, Polyimide resin, etc.).

在本實施形態中,經由具備如前述構成之骨幹11,和散熱板14之時,加大散熱空間的容積(增加散熱空間的空氣量),而謀求電源基板13,及LED光源基板15之散熱效率的提升。其結果,可提高LED元件群15b的發光效率。 In this embodiment, when the backbone 11 and the heat dissipation plate 14 are provided as described above, the volume of the heat dissipation space is increased (the amount of air in the heat dissipation space is increased), and the power source substrate 13 and the LED light source substrate 15 are radiated. Improved efficiency. As a result, the light emitting efficiency of the LED element group 15b can be improved.

圖6所示之LED光源基板15係顯示14疊用的LED之配列圖案之一例。LED元件群15b係具備發射白色(D色)的光之複數個之白光色LED(Light Emitting Diode)15b1,和發射燈泡色(L色)的光之複數個之燈泡色LED15b2,和發射藍色的光之複數個之藍色LED15b3,和保安燈LED15b4而加以構成主光源。另外,對於LED光源基板15之外周端係具有朝向於外側而加以突出形成的略圓弧形狀的突出片15c,和連接於加以載設於突出片15c之光源鎧甲21的2個連接部15d,及遙控器受光部15e。 The LED light source substrate 15 shown in FIG. 6 is an example of an array pattern of 14-layer LEDs. The LED element group 15b includes a plurality of white light-emitting LEDs (light emitting diodes) 15b1 that emit white (D color) light, and a plurality of light bulb-colored LEDs 15b2 that emit light (L color). A plurality of blue LEDs 15b3 and a security light LED15b4 constitute the main light source. In addition, the outer peripheral end of the LED light source substrate 15 has a slightly arc-shaped protruding piece 15c protruding toward the outside and two connecting portions 15d connected to the light source armor 21 mounted on the protruding piece 15c. And remote control light receiving unit 15e.

白光色LED15b1係峰值波長為430nm~ 460nm之構成,自外周側至內周側,加以配置為複數列(例如,8列)成同心圓狀。 The white LED 15b1 has a peak wavelength of 430 nm to 460 nm, and is arranged in a plurality of rows (for example, 8 rows) in a concentric circle from the outer peripheral side to the inner peripheral side.

燈泡色LED15b2係峰值波長為550nm~650nm之構成,而在加以複數列配置成同心圓狀地各列中,將白光色LED15b1夾入其間而加以配置。即,燈泡色LED15b2係在同心圓狀的各列中,於周方向,將2個白光色LED15b1夾入其間而加以配置。然而,亦包含本實施形態,白光色LED15b1,及燈泡色LED15b2之配置數量關係為未具有規則性亦可。另外,白光色LED15b1與燈泡色LED15b2係在同心圓狀的各列中,朝向於周方向而加以配置成等間隔或略等間隔。 The bulb-colored LED 15b2 has a peak wavelength of 550 nm to 650 nm, and in a plurality of columns arranged in a concentric circle, the white-color LED 15b1 is sandwiched therebetween and arranged. That is, the bulb-colored LEDs 15b2 are arranged in the concentric circles, and two white-colored LEDs 15b1 are sandwiched therebetween in the circumferential direction. However, this embodiment is also included, and the arrangement relationship between the white-color LED 15b1 and the bulb-color LED 15b2 may not have regularity. In addition, the white LED 15b1 and the light bulb LED15b2 are arranged in concentric circles, and are arranged at equal intervals or at approximately equal intervals in the circumferential direction.

藍色LED15b3係峰值波長為470nm~480nm之構成,在加以複數列配置成同心圓狀的白光色LED15b1,和燈泡色LED15b2之最外周與最內周之間,於周方向,隔著間隔而加以配置為圓環狀。在圖6的實施形態中,加以配置藍色LED15b3的列係成為自圓環狀的中心至同心圓狀第2列與第4列之配置。 The blue LED 15b3 has a peak wavelength of 470 nm to 480 nm. The white LED 15b1 and the bulb-color LED 15b2 are arranged in a plurality of rows in a concentric circle, and are arranged at intervals in the circumferential direction. Configured as a ring. In the embodiment of FIG. 6, the rows in which the blue LEDs 15 b 3 are arranged are arranged from the ring-shaped center to the concentric circles in the second and fourth rows.

圖6所示之LED元件群15b係例如,經由168個的白光色LED15b1,76個的燈泡色LED15b2,及32個的藍色LED15b3而加以構成。藍色LED15b3的數量係作為白光色LED15b1及燈泡色LED15b2之合計數的10%程度者為佳。 The LED element group 15b shown in FIG. 6 is configured by, for example, 168 white light LEDs 15b1, 76 light bulb color LEDs 15b2, and 32 blue LEDs 15b3. The number of blue LEDs 15b3 is preferably about 10% of the total of the white LED15b1 and the bulb LED15b2.

然而,對於散熱板14係經由使自LED元件群15b所照射的光反射於地面側之白色塗料而進行反射塗 裝。在本實施形態中,為了更使反射效率提升,於LED光源基板15之表面(地面側),具備呈避開LED元件群15b地,具有與LED元件群15b同等數量開孔之穴形狀19a,為高反射構件的反射片19,其結果,由更效率佳地使自LED元件群15b所照射的光反射於燈罩18者,抑制燈罩18之發光不勻同時,貢獻於高效率化。然而,反射片19之反射率係為90%以上者為佳。 However, the heat radiating plate 14 is subjected to reflection coating by reflecting the light radiated from the LED element group 15b to the white paint on the ground side. In this embodiment, in order to further improve the reflection efficiency, the surface (ground side) of the LED light source substrate 15 is provided with a hole shape 19a that avoids the LED element group 15b and has the same number of holes as the LED element group 15b. As a reflection sheet 19 of a highly reflective member, as a result, the light radiated from the LED element group 15b is more efficiently reflected by the lampshade 18, and uneven light emission of the lampshade 18 is suppressed while contributing to higher efficiency. However, the reflectance of the reflection sheet 19 is preferably 90% or more.

如圖5所示,透鏡蓋板16係夾持LED光源基板15與反射片19而壓住於散熱板14之基板支持部14a。為了壓住,而透鏡蓋板16係加以栓合於散熱板14。經由此,LED光源基板15之一面(上面側),和基板支持部14a的密著度則提升。 As shown in FIG. 5, the lens cover 16 sandwiches the LED light source substrate 15 and the reflection sheet 19 and presses the substrate support portion 14 a of the heat sink 14. In order to hold it, the lens cover 16 is bolted to the heat sink 14. As a result, the adhesion between the one surface (upper surface side) of the LED light source substrate 15 and the substrate supporting portion 14a is improved.

透鏡蓋板16係由對應於LED元件群15b而加以複數配置之透鏡部16a,和接合複數之透鏡部16a的平坦的連接部16b加以構成。在本實施形態中,將1個LED的組成,收容於一個透鏡部16a內,但加以收容於透鏡部16a內之LED的數量係未加以限定於此。例如,加以配置於一個之透鏡部16a內的2個之LED的組成之中,一方係為白光色LED15b1,而另一方係為燈泡色LED15b2。 The lens cover 16 is composed of a plurality of lens portions 16 a arranged corresponding to the LED element group 15 b and a flat connection portion 16 b that joins the plurality of lens portions 16 a. In this embodiment, the composition of one LED is housed in one lens portion 16a, but the number of LEDs housed in the lens portion 16a is not limited to this. For example, among the two LEDs arranged in one lens portion 16a, one is a white LED 15b1, and the other is a bulb LED 15b2.

對於連接部16b之外周部係加以形成有呈略正交於上面側地加以形成的壁部16c。在本實施形態中,壁部16c之端面係呈碰觸於散熱板14之斜面形狀的外周壁14g地加以形成。經由此,無須至散熱板14之環狀部14c為止延伸壁部16c於上面側,而削減成形材料成本之 同時,可內包LED光源基板15及反射片19。 A wall portion 16c is formed on the outer peripheral portion of the connection portion 16b so as to be formed substantially orthogonal to the upper surface side. In this embodiment, the end surface of the wall portion 16c is formed so as to touch the outer peripheral wall 14g of the inclined surface shape of the heat sink plate 14. As a result, it is not necessary to extend the wall portion 16c to the upper surface side up to the annular portion 14c of the heat dissipation plate 14, and to reduce the cost of the molding material, the LED light source substrate 15 and the reflection sheet 19 can be incorporated.

透鏡蓋板16係例如,使用具有聚苯乙烯(PS)、聚碳酸酯(PC)、丙烯酸(PMMA)等之透光性及電性絕緣性的樹脂,經由射出成形等而加以一體成形。特別是在透明性,成本及成形性的點中,使用聚苯乙烯者為佳。另外,使用於透鏡蓋板16之材料係如為具備透光性及電性絕緣性的構成,並不限定於樹脂,而亦可為玻璃等。 The lens cover 16 is integrally formed by, for example, injection molding using a light-transmitting and electrically insulating resin having polystyrene (PS), polycarbonate (PC), acrylic (PMMA), or the like. Especially in terms of transparency, cost, and moldability, it is preferable to use polystyrene. The material used for the lens cover 16 is not limited to resin as long as it has a light-transmitting and electrically insulating structure, and may be glass or the like.

中心蓋板17係被覆在裝置主體的中央露出之安裝配接器(圖示省略)之構件,例如,經由具有難燃性之合成樹脂(例如,PP:聚丙烯樹脂)而加以形成。另外,中心蓋板17係加以形成為圓板狀,拆裝自由地安裝於加以形成在透鏡蓋板16之徑方向的中央部之圓型的貫通孔16b1。 The center cover plate 17 is a member covering an attachment adapter (not shown) exposed at the center of the apparatus main body, and is formed, for example, via a flame-retardant synthetic resin (for example, PP: polypropylene resin). In addition, the center cover plate 17 is formed in a circular plate shape, and is detachably attached to a circular through hole 16 b 1 formed in a center portion in the radial direction of the lens cover plate 16.

燈罩18係具有透光性(透明,半透明,或包含乳白色)之樹脂製(例如,丙烯酸,或聚苯乙烯等)之透光蓋板,而加以構成為圓頂狀。燈罩18係達成使自光源(LED元件群15b)所放射的光束擴散,減輕使用者直視LED照明裝置1時之光耀度,以及均一化設置LED照明裝置1之空間的明亮度之作用。燈罩18係經由安裝於散熱板14之承受具22,而拆裝自由地加以卡合保持。 The lampshade 18 is a light-transmitting cover plate (for example, acrylic, polystyrene, or the like) made of resin (for example, acrylic, polystyrene, or the like) having a light-transmitting property (transparent, translucent, or containing milky white), and is formed in a dome shape. The lampshade 18 functions to diffuse the light beam emitted from the light source (LED element group 15b), reduce the brilliance of the user when looking directly at the LED lighting device 1, and uniformize the brightness of the space in which the LED lighting device 1 is installed. The lampshade 18 is detachably attached and held via a holder 22 mounted on the heat sink 14.

裝飾框23係加以保持環部之內周側於由透光材所成之燈罩18的外周側,環部之外周側則呈較燈罩18之外周突出於外側地加以構成(參照圖3)。裝飾框23係由具有光透過性的材料而加以形成。 The decorative frame 23 is configured to hold the inner peripheral side of the ring portion to the outer peripheral side of the lampshade 18 made of a light-transmitting material, and the outer peripheral side of the ring portion is configured to protrude outward from the outer periphery of the lampshade 18 (see FIG. 3). The decorative frame 23 is formed of a material having light transmittance.

如圖2及圖3所示,感測器單元24係例如,提供作為呈因應設置有LED照明裝置1之環境(空間)的明亮度而使對於LED元件群15b之供給電力變化,而在LED照明裝置1下得到一定之照度的機能。另外,檢測LED照明裝置1下的照度。 As shown in FIG. 2 and FIG. 3, the sensor unit 24 provides, for example, a change in power supplied to the LED element group 15 b according to the brightness of the environment (space) in which the LED lighting device 1 is installed. A function of obtaining a certain illuminance under the lighting device 1. In addition, the illuminance under the LED lighting device 1 is detected.

接著,對於有關本發明之實施形態的透鏡蓋板16之透鏡部16a加以詳細說明。 Next, the lens portion 16a of the lens cover 16 according to the embodiment of the present invention will be described in detail.

如圖7所示,對於對向於透鏡部16a’之配線基板15a的面,係呈各個被覆LED元件群15b地,加以形成具有平順表面之圓頂形狀部16a’1。 As shown in FIG. 7, the surface of the wiring substrate 15a facing the lens portion 16a 'is formed so as to cover each of the LED element groups 15b, and a dome-shaped portion 16a'1 having a smooth surface is formed.

將自LED元件群15b所照射的光線,例如作為θa1時,由自圓頂形狀部16a’1表面入射至透鏡部16a’內者,成為經由透鏡效果而擴散,之後自平順之透鏡表面部16a’2出射至燈罩18之光線θa2。但同樣地,自LED所照射之一部分的光線θb1係由導光至連接部16b’者,成為損失之光線θb2。另外,作為導光之光線θb2係由作為自壁部16c’之端部16c’1出射等,加以照射至燈罩18時成為光不勻的原因。 When the light radiated from the LED element group 15b is, for example, θa1, the light incident from the surface of the dome-shaped portion 16a'1 into the lens portion 16a 'is diffused by the lens effect, and then passes through the smooth lens surface portion 16a. '2 The light θa2 emitted to the lampshade 18. However, similarly, a part of the light θb1 irradiated from the LED is a light ray θb2 that is guided from the light to the connection portion 16b '. In addition, the light beam θb2 as a light guide is emitted from the end portion 16c'1, which is the wall portion 16c ', and the like, and causes light unevenness when irradiated to the lamp cover 18.

如圖8所示,對於對向於透鏡部16a之配線基板15a的面,係呈各個被覆LED元件群15b地,加以形成具有平順表面之圓頂形狀部16a1。 As shown in FIG. 8, the surface of the wiring substrate 15 a facing the lens portion 16 a is formed so as to cover each of the LED element groups 15 b, and a dome-shaped portion 16 a 1 having a smooth surface is formed.

將自LED元件15b所照射的光線,例如作為θa1時,由自圓頂形狀部16a1表面入射至透鏡部16a內者,成為經由透鏡效果而擴散,之後自平順之透鏡表面部 16a2出射至燈罩18之光線θa2。 When the light radiated from the LED element 15b is, for example, θa1, the light incident from the surface of the dome-shaped portion 16a1 into the lens portion 16a is diffused by the lens effect, and then emitted from the smooth lens surface portion 16a2 to the lamp cover 18 Ray of light θa2.

在此,與圖7所示之透鏡部16a’不同,如圖8所示,在本實施形態中,於透鏡部16a之透鏡表面部16a2側外緣部,由形成凹形狀部16a3者,可將由自LED元件15b所照射的光導光至連接部16b而成為損失的光線θb1,作為光線θa2而利用。也就是,可效率佳地將來自LED元件15b的光出射至燈罩18,其結果,成為可高光束,且高效率之製品開發。 Here, unlike the lens portion 16a 'shown in FIG. 7, as shown in FIG. 8, in this embodiment, the concave portion 16a3 may be formed on the outer edge portion of the lens surface portion 16a2 side of the lens portion 16a. The light ray θb1 that is guided by the light radiated from the LED element 15b to the connection portion 16b and is lost is used as the light ray θa2. That is, the light from the LED element 15b can be efficiently emitted to the lampshade 18, and as a result, high-beam and high-efficiency product development can be achieved.

當考慮經由射出成型而形成透鏡蓋板16之時之材料的流動性時,由設置凹形狀部16a3於透鏡部16a外緣部者,自連接部16b流動材料至透鏡部16a時,厚度則變窄。經由此,在形成透鏡部16a時有產生縮痕等之成形不良之虞,但在本實施形態中,於對向於圓頂形狀部16a1之配線基板15a側的外緣部,由設置呈圍繞LED元件15b地加以形成之凸形狀部16a4者,採取經由薄化之成形不良防止對策。經由呈圍繞LED元件15b地加以設置之凸形狀部16a4,均一地固定複數之LED元件15b,而不易受到經由安裝透鏡蓋板16及LED元件15b之LED光源基板15的變形之影響。 When considering the fluidity of the material when the lens cover 16 is formed by injection molding, when the concave portion 16a3 is provided on the outer edge portion of the lens portion 16a and the material flows from the connection portion 16b to the lens portion 16a, the thickness changes. narrow. As a result, there is a possibility of forming defects such as sink marks when forming the lens portion 16a. However, in this embodiment, the outer edge portion of the wiring substrate 15a side facing the dome-shaped portion 16a1 is surrounded by the installation. For the convex-shaped portion 16a4 formed on the LED element 15b, countermeasures are taken to prevent formation defects through thinning. The plurality of LED elements 15b are uniformly fixed through the convex-shaped portions 16a4 provided around the LED elements 15b, and are not easily affected by the deformation of the LED light source substrate 15 through which the lens cover 16 and the LED elements 15b are mounted.

對於與連接部16b對向,配線基板15a(及反射片19)之間,係設置有微小的間隙d(參照圖8)。此係為了避開加以安裝於配線基板15a之構件(例如,為了跨越配線圖案所安裝之跨接元件等)。凸狀部16a4係亦具有將透鏡蓋板16組裝於基板支持部14a時,以LED元件15b 之外周部壓住配線基板15a,及反射片19之機能,而使配線基板15a與基板支持部14a之密著性提升之外,由將加以設置於LED元件15b附近的反射片19之穴形狀19a外緣部,由凸狀部16a4加以壓制者,可經由反射片19之彎曲等,抑制在遮蔽自LED元件15b所照射的光而產生之燈罩18的光不勻或影子,及光束值之降低者。 A minute gap d is provided between the wiring substrate 15a (and the reflection sheet 19) facing the connection portion 16b (see FIG. 8). This is to avoid a component mounted on the wiring substrate 15a (for example, a jumper element mounted on a wiring pattern, etc.). The convex portion 16a4 also has the function of pressing the wiring substrate 15a and the reflection sheet 19 with the outer periphery of the LED element 15b when the lens cover 16 is assembled on the substrate supporting portion 14a, so that the wiring substrate 15a and the substrate supporting portion 14a In addition to improving the adhesion, the outer edge portion of the cavity shape 19a of the reflection sheet 19 provided near the LED element 15b and the convex portion 16a4 can be used to suppress the reflection by the bending of the reflection sheet 19 and the like. The light unevenness or shadow of the lampshade 18 generated by the light radiated from the LED element 15b, and the decrease in the light beam value.

Claims (2)

一種照明裝置,其特徵為具有:安裝LED光源之基板,和具有被覆前述LED光源之透鏡部與連接該透鏡部之連接部的透鏡蓋板,和被覆前述LED光源與前述透鏡蓋板,而具有曲面的擴散蓋板;前述連接部係具有平坦部和凹狀部;前述凹狀部係位置於前述透鏡的端部者。     An illuminating device includes a substrate on which an LED light source is mounted, a lens cover having a lens portion covering the LED light source and a connecting portion connecting the lens portion, and a lens cover covering the LED light source and the lens cover. A curved diffusion cover; the connecting portion has a flat portion and a concave portion; the concave portion is located at an end of the lens.     如申請專利範圍第1項記載之照明裝置,其中,對於對向於在前述透鏡之前述基板側的外緣部,係具有呈圍繞前述LED光源地加以設置之凸狀部者。     The illuminating device described in item 1 of the scope of patent application, wherein the outer edge portion facing the substrate side of the lens has a convex portion provided around the LED light source.    
TW106113132A 2016-08-30 2017-04-19 Lighting device TWI640719B (en)

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