CN107781735A - Lighting device - Google Patents
Lighting device Download PDFInfo
- Publication number
- CN107781735A CN107781735A CN201710155934.6A CN201710155934A CN107781735A CN 107781735 A CN107781735 A CN 107781735A CN 201710155934 A CN201710155934 A CN 201710155934A CN 107781735 A CN107781735 A CN 107781735A
- Authority
- CN
- China
- Prior art keywords
- lens
- led
- light source
- light
- lighting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 230000002093 peripheral effect Effects 0.000 description 14
- 230000017525 heat dissipation Effects 0.000 description 11
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001335 Galvanized steel Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000008397 galvanized steel Substances 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
本发明提供一种抑制光从透镜罩向漫射罩的出射量的减少的、高效率的照明装置。该照明装置包括:安装LED光源的基板;具有覆盖上述LED光源的透镜部和连接该透镜部的连接部的透镜罩;和覆盖上述LED光源和上述透镜罩的具有曲面的漫射罩,上述连接部具有平坦部和凹形部,上述凹形部位于上述透镜的端部。
The present invention provides a high-efficiency lighting device that suppresses a decrease in the amount of light emitted from a lens cover to a diffuser cover. The lighting device includes: a substrate on which an LED light source is mounted; a lens cover having a lens portion covering the LED light source and a connection portion connecting the lens portion; and a diffuser cover with a curved surface covering the LED light source and the lens cover, the connection The portion has a flat portion and a concave portion located at an end portion of the lens.
Description
技术领域technical field
本发明涉及照明装置。The present invention relates to lighting devices.
背景技术Background technique
近年来,使用LED(Light Emitting Diode,发光二极管)作为照明装置的光源的情况正在变多。作为安装在天花板的类型的室内照明装置用的光源,也开始使用LED代替荧光管。进而,LED照明装置有时使来自LED的出射光具有指向性。在专利文献1至专利文献4中,公开了使来自LED的出射光具有指向性的光学系统。In recent years, LEDs (Light Emitting Diodes, light emitting diodes) are increasingly used as light sources of lighting devices. LEDs have also begun to be used instead of fluorescent tubes as light sources for indoor lighting devices of the ceiling-mounted type. Furthermore, LED lighting devices may provide directivity to emitted light from LEDs. In Patent Document 1 to Patent Document 4, optical systems for directing light emitted from LEDs are disclosed.
现有技术文献prior art literature
专利文献patent documents
专利文献1:日本特开2014-154461号公报Patent Document 1: Japanese Patent Laid-Open No. 2014-154461
专利文献2:日本特开2014-135233号公报Patent Document 2: Japanese Patent Laid-Open No. 2014-135233
专利文献3:日本特开2011-204397号公报Patent Document 3: Japanese Patent Laid-Open No. 2011-204397
专利文献4:日本特开2013-145685号公报Patent Document 4: Japanese Patent Laid-Open No. 2013-145685
发明内容Contents of the invention
发明要解决的技术课题The technical problem to be solved by the invention
存在一种照明装置,其使用具有与光源基板上所配置的多个LED对应的透镜形状的透镜罩,作为使从LED出射的光扩散、效率良好地照亮漫射罩整体的单元。但是,透镜罩需要将与多个LED对应的透镜形状相互连接的连接部,并且为了确保成形材料的流动性能,连接部需要一定程度的厚度。因此,从LED出射的光的一部分不会从透镜向漫射罩出射,而是导向连接部,光从透镜罩向漫射罩的出射量减少。There is an illumination device that uses a lens cover having a lens shape corresponding to a plurality of LEDs arranged on a light source board as means for diffusing light emitted from the LEDs to efficiently illuminate the entire diffusion cover. However, the lens cover requires a connecting portion that connects lens shapes corresponding to a plurality of LEDs, and the connecting portion needs to have a certain thickness in order to ensure flowability of the molding material. Therefore, part of the light emitted from the LED is not emitted from the lens to the diffuser cover but guided to the connection portion, and the amount of light emitted from the lens cover to the diffuser cover is reduced.
本发明的目的在于提供一种抑制光从透镜罩向漫射罩的出射量的减少的照明装置。An object of the present invention is to provide a lighting device that suppresses a decrease in the amount of light emitted from a lens cover to a diffuser cover.
为了解决上述课题,本发明特征在于,包括:安装LED光源的基板;具有覆盖上述LED光源的透镜部和连接该透镜部的连接部的透镜罩;和覆盖上述LED光源和上述透镜罩的具有曲面的漫射罩,上述连接部包括平坦部和凹形部;上述凹形部位于上述透镜的端部。In order to solve the above-mentioned problems, the present invention is characterized in that it includes: a substrate on which an LED light source is mounted; a lens cover having a lens portion covering the LED light source and a connection portion connecting the lens portion; and a curved surface covering the LED light source and the lens cover. The diffuser cover, the connecting part includes a flat part and a concave part; the concave part is located at the end of the lens.
根据本发明,能够提供一种抑制光从透镜罩向漫射罩的出射量的减少的、高效率的照明装置。According to the present invention, it is possible to provide a high-efficiency lighting device that suppresses a decrease in the amount of light emitted from the lens cover to the diffusion cover.
附图说明Description of drawings
图1是表示本发明的实施方式的LED照明装置的图,是表示从斜下方向观察时的外观立体图。FIG. 1 is a diagram showing an LED lighting device according to an embodiment of the present invention, and is a perspective view showing an appearance when viewed obliquely from below.
图2是表示从斜上方向观察LED照明装置时的状态的外观立体图。Fig. 2 is an external perspective view showing a state in which the LED lighting device is viewed obliquely from above.
图3是表示从斜下方向观察LED照明装置时的状态的分解立体图。Fig. 3 is an exploded perspective view showing a state in which the LED lighting device is viewed obliquely from below.
图4是卸下灯罩来以截面表示LED罩的一部分的LED照明装置的立体图。Fig. 4 is a perspective view of the LED lighting device in which a shade is removed and a part of the LED cover is shown in section.
图5是卸下灯罩后的LED照明装置的中央纵截面图的一部分。Fig. 5 is a part of the central longitudinal sectional view of the LED lighting device with the lampshade removed.
图6是表示LED光源基板的一例的图。Fig. 6 is a diagram showing an example of an LED light source board.
图7是图5的A部放大图。Fig. 7 is an enlarged view of part A of Fig. 5 .
图8是图5的A部放大图,是表示本实施方式的图。FIG. 8 is an enlarged view of part A of FIG. 5 , showing the present embodiment.
符号说明Symbol Description
1……LED照明装置1...LED lighting device
11……支承骨干11...Support backbone
11a……适配器安装孔11a...Adapter mounting holes
12……适配器支承件(绝缘板)12...Adapter support (insulation plate)
12a……固定部12a...fixed part
12b……圆筒部12b...Cylindrical part
13……电源基板13...power board
13a……电源连接器13a...power connector
13b……光源连接器13b...Light source connector
14……散热板14...Heating plate
14a……基板支承部14a... Substrate supporting part
14b……贯通孔14b...Through hole
14c……环状部14c...Annulus
14d……竖壁部14d...Vertical wall
14e……电线贯通孔14e...Electric wire through hole
14f……收纳凹部14f...Accommodating concave part
14g……外周壁14g...Peripheral wall
15……LED光源基板15...LED light source substrate
15a……配线基板15a... Wiring board
15b……LED元件组(LED元件)15b...LED element group (LED element)
15b1……日光色LED15b1...daylight color LED
15b2……白炽灯色LED15b2...Incandescent color LED
15b3……蓝色LED15b3...Blue LED
15b4……保安灯LED15b4...Security light LED
15c……突出片15c... protruding piece
15d……连接器部15d...Connector part
15e……遥控器受光部15e……The light-receiving part of the remote control
16……透镜罩16...Lens cover
16a……透镜部16a...Lens part
16a1……圆顶形状部16a1...Dome shape part
16a2……透镜表面部16a2...Lens surface part
16a3……凹形部16a3... Concave part
16a4……凸形部16a4...Convex part
16b……连接部16b...connecting part
16b1……贯通孔16b1...Through hole
16c……壁部16c...Wall
16c1……端部16c1...end
17……中央罩17...Central cover
18……灯罩18...Shade
19……反射片19...reflector
19a……孔形状19a... Hole shape
20……电源线束20...Power harness
21……光源线束21...Light source wiring harness
22……支承件22...support
23……装饰框23...decorative frame
24……传感器单元24...sensor unit
具体实施方式Detailed ways
对于本发明的实施方式的LED照明装置(LED吸顶灯),适当参照附图进行详细说明。其中,本实施方式中,作为LED照明装置1的一例,举出俯视为圆形的照明装置为例进行说明,但形状不限定于此,例如也能够应用于四边形、六边形、八边形等多边形的照明装置。另外,本实施方式中,以下按使用了发光二极管(LED)作为主光源的LED照明装置1进行说明,但主光源不限定于LED。The LED lighting device (LED ceiling lamp) according to the embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In this embodiment, as an example of the LED lighting device 1 , a circular lighting device in plan view is taken as an example for description, but the shape is not limited thereto, and it can also be applied to a quadrangle, a hexagon, or an octagon, for example. Isometric lighting fixtures. In addition, in this embodiment, although the LED lighting device 1 using a light emitting diode (LED) as a main light source is demonstrated below, a main light source is not limited to LED.
图1和图2所示的LED照明装置1,例如经由与房屋的天花板面上设置的吊挂灯线盒或天花板接线盒等室内配线器具(省略图示)卡合的安装适配器(省略图示),与外部电源连接并且固定在天花板面的规定位置以供使用。LED照明装置1例如是圆型或方型等(本实施方式中是圆型)。另外,以下说明中,以LED照明装置1安装在天花板面上的状态为基准,纸面上侧是天花板侧(顶面侧),纸面下侧是地板侧(下面侧)。The LED lighting device 1 shown in FIG. 1 and FIG. 2 is, for example, connected to an indoor wiring device (not shown) such as a pendant light box or a ceiling junction box installed on the ceiling surface of a house (not shown). shown), connected to an external power source and fixed at a specified position on the ceiling for use. The LED lighting device 1 is, for example, circular or square (circular in this embodiment). In addition, in the following description, the upper side on the paper is the ceiling side (top side) and the lower side on the paper is the floor side (lower side) based on the state where the LED lighting device 1 is mounted on the ceiling.
如图3所示,LED照明装置1具有支承骨干11、适配器支承部12(绝缘板)、电源基板13、散热板14、LED光源基板15、透镜罩16、中央罩17、灯罩(shade)18、装饰框23、传感器单元24等构成。As shown in FIG. 3 , the LED lighting device 1 has a support backbone 11, an adapter support portion 12 (insulating plate), a power supply substrate 13, a heat dissipation plate 14, an LED light source substrate 15, a lens cover 16, a central cover 17, and a shade 18. , a decorative frame 23, a sensor unit 24 and the like.
支承骨干11是将钢板(例如SECC(电镀锌钢板))加工成形为大致圆形的基底部件,以凹面朝向地板侧的方式形成为大致凹形(盘形)。另外,在支承骨干11的中央,形成了用于卡止安装适配器(省略图示)的适配器安装孔11a。The support frame 11 is a substantially circular base member processed and formed from a steel plate (for example, SECC (electro-galvanized steel sheet)), and is formed in a substantially concave shape (disk shape) so that the concave surface faces the floor side. In addition, an adapter mounting hole 11 a for locking and mounting an adapter (not shown) is formed at the center of the support frame 11 .
适配器支承部12(绝缘板)用具有难燃性和电绝缘性的合成树脂(例如PP:聚丙烯树脂等)形成,具有在支承骨干11的下表面螺栓固定的环形的固定部12a、和从该固定部12a的内周缘部向地板侧(下方)延伸出的圆筒部12b。The adapter supporting part 12 (insulating plate) is formed with a synthetic resin (such as PP: polypropylene resin etc.) The inner peripheral portion of the fixed portion 12a is a cylindrical portion 12b extending toward the floor side (downward).
如图3所示,电源基板13具有包括控制部的点亮电路等,通过适配器支承部12(绝缘板)被螺栓固定在支承骨干11上。由此,电源基板13以维持电绝缘性的状态配置在由支承骨干11和后述的散热板14包围的散热空间内。As shown in FIG. 3 , the power supply board 13 has a lighting circuit including a control unit, and is fixed to the supporting body 11 with bolts via the adapter supporting portion 12 (insulating plate). As a result, the power supply board 13 is arranged in a heat dissipation space surrounded by the support backbone 11 and the heat dissipation plate 14 described later, while maintaining electrical insulation.
另外,电源基板13经由电源线束20与安装适配器(省略图示)电连接,上述电源线束20与固定在该电源基板13的下表面的电源连接器13a连接。The power board 13 is electrically connected to a mounting adapter (not shown) via a power harness 20 connected to a power connector 13 a fixed to the lower surface of the power board 13 .
光源连接器13b用于将电源基板13与LED光源基板15通过光源线束21连接。The light source connector 13 b is used to connect the power supply board 13 and the LED light source board 15 through the light source wire harness 21 .
由此,LED照明装置1构成为分别经由室内配线器具(省略图示)、安装适配器(省略图示)、电源线束20、光源线束21、电源基板13供电。Thus, the LED lighting device 1 is configured to supply power via an indoor wiring device (not shown), an installation adapter (not shown), the power harness 20 , the light source harness 21 , and the power board 13 .
散热板14是起到使工作时发热的电源基板13和安装了多个LED的LED光源基板15的热散热而冷却的作用的金属制部件。后述的LED元件组15b的LED具有耐热程度弱的性质。另外,LED在使用时流过低电压的大电流而进行高亮度发光,所以随着该发光产生的发热使LED自身和周围的部件劣化,所以为了抑制该劣化而实现长寿命、高可靠性,要求进行适当的散热。The heat dissipation plate 14 is a metal member that functions to dissipate heat from the power supply substrate 13 that generates heat during operation and the LED light source substrate 15 on which a plurality of LEDs are mounted, and cool them down. The LEDs of the LED element group 15b described later have a property of being weak in heat resistance. In addition, LEDs emit light with high luminance by flowing a large current at a low voltage during use, so the heat generated by the light emission degrades the LED itself and surrounding components. Therefore, in order to suppress this deterioration and achieve long life and high reliability, Proper cooling is required.
散热板14是将钢板加工形成为大致圆形,并形成了向地板侧突出的圆锥台形的基板支承部14a。另外,散热板14例如用镀锌钢板等导热性良好的金属构成,通过施加拉深加工,而无接缝地一体成形,实现强度提高。另外,散热板14形成为比支承骨干11直径大,以比支承骨干11向径向外侧突出的方式安装在支承骨干11上。对于散热板14,在该散热板14的下面侧以主光源的多个LED元件(LED元件组15b)向下照射光的方式配置有LED光源基板15。补充说明,LED光源基板15在散热板14的下面侧以沿着(紧贴)该下表面的方式配置。The radiator plate 14 is formed by processing a steel plate into a substantially circular shape, and has a truncated cone-shaped substrate support portion 14 a protruding toward the floor side. In addition, the radiator plate 14 is made of, for example, a metal having good thermal conductivity such as a galvanized steel sheet, and is formed integrally without a joint by applying a drawing process to improve strength. In addition, the radiator plate 14 is formed to have a larger diameter than the supporting body 11 , and is attached to the supporting body 11 so as to protrude radially outward from the supporting body 11 . The LED light source board 15 is arranged on the lower surface of the heat sink 14 so that a plurality of LED elements (LED element groups 15 b ) of the main light source irradiate light downward. In addition, the LED light source board 15 is arranged on the lower surface side of the heat dissipation plate 14 along (adhering to) the lower surface.
另外,在散热板14的径向的中心,在与适配器支承部12的圆筒部12b对应的位置形成有圆形的贯通孔14b。另外,在散热板14的外周部,具有水平地形成的圆形的环状部14c和在环状部14c的外周部形成的竖壁部14d。在环状部14c的下表面,以120°间隔在3处安装了用于卡止后述的灯罩18的支承件22(参考图3)。In addition, a circular through-hole 14 b is formed at a position corresponding to the cylindrical portion 12 b of the adapter support portion 12 at the center in the radial direction of the heat sink plate 14 . Moreover, the outer peripheral part of the heat dissipation plate 14 has the circular annular part 14c formed horizontally, and the vertical wall part 14d formed in the outer peripheral part of the annular part 14c. On the lower surface of the annular portion 14c, three supports 22 for locking a lamp shade 18 described later are attached at 120° intervals (refer to FIG. 3 ).
如图4所示,电线插通孔14e由在收纳凹部14f的外周壁14g上穿孔的贯通孔构成,上述收纳凹部14f形成为以向散热板14的上侧方向扩张开的方式倾斜的凹陷形状。在电线插通孔14e中,配置有多个光源线束21。As shown in FIG. 4 , the wire insertion hole 14e is formed by a through hole pierced in an outer peripheral wall 14g of a housing recess 14f formed in a concave shape inclined so as to expand upward of the radiator plate 14. . A plurality of light source harnesses 21 are arranged in the wire insertion hole 14e.
收纳凹部14f是内部设置连接有电源线束20、光源线束21的电源基板13的收纳空间(参考图5)。The storage recess 14f is a storage space in which the power supply substrate 13 to which the power supply harness 20 and the light source harness 21 are connected is provided (see FIG. 5 ).
LED光源基板15包括:在支承骨干11的下面侧隔着散热板14配置的环形的配线基板15a;和在该配线基板15a的一面侧(地板面一侧)通过焊接等安装了同心圆状地配置的多个LED的主光源的LED元件组15b(参考图3)。其中,LED元件组15b的详情在后文中叙述。The LED light source substrate 15 includes: a ring-shaped wiring substrate 15a arranged through the heat dissipation plate 14 on the lower side of the supporting backbone 11; The LED element group 15b (refer to FIG. 3 ) of the main light source of a plurality of LEDs arranged in a shape. However, the details of the LED element group 15b will be described later.
配线基板15a例如通过在铝合金制的大致环状的金属板形成绝缘层和铜箔图案等而构成,或者通过在导热性良好的树脂(例如聚酰亚胺树脂等)的平板上形成铜箔图案、阻焊剂等而构成。The wiring board 15a is constituted, for example, by forming an insulating layer and a copper foil pattern on a substantially ring-shaped metal plate made of aluminum alloy, or by forming a copper plate on a flat plate of a resin having good thermal conductivity (for example, polyimide resin, etc.). foil pattern, solder resist, etc.
本实施方式中,通过具有如上所述的结构的支承骨干11和散热板14,而增大散热空间的容积(增加散热空间的空气的量),实现电源基板13和LED光源基板15的散热效率的提高。其结果是,能够提高LED元件组15b的发光效率。In this embodiment, by having the supporting backbone 11 and the heat dissipation plate 14 of the above-mentioned structure, the volume of the heat dissipation space is increased (the amount of air in the heat dissipation space is increased), and the heat dissipation efficiency of the power supply substrate 13 and the LED light source substrate 15 is realized. improvement. As a result, the luminous efficiency of the LED element group 15b can be improved.
图6所示的LED光源基板15表示出了14块席(14块榻榻密的席)用的LED的排列模式的一例。LED元件组15b包括:发出日光色(D色)的光的多个日光色LED(Light EmittingDiode)15b1;发出白炽灯色(L色)的光的多个白炽灯色LED15b2;发出蓝色光的多个蓝色LED15b3;和保安灯LED15b4来构成主光源。另外,在LED光源基板15的外周端具有:向外侧突出地形成的大致圆弧形状的突出片15c;载设在突出片15c的与光源线束21连接的2个连接器部15d;和遥控器受光部15e。The LED light source board 15 shown in FIG. 6 shows an example of an arrangement pattern of LEDs for 14 mats (14 tatami mats). The LED element group 15b includes: a plurality of daylight color LEDs (Light Emitting Diode) 15b1 emitting light of daylight color (D color); a plurality of incandescent color LEDs 15b2 emitting light of incandescent light color (L color); and a plurality of light emitting diodes emitting blue light. A blue LED15b3; and a security light LED15b4 to form the main light source. In addition, at the outer peripheral end of the LED light source board 15, there are: a protruding piece 15c formed to protrude outward in a substantially arc shape; two connector parts 15d mounted on the protruding piece 15c and connected to the light source harness 21; and a remote controller. Light receiving unit 15e.
日光色LED15b1的峰值波长是430nm~460nm,从外周侧至内周侧同心圆状地配置有多列(例如8列)。The peak wavelength of daylight color LED15b1 is 430nm-460nm, and it arrange|positions concentrically in multiple rows (for example, 8 rows) from the outer peripheral side to the inner peripheral side.
白炽灯色LED15b2的峰值波长是550nm~650nm,在同心圆状配置了多列的各列中夹着日光色LED15b1地配置。即,白炽灯色LED15b2在同心圆状的各列中,在周向上中间夹着2个日光色LED15b1地配置。其中,包括本实施方式,日光色LED15b1和白炽灯色LED15b2的配置数量关系也可以不具有规则性。另外,日光色LED15b1和白炽灯色LED15b2在同心圆状的各列中,在周向上等间隔或大致等间隔地配置。The peak wavelength of the incandescent color LED15b2 is 550nm-650nm, and it arrange|positions so that daylight color LED15b1 may be sandwiched in each row which arrange|positioned concentrically in several rows. That is, the incandescent color LED15b2 is arrange|positioned on both sides of two daylight color LED15b1 in the circumferential direction in each concentric circle shape LED15b2. However, including this embodiment, the arrangement number relationship of daylight color LED15b1 and incandescent light color LED15b2 does not need to have regularity. Moreover, daylight color LED15b1 and incandescent light color LED15b2 are arrange|positioned at equal intervals or substantially equal intervals in the circumferential direction in each concentric row.
蓝色LED15b3的峰值波长是470nm~480nm,在同心圆状地配置有多列的日光色LED15b1和白炽灯色LED15b2的最外周与最内周之间,在周向上隔开间隔地配置为圆环状。在图6的实施方式中,蓝色LED15b3所配置的列,是从圆环状的中心起同心圆状地配置在第二列和第四列。The blue LED 15b3 has a peak wavelength of 470nm to 480nm, and is arranged in a ring at intervals in the circumferential direction between the outermost circumference and the innermost circumference of the daylight color LED 15b1 and the incandescent color LED 15b2 arranged concentrically. shape. In the embodiment shown in FIG. 6 , the rows in which the blue LEDs 15b3 are arranged are concentrically arranged in the second row and the fourth row from the ring-shaped center.
图6所示的LED元件组15b,例如由168个日光色LED15b1、76个白炽灯色LED15b2和32个蓝色LED15b3构成。蓝色LED15b3的数量优选为日光色LED15b1和白炽灯色LED15b2的合计数量的10%程度。The LED element group 15b shown in FIG. 6 is composed of, for example, 168 daylight color LEDs 15b1, 76 incandescent color LEDs 15b2, and 32 blue LEDs 15b3. It is preferable that the number of blue LED15b3 is about 10% of the total number of daylight color LED15b1 and incandescent color LED15b2.
另外,在散热板14上,用使从LED元件组15b照射的光向地板侧反射的白色涂料进行反射涂装。本实施方式中,为了进一步提高反射效率,在LED光源基板15的表面(地板侧),以避开LED元件组15b的方式具有作为高反射部件的反射片19,该反射片19具有与LED元件组15b同等数量的空孔形状19a,结果使从LED元件组15b照射的光更高效地向灯罩18反射,由此抑制灯罩18的发光不均,并且有助于提高效率。另外,优选反射片19的反射率在90%以上。In addition, reflective coating is performed on the radiator plate 14 with white paint that reflects light irradiated from the LED element group 15b toward the floor side. In this embodiment, in order to further improve the reflection efficiency, on the surface (floor side) of the LED light source substrate 15, there is a reflection sheet 19 as a high reflection member in a manner to avoid the LED element group 15b. The same number of hole shapes 19a in the group 15b results in more efficient reflection of light irradiated from the LED element group 15b toward the globe 18, thereby suppressing uneven light emission of the globe 18 and contributing to improvement in efficiency. In addition, it is preferable that the reflectance of the reflection sheet 19 is 90% or more.
如图5所示,透镜罩16隔着LED光源基板15和反射片19压紧在散热板14的基板支承部14a。为了压紧,透镜罩16被螺栓固定在散热板14上。由此,LED光源基板15的一面(上面侧)与基板支承部14a的密合度(紧贴度)提高。As shown in FIG. 5 , the lens cover 16 is pressed against the substrate supporting portion 14 a of the heat sink 14 via the LED light source substrate 15 and the reflection sheet 19 . For compression, the lens cover 16 is bolted to the cooling plate 14 . Thereby, the degree of adhesion (degree of adhesion) between one surface (upper surface side) of the LED light source board 15 and the board support portion 14a is improved.
透镜罩16由与LED元件组15b对应地配置多个的透镜部16a、和将多个透镜部16a相互连接的平坦的连接部16b构成。本实施方式中,将1个LED的组收容在一个透镜部16a内,但透镜部16a内收容的LED的数量不限定于此。例如,一个透镜部16a内配置的2个LED的组中,一方是日光色LED15b1,另一方是白炽灯色LED15b2。The lens cover 16 is comprised by the several lens part 16a arrange|positioned corresponding to the LED element group 15b, and the flat connection part 16b which mutually connected the some lens part 16a. In this embodiment, one LED group is accommodated in one lens portion 16a, but the number of LEDs accommodated in the lens portion 16a is not limited thereto. For example, in the group of two LEDs arrange|positioned in the one lens part 16a, one is daylight color LED15b1, and the other is incandescent color LED15b2.
在连接部16b的外周部,形成有以向上面侧(顶面侧)大致正交的方式形成的壁部16c。本实施方式中,壁部16c的端面以与散热板14的斜面形状的外周壁14g抵接的方式形成。由此,不需要在上面侧使壁部16c延伸至散热板14的环状部14c,能够削减成形材料成本,并且内部能够容纳LED光源基板15和反射片19。On the outer peripheral portion of the connecting portion 16b, a wall portion 16c is formed so as to be substantially perpendicular to the upper surface side (top surface side). In this embodiment, the end surface of the wall part 16c is formed so that it may contact the slope-shaped outer peripheral wall 14g of the heat sink 14. As shown in FIG. Thereby, it is not necessary to extend the wall portion 16c to the annular portion 14c of the heat sink 14 on the upper side, and the molding material cost can be reduced, and the LED light source board 15 and the reflection sheet 19 can be housed inside.
透镜罩16例如用聚苯乙烯(PS)、聚碳酸酯(PC)、聚甲基丙烯酸甲酯(PMMA)等具有透光性和电绝缘性的树脂,通过注塑成形等而一体成形。特别是,在透明性、成本和成形性的方面优选使用聚苯乙烯。另外,透镜罩16中使用的材料,只要具备透光性和电绝缘性,就不限定于树脂,也可以是玻璃等。The lens cover 16 is integrally molded, for example, by injection molding or the like, using a resin having translucency and electrical insulation properties such as polystyrene (PS), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. In particular, polystyrene is preferably used in terms of transparency, cost, and formability. In addition, the material used for the lens cover 16 is not limited to resin as long as it has translucency and electric insulation, and glass etc. may be sufficient as it.
中央罩17是覆盖在装置主体的中央露出的安装适配器(省略图示)的部件,例如用具有难燃性的合成树脂(例如PP:聚丙烯树脂)形成。另外,中央罩17形成为圆板状,能够自由装卸地安装在形成于透镜罩16的径向的中央部的圆形的贯通孔16b1。The center cover 17 covers an attachment adapter (not shown) exposed at the center of the device main body, and is formed of, for example, a flame-retardant synthetic resin (eg, PP: polypropylene resin). In addition, the central cover 17 is formed in a disc shape, and is detachably attached to a circular through-hole 16 b 1 formed in the center portion in the radial direction of the lens cover 16 .
灯罩18是具有透光性(包括透明、半透明、或乳白色)的树脂制(例如聚甲基丙烯酸甲酯或聚苯乙烯等)的透光罩,构成为圆顶状。灯罩18使从光源(LED元件组15b)射出的光束扩散,起到减轻用户直视LED照明装置1时的眩目(刺眼)感、使设置了LED照明装置1的空间的亮度均匀化的作用。灯罩18由安装在散热板14的支承件22能够自由装卸地卡合保持。The shade 18 is a translucent cover made of a translucent (including transparent, translucent, or milky white) resin (for example, polymethylmethacrylate, polystyrene, etc.), and is configured in a dome shape. The lampshade 18 diffuses the light beam emitted from the light source (LED element group 15b), reduces the glare (glare) feeling when the user looks directly at the LED lighting device 1, and makes the brightness of the space where the LED lighting device 1 is installed uniform. . The globe 18 is detachably engaged and held by a support 22 attached to the radiator plate 14 .
装饰框23以环状部的内周侧被保持在由透光材料构成的灯罩18的外周侧、并且环状部的外周侧比灯罩18的外周更向外侧突出的方式构成(参考图3)。装饰框23用具有透光性的材料形成。The decorative frame 23 is configured such that the inner peripheral side of the annular portion is held on the outer peripheral side of the lampshade 18 made of a light-transmitting material, and the outer peripheral side of the annular portion protrudes outward from the outer periphery of the lampshade 18 (see FIG. 3 ). . The decorative frame 23 is formed of a translucent material.
如图2和图3所示,传感器单元24例如提供与设置有LED照明装置1的环境(空间)的亮度相应地改变对LED元件组15b的供给电力,使得在LED照明装置1下得到一定的照度的功能。并且,检测LED照明装置1下的照度。As shown in FIGS. 2 and 3 , the sensor unit 24, for example, changes the power supply to the LED element group 15b corresponding to the brightness of the environment (space) in which the LED lighting device 1 is installed, so that a certain amount of light is obtained under the LED lighting device 1. function of illuminance. And, the illuminance under the LED lighting device 1 is detected.
接着,详细说明本发明的实施方式的透镜罩16的透镜部16a。Next, the lens portion 16a of the lens cover 16 according to the embodiment of the present invention will be described in detail.
如图7所示,在透镜部16a'的与配线基板15a相对的面,以分别地覆盖LED元件组15b的方式,形成了具有平滑表面的圆顶形状部16a'1。As shown in FIG. 7 , a dome-shaped portion 16 a ′ 1 having a smooth surface is formed on a surface of the lens portion 16 a ′ facing the wiring board 15 a so as to cover the LED element groups 15 b respectively.
对于从LED元件15b照射的光线,例如设其为θa1,通过从圆顶形状部16a'1表面入射到透镜16a'内,而利用透镜效果使其扩散,之后成为从平滑的透镜表面部16a'2对灯罩18出射的光线θa2。但是,同样地从LED照射的一部分光线θb1,因为向连接部16b'导光,而成为损失的光线θb2。另外,导光的光线θb2从壁部16c'的端部16c'1出射等,对灯罩18照射时成为光的不均的原因。Let the light irradiated from the LED element 15b be, for example, θa1, enter the lens 16a' from the surface of the dome-shaped part 16a'1, diffuse it by the lens effect, and then become 2 pairs of light θa2 emitted by the lampshade 18. However, similarly, part of the light θb1 irradiated from the LED is guided to the connecting portion 16b', and becomes lost light θb2. In addition, the light ray θb2 of the light guide is emitted from the end portion 16c′ 1 of the wall portion 16c ′, etc., and becomes a cause of light unevenness when irradiating the globe 18 .
如图8所示,在透镜部16a的与配线基板15a相对的面,以分别地覆盖LED元件组15b的方式,形成了具有平滑表面的圆顶形状部16a1。As shown in FIG. 8 , dome-shaped portions 16 a 1 having a smooth surface are formed on the surface of the lens portion 16 a facing the wiring board 15 a so as to cover the LED element groups 15 b respectively.
对于从LED元件15b所照射的光线,例如设其为θa1,通过从圆顶形状部16a1表面入射到透镜部16a内,而利用透镜效果使其扩散,之后成为从平滑的透镜表面部16a2对灯罩18出射的光线θa2。Let the light irradiated from the LED element 15b be, for example, θa1, enter into the lens portion 16a from the surface of the dome-shaped portion 16a1, diffuse it by the lens effect, and then become a light beam from the smooth lens surface portion 16a2 to the lampshade. 18 the outgoing light θa2.
此处,与图7所示的透镜部16a'不同,如图8所示,本实施方式中,在透镜部16a的透镜表面部16a2侧外缘部形成凹形部16a3,由此能够将因为从LED元件15b所照射的光向连接部16b导光而成为损失的光线θb1作为光线θa2利用。即,能够使来自LED元件15b的光效率良好地对灯罩18出射,结果能够开发出大光束、高效率的产品。Here, unlike the lens portion 16a' shown in FIG. 7, as shown in FIG. The light irradiated from the LED element 15b is guided to the connection portion 16b and the lost light θb1 is used as the light θa2. That is, the light from the LED element 15b can be emitted to the globe 18 efficiently, and as a result, a large light beam and a high-efficiency product can be developed.
考虑用注塑成型形成透镜罩16时的材料的流动性时,在透镜部16a外缘部设置了凹形部16a3,由此材料从连接部16b流动到透镜部16a时厚度变小。由此,形成透镜部16a时可能产生凹陷等成形不良,但本实施方式中,在圆顶形状部16a1的与配线基板15a相对一侧的外缘部,设置了以包围LED元件15b的方式形成的凸形部16a4,由此采取了防止变薄引起的成形不良的对策。通过以包围LED元件15b的方式设置的凸形部16a4均匀地固定多个LED元件15b,使其难以受到透镜罩16和安装LED元件15b的LED光源基板15的变形的影响。Considering the fluidity of the material when the lens cover 16 is formed by injection molding, the concave portion 16a3 is provided on the outer edge of the lens portion 16a, so that the thickness of the material becomes small when flowing from the connection portion 16b to the lens portion 16a. As a result, molding defects such as dents may occur when forming the lens portion 16a. By forming the convex portion 16a4, a countermeasure against molding failure due to thinning is taken. The plurality of LED elements 15b are uniformly fixed by the convex portion 16a4 provided so as to surround the LED elements 15b, making it less susceptible to deformation of the lens cover 16 and the LED light source board 15 on which the LED elements 15b are mounted.
与连接部16b相对的配线基板15a(以及反射片19)之间设置有微小的间隙d(参考图8)。这是为了避开安装在配线基板15a上的部件(例如为了越过配线图案而安装的跨接元件等)。凸形部16a4也具有在将透镜罩16安装在基板支承部14a时利用LED元件15b的外周部压紧配线基板15a和反射片19的功能,不仅提高配线基板15a与基板支承部14a的密合性,另外,通过用凸形部16a4压制设置LED元件15b附近的反射片19上的孔形状19a的外缘部,能够抑制因反射片19的翘曲等遮挡从LED元件15b照射的光而产生的灯罩18的光不均和阴影以及光束值的减少。A slight gap d is provided between the wiring board 15a (and the reflective sheet 19 ) facing the connection portion 16b (see FIG. 8 ). This is to avoid components mounted on the wiring board 15a (for example, jumper elements mounted to go over the wiring pattern, etc.). The convex part 16a4 also has the function of pressing the wiring board 15a and the reflection sheet 19 with the outer peripheral part of the LED element 15b when the lens cover 16 is mounted on the board supporting part 14a. In addition, by pressing the outer edge of the hole shape 19a on the reflective sheet 19 near the LED element 15b with the convex portion 16a4, it is possible to prevent the light irradiated from the LED element 15b from being blocked due to warping of the reflective sheet 19, etc. The light unevenness and shadow of the resulting lampshade 18 and the reduction of the beam value.
Claims (2)
- A kind of 1. lighting device, it is characterised in that:Including:The substrate of LED light source is installed;With the lens section for covering the LED light source and the connecting portion for connecting the lens section Lens cap;With the diffused reflector with curved surface for covering the LED light source and the lens cap,The connecting portion includes flat part and concave shaped portion,The concave shaped portion is located at the end of the lens.
- 2. lighting device as claimed in claim 1, it is characterised in that:In the outer edge of the side relative with the substrate of the lens, have and set in a manner of surrounding the LED light source Male portion.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-167485 | 2016-08-30 | ||
JP2016167485A JP2018037177A (en) | 2016-08-30 | 2016-08-30 | Luminaire |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107781735A true CN107781735A (en) | 2018-03-09 |
Family
ID=61437703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710155934.6A Pending CN107781735A (en) | 2016-08-30 | 2017-03-14 | Lighting device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2018037177A (en) |
CN (1) | CN107781735A (en) |
TW (1) | TWI640719B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019212452A (en) * | 2018-06-01 | 2019-12-12 | パナソニックIpマネジメント株式会社 | Lighting device |
JP2023509990A (en) | 2020-01-20 | 2023-03-10 | シグニファイ ホールディング ビー ヴィ | Luminaire with identical curved LED modules and LED module suitable for said luminaire |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013045604A (en) * | 2011-08-24 | 2013-03-04 | Panasonic Corp | Lighting fixture |
CN104676462A (en) * | 2013-11-29 | 2015-06-03 | 全亿大科技(佛山)有限公司 | Lens and lighting device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4981600B2 (en) * | 2007-09-20 | 2012-07-25 | パナソニック株式会社 | lighting equipment |
EP2450618A1 (en) * | 2009-07-03 | 2012-05-09 | Sharp Kabushiki Kaisha | Light source unit, illumination device, display device, and television receiving device |
JP5804588B2 (en) * | 2010-10-12 | 2015-11-04 | 東芝ライテック株式会社 | lighting equipment |
JP5842440B2 (en) * | 2011-01-11 | 2016-01-13 | 東芝ライテック株式会社 | lighting equipment |
CN103672725A (en) * | 2012-08-31 | 2014-03-26 | 东芝照明技术株式会社 | Illuminating shade and lighting device |
JP6112395B2 (en) * | 2013-02-13 | 2017-04-12 | パナソニックIpマネジメント株式会社 | lighting equipment |
CN204693230U (en) * | 2015-05-29 | 2015-10-07 | 深圳市洲明科技股份有限公司 | LED lamp affixed to the ceiling |
-
2016
- 2016-08-30 JP JP2016167485A patent/JP2018037177A/en active Pending
-
2017
- 2017-03-14 CN CN201710155934.6A patent/CN107781735A/en active Pending
- 2017-04-19 TW TW106113132A patent/TWI640719B/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013045604A (en) * | 2011-08-24 | 2013-03-04 | Panasonic Corp | Lighting fixture |
CN104676462A (en) * | 2013-11-29 | 2015-06-03 | 全亿大科技(佛山)有限公司 | Lens and lighting device |
Also Published As
Publication number | Publication date |
---|---|
JP2018037177A (en) | 2018-03-08 |
TWI640719B (en) | 2018-11-11 |
TW201819815A (en) | 2018-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4786750B2 (en) | Lighting device | |
JP5594600B2 (en) | lighting equipment | |
JP5253552B2 (en) | Lighting device | |
JP6956110B2 (en) | Lighting device | |
JP6624550B2 (en) | lighting equipment | |
JP6542579B2 (en) | LED lighting device | |
JP2017045624A (en) | LED lighting device | |
JP4902006B2 (en) | Lighting device | |
JP6601745B2 (en) | lighting equipment | |
CN107781735A (en) | Lighting device | |
JP2012146668A (en) | Lighting fixture | |
TW202100902A (en) | Lighting device including plural light-emitting modules, a lens cover, and a diffuser cover | |
JP5116865B2 (en) | Lighting device | |
JP7312964B2 (en) | lighting equipment | |
JP5126637B2 (en) | lighting equipment | |
JP7192083B2 (en) | LED lighting device | |
JP7108013B2 (en) | LED lighting device | |
JP5950141B2 (en) | lighting equipment | |
JP7231596B2 (en) | lighting equipment | |
JP6995730B2 (en) | LED lighting device | |
JP6531067B2 (en) | LED lighting device | |
JP6960094B2 (en) | lighting equipment | |
JP6807986B2 (en) | LED lighting device | |
CN207080893U (en) | lighting equipment | |
JP6260879B2 (en) | lighting equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan, Japan Applicant after: Hitachi Global Living Program Co., Ltd. Address before: Tokyo, Japan, Japan Applicant before: Hitachi Household Electric Appliance Co. |
|
CB02 | Change of applicant information | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180309 |
|
WD01 | Invention patent application deemed withdrawn after publication |