TW201819085A - Laser machining system - Google Patents

Abstract

A laser machining system includes a first laser source, a second laser source, a wave plate, and a light combination component. The first laser source is used for emitting a first laser beam. The second laser source is used for emitting a second laser beam. The first laser beam and the second laser beam are two types of laser beams, respectively, and have two different characteristics. The wave plate is used for polarizing the second laser beam emitted from the second laser source. The light combination component is used for receiving and combining the first laser beam emitted from the first laser source and the second laser beam polarized by the wave plate, so as to output a third laser beam for machining a workpiece. In such a way, the laser machining system of the present invention can increase machining speed, improve machining quality and enhance absorption rate of material.

Description

Laser processing system

The invention relates to a processing system, in particular to a laser processing system.

Laser processing is a high-power spot formed by laser light focusing to remove material. It belongs to a common non-contact processing method. Laser light can be divided into continuous wave form and pulse form according to its output mode. When laser light is output as a continuous wave or a long pulse to process a material, the material absorbs the energy of the laser light and forms a gap through the phase change of solid, liquid, and gaseous phases. However, the output mode of continuous wave or long pulse is Although the processing speed is fast, during the processing, the energy of the laser light will increase the temperature of the material, and the melting and deformation of the material caused by the thermal effect will reduce the processing accuracy. Breaking the bond between the atoms or molecules of the material, so that the material is vaporized before it can transfer heat, so the melting and deformation of the material is effectively avoided to improve the processing accuracy. However, compared with the continuous wave or long pulse laser, A short pulse of laser can remove less material in a single pulse, so the processing speed is slower.

Therefore, an object of the present invention is to provide a laser processing system, which can simultaneously take into account processing speed and processing accuracy to solve the above problems.

To achieve the above object, the present invention discloses a laser processing system including a first laser light source, a second laser light source, a polarizer, and an optical coupling element. The first laser light source is configured to emit a first laser light source. Laser light, the second laser light source is used to emit a second laser light, the polarizer is used to polarize the second laser light emitted by the second laser light source, and the optical coupling element is used to receive and couple The first laser light emitted by the first laser light source and the second laser light polarized by the polarizing plate are used to output a third laser light for processing a workpiece.

According to one embodiment of the present invention, the laser processing system further includes a laser beam expander and a laser processing head. The laser beam expander is used to reduce the third laser light emitted by the optical coupling element. Divergence, the laser processing head is used to focus the third laser light emitted by the laser beam expander to process the workpiece.

According to one embodiment of the present invention, the laser processing system further includes a first reflection component for reflecting the first laser light emitted by the first laser light source to the optical coupling element. .

According to one embodiment of the present invention, the laser processing system further includes a second reflection component for reflecting the second laser light emitted by the second laser light source through the polarizer. To the optical coupling element.

According to one embodiment of the present invention, the laser processing system further includes a third reflective component, and the third reflective component is configured to reflect the third laser light emitted by the optical coupling element to the laser beam expander. .

According to one embodiment of the present invention, the optical coupling element is a beam splitter having a polarized polarity.

According to one embodiment of the present invention, the first laser light has a first polarization characteristic, and the second laser light polarized by the polarizer has a second polarization characteristic, and the first polarization characteristic and the The second polar characteristics are different.

According to one embodiment of the present invention, the first laser light source emits the first laser light with a first pulse, the second laser light source emits the second laser light with a second pulse, and the second pulse is greater than The first pulse.

In summary, the present invention uses a polarizer and a light coupling element to couple a first laser light with a short pulse and a second laser light with a long pulse to form a third laser light to process a workpiece. Therefore, the third laser light is simultaneously The high peak energy of the first laser light with short pulses and the high pulse energy of the second laser light with long pulses. Therefore, the laser processing system of the present invention can simultaneously improve processing when processing, especially when processing hard and brittle materials. Speed, optimize processing quality and increase the material absorption rate, thereby achieving the effect of avoiding leaks or misalignment, so it can improve yield and productivity. The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the drawings.

Please refer to FIG. 1. FIG. 1 is a component configuration diagram of a laser processing system according to an embodiment of the present invention. As shown in FIG. 1, the laser processing system 1 of the present invention is used to process a workpiece 2, and is particularly suitable for machining workpieces 2 made of hard and brittle materials (such as ceramics, sapphire, glass, etc.). The laser processing system 1 includes a first laser light source 11, a second laser light source 12, a polarizer 13, an optical coupling element 14, a laser beam expander 15, a laser processing head 16, and a first The reflective component 17, a second reflective component 18 and a third reflective component 19.

In this embodiment, the first laser light source 11 emits a first laser light L1 with a first pulse width, and the second laser light source 12 emits a second laser light L2 with a second pulse width. The second pulse width may be larger than the first pulse width, that is, the peak power of the first laser light L1 is higher than that of the second laser light, but the pulse energy of the second laser light L2 is Compared with the first laser light L1, the first laser light source 11 may be a short-pulse laser light emitting device, and the second laser light source 12 may be a long-pulse laser light emitting device, but the present invention is not limited thereto. For example, in another embodiment, the second laser light source 12 may also be a continuous wave laser light emitting device, which depends on actual needs. In addition, the user can also adjust the power, repetition rate, wave length, and duty cycle of the first laser light L1 and the second laser light L2 according to the material characteristics of the workpiece 2. And other parameters to achieve different processing results. For example, the user can adjust the wavelengths of the first laser light L1 and the second laser light L2 to a specific wavelength according to the material characteristics of the workpiece 2 to help the material absorb the first laser light L1 and the second laser light L2.

The first reflection component 17 is disposed between the first laser light source 11 and the optical coupling element 14 and is used to change the light path of the first laser light L1 so that the first A laser light L1 is reflected to the optical coupling element 14. The second reflecting component 18 is disposed between the second laser light source 12 and the polarizing plate 13 and is used to change the light path of the second laser light L2 so that the second laser light emitted by the second laser light source 12 will be emitted in a specific space. The laser light L2 is reflected to the polarizing plate 13. The polarizing plate 13 is used to polarize the second laser light L2 reflected by the second reflecting component 18, and the light coupling element 14 is used to receive and couple the first laser light L1 reflected by the first reflecting component 17 and the polarized plate 13 The polarized second laser light L2 is used to output a third laser light L3 to the third reflective component 19. The third reflection component 19 is disposed between the optical coupling element 14 and the laser beam expander 15 and is used to change the optical path of the third laser light L3 so that the third laser emitted by the optical coupling element 14 will be emitted in a specific space. The emitted light L3 is reflected to the laser beam expander 15. Since the laser light emitted from the laser light source has a certain divergence angle, the laser beam expander 15 is used to reduce the divergence of the third laser light L3 emitted from the optical coupling element 14 so as to pass the laser beam expander 15 The third laser light is approximately a parallel beam. The laser processing head 16 is used to focus the third laser light L3 emitted by the laser beam expander 15 on the workpiece 2. The focal length end depends on the actual processing requirements.

In this embodiment, the light coupling element 14 is a beam splitter with a polarized polarity, but the present invention is not limited thereto. Furthermore, in this embodiment, the first reflective component 17, the second reflective component 18, and the third reflective component 19 may each include at least one plane mirror M to reflect the corresponding laser light. However, the reflective component of the present invention is not Not limited to this. Furthermore, in another embodiment, the laser processing system 1 may not include the first reflective component 17, which means that the optical coupling element 14 and the first laser light source 11 are disposed along the forward direction of the first laser light L1. In this way, the first laser light L1 emitted by the first laser light source 11 can directly proceed straight toward the optical coupling element 14 without being reflected by the first reflection component 17. Similarly, in other embodiments, the laser processing system 1 can also change the setting relationship between the second laser light source 12 and the polarizer 13 or the setting relationship between the optical coupling element 14 and the laser beam expander 15 without changing Contains a second reflective component 18 or a third reflective component 19. In addition, the installation positions of the first reflective component 17, the second reflective component 18, and the third reflective component 19 of the present invention and the number of the plane mirrors M included therein are not limited to those shown in the drawings of the embodiment of the present invention, and the ends thereof are actual. Design requirements. For example, when the polarizing plate 13 and the optical coupling element 14 are not disposed along the forward direction of the second laser light L2, the second reflection component 18 may further include at least one of the polarizing plate 13 and the optical coupling element 14 disposed between the polarizing plate 13 and the optical coupling element 14. A plane mirror, so that the second laser light L2 passing through the polarizing plate 13 can be reflected by the at least one plane mirror to advance toward the optical coupling element 14.

As shown in FIG. 1, when the laser processing system 1 is used to process a workpiece 2 made of a hard and brittle material, the first laser light source 11 and the second laser light source 12 face the first reflection component 17 and The second reflective component 18 emits the first laser light L1 and the second laser light L2, the first reflective component 17 reflects the first laser light L1 to the optical coupling element 14, and the second reflective component 18 reflects the second laser light L2 to polarization Sheet 13. In this embodiment, the first laser light L1 emitted by the first laser light source 11 and the second laser light L2 emitted by the second laser light source 12 may both have a first polarization characteristic and be polarized. The second laser light L2 polarized by the sheet 13 has a second polarization characteristic different from the first polarization characteristic, so that the optical coupling element 14 will be emitted by the first laser light source 11 and have the first polarization characteristic. Is coupled to the first laser light L1 and the second laser light L2 emitted by the second laser light source 12 and having a second polarization characteristic after being polarized by the polarizer 13, wherein the first polarization characteristic and the second The polarization characteristics can be horizontally polarized (P-polarized) and vertically polarized (S-polarized), but the present invention is not limited thereto.

When the optical coupling element 14 receives the first laser light L1 reflected from the first reflecting component 17 and the second laser light L2 polarized by the polarizing plate 13, the first laser light L1 and the second laser light L2 are different from each other. The first polarization characteristic and the second polarization characteristic, therefore, the first laser light L1 having the first polarization characteristic can be directly reflected by the optical coupling element 14 to the third reflection component 19 and polarized by the polarizer 13 The second laser light L2 having the second polarization characteristic will pass through the optical coupling element 14 and proceed toward the third reflection component 19. In other words, the first laser light L1 reflected by the light coupling element 14 and the second laser light L2 passing through the light coupling element 14 overlap each other to form a third laser light L3. Then, the third laser light L3 is reflected to the laser beam expander 15 by the third reflection component 19, and the laser beam expander 15 is used to adjust the third laser light L3 reflected by the third reflection component 19 to make the third The laser light L3 is approximately a parallel beam, and emits the third laser light L3 to the laser processing head 16. The laser processing head 16 focuses the third laser light L3 emitted from the laser beam expander 15 on the workpiece 2 to For processing.

Please refer to FIG. 2. FIG. 2 is a time T-power P relationship diagram of the third laser light L3 according to an embodiment of the present invention. As shown in Fig. 2, the third laser light L3 is substantially formed by coupling the first laser light L1 and the second laser light L2. Therefore, when the user uses the third laser light L3 to process the workpiece 2, the third laser light L3 The first laser light L1 having the shorter first pulse width in the light L3 has a higher peak energy, which can break through the ablation threshold AT of the material, and directly remove the heated material in an instant to reduce the diffusion of thermal effects to Elsewhere, the surface of the material is further modified and roughened, and the second laser light L2 having the longer second pulse width in the third laser light L3 has a higher pulse energy, which passes through melting or Vaporize the material to achieve the purpose of rapid processing of the workpiece, whereby the laser processing system 1 of the present invention can increase the processing speed, optimize the processing quality and increase the material absorption rate, thereby achieving the effect of avoiding leaks or misalignment. Improve yield and productivity. However, the present invention is not limited to this embodiment. Please refer to FIG. 3. FIG. 3 is a time T-power P relationship diagram of a third laser light L3 'according to another embodiment of the present invention. As shown in FIG. 3, in another embodiment, the third laser light L3 ′ is substantially composed of a first laser light L1 ′ having a high peak energy and a short pulse width and a second laser light having a high energy continuous wave. The laser light L2 'is coupled. Similarly, the first laser light L1' having a high peak energy and a short pulse width in the third laser light L3 'can modify and roughen the surface of the material, so that the surface of the material is subject to After the laser light L1 'is destroyed, the second laser light L2' having a high-energy continuous wave in the third laser light L3 'can be more effectively absorbed, thereby increasing the processing speed. Compared with the prior art, the present invention uses a polarizer and a light coupling element to couple the first laser light with a short pulse and the second laser light with a long pulse to form a third laser light, and then uses the third laser light to process the workpiece Therefore, the third laser light has both the high peak energy of the short pulse of the first laser light and the high pulse energy of the long pulse of the second laser light. Therefore, the laser processing system of the present invention is particularly hard and brittle during processing. When the material is used, the processing speed can be improved at the same time, the processing quality can be optimized, and the material absorption rate can be increased, thereby achieving the effect of avoiding leaks or misalignment, so the yield and productivity can be improved. The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the scope of patent application of the present invention shall fall within the scope of the present invention.

1‧‧‧laser processing system

11‧‧‧The first laser light source

12‧‧‧second laser light source

13‧‧‧Polarizer

14‧‧‧Optical coupling element

15‧‧‧laser beam expander

16‧‧‧laser processing head

17‧‧‧The first reflection component

18‧‧‧Second reflective component

19 ‧‧‧Third reflective component

2‧‧‧ Workpiece

L1, L1’‧‧‧ first laser light

L2, L2’‧‧‧Second laser light

L3, L3’‧‧‧ The third laser light

M‧‧‧ flat mirror

P‧‧‧Power

T‧‧‧time

AT‧‧‧Threshold of material erosion

FIG. 1 is a component configuration diagram of a laser processing system according to an embodiment of the present invention. FIG. 2 is a time-power relationship diagram of the third laser light according to the embodiment of the present invention. FIG. 3 is a time-power relationship diagram of a third laser light according to another embodiment of the present invention.

Claims (8)

A laser processing system includes: a first laser light source for emitting a first laser light; a second laser light source for emitting a second laser light; a polarizing plate for polarizing the light The second laser light emitted by the second laser light source; and a light coupling element for receiving and coupling the first laser light emitted by the first laser light source and the first laser light polarized by the polarizer Two laser lights to output a third laser light to process a workpiece. The laser processing system according to claim 1, further comprising: a laser beam expander for reducing the divergence of the third laser light emitted by the optical coupling element; and a laser processing head for The third laser light emitted by the laser beam expander is focused to process the workpiece. The laser processing system according to claim 2, further comprising: a first reflection component for reflecting the first laser light emitted by the first laser light source to the optical coupling element. The laser processing system according to claim 3, further comprising: a second reflecting component for reflecting the second laser light emitted by the second laser light source through the polarizer to the optical coupling element . The laser processing system according to claim 4, further comprising: a third reflecting component, configured to reflect the third laser light emitted by the optical coupling element to the laser beam expander. The laser processing system according to claim 1, wherein the optical coupling element is a beam splitter having a polarization polarity. The laser processing system according to claim 1, wherein the first laser light has a first polarization characteristic, and the second laser light polarized by the polarizer has a second polarization characteristic, and the first polarization The polar characteristic is different from the second polarized characteristic. The laser processing system according to claim 1, wherein the first laser light source emits the first laser light with a first pulse width, and the second laser light source emits the second laser light with a second pulse width , The second pulse width is greater than the first pulse width.