TW201817165A - Clocked commands timing adjustments in synchronous semiconductor integrated circuits - Google Patents

Clocked commands timing adjustments in synchronous semiconductor integrated circuits Download PDF

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TW201817165A
TW201817165A TW106133268A TW106133268A TW201817165A TW 201817165 A TW201817165 A TW 201817165A TW 106133268 A TW106133268 A TW 106133268A TW 106133268 A TW106133268 A TW 106133268A TW 201817165 A TW201817165 A TW 201817165A
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clock
circuit
time delay
signal
time
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TW106133268A
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TWI685203B (en
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馬修 曼寧
史蒂芬 伊頓
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美商芯成半導體有限公司
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Priority claimed from US15/337,979 external-priority patent/US10236042B2/en
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/22Read-write [R-W] timing or clocking circuits; Read-write [R-W] control signal generators or management 
    • G11C7/222Clock generating, synchronizing or distributing circuits within memory device

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  • Pulse Circuits (AREA)

Abstract

A clock timing adjust circuit is incorporated in a clocked integrated circuit to detect an input clock frequency and to adjust the timing latency of an internal control signal for accessing a memory element in the clocked integrated circuit. The clock timing adjust circuit introduces an adjustable timing latency to an internal control signal derived from the command signal. The clock timing adjust circuit operates to adjust the timing latency of the control signal to cause clock based operations to either be advanced or delayed by one or more clock cycles in response to the clock frequency detection. In one embodiment, the clock timing adjust circuit includes a clock frequency detect circuit and a latency adjust circuit. The clock timing adjust circuit can operate at both high and low clock frequencies to ensure that undesired data collision events are obviated without introducing unnecessary delays.

Description

同步半導體積體電路中時脈命令時間調整Clock command time adjustment in synchronous semiconductor integrated circuit

同步或時脈半導體積體電路具有由一時脈信號驅動之電路。通常,將一輸入時脈提供至同步半導體積體電路,且藉由該輸入時脈或該輸入時脈之一導出物來驅動積體電路之內部電路。 在時脈控制積體電路中,操作期間之一個主要關注問題係對各種內部時間信號之定序及擷取。內部時間信號自同步事件及不同步事件兩者產生,同步事件係基於時脈的且自輸入時脈之上升邊緣或下降邊緣開始計時,不同步事件則係基於閘延遲及/或基於歸因於積體電路之互連導線之電阻及電容之導線互連延遲(稱為RC延遲)。第一群組之內部時間信號(自同步事件產生且其中時間軸(stem)主要依據時脈閘控之信號)具有最小的或不具有溫度、晶圓製造製程或電壓對其時間之相依性。然而,第一群組之內部時間信號將直接取決於時脈頻率。第二群組之內部時間信號(自不同步事件產生且其時間軸主要依據閘延遲及RC延遲之信號)將具有其在不同溫度之可允許範圍內移位或變化之時間、製造製程及電壓操作條件。 在某些情況中,內部時間信號可進入至一衝突域中。當一資料信號之到達與意欲捕獲並儲存彼資料信號之擷取信號不相匹配時,會發生時間衝突。在一項實例中,一時脈積體電路中之一輸出緩衝器實施為一先進先出(FIFO)暫存器,該先進先出暫存器由輸入時脈或輸入時脈之一導出物進行時脈。當來自一後續記憶體讀取操作(一主要不同步事件)之資料在鎖存於一輸出緩衝器中之資料由接收系統讀出之前重寫所鎖存之資料時,可能發生一衝突域事件。在另一實例中,諸如在高速操作期間,RC延遲可導致來自一讀取操作之資料晚於所請求之時間到達輸出緩衝器,且因此時脈積體電路發送出無效資料。Synchronous or clocked semiconductor integrated circuits have circuits driven by a clock signal. Generally, an input clock is provided to a synchronous semiconductor integrated circuit, and the internal circuit of the integrated circuit is driven by the input clock or a derivative of one of the input clocks. In the clock control integrated circuit, a major concern during operation is the sequencing and acquisition of various internal time signals. Internal time signals are generated from both synchronous and asynchronous events. Synchronous events are clocked and timed from the rising or falling edge of the input clock. Asynchronous events are based on gate delay and / or based on The interconnection delay of the interconnecting wires and capacitors of integrated circuits is called the RC delay. The internal time signals of the first group (generated from synchronization events and in which the stem is mainly based on clock gating) have minimal or no temperature, wafer manufacturing process, or voltage dependence on their time. However, the internal time signal of the first group will directly depend on the clock frequency. The second group of internal time signals (signs generated from asynchronous events and whose time axis is mainly based on the gate delay and RC delay) will have the time, manufacturing process and voltage that they shift or change within the allowable range of different temperatures Operating conditions. In some cases, the internal time signal can enter a collision domain. A time conflict occurs when the arrival of a data signal does not match the acquisition signal intended to capture and store that data signal. In one example, one of the output buffers in the clock product circuit is implemented as a first-in-first-out (FIFO) register. The first-in-first-out register is derived from an input clock or an output of one of the input clocks. The clock. A collision domain event may occur when data from a subsequent memory read operation (a major asynchronous event) rewrites the latched data before the data latched in an output buffer is read by the receiving system. . In another example, such as during high-speed operation, the RC delay may cause data from a read operation to reach the output buffer later than requested, and thus the clock product circuit sends invalid data.

可以眾多方式實施本發明,包含以一製程、一設備、一系統及/或一物質組成。在本說明書中,此等實施方案或本發明可採用之任何其他形式可稱為技術。通常,可在本發明之範疇內更改所揭示製程之步驟之次序。 下文連同圖解說明本發明之原理之附圖一起提供對本發明之一或多個實施例之一詳細說明。結合此等實施例闡述本發明,但本發明並不限於任何實施例。本發明之範疇僅由申請專利範圍限制且本發明涵蓋眾多替代、修改及等效形式。在以下說明中陳述眾多特定細節以便提供對本發明之一透徹理解。此等細節係出於實例目的而提供,且可在無此等特定細節中之某些或所有細節之情況下根據申請專利範圍實踐本發明。出於清晰之目的,尚未詳細闡述與本發明相關之技術領域中已知之技術材料,因此不會不必要地模糊本發明。 根據本發明之實施例,一時脈時間調整電路係併入於一時脈積體電路中以偵測至時脈積體電路之一輸入時脈之一操作頻率或一操作頻率範圍且調整一內部控制信號之時間延時,以便存取時脈積體電路中之一記憶體元件。時脈積體電路接收一命令信號以存取時脈積體電路中之記憶體元件。命令信號用於產生一內部控制信號,所產生之內部控制信號被路由至時脈積體電路之記憶體元件以存取記憶體元件。時脈時間調整電路將一可調整時間延時引入至自命令信號導出之內部控制信號。在本發明之實施例中,時脈時間調整電路回應於頻率偵測而操作以在操作期間移位或調整內部控制信號之時間延時,以致使基於時脈之操作提前或延遲一或多個時脈循環。本發明之時脈時間調整電路使時脈積體電路能夠在一寬頻率範圍內操作,同時確保在不引入不必要延遲之情況下避免非期望資料衝突事件。 可在不使用模式暫存器設定命令或其他非習用操作程序之情況下實施時脈時間調整電路。而是,時脈時間調整電路可在正常電路操作或「高速運轉(on the fly)」期間實時地操作來調整內部時間信號以避免資料衝突。本發明之時脈時間調整電路可有利地應用於記憶體電路中,諸如動態隨機存取記憶體(DRAM)、NAND快閃記憶體、靜態隨機存取記憶體(SRAM)或其他類型之揮發性記憶體或非揮發性記憶體。本發明之時脈時間調整電路亦可有利地應用於邏輯電路中,諸如微處理器積體電路。通常,本發明之時脈時間調整電路可應用於含有一記憶體元件(諸如晶片上記憶體)之任何時脈積體電路或同步積體電路。時脈時間調整電路可有利地用於調整內部記憶體存取控制信號之時間,以避免可能在記憶體存取操作(諸如記憶體元件之讀取操作及寫入操作)期間發生之衝突事件。 更具體而言,在本發明之實施例中,時脈時間調整電路偵測到:至時脈積體電路之輸入時脈係慢速運行(在一低頻率下)或快速運行(在一高頻率下)的。時脈時間調整電路基於由時脈積體電路接收之命令信號且利用一預定可調整時間延時量而產生一內部控制信號。時脈時間調整電路基於輸入時脈之所偵測頻率且根據命令信號而調整內部控制信號之時間延時。在一項實例中,回應於偵測到輸入時脈處於低頻率,時脈時間調整電路使用預定時間延時產生內部控制信號。然而,回應於偵測到輸入時脈處於高頻率,時脈時間調整電路產生相對於預定時間延時提前或延遲一或多個時脈循環之內部控制信號。在另一實例中,回應於偵測到輸入時脈處於高頻率,時脈時間調整電路使用預定時間延時產生內部控制信號。同時,回應於偵測到輸入時脈處於低頻率,時脈時間調整電路產生相對於預定時間延時提前或延遲一或多個時脈循環之一內部控制信號。 特定而言,時脈時間調整電路可藉由基於預定時間延時移除一或多個時脈循環而產生提前一或多個時脈循環之一內部控制信號。將一控制信號提前一或多個時脈循環會引入一或多個額外時脈循環以給下游資料操作提供時間裕量。在一時脈記憶體電路中,將一控制信號提前會導致用於特定資料讀取操作之讀取資料提前,如下文將更詳細地闡述。 另一方面,時脈時間調整電路可藉由基於預定時間延時新增一或多個時脈循環而產生延遲一或多個時脈循環之一內部控制信號。將一控制信號延遲一或多個時脈循環會將一或多個額外時脈循環引入至一時脈積體電路之內部信號路徑。在一時脈記憶體電路中,將一控制信號延遲會導致用於特定資料寫入操作之資料延遲,如下文將更詳細地闡述。 在本發明之實施例中,本發明之時脈時間調整電路可有利地應用於記憶體電路中(諸如動態隨機存取記憶體(DRAM)、NAND快閃記憶體)或邏輯電路中(諸如微處理器)。在以下闡述中,在針對同步記憶體電路提供特定實施方案細節之情況下闡述本發明之時脈時間調整電路在一記憶體裝置及一微處理器裝置中之應用。然而,熟習此項技術者將瞭解,本發明之時脈時間調整電路可應用於任何時脈積體電路或同步積體電路以調整時脈時間,從而避免歸因於晶片上時間信號延時之衝突。特定而言,本發明之時脈時間調整電路可應用於具有一晶片上記憶體元件之任何時脈積體電路或同步積體電路,以調整控制信號之時脈時間來存取該晶片上記憶體元件。晶片上記憶體元件可以係一晶片上記憶體陣列或者一暫存器或一暫存器庫。 在本說明中,一時脈積體電路或一時脈控制積體電路係指具有由一時脈信號驅動之電路之一半導體積體電路。時脈積體電路有時稱為同步積體電路。將一輸入時脈提供至同步半導體積體電路,且藉由輸入時脈或輸入時脈之一導出物來驅動該積體電路之內部電路。時脈積體電路之實例包含時脈同步記憶體裝置以及時脈微處理器裝置或同步微處理器裝置。一時脈積體電路通常耦合至一基於時脈(或基於時脈循環)之外部系統,該外部系統同步地存取時脈積體電路。 此外,在本說明中,將一命令信號提供至一積體電路以致使積體電路執行由該積體電路支援之功能。在本說明中,一命令信號區別於一位址信號,位址信號規定積體電路中待施加功能之位置。一命令信號亦區別於為待施加之功能提供資料值之一資料信號。由積體電路接收命令信號以產生內部控制信號來控制積體電路之電路。在本發明之實施例中,時脈積體電路接收命令信號以存取時脈積體電路之一記憶體元件。此外,在某些實施例中,命令信號可包含一讀取命令信號及一寫入命令信號。 圖1係其中在本發明之例示性實施例中可併入有時脈時間調整電路之一同步記憶體裝置之一方塊圖。圖1中展示一同步記憶體裝置10之一個一般化架構以圖解說明本發明之時脈時間調整電路在一記憶體電路中之使用。同步記憶體裝置10可包含圖1中未展示之額外組件以完成記憶體電路。此外,圖1中所展示之記憶體架構僅係說明性的,且將瞭解本文中所闡述之時脈時間調整電路及方法可用於其他記憶體架構中。在某些實例中,可將同步記憶體裝置10構造成一DRAM、SRAM、快閃記憶體或其他類型之揮發性或非揮發性記憶體。 參考圖1,同步記憶體裝置10包含記憶體單元14之一個二維陣列12。陣列12中之記憶體單元14由字線(列)及位元線(行)存取。由一列解碼器18及一行解碼器20對單元陣列12進行定址以選擇性地存取陣列12中之記憶體單元14以用於讀取操作及寫入操作。特定而言,在一控制電路16處接收一位址ADDR且藉由選擇記憶體陣列12之字線之列解碼器18及選擇位元線之行解碼器20對所接收位址進行解碼。列解碼器18選擇性地啟動一字線且行解碼器選擇性地啟動一位元線以允許存取選定字線與選定位元線之相交點處之一記憶體單元14。 同步記憶體裝置10亦接收一命令信號以控制記憶體裝置之操作。由控制電路16接收命令信號,繼而基於命令信號而產生一或多個控制信號。命令信號可包含用以自記憶體陣列讀取資料之一讀取命令信號或用以將資料寫入至記憶體陣列之一寫入命令信號。同步記憶體裝置10亦可接收其他命令信號以支援記憶體裝置之操作。作為一同步或時脈裝置,同步記憶體裝置10亦在控制電路處接收具有一給定時脈頻率之一輸入時脈信號CLK。控制電路基於輸入時脈信號CLK而產生內部時脈信號以控制記憶體電路之操作。 為自時脈記憶體電路讀取資料,由感測放大器24感測來自記憶體陣列12之選定記憶體單元之所讀取資料且I/O閘控電路22將選定位元線連接至儲存所讀取資料之一讀取FIFO 26。作為一時脈記憶體裝置,讀取FIFO 26由一時脈信號CLK2R 控制,CLK2R 與輸入時脈信號CLK相同或自輸入時脈信號CLK導出。回應於時脈信號CLK2R ,將讀取資料提供至一輸出緩衝器28以提供為至同步記憶體裝置10外部之電路及系統之一輸出資料DOUT。 為將資料寫入至時脈記憶體電路中,由同步記憶體裝置10接收且更具體而言由一輸入緩衝器30自外部電路及系統接收寫入資料DIN。然後,將寫入資料DIN傳送至由時脈信號CLK2W 控制之一寫入FIFO 32。回應於時脈信號CLK2W ,將寫入資料自輸入緩衝器30鎖存至寫入FIFO 32中且又將寫入資料自寫入FIFO 32讀出。將寫入資料自寫入FIFO 32提供至寫入驅動器電路。寫入驅動器電路透過I/O閘控電路22將寫入資料驅動至選定位元線上以致使將資料儲存於選定記憶體單元14中。 根據本發明之實施例,將一時脈時間調整電路80併入於同步記憶體裝置10中以產生經時間調整控制信號來存取記憶體陣列。特定而言,時脈時間調整電路80自控制電路16接收輸入時脈信號CLK且亦自控制電路16接收命令信號,諸如讀取命令及寫入命令。時脈時間調整電路80基於所偵測輸入時脈頻率而產生時間調整內部控制信號,例如針對讀取命令之L-Read及針對寫入命令之L-Write,如下文將更詳細地闡述。將經時間調整控制信號L-Read及L-Write耦合至記憶體陣列12以控制對記憶體陣列12之讀取及寫入操作。 在某些實施例中,時脈時間調整電路80可形成為控制電路16之一部分。同步記憶體裝置10中之時脈時間調整電路80之確切組態對本發明之實踐並不重要。唯一必要的係時脈時間調整電路80產生經時間調整控制信號以利用期望時間調整來操作記憶體陣列。 圖2係其中在本發明之例示性實施例中可併入有時脈時間調整電路之一微處理器裝置之一方塊圖。參考圖2,一微處理器裝置或一微處理器積體電路50包含各種功能區塊52,諸如算術邏輯單元(ALU)、隨機存取記憶體(RAM)、移位暫存器及一階儲存裝置(L1快取記憶體)。功能區塊52有時稱為巨集區塊。此等巨集區塊52中之諸多巨集區塊係時脈電路,其中該時脈電路需要經由積體電路之大距離之矽來回地傳送資料。資料信號路徑中之傳播延遲可致使資料在預期時脈循環之外到達目的地巨集區塊。因此,在某些實施例中,將本發明之一時脈時間調整電路80併入至微處理器裝置50中以調整用於在功能區塊或巨集區塊之間傳送資料之控制信號之時間。舉例而言,時脈時間調整電路80接收至微處理器裝置50之輸入時脈信號CLK且亦接收一命令信號。時脈時間調整電路80產生一經時間調整控制信號L-command,L-command可用於控制巨集區塊1及/或巨集區塊2以促進資料在微處理器裝置內之巨集區塊之間之傳送。在某些實例中,命令信號用於存取巨集區塊52中之一記憶體元件且命令信號可係一讀取命令信號或一寫入命令信號。 可將本發明之時脈時間調整電路併入於除一微處理器積體電路之外的其他邏輯電路中。圖2之微處理器積體電路僅係說明性的且並不意欲係限制性的。 圖3(a)係本發明之某些實施例中之一時脈時間調整電路之一方塊圖。參考圖3(a),一時脈時間調整電路80包含一時脈頻率偵測電路82及一延時調整電路86。時脈頻率偵測電路82接收時脈積體電路之輸入時脈信號CLK且產生一時脈偵測輸出信號FASTCLK。時脈頻率偵測電路82偵測輸入時脈信號CLK之時脈頻率以判定輸入時脈信號CLK是高於一預定頻率臨限值還是低於一預定頻率臨限值。在本說明中,高於頻率臨限值之一時脈頻率稱為一高頻率時脈,而低於頻率臨限值之一時脈頻率稱為一低頻率時脈。舉例而言,在一個應用中,一高頻率時脈視為大於500 MHz。因此,在一項實施例中,頻率臨限值係500 MHz。500 MHz或高於500 MHz之一輸入時脈頻率視為一高時脈頻率,且低於500 MHz之一輸入時脈頻率視為一低時脈頻率。當輸入時脈頻率等於或大於頻率臨限值時,時脈頻率偵測電路82確證FASTCLK輸出信號以指示一高時脈頻率。否則,將FASTCLK輸出信號解除確證以指示一低時脈頻率。 延時調整電路86接收來自時脈頻率偵測電路82之FASTCLK信號且亦接收由時脈積體電路接收之命令信號並且亦接收輸入時脈信號CLK。延時調整電路86基於命令信號且回應於FASTCLK信號而產生一內部控制信號L-Command。在操作中,延時調整電路86經組態以將一給定時間延時量新增至命令信號以產生控制信號L-Command。時間延時量係給出為輸入時脈信號之時脈週期或時脈循環之數目,且可表示在低頻率操作模式或高頻率操作模式中期望之內部控制信號之時間延時。亦即,由延時調整電路86引入之預定時間延時量可具有適合於在低時脈頻率下操作時脈積體電路之延時值。另一選擇係,由延時調整電路86引入之預定時間延時量可具有適合於在高時脈頻率下操作時脈積體電路之延時值。然後,取決於FASTCLK信號之狀態,延時調整電路86藉由新增時脈循環或自預定時間延時移除時脈循環來調整時間延時,藉此將內部控制信號L-Command延遲或提前。 在一項實例中,延時調整電路86在FASTCLK信號被解除確證時並不施加時間調整。因此,控制信號L-Command產生有用於低頻率操作之預定時間延時。另一方面,延時調整電路86在FASTCLK信號被確證時施加時間調整。因此,控制信號L-Command產生有用於高頻率操作之經調整時間延時。時間調整可包含關於低頻率操作而將控制信號提前一或多個時脈循環。時間調整亦可包含關於低頻率操作而將控制信號延遲一或多個時脈循環。然後,使用經時間調整控制信號來存取時脈積體電路之記憶體元件。因此組態,經時間調整控制信號確保在正確時間處擷取於時脈積體電路內傳送之資料信號且避免衝突事件。在其他實例中,延時調整電路86可經組態而以相反方式操作:即當FASTCLK信號被確證時不施加時間調整,而當FASTCLK信號被解除確證時施加時間調整。 一時脈積體電路通常接收多個命令信號,該多個命令信號將需要基於輸入時脈頻率而進行時間調整以確保適當電路操作而無衝突事件。舉例而言,在包含一記憶體元件之一時脈積體電路中,時脈積體電路可接收用以自記憶體元件讀取資料之一讀取命令及用以將資料寫入至記憶體元件之一寫入命令。因此,一時脈積體電路可包含用於每一命令信號之時脈時間調整電路80之單獨例項。亦即,時脈時間調整電路80可重複以用於每一命令信號。在一替代實施例中,時脈時間調整電路可經組態以用於使用一共用時脈頻率來偵測電路之多個命令信號。圖3(b)係本發明之替代實施例中之一時脈時間調整電路之一方塊圖。參考圖3(b),一時脈時間調整電路90經組態以針對由積體電路接收之兩個命令信號(Command 1及Command 2)而產生內部控制信號。時脈時間調整電路90組態有用以產生FASTCLK信號之一單個時脈頻率偵測電路82以指示一低時脈頻率或一高時脈頻率。時脈時間調整電路90組態有延時調整電路86-1及86-2之兩個例項。每一延時調整電路實例接收FASTCLK信號、輸入時脈信號CLK及一各別命令信號。延時調整電路86-1產生經時間調整控制信號L-Command1,且延時調整電路86-2產生經時間調整控制信號L-Command2。 在有多個命令信號之情形中,當可將相同頻率臨限值施加至兩個命令信號時,圖3(b)之時脈時間調整電路90之組態提供簡化電路之優點。在此情形中,需要一單個時脈頻率偵測電路82來產生FASTCLK信號以調整多個命令信號之延時時間。每一延時調整電路86可具備相同或不同時間延時量,且可經組態以根據命令信號而新增或移除時脈循環。 在其他實例中,一時脈積體電路可針對多個命令信號而組態有圖3(a)之時脈時間調整電路80之多個例項。以此方式,可能將不同頻率臨限值施加至不同命令信號。舉例而言,可使用500 MHz之一頻率臨限值來處理一讀取命令信號,而可使用600 MHz之一頻率臨限值來處理一寫入命令信號。在此情形中,時脈時間調整電路80之單獨例項用於讀取命令及寫入命令信號,且時脈時間調整電路80之每一實例中之時脈頻率偵測電路82經組態以用於期望頻率臨限值。 本發明之時脈時間調整電路實現諸多優於時脈積體電路中所使用之習用衝突避免方法之益處。首先,本發明之時脈時間調整電路可有利地應用於經設計以在一寬輸入時脈頻率範圍內操作之時脈或同步積體電路中。時脈時間調整電路操作以基於輸入時脈頻率而調整內部控制信號,以避免衝突事件且確保在整個輸入時脈頻率範圍內之有效操作。其次,本發明之時脈時間調整電路在一時脈積體電路中之使用避免使用額外深度FIFO/輸出緩衝器電路塊來處置讀取資料之需要。將本發明之時脈時間調整電路用於時脈積體電路中亦能避免在記憶體陣列中使用額外深度FIFO/輸入暫存器來處置寫入資料之需要。將額外深度FIFO用作輸出緩衝器或輸入暫存器並不可取,此乃因其需要額外矽區域且會增大積體電路之大小,藉此增加積體電路之成本。可將本發明之時脈時間調整電路併入至一時脈積體電路中以減少成本且改良速度效能同時減少電力消耗。 圖4係圖解說明併入本發明之實施例中之時脈時間調整電路之一同步記憶體裝置之一讀取路徑及一寫入路徑之一方塊圖。參考圖4,一同步記憶體裝置100包含用於讀取命令之讀取路徑中之時脈時間調整電路之一第一例項80a、用於寫入命令之寫入路徑中之時脈時間調整電路之一第二例項80b。在本實施例中,針對讀取命令信號及寫入命令信號使用時脈時間調整電路之單獨例項。以此方式,可在時脈時間調整電路之每一例項中使用相同或不同之頻率臨限值。在其他實施例中,可使用圖3(b)之時脈時間調整電路90,其中讀取信號路徑及寫入信號路徑可共用同一時脈頻率偵測電路。 參考圖4,在讀取路徑中,時脈時間調整電路80a接收輸入時脈信號CLK,輸入時脈信號CLK係提供至同步記憶體裝置100之輸入時脈或系統時脈。時脈時間調整電路80a亦在期望一讀取操作時接收提供至同步記憶體裝置100之讀取命令。將輸入時脈信號CLK提供至時脈頻率偵測電路110a,時脈頻率偵測電路110a產生FASTCLK信號。然後,將FASTCLK信號及讀取命令提供至延時調整電路120a以產生經時間調整控制信號L-Read。然後,在讀取操作中使用經時間調整控制信號L-Read來存取記憶體陣列130。假定記憶體裝置100已接收一位址信號ADDR來在記憶體陣列130中選擇供讀出資料之一記憶體位置。在經時間調整控制信號L-Read之控制下,記憶體陣列130提供來自一選定記憶體單元之讀取資料且該讀取資料提供至含有一讀取FIFO之一先進先出FIFO/輸出緩衝器電路140。FIFO/輸出緩衝器電路140提供所讀出資料DOUT作為同步記憶體裝置100之一輸出信號。FIFO/輸出緩衝器電路140中之讀取FIFO由一時脈信號CLK2R 控制,時脈信號CLK2R 係輸入時脈信號CLK或自輸入時脈信號CLK導出。 在本發明之實施例中,時脈時間調整電路80a用於回應於輸入時脈信號CLK具有一高時脈頻率而將經時間調整控制信號L-Read提前一或多個時脈循環。在某些實施例中,當輸入時脈信號CLK具有高於一預定頻率臨限值之一時脈頻率時,時脈頻率偵測電路110a將輸入時脈信號CLK判定為具有一高時脈頻率且確證FASTCLK信號。當輸入時脈頻率被判定為一高時脈頻率時,延時調整電路120a藉由移除一或多個時脈循環使得將控制信號L-Read提前一或多個時脈循環來調整控制信號L-Read之時間延時。以此方式,控制記憶體陣列130在高頻率操作中提早一或多個時脈循環提供讀取資料,使得讀取資料可足夠早地到達FIFO/輸出緩衝器140以藉由時脈信號CLK2R 在期望讀取延時處鎖存至讀取FIFO中,該期望讀取延時通常由耦合至記憶體裝置以存取儲存於記憶體裝置上之資料之一系統規定。 另一方面,當輸入時脈具有一低時脈頻率(亦即低於頻率臨限值之一時脈頻率)時,時脈頻率偵測電路110a不確證FASTCLK信號且延時調整電路120a在不調整時間延時之情況下產生控制信號L-Read。以此方式,讀取資料將在期望時間到達FIFO/輸出緩衝器140,且在期望讀取延時時間處由時脈信號CLK2R 鎖存至讀取FIFO中並被發送出而到達輸出資料墊。 在寫入路徑中,時脈時間調整電路80b接收輸入時脈信號CLK且在期望一寫入操作時亦接收提供至同步記憶體裝置100之寫入命令。將輸入時脈信號CLK提供至時脈頻率偵測電路110b,時脈頻率偵測電路110b以與上文參考時脈時間調整電路80a所闡述相同之方式產生FASTCLK信號。然後,將FASTCLK信號及寫入命令提供至延時調整電路120b以產生經時間調整控制信號L-Write。然後,在寫入操作中使用經時間調整控制信號L-Write來控制記憶體陣列130。舉例而言,經時間調整控制信號L-Write用於控制一庫寫入資料緩衝器135。特定而言,記憶體陣列130通常被劃分成多個記憶體單元庫且每一記憶體單元庫可已與用以為彼記憶體庫儲存寫入資料之一庫寫入資料緩衝器相關聯。在本圖解說明中,控制信號L-Write經耦合以控制庫寫入資料緩衝器135來將寫入資料提供至待寫入至選定記憶體單元之記憶體陣列130。假定記憶體裝置100已接收用於在記憶體陣列130中選擇一記憶體位置以供寫入資料之一位址信號ADDR。亦假定記憶體裝置100已接收待寫入至由位址信號規定之記憶體位置之輸入資料DIN。在一寫入操作中,同步記憶體裝置100接收待寫入至由位址信號ADDR規定之記憶體位置之資料之輸入資料DIN。輸入資料DIN儲存於含有一寫入FIFO之一輸入緩衝器/FIFO電路145中。輸入緩衝器/FIFO電路145中之寫入FIFO受一時脈信號CLK2W 控制,時脈信號CLK2W 可係輸入時脈信號CLK或自輸入時脈信號CLK導出。回應於時脈信號CLK2W 而將儲存於寫入FIFO中之輸入資料自FIFO解鎖出並提供至庫寫入資料緩衝器135。在經時間調整控制信號L-Write之控制下,將儲存於庫寫入資料緩衝器135中之寫入資料寫入至選定記憶體單元中。 在本發明之實施例中,時脈時間調整電路80b用於回應於輸入時脈信號CLK具有一高時脈頻率而將經時間調整控制信號L-Write延遲一或多個時脈循環。在某些實施例中,當輸入時脈信號CLK具有高於一預定頻率臨限值之一時脈頻率時,時脈頻率偵測電路110b將輸入時脈信號CLK判定為具有一高時脈頻率且確證FASTCLK信號。當輸入時脈頻率被判定為一高時脈頻率時,延時調整電路120b藉由新增一或多個時脈循環使得控制信號L-Write被延遲一或多個時脈循環來調整控制信號L-Write之時間。以此方式,控制信號L-Write在高時脈頻率期間被延遲,使得寫入資料在控制L-Write被確證之前有時間到達庫寫入資料緩衝器135。 另一方面,當輸入時脈具有一低時脈頻率(亦即低於預定頻率臨限值之一時脈頻率)時,時脈頻率偵測電路110b不確證FASTCLK信號且延時調整電路120b在不調整時間延時之情況下產生控制信號L-Write。在低時脈頻率下,寫入資料在與控制信號L-Write相匹配之一時間到達庫寫入資料緩衝器135,使得將正確寫入資料寫入至記憶體陣列130中。 圖5係圖解說明本發明之實施例中之時脈時間調整電路之時脈頻率偵測電路之一方塊圖。參考圖5,一時脈頻率偵測電路110包含:一低通濾波器121,其經組態以接收輸入時脈信號CLK;及一或多個時脈正反器電路122,其經組態以產生輸出信號FASTCLK。時脈正反器電路122係受輸入時脈信號CLK控制。時脈頻率偵測電路110可進一步包含作為輸出信號FASTCLK之緩衝器或驅動器之一或多個反相器123。在時脈頻率偵測電路之其他實施例中可省略反相器123。 在本發明之實施例中,時脈頻率偵測電路110使用低通濾波器121來偵測時脈速度或時脈頻率。低通濾波器121經組態以允許低速時脈頻率信號通過而阻擋或濾除高速時脈頻率信號。然後,由時脈正反器級122擷取或鎖存經低通濾波時脈信號。時脈正反器電路122回應於一所偵測高時脈頻率而產生具有一邏輯高值之輸出信號FASTCLK,或回應於一所偵測低時脈頻率而產生具有一邏輯低值之輸出信號FASTCLK。 在某些實施例中,低通濾波器121經組態以具有作為頻率偵測臨限值之一預定頻率值。低通濾波器121能夠將高於預定頻率臨限值之時脈信號偵測為具有一高時脈頻率或高時脈速度。低通濾波器121能夠將低於預定頻率臨限值之時脈信號偵測為具有一低時脈頻率或低時脈速度。在某些實施例中,低通濾波器電路121實施為一RC低通濾波器電路。 圖6係圖解說明可被併入於本發明之實施例中之時脈時間調整電路之時脈頻率偵測電路中之一RC低通濾波器電路之一電路圖。參考圖6,低通濾波器121實施為一RC電路,該RC電路包含連接於輸入端子IN與輸出端子OUT之間的一電阻器R及自輸出端子OUT連接至接地之一電容器C。在某些實施例中,電阻器R不僅可以電阻器元件之形式來實施且亦使用給出一有效電阻之其他可用裝置(諸如一NMOS電晶體,其閘極被約束成高於NMOS臨限值電壓)來實施。類似地,電容器C可實施有除一電容器元件之外之裝置,諸如一MIM (金屬-絕緣體-金屬)電容器或一MOS (金屬-氧化物-矽)電容器。將輸入時脈信號CLK提供至輸入端子IN,且電阻器R與電容器C之間的共同節點提供經低通濾波輸出信號。因此組態,RC電路之電阻器及電容器之電阻及電容判定低通濾波器121之臨限值頻率。RC電路之電阻或電容可經調整以設定期望頻率臨限值以用於在時脈頻率偵測電路110中進行頻率偵測。特定而言,RC低通濾波器121之頻率臨限值判定輸出信號FASTCLK將被確證(邏輯高)之頻率。 在本實施例中,將由低通濾波器121濾除具有高於臨限值頻率之一時脈頻率之一輸入時脈信號。然後,時脈正反器電路122將鎖存一邏輯高信號且將產生具有一邏輯高值之輸出信號FASTCLK,從而指示一高時脈頻率。另一方面,具有低於臨限值頻率之一時脈頻率之一輸入時脈信號將通過低通濾波器121。時脈正反器電路122將鎖存一邏輯低信號且將產生具有一邏輯低值之輸出信號FASTCLK,從而指示一低時脈頻率。 圖7係圖解說明可併入於本發明之實施例中之時脈時間調整電路中之一時脈正反器電路之一電路圖。在本發明之實施例中,時脈正反器電路122可併入於時脈頻率偵測電路110及延時調整電路120中。參考圖7,一時脈正反器電路122具有:一輸入端子IN,其接收待鎖存之一輸入資料;及一時脈輸入端子,其接收一時脈信號。時脈正反器電路122包含由電晶體M0至M3形成之一輸入級、反相器I0至I4及由電晶體M4至M7形成之一輸出級。 在操作中,當輸入時脈處於一邏輯低時,時脈正反器電路122經由輸入端子IN將輸入資料傳遞於第一對背對背反相器I1及I2處。然後,當輸入時脈轉變為一邏輯高時,將鎖存並儲存於反相器I1及I2處之資料傳遞至第二對背對背反相器I3及I4且提供為輸出資料OUT。應理解,通常反相器I2及I4之驅動強度與電晶體M0至M7之驅動強度相比較弱,使得輸入級及輸出級可驅動反相器鎖存器。圖7中所展示之時脈正反器電路122僅係說明性的,且熟習此項技術者將瞭解可使用一時脈正反器電路之其他電路實施方案。時脈正反器電路之確切構造對本發明之實踐而言並不重要。 圖8係圖解說明本發明之實施例中之時脈時間調整電路之延時調整電路之一電路圖。參考圖8,延時調整電路120接收一命令信號(諸如用於一記憶體裝置之一讀取命令或一寫入命令),且連續地通過一系列時脈級或延遲級來將命令信號移位。在本實施例中,時脈級被實施為時脈正反器電路122,其由一時脈信號(諸如輸入時脈信號CLK)計時。鏈路中時脈級之數目判定用於命令信號之期望時間延時。可針對高時脈頻率操作或針對低時脈頻率操作來選擇期望時間延時。命令信號藉由時脈級122移位以產生經時間調整控制信號L-Command,諸如L-Read或L-Write。在本實施例中,使用圖7之時脈正反器電路來實施時脈級122。在其他實施例中,其他時脈延遲電路可用於實施時脈級。 在一項實例中,時脈級之數目提供在低時脈頻率操作期間所需之一時間延時。在另一實例中,時脈級之數目提供在高時脈頻率操作期間所需之一時間延時。舉例而言,耦合至時脈積體電路之一外部系統可規定自讀取命令之發出至由該外部系統在時脈積體電路之輸出處進行之對讀取資料之讀取之一讀取延時時間。然後,延時調整電路120可組態有一時脈級鏈,該時脈級經選擇以滿足在低時脈頻率操作下之讀取延時要求。 在另一實例中,耦合至時脈積體電路之一外部系統可規定自寫入命令之發出至在時脈積體電路之輸入墊處提供寫入資料之一寫入延時時間。然後,延時調整電路120可組態有一時脈級鏈,該時脈級經選擇以滿足在低時脈頻率操作下之寫入延時時間。 在本實施例中,所使用之時脈級之數目對應於時脈積體電路之低頻率操作所需之延時。延時調整電路120亦自時脈頻率偵測電路110接收FASTCLK信號。將FASTCLK信號提供至一個級跳過電路124以作為啟用-跳過ENSKIP信號。將級跳過電路124插入於一系列時脈級122中。在本實施例中,級跳過電路124經插入以能夠跳過一個時脈級。在其他實施例中,延時調整電路120可經組態以能夠跳過兩個或兩個以上時脈級,如下文將更詳細地闡釋。圖8之延時調整電路120之電路構造僅係說明性的並不意欲係限制性的。 在操作中,當FASTCLK信號被確證或處於一邏輯高位準時,啟用級跳過電路124以繞過一個時脈正反器電路122。以此方式,透過一系列時脈正反器電路122移位之命令信號已繞過一個時脈循環延遲。因此,將命令信號提前一個時脈循環。將比在低頻率操作中提早一個時脈循環來確證經時間調整控制信號L-Command。在一記憶體讀取操作之實例中,針對高時脈頻率提早一個時脈循環提供經時間調整控制信號L-Read導致在正確時間提供讀取資料以供鎖存至讀取FIFO中。讀取FIFO以適當次序儲存待緩衝及驅動至同步記憶體電路外部之讀取資料。在一高時脈頻率下,內部控制信號L-Read不可及時到達以存取記憶體陣列。然而,當由時脈頻率偵測電路110偵測到一高時脈頻率時,本發明之延時調整電路120將L-Read控制信號提前,使得可提早自記憶體陣列存取讀取資料,且然後讀取資料可在期望時間處到達讀取FIFO以供鎖存。 另一方面,當FASTCLK信號被解除確證或處於一邏輯低位準時,不啟用級跳過電路124且不繞過時脈正反器電路122。以此方式,控制信號L-Read未被提前,而係經歷一系列時脈正反器電路122中之所有延遲。在低頻率操作中,在指定時間處確證控制信號L-Read。 如上文所闡述,在延時調整電路120之其他實施例中,級跳過電路124可經組態以繞過一或多個時脈級122以提供期望之時間調整。在一項實例中,級跳過電路124可經組態以藉由將級跳過電路124放置在兩個時脈正反器電路122之後而繞過兩個時脈級122。 在另一實施例中,可由一時脈頻率偵測電路110產生一多位元FASTCLK信號(諸如FASTCLK<n:0>)。舉例而言,時脈頻率偵測電路110可實施為時脈頻率偵測電路之多個例項,其中每一實例之低通濾波器經組態以用於一不同頻率偵測臨限值。在一項實例中,可使用一組慢頻率臨限值、中等頻率臨限值、快頻率臨限值及極快頻率臨限值。時脈頻率偵測電路之每一例項產生一各別FASTCLK信號,該例項之所有FASTCLK信號一起形成FASTCLK<n:0>信號。然後,FASTCLK<n:0>之每一位元將與待跳過之一不同數目個時脈級相關聯。舉例而言,可使用級跳過電路124之多個例項,其中每一實例由一各別FASTCLK<n:0>信號驅動。 在上文所闡述之實施例中,延時調整電路120被闡述為經實施以跳過一或多個時脈級。亦即,級跳過電路124通常被停用,使得在低頻率操作中使用延時調整電路120中之全系列時脈級。當FASTCLK信號被確證時,啟用級跳過電路124以跳過或自延時調整電路中之一系列時脈級移除一或多個時脈級。在本實施例中,將FASTCLK信號提供至級跳過電路124之啟用跳過ENSKIP輸入信號。 在本發明之其他實施例中,延時調整電路120可經組態以新增一或多個時脈級,使得經時間調整命令信號L-Command因低頻率操作被延遲。因此,延時調整電路120組態有通常被級跳過電路124繞過之額外時脈級。亦即,在替代實施例中,通常在低頻率操作中啟用級跳過電路124以繞過或跳過額外時脈級,使得在剩餘時脈級之情況下操作延時調整電路120。然而,當FASTCLK信號被確證時,停用級跳過電路124使得將額外時脈級插入於一系列時脈級中。以此方式,經時間調整控制信號L-Command將通過額外時脈級,藉此將控制信號L-Command延遲額外時脈循環。在一項實施例中,延時調整電路120可經組態以藉由使用FASTCLK信號之一反相來新增一或多個時脈級以控制級跳過電路124之啟用跳過ENSKIP輸入信號。 在其他實施例中,所使用之時脈級之數目可對應於時脈積體電路之高頻率操作所需之延時,且級跳過電路124可經組態以跳過或插入時脈級低時脈頻率操作。 圖9係圖解說明本發明之實施例中之延時陣列存取啟動電路之級跳過電路之一電路圖。參考圖9,級跳過電路接收:啟用跳過輸入信號ENSKIP;及一IN_SKIP信號,其連接至待被繞過之一時脈級之輸入;及一IN_NORMAL信號,其連接至待被繞過之時脈級之輸出。啟用跳過輸入信號ENSKIP經組態以將信號IN_SKIP或信號IN_NORMAL引導至級跳過電路124之輸出端子。 在將信號FASTCLK提供為啟用跳過輸入信號ENSKIP之事件中,當信號FASTCLK被確證時級跳過電路124選擇IN_SKIP信號以移除一個時脈級,且當信號FASTCLK被解除確證時級跳過電路124選擇IN_NORMAL信號以在正常操作中使用全系列時脈級。 在將信號FASTCLK之反相提供為啟用跳過輸入信號ENSKIP之事件中,當信號FASTCLK被指示時級跳過電路124選擇IN_NORMAL信號以將額外時脈級新增至時脈級系列,且當信號FASTCLK被解除確證時級跳過電路124選擇IN_SKIP信號以移除額外時脈級,使得在正常操作中僅使用全系列時脈級。 在圖8中所闡述之實施例中,延時調整電路經組態以跳過時脈級鏈中之第一時脈級。在其他實施例中,延時調整電路可經組態以跳過時脈級鏈內之任何時脈級。另一選擇係,延時調整電路可經組態以在沿著時脈級鏈之任何位置處新增時脈級。 上文之圖8及9圖解說明延時調整電路之一個例示性實施例,其中使用一時脈級鏈或延遲級鏈將時間延時引入至命令信號且藉由新增或移除一或多個時脈級來調整時間延時。使用一時脈級鏈或一延遲級來在將可調整時間延時引入延時調整電路中僅係說明性的並不意欲係限制性的。在其他實施例中,延時調整電路可使用一計數器電路來對時脈循環之數目進行計數,且使用回應於FASTCLK信號而產生一選擇信號之一選擇電路來選擇期望之時脈循環數目。然後,藉由選定時脈循環數目將命令信號移位。 圖10係圖解說明本發明之實施例中之一同步記憶體裝置之一讀取操作之一時序圖。圖10之時序圖圖解說明其中以一低輸入時脈頻率執行讀取操作之情形。在一讀取操作中,同步記憶體裝置在時脈循環0處接收一讀取命令信號且稍後在一給定數目個時脈循環(稱為讀取延時或RL時脈循環)處期望有效讀取資料。在本發明實例中,時脈時間調整電路透過時脈級鏈移位讀取命令,使得在RL-4時脈循環處確證控制信號L-Read。 值得注意的係,雖然基於輸入時脈而產生同步記憶體裝置之控制信號,但記憶體陣列操作為一類比電路且產生具有RC延遲或傳播延遲之輸出信號,所產生之輸出信號並不基於輸入時脈之時脈循環。此外,RC延遲或傳播延遲並不隨時脈頻率而變化。亦即,隨著時脈頻率增大,RC延遲或傳播延遲可保持不變且因此變成高頻率時脈循環之一較大部分或較大數目個高頻率時脈循環,從而導致可能之衝突事件。 在圖10中所展示之實例中,在確證控制信號L-Read之情況下,存取記憶體陣列以在選定記憶體位置處讀出資料。自控制信號L-Read之確證至讀取資料自記憶體陣列產生之延遲係未必由時脈循環支配之一類比傳播延遲。然後在某一傳播延遲之後,將讀取資料傳輸至讀取FIFO。然後在時脈信號CLK2R 之控制下,讀取資料自FIFO讀出而至輸出資料墊以作為輸出資料DOUT。在此情形中,在輸入時脈於一低時脈頻率下運行之情況下,讀取資料在RL時脈循環處可用且有效資料被讀出。 圖11係圖解說明在某些實例中一同步記憶體裝置在一高時脈頻率下且在無時間延時調整之情況下之一讀取操作之一時序圖。記憶體讀取操作以與上文參考圖10所闡述相同之方式進行。然而,隨著讀取命令信號被傳播通過延時時脈鏈,存在自時脈信號RL-4之上升時脈邊緣至控制信號L-Read之上升邊緣之一固有延遲,在圖11中表示為「延遲」。當時脈頻率係低時,此固有延遲可忽略不計。然而,當鐘頻率係高時,此固有延遲變成時脈週期之一大部分。因此,在控制信號L-Read確證被延遲之情況下,來自記憶體陣列之讀出資料亦被延遲,使得讀出資料無法及時到達讀取FIFO以供鎖存並在讀取延時時脈循環RL處讀出。在本圖解說明中,有效讀出資料將在RL時脈循環之後的一個時脈循環時才到達。然而,由於一接收系統期望在時脈循環RL處自記憶體裝置讀出資料,因此讀出無效資料以作為輸出資料。 圖12係圖解說明在本發明之實施例中一同步記憶體裝置在一高時脈頻率下且在施加時間延時調整之情況下之一讀取操作之一時序圖。在圖12中所展示之記憶體讀取操作中,時脈時間調整電路偵測高輸入時脈頻率且組態延時調整電路以跳過讀取命令之一或多個時脈循環。如圖12中所展示,藉由跳過一時脈循環(舉例而言,+3時脈循環)來產生經時間調整控制信號L-Read,使得在RL-5時脈循環時(在RL-4時脈循環之前)確證控制信號L-Read。甚至在具有L-Read信號邊緣之確證延遲之情況下,仍能夠自記憶體陣列檢索所讀出資料,將所讀出資料提供至讀取FIFO且然後可在預期時脈循環RL處讀出以作為輸出資料DOUT。因此,藉由調整控制信號L-Read之時間延時,甚至在一高輸入時脈頻率下仍可讀出有效資料。 圖13係圖解說明在本發明之實施例中一同步記憶體裝置之一寫入操作之一時序圖。圖13之時序圖圖解說明其中以一低輸入時脈頻率下執行寫入操作之情形。在一寫入操作中,同步記憶體裝置在一時脈循環0處接收一寫入命令信號且稍後在給定數目個時脈循環(稱為寫入延時或WL時脈循環)處提供有效寫入資料。在輸入緩衝器處擷取寫入資料且然後將其傳送至記憶體陣列以供寫入至選定記憶體單元中。然而,在於輸入緩衝器處擷取寫入資料之時間與將寫入資料傳播至記憶體陣列之時間之間存在一類比傳播延遲。此傳播延遲不基於時脈循環且不隨時脈頻率而變化。在本發明實例中,時脈時間調整電路透過時脈級鏈移位寫入命令,使得控制信號L-Write在時脈循環t1處被確證。在低輸入時脈頻率下,控制信號L-Write與寫入資料同時到達且在記憶體陣列處擷取有效寫入資料。 圖14係圖解說明在某一實例中一同步記憶體裝置在一高時脈頻率下且在無時間延時調整之情況下之一寫入操作之一時序圖。記憶體讀取操作以與上文參考圖13所闡述相同之方式進行。然而,由於寫入資料之傳播延遲,當在時脈循環t1處確證控制信號L-Write時,有效寫入資料尚未到達記憶體陣列。因此,並不由控制信號L-Write擷取有效寫入資料。因此,代替期望寫入資料,將無效資料寫入至記憶體陣列。 圖15係圖解說明在本發明之實施例中一同步記憶體裝置在一高時脈頻率下且在施加時間延時調整之情況下之一寫入操作之一時序圖。在圖15中所展示之記憶體寫入操作中,時脈時間調整電路偵測高輸入時脈頻率且組態延時調整電路以新增寫入命令之一或多個時脈循環。因此,控制信號L-Write被延遲一個時脈循環且直至時脈循環t2為止才被確證。以此方式,提供額外時間以允許寫入資料到達記憶體陣列。在時脈循環t2處,當有效寫入資料已到達記憶體陣列時確證控制信號L-Write且執行一有效寫入操作。 在上文所闡述之實施例中,時脈時間調整電路經組態以針對高頻率讀取操作在一同步記憶體裝置中移除或跳過時脈級,且經組態以針對高頻率寫入操作在一同步記憶體裝置中新增時脈級。上文所闡述之對一同步記憶體裝置中之時脈時間調整電路之操作僅係說明性的並不意欲係限制性的。在其他實施例中,時脈時間調整電路可經組態以針對低或高頻率讀取操作在一同步記憶體裝置中移除或新增時脈級。此外,在其他實施例中,時脈時間調整電路可經組態以針對低或高頻率寫入操作在一同步記憶體裝置中移除或新增時脈級。 儘管已出於清晰理解之目的在某些細節上闡述前述實施例,但本發明並不限於所提供之細節。存在實施本發明之諸多替代方式。所揭示之實施例係說明性的而非限制性的。The invention can be implemented in numerous ways, including as a process, a device, a system, and / or a substance. In this specification, these embodiments or any other form that the invention may take may be referred to as technology. Generally, the order of the steps of the disclosed processes may be changed within the scope of the present invention. The following provides a detailed description of one or more embodiments of the invention, together with the accompanying drawings, which illustrate the principles of the invention. The present invention is described in conjunction with these embodiments, but the present invention is not limited to any embodiment. The scope of the invention is limited only by the scope of the patent application and the invention encompasses numerous alternatives, modifications and equivalents. Numerous specific details are set forth in the following description in order to provide a thorough understanding of the present invention. These details are provided for the purpose of example, and the invention may be practiced according to the scope of the patent without some or all of these specific details. For the purpose of clarity, technical material that is known in the technical fields related to the invention has not been described in detail, so the invention is not unnecessarily obscured. According to an embodiment of the present invention, a clock time adjustment circuit is incorporated in a clock product circuit to detect an input frequency or an operating frequency range of an input clock of the clock product circuit and adjust an internal control. The time delay of the signal is used to access a memory element in the clock product circuit. The clock product circuit receives a command signal to access the memory elements in the clock product circuit. The command signal is used to generate an internal control signal, and the generated internal control signal is routed to the memory element of the clock product circuit to access the memory element. The clock time adjustment circuit introduces an adjustable time delay to the internal control signal derived from the command signal. In an embodiment of the present invention, the clock time adjustment circuit operates in response to the frequency detection to shift or adjust the time delay of the internal control signal during operation, so that the clock-based operation is advanced or delayed by one or more hours. Pulse cycle. The clock timing adjustment circuit of the present invention enables the clock product circuit to operate over a wide frequency range, while ensuring that unwanted data conflict events are avoided without introducing unnecessary delays. The clock time adjustment circuit can be implemented without using a mode register setting command or other non-conventional operating procedures. Instead, the clock time adjustment circuit can be operated in real time during normal circuit operation or "on the fly" to adjust the internal time signal to avoid data conflicts. The clock timing adjustment circuit of the present invention can be advantageously applied to memory circuits such as dynamic random access memory (DRAM), NAND flash memory, static random access memory (SRAM), or other types of volatile Memory or non-volatile memory. The clock timing adjustment circuit of the present invention can also be advantageously applied to a logic circuit, such as a microprocessor integrated circuit. Generally, the clock timing adjustment circuit of the present invention can be applied to any clock integrated circuit or synchronous integrated circuit including a memory element such as a memory on a chip. The clock timing adjustment circuit can be advantageously used to adjust the timing of the internal memory access control signals to avoid conflict events that may occur during memory access operations such as read operations and write operations of memory elements. More specifically, in the embodiment of the present invention, the clock time adjustment circuit detects that the input clock of the clock product circuit is running slowly (at a low frequency) or running fast (at a high frequency). Frequency). The clock time adjustment circuit generates an internal control signal based on a command signal received by the clock product circuit and uses a predetermined adjustable time delay amount. The clock time adjustment circuit adjusts the time delay of the internal control signal based on the detected frequency of the input clock and according to the command signal. In one example, in response to detecting that the input clock is at a low frequency, the clock time adjustment circuit uses a predetermined time delay to generate an internal control signal. However, in response to detecting that the input clock is at a high frequency, the clock time adjustment circuit generates an internal control signal that is advanced or delayed by one or more clock cycles relative to a predetermined time delay. In another example, in response to detecting that the input clock is at a high frequency, the clock time adjustment circuit uses a predetermined time delay to generate an internal control signal. At the same time, in response to detecting that the input clock is at a low frequency, the clock time adjustment circuit generates an internal control signal that is advanced or delayed by one or more clock cycles relative to a predetermined time delay. In particular, the clock timing adjustment circuit may generate an internal control signal that is one or more clock cycles in advance by removing one or more clock cycles based on a predetermined time delay. Advancing a control signal by one or more clock cycles will introduce one or more additional clock cycles to provide time margin for downstream data operations. In a clock memory circuit, advancing a control signal in advance results in advance of reading data for a particular data reading operation, as will be explained in more detail below. On the other hand, the clock time adjustment circuit may generate an internal control signal delayed by one or more clock cycles by adding one or more clock cycles based on a predetermined time delay. Delaying a control signal by one or more clock cycles will introduce one or more additional clock cycles into the internal signal path of a clock product circuit. In a clock memory circuit, delaying a control signal causes a data delay for a specific data write operation, as described in more detail below. In an embodiment of the present invention, the clock timing adjustment circuit of the present invention can be advantageously applied to a memory circuit (such as a dynamic random access memory (DRAM), a NAND flash memory) or a logic circuit (such as a microcomputer). processor). In the following description, the application of the clock timing adjustment circuit of the present invention in a memory device and a microprocessor device will be described with specific implementation details provided for the synchronous memory circuit. However, those skilled in the art will understand that the clock time adjustment circuit of the present invention can be applied to any clock integrated circuit or synchronous integrated circuit to adjust the clock time, thereby avoiding conflicts due to time signal delay on the chip . In particular, the clock time adjustment circuit of the present invention can be applied to any clock integrated circuit or synchronous integrated circuit having a memory element on a chip to adjust the clock time of the control signal to access the memory on the chip. Body components. The on-chip memory element may be an on-chip memory array or a register or a register bank. In this description, a clock integrated circuit or a clock controlled integrated circuit refers to a semiconductor integrated circuit having a circuit driven by a clock signal. The clock integrated circuit is sometimes called a synchronous integrated circuit. An input clock is provided to the synchronous semiconductor integrated circuit, and the internal circuit of the integrated circuit is driven by an input clock or an output derived from one of the input clocks. Examples of the clock product circuit include a clock synchronous memory device and a clock microprocessor device or a synchronous microprocessor device. A clock product circuit is typically coupled to a clock-based (or clock cycle-based) external system that accesses the clock product circuit synchronously. In addition, in this description, a command signal is provided to an integrated circuit so that the integrated circuit performs a function supported by the integrated circuit. In this description, a command signal is different from a bit address signal, and the address signal specifies the position of the function to be applied in the integrated circuit. A command signal is also different from a data signal that provides a data value for a function to be applied. The integrated circuit receives the command signal to generate an internal control signal to control the integrated circuit circuit. In an embodiment of the present invention, the clock product circuit receives a command signal to access a memory element of the clock product circuit. In addition, in some embodiments, the command signal may include a read command signal and a write command signal. FIG. 1 is a block diagram of a synchronous memory device in which a clock timing adjustment circuit can be incorporated in an exemplary embodiment of the present invention. A generalized architecture of a synchronous memory device 10 is shown in FIG. 1 to illustrate the use of the clock timing adjustment circuit of the present invention in a memory circuit. The synchronous memory device 10 may include additional components not shown in FIG. 1 to complete the memory circuit. In addition, the memory architecture shown in FIG. 1 is merely illustrative, and it will be understood that the clock timing adjustment circuits and methods described herein can be used in other memory architectures. In some examples, the synchronous memory device 10 may be configured as a DRAM, SRAM, flash memory, or other types of volatile or non-volatile memory. Referring to FIG. 1, the synchronous memory device 10 includes a two-dimensional array 12 of memory cells 14. The memory cells 14 in the array 12 are accessed by word lines (columns) and bit lines (rows). A row of decoders 18 and a row of decoders 20 address the cell array 12 to selectively access the memory cells 14 in the array 12 for read operations and write operations. Specifically, a bit address ADDR is received at a control circuit 16 and the received address is decoded by a column decoder 18 that selects the word lines of the memory array 12 and a row decoder 20 that selects the bit lines. The column decoder 18 selectively activates a word line and the row decoder selectively activates a bit line to allow access to a memory cell 14 at the intersection of the selected word line and the selected bit line. The synchronous memory device 10 also receives a command signal to control the operation of the memory device. The command signal is received by the control circuit 16, and then one or more control signals are generated based on the command signal. The command signal may include a read command signal for reading data from the memory array or a write command signal for writing data to the memory array. The synchronous memory device 10 may also receive other command signals to support the operation of the memory device. As a synchronous or clock device, the synchronous memory device 10 also receives an input clock signal CLK having a given clock frequency at the control circuit. The control circuit generates an internal clock signal based on the input clock signal CLK to control the operation of the memory circuit. To read data from the clock memory circuit, the sense amplifier 24 senses the read data from the selected memory cell of the memory array 12 and the I / O gate circuit 22 connects the selected positioning element line to the storage. One of the read data reads the FIFO 26. As a clock memory device, the read FIFO 26 is controlled by a clock signal CLK2 R Control, CLK2 R It is the same as or derived from the input clock signal CLK. In response to the clock signal CLK2 R The read data is provided to an output buffer 28 to provide the output data DOUT as one of the circuits and systems external to the synchronous memory device 10. To write data into the clock memory circuit, it is received by the synchronous memory device 10 and more specifically an input buffer 30 receives the written data DIN from external circuits and systems. Then, the written data DIN is transmitted to the clock signal CLK2. W One of the controls is written to the FIFO 32. In response to the clock signal CLK2 W , The written data is latched into the write FIFO 32 from the input buffer 30 and the written data is read from the write FIFO 32 again. The write data is supplied from the write FIFO 32 to the write driver circuit. The write driver circuit drives the write data to the selected positioning element line through the I / O gate control circuit 22 so that the data is stored in the selected memory unit 14. According to an embodiment of the present invention, a clock time adjustment circuit 80 is incorporated in the synchronous memory device 10 to generate a time-adjusted control signal to access the memory array. Specifically, the clock time adjustment circuit 80 receives an input clock signal CLK from the control circuit 16 and also receives command signals such as a read command and a write command from the control circuit 16. The clock time adjustment circuit 80 generates a time adjustment internal control signal based on the detected input clock frequency, such as L-Read for a read command and L-Write for a write command, as described in more detail below. The time-adjusted control signals L-Read and L-Write are coupled to the memory array 12 to control read and write operations to the memory array 12. In some embodiments, the clock timing adjustment circuit 80 may be formed as a part of the control circuit 16. The exact configuration of the clock time adjustment circuit 80 in the synchronous memory device 10 is not important to the practice of the present invention. The only necessary clock timing adjustment circuit 80 generates a time-adjusted control signal to operate the memory array with the desired time adjustment. FIG. 2 is a block diagram of a microprocessor device in which a clock timing adjustment circuit can be incorporated in an exemplary embodiment of the present invention. Referring to FIG. 2, a microprocessor device or a microprocessor integrated circuit 50 includes various functional blocks 52 such as an arithmetic logic unit (ALU), a random access memory (RAM), a shift register, and a first order Storage device (L1 cache). The functional block 52 is sometimes called a macro block. Many of the macro blocks 52 are clock circuits, and the clock circuit needs to transmit data back and forth through the silicon of the integrated circuit over a large distance. Propagation delays in the data signal path can cause data to reach the destination macro block outside the expected clock cycle. Therefore, in some embodiments, a clock timing adjustment circuit 80 of the present invention is incorporated into the microprocessor device 50 to adjust the timing of control signals used to transfer data between functional blocks or macro blocks. . For example, the clock timing adjustment circuit 80 receives an input clock signal CLK from the microprocessor device 50 and also receives a command signal. The clock time adjustment circuit 80 generates a time-adjusted control signal L-command, which can be used to control the macro block 1 and / or the macro block 2 to promote data in the macro block of the microprocessor device. Time to time. In some examples, the command signal is used to access a memory element in the macro block 52 and the command signal may be a read command signal or a write command signal. The clock timing adjustment circuit of the present invention can be incorporated into other logic circuits than a microprocessor integrated circuit. The microprocessor integrated circuit of FIG. 2 is merely illustrative and is not intended to be limiting. FIG. 3 (a) is a block diagram of a clock timing adjustment circuit in some embodiments of the present invention. Referring to FIG. 3 (a), a clock time adjustment circuit 80 includes a clock frequency detection circuit 82 and a delay adjustment circuit 86. The clock frequency detection circuit 82 receives an input clock signal CLK of the clock product circuit and generates a clock detection output signal FASTCLK. The clock frequency detection circuit 82 detects the clock frequency of the input clock signal CLK to determine whether the input clock signal CLK is higher than a predetermined frequency threshold or lower than a predetermined frequency threshold. In this description, a frequency above a frequency threshold is referred to as a high-frequency clock, and a frequency below a frequency threshold is referred to as a low-frequency clock. For example, in an application, a high frequency clock is considered to be greater than 500 MHz. Therefore, in one embodiment, the frequency threshold is 500 MHz. An input clock frequency of 500 MHz or higher is considered as a high clock frequency, and an input clock frequency below 500 MHz is considered as a low clock frequency. When the input clock frequency is equal to or greater than the frequency threshold, the clock frequency detection circuit 82 confirms the FASTCLK output signal to indicate a high clock frequency. Otherwise, deassert the FASTCLK output signal to indicate a low clock frequency. The delay adjustment circuit 86 receives the FASTCLK signal from the clock frequency detection circuit 82 and also receives the command signal received by the clock product circuit and also receives the input clock signal CLK. The delay adjustment circuit 86 generates an internal control signal L-Command based on the command signal and in response to the FASTCLK signal. In operation, the delay adjustment circuit 86 is configured to add a given amount of time delay to the command signal to generate a control signal L-Command. The time delay amount is given as the number of clock cycles or clock cycles of the input clock signal, and can represent the time delay of the internal control signal expected in the low frequency operation mode or the high frequency operation mode. That is, the predetermined time delay amount introduced by the delay adjustment circuit 86 may have a delay value suitable for operating the clock product circuit at a low clock frequency. Alternatively, the predetermined time delay amount introduced by the delay adjustment circuit 86 may have a delay value suitable for operating the clock product circuit at a high clock frequency. Then, depending on the state of the FASTCLK signal, the delay adjustment circuit 86 adjusts the time delay by adding a clock cycle or removing the clock cycle from a predetermined time delay, thereby delaying or advancing the internal control signal L-Command. In one example, the delay adjustment circuit 86 does not apply time adjustment when the FASTCLK signal is deasserted. Therefore, the control signal L-Command is generated with a predetermined time delay for low-frequency operation. On the other hand, the delay adjustment circuit 86 applies a time adjustment when the FASTCLK signal is verified. Therefore, the control signal L-Command generates an adjusted time delay for high frequency operation. Time adjustment may involve advancing the control signal by one or more clock cycles with respect to low frequency operation. Time adjustment may also involve delaying the control signal by one or more clock cycles with respect to low frequency operation. Then, the time-adjusted control signal is used to access the memory elements of the clock product circuit. Because of this configuration, the time-adjusted control signal ensures that the data signals transmitted in the clock product circuit are captured at the correct time and collision events are avoided. In other examples, the delay adjustment circuit 86 may be configured to operate in the opposite way: that is, no time adjustment is applied when the FASTCLK signal is asserted, and time adjustment is applied when the FASTCLK signal is deasserted. A clock product circuit typically receives multiple command signals that will need to be time adjusted based on the input clock frequency to ensure proper circuit operation without conflict events. For example, in a clock product circuit including a memory element, the clock product circuit may receive a read command to read data from the memory element and write data to the memory element. One write command. Therefore, the clock product circuit may include a separate instance of the clock time adjustment circuit 80 for each command signal. That is, the clock timing adjustment circuit 80 can be repeated for each command signal. In an alternative embodiment, the clock timing adjustment circuit may be configured to detect a plurality of command signals of the circuit using a common clock frequency. FIG. 3 (b) is a block diagram of a clock timing adjustment circuit in an alternative embodiment of the present invention. Referring to FIG. 3 (b), a clock time adjustment circuit 90 is configured to generate internal control signals for two command signals (Command 1 and Command 2) received by the integrated circuit. The clock timing adjustment circuit 90 is configured to generate a single clock frequency detection circuit 82 of a FASTCLK signal to indicate a low clock frequency or a high clock frequency. The clock time adjustment circuit 90 is configured with two examples of the delay adjustment circuits 86-1 and 86-2. Each delay adjustment circuit instance receives a FASTCLK signal, an input clock signal CLK, and a respective command signal. The delay adjustment circuit 86-1 generates a time-adjusted control signal L-Command1, and the delay adjustment circuit 86-2 generates a time-adjusted control signal L-Command2. In the case of multiple command signals, when the same frequency threshold can be applied to two command signals, the configuration of the clock time adjustment circuit 90 of FIG. 3 (b) provides the advantage of simplifying the circuit. In this case, a single clock frequency detection circuit 82 is required to generate the FASTCLK signal to adjust the delay time of multiple command signals. Each delay adjustment circuit 86 can have the same or different time delay amount, and can be configured to add or remove clock cycles according to the command signal. In other examples, the clock product circuit can be configured with multiple examples of the clock time adjustment circuit 80 of FIG. 3 (a) for multiple command signals. In this way, it is possible to apply different frequency thresholds to different command signals. For example, a read command signal may be processed using a frequency threshold of 500 MHz, and a write command signal may be processed using a frequency threshold of 600 MHz. In this case, separate instances of the clock time adjustment circuit 80 are used for read commands and write command signals, and the clock frequency detection circuit 82 in each instance of the clock time adjustment circuit 80 is configured to Used for desired frequency threshold. The clock timing adjustment circuit of the present invention realizes many advantages over the conventional collision avoidance method used in the clock product circuit. First, the clock timing adjustment circuit of the present invention can be advantageously applied to a clock or synchronous integrated circuit designed to operate over a wide range of input clock frequencies. The clock time adjustment circuit operates to adjust internal control signals based on the input clock frequency to avoid conflict events and ensure effective operation over the entire input clock frequency range. Second, the use of the clock timing adjustment circuit of the present invention in a clock product circuit avoids the need to use extra depth FIFO / output buffer circuit blocks to handle the need to read data. The use of the clock time adjustment circuit of the present invention in a clock product circuit can also avoid the need to use an extra depth FIFO / input register in the memory array to process written data. It is not advisable to use the extra depth FIFO as an output buffer or an input register because it requires additional silicon area and increases the size of the integrated circuit, thereby increasing the cost of the integrated circuit. The clock timing adjustment circuit of the present invention can be incorporated into a clock product circuit to reduce costs and improve speed performance while reducing power consumption. FIG. 4 illustrates a block diagram of a read path and a write path of a synchronous memory device incorporated in a clock time adjustment circuit in an embodiment of the present invention. Referring to FIG. 4, a synchronous memory device 100 includes a first example 80a of a clock time adjustment circuit in a read path for a read command, and a clock time adjustment in a write path for a write command. One of the second examples of the circuit is 80b. In this embodiment, separate examples of the clock time adjustment circuit are used for the read command signal and the write command signal. In this way, the same or different frequency thresholds can be used in each instance of the clock time adjustment circuit. In other embodiments, the clock timing adjustment circuit 90 of FIG. 3 (b) may be used, wherein the read signal path and the write signal path may share the same clock frequency detection circuit. Referring to FIG. 4, in the read path, the clock time adjustment circuit 80 a receives an input clock signal CLK, and the input clock signal CLK is provided to the input clock or system clock of the synchronous memory device 100. The clock time adjustment circuit 80a also receives a read command provided to the synchronous memory device 100 when a read operation is expected. The input clock signal CLK is provided to the clock frequency detection circuit 110a, and the clock frequency detection circuit 110a generates a FASTCLK signal. Then, the FASTCLK signal and the read command are provided to the delay adjustment circuit 120a to generate the time-adjusted control signal L-Read. Then, the time-adjusted control signal L-Read is used to access the memory array 130 in a read operation. It is assumed that the memory device 100 has received a bit address signal ADDR to select a memory location in the memory array 130 for reading data. Under the control of the time-adjusted control signal L-Read, the memory array 130 provides read data from a selected memory unit and the read data is provided to a FIFO / output buffer containing a read FIFO Circuit 140. The FIFO / output buffer circuit 140 provides the read data DOUT as an output signal of the synchronous memory device 100. The read FIFO in the FIFO / output buffer circuit 140 consists of a clock signal CLK2. R Control, clock signal CLK2 R It is derived from the input clock signal CLK or derived from the input clock signal CLK. In the embodiment of the present invention, the clock time adjustment circuit 80a is used to advance the time-adjusted control signal L-Read by one or more clock cycles in response to the input clock signal CLK having a high clock frequency. In some embodiments, when the input clock signal CLK has a clock frequency higher than a predetermined frequency threshold, the clock frequency detection circuit 110a determines that the input clock signal CLK has a high clock frequency and Verify the FASTCLK signal. When the input clock frequency is determined to be a high clock frequency, the delay adjustment circuit 120a adjusts the control signal L by removing one or more clock cycles so that the control signal L-Read is advanced by one or more clock cycles. -Read time delay. In this way, the control memory array 130 provides read data one or more clock cycles earlier in high-frequency operation, so that the read data can reach the FIFO / output buffer 140 early enough to use the clock signal CLK2 R The desired read delay is latched into the read FIFO, which is typically specified by a system coupled to the memory device to access data stored on the memory device. On the other hand, when the input clock has a low clock frequency (that is, a clock frequency below one of the frequency thresholds), the clock frequency detection circuit 110a does not verify the FASTCLK signal and the delay adjustment circuit 120a does not adjust the time In the case of delay, the control signal L-Read is generated. In this way, the read data will arrive at the FIFO / output buffer 140 at the desired time and be clocked by the clock signal CLK2 at the desired read delay time. R It is latched into the read FIFO and sent out to the output data pad. In the write path, the clock time adjustment circuit 80b receives the input clock signal CLK and also receives a write command provided to the synchronous memory device 100 when a write operation is expected. The input clock signal CLK is provided to the clock frequency detection circuit 110b, which generates the FASTCLK signal in the same manner as explained above with reference to the clock time adjustment circuit 80a. Then, the FASTCLK signal and the write command are provided to the delay adjustment circuit 120b to generate a time-adjusted control signal L-Write. Then, the time-adjusted control signal L-Write is used to control the memory array 130 in a write operation. For example, the time-adjusted control signal L-Write is used to control a bank to write to the data buffer 135. In particular, the memory array 130 is generally divided into a plurality of memory cell banks and each memory cell bank may have been associated with a bank write data buffer for storing write data for its memory bank. In this illustration, the control signal L-Write is coupled to control the bank write data buffer 135 to provide the write data to the memory array 130 to be written to the selected memory unit. It is assumed that the memory device 100 has received an address signal ADDR for selecting a memory location in the memory array 130 for writing data. It is also assumed that the memory device 100 has received the input data DIN to be written to the memory location specified by the address signal. In a write operation, the synchronous memory device 100 receives input data DIN to be written to data in a memory location specified by the address signal ADDR. The input data DIN is stored in an input buffer / FIFO circuit 145 containing a write FIFO. The write FIFO in the input buffer / FIFO circuit 145 receives a clock signal CLK2. W Control, clock signal CLK2 W It can be derived from the input clock signal CLK or derived from the input clock signal CLK. In response to the clock signal CLK2 W The input data stored in the write FIFO is unlocked from the FIFO and provided to the library write data buffer 135. Under the control of the time-adjusted control signal L-Write, the write data stored in the bank write data buffer 135 is written into the selected memory unit. In the embodiment of the present invention, the clock timing adjustment circuit 80b is configured to delay the time-adjusted control signal L-Write by one or more clock cycles in response to the input clock signal CLK having a high clock frequency. In some embodiments, when the input clock signal CLK has a clock frequency higher than a predetermined frequency threshold, the clock frequency detection circuit 110b determines that the input clock signal CLK has a high clock frequency and Verify the FASTCLK signal. When the input clock frequency is determined to be a high clock frequency, the delay adjustment circuit 120b adjusts the control signal L by adding one or more clock cycles so that the control signal L-Write is delayed by one or more clock cycles. -Write time. In this way, the control signal L-Write is delayed during a high clock frequency, so that written data has time to reach the bank write data buffer 135 before the control L-Write is verified. On the other hand, when the input clock has a low clock frequency (that is, a clock frequency below one of the predetermined frequency thresholds), the clock frequency detection circuit 110b does not verify the FASTCLK signal and the delay adjustment circuit 120b is not adjusting. In the case of time delay, the control signal L-Write is generated. At a low clock frequency, the written data arrives at the library write data buffer 135 at a time that matches the control signal L-Write, so that the correctly written data is written into the memory array 130. FIG. 5 is a block diagram illustrating a clock frequency detection circuit of a clock time adjustment circuit according to an embodiment of the present invention. Referring to FIG. 5, a clock frequency detection circuit 110 includes: a low-pass filter 121 configured to receive an input clock signal CLK; and one or more clock flip-flop circuits 122 configured to Generate the output signal FASTCLK. The clock flip-flop circuit 122 is controlled by an input clock signal CLK. The clock frequency detection circuit 110 may further include one or more inverters 123 as a buffer or a driver of the output signal FASTCLK. In other embodiments of the clock frequency detection circuit, the inverter 123 may be omitted. In the embodiment of the present invention, the clock frequency detection circuit 110 uses a low-pass filter 121 to detect a clock speed or a clock frequency. The low-pass filter 121 is configured to allow low-speed clock frequency signals to pass through while blocking or filtering high-speed clock frequency signals. Then, the clock flip-flop stage 122 captures or latches the low-pass filtered clock signal. The clock flip-flop circuit 122 generates an output signal FASTCLK having a logic high value in response to a detected high clock frequency, or generates an output signal having a logic low value in response to a detected low clock frequency. FASTCLK. In some embodiments, the low-pass filter 121 is configured to have a predetermined frequency value as one of the frequency detection thresholds. The low-pass filter 121 can detect a clock signal higher than a predetermined frequency threshold to have a high clock frequency or a high clock speed. The low-pass filter 121 can detect a clock signal below a predetermined frequency threshold to have a low clock frequency or a low clock speed. In some embodiments, the low-pass filter circuit 121 is implemented as an RC low-pass filter circuit. FIG. 6 is a circuit diagram illustrating an RC low-pass filter circuit in a clock frequency detection circuit of a clock timing adjustment circuit that can be incorporated in an embodiment of the present invention. Referring to FIG. 6, the low-pass filter 121 is implemented as an RC circuit including a resistor R connected between the input terminal IN and the output terminal OUT and a capacitor C connected from the output terminal OUT to the ground. In some embodiments, the resistor R may not only be implemented in the form of a resistor element but also use other available devices (such as an NMOS transistor whose gate is constrained to be higher than the NMOS threshold value) that gives an effective resistance Voltage). Similarly, the capacitor C may be implemented with a device other than a capacitor element, such as a MIM (metal-insulator-metal) capacitor or a MOS (metal-oxide-silicon) capacitor. An input clock signal CLK is provided to the input terminal IN, and a common node between the resistor R and the capacitor C provides a low-pass filtered output signal. Therefore, the resistance and capacitance of the resistor and capacitor of the RC circuit determine the threshold frequency of the low-pass filter 121. The resistance or capacitance of the RC circuit can be adjusted to set a desired frequency threshold for frequency detection in the clock frequency detection circuit 110. Specifically, the frequency threshold of the RC low-pass filter 121 determines the frequency at which the output signal FASTCLK will be verified (logic high). In this embodiment, the input clock signal having one of the clock frequencies higher than a threshold frequency is filtered by the low-pass filter 121. Then, the clock flip-flop circuit 122 will latch a logic high signal and will generate an output signal FASTCLK with a logic high value, thereby indicating a high clock frequency. On the other hand, an input clock signal having one of the clock frequencies below one of the threshold frequencies will pass through the low-pass filter 121. The clock flip-flop circuit 122 will latch a logic low signal and will generate an output signal FASTCLK with a logic low value, thereby indicating a low clock frequency. FIG. 7 is a circuit diagram illustrating a clock flip-flop circuit that can be incorporated in a clock time adjustment circuit in an embodiment of the present invention. In the embodiment of the present invention, the clock flip-flop circuit 122 may be incorporated in the clock frequency detection circuit 110 and the delay adjustment circuit 120. Referring to FIG. 7, a clocked flip-flop circuit 122 has: an input terminal IN that receives an input data to be latched; and a clocked input terminal that receives a clock signal. The clock flip-flop circuit 122 includes an input stage formed of transistors M0 to M3, inverters I0 to I4, and an output stage formed of transistors M4 to M7. In operation, when the input clock is at a logic low, the clock flip-flop circuit 122 passes the input data to the first pair of back-to-back inverters I1 and I2 via the input terminal IN. Then, when the input clock transitions to a logic high, the data latched and stored in the inverters I1 and I2 are passed to the second pair of back-to-back inverters I3 and I4 and provided as output data OUT. It should be understood that the driving strength of the inverters I2 and I4 is generally weaker than that of the transistors M0 to M7, so that the input stage and the output stage can drive the inverter latches. The clocked flip-flop circuit 122 shown in FIG. 7 is merely illustrative, and those skilled in the art will understand other circuit implementations in which a clocked flip-flop circuit may be used. The exact construction of the clocked flip-flop circuit is not important to the practice of the invention. FIG. 8 is a circuit diagram illustrating one of the delay adjustment circuits of the clock time adjustment circuit in the embodiment of the present invention. Referring to FIG. 8, the delay adjustment circuit 120 receives a command signal (such as a read command or a write command for a memory device), and continuously shifts the command signal through a series of clock stages or delay stages. . In this embodiment, the clock stage is implemented as a clock flip-flop circuit 122, which is clocked by a clock signal, such as an input clock signal CLK. The number of clock levels in the link determines the desired time delay for the command signal. The desired time delay can be selected for high clock frequency operation or for low clock frequency operation. The command signal is shifted by the clock stage 122 to generate a time-adjusted control signal L-Command, such as L-Read or L-Write. In this embodiment, the clock stage 122 is implemented using the clock flip-flop circuit of FIG. 7. In other embodiments, other clock delay circuits may be used to implement the clock stage. In one example, the number of clock stages provides one of the time delays required during low clock frequency operation. In another example, the number of clock stages provides a time delay required during high clock frequency operation. For example, an external system coupled to a clock product circuit may specify a read from the issuance of a read command to a read of the read data by the external system at the output of the clock product circuit Delay time. Then, the delay adjustment circuit 120 may be configured with a chain of clock stages, and the clock stage is selected to meet the read delay requirement under low clock frequency operation. In another example, an external system coupled to a clock product circuit may specify a write delay time from the time a write command is issued to providing write data at an input pad of the clock product circuit. Then, the delay adjustment circuit 120 can be configured with a chain of clock stages, and the clock stage is selected to meet the write delay time under low clock frequency operation. In this embodiment, the number of clock stages used corresponds to the delay required for low frequency operation of the clock product circuit. The delay adjustment circuit 120 also receives the FASTCLK signal from the clock frequency detection circuit 110. The FASTCLK signal is provided to a stage skip circuit 124 as an enable-skip ENSKIP signal. A stage skip circuit 124 is inserted into a series of clock stages 122. In this embodiment, the stage skip circuit 124 is inserted to be able to skip a clock stage. In other embodiments, the delay adjustment circuit 120 may be configured to be able to skip two or more clock stages, as will be explained in more detail below. The circuit configuration of the delay adjustment circuit 120 of FIG. 8 is merely illustrative and is not intended to be limiting. In operation, when the FASTCLK signal is asserted or at a logic high level, the stage skip circuit 124 is enabled to bypass a clock flip-flop circuit 122. In this way, the command signal shifted through a series of clock flip-flop circuits 122 has bypassed a clock cycle delay. Therefore, the command signal is advanced by one clock cycle. The clock-adjusted control signal L-Command will be confirmed one clock cycle earlier than in low-frequency operation. In an example of a memory read operation, providing a time-adjusted control signal L-Read one clock cycle earlier for a high clock frequency results in providing read data at the correct time for latching into the read FIFO. The read FIFO stores the read data to be buffered and driven to the outside of the synchronous memory circuit in an appropriate order. At a high clock frequency, the internal control signal L-Read cannot arrive in time to access the memory array. However, when a high clock frequency is detected by the clock frequency detection circuit 110, the delay adjustment circuit 120 of the present invention advances the L-Read control signal so that the read data can be accessed from the memory array earlier, and The read data can then reach the read FIFO for latching at the desired time. On the other hand, when the FASTCLK signal is deasserted or at a logic low level, the stage skip circuit 124 is not enabled and the clock flip-flop circuit 122 is not bypassed. In this manner, the control signal L-Read is not advanced but undergoes all the delays in a series of clock flip-flop circuits 122. In low frequency operation, the control signal L-Read is asserted at a specified time. As explained above, in other embodiments of the delay adjustment circuit 120, the stage skip circuit 124 may be configured to bypass one or more clock stages 122 to provide a desired timing adjustment. In one example, the stage skip circuit 124 may be configured to bypass the two clock stages 122 by placing the stage skip circuit 124 behind the two clock flip-flop circuits 122. In another embodiment, a multi-bit FASTCLK signal (such as FASTCLK <n: 0>) can be generated by a clock frequency detection circuit 110. For example, the clock frequency detection circuit 110 can be implemented as multiple instances of the clock frequency detection circuit, wherein the low-pass filter of each instance is configured for a different frequency detection threshold. In one example, a set of slow frequency thresholds, medium frequency thresholds, fast frequency thresholds, and very fast frequency thresholds may be used. Each instance of the clock frequency detection circuit generates a respective FASTCLK signal, and all the FASTCLK signals of this instance form a FASTCLK <n: 0> signal together. Each bit of FASTCLK <n: 0> will then be associated with a different number of clock levels to be skipped. For example, multiple instances of the stage skip circuit 124 may be used, each of which is driven by a respective FASTCLK <n: 0> signal. In the embodiment set forth above, the delay adjustment circuit 120 is illustrated as being implemented to skip one or more clock stages. That is, the stage skip circuit 124 is generally disabled, so that a full series of clock stages in the delay adjustment circuit 120 is used in low-frequency operation. When the FASTCLK signal is asserted, stage skip circuit 124 is enabled to skip or remove one or more clock stages from a series of clock stages in the delay adjustment circuit. In this embodiment, the FASTCLK signal is provided to the enable skip ENSKIP input signal of the stage skip circuit 124. In other embodiments of the present invention, the delay adjustment circuit 120 may be configured to add one or more clock levels, so that the time-adjusted command signal L-Command is delayed due to low-frequency operation. Therefore, the delay adjustment circuit 120 is configured with an additional clock stage that is usually bypassed by the stage skip circuit 124. That is, in an alternative embodiment, the stage skip circuit 124 is typically enabled in low frequency operation to bypass or skip additional clock stages so that the delay adjustment circuit 120 is operated with the remaining clock stages. However, when the FASTCLK signal is asserted, disabling the stage skip circuit 124 causes additional clock stages to be inserted into a series of clock stages. In this way, the time-adjusted control signal L-Command will pass the extra clock stage, thereby delaying the control signal L-Command by an extra clock cycle. In one embodiment, the delay adjustment circuit 120 may be configured to add one or more clock stages by inverting one of the FASTCLK signals to control the enabling of the stage skip circuit 124 to skip the ENSKIP input signal. In other embodiments, the number of clock stages used may correspond to the delay required for high frequency operation of the clock product circuit, and the stage skip circuit 124 may be configured to skip or insert clock stages that are low Clock frequency operation. FIG. 9 is a circuit diagram illustrating one stage skip circuit of a delay array access enable circuit in an embodiment of the present invention. Referring to FIG. 9, the stage skip circuit receives: the enable skip input signal ENSKIP; and an IN_SKIP signal connected to an input of a clock stage to be bypassed; and an IN_NORMAL signal connected to a time to be bypassed Pulse-level output. The enable skip input signal ENSKIP is configured to direct the signal IN_SKIP or the signal IN_NORMAL to the output terminal of the stage skip circuit 124. In the event that the signal FASTCLK is provided as the enable skip input signal ENSKIP, the stage skip circuit 124 selects the IN_SKIP signal to remove a clock stage when the signal FASTCLK is verified, and the stage skip circuit when the signal FASTCLK is deasserted 124 Select the IN_NORMAL signal to use the full range of clock levels in normal operation. In the event that the inversion of the signal FASTCLK is provided as the enable skip input signal ENSKIP, when the signal FASTCLK is instructed, the time skip circuit 124 selects the IN_NORMAL signal to add an additional clock level to the clock level series, and when FASTCLK is deasserted. The timing skip circuit 124 selects the IN_SKIP signal to remove additional clock stages, so that only the full series of clock stages are used in normal operation. In the embodiment illustrated in FIG. 8, the delay adjustment circuit is configured to skip the first clock stage in the clock stage chain. In other embodiments, the delay adjustment circuit may be configured to skip any clock stage in the clock stage chain. Alternatively, the delay adjustment circuit can be configured to add a clock stage at any position along the clock stage chain. Figures 8 and 9 above illustrate an exemplary embodiment of a delay adjustment circuit in which a clock level chain or a delay level chain is used to introduce time delay to a command signal and by adding or removing one or more clocks Level to adjust the time delay. The use of a chain of clock stages or a delay stage to introduce an adjustable time delay into a delay adjustment circuit is merely illustrative and is not intended to be limiting. In other embodiments, the delay adjustment circuit may use a counter circuit to count the number of clock cycles, and use a selection circuit that generates a selection signal in response to the FASTCLK signal to select the desired number of clock cycles. The command signal is then shifted by selecting the number of clock cycles. FIG. 10 is a timing diagram illustrating a read operation of a synchronous memory device according to an embodiment of the present invention. The timing diagram of FIG. 10 illustrates a case where a read operation is performed at a low input clock frequency. In a read operation, the synchronous memory device receives a read command signal at clock cycle 0 and is expected to be valid at a given number of clock cycles (called a read delay or RL clock cycle) later. Read data. In the example of the present invention, the clock time adjustment circuit shifts the read command through the clock chain, so that the control signal L-Read is verified at the RL-4 clock cycle. It is worth noting that although the control signal of the synchronous memory device is generated based on the input clock, the memory array operates as an analog circuit and generates an output signal with RC delay or propagation delay. The output signal generated is not based on the input The clock clock cycle. In addition, the RC delay or propagation delay does not change with the clock frequency. That is, as the clock frequency increases, the RC delay or propagation delay can remain unchanged and therefore become a larger part or a larger number of high frequency clock cycles, leading to possible conflicting events . In the example shown in FIG. 10, the memory array is accessed to read data at a selected memory location with the control signal L-Read asserted. The delay from the confirmation of the control signal L-Read to the read data from the memory array is an analog propagation delay that is not necessarily dominated by the clock cycle. After a certain propagation delay, the read data is transferred to the read FIFO. Then the clock signal CLK2 R Under the control, the read data is read from the FIFO to the output data pad as the output data DOUT. In this case, in the case where the input clock operates at a low clock frequency, the read data is available at the RL clock cycle and the valid data is read out. 11 is a timing diagram illustrating a read operation of a synchronous memory device at a high clock frequency and without a time delay adjustment in some examples. The memory read operation is performed in the same manner as explained above with reference to FIG. 10. However, as the read command signal is propagated through the delayed clock chain, there is an inherent delay from the rising edge of the clock signal RL-4 to the rising edge of the control signal L-Read, which is shown in FIG. 11 as "delay". This inherent delay is negligible when the clock frequency is low. However, when the clock frequency is high, this inherent delay becomes a large part of the clock period. Therefore, under the condition that the control signal L-Read is confirmed to be delayed, the read data from the memory array is also delayed, so that the read data cannot reach the read FIFO in time for latching and cycle RL during the read delay clock. Read out everywhere. In this illustration, valid read data will arrive at a clock cycle after the RL clock cycle. However, since a receiving system expects to read data from the memory device at the clock cycle RL, invalid data is read as output data. 12 is a timing diagram illustrating a read operation of a synchronous memory device at a high clock frequency and a time delay adjustment is applied in an embodiment of the present invention. In the memory read operation shown in FIG. 12, the clock time adjustment circuit detects a high input clock frequency and configures a delay adjustment circuit to skip one or more clock cycles of the read command. As shown in FIG. 12, the time-adjusted control signal L-Read is generated by skipping a clock cycle (for example, +3 clock cycle) so that at the time of the RL-5 clock cycle (at RL-4 Before the clock cycle) confirm the control signal L-Read. Even with the confirmation delay of the L-Read signal edge, it is still possible to retrieve the read data from the memory array, provide the read data to the read FIFO, and then read it at the expected clock cycle RL to As output data DOUT. Therefore, by adjusting the time delay of the control signal L-Read, valid data can be read even at a high input clock frequency. 13 is a timing diagram illustrating a write operation of a synchronous memory device in an embodiment of the present invention. The timing chart of FIG. 13 illustrates a case where a write operation is performed at a low input clock frequency. In a write operation, the synchronous memory device receives a write command signal at a clock cycle 0 and then provides a valid write at a given number of clock cycles (called a write delay or WL clock cycle). Into the information. The written data is retrieved at the input buffer and then transferred to the memory array for writing to the selected memory cell. However, there is an analogous propagation delay between the time at which the written data is fetched at the input buffer and the time at which the written data is propagated to the memory array. This propagation delay is not based on the clock cycle and does not vary with the clock frequency. In the example of the present invention, the clock time adjustment circuit shifts the write command through the clock chain, so that the control signal L-Write is verified at the clock cycle t1. At a low input clock frequency, the control signal L-Write arrives at the same time as the written data and retrieves valid written data at the memory array. FIG. 14 is a timing diagram illustrating a write operation of a synchronous memory device at a high clock frequency and without a time delay adjustment in an example. The memory read operation is performed in the same manner as explained above with reference to FIG. 13. However, due to the propagation delay of the written data, when the control signal L-Write is confirmed at the clock cycle t1, the valid written data has not reached the memory array. Therefore, the effective write data is not captured by the control signal L-Write. Therefore, instead of expecting to write data, invalid data is written to the memory array. 15 is a timing diagram illustrating a write operation of a synchronous memory device at a high clock frequency and a time delay adjustment is applied in an embodiment of the present invention. In the memory write operation shown in FIG. 15, the clock time adjustment circuit detects a high input clock frequency and configures a delay adjustment circuit to add one or more clock cycles of a write command. Therefore, the control signal L-Write is delayed by one clock cycle and is not confirmed until the clock cycle t2. In this way, extra time is provided to allow written data to reach the memory array. At clock cycle t2, when the valid write data has reached the memory array, the control signal L-Write is verified and a valid write operation is performed. In the embodiment described above, the clock time adjustment circuit is configured to remove or skip clock stages in a synchronous memory device for high frequency read operations, and is configured to write to high frequency The operation adds a clock level to a synchronous memory device. The operation of the clock timing adjustment circuit in a synchronous memory device described above is merely illustrative and is not intended to be limiting. In other embodiments, the clock timing adjustment circuit can be configured to remove or add clock levels in a synchronous memory device for low or high frequency read operations. In addition, in other embodiments, the clock timing adjustment circuit can be configured to remove or add clock levels in a synchronous memory device for low or high frequency write operations. Although the foregoing embodiments have been set forth in certain details for purposes of clarity of understanding, the invention is not limited to the details provided. There are many alternative ways of implementing the invention. The disclosed embodiments are illustrative and not restrictive.

10‧‧‧同步記憶體裝置 10‧‧‧Sync Memory Device

12‧‧‧二維陣列/陣列/單元陣列/記憶體陣列 12‧‧‧ 2D array / array / cell array / memory array

14‧‧‧記憶體單元 14‧‧‧Memory Unit

16‧‧‧控制電路 16‧‧‧Control circuit

18‧‧‧列解碼器 18‧‧‧column decoder

20‧‧‧行解碼器 20‧‧‧line decoder

22‧‧‧I/O閘控電路 22‧‧‧I / O gate control circuit

24‧‧‧感測放大器 24‧‧‧Sense Amplifier

26‧‧‧讀取先進先出 26‧‧‧Read FIFO

28‧‧‧輸出緩衝器 28‧‧‧ output buffer

30‧‧‧輸入緩衝器 30‧‧‧ input buffer

32‧‧‧寫入先進先出 32‧‧‧Write FIFO

50‧‧‧微處理器積體電路/微處理器裝置 50‧‧‧Microprocessor integrated circuit / microprocessor device

52‧‧‧功能區塊/巨集區塊 52‧‧‧Function Block / Macro Block

80‧‧‧時脈時間調整電路 80‧‧‧Clock time adjustment circuit

80a‧‧‧第一例項/時脈時間調整電路 80a‧‧‧First example / Clock time adjustment circuit

80b‧‧‧第二例項/時脈時間調整電路 80b‧‧‧Second example / Clock time adjustment circuit

82‧‧‧時脈頻率偵測電路 82‧‧‧Clock frequency detection circuit

86‧‧‧延時調整電路 86‧‧‧Delay adjustment circuit

86-1‧‧‧延時調整電路 86-1‧‧‧Delay adjustment circuit

86-2‧‧‧延時調整電路 86-2‧‧‧Delay adjustment circuit

90‧‧‧時脈時間調整電路 90‧‧‧Clock time adjustment circuit

100‧‧‧時脈時間調整電路 100‧‧‧Clock time adjustment circuit

110‧‧‧時脈頻率偵測電路 110‧‧‧clock frequency detection circuit

110a‧‧‧時脈頻率偵測電路 110a‧‧‧clock frequency detection circuit

110b‧‧‧時脈頻率偵測電路 110b‧‧‧Clock frequency detection circuit

120‧‧‧延時調整電路 120‧‧‧ Delay adjustment circuit

120a‧‧‧延時調整電路 120a‧‧‧Delay adjustment circuit

120b‧‧‧延時調整電路 120b‧‧‧Delay adjustment circuit

121‧‧‧低通濾波器/低通濾波器電路/ 導線互連低通濾波器 121‧‧‧ Low Pass Filter / Low Pass Filter Circuit / Wire Interconnect Low Pass Filter

122‧‧‧時脈正反器電路/時脈正反器電路/時脈級/時脈級 122‧‧‧Frequency converter circuit / Frequency converter circuit / Clock level / Clock level

123‧‧‧反相器 123‧‧‧Inverter

124‧‧‧級跳過電路 124‧‧‧level skip circuit

130‧‧‧記憶體陣列 130‧‧‧Memory Array

135‧‧‧庫寫入資料緩衝器 135‧‧‧bank write data buffer

140‧‧‧先進先出/輸出緩衝器電路 140‧‧‧ FIFO / Output Buffer Circuit

145‧‧‧輸入緩衝器/先進先出電路 145‧‧‧input buffer / first-in-first-out circuit

Addr‧‧‧位址/位址信號 Addr‧‧‧ address / address signal

C‧‧‧電容器 C‧‧‧Capacitor

CLK‧‧‧輸入時脈信號 CLK‧‧‧ Input clock signal

CLK2R‧‧‧時脈信號CLK2 R ‧‧‧ clock signal

CLK2W‧‧‧時脈信號CLK2 W ‧‧‧ clock signal

DIN‧‧‧寫入資料/輸入資料 DIN‧‧‧Write data / input data

DOUT‧‧‧輸出資料/讀出資料 DOUT‧‧‧Output data / read data

ENSKIP‧‧‧輸入信號 ENSKIP‧‧‧Input signal

FASTCLK‧‧‧時脈偵測輸出信號/輸出信號/信號 FASTCLK‧‧‧Clock detection output signal / output signal / signal

I0‧‧‧反相器 I0‧‧‧ Inverter

I1‧‧‧反相器 I1‧‧‧ Inverter

I2‧‧‧反相器 I2‧‧‧ Inverter

I3‧‧‧反相器 I3‧‧‧ Inverter

I4‧‧‧反相器 I4‧‧‧ Inverter

IN‧‧‧輸入端子 IN‧‧‧Input terminal

IN_Normal‧‧‧信號 IN_Normal‧‧‧Signal

IN_SKIP‧‧‧信號 IN_SKIP‧‧‧Signal

L-Command‧‧‧經時間調整控制信號/內部控制信號/控制信號/經時間調整命令信號 L-Command‧‧‧Time-adjusted control signal / Internal control signal / Control signal / Time-adjusted command signal

L-Command1‧‧‧經時間調整控制信號 L-Command1‧‧‧Time-adjusted control signal

L-Command2‧‧‧經時間調整控制信號 L-Command2‧‧‧time-adjusted control signal

L-Read‧‧‧經時間調整控制信號/控制信號/內部控制信號 L-Read‧‧‧Time-adjusted control signal / control signal / internal control signal

L-Write‧‧‧經時間調整控制信號/控制信號 L-Write‧‧‧Time-adjusted control signal / control signal

M0-M7‧‧‧電晶體 M0-M7‧‧‧Transistor

OUT‧‧‧輸出端子 OUT‧‧‧output terminal

R‧‧‧電阻器 R‧‧‧ resistor

RL‧‧‧時脈循環 RL‧‧‧Cycle Cycle

t0‧‧‧時脈循環 t0‧‧‧clock cycle

t1‧‧‧時脈循環 t1‧‧‧clock cycle

t2‧‧‧時脈循環 t2‧‧‧clock cycle

t3‧‧‧時脈循環 t3‧‧‧clock cycle

WL‧‧‧時脈循環 WL‧‧‧Cycle Cycle

以下詳細說明及附圖中揭示本發明之各種實施例。 圖1係其中在本發明之例示性實施例中可併入有時脈時間調整電路之一同步記憶體裝置之一方塊圖。 圖2係其中在本發明之例示性實施例中可併入有時脈時間調整電路之一微處理器裝置之一方塊圖。 圖3(a)係本發明之某些實施例中之一時脈時間調整電路之一方塊圖。 圖3(b)係本發明之替代實施例中之一時脈時間調整電路之一方塊圖。 圖4係圖解說明併入本發明之實施例中之時脈時間調整電路之一同步記憶體裝置之一讀取路徑及一寫入路徑之一方塊圖。 圖5係圖解說明本發明之實施例中之時脈時間調整電路之時脈頻率偵測電路之一方塊圖。 圖6係圖解說明可被併入於本發明之實施例中之時脈時間調整電路之時脈頻率偵測電路中之一RC低通濾波器電路之一電路圖。 圖7係圖解說明可併入於本發明之實施例中之時脈時間調整電路中之一時脈正反器電路之一電路圖。 圖8係圖解說明本發明之實施例中之時脈時間調整電路之延時調整電路之一電路圖。 圖9係圖解說明本發明之實施例中之延時陣列存取啟動電路之級跳過電路之一電路圖。 圖10係圖解說明本發明之實施例中之一同步記憶體裝置之一讀取操作之一時序圖。 圖11係圖解說明在某些實例中一同步記憶體裝置在一高時脈頻率下且在無時間延時調整之情況下之一讀取操作之一時序圖。 圖12係圖解說明在本發明之實施例中一同步記憶體裝置在一高時脈頻率下且在施加時間延時調整之情況下之一讀取操作之一時序圖。 圖13係圖解說明在本發明之實施例中一同步記憶體裝置之一寫入操作之一時序圖。 圖14係圖解說明在某一實例中一同步記憶體裝置在一高時脈頻率下且在無時間延時調整之情況下之一寫入操作之一時序圖。 圖15係圖解說明在本發明之實施例中一同步記憶體裝置在一高時脈頻率下且在施加時間延時調整之情況下之一寫入操作之一時序圖。Various embodiments of the invention are disclosed in the following detailed description and the accompanying drawings. FIG. 1 is a block diagram of a synchronous memory device in which a clock timing adjustment circuit can be incorporated in an exemplary embodiment of the present invention. FIG. 2 is a block diagram of a microprocessor device in which a clock timing adjustment circuit can be incorporated in an exemplary embodiment of the present invention. FIG. 3 (a) is a block diagram of a clock timing adjustment circuit in some embodiments of the present invention. FIG. 3 (b) is a block diagram of a clock timing adjustment circuit in an alternative embodiment of the present invention. FIG. 4 illustrates a block diagram of a read path and a write path of a synchronous memory device incorporated in a clock time adjustment circuit in an embodiment of the present invention. FIG. 5 is a block diagram illustrating a clock frequency detection circuit of a clock time adjustment circuit according to an embodiment of the present invention. FIG. 6 is a circuit diagram illustrating an RC low-pass filter circuit in a clock frequency detection circuit of a clock timing adjustment circuit that can be incorporated in an embodiment of the present invention. FIG. 7 is a circuit diagram illustrating a clock flip-flop circuit that can be incorporated in a clock time adjustment circuit in an embodiment of the present invention. FIG. 8 is a circuit diagram illustrating one of the delay adjustment circuits of the clock time adjustment circuit in the embodiment of the present invention. FIG. 9 is a circuit diagram illustrating one stage skip circuit of a delay array access enable circuit in an embodiment of the present invention. FIG. 10 is a timing diagram illustrating a read operation of a synchronous memory device according to an embodiment of the present invention. 11 is a timing diagram illustrating a read operation of a synchronous memory device at a high clock frequency and without a time delay adjustment in some examples. 12 is a timing diagram illustrating a read operation of a synchronous memory device at a high clock frequency and a time delay adjustment is applied in an embodiment of the present invention. 13 is a timing diagram illustrating a write operation of a synchronous memory device in an embodiment of the present invention. FIG. 14 is a timing diagram illustrating a write operation of a synchronous memory device at a high clock frequency and without a time delay adjustment in an example. 15 is a timing diagram illustrating a write operation of a synchronous memory device at a high clock frequency and a time delay adjustment is applied in an embodiment of the present invention.

Claims (34)

一種時脈積體電路,其接收具有一時脈頻率之一輸入時脈信號及用於存取該時脈積體電路中之一記憶體元件之一命令信號,該時脈積體電路包括: 一時脈頻率偵測電路,其接收該輸入時脈信號且產生一時脈偵測輸出信號,該時脈偵測輸出信號回應於該時脈頻率低於一頻率臨限值而具有一第一邏輯狀態且回應於該時脈頻率處於或高於一頻率臨限值而具有一第二邏輯狀態;及 一延時調整電路,其接收該輸入時脈信號、該命令信號及該時脈偵測輸出信號,該延時調整電路產生一經時間調整控制信號,該經時間調整控制信號係被延遲一第一時間延時之該命令信號,該第一時間延時包括該輸入時脈信號之一或多個時脈週期,其中該延時調整電路回應於該時脈偵測輸出信號而調整該第一時間延時。A clock product circuit receives an input clock signal having a clock frequency and a command signal for accessing a memory element in the clock product circuit. The clock product circuit includes: The pulse frequency detection circuit receives the input clock signal and generates a clock detection output signal. The clock detection output signal has a first logic state in response to the clock frequency being lower than a frequency threshold and A second logic state in response to the clock frequency being at or above a frequency threshold; and a delay adjustment circuit that receives the input clock signal, the command signal, and the clock detection output signal, the The delay adjustment circuit generates a time-adjusted control signal. The time-adjusted control signal is delayed by the command signal for a first time delay. The first time delay includes one or more clock cycles of the input clock signal. The delay adjustment circuit adjusts the first time delay in response to the clock detection output signal. 如請求項1之時脈積體電路,其中回應於該時脈偵測輸出信號具有該第一邏輯狀態,該延時調整電路產生係被延遲該第一時間延時之該命令信號之該經時間調整控制信號;且回應於該時脈偵測輸出信號具有該第二邏輯狀態,該延時調整電路產生係被延遲一第二時間延時之該命令信號之該經時間調整控制信號,該第二時間延時係自該第一時間延時調整得出。For example, the clock product circuit of item 1, wherein the delay adjustment circuit generates the time-adjusted command signal delayed by the first time delay in response to the clock detection output signal having the first logic state. A control signal; and in response to the clock detection output signal having the second logic state, the delay adjustment circuit generates the time-adjusted control signal of the command signal delayed by a second time delay, the second time delay It is derived from the first time delay adjustment. 如請求項2之時脈積體電路,其中回應於該時脈偵測輸出信號具有該第二邏輯狀態,該延時調整電路將一或多個時脈週期新增至該第一時間延時。For example, the clock product circuit of claim 2, wherein in response to the clock detection output signal having the second logic state, the delay adjustment circuit adds one or more clock periods to the first time delay. 如請求項2之時脈積體電路,其中回應於該時脈偵測輸出信號具有該第二邏輯狀態,該延時調整電路自該第一時間延時移除一或多個時脈週期。For example, the clock product circuit of claim 2, wherein in response to the clock detection output signal having the second logic state, the delay adjustment circuit removes one or more clock cycles from the first time delay. 如請求項1之時脈積體電路,其中回應於該時脈偵測輸出信號具有該第二邏輯狀態,該延時調整電路產生係被延遲該第一時間延時之該命令信號之該經時間調整控制信號;且回應於該時脈偵測輸出信號具有該第一邏輯狀態,該延時調整電路產生係被延遲一第二時間延時之該命令信號之該經時間調整控制信號,該第二時間延時係自該第一時間延時調整得出。For example, if the clock product circuit of item 1 is provided, in response to the clock detection output signal having the second logic state, the delay adjustment circuit generates the time-adjusted command signal delayed by the first time delay. A control signal; and in response to the clock detection output signal having the first logic state, the delay adjustment circuit generates the time-adjusted control signal of the command signal delayed by a second time delay, the second time delay It is derived from the first time delay adjustment. 如請求項5之時脈積體電路,其中回應於該時脈偵測輸出信號具有該第一邏輯狀態,該延時調整電路將一或多個時脈週期新增至該第一時間延時。For example, the clock product circuit of claim 5, wherein in response to the clock detection output signal having the first logic state, the delay adjustment circuit adds one or more clock cycles to the first time delay. 如請求項5之時脈積體電路,其中回應於該時脈偵測輸出信號具有該第一邏輯狀態,該延時調整電路自該第一時間延時移除一或多個時脈週期。For example, the clock product circuit of claim 5, wherein in response to the clock detection output signal having the first logic state, the delay adjustment circuit removes one or more clock cycles from the first time delay. 如請求項1之時脈積體電路,其中該延時調整電路包括串聯連接且由該輸入時脈信號計時之複數個時脈級,該複數個時脈級判定該第一時間延時,該命令信號透過該複數個時脈級移位以產生具有該第一時間延時之該經時間調整控制信號。For example, the clock product circuit of claim 1, wherein the delay adjustment circuit includes a plurality of clock stages connected in series and timed by the input clock signal, and the plurality of clock stages determine the first time delay, the command signal The plurality of clock levels are shifted to generate the time-adjusted control signal having the first time delay. 如請求項8之時脈積體電路,其中該延時調整電路進一步包括一個級跳過電路,該級跳過電路經組態以回應於該時脈偵測輸出信號而調整該複數個時脈級中之時脈級之數目,該級跳過電路自該複數個時脈級移除一或多個時脈級。For example, the clock product circuit of claim 8, wherein the delay adjustment circuit further includes a stage skip circuit configured to adjust the plurality of clock stages in response to the clock detection output signal. The number of clock stages, the stage skip circuit removes one or more clock stages from the plurality of clock stages. 如請求項8之時脈積體電路,其中該延時調整電路進一步包括一個級跳過電路,該級跳過電路經組態以回應於該時脈偵測輸出信號而調整該複數個時脈級中之時脈級之數目,該級跳過電路將一或多個時脈級新增至該複數個時脈級。For example, the clock product circuit of claim 8, wherein the delay adjustment circuit further includes a stage skip circuit configured to adjust the plurality of clock stages in response to the clock detection output signal. The number of clock stages, the stage skip circuit adds one or more clock stages to the plurality of clock stages. 如請求項8之時脈積體電路,其中該複數個時脈級包括串聯連接之複數個時脈正反器級。For example, the clock product circuit of claim 8, wherein the plurality of clock stages includes a plurality of clock flip-flop stages connected in series. 如請求項1之時脈積體電路,其中該延時調整電路包括:一計數器電路,其由該輸入時脈信號計時且產生一計數器值;及一選擇電路,其經組態以回應於該時脈偵測輸出信號而產生一選擇信號,該選擇信號自該計數器電路選擇一計數器值,該計數器值經選擇以調整該經時間調整控制信號之該時間延時。For example, the clock product circuit of item 1, wherein the delay adjustment circuit includes: a counter circuit that is timed by the input clock signal and generates a counter value; and a selection circuit that is configured to respond to the time The pulse detection output signal generates a selection signal. The selection signal selects a counter value from the counter circuit. The counter value is selected to adjust the time delay of the time-adjusted control signal. 如請求項1之時脈積體電路,其中該時脈頻率偵測電路包括:一低通濾波器電路,其經組態以接收該輸入時脈信號且產生在該頻率臨限值下被低通濾波之一經低通濾波輸出信號;及複數個時脈級,其由該輸入時脈信號計時,該經低通濾波輸出信號透過該複數個時脈級移位以產生該時脈偵測輸出信號。For example, the clock product circuit of item 1, wherein the clock frequency detection circuit includes: a low-pass filter circuit configured to receive the input clock signal and generate a low frequency at the frequency threshold. One of the pass filters is a low-pass filtered output signal; and a plurality of clock stages are clocked by the input clock signal, and the low-pass filtered output signal is shifted through the plurality of clock stages to generate the clock detection output signal. 如請求項2之時脈積體電路,其中該時脈積體電路包括一時脈記憶體電路,且該命令信號包括用以自該時脈記憶體電路讀取資料之一讀取命令信號,且回應於該時脈偵測輸出信號具有該第二邏輯狀態,該延時調整電路產生係被延遲該第二時間延時之該讀取命令信號之一經時間調整讀取控制信號,該經時間調整讀取控制信號與該第一時間延時相比被提前該一或多個時脈週期。For example, the clock product circuit of item 2, wherein the clock product circuit includes a clock memory circuit, and the command signal includes a read command signal for reading data from the clock memory circuit, and In response to the clock detection output signal having the second logic state, the delay adjustment circuit generates a time-adjusted read control signal that is one of the read command signals delayed by the second time delay, and the time-adjusted read The control signal is advanced by the one or more clock cycles compared to the first time delay. 如請求項2之時脈積體電路,其中該時脈積體電路包括一時脈記憶體電路,且該命令信號包括用以將輸入資料寫入至該時脈記憶體電路之一寫入命令信號,且回應於該時脈偵測輸出信號具有該第二邏輯狀態,該延時調整電路產生係被延遲該第二時間延時之該寫入命令信號之一經時間調整寫入控制信號,該經時間調整寫入控制信號與該第一時間延時相比被延遲該一或多個時脈週期。For example, the clock product circuit of claim 2, wherein the clock product circuit includes a clock memory circuit, and the command signal includes a write command signal for writing input data to one of the clock memory circuits. And in response to the clock detection output signal having the second logic state, the delay adjustment circuit generates a time-adjusted write control signal that is one of the write command signals delayed by the second time delay, the time-adjusted The write control signal is delayed by the one or more clock cycles compared to the first time delay. 如請求項2之時脈積體電路,其中該時脈積體電路包括一微處理器電路,且該命令信號包括用以自該微處理器電路之一巨集區塊中之一記憶體元件讀取資料之一讀取命令信號,且回應於該時脈偵測輸出信號具有該第二邏輯狀態,該延時調整電路產生係被延遲該第二時間延時之該讀取命令信號之一經時間調整讀取控制信號,該經時間調整讀取控制信號與該第一時間延時相比被提前該一或多個時脈週期。For example, the clock product circuit of claim 2, wherein the clock product circuit includes a microprocessor circuit, and the command signal includes a memory element from a macro block of the microprocessor circuit. A read command signal of one of the read data, and in response to the clock detection output signal having the second logic state, the delay adjustment circuit generates a time-adjusted one of the read command signal delayed by the second time delay. The read control signal is advanced by the one or more clock cycles compared to the first time delay. 如請求項2之時脈積體電路,其中該時脈積體電路包括一微處理器電路,且該命令信號包括用以將資料寫入至該微處理器電路之一巨集區塊中之一記憶體元件之一寫入命令信號,且回應於該時脈偵測輸出信號具有該第二邏輯狀態,該延時調整電路產生係被延遲微處理器第二時間延時之該寫入命令信號之一經時間調整寫入控制信號,該經時間調整寫入控制信號與該第一時間延時相比被延遲該一或多個時脈週期。For example, the clock product circuit of item 2, wherein the clock product circuit includes a microprocessor circuit, and the command signal includes data for writing data into a macro block of the microprocessor circuit. A write command signal of one of the memory elements, and in response to the clock detection output signal having the second logic state, the delay adjustment circuit generates the write command signal delayed by a second time delay of the microprocessor. Once the time-adjusted write control signal is delayed by the one or more clock cycles compared to the first time delay. 如請求項1之時脈積體電路,其中該時脈頻率偵測電路包括複數個時脈頻率偵測電路例項,每一時脈頻率偵測電路例項與一各別頻率臨限值相關聯,該時脈頻率耦合至每一時脈頻率偵測電路例項以被對照該各別頻率臨限值進行偵測,該時脈頻率偵測電路產生指示該時脈頻率之一頻率範圍之一多位元時脈偵測輸出信號,且其中該延時調整電路回應於該多位元時脈偵測輸出信號而調整該第一時間延時。For example, the clock product circuit of item 1, wherein the clock frequency detection circuit includes a plurality of clock frequency detection circuit instances, and each clock frequency detection circuit instance is associated with a respective frequency threshold. The clock frequency is coupled to each clock frequency detection circuit instance to be detected against the respective frequency threshold. The clock frequency detection circuit generates an indication of one of the frequency ranges of the clock frequency. The bit clock detection output signal, and the delay adjustment circuit adjusts the first time delay in response to the multi-bit clock detection output signal. 一種在一時脈積體電路中進行之方法,該時脈積體電路接收具有一時脈頻率之一輸入時脈信號及用於存取該時脈積體電路中之一記憶體元件之一命令信號,該方法包括: 偵測該輸入時脈信號具有之一時脈頻率是高於一頻率臨限值還是低於該頻率臨限值; 回應於該時脈頻率低於該頻率臨限值而產生具有一第一邏輯狀態之一時脈偵測輸出信號; 回應於該時脈頻率高於該頻率臨限值而產生具有一第二邏輯狀態之該時脈偵測輸出信號; 將該命令信號延遲一第一時間延時以產生一經時間調整控制信號,該第一時間延時係該輸入時脈信號之一或多個時脈週期;及 回應於該時脈偵測輸出信號而調整該第一時間延時。A method performed in a clock product circuit, the clock product circuit receives an input clock signal having a clock frequency and a command signal for accessing a memory element in the clock product circuit The method includes: detecting whether the input clock signal has a clock frequency higher than a frequency threshold or lower than the frequency threshold; in response to the clock frequency being lower than the frequency threshold, having A clock detection output signal in one of the first logic states; generating the clock detection output signal with a second logic state in response to the clock frequency being higher than the frequency threshold; delaying the command signal by a first A time delay to generate a time-adjusted control signal, the first time delay is one or more clock cycles of the input clock signal; and the first time delay is adjusted in response to the clock detection output signal. 如請求項19之方法,其進一步包括: 回應於該時脈偵測輸出信號具有該第一邏輯狀態而將該命令信號延遲該第一時間延時以產生係被延遲該第一時間延時之該命令信號之該經時間調整控制信號; 回應於該時脈偵測輸出信號具有該第二邏輯狀態而將該第一時間延時調整至一第二時間延時;及 回應於該時脈偵測輸出信號具有該第二邏輯狀態而將該命令信號延遲該第二時間延時以產生該經時間調整控制信號。The method of claim 19, further comprising: in response to the clock detection output signal having the first logic state, delaying the command signal by the first time delay to generate the command delayed by the first time delay The time-adjusted control signal of the signal; adjusting the first time delay to a second time delay in response to the clock detection output signal having the second logic state; and in response to the clock detection output signal having The second logic state delays the command signal by the second time delay to generate the time-adjusted control signal. 如請求項20之方法,其中回應於該時脈偵測輸出信號具有該第二邏輯狀態而將該第一時間延時調整至一第二時間延時包括: 將一或多個時脈週期新增至該第一時間延時以產生該第二時間延時。The method of claim 20, wherein adjusting the first time delay to a second time delay in response to the clock detection output signal having the second logic state includes: adding one or more clock cycles to The first time delay generates the second time delay. 如請求項20之方法,其中回應於該時脈偵測輸出信號具有該第二邏輯狀態而將該第一時間延時調整至一第二時間延時包括: 自該第一時間延時移除一或多個時脈週期以產生該第二時間延時。The method of claim 20, wherein adjusting the first time delay to a second time delay in response to the clock detection output signal having the second logic state includes: removing one or more from the first time delay Clock cycles to generate the second time delay. 如請求項19之方法,其進一步包括: 回應於該時脈偵測輸出信號具有該第二邏輯狀態而將該命令信號延遲該第一時間延時以產生係被延遲該第一時間延時之該命令信號之該經時間調整控制信號; 回應於該時脈偵測輸出信號具有該第一邏輯狀態而將該第一時間延時調整至一第二時間延時;及 回應於該時脈偵測輸出信號具有該第一邏輯狀態而將該命令信號延遲該第二時間延時以產生該經時間調整控制信號。The method of claim 19, further comprising: in response to the clock detection output signal having the second logic state, delaying the command signal by the first time delay to generate the command delayed by the first time delay The time-adjusted control signal of the signal; adjusting the first time delay to a second time delay in response to the clock detection output signal having the first logic state; and in response to the clock detection output signal having The first logic state delays the command signal by the second time delay to generate the time-adjusted control signal. 如請求項23之方法,其中回應於該時脈偵測輸出信號具有該第一邏輯狀態而將該第一時間延時調整至一第二時間延時包括: 將一或多個時脈週期新增至該第一時間延時以產生該第二時間延時。The method of claim 23, wherein adjusting the first time delay to a second time delay in response to the clock detection output signal having the first logic state includes: adding one or more clock cycles to The first time delay generates the second time delay. 如請求項23之方法,其中回應於該時脈偵測輸出信號具有該第一邏輯狀態而將該第一時間延時調整至一第二時間延時包括: 自該第一時間延時移除一或多個時脈週期以產生該第二時間延時。The method of claim 23, wherein adjusting the first time delay to a second time delay in response to the clock detection output signal having the first logic state includes: removing one or more from the first time delay Clock cycles to generate the second time delay. 如請求項23之方法,其中: 將該命令信號延遲一第一時間延時以產生一經時間調整控制信號包括:透過複數個時脈級將該命令信號延遲以產生該經時間調整控制信號,該複數個時脈級判定該第一時間延時;且 回應於該時脈偵測輸出信號而調整該第一時間延時包括調整該複數個時脈級中之時脈級之數目。The method of claim 23, wherein: delaying the command signal by a first time delay to generate a time-adjusted control signal includes: delaying the command signal through a plurality of clock stages to generate the time-adjusted control signal, the complex number Each clock level determines the first time delay; and adjusting the first time delay in response to the clock detection output signal includes adjusting the number of clock levels in the plurality of clock levels. 如請求項26之方法,其中調整該複數個時脈級中之時脈級之該數目包括:自該複數個時脈級移除一或多個時脈級。The method of claim 26, wherein adjusting the number of clock levels in the plurality of clock levels includes removing one or more clock levels from the plurality of clock levels. 如請求項26之方法,其中調整該複數個時脈級中之時脈級之該數目包括:將一或多個時脈級新增至該複數個時脈級。The method of claim 26, wherein adjusting the number of clock levels in the plurality of clock levels includes: adding one or more clock levels to the plurality of clock levels. 如請求項19之方法,其中偵測該輸入時脈信號具有之一時脈頻率是高於一頻率臨限值還是低於該頻率臨限值包括: 在該頻率臨限值下對該輸入時脈信號進行低通濾波。The method of claim 19, wherein detecting whether the input clock signal has a clock frequency higher than a frequency threshold or lower than the frequency threshold includes: inputting the input clock at the frequency threshold The signal is low-pass filtered. 如請求項19之方法,其中: 偵測該輸入時脈信號具有之一時脈頻率是高於一頻率臨限值還是低於該頻率臨限值包括對照複數個頻率臨限值來偵測該輸入時脈信號; 產生該時脈偵測輸出信號包括產生指示該時脈頻率之一頻率範圍之一多位元時脈偵測輸出信號;且 回應於該時脈偵測輸出信號而調整該第一時間延時包括回應於該多位元時脈偵測輸出信號而調整該第一時間延時。The method of claim 19, wherein: detecting whether the input clock signal has a clock frequency higher than a frequency threshold or lower than the frequency threshold includes detecting the input by comparing a plurality of frequency thresholds Clock signal; generating the clock detection output signal includes generating a multi-bit clock detection output signal indicating a frequency range of the clock frequency; and adjusting the first in response to the clock detection output signal The time delay includes adjusting the first time delay in response to the multi-bit clock detection output signal. 如請求項20之方法,其中該時脈積體電路包括一時脈記憶體電路,且該命令信號包括用以自該時脈記憶體電路讀取資料之一讀取命令信號,該方法包括: 回應於該時脈偵測輸出信號具有該第二邏輯狀態,藉由將該第二時間延時與該第一時間延時相比提前一或多個時脈週期而將該第一時間延時調整至該第二時間延時;及 回應於該時脈偵測輸出信號具有該第二邏輯狀態而將該命令信號延遲該第二時間延時以產生該經時間調整控制信號。The method of claim 20, wherein the clock product circuit includes a clock memory circuit, and the command signal includes a read command signal for reading data from the clock memory circuit. The method includes: responding The clock detection output signal has the second logic state, and the first time delay is adjusted to the first time delay by one or more clock cycles compared to the first time delay. Two time delays; and in response to the clock detection output signal having the second logic state, delaying the command signal by the second time delay to generate the time-adjusted control signal. 如請求項20之方法,其中該時脈積體電路包括一時脈記憶體電路,且該命令信號包括用以將資料寫入至該時脈記憶體電路之一寫入命令信號,該方法包括: 回應於該時脈偵測輸出信號具有該第二邏輯狀態,藉由將該第二時間延時與該第一時間延時相比延遲一或多個時脈週期而將該第一時間延時調整至該第二時間延時;及 回應於該時脈偵測輸出信號具有該第二邏輯狀態而將該命令信號延遲該第二時間延時以產生該經時間調整控制信號。The method of claim 20, wherein the clock product circuit includes a clock memory circuit, and the command signal includes a write command signal for writing data to one of the clock memory circuits. The method includes: In response to the clock detection output signal having the second logic state, the first time delay is adjusted to the second time delay by delaying the second time delay from the first time delay by one or more clock cycles. A second time delay; and in response to the clock detection output signal having the second logic state, delaying the command signal by the second time delay to generate the time-adjusted control signal. 如請求項20之方法,其中該時脈積體電路包括一微處理器電路,且該命令信號包括用以自該微處理器電路之一巨集區塊中之一記憶體元件讀取資料之一讀取命令信號,該方法包括: 回應於該時脈偵測輸出信號具有該第二邏輯狀態,藉由將該第二時間延時與該第一時間延時相比提前一或多個時脈週期而將該第一時間延時調整至該第二時間延時;及 回應於該時脈偵測輸出信號具有該第二邏輯狀態而將該命令信號延遲該第二時間延時以產生該經時間調整控制信號。The method of claim 20, wherein the clock product circuit includes a microprocessor circuit, and the command signal includes data for reading data from a memory element in a macro block of the microprocessor circuit. A read command signal, the method includes: in response to the clock detection output signal having the second logic state, by making the second time delay earlier than the first time delay by one or more clock cycles And adjusting the first time delay to the second time delay; and in response to the clock detection output signal having the second logic state, delaying the command signal by the second time delay to generate the time-adjusted control signal . 如請求項20之方法,其中該時脈積體電路包括一微處理器電路,且該命令信號包括用以將資料寫入至該微處理器電路之一巨集區塊中之一記憶體元件之一寫入命令信號,該方法包括: 回應於該時脈偵測輸出信號具有該第二邏輯狀態,藉由將該第二時間延時與該第一時間延時相比延遲一或多個時脈週期而將該第一時間延時調整至該第二時間延時;及 回應於該時脈偵測輸出信號具有該第二邏輯狀態而將該命令信號延遲該第二時間延時以產生該經時間調整控制信號。The method of claim 20, wherein the clock product circuit includes a microprocessor circuit, and the command signal includes a memory element for writing data to a macro block of the microprocessor circuit One of the write command signals, the method comprising: in response to the clock detection output signal having the second logic state, delaying the second time delay by one or more clocks compared to the first time delay Periodically adjusting the first time delay to the second time delay; and in response to the clock detection output signal having the second logic state, delaying the command signal by the second time delay to generate the time-adjusted control signal.
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