TW201816462A - Machine vision system for substrate alignment and alignment device - Google Patents

Machine vision system for substrate alignment and alignment device Download PDF

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TW201816462A
TW201816462A TW106125532A TW106125532A TW201816462A TW 201816462 A TW201816462 A TW 201816462A TW 106125532 A TW106125532 A TW 106125532A TW 106125532 A TW106125532 A TW 106125532A TW 201816462 A TW201816462 A TW 201816462A
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substrate
objective lens
reflector
detector
mirror
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TW106125532A
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TWI641866B (en
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朱鷙
霍志軍
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大陸商上海微電子裝備（集團）股份有限公司
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    • H—ELECTRICITY
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes
    • G—PHYSICS
    • G02—OPTICS
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    • G02B21/00—Microscopes
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    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/18—Arrangements with more than one light path, e.g. for comparing two specimens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
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    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G—PHYSICS
    • G02—OPTICS
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    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7065—Production of alignment light, e.g. light source, control of coherence, polarization, pulse length, wavelength
    • G—PHYSICS
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    • G06T7/285—Analysis of motion using a sequence of stereo image pairs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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    • H01—ELECTRIC ELEMENTS
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    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/24—Base structure
    • G02B21/26—Stages; Adjusting means therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10016—Video; Image sequence
    • G06T2207/10021—Stereoscopic video; Stereoscopic image sequence
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    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30164—Workpiece; Machine component
    • G—PHYSICS
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    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
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    • H01L2224/757—Means for aligning
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Abstract

A machine vision system for substrate alignment, comprising first and second illumination light sources, first and second reflecting mirrors, first and second objective lenses and first and second detectors. The first and second illumination light sources, the first and second reflecting mirrors, the first and second objective lenses and the first and second detectors are symmetrical about an X axis, illumination light emitted by the first and the second illumination light sources is irradiated onto a corresponding substrate for reflection, and is projected onto the corresponding detector for detection after being amplified by the corresponding objective lens. Also disclosed is an alignment device. The first and second illumination light sources, the first and second reflecting mirrors, the first and second objective lenses and the first and second detectors are symmetrical about an X axis, thus greatly reducing the occupancy volume of a machine vision system in the direction of a lens cone, enlarging the detection range of the machine vision system, and improving the alignment efficiency and precision.

Description

一種用於基片對準的機器視覺系統及對準裝置    Machine vision system and alignment device for substrate alignment   

本發明有關於基片鍵合技術領域，特別有關於一種用於基片對準的機器視覺系統及對準裝置。 The present invention relates to the technical field of substrate bonding, and in particular to a machine vision system and an alignment device for substrate alignment.

現有技術中用於半導體技藝中基片鍵合的配套設備，在鍵合進行之前需將兩片基片進行對準。基片對準是基片鍵合設備中最重要的技術之一。 In the prior art, the supporting equipment for substrate bonding in semiconductor technology requires the two substrates to be aligned before the bonding is performed. Substrate alignment is one of the most important techniques in substrate bonding equipment.

現有的基片對準方法為：先將兩片基片的表面相對，使用兩組顯微物鏡分別檢測出兩片基片上對準標記的位置，然後藉由執行器補償檢測出的兩片基片上對準標記的相對位置偏差。然而由於基片鍵合技藝的需求，在對準過程中，兩片基片中間必須放置間隔片，用於確保在鍵合之前兩片基片相互不接觸，這導致兩片基片之間存在較大的間隙，該間隙通常大於0.4mm，而該間隙的存在使得所選用的顯微物鏡的景深必須大於兩片基片之間存在的距離，這樣兩片基片上的對準標記才能清晰成像，而對於顯微物鏡來說，其景深與解析度是矛盾的關係，即景深越大的顯微物鏡，其解析度就越低，因此想要進一步提高對準精度，首先應該提高顯微物鏡的解析度，但由於存在景深的要求，使得基片的對準精度難以提高。 The existing substrate alignment method is as follows: firstly, the surfaces of two substrates are opposite to each other, and the positions of the alignment marks on the two substrates are respectively detected by using two sets of microscope objectives, and then the detected two substrates are compensated by an actuator. The relative position deviation of the on-chip alignment marks. However, due to the needs of substrate bonding technology, a spacer must be placed between the two substrates during the alignment process to ensure that the two substrates do not contact each other before bonding, which results in the existence of the two substrates. Large gap, which is usually larger than 0.4mm, and the existence of the gap makes the depth of field of the selected micro-objective lens must be greater than the distance between the two substrates, so that the alignment marks on the two substrates can be clearly imaged For micro-objectives, the depth of field and resolution are in a contradictory relationship, that is, the higher the depth of field, the lower the resolution of the micro-objectives. Therefore, if you want to further improve the alignment accuracy, you should first improve the micro-objectives. Resolution, but due to the depth of field requirements, it is difficult to improve the alignment accuracy of the substrate.

針對上述問題，現有技術中提出一種檢測裝置，如圖 1所示，藉由將兩對顯微物鏡3’佈置在第一基片1’和第二基片2’之間，使用兩對顯微物鏡3’分別觀測第一基片1’和第二基片2’上的對準標記，最終藉由承載台六個自由度的運動，實現第一基片1’和第二基片2’的對準。然而該技術中為了實現顯微物鏡對第一基片1’和第二基片2’的對焦及找尋對準標記，需要機器視覺系統中的顯微物鏡3’能夠實現X、Y、Z三個方向的運動，然而由於機器視覺系統中顯微物鏡3’是水平同軸佈置的，在鏡筒方向需要佔用的空間較多，導致機器視覺系統在鏡筒方向能夠檢測的範圍較小，因此無法實現對整張基片上的任意位置進行檢測，最終降低基片的對準精度。 In view of the above problems, a detection device is proposed in the prior art. As shown in FIG. 1, two pairs of microscope objectives 3 'are arranged between the first substrate 1' and the second substrate 2 ', and two pairs of display lenses are used. The micro objective lens 3 'observes the alignment marks on the first substrate 1' and the second substrate 2 ', respectively, and finally realizes the first substrate 1' and the second substrate 2 by six degrees of freedom movement of the stage. 'Alignment. However, in this technology, in order to achieve the focusing of the first substrate 1 ′ and the second substrate 2 ′ by the micro objective lens and find the alignment mark, the micro objective lens 3 ′ in the machine vision system is required to realize the X, Y, and Z three. However, since the microscope objective lens 3 'is arranged horizontally and coaxially in the machine vision system, it requires more space in the direction of the lens barrel, resulting in a smaller range that the machine vision system can detect in the direction of the lens barrel. The detection of any position on the entire substrate is realized, and finally the alignment accuracy of the substrate is reduced.

本發明提供一種用於基片對準的機器視覺系統及對準裝置，以解决現有技術中存在的顯微物鏡水平同軸佈置，在鏡筒方向所佔用的空間較多而導致檢測的範圍較小以及降低基片對準精度的問題。 The invention provides a machine vision system and an alignment device for substrate alignment, in order to solve the horizontal coaxial arrangement of the micro objective lens existing in the prior art. The space occupied in the direction of the lens barrel leads to a small detection range. And the problem of reducing the alignment accuracy of the substrate.

為了解决上述技術問題，本發明的技術方案是：一種用於基片對準的機器視覺系統，設於沿X軸對稱設置的第一、第二基片之間，包括第一、第二照明光源，第一、第二反射鏡，第一、第二物鏡，第一、第二探測器，其中，該第一、第二照明光源之間，該第一、第二反射鏡之間，該第一、第二物鏡之間以及第一、第二探測器之間關於X軸對稱，該第一、第二照明光源發出的照明光線照射至對應的基片上進行反射，並經對應的物鏡放大之後投射至對應的探測器上進行探測。 In order to solve the above technical problems, the technical solution of the present invention is: a machine vision system for substrate alignment, which is arranged between the first and second substrates symmetrically arranged along the X axis, and includes first and second illumination Light source, first and second reflectors, first and second objective lenses, first and second detectors, wherein between the first and second illumination light sources, between the first and second reflectors, the The X-axis is symmetrical between the first and second objective lenses and between the first and second detectors. The illumination light emitted by the first and second illumination light sources is reflected on the corresponding substrate and amplified by the corresponding objective lens. It is then projected onto the corresponding detector for detection.

進一步的，該第一、第二照明光源，該第一、第二反 射鏡，該第一、第二物鏡，以及該第一、第二探測器固設於基礎框架上，該基礎框架上連有驅動機構，帶動該基礎框架沿X軸、Y軸、Z軸中的任意一個或幾個方向運動，其中，Y軸與X軸正交，Z軸同時與X軸和Y軸正交。 Further, the first and second illumination light sources, the first and second reflectors, the first and second objective lenses, and the first and second detectors are fixed on a base frame, and the base frame is connected to the base frame. There is a driving mechanism that drives the basic frame to move in any one or several directions of the X-axis, Y-axis, and Z-axis, wherein the Y-axis is orthogonal to the X-axis and the Z-axis is orthogonal to the X-axis and the Y-axis at the same time.

進一步的，該第一物鏡和第二物鏡沿X軸對稱設置，且分別與該第一基片和第二基片對應，該第一、第二反射鏡關於該第一物鏡和第二物鏡對稱設置。 Further, the first objective lens and the second objective lens are arranged symmetrically along the X axis, and respectively correspond to the first substrate and the second substrate, and the first and second reflectors are symmetrical about the first objective lens and the second objective lens. Settings.

進一步的，該第一反射鏡和第一探測器沿該X軸水平設置，該第二反射鏡和第二探測器沿該X軸水平設置，且該第一、第二探測器位於該第一物鏡、第二物鏡沿X軸方向的同一側。 Further, the first reflector and the first detector are horizontally disposed along the X axis, the second reflector and the second detector are horizontally disposed along the X axis, and the first and second detectors are located on the first The objective lens and the second objective lens are on the same side in the X-axis direction.

進一步的，該第一反射鏡和第一探測器之間設有第一分束鏡，該第一照明光源的位置與該第一分束鏡對應，該第二反射鏡和第二探測器之間設有第二分束鏡，該第二照明光源的位置與該第二分束鏡對應，該第一照明光源發出的照射光線經該第一分束鏡投射至該第一反射鏡上，該第二照明光源發出的照射光線經該第二分束鏡投射至該第二反射鏡上。 Further, a first beam splitter is disposed between the first reflector and the first detector, and the position of the first illumination light source corresponds to the first beam splitter, and the second mirror and the second detector A second beam splitter is arranged therebetween, the position of the second illumination light source corresponds to the second beam splitter, and the irradiation light emitted by the first illumination light source is projected onto the first reflector through the first beam splitter, The illumination light emitted by the second illumination light source is projected onto the second reflector through the second beam splitter.

進一步的，該第一物鏡和該第一反射鏡之間設有第三反射鏡，該第二物鏡和該第二反射鏡之間設有第四反射鏡，投射至該第一反射鏡上的光線經該第三反射鏡投射至第一基片上，該第一基片上反射的光線經第一物鏡放大後依序經該第三反射鏡、第一反射鏡轉向後投射至該第一探測器上；投射至該第二反射鏡上的光線經該第四反射鏡投射至第二基片上，該第二基片上反射的光線經第二物鏡放大後依序經該第四反射鏡、第二反射鏡轉向後投射至該第二探測器上。 Further, a third reflecting mirror is provided between the first objective lens and the first reflecting mirror, and a fourth reflecting mirror is provided between the second objective lens and the second reflecting mirror, which is projected onto the first reflecting mirror. The light is projected on the first substrate through the third mirror, and the light reflected on the first substrate is amplified by the first objective lens, and then sequentially turned by the third mirror and the first mirror and then projected to the first detector. Up; the light projected onto the second mirror is projected onto the second substrate via the fourth mirror, and the light reflected on the second substrate is amplified by the second objective lens and then passed through the fourth mirror, the second The mirror is turned and projected onto the second detector.

進一步的，該第一反射鏡和第二反射鏡之間設有第三分束鏡，該第三分束鏡與該第一物鏡和第二物鏡的位置對應；該第一反射鏡上的光線經該第三分束鏡投射至第一基片上，該第一基片上反射的光線經第一物鏡放大後依序經該第三分束鏡、第一反射鏡轉向後投射至該第一探測器上；該第二反射鏡上的光線經該第三分束鏡投射至第二基片上，該第二基片上反射的光線經第二物鏡放大後依序經該第三分束鏡、第二反射鏡轉向後投射至該第二探測器上。 Further, a third beam splitter is provided between the first mirror and the second mirror, and the third beam splitter corresponds to the positions of the first objective lens and the second objective lens; the light on the first reflector The third beam splitter is projected onto the first substrate, and the light reflected on the first substrate is amplified by the first objective lens, and then sequentially turned by the third beam splitter and the first mirror, and then projected to the first detection. The light on the second reflector is projected onto the second substrate by the third beam splitter, and the light reflected on the second substrate is amplified by the second objective lens and sequentially passes through the third beam splitter, the first The two mirrors are turned and projected onto the second detector.

進一步的，該第一反射鏡、第一物鏡和第一探測器沿X軸方向依序排列，該第二反射鏡、第二物鏡和第二探測器沿X軸方向依序排列。 Further, the first reflecting mirror, the first objective lens and the first detector are sequentially arranged along the X-axis direction, and the second reflecting mirror, the second objective lens and the second detector are sequentially arranged along the X-axis direction.

進一步的，該第一物鏡和該第一基片之間設有第三反射鏡，該第二物鏡和該第二基片之間設有第四反射鏡，投射至該第一反射鏡上的光線經該第三反射鏡投射至第一基片上，該第一基片上反射的光線依序經該第三反射鏡、第一反射鏡轉向至第一物鏡放大後投射至該第一探測器上；投射至該第二反射鏡上的光線經該第四反射鏡投射至第二基片上，該第二基片上反射的光線依序經該第四反射鏡、第二反射鏡轉向至第二物鏡放大後投射至該第二探測器上。 Further, a third reflector is provided between the first objective lens and the first substrate, and a fourth reflector is provided between the second objective lens and the second substrate. The light is projected on the first substrate through the third mirror, and the light reflected on the first substrate is sequentially turned by the third mirror and the first mirror to the first objective lens to be amplified and projected onto the first detector. ; The light projected onto the second mirror is projected onto the second substrate via the fourth mirror, and the light reflected on the second substrate is sequentially turned to the second objective lens via the fourth mirror and the second mirror It is projected onto the second detector after being magnified.

進一步的，該第一物鏡和該第一基片之間設有第三反射鏡，該第二物鏡和該第二基片之間設有第四反射鏡，該第一反射鏡上的光線經該第三反射鏡投射至第一基片上，該第一基片上反射的光線依序經該第三反射鏡、第一反射鏡轉向至第一物鏡放大後投射至該第一探測器上；該第二反射鏡上的光線經該第四 反射鏡投射至第二基片上，該第二基片上反射的光線依序經該第四反射鏡、第二反射鏡轉向至第二物鏡放大後投射至該第二探測器上。 Further, a third reflector is provided between the first objective lens and the first substrate, a fourth reflector is provided between the second objective lens and the second substrate, and light rays on the first reflector pass through The third mirror is projected on the first substrate, and the light reflected on the first substrate is sequentially turned by the third mirror and the first mirror to the first objective lens to be amplified and projected onto the first detector; The light on the second mirror is projected onto the second substrate through the fourth mirror, and the light reflected on the second substrate is sequentially turned by the fourth mirror and the second mirror to the second objective lens to be enlarged and projected to The second detector.

進一步的，該第一反射鏡和第二反射鏡镜之間設有第三分束鏡；該第一反射鏡上的光線經該第三分束鏡投射至第一基片上，該第一基片上反射的光線依序經該第三分束鏡、第一反射鏡轉向至第一物鏡放大後投射至該第一探測器上；該第二反射鏡上的光線經該第三分束鏡投射至第二基片上，該第二基片上反射的光線依序經該第三分束鏡、第二反射鏡轉向至第二物鏡放大後投射至該第二探測器上。 Further, a third beam splitter is provided between the first mirror and the second mirror; the light on the first mirror is projected onto the first substrate through the third beam splitter, and the first base The light reflected on the sheet is sequentially turned by the third beam splitter and the first mirror to the first objective lens to be enlarged and projected onto the first detector; the light on the second mirror is projected through the third beam splitter On the second substrate, the light reflected on the second substrate is sequentially turned by the third beam splitter and the second reflector to the second objective lens and then projected onto the second detector.

進一步的，該第一照明光源、第二照明光源沿X軸方向設於該第一反射鏡和第二反射鏡之間，該第一照明光源、第二照明光源沿Y軸對稱設置，且分別與該第一基片和第二基片對應，該第一照明光源、第二照明光源發出的照明光線分別直接投射至第一基片、第二基片上。 Further, the first illumination light source and the second illumination light source are disposed between the first reflection mirror and the second reflection mirror along the X axis direction, and the first illumination light source and the second illumination light source are symmetrically disposed along the Y axis, and are respectively Corresponding to the first substrate and the second substrate, the illumination light emitted by the first illumination light source and the second illumination light source are directly projected onto the first substrate and the second substrate, respectively.

進一步的，該第一物鏡和該第一照明光源之間設有第三反射鏡，該第二物鏡和該第二照明光源之間設有第四反射鏡，該第一基片上反射的光線依序經該第三反射鏡、第一反射鏡轉向至第一物鏡放大後投射至該第一探測器上；該第二基片上反射的光線依序經該第四反射鏡、第二反射鏡轉向至第二物鏡放大後投射至該第二探測器上。 Further, a third reflector is provided between the first objective lens and the first illumination light source, and a fourth reflector is provided between the second objective lens and the second illumination light source, and the light reflected on the first substrate depends on The third mirror and the first mirror are sequentially turned to the first objective lens and then projected onto the first detector; the light reflected on the second substrate is sequentially turned through the fourth mirror and the second mirror. After the second objective lens is enlarged, it is projected onto the second detector.

進一步的，該第一照明光源和第二照明光源之間設有第三分束鏡，該第三分束鏡与該第一照明光源和第二照明光源的位置對應；該第一基片上反射的光線依序經該第三分束鏡、第 一反射鏡轉向至第一物鏡放大後投射至該第一探測器上；該第二基片上反射的光線依序經該第三分束鏡、第二反射鏡轉向至第二物鏡放大後投射至該第二探測器上。 Further, a third beam splitter is provided between the first illumination light source and the second illumination light source, and the third beam splitter corresponds to the positions of the first illumination light source and the second illumination light source; the reflection on the first substrate The light beams are sequentially turned by the third beam splitter and the first reflector to the first objective lens and then projected onto the first detector; the light reflected on the second substrate is sequentially passed through the third beam splitter, The second reflecting mirror is turned to the second objective lens and is projected onto the second detector.

進一步的，該第一、第二探測器採用CCD相機。 Further, the first and second detectors use a CCD camera.

本發明還提供一種基片對準裝置，採用如上所述的用於基片對準的機器視覺系統。 The invention also provides a substrate alignment device using the machine vision system for substrate alignment as described above.

本發明提供的用於基片對準的機器視覺系統及對準裝置，該系統包括第一、第二照明光源，第一、第二反射鏡，第一、第二物鏡，第一、第二探測器，該第一、第二照明光源之間，該第一、第二反射鏡之間，該第一、第二物鏡之間以及第一、第二探測器之間關於X軸對稱，該第一、第二照明光源發出的照明光線照射至對應的基片上進行反射，並經對應的物鏡放大之後投射至對應的探測器上進行探測。本發明藉由將該第一、第二照明光源之間，該第一、第二反射鏡之間，該第一、第二物鏡之間以及第一、第二探測器之間關於X軸對稱設置，大大減少機器視覺系統在鏡筒方向的佔用體積，擴大機器視覺系統的檢測範圍，提高對準效率和精度。 A machine vision system and an alignment device for substrate alignment provided by the present invention, the system includes first and second illumination light sources, first and second reflecting mirrors, first and second objective lenses, and first and second The detector is symmetrical about the X axis between the first and second illumination light sources, the first and second reflectors, the first and second objective lenses, and the first and second detectors. The illumination light emitted by the first and second illumination light sources is irradiated on the corresponding substrate for reflection, and after being amplified by the corresponding objective lens, it is projected on the corresponding detector for detection. In the present invention, the X-axis symmetry is provided between the first and second illumination light sources, the first and second reflecting mirrors, the first and second objective lenses, and the first and second detectors. The setting greatly reduces the occupied volume of the machine vision system in the direction of the lens barrel, expands the detection range of the machine vision system, and improves alignment efficiency and accuracy.

1‧‧‧第一基片 1‧‧‧ the first substrate

1’‧‧‧第一基片 1’‧‧‧first substrate

2‧‧‧第二基片 2‧‧‧ second substrate

2’‧‧‧第二基片 2’‧‧‧second substrate

3’‧‧‧顯微物鏡 3’‧‧‧ Micro Objective

11‧‧‧第一照明光源 11‧‧‧The first lighting source

12‧‧‧第二照明光源 12‧‧‧second lighting source

21‧‧‧第一反射鏡 21‧‧‧The first mirror

22‧‧‧第二反射鏡 22‧‧‧Second Mirror

23‧‧‧第三反射鏡 23‧‧‧ Third Mirror

24‧‧‧第四反射鏡 24‧‧‧ Fourth Mirror

31‧‧‧第一物鏡 31‧‧‧The first objective lens

32‧‧‧第二物鏡 32‧‧‧Second objective lens

41‧‧‧第一探測器 41‧‧‧first detector

42‧‧‧第二探測器 42‧‧‧Second Detector

51‧‧‧第一分束鏡 51‧‧‧First Beamsplitter

52‧‧‧第二分束鏡 52‧‧‧Second Beamsplitter

53‧‧‧第三分束鏡 53‧‧‧ Third Beamsplitter

圖1是現有技術中檢測裝置的結構示意圖；圖2是本發明實施例1用於基片對準的機器視覺系統的結構示意圖；圖3是圖2中A處的側視圖；圖4是本發明實施例2用於基片對準的機器視覺系統的結構示 意圖；圖5是圖4中A處的側視圖；圖6是本發明實施例3用於基片對準的機器視覺系統的結構示意圖；圖7是圖6中A處的側視圖；圖8是本發明實施例5用於基片對準的機器視覺系統的結構示意圖；圖9是圖8中A處的側視圖。 1 is a schematic structural diagram of a detection device in the prior art; FIG. 2 is a schematic structural diagram of a machine vision system for substrate alignment according to Embodiment 1 of the present invention; FIG. 3 is a side view at A in FIG. 2; Embodiment 2 of the present invention is a schematic diagram of a structure of a machine vision system for substrate alignment; FIG. 5 is a side view at A in FIG. 4; and FIG. 6 is a structure of a machine vision system for substrate alignment according to Embodiment 3 of the present invention 7 is a side view at A in FIG. 6; FIG. 8 is a schematic structural diagram of a machine vision system for substrate alignment according to Embodiment 5 of the present invention; and FIG. 9 is a side view at A in FIG. 8.

下面結合附圖對本發明作詳細描述。 The present invention is described in detail below with reference to the drawings.

[實施例1]     [Example 1]    

如圖2-3所示，本發明提供一種用於基片對準的機器視覺系統，設於沿Y軸對稱設置的第一、第二基片之間，包括第一、第二照明光源11、12，第一、第二反射鏡21、22，第一、第二物鏡31、32，第一、第二探測器41、42，該第一、第二照明光源11、12之間，該第一、第二反射鏡21、22之間，該第一、第二物鏡31、32之間以及第一、第二探測器41、42之間關於X軸對稱，該第一、第二照明光源11、12發出的照明光線照射至對應的基片上進行反射，並經對應的物鏡放大之後投射至對應的探測器上進行探測，較佳的，該第一、第二探測器41、42採用CCD相機。具體的，第一照明光源11發出的照明光線照射至第一基片1上進行反射，並經第一物鏡31放大之後投射至第一探測器41上進行探測，第二照明光源12發出的照明光線照射至第二基片2上進行反射，並經第二 物鏡32放大之後投射至第二探測器42上進行探測。藉由將該第一、第二照明光源11、12之間，該第一、第二反射鏡21、22之間，該第一、第二物鏡31、32之間以及第一、第二探測器41、42之間關於X軸對稱設置，即本系統包括兩條沿X軸對稱的檢測光路，分別對第一、第二基片進行檢測，大大減少機器視覺系統在鏡筒方向(即沿X軸方向)的佔用體積，擴大機器視覺系統的檢測範圍，提高對準效率和精度。 As shown in FIG. 2-3, the present invention provides a machine vision system for substrate alignment, which is disposed between first and second substrates symmetrically disposed along the Y axis, and includes first and second illumination light sources 11 12, 12, first and second reflecting mirrors 21, 22, first and second objective lenses 31, 32, first and second detectors 41, 42, between the first and second illumination light sources 11, 12, and Between the first and second reflectors 21 and 22, the first and second objective lenses 31 and 32, and the first and second detectors 41 and 42 are symmetrical about the X axis, and the first and second illuminations The illumination light emitted by the light sources 11 and 12 is irradiated on the corresponding substrate for reflection, and after being amplified by the corresponding objective lens, it is projected on the corresponding detector for detection. Preferably, the first and second detectors 41 and 42 use CCD camera. Specifically, the illumination light emitted by the first illumination light source 11 is irradiated onto the first substrate 1 for reflection, and is amplified by the first objective lens 31 and then projected onto the first detector 41 for detection. The illumination emitted by the second illumination light source 12 is The light is irradiated onto the second substrate 2 for reflection, and after being amplified by the second objective lens 32, it is projected onto the second detector 42 for detection. By the first and second illumination light sources 11 and 12, the first and second reflectors 21 and 22, the first and second objective lenses 31 and 32, and the first and second detection The sensors 41 and 42 are arranged symmetrically about the X axis, that is, the system includes two detection light paths symmetrical along the X axis, which respectively detect the first and second substrates, greatly reducing the machine vision system in the direction of the lens barrel (that is, along the (X-axis direction) occupied volume, expand the detection range of the machine vision system, and improve alignment efficiency and accuracy.

較佳的，該第一、第二照明光源11、12，該第一、第二反射鏡21、22，該第一、第二物鏡31、32，以及該第一、第二探測器41、42固設於基礎框架上，該基礎框架上連有驅動機構，帶動該基礎框架沿X/Y/Z方向運動，從而實現針對第一、第二基片上任意位置進行檢測。 Preferably, the first and second illumination light sources 11 and 12, the first and second reflecting mirrors 21 and 22, the first and second objective lenses 31 and 32, and the first and second detectors 41, 42 is fixed on the basic frame, and a driving mechanism is connected to the basic frame to drive the basic frame to move in the X / Y / Z direction, thereby detecting at any position on the first and second substrates.

較佳的，該第一物鏡31和第二物鏡32沿Y軸對稱設置，且分別與該第一基片和第二基片對應，該第一、第二反射鏡21、22關於該第一物鏡31、第二物鏡32對稱設置。具體的，該第一、第二反射鏡21、22分別位於XY平面的上下兩側。較佳的，該第一反射鏡21和第一探測器41沿該X軸水平設置，該第二反射鏡21和第二探測器41沿該X軸水平設置，且該第一、第二探測器41、42位於該第一物鏡31、第二物鏡32沿X軸方向的同一側。 Preferably, the first objective lens 31 and the second objective lens 32 are symmetrically disposed along the Y axis, and correspond to the first substrate and the second substrate, respectively. The first and second reflecting mirrors 21 and 22 are about the first substrate. The objective lens 31 and the second objective lens 32 are arranged symmetrically. Specifically, the first and second reflecting mirrors 21 and 22 are located on the upper and lower sides of the XY plane, respectively. Preferably, the first reflector 21 and the first detector 41 are horizontally arranged along the X axis, the second reflector 21 and the second detector 41 are horizontally arranged along the X axis, and the first and second detectors The first objective lens 31 and the second objective lens 32 are located on the same side in the X-axis direction.

較佳的，該第一反射鏡21和第一探測器41之間設有第一分束鏡51，該第一照明光源11的位置與該第一分束鏡51對應，該第二反射鏡22和第二探測器42之間設有第二分束鏡52，該第二照明光源22的位置與該第二分束鏡52對應，該第一照明光源11發出的照射光線經該第一分束鏡51投射至該第一反射鏡21上， 該第二照明光源12發出的照射光線經該第二分束鏡52投射至該第二反射鏡22上進行探測。 Preferably, a first beam splitter 51 is provided between the first reflector 21 and the first detector 41, and a position of the first illumination light source 11 corresponds to the first beam splitter 51, and the second reflector A second beam splitter 52 is provided between 22 and the second detector 42. The position of the second illumination light source 22 corresponds to the second beam splitter 52. The irradiation light emitted by the first illumination light source 11 passes through the first The beam splitter 51 is projected onto the first reflector 21, and the illumination light emitted by the second illumination light source 12 is projected onto the second reflector 22 via the second beam splitter 52 for detection.

較佳的，該第一物鏡31和該第一反射鏡11之間設有第三反射鏡23，該第二物鏡32和該第二反射鏡22之間設有第四反射鏡24，該第一反射鏡11上的光線經該第三反射鏡23投射至第一基片上，該第一基片上反射的光線經第一物鏡31放大後依序經該第三反射鏡23、第一反射鏡21轉向後投射至該第一探測器41上；該第二反射鏡22上的光線經該第四反射鏡24投射至第二基片上，該第二基片上反射的光線經第二物鏡32放大後依序經該第四反射鏡24、第二反射鏡22轉向後投射至該第二探測器42上進行探測。 Preferably, a third reflecting mirror 23 is provided between the first objective lens 31 and the first reflecting mirror 11, and a fourth reflecting mirror 24 is provided between the second objective lens 32 and the second reflecting mirror 22. The light on a reflector 11 is projected onto the first substrate through the third reflector 23, and the light reflected on the first substrate is amplified by the first objective lens 31 and sequentially passes through the third reflector 23 and the first reflector. 21 turns and projects onto the first detector 41; the light on the second reflector 22 is projected onto the second substrate via the fourth reflector 24, and the light reflected on the second substrate is amplified by the second objective lens 32 Then, they are turned by the fourth reflecting mirror 24 and the second reflecting mirror 22 and projected on the second detector 42 for detection.

本發明還提供一種基片對準裝置，採用如上所述的用於基片對準的機器視覺系統。 The invention also provides a substrate alignment device using the machine vision system for substrate alignment as described above.

[實施例2]     [Example 2]    

如圖4-5所示，與實施例1不同的是，本實施例中，該第一反射鏡21和第二反射鏡22之間設有第三分束鏡53(見圖5)，該第三分束鏡53與該第一物鏡31和第二物鏡32的位置對應，該第一反射鏡21上的光線經該第三分束鏡53投射至第一基片上，該第一基片上反射的光線經第一物鏡31放大後依序經該第三分束鏡53、第一反射鏡21轉向後投射至該第一探測器41上進行探測；該第二反射鏡22上的光線經該第三分束鏡53投射至第二基片上，該第二基片上反射的光線經第二物鏡32放大後依序經該第三分束鏡53、第二反射鏡22轉向後投射至該第二探測器42上進行探測。本實施例中採用第三分束鏡53同時實現對兩個光路的光線進行反射，在 此過程中，需控制第一照明光源11和第二照明光源12發出的照明光線的波長不同，以免在第三分束鏡53中發生干涉而影響探測結果。 As shown in FIG. 4-5, the difference from Embodiment 1 is that in this embodiment, a third beam splitter 53 (see FIG. 5) is provided between the first reflecting mirror 21 and the second reflecting mirror 22. The third beam splitter 53 corresponds to the positions of the first objective lens 31 and the second objective lens 32. The light on the first reflector 21 is projected on the first substrate through the third beam splitter 53 and on the first substrate. The reflected light is amplified by the first objective lens 31 and sequentially passes through the third beam splitter 53 and the first reflector 21, and then is projected onto the first detector 41 for detection; the light on the second reflector 22 is detected by The third beam splitter 53 is projected onto the second substrate, and the light reflected on the second substrate is amplified by the second objective lens 32, and is sequentially turned by the third beam splitter 53 and the second reflector 22 and then projected onto the second substrate. Detection is performed on the second detector 42. In this embodiment, the third beam splitter 53 is used to simultaneously reflect light from two light paths. In this process, it is necessary to control the wavelengths of the illumination light emitted by the first illumination light source 11 and the second illumination light source 12 to avoid Interference occurs in the third beam splitter 53 and affects the detection result.

[實施例3]     [Example 3]    

如圖6-7所示，與實施例1-2不同的是，本實施例中，該第一反射鏡21、第一物鏡31和第一探測器42沿X軸方向依序排列，該第二反射鏡22、第二物鏡32和第二探測器42沿X軸方向依序排列。採用該排列方式可以獲得更大的物鏡的工作距，節約Y方向空間。 As shown in FIG. 6-7, different from Embodiment 1-2, in this embodiment, the first reflecting mirror 21, the first objective lens 31, and the first detector 42 are sequentially arranged along the X-axis direction. The two reflecting mirrors 22, the second objective lens 32, and the second detector 42 are sequentially arranged along the X-axis direction. With this arrangement, a larger working distance of the objective lens can be obtained, which saves space in the Y direction.

較佳的，該第一物鏡31和第一探測器41之間設有第一分束鏡51，該第一照明光源11的位置與該第一分束鏡51對應，該第二物鏡32和第二探測器42之間設有第二分束鏡52，該第二照明光源12的位置與該第二分束鏡52對應，該第一照明光源11發出的照射光線經該第一分束鏡51投射至該第一反射鏡21上，該第二照明光源12發出的照射光線經該第二分束鏡52投射至該第二反射鏡22上。 Preferably, a first beam splitter 51 is provided between the first objective lens 31 and the first detector 41, a position of the first illumination light source 11 corresponds to the first beam splitter 51, and the second objective lens 32 and A second beam splitter 52 is provided between the second detectors 42. The position of the second illumination light source 12 corresponds to the second beam splitter 52, and the irradiation light emitted by the first illumination light source 11 passes through the first beam splitter. The mirror 51 is projected onto the first reflecting mirror 21, and the illumination light emitted by the second illumination light source 12 is projected onto the second reflecting mirror 22 via the second beam splitter 52.

較佳的，該第一物鏡31和該第一基片之間設有第三反射鏡23，該第二物鏡22和該第二基片之間設有第四反射鏡24，該第一反射鏡21上的光線經該第三反射鏡23投射至第一基片上，該第一基片上反射的光線依序經該第三反射鏡23、第一反射鏡21轉向至第一物鏡31放大後投射至該第一探測器41上進行探測；該第二反射鏡22上的光線經該第四反射鏡24投射至第二基片上，該第二基片上反射的光線依序經該第四反射鏡24、第二反射鏡22轉 向至第二物鏡32放大後投射至該第二探測器42上進行探測。 Preferably, a third reflecting mirror 23 is provided between the first objective lens 31 and the first substrate, and a fourth reflecting mirror 24 is provided between the second objective lens 22 and the second substrate. The light on the mirror 21 is projected onto the first substrate through the third reflecting mirror 23, and the light reflected on the first substrate is sequentially turned by the third reflecting mirror 23 and the first reflecting mirror 21 to the first objective lens 31 to be enlarged. The light is projected onto the first detector 41 for detection; the light on the second reflector 22 is projected onto the second substrate via the fourth reflector 24, and the light reflected on the second substrate is sequentially passed through the fourth reflection The mirror 24 and the second reflecting mirror 22 are turned to the second objective lens 32 and then projected onto the second detector 42 for detection.

[實施例4]     [Example 4]    

與實施例3不同的是，本實施例中，該第一反射鏡21和第二反射鏡22之間設有第三分束鏡53；該第一反射鏡21上的光線經該第三分束鏡53投射至第一基片上，該第一基片上反射的光線依序經該第三分束鏡53、第一反射鏡21轉向至第一物鏡31放大後投射至該第一探測器41上進行探測；該第二反射鏡22上的光線經該第三分束鏡53投射至第二基片上，該第二基片上反射的光線依序經該第三分束鏡53、第二反射鏡22轉向至第二物鏡32放大後投射至該第二探測器42上進行探測。 Different from Embodiment 3, in this embodiment, a third beam splitter 53 is provided between the first mirror 21 and the second mirror 22; the light on the first mirror 21 passes through the third beam splitter. The beam mirror 53 is projected on the first substrate, and the light reflected on the first substrate is sequentially turned by the third beam splitter 53 and the first mirror 21 to the first objective lens 31 and then projected onto the first detector 41. The light on the second reflector 22 is projected onto the second substrate through the third beam splitter 53, and the light reflected on the second substrate is sequentially passed through the third beam splitter 53 and the second reflection The lens 22 is turned to the second objective lens 32 and is projected onto the second detector 42 for detection.

[實施例5]     [Example 5]    

如圖8-9所示，與實施例3-4不同的是，該第一照明光源11、第二照明光源12設於該第一反射鏡21和第二反射鏡22之間，沿Y軸對稱設置，且分別與該第一基片和第二基片對應，該第一照明光源11、第二照明光源12發出的照明光線直接投射至第一基片或第二基片上。 As shown in FIG. 8-9, different from Embodiment 3-4, the first illumination light source 11 and the second illumination light source 12 are disposed between the first reflecting mirror 21 and the second reflecting mirror 22, along the Y axis. They are symmetrically arranged and correspond to the first substrate and the second substrate, respectively. The illumination light emitted by the first illumination light source 11 and the second illumination light source 12 is directly projected onto the first substrate or the second substrate.

較佳的，該第一物鏡31和該第一照明光源11之間設有第三反射鏡23，該第二物鏡32和該第二照明光源12之間設有第四反射鏡24，該第一基片上反射的光線依序經該第三反射鏡23、第一反射鏡21轉向至第一物鏡31放大後投射至該第一探測器41上進行探測；該第二基片上反射的光線依序經該第四反射鏡24、第二反射鏡22轉向至第二物鏡32放大後投射至該第二探測器42上 進行探測。 Preferably, a third reflector 23 is provided between the first objective lens 31 and the first illumination light source 11, and a fourth reflector 24 is provided between the second objective lens 32 and the second illumination light source 12. The light reflected on a substrate is sequentially turned by the third mirror 23, the first mirror 21 to the first objective lens 31, and then is projected onto the first detector 41 for detection; the light reflected on the second substrate is detected in accordance with In turn, the fourth reflector 24 and the second reflector 22 are turned to the second objective lens 32 to be magnified and projected onto the second detector 42 for detection.

[實施例6]     [Example 6]    

與實施例5不同的是，本實施例中，該第一照明光源11和第二照明光源12之間設有第三分束鏡53，該第三分束鏡53與該第一照明光源11和第二照明光源12的位置對應；該第一基片上反射的光線依序經該第三分束鏡53、第一反射鏡21轉向至第一物鏡31放大後投射至該第一探測器41上進行探測；該第二基片上反射的光線依序經該第三分束鏡53、第二反射鏡22轉向至第二物鏡32放大後投射至該第二探測器42上進行探測。 Different from Embodiment 5, in this embodiment, a third beam splitter 53 is provided between the first illumination light source 11 and the second illumination light source 12, and the third beam splitter 53 and the first illumination light source 11 Corresponds to the position of the second illumination light source 12; the light reflected on the first substrate is sequentially turned by the third beam splitter 53 and the first reflector 21 to the first objective lens 31 and then projected to the first detector 41 The light reflected on the second substrate is sequentially turned by the third beam splitter 53 and the second reflector 22 to the second objective lens 32 and then projected onto the second detector 42 for detection.

綜上所述，本發明提供的用於基片對準的機器視覺系統及對準裝置，該系統包括第一、第二照明光源11、12，第一、第二反射鏡21、22，第一、第二物鏡31、32，第一、第二探測器41、42，該第一、第二照明光源11、12之間，該第一、第二反射鏡21、22之間，該第一、第二物鏡31、32之間以及第一、第二探測器41、42之間關於X軸對稱，該第一、第二照明光源11、12發出的照明光線照射至對應的基片上進行反射，並經對應的物鏡放大之後投射至對應的探測器上進行探測。本發明藉由將該第一、第二照明光源11、12之間，該第一、第二反射鏡之間21、22，該第一、第二物鏡31、32之間以及第一、第二探測器41、42之間關於X軸對稱設置，大大減少機器視覺系統在鏡筒方向的佔用體積，擴大機器視覺系統的檢測範圍，提高對準效率和精度。 In summary, the present invention provides a machine vision system and alignment device for substrate alignment. The system includes first and second illumination light sources 11, 12, first and second reflecting mirrors 21, 22, and First, second objective lenses 31, 32, first and second detectors 41, 42, between the first and second illumination light sources 11, 12, between the first and second reflecting mirrors 21, 22, the first First, the second objective lens 31 and 32 and the first and second detectors 41 and 42 are symmetrical with respect to the X axis. The illumination light emitted by the first and second illumination light sources 11 and 12 is irradiated on the corresponding substrate. Reflected and amplified by the corresponding objective lens and then projected to the corresponding detector for detection. According to the present invention, the first and second illumination light sources 11 and 12, the first and second reflectors 21 and 22, the first and second objective lenses 31 and 32, and the first and second The two detectors 41 and 42 are symmetrically arranged about the X axis, which greatly reduces the occupied volume of the machine vision system in the direction of the lens barrel, expands the detection range of the machine vision system, and improves alignment efficiency and accuracy.

雖然說明書中對本發明的實施方式進行說明，但這些實施方式只是作為提示，不應限定本發明的保護範圍。在不脫離本 發明宗旨的範圍內進行各種省略、置換和變更均應包含在本發明的保護範圍內。 Although the embodiments of the present invention are described in the specification, these embodiments are only for suggestion and should not limit the protection scope of the present invention. Various omissions, substitutions, and changes without departing from the spirit of the present invention should be included in the protection scope of the present invention.

Claims (16)

一種用於基片對準的機器視覺系統，設於沿X軸對稱設置的一第一基片、一第二基片之間，包括一第一照明光源、一第二照明光源，一第一反射鏡、一第二反射鏡，一第一物鏡、一第二物鏡，一第一探測器、一第二探測器，其特徵在於：該第一照明光源、該第二照明光源之間，該第一反射鏡、該第二反射鏡之間，該第一物鏡、該第二物鏡之間以及該第一探測器、該第二探測器之間關於X軸對稱，該第一照明光源、該第二照明光源發出的照明光線照射至對應的該第一基片、該第二基片上進行反射，並經對應的該第一物鏡、該第二物鏡放大之後投射至對應的該第一探測器、該第二探測器上進行探測。     A machine vision system for substrate alignment is provided between a first substrate and a second substrate symmetrically disposed along the X axis, and includes a first illumination light source, a second illumination light source, and a first A reflecting mirror, a second reflecting mirror, a first objective lens, a second objective lens, a first detector, a second detector, characterized in that between the first illumination light source and the second illumination light source, the The first reflector, the second reflector, the first objective lens, the second objective lens, and the first detector and the second detector are symmetrical about the X axis. The first illumination light source, the The illumination light emitted by the second illumination light source is irradiated onto the corresponding first substrate and reflected on the second substrate, and is projected onto the corresponding first detector after being amplified by the corresponding first objective lens and the second objective lens. And detecting on the second detector.     如請求項1之用於基片對準的機器視覺系統，其中，該第一照明光源、該第二照明光源，該第一反射鏡、該第二反射鏡，該第一物鏡、該第二物鏡，以及該第一探測器、該第二探測器固設於一基礎框架上，該基礎框架上連有一驅動機構，帶動該基礎框架沿X軸、Y軸、Z軸中的任意一個或幾個方向運動，其中，Y軸與X軸正交，Z軸同時與X軸和Y軸正交。     The machine vision system for substrate alignment according to claim 1, wherein the first illumination light source, the second illumination light source, the first reflector, the second reflector, the first objective lens, the second The objective lens, the first detector, and the second detector are fixed on a basic frame, and a driving mechanism is connected to the basic frame to drive the basic frame along any one or several of the X-axis, Y-axis, and Z-axis. Movement in all directions, where the Y axis is orthogonal to the X axis, and the Z axis is orthogonal to both the X and Y axes.     如請求項2之用於基片對準的機器視覺系統，其中，該第一物鏡和該第二物鏡沿X軸對稱設置，且分別與該第一基片和該第二基片對應，該第一反射鏡、該第二反射鏡關於該第一物鏡和該第二物鏡對稱設置。     For example, the machine vision system for substrate alignment of claim 2, wherein the first objective lens and the second objective lens are arranged symmetrically along the X axis, and respectively correspond to the first substrate and the second substrate, and The first mirror and the second mirror are disposed symmetrically about the first objective lens and the second objective lens.     如請求項3之用於基片對準的機器視覺系統，其中，該第一反射鏡和該第一探測器沿X軸水平設置，該第二反射鏡和該第二探測器沿X軸水平設置，且該第一探測器、該第二探測器位於該第一物鏡、該第二物鏡沿X軸方向的同一側。     The machine vision system for substrate alignment according to claim 3, wherein the first reflector and the first detector are horizontally arranged along the X axis, and the second reflector and the second detector are horizontally along the X axis And the first detector and the second detector are located on the same side of the first objective lens and the second objective lens along the X-axis direction.     如請求項4之用於基片對準的機器視覺系統，其中，該第一反射鏡和該第一探測器之間設有一第一分束鏡，該第一照明光源的位置與該第一分束鏡對應，該第二反射鏡和該第二探測器之間設有一第二分束鏡，該第二照明光源的位置與該第二分束鏡對應，該第一照明光源發出的照射光線經該第一分束鏡投射至該第一反射鏡上，該第二照明光源發出的照射光線經該第二分束鏡投射至該第二反射鏡上。     The machine vision system for substrate alignment according to claim 4, wherein a first beam splitter is disposed between the first reflector and the first detector, and the position of the first illumination light source and the first Corresponding to the beam splitter, a second beam splitter is provided between the second reflector and the second detector. The position of the second illumination light source corresponds to the second beam splitter. The light is projected onto the first reflector through the first beam splitter, and the illumination light emitted by the second illumination light source is projected onto the second reflector through the second beam splitter.     如請求項5之用於基片對準的機器視覺系統，其中，該第一物鏡和該第一反射鏡之間設有一第三反射鏡，該第二物鏡和該第二反射鏡之間設有一第四反射鏡，投射至該第一反射鏡上的光線經該第三反射鏡投射至該第一基片上，該第一基片上反射的光線經該第一物鏡放大後依序經該第三反射鏡、該第一反射鏡轉向後投射至該第一探測器上；投射至該第二反射鏡上的光線經該第四反射鏡投射至該第二基片上，該第二基片上反射的光線經該第二物鏡放大後依序經該第四反射鏡、該第二反射鏡轉向後投射至該第二探測器上。     The machine vision system for substrate alignment according to claim 5, wherein a third reflector is provided between the first objective lens and the first reflector, and a second reflector is provided between the second objective lens and the second reflector. There is a fourth mirror, and the light projected on the first mirror is projected on the first substrate through the third mirror. The light reflected on the first substrate is sequentially amplified by the first objective lens and then passes through the first mirror. The three mirrors and the first mirror are turned and projected onto the first detector; the light projected onto the second mirror is projected onto the second substrate through the fourth mirror, and reflected on the second substrate After being amplified by the second objective lens, the light rays are sequentially projected onto the second detector after being turned by the fourth mirror and the second mirror.     如請求項5之用於基片對準的機器視覺系統，其中，該第一反射鏡和該第二反射鏡之間設有一第三分束鏡，該第三分束鏡與該第一物鏡和該第二物鏡的位置對應；該第一反射鏡上的光線經該第三分束鏡投射至該第一基片上，該第一基片上反射的光線經該第一物鏡放大後依序經該第三分束鏡、該第一反射鏡轉向後投射至該第一探測器上；該第二反射鏡上的光線經該第三分束鏡投射至該第二基片上，該第二基片上反射的光線經該第二物鏡放大後依序經該第三分束鏡、該第二反射鏡轉向後投射至該第二探測器上。     The machine vision system for substrate alignment according to claim 5, wherein a third beam splitter is disposed between the first mirror and the second mirror, and the third beam splitter and the first objective lens Corresponds to the position of the second objective lens; the light on the first reflector is projected onto the first substrate by the third beam splitter, and the light reflected on the first substrate passes through the first objective lens in order to pass through The third beam splitter and the first reflector are projected onto the first detector after turning; the light on the second reflector is projected onto the second substrate through the third beam splitter, and the second base The light reflected on the chip is amplified by the second objective lens, sequentially passes through the third beam splitter, and is turned by the second reflector to be projected onto the second detector.     如請求項2之用於基片對準的機器視覺系統，其中，該第一反射鏡、該第一物鏡和該第一探測器沿X軸方向依序排列，該第二反射鏡、 該第二物鏡和該第二探測器沿X軸方向依序排列。     For example, the machine vision system for substrate alignment of claim 2, wherein the first reflector, the first objective lens, and the first detector are sequentially arranged along the X-axis direction, and the second reflector, the first The two objective lenses and the second detector are sequentially arranged along the X-axis direction.     如請求項8之用於基片對準的機器視覺系統，其中，該第一物鏡和該第一探測器之間設有一第一分束鏡，該第一照明光源的位置與該第一分束鏡對應，該第二物鏡和該第二探測器之間設有一第二分束鏡，該第二照明光源的位置與該第二分束鏡對應，該第一照明光源發出的照射光線經該第一分束鏡投射至該第一反射鏡上，該第二照明光源發出的照射光線經該第二分束鏡投射至該第二反射鏡上。     The machine vision system for substrate alignment according to claim 8, wherein a first beam splitter is provided between the first objective lens and the first detector, and the position of the first illumination light source and the first beam splitter The beam mirror corresponds to a second beam splitter provided between the second objective lens and the second detector. The position of the second illumination light source corresponds to the second beam splitter. The first beam splitter is projected onto the first reflector, and the illumination light emitted by the second illumination light source is projected onto the second mirror via the second beam splitter.     如請求項9之用於基片對準的機器視覺系統，其中，該第一物鏡和該第一基片之間設有一第三反射鏡，該第二物鏡和該第二基片之間設有一第四反射鏡，投射至該第一反射鏡上的光線經該第三反射鏡投射至該第一基片上，該第一基片上反射的光線依序經該第三反射鏡、該第一反射鏡轉向至該第一物鏡放大後投射至該第一探測器上；投射至該第二反射鏡上的光線經該第四反射鏡投射至該第二基片上，該第二基片上反射的光線依序經該第四反射鏡、該第二反射鏡轉向至該第二物鏡放大後投射至該第二探測器上。     The machine vision system for substrate alignment according to claim 9, wherein a third reflector is provided between the first objective lens and the first substrate, and a second reflector is provided between the second objective lens and the second substrate. There is a fourth mirror, and the light projected on the first mirror is projected on the first substrate through the third mirror, and the light reflected on the first substrate passes the third mirror and the first in order. The reflecting mirror is turned to the first objective lens and is projected onto the first detector; the light projected onto the second reflecting mirror is projected onto the second substrate through the fourth reflecting mirror, and The light is sequentially turned through the fourth mirror and the second mirror to the second objective lens, and then is projected onto the second detector.     如請求項9之用於基片對準的機器視覺系統，其中，該第一反射鏡和該第二反射鏡之間設有一第三分束鏡；該第一反射鏡上的光線經該第三分束鏡投射至該第一基片上，該第一基片上反射的光線依序經該第三分束鏡、該第一反射鏡轉向至該第一物鏡放大後投射至該第一探測器上；該第二反射鏡上的光線經該第三分束鏡投射至該第二基片上，該第二基片上反射的光線依序經該第三分束鏡、該第二反射鏡轉向至該第二物鏡放大後投射至該第二探測器上。     For example, the machine vision system for substrate alignment according to claim 9, wherein a third beam splitter is provided between the first reflector and the second reflector; the light on the first reflector passes through the first reflector. The third beam splitter is projected onto the first substrate, and the light reflected on the first substrate is sequentially passed through the third beam splitter and the first mirror to the first objective lens to be magnified and then projected to the first detector. The light on the second reflector is projected onto the second substrate through the third beam splitter, and the light reflected on the second substrate is sequentially turned through the third beam splitter and the second reflector to The second objective lens is projected onto the second detector after being magnified.     如請求項8之用於基片對準的機器視覺系統，其中，該第一照明光源、該第二照明光源沿X軸方向設於該第一反射鏡和該第二反射鏡 之間，該第一照明光源、該第二照明光源沿Y軸對稱設置，且分別與該第一基片和該第二基片對應，該第一照明光源、該第二照明光源發出的照明光線分別直接投射至該第一基片、該第二基片上。     The machine vision system for substrate alignment as claimed in claim 8, wherein the first illumination light source and the second illumination light source are disposed between the first reflector and the second reflector along the X-axis direction, the The first illumination light source and the second illumination light source are symmetrically arranged along the Y axis, and respectively correspond to the first substrate and the second substrate. The illumination light emitted by the first illumination light source and the second illumination light source is directly projected, respectively. To the first substrate and the second substrate.     如請求項12之用於基片對準的機器視覺系統，其中，該第一物鏡和該第一照明光源之間設有一第三反射鏡，該第二物鏡和該第二照明光源之間設有一第四反射鏡，該第一基片上反射的光線依序經該第三反射鏡、該第一反射鏡轉向至該第一物鏡放大後投射至該第一探測器上；該第二基片上反射的光線依序經該第四反射鏡、該第二反射鏡轉向至該第二物鏡放大後投射至該第二探測器上。     The machine vision system for substrate alignment according to claim 12, wherein a third reflector is provided between the first objective lens and the first illumination light source, and a second reflector is provided between the second objective lens and the second illumination light source. There is a fourth reflector, and the light reflected on the first substrate is sequentially passed through the third reflector and the first reflector to the first objective lens to be magnified and then projected onto the first detector; on the second substrate The reflected light is sequentially turned by the fourth mirror and the second mirror to the second objective lens, and then is projected onto the second detector.     如請求項12之用於基片對準的機器視覺系統，其中，該第一照明光源和該第二照明光源之間設有一第三分束鏡，該第三分束鏡與該第一照明光源和該第二照明光源的位置對應；該第一基片上反射的光線依序經該第三分束鏡、該第一反射鏡轉向至該第一物鏡放大後投射至該第一探測器上；該第二基片上反射的光線依序經該第三分束鏡、該第二反射鏡轉向至該第二物鏡放大後投射至該第二探測器上。     The machine vision system for substrate alignment according to claim 12, wherein a third beam splitter is provided between the first illumination light source and the second illumination light source, and the third beam splitter and the first illumination The light source corresponds to the position of the second illumination light source; the light reflected on the first substrate is sequentially turned by the third beam splitter and the first reflector to the first objective lens, and is projected onto the first detector. ; The light reflected on the second substrate is sequentially passed through the third beam splitter and the second reflector to the second objective lens to be magnified and then projected onto the second detector.     如請求項1之用於基片對準的機器視覺系統，其中，該第一探測器、該第二探測器採用CCD相機。     The machine vision system for substrate alignment according to claim 1, wherein the first detector and the second detector are CCD cameras.     一種基片對準裝置，其採用請求項1至15中任一項之用於基片對準的機器視覺系統。     A substrate alignment device using the machine vision system for substrate alignment according to any one of claims 1 to 15.    
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