TW201816404A - Test socket with ultra-high temperature testing function - Google Patents

Abstract

The present invention provides a test socket for testing an image sensor chip. The test socket comprises a socket frame made of a plastic material with a relatively low thermal conductivity, and a frame cover made of a metal with a relatively high thermal conductivity configured under the socket frame. At least one floating plate is configured within the socket frame, with plural pogo pins configured thereof. At least one heater is configured on the within the socket frame. At least one pogo pins housing is configured for the plural pogo pins passing through thereof.

Description

 Test stand with high temperature test function  

The present invention relates to a test stand for a semiconductor component, and more particularly to a semiconductor component test stand suitable for high temperature testing.

With the advancement of the times, the demand for technology products has become higher and higher. Under the principle of keeping the products light and thin, the functional requirements have only increased. In the case of enhanced functions but reduced size, electronic circuits have gradually As the product becomes more integrated, the cost of manufacturing is increased when fabricating a powerful wafer. For these expensive wafers, the quality control requirements must be higher and higher.

The image sensing wafer, such as a complementary metal oxide semiconductor CMOS image sensor or a charge coupled device (CCD), is still subjected to final testing after being packaged.

With the proliferation of digital cameras, mobile phones, tablets, notebook computers, car cameras, and various types of monitors, the huge demand for camera devices has increased, and the field of image sensor testing has been gradually developed.

In the image sensing chip that is ready to be shipped from the factory, it must be tested by the product. Traditionally, in order to test these precision image sensing wafer components, the wafer to be tested will be soldered over the test board. However, the wafer to be tested is soldered on the test circuit board, and it is difficult to remove after the test is completed, which tends to make the wafer to be tested into consumables, resulting in unnecessary cost. In addition, when the wafer to be tested is soldered, the pin is often broken and unnecessary waste is caused.

On the other hand, the packaged integrated circuit must be electrically tested to ensure the quality of the wafer. In the case of semiconductor packaging plants, due to their high throughput, wafer test systems that can be quickly tested must be used. For subsequent downstream electrical appliance manufacturers, since the number of wafers used is relatively small, it is still necessary to test before the assembly to screen out possible defective products, thereby reducing the defective rate of semi-finished products in the finished product or process. , which can reduce the overall manufacturing cost.

Further, a conventional conventional semiconductor element multi-wafer test stand is equipped with a heating device so that the wafer to be tested can be tested at a high temperature of about 100 °C. That is, the design of the test stand structure is suitable for a test environment with a temperature of 100 ° C. However, when the target test temperature is raised to a temperature higher than 100 ° C, the structural design of the conventional multi-wafer test stand cannot reach the set target temperature, so that the wafer test of higher temperature cannot be achieved. This is due to the fact that in a conventional multi-wafer test stand structure, the metal socket frame has a high thermal conductivity (for example, aluminum thermal conductivity of 237 Wm ^-1 K ^-1 ) and a large volume (for example) :0.0327m ³ ). Therefore, since the metal test stand frame is made entirely of metal material, its thermal conductivity is high, the volume is large, and the heat dissipation is fast, so the heating performance is not good, the temperature rise is very slow and unstable, and the heat energy is dissipated seriously and it is difficult to reach a high temperature environment.

The above conventional multi-wafer test stand structure has problems of poor heating performance and severe heat dissipation, which cannot achieve higher test temperatures and temperature instability. Therefore, in order to improve the above disadvantages, the present invention improves the existing test stand structure, and further proposes an invention having industrial use; it will be described in detail later.

It is an object of the present invention to provide a test stand having a high temperature test function for testing an image sensing wafer.

In order to achieve the above and other objects, the present invention provides a test socket for testing an image sensing wafer, comprising: a test socket frame formed of a plastic material having a low thermal conductivity; and a test frame cover having a height a metal material of thermal conductivity is disposed under the test frame; at least one floating plate is disposed in the test frame cover, and the plurality of probes are disposed in the at least one floating plate; at least one heating device Disposed in the test frame cover; and at least one probe holder for receiving the probes therethrough.

The plastic material is polyether oximine. The metal material is aluminum.

The test frame cover is provided with an accommodating space for the at least one floating plate to be disposed therein.

At least one of the floating plates is made of aluminum.

The at least one probe hub includes a probe upper seat and a probe pin base, wherein the probe upper seat and the probe pin base are respectively provided with a plurality of probe perforations to allow the probes to pass through the probe through holes. The material of the probe upper seat and the probe needle base is polyether quinone.

At least one of the heating devices is a temperature overheating protection device. The test stand frame is provided with an opening such that at least one floating plate is exposed therein. The test seat frame is integrally covered with a test frame cover.

The invention provides a test stand for testing an image sensing chip, comprising: an upper cover member, comprising an upper cover frame, at least one lens holder and at least one working pressure member, wherein at least one lens holder and at least one working pressure member are disposed on a test cover member for pivoting the upper cover member; wherein the test seat member includes a test seat frame, a test frame cover, at least one floating plate, at least one heating device, and a temperature overheat protection device And at least one probe socket; wherein the test socket frame is formed of a plastic material having low thermal conductivity; wherein the test frame cover is formed of a metal material having high thermal conductivity and disposed under the test seat frame; a floating plate disposed in the test frame cover, wherein the plurality of probes are disposed in the at least one floating plate; wherein at least one heating device and the temperature overheat protection device are disposed in the test frame cover; At least one probe holder for receiving the probes therethrough.

The upper cover member further includes an upper cover pivotally connected to the upper cover frame.

These and other advantages are apparent from the following description of the preferred embodiments and claims.

10‧‧‧Upper cover

20‧‧‧Test seat components

100‧‧‧Top cover frame

101‧‧‧ openings

102, 103‧‧‧ card joints

110‧‧‧Upper cover

111‧‧‧ openings

112‧‧‧Card recess

120, 121‧‧‧ lens holder

130, 131‧‧‧Working parts

140‧‧‧ test seat frame

141‧‧‧ openings

142‧‧‧ front opening

143‧‧‧Snap recess

150‧‧‧Test frame cover

151, 152‧‧ ‧ openings

160,161‧‧‧Overheat protection device

165, 166‧‧‧ heating device

170, 171‧‧‧ floating board

172, 173‧‧ probe

180,181‧‧‧ probe needle seat

182, 183, 192, 193 ‧ ‧ probe perforation

190, 191‧‧ ‧ probe needle base

200‧‧‧Test wafer

The present invention will be more fully understood from the following detailed description of the embodiments of the invention, and In the example.

The first figure shows an exploded schematic view of a test mechanism for testing an image sensing wafer of the present invention.

The second figure shows a schematic diagram of a test mechanism for testing an image sensing wafer of the present invention.

The third figure shows a schematic cross-sectional view of a test mechanism for testing an image sensing wafer of the present invention.

The fourth figure is a schematic diagram showing a test stand temperature monitoring experiment for testing an image sensing wafer according to an embodiment of the present invention.

The invention is described in detail herein with reference to the particular embodiments of the invention, and the description of the invention, which is intended to be illustrative, and not to limit the scope of the invention. Therefore, the present invention may be widely practiced in other different embodiments in addition to the specific embodiments and preferred embodiments of the specification. The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can readily understand the utility of the present invention and its advantages by the disclosure of the present disclosure. The present invention may be applied and implemented by other specific embodiments. The details of the present invention may be applied to various needs, and various modifications or changes may be made without departing from the spirit and scope of the invention.

An embodiment described in the specification refers to a particular feature, method or characteristic described in connection with this embodiment, which is included in at least some embodiments. Therefore, the implementation of the various embodiments or aspects of the various embodiments is not necessarily the same embodiment. Furthermore, the features, methods, or characteristics of the invention may be combined as appropriate in one or more embodiments.

In order to provide an ultra-high temperature image wafer test environment, the multi-wafer test bench of the present invention comprises a test socket frame and a test frame cover, which are composed of two materials with different heat conduction and different Structure to ensure a high temperature test environment can be achieved. In the present invention, when the wafer is placed over a socket assembly, a work press is used to fix the wafer. A heater is disposed in the test block member. A lens holder is disposed in the working press. The working press can be placed in a lid assembly. After the upper cover member is combined with the test seat member, high temperature image wafer testing can be performed.

As shown in the first figure, it shows an exploded view of the components of the test mechanism for testing an image sensing wafer of the present invention. The testing mechanism includes a lid frame 100, a lid cover 110, a lens holder 120/121, a working press member 130/131, a test seat frame 140, a test frame cover 150, and a thermal protection device (thermal Switch) 160/161, heater 165/166, floating plate 170/171, probe upper seat 180/181 and probe pin base 190/191, other parts are not shown in the figure. Please refer to the second figure for the combined structure of the test organization. The upper cover 110 is disposed above the upper cover frame 100. The lens holders 120, 121 are disposed in or on the working press members 130, 131, respectively. In one embodiment, the lens holders 120, 121 and the working press members 130, 131 are disposed in the opening 101 of the upper cover frame 100.

The present invention provides that the floating plates 170 and 171 are respectively disposed between the test frame cover 150 and the probe upper seats 180 and 181. In one embodiment, openings 151, 152 are provided in the middle of the test frame cover 150 to provide a space through which the floating plates 171, 170 pass, respectively. In other words, the size of the openings 151, 152 of the test frame cover 150 is approximately larger than the size of the floating plates 171, 170, allowing the floating plates 171, 170 to pass through the openings 151, 152. The opening 151 is adjacent to the opening 152 such that the floating plates 171 and 170 can be disposed adjacent to each other. The shape of the openings 151, 152 may be rectangular or other shape. In the present embodiment, the openings 151, 152 are rectangular in shape, and the floating plates 171, 170 are also rectangular in shape. In addition, grooves are provided on the left and right sides of the test frame cover 150 to provide a space for the overheat protection devices 160, 161 to be disposed under the grooves of the test frame cover 150, respectively. In other words, the size of the recess in the test frame cover 150 is approximately larger than the size of the thermal protection devices 160, 161, allowing the thermal protection devices 160, 161 to be disposed below the recess. The shape of the groove can be rectangular or other shape.

The test stand frame 140 is an element of a material having a low thermal conductivity. For example, the material of the test socket frame 140 is a plastic material. Among the plastic materials, polyetherimide (PEI) materials have a thermal conductivity of about 0.3 Wm ^-1 K ^-1 and have excellent mechanical strength, rigidity, electrical properties and excellent heat resistance (up to temperature). 170 ° C), which is a thermoplastic plastic material. The long-term creep resistance allows PEI materials to replace metals and other materials in many structural strength applications, and maintains excellent electrical characteristics under constantly changing temperature, humidity and frequency conditions. Therefore, the present invention can use PEI as the material of the test socket frame 140. The low thermal conductivity of the test block frame 140 prevents excessive heat loss from the heating devices 165, 166 and maintains a stable test temperature.

The test frame cover 150 is an element of a material having a high thermal conductivity compared to the test block frame 140 being a material having a low thermal conductivity. For example, the material of the test frame cover 150 is a metal material. Among the metal materials, aluminum has a thermal conductivity of about 237 Wm ^-1 K ^-1 . Therefore, the present invention uses aluminum as the material of the test frame cover 150. The high thermal conductivity of the test frame cover 150 allows the temperature of the test to rise relatively quickly to effectively reduce test time. The heating devices 165, 166 are respectively disposed below the floating plates 171, 170, so that the heat energy emitted therefrom can be directly transmitted to the floating plates 171, 170. In one embodiment, the test seat frame 140 is larger in size than the test frame cover 150, so the test block frame 140 can completely cover the test frame cover 150 to avoid excessive loss of thermal energy from the heating devices 165, 166. In one embodiment, an opening 141 is provided in the middle of the test block frame 140 to provide a space such that the floating plates 171, 170 pass through the openings 151, 152 of the test frame cover 150, respectively, and remain exposed in the opening 141. In other words, the size of the opening 141 of the test socket frame 140 is larger than the size of the openings 151, 152 of the test frame cover 150 such that the openings 151, 152 are exposed.

As shown in the second figure, it shows a schematic diagram of the components of the test mechanism for testing an image sensing wafer of the present invention. The test mechanism includes a lid assembly 10 and a test block member 20. The upper cover member 10 is composed of an upper cover frame 100, an upper cover 110, a lens holder 120/121 and a working press member 130/131, wherein the lens holder 120/121 and the working press member 130/131 can be fixed or disposed on the upper cover frame 100. The opening 101 and the opening 111 of the upper cover 110 (as shown in the first figure). For example, the upper cover 110 is provided with a latching recess 112 on both sides thereof, and the upper cover frame 100 is provided with a latching protrusion 103 on the two sides and a latching protrusion 102 on the lower side. The latching protrusions 103 of the upper cover frame 100 are correspondingly (quasi) clamped to the latching recesses 112 (shown in the first figure) on the upper cover 110 to achieve the purpose of pivoting the upper cover 110 to the upper cover frame 100. . The test stand member 20 is composed of a test stand frame 140, a test frame cover 150, a thermal protection device 160/161, a heating device 165/166, a floating plate 170/171, a probe 172/173, and a probe pin holder 180/181. The probe pin bases 190/191 are combined, wherein the overheat protection devices 160/161 and the heating devices 165/166 are respectively disposed under the grooves of the test frame cover 150, and the overheat protection devices 160/161 and the heating device 165/ The wire of 166 extends to the outside through the front end opening 142 of the test socket frame 140 and the front end opening of the test frame cover 150. The floating plates 170, 171 are respectively embedded in the openings 151, 152 of the test frame cover 150. A plurality of pogo pins 172 and 173 are disposed on the floating plates 170 and 171, respectively. The lengths of the probes 172, 173 are sufficient to pass through the upper surface to the lower surface of the floating plate 170, 171, the upper surface to the lower surface of the probe upper seat 180, 181, and the upper surface of the probe base 190, 191, respectively. To the lower surface, after the above components are combined to complete the test block member 20, the upper and lower surfaces of the probes 172, 173 can be exposed, as shown in the third figure. The upper surfaces of the probes 172 and 173 are electrically connected to the solder pads of the test wafer 200, and the lower surfaces of the probes 172 and 173 are electrically connected to external circuits for the purpose of testing the electrical properties of the wafers 200. A plurality of probe through holes 182 and 183 are respectively disposed on the probe pin holders 180 and 181, and a plurality of probe holes 192 and 193 are respectively disposed on the probe pin bases 190 and 191 to facilitate the combination of the floating plates 170 and 171. When the probe upper seats 180, 181 and the probe pins 190, 191 are probed, a plurality of probes 172, 173 therein are passed through the probe holes 182, 183, 192, 193.

For example, a snap recess 143 is provided on both sides of the test socket frame 140. The snap-in protrusions 102 of the upper cover frame 100 are correspondingly (quasi)-locked to the snap-in recesses 143 of the test-seat frame 140 at the bottom to achieve the purpose of pivoting the test-frame frame 140 to the cover frame 100, as shown in the second figure. Shown.

In one embodiment, the test socket of the present invention can be used to test an image sensing wafer, such as a complementary metal oxide semiconductor (CMOS) image sensing wafer or a charge coupled device (CCD). The image sensing wafer has a photosensitive area that faces the light emitted by a light source. The photosensitive area is mainly composed of a pixel array, and the pixel array faces the light source to cover a micro lens so that the light can illuminate every pixel of the pixel array. The microlens has a certain transmittance, and the material thereof may be one or a combination of bismuth, quartz, glass, polymer light-transmitting material and other optical materials.

For example, the test frame cover 150 has a plurality of fixing holes thereon to facilitate the corresponding fixing elements (for example, screws) to fix the test frame cover 150 on the table. The fixing hole may be a screw hole.

In one embodiment, the material of the floating plates 170, 171 is a metal such as aluminum. In one embodiment, the material of the probe upper seats 180, 181 is a plastic material, such as a PEI material. In one embodiment, the material of the probe base 190, 191 is a plastic material, such as a PEI material. In an embodiment, the upper cover member 10 may comprise a structural design or material that is resistant to light leakage, light refracting or scattering, and conductive, such as an aluminum metal plate treated through an anode, or a high temperature resistant plastic member.

In one embodiment, the lens holders 120, 121 are each provided with a lens having a visible opening angle of up to 130 degrees.

In addition, the test socket can also be provided with a diffuser disposed on the lens. Light can diffuse and scatter light by means of a diffuser. The diffuser allows the passing light to reduce brightness. For example, the diffusion sheet can be made of polystyrene (PS) or polycarbonate (PC). The material of the diffusion sheet includes engineering plastics. Further, a void or a diffusing agent having a refractive index different from that of the diffusion sheet material is distributed in the light diffusion sheet. A void or diffusing agent inside the diffuser refracts or reflects light entering the diffuser. In particular, when a sufficient amount of voids or diffusing agent is present in the diffuser, the light entering the diffuser is scattered after being internally refracted or reflected for a sufficient number of times. Therefore, when the light entering the diffusion sheet leaves the diffusion sheet, the intensity of the light is uniform and the divergence angle thereof increases. However, part of the light entering the diffusion sheet is absorbed after being refracted or reflected by a void or a diffusing agent inside the diffusion sheet. Therefore, light loss occurs when light passes through the diffusion sheet, that is, light attenuation occurs.

In one embodiment, the test socket is also provided with a retaining ring for securing the diffuser. For example, the fixing ring is provided with an opening to accommodate the diffusion sheet, and the diffusion sheet is pressed and fixed to prevent the diffusion sheet from moving up and down.

As described above, in the present invention, a two-piece test stand structure (including the test stand frame 140 and the test frame cover 150) is proposed in place of the conventional metal test stand frame; wherein the test frame cover 150 houses the heating device 165 , 166, to receive the thermal energy provided by the heating devices 165, 166. The material of the main test frame cover 150 is metal, which belongs to a high thermal conductivity material to quickly absorb thermal energy; however, the test frame cover 150 of the present invention has a volume that is about 64% smaller than that of a conventional metal test stand frame (about 0.0116m ³ ), which can achieve better heat transfer efficiency. Moreover, since the test piece frame 140 having a low thermal conductivity is entirely coated with the test frame cover 150 having a high thermal conductivity, the thermal energy is not excessively lost, and the temperature can be stably maintained. Therefore, the present invention can overcome the problem of the test stand structure of the prior art, after the heat energy emitted by the heating devices 165, 166 is transmitted to the metal test stand frame, the heat energy is quickly lost and the test temperature cannot be continuously improved. In other words, the test seat of the present invention can achieve a temperature-stable and efficient design suitable for high-temperature testing without requiring a large-volume test frame cover 150.

The invention can effectively solve the problem of high temperature wafer testing and obtain a stable test environment temperature.

The two-piece test socket structure according to the present invention, that is, the low thermal conductivity test socket frame 140 integrally covers the two-piece test socket structure of the high thermal conductivity test frame cover 150, replacing the conventional metal test socket frame. The test temperature of 150 ° C can be easily reached, and the test temperature can be stably maintained as shown in the fourth figure. As shown in the fourth figure, it is an experiment on the temperature monitoring of the test stand, wherein the A test area and the B test area are the areas where the openings 151 and 152 of the test frame cover 150 are respectively located. From the fourth figure, it is shown that the heating means 165, 166 are heated for about 10 minutes to reach the target test temperature of 150 °C. After 10 minutes, the overheat protection device 160/161 can switch the temperature at a temperature above 150 ° C. For example, it can be set to start heating when the temperature is less than 150 ° C (for example, 145 ° C), and the temperature is greater than 150 ° C ( For example, at 155 ° C), the heating is turned off to maintain the temperature at 150 ° C.

From the above, it can be seen that the two-piece test stand structure of the present invention can provide a test environment with a test temperature of 150 ° C or even higher. The two-piece test stand structure of the present invention can be applied to automotive sensor wafers or other wafers requiring a high temperature test environment. In other words, the present invention provides an ultra-high temperature test environment that is not achievable with conventional multi-wafer test stands, as compared to conventional multi-wafer test stands with metal test stand frames that provide only a test environment of about 100 °C. The present invention has effects that are not expected by conventional techniques.

According to the above, the present invention has the following advantages: First, the new test seat design concept provides an ultra-high temperature test environment; Second, the temperature stability of the test environment is improved; Third, the test hardware heating efficiency is improved.

The above description is a preferred embodiment of the invention. Those skilled in the art should be able to understand the invention and not to limit the scope of the patent claims claimed herein. The scope of patent protection is subject to the scope of the patent application and its equivalent fields. Any modification or refinement made by those skilled in the art without departing from the spirit or scope of the present invention is equivalent to the equivalent change or design made in the spirit of the present disclosure, and should be included in the following patent application scope. Inside.

Claims (10)

 A test stand for testing an image sensing chip, comprising: a test stand frame formed of a plastic material having a low thermal conductivity; and a test frame cover formed of a metal material having a high thermal conductivity, configured in the Under the test frame; at least one floating plate disposed in the test frame cover, a plurality of probes disposed in the at least one floating plate; and at least one probe holder for receiving the probes The needle passes through it.    The test stand for testing an image sensing wafer according to claim 1, wherein the plastic material is polyether quinone, wherein the metal material is aluminum.    The test socket for testing an image sensing chip according to claim 1, wherein the at least one probe socket comprises a probe upper seat and a probe pin base, wherein the probe pin upper seat and the probe pin base respectively A plurality of probe perforations are provided to allow the probes to pass through the probe perforations.    The test stand for testing the image sensing chip according to claim 1 further includes a heating device and an overheat protection device disposed in the test frame cover.    The test socket for testing an image sensing wafer according to claim 1, wherein the test socket frame integrally covers the test frame cover.    A test stand for testing an image sensing chip, comprising: an upper cover member, comprising an upper cover frame, at least one lens holder and at least one working pressure member, wherein the at least one lens holder and the at least one working pressure member are disposed on the And a test seat member for pivoting the upper cover member; wherein the test seat member comprises a test seat frame, a test frame cover, at least one floating plate, at least one heating device and at least one detection a needle holder; wherein the test seat frame is formed of a plastic material having a low thermal conductivity; wherein the test frame cover is formed of a metal material having a high thermal conductivity and disposed under the test seat frame; wherein the at least a floating plate disposed in the test frame cover, a plurality of probes disposed in the at least one floating plate; and wherein the at least one probe holder is configured to receive the probes therethrough.    The test stand for testing an image sensing chip according to Item 6, wherein the upper cover member further comprises an upper cover pivotally connected to the upper cover frame.    The test socket for testing an image sensing chip according to Item 6, wherein the at least one detecting needle socket comprises a detecting needle upper seat and a detecting needle base, wherein the detecting needle upper seat and the detecting needle base respectively A plurality of probe perforations are provided to allow the probes to pass through the probe perforations.    The test stand for testing the image sensing chip according to Item 6 of the claim further includes an overheat protection device disposed in the test frame cover.    The test socket for testing an image sensing chip according to claim 6, wherein the test socket frame integrally covers the test frame cover.