TW201813496A - Plant temperature adjustment system and application methods thereof - Google Patents

Abstract

The disclosure utilizes a thermoelectric cooling chip (TEC) to increase or decrease the temperature of water source for supplying water through the sprayer or irrigation heads to the plant. Alternatively, the TEC can be utilized to increase or decrease the temperature of soil around plant roots through heat conduction. A plant temperature adjustment system includes a heat preservation assembly having a tank filled with liquid, a temperature adjusting apparatus having a TEC, and a spraying apparatus connecting to the tank for spraying the liquid to an environment with plants. The temperature of the liquid in the tank can be increased or decreased through the hot side or the cold side of the TEC. Another plant temperature adjustment system includes a hollow metal pipe/tube placed adjacent to the soil around plant roots, and a temperature adjusting apparatus having a TEC, wherein the hot side or the cold side of the TEC is directly connected to the hollow metal pipe/tube, or alternatively communicated to a liquid for increasing or decreasing the liquid temperature. Hot or cold liquid is pumped into the hollow metal pipe/tube to increase or decrease the temperature of soil around plant roots through heat conduction.

Description

Planting temperature adjustment system and application method thereof

The present invention relates to a temperature adjustment system, and more particularly to a planting temperature adjustment system and method of application thereof.

In the process of growing agricultural crops, environmental climate dependence and high demand for manual farming are high. Due to the current development of environmental changes and industrial upgrading, the challenges of traditional agricultural cultivation and cultivation to environmental and climatic factors have become increasingly severe. The disaster caused by environmental climate variability leads to a decrease in crop harvesting output year by year. The quality of agricultural products and the harvesting period are different, and the refinement is not easy. Those engaged in agricultural cultivation cannot apply past experience rules to judge and use cultivation practices.

In recent years, in order to stabilize the stable output of crops and expand the market economy, the Wenwang room structure and the ground planting racks have been gradually developed. However, the Wimbledon chamber is prone to heat accumulation in Taiwan during the summer, and the ambient temperature rises rapidly and obviously, resulting in an increase in the impact of crop pests and diseases, and a decrease in the yield per unit area of crops. Therefore, how to reduce or solve the disasters and losses caused by heat accumulation is one of the important issues of the relevant industry.

The invention relates to a planting temperature adjustment system and a application method thereof, wherein the cooling source is used for cooling (or heating) the water source for supplying drip irrigation or spraying, or the soil of the root of the planting is cooled (or heated by heat conduction). ), the plant can achieve the effect of local temperature regulation (cooling or warming).

According to an embodiment, a planting temperature adjustment system is provided, comprising a thermal insulation component comprising a container for holding a liquid; a temperature adjustment device comprising a uniform cold wafer having a cold end and a hot end, and a cold end and a hot end One of them is disposed toward the liquid and cools or warms the liquid; and a spray device is connected to the container to spray the liquid into an environment in which the planting system is disposed.

According to an embodiment, a planting temperature adjustment system is further provided, comprising a heat insulation component disposed on a periphery of a root soil of a plant; a metal hollow pipe disposed adjacent to the root soil of the plant; and a temperature adjustment device including Cooling the wafer, and the temperature adjusting device is connected with the metal hollow tube to lower or raise the temperature of the root soil of the planting plant, wherein one of the cold end and the hot end of the cooling chip is connected with the metal hollow tube to make the metal hollow tube And the internal medium temperature drops or rises; or one of the cold end and the hot end of the cooled wafer causes a liquid to cool or warm, and the liquid system after cooling or warming flows into the metal hollow tube.

According to an embodiment, a method for applying a planting temperature adjustment system is provided, comprising providing an insulation component and a temperature adjustment device, and providing a spray device in an environment with planting. The thermal insulation assembly includes a container for holding a liquid, the temperature adjustment device includes a uniform cold wafer and one of the cold end and the hot end of the refrigerating wafer is disposed toward the liquid and cools or warms the liquid. The spray device is coupled to the container to spray the cooled or warmed liquid into the environment.

According to an embodiment, a method for applying a planting temperature adjustment system is further provided, comprising: setting a heat insulating component on the periphery of the root soil of the planting; setting a metal hollow pipe adjacent to the root soil of the plant; and providing a temperature adjusting device, the temperature The adjusting device comprises a uniform cold wafer and is connected with the metal hollow tube to lower or raise the temperature of the root soil of the plant, wherein the cold end of the cold wafer is connected with one of the hot ends to the metal hollow tube to make the metal hollow The temperature of the tube and the internal medium drops or rises; or one of the cold end and the hot end of the cooled wafer causes a liquid to cool or warm, and causes the liquid to be cooled or warmed to flow into the metal hollow tube to make the metal hollow tube The temperature drops or rises.

In order to better understand the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings are set forth below. However, the scope of the invention is defined by the scope of the appended claims.

The embodiment proposes a planting temperature adjustment system and an application method thereof, which can achieve the effects of local temperature regulation (cooling or warming) in the greenhouse environment and planting. The temperature adjusting device of the embodiment comprises a uniform cold wafer, the cooling source is used for cooling (or heating) the water source for supplying drip or spray, or the soil of the root of the planting is cooled (or heated) by heat conduction. Furthermore, in one embodiment, the plant temperature adjustment system can be combined with the control component to adjust the control energy consumption timing and improve the efficiency of the unit energy consumption. Furthermore, in one embodiment, the planting temperature adjustment system can be combined with a temperature sensing device to integrate the instant information of the planting plant to promote the development of intelligent energy-saving crop cultivation. Furthermore, the design of the present disclosure has the advantages of small size, convenient movement, and rapid cooling (or warming) in the region, which can effectively reduce or solve the disaster and loss caused by heat accumulation, so as to increase the yield and stability of the crop per unit area. Crop quality.

The design proposed by the present disclosure is widely used, except that the temperature of the planting environment or the temperature of the planting soil can be lowered at high temperatures (such as hot summer or spring and summer seasons), or can be reversed at low temperatures (such as cold current or autumn and winter seasons). The heat source causes the plant's ambient temperature or soil temperature to rise. <planting environment temperature adjustment>

FIG. 1A is a block diagram of a planting temperature adjustment system according to an embodiment of the present disclosure. The planting temperature adjustment system includes a temperature adjustment device 11, an insulation assembly 13, and a spray device 15. The heat insulating component 11 includes a container for holding a liquid, and the temperature adjusting device 13 includes a thermo-electric cooling chip TEC, which can generate a temperature difference to form a cold end and a hot end, and a cold end and a hot end. One of them is set toward the liquid to cool or warm the liquid. The spray device is connected to the thermal insulation component (for example, one of the outlet ends of the connection container) to spray the cooled or warmed liquid into the environment in which the planting system is installed.

FIG. 1B is a schematic diagram of a consistent cold wafer according to an embodiment of the present disclosure. As shown in FIG. 1B, the uniform cold wafer TEC is composed of a plurality of N-type semiconductor materials 112 and a P-type semiconductor material 113 stacked, and metal conductors 114 are connected on the upper and lower sides, and the metal conductors 114 on both sides are covered with ceramics. The plate 115 has a direct current flowing to cause a temperature difference between the two surfaces of the wafer, for example, a cold side CS that absorbs heat and a hot side HS that releases heat. It should be noted that FIG. 1B only illustrates one of the applicable structural forms of the cooled wafer as an embodiment. Other structural aspects of the cooled wafer can also be applied to the present disclosure; the following embodiments simply illustrate the structure of the cooled wafer.

FIG. 2A is a schematic diagram showing the cooling and cooling of water in a planting temperature adjustment system according to an embodiment of the present disclosure. In the application of the liquid cooling and cooling, the object to be cooled is a liquid 132 (for example, water or an aqueous solution, also referred to as a water solution) contained in a container 130, as shown in FIG. 2A, below the cooling wafer TEC . The cold end CS system is disposed toward the liquid 132 and is in contact with the liquid 132 through a conductive member 110 (e.g., a plurality of fins) (e.g., immersing the fins in a liquid for heat conduction), thereby causing the liquid 132 to achieve a cooling effect. Above the chilled wafer TEC is a hot end HS. Therefore, in one embodiment, the chilled wafer TEC further includes a heat dissipating member 111 disposed at the hot end HS to conduct heat energy of the hot end HS. The heat sink 111 includes at least one of a fan (ex axial fan) and a heat sink fin. As shown in FIG. 2A, the heat sink 111 includes fans 111a and 111b (with fins on the back side to help dissipate heat) to direct thermal energy in different directions.

Furthermore, the thermal insulation assembly includes, in addition to the container 130 for holding the liquid 132, a heat insulating material covering the periphery of the container 130 to delay heat exchange between the liquid 132 after cooling (or heating) and the surroundings. The water inlet 134I and the water outlet 134O of the container 130 are selectively connectable to the filtering device. The cooled (or heated) liquid 132 is delivered to a spray device via a water outlet 134O.

In addition, if it is necessary to apply the temperature rise of the liquid water, the above-mentioned cooled wafer TEC may be reversely disposed, that is, the liquid end 132 may be heated by the hot end HS.

FIG. 2B is a schematic diagram of water liquid cooling and cooling in another planting temperature adjustment system according to another embodiment of the present disclosure. The difference from Figure 2A is the way the heat is dissipated. In Fig. 2B, a cooling line 117 in which water or a coolant continuously flows is used as a heat sink for the hot end HS to carry away the heat energy generated by the hot end HS. Water or coolant is input from the input end 117a of the cooling line 117 and is output from the output end 117b. As shown in Figure 2B, the thermal energy caused by the TEC can be transferred to the remote by the liquid without affecting the water that has been cooled. Moreover, in an embodiment, the water path of the portion of the cooling pipe 117 can be designed as a closed cycle, and water return measures are taken to save water resources.

The object of the invention relates to a plant temperature adjustment system, which further comprises a spray device, a combination of a water-cooling system and a spray device, and a temperature difference between the fins and the heat pipe fin fan structure. Heat exchange, cooling the water to cool down. And with the spray device sprayed in the air of the planting area, the atomized water molecules are evaded in the air to reach the local cooling of the planting area. FIG. 2C is an experimental data of temperature measurement of the refrigerant water in the plant temperature adjustment system according to an embodiment of the present disclosure. Wherein, the curve (A) represents the room temperature of the planting environment, the curve (B) represents the humidity of the planting environment, and the curve (A) represents the measured temperature of the refrigerant water. In the experiment, the hot end of the cooled wafer is provided with a fan to derive the thermal energy of the hot end (please refer to Figure 2B). The results show that using 4 pieces of cooled wafer (72W) to reduce 40 liters of water from a temperature of 25 ° C to about 18 ° C (requiring 21.6 degrees of electricity) takes only 3 hours, and is dispersed in the vicinity of the spray area. It can reduce the temperature rise caused by ice water transportation. According to the design of the embodiment, if the demand of one ton of water is used, the cooling time of the water liquid is shortened and the problem of excessive power consumption is not transmitted through about 25 sets of distributed systems, so the design of the embodiment can be practically applied. Planting area. E.g. The water liquid cooling and cooling system can be operated at night, taking into account the cost factors such as low water source temperature and low electricity cost. The treated ice water (enough enough for daytime use) is stored in the insulated barrel at the high temperature every other day (3 30°). C) Using a spray device to create a micro-mist in the air, the water droplets quickly evaporate and dissipate to reduce the high temperature in the air.

Therefore, taking the cooling application as an example, the temperature adjusting device 11 of the embodiment is a water liquid cooling and cooling device, which can be matched with a high pressure nozzle spray system (such as FIG. 3A) or an ultrasonic spray system (such as FIG. 3B). The ice water after cooling is atomized into the air to reduce the ambient temperature near the plant. Spray device of the disclosed embodiment For example, a high pressure nozzle spray system or an ultrasonic spray system.

FIG. 3A is a schematic diagram of a spray device of a planting temperature adjustment system according to an embodiment of the present disclosure. As shown in FIG. 3A, a high pressure nozzle spray system is composed of a water inlet portion 151 (ex: including a water pump, a compressor) and a filter, a water liquid line 153 and a nozzle head 155, and the water is used to hold the container 130. The cooling water (or warm water) is taken out through the filter and the compressor, and finally flows through the water liquid line 153 at the nozzle head 155 to be atomized and sprayed in the planting area. In one embodiment, the compressed air is mixed with a liquid using a compressor, and the liquid is atomized by the nozzle head 155, and the nozzle efficiency is, for example, N (%) = E _w / I _w , where N (%) is Nozzle efficiency, E _w is the amount of evaporated water, and I _w is the total amount of water discharged. In addition, an A-type planting tower TF is shown below the nozzle head 155. However, in practice, the planting and erecting configuration is not limited. For example, the planting frame of the shovel type can also be applied.

FIG. 3B is a schematic view of another spray device of the planting temperature adjustment system according to the embodiment. As shown in FIG. 3B, an ultrasonic spray system includes a water inlet portion 251 (including a water pump, a water liquid line, a water tray) and an ultrasonic mist eliminator 255, and the water pump cools the water in the container 130 (or temperature). The water is pumped to the water tray, and the water mist output is distributed in the planting area (the planting tower TF) by the ultrasonic mist eliminator 255. In one embodiment, the ultrasonic mist concentrator 255 is, for example, but not limited to, consisting of a metal foil coated with a piezoelectric material and an oscillator. The oscillator is oscillated to excite the piezoelectric sheet, and the water is oscillated. The instantaneous pressure difference atomizes the cooling water molecules and finally sprays the air in the nozzle to achieve thermal conversion.

The planting temperature adjustment system of the embodiment can be further matched with the control element and the sensing device in addition to the temperature adjustment device 11 and the spray device 15 described above. 4A is a block diagram of a planting temperature adjustment system according to another embodiment of the present disclosure. The planting temperature adjustment system includes a temperature adjustment device 11, a heat preservation component 13, a spray device 15 (refer to the above for related details), a control element 16 and a sensing device 17. The control element 16 is electrically connected to the spray device 15 to control the timing of opening and closing of the spray device 15. For example, the control element 16 controls the start time, off time and duration of spraying the liquid/liquid. In one embodiment, control element 16 includes a timing timer (ex: Timer) and a solenoid valve. Moreover, the sensing device 17 can be electrically connected to the control component 16, and the sensing device 17 includes, for example, a plurality of sensing components for sensing the temperature of the environment. In one embodiment, the sensing element is a plurality of thermocouples that can be distributed in the front, middle, and rear sections of the planting tower of the planting system for temperature sensing, and will immediately integrate the sensing information of the cultivation environment (ex: The temperature and humidity information is transmitted back to the control element 16. When the sensing device 17 senses that the ambient temperature is too high, the control element 16 drives the spray device 15 to spray the liquid into the environment.

Furthermore, the planting temperature adjustment system of the embodiment may further comprise a filtering device for filtering impurities in the liquid/water liquid. FIG. 4B is a schematic view of a planting temperature adjustment system according to an embodiment of the present disclosure. In Fig. 4B, a high-pressure nozzle spray system as shown in Fig. 3A is used, and the water after cooling is atomized and sprayed to the planting area by the nozzle head. In addition to the temperature adjustment device 11 (including the cryo-wafer TEC), the thermal insulation assembly 13 (including the container 130 and the liquid 132), the spray device 15 (the details of the components are as described above), the plant temperature adjustment system may further include a filter. The device 18 is disposed in front of the spray device 15, for example, the water inlet portion 151 (ex: water pump and pressurizer) of the spray device 15 and the water outlet end 134O of the container 130 are respectively connected at both ends of the filter device 18 to filter out the flow from the container 130. Liquid/water liquid impurities. At the junction with the water outlet end 134O of the vessel 130, for example, a liquid pump 181 feeds the liquid/water liquid into the filter core 183. Of course, FIG. 4B is merely an illustration of one of the planting temperature adjustment systems, and the filtering device 18 may also be disposed in front of the container 130 to filter the liquid/water liquid to be flowed into the container 130.

Furthermore, the arrangement of a sensing device 17 of the planting temperature adjustment system is also illustrated in FIG. 4B as an example. As shown in Fig. 4B, the planting area A _plant is provided with a type A planting tower TF, and a plurality of planting plants 30 are placed on the tower TF. The sensing device 17 is, for example, a plurality of thermocouples (sensing elements) disposed adjacent to the plant 30, for example, adjacent to the soil surface of the plant 30 or under the leaves or flowers of the plant 30 to sense proximity to the plant. The temperature of the 30 roots, the thermocouple and back to the integrated sensing real-time information to the control element 16 (Fig. 4A). In an application, a certain temperature may be preset according to the application requirement. Once the temperature of the adjacent plant root rises above a preset temperature, the control element 16 activates the spray device 15, such as the water inlet portion 151 of the high pressure nozzle spray system. The cooling water is sent to the nozzle head 155 via the water liquid line 153, and the nozzle head 155 sprays the cold water mist after the cooling to cool the plant. Another application mode is that in the cold season, once the sensing device 17 senses that the temperature of the adjacent plant root 30 drops below a preset temperature, the control element 16 activates the spray device 15 to spray the heated warm water. Fog to warm the plants.

In practical applications, after the spraying device 15 is sprayed, the closing time and duration of the spraying may be preset according to the experimental result, or the integrated real-time information may be returned according to the sensing device 17 (ex: thermocouple). Ex: When the temperature measured by the thermocouple reaches a certain value, it is decided whether to stop spraying. The spraying method can be continuous spraying or intermittent spraying. The points and methods of spraying can be appropriately selected and adjusted according to the factors such as the type of planting, the local environmental conditions, and the application time. This disclosure does not limit this much.

FIG. 5 is a flow chart of an application method of a planting temperature adjustment system according to an embodiment of the present disclosure. Firstly, a heat insulating component and a temperature adjusting device are provided. The heat insulating component comprises a container for holding a liquid, the temperature adjusting device comprises a uniform cold wafer, and one of the cold end and the hot end of the cooling chip is disposed toward the liquid and cools the liquid. Or warming up (step 501). A spray device is disposed in the environment with the planting, and the spray device is connected to the container to spray the cooled or warmed liquid to the environment (step 502). Of course, this application method can be further matched with a control component (which can control the timing of the opening and closing of the spray device) and a sensing device (to sense the ambient temperature and integrate the information in real time). The structure and operation of the related components, as well as the details of the implementation, have been described in detail above (see Figures 2A-4B) and will not be repeated here. <Plant soil temperature adjustment>

In addition to the above-mentioned application method of cooling the water source for supplying drip or spray by using the cooling chip, the temperature adjusting device (including the cooling chip) proposed by the embodiment of the present disclosure can also use the heat conduction method to cool the soil of the planting root (or Warm up). In application, for example, a metal hollow tube (for example, a copper tube) is disposed adjacent to the root soil of the plant, and the heat transfer to the root soil is performed through the temperature drop (or rise) of the metal hollow tube, thereby lowering the temperature of the root soil ( Or rise). The following are two ways to reduce (or increase) the temperature of the metal hollow tube, including (1) contacting the metal hollow tube with the cold end and the hot end of the cooled wafer, or (2) cooling the cooled wafer. (or) the heated liquid is delivered to the metal hollow tube.

6A-6C is a schematic view showing a plant temperature adjustment system for cooling (or warming) the root soil of the plant root according to another embodiment of the present invention, wherein the fan and the heat dissipation fin are used as the heat sink of the cooling chip. In this embodiment, the planting temperature adjustment system includes a heat insulating component (for example, the insulating foam 634) disposed on the outer periphery of a planting soil Sp, and a metal hollow pipe (for example, a copper pipe) 635 is disposed adjacent to the root of the planting soil Sp. And a temperature adjusting device (for example, including the cooling fin TEC and the heat dissipating member 611) is coupled with the metal hollow tube 635 to lower or raise the temperature of the soil Sp of the root of the plant. In this embodiment, one of the cold end CS and the hot end HS formed by the current-driven cooling of the chilled wafer TEC is connected to the metal hollow tube 635, and the temperature of the metal hollow tube 635 and the internal medium is lowered or increased. The medium within the metal hollow tube 635 can be a gas such as air, or a liquid such as water or a coolant. As shown in Figures 6A-6C, the cold end CS of the cooled wafer TEC is in direct contact with the metal hollow tube 635, causing the temperature of the medium in the metal hollow tube 635 to drop, and the heat sink 611 (including the fan 611a and the heat sink fin 611b). It is disposed at the hot end HS of the chilled wafer TEC to derive the thermal energy of the hot end HS. The planting temperature adjustment system further comprises a metal sleeve (for example, an aluminum sleeve) 636 covering the root soil of the plant, and the metal hollow tube 635 is directly in contact with the metal sleeve 636 covering the root soil of the planting plant. The heat conduction between the two causes the root soil to reach the effect of cooling or warming, and the insulating foam (ie heat insulating component) 634 coats the metal hollow tube 635 and the metal sleeve 636 to slow down the heat transfer with the external environment.

Fig. 7 is a schematic view showing a plant temperature adjustment system for cooling (or warming) the root soil of the plant root according to another embodiment of the present invention, wherein a cooling pipe is used as a heat sink for the cooling chip. The difference between Fig. 7 and Fig. 6C is that the heat sink comprises a cooling line 617 (with cooling line 117 of Fig. 2B) in which water or coolant continuously flows, water or coolant self-cooling line 617. The input 617a is input and output from the output 617b to carry away the thermal energy of the hot end HS of the chilled wafer TEC. Moreover, in an embodiment, the water path of the cooling pipeline 617 portion can be designed as a closed loop, and water return measures are taken to save water resources. Please refer to FIG. 6C and related descriptions for the same points in FIG. 7 and FIG. 6C, and details are not described herein.

8A and 8B are schematic views showing a plant temperature adjustment system for cooling (or warming) single and multiple plant root soils according to still another embodiment of the present disclosure. In this embodiment, the planting temperature adjustment system includes a metal hollow tube (e.g., copper tube) 835 disposed adjacent to the root soil Sp of the plant 80, and a temperature adjustment device (including a refrigerant wafer) coupled to the metal hollow tube 835. In this embodiment, the cold-end wafer (the principle and structure of the cold-formed wafer are the same as described above, and can be referred to in FIGS. 2A and 2B, which are not shown in FIGS. 8A and 8B), and one of the cold end and the hot end causes a liquid to cool down. Or heating up, and the liquid after cooling or warming flows into the metal hollow tube 835, so that the temperature of the soil Sp in the root of the plant 80 is lowered or increased. Furthermore, a heat-insulating component (for example, a heat-insulating foam or a heat-insulating foam to form a planting groove) may be provided on the periphery of the soil Sp of the root of the planting plant 80 to slow down the root soil Sp and the external environment. Heat exchange.

Figure 8A shows a single plant and metal hollow tube 835, and Figure 8B shows a plurality of plant and metal hollow tubes 835. The following is an example of the application of a temperature adjustment system in one of the planting areas (including a plurality of planting plants 80). A space bag type plant is placed in each groove of a planting rack, and a U-shaped metal hollow tube 835 is arranged near the root of each plant, and all U-shaped metal hollow tubes are connected in series (as shown in Fig. 8B) Show). All U-shaped metal hollow tubes can also be connected in series to form a closed circulating water path (for example, water return measures). For cooling application, the ice water treated by the water-cooling and cooling system in the hollow metal tube 835 is heated by the metal hollow tube 835 in contact with the soil to achieve the cooling of the root of the plant.

FIG. 9 is a flow chart of an application method of a planting temperature adjustment system according to another embodiment of the disclosure. First, an insulation component is disposed on the periphery of the root soil of the plant (step 901); a metal hollow pipe is disposed adjacent to the root soil of the plant (step 902); a temperature adjustment device is provided, and the temperature adjustment device comprises a uniform cold wafer and the metal The hollow tubes are connected so that the temperature of the root soil of the plant is lowered or increased, wherein one of the cold end and the hot end of the cooling chip is connected to the metal hollow tube to lower or increase the temperature of the metal hollow tube and the internal medium; or It is one of the cold end and the hot end of the cooling chip that causes a liquid to cool or warm, and the liquid system after cooling or warming flows into the metal hollow tube (step 903). Of course, this application method can be further matched with a control component (which can control the actuation and opening and closing of the cryogenic wafer) and a sensing device (to sense the temperature of the root soil of the plant, and integrate the temperature information in real time). The structure and operation of the related components, as well as the details of the implementation, are described in detail above (see Figure 6A-8) and will not be repeated here.

In summary, the embodiment proposes that the plant temperature adjustment system and the application method thereof can be divided into cooling device planting environment cooling (or heating) (spray local cooling or heating) and cooling chip planting soil cooling (or heating). . The former system is mainly composed of a liquid water cooling and cooling (or heating) system and a spraying device. After cooling, the water liquid is sprayed through the spraying device to atomize and spray the water droplets in the planting air, and after evaporation, the heat energy is evaporated. Achieve local cooling of the plant. The former method has high field compatibility (both closed and open greenhouses). The latter system mainly makes the metal hollow tube (such as the cold end of the contact cooling chip) contact with the metal casing covering the planting soil for heat conduction, or the metal hollow tube is directly in contact with the planting soil and the metal hollow tube is circulated inside. The cold liquid is cooled by the cold wafer; the outer periphery of the metal hollow tube is covered with the insulating foam to be isolated from the outside to reduce the internal and external energy exchange, and the root temperature of the plant is lowered. The latter method has high field compatibility (both closed and open greenhouses), and the local temperature regulation is achieved by planting root coating. Moreover, the two application modes not only reduce the temperature (or increase temperature) in the area, but also have a small size, convenient movement, high module replacement and simple application procedure. Furthermore, the embodiment proposes that the plant temperature adjustment system and the application method thereof can also be combined with intelligent energy-saving control, such as timing adjustment control, spray atomization control, and cultivation environment temperature control (for example, planting cultivation temperature regulation and cultivation environment temperature and humidity) Monitoring) and other ways to achieve a new way of intelligent energy-saving crop cultivation. Therefore, the application of the present disclosure can effectively reduce or solve the disasters and losses caused by the accumulation of heat (or cold), thereby improving crop quality stability and increasing the yield per unit area of crops. The design of the present disclosure can be applied to a variety of field applications, such as closed or open greenhouses, and there are many types of cultivated crops to be applied, particularly suitable for crop cultivation with high environmental temperature dependency. High-value crops that are sensitive to cultivation temperature, such as strawberries and orchids, can enhance their market value competitive advantage, so the design of this disclosure is extremely economical.

Other embodiments, such as temperature adjustment devices, spray devices, control elements, and sensing devices, may have different configurations and arrangements of related components, and may also be applicable depending on actual needs and conditions of the application. Make appropriate adjustments or changes. Therefore, the structures shown in the specification and drawings are for illustrative purposes only and are not intended to limit the scope of the disclosure. In addition, it is to be understood by those skilled in the art that the shapes and positions of the components in the embodiments are not limited to those illustrated in the drawings, and the requirements and/or manufacturing steps according to actual applications are not deviated from the spirit of the disclosure. In the case of the situation can be adjusted accordingly.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

11‧‧‧Temperature adjustment device

TEC‧‧‧Cold wafer

Cold end of CS‧‧‧ cold chip

HS‧‧‧ hot end of cold chip

111, 611‧‧‧ heat sink

111a, 111b, 611a‧‧‧ fans

611b‧‧‧heat fins

112‧‧‧N type semiconductor materials

113‧‧‧P type semiconductor material

114‧‧‧Metal conductor

115‧‧‧ceramic plates

117, 617‧‧‧ Cooling lines

117a, 617a‧‧‧ input

117b, 617b‧‧‧ output

13‧‧‧Insulation components

130‧‧‧ Container

134I‧‧‧ container inlet

134O‧‧‧ container outlet

132‧‧‧Liquid

15‧‧‧Spray device

151, 251‧‧ into the water department

153‧‧‧Water pipeline

155‧‧‧Nozzle head

255‧‧‧Ultrasonic fogger

16‧‧‧Control elements

17‧‧‧Sensing device

18‧‧‧Filter device

181‧‧‧Water pump

183‧‧‧ Filter heart

A _plant ‧‧‧planting area

TF‧‧‧planting tower

30, 80‧‧‧ planting

Sp‧‧‧planted root soil

634‧‧‧Insulated foam

635, 835‧‧‧ metal hollow tube

636‧‧‧Metal sleeve

501, 502, 901-903‧‧‧ steps

FIG. 1A is a block diagram of a planting temperature adjustment system according to an embodiment of the present disclosure. FIG. 1B is a schematic diagram of a consistent cold wafer according to an embodiment of the present disclosure. FIG. 2A is a schematic diagram showing the cooling and cooling of water in a planting temperature adjustment system according to an embodiment of the present disclosure. FIG. 2B is a schematic diagram of water liquid cooling and cooling in another planting temperature adjustment system according to another embodiment of the present disclosure. FIG. 2C is an experimental data of temperature measurement of the refrigerant water in the plant temperature adjustment system according to an embodiment of the present disclosure. FIG. 3A is a schematic view of a spray device (high pressure nozzle spray system) of the planting temperature adjustment system according to the embodiment of the present disclosure. FIG. 3B is a schematic view of another spray device (ultrasonic spray system) of the plant temperature adjustment system according to the embodiment. 4A is a block diagram of a planting temperature adjustment system according to another embodiment of the present disclosure. FIG. 4B is a schematic view of a planting temperature adjustment system according to an embodiment of the present disclosure. FIG. 5 is a flow chart of an application method of a planting temperature adjustment system according to an embodiment of the present disclosure. 6A-6C is a schematic view showing a plant temperature adjustment system for cooling (or warming) the root soil of the plant root according to another embodiment of the present invention, wherein the fan and the heat dissipation fin are used as the heat sink of the cooling chip. Fig. 7 is a schematic view showing a plant temperature adjustment system for cooling (or warming) the root soil of the plant root according to another embodiment of the present invention, wherein a cooling pipe is used as a heat sink for the cooling chip. 8A and 8B are schematic views showing a plant temperature adjustment system for cooling (or warming) single and multiple plant root soils according to still another embodiment of the present disclosure. FIG. 9 is a flow chart of an application method of a planting temperature adjustment system according to another embodiment of the disclosure.

Claims (21)

A planting temperature adjustment system comprising: an insulation component comprising a container for holding a liquid; a temperature adjustment device comprising a uniform cold wafer having a cold end and a hot end, and wherein the cold end and the hot end are The liquid is placed and the liquid is cooled or warmed; and a spray device is attached to the container to spray the liquid into an environment in which the planting system is disposed. The system of claim 1, wherein one of the cold end and the hot end of the refrigerated wafer is in contact with the liquid through a conductive member to cool or raise the liquid. The system of claim 2, wherein the refrigerating wafer further comprises a heat dissipating member disposed at the hot end of the refrigerating wafer to conduct thermal energy of the hot end. The system of claim 1, further comprising: a control component electrically connected to the spray device to control a timing of opening and closing the spray device; and a sensing device electrically connected to the control component The sensing device includes a plurality of sensing elements for sensing the temperature of the environment. The system of claim 4, wherein the sensing elements are a plurality of thermocouples distributed in the front, middle and rear sections of the planting tower of the planting system for temperature Perceive, and return real-time information of the integrated sensing to the control element. The system of claim 1, wherein the spray device comprises a high pressure nozzle spray system or an ultrasonic spray system. The system of claim 1, further comprising a filtering device, the two ends are respectively connected to the spraying device and connected to a water outlet end of the container to filter impurities of the liquid flowing out of the container. A planting temperature adjustment system comprising: an insulation component disposed on a periphery of a root soil of a plant; a metal hollow tube adjacent to the root soil of the plant; and a temperature adjustment device including a uniform cold wafer, and The temperature adjusting device is coupled to the metal hollow tube to lower or raise the temperature of the root soil of the plant, wherein one of the cold end and the hot end of the cooling chip is connected to the metal hollow tube to The temperature of the metal hollow tube and the internal medium is lowered or increased; or one of the cold end and the hot end of the refrigerating wafer causes a liquid to cool or warm, and the liquid system after cooling or warming flows into the metal hollow tube. The system of claim 8, wherein the cold end of the refrigerant wafer directly contacts the metal hollow tube, the temperature of the medium in the metal hollow tube is lowered, and the temperature adjusting device further comprises a A heat dissipating member is disposed at the hot end of the refrigerating wafer to conduct heat energy of the hot end. The system of claim 8, further comprising a metal sleeve coated on the root soil of the plant, the metal hollow tube directly contacting the metal sleeve to cool the root soil of the plant Or heating up, and the heat insulating component includes a heat insulating foam and covers the metal hollow tube and the metal sleeve. The system of claim 8, wherein one of the cold end and the hot end of the refrigerating wafer is in contact with the liquid through a conducting member to cool or raise the liquid, and the liquid system is introduced into the liquid In the metal hollow tube, the metal hollow tube is placed at the surface of the root soil of the plant, so that the temperature of the root soil of the plant is lowered or increased. For example, the system described in claim 11 includes a plurality of metal hollow tubes which are planted and connected in series, respectively, corresponding to the root soils of the plants, wherein the metal hollow tubes are connected in series with each other. A closed circulation water path is formed. The system of claim 8, further comprising: a control component electrically connected to the temperature adjustment device to control actuation and opening and closing of the refrigerant chip; and a sensing device adjacent to the planting The root soil is disposed and electrically connected to the control element, and the sensing device includes a sensing component for sensing the soil temperature of the root of the plant. A method for applying a planting temperature adjustment system includes providing a heat insulating component and a temperature adjusting device, the heat insulating component comprising a container for holding a liquid, the temperature adjusting device comprising a uniform cold wafer and a cold end of the cold chip and the heat One of the ends is disposed toward the liquid and cools or warms the liquid; and a spray device is disposed in the environment with the plant, the spray device is connected to the container to spray the cooled or warmed liquid to the environment . The application method of claim 14, wherein the refrigerating wafer further comprises a heat dissipating member disposed at the hot end of the refrigerating wafer to conduct heat energy of the hot end. The application method of claim 14, further comprising: providing a control component electrically connected to the spray device to control a timing of opening and closing the spray device; and providing a sensing device electrically connected to the control component The sensing device includes a plurality of sensing elements for sensing the temperature of the aforementioned environment. A method for applying a planting temperature adjustment system comprises: providing a heat insulating component on a soil periphery of a root of the planting; providing a metal hollow pipe adjacent to the root soil of the plant; and providing a temperature adjusting device comprising the same temperature adjusting device Cooling the wafer and connecting with the metal hollow tube to lower or raise the temperature of the root soil of the plant, wherein one of the cold end and the hot end of the refrigerant chip is connected to the metal hollow tube to make the metal The temperature of the hollow tube and the internal medium is lowered or increased; or one of the cold end and the hot end of the refrigerating wafer causes a liquid to cool or warm, and the liquid system after cooling or warming flows into the hollow metal tube. The application method of claim 17, further comprising providing a metal sleeve covering the root soil of the plant, the cold end of the cold wafer directly contacting the metal hollow with one of the hot ends And the metal hollow tube directly contacts the metal sleeve to cool or heat the root soil of the plant, and the heat insulating component comprises a heat insulating foam and covers the metal hollow tube and the metal sleeve. The application method of claim 17, wherein the cold end of the refrigerant wafer directly contacts the metal hollow tube, so that the temperature of the medium in the metal hollow tube is lowered, and the temperature adjusting device further comprises A heat dissipating member is disposed at the hot end of the refrigerating wafer to conduct heat energy of the hot end. The application method according to claim 17, wherein in the application of the liquid which is cooled or heated to flow into the metal hollow tube, the metal hollow tube is placed at the surface of the root soil of the plant, so that The temperature of the root soil of the plant is lowered or increased. The application method of claim 17, further comprising: providing a control component electrically connected to the temperature adjustment device to control actuation and opening and closing of the refrigerant chip; and providing a sensing device adjacent to the implant The root soil of the plant is disposed and electrically connected to the control element, and the sensing device includes a sensing component for sensing the soil temperature of the root of the plant.