TW201810764A - Exterior material for power storage device, and power storage device - Google Patents

Exterior material for power storage device, and power storage device Download PDF

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TW201810764A
TW201810764A TW106113329A TW106113329A TW201810764A TW 201810764 A TW201810764 A TW 201810764A TW 106113329 A TW106113329 A TW 106113329A TW 106113329 A TW106113329 A TW 106113329A TW 201810764 A TW201810764 A TW 201810764A
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layer
melting
melting point
low
power storage
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TW106113329A
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TWI712200B (en
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永田健祐
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昭和電工包裝股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/116Primary casings, jackets or wrappings of a single cell or a single battery characterised by the material
    • H01M50/124Primary casings, jackets or wrappings of a single cell or a single battery characterised by the material having a layered structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/116Primary casings, jackets or wrappings of a single cell or a single battery characterised by the material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/78Cases; Housings; Encapsulations; Mountings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/116Primary casings, jackets or wrappings of a single cell or a single battery characterised by the material
    • H01M50/117Inorganic material
    • H01M50/119Metals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/116Primary casings, jackets or wrappings of a single cell or a single battery characterised by the material
    • H01M50/121Organic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/131Primary casings, jackets or wrappings of a single cell or a single battery characterised by physical properties, e.g. gas-permeability or size
    • H01M50/133Thickness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/06Coating on the layer surface on metal layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206Insulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558Impact strength, toughness
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Abstract

To provide an exterior material for a power storage device, which enables the suppression of outflow of sealant layers in thermally fusing the sealant layers to each other, and which allows an adequate insulating property to be ensured in a thermally sealed part. An exterior material for a power storage device comprises: a metal foil layer 4; and a sealant layer 3 laminated on one face of the metal foil layer. The sealant layer 3 includes: a first low-melting point layer 7 made of a thermoplastic resin and forming an outermost layer on the metal foil layer side; a second low-melting point layer 8 made of a thermoplastic resin and forming an outermost layer on a side opposite to the metal foil layer; and a high-melting point intermediate layer 9 made of a thermoplastic resin and disposed between the first low-melting point layer 7 and the second low-melting point layer 8. The melting point of the high-melting point intermediate layer 9 is 120-180 DEG C. The melting points of the first and second low-melting point layers are lower than that of the high-melting point intermediate layer. The high-melting point intermediate layer 9 has a thickness of 20 [mu]m or more. Supposing that the thickness of the high-melting point intermediate layer 9 is "X", and the thickness of the sealant layer 3 is "Y", the thicknesses are in the following relation: 0.50Y ≤ X ≤ 0.99Y.

Description

蓄電裝置用外裝材及蓄電裝置 Exterior material for power storage device and power storage device

本發明,係關於智慧型手機、平板電腦等之攜帶機器所使用之電池抑或電容器、油電混合汽車、電動汽車、風力發電、太陽光發電、夜間電蓄電用所使用之電池或電容器等之蓄電裝置用之外裝材及以該外裝材所外裝之蓄電裝置。 The present invention relates to the storage of batteries or capacitors used in portable devices such as smart phones and tablet computers, hybrid electric vehicles, electric vehicles, wind power generation, solar power generation, and batteries or capacitors used in electric power storage at night. An exterior material for a device and a power storage device that is exteriorized with the exterior material.

近年來,伴隨智慧型手機、平板電腦終端等之攜帶電機器的薄型化、輕量化,作為此等設備所搭載之鋰離子蓄電池、鋰聚合物蓄電池、鋰離子電容器、雙電層電容器等之蓄電裝置之外裝材,目前正使用耐熱性樹脂層/接著劑層/金屬箔層/接著劑層/熱可塑性樹脂層所成積層體(層壓外裝材)以取代傳統之金屬罐。(參照專利文獻1)。電動汽車等之電源、蓄電用途之大型電源、電容器等由上述構成之積層體(外裝體)所外裝之情形亦逐漸增加。 In recent years, with the reduction in thickness and weight of portable electric machines such as smart phones and tablet terminals, power storage for lithium-ion batteries, lithium polymer batteries, lithium-ion capacitors, and electric double-layer capacitors mounted on these devices has been carried out. The exterior of the device is currently using a laminated body (laminated exterior) made of a heat-resistant resin layer / adhesive layer / metal foil layer / adhesive layer / thermoplastic resin layer to replace the traditional metal can. (See Patent Document 1). Outer cases of power sources such as electric vehicles, large-scale power sources for storage, capacitors, and the like, which are composed of the above-mentioned laminated body (outer body), are gradually increasing.

【先前技術文獻】[Previous Technical Literature] 【專利文獻】[Patent Literature]

【專利文獻1】日本特開2007-161310號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2007-161310

然而,上述傳統技術(專利文獻1所記載之外裝材)有以下之問題。亦即,在外裝電池等時,雖係將外裝材之密封層彼此熱融著而進行密封,惟若此密封層之表面附著有異物(電極活性物質、電解質等),則有熱密封部會薄化而導致該熱密封部難以確保充分之絶緣性的一面。特別係接片部分容易絶緣性不充足,有發生短路之虞。 However, the above-mentioned conventional technology (external materials described in Patent Document 1) has the following problems. That is, when external batteries are installed, the sealing layers of the external materials are heat-sealed with each other and sealed, but if foreign matter (electrode active material, electrolyte, etc.) adheres to the surface of this sealing layer, there is a heat-sealed portion. The thinned side makes it difficult to ensure sufficient insulation of the heat-sealed portion. In particular, the connecting piece part is easy to be insufficiently insulated, and may cause a short circuit.

本發明,係鑒於上述之技術背景,目的在於提供一種蓄電裝置用外裝材,其可抑制在將密封層彼此熱融著時發生之密封層的流出,從而可確保熱密封部具有充分之絶緣性,且可確保充分密封強度。 The present invention is made in view of the above-mentioned technical background, and an object thereof is to provide an exterior material for a power storage device, which can suppress the outflow of a sealing layer that occurs when the sealing layers are thermally fused to each other, thereby ensuring that the thermally sealed portion has sufficient insulation. And ensure sufficient sealing strength.

為了達成前述目的,本發明提供以下技術手段。 To achieve the foregoing object, the present invention provides the following technical means.

〔1〕一種蓄電裝置用外裝材,其係包含金屬箔層、及該金屬箔層之一側的面所積層之密封層的蓄電裝置用外裝材,其特徵係前述密封層,係包含:第1低熔點層,由構成該密封層中金屬箔層側的最外層之熱可塑性樹脂所成;第2低熔點層,由構成前述密封層中與金屬箔層側為相反側的最外層之熱可塑性樹脂所成;及高熔點中間層,由配置於前述第1低熔點層與前述第2低熔點層之間之熱可塑性樹脂所成;且前述高熔點中間層之熔點,係120℃~180℃; 前述第1低熔點層之熔點及前述第2低熔點層之熔點,係較前述高熔點中間層之熔點為低;前述高熔點中間層之厚度係20μm以上;前述高熔點中間層之厚度為「X」,前述密封層之厚度為「Y」時,係滿足0.50Y≦X≦0.99Y [1] An exterior material for a power storage device is an exterior material for a power storage device that includes a metal foil layer and a sealing layer laminated on a surface on one side of the metal foil layer, and is characterized in that the sealing layer includes : The first low melting point layer is made of a thermoplastic resin constituting the outermost layer on the metal foil layer side of the sealing layer; the second low melting point layer is made of the outermost layer on the opposite side to the metal foil layer side of the sealing layer Made of a thermoplastic resin; and a high-melting intermediate layer made of a thermoplastic resin disposed between the first low-melting layer and the second low-melting layer; and the melting point of the high-melting intermediate layer is 120 ° C. ~ 180 ° C; the melting point of the first low-melting layer and the melting point of the second low-melting layer are lower than the melting point of the high-melting intermediate layer; the thickness of the high-melting intermediate layer is 20 μm or more; the foregoing high melting point The thickness of the intermediate layer is "X", and when the thickness of the aforementioned sealing layer is "Y", it satisfies 0.50Y ≦ X ≦ 0.999Y

之關係者。 Related person.

〔2〕如前項1所記載之蓄電裝置用外裝材,其中,前述第1低熔點層之厚度係0.5μm以上,前述第2低熔點層之厚度係1μm以上。 [2] The exterior material for a power storage device according to the item 1, wherein the thickness of the first low-melting layer is 0.5 μm or more, and the thickness of the second low-melting layer is 1 μm or more.

〔3〕如前項1或2所記載之蓄電裝置用外裝材,其中,前述高熔點中間層之熔點係較前述第1低熔點層之熔點高20℃以上,且前述高熔點中間層之熔點係較前述第2低熔點層之熔點高20℃以上。 [3] The exterior material for a power storage device according to item 1 or 2, wherein the melting point of the high-melting intermediate layer is 20 ° C or more higher than the melting point of the first low-melting layer, and the melting point of the high-melting intermediate layer is It is 20 ° C or more higher than the melting point of the second low-melting layer.

〔4〕如前項1~3項中任一項所記載之蓄電裝置用外裝材,其中,構成前述高熔點中間層之熱可塑性樹脂,係重量平均分子量為200,000~800,000之範圍之乙烯-丙烯嵌段共聚物樹脂;且構成前述第1低熔點層之熱可塑性樹脂及構成前述第2低熔點層之熱可塑性樹脂,係重量平均分子量為10,000~200,000之範圍之乙烯-丙烯無規共聚物樹脂。 [4] The exterior material for a power storage device according to any one of items 1 to 3 above, wherein the thermoplastic resin constituting the high-melting intermediate layer has a weight average molecular weight in a range of 200,000 to 800,000. An ethylene-propylene block copolymer resin; and the thermoplastic resin constituting the first low-melting layer and the thermoplastic resin constituting the second low-melting layer, each having a weight average molecular weight in a range of 10,000 to 200,000. Ethylene-propylene random copolymer resin.

〔5〕如前項1~4中任一項所記載之蓄電裝置用外裝材,其中,前述金屬箔層之另一側的面係介由外側接著劑層與耐熱性樹脂層積 層。 [5] The exterior material for a power storage device according to any one of the preceding paragraphs 1 to 4, wherein the other surface of the metal foil layer is laminated with a heat-resistant resin through an outer adhesive layer. Floor.

〔6〕一種蓄電裝置,其特徵係具備蓄電裝置本體部、及前項1~5項中任一項所記載之蓄電裝置用外裝材,且前述蓄電裝置本體部,係由前述外裝材所外裝者。 [6] A power storage device comprising a power storage device body portion and the exterior material for a power storage device according to any one of the preceding items 1 to 5, and the power storage device body portion is provided by the exterior material Outfitters.

根據〔1〕之發明,由於高熔點中間層之熔點係120℃~180℃,且高熔點中間層之外側存在有低熔點層,故在將密封層彼此熱融著時,可抑制高熔點中間層從熱密封部流出,且由於高熔點中間層之厚度係20μm以上,且滿足0.50Y≦X≦0.99Y之關係,故可抑制將密封層彼此熱融著時密封層的流出所導致厚度減少,從而可確保熱密封部具有充分之絶緣性,充分防止短路的發生。此外,由於上述高熔點中間層之兩側,係配置具有較高熔點中間層之熔點為低之熔點之第1低熔點層及第2低熔點層,故在將密封層彼此熱融著時高熔點中間層不會熔融,可進行良好之熱密封而以充分之密封強度進行密封接合(可確保熱密封部具有充分之密封強度)。 According to the invention of [1], since the melting point of the high-melting intermediate layer is 120 ° C to 180 ° C, and a low-melting layer exists outside the high-melting intermediate layer, the high-melting intermediate layer can be suppressed when the sealing layers are thermally fused to each other. The layer flows out from the heat-sealed portion, and since the thickness of the high-melting intermediate layer is 20 μm or more and satisfies the relationship of 0.50Y ≦ X ≦ 0.999Y, the leakage of the sealing layer caused by the heat-sealing of the sealing layers to each other can be suppressed. The thickness is reduced, so that the heat-sealed portion can be sufficiently insulated to sufficiently prevent a short circuit from occurring. In addition, since both sides of the above-mentioned high-melting intermediate layer are provided with a first low-melting layer and a second low-melting layer having a low-melting and low-melting intermediate layer, the sealing layer is high when the sealing layers are thermally fused to each other. The melting point intermediate layer does not melt, and can perform good heat-sealing and hermetic bonding with sufficient sealing strength (to ensure that the heat-sealed portion has sufficient sealing strength).

根據〔2〕之發明,由於第1低熔點層之厚度係0.5μm以上,第2低熔點層之厚度係1μm以上,故在將密封層彼此熱融著時,可以更充分之密封強度而密封接合(可確保熱密封部具有更充分之密封強度)。 According to the invention of [2], since the thickness of the first low-melting-point layer is 0.5 μm or more and the thickness of the second low-melting-point layer is 1 μm or more, when the sealing layers are thermally fused to each other, the sealing strength can be more sufficient. Sealed joint (ensures better sealing strength of the heat-sealed part).

根據〔3〕之發明,由於其係高熔點中間層之熔點較第1低 熔點層之熔點高20℃以上,且高熔點中間層之熔點較第2低熔點層之熔點高20℃以上之構成,故在將密封層彼此熱融著時,可充分抑制密封層從熱密封部流出,從而可確保熱密封部具有更充分之絶緣性。 According to the invention of [3], since the melting point of the high-melting intermediate layer is lower than that of the first layer The melting point layer has a higher melting point of 20 ° C or higher, and the melting point of the high-melting intermediate layer is higher than the melting point of the second low-melting layer by 20 ° C or more. Therefore, when the sealing layers are thermally fused to each other, the sealing layer can be sufficiently suppressed from being heat-sealed. The part is flowed out, so that the heat-sealed part can be more fully insulated.

根據〔4〕之發明,由於構成高熔點中間層之熱可塑性樹脂,係重量平均分子量為200,000~800,000之範圍之乙烯-丙烯嵌段共聚物樹脂,故在將密封層彼此熱融著時,可更充分抑制密封層從熱密封部流出,從而進一步提升熱密封部之絶緣性。此外,由於構成前述第1、2低熔點層之熱可塑性樹脂,個別係重量平均分子量為10,000~200,000之範圍之乙烯-丙烯無規共聚物樹脂,故在將密封層彼此熱融著時,可具有進一步充分之密封強度而密封接合(可確保熱密封部具有更充分之密封強度)。 According to the invention of [4], since the thermoplastic resin constituting the high-melting intermediate layer is an ethylene-propylene block copolymer resin having a weight-average molecular weight in a range of 200,000 to 800,000, the sealing layers are melted with each other. At this time, the sealing layer can be more sufficiently prevented from flowing out of the heat-sealed portion, thereby further improving the insulation of the heat-sealed portion. In addition, since the thermoplastic resins constituting the first and second low-melting layers are individually ethylene-propylene random copolymer resins having a weight-average molecular weight in the range of 10,000 to 200,000, the sealing layers are melted with each other. At this time, it is possible to have a further sufficient sealing strength to seal the joint (to ensure that the heat-sealed portion has more sufficient sealing strength).

根據〔5〕之發明,由於金屬箔層之另一側的面係介由外側接著劑層而與耐熱性樹脂層積層,故可充分確保金屬箔層之另一側的面側的絶緣性,提升外裝材之物理性強度及耐衝撃性。 According to the invention of [5], since the surface on the other side of the metal foil layer is laminated with the heat-resistant resin through the outer adhesive layer, the insulation on the surface side of the other side of the metal foil layer can be sufficiently ensured. Improve the physical strength and impact resistance of exterior materials.

根據〔6〕之發明(蓄電裝置),可提供一種蓄電裝置,其熱密封部係以充分之密封強度進行接合,且係由熱密封部確保具有充分之絕緣性的外裝材所外裝。 According to the invention (electric storage device) of [6], it is possible to provide a power storage device in which the heat-sealed portion is joined with sufficient sealing strength, and the heat-sealed portion is provided with an exterior material having sufficient insulation properties.

1‧‧‧蓄電裝置用外裝材 1‧‧‧ Exterior materials for power storage devices

2‧‧‧耐熱性樹脂層(外側層) 2‧‧‧ heat-resistant resin layer (outer layer)

3‧‧‧密封層(內側層) 3‧‧‧Sealing layer (inner layer)

4‧‧‧金屬箔層 4‧‧‧ metal foil layer

5‧‧‧外側接著劑層 5‧‧‧ outside adhesive layer

6‧‧‧內側接著劑層 6‧‧‧ inside adhesive layer

7‧‧‧第1低熔點層 7‧‧‧The first low melting layer

8‧‧‧第2低熔點層 8‧‧‧ 2nd low melting point layer

9‧‧‧高熔點中間層 9‧‧‧ high-melting intermediate layer

11‧‧‧成形外殼 11‧‧‧Shape

19‧‧‧蓄電裝置本體部 19‧‧‧ Power storage device body

20‧‧‧蓄電裝置 20‧‧‧ Power storage device

【圖1】表示本發明之蓄電裝置用外裝材之一實施型態的斷面圖。 FIG. 1 is a cross-sectional view showing an embodiment of an exterior material for a power storage device according to the present invention.

【圖2】表示使用本發明之蓄電裝置用外裝材所構成之蓄電裝置之一 實施型態的斷面圖。 [Fig. 2] Shows one of the power storage devices constituted by using the exterior material for a power storage device of the present invention Sectional view of implementation type.

本發明之蓄電裝置用外裝材1之一實施型態以圖1表示。此蓄電裝置用外裝材1,係作為鋰離子蓄電池外殼用而使用者。前述蓄電裝置用外裝材1,例如,可進行深絞伸成形、鼓脹成形等之成形而作為蓄電池的外殼等使用。此外,前述蓄電裝置用外裝材1,亦可作為不進行成形之平面狀之外裝材使用(參照圖2)。 One embodiment of an exterior material 1 for a power storage device according to the present invention is shown in FIG. 1. This exterior material 1 for a power storage device is intended for use as a lithium ion battery case. The exterior material 1 for a power storage device can be formed, for example, by deep-stretch forming, bulging, or the like, and can be used as a battery case or the like. In addition, the said exterior material 1 for electrical storage devices can also be used as a planar exterior material which is not shape | molded (refer FIG. 2).

本實施型態中,前述蓄電裝置用外裝材1,其係由金屬箔層4之一側的面介由內側接著劑層6與密封層(內側層)3積層一體化,且前述金屬箔層4之另一側的面介由外側接著劑層5與耐熱性樹脂層(外側層)2積層一體化之構成所成。 In this embodiment, the aforementioned exterior material 1 for a power storage device is integrated by laminating a surface on one side of the metal foil layer 4 with an inner adhesive layer 6 and a sealing layer (inner layer) 3, and the aforementioned metal foil is integrated. The surface on the other side of the layer 4 is formed by laminating and integrating the outer adhesive layer 5 and the heat-resistant resin layer (outer layer) 2.

前述密封層(熱可塑性樹脂層)(內側層)3,係具備對於使用於鋰離子蓄電池之腐蝕性強的電解液等優異之耐藥品性,同時擔任賦予外裝材熱密封性之角色。 The sealing layer (thermoplastic resin layer) (inner layer) 3 has excellent chemical resistance to a corrosive electrolytic solution used in a lithium-ion battery, and also serves to impart heat-sealing properties to exterior materials.

本發明中,前述密封層3,其構成係包含:第1低熔點層7,由構成該密封層3中金屬箔層4側之最外層之熱可塑性樹脂所成;第2低熔點層8,由構成前述密封層3中與金屬箔層側為相反側之最外層之熱可塑性樹脂所成;及高熔點中間層9,由配置於前述第1低熔點層7與前述第2低熔點層8之間之熱可塑性樹脂所成(參照圖1),且其係前述高熔點中間層9之熔點為120℃~180℃,前述第1低熔點層7之熔點及前述第2低熔點層8之熔點,較前述高熔點中間層9之熔點為低,前述高熔 點中間層之厚度係20μm以上,且前述高熔點中間層9之厚度為「X」,前述密封層3之厚度為「Y」時,係滿足0.50Y≦X≦0.99Y之關係之構成。 In the present invention, the sealing layer 3 includes a first low-melting layer 7 made of a thermoplastic resin constituting an outermost layer on the metal foil layer 4 side of the sealing layer 3, and a second low-melting layer 8, It is made of a thermoplastic resin constituting the outermost layer on the side opposite to the metal foil layer side of the sealing layer 3; and a high-melting intermediate layer 9 is disposed on the first low-melting layer 7 and the second low-melting layer 8 It is made of thermoplastic resin (see Figure 1), and the melting point of the high-melting intermediate layer 9 is 120 ° C to 180 ° C, the melting point of the first low-melting layer 7 and the melting point of the second low-melting layer 8 The melting point is lower than the melting point of the high-melting intermediate layer 9 The thickness of the dot intermediate layer is 20 μm or more, and the thickness of the high-melting intermediate layer 9 is “X”, and the thickness of the aforementioned sealing layer 3 is “Y”, which satisfies the relationship of 0.50Y ≦ X ≦ 0.999Y. .

又,上述實施型態中,雖前述密封層3,係前述第1低熔點層7/高熔點中間層9/第2低熔點層8之3層積層構成,但並未特別限定為如此之3層積層構成,只要係至少包含前述第1低熔點層7、前述高熔點中間層9、前述第2低熔點層8之構成即可,不論係4層積層構成、5層積層構成、或6層以上之積層構成皆可。 Moreover, in the above-mentioned embodiment, although the sealing layer 3 is a three-layer laminated structure of the first low-melting layer 7 / high-melting intermediate layer 9 / second low-melting layer 8 described above, it is not particularly limited to such a three-layer structure. The laminated structure may be a structure including at least the first low-melting layer 7, the high-melting intermediate layer 9, and the second low-melting layer 8, regardless of a four-layer structure, a five-layer structure, or a six-layer structure. Any of the above laminated structures may be used.

前述高熔點中間層9之熔點,必須係120℃~180℃。若未達120℃時,在將密封層彼此熱融著時熱密封部中高熔點中間層亦容易發生流出,故難以確保熱密封部具有充分之絕緣性。另一方面,若熔點超過180℃,將密封層彼此熱融著之密封溫度必須極高,惟密封溫度高時會有電解液受到熱影響而容易分解之問題產生。其中,高熔點中間層9之熔點,係以150℃~170℃為佳。又,將密封層彼此熱融著時之熱密封溫度,設定在相對於高熔點中間層9之熔點係+10℃~+40℃之範圍為佳。 The melting point of the aforementioned high-melting intermediate layer 9 must be 120 ° C to 180 ° C. When the temperature is lower than 120 ° C, the high-melting intermediate layer in the heat-sealed portion also easily flows out when the sealing layers are thermally fused to each other, so it is difficult to ensure that the heat-sealed portion has sufficient insulation. On the other hand, if the melting point exceeds 180 ° C, the sealing temperature for heat-sealing the sealing layers with each other must be extremely high. However, when the sealing temperature is high, the electrolyte is affected by heat and easily decomposed. Among them, the melting point of the high-melting intermediate layer 9 is preferably 150 ° C to 170 ° C. The heat-sealing temperature when the sealing layers are thermally fused to each other is preferably set to a range of + 10 ° C to + 40 ° C relative to the melting point of the high-melting intermediate layer 9.

前述高熔點中間層9之厚度必須係20μm以上。若未達20μm,則熱密封後無法維持(確保)為了確保充分絕緣性之密封層3之厚度。其中,前述高熔點中間層9之厚度係以20μm~30μm為佳。又,前述高熔點中間層9之厚度若過大,有熱密封時之熱傳導降低而無法充分密封接合之可能性,根據此觀點,前述高熔點中間層9之厚度係設定在40μm以下為佳。 The thickness of the high-melting intermediate layer 9 must be 20 μm or more. If it is less than 20 μm, the thickness of the sealing layer 3 for ensuring sufficient insulation cannot be maintained (guaranteed) after heat sealing. The thickness of the high-melting intermediate layer 9 is preferably 20 μm to 30 μm. In addition, if the thickness of the high-melting intermediate layer 9 is too large, there is a possibility that the heat conduction during heat sealing is reduced and the sealing cannot be sufficiently sealed. From this viewpoint, the thickness of the high-melting intermediate layer 9 is preferably set to 40 μm or less.

再者,前述高熔點中間層9之厚度為「X」,前述密封層3之厚度為「Y」時,係滿足0.50Y≦X≦0.99Y之關係的構成。高熔點中間層9之厚度X,若未達密封層3之厚度Y之50%時,有在將密封層彼此熱融著時,低熔點層會過度流出導致無法充分確保熱密封後絶緣部分之距離的疑慮。此外,高熔點中間層9之厚度X,若係密封層3之厚度Y之99%以上時,則在將密封層彼此熱融著時,有無法以充分之密封強度進行密封接合之問題產生。其中,係滿足0.60Y≦X≦0.90Y之關係之構成為佳。 In addition, when the thickness of the high-melting intermediate layer 9 is "X" and the thickness of the sealing layer 3 is "Y", it has a configuration satisfying the relationship of 0.50Y ≦ X ≦ 0.999Y. If the thickness X of the high-melting intermediate layer 9 is less than 50% of the thickness Y of the sealing layer 3, when the sealing layers are thermally fused to each other, the low-melting layer may excessively flow out, which may not fully ensure the insulation portion after heat sealing. Doubts about distance. In addition, if the thickness X of the high-melting-point intermediate layer 9 is more than 99% of the thickness Y of the sealing layer 3, when the sealing layers are thermally fused to each other, there is a problem that sealing joints cannot be performed with sufficient sealing strength. Among them, a structure that satisfies the relationship of 0.60Y ≦ X ≦ 0.90Y is preferred.

前述高熔點中間層9之熔點,係較前述第1低熔點層7之熔點高20℃以上,且前述高熔點中間層9之熔點,係較前述第2低熔點層8之熔點高20℃以上之構成為佳。藉由如此之構成,在將密封層彼此熱融著時,可充分抑制密封層3從熱密封部流出。其中,前述高熔點中間層9之熔點,係較前述第1低熔點層7之熔點高25℃~35℃,且前述高熔點中間層9之熔點,係較前述第2低熔點層8之熔點高25℃~35℃之構成為佳。 The melting point of the high-melting intermediate layer 9 is more than 20 ° C higher than the melting point of the first low-melting layer 7, and the melting point of the high-melting intermediate layer 9 is 20 ° C or more higher than the melting point of the second low-melting layer 8. The composition is better. With such a configuration, when the sealing layers are thermally fused to each other, it is possible to sufficiently suppress the sealing layer 3 from flowing out of the heat-sealed portion. The melting point of the high-melting intermediate layer 9 is 25 ° C to 35 ° C higher than the melting point of the first low-melting layer 7, and the melting point of the high-melting intermediate layer 9 is higher than the melting point of the second low-melting layer 8. A composition with a temperature between 25 ° C and 35 ° C is preferred.

又,前述第1低熔點層7之熔點及前述第2低熔點層8之熔點,任一者皆在90℃~140℃之範圍為佳。 The melting point of the first low-melting layer 7 and the melting point of the second low-melting layer 8 are both preferably within a range of 90 ° C to 140 ° C.

形成前述第1低熔點層7、前述第2低熔點層8及前述高熔點中間層9之熱可塑性樹脂,雖無特別限定,但以無延伸薄膜為佳。前述熱可塑性樹脂,雖無特別限定,但使用選自聚乙烯、聚丙烯、烯烴系共聚物,此等之酸變性物及離聚物所成群中至少1種之熱可塑性樹脂為佳。 The thermoplastic resin forming the first low-melting layer 7, the second low-melting layer 8, and the high-melting intermediate layer 9 is not particularly limited, but is preferably an unstretched film. Although the thermoplastic resin is not particularly limited, it is preferable to use at least one thermoplastic resin selected from the group consisting of polyethylene, polypropylene, and olefin-based copolymers, and acid-denatured products and ionomers thereof.

其中,構成前述高熔點中間層9之熱可塑性樹脂,係重量平 均分子量為200,000~800,000之範圍之乙烯-丙烯嵌段共聚物樹脂為佳。此情形中,在將密封層彼此熱融著時,可充分抑制密封層從熱密封部流出。 Among them, the thermoplastic resin constituting the high-melting intermediate layer 9 has a flat weight. An ethylene-propylene block copolymer resin having an average molecular weight in the range of 200,000 to 800,000 is preferable. In this case, when the sealing layers are thermally fused to each other, it is possible to sufficiently suppress the sealing layer from flowing out of the heat-sealed portion.

此外,構成前述第1低熔點層7之熱可塑性樹脂及構成前述第2低熔點層8之熱可塑性樹脂,係重量平均分子量為10,000~200,000之範圍之乙烯-丙烯無規共聚物樹脂為佳。此情形中,在將密封層彼此熱融著時,可進一步以充分之密封強度進行密封接合。例如,可將前述第1低熔點層7係由重量平均分子量為100,000之乙烯-丙烯無規共聚物樹脂形成,前述第2低熔點層8係由重量平均分子量為70,000之乙烯-丙烯無規共聚物樹脂形成之構成,或前述第1低熔點層7及前述第2低熔點層8,任一者皆係由重量平均分子量為120,000之乙烯-丙烯無規共聚物樹脂形成之構成等作為例示。 The thermoplastic resin constituting the first low-melting layer 7 and the thermoplastic resin constituting the second low-melting layer 8 are ethylene-propylene random copolymers having a weight average molecular weight in the range of 10,000 to 200,000. Resin is preferred. In this case, when the sealing layers are thermally fused to each other, the sealing joint can be further sealed with sufficient sealing strength. For example, the first low melting point layer 7 may be formed of an ethylene-propylene random copolymer resin having a weight average molecular weight of 100,000, and the second low melting point layer 8 may be formed of an ethylene-propylene random copolymer resin having a weight average molecular weight of 70,000. The composition of the propylene random copolymer resin, or the first low-melting layer 7 and the second low-melting layer 8 are each formed of an ethylene-propylene random copolymer resin having a weight average molecular weight of 120,000. The structure and the like are exemplified.

此外,採用前述第1低熔點層7之厚度係0.5μm以上,前述第2低熔點層8之厚度係1μm以上之構成為佳,採用如此之構成之情形,在將密封層彼此熱融著時,可確保更充分之密封強度而密封接合。其中,前述第1低熔點層7之厚度,係1μm~10μm為特佳。此外,前述第2低熔點層8之厚度,係1μm~10μm為特佳。 The thickness of the first low-melting layer 7 is 0.5 μm or more, and the thickness of the second low-melting layer 8 is 1 μm or more. In such a configuration, the sealing layers are heat-fused with each other. In this case, it is possible to ensure a sufficient sealing strength and seal the joint. The thickness of the first low-melting layer 7 is particularly preferably 1 μm to 10 μm. The thickness of the second low-melting layer 8 is particularly preferably 1 μm to 10 μm.

前述密封層3之厚度(全體厚度),係設定在21μm~40μm為佳。21μm以上時可充分防止針孔的產生,且設定在40μm以下時可降低樹脂使用量而實現成本減縮。其中,前述密封層3之厚度,係設定在25μm~35μm為特佳。 The thickness (the entire thickness) of the sealing layer 3 is preferably set to 21 μm to 40 μm. When it is 21 μm or more, the occurrence of pinholes can be fully prevented, and when it is set to 40 μm or less, the amount of resin used can be reduced to achieve cost reduction. The thickness of the sealing layer 3 is particularly preferably set to 25 μm to 35 μm.

前述金屬箔層4,係賦予外裝材1阻止氧或水分之侵入之氣 體阻隔性之角色。前述金屬箔層4,並無特別限定,可列舉例如:鋁箔、SUS箔(不鏽鋼箔)、銅箔等,一般係使用鋁箔。前述金屬箔層4之厚度,係10μm~100μm為佳。10μm以上可防止在製造金屬箔中之壓延時之針孔產生,且100μm以下可縮小鼓脹成形、絞深成形等之成形時的應力而提升成形性。其中,前述金屬箔層4之厚度,係20μm~50μm為特佳。 The metal foil layer 4 is a gas that imparts to the exterior material 1 to prevent the intrusion of oxygen or moisture. The role of body barrier. The metal foil layer 4 is not particularly limited, and examples thereof include aluminum foil, SUS foil (stainless steel foil), and copper foil. Generally, aluminum foil is used. The thickness of the metal foil layer 4 is preferably 10 μm to 100 μm. 10 μm or more can prevent the occurrence of pinholes in the metal foil during pressure delay, and 100 μm or less can reduce the stress during forming such as bulging and deep forming and improve the formability. The thickness of the metal foil layer 4 is particularly preferably 20 μm to 50 μm.

前述金屬箔層4,至少內側之面(內側接著劑層6側之面)係施以化成處理為佳。藉由施以如此之化成處理,可充分防止因內容物(電池之電解液等)所導致之金屬箔表面之腐蝕。例如藉由下述之處理可對於金屬箔施以化成處理。亦即,例如,在進行脫脂處理的金屬箔表面上,藉由塗工下述1)~3)之中任一者之水溶液後、乾燥,從而施加化成處理:1)含有磷酸、鉻酸、及選自氟化物之金屬鹽及氟化物之非金屬鹽所成群中至少1種之化合物的混合物水溶液;2)含有磷酸、選自丙烯酸系樹脂、殼聚醣衍生物樹脂及苯酚系樹脂所成群中至少1種之樹脂、及選自鉻酸及鉻(III)鹽所成群中至少1種之化合物的混合物之水溶液。3)含有磷酸、選自丙烯酸系樹脂、殼聚醣衍生物樹脂及苯酚系樹脂所成群中至少1種之樹脂、 選自鉻酸及鉻(III)鹽所成群中至少1種之化合物、及選自氟化物之金屬鹽及氟化物之非金屬鹽所成群中至少1種之化合物的混合物之水溶液。 It is preferable that at least the inner surface (the surface on the inner adhesive layer 6 side) of the metal foil layer 4 is subjected to chemical conversion treatment. By applying such a chemical conversion treatment, it is possible to sufficiently prevent the corrosion of the surface of the metal foil caused by the contents (the electrolyte of the battery, etc.). For example, the metal foil may be subjected to a chemical conversion treatment by the following treatment. That is, for example, on the surface of a metal foil subjected to degreasing treatment, a chemical treatment is applied after applying an aqueous solution of any one of the following 1) to 3) and then drying: 1) containing phosphoric acid, chromic acid, And a mixture of at least one compound selected from the group consisting of metal salts of fluorides and non-metal salts of fluorides; 2) containing phosphoric acid, selected from acrylic resins, chitosan derivative resins, and phenol resins; An aqueous solution of a mixture of at least one resin in the group and at least one compound selected from the group consisting of chromic acid and chromium (III) salts. 3) a resin containing phosphoric acid, at least one selected from the group consisting of an acrylic resin, a chitosan derivative resin, and a phenol resin, An aqueous solution of a mixture of at least one compound selected from the group consisting of chromic acid and chromium (III) salts, and at least one compound selected from the group consisting of metal salts of fluorides and non-metal salts of fluorides.

前述化成皮膜,其鉻附著量(單面)為0.1mg/m2~50mg/m2為佳,2mg/m2~20mg/m2為特佳。 In the aforementioned chemical conversion film, the chromium adhesion amount (one side) is preferably 0.1 mg / m 2 to 50 mg / m 2 , and 2 mg / m 2 to 20 mg / m 2 is particularly preferred.

本發明中,前述耐熱性樹脂層2,並非係必須之構成層,但採用前述金屬箔層4之另一側的面介由外側接著劑層5與耐熱性樹脂層2積層之構成為佳(參照圖1)。藉由設置如此之耐熱性樹脂層2,可充分確保金屬箔層4之另一側的面側之絶緣性,並可提升外裝材1之物理性強度及耐衝撃性。 In the present invention, the heat-resistant resin layer 2 is not an essential constituent layer, but a structure in which the other surface of the metal foil layer 4 is laminated with the outer adhesive layer 5 and the heat-resistant resin layer 2 is preferable ( (See Figure 1). By providing such a heat-resistant resin layer 2, the insulation on the other side of the metal foil layer 4 can be sufficiently ensured, and the physical strength and impact resistance of the exterior material 1 can be improved.

構成前述耐熱性樹脂層(外側層)2之耐熱性樹脂,係使用不會因熱密封時之熱密封溫度而溶融之耐熱性樹脂。前述耐熱性樹脂,係使用具有較構成密封層3之高熔點中間層9之熔點高10℃以上之高熔點的耐熱性樹脂為佳,使用具有較高熔點中間層9之熔點高20℃以上之高熔點的耐熱性樹脂為特佳。 The heat-resistant resin constituting the heat-resistant resin layer (outer layer) 2 is a heat-resistant resin that does not melt due to the heat-sealing temperature during heat-sealing. The heat-resistant resin is preferably a heat-resistant resin having a high melting point higher than the melting point of the high-melting intermediate layer 9 constituting the sealing layer 3 by 10 ° C or higher, and a resin having a higher melting point of the intermediate layer 9 having a higher melting point by 20 ° C or higher. A high-melting heat-resistant resin is particularly preferred.

前述耐熱性樹脂層(外側層)2,並無特別限定,可列舉例如:尼龍薄膜等之聚醯胺薄膜、聚酯薄膜、聚烯烴薄膜等,可合適地使用此等之延伸薄膜。其中,前述耐熱性樹脂層2,係使用二軸延伸尼龍薄膜等之二軸延伸聚醯胺薄膜、二軸延伸聚對苯二甲酸丁二酯(PBT)薄膜、二軸延伸聚對苯二甲酸乙二酯(PET)薄膜、二軸延伸聚萘二甲酸乙醇酯(PEN)薄膜、二軸延伸聚丙烯薄膜為特佳。前述尼龍薄膜,並無特別限定,可列舉例如:6尼龍薄膜、6,6尼龍薄膜、MXD尼龍薄膜等。 又,前述耐熱性樹脂層2,可以單層形成,抑或,例如以聚酯薄膜/聚醯胺薄膜所成複層(PET薄膜/尼龍薄膜所成複層等)形成亦可。前述例示之複層構成中,較佳係將聚酯薄膜配置較聚醯胺薄膜為外側,相同地,較佳係將PET薄膜配置較尼龍薄膜為外側。 The heat-resistant resin layer (outer layer) 2 is not particularly limited, and examples thereof include polyamide films such as nylon films, polyester films, and polyolefin films, and these stretched films can be suitably used. The heat-resistant resin layer 2 is a biaxially stretched polyamide film, a biaxially stretched polybutylene terephthalate (PBT) film, or a biaxially stretched polyterephthalic acid. Ethylene glycol (PET) film, biaxially stretched polyethylene naphthalate (PEN) film, and biaxially stretched polypropylene film are particularly preferred. The nylon film is not particularly limited, and examples thereof include 6 nylon films, 6,6 nylon films, and MXD nylon films. The heat-resistant resin layer 2 may be formed as a single layer, or may be formed, for example, as a multi-layer made of a polyester film / polyamide film (such as a multi-layer made of a PET film / nylon film). In the above-mentioned exemplified multi-layer structure, the polyester film is preferably disposed outside the polyamide film, and similarly, the PET film is disposed outside the nylon film.

前述耐熱性樹脂層2之厚度,係8μm~50μm為佳。藉由設定在上述合適下限值以上可確保作為外裝材具有充分之強度,且藉由設定在上述合適上限值以下可縮小鼓脹成形、絞伸成形等之成形時的應力而提升成形性。其中,前述耐熱性樹脂層2之厚度,係12μm~25μm為特佳。 The thickness of the heat-resistant resin layer 2 is preferably 8 μm to 50 μm. By setting it above the appropriate lower limit value, sufficient strength can be ensured as an exterior material, and by setting it below the appropriate upper limit value, molding stress such as bulging forming and strand forming can be reduced to improve formability. . The thickness of the heat-resistant resin layer 2 is particularly preferably 12 μm to 25 μm.

前述外側接著劑層5,並無特別限定,可列舉例如:聚胺基甲酸酯接著劑層,聚酯聚胺基甲酸酯接著劑層,聚醚聚胺基甲酸酯接著劑層等。前述外側接著劑層5之厚度,係設定在1μm~5μm為佳。其中,根據外裝材之薄膜化、輕量化之觀點,前述外側接著劑層5之厚度,係設定在1μm~3μm為特佳。 The outer adhesive layer 5 is not particularly limited, and examples thereof include a polyurethane adhesive layer, a polyester polyurethane adhesive layer, a polyether polyurethane adhesive layer, and the like. . The thickness of the outer adhesive layer 5 is preferably set to 1 μm to 5 μm. Among them, from the viewpoint of thinning and reducing the weight of the exterior material, the thickness of the outer adhesive layer 5 is particularly preferably set to 1 μm to 3 μm.

前述內側接著劑層6,並無特別限定,例如,可使用作為上述外側接著劑層5所例示者,惟使用因電解液導致之膨潤現象較少之聚烯烴系接著劑為佳。前述內側接著劑層6之厚度,係設定在1μm~5μm為佳。其中,根據外裝材之薄膜化、輕量化之觀點,前述內側接著劑層6之厚度,係設定在1μm~3μm為特佳。 The inner adhesive layer 6 is not particularly limited. For example, the outer adhesive layer 5 may be exemplified as described above. However, it is preferable to use a polyolefin-based adhesive having less swelling due to an electrolytic solution. The thickness of the inner adhesive layer 6 is preferably set to 1 μm to 5 μm. Among them, from the viewpoint of thinning and reducing the weight of the exterior material, the thickness of the inner adhesive layer 6 is particularly preferably set to 1 μm to 3 μm.

本發明之蓄電裝置用外裝材1之厚度,係設定在60μm~160μm為佳。 The thickness of the exterior material 1 for a power storage device according to the present invention is preferably set to 60 μm to 160 μm.

藉由將本發明之外裝材1進行成形(深絞伸成形、鼓脹成形 等),可得到成形外殼(電池外殼等)。又,本發明之外裝材1,亦可不進行成形而直接使用。 By forming the exterior material 1 of the present invention (deep drawing, bulging) Etc.) to obtain a molded case (battery case, etc.). The exterior material 1 of the present invention may be used without being formed.

使用本發明之外裝材1所構成之蓄電裝置20之一實施型態以圖2表示。此蓄電裝置20,係鋰離子蓄電池。 An embodiment of the power storage device 20 constructed using the exterior material 1 of the present invention is shown in FIG. 2. The power storage device 20 is a lithium-ion battery.

前述電池20,係具備:裸電池21,由正極活性物質、負極活性物質、隔板、電解質所構成;接片22,個別與正極及負極連接;未進行成形之平面狀之前述外裝材1;及成形外殼11,將前述外裝材1成形所得具有收容凹部11b者(參照圖2)。前述裸電池21及前述接片22構成蓄電裝置本體部19。 The battery 20 includes: a bare cell 21 composed of a positive electrode active material, a negative electrode active material, a separator, and an electrolyte; a tab 22 that is individually connected to the positive electrode and the negative electrode; and the planar exterior material 1 that is not formed. And a molding case 11 in which the exterior material 1 is molded and has a receiving recess 11b (see FIG. 2). The bare cell 21 and the tab 22 constitute a power storage device body portion 19.

於前述成形外殼11之收容凹部11b內收容前述裸電池21及前述接片22之一部分,將前述平面狀之外裝材1配置於該成形外殼11之上,將該外裝材1之周緣部(之內側層3)及前述成形外殼11之密封用周緣部11a(之內側層3)藉由熱密封而接合形成熱密封部(熱密封部),藉此構成前述蓄電裝置(電池)20。又,前述接片22之先端部,係導出至外部(參照圖2)。 A part of the bare cell 21 and the connecting piece 22 are housed in the receiving recess 11 b of the molded case 11, the planar exterior material 1 is arranged on the molded case 11, and a peripheral edge portion of the exterior material 1 (Inner layer 3) and the sealing peripheral portion 11a (inner layer 3) of the molded case 11 are heat-sealed to form a heat-sealed portion (heat-sealed portion), thereby constituting the power storage device (battery) 20 described above. In addition, the tip end portion of the aforementioned tab 22 is led out to the outside (see FIG. 2).

【實施例】 [Example]

接著,說明本發明之具體實施例,惟本發明並非限定為此等實施例者。 Next, specific embodiments of the present invention will be described, but the present invention is not limited to those embodiments.

<實施例1> <Example 1>

在厚度35μm之鋁箔(JIS H4160所規定A8021之燒鈍鋁箔)4的兩面,塗佈含有磷酸、聚丙烯酸(丙烯酸系樹脂)、 鉻(III)鹽化合物、水、乙醇所成的化成處理液後,以180℃進行乾燥,從而形成化成皮膜。此化成皮膜之鉻附著量係單面10mg/m2Apply a chemical conversion treatment solution containing phosphoric acid, polyacrylic acid (acrylic resin), chromium (III) salt compound, water, and ethanol to both sides of a 35 μm-thick aluminum foil (A8021 burnt aluminum foil specified in JIS H4160). , And dried at 180 ° C. to form a chemical conversion film. The amount of chromium adhered to the formed film was 10 mg / m 2 on one side.

接著,在前述完成化成處理之鋁箔4的一側的面,介由2液硬化型之胺基甲酸乙酯系接著劑5,與厚度15μm之二軸延伸6尼龍薄膜(外側層)2乾式層壓(貼合)。 Next, on the side of the aluminum foil 4 that has undergone the chemical conversion treatment, a 2 layer hardened urethane-based adhesive 5 and a biaxially stretched 6 nylon film (outer layer) 2 with a thickness of 15 μm are formed as a dry layer. Press (fit).

接著,使用T型將熔點137℃之乙烯-丙烯無規共聚物(重量平均分子量為150,000)所成厚度4.5μm之第1低熔點層7;熔點163℃之乙烯-丙烯嵌段共聚物(重量平均分子量為600,000)所成厚度21μm之高熔點中間層9;熔點137℃之乙烯-丙烯無規共聚物(重量平均分子量為150,000)所成厚度4.5μm之第2低熔點層8依序3層積層共押出,從而得到此等3層積層之厚度30μm之密封薄膜(第1低熔點層7/高熔點中間層9/第2低熔點層8)3後,該密封薄膜(內側層)3之第1低熔點層7面,介由2液硬化型之馬來酸變性聚丙烯接著劑(硬化劑為多官能異氰酸酯)6,與前述乾式層壓後之鋁箔4之另一側的面重合,藉由夾入橡膠壓輥及加熱至100℃之層壓輥之間壓著而乾式層壓,之後,藉由以40℃養護5天(加熱),得到圖1所示構成之厚度86μm之蓄電裝置用外裝材1。 Next, the first low-melting layer 7 having a thickness of 4.5 μm formed from an ethylene-propylene random copolymer having a melting point of 137 ° C. (with a weight average molecular weight of 150,000) using a T-type; and an ethylene-propylene block copolymer having a melting point of 163 ° C. Material (weight average molecular weight of 600,000) made of high-melting-point intermediate layer 9 with a thickness of 21 μm; ethylene-propylene random copolymer with a melting point of 137 ° C (weight average molecular weight of 150,000) was the second with a thickness of 4.5 μm The low-melting layer 8 was sequentially co-extruded in 3 layers to obtain these 30-layer sealing films (the first low-melting layer 7 / the high-melting intermediate layer 9 / the second low-melting layer 8) 3. The first low melting point layer 7 of the sealing film (inner layer) 3 is passed through a two-liquid curing type maleic acid-denatured polypropylene adhesive (the curing agent is a polyfunctional isocyanate) 6 and the dry-laminated aluminum foil 4 The other side is overlapped, dry lamination is carried out by sandwiching between a rubber pressure roller and a lamination roller heated to 100 ° C, and then cured at 40 ° C for 5 days (heating) to obtain FIG. 1 The exterior material 1 for a power storage device having a thickness of 86 μm having the structure shown.

又,說明前述高熔點中間層(乙烯-丙烯嵌段共聚物)之詳細內容,前述高熔點中間層,係由:第1彈性體變性烯烴系樹脂99質量%與第2彈性體變性烯烴系樹脂1質量%之組成之樹脂組成物所形成,且該第1彈性體變性烯烴系樹脂係熔點為163℃、結晶熔解能為58J/g;該第2彈性體變性烯烴系樹脂係熔點為144℃、結晶熔解能為19 J/g。前述第1彈性體變性烯烴系樹脂及前述第2彈性體變性烯烴系樹脂,任一者皆係由彈性體變性均聚丙烯或/及彈性體變性無規共聚物所成。前述彈性體變性無規共聚物,係共聚物成分為含有丙烯及除了丙烯之外的其他之共聚物成分之無規共聚物之彈性體變性體。又,只有高熔點中間層使用SEM觀察(以掃描式電子顯微鏡觀察)時,可確認出高熔點中間層係具備彈性體成分為島狀之海島構造。 The details of the high-melting intermediate layer (ethylene-propylene block copolymer) will be described. The high-melting intermediate layer is composed of 99% by mass of a first elastomer-modified olefin resin and a second elastomer-modified olefin resin. A 1% by mass resin composition is formed, and the melting point of the first elastomer-modified olefin-based resin is 163 ° C and the melting energy of crystal is 58 J / g; the melting point of the second elastomer-modified olefin-based resin is 144 ° C The crystal melting energy is 19 J / g. Either the first elastomer-denatured olefin-based resin or the second elastomer-denatured olefin-based resin is made of an elastomer-modified homopolypropylene or / and an elastomer-modified random copolymer. The aforementioned elastomer-denatured random copolymer refers to an elastomer-denatured body of a random copolymer containing propylene and copolymer components other than propylene. In addition, when only the high-melting intermediate layer was observed by SEM (observation with a scanning electron microscope), it was confirmed that the high-melting intermediate layer had an island structure having an island shape with an elastomer component.

上述「熔點」之詞,係意指將JIS K7121-1987作為基準,藉由差示掃描熱量測定(DSC)測定之熔解高峰溫度,「結晶熔解能」之詞,係意指將JIS K7122-1987作為基準,藉由差示掃描熱量測定(DSC)測定之熔解熱(結晶熔解能)。 The term "melting point" means the melting peak temperature measured by differential scanning calorimetry (DSC) based on JIS K7121-1987, and the term "crystallization melting energy" means the JIS K7122-1987 As a reference, the heat of fusion (crystal melting energy) measured by differential scanning calorimetry (DSC).

此外,前述2液硬化型馬來酸變性聚丙烯接著劑,係使用:作為主劑之馬來酸變性聚丙烯(熔點80℃,酸價10mgKOH/g)100質量份;作為硬化劑之六亞甲基二異氰酸酯之異氰脲酸酯體(NCO含有率:20質量%)8質量份;進一步使用混合有溶劑之接著劑溶液,使該接著劑溶液成為固形份塗佈量係2g/m2而塗佈於前述鋁箔4之另一側的面,加熱乾燥後,與前述密封薄膜3之第1低熔點層7面重合。 In addition, the aforementioned two-liquid curing type maleic acid modified polypropylene adhesive is used: 100 parts by mass of maleic acid modified polypropylene (melting point 80 ° C, acid value 10 mgKOH / g) as a main agent; Liuya as a curing agent 8 parts by mass of an isocyanurate body of methyl diisocyanate (NCO content rate: 20% by mass); a solvent-containing adhesive solution was further used to make the adhesive solution a solid content, and the coating amount was 2 g / m 2 The surface coated on the other side of the aluminum foil 4 is heated and dried, and then overlaps with the first low-melting layer 7 surface of the sealing film 3.

<實施例2> <Example 2>

除了密封薄膜,係使用熔點115℃之低密度聚乙烯(重量平均分子量為80,000)所成厚度3.75μm之第1低熔點層7;熔點142℃之乙烯-丙烯嵌段共聚物(重量平均分子量為400,000)所成厚度22.5μm之高熔點中間層9;熔點115℃之低密度聚乙烯(重量平均分子量為80,000)所成厚度3.75μm之第2低熔點層8依 序積層之厚度30μm之密封薄膜3以外,其他皆與實施例1相同,得到圖1所示構成之厚度86μm之蓄電裝置用外裝材1。 Except for the sealing film, the first low-melting layer 7 made of low-density polyethylene with a melting point of 115 ° C (weight-average molecular weight of 80,000) is 3.75 μm in thickness; the ethylene-propylene block copolymer having a melting point of 142 ° C (weight High-melting intermediate layer 9 with a thickness of 22.5 μm formed from an average molecular weight of 400,000; Second low-melting layer 8 with a thickness of 3.75 μm from a low-density polyethylene having a melting point of 115 ° C. (80,000 weight average molecular weight) according to Except for the sealing film 3 with a thickness of 30 μm, which was sequentially laminated, the rest was the same as in Example 1, and an exterior material 1 for a power storage device having a thickness of 86 μm and having a structure shown in FIG. 1 was obtained.

<實施例3> <Example 3>

除了密封薄膜,係使用熔點135℃之乙烯-丙烯無規共聚物(重量平均分子量為120,000)所成厚度1.5μm之第1低熔點層7;熔點161℃之乙烯-丙烯嵌段共聚物(重量平均分子量為500,000)所成厚度27μm之高熔點中間層9;熔點135℃之乙烯-丙烯無規共聚物(重量平均分子量為120,000)所成厚度1.5μm之第2低熔點層8依序積層之厚度30μm之密封薄膜3以外,其他皆與實施例1相同,得到圖1所示構成之厚度86μm之蓄電裝置用外裝材1。 Except for the sealing film, the first low-melting layer 7 having a thickness of 1.5 μm and an ethylene-propylene random copolymer having a melting point of 135 ° C (weight average molecular weight of 120,000); and an ethylene-propylene block copolymer having a melting point of 161 ° C Material (weight average molecular weight of 500,000) formed a high melting point intermediate layer 9 with a thickness of 27 μm; ethylene-propylene random copolymer with a melting point of 135 ° C. (weight average molecular weight of 120,000) formed a second layer with a thickness of 1.5 μm The low-melting-point layer 8 was sequentially laminated except for the sealing film 3 having a thickness of 30 μm, and the rest were the same as those in Example 1, and an exterior material 1 for a power storage device having a thickness of 86 μm and having the structure shown in FIG. 1 was obtained.

<實施例4> <Example 4>

除了密封薄膜,係使用熔點137℃之乙烯-丙烯無規共聚物(重量平均分子量為150,000)所成厚度6μm之第1低熔點層7;熔點163℃之乙烯-丙烯嵌段共聚物(重量平均分子量為600,000)所成厚度21μm之高熔點中間層9;熔點137℃之乙烯-丙烯無規共聚物(重量平均分子量為150,000)所成厚度3μm之第2低熔點層8依序積層之厚度30μm之密封薄膜3以外,其他皆與實施例1相同,得到圖1所示構成之厚度86μm之蓄電裝置用外裝材1。 Except for the sealing film, the first low-melting layer 7 having a thickness of 6 μm and an ethylene-propylene random copolymer having a melting point of 137 ° C (weight average molecular weight of 150,000); and an ethylene-propylene block copolymer having a melting point of 163 ° C ( 21 μm high-melting intermediate layer 9 with a weight average molecular weight of 600,000); ethylene-propylene random copolymer with a melting point of 137 ° C (weight average molecular weight of 150,000) is a second low-melting layer with a thickness of 3 μm 8 Except that the sealing film 3 with a thickness of 30 μm was sequentially laminated, the rest were the same as in Example 1, and an exterior material 1 for a power storage device with a thickness of 86 μm and a structure shown in FIG. 1 was obtained.

<實施例5> <Example 5>

除了密封薄膜,係使用熔點137℃之乙烯-丙烯無規共聚物(重量平均分子量為150,000)所成厚度3μm之第1低熔點層7;熔點163℃之乙烯-丙烯嵌段共聚物(重量平均分子量為600,00 0)所成厚度21μm之高熔點中間層9;熔點137℃之乙烯-丙烯無規共聚物(重量平均分子量為150,000)所成厚度6μm之第2低熔點層8依序積層之厚度30μm之密封薄膜3以外,其他皆與實施例1相同,得到圖1所示構成之厚度86μm之蓄電裝置用外裝材1。 Except for the sealing film, the first low-melting layer 7 having a thickness of 3 μm and an ethylene-propylene random copolymer having a melting point of 137 ° C. (with a weight average molecular weight of 150,000); Weight average molecular weight is 600,00 0) A high-melting intermediate layer 9 having a thickness of 21 μm; a second low-melting layer 8 having a thickness of 6 μm and a thickness of 30 μm sequentially formed from an ethylene-propylene random copolymer having a melting point of 137 ° C. (weight average molecular weight of 150,000) Except for the sealing film 3, everything was the same as in Example 1 to obtain an exterior material 1 for a power storage device having a thickness of 86 μm and a structure shown in FIG. 1.

<實施例6> <Example 6>

除了密封薄膜,係使用熔點137℃之乙烯-丙烯無規共聚物(重量平均分子量為150,000)所成厚度4.5μm之第1低熔點層7;熔點152℃之乙烯-丙烯嵌段共聚物(重量平均分子量為400,000)所成厚度21μm之高熔點中間層9;熔點137℃之乙烯-丙烯無規共聚物(重量平均分子量為150,000)所成厚度4.5μm之第2低熔點層8依序積層之厚度30μm之密封薄膜3以外,其他皆與實施例1相同,得到圖1所示構成之厚度86μm之蓄電裝置用外裝材1。 Except for the sealing film, the first low-melting layer 7 with a thickness of 4.5 μm formed from an ethylene-propylene random copolymer with a melting point of 137 ° C (weight average molecular weight of 150,000); and an ethylene-propylene block copolymer having a melting point of 152 ° C Material (weight average molecular weight of 400,000) made of high-melting intermediate layer 9 with a thickness of 21 μm; ethylene-propylene random copolymer with a melting point of 137 ° C. (weight average molecular weight of 150,000) was the second with a thickness of 4.5 μm The low-melting-point layer 8 was sequentially laminated except for the sealing film 3 having a thickness of 30 μm, and the rest were the same as those in Example 1, and an exterior material 1 for a power storage device having a thickness of 86 μm and having the structure shown in FIG. 1 was obtained.

<比較例1> <Comparative example 1>

除了密封薄膜,係使用熔點140℃之乙烯-丙烯無規共聚物(重量平均分子量為140,000)所成厚度10.5μm之第1低熔點層7;熔點163℃之乙烯-丙烯嵌段共聚物(重量平均分子量為600,000)所成厚度9μm之高熔點中間層9;熔點140℃之乙烯-丙烯無規共聚物(重量平均分子量為140,000)所成厚度10.5μm之第2低熔點層8依序積層之厚度30μm之密封薄膜3以外,其他皆與實施例1相同,得到厚度86μm之蓄電裝置用外裝材。 Except for the sealing film, the first low-melting layer 7 having a thickness of 10.5 μm was formed using an ethylene-propylene random copolymer having a melting point of 140 ° C (weight average molecular weight of 140,000); and an ethylene-propylene block copolymer having a melting point of 163 ° C Material (weight average molecular weight of 600,000) made of high-melting-point intermediate layer 9 with a thickness of 9 μm; ethylene-propylene random copolymer with a melting point of 140 ° C. (weight average molecular weight of 140,000) of the second having a thickness of 10.5 μm The low-melting-point layer 8 was sequentially laminated except for the sealing film 3 having a thickness of 30 μm, and the rest were the same as those in Example 1 to obtain an exterior material for a power storage device having a thickness of 86 μm.

<比較例2> <Comparative example 2>

除了密封薄膜,係使用熔點140℃之乙烯-丙烯無規共聚 物(重量平均分子量為140,000)所成厚度15μm之第1低熔點層;熔點156℃之乙烯-丙烯嵌段共聚物(重量平均分子量為450,000)所成厚度15μm之高熔點中間層,依序積層之厚度30μm之密封薄膜以外,其他皆與實施例1相同,得到厚度86μm之蓄電裝置用外裝材。又,所得蓄電裝置用外裝材中,第1低熔點層,係構成密封層中金屬箔層側之最外層。 Except for sealing film, ethylene-propylene random copolymerization with melting point of 140 ℃ The first low melting point layer with a thickness of 15 μm formed by a polymer (weight average molecular weight of 140,000); the high melting point intermediate layer with a thickness of 15 μm formed by an ethylene-propylene block copolymer (weight average molecular weight of 450,000) having a melting point of 156 ° C Except that the sealing film with a thickness of 30 μm was sequentially laminated, the rest were the same as in Example 1, and an exterior material for a power storage device with a thickness of 86 μm was obtained. In the obtained exterior material for a storage device, the first low-melting layer constitutes the outermost layer on the metal foil layer side of the sealing layer.

<比較例3> <Comparative example 3>

除了密封薄膜,係使用熔點115℃之低密度聚乙烯(重量平均分子量為80,000)所成厚度10.5μm之第1低熔點層7;熔點142℃之乙烯-丙烯嵌段共聚物(重量平均分子量為400,000)所成厚度9μm之高熔點中間層9;熔點115℃之低密度聚乙烯(重量平均分子量為80,000)所成厚度10.5μm之第2低熔點層8依序積層之厚度30μm之密封薄膜3以外,其他皆與實施例1相同,得到厚度86μm之蓄電裝置用外裝材。 Except for the sealing film, the first low-melting layer 7 with a thickness of 10.5 μm made of low-density polyethylene (having a weight-average molecular weight of 80,000) having a melting point of 115 ° C; and an ethylene-propylene block copolymer having a melting point of 142 ° C (weight High molecular weight intermediate layer 9 with a thickness of 9 μm formed from an average molecular weight of 400,000; Low density polyethylene with a melting point of 115 ° C (weight average molecular weight of 80,000) formed a second low melting point layer 8 with a thickness of 10.5 μm in order Except for the laminated sealing film 3 having a thickness of 30 μm, the rest were the same as in Example 1 to obtain an exterior material for a power storage device having a thickness of 86 μm.

基於下述測定法對於上述所得之各蓄電裝置用外裝材進行評估。其結果以表1表示。又,表1中,X/Y,係意指(高熔點中間層之厚度)÷(密封層之厚度)。此外,表1中,絕緣阻抗值之「>200MΩ」之表記,係表示絕緣阻抗值較200MΩ大之值。 Each of the obtained exterior materials for power storage devices was evaluated based on the following measurement methods. The results are shown in Table 1. In Table 1, X / Y means (thickness of the high-melting intermediate layer) ÷ (thickness of the sealing layer). In addition, in Table 1, the expression of "> 200MΩ" of the insulation resistance value indicates that the insulation resistance value is larger than 200MΩ.

<絕緣阻抗值測定法> <Insulation resistance measurement method>

將所得之蓄電裝置用外裝材裁切為縱100mm×橫15mm之大小的矩形狀之試驗片2張。將此等一對之試驗片彼此之密封層接觸而重合,使用兩面加熱式之熱密封器,以密封幅5mm,0.15MPa之條件進行2秒密封層彼此之熱融著。又,實施例1、3~6、比較例1、2,熱密封溫度係設定為180℃,實施例2及比較例3之熱密封溫度則係設定為160℃(參照表1)。 The obtained exterior material for a power storage device was cut into two rectangular test pieces having a size of 100 mm in length × 15 mm in width. The pair of test pieces were brought into contact with each other and the sealing layers were overlapped, and a heat seal of a double-sided heating type was used to heat-seal the sealing layers with each other for 2 seconds under the conditions of a sealing width of 5 mm and 0.15 MPa. In addition, in Examples 1, 3 to 6, and Comparative Examples 1, 2, the heat-sealing temperature was set to 180 ° C, and the heat-sealing temperatures of Example 2 and Comparative Example 3 were set to 160 ° C (see Table 1).

接著,在試驗片之長方向的兩端部個別貼附導電性之兩面膠帶,確保與鋁箔層之導通。將絶緣阻抗測定裝置(日置電機社製;品號HIOKI3154)之端子與前述試驗片之長方向的兩端部之兩面膠帶一同結線而形成電路後,以25V、5秒之條件進行電壓施加,測定絕緣阻抗值。 Next, a conductive double-sided tape was individually attached to both ends in the longitudinal direction of the test piece to ensure conduction with the aluminum foil layer. The terminals of the insulation resistance measuring device (manufactured by Hitachi Denki Co., Ltd .; HIOKI3154) and the two-sided tape on both ends of the test piece in the longitudinal direction are connected to form a circuit, and a voltage is applied at 25V for 5 seconds to measure. Insulation resistance value.

<密封強度測定法> <Seal strength measurement method>

將外裝材裁切為寬15mm×長100mm之短冊狀,得到試驗片。準備2張前述試驗片,將此等2張試驗片互相之內側層成為內側而重合後,橫渡幅15mm進行全面之熱密封形成熱密封部(熱密封部)。前述熱密封,係使用測試器產業股份有限公司製之熱密封裝置(TP-701-A),以密封壓0.2MPa(儀表表示壓)單面加熱2秒而進行。 又,實施例1、3~6,比較例1、2之試驗片,熱密封溫度係設定為180℃,實施例2及比較例3之試驗片,熱密封溫度係設定為160℃,進行熱密封。 The exterior material was cut into a booklet shape having a width of 15 mm × a length of 100 mm to obtain a test piece. Two test pieces were prepared, and the inner layers of these two test pieces were placed inside and overlapped each other, and then they were heat-sealed across a width of 15 mm to form a heat-sealed portion (heat-sealed portion). The heat sealing is performed by using a heat sealing device (TP-701-A) manufactured by Tester Industries Co., Ltd. and heating at one side with a sealing pressure of 0.2 MPa (indicator pressure) for 2 seconds. In addition, for the test pieces of Examples 1, 3 to 6, and Comparative Examples 1, 2, the heat seal temperature was set to 180 ° C, and for the test pieces of Example 2 and Comparative Example 3, the heat seal temperature was set to 160 ° C. seal.

接著,將JIS Z0238-1998作為基準,對於前述熱密封完成之2張試驗片測定其剝離強度。前述熱密封完成之2張試驗片,固定其個別未密封部所成之兩端部並以引張速度(夾住移動速度)100mm/分進行T字剥離(90度剝離),從而測定剝離強度,將此作為密封強度(N/15mm幅)。 Next, using the JIS Z0238-1998 as a reference, the peel strength was measured for the two test pieces in which the heat sealing was completed. The two test pieces that were heat-sealed were fixed at both ends of the individual unsealed portions, and T-peeled (90-degree peeled) at a tensile speed (clamping moving speed) of 100 mm / minute to measure the peel strength. This was taken as the sealing strength (N / 15mm width).

由表1可明確得知,本發明之實施例1~6之蓄電裝置用外裝材,絕緣阻抗值係較大值,可確保熱密封部具有充分之絶緣性。 It is clear from Table 1 that the insulation resistance value of the exterior materials for power storage devices according to Examples 1 to 6 of the present invention is a relatively large value, which can ensure that the heat-sealed portion has sufficient insulation.

相對於此,X/Y脫離本發明之規定範圍的比較例1、3、及未具備第2低熔點層之比較例2,任一者之絶緣阻抗值皆較小,無法確保充分之絶緣性。 In contrast, in Comparative Examples 1, 3 in which X / Y deviates from the specified range of the present invention, and Comparative Example 2 without a second low-melting layer, the insulation resistance value of either is small, and sufficient insulation cannot be secured. .

【產業利用性】[Industrial availability]

本發明之蓄電裝置用外裝材,作為具體例,係可用於例如: As a specific example, the exterior material for a power storage device of the present invention can be used, for example:

‧鋰蓄電池(鋰離子電池、鋰聚物電池等)等之蓄電裝置 ‧Power storage devices such as lithium batteries (lithium ion batteries, lithium polymer batteries, etc.)

‧鋰離子電容器 ‧Lithium ion capacitor

‧雙電層電容器 ‧Double layer capacitor

等之各種蓄電裝置之外裝材。此外,本發明之蓄電裝置,除了上述例示之蓄電裝置以外,亦包含全固體電池。 And other external storage materials. The power storage device of the present invention includes an all-solid-state battery in addition to the power storage device exemplified above.

本申請案,係伴隨著在2016年4月21日提出申請的日 本專利申請案的特願2016-85436號的優先權主張,其揭示內容直接構成本申請案的一部分。 This application is accompanied by the date of application on April 21, 2016 The priority claim No. 2016-85436 of this patent application, the disclosure of which directly constitutes a part of this application.

在此所使用的用語及說明,係用以說明本發明的實施形態所使用,但本發明並不限定於此。在本發明所揭示且敘述的特徵事項的任何均等物皆不應被排除,且在本發明所請求的範圍內的各種變形亦應被理解為係可被接受的。 The terms and descriptions used herein are used to describe embodiments of the present invention, but the present invention is not limited thereto. Any equivalents of the characteristic matters disclosed and described in the present invention should not be excluded, and various modifications within the scope claimed by the present invention should also be understood as acceptable.

1‧‧‧蓄電裝置用外裝材 1‧‧‧ Exterior materials for power storage devices

2‧‧‧耐熱性樹脂層(外側層) 2‧‧‧ heat-resistant resin layer (outer layer)

3‧‧‧密封層(內側層) 3‧‧‧Sealing layer (inner layer)

4‧‧‧金屬箔層 4‧‧‧ metal foil layer

5‧‧‧外側接著劑層 5‧‧‧ outside adhesive layer

6‧‧‧內側接著劑層 6‧‧‧ inside adhesive layer

7‧‧‧第1低熔點層 7‧‧‧The first low melting layer

8‧‧‧第2低熔點層 8‧‧‧ 2nd low melting point layer

9‧‧‧高熔點中間層 9‧‧‧ high-melting intermediate layer

Claims (6)

一種蓄電裝置用外裝材,其係包含金屬箔層、及該金屬箔層之一側的面所積層之密封層的蓄電裝置用外裝材,其特徵係前述密封層,係包含:第1低熔點層,由構成該密封層中金屬箔層側的最外層之熱可塑性樹脂所成;第2低熔點層,由構成前述密封層中與金屬箔層側為相反側的最外層之熱可塑性樹脂所成;及高熔點中間層,由配置於前述第1低熔點層與前述第2低熔點層之間之熱可塑性樹脂所成;且前述高熔點中間層之熔點,係120℃~180℃;前述第1低熔點層之熔點及前述第2低熔點層之熔點,係較前述高熔點中間層之熔點為低;前述高熔點中間層之厚度係20μm以上;前述高熔點中間層之厚度為「X」,前述密封層之厚度為「Y」時,係滿足0.50Y≦X≦0.99Y之關係者。 An exterior material for a power storage device is an exterior material for a power storage device including a metal foil layer and a sealing layer laminated on a surface on one side of the metal foil layer, characterized in that the aforementioned sealing layer includes: the first The low melting point layer is made of a thermoplastic resin constituting the outermost layer on the metal foil layer side of the sealing layer; the second low melting point layer is made of the thermoplasticity constituting the outermost layer on the opposite side to the metal foil layer side of the sealing layer Made of resin; and a high-melting intermediate layer made of a thermoplastic resin disposed between the first low-melting layer and the second low-melting layer; and the melting point of the high-melting intermediate layer is 120 ° C to 180 ° C ; The melting point of the first low-melting layer and the melting point of the second low-melting layer are lower than the melting point of the high-melting intermediate layer; the thickness of the high-melting intermediate layer is 20 μm or more; When the thickness is "X" and the thickness of the aforementioned sealing layer is "Y", it is a relationship that satisfies 0.50Y ≦ X ≦ 0.999Y. 如申請專利範圍第1項所記載之蓄電裝置用外裝材,其中,前述第1低熔點層之厚度係0.5μm以上,前述第2低熔點層之厚度係1μm以上。 The exterior material for a power storage device according to item 1 of the scope of the patent application, wherein the thickness of the first low melting point layer is 0.5 μm or more, and the thickness of the second low melting point layer is 1 μm or more. 如申請專利範圍第1或2項所記載之蓄電裝置用外裝材,其中,前述高熔點中間層之熔點係較前述第1低熔點層之熔點高20℃以上,且前述高熔點中間層之熔點係較前述第2低熔點層之熔點高20℃以上。 The exterior material for a power storage device according to item 1 or 2 of the scope of the patent application, wherein the melting point of the high-melting intermediate layer is 20 ° C or more higher than the melting point of the first low-melting layer, and the melting point of the high-melting intermediate layer is The melting point is 20 ° C or more higher than the melting point of the second low-melting layer. 如申請專利範圍第1或2項所記載之蓄電裝置用外裝材,其中,構成前 述高熔點中間層之熱可塑性樹脂,係重量平均分子量為200,000~800,000之範圍之乙烯-丙烯嵌段共聚物樹脂;且構成前述第1低熔點層之熱可塑性樹脂及構成前述第2低熔點層之熱可塑性樹脂,係重量平均分子量為10,000~200,000之範圍之乙烯-丙烯無規共聚物樹脂。 The exterior material for a power storage device as described in item 1 or 2 of the scope of patent application, wherein The thermoplastic resin of the high-melting intermediate layer is an ethylene-propylene block copolymer resin having a weight average molecular weight in the range of 200,000 to 800,000; and the thermoplastic resin constituting the first low-melting layer and the foregoing first 2 The thermoplastic resin of the low melting point layer is an ethylene-propylene random copolymer resin having a weight average molecular weight in the range of 10,000 to 200,000. 如申請專利範圍第1或2項所記載之蓄電裝置用外裝材,其中,前述金屬箔層之另一側的面係介由外側接著劑層與耐熱性樹脂層積層。 The exterior material for a power storage device according to item 1 or 2 of the scope of patent application, wherein the other surface of the metal foil layer is laminated with an outer adhesive layer and a heat-resistant resin. 一種蓄電裝置,其特徵係具備蓄電裝置本體部、及申請專利範圍第1~5項中任一項所記載之蓄電裝置用外裝材,且前述蓄電裝置本體部,係由前述外裝材所外裝者。 A power storage device comprising a power storage device main body and an exterior material for a power storage device described in any one of claims 1 to 5 of the scope of patent application, and the power storage device main body is provided by the exterior material Outfitters.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI770360B (en) * 2018-04-02 2022-07-11 日商昭和電工包裝股份有限公司 Laminates, shaped containers, and packages for shaped containers

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110341260B (en) * 2018-04-02 2021-10-29 昭和电工包装株式会社 Laminate for molded container, and package
JP7240824B2 (en) * 2018-06-07 2023-03-16 株式会社レゾナック・パッケージング Deep-drawn molded case for exterior of power storage device and power storage device
JP7460852B2 (en) * 2021-10-06 2024-04-02 大日本印刷株式会社 Adhesive film, adhesive film manufacturing method, power storage device, and power storage device manufacturing method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE45921T1 (en) * 1982-11-23 1989-09-15 American National Can Co MULTI-LAYER FLEXIBLE WEB STRUCTURE FOR PACKAGING AND TUBE MADE THEREOF.
JP4732884B2 (en) 2005-12-15 2011-07-27 昭和電工パッケージング株式会社 Electronic parts case packaging and electronic parts case
US10070332B2 (en) * 2007-06-21 2018-09-04 Interdigital Technology Corporation Method and apparatus for measurement reporting and event-triggered periodic measurement reporting in an evolved universal terrestrial radio access network
JP5441271B2 (en) * 2011-01-27 2014-03-12 日東電工株式会社 Nonaqueous battery laminate
KR101309392B1 (en) * 2012-04-19 2013-09-17 율촌화학 주식회사 Cell pouch with high insulation resistance
JP5626404B1 (en) * 2013-05-10 2014-11-19 大日本印刷株式会社 Battery packaging materials
CN104969378B (en) * 2013-02-06 2019-10-22 大日本印刷株式会社 Battery use packing material
JP6276047B2 (en) * 2014-01-31 2018-02-07 昭和電工パッケージング株式会社 Packaging material, packaging material manufacturing method and molded case
JP6381234B2 (en) * 2014-03-06 2018-08-29 昭和電工パッケージング株式会社 Insulating film for sealing tab and electrochemical device
JP6479323B2 (en) * 2014-03-14 2019-03-06 昭和電工パッケージング株式会社 Packaging material, battery outer case and battery
JP6349986B2 (en) * 2014-06-09 2018-07-04 凸版印刷株式会社 Terminal film for power storage device and power storage device
WO2016159233A1 (en) * 2015-03-31 2016-10-06 大日本印刷株式会社 Packaging material for cell, process for producing same, and cell
JP6679918B2 (en) * 2015-12-18 2020-04-15 大日本印刷株式会社 Battery packaging material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI770360B (en) * 2018-04-02 2022-07-11 日商昭和電工包裝股份有限公司 Laminates, shaped containers, and packages for shaped containers

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