TW201807794A - Manufacturing method of fan-out fingerprint identification module and fingerprint identification module - Google Patents

Abstract

A manufacturing method of fan-out fingerprint identification module provided in the present invention comprises an inverting step, a filling step, a inverting and removing step, an electrical contact setting step, an inverting and drilling step, a rewiring step, a panel bonding step, and a cutting step. The method not only saves the packaging process manufacturing costs, but also significantly reduces the distance between the fingerprint identification of the front to the panel so that the detection of fingerprint identification more accurate. And the specifications of the fingerprint identification module manufactured by the method proposed by the invention can be easily and uniformly controlled to a certain standard without individual difference, and the yield can be greatly improved. A fingerprint identification module manufactured by the aforementioned method is also provided in the present invention.

Description

Fan-out type fingerprint recognition module manufacturing method and fingerprint recognition module

The invention relates to a method for manufacturing a fingerprint recognition module and a fingerprint recognition module, and more particularly to a method for manufacturing a fan-out fingerprint recognition module and a fingerprint recognition module manufactured by the method.

The traditional manufacturing method of a fingerprint recognition module is to fix a fingerprint recognition chip to a substrate correspondingly, and electrically connect the fingerprint recognition chip to a circuit of the substrate through wire bonding or the like. Next, an insulating layer is laid on the outside of the fingerprint identification chip, and a panel is bonded through an adhesive above the insulation layer, so that the fingerprint identification chip can recognize the finger fingerprint on the other side through the panel.

However, the above-mentioned packaging operation must be repeated every time a fingerprint recognition module is manufactured. Not only is the efficiency low, but the distance from the front of the fingerprint recognition to the panel is too thick, which easily leads to unsuccessful fingerprint recognition. More importantly, it is difficult to maintain each packaging. The thickness of the coated insulating layer and adhesive, so the distance between the fingerprint recognition front and the panel of each fingerprint recognition module is different, and it is difficult to control the product yield.

Therefore, in order to solve the above problems, an object of the present invention is to provide a method for manufacturing a fan-out fingerprint recognition module and a fingerprint recognition module.

The technical method adopted by the present invention to solve the problems of the conventional technology is to provide a method for manufacturing a fan-out type fingerprint recognition module, which includes the following steps: an inversion step, and the fingerprint identification of a plurality of fingerprint identification chips is attached face down on A temporary substrate separated by a predetermined distance from the plurality of fingerprint identification chips; a glue filling step to form an insulating base layer on the fingerprint identification back surface of the plurality of fingerprint identification chips and the temporary substrate; the temporary substrate The plurality of fingerprint identification chips and the insulating base layer form a temporary structure; a flipping removal step, flipping the temporary structure upside down to make the fingerprint identification face up, and removing the temporary substrate to reveal the fingerprint identification front face An electric contact setting step, each of the plurality of electric contact elements is provided with the plurality of fingerprint identification front sides, the plurality of electric contact elements, the plurality of fingerprint identification chips and the insulating base layer form a structure to be wired; The flip drilling step, flips the structure to be routed up and down, and drills holes in the insulating base layer to form a plurality of connections to the Connection channels of several electrical contact elements; a re-routing step, forming a plurality of wires electrically connecting the electrical contact elements on the plurality of connection channels to make the structure to be wired a integrated circuit structure, the wires Extending from the connection channel along the surface of the insulating base layer opposite to the fingerprint identification chip; a panel bonding step, flipping the integrated circuit structure up and down to make the fingerprint identification face up, and adhering a panel to the fingerprint identification A front surface and an upper surface of the insulating base layer; and a cutting step, using the fingerprint identification chip as a center of a cutting range, and cutting the integrated circuit structure with a predetermined range and shape to form a plurality of fingerprint identification modules.

According to an embodiment of the present invention, a method for manufacturing a fan-out fingerprint recognition module is provided. In the turning drilling step, a plurality of connection channels are formed by laser drilling.

In one embodiment of the present invention, a method for manufacturing a fan-out fingerprint recognition module is provided. In the rewiring step, the conductive wire is formed in the connection channel by a chemical process method.

In one embodiment of the present invention, a method for manufacturing a fan-out fingerprint recognition module is provided. The temporary substrate is a laser-sensitive plastic material, and the laser-sensitive automatic peeling method is used to remove it in the reversing and removing step. The temporary substrate.

Another technical means adopted by the present invention to solve the problems of the conventional technology is to provide a fingerprint recognition module manufactured by the aforementioned fan-out fingerprint recognition module manufacturing method.

Another technical means adopted by the present invention to solve the problems of the conventional technology is to provide a fingerprint identification module, which includes: an insulating base layer with a connection channel penetrating up and down; a fingerprint identification chip buried in the insulating base layer, the The fingerprint recognition front of the fingerprint recognition chip is flush with the upper surface of the insulating base layer; an electrical contact element is disposed on the fingerprint recognition front and extends along the fingerprint recognition front to the upper surface of the insulation base layer; a wire is disposed on the A connecting channel and one end of the wire is electrically connected to the electrical contact element, and the other end of the wire extends along the lower surface of the insulating base layer; and a panel is adhered to the front surface of the fingerprint identification and the upper surface of the insulating base layer so that the The fingerprint recognition chip performs a fingerprint recognition detection through the panel.

In one embodiment of the present invention, a fingerprint identification module is provided. The panel is adhered to the front surface of the fingerprint identification and the upper surface of the insulating base layer through an insulating adhesive layer.

According to an embodiment of the present invention, a fingerprint identification module is provided, and the thickness of the insulating adhesive layer is less than 20 microns.

According to an embodiment of the present invention, a fingerprint identification module is provided, and the insulating base layer is an insulating glue layer.

Through the technical means adopted by the present invention, the manufacturing cost of the packaging process can be saved, and the distance from the front face of the fingerprint identification to the panel can be greatly reduced, so that the fingerprint identification detection can be more accurate. In addition, the distance between the fingerprint recognition chip and the fingerprint can be stably controlled during mass production, and the difference between the distance from the front of the fingerprint recognition to the panel can be minimized to improve the product yield.

The specific embodiments used in the present invention will be further explained by the following embodiments and accompanying drawings.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 2h. This description is not intended to limit the embodiment of the present invention, but is an example of the embodiment of the present invention.

Referring to FIG. 1 and referring to FIGS. 2a to 2h, the description of this embodiment is as follows. The method for manufacturing a fan-out fingerprint recognition module includes an inversion step S101, a glue filling step S102, an inversion removal step S103, an electric contact setting step S104, an inversion drilling step S105, a rewiring step S106, a panel bonding step S107, and a cutting step S108 .

Referring to FIG. 2a, in the inversion step S101, the fingerprint recognition front surface 21 of the plurality of fingerprint recognition chips 2 is attached to a temporary substrate 1 facing downward, and the plurality of fingerprint recognition chips 2 are separated by a predetermined distance. The so-called fingerprint identification front surface 21 refers to a surface of the fingerprint identification chip 2 having a fingerprint identification circuit after being etched, plated, or other semiconductor processes. A large number of fingerprint identification chips 2 can be attached to the surface of a temporary substrate 1.

Referring to FIG. 2b, then in a glue filling step S102, an insulating glue is glued on the plurality of fingerprint identification chips 2 and the temporary substrate 1, and the thickness is controlled to make the surface even and uniform. After the insulating glue is hardened, an insulating base layer 3 is formed on the fingerprint identification back surface 22 and the temporary substrate 1 of the plurality of fingerprint identification chips 2, and the temporary substrate 1, the plurality of fingerprint identification chips 2 and the insulating base layer 3 form a temporary Structure.

Referring to FIG. 2c, then in the flip removal step S103, the temporary structure is flipped up and down so that the fingerprint recognition front surface 21 faces upward, and the temporary substrate 1 is removed to expose the fingerprint recognition front surface 21. In this way, the fingerprint identification chip 2 is buried in the insulating base layer 3, and the fingerprint identification front surface 21 of the fingerprint identification chip 2 is flush with the upper surface of the insulating base layer 3. In this embodiment, the temporary substrate 1 is a laser-sensitive plastic material, and in this step, the temporary substrate 1 is removed in a manner of automatic peeling of the laser light, but the present invention is not limited thereto.

Referring to FIG. 2D, the electrical contact setting step S104 is followed by setting a plurality of electrical contact elements 4 with a plurality of fingerprint identification front surfaces 21 and extending along the fingerprint identification front surface 21 to the upper surface of the insulating base layer 3. The electrical contact element 4 is a conductive material and can be provided by means of wire drawing or plating. The plurality of electrical contact elements 4, the plurality of fingerprint identification chips 2 and the insulating base layer 3 form a structure to be wired.

Referring to FIG. 2e, in the flip drilling step S105, the structure to be routed is flipped up and down, and a hole is drilled in the insulating base layer 3 to form a plurality of upper and lower connection channels 31 respectively connected to the plurality of electrical contact elements 4. In this embodiment, a plurality of connection channels 31 are formed by means of laser drilling, but the present invention is not limited thereto. These connection channels 31 are formed on the periphery of the fingerprint identification chip 2 and correspond to a plurality of electrical contact elements 4.

Referring to FIG. 2f, following the rewiring step S106, a plurality of wires 5 electrically connected to the electrical contact element 4 are formed on the plurality of connection channels 31 respectively, so that the structure to be wired becomes a integrated circuit structure. In this embodiment, the conductive wire 5 is formed in the connection channel 31 by a chemical process method. One end of the lead 5 is electrically connected to the electric contact element 4, and the other end of the lead 5 is along the surface of the insulating base layer 3 opposite to the fingerprint identification chip 2 from the connection channel 31 (the lower surface of the insulating base layer 3 is not provided with the fingerprint identification chip 2, But in this figure).

Referring to FIG. 2g, then at the panel bonding step S107, flip the integrated circuit structure up and down so that the fingerprint recognition front surface 21 faces upward, and adhere a panel 6 to the fingerprint recognition front surface 21 and the upper surface of the insulating base layer 3. In this embodiment, the panel 6 is adhered to the fingerprint recognition front surface 21 and the upper surface of the insulating base layer 3 with an insulating adhesive layer 7 formed by an insulating adhesive. The insulating adhesive layer 7 has both the function of adhering the panel 6 to the top of the fingerprint recognition chip 2 and the function of insulating and protecting the fingerprint recognition front surface 21. Only one layer structure and one package are needed, which not only saves the manufacturing cost of the packaging process, but also greatly Shorten the distance between the fingerprint recognition front 21 and the panel 6 to make the fingerprint recognition detection more accurate. More importantly, in the structure with only one layer of packaging, the difference in distance between each fingerprint identification front 21 and panel 6 can be minimized (multiple packaging will cause each fingerprint identification front 21 to panel 6 The difference in distance is more difficult to control, so the quality is unstable and the yield is reduced).

Referring to FIG. 2h, then in the cutting step S108, the fingerprint recognition chip 2 is used as the center of the cutting range, and the integrated circuit structure and the panel 6 and the insulating adhesive layer 7 thereon are cut to a predetermined range and shape to form A plurality of fingerprint identification modules 100. Since the plurality of fingerprint identification chips 2 are arranged on the insulating base layer 3, the plurality of fingerprint identification modules 100 can be cut out. The specifications of the fingerprint identification module 100 produced in this way can be easily uniformly controlled at a certain standard without individual differences, which greatly improves the yield. The fingerprint recognition module 100 manufactured by the fan-out fingerprint recognition module manufacturing method of the present invention can be a contour with a smooth curve, such as a circle or an ellipse, and can be applied to cooperate with various devices, such as the home button on a mobile phone. Pieces.

Therefore, the present invention proposes a fingerprint recognition module 100 manufactured by the aforementioned fan-out fingerprint recognition module manufacturing method (steps S101 to S108), and its structure is as shown in FIG. 2h.

As shown in FIG. 2h, the fingerprint identification module 100 manufactured by the method for manufacturing a fan-out fingerprint identification module according to the present invention includes: an insulating base layer 3, a fingerprint identification chip 2, an electrical contact element 4, an Lead 5 and a panel 6.

The insulating base layer 3 has a connection channel 31 penetrating vertically. In this embodiment, the connection channel 31 is formed by laser drilling. The insulating base layer 3 is hardened by an insulating rubber layer, and has the effect of insulating and protecting the fingerprint identification chip 2.

The fingerprint identification chip 2 is embedded in the insulating base layer 3. The fingerprint identification front surface 21 of the fingerprint identification chip 2 is flush with the upper surface of the insulating base layer 3. In other words, the insulating base layer 3 covers the fingerprint recognition back surface 22 and the outer periphery of the fingerprint recognition chip 2 with insulation.

The electrical contact element 4 is disposed on the fingerprint recognition front surface 21 and extends along the fingerprint recognition front surface 21 to the upper surface of the insulating base layer 3.

The lead 5 is disposed in the connection channel 31 and one end of the lead 5 is electrically connected to the electric contact element 4. The other end of the lead 5 extends along the lower surface of the insulating base layer 3. In this embodiment, the conductive line 5 is a plated conductive line, and is formed in the connection channel 31 by a chemical process method.

The panel 6 is adhered to the upper surface of the fingerprint identification front surface 21 and the insulating base layer 3 through an insulating adhesive layer 7, so that the fingerprint identification chip 2 performs a fingerprint identification detection through the panel 6. In this embodiment, the thickness of the insulating adhesive layer 7 is less than 20 microns.

In summary, the method for manufacturing a fan-out fingerprint recognition module provided by the present invention and the fingerprint recognition module manufactured by the method have the advantages of saving the manufacturing cost of the packaging process, improving the detection accuracy and success rate of fingerprint recognition, And it can minimize the difference between the distance from the front of the fingerprint identification to the panel to eliminate many advantages such as individual differences.

The above descriptions and descriptions are merely illustrations of the preferred embodiments of the present invention. Those with ordinary knowledge of this technology may make other modifications based on the scope of the patent application defined below and the above description, but these modifications should still be made. It is the spirit of the present invention and is within the scope of the present invention.

100‧‧‧Fingerprint recognition module
1‧‧‧ temporary base
2‧‧‧Fingerprint identification chip
21‧‧‧Fingerprint identification front
22‧‧‧ Fingerprint Identification Back
3‧‧‧ insulating base
31‧‧‧connection channel
4‧‧‧ Electric contact components
5‧‧‧ lead
6‧‧‧ Panel
7‧‧‧ Insulation Adhesive Layer
S101‧‧‧ Inverted steps
S102‧‧‧Gelling process
S103‧‧‧ Flip removal step
S104‧‧‧ Electric contact setting steps
S105‧‧‧Flip drilling steps
S106‧‧‧Re-wiring steps
S107‧‧‧Panel bonding steps
S108‧‧‧Cutting steps

FIG. 1 is a flowchart illustrating a method for manufacturing a fan-out fingerprint recognition module according to an embodiment of the present invention. FIG. 2a to FIG. 2h are schematic diagrams showing manufacturing steps of a fingerprint recognition module according to an embodiment of the present invention.

S101‧‧‧ Inverted steps

S102‧‧‧Gelling process

S103‧‧‧ Flip removal step

S104‧‧‧ Electric contact setting steps

S105‧‧‧Flip drilling steps

S106‧‧‧Re-wiring steps

S107‧‧‧Panel bonding steps

S108‧‧‧Cutting steps

Claims (9)

A method for manufacturing a fan-out type fingerprint recognition module includes the following steps: An inversion step, the fingerprint recognition of a plurality of fingerprint recognition chips is face-down bonded to a temporary substrate, and the plurality of fingerprint recognition chips are separated by a predetermined interval. Distance; a glue filling step, forming an insulating base layer on the fingerprint identification back surface of the plurality of fingerprint identification chips and the temporary substrate, the temporary substrate, the plurality of fingerprint identification chips and the insulating base layer forming a temporary structure A flipping removal step, flipping the temporary structure upside down to make the fingerprint identification face up, and removing the temporary substrate to reveal the fingerprint identification front; an electrical contact setting step, each of the plurality of electrical contact components The plurality of fingerprint identification front surfaces are arranged, the plurality of electrical contact elements, the plurality of fingerprint identification chips, and the insulating base layer form a structure to be wired; a turning drilling step, the structure to be wired is flipped up and down, and the insulation is The base layer is drilled to form a plurality of connection channels that are respectively connected to the plurality of electrical contact components; The plurality of connection channels respectively form a plurality of wires electrically connected to the electrical contact element, so that the structure to be wired becomes an integrated circuit structure, and the wires from the connection channel along the insulating base layer are opposite to the fingerprint recognition chip. A surface joining step; a panel bonding step, flipping the integrated circuit structure up and down so that the fingerprint identification front faces upward, and adhering a panel to the fingerprint identification front and the upper surface of the insulating base layer; and a cutting step using the The fingerprint recognition chip is the center of the cutting range and cuts the integrated circuit structure in a predetermined range and shape to form a plurality of fingerprint recognition modules. The method for manufacturing a fan-out fingerprint recognition module according to claim 1, wherein in the turning drilling step, the plurality of connection channels are formed by laser drilling. The method for manufacturing a fan-out fingerprint identification module according to claim 1, wherein in the rewiring step, the conductive wire is formed in the connection channel by a chemical process method. The method for manufacturing a fan-out fingerprint recognition module as described in claim 1, wherein the temporary substrate is a laser-sensitive plastic material, and the temporary is removed by a laser-sensitive automatic peeling method in the reversing and removing step. Substrate. A fingerprint recognition module manufactured by the method for manufacturing a fan-out fingerprint recognition module according to claim 1. A fingerprint identification module includes: an insulating base layer having a connection channel penetrating up and down; a fingerprint identification chip embedded in the insulating base layer; a fingerprint identification front face of the fingerprint identification chip being flush with an upper surface of the insulating base layer; An electric contact element is disposed on the front surface of the fingerprint recognition and extends along the front surface of the fingerprint identification to the upper surface of the insulating base layer; a wire is disposed in the connection channel and one end of the wire is electrically connected to the electric contact element, the wire The other end extends along the lower surface of the insulating base layer; and a panel is adhered to the front surface of the fingerprint identification and the upper surface of the insulating base layer, so that the fingerprint identification chip can perform a fingerprint identification detection through the panel. The fingerprint identification module according to claim 6, wherein the panel is adhered to the front surface of the fingerprint identification and the upper surface of the insulating base layer through an insulating adhesive layer. The fingerprint identification module according to claim 7, wherein the thickness of the insulating adhesive layer is less than 20 microns. The fingerprint identification module according to claim 6, wherein the insulating base layer is an insulating adhesive layer.