TW201806465A - Heat dissipating device - Google Patents

Abstract

A heat dissipating device includes a thermal conductive module, a nozzle and a consumable coolant bottle. The nozzle has a coolant outlet facing a heat exchange zone. The consumable coolant bottle is used for providing coolant to the nozzle.

Description

Heat sink

This invention relates to a heat sink and, more particularly, to a heat sink having a consumable coolant bottle.

With the development of technology and the needs of the industry, the operating frequency of the processor of the electronic device is getting higher and higher, resulting in more and more heat. Therefore, heat dissipation technology has become one of the most important considerations for electronic devices.

Conventional electronic devices are usually externally connected to a heat sink comprising a pump, a cooling water line and cooling water. The cooling water is closed in circulation between the pump and the cooling water line to cool the heating elements located on the cooling path.

However, the volume of the pump and cooling water lines is large, which reduces the portability of the electronic device.

The present invention relates to a heat sink that can ameliorate the above-mentioned conventional problems.

According to an embodiment of the invention, a heat sink is proposed. The heat sink comprises a heat conducting module, a nozzle and a consumable coolant bottle. The nozzle has a coolant outlet with the coolant outlet facing the heat exchange zone. Consumable coolant bottle for lifting Supply coolant to the nozzle.

According to another embodiment of the present invention, a heat sink is proposed. The heat sink includes a heat sink fan, a nozzle and a consumable coolant bottle. The cooling fan has an air inlet. The nozzle has a coolant outlet, and the coolant outlet faces the air inlet. A consumable coolant bottle is used to provide a coolant to the nozzle.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

10‧‧‧Electronic devices

11‧‧‧Shell

11a‧‧‧ vents

100, 200‧‧‧ heat sink

110‧‧‧thermal module

111‧‧‧heat pipe

112‧‧‧Heat fins

112u‧‧‧ top surface

120‧‧‧heat plate

121‧‧‧ Carrier Board

121r‧‧‧ cavity

122‧‧‧Nozzles

122a‧‧‧ coolant outlet

123‧‧‧Second connection tube

130‧‧‧ cooling fan

130a‧‧‧air outlet

130b, 130c‧‧‧ inlet

130a1‧‧‧Upper edge

135‧‧‧ Controller

140‧‧‧Consumable coolant bottle

141‧‧‧First connecting pipe

142‧‧‧First joint

143‧‧‧second joint

144‧‧‧ third joint

145‧‧‧fourth joint

C1‧‧‧ coolant

G1‧‧‧ airflow

H1‧‧‧ heating element

P1‧‧‧Hot convection channel

2-2’‧‧‧section direction

FIG. 1 is a schematic view of a heat sink according to an embodiment of the invention.

Fig. 2 is a cross-sectional view of the heat dissipation plate of Fig. 1 taken along the direction 2-2'.

FIG. 3 is a schematic view showing the heat dissipating device of FIG. 1 assembled to the electronic device.

4 is a schematic view of a heat sink according to another embodiment of the present invention.

1 and 2, FIG. 1 is a schematic view of a heat sink 100 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the heat sink 120 of FIG. 1 taken along a direction 2-2'. The heat sink 100 includes a heat conduction module 110, a heat dissipation plate 120, a heat dissipation fan 130, a controller 135, and a consumable coolant bottle 140.

The heat conduction module 110 has a heat exchange zone. In this embodiment, the heat dissipation module 110 includes a heat pipe 111 and a plurality of heat dissipation fins 112 , wherein the heat dissipation fins 112 are connected to the heat pipe 111 . The aforementioned heat exchange zone is the area of the heat dissipation fins 112. As shown in Fig. 1, although the heating element H1 and the heat exchange area (such as the area of the heat sink fin 112) The domains are respectively located in two different regions, but since the heat generating element H1 is adjacent to the heat pipe 111, the heat pipe 111 can conduct heat of the heat generating element H1 to the heat exchange zone. In an embodiment, the heat generating component H1 is, for example, a central processing unit (CPU) or other component that generates heat.

In detail, as shown in FIG. 2, the heat dissipation plate 120 includes a carrier plate 121 and a plurality of nozzles 122, wherein the nozzles 122 are disposed on the carrier plate 121. Each nozzle 122 has a coolant outlet 122a. The consumable coolant bottle 140 can provide a coolant C1 to the nozzle 122, and the coolant C1 is ejected through the coolant outlet 122a of the nozzle 122 to lower the temperature of the heat exchange zone and the heat generating component H1. Compared with the fan, the effect of dissipating heat to the heat exchange zone by the coolant C1 is better. The coolant outlet 122a faces the heat exchange zone and enhances the effect of cooling the heat exchange zone. Further, the carrier plate 121 has a cavity 121r to accommodate the coolant C1 from the consumable coolant bottle 140. In an embodiment, the heat sink 120 may omit the carrier 121; in this design, the consumable coolant bottle 140 directly communicates with the nozzle 122 through the conduit.

The coolant C1 in the consumable coolant bottle 140 is under high pressure to push the internal coolant C1 to the nozzle 122. The controller 135 can control the coolant outlet 122a of the nozzle 122 to open or close depending on the current temperature of the heat generating component H1. When the coolant outlet 122a of the nozzle 122 is opened, the coolant C1 is automatically ejected from the coolant outlet 122a under high pressure driving. For example, when the current temperature of the heat generating component H1 is higher than a preset temperature value, the controller 135 controls the coolant outlet 122a of the nozzle 122 to be turned on to lower the current temperature of the heat generating component H1; when the temperature of the heat generating component H1 is not high At the preset temperature value, the controller 135 controls the cooling of the nozzle 122. The agent outlet 122a is closed to save the amount of coolant C1. The aforementioned "preset temperature value" refers to an operating temperature range in which the heating element H1 can operate normally or has an optimum working efficiency. In an embodiment, the preset temperature value may be between about 70 degrees Celsius to about 100 degrees Celsius or between about 75 degrees Celsius and about 90 degrees Celsius, but the actual temperature may be determined according to actual requirements, and the present invention The embodiment is not limited. When the heat generating component H1 is the central processing unit, the heat generating component H1 itself can provide the current temperature to the controller 135, so that the controller 135 can control the coolant outlet 122a to be turned on or off. Alternatively, the heat sink 100 further includes a temperature sensor (not shown) disposed on the heat generating component H1 to sense the current temperature of the heat generating component H1 and transmit the current temperature value to the controller 135. In an embodiment, the controller 135 and the heating element H1 may be integrated into a single component, but may also be different and independent two components.

The coolant C1 stored in the consumable coolant bottle 140 may be a liquid; in this design, the vaporization temperature of the liquid is lower than the aforementioned preset temperature value. In detail, when the current temperature of the heat generating component H1 reaches or exceeds the preset temperature value, the controller 135 may control the nozzle 122 to open the coolant outlet 122a to allow the liquid coolant C1 to be ejected from the coolant outlet 122a to the heat. Exchange area. Since the vaporization temperature of the coolant C1 is lower than the preset temperature value, the liquid coolant C1 ejected to the heat exchange zone is vaporized into a gaseous state, thereby preventing the liquid coolant C1 from being destroyed or adversely affecting the electrons around the heat sink 100. element. In another embodiment, the coolant C1 stored in the consumable coolant bottle 140 may also be a gas such as an inert gas such as nitrogen, or may be a general air or other gas having a cooling effect. The gas within the consumable coolant bottle 140 is in a compressed state. According to the principle of thermodynamics, when this When the compressed gas is released to the atmosphere, the air pressure is lowered due to the expansion, and the cooling effect of the temperature drop is generated. Therefore, as long as it is harmless to the environment or the human body (a harmful gas such as a fire, explosion or poisoning), it can be used as the coolant C1 of the embodiment of the present invention.

In one embodiment, the nozzle 122 is, for example, a flow valve, and the controller 135 can control the flow valve to control the flow rate of the coolant C1 from the coolant outlet 122a.

The heat dissipation fan 130 is disposed adjacent to the heat conduction module 110. For example, the heat dissipation fan 130 is disposed adjacent to the heat dissipation fins 112 of the heat conduction module 110. When the cooling fan 130 is in operation, an air flow G1 is generated (shown in FIG. 3). The airflow G1 is blown from the air outlet 130a of the heat radiating fan 130, and the coolant C1 is blown out of the electronic device.

FIG. 3 is a schematic view showing the heat sink 100 of FIG. 1 mounted on the electronic device 10. The electronic device 10 is, for example, a portable electronic device such as a notebook computer, a tablet computer, or other types of portable electronic devices. The heat dissipation module 110, the heat dissipation plate 120, the heat dissipation fan 130, and the controller 135 of the heat dissipation device 100 may be disposed in the casing 11 of the electronic device 10, and the consumable coolant bottle 140 may be disposed outside the casing 11, that is, consumed. The coolant bottle 140 is an external coolant bottle.

The consumable coolant bottle 140 disposed outside the casing 11 is detachably coupled to the heat dissipation plate 120 disposed in the casing 11. When the consumable coolant bottle 140 is required, for example, when the electronic device 10 is turned on, the consumable coolant bottle 140 and the heat dissipation plate 120 can be connected. When the consumable coolant bottle 140 is not required, such as when the electronic device 10 is turned off or the consumable coolant bottle 140 needs to be replaced, the consumable coolant bottle 140 and the heat sink 120 can be separated. For example, as shown in FIG. 3, the heat sink 100 further includes a first connecting tube 141. And the second connecting pipe 123, wherein the first connecting pipe 141 is connected to the consumption coolant bottle 140, and the second connecting pipe 123 is connected to the carrier plate 121 of the heat dissipation plate 120. When it is required to use the consumable coolant bottle 140, the first connecting pipe 141 and the second connecting pipe 123 may be connected to connect the consumable coolant bottle 140 and the heat dissipation plate 120 to make the coolant C1 in the consumable coolant bottle 140. The first connecting tube 141 and the second connecting tube 123 are transmitted to the nozzle 122 (shown in FIG. 2), and then supplied to the heat exchange area through the nozzle 122. In an embodiment, the first connecting tube 141 and/or the second connecting tube 123 are, for example, flexible tubes, but may also be rigid tubes.

At least one detachable joint or quick release joint may be disposed between the first connecting pipe 141 and the consumable coolant bottle 140 or between the first connecting pipe 141 and the second connecting pipe 123, such as a commercially available gas burner for connecting the card. The joint of the gas bottle. For example, as shown in FIG. 3, the heat sink 100 further includes a first joint 142, a second joint 143, a third joint 144, and a fourth joint 145, wherein the first joint 142 and the second joint 143 are respectively connected to the first joint A second end of the connecting tube 141 is connected to the consumable coolant bottle 140, and the fourth joint 145 is connected to one end of the second connecting tube 123. The first connecting tube 141 and the consumable coolant bottle 140 are connected to each other through the connection of the first joint 142 and the third joint 144, and the first connecting tube 141 and the second connecting tube 123 are transmitted through the second joint 143 and the fourth joint 145. The connection is connected to communicate with the nozzle 122 (shown in Figure 2).

In addition, as shown in the enlarged view of FIG. 3, a heat convection passage P1 is formed between the two heat dissipation fins 112. The heat convection passage P1 extends in the direction of the air outlet of the air outlet 130a. In this way, the airflow G1 blown out from the air outlet 130a can circulate the heat The coolant C1 in the passage P1 is taken out of the casing 11 through the heat dissipation holes 11a of the casing 11, so that any negative influence caused by the coolant C1 remaining in the casing 11 can be avoided.

As shown in the enlarged view of FIG. 3, the upper edge 130a1 of the air outlet 130a may be lower than the top surface 112u of the heat dissipation fin 112, but may be higher or equal to the top surface 112u of the heat dissipation fin 112. When the upper edge 130a1 is higher than the top surface 112u, the airflow G1 can bring more coolant C1 out of the casing 11.

Please refer to FIG. 4, which is a schematic diagram of a heat sink 200 according to another embodiment of the present invention. The heat sink 200 includes a heat conduction module 110, a nozzle 122, a heat dissipation fan 130, a consumable coolant bottle 140, and a controller 135.

The cooling fan 130 has an air outlet 130a and an air inlet 130b (the air inlet 130c on the other side of the heat dissipation fan 130 in Fig. 4 is shown in Fig. 1). When the cooling fan 130 is operated, the airflow G1 is pushed from the air inlet 130b to the air outlet 130a, and the air is discharged from the air outlet 130a. Compared with the above embodiment, the nozzle 122 of the present embodiment faces the region of the air inlet 130b on the other side of the heat dissipation fan 130 of FIG. 4 to provide the coolant C1 to the air inlet 130b, and is provided from the air inlet 130b. Bring to the air outlet 130a. In this way, the coolant C1 is blown toward the heat dissipation fins 112 to lower the temperature of the heat dissipation fins 112, and the airflow G1 flowing from the air inlet 130b to the air outlet 130a is also cooled by the contact with the coolant C1. This provides a low temperature gas flow G1 to the heat dissipation fins 112 to reduce the temperature of the heat dissipation fins 112. In another embodiment, the nozzle 122 can face the region of the air inlet 130b shown in FIG.

In the present embodiment, the coolant C1 is a gas, so that the liquid can be avoided. The body is condensed on the blades of the cooling fan 130. In an embodiment, the temperature of the coolant C1 may be between 0 degrees Celsius and about 15 degrees Celsius or less than 0 degrees, so that liquid condensation on the blades of the heat dissipation fan 130 may be avoided. However, the temperature of the coolant C1 may be determined according to actual needs, and the embodiment of the present invention does not limit the temperature range of the coolant C1. In another embodiment, the discharge flow rate of the coolant C1 can also be controlled to prevent the liquid from condensing on the blades of the heat dissipation fan 130.

In summary, the heat dissipating device of the embodiment of the present invention includes a consumable coolant bottle which can supply a coolant to the heat exchange area or the air inlet of the heat dissipating fan, thereby reducing the current temperature of the heat generating component. As the coolant in the consumable coolant bottle decreases, the pressure inside the bottle also decreases. When the internal pressure of the consumable coolant bottle is insufficient, the consumable coolant bottle with sufficient internal pressure can be replaced; that is, when the coolant in the consumable coolant bottle is used, the detachable and replaceable one can be replaced Consumable coolant bottles to maintain coolant supply. It can be seen that after the coolant is supplied to the air inlet of the heat exchange area or the heat dissipating fan, it can be returned to the consumable coolant bottle, so that the heat dissipating device of the embodiment of the invention provides an open heat dissipating path.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧heating device

110‧‧‧thermal module

111‧‧‧heat pipe

112‧‧‧Heat fins

120‧‧‧heat plate

130‧‧‧ cooling fan

130c‧‧‧ inlet

135‧‧‧ Controller

140‧‧‧Consumable coolant bottle

C1‧‧‧ coolant

H1‧‧‧ heating element

2-2’‧‧‧section direction

Claims (11)

A heat dissipating device comprising: a heat conducting module having a heat exchange zone; a nozzle having a coolant outlet facing the heat exchange zone; and a consumable coolant bottle for providing a cooling The agent is given to the nozzle. The heat dissipating device of claim 1, further comprising: a joint; wherein the consumable coolant bottle is detachably connected to the nozzle via the joint. The heat dissipation device of claim 1, wherein the heat conduction module comprises: a heat pipe; and a heat dissipation fin connected to the heat pipe; wherein the heat exchange zone is a region of the heat dissipation fin. The heat dissipating device of claim 1, wherein the heat dissipating device further comprises: a heat dissipating fan disposed adjacent to the heat conducting module and having an air outlet; wherein the heat conducting module comprises two heat dissipating fins, Between two heat sink fins The heat convection passage extends along the air outlet direction of the air outlet. The heat dissipating device according to claim 1, wherein the coolant liquid ejected from the coolant outlet has a vaporization temperature lower than a preset temperature value. The heat sink of claim 1, wherein the coolant in the consumable coolant bottle is at a high pressure for pushing the coolant to the nozzle. The heat dissipating device of claim 1, wherein the nozzle is a flow valve; the heat dissipating device further comprises: a controller that controls the flow valve to control a flow rate of the coolant from the coolant outlet. The heat dissipating device of claim 1, wherein the heat conducting module is adjacent to a heat generating component, and the heat generating component is located in two different regions from the heat exchange zone. A heat dissipating device comprising: a heat dissipating fan having an air inlet; a nozzle having a coolant outlet, the coolant outlet being opposite to the air inlet; And a consumable coolant bottle for providing a coolant to the nozzle. The heat dissipating device of claim 9, wherein the nozzle is a flow valve; the heat dissipating device further comprises: a controller that controls the flow valve to control a flow rate of the coolant from the coolant outlet. The heat dissipating device of claim 9, further comprising: a heat dissipating fin; wherein the heat dissipating fan is disposed adjacent to the heat dissipating fin.