TW201805765A - Liquid cooling system - Google Patents

Abstract

A liquid cooling system includes a heat absorbing member, a heat dissipation member, at least one pipe and a metal layer. The heat absorbing member is in thermal contact with at least one heat source. The pipe is connected between the heat absorbing member and the heat dissipation member. The metal layer is coating on an inner wall or an outer wall of the pipe.

Description

Liquid cooled cooling system

The invention relates to a liquid cooling heat dissipation system, in particular to a liquid cooling heat dissipation system suitable for heat dissipation of an electronic device.

Many high power electronic components, such as a central processing unit or an image processor, are provided in existing electronic devices. These electronic components have excellent data processing performance, but they generate amazing heat energy during operation. Without proper heat dissipation mechanism to eliminate thermal energy, thermal energy will cause these electronic components to exceed their safe operating temperature and reduce operational efficiency, even making the whole The electronic device crashed due to overheating.

With the advancement of heat dissipation technology, liquid-cooled heat dissipation systems have gradually become one of the mainstream of heat dissipation for electronic devices. The so-called liquid-cooled heat dissipation uses liquid as a heat dissipation medium. Traditionally, the liquid-cooled heat-dissipating system is mainly composed of a liquid-cooled head and a liquid-cooled row connected in series by a flow tube. It is filled with a coolant as a medium for heat exchange.

However, the material of the flow tube is usually plastic, such as Teflon, which absorbs the coolant and evaporates the coolant outward. And the higher the temperature, the higher the amount of evapotranspiration of the coolant per unit time. According to the experimental data, the amount of cooling liquid that is evaded outward through the flow tube is about 8 to 10 grams per year in a use environment of about 60 degrees Celsius. During the process of escaping the coolant outward, the internal pressure of the flow tube is lowered, and the smaller gas molecules in the outside air, such as helium, are dissolved in the flow tube and dissolved in the flow tube while the coolant is evacuated. In the coolant, when the solution is saturated, the air will be present in the cycle as bubbles, and these bubbles will increase the flow resistance of the cycle and affect the heat dissipation performance.

The present invention provides a liquid-cooled heat dissipation system for reducing the probability of chilling of the coolant.

The liquid cooling heat dissipation system disclosed in the present invention comprises a liquid cooling row, a liquid cooling head, at least a first tube and at least one metal layer. The liquid cooling head is in thermal contact with at least one heat source. The flow tube is connected between the liquid cooling head and the liquid cooling row. The metal layer covers an inner tube wall or an outer tube wall of at least the first tube.

The liquid-cooled heat dissipating system disclosed by the invention can reduce the evapotranspiration of the coolant by the design of the metal layer inside or outside the flow tube, so as to avoid the air displacement and the flow resistance, thereby increasing the flow resistance. Maintain the cooling performance of the cooling system.

The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.

Embodiments of the present invention provide a liquid-cooled heat dissipation system including a liquid cold discharge, a liquid cold head, at least a first-stage tube, and at least one metal layer. The liquid cooling head is in thermal contact with at least one heat source. The flow tube is connected between the liquid cooling head and the liquid cooling row. The metal layer covers an inner tube wall or an outer tube wall of at least the first tube. By designing a metal layer inside or outside the flow tube, the evapotranspiration of the coolant can be reduced to avoid air displacement into the flow tube and increase the flow resistance, thereby maintaining the heat dissipation performance of the heat dissipation system.

In a refinement, the metal layer is a flexible metal tube that is sleeved on the outer tube wall of the at least first tube. Moreover, the total area of the flexible metal tube attached to the outer tube wall accounts for more than 70% of the area of the outer tube wall, which greatly reduces the probability of the coolant escaping outward.

In another modification, the metal layer is plated on the inner tube wall of the flow tube to solve the problem of low effusion of the low coolant.

The detailed features and advantages of the present invention are described in detail below with reference to the detailed description of the embodiments of the present invention. The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

It is to be noted that the present invention is a simplified schematic and is merely illustrative of the basic structure of the invention. Therefore, only the components related to the present invention are labeled in the drawings, and the components are not drawn in the actual number, shape, size ratio, etc., and the actual size is actually an option. The design, and its component layout form may be more complicated, first described.

1 is a schematic diagram of a liquid-cooled heat dissipation system according to a first embodiment of the present invention, and FIG. 2 is a partial enlarged cross-sectional view of FIG.

In the embodiment, a liquid cooling heat dissipation system 1a is proposed, which is suitable for dissipating heat from an electronic device. The electronic device may be, for example, a desktop computer, but the invention is not limited thereto.

Specifically, in the present embodiment, the liquid-cooled heat dissipation system 1a includes a liquid cooling head 10, a liquid cooling row 20, a first-stage tube 31, and a metal layer 40.

The liquid cooling head 10 can be used to thermally contact at least one heat source 9. The heat source 9 can be, for example, an electronic component that generates a large amount of thermal energy during operation such as a central processing unit (CPU) or a graphics processing unit (GPU) in the electronic device, but the present invention Not limited to this. The liquid cooling row 20 can be formed, for example, by a plurality of heat dissipating fins (not shown) and a conveying pipe (not shown) passing through the heat dissipating fins. The flow tube 31 is a hollow tube made of a plastic material and has flexibility. The opposite ends are respectively connected to the liquid cooling head 10 and the liquid cooling row 20 for circulating the cooling liquid to the liquid cooling head 10 . With liquid cooling row 20.

Among them, since the material of the flow tube is usually made of Teflon, the length of the chain between the polymers allows a small amount of coolant to pass through and evaporates to the outside environment via the tube. In the process of evapotranspiration, the pressure in the flow tube is lowered, so that smaller air molecules (such as helium gas) in the outside air are sucked into the flow tube through the tube and dissolved in the coolant. If the dissolved air is saturated, it will exist as bubbles. These bubbles are present in the cooling fluid, which increases the flow resistance and affects the heat dissipation performance. What is more serious is that in a liquid cooling system equipped with a water pump, if these bubbles enter the water pump through the liquid cooling cycle, they will be affected by the impact of the pump blades and will interfere with the rotation of the water pump blades and affect the performance of the water pump. Even the air bubbles cause the blades to excessively sway during rotation, causing damage to the bearings of the blades, which in turn stops the pump and shortens the service life of the entire liquid cooling system.

In order to avoid the occurrence of the aforementioned problems, the metal layer 40 is disposed on the flow tube 31 of the liquid-cooled heat dissipation system 1a of the present embodiment. The metal layer 40 is a flexible metal tube that is sleeved on an outer wall surface 31a of the flow tube 31. In detail, the metal layer 40 is composed of a plurality of metal rings 410 arranged in sequence, and the metal rings 410 are spaced apart and movable relative to each other to cooperate with the flexural bending of the flow tube 31. In more detail, each metal ring 410 includes a cover segment 411 and a non-adhesive segment 412 that are connected to each other. As seen in one of the metal rings 410, the applicator section 411 is attached to the outer wall surface 31a of the flow tube 31, and the non-applied section 412 is overlaid on the portion of the adjacent section 411 of the adjacent metal ring 410. .

It should be noted that in the present embodiment, the total area of the outer tube wall 31a of the metal tube 410 attached to the outer tube wall 31a of the flow tube 31 accounts for 70% or more of the area of the outer tube wall 31a. Thereby, under the premise of the need of the flexing and bending of the flow tube 31, the probability of evapotranspiration of the coolant from the flow tube 31 can be greatly reduced, and the flow resistance can be prevented by replacing the air when the coolant is evacuated outward. The problem occurs to maintain the heat dissipation performance of the liquid-cooled heat dissipation system 1a.

It should be noted that the present invention is not limited to the shape of the metal ring 410 illustrated in the drawings, as long as it can be sleeved and covered outside the flow tube 31, and the total area of the flow tube 31 can reach the flow tube. The design of the outer tube wall 31a having an area of 70% or more is within the scope of the present invention.

Next, please refer to FIG. 3. FIG. 3 is a partially enlarged cross-sectional view showing the liquid cooling heat dissipation system according to the second embodiment of the present invention. The present embodiment proposes a liquid-cooled heat dissipation system 1b. However, since the liquid-cooled heat dissipation system 1b of the present embodiment is similar to the liquid-cooled heat dissipation system 1a of the foregoing embodiment, only differences will be described below.

The difference from the foregoing embodiment is that in the liquid-cooled heat dissipation system 1b of the present embodiment, the metal layer 50 is directly plated on the inner tube wall 31b of the flow tube 31. Thereby, it is also possible to prevent the cooling liquid from escaping outward through the tube wall of the flow tube 31.

Further, in this embodiment, the metal layer 50 itself still has flexibility, so that the flow tube 31 can still be flexibly bent under the permission of this metal property. Even if the metal layer 50 is somewhat broken due to the bending of the flow tube 31, most of the inner tube wall 31b of the flow tube 31 is still covered by the metal layer 50, so that the cooling liquid can be effectively prevented from escaping to the outside.

In addition, it should be noted that the present invention is not limited to the material of the flow tube and the metal layer. Moreover, the present invention is not limited by the number of flow tubes, and the user can increase or decrease the number of flow tubes for the liquid cooling system according to actual needs. For example, in other embodiments, the number of flow tubes may also be two.

It can be seen from the above that in the liquid-cooled heat dissipating system disclosed in the present invention, by designing the metal layer inside or outside the flow tube, the situation that the coolant is evaded outward can be reduced to prevent the air from being displaced into the flow tube. Increase the flow resistance to maintain the heat dissipation performance of the cooling system.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1a, 1b‧‧‧ liquid cooling system
9‧‧‧heat source
10‧‧‧ liquid cold head
20‧‧‧Liquid cooling row
31‧‧‧Flow tube
31a‧‧‧Outer wall
31b‧‧‧ inner wall
40, 50‧‧‧ metal layer
410‧‧‧Metal ring
411‧‧‧Match section
412‧‧‧Non-posting section

1 is a schematic view of a liquid-cooled heat dissipation system according to a first embodiment of the present invention. Fig. 2 is a partially enlarged cross-sectional view of Fig. 1. 3 is a partially enlarged cross-sectional view showing a liquid-cooled heat dissipation system according to a second embodiment of the present invention.

1a‧‧‧Liquid cooling system

9‧‧‧heat source

10‧‧‧ liquid cold head

20‧‧‧Liquid cooling row

31‧‧‧Flow tube

40‧‧‧metal layer

Claims (6)

A liquid-cooled heat dissipation system comprising: a liquid cold discharge; a liquid cold head electrically contacting at least one heat source; at least a first-stage tube connected between the liquid cold head and the liquid cold discharge; and at least one metal layer, Covering an inner tube wall or an outer tube wall of the at least one of the tubes. The liquid-cooled heat dissipation system of claim 1, wherein the at least one metal layer is a flexible metal tube that is sleeved on the outer tube wall of the at least one of the first tubes. The liquid-cooled heat dissipation system of claim 2, wherein the at least one metal layer comprises a plurality of metal rings arranged in sequence, the metal rings being movable relative to each other. The liquid-cooled heat-dissipating system of claim 3, wherein each of the metal rings comprises a covering section and a non-adhesive section connected to each other, and in one of the metal rings, the covering section is attached to the The outer tube wall of the flow tube, and the non-adhesive portion overlies a portion of the adjacent one of the adjacent metal rings. The liquid-cooled heat dissipating system of claim 4, wherein the total area of the covering portions of the metal rings attached to the outer tube wall accounts for more than 70% of the area of the outer tube wall. The liquid-cooled heat dissipation system of claim 1, wherein the at least one metal layer is attached to the inner tube wall of the at least one of the tubes.