TW201801472A - Multilayer electronic component - Google Patents

Abstract

A multilayer body of a multilayer electronic component includes therein a first pattern conductor, and first and second via conductors. A first end of the first via conductor is coupled with a second signal electrode, and a second end thereof is coupled with the first pattern conductor. A first end of the second via conductor is coupled with the first pattern conductor. The first pattern conductor is provided to extend so that a distance between the second via conductor and a second shield electrode is smaller than a distance between the first via conductor and the second shield electrode, a distance between the second via conductor and a third shield electrode is smaller than a distance between the first via conductor and the third shield electrode, and a coupling portion between the second via conductor and the first pattern conductor is arranged outside an area of the second signal electrode.

Description

Laminated electronic parts

The present invention relates to a laminated electronic component, and more particularly to a laminated electronic component in which an external electrode is provided on a bottom surface of a laminated body as a base of an electronic component, and a shield electrode is provided on a side surface of the laminated body.

An example of the laminated electronic component in which the shield electrode is provided on the side surface of the laminated body of the electronic component substrate is a laminated electronic component described in JP-A-2002-76807 (Patent Document 1).

FIG. 9 is an external perspective view of the laminated electronic component 300 described in Patent Document 1. The laminated electronic component 300 includes a laminated body 301 as a base of an electronic component, a first shield electrode 302a, a second shield electrode 302b, a first external electrode 303a, and a second external electrode 303b.

The laminated body 301 has a rectangular parallelepiped shape. The first shield electrode 302a is disposed on one of the two side faces opposed to each other in the short-side direction of the laminated body 301, and the second shield electrode 302b is disposed in the two side faces opposed to each other in the short-side direction of the laminated body 301. The other side. Further, the first outer electrode 303a is provided on one of the two side faces opposed to each other in the longitudinal direction of the laminated body 301, and the second outer electrode 303b is provided on two opposite sides in the longitudinal direction of the laminated body 301. The other side of the side.

The internal structure of the laminated body 301 is omitted, but the pattern conductor and the pass are used. The hole conductors form a plurality of inductors. Further, a plurality of capacitors are formed by the pattern conductors. Further, a band pass filter is constructed using the above inductor and capacitor.

[Advanced technical literature]

[Patent Literature]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-76807

Here, in the laminated electronic component including the shield electrode on the side surface of the laminated body as described above, it is considered that the connection between the pattern conductor and the external electrode may be performed by the via conductor. Here, as the external electrode, a so-called LGA (Land Grid Array) in which a plurality of pad electrodes including a signal electrode and a ground electrode are arranged in a predetermined arrangement on the bottom surface of the laminate is used. However, it is not limited to this.

In such a laminated electronic component, the stray capacitance between the via-hole conductor and the shield electrode disposed near the via-hole conductor is intentionally increased to use the stray capacitance as the electrostatic capacitance when designing the filter characteristic. Next, it is sometimes necessary to form the via conductors as close as possible to the shield electrodes. However, there is a concern that if the area of the signal electrode is small or the signal electrode is close to the side surface, if the via hole conductor is to be formed in the area of the signal electrode, the via hole conductor cannot be sufficiently brought close to the shield electrode. In this case, there is a fear that the stray capacitance between the via hole conductor and the shield electrode provided in the vicinity of the via hole conductor cannot be increased.

Accordingly, it is an object of the present invention to provide a laminated electronic component having a large stray capacitance between a via conductor and a shield electrode disposed adjacent to the via conductor, wherein the via conductor will pattern conductors inside the laminate Connected to the signal electrode disposed on the bottom surface of the laminate Pick up.

In the present invention, it is desired to improve the arrangement of the via conductors to increase the stray capacitance between the via conductors and the shield electrodes provided in the vicinity of the via conductors.

The laminated electronic component of the present invention includes a laminate as an electronic component substrate, a shield electrode, and an external electrode including a signal electrode and a ground electrode. The laminated body has a rectangular parallelepiped shape, and has one main surface, another main surface, and four sides connecting one main surface to the other main surface. Further, the laminated body has therein a first pattern conductor parallel to one main surface and the other main surface of the laminated body, and a first via-hole conductor orthogonal to one main surface and the other main surface of the laminated body And a second via conductor. The shield electrode is disposed on at least one side. The external electrode is disposed on the other main surface. The external electrode may, for example, be an LGA or the like as described above, but is not limited thereto.

One end of the first via conductor is connected to the signal electrode within the area of the signal electrode, and the other end of the first via conductor is connected to the first pattern conductor on the other main surface side of the laminate. One end of the second via conductor is connected to the first pattern conductor on one main surface side of the laminate. The first pattern conductor is extended such that a distance between the second via conductor and the shield electrode is smaller than a distance between the first via conductor and the shield electrode when viewed from one main surface side, and the second via conductor is The connection between the first pattern conductors is at least partially outside the area of the signal electrodes to which the first via conductors are connected.

In the laminated electronic component having the above configuration, the via conductor connected between the pattern conductor inside the laminate and the signal electrode provided on the bottom surface of the laminate is divided into a first via conductor and a second via conductor. Moreover, the second via conductor and the first pattern having the above features The conductors are connected so as to be sufficiently close to the shield electrode disposed adjacent to the second via conductor. Therefore, even when the area of the signal electrode is small or the signal electrode is close to the side, the stray capacitance between the above-mentioned via-hole conductor and the shield electrode is large.

The laminated electronic component of the present invention preferably has the following features. That is, the length of the second via conductor is greater than the length of the first via conductor.

In the laminated electronic component having the above structure, the proportion of the second via-hole conductor sufficiently separated from the shield electrode is larger than the proportion of the first via-hole conductor, thereby reliably increasing the impurity between the via-hole conductor and the shield electrode Bulk capacitor.

The laminated electronic component of the present invention preferably has the following features. That is, the laminated body further includes a second pattern conductor in parallel with one main surface and the other main surface of the laminated body. Further, the second pattern conductor is connected to the other end of the second via-hole conductor on the other main surface side of the laminated body, and constitutes an inductor or a capacitor.

In the laminated electronic component having the above structure, the stray capacitance between the via hole conductor and the shield electrode is large as described above. Therefore, the second pattern conductor constitutes an inductor or a capacitor in a circuit such as an LC parallel resonator. In the case where the laminated electronic component is a layered band pass filter, it is considered that the stray capacitance is used as a static capacitance in designing a filter characteristic. .

The laminated electronic component of the present invention and its preferred embodiment further preferably have the following features. That is, the shield electrodes are respectively disposed on the four side faces of the laminated body.

In the laminated electronic component having the above configuration, the influence of noise from the outside is effectively suppressed.

The laminated electronic component of the present invention and its preferred embodiment further preferably have the following features. That is, the laminated body has one main surface and the other main body of the laminated body inside. a third pattern conductor parallel to the surface, and a third via conductor orthogonal to one main surface and the other main surface of the laminate. One end of the third via-hole conductor is connected to the ground electrode within the area of the ground electrode, and the other end of the third via-hole conductor is connected to the third pattern conductor on the other main surface side of the laminated body. Moreover, one end of the third pattern conductor is connected to the shield conductor.

In the laminated electronic component having the above structure, the shield conductor and the ground electrode are separated on the outer surface of the laminated electronic component. That is, when the external electrode including the ground conductor is soldered to the mounting electrode on the circuit board of the electronic device, the solder is prevented from oozing out to the shield conductor. As a result, it is possible to suppress the occurrence of conduction between the laminated electronic component of the present invention and other electronic components due to the bleed out of the solder. Therefore, the laminated electronic component and other electronic components of the present invention can be mounted at a high density.

The laminated electronic component of the present invention and its preferred embodiment further preferably have the following features. That is, the shield conductor includes a first portion and a second portion, one end of which is connected to the first portion, and the other end of the second portion reaches the other main surface of the laminate. The ground electrode includes a first portion and a second portion, one end of the second portion being coupled to the first portion, and the other end of the second portion reaching a side of the second portion where the shield conductor is disposed. Moreover, the second portion of the shield conductor is coupled to the second portion of the ground electrode.

In the laminated electronic component having the above structure, that is, the shield conductor and the ground electrode are directly connected to the outer surface of the laminated electronic component. As a result, the pattern conductor and the via-hole conductor for connecting the shield conductor to the ground electrode may not be provided inside the laminated body. Therefore, the degree of freedom in arranging the pattern conductor and the via-hole conductor inside the laminated body can be improved. In addition, it is also possible to use a structure in which a pattern conductor and a via-hole conductor for connecting a shield conductor and a ground electrode are provided inside the laminated body, and in this case, the grounding effect can be improved.

In the laminated electronic component of the present invention, the stray capacitance between the via-hole conductor and the shield electrode disposed near the via-hole conductor is large, wherein the via-hole conductor places the pattern conductor inside the laminate and the laminated body The signal electrodes on the bottom surface are connected.

100, 100A, 100B, 100C, 100D‧‧‧ laminated electronic parts

1‧‧ ‧ laminated body

2‧‧‧Shield electrode

2a‧‧‧First shield electrode

2b‧‧‧second shield electrode

2c‧‧‧ third shield electrode

2d‧‧‧fourth shield electrode

3‧‧‧External electrode

3a‧‧‧first signal electrode

3b‧‧‧second signal electrode

3e‧‧‧third signal electrode

3f‧‧‧fourth signal electrode

3c‧‧‧First grounding electrode

3d‧‧‧Second ground electrode

4‧‧‧pattern conductor

4a‧‧‧First pattern conductor

4b‧‧‧Second pattern conductor

5‧‧‧through hole conductor

5a‧‧‧First via conductor

5b‧‧‧Second via conductor

Fig. 1 is a perspective perspective view showing a main part of a laminated electronic component 100 according to an embodiment of the laminated electronic component of the present invention.

Fig. 2 is a cross-sectional view of the main part of the laminated electronic component 100 taken along the cut surface shown in Fig. 1 .

FIG. 3 is a perspective perspective view showing a main part of the laminated electronic component 200 as a comparative example with respect to the laminated electronic component 100.

4 is a cross-sectional view of the main portion of the laminated electronic component 200 taken along the cut surface shown in FIG. 3.

FIG. 5 is a perspective perspective view showing a connection structure between the shield electrode and the ground electrode of the laminated electronic component 100.

FIG. 6 is a perspective perspective view showing a connection structure between the shield electrode and the ground electrode of the laminated electronic component 100A different from the laminated electronic component 100 only in the connection structure between the shield electrode and the ground electrode.

FIG. 7 is a view showing a laminated electronic component 100B viewed from the top surface side of the laminated electronic component 100B according to the first modification of the embodiment of the laminated electronic component according to the present invention, and an embodiment of the laminated electronic component according to the present invention. The top side of the laminated electronic component 100C of the second modification is observed as a laminate A perspective top view of a type of electronic component 100C.

Fig. 8 is a perspective perspective view of a laminated electronic component 100D according to a third modified example of the embodiment of the laminated electronic component of the present invention.

Fig. 9 is a perspective view showing the appearance of a laminated electronic component 300 of the background art.

The embodiments of the present invention are shown below, and thus the features of the present invention will be described in more detail. The laminated electronic component to which the present invention is applied is exemplified by a laminated band pass filter, but is not limited thereto.

- Embodiments of laminated electronic components -

The laminated electronic component 100 which is an embodiment of the laminated electronic component of the present invention will be described with reference to Figs. 1 and 2 . Incidentally, only the main portion is shown in the drawings, and a plurality of pattern conductors for constituting a circuit exist in a portion other than the main portion shown in the inside of the laminated body to be described later. And a plurality of Via conductors, but the description and illustration are omitted for simplification. In addition, with respect to the drawings subsequent to FIGS. 1 and 2, only the main part is also shown.

In addition, in the drawings, the difference in shape of the shield electrode, the external electrode, the pattern conductor, the via-hole conductor, and the laminated body which are generated in the manufacturing process is not reflected. That is, even if there are parts different from the actual product in the drawings to be used later, these drawings can be said to be able to represent the actual products in essence.

FIG. 1 is a perspective perspective view showing a main part of a laminated electronic component 100. Fig. 2(A) shows a section along the line including A1-A1 shown in Fig. 1 The line shows a cross-sectional view of the arrow in which the main part of the laminated electronic component 100 is cut. 2(B) is a cross-sectional view of the arrow in the same manner as the main portion of the laminated electronic component 100 taken along the section including the A2-A2 line shown in FIG. 1 (indicated by a one-dot chain line). The connection structure (refer FIG. 5 and FIG. 6) of the shield electrode and the ground electrode mentioned later is abbreviate|omitted in FIG. 1 and FIG.

The laminated electronic component 100 includes a laminated body 1 as a base of an electronic component, a shield electrode 2, and an external electrode 3. The laminated body 1 has a rectangular parallelepiped shape, and has one main surface, another main surface, and four side surfaces that connect one main surface to the other main surface. In Fig. 1, one main surface corresponds to the top surface in the drawing, and the other main surface corresponds to the bottom surface.

The laminated body 1 includes: a dielectric layer (not labeled); a pattern conductor 4 including a first pattern conductor 4a and a second pattern conductor 4b parallel to one main surface and the other main surface of the laminated body 1; and a through hole The conductor 5 includes a first via conductor 5a and a second via conductor 5b which are orthogonal to one main surface and the other main surface of the laminated body 1. The dielectric layer is made of, for example, a low-temperature fired ceramic material, and the pattern conductor 4 and the via-hole conductor 5 are made of, for example, Cu or the like. As described above, a plurality of pattern conductors and a plurality of via-hole conductors other than the pattern conductor 4 and the via-hole conductor 5 are present inside the laminated body 1, and constitute, for example, an LC parallel resonator.

The shield electrode 2 includes a first shield electrode 2a, a second shield electrode 2b, a third shield electrode 2c, and a fourth shield electrode 2d. Each of the shield electrodes is made of, for example, Cu or the like, and one shield electrode is provided on each of the four side faces of the laminated body 1. In this case, it is preferable to effectively suppress the influence of noise from the outside. Here, the shield electrode of the laminated electronic component 100 is not limited to four, and may be provided at a desired position among the four side faces. Further, in the laminated electronic component 100, each shield electrode is in the ridge portion of the laminated body 1 They are connected to each other, but each of the shield electrodes may be disposed in a state of being separated from each other.

The external electrode 3 is an LGA (Land Grid Array), and is disposed to connect the first signal electrode 3a, the second signal electrode 3b, the third signal electrode 3e, the fourth signal electrode 3f, the first ground electrode 3c, and The second ground electrodes 3d are arranged in a state of being arranged on the bottom surface of the laminated body 1 in a predetermined arrangement. In the laminated electronic component 100, the first signal electrode 3a, the second signal electrode 3b, the third signal electrode 3e, the fourth signal electrode 3f, the first ground electrode 3c, and the second ground electrode 3d are formed in a so-called matrix arrangement. Way, but not limited to this. Incidentally, the external electrodes 3 of the laminated electronic component 100 are not limited to six, and the number of external electrodes 3 required for the circuit may be provided. Incidentally, the external electrodes are not limited to the LGA, and solder bumps or the like arranged in a predetermined arrangement may be used, for example.

In the laminated electronic component 100, the first pattern conductor 4a is along the center of gravity of the second signal electrode 3b and the second shield electrode 2b of the laminated body 1 when viewed from one main surface side of the laminated body 1. The strip-shaped conductor extending in the direction in which the ridge line portion connected to the third shield electrode 2c is connected, one end portion and the other end portion of the first pattern conductor 4a serve as a connection region. However, the direction of extension is not limited to this. Further, the second pattern conductor 4b is a pattern conductor of a capacitor constituting, for example, an LC parallel resonator.

In the laminated electronic component 100, one end of the first via-hole conductor 5a is connected to the second signal electrode 3b at the position of the center of gravity of the second signal electrode 3b. However, the connection portion is not limited thereto, and may be within the area of the second signal electrode 3b. Further, the other end of the first via-hole conductor 5a is connected to one end portion of the first pattern conductor 4a at the other main surface of the laminated body 1, that is, the bottom surface side. It should be noted that the connection portion between the other end of the first via-hole conductor 5a and the first pattern conductor 4a may be shifted toward the center side with respect to one end portion of the first pattern conductor 4a. position.

In the laminated electronic component 100, when viewed from one main surface side of the laminated body 1, one end of the second via-hole conductor 5b is outside the area of the second signal electrode 3b, and is on one main surface of the laminated body 1 The face side is connected to the other end of the first pattern conductor 4a. Therefore, the shield electrodes provided in the vicinity of the first via hole conductor 5a and the second via hole conductor 5b are the second shield electrode 2b and the third shield electrode 2c.

The first pattern conductor 4a is extended such that the distance d _1X between the second via-hole conductor 5b and the second shield electrode 2b is smaller than that of the first via-hole conductor 5a and the second when viewed from one main surface side of the laminated body 1. The distance d _2X between the shield electrodes 2b (described below), the distance d _1Y between the second via conductor 5b and the third shield electrode 2c is smaller than between the first via conductor 5a and the third shield electrode 2c a distance d _2Y (described below), and a connection portion between the second via-hole conductor 5b and the first pattern conductor 4a is outside the area of the second signal electrode 3b to which the first via-hole conductor 5a is connected (refer to the figure) 2).

It should be noted that the connection portion between one end of the second via-hole conductor 5b and the other end portion of the first pattern conductor 4a may partially overlap the area of the second signal electrode 3b. Further, the connection portion between the one end of the second via-hole conductor 5b and the first pattern conductor 4a may be shifted to the center side with respect to the other end portion of the first pattern conductor 4a.

On the other hand, the laminated electronic component 200 which is a comparative example with respect to the laminated electronic component 100 is demonstrated. FIG. 3 is a perspective perspective view of the laminated electronic component 200. (A) of FIG. 4 is an arrow cross-sectional view showing a state in which a main portion of the laminated electronic component 200 is cut along a cross section (indicated by a one-dot chain line) including the A3-A3 line shown in FIG. 3 . (B) of FIG. 4 is similarly shown along the section including the line A4-A4 shown in FIG. 3 (indicated by a one-dot chain line). An arrow cross-sectional view of a case where the main part of the layered electronic component 200 is cut.

The laminated electronic component 200 includes a laminated body 201 as a base of an electronic component, a shield electrode 202 (a first shield electrode 202a to a fourth shield electrode 202d), and an external electrode 203 (a first signal electrode 203a, a second signal electrode 203b, The third signal electrode 203e, the fourth signal electrode 203f, the first ground electrode 203c, and the second ground electrode 203d). Further, the laminated body 201 is provided therein with a pattern conductor 204 parallel to one main surface and the other main surface of the laminated body 201, and a via conductor orthogonal to one main surface and the other main surface of the laminated body 201. 205. The shield electrode 202 and the external electrode 203 are the same as the laminated electronic component 100 of the present invention.

In the laminated electronic component 200, one end of the via conductor 205 is connected to the second signal electrode 203b at the position of the center of gravity of the second signal electrode 203b. That is, similarly to the laminated electronic component 100, the shield electrode provided in the vicinity of the via hole conductor 205 is the second shield electrode 202b and the third shield electrode 202c.

At this time, the through-hole conductors 205 and the distance between the second shield electrode 202b is d _2X, the distance d _2X is the distance between the first through-hole conductors 5a and the second shield electrode 2b multilayer type electronic component 100. Further, the distance between the through-hole conductors 205 and electrode 202c of the third shield d _2Y, the distance d _2Y is the distance between the first through-hole conductors 5a and the third shield electrode 2c stacked-type electronic component 100 (see FIG. 4).

In this case, stray capacitance is generated between the entire via hole conductor 205 and the second shield electrode 202b, and between the entire via hole conductor 205 and the third shield electrode 202c. The size of the stray capacitance is also dependent on the relative dielectric constant of the dielectric material constituting the laminated body 201, but if the distance between the via hole conductor 205 and the second shield electrode 202b and the third shield electrode 202c is not sufficiently small, then The size of the stray capacitance cannot be increased until the filter characteristics are designed. The degree to which electrostatic capacitance is used.

On the other hand, in the laminated electronic component 100 of the present invention, as described above, the distance between the second via-hole conductor 5b and the second shield electrode 2b and the third shield electrode 2c is made smaller by the first pattern conductor 4a. The distance between the first via hole conductor 5a and the second shield electrode 2b and the third shield electrode 2c. Since the distance between the capacitor and the conductor is inversely proportional, the amount of stray capacitance generated between the second via-hole conductor 5b and the shield electrode is greatly increased.

Therefore, the size of the stray capacitance generated between the first via-hole conductor 5a and the second via-hole conductor 5b in the laminated electronic component 100 and the shield electrode in the vicinity thereof is larger than that of the via-hole conductor in the laminated electronic component 200. The magnitude of the stray capacitance generated between the 205 and the shield electrode near the via conductor 205. That is, the laminated electronic component 100 can be designed in consideration of the use of the stray capacitance as a capacitance required to develop the filter characteristics.

Here, the connection structure between the shield electrode and the ground electrode of the laminated electronic component of the present invention will be described with reference to FIGS. 5 and 6. FIG. 5 is a perspective perspective view focusing on a connection structure between the shield electrode and the ground electrode of the laminated electronic component 100. As shown in FIG. 5, the laminated body 1 is provided with a third pattern conductor 6a, 6b parallel to one main surface and the other main surface of the laminated body 1, and one main surface and the other main body of the laminated body 1 The third via-hole conductors 7a, 7b are orthogonal to each other.

One end of the third via-hole conductor 7b is connected to the second ground electrode 3d within the area of the second ground electrode 3d, and the other end of the third via-hole conductor 7b is on the other main surface side of the laminated body 1 and the third pattern conductor 6b. connection. Further, one end of the third pattern conductor 6b is connected to the second shield electrode 2b. In addition, the third pattern conductor 6a and the third via conductor 7a are in the same positional relationship as the third pattern conductor 6b and the third via conductor 7b, and the third via conductor 7a and the first ground electrode 3c is connected, and one end of the third pattern conductor 6a is connected to the first shield electrode 2a.

In the connection structure, when the first ground electrode 3c and the second ground electrode 3d are soldered to the mounting electrode on the circuit board of the corresponding electronic device, the solder is suppressed to the first shield electrode 2a and the second shield. The electrode 2b is oozing out. As a result, conduction (forming of a solder bridge) formed by the solder oozing between the laminated electronic component 100 and other electronic components is suppressed. Therefore, the laminated electronic component 100 and other electronic components can be mounted at a high density.

FIG. 6 is a perspective perspective view showing a connection structure between the shield electrode and the ground electrode of the laminated electronic component 100A which is different from the laminated electronic component 100 only in the connection structure between the shield electrode and the ground electrode. 6, the second shield electrode 2b 2b comprises a first portion and a second portion 2b _{2. 1,} one end of the second portion 2b ₂ is connected to the first part _{2b. 1,} the other end of the second portion 2b of the laminate ₂ reaches The other main face of 1. Further, the first shield electrode 2a includes a first portion 2a ₁ and a second portion 2a _{2 which are} identical in construction to the first portion 2b ₁ and the second portion 2b ₂ described above.

The second ground electrode _{3d. 1} comprises a first portion and a second portion 3d 3d _2, the second end portion 3d is connected to the first portion ₂ is 3d _1, the other end of the second portion 3d provided ₂ reaches the second shield electrode 2b side. In the laminated electronic component 100A, the width of the first portion 3d ₁ is the same as the width of the second portion 3d ₂ , but the widths of the two portions may be different. Further, the width of the second portion 2b ₂ of the second shield electrode 2b is the same as the width of the second portion 3d ₂ of the second ground electrode 3d, but the widths of the two may be different. Moreover, the second portion 2b _{2 of the} second shield electrode 2b is connected to the second portion 3d _{2 of the} second ground electrode 3d.

Further, the first ground electrode 3c and the second ground electrode 3d have the same configuration, and include a first portion 3c ₁ and a second portion 3c ₂ which are not shown. Moreover, the second portion 2a _{2 of the} first shield electrode 2a is connected to the second portion 3c _{2 of the} first ground electrode 3c.

In the connection structure, the pattern conductor and the via conductor for connecting the first shield electrode 2a and the first ground electrode 3c, and the second shield electrode 2b and the second ground electrode 3d may not be connected. The pattern conductor and the via conductor are disposed inside the laminated body 1. Therefore, the degree of freedom in arranging the pattern conductor and the via-hole conductor inside the laminated body 1 can be improved.

- First and second modifications of the embodiment of the laminated electronic component -

The laminated electronic component 100B according to the first modification of the embodiment of the laminated electronic component of the present invention and the laminated electronic component 100C of the second modification will be described with reference to FIG. The shape of the first pattern conductor 4a of the laminated electronic components 100B and 100C is different from the shape of the first pattern conductor 4a of the laminated electronic component 100. The other components are common to the laminated electronic component 100. Therefore, the common components may be omitted or simplified. In the following description, the common constituent elements will be omitted or simplified in the same manner.

(A) is a perspective plan view of the laminated electronic component 100B as viewed from the top surface side of the laminated electronic component 100B according to the first modification of the embodiment of the laminated electronic component of the present invention. (B) of FIG. 7 is a perspective plan view of the laminated electronic component 100C as viewed from the top surface side of the multilayer electronic component 100C according to the second modification of the embodiment of the laminated electronic component of the present invention.

Also in the laminated electronic component 100B, the distance between the second via-hole conductor 5b and the shield electrode in the vicinity of the second via-hole conductor 5b is smaller than that of the first via hole when viewed from one main surface side of the laminated body 1. The distance between the conductor 5a and the same shield electrode. On the other hand, in the laminated electronic component 100B, the distance d _1X between the second via-hole conductor 5b and the second shield electrode 2b is smaller than the distance d _2X between the first via-hole conductor 5a and the second shield electrode 2b, However, the distance between the second via-hole conductor 5b and the third shield electrode 2c is the same as the distance d _2Y between the first via-hole conductor 5a and the third shield electrode 2c.

Further, as in the laminated electronic component 100C, the distance d _1Y between the second via-hole conductor 5b and the third shield electrode 2c may be smaller than the distance d _2Y between the first via-hole conductor 5a and the third shield electrode 2c. The distance between the second via-hole conductor 5b and the second shield electrode 2b is the same as the distance d _2X between the first via-hole conductor 5a and the second shield electrode 2b. In the case of the laminated electronic component 100C, it is effective to shift the arrangement position of the second via-hole conductor 5b by the first pattern conductor 4a to reduce the first via-hole conductor 5a and a further shield electrode (the first The distance between the three shield electrodes 2c).

- Third Modification of Embodiment of Laminated Electronic Component -

A laminated electronic component 100D according to a third modification of the embodiment of the laminated electronic component of the present invention will be described with reference to FIG. The shape of the second pattern conductor 4b of the laminated electronic component 100D is different from the shape of the second pattern conductor 4b of the laminated electronic component 100. The other components are common to the laminated electronic component 100.

Fig. 8 is a perspective perspective view of a laminated electronic component 100D according to a third modified example of the embodiment of the laminated electronic component of the present invention. In the laminated electronic component 100, the second pattern conductor 4b is a pattern conductor constituting a capacitor in a circuit such as an LC parallel resonator, but in the laminated electronic component 100D, the second pattern conductor 4b is used to constitute an inductor. Pattern conductor.

Even in this case, the first pattern conductor 4a is extended such that the distance between the second via-hole conductor 5b and the second shield electrode 2b is smaller than the distance between the first via-hole conductor 5a and the second shield electrode 2b, The distance between the second via hole conductor 5b and the third shield electrode 2c is smaller than The distance between the first via hole conductor 5a and the third shield electrode 2c. Incidentally, the distance between the second via-hole conductor 5b and one of the shield electrodes may be reduced as in the first and second modifications described above.

Further, when the arrangement position of the second via-hole conductor 5b is shifted with respect to the arrangement position of the first via-hole conductor 5a by the first pattern conductor 4a, the arrangement position of the second pattern conductor 4b is also simultaneously shifted to reduce the The distance between the two pattern conductors 4b and the second shield electrode 2b. Further, the shape of the second pattern conductor 4b is also adjusted to increase the length of the region where the second pattern conductor 4b faces the second shield electrode 2b.

Thereby, the magnitude of the stray capacitance generated between the second pattern conductor 4b and the second shield electrode 2b is greatly increased.

Therefore, the size of the stray capacitance generated between the second pattern conductor 4b, the first via-hole conductor 5a, the second via-hole conductor 5b, and the shield electrode in the vicinity of the three in the laminated electronic component 100D is sufficiently increased. That is, the laminated electronic component 100D can be designed in consideration of the use of the stray capacitance as the capacitance required to develop the filter characteristics.

It should be noted that the present invention is not limited to the above-described embodiments, and various modifications and various modifications can be made within the scope of the invention. In addition, it should be noted that each embodiment described in the specification is an exemplary description, and the structure may be partially replaced or combined between different embodiments.

100‧‧‧Laminated electronic components

1‧‧ ‧ laminated body

2‧‧‧Shield electrode

2a‧‧‧First shield electrode

2b‧‧‧second shield electrode

2c‧‧‧ third shield electrode

2d‧‧‧fourth shield electrode

3‧‧‧External electrode

3a‧‧‧first signal electrode

3b‧‧‧second signal electrode

3e‧‧‧third signal electrode

3f‧‧‧fourth signal electrode

3c‧‧‧First grounding electrode

3d‧‧‧Second ground electrode

4‧‧‧pattern conductor

4a‧‧‧First pattern conductor

4b‧‧‧Second pattern conductor

5‧‧‧through hole conductor

5a‧‧‧First via conductor

5b‧‧‧Second via conductor

Claims (10)

A laminated electronic component comprising a laminated body as a base of an electronic component, a shield electrode, and an external electrode including a signal electrode and a ground electrode, wherein the laminated body has a rectangular parallelepiped shape and has one main surface and another main surface And four side faces connecting the one main surface and the other main surface, and a first pattern conductor parallel to the one main surface and the other main surface, and the one main surface are provided inside the laminated body a first via conductor and a second via conductor orthogonal to the other main surface, the shield electrode being disposed on at least one side, the external electrode being disposed on the other main surface, one end of the first via conductor being Connected to the signal electrode in an area of the signal electrode, the other end of the first via conductor is connected to the first pattern conductor on the other main surface side, and one end of the second via conductor is on the one main surface The side is connected to the first pattern conductor, and the first pattern conductor is extended such that a distance between the second via-hole conductor and the shield electrode is smaller than the first pass when viewed from the one main surface side The distance between the conductor and the shield electrode, and the second through-hole conductor and the connection point between the first conductive pattern is at least partially connected to the outer conductor of the through-hole of the first signal electrode area. The laminated electronic component of claim 1, wherein the second via conductor has a length greater than a length of the first via conductor. The laminated electronic component of claim 1, wherein the laminated body further includes a second pattern conductor parallel to the one main surface and the other main surface, the second pattern conductor being at the other main The face side is connected to the other end of the second via conductor and constitutes an inductor or a capacitor. The laminated electronic component of claim 2, wherein the laminate further includes a second pattern conductor parallel to the one main surface and the other main surface, the second pattern conductor being at the other main The face side is connected to the other end of the second via conductor and constitutes an inductor or a capacitor. The laminated electronic component according to claim 1, wherein the shielding electrodes are respectively disposed on the four sides. The laminated electronic component according to claim 2, wherein the shielding electrodes are respectively disposed on the four sides. The laminated electronic component of claim 3, wherein the shielding electrodes are respectively disposed on the four sides. The laminated electronic component of claim 4, wherein the shielding electrodes are respectively disposed on the four sides. The laminated electronic component according to any one of claims 1 to 8, wherein the laminated body internally has a third pattern conductor parallel to the one main surface and the other main surface, and the one main body a third via-hole conductor orthogonal to the other main surface, one end of the third via-hole conductor being connected to the ground electrode within an area of the ground electrode, the other end of the third via-hole conductor being at the other The main surface side is connected to the third pattern conductor, and one end of the third pattern conductor is connected to the shield conductor. The laminated electronic component of any one of claims 1 to 8, wherein the shield conductor comprises a first portion and a second portion, one end of the second portion being connected to the first portion, and the second portion being further One end reaches the other main surface, the ground electrode includes a first portion and a second portion, one end of the second portion and the first portion The sub-connections, the other end of the second portion reaches a side of the second portion where the shield conductor is disposed, and the second portion of the shield conductor is connected to the second portion of the ground electrode.