以下，對本發明之詳細內容進行說明。 (含金屬之粒子) 本發明之含金屬之粒子具備基材粒子、及金屬部。上述金屬部係配置於上述基材粒子之表面上。於本發明之含金屬之粒子中，上述金屬部於外表面具有複數個突起。於本發明之含金屬之粒子中，上述金屬部之上述突起之前端能夠以400℃以下熔融。 於本發明中，由於具備上述構成，故而能夠以相對低溫使金屬部之突起之前端熔融。因此，能夠以相對低溫使上述含金屬之粒子中之上述金屬部突起之前端熔融，於熔融後固化而接合於其他粒子或其他構件。又，可使複數個含金屬之粒子熔融接合。又，可將含金屬之粒子熔融接合於連接對象構件。又，進而可將含金屬之粒子熔融接合於電極。 已知若金屬粒子之粒徑小至100 nm以下之尺寸，構成原子數變少，則粒子之相對於體積之表面積比急遽增大，與塊體狀態相比熔點或燒結溫度大幅降低。本發明者等人發現，藉由減小上述金屬部之突起之前端徑，而與使用奈米尺寸之金屬粒子之情形同樣地，可降低上述金屬部之上述突起之前端之熔融溫度。 為了降低上述金屬部之上述突起之前端之熔融溫度，亦可將上述突起部之形狀設為前端變細之針狀。為了降低上述金屬部之上述突起之前端之熔融溫度，亦可於上述金屬部之外表面形成複數個較小之突起。為了降低上述金屬部之上述突起之前端之熔融溫度，於本發明之含金屬之粒子中，較佳為上述金屬部於外表面具有複數個凸部(第1突起)，且上述金屬部於上述凸部之外表面具有上述突起(第2突起)。較佳為上述凸部大於上述突起。藉由不同於上述突起而另行存在大於上述突起之上述凸部，連接可靠性進一步提高。可將凸部與突起一體化，可將突起附著於凸部上。上述突起亦可包含粒子。於本說明書中，與上述突起區別而將於外表面上形成有該突起之突起部分稱為凸部。上述凸部之前端亦可無法以400℃以下熔融。 如上所述，藉由減小突起之前端徑，可降低熔融溫度。又，為了降低熔融溫度，可對金屬部之材料加以選擇。為了使上述金屬部之突起之前端之熔融溫度成為400℃以下，較佳為對突起之形狀與金屬部之材料加以選擇。 上述金屬部之突起之前端之熔融溫度係以如下方式進行評價。 上述金屬部之突起之前端之熔融溫度可使用示差掃描熱量計(Yamato Scientific公司製造之「DSC-6300」)進行測定。上述測定係使用含金屬之粒子15 g，於升溫範圍30℃至500℃、升溫速度5℃/min.、氮氣吹拂量5 ml/min.之測定條件下進行。 繼而，確認上述金屬部之突起之前端以上述之測定所獲得之熔融溫度熔融。將含金屬之粒子1 g放入至容器中，並放入至電爐中。於電爐中設定與上述測定所獲得之熔融溫度相同之溫度，於氮氣環境下加熱10分鐘。其後，將經加熱之含金屬之粒子自電爐取出，使用掃描式電子顯微鏡確認突起之前端之熔融狀態(或熔融後之固化狀態)。 就有效地降低突起之前端之熔融溫度，有效地提高連接可靠性之觀點而言，上述突起之形狀較佳為前端變細之針狀。於該含金屬之粒子中，上述金屬部之外表面之上述突起之形狀與先前之形狀不同，而發揮出藉由突起之形狀為前端變細之針狀所獲得之新效果。 本發明之含金屬之粒子由於能夠以相對低溫使上述金屬部之上述突起之前端熔融接合，故而可用於2個連接對象構件之連接。藉由在2個連接對象構件間，於含金屬之粒子之上述金屬部之突起之前端熔融接合，可形成發揮出牢固之連接之連接部，而可提高連接可靠性。 又，本發明之含金屬之粒子亦可用於導電連接。進而，本發明之含金屬性粒子亦可用作間隙控制材(間隔件)。 複數個上述突起之頂角之平均值(a)較佳為10°以上，更佳為20°以上，且較佳為60°以下，更佳為45°以下。若上述頂角之平均值(a)為上述下限以上，則突起變得不易過度彎折。若上述頂角之平均值(a)為上述上限以下，則熔融溫度進一步降低。再者，存在彎折之突起於導電連接時使電極間之連接電阻上升之情況。 上述突起之上述頂角之平均值(a)可藉由將1個含金屬之粒子所含之突起之各頂角進行平均而求出。 複數個上述突起之平均高度(b)較佳為3 nm以上，更佳為5 nm以上，進而較佳為50 nm以上，且較佳為5000 nm以下，更佳為1000 nm以下，進而較佳為800 nm以下。若上述突起之平均高度(b)為上述下限以上，則熔融溫度進一步降低。若上述突起之平均高度(b)為上述上限以下，則突起變得不易過度彎折。 上述突起之平均高度(b)係1個含金屬之粒子所含之突起之高度的平均值。於金屬部不具有上述凸部、且具有上述突起之情形時，上述突起之高度表示連結含金屬之粒子之中心與突起之前端之線(圖1所示之虛線L1)上自假定無突起之情形時之金屬部之假想線(圖1所示之虛線L2)上(假定無突起之情形時球狀之含金屬之粒子之外表面上)起至突起之前端為止之距離。即，於圖1中，表示自虛線L1與虛線L2之交點起至突起之前端為止之距離。再者，於上述金屬部具有上述凸部、且具有上述突起之情形，即於上述金屬部於上述凸部上具有上述突起之情形時，上述突起之高度表示自假定無突起之情形時之金屬部(凸部)之假想線起至突起之前端為止之距離。突起亦可為複數個粒狀物之集合體。例如，突起可由構成突起之複數個粒子相連而形成。於該情形時，突起之高度係將複數個粒狀物之集合體或相連之粒子視為整體時之突起之高度。於圖3中，突起1Ba、3Ba之高度亦表示自假定無突起之情形時之金屬部之假想線上起至突起之前端為止之距離。 複數個上述突起之基部之平均徑(c)較佳為3 nm以上，更佳為5 nm以上，進而較佳為50 nm以上，且較佳為1000 nm以下，更佳為800 nm以下。若上述平均徑(c)為上述下限以上，則突起變得不易過度彎折。若上述平均徑(c)為上述上限以下，則連接可靠性進一步提高。 上述突起之基部之平均徑(c)係1個含金屬之粒子所含之突起之基部之徑之平均值。基部之徑係突起之各基部之最大徑。於上述金屬部具有上述凸部、且具有上述突起之情形，即於上述金屬部於上述凸部上具有上述突起之情形時，連結含金屬之粒子之中心與突起之前端之線上的假定無突起之情形時之金屬部之假想線部分之端部為上述突起之基部，上述假想線部分之端部間距離(以直線連結端部之距離)為基部之徑。 複數個上述突起之平均高度(b)相對於複數個上述突起之基部之平均徑(c)之比(平均高度(b)/平均徑(c))較佳為0.5以上，更佳為1.5以上，且較佳為10以下，更佳為5以下。若上述比(平均高度(b)/平均徑(c))為上述下限以上，則連接可靠性進一步提高。若上述比(平均高度(b)/平均徑(c))為上述上限以下，則突起變得不易過度彎折。 複數個上述突起之高度之中央位置之平均徑(d)相對於複數個上述突起之基部之平均徑(c)之比(平均徑(d)/平均徑(c))較佳為1/5以上，更佳為1/4以上，進而較佳為1/3以上，且較佳為4/5以下，更佳為3/4以下，進而較佳為2/3以下。若上述比(平均徑(d)/平均徑(c))為上述下限以上，則突起變得不易過度彎折。若上述比(平均徑(d)/平均徑(c))為上述上限以下，則連接可靠性進一步提高。 上述突起之高度之中央位置之平均徑(d)係1個含金屬之粒子所含之突起之高度之中央位置的徑之平均值。突起之高度之中央位置之徑係突起之高度之各中央位置之最大徑。 就抑制突起之過度彎折，進一步提高利用突起之熔融接合性，有效地提高連接可靠性之觀點而言，複數個上述突起之形狀較佳為針狀或球體之一部分之形狀。針狀之形狀較佳為角錐狀、圓錐狀或旋轉抛物面狀，更佳為圓錐狀或旋轉抛物面狀，進而較佳為圓錐狀。上述突起之形狀可為角錐狀，亦可為圓錐狀，亦可為旋轉抛物面狀。於本發明中，旋轉抛物面狀亦包含於前端變細之針狀中。於旋轉抛物面狀之突起中，自基部至前端逐漸變細。 每個上述含金屬之粒子之上述金屬部的外表面之突起較佳為3個以上，更佳為5個以上。上述突起個數之上限並無特別限定。突起個數之上限可考慮含金屬之粒子之粒徑等而適當選擇。再者，上述含金屬之粒子所含之突起亦可不為前端變細之針狀，進而上述含金屬之粒子所含之突起無需全部為前端變細之針狀。 每個上述含金屬之粒子所含之突起個數中前端變細之針狀之突起個數所占之比率較佳為30%以上，更佳為50%以上，進而較佳為60%以上，尤佳為70%以上，最佳為80%以上。針狀之突起個數之比率越多，越可更有效地獲得利用針狀之突起之效果。 金屬部之外表面之表面積整體100%中具有突起之部分之表面積之比率(x)較佳為10%以上，更佳為20%以上，進而較佳為30%以上，且較佳為90%以下，更佳為80%以下，進而較佳為70%以下。具有突起之部分之表面積之比率越多，越可更有效地獲得利用突起之效果。 就有效地提高連接可靠性之觀點而言，金屬部之外表面之表面積整體100%中具有針狀突起之部分之表面積之比率較佳為10%以上，更佳為20%以上，進而較佳為30%以上，且較佳為90%以下，更佳為80%以下，進而較佳為70%以下。具有針狀突起之部分之表面積之比率越多，越可更有效地獲得利用突起之效果。 複數個上述凸部之頂角之平均值(A)較佳為10°以上，更佳為20°以上，且較佳為60°以下，更佳為45°以下。若上述頂角之平均值(A)為上述下限以上，則凸部變得不易過度彎折。若上述頂角之平均值(A)為上述上限以下，則熔融溫度進一步降低。再者，存在彎折之凸部於導電連接時使電極間之連接電阻上升之情況。 上述凸部之上述頂角之平均值(A)可藉由將1個含金屬之粒子所含之凸部之各頂角進行平均而求出。 複數個上述凸部之平均高度(B)較佳為5 nm以上，更佳為50 nm以上，且較佳為5000 nm以下，更佳為1000 nm以下，進而較佳為800 nm以下。若上述凸部之平均高度(B)為上述下限以上，則熔融溫度進一步降低。若上述凸部之平均高度(B)為上述上限以下，則凸部變得不易過度彎折。 上述凸部之平均高度(B)係1個含金屬之粒子所含之凸部高度之平均值。上述凸部之高度表示連結含金屬之粒子之中心與凸部之前端之線(圖8所示之虛線L1)上自假定無凸部之情形時之金屬部之假想線(圖8所示之虛線L2)上(假定無凸部之情形時球狀之含金屬之粒子之外表面上)起至凸部之前端為止之距離。即，於圖8中，表示自虛線L1與虛線L2之交點起至凸部之前端為止之距離。 複數個上述凸部之基部之平均徑(C)較佳為3 nm以上，更佳為5 nm以上，進而較佳為50 nm以上，且較佳為5000 nm以下，更佳為1000 nm以下，進而較佳為800 nm以下。若上述平均徑(C)為上述下限以上，則凸部變得不易過度彎折。若上述平均徑(C)為上述上限以下，則連接可靠性進一步提高。 上述凸部之基部之平均徑(C)係1個含金屬之粒子所含之凸部之基部徑之平均值。基部之徑係凸部中之各基部之最大徑。連結含金屬之粒子之中心與凸部之前端之線(圖8所示之虛線L1)上的假定無凸部之情形時之金屬部之假想線部分(圖8所示之虛線L2)之端部為上述凸部之基部，上述假想線部分之端部間距離(以直線連結端部之距離)為基部之徑。 複數個上述凸部之高度之中央位置之平均徑(D)相對於複數個上述凸部之基部之平均徑(C)之比(平均徑(D)/平均徑(C))較佳為1/5以上，更佳為1/4以上，進而較佳為1/3以上，且較佳為4/5以下，更佳為3/4以下，進而較佳為2/3以下。若上述比(平均徑(D)/平均徑(C))為上述下限以上，則凸部變得不易過度彎折。若上述比(平均徑(D)/平均徑(C))為上述上限以下，則連接可靠性進一步提高。 上述凸部之高度之中央位置之平均徑(D)係1個含金屬之粒子所含之凸部之高度的中央位置之徑之平均值。凸部之高度之中央位置之徑係凸部之高度之各中央位置之最大徑。 就抑制凸部之過度彎折，進一步提高利用凸部之熔融接合性，有效地提高連接可靠性之觀點而言，複數個上述凸部之形狀較佳為針狀或球體之一部分之形狀。針狀之形狀較佳為角錐狀、圓錐狀或旋轉抛物面狀，更佳為圓錐狀或旋轉抛物面狀，進而較佳為圓錐狀。上述凸部之形狀可為角錐狀，亦可為圓錐狀，亦可為旋轉抛物面狀。於本發明中，旋轉抛物面狀亦包含於前端變細之針狀中。於旋轉抛物面狀之凸部中，自基部至前端逐漸變細。 每個上述含金屬之粒子之上述金屬部之外表面之凸部較佳為3個以上，更佳為5個以上。上述凸部個數之上限並無特別限定。凸部個數之上限可考慮含金屬之粒子之粒徑等而適當選擇。再者，上述含金屬之粒子所含之凸部亦可不為前端變細之針狀，上述含金屬之粒子所含之凸部無需全部為前端變細之針狀。 每個上述含金屬之粒子所含之凸部個數中前端變細之針狀之凸部個數所占之比率較佳為30%以上，更佳為50%以上，進而較佳為60%以上，尤佳為70%以上，最佳為80%以上。針狀之凸部個數之比率越多，越可更有效地獲得利用針狀之凸部之效果。 金屬部之外表面之表面積整體100%中具有凸部之部分之表面積之比率(X)較佳為10%以上，更佳為20%以上，進而較佳為30%以上，且較佳為90%以下，更佳為80%以下，進而較佳為70%以下。具有凸部之部分之表面積之比率越多，越可更有效地獲得利用凸部上之突起之效果。 就有效地提高連接可靠性之觀點而言，金屬部之外表面之表面積整體100%中具有針狀凸部之部分之表面積之比率較佳為10%以上，更佳為20%以上，進而較佳為30%以上，且較佳為90%以下，更佳為80%以下，進而較佳為70%以下。具有針狀凸部之部分之表面積之比率越多，越可更有效地獲得利用凸部上之突起之效果。 複數個上述凸部之平均高度(B)相對於複數個上述突起之平均高度(b)之比(平均高度(B)/平均高度(b))較佳為5以上，更佳為10以上，且較佳為1000以下，更佳為800以下。若上述比(平均高度(B)/平均高度(b))為上述下限以上，則連接可靠性進一步提高。若上述比(平均高度(B)/平均高度(b))為上述上限以下，則凸部變得不易過度彎折。 較佳為具有複數個上述突起之上述金屬部係藉由金屬或合金之結晶配向所形成。再者，於下述之實施例中，金屬部係藉由金屬或合金之結晶配向所形成。 就有效地提高連接可靠性之觀點而言，將上述含金屬之粒子壓縮10%時之壓縮彈性模數(10%K值)較佳為100 N/mm2
以上，更佳為1000 N/mm2
以上，且較佳為25000 N/mm2
以下，更佳為10000 N/mm2
以下，更佳為8000 N/mm2
以下。 上述含金屬之粒子之上述壓縮彈性模數(10%K值)可以如下方式進行測定。 使用微小壓縮試驗機，於25℃、壓縮速度0.3 mN/秒、及最大試驗荷重20 mN之條件下，以圓柱(直徑100 μm，鑽石製)之平滑壓頭端面壓縮含金屬之粒子。測定此時之荷重值(N)及壓縮位移(mm)。根據所獲得之測定值，藉由下述式可求出上述壓縮彈性模數。作為上述微小壓縮試驗機，例如可使用Fischer公司製造之「Fischerscope H-100」等。 10%K值(N/mm2
)＝(3/21/2
)・F・S-3/2
・R-1/2
F：含金屬之粒子壓縮10%而變形時之荷重值(N) S：含金屬之粒子壓縮10%而變形時之壓縮位移(mm) R：含金屬之粒子之半徑(mm) 較佳為上述突起之X射線繞射中之(111)面之比率為50%以上。 以下，一邊參照圖式，一邊對本發明之具體之實施形態進行說明。 圖1係模式性地表示本發明之第1實施形態之含金屬之粒子的剖視圖。 如圖1所示，含金屬之粒子1具備基材粒子2與金屬部3。 金屬部3係配置於基材粒子2之表面上。含金屬之粒子1係基材粒子2之表面被金屬部3所被覆之被覆粒子。金屬部3係連續皮膜。 含金屬之粒子1於金屬部3之外表面具有複數個突起1a。金屬部3於外表面具有複數個突起3a。複數個突起1a、3a之形狀係前端變細之針狀，於本實施形態中為圓錐狀。於本實施形態中，突起1a、3a之前端能夠以400℃以下熔融。金屬部3具有第1部分、與厚度厚於該第1部分之第2部分。除複數個突起1a、3a以外之部分為金屬部3之上述第1部分。複數個突起1a、3a為金屬部3之厚度較厚之上述第2部分。 圖2係模式性地表示本發明之第2之實施形態之含金屬之粒子的剖視圖。 如圖2所示，含金屬之粒子1A具備基材粒子2與金屬部3A。 金屬部3A係配置於基材粒子2之表面上。含金屬之粒子1A於金屬部3A之外表面具有複數個突起1Aa。金屬部3A於外表面具有複數個突起3Aa。複數個突起1Aa、3Aa之形狀為前端變細之針狀，於本實施形態中為旋轉抛物面狀。於本實施形態中，突起1Aa、3Aa之前端能夠以400℃以下熔融。 如含金屬之粒子1、1A般，上述金屬部中之複數個突起之形狀較佳為前端變細之針狀，可為圓錐狀，亦可為旋轉抛物面狀。 圖3係模式性地表示本發明之第3之實施形態之含金屬之粒子的剖視圖。 如圖3所示，含金屬之粒子1B具備基材粒子2與金屬部3B。 金屬部3B係配置於基材粒子2之表面上。含金屬之粒子1B於金屬部3B之外表面具有複數個突起1Ba。金屬部3B於外表面具有複數個突起3Ba。複數個突起1Ba、3Ba之形狀為球體之一部分之形狀。金屬部3B於外表面上具有以露出一部分之方式嵌埋之金屬粒子3BX。金屬粒子3BX之露出之部分構成突起1Ba、3Ba。於本實施形態中，突起1Ba、3Ba之前端能夠以400℃以下熔融。 如含金屬之粒子1B般，藉由減小突起，突起之形狀亦可不為前端變細之針狀，例如亦可為球體之一部分之形狀。 圖4係模式性地表示本發明之第4之實施形態之含金屬之粒子的剖視圖。 如圖4所示，含金屬之粒子1C具備基材粒子2與金屬部3C。 含金屬之粒子1與含金屬之粒子1C僅金屬部有所不同。即，於含金屬之粒子1中，形成有1層結構之金屬部3，與此相對，於含金屬之粒子1C中，形成有2層結構之金屬部3C。 金屬部3C具有第1金屬部3CA及第2金屬部3CB。第1、第2金屬部3CA、3CB係配置於基材粒子2之表面上。於基材粒子2與第2金屬部3CB之間配置有第1金屬部3CA。因此，於基材粒子2之表面上配置有第1金屬部3CA，於第1金屬部3CA之外表面上配置有第2金屬部3CB。第1金屬部3CA之外形為球狀。含金屬之粒子1C於金屬部3C之外表面具有複數個突起1Ca。金屬部3C於外表面具有複數個突起3Ca。第2金屬部3CB於外表面具有複數個突起。複數個突起1Ca、3Ca之形狀為前端變細之針狀，於本實施形態中為圓錐狀。於本實施形態中，突起1Ca、3Ca之前端能夠以400℃以下熔融。內側之第1金屬部亦可於外表面具有複數個突起。 圖5係模式性地表示本發明之第5之實施形態之含金屬之粒子的剖視圖。 如圖5所示，含金屬之粒子1D具備基材粒子2與金屬部3D。 金屬部3D係配置於基材粒子2之表面上。含金屬之粒子1D於金屬部3D之外表面具有複數個突起1Da。含金屬之粒子1D於金屬部3D之外表面具有複數個凸部(第1突起)3Da。金屬部3D於外表面具有複數個凸部(第1突起)3Da。金屬部3D於凸部(第1突起)3Da之外表面具有小於凸部(第1突起)3Da之突起3Db(第2突起)。凸部(第1突起)3Da與突起3Db(第2突起)係一體化而相連。於本實施形態中，突起3Db(第2突起)之前端徑較小，突起3Db(第2突起)之前端能夠以400℃以下熔融。 圖6係模式性地表示本發明之第6之實施形態之含金屬之粒子的剖視圖。 如圖6所示，含金屬之粒子1E具備基材粒子2、金屬部3E及芯物質4E。 金屬部3E係配置於基材粒子2之表面上。含金屬之粒子1E於金屬部3E之外表面具有複數個突起1Ea。含金屬之粒子1E於金屬部3E之外表面具有複數個凸部(第1突起)3Ea。金屬部3E於外表面具有複數個凸部(第1突起)3Ea。金屬部3E於凸部(第1突起)3Ea之外表面具有小於凸部(第1突起)3Ea之突起3Eb(第2突起)。凸部(第1突起)3Ea與突起3Eb(第2突起)係一體化而相連。於本實施形態中，突起3Eb(第2突起)之前端徑較小，突起3Eb(第2突起)之前端能夠以400℃以下熔融。 複數個芯物質4E係配置於基材粒子2之外表面上。複數個芯物質4E係配置於金屬部3E之內側。複數個芯物質4E係被嵌埋於金屬部3E之內側。芯物質4E係配置於凸部3Ea之內側。金屬部3E被覆複數個芯物質4E。藉由複數個芯物質4E，金屬部3E之外表面鼓起，而形成凸部3Ea。 如含金屬原子之粒子1E般，含金屬之粒子亦可具備使金屬部之外表面鼓起之複數個芯物質。 圖7係模式性地表示本發明之第7之實施形態之含金屬之粒子的剖視圖。 如圖7所示，含金屬之粒子1F具備基材粒子2與金屬部3F。 金屬部3F係配置於基材粒子2之表面上。含金屬之粒子1F於金屬部3F之外表面具有複數個突起1Fa。金屬部3F於凸部(第1突起)3Fa之外表面具有小於凸部(第1突起)3Fa之突起3Fb(第2突起)。凸部(第1突起)3Fa與突起3Fb(第2突起)並未一體化。於本實施形態中，突起3Fb(第2突起)之前端徑較小，突起3Fb(第2突起)之前端能夠以400℃以下熔融。 圖8係模式性地表示本發明之第8之實施形態之含金屬之粒子的剖視圖。 如圖8所示，含金屬之粒子1G具備基材粒子2與金屬部3G。 金屬部3G具有第1金屬部3GA及第2金屬部3GB。第1、第2金屬部3GA、3GB係配置於基材粒子2之表面上。於基材粒子2與第2金屬部3GB之間配置有第1金屬部3GA。因此，於基材粒子2之表面上配置有第1金屬部3GA，於第1金屬部3GA之外表面上配置有第2金屬部3GB。 金屬部3G係配置於基材粒子2之表面上。含金屬之粒子1G於金屬部3G之外表面具有複數個突起1Ga。含金屬之粒子1G於金屬部3G之外表面具有複數個凸部(第1突起)3Ga。金屬部3G於凸部(第1突起)3Ga之外表面具有小於凸部(第1突起)3Ga之突起3Gb(第2突起)。於凸部(第1突起)3Ga與突起3Gb(第2突起)之間存在界面。於本實施形態中，突起3Gb(第2突起)之前端徑較小，突起3Gb(第2突起)之前端能夠以400℃以下熔融。 又，於圖11～14中示出實際所製造之含金屬之粒子之圖像。圖11～14所示之含金屬之粒子於金屬部之外表面具有複數個突起，複數個該突起之前端能夠以400℃以下熔融。於圖14所示之含金屬之粒子中，金屬部於外表面具有複數個凸部，於該凸部之外表面上具有小於上述凸部之突起。 又，於圖15～18中示出使所製造之含金屬之粒子之金屬部之突起熔融後加以固化而成之粒子之圖像。圖18係使圖14所示之含金屬之粒子之金屬部突起之前端熔融後加以固化而成之粒子。 以下，進一步詳細地說明含金屬之粒子。再者，於以下之說明中，「(甲基)丙烯酸」意指「丙烯酸」與「甲基丙烯酸」之一者或兩者，「(甲基)丙烯酸酯」意指「丙烯酸酯」與「甲基丙烯酸酯」之一者或兩者。 [基材粒子] 作為上述基材粒子，可列舉：樹脂粒子、除金屬粒子以外之無機粒子、有機無機混合粒子及金屬粒子等。上述基材粒子可具有核、與配置於該核之表面上之殼，可為核殼粒子。上述基材粒子較佳為除金屬粒子以外之基材粒子，更佳為樹脂粒子、除金屬粒子以外之無機粒子或有機無機混合粒子。 上述基材粒子進而較佳為樹脂粒子或有機無機混合粒子，可為樹脂粒子，亦可為有機無機混合粒子。藉由使用該等較佳之基材粒子，可獲得對於2個連接對象構件之連接用途而言適宜之含金屬之粒子。 若上述基材粒子為樹脂粒子或有機無機混合粒子，則上述含金屬之粒子容易變形，上述含金屬之粒子之柔軟性變高。因此，連接後衝擊吸收性變高。 作為用以形成上述樹脂粒子之樹脂，可適宜地使用各種有機物。作為用以形成上述樹脂粒子之樹脂，例如可列舉：聚乙烯、聚丙烯、聚苯乙烯、聚氯乙烯、聚偏二氯乙烯、聚異丁烯、聚丁二烯等聚烯烴樹脂；聚甲基丙烯酸甲酯、聚丙烯酸甲酯等丙烯酸系樹脂；聚對苯二甲酸烷二酯、聚碳酸酯、聚醯胺、苯酚甲醛樹脂、三聚氰胺甲醛樹脂、苯并胍胺甲醛樹脂、脲甲醛樹脂、酚樹脂、三聚氰胺樹脂、苯并胍胺樹脂、脲樹脂、環氧樹脂、不飽和聚酯樹脂、飽和聚酯樹脂、聚碸、聚苯醚、聚縮醛、聚醯亞胺、聚醯胺醯亞胺、聚醚醚酮、聚醚碸、及使1種或2種以上具有乙烯性不飽和基之各種聚合性單體聚合而獲得之聚合物等。由於可設計及合成適於2個連接對象構件之連接用途之任意具有壓縮時之物性的樹脂粒子，且可容易地將基材粒子之硬度控制於適宜之範圍，因此用以形成上述樹脂粒子之樹脂較佳為使1種或2種以上具有複數個乙烯性不飽和基之聚合性單體聚合而成之聚合物。 於使具有乙烯性不飽和基之聚合性單體聚合而獲得上述樹脂粒子之情形時，作為上述具有乙烯性不飽和基之聚合性單體，可列舉非交聯性之單體及交聯性之單體。 作為上述非交聯性之單體，例如可列舉：苯乙烯、α-甲基苯乙烯等苯乙烯系單體；(甲基)丙烯酸、順丁烯二酸、順丁烯二酸酐等含羧基之單體；(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異𦯉酯等(甲基)丙烯酸烷基酯化合物；(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸甘油酯、聚氧乙烯(甲基)丙烯酸酯、(甲基)丙烯酸縮水甘油酯等含氧原子之(甲基)丙烯酸酯化合物；(甲基)丙烯腈等含有腈之單體；甲基乙烯醚、乙基乙烯醚、丙基乙烯醚等乙烯醚化合物；乙酸乙烯酯、丁酸乙烯酯、月桂酸乙烯酯、硬脂酸乙烯酯等酸乙烯酯化合物；乙烯、丙烯、異戊二烯、丁二烯等不飽和烴；(甲基)丙烯酸三氟甲酯、(甲基)丙烯酸五氟乙酯、氯乙烯、氟乙烯、氯苯乙烯等含有鹵素之單體等。 作為上述交聯性之單體，例如可列舉：四羥甲基甲烷四(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、四羥甲基甲烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、(聚)四亞甲基二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯等多官能(甲基)丙烯酸酯化合物；(異)氰尿酸三烯丙酯、偏苯三酸三烯丙酯、二乙烯苯、鄰苯二甲酸二烯丙酯、二烯丙基丙烯醯胺、二烯丙醚、γ-(甲基)丙烯醯氧基丙基三甲氧基矽烷、三甲氧基矽烷基苯乙烯、乙烯基三甲氧基矽烷等含矽烷之單體等。 藉由利用公知之方法使上述具有乙烯性不飽和基之聚合性單體聚合，可獲得上述樹脂粒子。作為該方法，例如可列舉：於自由基聚合起始劑之存在下進行懸浮聚合之方法；以及使用非交聯之種粒子使單體與自由基聚合起始劑一併膨潤而聚合之方法等。 於上述基材粒子為除金屬粒子以外之無機粒子或有機無機混合粒子之情形時，作為用以形成上述基材粒子之無機物，可列舉：二氧化矽、氧化鋁、鈦酸鋇、氧化鋯及碳黑等。上述無機物較佳為不為金屬。作為上述由二氧化矽形成之粒子，並無特別限定，例如可列舉藉由將具有2個以上水解性之烷氧基矽烷基之矽化合物進行水解而形成交聯聚合物粒子後，視需要進行煅燒而獲得之粒子。作為上述有機無機混合粒子，例如可列舉由經交聯之烷氧基矽烷基聚合物與丙烯酸系樹脂所形成之有機無機混合粒子等。 上述有機無機混合粒子較佳為具有核、與配置於該核之表面上之殼的核殼型之有機無機混合粒子。上述核較佳為有機核。上述殼較佳為無機殼。就有效地提高連接可靠性之觀點而言，上述基材粒子較佳為具有有機核與配置於上述有機核之表面上之無機殼之有機無機混合粒子。 作為用以形成上述無機殼之材料，可列舉用以形成上述之基材粒子之無機物。用以形成上述無機殼之材料較佳為二氧化矽。上述無機殼較佳為藉由在上述核之表面上，利用溶膠凝膠法將金屬烷氧化物製成殼狀物後，將該殼狀物煅燒而形成。上述金屬烷氧化物較佳為矽烷烷氧化物。上述無機殼較佳為由矽烷烷氧化物所形成。 上述核之粒徑較佳為0.5 μm以上，更佳為1 μm以上，且較佳為500 μm以下，更佳為100 μm以下，進而較佳為50 μm以下，尤佳為20 μm以下，最佳為10 μm以下。若上述核之粒徑為上述下限以上及上述上限以下，則可適宜地用於2個連接對象構件之連接用途。例如，若上述核之粒徑為上述下限以上及上述上限以下，則於使用上述含金屬之粒子連接2個連接對象構件之情形時，含金屬之粒子與連接對象構件之接觸面積變得充分地大，且於形成金屬部時變得不易形成凝聚之含金屬之粒子。又，經由含金屬之粒子所連接之2個連接對象構件之間隔不會變得過大，且金屬部不易自基材粒子之表面剝離。 上述核之粒徑於上述核為真球狀之情形時意指直徑，於上述核為真球狀以外之形狀之情形時，意指最大徑。又，核之粒徑意指藉由任意粒徑測定裝置測定核而獲得之平均粒徑。例如，可利用使用雷射光散射、電阻值變化、拍攝後之圖像解析等原理之粒度分佈測定機。 上述殼之厚度較佳為100 nm以上，更佳為200 nm以上，且較佳為5 μm以下，更佳為3 μm以下。若上述殼之厚度為上述下限以上及上述上限以下，則可適宜地用於2個連接對象構件之連接用途。上述殼之厚度係每個基材粒子之平均厚度。藉由溶膠凝膠法之控制，可控制上述殼之厚度。 於上述基材粒子為金屬粒子之情形時，作為用以形成該金屬粒子之金屬，可列舉：銀、銅、鎳、矽、金及鈦等。但是，上述基材粒子較佳為不為金屬粒子。 上述基材粒子之粒徑較佳為0.1 μm以上，更佳為0.5 μm以上，進而較佳為1 μm以上，進而較佳為1.5 μm以上，尤佳為2 μm以上，且較佳為1000 μm以下，更佳為500 μm以下，進而較佳為400 μm以下，進而較佳為100 μm以下，進而較佳為50 μm以下，進而更佳為30 μm以下，尤佳為5 μm以下，最佳為3 μm以下。若上述基材粒子之粒徑為上述下限以上，則連接可靠性進一步提高。進而，於藉由無電解鍍覆於基材粒子之表面形成金屬部時不易凝聚，而不易形成凝聚之含金屬之粒子。若基材粒子之平均粒徑為上述上限以下，則容易將含金屬之粒子充分地壓縮，連接可靠性進一步提高。 上述基材粒子之粒徑於基材粒子為真球狀之情形時表示直徑，於基材粒子不為真球狀之情形時表示最大徑。 就進一步抑制於連接可靠性之熱循環試驗中連接部之龜裂或剝離之產生，進一步抑制應力負荷時之龜裂之產生的觀點而言，上述基材粒子較佳為含有聚矽氧樹脂之粒子(聚矽氧粒子)。上述基材粒子之材料較佳為含有聚矽氧樹脂。 上述聚矽氧粒子之材料較佳為具有自由基聚合性基之矽烷化合物與具有碳數5以上之疏水基之矽烷化合物，或具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物，或兩末端具有自由基聚合性基之矽烷化合物。於使該等材料進行反應之情形時，形成矽氧烷鍵。於所獲得之聚矽氧粒子中，通常殘存自由基聚合性基及碳數5以上之疏水基。藉由使用此種材料，能夠容易地獲得具有0.1 μm以上且500 μm以下之1次粒徑之聚矽氧粒子，並且能夠提高聚矽氧粒子之耐化學品性，且降低透濕性。 於上述具有自由基聚合性基之矽烷化合物中，較佳為自由基聚合性基直接鍵結於矽原子上。上述具有自由基聚合性基之矽烷化合物可僅使用1種，亦可併用2種以上。 上述具有自由基聚合性基之矽烷化合物較佳為烷氧基矽烷化合物。作為上述具有自由基聚合性基之矽烷化合物，可列舉：乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、二甲氧基甲基乙烯基矽烷、二乙氧基甲基乙烯基矽烷、二乙烯基甲氧基乙烯基矽烷、二乙烯基乙氧基乙烯基矽烷、二乙烯基二甲氧基矽烷、二乙烯基二乙氧基矽烷、及1,3-二乙烯基四甲基二矽氧烷等。 於上述具有碳數5以上之疏水基之矽烷化合物中，較佳為碳數5以上之疏水基直接鍵結於矽原子上。上述具有碳數5以上之疏水基之矽烷化合物可僅使用1種，亦可併用2種以上。 上述具有碳數5以上之疏水基之矽烷化合物較佳為烷氧基矽烷化合物。作為上述具有碳數5以上之疏水基之矽烷化合物，可列舉：苯基三甲氧基矽烷、二甲氧基甲基苯基矽烷、二乙氧基甲基苯基矽烷、二甲基甲氧基苯基矽烷、二甲基乙氧基苯基矽烷、六苯基二矽氧烷、1,3,3,5-四甲基-1,1,5,5-四苯基三矽氧烷、1,1,3,5,5-五苯基-1,3,5-三甲基三矽氧烷、六苯基環三矽氧烷、苯基三(三甲基矽烷氧基)矽烷、及八苯基環四矽氧烷等。 於上述具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物中，較佳為自由基聚合性基直接鍵結於矽原子上，且較佳為碳數5以上之疏水基直接鍵結於矽原子上。上述具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物可僅使用1種，亦可併用2種以上。 作為上述具有自由基聚合性基且具有碳數5以上之疏水基之矽烷化合物，可列舉：苯基乙烯基二甲氧基矽烷、苯基乙烯基二乙氧基矽烷、苯基甲基乙烯基甲氧基矽烷、苯基甲基乙烯基乙氧基矽烷、二苯基乙烯基甲氧基矽烷、二苯基乙烯基乙氧基矽烷、苯基二乙烯基甲氧基矽烷、苯基二乙烯基乙氧基矽烷、及1,1,3,3-四苯基-1,3-二乙烯基二矽氧烷等。 於為了獲得聚矽氧粒子而使用上述具有自由基聚合性基之矽烷化合物、與上述具有碳數5以上之疏水基之矽烷化合物之情形時，上述具有自由基聚合性基之矽烷化合物、與上述具有碳數5以上之疏水基之矽烷化合物較佳為以重量比1：1～1：20使用，更佳為以1：5～1：15使用。 於用以獲得聚矽氧粒子之矽烷化合物之整體中，自由基聚合性基之個數與碳數5以上之疏水基之個數較佳為1：0.5～1：20，更佳為1：1～1：15。 就有效地提高耐化學品性，有效地降低透濕性，將10%K值控制於適宜之範圍之觀點而言，上述聚矽氧粒子較佳為具有於1個矽原子上鍵結有2個甲基之二甲基矽氧烷骨架，上述聚矽氧粒子之材料較佳為含有於1個矽原子上鍵結有2個甲基之矽烷化合物。 就有效地提高耐化學品性，有效地降低透濕性，將10%K值控制於適宜之範圍之觀點而言，上述聚矽氧粒子較佳為藉由自由基聚合起始劑使上述之矽烷化合物進行反應而使其形成矽氧烷鍵。一般而言，使用自由基聚合起始劑難以獲得具有0.1 μm以上且500 μm以下之1次粒徑之聚矽氧粒子，尤其難以獲得具有100 μm以下之1次粒徑之聚矽氧粒子。與此相對，即使於使用自由基聚合起始劑之情形時，藉由使用上述矽烷化合物，亦能夠獲得具有0.1 μm以上且500 μm以下之1次粒徑之聚矽氧粒子，且亦能夠獲得具有100 μm以下之1次粒徑之聚矽氧粒子。 為了獲得上述聚矽氧粒子，亦可不使用具有鍵結於矽原子上之氫原子之矽烷化合物。於該情形時，可不使用金屬觸媒，使用自由基聚合起始劑而使矽烷化合物聚合。結果能夠避免於聚矽氧粒子中含有金屬觸媒，能夠減少聚矽氧粒子中之金屬觸媒之含量，進而能夠有效地提高耐化學品性，有效地降低透濕性，將10%K值控制於適宜之範圍。 作為上述聚矽氧粒子之具體之製造方法，有藉由懸浮聚合法、分散聚合法、迷你乳化聚合法、或乳化聚合法等進行矽烷化合物之聚合反應而製作聚矽氧粒子之方法等。進行矽烷化合物之聚合而獲得低聚物後，亦可藉由懸浮聚合法、分散聚合法、迷你乳化聚合法、或乳化聚合法等進行作為聚合物(低聚物等)之矽烷化合物之聚合反應而製作聚矽氧粒子。例如，亦可使具有乙烯基之矽烷化合物聚合，而獲得末端具有鍵結於矽原子上之乙烯基之矽烷化合物。亦可使具有苯基之矽烷化合物聚合，從而作為聚合物(低聚物等)而獲得側鏈具有鍵結於矽原子上之苯基之矽烷化合物。亦可使具有乙烯基之矽烷化合物與具有苯基之矽烷化合物聚合，從而作為聚合物(低聚物等)而獲得末端具有鍵結於矽原子上之乙烯基且側鏈具有鍵結於矽原子上之苯基之矽烷化合物。 聚矽氧粒子亦可於外表面具有複數個粒子。於該情形時，聚矽氧粒子可具備聚矽氧粒子本體、與配置於聚矽氧粒子本體之表面上之複數個粒子。作為上述複數個粒子，可列舉聚矽氧粒子及球狀二氧化矽等。藉由存在上述複數個粒子，而能夠抑制聚矽氧粒子之凝聚。 [金屬部] 上述金屬部之上述突起之前端能夠以400℃以下熔融。就藉由降低熔融溫度，而抑制加熱時之能量之消耗量，進而抑制連接對象構件等之熱劣化之觀點而言，上述金屬部之上述突起之前端較佳為能夠以350℃以下熔融，更佳為能夠以300℃以下熔融，進而較佳為能夠以250℃以下熔融，尤佳為能夠以200℃以下熔融。上述突起之前端之熔融溫度可藉由突起之前端之金屬種類及突起之前端之形狀進行控制。上述凸部之基部、上述突起之高度之中央位置、上述突起之基部、及上述突起之高度之中央位置之熔點亦可超過200℃，亦可超過250℃，亦可超過300℃，亦可超過350℃，亦可超過400℃。上述金屬部、上述凸部及上述突起可具有超過200℃之部分，亦可具有超過250℃之部分，亦可具有超過300℃之部分，亦可具有超過350℃之部分，亦可具有超過400℃之部分。 上述金屬部之材料並無特別限定。上述金屬部之材料較佳為含有金屬。作為該金屬，例如可列舉：金、銀、鈀、銠、銥、鋰、銅、鉑、鋅、鐵、錫、鉛、釕、鋁、鈷、銦、鎳、鉻、鈦、銻、鉍、鉈、鍺、鎘、矽及該等之合金等。又，作為上述金屬，可列舉摻錫氧化銦(ITO)等。 於本發明中，以上述金屬部之突起之前端於400℃以下可熔融之方式選擇金屬部之材料。 就有效地提高連接可靠性之觀點而言，上述突起之材料較佳為含有銀、銅、金、鈀、錫、銦或鋅。上述突起之材料亦可不含錫。 較佳為上述金屬部之材料不為焊料。藉由上述金屬部之材料不為焊料，能夠抑制金屬部整體過度熔融。上述金屬部之材料亦可不含錫。 就有效地提高連接可靠性之觀點而言，上述金屬部之材料較佳為含有銀、銅、金、鈀、錫、銦、鋅、鎳、鈷、鐵、鎢、鉬、釕、鉑、銠、銥、磷或硼，更佳為含有銀、銅、金、鈀、錫、銦或鋅，進而較佳為含有銀。該等較佳之材料可僅使用1種，亦可併用2種以上。就有效地提高連接可靠性之觀點而言，上述銀可以銀單質或氧化銀之形式而含有。作為氧化銀，可列舉Ag2
O及AgO。 含有銀之金屬部100重量%中，銀之含量較佳為0.1重量%以上，更佳為1重量%以上，且較佳為100重量%以下，更佳為90重量%以下，亦可為80重量%以下，亦可為60重量%以下，亦可為40重量%以下，亦可為20重量%以下，亦可為10重量%以下。若銀之含量為上述下限以上及上述上限以下，則接合強度變高，連接可靠性進一步提高。 上述銅可以銅單質或氧化銅之形式而含有。 含有銅之金屬部100重量%中，銅之含量較佳為0.1重量%以上，更佳為1重量%以上，且較佳為100重量%以下，更佳為90重量%以下，亦可為80重量%以下，亦可為60重量%以下，亦可為40重量%以下，亦可為20重量%以下，亦可為10重量%以下。若銅之含量為上述下限以上及上述上限以下，則接合強度變高，連接可靠性進一步提高。 上述金屬部可由一層所形成。上述金屬部亦可由複數層所形成。 亦可對上述金屬部之外表面進行防銹處理。上述含金屬之粒子可於上述金屬部之外表面具有防銹膜。作為防銹處理，可列舉：於金屬部之外表面配置防銹劑之方法、將金屬部之外表面進行合金化而提高耐腐蝕性之方法、於金屬部之外表面塗佈高耐腐蝕金屬膜之方法等。作為上述防銹劑，可列舉：苯并三唑化合物、咪唑化合物等含氮雜環化合物；如硫醇(mercaptan)化合物、噻唑化合物、有機二硫醚化合物之含硫化合物；有機磷酸化合物等含磷化合物。 [防銹處理] 為了抑制含金屬之粒子之腐蝕，降低電極間之連接電阻，較佳為對上述金屬部之外表面進行防銹處理、或耐硫化處理。 作為耐硫化劑、防銹劑或防變色劑，可列舉：苯并三唑化合物、咪唑化合物等含氮雜環化合物；如硫醇(mercaptan)化合物、噻唑化合物、有機二硫醚化合物之含硫化合物；有機磷酸化合物等含磷化合物。 就進一步提高導通可靠性之觀點而言，較佳為藉由具有碳數6～22之烷基之化合物對上述金屬部之外表面進行防銹處理。亦可藉由不含磷之化合物對上述金屬部之表面進行防銹處理，亦可藉由具有碳數6～22之烷基且不含磷之化合物進行防銹處理。就進一步提高導通可靠性之觀點而言，較佳為藉由烷基磷酸化合物或烷基硫醇對上述金屬部之外表面進行防銹處理。藉由防銹處理，可於上述金屬部之外表面形成防銹膜。 上述防銹膜較佳為由具有碳數6～22之烷基之化合物(以下亦稱為化合物A)所形成。較佳為藉由上述化合物A對上述金屬部之外表面進行表面處理。若上述烷基之碳數為6以上，則金屬部整體更不易生銹。若上述烷基之碳數為22以下，則含金屬之粒子之導電性變高。就進一步提高含金屬之粒子之導電性的觀點而言，上述化合物A中之上述烷基之碳數較佳為16以下。上述烷基可具有直鏈結構，亦可具有分支結構。上述烷基較佳為具有直鏈結構。 上述化合物A只要具有碳數6～22之烷基，則無特別限定。上述化合物A較佳為具有碳數6～22之烷基之磷酸酯或其鹽、具有碳數6～22之烷基之亞磷酸酯或其鹽、具有碳數6～22之烷基之烷氧基矽烷、具有碳數6～22之烷基之烷基硫醇、或者具有碳數6～22之烷基之二烷基二硫醚。即，上述具有碳數6～22之烷基之化合物A較佳為磷酸酯或其鹽、亞磷酸酯或其鹽、烷氧基矽烷、烷基硫醇、或者二烷基二硫醚。藉由使用該等較佳之化合物A，能夠使金屬部變得更不易生銹。就使其更不易生銹之觀點而言，上述化合物A較佳為上述磷酸酯或其鹽、亞磷酸酯或其鹽、或者烷基硫醇，更佳為上述磷酸酯或其鹽、或者亞磷酸酯或其鹽。上述化合物A可僅使用1種，亦可併用2種以上。 上述化合物A較佳為具有能夠與上述金屬部之外表面反應之反應性官能基。於上述含金屬之粒子具備配置於上述金屬部之外表面上之絕緣性物質之情形時，較佳為上述化合物A具有能夠與上述絕緣性物質反應之反應性官能基。較佳為上述防銹膜與上述金屬部進行化學結合。較佳為上述防銹膜與上述絕緣性物質進行化學結合。更佳為上述防銹膜與上述金屬部及上述絕緣性物質之兩者進行化學結合。藉由上述反應性官能基之存在，以及藉由上述化學結合，變得不易產生上述防銹膜之剝離，其結果為，金屬部更不易生銹，且絕緣性物質更不易無意識地自含金屬之粒子之表面脫離。 作為上述具有碳數6～22之烷基之磷酸酯或其鹽，例如可列舉：磷酸己酯、磷酸庚酯、磷酸單辛酯、磷酸單壬酯、磷酸單癸酯、磷酸單十一烷基酯、磷酸單十二烷基酯、磷酸單十三烷基酯、磷酸單十四烷基酯、磷酸單十五烷基酯、磷酸單己酯單鈉鹽、磷酸單庚酯單鈉鹽、磷酸單辛酯單鈉鹽、磷酸單壬酯單鈉鹽、磷酸單癸酯單鈉鹽、磷酸單十一烷基酯單鈉鹽、磷酸單十二烷基酯單鈉鹽、磷酸單十三烷基酯單鈉鹽、磷酸單十四烷基酯單鈉鹽及磷酸單十五烷基酯單鈉鹽等。亦可使用上述磷酸酯之鉀鹽。 作為上述具有碳數6～22之烷基之亞磷酸酯或其鹽，例如可列舉：亞磷酸己酯、亞磷酸庚酯、亞磷酸單辛酯、亞磷酸單壬酯、亞磷酸單癸酯、亞磷酸單十一烷基酯、亞磷酸單十二烷基酯、亞磷酸單十三烷基酯、亞磷酸單十四烷基酯、亞磷酸單十五烷基酯、亞磷酸單己酯單鈉鹽、亞磷酸單庚酯單鈉鹽、亞磷酸單辛酯單鈉鹽、亞磷酸單壬酯單鈉鹽、亞磷酸單癸酯單鈉鹽、亞磷酸單十一烷基酯單鈉鹽、亞磷酸單十二烷基酯單鈉鹽、亞磷酸單十三烷基酯單鈉鹽、亞磷酸單十四烷基酯單鈉鹽及亞磷酸單十五烷基酯單鈉鹽等。亦可使用上述亞磷酸酯之鉀鹽。 作為上述具有碳數6～22之烷基之烷氧基矽烷，例如可列舉：己基三甲氧基矽烷、己基三乙氧基矽烷、庚基三甲氧基矽烷、庚基三乙氧基矽烷、辛基三甲氧基矽烷、辛基三乙氧基矽烷、壬基三甲氧基矽烷、壬基三乙氧基矽烷、癸基三甲氧基矽烷、癸基三乙氧基矽烷、十一烷基三甲氧基矽烷、十一烷基三乙氧基矽烷、十二烷基三甲氧基矽烷、十二烷基三乙氧基矽烷、十三烷基三甲氧基矽烷、十三烷基三乙氧基矽烷、十四烷基三甲氧基矽烷、十四烷基三乙氧基矽烷、十五烷基三甲氧基矽烷及十五烷基三乙氧基矽烷等。 作為上述具有碳數6～22之烷基之烷基硫醇，例如可列舉：己基硫醇、庚基硫醇、辛基硫醇、壬基硫醇、癸基硫醇、十一烷基硫醇、十二烷基硫醇、十三烷基硫醇、十四烷基硫醇、十五烷基硫醇及十六烷基硫醇等。上述烷基硫醇較佳為於烷基鏈之末端具有硫醇基。 作為上述具有碳數6～22之烷基之二烷基二硫醚，例如可列舉：二己基二硫醚、二庚基二硫醚、二辛基二硫醚、二壬基二硫醚、二癸基二硫醚、二(十一烷基)二硫醚、二(十二烷基)二硫醚、二(十三烷基)二硫醚、二(十四烷基)二硫醚、二(十五烷基)二硫醚及二(十六烷基)二硫醚等。 就進一步提高導通可靠性之觀點而言，較佳為藉由以硫醚化合物或硫醇化合物作為主成分之含硫化合物、苯并三唑化合物或聚氧乙烯醚界面活性劑之任一者之層對上述金屬部之外表面進行耐硫化處理。藉由耐硫化處理，可於上述金屬部之外表面形成防銹膜。 作為上述硫醚化合物，可列舉：二己基硫醚、二庚基硫醚、二辛基硫醚、二癸基硫醚、二(十二烷基)硫醚、二(十四烷基)硫醚、二(十六烷基)硫醚、二(十八烷基)硫醚等碳數6～40左右(較佳為碳數10～40左右)之直鏈狀或支鏈狀之二烷基硫醚(烷基硫醚)；二苯基硫醚、苯基對甲苯基硫醚、4,4-硫代雙苯硫醇等碳數12～30左右之芳香族硫醚；3,3'-硫代二丙酸、4,4'-硫代二丁酸等硫代二羧酸等。上述硫醚化合物尤佳為二烷基硫醚。 作為上述硫醇化合物，可列舉：2-巰基苯并噻唑、2-巰基苯并㗁唑、2-巰基苯并咪唑、2-甲基-2-丙硫醇或十八烷基硫醇等碳數4～40左右(更佳為6～20左右)之直鏈狀或支鏈狀之烷基硫醇等。又，可列舉鍵結於該等化合物之碳基上之氫原子被取代為氟之化合物等。 作為上述苯并三唑化合物，可列舉：苯并三唑、苯并三唑鹽、甲基苯并三唑、羧基苯并三唑及苯并三唑衍生物等。 又，作為上述防變色劑，可列舉：北池產業公司製造之商品名「AC-20」、「AC-70」、「AC-80」、Meltex公司製造之商品名「ENTEK CU-56」、大和化成公司製造之商品名「New Dain Silver」、「New Dain Silver S-1」、Chiyoda Chemical公司製造之商品名「B-1057」、及Chiyoda Chemical公司製造之商品名「B-1009NS」等。 於上述基材粒子之表面上形成金屬部之方法並無特別限定。作為形成金屬部之方法，例如可列舉：利用無電解鍍覆之方法、利用電鍍之方法、利用物理蒸鍍之方法、以及將含有金屬粉末或金屬粉末與黏合劑之糊劑塗佈於基材粒子之表面之方法等。由於金屬部之形成簡便，因此較佳為利用無電解鍍覆之方法。作為上述利用物理蒸鍍之方法，可列舉真空蒸鍍、離子鍍覆及離子濺鍍等方法。 作為於金屬部之外表面形成具有前端變細之針狀之形狀的突起之方法，可列舉下述之方法。 可列舉：使用肼作為還原劑之利用無電解鍍高純度鎳之方法、使用肼作為還原劑之利用無電解鈀-鎳合金之方法、使用次磷酸化合物作為還原劑之無電解鍍CoNiP合金之方法、使用肼作為還原劑之利用無電解鍍銀之方法、以及使用次磷酸化合物作為還原劑之利用無電解鍍銅-鎳-磷合金之方法等。 於藉由無電解鍍覆形成之方法中，通常進行觸媒化步驟、與無電解鍍覆步驟。以下，對藉由無電解鍍覆而於樹脂粒子之表面形成包含銅及鎳之合金鍍覆層以及於金屬部之外表面形成具有前端變細之針狀之形狀的突起之方法之例進行說明。 於上述觸媒化步驟中，於樹脂粒子之表面形成成為用以藉由無電解鍍覆形成鍍覆層之起點之觸媒。 作為於樹脂粒子之表面形成上述觸媒之方法，例如可列舉：於含有氯化鈀與氯化錫之溶液中添加樹脂粒子後，藉由酸溶液或鹼溶液將樹脂粒子之表面活化，而使鈀析出至樹脂粒子之表面之方法；以及於含有硫酸鈀與胺基吡啶之溶液中添加樹脂粒子後，藉由含有還原劑之溶液將樹脂粒子之表面活化，而使鈀析出至樹脂粒子之表面之方法等。作為上述還原劑，可使用含磷還原劑。又，藉由使用含磷還原劑作為上述還原劑，可形成含有磷之金屬部。 於上述無電解鍍覆步驟中，於使用含有含銅化合物、錯合劑及還原劑之鍍覆液之無電解鍍銅-鎳-磷合金方法中，較佳為使用含有次磷酸化合物作為還原劑，含有含鎳化合物作為還原劑之反應起始金屬觸媒，且含有非離子界面活性劑之銅-鎳-磷合金鍍覆液。 藉由將樹脂粒子浸漬於銅-鎳-磷合金鍍浴中，可使銅-鎳-磷合金析出至表面形成有觸媒之樹脂粒子之表面，而可形成含有銅、鎳及磷之金屬部。 作為上述含銅化合物，可列舉：硫酸銅、氯化銅、及硝酸銅等。上述含銅化合物較佳為硫酸銅。 作為上述含鎳化合物，可列舉：硫酸鎳、氯化鎳、碳酸鎳、胺基磺酸鎳、及硝酸鎳等。上述含鎳化合物較佳為硫酸鎳。 作為上述含磷還原劑，可列舉：次磷酸、及次磷酸鈉等。除了上述含磷還原劑以外，亦可使用含硼還原劑。作為上述含硼還原劑，可列舉：二甲胺硼烷、硼氫化鈉及硼氫化鉀等。 上述錯合劑較佳為：乙酸鈉、丙酸鈉等單羧酸錯合劑；丙二酸二鈉等二羧酸錯合劑；丁二酸二鈉等三羧酸錯合劑；乳酸、DL-蘋果酸、羅謝耳鹽(Rochelle salt)、檸檬酸鈉、葡萄糖酸鈉等羥酸錯合劑；甘胺酸、EDTA(ethylenediamine tetraacetic acid，四乙酸乙二胺)等胺基酸錯合劑；乙二胺等胺錯合劑；順丁烯二酸等有機酸錯合劑；或該等之鹽。該等較佳之錯合劑可僅使用1種，亦可併用2種以上。 作為上述界面活性劑，可列舉：陰離子界面活性劑、陽離子界面活性劑、非離子界面活性劑或兩性界面活性劑，尤其是非離子界面活性劑較為適宜。較佳之非離子界面活性劑係含有醚氧原子之聚醚。作為較佳之非離子界面活性劑，可列舉：聚氧乙烯月桂醚、聚乙二醇、聚丙二醇、聚氧乙烯烷基醚、聚氧乙烯聚氧丙二醇、聚氧乙烯壬基苯醚、聚氧乙烯聚氧丙烯烷基胺、及乙二胺之聚氧伸烷基加成物等。較佳為聚氧乙烯單丁醚、聚氧丙烯單丁醚、聚氧乙烯聚氧丙二醇單丁醚等聚氧乙烯單烷基醚、聚乙二醇或酚乙氧化物。上述界面活性劑可僅使用1種，亦可併用2種以上。尤佳為分子量1000左右(例如500以上且2000以下)之聚乙二醇。 為了於金屬部之外表面形成具有前端變細之針狀之形狀的突起，較理想為控制銅化合物與鎳化合物之莫耳比。上述銅化合物之使用量以相對於鎳化合物之莫耳比計較佳為2倍至100倍。 又，即使不使用上述非離子界面活性劑等，亦可獲得具有針狀之形狀之突起。為了形成以頂角更銳利之方式前端變細之形狀之突起，較佳為使用非離子界面活性劑，尤佳為使用分子量1000左右(例如500以上且2000以下)之聚乙二醇。 複數個突起之平均高度(b)相對於複數個上述突起之基部之平均徑(c)之比(平均高度(b)/平均徑(c))取決於金屬部之厚度，可藉由在鍍浴中之浸漬時間加以控制。鍍覆溫度較佳為30℃以上，且較佳為100℃以下，又，於鍍浴中之浸漬時間較佳為5分鐘以上。 繼而，對藉由無電解鍍覆而於樹脂粒子之表面形成鍍銀層及於金屬部之外表面形成具有前端變細之針狀之形狀的突起之方法之例進行說明。 於上述觸媒化步驟中，於樹脂粒子之表面形成成為用以藉由無電解鍍覆形成鍍覆層之起點之觸媒。 作為於樹脂粒子之表面形成上述觸媒之方法，例如可列舉：於含有氯化鈀與氯化錫之溶液中添加樹脂粒子後，藉由酸溶液或鹼溶液將樹脂粒子之表面活化，而使鈀析出至樹脂粒子之表面之方法；以及於含有硫酸鈀與胺基吡啶之溶液中添加樹脂粒子後，藉由含有還原劑之溶液將樹脂粒子之表面活化，而使鈀析出至樹脂粒子之表面之方法等。作為上述還原劑，可使用含磷還原劑。又，藉由使用含磷還原劑作為上述還原劑，可形成含有磷之金屬部。 於上述無電解鍍覆步驟中，於使用含有含銀化合物、錯合劑及還原劑之鍍覆液之無電解鍍銀方法中，較佳為使用含有作為還原劑之肼、非離子界面活性劑及含硫有機化合物之鍍銀液。 藉由將樹脂粒子浸漬於銀鍍浴中，可使銀析出至表面形成有觸媒之樹脂粒子之表面，而可形成含有銀之金屬部。 作為上述含銀化合物，較佳為氰化銀鉀、硝酸銀、硫代硫酸銀鈉、葡萄糖酸銀、銀-半胱胺酸錯合物、甲磺酸銀。 作為上述還原劑，可列舉：肼、次磷酸鈉、二甲胺硼烷、硼氫化鈉及硼氫化鉀、福馬林、葡萄糖等。 作為用以形成具有針狀之形狀之突起的還原劑，較佳為肼一水合物、鹽酸肼、及硫酸肼。 上述錯合劑較佳為：乙酸鈉、丙酸鈉等單羧酸系錯合劑；丙二酸二鈉等二羧酸系錯合劑；丁二酸二鈉等三羧酸系錯合劑；乳酸、DL-蘋果酸、羅謝耳鹽、檸檬酸鈉、葡萄糖酸鈉等羥酸系錯合劑；甘胺酸、EDTA等胺基酸系錯合劑；乙二胺等胺系錯合劑；順丁烯二酸等有機酸系錯合劑；或該等之鹽。該等較佳之錯合劑可僅使用1種，亦可併用2種以上。 作為上述界面活性劑，可列舉：陰離子界面活性劑、陽離子界面活性劑、非離子界面活性劑或兩性界面活性劑，尤其是非離子界面活性劑較為適宜。較佳之非離子界面活性劑係含有醚氧原子之聚醚。作為較佳之非離子界面活性劑，可列舉：聚氧乙烯月桂醚、聚乙二醇、聚丙二醇、聚氧乙烯烷基醚、聚氧乙烯聚氧丙二醇、聚氧乙烯壬基苯醚、聚氧乙烯聚氧丙烯烷基胺、及乙二胺之聚氧伸烷基加成物等。較佳為聚氧乙烯單丁醚、聚氧丙烯單丁醚、聚氧乙烯聚氧丙二醇單丁醚等聚氧乙烯單烷基醚、聚乙二醇或酚乙氧化物。上述界面活性劑可僅使用1種，亦可併用2種以上。尤佳為分子量1000左右(例如500以上且2000以下)之聚乙二醇。 又，即使不使用上述非離子界面活性劑等，亦可獲得具有針狀之形狀之突起。為了形成以頂角更銳利之方式前端變細之形狀之突起，較佳為使用非離子界面活性劑，尤佳為使用分子量1000左右(例如500以上且2000以下)之聚乙二醇。 作為上述含硫有機化合物，可列舉：具有硫醚或磺酸基之有機化合物、硫脲化合物、及苯并噻唑化合物等。作為上述具有硫醚或磺酸基之有機化合物，可列舉：N,N-二甲基二硫代胺基甲酸3-磺基丙酯、3-巰基丙磺酸3-磺基丙酯、3-巰基丙磺酸鈉鹽、3-巰基-1-丙磺酸鉀鹽、二硫代碳酸-o-乙酯、雙磺丙基二硫醚、雙(3-磺丙基)-二硫醚-二鈉鹽、3-(苯并噻唑基-s-硫代)丙磺酸鈉鹽、吡啶鎓丙基磺基甜菜鹼、1-鈉-3-巰基丙烷-1-磺酸鹽、N,N-二甲基二硫代胺基甲酸3-磺基乙酯、3-巰基乙基丙磺酸3-磺基乙酯、3-巰基乙基磺酸鈉鹽、3-巰基-1-乙磺酸鉀鹽、二硫代碳酸-o-乙酯-s-酯、雙磺基乙基二硫醚、3-(苯并噻唑基-s-硫代)乙基磺酸鈉鹽、吡啶鎓乙基磺基甜菜鹼、1-鈉-3-巰基乙烷-1-磺酸鹽、及硫脲化合物等。作為上述硫脲化合物，可列舉：硫脲、1,3-二甲基硫脲、三甲基硫脲、二乙基硫脲、及烯丙基硫脲等。 又，即使不使用上述含硫有機化合物等，亦可獲得具有針狀之形狀之突起。為了形成以頂角更銳利之方式前端變細之形狀之突起，較佳為使用含硫有機化合物，尤佳為使用硫脲。 複數個突起之平均高度(b)相對於複數個上述突起之基部之平均徑(c)之比(平均高度(b)/平均徑(c))取決於金屬部之厚度，可藉由在鍍浴中之浸漬時間加以控制。鍍覆溫度較佳為30℃以上，且較佳為100℃以下，又，於鍍浴中之浸漬時間較佳為5分鐘以上。 繼而，對藉由無電解鍍覆而於樹脂粒子之表面形成高純度鎳鍍覆層及於金屬部之外表面形成具有前端變細之針狀之形狀的突起之方法之例進行說明。 於上述觸媒化步驟中，於樹脂粒子之表面形成成為用以藉由無電解鍍覆形成鍍覆層之起點之觸媒。 作為於樹脂粒子之表面形成上述觸媒之方法，例如可列舉：於含有氯化鈀與氯化錫之溶液中添加樹脂粒子後，藉由酸溶液或鹼溶液將樹脂粒子之表面活化，而使鈀析出至樹脂粒子之表面之方法；以及於含有硫酸鈀與胺基吡啶之溶液中添加樹脂粒子後，藉由含有還原劑之溶液將樹脂粒子之表面活化，而使鈀析出至樹脂粒子之表面之方法等。作為上述還原劑，可使用含磷還原劑。又，藉由使用含磷還原劑作為上述還原劑，可形成含有磷之金屬部。 於上述無電解鍍覆步驟中，於使用含有含鎳化合物、錯合劑及還原劑之鍍覆液之無電解鍍高純度鎳方法中，可適宜地使用含有肼作為還原劑之高純度鎳鍍覆液。 藉由將樹脂粒子浸漬於高純度鎳鍍浴中，可使高純度鎳鍍覆析出至表面形成有觸媒之樹脂粒子之表面，而可形成高純度鎳之金屬部。 作為上述含鎳化合物，可列舉：硫酸鎳、氯化鎳、碳酸鎳、胺基磺酸鎳、及硝酸鎳等。上述含鎳化合物較佳為氯化鎳。 作為上述之還原劑，可列舉：肼一水合物、鹽酸肼、及硫酸肼。上述之還原劑較佳為肼一水合物。 作為上述錯合劑，可列舉：乙酸鈉、丙酸鈉等單羧酸系錯合劑；丙二酸二鈉等二羧酸系錯合劑；丁二酸二鈉等三羧酸系錯合劑；乳酸、DL-蘋果酸、羅謝耳鹽、檸檬酸鈉、葡萄糖酸鈉等羥酸系錯合劑；甘胺酸、EDTA等胺基酸系錯合劑；乙二胺等胺系錯合劑；順丁烯二酸等有機酸系錯合劑等。上述錯合劑較佳為作為胺基酸系錯合劑之甘胺酸。 為了於金屬部之外表面形成具有前端變細之針狀之形狀的突起，較佳為將鍍覆液之pH值調整為8.0以上。於使用肼作為還原劑之無電解鍍覆液中，於藉由肼之氧化反應將鎳還原時伴隨著pH值之急遽降低。為了抑制上述之pH值之急遽降低，較佳為使用磷酸、硼酸、碳酸等緩衝劑。上述緩衝劑較佳為具有pH值為8.0以上之緩衝作用之效果的硼酸。 複數個突起之平均高度(b)相對於複數個上述突起之基部之平均徑(c)之比(平均高度(b)/平均徑(c))取決於金屬部之厚度，可藉由在鍍浴中之浸漬時間加以控制。鍍覆溫度較佳為30℃以上，且較佳為100℃以下，又，於鍍浴中之浸漬時間較佳為5分鐘以上。 繼而，對藉由無電解鍍覆而於樹脂粒子之表面形成鈀-鎳合金鍍覆層及於金屬部之外表面形成具有前端變細之針狀之形狀的突起之方法之例進行說明。 於上述觸媒化步驟中，於樹脂粒子之表面形成成為用以藉由無電解鍍覆形成鍍覆層之起點之觸媒。 作為於樹脂粒子之表面形成上述觸媒之方法，例如可列舉：於含有氯化鈀與氯化錫之溶液中添加樹脂粒子後，藉由酸溶液或鹼溶液將樹脂粒子之表面活化，而使鈀析出至樹脂粒子之表面之方法；以及於含有硫酸鈀與胺基吡啶之溶液中添加樹脂粒子後，藉由含有還原劑之溶液將樹脂粒子之表面活化，而使鈀析出至樹脂粒子之表面之方法等。作為上述還原劑，可使用含磷還原劑。又，藉由使用含磷還原劑作為上述還原劑，可形成含有磷之金屬部。 於上述無電解鍍覆步驟中，於使用含有含鎳化合物、鈀化合物、穩定劑、錯合劑及還原劑之鍍覆液之無電解鍍鈀-鎳方法中，可適宜地使用含有肼作為還原劑之鈀-鎳合金鍍覆液。 藉由將樹脂粒子浸漬於鈀-鎳合金鍍浴中，可使鈀-鎳合金鍍覆析出至表面形成有觸媒之樹脂粒子之表面，而可形成鈀-鎳之金屬部。 作為上述含鎳化合物，可列舉：硫酸鎳、氯化鎳、碳酸鎳、胺基磺酸鎳、及硝酸鎳等。上述含鎳化合物較佳為硫酸鎳。 作為上述含鈀化合物，可列舉：二氯乙二胺鈀(II)、氯化鈀、二氯二氨合鈀(II)、二硝基二氨合鈀(II)、四氨合鈀(II)硝酸鹽、四氨合鈀(II)硫酸鹽、草酸基二氨合鈀(II)、四氨合鈀(II)草酸鹽、及四氨合氯化鈀(II)等。上述含鈀化合物較佳為氯化鈀。 作為上述穩定劑，可列舉：鉛化合物、鉍化合物、及鉈化合物等。作為該等化合物，具體而言，可列舉：構成化合物之金屬(鉛、鉍、鉈)之硫酸鹽、碳酸鹽、乙酸鹽、硝酸鹽、及鹽酸鹽等。若考慮對環境之影響，則較佳為鉍化合物或鉈化合物。該等較佳之穩定劑可僅使用1種，亦可併用2種以上。 作為上述之還原劑，可列舉：肼一水合物、鹽酸肼、及硫酸肼。上述之還原劑較佳為肼一水合物。 作為上述錯合劑，可列舉：乙酸鈉、丙酸鈉等單羧酸系錯合劑；丙二酸二鈉等二羧酸系錯合劑；丁二酸二鈉等三羧酸系錯合劑；乳酸、DL-蘋果酸、羅謝耳鹽、檸檬酸鈉、葡萄糖酸鈉等羥酸系錯合劑；甘胺酸、EDTA等胺基酸系錯合劑；乙二胺等胺系錯合劑；順丁烯二酸等有機酸系錯合劑等。上述錯合劑較佳為作為胺基酸系錯合劑之乙二胺。 為了於金屬部之外表面形成具有前端變細之針狀之形狀的突起，較佳為將鍍覆液之pH值調整為8.0至10.0。若pH值為7.5以下，則鍍覆液之穩定性降低，而引起浴分解，因此較佳為將pH值設為8.0以上。 複數個突起之平均高度(b)相對於複數個上述突起之基部之平均徑(c)之比(平均高度(b)/平均徑(c))取決於金屬部之厚度，可藉由在鍍浴中之浸漬時間加以控制。鍍覆溫度較佳為30℃以上，且較佳為100℃以下，又，於鍍浴中之浸漬時間較佳為5分鐘以上。 繼而，對藉由無電解鍍覆而於樹脂粒子之表面形成含有鈷與鎳之合金鍍覆層及於金屬部之外表面形成具有前端變細之針狀之形狀的突起之方法之一例進行說明。 於上述觸媒化步驟中，於樹脂粒子之表面形成成為用以藉由無電解鍍覆形成鍍覆層之起點之觸媒。 作為於樹脂粒子之表面形成上述觸媒之方法，例如可列舉：於含有氯化鈀與氯化錫之溶液中添加樹脂粒子後，藉由酸溶液或鹼溶液將樹脂粒子之表面活化，而使鈀析出至樹脂粒子之表面之方法；以及於含有硫酸鈀與胺基吡啶之溶液中添加樹脂粒子後，藉由含有還原劑之溶液將樹脂粒子之表面活化，而使鈀析出至樹脂粒子之表面之方法等。作為上述還原劑，可使用含磷還原劑。又，藉由使用含磷還原劑作為上述還原劑，可形成含有磷之金屬部。 於上述無電解鍍覆步驟中，於使用含有含鈷化合物、無機添加劑、錯合劑及還原劑之鍍覆液之無電解鈷-鎳-磷合金鍍覆方法中，可適宜地使用含有次磷酸化合物作為還原劑，且含有含鈷化合物作為還原劑之反應起始金屬觸媒之鈷-鎳-磷合金鍍覆液。 藉由將樹脂粒子浸漬於鈷-鎳-磷合金鍍浴中，可使鈷-鎳-磷合金析出至表面形成有觸媒之樹脂粒子之表面，而可形成含有鈷、鎳、及磷之金屬部。 上述含鈷化合物較佳為硫酸鈷、氯化鈷、硝酸鈷、乙酸鈷、或碳酸鈷。上述含鈷化合物更佳為硫酸鈷。 作為上述含鎳化合物，可列舉：硫酸鎳、氯化鎳、碳酸鎳、胺基磺酸鎳、及硝酸鎳等。上述含鎳化合物較佳為硫酸鎳。 作為上述含磷還原劑，可列舉：次磷酸、及次磷酸鈉等。除了上述含磷還原劑以外，亦可使用含硼還原劑。作為上述含硼還原劑，可列舉：二甲胺硼烷、硼氫化鈉及硼氫化鉀等。 上述錯合劑較佳為：乙酸鈉、丙酸鈉等單羧酸系錯合劑；丙二酸二鈉等二羧酸系錯合劑；丁二酸二鈉等三羧酸系錯合劑；乳酸、DL-蘋果酸、羅謝耳鹽、檸檬酸鈉、葡萄糖酸鈉等羥酸系錯合劑；甘胺酸、EDTA等胺基酸系錯合劑；乙二胺等胺系錯合劑；順丁烯二酸等有機酸系錯合劑；或該等之鹽。該等較佳之錯合劑可僅使用1種，亦可併用2種以上。 上述無機添加劑較佳為硫酸銨、氯化銨、或硼酸。該等較佳之無機添加劑可僅使用1種，亦可併用2種以上。認為上述無機添加劑發揮促進無電解鈷鍍覆層之析出之作用。 為了於金屬部之外表面形成具有前端變細之針狀之形狀的突起，較理想為控制鈷化合物與鎳化合物之莫耳比。上述之鈷化合物之使用量以相對於鎳化合物之莫耳比計較佳為2倍至100倍。 又，即使不使用上述之無機添加劑，亦可獲得具有針狀之形狀之突起。為了形成頂角更小、前端銳利地變細之形狀之突起，較佳為使用無機添加劑，尤佳為使用硫酸銨。 複數個突起之平均高度(b)相對於複數個上述突起之基部之平均徑(c)之比(平均高度(b)/平均徑(c))取決於金屬部之厚度，可藉由在鍍浴中之浸漬時間加以控制。鍍覆溫度較佳為30℃以上，且較佳為100℃以下，又，於鍍浴中之浸漬時間較佳為5分鐘以上。 上述無突起之部分中之金屬部整體之厚度較佳為5 nm以上，更佳為10 nm以上，進而較佳為20 nm以上，尤佳為50 nm以上，且較佳為1000 nm以下，更佳為800 nm以下，進而較佳為500 nm以下，尤佳為400 nm以下。上述無凸部之部分中之金屬部整體之厚度較佳為5 nm以上，更佳為10 nm以上，進而較佳為20 nm以上，尤佳為50 nm以上，且較佳為1000 nm以下，更佳為800 nm以下，進而較佳為500 nm以下，尤佳為400 nm以下。若金屬部整體之厚度為上述下限以上，則可抑制金屬部之剝離。若金屬部整體之厚度為上述上限以下，則基材粒子與金屬部之熱膨脹率之差變小，金屬部變得不易自基材粒子剝離。上述金屬部之厚度於金屬部具有複數個金屬部(第1金屬部與第2金屬部)之情形時，表示金屬部整體之厚度(第1、第2金屬部之合計之厚度)。 於上述金屬部具有複數個金屬部之情形時，最外層之上述無突起之部分中之金屬部之厚度較佳為1 nm以上，更佳為10 nm以上，且較佳為500 nm以下，更佳為100 nm以下。於上述金屬部具有複數個金屬部之情形時，最外層之上述無凸部之部分中之金屬部之厚度較佳為1 nm以上，更佳為10 nm以上，且較佳為500 nm以下，更佳為100 nm以下。若上述最外層之金屬部之厚度為上述下限以上及上述上限以下，則可使利用最外層之金屬部之被覆變得均勻，耐腐蝕性變得充分高，且電極間之連接電阻變得充分低。又，於上述最外層較內層之金屬部更昂貴之情形時，最外層之厚度越薄，成本越低。 上述金屬部之厚度可藉由例如使用穿透式電子顯微鏡(transmission electron microscope，TEM)觀察含金屬之粒子之剖面而測定。 [芯物質] 上述含金屬之粒子較佳為具備複數個使上述金屬部之表面鼓起之芯物質，更佳為於上述金屬部內具備複數個使上述金屬部之表面鼓起之芯物質，以形成複數個上述凸部或複數個上述突起。藉由將上述芯物質嵌埋於上述金屬部中，而容易使上述金屬部於外表面具有複數個上述凸部或複數個突起。但是，為了於含金屬之粒子及金屬部之外表面形成凸部或突起，亦可未必使用芯物質。例如，作為不使用芯物質，藉由無電解鍍覆形成凸部或突起之方法，可列舉藉由無電解鍍覆產生金屬核，使金屬核附著於基材粒子或金屬部之表面，進而藉由無電解鍍覆形成金屬部之方法等。 作為形成上述凸部或突起之方法，可列舉：使芯物質附著於基材粒子之表面後，藉由無電解鍍覆形成金屬部之方法；以及藉由無電解鍍覆而於基材粒子之表面形成金屬部後，使芯物質附著，進而藉由無電解鍍覆形成金屬部之方法等。 作為將芯物質配置於上述基材粒子之表面上之方法，例如可列舉：於基材粒子之分散液中添加芯物質，藉由例如凡得瓦爾力使芯物質集成並附著於基材粒子之表面之方法；以及於裝有基材粒子之容器中添加芯物質，藉由利用容器之旋轉等之機械作用使芯物質附著於基材粒子之表面之方法等。其中，由於容易控制所附著之芯物質之量，故而較佳為使芯物質集成並附著於分散液中之基材粒子之表面之方法。 藉由將上述芯物質嵌埋於上述金屬部中，而容易使上述金屬部於外表面具有複數個上述凸部或複數個突起。但是，為了於含金屬之粒子之導電性之表面及金屬部之表面形成凸部或突起，亦可未必使用芯物質。 作為形成上述凸部或突起之方法，可列舉：使芯物質附著於基材粒子之表面後，藉由無電解鍍覆形成金屬部之方法；藉由無電解鍍覆而於基材粒子之表面形成金屬部後，使芯物質附著，進而藉由無電解鍍覆形成金屬部之方法；以及於藉由無電解鍍覆在基材粒子之表面形成金屬部之途中階段性地添加芯物質之方法等。 作為上述芯物質之材料，可列舉導電性物質及非導電性物質。作為上述導電性物質，例如可列舉：金屬、金屬之氧化物、石墨等導電性非金屬及導電性聚合物等。作為上述導電性聚合物，可列舉聚乙炔等。作為上述非導電性物質，可列舉：二氧化矽、氧化鋁、鈦酸鋇及氧化鋯等。其中，由於能夠提高導電性，進而能夠有效地降低連接電阻，故而較佳為金屬。上述芯物質較佳為金屬粒子。作為上述芯物質之材料之金屬可適當地使用作為上述導電材料之材料所列舉之金屬。 作為上述芯物質之材料之具體例，可列舉：鈦酸鋇(莫氏硬度4.5)、鎳(莫氏硬度5)、二氧化矽(silica，莫氏硬度6～7)、氧化鈦(莫氏硬度7)、氧化鋯(莫氏硬度8～9)、氧化鋁(莫氏硬度9)、碳化鎢(莫氏硬度9)及鑽石(莫氏硬度10)等。上述無機粒子較佳為鎳、二氧化矽、氧化鈦、氧化鋯、氧化鋁、碳化鎢或鑽石，更佳為二氧化矽、氧化鈦、氧化鋯、氧化鋁、碳化鎢或鑽石，進而較佳為氧化鈦、氧化鋯、氧化鋁、碳化鎢或鑽石，尤佳為氧化鋯、氧化鋁、碳化鎢或鑽石。上述芯物質之材料之莫氏硬度較佳為5以上，更佳為6以上，進而較佳為7以上，尤佳為7.5以上。 上述芯物質之形狀並無特別限定。芯物質之形狀較佳為塊狀。作為芯物質，例如可列舉：粒子狀之塊、複數個微小粒子凝聚而成之凝聚塊、及不定形之塊等。 上述芯物質之平均徑(平均粒徑)較佳為0.001 μm以上，更佳為0.05 μm以上，且較佳為0.9 μm以下，更佳為0.2 μm以下。若上述芯物質之平均徑為上述下限以上及上述上限以下，則電極間之連接電阻有效地降低。 上述芯物質之「平均徑(平均粒徑)」表示數量平均徑(數量平均粒徑)。芯物質之平均徑可藉由利用電子顯微鏡或光學顯微鏡觀察任意之芯物質50個並算出平均值而求出。 [絕緣性物質] 本發明之含金屬之粒子較佳為具備配置於上述金屬部之外表面上之絕緣性物質。於該情形時，若將含金屬之粒子用於電極間之連接，則能夠防止鄰接之電極間之短路。具體而言，於複數個含金屬之粒子接觸時，由於在複數個電極間存在絕緣性物質，故而能夠防止橫向相鄰之電極間而非上下之電極間之短路。再者，於將電極間連接時，藉由利用2個電極對含金屬之粒子加壓，而能夠容易地排除含金屬之粒子之金屬部與電極之間的絕緣性物質。由於金屬部於外表面具有複數個突起，故而能夠容易地排除含金屬之粒子之金屬部與電極之間的絕緣性物質。又，於金屬部於外表面具有複數個凸部之情形時，能夠容易地排除含金屬之粒子之金屬部與電極之間的絕緣性物質。 就於電極間之壓接時能夠更容易地排除上述絕緣性物質之方面而言，上述絕緣性物質較佳為絕緣性粒子。 作為上述絕緣性物質之材料之絕緣性樹脂的具體例可列舉：聚烯烴化合物、(甲基)丙烯酸酯聚合物、(甲基)丙烯酸酯共聚物、嵌段聚合物、熱塑性樹脂、熱塑性樹脂之交聯物、熱硬化性樹脂及水溶性樹脂等。 作為上述聚烯烴化合物，可列舉聚乙烯、乙烯-乙酸乙烯酯共聚物及乙烯-丙烯酸酯共聚物等。作為上述(甲基)丙烯酸酯聚合物，可列舉聚(甲基)丙烯酸甲酯、聚(甲基)丙烯酸乙酯及聚(甲基)丙烯酸丁酯等。作為上述嵌段聚合物，可列舉聚苯乙烯、苯乙烯-丙烯酸酯共聚物、SB型苯乙烯-丁二烯嵌段共聚物、及SBS型苯乙烯-丁二烯嵌段共聚物、以及該等之氫化物等。作為上述熱塑性樹脂，可列舉乙烯基聚合物及乙烯基共聚物等。作為上述熱硬化性樹脂，可列舉環氧樹脂、酚樹脂及三聚氰胺樹脂等。作為上述水溶性樹脂，可列舉聚乙烯醇、聚丙烯酸、聚丙烯醯胺、聚乙烯基吡咯啶酮、聚環氧乙烷及甲基纖維素等。其中，較佳為水溶性樹脂，更佳為聚乙烯醇。 作為於上述金屬部之表面上配置絕緣性物質之方法，可列舉化學方法、及物理或機械方法等。作為上述化學方法，例如可列舉：界面聚合法、粒子存在下之懸浮聚合法及乳化聚合法等。作為上述物理或機械方法，可列舉利用噴霧乾燥、混成(hybridization)、靜電附著法、噴霧法、浸漬及真空蒸鍍之方法等。其中，就絕緣性物質不易脫離之方面而言，較佳為經由化學結合於上述金屬部之表面配置上述絕緣性物質之方法。 上述金屬部之外表面、及絕緣性物質(絕緣性粒子等)之表面可分別經具有反應性官能基之化合物所被覆。金屬部之外表面與絕緣性物質之表面可並非直接進行化學結合，亦可藉由具有反應性官能基之化合物而間接進行化學結合。亦可將羧基導入金屬部之外表面後，該羧基經由聚伸乙基亞胺等高分子電解質而與絕緣性物質之表面之官能基進行化學結合。 上述絕緣性物質之平均徑(平均粒徑)可根據含金屬之粒子之粒徑及含金屬之粒子之用途等而適當選擇。上述絕緣性物質之平均徑(平均粒徑)較佳為0.005 μm以上，更佳為0.01 μm以上，且較佳為1 μm以下，更佳為0.5 μm以下。若絕緣性物質之平均徑為上述下限以上，則於含金屬之粒子分散於黏合劑樹脂中時，複數個含金屬之粒子中之金屬部彼此變得不易接觸。若絕緣性物質之平均徑為上述上限以下，則於電極間之連接時，無需為了排除電極與含金屬之粒子之間的絕緣性物質而過度提高壓力，亦無須加熱至高溫。 上述絕緣性物質之「平均徑(平均粒徑)」表示數量平均徑(數量平均粒徑)。絕緣性物質之平均徑可使用粒度分佈測定裝置等而求出。 (粒子連結體) 本發明之含金屬之粒子如上文所述，藉由使金屬部之突起熔融後使其固化，可形成如圖15所示之粒子連結體。此種粒子連結體作為能夠提高較先前之含金屬之粒子更高之連接可靠性之新穎材料而有用。即，作為新穎之連接材料，本發明者等人進一步發現下述之發明。 1)一種粒子連結體，其係複數個含金屬之粒子(與本發明之含金屬之粒子相區別而亦稱為含金屬之粒子本體)經由含有金屬之柱狀連結部而連結。 2)如上述1)之粒子連結體，其中上述柱狀連結部含有與上述含金屬之粒子所含之金屬同種之金屬。 3)如上述1)或2)之粒子連結體，其中構成上述粒子連結體之上述含金屬之粒子係源自本發明之含金屬之粒子。 4)如上述1)至3)中任一項之粒子連結體，其中構成上述粒子連結體之上述含金屬之粒子及上述柱狀連結部係藉由本發明之含金屬之粒子之上述突起熔融固化所形成。 5)如上述1)至4)中任一項之粒子連結體，其中上述柱狀連結部係源自本發明之含金屬之粒子之突起。 本發明之粒子連結體可藉由上文所述之方法而製造，但製造方法並不限定於上文所述之方法。例如亦可分開製造含金屬之粒子與柱狀體，藉由柱狀體使含金屬之粒子連結，而形成柱狀連結部。 上述柱狀連結部可為圓柱狀連結部或多角柱狀連結部，柱之中央部分可粗亦可細。 上述柱狀連結部中與上述含金屬之粒子之連接面之外接圓的直徑(d)較佳為3 nm以上，更佳為100 nm以上，且較佳為10000 nm以下，更佳為1000 nm以下。 上述柱狀連結部中，柱狀連結部之長度(l)較佳為3 nm以上，更佳為100 nm以上，且較佳為10000 nm以下，更佳為1000 nm以下。 上述柱狀連結部中柱狀連結部之長度(l)相對於與上述含金屬之粒子之連接面之外接圓的直徑(d)之比((d)/(l))較佳為0.001以上，更佳為0.1以上，且較佳為100以下，更佳為10以下。 本發明之粒子連結體可為如圖15所示之2個之含金屬之粒子之連結體，亦可為3個以上之含金屬之粒子之連結體。 (連接材料) 本發明之連接材料可適宜地用以形成連接2個連接對象構件之連接部。上述連接材料包含上述之含金屬之粒子、及樹脂。上述連接材料較佳為藉由使複數個含金屬之粒子之金屬部突起之前端熔融後使其固化而用以形成上述連接部。 上述樹脂並無特別限定。上述樹脂係使上述含金屬之粒子分散之黏合劑。上述樹脂較佳為含有熱塑性樹脂或硬化性樹脂，更佳為含有硬化性樹脂。作為上述硬化性樹脂，可列舉光硬化性樹脂及熱硬化性樹脂。上述光硬化性樹脂較佳為含有光硬化性樹脂及光聚合起始劑。上述熱硬化性樹脂較佳為含有熱硬化性樹脂及熱硬化劑。作為上述樹脂，例如可列舉：乙烯基樹脂、熱塑性樹脂、硬化性樹脂、熱塑性嵌段共聚物及彈性體等。上述樹脂可僅使用1種，亦可併用2種以上。 作為上述乙烯基樹脂，例如可列舉：乙酸乙烯酯樹脂、丙烯酸系樹脂及苯乙烯樹脂等。作為上述熱塑性樹脂，例如可列舉：聚烯烴樹脂、乙烯-乙酸乙烯酯共聚物及聚醯胺樹脂等。作為上述硬化性樹脂，例如可列舉：環氧樹脂、胺基甲酸酯樹脂、聚醯亞胺樹脂及不飽和聚酯樹脂等。再者，上述硬化性樹脂可為常溫硬化型樹脂、熱硬化型樹脂、光硬化型樹脂或濕氣硬化型樹脂。作為上述熱塑性嵌段共聚物，例如可列舉：苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-異戊二烯-苯乙烯嵌段共聚物、苯乙烯-丁二烯-苯乙烯嵌段共聚物之氫化物、及苯乙烯-異戊二烯-苯乙烯嵌段共聚物之氫化物等。作為上述彈性體，例如可列舉：苯乙烯-丁二烯共聚合橡膠、及丙烯腈-苯乙烯嵌段共聚合橡膠等。 於上述金屬部之突起含有金屬氧化物之情形時，較佳為使用還原劑。作為上述還原劑，可列舉：醇化合物(具有醇性羥基之化合物)、羧酸化合物(具有羧基之化合物)及胺化合物(具有胺基之化合物)等。上述還原劑可僅使用1種，亦可併用2種以上。 作為上述醇化合物，可列舉烷基醇。作為上述醇化合物之具體例，例如可列舉：乙醇、丙醇、丁醇、戊醇、己醇、庚醇、辛醇、壬醇、癸醇、十一烷基醇、十二烷基醇、十三烷基醇、十四烷基醇、十五烷基醇、十六烷基醇、十七烷基醇、十八烷基醇、十九烷基醇及二十烷基醇等。又，作為上述醇化合物，並不限於1級醇型化合物，亦可使用2級醇型化合物、3級醇型化合物、烷二醇及具有環狀結構之醇化合物。進而，作為上述醇化合物，亦可使用乙二醇及三乙二醇等具有多數之醇基之化合物。又，作為上述醇化合物，亦可使用檸檬酸、抗壞血酸及葡萄糖等化合物。 作為上述羧酸化合物，可列舉烷基羧酸等。作為上述羧酸化合物之具體例，可列舉：丁酸、戊酸、己酸、庚酸、辛酸、壬酸、癸酸、十一酸、十二酸、十三酸、十四酸、十五酸、十六酸、十七酸、十八酸、十九酸及二十酸等。又，上述羧酸化合物並不限於1級羧酸型化合物，亦可使用2級羧酸型化合物、3級羧酸型化合物、二羧酸及具有環狀結構之羧基化合物。 作為上述胺化合物，可列舉烷基胺等。作為上述胺化合物之具體例，可列舉：丁基胺、戊基胺、己基胺、庚基胺、辛基胺、壬基胺、癸基胺、十一烷基胺、十二烷基胺、十三烷基胺、十四烷基胺、十五烷基胺、十六烷基胺、十七烷基胺、十八烷基胺、十九烷基胺及二十烷基胺等。又，上述胺化合物亦可具有分支結構。作為具有分支結構之胺化合物，可列舉：2-乙基己基胺及1,5-二甲基己基胺等。上述胺化合物並不限於1級胺型化合物，亦可使用2級胺型化合物、3級胺型化合物及具有環狀結構之胺化合物。 上述還原劑可為具有醛基、酯基、磺醯基或酮基等之有機物，亦可為羧酸金屬鹽等有機物。羧酸金屬鹽亦可用作金屬粒子之前驅物，另一方面，由於含有有機物，因此亦可用作金屬氧化物粒子之還原劑。 上述連接材料除了上述含金屬之粒子及上述樹脂以外，亦可含有例如填充劑、增量劑、軟化劑、塑化劑、聚合觸媒、硬化觸媒、著色劑、抗氧化劑、熱穩定劑、光穩定劑、紫外線吸收劑、滑劑、抗靜電劑及阻燃劑等各種添加劑。 上述連接材料較佳為用於導電連接，較佳為導電連接材料。上述連接材料較佳為用於各向異性導電連接，較佳為各向異性導電連接材料。上述連接材料可以糊劑及膜等形式使用。於上述連接材料為膜之情形時，亦可對含有含金屬之粒子之膜積層不含含金屬之粒子之膜。上述糊劑較佳為導電糊劑，更佳為各向異性導電糊劑。上述膜較佳為導電膜，更佳為各向異性導電膜。 上述連接材料100重量%中，上述樹脂之含量較佳為1重量%以上，更佳為5重量%以上，亦可為10重量%以上，亦可為30重量%以上，亦可為50重量%以上，亦可為70重量%以上，且較佳為99.99重量%以下，更佳為99.9重量%以下。若上述樹脂之含量為上述下限以上及上述上限以下，則連接可靠性進一步提高。 上述連接材料100重量%中，上述含金屬之粒子之含量較佳為0.01重量%以上，更佳為0.1重量%以上，且較佳為99重量%以下，更佳為95重量%以下，亦可為80重量%以下，亦可為60重量%以下，亦可為40重量%以下，亦可為20重量%以下，亦可為10重量%以下。若上述含金屬之粒子之含量為上述下限以上及上述上限以下，則連接可靠性進一步提高。又，若上述含金屬之粒子之含量為上述下限以上及上述上限以下，則可使含金屬之粒子充分存在於第1、第2連接對象構件間，藉由含金屬之粒子，能夠進一步抑制第1、第2連接對象構件間之間隔局部變狹之情況。因此，亦可抑制連接部之散熱性局部降低之情況。 上述連接材料亦可除了含金屬之粒子以外另行含有不具有基材粒子之含金屬原子之粒子。 作為上述含金屬原子之粒子，可列舉金屬粒子及金屬化合物粒子等。上述金屬化合物粒子包含金屬原子、與該金屬原子以外之原子。作為上述金屬化合物粒子之具體例，可列舉：金屬氧化物粒子、金屬之碳酸鹽粒子、金屬之羧酸鹽粒子及金屬之錯合物粒子等。上述金屬化合物粒子較佳為金屬氧化物粒子。例如，上述金屬氧化物粒子係於還原劑之存在下，藉由連接時之加熱成為金屬粒子後進行燒結。上述金屬氧化物粒子係金屬粒子之前驅物。作為上述金屬之羧酸鹽粒子，可列舉金屬之乙酸鹽粒子等。 作為構成上述金屬粒子及上述金屬氧化物粒子之金屬，可列舉：銀、銅、鎳及金等。較佳為銀或銅，尤佳為銀。因此，上述金屬粒子較佳為銀粒子或銅粒子，更佳為銀粒子。上述金屬氧化物粒子較佳為氧化銀粒子或氧化銅粒子，更佳為氧化銀粒子。於使用銀粒子及氧化銀粒子之情形時，連接後殘渣較少，體積減少率亦非常小。作為該氧化銀粒子中之氧化銀，可列舉Ag2
O及AgO。 上述含金屬原子之粒子較佳為於未達400℃之加熱下燒結。上述含金屬原子之粒子燒結之溫度(燒結溫度)更佳為350℃以下，且較佳為300℃以上。若上述含金屬原子之粒子燒結之溫度為上述上限以下或未達上述上限，則能夠有效率地進行燒結，進而能夠減小燒結所需之能量，且減小環境負荷。 含有上述含金屬原子之粒子之連接材料較佳為含有平均粒徑為1 nm以上且100 nm以下之金屬粒子之連接材料，或含有平均粒徑為1 nm以上且50 μm以下之金屬氧化物粒子與還原劑之連接材料。若使用此種連接材料，則藉由連接時之加熱而可使上述含金屬原子之粒子彼此良好地燒結。上述金屬氧化物粒子之平均粒徑較佳為5 μm以下。上述含金屬原子之粒子之粒徑於含金屬原子之粒子為真球狀之情形時表示直徑，於含金屬原子之粒子不為真球狀之情形時表示最大徑。 上述連接材料100重量%中，上述含金屬原子之粒子之含量較佳為10重量%以上，更佳為30重量%以上，進而較佳為50重量%以上，且為100重量%以下，較佳為99重量%以下，更佳為90重量%以下。亦可為上述連接材料之全部量為上述含金屬原子之粒子。若上述含金屬原子之粒子之含量為上述下限以上，則能夠使上述含金屬原子之粒子更緻密地燒結。其結果為，連接部之散熱性及耐熱性亦變高。 於上述含金屬原子之粒子為金屬氧化物粒子之情形時，較佳為使用還原劑。作為上述還原劑，可列舉：醇化合物(具有醇性羥基之化合物)、羧酸化合物(具有羧基之化合物)及胺化合物(具有胺基之化合物)等。上述還原劑可僅使用1種，亦可併用2種以上。 作為上述醇化合物，可列舉烷基醇。作為上述醇化合物之具體例，例如可列舉：乙醇、丙醇、丁醇、戊醇、己醇、庚醇、辛醇、壬醇、癸醇、十一烷基醇、十二烷基醇、十三烷基醇、十四烷基醇、十五烷基醇、十六烷基醇、十七烷基醇、十八烷基醇、十九烷基醇及二十烷基醇等。又，作為上述醇化合物，並不限於1級醇型化合物，亦可使用2級醇型化合物、3級醇型化合物、烷二醇及具有環狀結構之醇化合物。進而，作為上述醇化合物，亦可使用乙二醇及三乙二醇等具有多數之醇基之化合物。又，作為上述醇化合物，亦可使用檸檬酸、抗壞血酸及葡萄糖等化合物。 作為上述羧酸化合物，可列舉烷基羧酸等。作為上述羧酸化合物之具體例，可列舉：丁酸、戊酸、己酸、庚酸、辛酸、壬酸、癸酸、十一酸、十二酸、十三酸、十四酸、十五酸、十六酸、十七酸、十八酸、十九酸及二十酸等。又，上述羧酸化合物並不限於1級羧酸型化合物，亦可使用2級羧酸型化合物、3級羧酸型化合物、二羧酸及具有環狀結構之羧基化合物。 作為上述胺化合物，可列舉烷基胺等。作為上述胺化合物之具體例，可列舉：丁基胺、戊基胺、己基胺、庚基胺、辛基胺、壬基胺、癸基胺、十一烷基胺、十二烷基胺、十三烷基胺、十四烷基胺、十五烷基胺、十六烷基胺、十七烷基胺、十八烷基胺、十九烷基胺及二十烷基胺等。又，上述胺化合物亦可具有分支結構。作為具有分支結構之胺化合物，可列舉：2-乙基己基胺及1,5-二甲基己基胺等。上述胺化合物並不限於1級胺型化合物，亦可使用2級胺型化合物、3級胺型化合物及具有環狀結構之胺化合物。 進而，上述還原劑可為具有醛基、酯基、磺醯基或酮基等之有機物，亦可為羧酸金屬鹽等有機物。羧酸金屬鹽亦可用作金屬粒子之前驅物，另一方面，由於含有有機物，因此亦可用作金屬氧化物粒子之還原劑。 若使用具有較上述含金屬原子之粒子之燒結溫度(接合溫度)更低之熔點之還原劑，則有接合時凝聚而接合部容易產生孔隙之傾向。藉由使用羧酸金屬鹽，由於該羧酸金屬鹽不會因接合時之加熱而熔解，因此能夠抑制產生孔隙之情況。再者，亦可使用除了羧酸金屬鹽以外亦含有有機物之金屬化合物作為還原劑。 於使用上述還原劑之情形時，上述連接材料100重量%中，上述還原劑之含量較佳為1重量%以上，更佳為10重量%以上，且較佳為90重量%以下，更佳為70重量%以下，進而較佳為50重量%以下。若上述還原劑之含量為上述下限以上，則能夠使上述含金屬原子之粒子更緻密地燒結。其結果為，接合部之散熱性及耐熱性亦變高。 上述連接材料100重量%中，上述金屬氧化物粒子之含量較佳為10重量%以上，更佳為30重量%以上，進而較佳為60重量%以上，且較佳為99.99重量%以下，更佳為99.9重量%以下，進而較佳為99.5重量%以下，進而較佳為99重量%以下，尤佳為90重量%以下，最佳為80重量%以下。 於上述連接材料為糊劑之情形時，用於該糊劑之黏合劑並無特別限定。上述黏合劑較佳為於上述含金屬原子之粒子燒結時消失。上述黏合劑可僅使用1種，亦可併用2種以上。 作為上述黏合劑之具體例，作為溶劑而可列舉：脂肪族系溶劑、酮系溶劑、芳香族系溶劑、酯系溶劑、醚系溶劑、醇系溶劑、石蠟系溶劑及石油系溶劑等。 作為上述脂肪族系溶劑，可列舉：環己烷、甲基環己烷及乙基環己烷等。作為上述酮系溶劑，可列舉：丙酮及甲基乙基酮等。作為上述芳香族系溶劑，可列舉：甲苯及二甲苯等。作為上述酯系溶劑，可列舉：乙酸乙酯、乙酸丁酯及乙酸異丙酯等。作為上述醚系溶劑，可列舉：四氫呋喃(THF)、及二㗁烷等。作為上述醇系溶劑，可列舉：乙醇及丁醇等。作為上述石蠟系溶劑，可列舉：石蠟油及環烷油等。作為上述石油系溶劑，可列舉：松脂油及石腦油等。 (連接結構體) 本發明之連接結構體具備第1連接對象構件、第2連接對象構件、及連接第1、第2連接對象構件之連接部。於本發明之連接結構體中，上述連接部係由上述含金屬之粒子或上述連接材料所形成。上述連接部之材料係上述含金屬之粒子或上述連接材料。 本發明之連接結構體之製造方法包括：於第1連接對象構件與第2連接對象構件之間配置上述含金屬之粒子，或配置上述連接材料之步驟；及對上述含金屬之粒子進行加熱，使上述金屬部之上述突起之前端熔融，於熔融後固化，而藉由上述含金屬之粒子或上述連接材料形成將上述第1連接對象構件與上述第2連接對象構件連接之連接部之步驟。 圖9係模式性地表示使用本發明之第1實施形態之含金屬之粒子的連接結構體之剖視圖。 圖9所示之連接結構體51包括第1連接對象構件52、第2連接對象構件53、及連接第1、第2連接對象構件52、53之連接部54。連接部54包含含金屬之粒子1與樹脂(經硬化之樹脂等)。連接部54係由含有含金屬之粒子1之連接材料所形成。連接部54之材料係上述連接材料。連接部54較佳為藉由使連接材料硬化而形成。再者，於圖9中，含金屬之粒子1之金屬部3之突起3a的前端於熔融後固化。於連接部54中包含複數個含金屬之粒子1之接合體。於連接結構體51中，含金屬之粒子1與第1連接對象構件51接合，含金屬之粒子1與第2連接對象構件53接合。 亦可使用含金屬之粒子1A、1B、1C、1D、1E、1F、1G等其他含金屬之粒子代替含金屬之粒子1。 第1連接對象構件52於表面(上表面)具有複數個第1電極52a。第2連接對象構件53於表面(下表面)具有複數個第2電極53a。第1電極52a與第2電極53a藉由1個或複數個含金屬之粒子1而電性連接。因此，第1、第2連接對象構件52、53藉由含金屬之粒子1而電性連接。於連接結構體51中，含金屬之粒子1與第1電極52a接合，含金屬之粒子1與第2電極53a接合。 上述連接結構體之製造方法並無特別限定。作為連接結構體之製造方法之一例，可列舉於第1連接對象構件與第2連接對象構件之間配置上述連接材料，獲得積層體之後，對該積層體進行加熱及加壓之方法等。上述加壓之壓力為9.8×104
～4.9×106
Pa左右。上述加熱之溫度為120～220℃左右。 作為上述連接對象構件，具體而言，可列舉：半導體晶片、電容器及二極體等電子零件；以及作為印刷基板、軟性印刷基板、玻璃環氧基板及玻璃基板等電路基板之電子零件等。上述連接對象構件較佳為電子零件。上述含金屬之粒子較佳為用於電子零件中之電極之電性連接。 作為設置於上述連接對象構件之電極，可列舉：金電極、鎳電極、錫電極、鋁電極、銅電極、銀電極、SUS電極、鉬電極及鎢電極等金屬電極。於上述連接對象構件為軟性印刷基板之情形時，上述電極較佳為金電極、鎳電極、錫電極或銅電極。於上述連接對象構件為玻璃基板之情形時，上述電極較佳為鋁電極、銅電極、鉬電極或鎢電極。再者，於上述電極為鋁電極之情形時，可為僅由鋁形成之電極，亦可為於金屬氧化物層之表面積層鋁層而成之電極。作為上述金屬氧化物層之材料，可列舉摻雜有三價金屬元素之氧化銦及摻雜有三價金屬元素之氧化鋅等。作為上述三價金屬元素，可列舉：Sn、Al及Ga等。 圖10係模式性地表示使用本發明之第1實施形態之含金屬之粒子的連接結構體之變化例之剖視圖。 圖10所示之連接結構體61具備第1連接對象構件62、第2連接對象構件63及64、以及連接第1連接對象構件62與第2連接對象構件63及64之連接部65、66。連接部65、66係使用含有含金屬之粒子1與其他含金屬之粒子67之連接材料所形成。連接部65、66之材料係上述連接材料。 於第1連接對象構件62之第1表面(一側之表面)側配置有連接部65及第2連接對象構件63。連接部65連接第1連接對象構件62與第2連接對象構件63。 於與第1連接對象構件62之第1表面相反之第2表面(另一側之表面)側配置有連接部66及第2連接對象構件64。連接部66連接第1連接對象構件62與第2連接對象構件64。 於第1連接對象構件62與第2連接對象構件63、64之間分別配置有含金屬之粒子1、與含金屬之粒子67。於本實施形態中，於連接部65、66中，含金屬原子之粒子及含金屬之粒子1為經燒結之燒結物之狀態。於第1連接對象構件62與第2連接對象構件63、64間配置有含金屬之粒子1。藉由含金屬之粒子1而將第1連接對象構件62與第2連接對象構件63、64連接。 於第2連接對象構件63之與連接部65側相反之表面配置有散熱片68。於第2連接對象構件64之與連接部66側為相反側之表面配置有散熱片69。因此，連接結構體61具有依序積層有散熱片68、第2連接對象構件63、連接部65、第1連接對象構件62、連接部66、第2連接對象構件64及散熱片69之部分。 作為第1連接對象構件62，可列舉：整流二極體、功率電晶體(功率MOSFET，絕緣閘極雙極電晶體)、閘流體、閘極截止閘流體及三端雙向可控矽開關等所使用之Si、SiC、GaN等為材料之功率半導體元件等。於具備此種第1連接對象構件62之連接結構體61中，在使用連接結構體61時，第1連接對象構件62中容易產生較大之熱量。因此，必須使由第1連接對象構件62產生之熱量有效率地發散至散熱片68、69等。因此，對於配置於第1連接對象構件62與散熱片68、69之間之連接部65、66，要求較高之散熱性與較高之可靠性。 作為第2連接對象構件63、64，可列舉：陶瓷、塑膠等為材料之基板等。 連接部65、66係藉由對上述連接材料進行加熱，使上述含金屬之粒子之前端熔融後固化所形成。 (導通檢查用構件或導通用構件) 本發明之粒子連結體、及連接材料亦可應用於導通檢查用構件或導通用構件。以下，記載導通檢查用構件之一態樣。再者，導通檢查用構件並不限定於下述態樣。上述導通檢查用構件及上述導通用構件亦可為片狀導通用構件。 圖19(a)、(b)係表示導通檢查用構件之一例之俯視圖及剖視圖。圖19(b)係沿圖19(a)中之A-A線之剖視圖。 圖19(a)、(b)所示之導通檢查用構件11具備具有貫通孔12a之基體12、及配置於基體12之貫通孔12a內之導電部13。導電部13之材料含有上述含金屬之粒子。導通檢查用構件11亦可為導通用構件。 上述基體係成為上述導通檢查用構件之基板之構件。上述基體較佳為具有絕緣性，上述基體較佳為由絕緣性之材料所形成。作為絕緣性之材料，例如可列舉絕緣性樹脂。 構成上述基體之絕緣性樹脂例如可為熱塑性樹脂及熱硬化性樹脂之任一者。作為熱塑性樹脂，可列舉：聚酯樹脂、聚苯乙烯樹脂、聚乙烯樹脂、聚醯胺樹脂、ABS樹脂、及聚碳酸酯樹脂等。作為熱硬化性樹脂，可列舉：環氧樹脂、胺基甲酸酯樹脂、聚醯亞胺樹脂、聚醚醚酮樹脂、聚醯胺醯亞胺樹脂、聚醚醯亞胺系樹脂、聚矽氧樹脂、及酚樹脂等。作為聚矽氧樹脂，可列舉聚矽氧橡膠等。 於上述基體係由絕緣性樹脂所形成之情形時，構成上述基體之絕緣性樹脂可僅使用1種，亦可併用2種以上。 上述基體例如為板狀、片狀等。片狀中包括膜狀。上述基體之厚度可根據導通檢查用構件之種類而適當設定，例如可為0.005 mm以上且50 mm以下之厚度。上述基體之俯視下之大小亦可根據目標檢查裝置而適當設定。 上述基體例如可藉由以上述之絕緣性樹脂等絕緣性材料作為原料，成形為所需之形狀而獲得。 於上述基體配置有複數個上述基體之上述貫通孔。上述貫通孔較佳為沿上述基體之厚度方向貫通。 上述基體之上述貫通孔可形成為圓柱狀，但並不限於圓柱狀，亦可形成為其他形狀，例如亦可形成為多角柱狀。又，上述貫通孔可形成為沿一方向前端變細之錐形，除此以外，亦可形成為變形之形狀。 亦可將上述貫通孔之大小、例如俯視下之上述貫通孔之視面積形成為合適之大小，例如形成為可收容導電部且可保持之程度之大小即可。若上述貫通孔為例如圓柱狀，則上述貫通孔之直徑較佳為0.01 mm以上，且較佳為10 mm以下。 再者，上述基體之上述貫通孔可全部為相同之形狀、相同之大小，上述基體之上述貫通孔之一部分之形狀或大小亦可與其他貫通孔不同。 上述基體之上述貫通孔之個數亦可於合適之範圍內進行設定，具有可進行導通檢查之程度之個數即可，可根據目標檢查裝置而適當設定。又，上述基體之上述貫通孔之配置部位亦可根據目標檢查裝置而適當設定。 形成上述基體之上述貫通孔之方法並無特別限定，可藉由公知之方法(例如雷射加工)形成貫通孔。 上述基體之上述貫通孔內之導電部具有導電性。 具體而言，導電部含有源自上述含金屬之粒子之粒子。例如，導電部係將複數個含金屬之粒子收容至貫通孔內而形成。上述導電部包含源自含金屬之粒子之粒子之集合體(粒子群)。 上述導電部之材料亦可含有上述含金屬之粒子以外之材料。例如，上述導電部之材料可除了上述含金屬之粒子以外亦含有黏合劑。藉由上述導電部之材料含有黏合劑，上述含金屬之粒子更牢固地集合，藉此容易將源自上述含金屬之粒子之粒子保持於上述貫通孔內。 作為上述黏合劑，並無特別限定，例如可列舉：光硬化性樹脂、熱硬化性樹脂。上述光硬化性樹脂較佳為包含光硬化性樹脂及光聚合起始劑。上述熱硬化性樹脂較佳為包含熱硬化性樹脂及熱硬化劑。作為上述樹脂，例如可列舉：聚矽氧系共聚物、乙烯基樹脂、熱塑性樹脂、硬化性樹脂、熱塑性嵌段共聚物及彈性體等。上述樹脂可僅使用1種，亦可併用2種以上。 較佳為將源自上述含金屬之粒子之粒子緊密地填充至上述貫通孔內，於該情形時，可藉由上述導通檢查用構件進行更確實之導通檢查。較佳為將上述導電部以可將導通檢查用構件或導通用構件之正面及背面導通之方式收容至上述貫通孔內。 於上述導電部中，源自上述含金屬之粒子之粒子較佳為自導電部之正面連續至背面，源自上述含金屬之粒子之粒子以互相接觸之方式存在。於該情形時，上述導電部之導通性提高。 將上述導電部收容至上述貫通孔內之方法並無特別限定。例如，藉由利用將包含上述含金屬之粒子與黏合劑之材料塗佈於基體之方法將上述含金屬之粒子填充至貫通孔內並於合適之條件下使其硬化，可於貫通孔內形成導電部。藉此，將導電部收容至貫通孔內。於包含上述含金屬之粒子與黏合劑之材料中亦可視需要而含有溶劑。 包含上述含金屬之粒子與黏合劑之材料中，相對於上述含金屬之粒子100重量份，黏合劑之含量以固形物成分換算計，較佳為5重量份以上，更佳為10重量份以上，且較佳為70重量份以下，更佳為50重量份以下。 上述導通檢查用構件可用作探針卡。再者，上述導通檢查用構件只要為不阻礙本發明之效果之程度，則亦可具備其他構成要素。 圖20(a)～(c)係模式性地表示藉由導通檢查用構件檢查電子電路設備之電特性之情況的圖。 於圖20(a)～(c)中，電子電路設備為BGA基板31(球柵陣列基板)。BGA基板31係具有將連接墊以格子狀排列於多層基板31A，且於各墊上配設有焊料球31B之結構之基板。又，於圖20(a)～(c)中，導通檢查用構件21為探針卡。導通檢查用構件21於基體22上形成有複數個貫通孔22a，於貫通孔22a內收容有導電部23。如圖20(a)般準備BGA基板31與導通檢查用構件21，如圖20(b)般使BGA基板31與導通檢查用構件21接觸並將其壓縮。此時，焊料球31B與貫通孔22a內之導電部23接觸。於該狀態下，如圖20(c)般連接電流計32而實施導通檢查，從而可判定BGA基板31之合格與否。 以下，列舉實施例及比較例，對本發明進行具體說明。本發明並不僅限定於以下之實施例。 (實施例1) 作為基材粒子A，準備粒徑為3.0 μm之二乙烯苯共聚物樹脂粒子(積水化學工業公司製造之「Micropearl SP-203」)。 使用超音波分散器使10重量份之基材粒子A分散於含有鈀觸媒液5重量%之鹼溶液100重量份中後，藉由將溶液進行過濾而取出基材粒子A。繼而，將基材粒子A添加至二甲胺硼烷1重量%溶液100重量份中，將基材粒子A之表面活化。將表面經活化之基材粒子A充分水洗後，添加至蒸餾水500重量份中，使其分散，藉此獲得懸浮液(A)。 繼而，花費3分鐘將金屬鎳粒子漿料(三井金屬公司製造之「2020SUS」，平均粒徑150 nm)1重量份添加至上述懸浮液(A)中，而獲得含有附著有芯物質之基材粒子A之懸浮液(B)。 將懸浮液(B)加入至含有硫酸銅20 g/L、及乙二胺四乙酸30 g/L之溶液中，而獲得粒子混合液(C)。 又，作為無電解鍍銅液，準備藉由氨將含有硫酸銅250 g/L、乙二胺四乙酸150 g/L、葡萄糖酸鈉100 g/L、及甲醛50 g/L之混合液之pH值調整為10.5而成之鍍銅液(D)。 又，作為無電解鍍銀液，準備藉由氨水將含有硝酸銀30 g/L、丁二醯亞胺100 g/L、及甲醛20 g/L之混合液之pH值調整為8.0而成之鍍銀液(E)。 又，準備含有二甲胺硼烷100 g/L、及氫氧化鈉0.5 g/L之突起形成用鍍覆液(F)(pH值10.0)。 於調整為55℃之分散狀態之粒子混合液(C)中緩慢滴加上述鍍銅液(D)，進行無電解鍍銅。於鍍銅液(D)之滴加速度為30 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍銅。以此方式獲得含有於樹脂粒子之表面配置有銅金屬部，具備表面具有凸部之金屬部之粒子的粒子混合液(G)。 其後，藉由過濾粒子混合液(G)而取出粒子，並進行水洗，藉此獲得於上述基材粒子A之表面上配置有銅金屬部，具備表面具有凸部之金屬部之粒子。將該粒子充分水洗後，加入至蒸餾水500重量份中，使其分散，藉此獲得粒子混合液(H)。 繼而，於調整為60℃之分散狀態之粒子混合液(H)中緩慢滴加上述鍍銀液(E)，進行無電解鍍銀。於鍍銀液(E)之滴加速度為10 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍銀。其後，緩慢滴加上述突起形成用鍍覆液(F)而進行突起形成。於突起形成用鍍覆液(F)之滴加速度為1 mL/分鐘、滴加時間為10分鐘之條件下進行突起形成。於突起形成用鍍覆液(F)之滴加中，一邊藉由超音波攪拌將所產生之銀突起核分散一邊進行鍍銀(突起形成步驟)。其後，藉由進行過濾而取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有銅及銀金屬部(無凸部之部分之金屬部整體之厚度：0.1 μm)，具備表面具有凸部且於凸部之表面上具有複數個突起之金屬部的含金屬之粒子。 (實施例2) 將金屬鎳粒子漿料變更為氧化鋁粒子漿料(平均粒徑150 nm)，除此以外，以與實施例1同樣之方式獲得含金屬之粒子。 (實施例3) 將實施例1中獲得之懸浮液(A)加入至含有硫酸鎳40 ppm、檸檬酸三鈉2 g/L、及氨水10 g/L之溶液中，而獲得粒子混合液(B)。 作為針狀突起形成用鍍覆液，而準備藉由氨水將含有硫酸銅100 g/L、硫酸鎳10 g/L、次磷酸鈉100 g/L、檸檬酸三鈉70 g/L、硼酸10 g/L、及作為非離子界面活性劑之聚乙二醇1000(分子量：1000)5 mg/L之混合液的pH值調整為10.0而成之作為無電解鍍銅-鎳-磷合金液之針狀突起形成用鍍覆液(C)。 又，作為無電解鍍銀液，而準備藉由氨水將硝酸銀30 g/L、丁二醯亞胺100 g/L、及甲醛20 g/L之混合液之pH值調整為8.0而成之鍍銀液(D)。 又，準備含有二甲胺硼烷100 g/L、及氫氧化鈉0.5 g/L之突起形成用鍍覆液(E)(pH值10.0)。 於調整為70℃之分散狀態之粒子混合液(B)中緩慢滴加上述針狀突起形成用鍍覆液(C)，而形成針狀突起。於針狀突起形成用鍍覆液(C)之滴加速度為40 mL/分鐘、滴加時間為60分鐘之條件下進行無電解鍍銅-鎳-磷合金(針狀突起形成及銅-鎳-磷合金鍍覆步驟)。其後，藉由進行過濾取出粒子，而獲得於基材粒子A之表面上配置有銅-鎳-磷合金金屬部，而具備表面具有凸部之金屬部之粒子(F)。將粒子(F)添加至蒸餾水500重量份中，使其分散，藉此獲得懸浮液(G)。 其後，藉由過濾懸浮液(G)而取出粒子，並進行水洗，藉此獲得於上述基材粒子A之表面上配置有銅-鎳-磷合金金屬部，而具備表面具有針狀凸部之金屬部之粒子。將該粒子充分水洗後，加入至蒸餾水500重量份中，使其分散，藉此獲得粒子混合液(H)。 繼而，於調整為60℃之分散狀態之粒子混合液(H)中緩慢滴加上述鍍銀液(D)，進行無電解鍍銀。於鍍銀液(D)之滴加速度為10 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍銀。其後，緩慢滴加上述突起形成用鍍覆液(E)，而進行突起形成。於突起形成用鍍覆液(E)之滴加速度為1 mL/分鐘、滴加時間為10分鐘之條件下進行突起形成。於突起形成用鍍覆液(E)之滴加中，一邊藉由超音波攪拌將所產生之銀突起核分散一邊進行鍍銀(突起形成步驟)。其後，藉由進行過濾取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有銅-鎳-磷合金及銀金屬部(無凸部之部分中之金屬部整體之厚度：0.1 μm)，而具備表面具有複數個針狀凸部，且於凸部之表面上具有複數個突起之金屬部之含金屬之粒子。 (實施例4) 將實施例1中獲得之懸浮液(A)加入至含有硫酸鎳80 g/L、硝酸鉈10 ppm及硝酸鉍5 ppm之溶液中，而獲得粒子混合液(B)。 作為針狀突起形成用鍍覆液，而準備藉由氫氧化鈉將含有氯化鎳100 g/L、肼一水合物100 g/L、檸檬酸三鈉50 g/L、及聚乙二醇1000(分子量：1000)20 mg/L之混合液之pH值調整為9.0而成之作為無電解鍍高純度鎳液之針狀突起形成用鍍覆液(C)。 又，作為無電解鍍銀液，而準備藉由氨水將含有硝酸銀30 g/L、丁二醯亞胺100 g/L、及甲醛20 g/L之混合液之pH值調整為8.0而成之鍍銀液(D)。 又，準備含有二甲胺硼烷100 g/L、及氫氧化鈉0.5 g/L之突起形成用鍍覆液(E)(pH值10.0)。 於調整為60℃之分散狀態之粒子混合液(B)中緩慢滴加上述針狀突起形成用鍍覆液(C)，而形成針狀突起。於針狀突起形成用鍍覆液(C)之滴加速度為20 mL/分鐘、滴加時間為50分鐘之條件下進行無電解鍍高純度鎳(針狀突起形成及銅-鎳-磷合金鍍覆步驟)。其後，藉由過濾取出粒子，而獲得於基材粒子A之表面上配置有高純度鎳金屬部，而具備表面具有凸部之金屬部之粒子(F)。將粒子(F)添加至蒸餾水500重量份中，使其分散，藉此獲得懸浮液(G)。 其後，藉由過濾懸浮液(G)而取出粒子，並進行水洗，藉此獲得於上述基材粒子A之表面上配置高純度鎳金屬部，而具備表面具有針狀凸部之金屬部之粒子。將該粒子充分水洗後，加入至蒸餾水500重量份中，使其分散，藉此獲得粒子混合液(H)。 繼而，於調整為60℃之分散狀態之粒子混合液(H)中緩慢滴加上述鍍銀液(D)，進行無電解鍍銀。於鍍銀液(D)之滴加速度為10 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍銀。其後，緩慢滴加上述突起形成用鍍覆液(E)，而進行突起形成。於突起形成用鍍覆液(E)之滴加速度為1 mL/分鐘、滴加時間為10分鐘之條件下進行突起形成。於突起形成用鍍覆液(E)之滴加中，一邊藉由超音波攪拌將所產生之銀突起核分散一邊進行鍍銀(突起形成步驟)。其後，藉由進行過濾取出粒子，而獲得於基材粒子A之表面上配置有高純度鎳及銀金屬部，而具備表面具有針狀凸部，且於凸部之表面上具有複數個突起之金屬部之粒子混合液(I)。 其後，藉由將粒子混合液(I)進行過濾而取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有高純度鎳及銀金屬部(無凸部之部分中之金屬部整體之厚度：0.1 μm)，而具備表面具有複數個針狀凸部，且於凸部之表面上具有複數個突起之金屬部之含金屬之粒子。 (實施例5) 將實施例1中獲得之懸浮液(A)加入至含有硝酸銀500 ppm、丁二醯亞胺10 g/L、氨水10 g/L之溶液中，而獲得粒子混合液(B)。 作為無電解鍍銀液，而準備藉由氨水將含有硝酸銀30 g/L、丁二醯亞胺100 g/L、及甲醛20 g/L之混合液之pH值調整為8而成之鍍銀液(C)。 又，準備含有二甲胺硼烷100 g/L、及氫氧化鈉0.5 g/L之突起形成用鍍覆液(D)(pH值10.0)。 於調整為60℃之分散狀態之粒子混合液(B)中緩慢滴加上述無電解鍍銀液(C)，而形成針狀突起。於無電解鍍銀液(C)之滴加速度為10 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍銀(鍍銀步驟)。其後，緩慢滴加上述突起形成用鍍覆液(D)，而進行突起形成。於突起形成用鍍覆液(D)之滴加速度為1 mL/分鐘、滴加時間為10分鐘之條件下進行突起形成。於突起形成用鍍覆液(D)之滴加中，一邊藉由超音波攪拌將所產生之銀突起核分散一邊進行鍍銀(突起形成步驟)。其後，藉由進行過濾取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有銀金屬部(無突起之部分中之金屬部整體之厚度：0.1 μm)，而具備表面上具有複數個突起之金屬部之含金屬之粒子。 (實施例6) 將實施例1中獲得之懸浮液(A)加入至含有氰化銀鉀500 ppm、氰化鉀10 g/L、及氫氧化鉀10 g/L之溶液中，而獲得粒子混合液(B)。 作為針狀突起形成用鍍覆液，而準備藉由氫氧化鉀將含有氰化銀鉀80 g/L、氰化鉀10 g/L、聚乙二醇1000(分子量：1000)20 mg/L、硫脲50 ppm、及肼一水合物100 g/L之混合液之pH值調整為7.5而成之鍍銀液(C)。 於調整為80℃之分散狀態之粒子混合液(B)中緩慢滴加上述無電解鍍銀液(C)，而形成針狀突起。於無電解鍍銀液(C)之滴加速度為10 mL/分鐘、滴加時間為60分鐘之條件下進行無電解鍍銀(針狀突起形成及鍍銀步驟)。其後，藉由進行過濾取出粒子，並進行水洗、乾燥，藉此獲得於樹脂粒子之表面配置有銀金屬部(無突起之部分中之金屬部整體之厚度：0.1 μm)，而具備表面形成有複數個針狀突起之銀金屬部之含金屬之粒子。 (實施例7) 將實施例1中獲得之懸浮液(A)加入至含有氰化銀鉀500 ppm、氰化鉀10 g/L、及氫氧化鉀10 g/L之溶液中，而獲得粒子混合液(B)。 作為針狀突起形成用鍍覆液，而準備藉由氫氧化鉀將含有氰化銀鉀80 g/L、氰化鉀10 g/L、聚乙二醇1000(分子量：1000)20 mg/L、硫脲50 ppm、及肼一水合物100 g/L之混合液之pH值調整為7.5而成之鍍銀液(C)。 又，作為無電解鍍銀液，而準備藉由氨水將含有硝酸銀30 g/L、丁二醯亞胺100 g/L、及甲醛20 g/L之混合液之pH值調整為8.0而成之鍍銀液(D)。 又，準備含有二甲胺硼烷100 g/L、及氫氧化鈉0.5 g/L之突起形成用鍍覆液(E)(pH值10.0)。 於調整為80℃之分散狀態之粒子混合液(B)中緩慢滴加上述無電解鍍銀液(C)，而形成針狀突起。於無電解鍍銀液(C)之滴加速度為10 mL/分鐘、滴加時間為45分鐘之條件下進行無電解鍍銀(針狀突起形成及鍍銀步驟)。 其後，藉由進行過濾取出粒子，而獲得於基材粒子A之表面上配置有銀金屬部，而具備表面具有針狀凸部之金屬部之粒子(F)。將粒子(F)加入至蒸餾水500重量份中，使其分散，藉此獲得粒子混合液(G)。 繼而，於調整為60℃之分散狀態之粒子混合液(G)中緩慢滴加上述鍍銀液(D)，進行無電解鍍銀。於鍍銀液(D)之滴加速度為10 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍銀。其後，緩慢滴加上述突起形成用鍍覆液(E)，而進行突起形成。於突起形成用鍍覆液(E)之滴加速度為1 mL/分鐘、滴加時間為10分鐘之條件下進行突起形成。於突起形成用鍍覆液(E)之滴加中，一邊藉由超音波攪拌將所產生之銀突起核分散一邊進行鍍銀(突起形成步驟)。其後，藉由進行過濾取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有銀金屬部(無凸部之部分中之金屬部整體之厚度：0.1 μm)，而具備表面具有複數個針狀凸部，且於凸部之表面上具有複數個突起之金屬部之含金屬之粒子。 (實施例8) 將實施例1中獲得之懸浮液(B)加入至含有硫酸鎳50 g/L、硝酸鉈30 ppm及硝酸鉍20 ppm之溶液中，而獲得粒子混合液(C)。 作為無電解鎳-鎢-硼合金鍍覆液，而準備藉由氫氧化鈉將含有硫酸鎳100 g/L、鎢酸鈉5 g/L、二甲胺硼烷30 g/L、硝酸鉍10 ppm、及檸檬酸三鈉30 g/L之混合液之pH值調整為6而成之無電解鎳-鎢-硼合金鍍覆液(D)。 又，作為無電解鍍銀液，而準備藉由氨水將硝酸銀30 g/L、丁二醯亞胺100 g/L、及甲醛20 g/L之混合液之pH值調整為8.0而成之鍍銀液(E)。 又，準備含有二甲胺硼烷100 g/L、及氫氧化鈉0.5 g/L之突起形成用鍍覆液(F)(pH值10.0)。 於調整為60℃之分散狀態之粒子混合液(C)中緩慢滴加上述無電解鎳-鎢-硼合金鍍覆液(D)，進行無電解鎳-鎢-硼合金鍍覆。於無電解鎳-鎢-硼合金鍍覆液(D)之滴加速度為15 mL/分鐘、滴加時間為60分鐘之條件下進行無電解鎳-鎢-硼合金鍍覆。由此獲得含有於基材粒子A之表面上配置有鎳-鎢-硼合金金屬部，而具備表面具有凸部之金屬部之粒子的粒子混合液(G)。 其後，藉由過濾粒子混合液(G)而取出粒子，並進行水洗，藉此獲得於上述基材粒子A之表面上配置有鎳-鎢-硼合金金屬層，而具備表面具有凸部之金屬部之粒子。將該粒子充分水洗後，加入至蒸餾水500重量份中，使其分散，藉此獲得粒子混合液(H)。 繼而，於調整為60℃之分散狀態之粒子混合液(H)中緩慢滴加上述鍍銀液(E)，進行無電解鍍銀。於鍍銀液(E)之滴加速度為10 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍銀。其後，緩慢滴加上述突起形成用鍍覆液(F)而進行突起形成。於突起形成用鍍覆液(F)之滴加速度為1 mL/分鐘、滴加時間為10分鐘之條件下進行突起形成。於突起形成用鍍覆液(F)之滴加中，一邊藉由超音波攪拌將所產生之銀突起核分散一邊進行鍍銀(突起形成步驟)。其後，藉由進行過濾取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有鎳-鎢-硼合金及銀金屬部(無凸部之部分中之金屬部整體之厚度：0.1 μm)，而具備表面具有複數個凸部，且於凸部之表面上具有複數個突起之金屬部之含金屬之粒子。 (實施例9) 將實施例1中獲得之懸浮液(B)加入至含有硫酸鎳50 g/L、硝酸鉈30 ppm及硝酸鉍20 ppm之溶液中，而獲得粒子混合液(C)。 作為無電解鎳-鎢-硼合金鍍覆液，而準備藉由氫氧化鈉將含有硫酸鎳100 g/L、鎢酸鈉2 g/L、二甲胺硼烷30 g/L、硝酸鉍10 ppm、及檸檬酸三鈉30 g/L之混合液之pH值調整為6而成之無電解鎳-鎢-硼合金鍍覆液(D)。 又，作為無電解鍍金液，而準備藉由氫氧化鉀將含有氰化金鉀30 g/L、氰化鉀2 g/L、檸檬酸三鈉30 g/L、乙二胺四乙酸15 g/L、氫氧化鉀10 g/L、及二甲胺硼烷20 g/L之混合液之pH值調整為8.0而成之鍍金液(E)。 又，準備含有硼氫化鈉30 g/L、及氫氧化鈉0.5 g/L之突起形成用鍍覆液(F)(pH值10.0)。 於調整為60℃之分散狀態之粒子混合液(C)中緩慢滴加上述無電解鎳-鎢-硼合金鍍覆液(D)，進行無電解鎳-鎢-硼合金鍍覆。於無電解鎳-鎢-硼合金鍍覆液(D)之滴加速度為15 mL/分鐘、滴加時間為60分鐘之條件下進行無電解鎳-鎢-硼合金鍍覆。由此獲得於基材粒子A之表面上配置有鎳-鎢-硼合金金屬部，而具備表面具有凸部之金屬部之粒子(G)。 其後，藉由過濾懸浮液(G)而取出粒子，並進行水洗，藉此獲得於上述基材粒子A之表面上配置有鎳-鎢-硼合金金屬部，而具備表面具有凸部之金屬部之粒子。將該粒子充分水洗後，加入至蒸餾水500重量份中，使其分散，藉此獲得粒子混合液(H)。 繼而，於調整為60℃之分散狀態之粒子混合液(H)中緩慢滴加上述無電解鍍金液(E)，而進行無電解鍍金。於無電解鍍金液(E)之滴加速度為10 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍金。其後，緩慢滴加上述突起形成用鍍覆液(F)而進行突起形成。於突起形成用鍍覆液(F)之滴加速度為1 mL/分鐘、滴加時間為5分鐘之條件下進行突起形成。於突起形成用鍍覆液(F)之滴加中，一邊藉由超音波攪拌將所產生之金突起核分散一邊進行鍍金(突起形成步驟)。其後，藉由進行過濾取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有鎳-鎢-硼合金及金金屬部(無凸部之部分中之金屬部整體之厚度：0.1 μm)，而具備表面具有複數個凸部，且於凸部之表面上具有複數個突起之金屬部之含金屬之粒子。 (實施例10) 將實施例1中獲得之懸浮液(B)加入至含有硫酸銅20 g/L、及乙二胺四乙酸30 g/L之溶液中，而獲得粒子混合液(C)。 又，作為無電解鍍銅液，而準備藉由氨將含有硫酸銅250 g/L、乙二胺四乙酸150 g/L、葡萄糖酸鈉100 g/L、及甲醛50 g/L之混合液之pH值調整為10.5而成之鍍銅液(D)。 又，作為無電解鍍錫液，而準備藉由硫酸將含有氯化錫20 g/L、氮基三乙酸50 g/L、硫脲2 g/L、硫代蘋果酸1 g/L、乙二胺四乙酸7.5 g/L、及三氯化鈦15 g/L之混合液之pH值調整為7.0而成之鍍錫液(E)。 又，準備含有二甲胺硼烷100 g/L之突起形成用鍍覆液(F)(pH值7.0)。 於調整為55℃之分散狀態之粒子混合液(C)中緩慢滴加上述鍍銅液(D)，進行無電解鍍銅。於鍍銅液(D)之滴加速度為30 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍銅。其後，藉由進行過濾取出粒子，由此獲得含有於基材粒子A之表面上配置有銅金屬部，而具備表面具有凸部之金屬部之粒子的粒子混合液(G)。 其後，藉由過濾粒子混合液(G)而取出粒子，並進行水洗，藉此獲得於上述基材粒子A之表面上配置銅金屬部，而具備表面具有凸部之金屬部之粒子。將該粒子充分水洗後，加入至蒸餾水500重量份中，使其分散，藉此獲得粒子混合液(H)。 繼而，於調整為60℃之分散狀態之粒子混合液(H)中緩慢滴加上述鍍錫液(E)，而進行無電解鍍錫。於鍍錫液(E)之滴加速度為10 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍錫。其後，緩慢滴加上述突起形成用鍍覆液(F)而進行突起形成。於突起形成用鍍覆液(F)之滴加速度為1 mL/分鐘、滴加時間為10分鐘之條件下進行突起形成。於突起形成用鍍覆液(F)之滴加中，一邊藉由超音波攪拌將所產生之錫突起核分散一邊進行鍍錫(突起形成步驟)。其後，藉由進行過濾取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有銅及錫金屬部(無凸部之部分中之金屬部整體之厚度：0.1 μm)，而具備表面具有複數個凸部，且於凸部之表面上具有複數個突起之金屬部之含金屬之粒子。 (實施例11) (1)聚矽氧低聚物之製作 於設置於溫浴槽內之100 ml之可分離式燒瓶中加入1,3-二乙烯基四甲基二矽氧烷1重量份、與0.5重量%對甲苯磺酸水溶液20重量份。於40℃下攪拌1小時後，添加碳酸氫鈉0.05重量份。其後，添加二甲氧基甲基苯基矽烷10重量份、二甲基二甲氧基矽烷49重量份、三甲基甲氧基矽烷0.6重量份、及甲基三甲氧基矽烷3.6重量份，進行1小時之攪拌。其後，添加10重量%氫氧化鉀水溶液1.9重量份，一邊升溫至85℃並藉由吸出器減壓，一邊攪拌10小時，而進行反應。反應結束後，恢復至常壓並冷卻至40℃，添加乙酸0.2重量份，於分液漏斗內靜置12小時以上。取出二層分離後之下層，利用蒸發器進行精製，藉此獲得聚矽氧低聚物。 (2)聚矽氧粒子材料(含有有機聚合物)之製作 準備於所獲得之聚矽氧低聚物30重量份中溶解2-乙基過氧己酸第三丁酯(聚合起始劑，日油公司製造之「Perbutyl O」)0.5重量份而成之溶解液A。又，於離子交換水150重量份中混合月桂基硫酸三乙醇胺鹽40重量%水溶液(乳化劑)0.8重量份與聚乙烯醇(聚合度：約2000，皂化度：86.5～89莫耳%，日本合成化學公司製造之「Gohsenol GH-20」)之5重量%水溶液80重量份，而準備水溶液B。將上述溶解液A加入設置於溫浴槽中之可分離式燒瓶中後，添加上述水溶液B。其後，藉由使用Shirasu Porous Glass(SPG)膜(細孔平均徑約1 μm)進行乳化。其後，升溫至85℃，進行9小時之聚合。藉由離心分離將聚合後之粒子之全部量進行水洗淨，並進行冷凍乾燥。乾燥後，藉由球磨機進行粉碎直至粒子之凝聚體成為目標比(平均2次粒徑/平均1次粒徑)為止，而獲得粒徑為3.0 μm之聚矽氧粒子(基材粒子B)。 將上述基材粒子A變更為上述基材粒子B，以與實施例1同樣之方式形成金屬部，而獲得含金屬之粒子。 (實施例12) 使用兩封端丙烯酸聚矽氧油(信越化學工業公司製造之「X-22-2445」)代替聚矽氧低聚物而獲得粒徑為3.0 μm之聚矽氧粒子(基材粒子C)。 將上述基材粒子A變更為上述基材粒子C，以與實施例1同樣之方式形成金屬部，而獲得含金屬之粒子。 (實施例13) 準備純銅粒子(Nippon Atomized Metal Powders Corporation製造之「HXR-Cu」，粒徑2.5 μm)作為基材粒子D。 將上述基材粒子A變更為上述基材粒子D，以與實施例1同樣之方式形成金屬部，而獲得含金屬之粒子。 (實施例14) 準備純銀粒子(粒徑2.5 μm)作為基材粒子E。 將上述基材粒子A變更為上述基材粒子E，以與實施例1同樣之方式形成金屬部，而獲得含金屬之粒子。 (實施例15) 準備僅粒徑與基材粒子A不同、粒徑為2.0 μm之基材粒子F。 將上述基材粒子A變更為上述基材粒子F，以與實施例1同樣之方式形成金屬部，而獲得含金屬之粒子。 (實施例16) 準備僅粒徑與基材粒子A不同、粒徑為10.0 μm之基材粒子G。 將上述基材粒子A變更為上述基材粒子G，以與實施例1同樣之方式形成金屬部，而獲得含金屬之粒子。 (實施例17) 準備僅粒徑與基材粒子A不同、粒徑為50.0 μm之基材粒子H。 將上述基材粒子A變更為上述基材粒子H，以與實施例1同樣之方式形成金屬部，而獲得含金屬之粒子。 (實施例18) 於安裝有四口可分離式蓋、攪拌翼、三向旋塞、冷卻管及溫度探針之1000 mL之可分離式燒瓶中，以固形物成分率成為5重量%之方式稱取包含甲基丙烯酸甲酯100 mmol、N,N,N-三甲基-N-2-甲基丙烯醯氧基乙基氯化銨1 mmol、及2,2'-偶氮雙(2-脒基丙烷)二鹽酸鹽1 mmol之單體組合物加入離子交換水中後，以200 rpm加以攪拌，於氮氣環境、70℃下進行24小時之聚合。反應結束後，進行冷凍乾燥，而獲得表面具有銨基、且平均粒徑為220 nm及CV值為10%之絕緣性粒子。 於超音波照射下使絕緣性粒子分散於離子交換水中，而獲得絕緣性粒子之10重量%水分散液。 將實施例1中獲得之含金屬之粒子10 g分散於離子交換水500 mL中，並添加絕緣性粒子之水分散液4 g，於室溫下攪拌6小時。利用3 μm之篩網過濾器進行過濾後，進而利用甲醇進行洗淨，並加以乾燥，而獲得附著有絕緣性粒子之含金屬之粒子。 藉由掃描式電子顯微鏡(SEM)進行觀察，結果於含金屬之粒子之表面僅形成1層由絕緣性粒子形成之被覆層。藉由圖像解析算出相對於距含金屬之粒子之中心2.5 μm之面積的絕緣性粒子之被覆面積(即絕緣性粒子之粒徑之投影面積)，結果被覆率為30%。 (實施例19) 將實施例1中獲得之懸浮液(B)加入至含有硫酸鎳50 g/L、硝酸鉈30 ppm及硝酸鉍20 ppm之溶液中，而獲得粒子混合液(C)。 作為無電解鎳-磷合金鍍覆液，而準備藉由氫氧化鈉將含有硫酸鎳100 g/L、次磷酸鈉30 g/L、硝酸鉍10 ppm、及檸檬酸三鈉30 g/L之混合液之pH值調整為6而成之無電解鎳-磷合金鍍覆液(D)。 又，作為無電解鍍銀液，而準備藉由氨水將硝酸銀30 g/L、丁二醯亞胺100 g/L、及甲醛20 g/L之混合液之pH值調整為8.0而成之鍍銀液(E)。 又，準備含有次磷酸鈉130 g/L、及氫氧化鈉0.5 g/L之突起形成用鍍覆液(F)(pH值12.0)。 於調整為65℃之分散狀態之粒子混合液(C)中緩慢滴加上述無電解鎳-磷合金鍍覆液(D)，進行無電解鎳-磷合金鍍覆。於無電解鎳-磷合金鍍覆液(D)之滴加速度為15 mL/分鐘、滴加時間為60分鐘之條件下進行無電解鎳-磷合金鍍覆。由此獲得含有於基材粒子A之表面上配置有鎳-磷合金金屬部，而具備表面具有凸部之金屬部之粒子的粒子混合液(G)。 其後，藉由過濾粒子混合液(G)而取出粒子，並進行水洗，藉此獲得於上述基材粒子A之表面上配置有鎳-磷合金金屬層，而具備表面具有凸部之金屬部之粒子。將該粒子充分水洗後，加入至蒸餾水500重量份中，使其分散，藉此獲得粒子混合液(H)。 繼而，於調整為60℃之分散狀態之粒子混合液(H)中緩慢滴加上述鍍銀液(E)，進行無電解鍍銀。於鍍銀液(E)之滴加速度為10 mL/分鐘、滴加時間為30分鐘之條件下進行無電解鍍銀。其後，緩慢滴加上述突起形成用鍍覆液(F)而進行突起形成。於突起形成用鍍覆液(F)之滴加速度為1 mL/分鐘、滴加時間為10分鐘之條件下進行突起形成。於突起形成用鍍覆液(F)之滴加中，一邊藉由超音波攪拌將所產生之銀突起核分散一邊進行鍍銀(突起形成步驟)。其後，藉由進行過濾取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有鎳-磷合金及銀金屬部(無凸部之部分中之金屬部整體之厚度：0.1 μm)，而具備表面具有複數個凸部，且於凸部之表面上具有複數個突起之金屬部之含金屬之粒子。 (實施例20) 針對實施例1中獲得之含金屬之粒子，使用大和化成公司製造之「New Dain Silver」作為銀變色防止劑而進行防硫化處理。 使用超音波分散器使實施例1中獲得之含金屬之粒子10重量份分散於含有10重量%之New Dain Silver之異丙醇溶液100重量份中後，將溶液進行過濾，藉此獲得形成有防硫化膜之含金屬之粒子。 (實施例21) 針對實施例1中獲得之含金屬之粒子，使用2-巰基苯并噻唑溶液作為銀硫化防止劑而進行防硫化處理。 使用超音波分散器使實施例1中獲得之含金屬之粒子10重量份分散於含有2-巰基苯并噻唑0.5重量%之異丙醇溶液100重量份中後，將溶液進行過濾，藉此獲得形成有防硫化膜之含金屬之粒子。 (比較例1) 使用超音波分散器使上述10重量份之基材粒子A分散於含有鈀觸媒液5重量%之鹼溶液100重量份中後，藉由將溶液進行過濾而取出基材粒子A。繼而，將基材粒子A添加至二甲胺硼烷1重量%溶液100重量份中，將基材粒子A之表面活化。將表面經活化之基材粒子A充分水洗後，加入至蒸餾水500重量份中，使其分散，藉此獲得分散液(A)。 繼而，花費3分鐘將金屬鎳粒子漿料(三井金屬公司製造之「2020SUS」，平均粒徑150 nm)1 g添加至上述分散液(A)中，而獲得含有附著有芯物質之基材粒子A之懸浮液(B)。 將懸浮液(B)加入至含有硫酸鎳50 g/L、硝酸鉈30 ppm及硝酸鉍20 ppm之溶液中，而獲得粒子混合液(C)。 又，準備含有硫酸鎳200 g/L、次磷酸鈉85 g/L、檸檬酸鈉30 g/L、硝酸鉈50 ppm、及硝酸鉍20 ppm之鍍鎳液(D)(pH值6.5)。 於調整為50℃之分散狀態之粒子混合液(C)中緩慢滴加上述鍍鎳液(D)，而進行無電解鍍鎳。於鍍鎳液(D)之滴加速度為25 mL/分鐘、滴加時間為60分鐘之條件下進行無電解鍍鎳(鍍Ni步驟)。其後，藉由進行過濾取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有鎳-磷合金金屬部，而具備表面具有突起之金屬部之含金屬之粒子合金(無突起之部分中之金屬部整體之厚度：0.1 μm)。 (比較例2) 使用超音波分散器使10重量份之基材粒子A分散於含有鈀觸媒液5重量%之鹼溶液100重量份中後，藉由將溶液進行過濾而取出基材粒子A。繼而，將基材粒子A添加至二甲胺硼烷1重量%溶液100重量份中，將基材粒子A之表面活化。將表面經活化之基材粒子A充分水洗後，添加至蒸餾水500重量份中，使其分散，藉此獲得懸浮液(A)。 將懸浮液(A)加入至含有硫酸鎳50 g/L、硝酸鉈30 ppm及硝酸鉍20 ppm之溶液中，而獲得粒子混合液(B)。 又，準備含有次磷酸鈉300 g/L、及氫氧化鈉10 g/L之突起形成用鍍覆液(C)(pH值11.0)。 又，準備含有硫酸鎳200 g/L、次磷酸鈉85 g/L、檸檬酸鈉30 g/L、硝酸鉈50 ppm、及硝酸鉍20 ppm之鍍鎳液(D)(pH值6.5)。 於調整為50℃之分散狀態之粒子混合液(B)中緩慢滴加上述突起形成用鍍覆液(C)，而進行突起形成。於突起形成用鍍覆液(C)之滴加速度為20 mL/分鐘、滴加時間為5分鐘之條件下進行突起形成。於突起形成用鍍覆液(C)之滴加中，一邊藉由超音波攪拌將所產生之Ni突起核分散一邊進行鍍鎳(突起形成步驟)。由此獲得分散狀態之Ni突起核及粒子混合液(E)。 其後，於分散狀態之Ni突起核及粒子混合液(E)中緩慢滴加上述鍍鎳液(D)，而進行無電解鍍鎳。於鍍鎳液(D)之滴加速度為25 mL/分鐘、滴加時間為60分鐘之條件下進行無電解鍍鎳。於鍍鎳液(D)之滴加中，一邊藉由超音波攪拌將所產生之Ni突起核分散一邊進行鍍鎳(鍍Ni步驟)。其後，藉由進行過濾取出粒子，並進行水洗、乾燥，藉此獲得於基材粒子A之表面上配置有鎳-磷合金金屬部，而具備表面具有突起之金屬部之含金屬之粒子(無突起之部分中之金屬部整體之厚度：0.1 μm)。 (評價) (1)凸部及突起之高度之測定 以含量成為30重量%之方式將所獲得之含金屬之粒子添加至Kulzer公司製造之「Technovit 4000」中，使其分散，而製作含金屬之粒子檢查用嵌埋樹脂。使用離子研磨裝置(Hitachi High-Technologies公司製造之「IM4000」)，以通過分散於該檢查用嵌埋樹脂中之含金屬之粒子之中心附近的方式切出含金屬之粒子之剖面。 然後，使用場發射型穿透式電子顯微鏡(FE-TEM)(日本電子公司製造之「JEM-ARM200F」)，將圖像倍率設定為5萬倍，隨機選擇20個含金屬之粒子，觀察各含金屬之粒子之凸部及突起。計測所獲得之含金屬之粒子中之凸部及突起之高度，對其進行算術平均而作為凸部及突起之平均高度。 (2)突起之基部之平均徑之測定 以含量成為30重量%之方式將所獲得之含金屬之粒子添加至Kulzer公司製造之「Technovit 4000」中，使其分散，而製作含金屬之粒子檢查用嵌埋樹脂。使用離子研磨裝置(Hitachi High-Technologies公司製造之「IM4000」)，以通過分散於該檢查用嵌埋樹脂中之含金屬之粒子之中心附近的方式切出含金屬之粒子之剖面。 然後，使用場發射型穿透式電子顯微鏡(FE-TEM)(日本電子公司製造之「JEM-ARM200F」)，將圖像倍率設定為5萬倍，隨機選擇20個含金屬之粒子，觀察各含金屬之粒子之凸部及突起。計測所獲得之含金屬之粒子中之凸部及突起之基部徑，對其進行算術平均而作為凸部及突起之平均基部徑。 (3)凸部及突起之形狀之觀察 使用掃描式電子顯微鏡(FE-SEM)，將圖像倍率設定為25000倍，隨機選擇20個含金屬之粒子，觀察各含金屬之粒子之凸部及突起，對全部凸部及突起所屬之形狀之種類進行調查。 (4)凸部及突起之頂角之平均值之測定 以含量成為30重量%之方式將所獲得之含金屬之粒子添加至Kulzer公司製造之「Technovit 4000」中，使其分散，而製作含金屬之粒子檢查用嵌埋樹脂。使用離子研磨裝置(Hitachi High-Technologies公司製造之「IM4000」)，以通過分散於該檢查用嵌埋樹脂中之含金屬之粒子之中心附近的方式切出含金屬之粒子之剖面。 然後，使用場發射型穿透式電子顯微鏡(FE-TEM)(日本電子公司製造之「JEM-ARM200F」)，將圖像倍率設定為100萬倍，隨機選擇20個含金屬之粒子，觀察各含金屬之粒子之突起部。計測所獲得之含金屬之粒子中之凸部及突起之頂角，對其進行算術平均而作為凸部及突起之頂角之平均值。 (5)凸部及突起之高度之中央位置的平均徑之測定 以含量成為30重量%之方式將所獲得之含金屬之粒子添加至Kulzer公司製造之「Technovit 4000」中，使其分散，而製作含金屬之粒子檢查用嵌埋樹脂。使用離子研磨裝置(Hitachi High-Technologies公司製造之「IM4000」)，以通過分散於該檢查用嵌埋樹脂中之含金屬之粒子之中心附近的方式切出含金屬之粒子之剖面。 然後，使用場發射型穿透式電子顯微鏡(FE-TEM)(日本電子公司製造之「JEM-ARM200F」)，將圖像倍率設定為5萬倍，隨機選擇20個含金屬之粒子，觀察各含金屬之粒子之突起部。計測所獲得之含金屬之粒子中之凸部及突起之基部徑，對其進行算術平均而求出凸部及突起之高度之中央位置之平均徑。 (6)為針狀之凸部及突起個數之比率之測定 使用掃描式電子顯微鏡(FE-SEM)，將圖像倍率設定為25000倍，隨機選擇20個含金屬之粒子，觀察各含金屬之粒子之凸部及突起。對於全部凸部及突起，評價凸部形狀及突起形狀是否為前端變細之針狀，而分為凸部形狀及突起形狀由前端變細之針狀所形成之凸部及突起，以及凸部形狀及突起形狀未由前端變細之針狀所形成之凸部及突起。由此計測每個含金屬之粒子之：1)由前端變細之針狀所形成之凸部及突起之個數、及2)未由前端變細之針狀形狀所形成之凸部及突起之個數。算出1)與2)之突起部之總個數100%中為1)針狀之凸部及突起個數之比率X。 (7)無凸部及突起之部分中之金屬部整體之厚度之測定 以含量成為30重量%之方式將所獲得之含金屬之粒子添加至Kulzer公司製造之「Technovit 4000」中，使其分散，而製作含金屬之粒子檢查用嵌埋樹脂。使用離子研磨裝置(Hitachi High-Technologies公司製造之「IM4000」)，以通過分散於該檢查用嵌埋樹脂中之含金屬之粒子之中心附近的方式切出含金屬之粒子之剖面。 然後，使用場發射型穿透式電子顯微鏡(FE-TEM)(日本電子公司製造之「JEM-ARM200F」)，將圖像倍率設定為5萬倍，隨機選擇20個含金屬之粒子，觀察各含金屬之粒子之無突起之部分中的金屬部。計測所獲得之含金屬之粒子中之無突起之部分中的金屬部整體之厚度，對其進行算術平均而作為厚度(平均厚度)(記載於上述實施例及比較例中)。 (8)含金屬之粒子之壓縮彈性模數(10%K值) 於23℃之條件下，藉由上述之方法，使用微小壓縮試驗機(Fischer公司製造之「Fischerscope H-100」)測定所獲得之含金屬之粒子之上述壓縮彈性模數(10%K值)。求出10%K值。 (9)金屬部之面格子之評價 使用X射線繞射裝置(理學電機公司製造之「RINT2500VHF」)，算出依存於繞射角之裝置固有之繞射線的峰強度比。求出(111)方位之繞射峰強度於金層之繞射線整體之繞射峰強度中所占之比率((111)面之比率)。 (10)連接結構體A中之金屬部突起之前端之熔融及固化狀態 以含量成為10重量%之方式將所獲得之含金屬之粒子添加至三井化學公司製造之「Struct Bond XN-5A」中，使其分散，而製作各向異性導電糊劑。 準備上表面具有L/S為30 μm/30 μm之銅電極圖案之透明玻璃基板。又，準備下表面具有L/S為30 μm/30 μm之金電極圖案之半導體晶片。 以厚度成為30 μm之方式將剛製作後之各向異性導電糊劑塗佈於上述透明玻璃基板上，從而形成各向異性導電糊劑層。其次，以電極彼此相對向之方式將上述半導體晶片積層於各向異性導電糊劑層上。其後，一邊以各向異性導電糊劑層之溫度成為250℃之方式調整頭之溫度，一邊於半導體晶片之上表面載置加壓加熱頭，施加0.5 MPa之壓力，於250℃下使各向異性導電糊劑層硬化，而獲得連接結構體A。為了獲得連接結構體A，而於0.5 MPa之低壓下將電極間連接。 將所獲得之連接結構體裝入至Kulzer公司製造之「Technovit 4000」中使其硬化，而製作連接結構體檢查用嵌埋樹脂。使用離子研磨裝置(Hitachi High-Technologies公司製造之「IM4000」)，以通過該檢查用樹脂中之連接結構體之中心附近之方式切出含金屬之粒子之剖面。 然後，使用掃描式電子顯微鏡(FE-SEM)，對所獲得之連接結構體A進行剖面觀察，藉此判定含金屬之粒子之金屬部突起之前端熔融後是否固化。 [金屬部突起之前端之熔融及固化狀態之判定基準] A：金屬部之突起之前端熔融後固化 B：金屬部之突起之前端熔融後未固化 (11)連接結構體A中之金屬部之突起之接合狀態 於上述(10)之評價中所獲得之連接結構體A中，對連接結構體A進行剖面觀察，藉此判定金屬部之突起之接合狀態。 [金屬部突起之接合狀態之判定基準] A：於連接部中，含金屬之粒子中之金屬部突起之前端熔融後固化，與電極及其他含金屬之粒子接合 B：於連接部中，含金屬之粒子中之金屬部突起之前端熔融後固化，未與電極及其他含金屬之粒子接合 (12)連接結構體A之連接可靠性 藉由4端子法測定15個上述(10)之評價中所獲得之連接結構體A之上下電極間之連接電阻。算出連接電阻之平均值。再者，根據電壓＝電流×電阻之關係，可藉由測定流通恆定之電流時之電壓而求出連接電阻。按照下述之基準判定連接可靠性。 [連接可靠性之判定基準] ○○○：連接電阻為1.0 Ω以下 ○○：連接電阻超過1.0 Ω，且為2.0 Ω以下 ○：連接電阻超過2.0 Ω，且為3.0 Ω以下 △：連接電阻超過3.0 Ω，且為5 Ω以下 ×：連接電阻超過5 Ω (13)連接結構體B中之金屬部突起之前端之熔融及固化狀態 以含量成為5重量%之方式，將所獲得之含金屬之粒子添加至Nihon Superior公司製造之「ANP-1」(含有含金屬原子之粒子)中，使其分散，而製作燒結銀糊劑。 作為第1連接對象構件，而準備對連接面實施有鍍Ni/Au之功率半導體元件。作為第2連接對象構件，而準備對連接面實施有鍍Cu之氮化鋁基板。 以成為約70 μm之厚度之方式將上述燒結銀糊劑塗佈於第2連接對象構件上，而形成連接用銀糊劑層。其後，將上述第1連接對象構件積層於連接用銀糊劑層上，而獲得積層體。 藉由130℃之加熱板將所獲得之積層體預熱60秒，其後，對積層體施加10 MPa之壓力，並且於300℃下將其加熱3分鐘，藉此將燒結銀糊劑所含之上述含金屬原子之粒子燒結，而形成包含燒結物與含金屬之粒子之連接部，藉由該燒結物將上述第1、第2連接對象構件接合，而獲得連接結構體B。 將所獲得之連接結構體裝入至Kulzer公司製造之「Technovit 4000」中，使其硬化，而製作連接結構體檢查用嵌埋樹脂。使用離子研磨裝置(Hitachi High-Technologies公司製造之「IM4000」)，以通過該檢查用嵌埋樹脂中之連接結構體之中心附近之方式切出含金屬之粒子之剖面。 然後，使用掃描式電子顯微鏡(FE-SEM)，對所獲得之連接結構體B進行剖面觀察，藉此判定含金屬之粒子之金屬部突起之前端熔融後是否固化。 [金屬部之突起之前端之熔融及固化狀態之判定基準] A：金屬部之突起之前端熔融後固化 B：金屬部之突起之前端熔融後未固化 (14)連接結構體B中之金屬部之突起之接合狀態 於上述(13)之評價中所獲得之連接結構體B中，對連接結構體B進行剖面觀察，藉此判定金屬部之突起之接合狀態。 [金屬部之突起之接合狀態之判定基準] A：於連接部中，含金屬之粒子中之金屬部突起之前端熔融後固化，與電極及其他含金屬之粒子接合 B：於連接部中，含金屬之粒子中之金屬部突起之前端熔融後固化，未與電極及其他含金屬之粒子接合 (15)連接結構體B之連接可靠性 將上述(13)之評價中所獲得之連接結構體B投入至冷熱衝擊試驗機(ESPEC公司製造：TSA-101S-W)中，以最低溫度-40℃下保持時間30分鐘、最高溫度200℃下保持時間30分鐘之處理條件作為1個週期，3000個週期後藉由剪切強度試驗機(Rhesca公司製造：STR-1000)測定接合強度。按照下述之基準判定連接可靠性。 [連接可靠性之判定基準] ○○○：接合強度為50 MPa以上 ○○：接合強度超過40 MPa，且為50 MPa以下 ○：接合強度超過30 MPa，且為40 MPa以下 △：接合強度超過20 MPa，且為30 MPa以下 ×：接合強度為20 MPa以下 (16)導通檢查用構件之接觸電阻值 調配聚矽氧系共聚物10重量份、所獲得之含金屬之粒子90重量份、環氧矽烷偶合劑(信越化學工業公司製造，「KBE-303」)1重量份及異丙醇36重量份，使用勻相分散機，於1000 rpm下攪拌20分鐘後，使用Thinky公司製造之「練太郎ARE250」進行脫泡，藉此製備含有含金屬之粒子與黏合劑之導電材料。 上述之聚矽氧系共聚物係藉由以下方法進行聚合。於內容量2 L之金屬混練機內裝入4,4'-二環己基甲烷二異氰酸酯(Degussa公司製造)162 g(628 mmol)、單封端胺基改性聚二甲基矽氧烷(Momentive公司製造之「TSF4709」)(分子量10000)900 g(90 mmol)，於70～90℃下溶解後，進行2小時之攪拌。其後，緩慢添加新戊二醇(Mitsubishi Gas Chemical公司製造)65 g(625 mmol)，混練30分鐘，繼而將未反應之新戊二醇減壓除去。所獲得之聚矽氧系共聚物係以成為20重量%之方式使其溶解於異丙醇中而使用。再者，異氰酸酯基之消失係藉由IR光譜進行確認。於所獲得之聚矽氧系共聚物中，聚矽氧含量為80重量%，重量平均分子量為25000，SP值為7.8，具有極性基之結構(聚胺基甲酸酯)之重複單元之SP值為10。 繼而，作為導通檢查用構件之基材(由絕緣材料形成之片狀之基材)，而準備聚矽氧橡膠。聚矽氧橡膠之尺寸為橫寬25 mm、縱寬25 mm及厚度1 mm。於聚矽氧橡膠中形成有縱20個及橫20個、總數400個之藉由雷射加工所形成之直徑0.5 mm之圓柱狀之貫通孔。 使用刮刀塗佈機，將上述導電材料塗佈於具有貫通孔之聚矽氧橡膠上，於貫通孔中填充導電材料。繼而，於烘箱中將貫通孔中填充有導電材料之聚矽氧橡膠在50℃下乾燥10分鐘後，進而繼續於100℃下乾燥20分鐘，而獲得厚度1 mm之導通檢查用構件。 所獲得之導通檢查用構件之接觸電阻值係使用接觸電阻測定系統(FACTK公司製造之「MS7500」)進行測定。接觸電阻測定係藉由直徑0.5 mm之鉑探針，以荷重15 gf自垂直於所獲得之導通檢查用構件之導電部之方向進行加壓。此時，藉由低電阻計(鶴賀電機公司製造之「MODEL3566」)施加5 V之電壓，測定接觸電阻值。算出測定5處導電部而獲得之接觸連接電阻值之平均值。按照下述之基準判定接觸電阻值。 [接觸電阻值之判定基準] ○○：連接電阻之平均值為50.0 mΩ以下 ○：連接電阻之平均值超過50.0 mΩ，且為100.0 mΩ以下 △：連接電阻之平均值超過100.0 mΩ，且為500.0 mΩ以下 ×：連接電阻之平均值超過500.0 mΩ (17)導通檢查用構件之反覆可靠性試驗 準備上述(16)導通檢查用構件之接觸電阻值之評價的導通檢查用構件。 所獲得之導通檢查用構件之反覆可靠性試驗及接觸電阻值係使用接觸電阻測定系統(FACTK公司製造之「MS7500」)進行測定。反覆可靠性試驗係藉由直徑0.5 mm之鉑探針，以荷重15 gf自垂直於所獲得之探針片之導電部之方向反覆加壓1000次。反覆加壓1000次後，藉由低電阻計(鶴賀電機公司製造之「MODEL3566」)施加5 V之電壓，測定接觸電阻值。算出同樣地測定5處導電部而獲得之接觸電阻值之平均值。按照下述之基準判定接觸電阻值。 [反覆加壓後之接觸電阻值之判定基準] ○○：連接電阻之平均值為100.0 mΩ以下 ○：連接電阻之平均值超過100.0 mΩ，且為500.0 mΩ以下 △：連接電阻之平均值超過500.0 mΩ，且為1000.0 mΩ以下 ×：連接電阻之平均值超過1000.0 mΩ 將組成及結果示於表1～5。 [表1]
[表2]
[表3]
[表4]
[表5]
再者，凸部及突起中之球狀包括球之一部分之形狀。再者，於比較例1、2中，確認到即使加熱至400℃，突起之前端亦不熔融。Hereinafter, the details of the present invention will be described. (Metal-Containing Particles) The metal-containing particles of the present invention include substrate particles and a metal portion. The metal portion is disposed on a surface of the substrate particle. In the metal-containing particle of the present invention, the metal portion has a plurality of protrusions on an outer surface. In the metal-containing particles of the present invention, the front end of the protrusion of the metal portion can be melted at 400 ° C or lower. In this invention, since it has the said structure, the front end of the protrusion of a metal part can be melted at a relatively low temperature. Therefore, the front end of the metal portion of the metal-containing particles can be melted at a relatively low temperature, and can be solidified after being melted to be bonded to other particles or other members. Furthermore, a plurality of metal-containing particles can be fusion-bonded. In addition, metal-containing particles can be fusion-bonded to a connection target member. Furthermore, metal-containing particles can be further melt-bonded to the electrode. It is known that if the particle diameter of the metal particles is as small as 100 nm or less and the number of constituent atoms is reduced, the surface area ratio of the particles to the volume will increase sharply, and the melting point or sintering temperature will be significantly reduced compared to the bulk state. The inventors have found that by reducing the diameter of the front end of the protrusion of the metal portion, the melting temperature of the front end of the protrusion of the metal portion can be reduced in the same manner as in the case of using nano-sized metal particles. In order to reduce the melting temperature at the front end of the protrusion of the metal portion, the shape of the protrusion portion may be a needle shape with a tapered tip. In order to reduce the melting temperature at the front end of the protrusion of the metal portion, a plurality of smaller protrusions may be formed on the outer surface of the metal portion. In order to reduce the melting temperature of the front end of the protrusion of the metal portion, in the metal-containing particles of the present invention, it is preferable that the metal portion has a plurality of convex portions (first protrusions) on an outer surface, and the metal portion is formed on the The convex portion has the above-mentioned protrusions (second protrusions) on the outer surface. Preferably, the convex portion is larger than the protrusion. The presence of the protrusions larger than the protrusions, which are different from the protrusions, further improves connection reliability. The protrusion can be integrated with the protrusion, and the protrusion can be attached to the protrusion. The protrusion may include particles. In this specification, a protruding portion where the protrusion is formed on the outer surface, which is different from the above-mentioned protrusion, is called a convex portion. The front end of the convex portion may not be melted at 400 ° C or lower. As described above, by reducing the end diameter before the protrusion, the melting temperature can be reduced. In order to reduce the melting temperature, the material of the metal portion may be selected. In order to make the melting temperature of the front end of the protrusion of the metal portion 400 ° C or lower, it is preferable to select the shape of the protrusion and the material of the metal portion. The melting temperature of the front end of the protrusion of the metal portion was evaluated as follows. The melting temperature at the front end of the protrusion of the metal portion can be measured using a differential scanning calorimeter ("DSC-6300" manufactured by Yamato Scientific). The above measurement was performed using 15 g of metal-containing particles under measurement conditions in a temperature range of 30 ° C to 500 ° C, a temperature increase rate of 5 ° C / min., And a nitrogen purge amount of 5 ml / min. Then, it was confirmed that the front end of the protrusion of the metal portion was melted at the melting temperature obtained by the above measurement. 1 g of metal-containing particles was placed in a container and placed in an electric furnace. The same temperature as the melting temperature obtained in the above measurement was set in an electric furnace, and heated in a nitrogen atmosphere for 10 minutes. Thereafter, the heated metal-containing particles were taken out of the electric furnace, and the melting state (or the solidified state after melting) of the front end of the protrusion was confirmed using a scanning electron microscope. From the viewpoint of effectively reducing the melting temperature at the front end of the protrusion and effectively improving the connection reliability, the shape of the protrusion is preferably a needle shape with a tapered tip. In the metal-containing particle, the shape of the protrusion on the outer surface of the metal portion is different from the previous shape, and a new effect obtained by making the shape of the protrusion into a needle shape with a tapered tip is exerted. The metal-containing particles of the present invention can be used for connection of two connection target members because the front ends of the protrusions of the metal portion can be fusion-bonded at a relatively low temperature. By fusion-bonding the front end of the above-mentioned metal portion of the metal-containing particles between the two connection target members, a connection portion exhibiting a strong connection can be formed, and connection reliability can be improved. In addition, the metal-containing particles of the present invention can also be used for conductive connection. Furthermore, the metal-containing particles of the present invention can also be used as a gap control material (spacer). The average value (a) of the apex angles of the plurality of protrusions is preferably 10 ° or more, more preferably 20 ° or more, and preferably 60 ° or less, and more preferably 45 ° or less. When the average value (a) of the said apex angle is more than the said lower limit, it becomes difficult for a protrusion to bend excessively. If the average value (a) of the said apex angle is below the said upper limit, a melting temperature will fall further. In addition, the bent protrusion may increase the connection resistance between the electrodes during the conductive connection. The average value (a) of the apex angles of the protrusions can be obtained by averaging the apex angles of the protrusions included in one metal-containing particle. The average height (b) of the plurality of protrusions is preferably 3 nm or more, more preferably 5 nm or more, even more preferably 50 nm or more, and preferably 5000 nm or less, more preferably 1000 nm or less, and further preferably It is 800 nm or less. When the average height (b) of the protrusions is greater than or equal to the above lower limit, the melting temperature is further reduced. When the average height (b) of the protrusions is equal to or less than the upper limit, the protrusions are less likely to be bent excessively. The average height (b) of the protrusions is an average value of the heights of the protrusions included in one metal-containing particle. In the case where the metal portion does not have the above-mentioned convex portion and has the above-mentioned protrusion, the height of the above-mentioned protrusion represents the line connecting the center of the metal-containing particle and the front end of the protrusion (the dotted line L1 shown in FIG. 1) The distance from the imaginary line (dotted line L2 shown in Fig. 1) of the metal part in the case (on the outer surface of the spherical metal-containing particle in the case of no protrusion) to the front end of the protrusion. That is, in FIG. 1, the distance from the intersection of the dotted line L1 and the dotted line L2 to the front end of the protrusion is shown. Furthermore, in a case where the metal portion has the convex portion and the protrusion, that is, when the metal portion has the protrusion on the convex portion, the height of the protrusion indicates the metal from a case where no protrusion is assumed. The distance from the imaginary line of the part (convex part) to the front end of the protrusion. The protrusion may also be an aggregate of a plurality of particles. For example, the protrusion may be formed by connecting a plurality of particles constituting the protrusion. In this case, the height of the protrusion is the height of the protrusion when the aggregate or connected particles of a plurality of particles are regarded as a whole. In FIG. 3, the heights of the protrusions 1Ba and 3Ba also represent the distance from the imaginary line of the metal portion to the front end of the protrusion when it is assumed that there are no protrusions. The average diameter (c) of the bases of the plurality of protrusions is preferably 3 nm or more, more preferably 5 nm or more, still more preferably 50 nm or more, and preferably 1000 nm or less, and more preferably 800 nm or less. When the average diameter (c) is greater than or equal to the above lower limit, it is difficult for the protrusion to bend excessively. When the average diameter (c) is equal to or smaller than the upper limit, connection reliability is further improved. The average diameter (c) of the bases of the protrusions is an average value of the diameters of the bases of the protrusions contained in one metal-containing particle. The diameter of the base is the maximum diameter of each base of the protrusion. In the case where the metal portion has the convex portion and the protrusion, that is, when the metal portion has the protrusion on the convex portion, it is assumed that there is no protrusion on a line connecting the center of the metal-containing particle and the front end of the protrusion. In this case, the end portion of the imaginary line portion of the metal portion is the base portion of the protrusion, and the distance between the end portions of the imaginary line portion (the distance connecting the end portions by a straight line) is the diameter of the base portion. The ratio (average height (b) / average diameter (c)) of the average height (b) of the plurality of protrusions to the average diameter (c) of the base of the plurality of protrusions is preferably 0.5 or more, more preferably 1.5 or more It is preferably 10 or less, and more preferably 5 or less. When the above-mentioned ratio (average height (b) / average diameter (c)) is equal to or more than the aforementioned lower limit, connection reliability is further improved. When the ratio (average height (b) / average diameter (c)) is equal to or less than the upper limit described above, it is difficult for the protrusions to bend excessively. The ratio (average diameter (d) / average diameter (c)) of the average diameter (d) of the central position of the height of the plurality of protrusions to the average diameter (c) of the base of the plurality of protrusions is preferably 1/5 The above is more preferably 1/4 or more, further preferably 1/3 or more, and more preferably 4/5 or less, more preferably 3/4 or less, and even more preferably 2/3 or less. When the ratio (average diameter (d) / average diameter (c)) is equal to or more than the lower limit described above, the protrusions are less likely to be excessively bent. When the ratio (average diameter (d) / average diameter (c)) is equal to or less than the above upper limit, connection reliability is further improved. The average diameter (d) of the center position of the height of the said protrusion is the average value of the diameter of the center position of the height of the protrusion contained in one metal containing particle. The diameter of the central position of the height of the protrusion is the maximum diameter of each central position of the height of the protrusion. From the viewpoint of suppressing excessive bending of the protrusions, further improving the fusion bonding property of the protrusions, and effectively improving connection reliability, the shape of the plurality of protrusions is preferably a needle shape or a part of a sphere. The acicular shape is preferably a pyramidal shape, a conical shape, or a rotating paraboloid, more preferably a conical shape or a rotating paraboloid, and further preferably a conical shape. The shape of the protrusion may be a pyramid shape, a conical shape, or a rotating paraboloid shape. In the present invention, the shape of the rotating paraboloid is also included in the needle shape with a tapered tip. In the rotating paraboloid-shaped protrusion, it gradually tapers from the base to the front end. The number of protrusions on the outer surface of the metal portion of each of the metal-containing particles is preferably three or more, and more preferably five or more. The upper limit of the number of the protrusions is not particularly limited. The upper limit of the number of protrusions can be appropriately selected in consideration of the particle diameter of metal-containing particles and the like. Furthermore, the protrusions included in the metal-containing particles may not be needle-shaped with a tapered tip, and further, the protrusions included in the metal-containing particles need not be all needle-shaped with a tapered tip. The ratio of the number of needle-shaped protrusions with a tapered tip to the number of protrusions contained in each of the above metal-containing particles is preferably 30% or more, more preferably 50% or more, and even more preferably 60% or more. It is more preferably 70% or more, and most preferably 80% or more. The larger the ratio of the number of needle-like protrusions, the more effectively the effect of using the needle-like protrusions can be obtained. The ratio (x) of the surface area of the portion having the protrusions in the entire surface area of the outer surface of the metal portion (x) is preferably 10% or more, more preferably 20% or more, still more preferably 30% or more, and preferably 90% Hereinafter, it is more preferably 80% or less, and still more preferably 70% or less. The larger the ratio of the surface area of the portion having the protrusion, the more effectively the effect of utilizing the protrusion can be obtained. From the viewpoint of effectively improving the reliability of the connection, the ratio of the surface area of the portion having the needle-like protrusions to the entire surface area of the outer surface of the metal portion is preferably 10% or more, more preferably 20% or more, and more preferably It is 30% or more, and preferably 90% or less, more preferably 80% or less, and even more preferably 70% or less. The larger the ratio of the surface area of the portion having the needle-like protrusions, the more effectively the effect of utilizing the protrusions can be obtained. The average value (A) of the apex angles of the plurality of convex portions is preferably 10 ° or more, more preferably 20 ° or more, and preferably 60 ° or less, and more preferably 45 ° or less. When the average value (A) of the apex angle is equal to or more than the lower limit, it is difficult for the convex portion to be excessively bent. If the average value (A) of the said apex angle is below the said upper limit, a melting temperature will fall further. Furthermore, the bent convex portion may increase the connection resistance between the electrodes during the conductive connection. The average value (A) of the said apex angle of the said convex part can be calculated | required by averaging each apex angle of the convex part contained in one metal containing particle. The average height (B) of the plurality of convex portions is preferably 5 nm or more, more preferably 50 nm or more, and more preferably 5000 nm or less, more preferably 1000 nm or less, and even more preferably 800 nm or less. When the average height (B) of the convex portion is equal to or higher than the lower limit, the melting temperature is further reduced. When the average height (B) of the convex portion is equal to or lower than the upper limit, the convex portion is less likely to be bent excessively. The average height (B) of the convex portion is an average of the height of the convex portion included in one metal-containing particle. The height of the above-mentioned convex part indicates the imaginary line of the metal part (as shown in FIG. 8) on the line connecting the center of the metal-containing particle and the front end of the convex part (the broken line L1 shown in FIG. 8) from the assumption that there is no convex part. Dotted line L2) (on the external surface of the spherical metal-containing particles when there is no convex part) to the front end of the convex part. That is, in FIG. 8, the distance from the intersection of the dotted line L1 and the dotted line L2 to the front end of the convex portion is shown. The average diameter (C) of the bases of the plurality of convex portions is preferably 3 nm or more, more preferably 5 nm or more, still more preferably 50 nm or more, and preferably 5000 nm or less, more preferably 1000 nm or less, It is more preferably 800 nm or less. When the average diameter (C) is greater than or equal to the above lower limit, it is difficult for the convex portion to be excessively bent. When the average diameter (C) is equal to or smaller than the upper limit, connection reliability is further improved. The average diameter (C) of the base portion of the convex portion is an average value of the base portion diameter of the convex portion contained in one metal-containing particle. The diameter of the base is the maximum diameter of each base in the convex portion. The end of an imaginary line portion of the metal part (dashed line L2 shown in FIG. 8) on the line connecting the center of the metal-containing particle and the front end of the convex part (dotted line L1 shown in FIG. 8) on the assumption that there is no convex part. The portion is the base portion of the convex portion, and the distance between the ends of the imaginary line portion (the distance connecting the end portions by a straight line) is the diameter of the base portion. The ratio (average diameter (D) / average diameter (C)) of the average diameter (D) of the central position of the height of the plurality of convex portions to the average diameter (C) of the base portions of the plurality of convex portions is preferably 1 / 5 or more, more preferably 1/4 or more, further preferably 1/3 or more, and more preferably 4/5 or less, more preferably 3/4 or less, and still more preferably 2/3 or less. When the ratio (average diameter (D) / average diameter (C)) is equal to or greater than the above lower limit, it is difficult for the convex portion to be excessively bent. When the ratio (average diameter (D) / average diameter (C)) is equal to or less than the above upper limit, connection reliability is further improved. The average diameter (D) of the center position of the height of the said convex part is an average value of the diameter of the center position of the height of the convex part contained in one metal containing particle. The diameter of the central position of the height of the convex part is the maximum diameter of each central position of the height of the convex part. From the viewpoint of suppressing excessive bending of the convex portion, further improving the fusion bonding property of the convex portion, and effectively improving the connection reliability, the shape of the plurality of convex portions is preferably a needle shape or a part of a sphere. The acicular shape is preferably a pyramidal shape, a conical shape, or a rotating paraboloid, more preferably a conical shape or a rotating paraboloid, and further preferably a conical shape. The shape of the convex portion may be a pyramid shape, a conical shape, or a rotating paraboloid shape. In the present invention, the shape of the rotating paraboloid is also included in the needle shape with a tapered tip. In the convex part of the rotating paraboloid shape, it gradually becomes thinner from the base to the front end. The number of convex portions on the outer surface of the metal portion of each of the metal-containing particles is preferably three or more, and more preferably five or more. The upper limit of the number of the convex portions is not particularly limited. The upper limit of the number of convex portions can be appropriately selected in consideration of the particle diameter of metal-containing particles and the like. In addition, the convex portions included in the metal-containing particles may not be needle-shaped with a tapered tip, and the convex portions included in the metal-containing particles need not be all needle-shaped with a tapered tip. The ratio of the number of needle-shaped convex portions with a tapered tip in the number of convex portions contained in each of the above metal-containing particles is preferably 30% or more, more preferably 50% or more, and even more preferably 60%. Above, more preferably 70% or more, and most preferably 80% or more. The larger the ratio of the number of needle-shaped projections, the more effectively the effect of using the needle-shaped projections can be obtained. The ratio (X) of the surface area of the entire surface area of the outer surface of the metal portion to the portion having the convex portion (X) is preferably 10% or more, more preferably 20% or more, still more preferably 30% or more, and preferably 90%. % Or less, more preferably 80% or less, and even more preferably 70% or less. The more the ratio of the surface area of the portion having the convex portion, the more effectively the effect of utilizing the protrusion on the convex portion can be obtained. From the viewpoint of effectively improving the reliability of the connection, the ratio of the surface area of the portion having the needle-shaped convex portion to the entire surface area of the outer surface of the metal portion is preferably 10% or more, more preferably 20% or more, It is preferably 30% or more, and preferably 90% or less, more preferably 80% or less, and even more preferably 70% or less. The larger the ratio of the surface area of the portion having the needle-like convex portion, the more effectively the effect of utilizing the protrusion on the convex portion can be obtained. The ratio (average height (B) / average height (b)) of the average height (B) of the plurality of protrusions to the average height (b) of the plurality of protrusions is preferably 5 or more, more preferably 10 or more, It is preferably 1,000 or less, and more preferably 800 or less. When the ratio (average height (B) / average height (b)) is equal to or greater than the lower limit, connection reliability is further improved. When the ratio (average height (B) / average height (b)) is equal to or less than the above upper limit, it is difficult for the convex portion to be excessively bent. Preferably, the metal portion having the plurality of protrusions is formed by crystal orientation of a metal or an alloy. Furthermore, in the following embodiments, the metal portion is formed by crystal orientation of a metal or an alloy. From the viewpoint of effectively improving connection reliability, the compression modulus of elasticity (10% K value) when the metal-containing particles are compressed by 10% is preferably 100 N / mm 2 Above, more preferably 1000 N / mm 2 Above, and preferably 25000 N / mm 2 Below, more preferably 10000 N / mm 2 Below, more preferably 8000 N / mm 2 the following. The compression elastic modulus (10% K value) of the metal-containing particles can be measured as follows. Using a micro compression tester, metal-containing particles were compressed with a smooth end face of a cylinder (100 μm in diameter, made of diamond) under the conditions of 25 ° C, a compression speed of 0.3 mN / s, and a maximum test load of 20 mN. The load value (N) and compression displacement (mm) at this time were measured. Based on the obtained measured values, the above-mentioned compressive elastic modulus can be obtained by the following formula. As the above-mentioned minute compression testing machine, for example, "Fischerscope H-100" manufactured by Fischer Corporation can be used. 10% K value (N / mm 2 ) = (3/2 1/2 ) ・ F ・ S -3/2 ・ R -1/2 F: load value when metal-containing particle is compressed by 10% and deformed (N) S: metal-containing particle when 10% compressed and deformed by deformation (mm) R: metal-containing particle radius (mm) is preferably The ratio of the (111) plane in the X-ray diffraction of the protrusions is 50% or more. Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing metal-containing particles according to the first embodiment of the present invention. As shown in FIG. 1, the metal-containing particles 1 include substrate particles 2 and a metal portion 3. The metal portion 3 is arranged on the surface of the base particle 2. The metal-containing particles 1 are coated particles whose surface is covered with the metal portion 3 on the substrate particles 2. The metal part 3 is a continuous film. The metal-containing particle 1 has a plurality of protrusions 1 a on the outer surface of the metal portion 3. The metal portion 3 has a plurality of protrusions 3a on the outer surface. The shape of the plurality of protrusions 1a and 3a is a needle shape having a tapered tip, and is conical in this embodiment. In this embodiment, the front ends of the protrusions 1a and 3a can be melted at 400 ° C or lower. The metal portion 3 has a first portion and a second portion which is thicker than the first portion. The portion other than the plurality of protrusions 1 a and 3 a is the above-mentioned first portion of the metal portion 3. The plurality of protrusions 1a and 3a are the second portion where the thickness of the metal portion 3 is thick. FIG. 2 is a cross-sectional view schematically showing metal-containing particles according to a second embodiment of the present invention. As shown in FIG. 2, the metal-containing particle 1A includes a substrate particle 2 and a metal portion 3A. The metal portion 3A is arranged on the surface of the base particle 2. The metal-containing particle 1A has a plurality of protrusions 1Aa on the outer surface of the metal portion 3A. The metal portion 3A has a plurality of protrusions 3Aa on the outer surface. The shape of the plurality of protrusions 1Aa and 3Aa is a needle shape having a tapered tip, and in this embodiment, it is a rotating paraboloid shape. In this embodiment, the front ends of the protrusions 1Aa and 3Aa can be melted at 400 ° C or lower. Like the metal-containing particles 1 and 1A, the shape of the plurality of protrusions in the metal portion is preferably a needle shape with a tapered tip, which may be a conical shape or a rotating paraboloid shape. 3 is a cross-sectional view schematically showing metal-containing particles according to a third embodiment of the present invention. As shown in FIG. 3, the metal-containing particle 1B includes base material particles 2 and a metal portion 3B. The metal portion 3B is arranged on the surface of the base particle 2. The metal-containing particle 1B has a plurality of protrusions 1Ba on the outer surface of the metal portion 3B. The metal portion 3B has a plurality of protrusions 3Ba on the outer surface. The shape of the plurality of protrusions 1Ba and 3Ba is a part of a sphere. The metal part 3B has metal particles 3BX embedded on the outer surface so as to expose a part. The exposed portions of the metal particles 3BX constitute protrusions 1Ba and 3Ba. In this embodiment, the front ends of the protrusions 1Ba and 3Ba can be melted at 400 ° C or lower. Like the metal-containing particles 1B, by reducing the protrusions, the shape of the protrusions may not be a needle shape with a tapered tip, for example, the shape of a part of a sphere. 4 is a cross-sectional view schematically showing metal-containing particles according to a fourth embodiment of the present invention. As shown in FIG. 4, the metal-containing particle 1C includes a substrate particle 2 and a metal portion 3C. The metal-containing particle 1 differs from the metal-containing particle 1C only in the metal portion. That is, in the metal-containing particle 1, a metal portion 3 having a single-layer structure is formed, while in the metal-containing particle 1C, a metal portion 3C having a two-layer structure is formed. The metal portion 3C includes a first metal portion 3CA and a second metal portion 3CB. The first and second metal portions 3CA and 3CB are arranged on the surface of the substrate particle 2. A first metal portion 3CA is disposed between the substrate particles 2 and the second metal portion 3CB. Therefore, the first metal portion 3CA is disposed on the surface of the substrate particle 2, and the second metal portion 3CB is disposed on the outer surface of the first metal portion 3CA. The first metal portion 3CA has a spherical shape outside. The metal-containing particle 1C has a plurality of protrusions 1Ca on the outer surface of the metal portion 3C. The metal portion 3C has a plurality of protrusions 3Ca on the outer surface. The second metal portion 3CB has a plurality of protrusions on the outer surface. The shape of the plurality of protrusions 1Ca and 3Ca is a needle shape with a tapered tip, and in this embodiment is a conical shape. In this embodiment, the front ends of the protrusions 1Ca and 3Ca can be melted at 400 ° C or lower. The first metal portion on the inner side may have a plurality of protrusions on the outer surface. 5 is a cross-sectional view schematically showing metal-containing particles according to a fifth embodiment of the present invention. As shown in FIG. 5, the metal-containing particle 1D includes a substrate particle 2 and a metal portion 3D. The metal portion 3D is arranged on the surface of the base particle 2. The metal-containing particle 1D has a plurality of protrusions 1Da on the outer surface of the metal portion 3D. The metal-containing particle 1D has a plurality of convex portions (first protrusions) 3Da on the outer surface of the metal portion 3D. The metal portion 3D has a plurality of convex portions (first protrusions) 3Da on the outer surface. The metal portion 3D has a protrusion 3Db (second protrusion) smaller than the protrusion (first protrusion) 3Da on the outer surface of the convex portion (first protrusion) 3Da. The protrusions (first protrusions) 3Da and the protrusions 3Db (second protrusions) are integrated and connected. In this embodiment, the front end diameter of the projection 3Db (second projection) is small, and the front end of the projection 3Db (second projection) can be melted at 400 ° C or lower. 6 is a cross-sectional view schematically showing metal-containing particles according to a sixth embodiment of the present invention. As shown in FIG. 6, the metal-containing particle 1E includes substrate particles 2, a metal portion 3E, and a core substance 4E. The metal portion 3E is arranged on the surface of the base particle 2. The metal-containing particle 1E has a plurality of protrusions 1Ea on the outer surface of the metal portion 3E. The metal-containing particle 1E has a plurality of convex portions (first protrusions) 3Ea on the outer surface of the metal portion 3E. The metal portion 3E has a plurality of convex portions (first protrusions) 3Ea on the outer surface. The metal portion 3E has a protrusion 3Eb (second protrusion) smaller than the protrusion (first protrusion) 3Ea on the outer surface of the protrusion (first protrusion) 3Ea. The convex portion (first protrusion) 3Ea and the protrusion 3Eb (second protrusion) are integrated and connected. In this embodiment, the front end diameter of the projection 3Eb (second projection) is small, and the front end of the projection 3Eb (second projection) can be melted at 400 ° C or lower. The plurality of core substances 4E are arranged on the outer surface of the substrate particle 2. The plurality of core substances 4E are arranged inside the metal portion 3E. The plurality of core substances 4E are embedded inside the metal portion 3E. The core material 4E is disposed inside the convex portion 3Ea. The metal portion 3E is covered with a plurality of core substances 4E. With the plurality of core materials 4E, the outer surface of the metal portion 3E bulges to form a convex portion 3Ea. Like the metal atom-containing particles 1E, the metal-containing particles may be provided with a plurality of core substances that swell the outer surface of the metal portion. FIG. 7 is a cross-sectional view schematically showing metal-containing particles according to a seventh embodiment of the present invention. As shown in FIG. 7, the metal-containing particle 1F includes a substrate particle 2 and a metal portion 3F. The metal portion 3F is arranged on the surface of the base particle 2. The metal-containing particle 1F has a plurality of protrusions 1Fa on the outer surface of the metal portion 3F. The metal portion 3F has a projection 3Fb (second projection) smaller than the projection (first projection) 3Fa on the outer surface of the projection (first projection) 3Fa. The convex portion (first protrusion) 3Fa and the protrusion 3Fb (second protrusion) are not integrated. In this embodiment, the front end diameter of the projection 3Fb (second projection) is small, and the front end of the projection 3Fb (second projection) can be melted at 400 ° C or lower. 8 is a cross-sectional view schematically showing metal-containing particles according to an eighth embodiment of the present invention. As shown in FIG. 8, the metal-containing particle 1G includes a base material particle 2 and a metal portion 3G. The metal portion 3G includes a first metal portion 3GA and a second metal portion 3GB. The first and second metal portions 3GA and 3GB are arranged on the surface of the substrate particle 2. A first metal portion 3GA is disposed between the substrate particles 2 and the second metal portion 3GB. Therefore, the first metal portion 3GA is disposed on the surface of the substrate particle 2, and the second metal portion 3GB is disposed on the outer surface of the first metal portion 3GA. The metal portion 3G is arranged on the surface of the base particle 2. The metal-containing particle 1G has a plurality of protrusions 1Ga on the outer surface of the metal portion 3G. The metal-containing particle 1G has a plurality of convex portions (first protrusions) 3Ga on the outer surface of the metal portion 3G. The metal portion 3G has a protrusion 3Gb (second protrusion) smaller than the convex portion (first protrusion) 3Ga on the outer surface of the convex portion (first protrusion) 3Ga. An interface exists between the convex portion (first protrusion) 3Ga and the protrusion 3Gb (second protrusion). In this embodiment, the diameter of the front end of the projection 3Gb (second projection) is small, and the front end of the projection 3Gb (second projection) can be melted at 400 ° C or lower. In addition, FIGS. 11 to 14 show images of metal-containing particles actually produced. The metal-containing particles shown in FIGS. 11 to 14 have a plurality of protrusions on the outer surface of the metal portion, and the front ends of the plurality of protrusions can be melted at 400 ° C. or lower. In the metal-containing particles shown in FIG. 14, the metal portion has a plurality of convex portions on the outer surface, and the outer surface of the convex portion has protrusions smaller than the convex portions. 15 to 18 show images of particles obtained by melting and solidifying the protrusions of the metal portion of the produced metal-containing particles. FIG. 18 is a particle obtained by melting and solidifying a front end of a metal portion of a metal-containing particle shown in FIG. 14 after protrusion. Hereinafter, the metal-containing particles will be described in more detail. Furthermore, in the following description, "(meth) acrylic acid" means one or both of "acrylic acid" and "methacrylic acid", and "(meth) acrylate" means "acrylate" and " Methacrylate "or one. [Substrate particles] Examples of the substrate particles include resin particles, inorganic particles other than metal particles, organic-inorganic mixed particles, and metal particles. The substrate particles may have a core and a shell disposed on a surface of the core, and may be core-shell particles. The substrate particles are preferably substrate particles other than metal particles, and more preferably resin particles, inorganic particles other than metal particles, or organic-inorganic mixed particles. The substrate particles are more preferably resin particles or organic-inorganic mixed particles, and may be resin particles or organic-inorganic mixed particles. By using these preferred substrate particles, metal-containing particles suitable for the connection use of the two connection target members can be obtained. When the substrate particles are resin particles or organic-inorganic mixed particles, the metal-containing particles are easily deformed, and the metal-containing particles have high flexibility. Therefore, the shock absorbing property becomes high after the connection. As the resin for forming the resin particles, various organic substances can be suitably used. Examples of the resin for forming the resin particles include polyolefin resins such as polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, polyisobutylene, and polybutadiene; polymethacrylic acid Acrylic resins such as methyl ester and polymethyl acrylate; polyalkylene terephthalate, polycarbonate, polyamide, phenol formaldehyde resin, melamine formaldehyde resin, benzoguanamine formaldehyde resin, urea formaldehyde resin, phenol resin , Melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polyfluorene, polyphenylene ether, polyacetal, polyimide, polyimide , Polyether ether ketone, polyether fluorene, and a polymer obtained by polymerizing one or two or more kinds of polymerizable monomers having an ethylenically unsaturated group. It is possible to design and synthesize any resin particle with physical properties suitable for the connection purpose of the two connection target members, and it is easy to control the hardness of the substrate particles to an appropriate range. The resin is preferably a polymer obtained by polymerizing one or more polymerizable monomers having a plurality of ethylenically unsaturated groups. When polymerizing a polymerizable monomer having an ethylenically unsaturated group to obtain the resin particles, examples of the polymerizable monomer having an ethylenically unsaturated group include non-crosslinkable monomers and crosslinkability. Of the monomer. Examples of the non-crosslinkable monomer include styrene-based monomers such as styrene and α-methylstyrene; carboxyl groups such as (meth) acrylic acid, maleic acid, and maleic anhydride Monomers; methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (formyl) (Meth) acrylic acid, such as lauryl acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, iso (meth) acrylate, etc. Alkyl ester compounds; 2-methyl (meth) acrylate, glyceryl (meth) acrylate, polyoxyethylene (meth) acrylate, glycidyl (meth) acrylate, etc. ) Acrylate compounds; monomers containing nitriles such as (meth) acrylonitrile; vinyl ether compounds such as methyl vinyl ether, ethyl vinyl ether, propyl vinyl ether; vinyl acetate, vinyl butyrate, vinyl laurate Acid vinyl ester compounds, such as vinyl stearate; unsaturated hydrocarbons such as ethylene, propylene, isoprene, butadiene; trifluoromethyl (meth) acrylate , (Meth) acrylate, pentafluoro methacrylate, vinyl chloride, vinyl fluoride, chlorine-containing monomers such as styrene, halogen or the like. Examples of the crosslinkable monomer include tetramethylolmethane tetra (meth) acrylate, tetramethylolmethane tri (meth) acrylate, and tetramethylolmethane di (meth) acrylic acid. Ester, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, glycerol tri (meth) acrylate, glycerol di (meth) Acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, (poly) tetramethylene glycol di (meth) acrylate, 1,4- Multifunctional (meth) acrylate compounds such as butanediol di (meth) acrylate; triallyl (iso) cyanurate, triallyl trimellitate, divinylbenzene, phthalate diene Silane-containing compounds such as propyl ester, diallyl allylamine, diallyl ether, γ- (meth) propenyloxypropyltrimethoxysilane, trimethoxysilylstyrene, vinyltrimethoxysilane, etc. Of monomers, etc. The resin particles can be obtained by polymerizing the polymerizable monomer having an ethylenically unsaturated group by a known method. Examples of the method include a method of performing suspension polymerization in the presence of a radical polymerization initiator, and a method of using a non-crosslinked seed particle to swell a monomer and a radical polymerization initiator together to polymerize. . When the substrate particles are inorganic particles or organic-inorganic mixed particles other than metal particles, examples of the inorganic substance used to form the substrate particles include silicon dioxide, alumina, barium titanate, zirconia, and Carbon black and so on. The inorganic substance is preferably not a metal. The particles formed from the silicon dioxide are not particularly limited, and examples thereof include hydrolysis of a silicon compound having two or more hydrolyzable alkoxysilyl groups to form crosslinked polymer particles, and then proceeding as necessary. Particles obtained by calcination. Examples of the organic-inorganic mixed particles include organic-inorganic mixed particles formed of a crosslinked alkoxysilyl polymer and an acrylic resin. The organic-inorganic mixed particles are preferably core-shell type organic-inorganic mixed particles having a core and a shell arranged on the surface of the core. The core is preferably an organic core. The shell is preferably an inorganic shell. From the viewpoint of effectively improving connection reliability, the substrate particles are preferably organic-inorganic mixed particles having an organic core and an inorganic shell disposed on a surface of the organic core. Examples of the material used to form the inorganic shell include inorganic substances used to form the aforementioned substrate particles. The material used to form the inorganic shell is preferably silicon dioxide. The inorganic shell is preferably formed on the surface of the core by forming a metal alkoxide into a shell by a sol-gel method, and then calcining the shell. The metal alkoxide is preferably a silane alkoxide. The inorganic shell is preferably formed of a silane oxide. The particle diameter of the core is preferably 0.5 μm or more, more preferably 1 μm or more, and more preferably 500 μm or less, more preferably 100 μm or less, still more preferably 50 μm or less, and even more preferably 20 μm or less. It is preferably 10 μm or less. When the particle diameter of the core is equal to or greater than the lower limit and equal to or lower than the upper limit, the core can be suitably used for connection of two connection target members. For example, if the particle diameter of the core is above the lower limit and below the upper limit, when the two connection target members are connected using the metal-containing particles, the contact area between the metal-containing particles and the connection target member becomes sufficient It is large and it becomes difficult to form agglomerated metal-containing particles when forming a metal part. In addition, the distance between the two connection target members connected via the metal-containing particles does not become too large, and the metal portion is not easily peeled from the surface of the substrate particles. The particle size of the core means a diameter when the core is a true sphere, and the maximum diameter when the core is in a shape other than a true sphere. The particle size of the core means an average particle size obtained by measuring the core with an arbitrary particle size measuring device. For example, a particle size distribution measuring machine using the principles of laser light scattering, resistance change, and image analysis after shooting can be used. The thickness of the shell is preferably 100 nm or more, more preferably 200 nm or more, and preferably 5 μm or less, and more preferably 3 μm or less. If the thickness of the shell is greater than or equal to the above lower limit and less than or equal to the above upper limit, the shell can be suitably used for the connection of two connection target members. The thickness of the shell is the average thickness of each substrate particle. Through the control of the sol-gel method, the thickness of the shell can be controlled. When the substrate particles are metal particles, examples of the metal used to form the metal particles include silver, copper, nickel, silicon, gold, and titanium. However, it is preferred that the substrate particles are not metal particles. The particle size of the substrate particles is preferably 0.1 μm or more, more preferably 0.5 μm or more, still more preferably 1 μm or more, still more preferably 1.5 μm or more, particularly preferably 2 μm or more, and preferably 1000 μm. Below, more preferably 500 μm or less, still more preferably 400 μm or less, still more preferably 100 μm or less, still more preferably 50 μm or less, even more preferably 30 μm or less, and even more preferably 5 μm or less, most preferably It is 3 μm or less. When the particle diameter of the substrate particles is greater than or equal to the above lower limit, connection reliability is further improved. Furthermore, when a metal portion is formed on the surface of the substrate particles by electroless plating, it is not easy to aggregate, and it is difficult to form aggregated metal-containing particles. When the average particle diameter of the substrate particles is equal to or less than the above-mentioned upper limit, it is easy to sufficiently compress the metal-containing particles, and the connection reliability is further improved. The particle diameter of the substrate particles indicates a diameter when the substrate particles are truly spherical, and indicates a maximum diameter when the substrate particles are not truly spherical. From the viewpoint of further suppressing the occurrence of cracks or peeling of the connection portion in the thermal cycle test of connection reliability, and further suppressing the occurrence of cracks at the time of a stress load, the above-mentioned substrate particles are preferably those containing a silicone resin. Particles (polysiloxane particles). The material of the substrate particles is preferably a silicone-containing resin. The material of the above polysiloxane particles is preferably a silane compound having a radical polymerizable group and a silane compound having a hydrophobic group having a carbon number of 5 or more, or a silane compound having a radical polymerizable group and a hydrophobic group having a carbon number of 5 or more Compounds, or silane compounds with radical polymerizable groups at both ends. When these materials are reacted, a siloxane bond is formed. In the obtained polysiloxane particles, a radical polymerizable group and a hydrophobic group having a carbon number of 5 or more usually remain. By using such a material, polysiloxane particles having a primary particle diameter of 0.1 μm or more and 500 μm or less can be easily obtained, the chemical resistance of the polysiloxane particles can be improved, and moisture permeability can be reduced. In the silane compound having a radical polymerizable group, the radical polymerizable group is preferably directly bonded to a silicon atom. The aforementioned silane compound having a radical polymerizable group may be used alone or in combination of two or more thereof. The silane compound having a radical polymerizable group is preferably an alkoxysilane compound. Examples of the silane compound having a radically polymerizable group include vinyltrimethoxysilane, vinyltriethoxysilane, dimethoxymethylvinylsilane, diethoxymethylvinylsilane, Divinylmethoxyvinylsilane, divinylethoxyvinylsilane, divinyldimethoxysilane, divinyldiethoxysilane, and 1,3-divinyltetramethyldisiloxane Siloxane, etc. Among the above-mentioned silane compounds having a hydrophobic group having 5 or more carbon atoms, it is preferred that the hydrophobic group having 5 or more carbon atoms be directly bonded to a silicon atom. The above-mentioned silane compound having a hydrophobic group having 5 or more carbon atoms may be used alone or in combination of two or more thereof. The silane compound having a hydrophobic group having 5 or more carbon atoms is preferably an alkoxysilane compound. Examples of the silane compound having a hydrophobic group having 5 or more carbon atoms include phenyltrimethoxysilane, dimethoxymethylphenylsilane, diethoxymethylphenylsilane, and dimethylmethoxy Phenylsilane, dimethylethoxyphenylsilane, hexaphenyldisilaxane, 1,3,3,5-tetramethyl-1,1,5,5-tetraphenyltrisiloxane, 1,1,3,5,5-pentaphenyl-1,3,5-trimethyltrisiloxane, hexaphenylcyclotrisiloxane, phenyltri (trimethylsilyloxy) silane, And octaphenylcyclotetrasiloxane. In the silane compound having a radical polymerizable group and a hydrophobic group having a carbon number of 5 or more, the radical polymerizable group is preferably directly bonded to a silicon atom, and the hydrophobic group having a carbon number of 5 or more is directly Bonded to a silicon atom. The silane compound having a radical polymerizable group and a hydrophobic group having 5 or more carbon atoms may be used alone or in combination of two or more. Examples of the silane compound having a radically polymerizable group and a hydrophobic group having 5 or more carbon atoms include phenylvinyldimethoxysilane, phenylvinyldiethoxysilane, and phenylmethylvinyl Methoxysilane, phenylmethylvinylethoxysilane, diphenylvinylmethoxysilane, diphenylvinylethoxysilane, phenyldivinylmethoxysilane, phenyldivinyl Ethoxysilane, and 1,1,3,3-tetraphenyl-1,3-divinyldisiloxane. When the above-mentioned silane compound having a radical polymerizable group and the silane compound having a hydrophobic group having a carbon number of 5 or more are used in order to obtain polysiloxane particles, the above-mentioned silane compound having a radical polymerizable group and the above-mentioned The silane compound having a hydrophobic group having 5 or more carbon atoms is preferably used in a weight ratio of 1: 1 to 1:20, and more preferably used in a ratio of 1: 5 to 1:15. In the whole of the silane compound used to obtain the polysiloxane particles, the number of radical polymerizable groups and the number of hydrophobic groups having 5 or more carbon atoms is preferably 1: 0.5 to 1:20, and more preferably 1: 1 to 1:15. From the viewpoint of effectively improving chemical resistance, effectively reducing moisture permeability, and controlling the 10% K value to an appropriate range, it is preferable that the above-mentioned polysiloxane particles have two silicon atoms bonded to each other. A dimethylsiloxane skeleton of two methyl groups, and the material of the polysiloxane particles is preferably a silane compound having two methyl groups bonded to one silicon atom. From the viewpoints of effectively improving chemical resistance, effectively reducing moisture permeability, and controlling the 10% K value to an appropriate range, it is preferable that the above-mentioned polysiloxane particles are made by a radical polymerization initiator. The silane compound reacts to form a siloxane bond. In general, it is difficult to obtain a polysiloxane particle having a primary particle diameter of 0.1 μm to 500 μm using a radical polymerization initiator, and it is particularly difficult to obtain a polysiloxane particle having a primary particle diameter of 100 μm or less. On the other hand, even when a radical polymerization initiator is used, by using the above-mentioned silane compound, polysiloxane particles having a primary particle diameter of 0.1 μm or more and 500 μm or less can be obtained, and also can be obtained. Polysiloxane particles with a primary particle size of 100 μm or less. In order to obtain the polysiloxane particles, a silane compound having a hydrogen atom bonded to a silicon atom may not be used. In this case, the silane compound can be polymerized by using a radical polymerization initiator without using a metal catalyst. As a result, it is possible to avoid the inclusion of metal catalysts in the polysiloxane particles, reduce the content of the metal catalyst in the polysiloxane particles, and then effectively improve the chemical resistance, effectively reduce the moisture permeability, and reduce the value of 10% K Controlled within the appropriate range. As a specific manufacturing method of the above-mentioned polysiloxane particles, there is a method for producing a polysiloxane particle by performing a polymerization reaction of a silane compound by a suspension polymerization method, a dispersion polymerization method, a mini-emulsion polymerization method, or an emulsion polymerization method. After the oligomer is obtained by polymerizing the silane compound, the polymerization reaction of the silane compound as a polymer (oligomer, etc.) can also be performed by a suspension polymerization method, a dispersion polymerization method, a mini-emulsion polymerization method, or an emulsion polymerization method. And make polysiloxane particles. For example, a silane compound having a vinyl group may be polymerized to obtain a silane compound having a vinyl group bonded to a silicon atom at a terminal. A silane compound having a phenyl group can be polymerized to obtain a silane compound having a phenyl group bonded to a silicon atom in a side chain as a polymer (oligomer, etc.). It is also possible to polymerize a silane compound having a vinyl group and a silane compound having a phenyl group to obtain a polymer (oligomer, etc.) with a vinyl group having a terminal bonded to a silicon atom and a side chain having a silicon atom bonded. Silane compounds on phenyl. The polysiloxane particles may have a plurality of particles on the outer surface. In this case, the polysiloxane particles may include a polysiloxane particle body and a plurality of particles arranged on the surface of the polysiloxane particle body. Examples of the plurality of particles include polysiloxane particles and spherical silica. The presence of the plurality of particles can suppress aggregation of the polysiloxane particles. [Metal part] The front end of the protrusion of the metal part can be melted at 400 ° C or lower. From the viewpoint of reducing the melting temperature to suppress the amount of energy consumed during heating, and further to suppress the thermal degradation of the connection target member, it is preferable that the front end of the protrusion of the metal portion can be melted at 350 ° C or lower, more It is preferred that it can be melted at 300 ° C or lower, more preferably it can be melted at 250 ° C or lower, and even more preferably it can be melted at 200 ° C or lower. The melting temperature of the front end of the protrusion can be controlled by the type of metal at the front end of the protrusion and the shape of the front end of the protrusion. The melting point of the base of the protrusion, the center of the height of the protrusion, the center of the height of the protrusion, and the center of the height of the protrusion may also exceed 200 ° C, 250 ° C, 300 ° C, or more. 350 ℃, it can also exceed 400 ℃. The metal portion, the convex portion, and the protrusion may have a portion exceeding 200 ° C, a portion exceeding 250 ° C, a portion exceeding 300 ° C, a portion exceeding 350 ° C, or a temperature exceeding 400 ° C. ℃ part. The material of the metal portion is not particularly limited. The material of the metal portion is preferably a metal. Examples of the metal include gold, silver, palladium, rhodium, iridium, lithium, copper, platinum, zinc, iron, tin, lead, ruthenium, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, Thorium, germanium, cadmium, silicon and alloys thereof. Examples of the metal include tin-doped indium oxide (ITO). In the present invention, the material of the metal portion is selected such that the front end of the protrusion of the metal portion can be melted below 400 ° C. From the viewpoint of effectively improving connection reliability, the material of the protrusions preferably contains silver, copper, gold, palladium, tin, indium, or zinc. The material of the protrusions may be free of tin. It is preferable that the material of the metal part is not solder. Since the material of the metal portion is not solder, it is possible to suppress the entire metal portion from excessive melting. The material of the metal part may be free of tin. From the viewpoint of effectively improving connection reliability, it is preferable that the material of the metal portion contains silver, copper, gold, palladium, tin, indium, zinc, nickel, cobalt, iron, tungsten, molybdenum, ruthenium, platinum, rhodium , Iridium, phosphorus, or boron, more preferably silver, copper, gold, palladium, tin, indium, or zinc, and still more preferably silver. These preferred materials may be used alone or in combination of two or more. From the viewpoint of effectively improving connection reliability, the silver may be contained in the form of a simple substance of silver or silver oxide. Examples of the silver oxide include Ag 2 O and AgO. 100% by weight of the metal portion containing silver, the content of silver is preferably 0. 1% by weight or more, more preferably 1% by weight or more, and preferably 100% by weight or less, more preferably 90% by weight or less, 80% by weight or less, 60% by weight or less, or 40% by weight It may be 20% by weight or less, or 10% by weight or less. When the content of silver is at least the above lower limit and at most the above upper limit, the bonding strength is increased, and connection reliability is further improved. The above-mentioned copper may be contained in the form of copper simple substance or copper oxide. 100% by weight of the metal portion containing copper, the copper content is preferably 0. 1% by weight or more, more preferably 1% by weight or more, and preferably 100% by weight or less, more preferably 90% by weight or less, 80% by weight or less, 60% by weight or less, or 40% by weight It may be 20% by weight or less, or 10% by weight or less. When the content of copper is at least the above lower limit and not more than the above upper limit, the bonding strength is increased, and connection reliability is further improved. The metal portion may be formed of one layer. The metal portion may be formed of a plurality of layers. The outer surface of the metal portion may be subjected to rust prevention treatment. The metal-containing particles may have a rust-preventive film on an outer surface of the metal portion. Examples of the anti-rust treatment include a method of disposing an anti-rust agent on the surface of the metal part, a method of alloying the outer surface of the metal part to improve the corrosion resistance, and applying a highly corrosion-resistant metal to the outer surface of the metal part. Film method, etc. Examples of the rust preventive include nitrogen-containing heterocyclic compounds such as benzotriazole compounds and imidazole compounds; sulfur-containing compounds such as mercaptan compounds, thiazole compounds, and organic disulfide compounds; organic phosphoric acid compounds and the like Phosphorus compounds. [Rust prevention treatment] In order to suppress the corrosion of metal-containing particles and reduce the connection resistance between the electrodes, it is preferable to perform a rust prevention treatment or a vulcanization resistance treatment on the outer surface of the metal portion. Examples of sulfur-resistant agents, rust inhibitors, or discoloration inhibitors include nitrogen-containing heterocyclic compounds such as benzotriazole compounds and imidazole compounds; sulfur-containing compounds such as mercaptan compounds, thiazole compounds, and organic disulfide compounds. Compounds; phosphorus-containing compounds such as organic phosphoric acid compounds. From the viewpoint of further improving the conduction reliability, it is preferable to perform a rust prevention treatment on the outer surface of the metal portion with a compound having an alkyl group having 6 to 22 carbon atoms. The surface of the metal part may be subjected to antirust treatment by a compound containing no phosphorus, and may also be subjected to antirust treatment by a compound having an alkyl group having 6 to 22 carbon atoms and not containing phosphorus. From the viewpoint of further improving the conduction reliability, it is preferable to perform an antirust treatment on the outer surface of the metal portion with an alkyl phosphate compound or an alkyl mercaptan. By the rust prevention treatment, a rust prevention film can be formed on the outer surface of the metal portion. The rust preventive film is preferably formed of a compound having an alkyl group having 6 to 22 carbon atoms (hereinafter also referred to as a compound A). The surface of the outer surface of the metal portion is preferably surface-treated with the compound A. When the carbon number of the alkyl group is 6 or more, the entire metal portion is less likely to rust. When the carbon number of the alkyl group is 22 or less, the conductivity of the metal-containing particles becomes high. From the viewpoint of further improving the conductivity of the metal-containing particles, the number of carbon atoms of the alkyl group in the compound A is preferably 16 or less. The alkyl group may have a linear structure or a branched structure. The alkyl group preferably has a linear structure. The compound A is not particularly limited as long as it has an alkyl group having 6 to 22 carbon atoms. The compound A is preferably a phosphoric acid ester or a salt thereof having an alkyl group having 6 to 22 carbon atoms, a phosphorous acid ester or a salt thereof having an alkyl group having 6 to 22 carbon atoms, and an alkane having an alkyl group having 6 to 22 carbon atoms. An oxysilane, an alkyl mercaptan having an alkyl group having 6 to 22 carbon atoms, or a dialkyl disulfide having an alkyl group having 6 to 22 carbon atoms. That is, the compound A having an alkyl group having 6 to 22 carbon atoms is preferably a phosphate ester or a salt thereof, a phosphite ester or a salt thereof, an alkoxysilane, an alkyl mercaptan, or a dialkyl disulfide. By using these preferred compounds A, it is possible to make the metal portion less susceptible to rust. From the viewpoint of making it harder to rust, the compound A is preferably the above-mentioned phosphate or its salt, a phosphite or its salt, or an alkyl mercaptan, more preferably the above-mentioned phosphate or its salt, or Phosphate or its salt. The compound A may be used alone or in combination of two or more. It is preferable that the said compound A has a reactive functional group which can react with the surface other than the said metal part. When the metal-containing particles include an insulating substance disposed on the outer surface of the metal portion, the compound A preferably has a reactive functional group capable of reacting with the insulating substance. Preferably, the rust preventive film is chemically bonded to the metal portion. Preferably, the rust-preventive film is chemically bonded to the insulating substance. More preferably, the rust-preventive film is chemically bonded to both the metal portion and the insulating substance. The presence of the reactive functional groups and the chemical bonding make it difficult to produce the peeling of the rust-preventive film. As a result, the metal part is less likely to rust, and the insulating substance is less likely to contain metals unintentionally. The surface of the particles is detached. Examples of the phosphate ester or a salt thereof having an alkyl group having 6 to 22 carbon atoms include hexyl phosphate, heptyl phosphate, monooctyl phosphate, monononyl phosphate, monodecyl phosphate, and monoundecane phosphate. Monoester, monododecyl phosphate, monotridecyl phosphate, monotetradecyl phosphate, monopentadecyl phosphate, monohexyl phosphate monosodium salt, monoheptyl phosphate monosodium salt , Monooctyl phosphate monosodium salt, Monononyl phosphate monosodium salt, Monodecyl phosphate monosodium salt, Monoundecyl phosphate monosodium salt, Monododecyl phosphate monosodium salt, Monodecyl phosphate Trialkyl ester monosodium salt, monotetradecyl phosphate monosodium salt and monopentadecyl phosphate monosodium salt, etc. Potassium salts of the above-mentioned phosphates can also be used. Examples of the phosphite or a salt thereof having an alkyl group having 6 to 22 carbon atoms include hexyl phosphite, heptyl phosphite, monooctyl phosphite, monononyl phosphite, and monodecyl phosphite. , Monoundecyl phosphite, monododecyl phosphite, monotridecyl phosphite, monotetradecyl phosphite, monopentadecyl phosphite, monohexyl phosphite Esters monosodium salt, monoheptyl phosphite monosodium salt, monooctyl phosphite monosodium salt, monononyl phosphite monosodium salt, monodecyl phosphite monosodium salt, monoundecyl phosphate Sodium, Monosodium Dodecyl Phosphate, Sodium Sodium Tridecyl Phosphate, Sodium Sodium Tetradecyl Phosphate, and Sodium Sodium Pentadecyl Phosphite Wait. Potassium salts of the above-mentioned phosphites can also be used. Examples of the alkoxysilane having an alkyl group having 6 to 22 carbon atoms include hexyltrimethoxysilane, hexyltriethoxysilane, heptyltrimethoxysilane, heptyltriethoxysilane, and octyl. Trimethoxysilane, octyltriethoxysilane, nonyltrimethoxysilane, nonyltriethoxysilane, decyltrimethoxysilane, decyltriethoxysilane, undecyltrimethoxy Silyl, undecyltriethoxysilane, dodecyltrimethoxysilane, dodecyltriethoxysilane, tridecyltrimethoxysilane, tridecyltriethoxysilane , Tetradecyltrimethoxysilane, tetradecyltriethoxysilane, pentadecyltrimethoxysilane and pentadecyltriethoxysilane. Examples of the alkyl mercaptan having an alkyl group having 6 to 22 carbon atoms include hexyl mercaptan, heptyl mercaptan, octyl mercaptan, nonyl mercaptan, decyl mercaptan, and undecyl mercaptan. Alcohols, dodecyl mercaptan, tridecyl mercaptan, tetradecyl mercaptan, pentadecyl mercaptan, and cetyl mercaptan. It is preferable that the said alkyl mercaptan has a thiol group at the terminal of an alkyl chain. Examples of the dialkyl disulfide having an alkyl group having 6 to 22 carbon atoms include dihexyl disulfide, diheptyl disulfide, dioctyl disulfide, dinonyl disulfide, Didecyl disulfide, di (undecyl) disulfide, bis (dodecyl) disulfide, bis (tridecyl) disulfide, di (tetradecyl) disulfide Bis (pentadecyl) disulfide and bis (hexadecyl) disulfide. From the viewpoint of further improving the conduction reliability, any one of a sulfur-containing compound, a benzotriazole compound, or a polyoxyethylene ether surfactant containing a thioether compound or a thiol compound as a main component is preferred. The layer performs a vulcanization-resistant treatment on the outer surface of the metal portion. A rust-resistant film can be formed on the outer surface of the metal part by the sulfur-resistant treatment. Examples of the thioether compound include dihexyl sulfide, diheptyl sulfide, dioctyl sulfide, didecyl sulfide, di (dodecyl) sulfide, and di (tetradecyl) sulfide. Straight-chain or branched dioxane having 6 to 40 carbons (preferably about 10 to 40 carbons) such as ether, bis (hexadecyl) sulfide, and bis (octadecyl) sulfide Alkyl sulfide (alkyl sulfide); diphenyl sulfide, phenyl p-tolyl sulfide, 4,4-thiobisphenyl mercaptan and other aromatic sulfides having a carbon number of about 12 to 30; 3,3 Thiodicarboxylic acids such as' -thiodipropionic acid and 4,4'-thiodibutyric acid. The sulfide compound is particularly preferably a dialkyl sulfide. Examples of the thiol compound include carbons such as 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, 2-mercaptobenzimidazole, 2-methyl-2-propanethiol, and octadecyl mercaptan. A linear or branched alkyl mercaptan of about 4 to about 40 (more preferably about 6 to 20). In addition, a compound in which a hydrogen atom bonded to a carbon group of these compounds is replaced with fluorine can be cited. Examples of the benzotriazole compound include benzotriazole, benzotriazole salt, methylbenzotriazole, carboxybenzotriazole, and benzotriazole derivatives. Examples of the anti-tarnish agent include the trade names "AC-20", "AC-70", "AC-80" manufactured by Kita Sangyo Co., Ltd., and the trade name "ENTEK CU-56" manufactured by Meltex Corporation, Yamato The brand names "New Dain Silver", "New Dain Silver S-1" manufactured by Kasei Corporation, the brand name "B-1057" manufactured by Chiyoda Chemical, and the brand name "B-1009NS" manufactured by Chiyoda Chemical. The method of forming a metal part on the surface of the said substrate particle is not specifically limited. Examples of the method for forming the metal portion include a method using electroless plating, a method using electroplating, a method using physical vapor deposition, and applying a paste containing a metal powder or a metal powder and a binder to a substrate. Method of particle surface, etc. Since the formation of the metal portion is simple, a method using electroless plating is preferred. Examples of the method using the physical vapor deposition include vacuum vapor deposition, ion plating, and ion sputtering. As a method of forming a protrusion having a needle-like shape with a tapered tip on the outer surface of the metal portion, the following method may be mentioned. Examples include a method of electroless plating of high-purity nickel using hydrazine as a reducing agent, a method of electroless palladium-nickel alloy using hydrazine as a reducing agent, and a method of electroless CoNiP alloy using hypophosphorous acid compound as a reducing agent A method using electroless silver plating using hydrazine as a reducing agent, and a method using electroless copper-nickel-phosphorus alloy using hypophosphite compound as a reducing agent. In the method formed by electroless plating, a catalyst step and an electroless plating step are usually performed. Hereinafter, an example of a method of forming an alloy plating layer containing copper and nickel on the surface of the resin particles by electroless plating and forming a protrusion having a needle-like shape with a tapered tip on the outer surface of the metal portion will be described. . In the above-mentioned catalystizing step, a catalyst is formed on the surface of the resin particles as a starting point for forming a plating layer by electroless plating. As a method for forming the catalyst on the surface of the resin particles, for example, after adding the resin particles to a solution containing palladium chloride and tin chloride, the surface of the resin particles is activated by an acid solution or an alkali solution to make A method for depositing palladium on the surface of resin particles; and after adding resin particles to a solution containing palladium sulfate and aminopyridine, the surface of the resin particles is activated by a solution containing a reducing agent to precipitate palladium on the surface of the resin particles Methods, etc. As the reducing agent, a phosphorus-containing reducing agent can be used. Further, by using a phosphorus-containing reducing agent as the reducing agent, a metal portion containing phosphorus can be formed. In the above electroless plating step, in an electroless copper-nickel-phosphorus alloy plating method using a plating solution containing a copper-containing compound, a complexing agent, and a reducing agent, it is preferable to use a hypophosphorous acid compound as a reducing agent. A copper-nickel-phosphorus alloy plating solution containing a nickel-containing compound as a reducing agent, a reaction-starting metal catalyst, and a non-ionic surfactant. By immersing the resin particles in the copper-nickel-phosphorus alloy plating bath, the copper-nickel-phosphorus alloy can be deposited on the surface of the resin particles having the catalyst formed on the surface, and a metal portion containing copper, nickel, and phosphorus can be formed. . Examples of the copper-containing compound include copper sulfate, copper chloride, and copper nitrate. The copper-containing compound is preferably copper sulfate. Examples of the nickel-containing compound include nickel sulfate, nickel chloride, nickel carbonate, nickel sulfamate, and nickel nitrate. The nickel-containing compound is preferably nickel sulfate. Examples of the phosphorus-containing reducing agent include hypophosphorous acid and sodium hypophosphite. In addition to the phosphorus-containing reducing agent described above, a boron-containing reducing agent may be used. Examples of the boron-containing reducing agent include dimethylamine borane, sodium borohydride, and potassium borohydride. The above complexing agents are preferably: monocarboxylic acid complexing agents such as sodium acetate and sodium propionate; dicarboxylic acid complexing agents such as disodium malonate; tricarboxylic acid complexing agents such as disodium succinate; lactic acid and DL-malic acid , Rochelle salt, sodium citrate, sodium gluconate and other hydroxy acid complexes; glycine, EDTA (ethylenediamine tetraacetic acid, tetraacetic acid) and other amino acid complexes; ethylene diamine, etc. Amine complexes; Organic acid complexes such as maleic acid; or salts thereof. These preferred complexing agents may be used alone or in combination of two or more. Examples of the surfactant include anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants. Nonionic surfactants are particularly suitable. Preferred nonionic surfactants are polyethers containing ether oxygen atoms. Examples of preferred nonionic surfactants include polyoxyethylene lauryl ether, polyethylene glycol, polypropylene glycol, polyoxyethylene alkyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyethylene nonylphenyl ether, and polyoxyethylene. Polyoxyalkylene alkylamines of ethylene and polyoxyalkylene adducts of ethylenediamine. Preferred are polyoxyethylene monoalkyl ethers such as polyoxyethylene monobutyl ether, polyoxypropylene monobutyl ether, polyoxyethylene polyoxypropylene glycol monobutyl ether, polyethylene glycol, or phenol ethyl oxide. These surfactants may be used alone or in combination of two or more. Particularly preferred is polyethylene glycol having a molecular weight of about 1,000 (for example, 500 or more and 2000 or less). In order to form a needle-shaped protrusion having a tapered tip on the outer surface of the metal portion, it is desirable to control the molar ratio of the copper compound to the nickel compound. The amount of the copper compound used is preferably 2 to 100 times the molar ratio relative to the nickel compound. Further, even if the non-ionic surfactant and the like are not used, protrusions having a needle-like shape can be obtained. In order to form protrusions having a tapered tip with a sharper apex angle, a non-ionic surfactant is preferably used, and polyethylene glycol having a molecular weight of about 1,000 (for example, 500 or more and 2000 or less) is more preferably used. The ratio of the average height (b) of the plurality of protrusions to the average diameter (c) of the base of the plurality of protrusions (average height (b) / average diameter (c)) depends on the thickness of the metal portion. The immersion time in the bath is controlled. The plating temperature is preferably 30 ° C or higher, and preferably 100 ° C or lower, and the immersion time in the plating bath is preferably 5 minutes or longer. Next, an example of a method of forming a silver-plated layer on the surface of the resin particles by electroless plating and forming a protrusion having a needle-like shape with a tapered tip on the outer surface of the metal portion will be described. In the above-mentioned catalystizing step, a catalyst is formed on the surface of the resin particles as a starting point for forming a plating layer by electroless plating. As a method for forming the catalyst on the surface of the resin particles, for example, after adding the resin particles to a solution containing palladium chloride and tin chloride, the surface of the resin particles is activated by an acid solution or an alkali solution to make A method for depositing palladium on the surface of resin particles; and after adding resin particles to a solution containing palladium sulfate and aminopyridine, the surface of the resin particles is activated by a solution containing a reducing agent to precipitate palladium on the surface of the resin particles Methods, etc. As the reducing agent, a phosphorus-containing reducing agent can be used. Further, by using a phosphorus-containing reducing agent as the reducing agent, a metal portion containing phosphorus can be formed. In the above electroless plating step, in an electroless silver plating method using a plating solution containing a silver-containing compound, a complexing agent, and a reducing agent, it is preferable to use hydrazine, a nonionic surfactant, and Silver plating solution containing sulfur organic compounds. By immersing the resin particles in a silver plating bath, silver can be deposited on the surface of the resin particles having a catalyst formed on the surface, and a metal portion containing silver can be formed. The silver-containing compound is preferably silver cyanide, silver nitrate, silver sodium thiosulfate, silver gluconate, silver-cysteine complex, and silver methanesulfonate. Examples of the reducing agent include hydrazine, sodium hypophosphite, dimethylamine borane, sodium borohydride and potassium borohydride, formalin, glucose, and the like. As the reducing agent for forming protrusions having a needle-like shape, hydrazine monohydrate, hydrazine hydrochloride, and hydrazine sulfate are preferred. The above complexing agents are preferably: monocarboxylic acid complexing agents such as sodium acetate and sodium propionate; dicarboxylic acid complexing agents such as disodium malonate; tricarboxylic acid complexing agents such as disodium succinate; lactic acid and DL -Malic acid, Rochelle salt, sodium citrate, sodium gluconate and other acid-based complexes; glycine, EDTA and other amino acid-based complexes; ethylene-diamine and other amine-based complexes; maleic acid And other organic acid-based complexing agents; or such salts. These preferred complexing agents may be used alone or in combination of two or more. Examples of the surfactant include anionic surfactants, cationic surfactants, nonionic surfactants, and amphoteric surfactants. Nonionic surfactants are particularly suitable. Preferred nonionic surfactants are polyethers containing ether oxygen atoms. Examples of preferred nonionic surfactants include polyoxyethylene lauryl ether, polyethylene glycol, polypropylene glycol, polyoxyethylene alkyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyethylene nonylphenyl ether, and polyoxyethylene. Polyoxyalkylene alkylamines of ethylene and polyoxyalkylene adducts of ethylenediamine. Preferred are polyoxyethylene monoalkyl ethers such as polyoxyethylene monobutyl ether, polyoxypropylene monobutyl ether, polyoxyethylene polyoxypropylene glycol monobutyl ether, polyethylene glycol, or phenol ethyl oxide. These surfactants may be used alone or in combination of two or more. Particularly preferred is polyethylene glycol having a molecular weight of about 1,000 (for example, 500 or more and 2000 or less). Further, even if the non-ionic surfactant and the like are not used, protrusions having a needle-like shape can be obtained. In order to form protrusions having a tapered tip with a sharper apex angle, a non-ionic surfactant is preferably used, and polyethylene glycol having a molecular weight of about 1,000 (for example, 500 or more and 2000 or less) is more preferably used. Examples of the sulfur-containing organic compound include an organic compound having a thioether or a sulfonic acid group, a thiourea compound, and a benzothiazole compound. Examples of the organic compound having a thioether or a sulfonic acid group include N, N-dimethyldithiocarbamic acid 3-sulfopropyl ester, 3-mercaptopropanesulfonic acid 3-sulfopropyl ester, 3 -Sodium salt of mercaptopropanesulfonic acid, potassium salt of 3-mercapto-1-propanesulfonic acid, -o-ethyl dithiocarbonate, bissulfopropyl disulfide, bis (3-sulfopropyl) -disulfide -Disodium salt, 3- (benzothiazolyl-s-thio) propanesulfonic acid sodium salt, pyridiniumpropylsulfobetaine, 1-sodium-3-mercaptopropane-1-sulfonic acid salt, N, N-dimethyldithioaminocarboxylic acid 3-sulfoethyl ester, 3-mercaptoethylpropanesulfonic acid 3-sulfoethyl ester, 3-mercaptoethylsulfonic acid sodium salt, 3-mercapto-1-ethyl Potassium sulfonate, -o-ethyl-s-dithiocarbonate, bissulfoethyldisulfide, sodium 3- (benzothiazolyl-s-thio) ethylsulfonate, pyridinium Ethylsulfobetaine, 1-sodium-3-mercaptoethane-1-sulfonate, and thiourea compounds. Examples of the thiourea compound include thiourea, 1,3-dimethylthiourea, trimethylthiourea, diethylthiourea, and allylthiourea. Moreover, even if the sulfur-containing organic compound or the like is not used, protrusions having a needle-like shape can be obtained. In order to form protrusions having a tapered tip with a sharper apex angle, it is preferable to use a sulfur-containing organic compound, and it is more preferable to use thiourea. The ratio of the average height (b) of the plurality of protrusions to the average diameter (c) of the base of the plurality of protrusions (average height (b) / average diameter (c)) depends on the thickness of the metal portion. The immersion time in the bath is controlled. The plating temperature is preferably 30 ° C or higher, and preferably 100 ° C or lower, and the immersion time in the plating bath is preferably 5 minutes or longer. Next, an example of a method of forming a high-purity nickel plating layer on the surface of the resin particles by electroless plating and forming a protrusion having a needle-like shape with a tapered tip on the outer surface of the metal portion will be described. In the above-mentioned catalystizing step, a catalyst is formed on the surface of the resin particles as a starting point for forming a plating layer by electroless plating. As a method for forming the catalyst on the surface of the resin particles, for example, after adding the resin particles to a solution containing palladium chloride and tin chloride, the surface of the resin particles is activated by an acid solution or an alkali solution to make A method for depositing palladium on the surface of resin particles; and after adding resin particles to a solution containing palladium sulfate and aminopyridine, the surface of the resin particles is activated by a solution containing a reducing agent to precipitate palladium on the surface of the resin particles Methods, etc. As the reducing agent, a phosphorus-containing reducing agent can be used. Further, by using a phosphorus-containing reducing agent as the reducing agent, a metal portion containing phosphorus can be formed. In the above electroless plating step, in a method for electroless high-purity nickel plating using a plating solution containing a nickel-containing compound, a complexing agent, and a reducing agent, high-purity nickel plating containing hydrazine as a reducing agent may be suitably used. liquid. By immersing the resin particles in a high-purity nickel plating bath, the high-purity nickel plating can be deposited on the surface of the resin particles having a catalyst formed on the surface, and a metal portion of high-purity nickel can be formed. Examples of the nickel-containing compound include nickel sulfate, nickel chloride, nickel carbonate, nickel sulfamate, and nickel nitrate. The nickel-containing compound is preferably nickel chloride. Examples of the reducing agent include hydrazine monohydrate, hydrazine hydrochloride, and hydrazine sulfate. The aforementioned reducing agent is preferably hydrazine monohydrate. Examples of the above-mentioned complexing agents include monocarboxylic acid-based complexing agents such as sodium acetate and sodium propionate; dicarboxylic acid-based complexing agents such as disodium malonate; tricarboxylic acid-based complexing agents such as disodium succinate; lactic acid, DL-Malic acid, Rochelle salt, sodium citrate, sodium gluconate and other hydroxy acid-based complexes; Glycine, EDTA and other amino acid-based complexes; Ethylene-diamine and other amine-based complexes; Maleic acid Organic acid-based complexing agents such as acids. The complexing agent is preferably glycine as an amino acid-based complexing agent. In order to form a protrusion with a tapered tip shape on the outer surface of the metal portion, it is preferable to adjust the pH of the plating solution to 8. 0 or more. In an electroless plating solution using hydrazine as a reducing agent, the reduction of nickel is accompanied by a sharp decrease in the pH value by the oxidation reaction of hydrazine. In order to suppress the above-mentioned rapid decrease in pH, it is preferable to use a buffering agent such as phosphoric acid, boric acid, and carbonic acid. The aforementioned buffering agent preferably has a pH value of 8. Boric acid with a buffering effect above 0. The ratio of the average height (b) of the plurality of protrusions to the average diameter (c) of the base of the plurality of protrusions (average height (b) / average diameter (c)) depends on the thickness of the metal portion. The immersion time in the bath is controlled. The plating temperature is preferably 30 ° C or higher, and preferably 100 ° C or lower, and the immersion time in the plating bath is preferably 5 minutes or longer. Next, an example of a method of forming a palladium-nickel alloy plating layer on the surfaces of the resin particles by electroless plating and forming protrusions having a needle-like shape with a tapered tip on the outer surface of the metal portion will be described. In the above-mentioned catalystizing step, a catalyst is formed on the surface of the resin particles as a starting point for forming a plating layer by electroless plating. As a method for forming the catalyst on the surface of the resin particles, for example, after adding the resin particles to a solution containing palladium chloride and tin chloride, the surface of the resin particles is activated by an acid solution or an alkali solution to make A method for depositing palladium on the surface of resin particles; and after adding resin particles to a solution containing palladium sulfate and aminopyridine, the surface of the resin particles is activated by a solution containing a reducing agent to precipitate palladium on the surface of the resin particles Methods, etc. As the reducing agent, a phosphorus-containing reducing agent can be used. Further, by using a phosphorus-containing reducing agent as the reducing agent, a metal portion containing phosphorus can be formed. In the above electroless plating step, in an electroless palladium-nickel plating method using a plating solution containing a nickel-containing compound, a palladium compound, a stabilizer, a complexing agent, and a reducing agent, hydrazine may be suitably used as a reducing agent. Palladium-nickel alloy plating solution. By immersing the resin particles in a palladium-nickel alloy plating bath, the palladium-nickel alloy plating can be deposited on the surface of the resin particles having a catalyst formed on the surface, and a palladium-nickel metal portion can be formed. Examples of the nickel-containing compound include nickel sulfate, nickel chloride, nickel carbonate, nickel sulfamate, and nickel nitrate. The nickel-containing compound is preferably nickel sulfate. Examples of the palladium-containing compound include dichloroethylenediamine palladium (II), palladium chloride, dichlorodiamine palladium (II), dinitrodiammine palladium (II), and tetraamine palladium (II). ) Nitrate, tetraamminepalladium (II) sulfate, oxalate diamminepalladium (II), tetraamminepalladium (II) oxalate, and tetraamminepalladium (II) chloride. The palladium-containing compound is preferably palladium chloride. Examples of the stabilizer include lead compounds, bismuth compounds, and thallium compounds. Specific examples of these compounds include sulfates, carbonates, acetates, nitrates, and hydrochlorides of metals (lead, bismuth, and rhenium) constituting the compounds. Considering the impact on the environment, a bismuth compound or a thallium compound is preferred. These preferred stabilizers may be used alone or in combination of two or more. Examples of the reducing agent include hydrazine monohydrate, hydrazine hydrochloride, and hydrazine sulfate. The aforementioned reducing agent is preferably hydrazine monohydrate. Examples of the above-mentioned complexing agents include monocarboxylic acid-based complexing agents such as sodium acetate and sodium propionate; dicarboxylic acid-based complexing agents such as disodium malonate; tricarboxylic acid-based complexing agents such as disodium succinate; lactic acid, DL-Malic acid, Rochelle salt, sodium citrate, sodium gluconate and other hydroxy acid-based complexes; Glycine, EDTA and other amino acid-based complexes; Ethylene-diamine and other amine-based complexes; Maleic acid Organic acid-based complexing agents such as acids. The above-mentioned complexing agent is preferably ethylenediamine as an amino acid-based complexing agent. In order to form a protrusion with a tapered tip shape on the outer surface of the metal portion, it is preferable to adjust the pH of the plating solution to 8. 0 to 10. 0. If the pH is 7. 5 or less, the stability of the plating solution is reduced, causing bath decomposition, so it is preferable to set the pH to 8. 0 or more. The ratio of the average height (b) of the plurality of protrusions to the average diameter (c) of the base of the plurality of protrusions (average height (b) / average diameter (c)) depends on the thickness of the metal portion. The immersion time in the bath is controlled. The plating temperature is preferably 30 ° C or higher, and preferably 100 ° C or lower, and the immersion time in the plating bath is preferably 5 minutes or longer. Next, an example of a method of forming an alloy plating layer containing cobalt and nickel on the surface of the resin particles by electroless plating and forming a protrusion having a needle-like shape with a tapered tip on the outer surface of the metal portion will be described. . In the above-mentioned catalystizing step, a catalyst is formed on the surface of the resin particles as a starting point for forming a plating layer by electroless plating. As a method for forming the catalyst on the surface of the resin particles, for example, after adding the resin particles to a solution containing palladium chloride and tin chloride, the surface of the resin particles is activated by an acid solution or an alkali solution to make A method for depositing palladium on the surface of resin particles; and after adding resin particles to a solution containing palladium sulfate and aminopyridine, the surface of the resin particles is activated by a solution containing a reducing agent to precipitate palladium on the surface of the resin particles Methods, etc. As the reducing agent, a phosphorus-containing reducing agent can be used. Further, by using a phosphorus-containing reducing agent as the reducing agent, a metal portion containing phosphorus can be formed. In the above electroless plating step, in an electroless cobalt-nickel-phosphorus alloy plating method using a plating solution containing a cobalt-containing compound, an inorganic additive, a complexing agent, and a reducing agent, a hypophosphorous acid-containing compound can be suitably used As a reducing agent, a cobalt-nickel-phosphorus alloy plating solution containing a cobalt-containing compound as a reducing agent as a reaction-starting metal catalyst. By immersing the resin particles in a cobalt-nickel-phosphorus alloy plating bath, the cobalt-nickel-phosphorus alloy can be precipitated on the surface of the resin particles having a catalyst formed on the surface, and a metal containing cobalt, nickel, and phosphorus can be formed. unit. The cobalt-containing compound is preferably cobalt sulfate, cobalt chloride, cobalt nitrate, cobalt acetate, or cobalt carbonate. The cobalt-containing compound is more preferably cobalt sulfate. Examples of the nickel-containing compound include nickel sulfate, nickel chloride, nickel carbonate, nickel sulfamate, and nickel nitrate. The nickel-containing compound is preferably nickel sulfate. Examples of the phosphorus-containing reducing agent include hypophosphorous acid and sodium hypophosphite. In addition to the phosphorus-containing reducing agent described above, a boron-containing reducing agent may be used. Examples of the boron-containing reducing agent include dimethylamine borane, sodium borohydride, and potassium borohydride. The above complexing agents are preferably: monocarboxylic acid complexing agents such as sodium acetate and sodium propionate; dicarboxylic acid complexing agents such as disodium malonate; tricarboxylic acid complexing agents such as disodium succinate; lactic acid and DL -Malic acid, Rochelle salt, sodium citrate, sodium gluconate and other acid-based complexes; glycine, EDTA and other amino acid-based complexes; ethylene-diamine and other amine-based complexes; maleic acid And other organic acid-based complexing agents; or such salts. These preferred complexing agents may be used alone or in combination of two or more. The inorganic additive is preferably ammonium sulfate, ammonium chloride, or boric acid. These preferred inorganic additives may be used alone or in combination of two or more. The above-mentioned inorganic additives are considered to play a role in promoting the precipitation of the electroless cobalt plating layer. In order to form a needle-shaped protrusion with a tapered tip on the outer surface of the metal portion, it is desirable to control the molar ratio of the cobalt compound to the nickel compound. The amount of the above-mentioned cobalt compound to be used is preferably 2 to 100 times the molar ratio relative to the nickel compound. Moreover, even without using the above-mentioned inorganic additives, protrusions having a needle-like shape can be obtained. In order to form a protrusion with a smaller apex angle and a sharper tip, it is preferable to use an inorganic additive, and more preferably to use ammonium sulfate. The ratio of the average height (b) of the plurality of protrusions to the average diameter (c) of the base of the plurality of protrusions (average height (b) / average diameter (c)) depends on the thickness of the metal portion. The immersion time in the bath is controlled. The plating temperature is preferably 30 ° C or higher, and preferably 100 ° C or lower, and the immersion time in the plating bath is preferably 5 minutes or longer. The thickness of the entire metal portion in the non-protrusion portion is preferably 5 nm or more, more preferably 10 nm or more, even more preferably 20 nm or more, particularly preferably 50 nm or more, and more preferably 1000 nm or less, more It is preferably 800 nm or less, more preferably 500 nm or less, and even more preferably 400 nm or less. The thickness of the entire metal portion in the non-convex portion is preferably 5 nm or more, more preferably 10 nm or more, still more preferably 20 nm or more, particularly preferably 50 nm or more, and preferably 1000 nm or less. It is more preferably 800 nm or less, still more preferably 500 nm or less, and even more preferably 400 nm or less. When the thickness of the entire metal portion is greater than or equal to the above lower limit, peeling of the metal portion can be suppressed. When the thickness of the entire metal portion is equal to or less than the above-mentioned upper limit, the difference in thermal expansion coefficient between the substrate particles and the metal portion becomes smaller, and the metal portion becomes less likely to peel off from the substrate particles. When the thickness of the metal portion includes a plurality of metal portions (a first metal portion and a second metal portion), the thickness of the metal portion indicates the thickness of the entire metal portion (the total thickness of the first and second metal portions). When the metal part has a plurality of metal parts, the thickness of the metal part in the non-protrusion portion of the outermost layer is preferably 1 nm or more, more preferably 10 nm or more, and preferably 500 nm or less, more It is preferably below 100 nm. In the case where the metal portion has a plurality of metal portions, the thickness of the metal portion in the outermost layer without the convex portion is preferably 1 nm or more, more preferably 10 nm or more, and preferably 500 nm or less. More preferably, it is 100 nm or less. If the thickness of the metal part of the outermost layer is equal to or more than the lower limit and the upper limit, the coating using the outermost metal part can be made uniform, the corrosion resistance can be sufficiently high, and the connection resistance between the electrodes can be sufficient. low. When the outermost layer is more expensive than the inner metal part, the thinner the outermost layer, the lower the cost. The thickness of the metal portion can be measured by observing a cross section of metal-containing particles using a transmission electron microscope (TEM), for example. [Core substance] The metal-containing particles are preferably provided with a plurality of core substances that swell the surface of the metal portion, and more preferably include a plurality of core substances that swell the surface of the metal portion in the metal portion, so that A plurality of the protrusions or a plurality of the protrusions are formed. By embedding the core substance in the metal portion, it is easy for the metal portion to have a plurality of the convex portions or a plurality of protrusions on the outer surface. However, in order to form protrusions or protrusions on the outer surface of metal-containing particles and metal parts, a core substance may not necessarily be used. For example, as a method of forming protrusions or protrusions by electroless plating without using a core substance, a metal core is generated by electroless plating, and the metal core is adhered to the surface of the substrate particles or the metal portion. A method of forming a metal part by electroless plating, and the like. Examples of the method for forming the convex portion or the protrusion include a method of forming a metal portion by electroless plating after attaching a core substance to the surface of the substrate particles; and a method of forming the metal portion by electroless plating. After forming a metal part on the surface, a method of attaching a core substance and further forming a metal part by electroless plating, and the like. As a method for disposing the core substance on the surface of the substrate particles, for example, a core substance is added to a dispersion liquid of the substrate particles, and the core substance is integrated and attached to the substrate particles by, for example, Van der Waals force. Surface method; and a method of adding a core substance to a container containing a substrate particle and attaching the core substance to the surface of the substrate particle by a mechanical action such as rotation of the container. Among them, since it is easy to control the amount of the core substance to be attached, the method of integrating and attaching the core substance to the surface of the substrate particles in the dispersion is preferred. By embedding the core substance in the metal portion, it is easy for the metal portion to have a plurality of the convex portions or a plurality of protrusions on the outer surface. However, in order to form protrusions or protrusions on the conductive surface of the metal-containing particles and the surface of the metal portion, a core substance may not necessarily be used. Examples of the method for forming the above-mentioned protrusions or protrusions include a method of forming a metal portion by electroless plating after attaching a core substance to the surface of the substrate particles; and forming a metal portion on the surface of the substrate particles by electroless plating. A method of forming a metal part by attaching a core substance and forming the metal part by electroless plating; and a method of adding a core substance in stages while forming a metal part on the surface of the substrate particles by electroless plating Wait. Examples of the material of the core substance include a conductive substance and a non-conductive substance. Examples of the conductive substance include conductive non-metals such as metals, metal oxides, and graphite, and conductive polymers. Examples of the conductive polymer include polyacetylene. Examples of the non-conductive material include silicon dioxide, aluminum oxide, barium titanate, and zirconia. Among them, metal is preferable because it can improve the conductivity and further effectively reduce the connection resistance. The core substance is preferably a metal particle. As the metal as the material of the core material, the metals listed as the material of the conductive material can be appropriately used. As a specific example of the material of the core substance, barium titanate (Mohs hardness 4. 5), nickel (Mohs hardness 5), silicon dioxide (silica, Mohs hardness 6-7), titanium oxide (Mohs hardness 7), zirconia (Mohs hardness 8-9), alumina (Mohs hardness Hardness 9), tungsten carbide (Mohs hardness 9), diamond (Mohs hardness 10), and the like. The above-mentioned inorganic particles are preferably nickel, silicon dioxide, titanium oxide, zirconia, alumina, tungsten carbide or diamond, more preferably silicon dioxide, titanium oxide, zirconia, alumina, tungsten carbide or diamond, and more preferably Titanium oxide, zirconia, alumina, tungsten carbide or diamond, particularly preferred is zirconia, alumina, tungsten carbide or diamond. The Mohs hardness of the core material is preferably 5 or more, more preferably 6 or more, even more preferably 7 or more, and even more preferably 7. 5 or more. The shape of the core substance is not particularly limited. The shape of the core substance is preferably a block. Examples of the core substance include a particulate block, an aggregated block formed by aggregating a plurality of fine particles, and an irregularly shaped block. The average diameter (average particle diameter) of the core substance is preferably 0. 001 μm or more, more preferably 0. 05 μm or more, and preferably 0. 9 μm or less, more preferably 0. 2 μm or less. When the average diameter of the core substance is at least the above lower limit and at most the above upper limit, the connection resistance between the electrodes is effectively reduced. The "average diameter (average particle diameter)" of the core substance indicates a number average diameter (quantity average particle diameter). The average diameter of the core material can be determined by observing 50 arbitrary core materials with an electron microscope or an optical microscope and calculating an average value. [Insulating Substance] The metal-containing particles of the present invention preferably include an insulating substance arranged on the outer surface of the metal portion. In this case, if metal-containing particles are used for connection between the electrodes, a short circuit between adjacent electrodes can be prevented. Specifically, when a plurality of metal-containing particles are in contact with each other, since an insulating substance is present between the plurality of electrodes, a short circuit between the laterally adjacent electrodes rather than between the upper and lower electrodes can be prevented. In addition, when the electrodes are connected, an insulating substance between the metal portion of the metal-containing particles and the electrode can be easily eliminated by pressurizing the metal-containing particles with the two electrodes. Since the metal portion has a plurality of protrusions on the outer surface, an insulating substance between the metal portion of the metal-containing particles and the electrode can be easily excluded. When the metal portion has a plurality of convex portions on the outer surface, an insulating substance between the metal portion of the metal-containing particles and the electrode can be easily excluded. It is preferable that the said insulating substance is an insulating particle in the point which can more easily exclude the said insulating substance at the time of the pressure bonding between electrodes. Specific examples of the insulating resin as the material of the insulating substance include polyolefin compounds, (meth) acrylate polymers, (meth) acrylate copolymers, block polymers, thermoplastic resins, and thermoplastic resins. Crosslinked products, thermosetting resins and water-soluble resins. Examples of the polyolefin compound include polyethylene, ethylene-vinyl acetate copolymer, and ethylene-acrylate copolymer. Examples of the (meth) acrylate polymer include polymethyl (meth) acrylate, polyethyl (meth) acrylate, and polybutyl (meth) acrylate. Examples of the block polymer include polystyrene, a styrene-acrylate copolymer, an SB-type styrene-butadiene block copolymer, an SBS-type styrene-butadiene block copolymer, and the same. And so on. Examples of the thermoplastic resin include a vinyl polymer and a vinyl copolymer. Examples of the thermosetting resin include epoxy resin, phenol resin, and melamine resin. Examples of the water-soluble resin include polyvinyl alcohol, polyacrylic acid, polyacrylamide, polyvinylpyrrolidone, polyethylene oxide, and methyl cellulose. Among these, a water-soluble resin is preferable, and polyvinyl alcohol is more preferable. Examples of a method for disposing the insulating substance on the surface of the metal portion include a chemical method, a physical or mechanical method, and the like. Examples of the chemical method include an interfacial polymerization method, a suspension polymerization method in the presence of particles, and an emulsion polymerization method. Examples of the physical or mechanical method include a method using spray drying, hybridization, electrostatic adhesion method, spray method, dipping, and vacuum evaporation. Among them, a method of disposing the insulating substance on the surface of the metal portion through chemical bonding is preferred in terms of the difficulty of detaching the insulating substance. The outer surface of the metal portion and the surface of the insulating substance (insulating particles, etc.) may be coated with a compound having a reactive functional group, respectively. The outer surface of the metal part and the surface of the insulating substance may not be chemically bonded directly, or may be chemically bonded indirectly through a compound having a reactive functional group. After the carboxyl group is introduced into the outer surface of the metal portion, the carboxyl group may be chemically bonded to the functional group on the surface of the insulating material through a polymer electrolyte such as polyethyleneimine. The average diameter (average particle diameter) of the insulating substance can be appropriately selected depending on the particle diameter of the metal-containing particles, the use of the metal-containing particles, and the like. The average diameter (average particle diameter) of the insulating material is preferably 0. 005 μm or more, more preferably 0. 01 μm or more, and preferably 1 μm or less, more preferably 0. 5 μm or less. When the average diameter of the insulating substance is greater than or equal to the above-mentioned lower limit, when metal-containing particles are dispersed in the binder resin, the metal portions in the plurality of metal-containing particles become difficult to contact with each other. If the average diameter of the insulating substance is below the above upper limit, it is not necessary to increase the pressure excessively in order to exclude the insulating substance between the electrode and the metal-containing particles during the connection between the electrodes, and it is not necessary to heat to high temperature. The "average diameter (average particle diameter)" of the above-mentioned insulating substance means a number average diameter (number average particle diameter). The average diameter of the insulating substance can be determined using a particle size distribution measuring device or the like. (Particle-connected body) As described above, the metal-containing particles of the present invention can be formed into a particle-connected body as shown in FIG. 15 by melting and solidifying the protrusions of the metal portion. Such a particle-connected body is useful as a novel material capable of improving the connection reliability higher than the previous metal-containing particles. That is, the present inventors have further discovered the following inventions as novel connection materials. 1) A particle-connected body comprising a plurality of metal-containing particles (different from the metal-containing particles of the present invention and also referred to as metal-containing particle bodies) via a metal-containing columnar connection portion. 2) The particle-connected body according to the above 1), wherein the columnar connection portion contains a metal of the same kind as the metal contained in the metal-containing particle. 3) The particle linked body according to the above 1) or 2), wherein the metal-containing particles constituting the particle linked body are derived from the metal-containing particles of the present invention. 4) The particle-connected body according to any one of 1) to 3) above, wherein the metal-containing particles and the columnar connecting portions constituting the particle-connected body are melt-solidified by the protrusions of the metal-containing particles of the present invention Formed. 5) The particle coupling body according to any one of 1) to 4) above, wherein the columnar coupling portion is a protrusion derived from the metal-containing particle of the present invention. The particle linked body of the present invention can be manufactured by the method described above, but the manufacturing method is not limited to the method described above. For example, metal-containing particles and columnar bodies may be separately manufactured, and metal-containing particles may be connected by the columnar bodies to form columnar connecting portions. The columnar connection portion may be a columnar connection portion or a polygonal columnar connection portion, and the central portion of the column may be thick or thin. The diameter (d) of the outer circle of the columnar connection portion and the connection surface with the metal-containing particles is preferably 3 nm or more, more preferably 100 nm or more, and preferably 10,000 nm or less, and more preferably 1000 nm. the following. In the above-mentioned columnar connection portion, the length (l) of the columnar connection portion is preferably 3 nm or more, more preferably 100 nm or more, and preferably 10,000 nm or less, and more preferably 1000 nm or less. The ratio ((d) / (l)) of the length (l) of the columnar connection portion in the columnar connection portion to the diameter (d) of the outer circle with the connection surface of the metal-containing particles is preferably 0. Above 001, more preferably 0. 1 or more, and preferably 100 or less, and more preferably 10 or less. The particle linked body of the present invention may be a linked body of two metal-containing particles as shown in FIG. 15, or may be a linked body of three or more metal-containing particles. (Connection material) The connection material of the present invention can be suitably used to form a connection portion that connects two connection target members. The connection material includes the metal-containing particles described above, and a resin. The connecting material is preferably used to form the connecting portion by melting and solidifying the front ends of the metal portions of the plurality of metal-containing particles. The resin is not particularly limited. The resin is a binder for dispersing the metal-containing particles. The resin preferably contains a thermoplastic resin or a curable resin, and more preferably contains a curable resin. Examples of the curable resin include a photocurable resin and a thermosetting resin. The photocurable resin preferably contains a photocurable resin and a photopolymerization initiator. The thermosetting resin preferably contains a thermosetting resin and a thermosetting agent. Examples of the resin include a vinyl resin, a thermoplastic resin, a curable resin, a thermoplastic block copolymer, and an elastomer. These resins may be used alone or in combination of two or more. Examples of the vinyl resin include vinyl acetate resin, acrylic resin, and styrene resin. Examples of the thermoplastic resin include polyolefin resins, ethylene-vinyl acetate copolymers, and polyamide resins. Examples of the curable resin include epoxy resin, urethane resin, polyimide resin, and unsaturated polyester resin. The curable resin may be a room temperature curable resin, a thermosetting resin, a light curable resin, or a moisture curable resin. Examples of the thermoplastic block copolymer include a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, and a styrene-butadiene-styrene. Block copolymer hydride and styrene-isoprene-styrene block copolymer. Examples of the elastomer include a styrene-butadiene copolymer rubber and an acrylonitrile-styrene block copolymer rubber. When the protrusion of the said metal part contains a metal oxide, it is preferable to use a reducing agent. Examples of the reducing agent include an alcohol compound (a compound having an alcoholic hydroxyl group), a carboxylic acid compound (a compound having a carboxyl group), and an amine compound (a compound having an amine group). These reducing agents may be used alone or in combination of two or more. Examples of the alcohol compound include an alkyl alcohol. Specific examples of the alcohol compound include ethanol, propanol, butanol, pentanol, hexanol, heptanol, octanol, nonanol, decanol, undecyl alcohol, dodecyl alcohol, Tridecyl alcohol, tetradecyl alcohol, pentadecyl alcohol, cetyl alcohol, heptadecyl alcohol, octadecyl alcohol, nonadecyl alcohol, and eicosyl alcohol. The alcohol compound is not limited to a primary alcohol compound, and a secondary alcohol compound, a tertiary alcohol compound, an alkanediol, and an alcohol compound having a cyclic structure may also be used. Further, as the alcohol compound, a compound having a large number of alcohol groups such as ethylene glycol and triethylene glycol may be used. In addition, as the alcohol compound, compounds such as citric acid, ascorbic acid, and glucose can also be used. Examples of the carboxylic acid compound include an alkylcarboxylic acid. Specific examples of the carboxylic acid compound include butyric acid, valeric acid, hexanoic acid, heptanoic acid, caprylic acid, nonanoic acid, capric acid, undecanoic acid, dodecanoic acid, tridecanoic acid, myristic acid, and fifteen Acid, hexadecanoic acid, heptadecanoic acid, octadecanoic acid, undecanoic acid and eicosanoic acid. The carboxylic acid compound is not limited to a primary carboxylic acid type compound, and a secondary carboxylic acid type compound, a tertiary carboxylic acid type compound, a dicarboxylic acid, and a carboxylic compound having a cyclic structure may be used. Examples of the amine compound include an alkylamine. Specific examples of the amine compound include butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, undecylamine, dodecylamine, Tridecylamine, tetradecylamine, pentadecylamine, cetylamine, heptadecylamine, octadecylamine, undecylamine and eicosylamine. The amine compound may have a branched structure. Examples of the amine compound having a branched structure include 2-ethylhexylamine and 1,5-dimethylhexylamine. The amine compound is not limited to a primary amine compound, and a secondary amine compound, a tertiary amine compound, and an amine compound having a cyclic structure may be used. The reducing agent may be an organic substance having an aldehyde group, an ester group, a sulfonyl group, or a ketone group, or may be an organic substance such as a metal carboxylic acid salt. Carboxylic acid metal salts can also be used as precursors of metal particles. On the other hand, since they contain organic substances, they can also be used as reducing agents for metal oxide particles. In addition to the metal-containing particles and the resin, the connecting material may contain, for example, fillers, extenders, softeners, plasticizers, polymerization catalysts, hardening catalysts, colorants, antioxidants, heat stabilizers, Various additives such as light stabilizer, ultraviolet absorber, slip agent, antistatic agent and flame retardant. The connection material is preferably used for conductive connection, and is preferably a conductive connection material. The connection material is preferably used for an anisotropic conductive connection, and is preferably an anisotropic conductive connection material. The connection material may be used in the form of a paste or a film. In the case where the connection material is a film, a film containing metal-containing particles may be laminated without a metal-containing particle. The paste is preferably a conductive paste, and more preferably an anisotropic conductive paste. The film is preferably a conductive film, and more preferably an anisotropic conductive film. In 100% by weight of the connecting material, the content of the resin is preferably 1% by weight or more, more preferably 5% by weight or more, 10% by weight or more, 30% by weight or more, and 50% by weight. Above, can also be 70% by weight or more, and preferably 99. 99% by weight or less, more preferably 99. 9% by weight or less. When the content of the resin is at least the above lower limit and below the above upper limit, connection reliability is further improved. 100% by weight of the connection material, the content of the metal-containing particles is preferably 0. 01% by weight or more, more preferably 0. 1% by weight or more, and preferably 99% by weight or less, more preferably 95% by weight or less, or 80% by weight or less, 60% by weight or less, 40% by weight or less, or 20% by weight It may be 10% by weight or less. When the content of the metal-containing particles is at least the above lower limit and below the above upper limit, connection reliability is further improved. Further, if the content of the metal-containing particles is at least the above lower limit and below the above upper limit, the metal-containing particles can be sufficiently present between the first and second connection target members, and the metal-containing particles can further suppress the first 1. The case where the interval between the second connection target members is locally narrowed. Therefore, it is also possible to suppress a situation where the heat radiation property of the connection portion is locally reduced. The connecting material may contain metal-atom-containing particles having no base material particles in addition to the metal-containing particles. Examples of the metal atom-containing particles include metal particles and metal compound particles. The metal compound particles include a metal atom and atoms other than the metal atom. Specific examples of the metal compound particles include metal oxide particles, metal carbonate particles, metal carboxylate particles, and metal complex particles. The metal compound particles are preferably metal oxide particles. For example, the above-mentioned metal oxide particles are sintered after being converted into metal particles by heating during connection in the presence of a reducing agent. The metal oxide particles are precursors of metal particles. Examples of the metal carboxylate particles include metal acetate particles. Examples of the metal constituting the metal particles and the metal oxide particles include silver, copper, nickel, and gold. Silver or copper is preferred, and silver is particularly preferred. Therefore, the metal particles are preferably silver particles or copper particles, and more preferably silver particles. The metal oxide particles are preferably silver oxide particles or copper oxide particles, and more preferably silver oxide particles. When silver particles and silver oxide particles are used, there is less residue after connection, and the volume reduction rate is also very small. Examples of the silver oxide in the silver oxide particles include Ag 2 O and AgO. The above metal atom-containing particles are preferably sintered under heating at a temperature of less than 400 ° C. The sintering temperature (sintering temperature) of the metal atom-containing particles is more preferably 350 ° C or lower, and more preferably 300 ° C or higher. If the temperature at which the metal atom-containing particles are sintered is equal to or lower than the upper limit, the sintering can be performed efficiently, the energy required for sintering can be reduced, and the environmental load can be reduced. The connecting material containing the metal atom-containing particles is preferably a connecting material containing metal particles having an average particle diameter of 1 nm to 100 nm, or metal oxide particles having an average particle diameter of 1 nm to 50 μm. The connecting material with reducing agent. When such a connecting material is used, the metal atom-containing particles can be sintered well by heating during connection. The average particle diameter of the metal oxide particles is preferably 5 μm or less. The particle diameter of the metal atom-containing particle is a diameter when the metal atom-containing particle is truly spherical, and the metal particle-containing particle is a maximum diameter when the particle is not truly spherical. The content of the metal atom-containing particles in 100% by weight of the connecting material is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 50% by weight or more, and 100% by weight or less, preferably It is 99% by weight or less, and more preferably 90% by weight or less. The total amount of the connection material may be the metal atom-containing particles. When the content of the metal atom-containing particles is at least the above lower limit, the metal atom-containing particles can be more densely sintered. As a result, the heat radiation and heat resistance of the connection portion are also increased. When the metal atom-containing particles are metal oxide particles, it is preferable to use a reducing agent. Examples of the reducing agent include an alcohol compound (a compound having an alcoholic hydroxyl group), a carboxylic acid compound (a compound having a carboxyl group), and an amine compound (a compound having an amine group). These reducing agents may be used alone or in combination of two or more. Examples of the alcohol compound include an alkyl alcohol. Specific examples of the alcohol compound include ethanol, propanol, butanol, pentanol, hexanol, heptanol, octanol, nonanol, decanol, undecyl alcohol, dodecyl alcohol, Tridecyl alcohol, tetradecyl alcohol, pentadecyl alcohol, cetyl alcohol, heptadecyl alcohol, octadecyl alcohol, nonadecyl alcohol, and eicosyl alcohol. The alcohol compound is not limited to a primary alcohol compound, and a secondary alcohol compound, a tertiary alcohol compound, an alkanediol, and an alcohol compound having a cyclic structure may also be used. Further, as the alcohol compound, a compound having a large number of alcohol groups such as ethylene glycol and triethylene glycol may be used. In addition, as the alcohol compound, compounds such as citric acid, ascorbic acid, and glucose can also be used. Examples of the carboxylic acid compound include an alkylcarboxylic acid. Specific examples of the carboxylic acid compound include butyric acid, valeric acid, hexanoic acid, heptanoic acid, caprylic acid, nonanoic acid, capric acid, undecanoic acid, dodecanoic acid, tridecanoic acid, myristic acid, and fifteen Acid, hexadecanoic acid, heptadecanoic acid, octadecanoic acid, undecanoic acid and eicosanoic acid. The carboxylic acid compound is not limited to a primary carboxylic acid type compound, and a secondary carboxylic acid type compound, a tertiary carboxylic acid type compound, a dicarboxylic acid, and a carboxylic compound having a cyclic structure may be used. Examples of the amine compound include an alkylamine. Specific examples of the amine compound include butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, undecylamine, dodecylamine, Tridecylamine, tetradecylamine, pentadecylamine, cetylamine, heptadecylamine, octadecylamine, undecylamine and eicosylamine. The amine compound may have a branched structure. Examples of the amine compound having a branched structure include 2-ethylhexylamine and 1,5-dimethylhexylamine. The amine compound is not limited to a primary amine compound, and a secondary amine compound, a tertiary amine compound, and an amine compound having a cyclic structure may be used. Furthermore, the reducing agent may be an organic substance having an aldehyde group, an ester group, a sulfonyl group, or a ketone group, or an organic substance such as a metal carboxylic acid salt. Carboxylic acid metal salts can also be used as precursors of metal particles. On the other hand, since they contain organic substances, they can also be used as reducing agents for metal oxide particles. If a reducing agent having a lower melting point than the sintering temperature (joining temperature) of the above-mentioned metal atom-containing particles is used, there is a tendency that agglomeration occurs during joining and porosity tends to occur at the joining portion. By using a metal carboxylic acid salt, since the metal carboxylic acid salt is not melted by heating during bonding, the occurrence of pores can be suppressed. Furthermore, a metal compound containing an organic substance in addition to the carboxylic acid metal salt may be used as a reducing agent. In the case where the reducing agent is used, the content of the reducing agent in 100% by weight of the connecting material is preferably 1% by weight or more, more preferably 10% by weight or more, and preferably 90% by weight or less, and more preferably 70% by weight or less, more preferably 50% by weight or less. When the content of the reducing agent is at least the above lower limit, the metal atom-containing particles can be densely sintered. As a result, the heat radiation property and heat resistance of a joint part also become high. The content of the metal oxide particles in 100% by weight of the connecting material is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 60% by weight or more, and preferably 99.99% by weight or less, more It is preferably 99.9% by weight or less, more preferably 99.5% by weight or less, still more preferably 99% by weight or less, particularly preferably 90% by weight or less, and most preferably 80% by weight or less. When the connection material is a paste, the adhesive used for the paste is not particularly limited. The binder preferably disappears when the metal atom-containing particles are sintered. These adhesives may be used alone or in combination of two or more. Specific examples of the binder include, as the solvent, aliphatic solvents, ketone solvents, aromatic solvents, ester solvents, ether solvents, alcohol solvents, paraffin solvents, and petroleum solvents. Examples of the aliphatic solvent include cyclohexane, methylcyclohexane, and ethylcyclohexane. Examples of the ketone-based solvent include acetone and methyl ethyl ketone. Examples of the aromatic solvent include toluene and xylene. Examples of the ester-based solvent include ethyl acetate, butyl acetate, and isopropyl acetate. Examples of the ether-based solvent include tetrahydrofuran (THF) and dioxane. Examples of the alcohol-based solvent include ethanol and butanol. Examples of the paraffin-based solvent include paraffin oil and naphthenic oil. Examples of the petroleum-based solvent include turpentine oil and naphtha. (Connection Structure) The connection structure of the present invention includes a first connection target member, a second connection target member, and a connection portion to which the first and second connection target members are connected. In the connection structure of the present invention, the connection portion is formed of the metal-containing particles or the connection material. The material of the connection portion is the metal-containing particles or the connection material. The manufacturing method of the connection structure of the present invention includes the steps of disposing the metal-containing particles or the connection material between the first connection object member and the second connection object member; and heating the metal-containing particles, The step of melting the front end of the protrusion of the metal portion and solidifying after melting, and forming a connection portion that connects the first connection target member and the second connection target member by the metal-containing particles or the connection material. 9 is a cross-sectional view schematically showing a connection structure using metal-containing particles according to the first embodiment of the present invention. The connection structure 51 shown in FIG. 9 includes a first connection target member 52, a second connection target member 53, and a connection portion 54 connecting the first and second connection target members 52 and 53. The connecting portion 54 includes the metal-containing particles 1 and a resin (hardened resin or the like). The connection portion 54 is formed of a connection material containing the metal-containing particles 1. The material of the connection portion 54 is the above-mentioned connection material. The connection portion 54 is preferably formed by hardening a connection material. Furthermore, in FIG. 9, the tip of the protrusion 3 a of the metal portion 3 of the metal-containing particle 1 is solidified after melting. A joint body including a plurality of metal-containing particles 1 in the connection portion 54. In the connection structure 51, the metal-containing particles 1 are bonded to the first connection target member 51, and the metal-containing particles 1 are bonded to the second connection target member 53. Instead of the metal-containing particles 1, other metal-containing particles such as metal-containing particles 1A, 1B, 1C, 1D, 1E, 1F, 1G may also be used. The first connection target member 52 has a plurality of first electrodes 52a on a surface (upper surface). The second connection target member 53 has a plurality of second electrodes 53a on the surface (lower surface). The first electrode 52a and the second electrode 53a are electrically connected through one or a plurality of metal-containing particles 1. Therefore, the first and second connection target members 52 and 53 are electrically connected by the metal-containing particles 1. In the connection structure 51, the metal-containing particles 1 are bonded to the first electrode 52a, and the metal-containing particles 1 are bonded to the second electrode 53a. The manufacturing method of the said connection structure is not specifically limited. As an example of a method of manufacturing the connection structure, a method of arranging the connection material between the first connection target member and the second connection target member to obtain a laminated body, and then heating and pressing the laminated body can be cited. The above mentioned pressure is 9.8 × 10 4 ～ 4.9 × 10 6 Around Pa. The heating temperature is about 120 to 220 ° C. Specific examples of the connection target member include electronic components such as semiconductor wafers, capacitors, and diodes; and electronic components such as printed circuit boards, flexible printed substrates, glass epoxy substrates, and circuit substrates such as glass substrates. The connection target member is preferably an electronic component. The metal-containing particles are preferably used for the electrical connection of electrodes in electronic parts. Examples of the electrodes provided on the connection target member include metal electrodes such as gold electrodes, nickel electrodes, tin electrodes, aluminum electrodes, copper electrodes, silver electrodes, SUS electrodes, molybdenum electrodes, and tungsten electrodes. When the connection target member is a flexible printed circuit board, the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, or a copper electrode. When the connection target member is a glass substrate, the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, or a tungsten electrode. When the above-mentioned electrode is an aluminum electrode, it may be an electrode formed of only aluminum, or an electrode formed of an aluminum layer on the surface area of the metal oxide layer. Examples of the material of the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, Al, and Ga. FIG. 10 is a cross-sectional view schematically showing a modified example of a connection structure using metal-containing particles according to the first embodiment of the present invention. The connection structure 61 shown in FIG. 10 includes a first connection target member 62, second connection target members 63 and 64, and connection portions 65 and 66 connecting the first connection target member 62 and the second connection target members 63 and 64. The connection portions 65 and 66 are formed using a connection material containing the metal-containing particles 1 and other metal-containing particles 67. The material of the connection portions 65 and 66 is the above-mentioned connection material. A connection portion 65 and a second connection target member 63 are arranged on a first surface (one surface) side of the first connection target member 62. The connection portion 65 connects the first connection target member 62 and the second connection target member 63. A connection portion 66 and a second connection target member 64 are disposed on a second surface (the other surface) side opposite to the first surface of the first connection target member 62. The connection portion 66 connects the first connection target member 62 and the second connection target member 64. Metal-containing particles 1 and metal-containing particles 67 are arranged between the first connection-target member 62 and the second connection-target members 63 and 64, respectively. In this embodiment, in the connecting portions 65 and 66, the metal atom-containing particles and the metal-containing particles 1 are in a state of being sintered. The metal-containing particles 1 are arranged between the first connection target member 62 and the second connection target members 63 and 64. The first connection target member 62 and the second connection target members 63 and 64 are connected by the metal-containing particles 1. A heat sink 68 is disposed on a surface of the second connection target member 63 opposite to the connection portion 65 side. A heat sink 69 is disposed on a surface of the second connection target member 64 opposite to the connection portion 66 side. Therefore, the connection structure 61 has a portion in which the fins 68, the second connection target member 63, the connection portion 65, the first connection target member 62, the connection portion 66, the second connection target member 64, and the heat radiation fin 69 are sequentially stacked. Examples of the first connection target member 62 include rectifier diodes, power transistors (power MOSFETs, insulated gate bipolar transistors), gate fluids, gate cutoff fluids, and triacs. Power semiconductor devices such as Si, SiC, and GaN are used as materials. In the connection structure 61 provided with such a first connection target member 62, when the connection structure 61 is used, a large amount of heat is easily generated in the first connection target member 62. Therefore, it is necessary to efficiently dissipate the heat generated by the first connection target member 62 to the heat sinks 68, 69, and the like. Therefore, the connection portions 65 and 66 disposed between the first connection target member 62 and the heat sinks 68 and 69 require higher heat dissipation and higher reliability. Examples of the second connection target members 63 and 64 include substrates made of ceramics, plastic, or the like. The connecting portions 65 and 66 are formed by heating the connecting material to melt and solidify the front ends of the metal-containing particles. (Continuity inspection member or conduction member) The particle connection body and the connection material of the present invention can also be applied to a conduction inspection member or a conduction member. One aspect of the continuity inspection member is described below. The continuity check member is not limited to the following aspect. The conduction inspection member and the conduction member may be sheet-shaped conduction members. 19 (a) and 19 (b) are a plan view and a cross-sectional view showing an example of a continuity inspection member. Fig. 19 (b) is a sectional view taken along the line AA in Fig. 19 (a). The continuity inspection member 11 shown in FIGS. 19A and 19B includes a base body 12 having a through hole 12 a and a conductive portion 13 disposed in the through hole 12 a of the base body 12. The material of the conductive portion 13 contains the metal-containing particles described above. The continuity check member 11 may be a general-purpose member. The base system is a member of a substrate of the continuity inspection member. The substrate is preferably insulating, and the substrate is preferably formed of an insulating material. Examples of the insulating material include an insulating resin. The insulating resin constituting the substrate may be, for example, any of a thermoplastic resin and a thermosetting resin. Examples of the thermoplastic resin include polyester resin, polystyrene resin, polyethylene resin, polyamide resin, ABS resin, and polycarbonate resin. Examples of the thermosetting resin include an epoxy resin, a urethane resin, a polyimide resin, a polyetheretherketone resin, a polyamidoimide resin, a polyetherimide resin, and a polysiloxane Oxygen resin, and phenol resin. Examples of the silicone resin include silicone rubber and the like. When the base system is formed of an insulating resin, the insulating resin constituting the base may be used alone or in combination of two or more. The substrate is, for example, a plate shape or a sheet shape. The sheet shape includes a film shape. The thickness of the above-mentioned substrate can be appropriately set according to the type of the continuity inspection member, for example, it can be 0. Thickness from 005 mm to 50 mm. The size of the above-mentioned substrate in plan view can also be appropriately set according to the target inspection device. The substrate can be obtained, for example, by forming an insulating material such as the insulating resin described above into a desired shape. A plurality of the through holes of the substrate are arranged in the substrate. The through hole is preferably penetrated in a thickness direction of the base body. The through hole of the base may be formed in a cylindrical shape, but is not limited to a cylindrical shape, and may be formed in another shape, for example, a polygonal column shape. In addition, the above-mentioned through hole may be formed in a tapered shape that is tapered at the front end in one direction, or may be formed in a deformed shape. The size of the through-hole, for example, the apparent area of the through-hole in a plan view may be formed to a suitable size, such as a size that can accommodate and hold a conductive portion. If the through-hole is, for example, cylindrical, the diameter of the through-hole is preferably 0. 01 mm or more, and preferably 10 mm or less. Furthermore, the through holes of the base body may all have the same shape and the same size, and a shape or size of a part of the through holes of the base body may be different from other through holes. The number of the through-holes of the base body can also be set within an appropriate range, and the number of the through-hole inspection is sufficient, and it can be appropriately set according to the target inspection device. The arrangement position of the through-holes of the base body may be appropriately set according to the target inspection device. The method of forming the through-holes of the base body is not particularly limited, and the through-holes can be formed by a known method (for example, laser processing). The conductive portion in the through hole of the base body has conductivity. Specifically, the conductive portion contains particles derived from the metal-containing particles. For example, the conductive portion is formed by accommodating a plurality of metal-containing particles in a through hole. The conductive portion includes an aggregate (particle group) of particles derived from metal-containing particles. The material of the conductive portion may include materials other than the metal-containing particles. For example, the material of the conductive portion may contain a binder in addition to the metal-containing particles. Since the material of the conductive portion contains a binder, the metal-containing particles are more firmly aggregated, thereby easily holding the particles derived from the metal-containing particles in the through-holes. The adhesive is not particularly limited, and examples thereof include a photocurable resin and a thermosetting resin. The photocurable resin preferably contains a photocurable resin and a photopolymerization initiator. It is preferable that the said thermosetting resin contains a thermosetting resin and a thermosetting agent. Examples of the resin include a silicone copolymer, a vinyl resin, a thermoplastic resin, a curable resin, a thermoplastic block copolymer, and an elastomer. These resins may be used alone or in combination of two or more. It is preferable that the particles derived from the metal-containing particles are tightly filled in the through-holes. In this case, a more accurate continuity inspection can be performed by the continuity inspection member. Preferably, the conductive portion is housed in the through hole so that the front and back surfaces of the continuity inspection member or the general-purpose member can be conducted. In the conductive portion, the particles derived from the metal-containing particles are preferably continuous from the front surface to the back surface of the conductive portion, and the particles derived from the metal-containing particles are present in contact with each other. In this case, the conductivity of the conductive portion is improved. A method of accommodating the conductive portion in the through hole is not particularly limited. For example, by applying the material containing the metal-containing particles and the binder to a substrate, the metal-containing particles are filled into the through-holes and hardened under appropriate conditions to form the through-holes. Conductive part. Thereby, the conductive portion is accommodated in the through hole. A solvent may also be contained in a material containing the above-mentioned metal-containing particles and a binder as required. In the material containing the metal-containing particles and the binder, the content of the binder is 100 parts by weight of the metal-containing particles in terms of solid content, preferably 5 parts by weight or more, and more preferably 10 parts by weight or more. It is preferably 70 parts by weight or less, and more preferably 50 parts by weight or less. The above-mentioned member for continuity inspection can be used as a probe card. In addition, as long as the said member for continuity inspection is a degree which does not inhibit the effect of this invention, it may be equipped with another component. 20 (a) to (c) are diagrams schematically showing a case where the electrical characteristics of the electronic circuit device are inspected by the continuity inspection member. In FIGS. 20 (a) to (c), the electronic circuit device is a BGA substrate 31 (ball grid array substrate). The BGA substrate 31 is a substrate having a structure in which connection pads are arranged in a grid pattern on a multilayer substrate 31A, and solder balls 31B are arranged on each pad. In addition, in FIGS. 20 (a) to (c), the continuity check member 21 is a probe card. The continuity inspection member 21 has a plurality of through holes 22 a formed in the base body 22, and a conductive portion 23 is housed in the through holes 22 a. The BGA substrate 31 and the continuity inspection member 21 are prepared as shown in FIG. 20 (a), and the BGA substrate 31 is brought into contact with the continuity inspection member 21 as shown in FIG. 20 (b) and compressed. At this time, the solder ball 31B is in contact with the conductive portion 23 in the through hole 22a. In this state, as shown in FIG. 20 (c), an ammeter 32 is connected and a continuity check is performed to determine the pass or fail of the BGA substrate 31. Hereinafter, the present invention will be specifically described with examples and comparative examples. The present invention is not limited to the following examples. (Example 1) As the substrate particle A, a particle diameter of 3. 0 μm of divinylbenzene copolymer resin particles ("Micropearl SP-203" manufactured by Sekisui Chemical Industry Co., Ltd.). After dispersing 10 parts by weight of the substrate particles A in 100 parts by weight of an alkali solution containing 5% by weight of a palladium catalyst solution using an ultrasonic disperser, the substrate particles A were taken out by filtering the solution. Next, the substrate particles A were added to 100 parts by weight of a 1% by weight solution of dimethylamineborane, and the surface of the substrate particles A was activated. The surface-activated substrate particles A were sufficiently washed with water, and then added to 500 parts by weight of distilled water to disperse them, thereby obtaining a suspension (A). Then, it took 3 minutes to add 1 part by weight of a metal nickel particle slurry ("2020SUS" manufactured by Mitsui Metals Corporation, with an average particle diameter of 150 nm) to the above-mentioned suspension (A) to obtain a substrate containing a core substance attached Particle A suspension (B). The suspension (B) was added to a solution containing 20 g / L of copper sulfate and 30 g / L of ethylenediaminetetraacetic acid to obtain a particle mixture (C). As an electroless copper plating solution, a mixed solution containing 250 g / L of copper sulfate, 150 g / L of ethylenediamine tetraacetic acid, 100 g / L of sodium gluconate, and 50 g / L of formaldehyde was prepared by ammonia. The pH is adjusted to 10. 5 copper plating solution (D). Also, as an electroless silver plating solution, the pH value of a mixed solution containing 30 g / L of silver nitrate, 100 g / L of succinimide, and 20 g / L of formaldehyde was prepared by ammonia to 8. 0 silver plating solution (E). Also, prepare to contain dimethylamine borane 100 g / L, and sodium hydroxide 0. 5 g / L plating solution (F) for protrusion formation (pH 10. 0). The above-mentioned copper plating solution (D) was slowly added dropwise to the particle mixture liquid (C) adjusted to a dispersion state of 55 ° C. to perform electroless copper plating. Electroless copper plating was performed under the conditions that the dropping acceleration of the copper plating solution (D) was 30 mL / min and the dropping time was 30 minutes. In this way, a particle mixture liquid (G) containing particles having copper metal portions arranged on the surfaces of the resin particles and having metal portions having convex portions on the surface was obtained. Thereafter, the particles were taken out by filtering the particle mixture (G) and washed with water, thereby obtaining particles having a copper metal portion disposed on the surface of the substrate particle A and a metal portion having a convex portion on the surface. After the particles were sufficiently washed with water, they were added to 500 parts by weight of distilled water and dispersed to obtain a particle mixture (H). Then, the above-mentioned silver plating solution (E) was slowly added dropwise to the particle mixture liquid (H) adjusted to a dispersed state of 60 ° C. to perform electroless silver plating. Electroless silver plating was performed under the conditions that the dropping acceleration of the silver plating solution (E) was 10 mL / minute and the dropping time was 30 minutes. Thereafter, the plating solution (F) for protrusion formation was slowly added dropwise to form protrusions. The protrusion formation was performed under the conditions that the dropping acceleration of the plating liquid (F) for protrusion formation was 1 mL / minute and the dropping time was 10 minutes. In the dropwise addition of the plating solution (F) for protrusion formation, silver plating was performed while dispersing the generated silver protrusion nuclei by ultrasonic stirring (protrusion formation step). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining copper and silver metal portions (the entire thickness of the metal portion of the portion having no convex portion) on the surface of the substrate particle A: 0. 1 μm), including metal-containing particles having a convex portion on the surface and a plurality of protruding metal portions on the surface of the convex portion. (Example 2) A metal-containing particle was obtained in the same manner as in Example 1 except that the metal nickel particle slurry was changed to an alumina particle slurry (average particle diameter: 150 nm). (Example 3) The suspension (A) obtained in Example 1 was added to a solution containing 40 ppm of nickel sulfate, 2 g / L of trisodium citrate, and 10 g / L of ammonia water to obtain a particle mixture ( B). As a plating solution for forming acicular protrusions, 100 g / L of copper sulfate, 10 g / L of nickel sulfate, 100 g / L of sodium hypophosphite, 70 g / L of trisodium citrate, and boric acid 10 were prepared with ammonia water. The pH value of the mixed solution of g / L and polyethylene glycol 1000 (molecular weight: 1000) 5 mg / L as a nonionic surfactant is adjusted to 10. 0 is a plating solution (C) for forming needle-like protrusions as an electroless copper-nickel-phosphorus alloy plating solution. Also, as an electroless silver plating solution, the pH value of the mixed solution of silver nitrate 30 g / L, succinimide 100 g / L, and formaldehyde 20 g / L was adjusted to 8 by ammonia. 0 silver plating solution (D). Also, prepare to contain dimethylamine borane 100 g / L, and sodium hydroxide 0. 5 g / L plating solution (E) for protrusion formation (pH 10. 0). The above-mentioned acicular projection forming plating solution (C) was slowly dropped into the particle mixture liquid (B) adjusted to a dispersion state of 70 ° C. to form acicular projections. Electroless copper-nickel-phosphorus alloy plating (acicular projection formation and copper-nickel-) was performed under conditions that the droplet acceleration of the plating solution (C) for the formation of needle-shaped protrusions was 40 mL / min and the dropping time was 60 minutes. Phosphorus alloy plating step). Thereafter, particles were taken out by filtration to obtain particles (F) having copper-nickel-phosphorus alloy metal portions arranged on the surface of the substrate particles A and having metal portions having convex portions on the surface. The particles (F) were added to 500 parts by weight of distilled water and dispersed, thereby obtaining a suspension (G). Thereafter, the particles were taken out by filtering the suspension (G) and washed with water, thereby obtaining a copper-nickel-phosphorus alloy metal portion disposed on the surface of the substrate particle A and having needle-shaped convex portions on the surface. The particles of the metal part. After the particles were sufficiently washed with water, they were added to 500 parts by weight of distilled water and dispersed to obtain a particle mixture (H). Then, the above-mentioned silver plating solution (D) was slowly added dropwise to the particle mixture liquid (H) adjusted to a dispersed state of 60 ° C. to perform electroless silver plating. Electroless silver plating was performed under the conditions that the dropping acceleration of the silver plating solution (D) was 10 mL / minute and the dropping time was 30 minutes. Thereafter, the plating solution (E) for protrusion formation was slowly added dropwise to form protrusions. The protrusion formation was performed under the conditions that the dropping acceleration of the plating solution (E) for protrusion formation was 1 mL / minute and the dropping time was 10 minutes. In the dropwise addition of the plating solution (E) for protrusion formation, silver plating was performed while dispersing the generated silver protrusion nuclei by ultrasonic stirring (protrusion formation step). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining a copper-nickel-phosphorus alloy and a silver metal portion (the entire metal portion in the portion without the convex portion) disposed on the surface of the substrate particle A. Thickness: 0. 1 μm) and metal-containing particles having a plurality of needle-like convex portions on the surface and a plurality of metal portions having protrusions on the surface of the convex portion. (Example 4) The suspension (A) obtained in Example 1 was added to a solution containing 80 g / L of nickel sulfate, 10 ppm of osmium nitrate, and 5 ppm of bismuth nitrate to obtain a particle mixture (B). As a plating solution for forming acicular protrusions, sodium hydroxide 100 g / L, hydrazine monohydrate 100 g / L, trisodium citrate 50 g / L, and polyethylene glycol were prepared with sodium hydroxide. 1000 (Molecular weight: 1000) 20 mg / L of the mixed solution was adjusted to pH 9. 0 is a plating solution (C) for forming needle-like protrusions as an electroless plating high-purity nickel liquid. Also, as an electroless silver plating solution, it is prepared to adjust the pH value of the mixed solution containing silver nitrate 30 g / L, succinimide 100 g / L, and formaldehyde 20 g / L by ammonia to 8. 0 silver plating solution (D). Also, prepare to contain dimethylamine borane 100 g / L, and sodium hydroxide 0. 5 g / L plating solution (E) for protrusion formation (pH 10. 0). In the particle mixture liquid (B) adjusted to a dispersed state of 60 ° C., the above-mentioned plating solution (C) for forming needle-like protrusions was slowly dropped to form needle-like protrusions. Electroless plating of high-purity nickel (acicular protrusion formation and copper-nickel-phosphorus alloy plating) under conditions that the droplet acceleration of the plating solution (C) for the formation of needle-like protrusions is 20 mL / min and the dropping time is 50 minutes Repeat steps). Thereafter, the particles were taken out by filtration to obtain particles (F) having a high-purity nickel metal portion disposed on the surface of the substrate particle A and having a metal portion having a convex portion on the surface. The particles (F) were added to 500 parts by weight of distilled water and dispersed, thereby obtaining a suspension (G). Thereafter, the particles were taken out by filtering the suspension (G) and washed with water, thereby obtaining a high-purity nickel metal portion disposed on the surface of the substrate particle A, and having a metal portion having needle-shaped convex portions on the surface. particle. After the particles were sufficiently washed with water, they were added to 500 parts by weight of distilled water and dispersed to obtain a particle mixture (H). Then, the above-mentioned silver plating solution (D) was slowly added dropwise to the particle mixture liquid (H) adjusted to a dispersed state of 60 ° C. to perform electroless silver plating. Electroless silver plating was performed under the conditions that the dropping acceleration of the silver plating solution (D) was 10 mL / minute and the dropping time was 30 minutes. Thereafter, the plating solution (E) for protrusion formation was slowly added dropwise to form protrusions. The protrusion formation was performed under the conditions that the dropping acceleration of the plating solution (E) for protrusion formation was 1 mL / minute and the dropping time was 10 minutes. In the dropwise addition of the plating solution (E) for protrusion formation, silver plating was performed while dispersing the generated silver protrusion nuclei by ultrasonic stirring (protrusion formation step). Thereafter, the particles were taken out by filtration, and a high-purity nickel and silver metal portion was arranged on the surface of the substrate particle A, and the surface was provided with needle-like convex portions and a plurality of protrusions were provided on the surface of the convex portion. Particle mixture (I) of the metal part. Thereafter, the particles are removed by filtering the particle mixture (I), and the particles are washed with water and dried, thereby obtaining high-purity nickel and silver metal portions (portions without convex portions) on the surface of the substrate particle A. The overall thickness of the metal part: 0. 1 μm) and metal-containing particles having a plurality of needle-like convex portions on the surface and a plurality of metal portions having protrusions on the surface of the convex portion. (Example 5) The suspension (A) obtained in Example 1 was added to a solution containing 500 ppm of silver nitrate, succinimide 10 g / L, and ammonia water 10 g / L to obtain a particle mixture (B ). As an electroless silver plating solution, a silver plating solution prepared by adjusting the pH of a mixed solution containing 30 g / L of silver nitrate, 100 g / L of succinimide, and 20 g / L of formaldehyde to 8 with ammonia was prepared.液 (C). Also, prepare to contain dimethylamine borane 100 g / L, and sodium hydroxide 0. 5 g / L plating solution (D) for protrusion formation (pH 10. 0). The above-mentioned electroless silver plating solution (C) was slowly added dropwise to the particle mixture liquid (B) adjusted to a dispersed state of 60 ° C to form needle-like protrusions. Electroless silver plating was performed under the conditions that the dropping acceleration of the electroless silver plating solution (C) was 10 mL / min and the dropping time was 30 minutes (silver plating step). Thereafter, the above-mentioned plating solution (D) for protrusion formation was slowly added dropwise to form protrusions. The protrusion formation was performed under the conditions that the dropping acceleration of the plating solution (D) for protrusion formation was 1 mL / minute and the dropping time was 10 minutes. In the dropwise addition of the plating solution (D) for protrusion formation, silver plating was performed while dispersing the generated silver protrusion nuclei by ultrasonic stirring (protrusion formation step). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining a silver metal portion (the entire thickness of the metal portion in the non-protrusion portion) on the surface of the substrate particle A: 0. 1 μm), and includes metal-containing particles having a plurality of protruding metal portions on the surface. (Example 6) The suspension (A) obtained in Example 1 was added to a solution containing 500 ppm of silver potassium cyanide, 10 g / L of potassium cyanide, and 10 g / L of potassium hydroxide to obtain particles. Mixed liquid (B). As a plating solution for forming needle-like protrusions, potassium hydroxide cyanide 80 g / L, potassium cyanide 10 g / L, polyethylene glycol 1000 (molecular weight: 1000), 20 mg / L were prepared by potassium hydroxide. The pH of the mixed solution of thiourea 50 ppm and hydrazine monohydrate 100 g / L was adjusted to 7. 5 silver plating solution (C). The above-mentioned electroless silver plating solution (C) was slowly added dropwise to the particle mixture liquid (B) adjusted to a dispersion state of 80 ° C to form needle-like protrusions. Electroless silver plating was performed under the conditions that the dropping acceleration of the electroless silver plating solution (C) was 10 mL / min and the dropping time was 60 minutes (needle-like protrusion formation and silver plating steps). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining a silver metal portion (the entire thickness of the metal portion in the non-protrusion portion) on the surface of the resin particles: 0. 1 μm) and metal-containing particles having a silver metal portion having a plurality of needle-shaped protrusions formed on the surface. (Example 7) The suspension (A) obtained in Example 1 was added to a solution containing 500 ppm of silver potassium cyanide, 10 g / L of potassium cyanide, and 10 g / L of potassium hydroxide to obtain particles. Mixed liquid (B). As a plating solution for forming needle-like protrusions, potassium hydroxide cyanide 80 g / L, potassium cyanide 10 g / L, polyethylene glycol 1000 (molecular weight: 1000), 20 mg / L were prepared by potassium hydroxide. The pH of the mixed solution of thiourea 50 ppm and hydrazine monohydrate 100 g / L was adjusted to 7. 5 silver plating solution (C). Also, as an electroless silver plating solution, it is prepared to adjust the pH value of the mixed solution containing silver nitrate 30 g / L, succinimide 100 g / L, and formaldehyde 20 g / L by ammonia to 8. 0 silver plating solution (D). Also, prepare to contain dimethylamine borane 100 g / L, and sodium hydroxide 0. 5 g / L plating solution (E) for protrusion formation (pH 10. 0). The above-mentioned electroless silver plating solution (C) was slowly added dropwise to the particle mixture liquid (B) adjusted to a dispersion state of 80 ° C to form needle-like protrusions. Electroless silver plating was performed under the conditions that the dropping acceleration of the electroless silver plating solution (C) was 10 mL / min and the dropping time was 45 minutes (needle-like protrusion formation and silver plating steps). Thereafter, particles were taken out by filtration to obtain particles (F) having silver metal portions arranged on the surface of the substrate particles A and having metal portions having needle-like convex portions on the surface. The particles (F) were added to 500 parts by weight of distilled water and dispersed, thereby obtaining a particle mixed liquid (G). Then, the above-mentioned silver plating solution (D) was slowly added dropwise to the particle mixture liquid (G) adjusted to a dispersed state of 60 ° C. to perform electroless silver plating. Electroless silver plating was performed under the conditions that the dropping acceleration of the silver plating solution (D) was 10 mL / minute and the dropping time was 30 minutes. Thereafter, the plating solution (E) for protrusion formation was slowly added dropwise to form protrusions. The protrusion formation was performed under the conditions that the dropping acceleration of the plating solution (E) for protrusion formation was 1 mL / minute and the dropping time was 10 minutes. In the dropwise addition of the plating solution (E) for protrusion formation, silver plating was performed while dispersing the generated silver protrusion nuclei by ultrasonic stirring (protrusion formation step). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining a silver metal portion (the entire thickness of the metal portion in the portion having no convex portion) on the surface of the substrate particle A: 0. 1 μm) and metal-containing particles having a plurality of needle-like convex portions on the surface and a plurality of metal portions having protrusions on the surface of the convex portion. (Example 8) The suspension (B) obtained in Example 1 was added to a solution containing 50 g / L of nickel sulfate, 30 ppm of osmium nitrate, and 20 ppm of bismuth nitrate to obtain a particle mixture (C). As an electroless nickel-tungsten-boron alloy plating solution, sodium hydroxide 100 g / L, sodium tungstate 5 g / L, dimethylamine borane 30 g / L, and bismuth nitrate 10 were prepared by sodium hydroxide. Electroless nickel-tungsten-boron alloy plating solution (D) prepared by adjusting the pH of a mixed solution of ppm and trisodium citrate 30 g / L to 6. Also, as an electroless silver plating solution, the pH value of the mixed solution of silver nitrate 30 g / L, succinimide 100 g / L, and formaldehyde 20 g / L was adjusted to 8 by ammonia. 0 silver plating solution (E). Also, prepare to contain dimethylamine borane 100 g / L, and sodium hydroxide 0. 5 g / L plating solution (F) for protrusion formation (pH 10. 0). The above-mentioned electroless nickel-tungsten-boron alloy plating solution (D) was slowly added dropwise to the particle mixture liquid (C) adjusted to a dispersed state of 60 ° C to perform electroless nickel-tungsten-boron alloy plating. Electroless nickel-tungsten-boron alloy plating was performed under the conditions that the dropping acceleration of the electroless nickel-tungsten-boron alloy plating solution (D) was 15 mL / minute and the dropping time was 60 minutes. Thus, a particle mixed liquid (G) containing particles in which a nickel-tungsten-boron alloy metal portion is arranged on the surface of the substrate particle A and which has a metal portion having a convex portion on the surface is obtained. Thereafter, the particles are taken out by filtering the particle mixture (G) and washed with water, thereby obtaining a nickel-tungsten-boron alloy metal layer disposed on the surface of the substrate particle A, and having a surface having convex portions. Particles of metal parts. After the particles were sufficiently washed with water, they were added to 500 parts by weight of distilled water and dispersed to obtain a particle mixture (H). Then, the above-mentioned silver plating solution (E) was slowly added dropwise to the particle mixture liquid (H) adjusted to a dispersed state of 60 ° C. to perform electroless silver plating. Electroless silver plating was performed under the conditions that the dropping acceleration of the silver plating solution (E) was 10 mL / minute and the dropping time was 30 minutes. Thereafter, the plating solution (F) for protrusion formation was slowly added dropwise to form protrusions. The protrusion formation was performed under the conditions that the dropping acceleration of the plating liquid (F) for protrusion formation was 1 mL / minute and the dropping time was 10 minutes. In the dropwise addition of the plating solution (F) for protrusion formation, silver plating was performed while dispersing the generated silver protrusion nuclei by ultrasonic stirring (protrusion formation step). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining a nickel-tungsten-boron alloy and a silver metal portion (the entire metal portion in the portion without the convex portion) disposed on the surface of the substrate particle A. Thickness: 0. 1 μm) and metal-containing particles having a plurality of convex portions on the surface and metal portions having a plurality of protrusions on the surface of the convex portion. (Example 9) The suspension (B) obtained in Example 1 was added to a solution containing 50 g / L of nickel sulfate, 30 ppm of osmium nitrate, and 20 ppm of bismuth nitrate to obtain a particle mixed solution (C). As an electroless nickel-tungsten-boron alloy plating solution, sodium hydroxide 100 g / L, sodium tungstate 2 g / L, dimethylamine borane 30 g / L, and bismuth nitrate 10 were prepared by sodium hydroxide. Electroless nickel-tungsten-boron alloy plating solution (D) prepared by adjusting the pH of a mixed solution of ppm and trisodium citrate 30 g / L to 6. In addition, as an electroless gold plating solution, 30 g / L of potassium cyanide, 2 g / L of potassium cyanide, 30 g / L of trisodium citrate, and 15 g of ethylenediamine tetraacetic acid were prepared by potassium hydroxide. / L, potassium hydroxide 10 g / L, and dimethylamine borane 20 g / L, the pH value of the mixture was adjusted to 8. 0 gold plating solution (E). Also, prepare to contain sodium borohydride 30 g / L, and sodium hydroxide 0. 5 g / L plating solution (F) for protrusion formation (pH 10. 0). The above-mentioned electroless nickel-tungsten-boron alloy plating solution (D) was slowly added dropwise to the particle mixture liquid (C) adjusted to a dispersed state of 60 ° C to perform electroless nickel-tungsten-boron alloy plating. Electroless nickel-tungsten-boron alloy plating was performed under the conditions that the dropping acceleration of the electroless nickel-tungsten-boron alloy plating solution (D) was 15 mL / minute and the dropping time was 60 minutes. Thus, particles (G) having a metal portion having a nickel-tungsten-boron alloy metal portion disposed on the surface of the substrate particle A and having a convex portion on the surface were obtained. Thereafter, the particles were taken out by filtering the suspension (G) and washed with water, thereby obtaining a metal portion having a nickel-tungsten-boron alloy metal portion on the surface of the substrate particle A, and a metal having convex portions on the surface Department of particles. After the particles were sufficiently washed with water, they were added to 500 parts by weight of distilled water and dispersed to obtain a particle mixture (H). Then, the above-mentioned electroless gold plating solution (E) was slowly added dropwise to the particle mixture liquid (H) adjusted to a dispersed state of 60 ° C. to perform electroless gold plating. Electroless gold plating was performed under the conditions that the dropping acceleration of the electroless gold plating solution (E) was 10 mL / min and the dropping time was 30 minutes. Thereafter, the plating solution (F) for protrusion formation was slowly added dropwise to form protrusions. The protrusion formation was performed under the conditions that the dropping acceleration of the plating solution (F) for protrusion formation was 1 mL / minute and the dropping time was 5 minutes. In the dropwise addition of the plating solution (F) for protrusion formation, gold plating was performed while dispersing the generated gold protrusion cores by ultrasonic stirring (protrusion formation step). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining a nickel-tungsten-boron alloy and a gold metal portion (the entire metal portion in the portion without the convex portion) disposed on the surface of the substrate particle A. Thickness: 0. 1 μm) and metal-containing particles having a plurality of convex portions on the surface and metal portions having a plurality of protrusions on the surface of the convex portion. (Example 10) The suspension (B) obtained in Example 1 was added to a solution containing 20 g / L of copper sulfate and 30 g / L of ethylenediaminetetraacetic acid to obtain a particle mixture (C). In addition, as an electroless copper plating solution, a mixed solution containing 250 g / L of copper sulfate, 150 g / L of ethylenediamine tetraacetic acid, 100 g / L of sodium gluconate, and 50 g / L of formaldehyde was prepared by ammonia. The pH is adjusted to 10. 5 copper plating solution (D). Also, as an electroless tin plating solution, 20 g / L of tin chloride, 50 g / L of nitrogen triacetic acid, 2 g / L of thiourea, 1 g / L of thiomalic acid, and ethyl acetate were prepared by sulfuric acid. Diamine tetraacetic acid 7. The pH of the mixed solution of 5 g / L and 15 g / L of titanium trichloride was adjusted to 7. 0 tin plating solution (E). Also, prepare a plating solution (F) (pH 7. 0). The above-mentioned copper plating solution (D) was slowly added dropwise to the particle mixture liquid (C) adjusted to a dispersion state of 55 ° C. to perform electroless copper plating. Electroless copper plating was performed under the conditions that the dropping acceleration of the copper plating solution (D) was 30 mL / min and the dropping time was 30 minutes. Thereafter, the particles were taken out by filtration to obtain a particle mixture (G) containing particles having copper metal portions arranged on the surface of the substrate particles A and having metal portions having convex portions on the surface. Thereafter, the particles are taken out by filtering the particle mixture (G) and washed with water, thereby obtaining particles having a copper metal portion disposed on the surface of the substrate particle A and having a metal portion having a convex portion on the surface. After the particles were sufficiently washed with water, they were added to 500 parts by weight of distilled water and dispersed to obtain a particle mixture (H). Then, the above-mentioned tin plating solution (E) was slowly added dropwise to the particle mixture liquid (H) adjusted to a dispersed state of 60 ° C. to perform electroless tin plating. Electroless tin plating was performed under the conditions that the dropping acceleration of the tin plating solution (E) was 10 mL / min and the dropping time was 30 minutes. Thereafter, the plating solution (F) for protrusion formation was slowly added dropwise to form protrusions. The protrusion formation was performed under the conditions that the dropping acceleration of the plating liquid (F) for protrusion formation was 1 mL / minute and the dropping time was 10 minutes. During the dropwise addition of the plating solution (F) for protrusion formation, tin plating was performed while dispersing the generated tin protrusion nuclei by ultrasonic stirring (protrusion formation step). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining a copper and tin metal portion (the thickness of the entire metal portion in the portion without the convex portion) on the surface of the substrate particle A: 0. 1 μm) and metal-containing particles having a plurality of convex portions on the surface and metal portions having a plurality of protrusions on the surface of the convex portion. (Example 11) (1) Preparation of polysiloxane oligomer In a 100 ml separable flask set in a warm bath, 1 part by weight of 1,3-divinyltetramethyldisiloxane, With 0. 20 weight part of 5 weight% p-toluenesulfonic acid aqueous solution. After stirring at 40 ° C for 1 hour, sodium bicarbonate was added at 0. 05 parts by weight. Thereafter, 10 parts by weight of dimethoxymethylphenylsilane, 49 parts by weight of dimethyldimethoxysilane, and 0.1% of trimethylmethoxysilane were added. 6 parts by weight, and methyltrimethoxysilane 3. 6 parts by weight was stirred for 1 hour. Thereafter, a 10% by weight potassium hydroxide aqueous solution was added 1. 9 parts by weight, the reaction was carried out while stirring for 10 hours while raising the temperature to 85 ° C. and decompressing with an aspirator. After the reaction was completed, the pressure was returned to normal pressure and cooled to 40 ° C., and acetic acid was added at 0. 2 parts by weight, and allowed to stand in a separating funnel for more than 12 hours. The lower layer after taking out the two layers was separated and refined by an evaporator, thereby obtaining a polysiloxane oligomer. (2) Preparation of polysiloxane particle material (containing organic polymer) It is prepared that 30 parts by weight of the obtained polysiloxane oligomer is dissolved with 2-ethylperoxyhexanoic acid third butyl ester (polymerization initiator, (`` Perbutyl O '' manufactured by Nippon Oil Co.) 0. 5 parts by weight of solution A. Also, in a weight of 150 parts by weight of ion-exchanged water, a 40% by weight aqueous solution of lauryl sulfate triethanolamine salt (emulsifier) is 0.1. 8 parts by weight with polyvinyl alcohol (degree of polymerization: about 2000, degree of saponification: 86. 5 to 89 mol%, 80 parts by weight of a 5% by weight aqueous solution of "Gohsenol GH-20" manufactured by Nippon Synthetic Chemical Co., Ltd. was prepared as an aqueous solution B. The dissolving solution A was added to a separable flask set in a warm bath, and then the aqueous solution B was added. Thereafter, emulsification was performed by using a Shirasu Porous Glass (SPG) film (average pore diameter of about 1 μm). Thereafter, the temperature was raised to 85 ° C., and polymerization was performed for 9 hours. The entire amount of the polymerized particles was washed with water by centrifugation, and freeze-dried. After drying, it was pulverized by a ball mill until the aggregates of the particles became the target ratio (average secondary particle diameter / average primary particle diameter) so as to obtain a particle diameter of 3. 0 μm polysiloxane particles (base particle B). The substrate particles A were changed to the substrate particles B, and a metal portion was formed in the same manner as in Example 1 to obtain metal-containing particles. (Example 12) A two-terminal acrylic polysiloxane ("X-22-2445" manufactured by Shin-Etsu Chemical Industry Co., Ltd.) was used instead of the polysiloxane oligomer to obtain a particle size of 3. 0 μm polysiloxane particles (substrate particle C). The base material particle A was changed to the base material particle C, and a metal portion was formed in the same manner as in Example 1 to obtain metal-containing particles. (Example 13) Preparation of pure copper particles ("HXR-Cu" manufactured by Nippon Atomized Metal Powders Corporation, particle size 2. 5 μm) as the substrate particle D. The substrate particles A were changed to the substrate particles D, and metal parts were formed in the same manner as in Example 1 to obtain metal-containing particles. (Example 14) Pure silver particles (particle size 2. 5 μm) as substrate particles E. The substrate particles A were changed to the substrate particles E, and a metal portion was formed in the same manner as in Example 1 to obtain metal-containing particles. (Example 15) Only a particle diameter different from that of the substrate particle A and a particle diameter of 2. 0 μm substrate particles F. The substrate particles A were changed to the substrate particles F, and a metal portion was formed in the same manner as in Example 1 to obtain metal-containing particles. (Example 16) Only a particle diameter different from that of the substrate particle A and a particle diameter of 10. 0 μm substrate particles G. The base material particle A was changed to the base material particle G, and a metal portion was formed in the same manner as in Example 1 to obtain metal-containing particles. (Example 17) Only a particle diameter different from the substrate particle A and a particle diameter of 50 were prepared. 0 μm substrate particles H. The substrate particles A were changed to the substrate particles H, and a metal portion was formed in the same manner as in Example 1 to obtain metal-containing particles. (Example 18) In a 1000 mL separable flask equipped with a four-port separable cover, a stirring wing, a three-way cock, a cooling tube, and a temperature probe, the solid content rate was 5% by weight. Take 100 mmol of methyl methacrylate, 1 mmol of N, N, N-trimethyl-N-2-methacryloxyethylammonium chloride, and 2,2'-azobis (2- 1 mmol of fluorenylpropane) dihydrochloride monomer composition was added to ion-exchanged water, followed by stirring at 200 rpm, and polymerization was performed at 70 ° C for 24 hours in a nitrogen atmosphere. After completion of the reaction, freeze-drying was performed to obtain insulating particles having an ammonium group on the surface, an average particle diameter of 220 nm, and a CV value of 10%. The insulating particles were dispersed in ion-exchanged water under ultrasonic irradiation to obtain a 10% by weight aqueous dispersion of the insulating particles. 10 g of the metal-containing particles obtained in Example 1 were dispersed in 500 mL of ion-exchanged water, and 4 g of an aqueous dispersion of insulating particles was added, followed by stirring at room temperature for 6 hours. After filtering through a 3 μm sieve filter, washing with methanol and drying were performed to obtain metal-containing particles to which insulating particles were attached. Observation with a scanning electron microscope (SEM) revealed that only one coating layer made of insulating particles was formed on the surface of the metal-containing particles. Calculate relative to the center from metal-containing particles by image analysis 2. The covering area of the insulating particles having an area of 5 μm (that is, the projected area of the particle diameter of the insulating particles), as a result, the covering rate was 30%. (Example 19) The suspension (B) obtained in Example 1 was added to a solution containing 50 g / L of nickel sulfate, 30 ppm of osmium nitrate, and 20 ppm of bismuth nitrate to obtain a particle mixed liquid (C). As an electroless nickel-phosphorus alloy plating solution, a solution containing 100 g / L of nickel sulfate, 30 g / L of sodium hypophosphite, 10 ppm of bismuth nitrate, and 30 g / L of trisodium citrate was prepared with sodium hydroxide. Electroless nickel-phosphorus alloy plating solution (D) prepared by adjusting the pH of the mixed solution to 6. Also, as an electroless silver plating solution, the pH value of the mixed solution of silver nitrate 30 g / L, succinimide 100 g / L, and formaldehyde 20 g / L was adjusted to 8 by ammonia. 0 silver plating solution (E). Also, prepared to contain sodium hypophosphite 130 g / L, and sodium hydroxide 0. 5 g / L plating solution (F) for protrusion formation (pH 12. 0). The above-mentioned electroless nickel-phosphorus alloy plating solution (D) was slowly dropped into the particle mixture liquid (C) adjusted to a dispersed state of 65 ° C. to perform electroless nickel-phosphorus alloy plating. Electroless nickel-phosphorus alloy plating was performed under the conditions that the dropping acceleration of the electroless nickel-phosphorus alloy plating solution (D) was 15 mL / min and the dropping time was 60 minutes. Thus, a particle mixed liquid (G) containing particles having a nickel-phosphorus alloy metal portion arranged on the surface of the substrate particle A and having a metal portion having a convex portion on the surface was obtained. Thereafter, the particles are taken out by filtering the particle mixture (G) and washed with water, thereby obtaining a metal portion having a nickel-phosphorus alloy metal layer on the surface of the substrate particle A and having a convex portion on the surface. Of particles. After the particles were sufficiently washed with water, they were added to 500 parts by weight of distilled water and dispersed to obtain a particle mixture (H). Then, the above-mentioned silver plating solution (E) was slowly added dropwise to the particle mixture liquid (H) adjusted to a dispersed state of 60 ° C. to perform electroless silver plating. Electroless silver plating was performed under the conditions that the dropping acceleration of the silver plating solution (E) was 10 mL / minute and the dropping time was 30 minutes. Thereafter, the plating solution (F) for protrusion formation was slowly added dropwise to form protrusions. The protrusion formation was performed under the conditions that the dropping acceleration of the plating liquid (F) for protrusion formation was 1 mL / minute and the dropping time was 10 minutes. In the dropwise addition of the plating solution (F) for protrusion formation, silver plating was performed while dispersing the generated silver protrusion nuclei by ultrasonic stirring (protrusion formation step). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining a thickness of the entire nickel portion of the nickel-phosphorus alloy and the silver metal portion (the entire metal portion in the portion without the convex portion) disposed on the surface of the substrate particle A. ： 0. 1 μm) and metal-containing particles having a plurality of convex portions on the surface and metal portions having a plurality of protrusions on the surface of the convex portion. (Example 20) The metal-containing particles obtained in Example 1 were subjected to an anti-vulcanization treatment using "New Dain Silver" manufactured by Yamato Chemical Co., Ltd. as a silver discoloration preventing agent. Using an ultrasonic disperser, 10 parts by weight of the metal-containing particles obtained in Example 1 were dispersed in 100 parts by weight of an isopropanol solution containing 10% by weight of New Dain Silver, and then the solution was filtered to obtain a formed product. Anti-vulcanization film containing metal particles. (Example 21) The metal-containing particles obtained in Example 1 were subjected to an anti-vulcanization treatment using a 2-mercaptobenzothiazole solution as a silver vulcanization preventive agent. Using an ultrasonic disperser, 10 parts by weight of the metal-containing particles obtained in Example 1 were dispersed in a solution containing 2-mercaptobenzothiazole. After 100 parts by weight of a 5% by weight isopropyl alcohol solution was used, the solution was filtered to obtain metal-containing particles having an antisulfide film formed thereon. (Comparative Example 1) After dispersing the above 10 parts by weight of the substrate particles A in 100 parts by weight of an alkali solution containing 5% by weight of a palladium catalyst solution using an ultrasonic disperser, the solution was filtered to remove the substrate particles. A. Next, the substrate particles A were added to 100 parts by weight of a 1% by weight solution of dimethylamineborane, and the surface of the substrate particles A was activated. The surface-activated substrate particles A were sufficiently washed with water, and then added to 500 parts by weight of distilled water to disperse them, thereby obtaining a dispersion liquid (A). Next, it took 3 minutes to add 1 g of a metal nickel particle slurry ("2020SUS" manufactured by Mitsui Metals Co., Ltd., with an average particle diameter of 150 nm) to the above-mentioned dispersion (A) to obtain substrate particles containing a core substance attached A suspension (B). The suspension (B) was added to a solution containing 50 g / L of nickel sulfate, 30 ppm of osmium nitrate, and 20 ppm of bismuth nitrate to obtain a particle mixture (C). In addition, a nickel plating solution (D) (pH 6) containing 200 g / L of nickel sulfate, 85 g / L of sodium hypophosphite, 30 g / L of sodium citrate, 50 ppm of europium nitrate, and 20 ppm of bismuth nitrate was prepared. 5). The above-mentioned nickel plating solution (D) was slowly added dropwise to the particle mixture liquid (C) adjusted to a dispersed state of 50 ° C. to perform electroless nickel plating. Electroless nickel plating was performed under the conditions that the dropping acceleration of the nickel plating solution (D) was 25 mL / min and the dropping time was 60 minutes (Ni plating step). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining a metal-containing particle alloy having a nickel-phosphorus alloy metal portion disposed on the surface of the substrate particle A and having a metal portion having a protrusion on the surface. (The thickness of the entire metal part in the non-protrusion part: 0. 1 μm). (Comparative Example 2) After dispersing 10 parts by weight of the substrate particles A in 100 parts by weight of an alkali solution containing 5% by weight of a palladium catalyst solution using an ultrasonic disperser, the solution was filtered to remove the substrate particles A . Next, the substrate particles A were added to 100 parts by weight of a 1% by weight solution of dimethylamineborane, and the surface of the substrate particles A was activated. The surface-activated substrate particles A were sufficiently washed with water, and then added to 500 parts by weight of distilled water to disperse them, thereby obtaining a suspension (A). The suspension (A) was added to a solution containing 50 g / L of nickel sulfate, 30 ppm of osmium nitrate, and 20 ppm of bismuth nitrate to obtain a particle mixture (B). Also, a plating solution (C) (pH value 11.) containing 300 g / L of sodium hypophosphite and 10 g / L of sodium hydroxide was prepared. 0). In addition, a nickel plating solution (D) (pH 6) containing 200 g / L of nickel sulfate, 85 g / L of sodium hypophosphite, 30 g / L of sodium citrate, 50 ppm of europium nitrate, and 20 ppm of bismuth nitrate was prepared. 5). In the particle mixture liquid (B) adjusted to a dispersion state of 50 ° C., the above-mentioned plating solution (C) for protrusion formation was slowly added dropwise to form protrusions. The protrusion formation was performed under the conditions that the dropping acceleration of the plating solution (C) for protrusion formation was 20 mL / minute and the dropping time was 5 minutes. In the dropwise addition of the plating solution (C) for protrusion formation, nickel plating was performed while dispersing the generated Ni protrusion nuclei by ultrasonic stirring (protrusion formation step). In this way, a dispersed Ni protruding core and particle mixed liquid (E) were obtained. Thereafter, the nickel plating solution (D) was slowly added dropwise to the Ni protruding core and particle mixed solution (E) in a dispersed state to perform electroless nickel plating. Electroless nickel plating was performed under the conditions that the dropping acceleration of the nickel plating solution (D) was 25 mL / min and the dropping time was 60 minutes. In the dropwise addition of the nickel plating solution (D), nickel plating was performed while dispersing the generated Ni protruding nuclei by ultrasonic stirring (Ni plating step). Thereafter, the particles were taken out by filtration, washed with water, and dried, thereby obtaining metal-containing particles having a nickel-phosphorus alloy metal portion disposed on the surface of the substrate particle A and having a metal portion having a protrusion on the surface ( Thickness of the entire metal portion in the non-protrusion portion: 0. 1 μm). (Evaluation) (1) Measurement of height of protrusions and protrusions The obtained metal-containing particles were added to "Technovit 4000" manufactured by Kulzer Corporation so that the content became 30% by weight, and dispersed to produce a metal-containing material. Embedded resin for particle inspection. Using an ion polishing apparatus ("IM4000" manufactured by Hitachi High-Technologies, Inc.), a section of the metal-containing particles was cut out so as to be dispersed near the center of the metal-containing particles in the embedded resin for inspection. Then, using a field emission type transmission electron microscope (FE-TEM) ("JEM-ARM200F" manufactured by Japan Electronics Corporation), the image magnification was set to 50,000 times, and 20 metal-containing particles were randomly selected and observed. Convexes and protrusions of metal-containing particles. The heights of the protrusions and protrusions in the obtained metal-containing particles were measured and arithmetically averaged to be the average height of the protrusions and protrusions. (2) Measurement of the average diameter of the base of the protrusions The obtained metal-containing particles were added to "Technovit 4000" manufactured by Kulzer Corporation so that the content became 30% by weight, and dispersed to prepare metal-containing particles. Use embedding resin. Using an ion polishing apparatus ("IM4000" manufactured by Hitachi High-Technologies, Inc.), a section of the metal-containing particles was cut out so as to be dispersed near the center of the metal-containing particles in the embedded resin for inspection. Then, using a field emission type transmission electron microscope (FE-TEM) ("JEM-ARM200F" manufactured by Japan Electronics Corporation), the image magnification was set to 50,000 times, and 20 metal-containing particles were randomly selected and observed. Convexes and protrusions of metal-containing particles. The base diameters of the convex portions and the protrusions in the obtained metal-containing particles were measured, and arithmetically averaged to obtain the average base diameters of the convex portions and the protrusions. (3) Observation of the shape of the protrusions and protrusions Using a scanning electron microscope (FE-SEM), the image magnification was set to 25000 times, 20 metal-containing particles were randomly selected, and the protrusions and The protrusions are investigated for all the protrusions and the types of shapes to which the protrusions belong. (4) Measurement of average value of apex angles of protrusions and protrusions The obtained metal-containing particles were added to "Technovit 4000" manufactured by Kulzer Corporation so that the content became 30% by weight, and dispersed to produce Embedded resin for metal particle inspection. Using an ion polishing apparatus ("IM4000" manufactured by Hitachi High-Technologies, Inc.), a section of the metal-containing particles was cut out so as to be dispersed near the center of the metal-containing particles in the embedded resin for inspection. Then, using a field emission transmission electron microscope (FE-TEM) ("JEM-ARM200F" manufactured by Japan Electronics Corporation), the image magnification was set to 1 million times, and 20 metal-containing particles were randomly selected and observed. Protrusions of metal-containing particles. The apex angles of the convex portions and the protrusions in the obtained metal-containing particles were measured, and arithmetically averaged to be the average value of the apex angles of the convex portions and the protrusions. (5) Measurement of the average diameter of the central position of the height of the protrusions and protrusions The obtained metal-containing particles were added to the "Technovit 4000" manufactured by Kulzer Corporation so that the content became 30% by weight, and dispersed, and Embedded resin for metal-containing particle inspection. Using an ion polishing apparatus ("IM4000" manufactured by Hitachi High-Technologies, Inc.), a section of the metal-containing particles was cut out so as to be dispersed near the center of the metal-containing particles in the embedded resin for inspection. Then, using a field emission type transmission electron microscope (FE-TEM) ("JEM-ARM200F" manufactured by Japan Electronics Corporation), the image magnification was set to 50,000 times, and 20 metal-containing particles were randomly selected and observed. Protrusions of metal-containing particles. The diameters of the bases of the convex portions and the protrusions in the obtained metal-containing particles were measured, and the average diameters of the central positions of the heights of the convex portions and the protrusions were arithmetically averaged. (6) Measurement of the ratio of needle-like protrusions and protrusions Using a scanning electron microscope (FE-SEM), the image magnification was set to 25000 times, 20 metal-containing particles were randomly selected, and each metal-containing particle was observed. The protrusions and protrusions of the particles. For all the protrusions and protrusions, evaluate whether the shape of the protrusions and protrusions is a needle shape with a tapered tip, and can be divided into protrusions and protrusions formed by the shape of the protrusions and needles with a tapered tip, and protrusions. Shapes and protrusions The protrusions and protrusions are not formed by needle shapes with a tapered tip. From this, measure each metal-containing particle: 1) the number of protrusions and protrusions formed by a needle shape with a tapered tip, and 2) the protrusions and protrusions formed by a needle shape with a tapered tip Number of them. Calculate the ratio X of the number of protrusions and protrusions 1) out of 100% of the total number of protrusions 1) and 2). (7) Measurement of the thickness of the entire metal portion in the portion without protrusions and protrusions The obtained metal-containing particles were added to the "Technovit 4000" manufactured by Kulzer Corporation so that the content became 30% by weight, and dispersed. , And manufacture embedded resin for metal-containing particle inspection. Using an ion polishing apparatus ("IM4000" manufactured by Hitachi High-Technologies, Inc.), a section of the metal-containing particles was cut out so as to be dispersed near the center of the metal-containing particles in the embedded resin for inspection. Then, using a field emission type transmission electron microscope (FE-TEM) ("JEM-ARM200F" manufactured by Japan Electronics Corporation), the image magnification was set to 50,000 times, and 20 metal-containing particles were randomly selected and observed. A metal portion in a non-protrusion portion of a metal-containing particle. The thickness of the entire metal portion in the non-protrusion portion of the obtained metal-containing particles was measured and arithmetically averaged to obtain the thickness (average thickness) (described in the above examples and comparative examples). (8) The compressive elastic modulus (10% K value) of metal-containing particles was measured at 23 ° C by the above method using a micro compression tester ("Fischerscope H-100" manufactured by Fischer Corporation). The above-mentioned compressive elastic modulus (10% K value) of the obtained metal-containing particles. Find the 10% K value. (9) Evaluation of the surface lattice of the metal part Using an X-ray diffraction device ("RINT2500VHF" manufactured by Rigaku Corporation), the peak intensity ratio of the diffraction rays inherent to the device depending on the diffraction angle was calculated. The ratio of the diffraction peak intensity of the (111) azimuth to the diffraction peak intensity of the entire ray of the gold layer (the ratio of the (111) plane) was obtained. (10) The molten and solidified state of the front end of the protrusion of the metal part in the connection structure A is added to the obtained metal-containing particles to "Struct Bond XN-5A" manufactured by Mitsui Chemicals Corporation so that the content becomes 10% by weight. To disperse it to produce an anisotropic conductive paste. A transparent glass substrate having a copper electrode pattern having an L / S of 30 μm / 30 μm on the upper surface was prepared. A semiconductor wafer having a gold electrode pattern having an L / S of 30 μm / 30 μm on the lower surface was prepared. The anisotropic conductive paste was applied on the transparent glass substrate immediately after the thickness was 30 μm to form an anisotropic conductive paste layer. Next, the semiconductor wafer is laminated on the anisotropic conductive paste layer so that the electrodes face each other. Thereafter, while adjusting the temperature of the head in such a manner that the temperature of the anisotropic conductive paste layer became 250 ° C, a pressure heating head was placed on the upper surface of the semiconductor wafer, and 0 was applied. The anisotropic conductive paste layer was hardened at a pressure of 5 MPa at 250 ° C to obtain a connection structure A. In order to obtain the connection structure A, and at 0. Connect the electrodes at a low pressure of 5 MPa. The obtained connection structure was charged into "Technovit 4000" manufactured by Kulzer Corporation and hardened to produce an embedded resin for inspection of the connection structure. Using an ion polishing apparatus ("IM4000" manufactured by Hitachi High-Technologies Corporation), a cross section of metal-containing particles was cut out so as to pass near the center of the connection structure in the resin for inspection. Then, using a scanning electron microscope (FE-SEM), a cross-sectional observation of the obtained connection structure A was performed to determine whether or not the front end of the metal portion of the metal-containing particle protrusions was solidified after melting. [Judgment criteria for the melting and solidification state of the front end of the metal part protrusion] A: The front end of the metal part is cured after the front end is melted B: The front end of the metal part is not cured after the front end is melted (11) The metal part Joining state of protrusions In the connecting structure A obtained in the evaluation of the above (10), the joining structure A was observed in cross section to determine the joining state of the protrusions of the metal portion. [Criteria for judging the bonding state of metal part protrusions] A: In the connection part, the front part of the metal part protrusion in the metal-containing particles is melted and solidified before being bonded to the electrode and other metal-containing particles B: In the connection part, the The metal part protrusions in the metal particles melted and solidified at the front end, and were not bonded to the electrodes and other metal-containing particles. (12) Connection reliability of the connection structure A. 15 of the above (10) were measured by the 4-terminal method. The connection resistance between the upper and lower electrodes of the obtained connection structure A. Calculate the average connection resistance. Furthermore, based on the relationship of voltage = current × resistance, the connection resistance can be determined by measuring the voltage when a constant current flows. Use the following criteria to determine connection reliability. [Judgment Criteria for Connection Reliability] ○○○: Connection resistance is 1. 0 Ω or less ○○: Connection resistance exceeds 1. 0 Ω, and is 2. 0 Ω or less ○: Connection resistance exceeds 2. 0 Ω and 3. 0 Ω or less △: Connection resistance exceeds 3. 0 Ω and less than 5 Ω ×: Connection resistance exceeds 5 Ω (13) The molten and solidified state of the front end of the metal part protrusion in the connection structure B is such that the obtained metal-containing The particles were added to "ANP-1" (containing metal atom-containing particles) manufactured by Nihon Superior, and dispersed to prepare a sintered silver paste. As the first connection target member, a power semiconductor element having Ni / Au plating applied to the connection surface is prepared. As a second connection target member, an aluminum nitride substrate having a Cu-plated connection surface is prepared. The sintered silver paste was applied onto the second connection target member so as to have a thickness of about 70 μm to form a silver paste layer for connection. Thereafter, the first connection target member was laminated on the silver paste layer for connection to obtain a laminate. The obtained laminate was preheated by a heating plate at 130 ° C for 60 seconds, and thereafter, a pressure of 10 MPa was applied to the laminate, and it was heated at 300 ° C for 3 minutes, whereby the sintered silver paste was contained. The above-mentioned metal atom-containing particles are sintered to form a connection portion including a sintered body and metal-containing particles, and the first and second connection target members are joined by the sintered body to obtain a connection structure B. The obtained connection structure was charged into "Technovit 4000" manufactured by Kulzer Corporation, and was hardened to produce an embedded resin for inspection of the connection structure. Using an ion polishing apparatus ("IM4000" manufactured by Hitachi High-Technologies Corporation), a cross section of metal-containing particles was cut out so as to pass near the center of the connection structure in the inspection embedded resin. Then, using a scanning electron microscope (FE-SEM), a cross-sectional observation of the obtained connection structure B was performed to determine whether the front end of the metal portion of the metal-containing particle protrusions was melted and solidified. [Judgment criteria for the melting and solidification state of the front end of the metal part] A: The front end of the metal part is melted and solidified after the front end is melted B: The front end of the metal part is not solidified after the front end is melted (14) The metal part in the connecting structure B The bonding state of the protrusions is the connection structure B obtained in the evaluation of the above (13), and the connection structure B is observed in cross section to determine the bonding state of the protrusions of the metal portion. [Judgement criteria for the bonding state of the protrusions of the metal part] A: In the connection part, the front end of the metal part protrusion in the metal-containing particles is melted and solidified, and is bonded to the electrode and other metal-containing particles B: In the connection part, The metal part protrusions in the metal-containing particles are solidified after melting at the front end, and are not bonded to the electrode and other metal-containing particles. (15) Connection structure B Connection reliability The connection structure obtained in the above evaluation (13) B was put into a hot and cold shock tester (manufactured by ESPEC: TSA-101S-W), and the treatment conditions were 30 minutes at a minimum temperature of -40 ° C and 30 minutes at a maximum temperature of 200 ° C as one cycle, 3000 After each cycle, the bonding strength was measured by a shear strength tester (manufactured by Rhesca: STR-1000). Use the following criteria to determine connection reliability. [Judging Criteria for Connection Reliability] ○ ○ ○: Joint strength is 50 MPa or more ○ ○: Joint strength exceeds 40 MPa and 50 MPa or less ○: Joint strength exceeds 30 MPa and 40 MPa or less △: Joint strength exceeds 20 MPa and 30 MPa or less ×: Joint strength is 20 MPa or less (16) The contact resistance value of the member for conduction inspection is adjusted to 10 parts by weight of the polysiloxane copolymer, 90 parts by weight of the metal-containing particles obtained, and 1 part by weight of an oxysilane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., "KBE-303") and 36 parts by weight of isopropyl alcohol, stirred at 1000 rpm for 20 minutes using a homogeneous disperser, and then used "training" manufactured by Thinky Taro ARE250 "is defoamed to prepare a conductive material containing metal-containing particles and a binder. The above-mentioned polysiloxane copolymer is polymerized by the following method. A metal mixing machine with an internal volume of 2 L was charged with 162 g (628 mmol) of 4,4'-dicyclohexylmethane diisocyanate (manufactured by Degussa), a single-terminated amine-modified polydimethylsiloxane ( 900 g (90 mmol) of "TSF4709" (molecular weight 10,000) manufactured by Momentive, was dissolved at 70 to 90 ° C, and then stirred for 2 hours. Thereafter, 65 g (625 mmol) of neopentyl glycol (manufactured by Mitsubishi Gas Chemical Co., Ltd.) was slowly added and kneaded for 30 minutes, and then unreacted neopentyl glycol was removed under reduced pressure. The obtained polysiloxane-based copolymer was used by dissolving it in isopropyl alcohol so as to be 20% by weight. The disappearance of the isocyanate group was confirmed by an IR spectrum. In the obtained polysiloxane copolymer, the polysiloxane content was 80% by weight, the weight average molecular weight was 25,000, and the SP value was 7. 8. The SP value of the repeating unit having a polar structure (polyurethane) is 10. Then, as a base material (a sheet-like base material made of an insulating material) of the member for continuity inspection, a silicone rubber was prepared. The dimensions of the silicone rubber are 25 mm in width, 25 mm in width, and 1 mm in thickness. In the silicone rubber, a diameter of 0. 5 mm cylindrical through hole. Using a doctor blade coater, the conductive material is coated on a silicone rubber having a through hole, and the conductive material is filled in the through hole. Then, the silicone rubber filled with the conductive material in the through-holes was dried in an oven at 50 ° C for 10 minutes, and then further dried at 100 ° C for 20 minutes to obtain a continuity inspection member having a thickness of 1 mm. The contact resistance value of the obtained continuity inspection member was measured using a contact resistance measurement system ("MS7500" manufactured by FACTK). Contact resistance is measured by a diameter of 0. A platinum probe of 5 mm was pressurized with a load of 15 gf from a direction perpendicular to the conductive portion of the obtained inspection member. At this time, a low resistance meter ("MODEL3566" manufactured by Tsuruga Electric Co., Ltd.) was applied with a voltage of 5 V to measure the contact resistance value. The average value of the contact resistance values obtained by measuring the five conductive portions was calculated. The contact resistance value was determined according to the following criteria. [Criteria for determining the contact resistance value] ○ ○: The average value of the connection resistance is 50. 0 mΩ or less ○: The average value of the connection resistance exceeds 50. 0 mΩ and 100. 0 mΩ or less △: The average value of the connection resistance exceeds 100. 0 mΩ and 500. 0 mΩ or less ×: The average value of the connection resistance exceeds 500. 0 mΩ (17) Repeated reliability test of continuity inspection member Prepare the continuity inspection member of the above (16) Evaluation of the contact resistance value of the continuity inspection member. The repeated reliability test and contact resistance value of the obtained members for continuity inspection were measured using a contact resistance measurement system ("MS7500" manufactured by FACTK Corporation). Repeated reliability test with a diameter of 0. A platinum probe of 5 mm was repeatedly pressed 1,000 times with a load of 15 gf from a direction perpendicular to the conductive part of the obtained probe sheet. After repeatedly applying pressure 1,000 times, a low resistance meter ("MODEL 3566" manufactured by Tsuruga Electric Co., Ltd.) was applied with a voltage of 5 V to measure the contact resistance value. The average value of the contact resistance values obtained by measuring the five conductive portions in the same manner was calculated. The contact resistance value was determined according to the following criteria. [Criteria for determining the contact resistance value after repeated pressure] ○ ○: The average value of the connection resistance is 100. 0 mΩ or less ○: The average value of the connection resistance exceeds 100. 0 mΩ and 500. 0 mΩ or less △: The average value of the connection resistance exceeds 500. 0 mΩ and 1000. 0 mΩ or less ×: The average value of the connection resistance exceeds 1000. The composition and results are shown in Tables 1 to 5 at 0 mΩ. [Table 1] [Table 2] [table 3] [Table 4] [table 5] Furthermore, the spherical shape in the convex portion and the protrusion includes the shape of a part of the ball. Moreover, in Comparative Examples 1 and 2, it was confirmed that the front end of the protrusions did not melt even when heated to 400 ° C.
