TW201736795A - Vapor chamber structure - Google Patents

Abstract

A vapor chamber structure includes a main body, a fan and multiple perforations. The main body has a heat absorption section, a heat dissipation section and a chamber. The heat absorption section and the heat dissipation section are respectively horizontally disposed on left and right sides of the main body. The heat absorption section is attached to at least one heat source. The chamber is positioned at the heat absorption section and partially extends to the heat dissipation section. The chamber has a capillary structure and at least one perforated section. The perforated section is connected between an upper side and a lower side of the chamber. The fan is disposed on one side of the heat dissipation section. The perforations are formed through the parts of the main body, which parts are free from the chamber and the parts of the main body, where the perforated section is disposed.

Description

Temperature uniform plate structure

The invention relates to a temperature equalizing plate structure, in particular to a thinned form, and has a uniform temperature plate structure combined with a cooling fan.

The current electronic devices such as handheld devices, tablet computers, ultra-thin notebooks, and mobile devices are becoming thinner and lighter, and as the work efficiency is improved, the power of the internal computing unit (CPU) of the aforementioned various electronic devices is also increased, and when calculating When the power of the unit (CPU) is increased, the heat is also increased. Therefore, it is impossible to obtain proper heat dissipation without forced heat dissipation through the heat dissipating component. Therefore, it is necessary to provide heat dissipation components such as a heat pipe, a temperature equalizing plate, a heat sink, a heat sink fin, and a fan. Auxiliary heat release to avoid the overheating of the computing unit (CPU) affecting work or causing burns. Moreover, due to the fact that the current electronic equipment is increasingly thin and light, the internal space is limited, so the space for the remaining heat dissipating components is limited. When the temperature equalizing plate is installed, the heat source is attached to one side of the temperature equalizing plate (calculation unit (CPU) )), and fixing the temperature equalizing plate and the heat source through the buckle, and the height of the space-limited buckle and the temperature equalizing plate may exceed the height of the preset accommodating space, if directly The temperature equalization plate is directly locked with the fastener and locked with the heat source (computing unit (CPU)), and the airtightness of the temperature equalizing plate itself cannot be achieved, and the fixed temperature plate is improved. In addition to the problem, there is a problem that the heat sink fins and the fan cannot be separately provided because of the limited space. Therefore, how to use the limited space to set the heat dissipating components and how to fix the heat dissipating components and the heat source are the first priority to be solved. The problem.

Accordingly, in order to solve the above disadvantages of the prior art, it is a primary object of the present invention to provide a temperature equalizing plate structure that is thinned and combined with a fan. In order to achieve the above object, the present invention provides a temperature equalizing plate structure, comprising: a body, a fan, and a plurality of holes; the body has a heat receiving zone and a heat dissipating zone and a cavity, the heat receiving zone and the The heat dissipation zone is disposed on the left and right sides of the horizontal direction of the body, and the heat receiving zone is disposed adjacent to at least one heat source, the cavity is disposed in the heat receiving zone and partially extends in the heat dissipation zone, and the cavity has a capillary a structure and at least one penetration portion connecting the upper and lower sides of the chamber. The fan is correspondingly disposed on one side of the heat dissipation area of the body. The holes correspond to a portion through which the chamber is not provided with a chamber and a portion having a penetration portion in the chamber of the body. The uniform temperature plate structure of the invention can be thinned, and the temperature equalization plate can be stably combined with the heat source in a limited space, and the internal chamber of the combined uniform temperature plate can ensure the airtightness effect. By.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. 1 and 2 are a perspective exploded view and a combined cross-sectional view of a first embodiment of a temperature equalizing plate structure of the present invention. As shown in the figure, the temperature equalizing plate structure 1 of the present invention comprises: a body 11 and a fan 12 The body 11 is a flat plate-shaped body. The body 11 has a heat receiving area 111 and a heat dissipating area 112 and a chamber 113. The heat receiving area 111 and the heat dissipating area 112 are separately disposed. The heat receiving area 111 is disposed on the left and right sides of the body 11 in a horizontal direction, and the heat receiving area 111 is disposed on the heat receiving area 111, and the chamber 113 is partially disposed in the heat receiving area 111, and partially extends in the heat dissipation area 112. The chamber 113 has a capillary structure 114 and at least one through portion 115. The through portion 115 is connected to the upper and lower sides of the chamber 113. The capillary structure 114 is disposed on the wall surface of the chamber 113 and the outer edge of the through portion 115. . The fan 12 is disposed on the side of the heat dissipation area 112 of the main body 11. The fan 12 is a centrifugal fan, and the fan 12 has a fan frame 121. The body 11 is correspondingly disposed on the fan. The frame body 121 is open above, and the body 11 has a through hole 116 corresponding to the fan 12 . The through hole 116 is an air inlet of the fan 12 , and the fan frame 121 has at least one air outlet. 122. The holes 13 correspond to a portion (such as a corner) through which the chamber 11 is not provided, and a portion having a penetrating portion 115 is disposed in the chamber 113 of the body 11, thereby ensuring the atmosphere of the chamber 113 in the body 11. Confidentiality. The body 11 has a first plate body 11a and a second plate body 11b. The first and second plate bodies 11a and 11b are disposed on the upper and lower sides of the body 11 and are correspondingly closed. The first and second plates 11a and 11b are combined to define the chamber 113. The two ends of the through portion 115 are connected to the first and second plates 11a and 11b, respectively. The chamber 113 defined by the first and second plates 11a, 11b is a first groove 117 disposed on one of the first and second plates 11a, 11b, and is formed by another plate (the first The second plate body 11b is formed by correspondingly covering the first groove 117. The first groove 117 has an outer edge portion 118. The edge portion 118 and the through portion 115 are opposite to the first groove 117. A protruding structure, the through portion 115 is disposed in the first groove 117. The fan 12 is coupled to the body 11 by means of riveting or bonding or screwing or injection molding. The fan frame 121 has a plurality of positioning holes 123, and the positioning holes 123 and the holes 13 of the body 11 correspond to each other. When the fan 12 is coupled to the body 11 through any of the aforementioned riveting or screwing, the screw used for riveting the rivet or the screw is passed through the hole 13 of the body 11 and the fan. The positioning hole 123 of the frame body 121 allows the body 11 and the fan 12 to be fixedly combined with each other. Referring to FIG. 3, it is a perspective exploded view of a second embodiment of the temperature equalizing plate structure of the present invention. As shown in the figure, the structural features of the embodiment are the same as those of the first embodiment, and therefore will not be used here. For example, the maximum difference between the embodiment and the first embodiment is that the side air outlets 123 are correspondingly provided with a plurality of heat dissipation fins 3 stacked on each other and having at least the first-class track 31 between each other. 4 and 5 are a sectional view and a schematic view of a third embodiment of the temperature equalizing plate structure of the present invention. As shown in the figure, the structural features of the embodiment are the same as those of the first embodiment described above. The maximum difference between the present embodiment and the first embodiment is that the two ends of the through portion 115 are joined to the upper and lower sides of the chamber 13 by diffusion bonding, and the through portion 115 is hollow. The ring body, the portions of the holes 13 provided in the first and second plates 11a, 11b correspond to the through portion 115 (hollow ring body), and the through portion 115 (hollow ring body) has a consistent perforation 1151 The through hole 1151 extends through the two ends of the through portion 115 (the hollow ring body), and the diameter of the through hole 1151 of the penetrating portion 115 (the hollow ring body) is greater than or equal to the diameter of the holes 13 through the through portion In addition to the through hole 1151, both ends of the 115 (hollow ring body) are joined to the first and second plates 11a and 11b by diffusion bonding, and the vacuum airtightness of the inside of the chamber 13 of the body 11 is maintained. Of course, the penetrating portion 115 of the present embodiment can also be used as the penetrating portion 115. The penetrating portion 115 is disposed in the chamber 113 defined by the first and second plates 11a, 11b and has a hole 13 therein. Wherein, both ends of the through portion 115 are first joined to the first and second plates 11a and 11b, and then the first and second plates 11a and 11b are provided with a hole 13 and a through portion 115. For drilling, the diameter of the through hole 1151 drilled may not be larger than the diameter of the hole 13 of the first and second plates 11a, 11b, thereby preventing the internal cavity 113 of the body 11 from being vacuum-sealed. Referring to FIG. 6 , it is a sectional view of a fourth embodiment of the present invention. The structural features of the embodiment are the same as those of the first embodiment, and therefore will not be described again. The maximum difference between the embodiment and the first embodiment is that the heat receiving portion 111 has a heat receiving convex portion 1111 at a position where the heat receiving portion 111 is in contact with the heat generating source 2, and the heat receiving convex portion 1111 can be directly attached to the heat generating source 2 directly. And the capillary structure 114 in the heated convex portion 1111 can select a capillary structure 114 which is more dense and has better water-containing characteristics, thereby increasing the water-containing property to prevent the occurrence of dry burning. FIG. 7 is a perspective exploded view of the fifth embodiment of the temperature equalizing plate structure of the present invention. As shown in the figure, the structural features of the embodiment are the same as those of the first embodiment, and therefore will not be described herein. The maximum difference between the embodiment and the foregoing first embodiment is that the fan 12 is a centrifugal fan, and the body 11 is correspondingly disposed on the side of the fan 12, and the body 11 is disposed corresponding to the fan 12. The fan frame 121 of the fan 12 is disposed outside the shaft cylinder 125, and a fan blade group 126 is pivoted from the shaft cylinder 125. 8 is a perspective exploded view and a combined cross-sectional view of a sixth embodiment of the temperature equalizing plate structure of the present invention. As shown in the figure, some of the structural features of the present embodiment are the same as those of the first embodiment described above, and thus will not be herein. Further, the maximum difference between the present embodiment and the first embodiment is that the chambers 113 defined by the first and second plates 11a and 11b are respectively disposed on the first and second plates 11a and 11b. a first groove 117 and a second groove 119. The first and second grooves 117 and 119 have an edge portion 118. The edge portion 118 and the through portion 115 are opposite to the first and second grooves 117. The 119 is a convex structure, and the through portion 115 is disposed in the first and second grooves 117 and 119. The first and second plate systems 11a and 11b are butted through the edge portion 118 and the through portion 115. To achieve the hermetic sealing, the capillary structure 114 disposed in the first groove 117 of the first plate body 11a is a mesh, a sintered powder, a groove, and the second groove 119 of the second plate 11b. A plurality of bumps 120 are disposed therein. Through the uniform temperature plate structure of the invention, the space is narrowed to the inside of the electronic device, not only can effectively provide the anti-heating, and the use of the fan-shaped fixing seat can be saved by using the direct combination of the temperature-averaging plate and the fan, thereby saving the setting. The space can also ensure the airtightness of the temperature equalizing plate because the through portion 115 in the chamber 113 acts as a locking point through the body 11. Since the present invention is an ultra-thin uniform temperature plate structure, the first is performed by etching. The corresponding surface of the two plates 11a, 11b is opened to form the first groove 117 of the chamber 113, not only does not increase its thickness, but also passes through the outer edge of the chamber 113 of the first and second plates 11a, 11b. The portion 118 and the through portion 115 in the chamber 113 can bond and seal the chamber 113 between the first and second plates 11a and 11b by diffusion bonding, brazing, or the like, thereby maintaining the airtightness of the chamber 113 and The first and second plates 11a and 11b are combined, and the through hole 1151 extending through the first and second plates 11a and 11b can be opened at the edge portion 118 and the through portion 115, and the chamber 113 can be maintained. Vacuum tightness.

1‧‧‧Wave plate structure
11‧‧‧Ontology
11a‧‧‧First board
11b‧‧‧Second plate
111‧‧‧heated area
1111‧‧‧heated convex
112‧‧‧heating area
113‧‧‧ chamber
114‧‧‧Capillary structure
115‧‧‧ penetration
1151‧‧‧through holes
116‧‧‧through hole
117‧‧‧first groove
118‧‧‧Edge
119‧‧‧second groove
120‧‧‧ bumps
12‧‧‧Fan
121‧‧‧Fan frame
122‧‧‧ side outlet
123‧‧‧Positioning holes
125‧‧‧ shaft tube
126‧‧‧Face Leaf Group
13‧‧‧ hole
2‧‧‧heat source
3‧‧‧heat fins
31‧‧‧ flow path

1 is a perspective exploded view of a first embodiment of a temperature equalizing plate structure of the present invention; FIG. 2 is a cross-sectional view showing a first embodiment of a temperature equalizing plate structure of the present invention; and FIG. 3 is a temperature equalizing plate structure of the present invention. FIG. 4 is a cross-sectional view showing a third embodiment of the temperature equalizing plate structure of the present invention; FIG. 5 is a schematic view showing the processing of the third embodiment of the temperature equalizing plate structure of the present invention; The present invention is a sectional view of a fourth embodiment of the temperature equalizing plate structure of the present invention; FIG. 7 is a perspective exploded view of a fifth embodiment of the temperature equalizing plate structure of the present invention; 3 is an exploded perspective view of a sixth embodiment of the temperature equalizing plate structure of the present invention.

1‧‧‧Wave plate structure

11‧‧‧Ontology

11a‧‧‧First board

11b‧‧‧Second plate

111‧‧‧heated area

112‧‧‧heating area

113‧‧‧ chamber

114‧‧‧Capillary structure

115‧‧‧ penetration

1151‧‧‧through holes

116‧‧‧through hole

12‧‧‧Fan

121‧‧‧Fan frame

122‧‧‧ side outlet

123‧‧‧Positioning holes

126‧‧‧Face Leaf Group

13‧‧‧ hole

Heat source

Claims (10)

A uniform temperature plate structure comprises: a body having a heat receiving zone and a heat dissipating zone and a chamber, wherein the heat receiving zone and the heat dissipating are respectively disposed on the left and right sides of the main body horizontal direction, and the heating zone is Attached to the at least one heat source, the chamber is disposed in the heat receiving portion and partially extends in the heat dissipating region, the chamber has a capillary structure and at least one penetrating portion, and the penetrating portion connects the chamber to the upper and lower portions a fan; a corresponding group is disposed on a side of the heat dissipation area of the body; a plurality of holes corresponding to the portion of the body through which the chamber is not provided and a portion having a penetration portion. The uniform temperature plate structure according to claim 1, wherein the body has a first plate body and a second plate body, and the first and second plates correspond to the cover to jointly define the cavity. The uniform temperature plate structure according to claim 1, wherein the fan is a centrifugal fan, and the body is correspondingly disposed above the fan, and the body has a through hole corresponding to the fan. The through hole is an air inlet of the fan, and the fan has at least one side air outlet. The uniform temperature plate structure of claim 1, wherein the fan is coupled to the body by riveting or bonding or screwing or injection molding. The uniform temperature plate structure according to claim 3, wherein the side air outlets are provided with a plurality of heat dissipation fins. The temperature equalizing plate structure according to claim 1, wherein the two ends of the penetrating portion are joined to the upper and lower sides of the chamber by diffusion bonding, and the penetrating portion is a solid cylinder or a Any of the hollow rings. The uniform temperature plate structure according to claim 1, wherein the capillary structure is disposed on a wall surface of the chamber and an outer edge of the through portion. The uniform temperature plate structure according to claim 1, wherein the fan is a centrifugal fan, and the body is correspondingly disposed on a side of the fan, and the body is disposed corresponding to the fan. cylinder. The uniform temperature plate structure according to claim 2, wherein the chamber defined by the first and second plates is a first groove disposed in any one of the first and second plates. And the first groove is formed by the corresponding cover of the other plate body, and the outer portion of the first groove has an edge portion, and the edge portion and the through portion are a convex structure with respect to the first groove. The through portion is disposed in the first groove. The uniform temperature plate structure according to claim 2, wherein the first and second plates are defined by a first groove and a first body respectively. The two grooves have an edge portion, and the edge portion and the through portion are a convex structure with respect to the first and second grooves, and the through portion is disposed at the first portion In the two grooves, the first and second plate systems are hermetically sealed through the edge portion and the through portion, and the capillary structure disposed in the first groove of the first plate is a mesh and sintered. Any one of the powder and the groove, wherein the second groove of the second plate body is provided with a plurality of bumps.