TW201732403A - Method for forming wiring hole, and electronic device - Google Patents

Abstract

A wiring hole 8 is formed in a liquid crystal panel 1 that is provided with a first glass substrate 3, a second glass substrate 4 that is disposed to face the first glass substrate 3, and a seal member 5 that is disposed between the substrates 3, 4. The wiring hole 8, which penetrates the first glass substrate 3 and the seal member 5 in the thickness direction, and which has a hole bottom 8a within the thickness of the second glass substrate 4, is formed by irradiating the liquid crystal panel 1 with a pulsed laser beam 2 from the first glass substrate 3 side.

Description

Method for forming wiring hole and electronic device

The present invention relates to a method for forming a wiring hole in an electronic device such as a liquid crystal panel, and an electronic device for forming the wiring hole.

As is known, a liquid crystal panel is an electronic device having two glass substrates which are formed with a pattern of BM, RGB, a light spacer, a transparent electrode, and a pattern formed by mutually opposing patterns. An array substrate of a thin film transistor or a transparent electrode. A sealing member made of a resin (for example, an ultraviolet curable resin or the like) is interposed between the two substrates, and a liquid crystal is sealed in a space enclosed by the sealing member (see Patent Document) 1).

By the way, in the past few years, from the viewpoint of space saving or wide-distribution, the type of wiring for the liquid crystal panel is used as a wiring hole formed in the thickness direction of both the substrate and the sealing member. The hole is plated, or the hole is filled with a conductive paste, and the type of the conductive material is introduced into the hole. This hole is formed, for example, by irradiating a laser to a liquid crystal panel and melting and removing the irradiation portion by the heat of the laser.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2015-161837

However, when the wiring hole is formed in the above-described manner, since the inner peripheral surface of the hole becomes a small flat surface having irregularities, for example, the conductivity introduced into the hole is accompanied by thermal expansion of the electronic device. The material is easily removed, etc., and there is a problem that the conductive material and the inner peripheral surface of the hole are difficult to fix. Further, such a problem does not occur in the case where a wiring hole is formed only for the liquid crystal panel. In the case of another electronic device having a structure in which a resin is interposed between two glass substrates arranged in the opposite direction, a wiring hole through which the two substrates and the resin to be interposed is formed is formed. The same problem occurs underneath.

In view of the above-described circumstances, the fixing of the wiring hole formed in the electronic device and the conductive material introduced into the wiring hole is stabilized, which is a technical problem.

The method of the present invention, which is first created to solve the above problems, is a method of forming a wiring hole for an electronic device including a first glass substrate and a second glass disposed opposite to the first glass substrate a substrate and a resin interposed between the two substrates The spacer member is configured to form a wiring hole by irradiating a pulsed laser from one of the two substrates to the substrate side, and the wiring hole penetrates one of the substrate and the spacer member in the thickness direction. Moreover, there is a hole bottom in the thickness of the other substrate.

According to such a method, the pulse laser irradiated to the electronic device is moved from the incident surface side of the laser to the emitting surface (the interface with the partition member) in one of the substrates formed of glass. Contracted sideways. On the other hand, in the spacer member made of a resin, the pulsed laser that has contracted in one of the substrates moves toward the side from the incident surface of the laser (the interface with one of the substrates). The side of the exit surface (the interface with the other substrate) is expanded on the contrary. As a result, the wiring holes are formed such that the diameter of the substrate shrinks as it moves to the bottom side of the hole, and the diameter of the partition member increases as it moves to the bottom side of the hole. In other words, the wiring hole has a boundary between the substrate and the spacer member, and one of the substrate side and the spacer member side is pushed back in the opposite direction. For this reason, when the conductive material is introduced into the wiring hole, the inner peripheral surface of the hole and the conductive material are easily caught, and both of them can be firmly fixed. Further, in the method, the wiring holes are formed such that the hole bottom position is within the thickness of the other substrate. As described above, in the formation of the wiring hole, a part of the laser light of the pulsed laser is reflected on the other substrate, and the reflected light interferes with the laser light incident on the other substrate. When the wiring hole is formed in such a state, the inner peripheral surface of the spacer member of the wiring hole can be formed with irregularities along the periodic direction of the interference pattern in the thickness direction. Therefore, if a conductive material is introduced into the wiring hole, By the presence of the periodic concavities and convexities, the inner peripheral surface of the hole and the electrically conductive material become more likely to be caught, so that both can be more firmly fixed. Further, in the present method, the following actions and effects can be obtained by secondary. In other words, as the wiring hole, it is not necessary to form a through hole penetrating through both the substrate and the spacer member, and the time required for the hole for the wiring can be shortened, and the manufacturing efficiency of the electronic device in which the wiring hole is formed can be improved. Upgrade. In addition, as compared with the case where the wiring hole is formed to penetrate through the through holes of both the substrate and the spacer member, it is possible to suppress the occurrence of discomfort such as skew in the both substrates due to the irradiation of the laser.

In the above method, it is preferable that the depth of the wiring hole formed in the other substrate is 50% or less with respect to the thickness of the other substrate. Further, it is preferable to use a laser having a wavelength of 8.5 μm to 14 μm as a pulsed laser and a substrate having a reflectance of 5% or more with respect to a wavelength of 8.5 μm to 14 μm as the other substrate.

According to these, the laser light of a part of the pulsed laser is more easily reflected by the other substrate. For this reason, it is easier to form periodic irregularities on the inner peripheral surface of the spacer member of the wiring hole. As a result, the inner peripheral surface of the wiring hole and the conductive material can be more firmly fixed.

In the above method, it is preferable that the interface between the first glass substrate and the spacer member is partially peeled off along the inner peripheral surface of the wiring hole.

In this case, when the conductive material is introduced into the wiring hole, the conductive material enters between the first glass substrate and the spacer member. For this reason, the inner peripheral surface of the wiring hole and the conductive material are further changed. It's easier to get stuck, and it's more stable.

When the above-described method for forming a wiring hole is performed, an electronic device including a first glass substrate, a second glass substrate disposed to face the first glass substrate, and a spacer between the two substrates can be used. a spacer member made of a resin; the wiring hole is formed to penetrate one of the substrates and the spacer member in the thickness direction, and has a thickness in the other substrate The hole bottom; the diameter of the wiring hole is contracted as it moves to the bottom side of the hole in one of the substrates, and is enlarged in the spacer member as it moves to the bottom side of the hole.

Further, when the above-described method of forming the wiring hole is performed, the depth of the wiring hole formed in the other substrate can be obtained, and the thickness of the other substrate is 50% or less.

Further, when the above-described method of forming the wiring hole is performed, the inclination angle of the inner peripheral surface of the wiring hole with respect to the center line of the hole can be obtained, which is 0.1 to 30 degrees in one of the substrates, and In the spacer member, the electronic device is 1°~45°.

In the above-described method of forming the wiring hole, an electronic device in which periodic irregularities are formed in the thickness direction on the inner peripheral surface of the spacer member of the wiring hole can be obtained.

Further, by performing the above-described method of forming the wiring hole, an electronic device in which the interface between the first glass substrate and the spacer member is partially peeled off along the inner peripheral surface of the wiring hole can be obtained.

According to the electronic device constituting these, it is possible to obtain the same action and effect as those already described in the above-described method of forming the wiring hole.

According to the present invention, when the conductive material is introduced into the wiring hole, the inner peripheral surface of the hole and the conductive material are easily caught, and both the inner peripheral surface of the hole and the conductive material can be stably fixed.

1‧‧‧LCD panel

2‧‧‧pulse laser

3‧‧‧First glass substrate

4‧‧‧Second glass substrate

5‧‧‧ Sealing member

8‧‧‧ wiring holes

8a‧‧‧ hole bottom

8b‧‧‧ center line

D‧‧‧Deep

Θ1‧‧‧ tilt angle

Θ2‧‧‧ tilt angle

Fig. 1 is a longitudinal side view showing a method of forming a wiring hole according to an embodiment of the present invention.

FIG. 2 is a longitudinal side view showing a method of forming a wiring hole according to an embodiment of the present invention.

Fig. 3 is a longitudinal side view showing a method of forming a wiring hole according to an embodiment of the present invention.

Fig. 4 is a longitudinal side view showing an electronic device according to an embodiment of the present invention.

Fig. 5 is an enlarged view showing an enlarged portion A in Fig. 4;

Fig. 6 is an enlarged view showing an enlarged portion B of Fig. 4;

Hereinafter, the wiring hole according to the embodiment of the present invention will be described. For the method of forming the electronic device and the electronic device obtained by the method, refer to the attached drawings.

As shown in FIG. 1 to FIG. 3, a method of forming a wiring hole according to an embodiment of the present invention is a method of forming a wiring hole by irradiating a liquid crystal panel 1 as an electronic device with a pulsed laser beam 2.

The liquid crystal panel 1 is a main constituent element, and includes a first glass substrate 3, a second glass substrate 4 disposed to face the first glass substrate 3, and a spacer member interposed between the substrates 3 and 4. The sealing member 5 and the metal wiring 6 formed on the second glass substrate 4.

Each of the first glass substrate 3 and the second glass substrate 4 has a rectangular shape and has a thickness of 1 μm to 400 μm. Further, the gap (cell gap) formed between the substrates 3 and 4 has a width of 0.5 μm to 100 μm. The first glass substrate 3 is a color filter substrate in which BM, RGB, a light spacer, and a transparent electrode (all of which are not shown) are formed in a pattern. On the other hand, the second glass substrate 4 is an array substrate in which a thin film transistor or a transparent electrode (all of which are not shown) is formed in a pattern. Further, in the two substrates 3 and 4, as the second glass substrate 4, a substrate having a reflectance of 5% or more with respect to light having a wavelength of 8.5 μm to 14 μm is used.

The sealing member 5 is bonded to the first glass substrate 3 and the second glass substrate 4, and is disposed along the peripheral edge portion of the both substrates 3 and 4. The liquid crystal 7 is sealed in a space surrounded by the sealing member 5. The resin constituting the sealing member 5 is, for example, an ultraviolet curable resin. The metal wiring 6 is a wiring for transmitting a signal for driving to a driving circuit (not shown). The metal constituting the metal wiring 6 is, for example, aluminum, and is used as a barrier metal, for example, molybdenum.

In the method of forming the wiring hole, the pulse laser 2 is irradiated from the first glass substrate 3 side with respect to the liquid crystal panel 1 described above. Further, in the present embodiment, the optical axis 2a of the pulse laser 2 is extended in the thickness direction of the first glass substrate 3 and the second glass substrate 4, and is irradiated.

Here, as the pulse laser 2, a CO ₂ laser, a CO laser, a fiber laser, or the like can be used. The wavelength of the pulsed laser 2 is preferably from 2.5 μm to 15 μm, and in the present embodiment, it is from 8.5 μm to 14 μm. Moreover, ideally, the pulse width is 0.05 μs to 50 μs. Further, as the frequency, it is ideally 100 Hz to 20 kHz. Further, as the pulse energy, it is preferably 10 μJ to 10 mJ. Further, the polarized light of the pulsed laser 2 is circularly polarized, and the position of the focus of the pulsed laser 2 is the surface of the first glass substrate 3 (the incident surface 3a to be described later). Further, the number of shots of the pulsed laser 2 is not particularly limited, and is three in the present embodiment.

As shown in FIG. 1, the pulse laser 2 irradiated to the liquid crystal panel 1 moves along the side from the incident surface 3a of the laser to the side of the exit surface 3b (the interface with the sealing member 5) in the first glass substrate 3. And shrinking. On the other hand, as shown in FIG. 2, in the sealing member 5, the pulsed laser 2 contracted in the first glass substrate 3 follows the interface from the laser incident surface 5a (the interface with the first glass substrate 3). The side moves to the side of the emitting surface 5b (the interface with the second glass substrate 4), and conversely expands. Further, as shown in FIG. 3, in the second glass substrate 4, the pulsed laser 2 enlarged in the sealing member 5 moves along the side from the incident surface 4a of the laser (the interface with the sealing member 5). It shrinks again to the side of the exit surface 4b.

In the two substrates 3, 4 and the sealing member 5, the field irradiated by the pulsed laser 2 is melted by the heat of the laser. As a result, in the liquid crystal panel 1, a wiring hole is gradually formed from the first glass substrate 3 side to the second glass substrate 4 side. Further, in the formation of the wiring hole, a part of the laser light of the pulse laser 2 is reflected by the second glass substrate 4, and the reflected light interferes with the laser light incident on the second glass substrate 4.

The irradiation of the pulsed laser 2 is as shown in FIG. 4, and the wiring hole 8 penetrates the first glass substrate 3, the sealing member 5, and the metal wiring 6, and continues until the hole bottom 8a is formed on the second glass substrate. Within 4 thicknesses. At this time, the depth D of the wiring hole 8 formed in the second glass substrate 4 is 50% or less with respect to the thickness of the second glass substrate 4.

Through the above, the liquid crystal panel 1 in which the wiring holes 8 are formed is obtained. In the liquid crystal panel 1, the wiring hole 8 is formed in a push-out shape in which the diameter is contracted in the first glass substrate 3 as it moves to the side of the hole bottom 8a, and is formed in the sealing member 5 as it moves to the bottom of the hole. 8a side and enlarged diameter. In other words, the wiring hole 8 is formed by pushing the interface between the first glass substrate 3 and the sealing member 5 as a boundary, and the first glass substrate 3 side and the sealing member 5 side are oppositely pushed out.

When the wiring hole 8 is formed by the pulsed laser 2 irradiated under the above-described conditions, the inner peripheral surface of the first glass substrate 3 of the wiring hole 8 is inclined with respect to the center line 8b of the hole. The inclination angle θ1 is 0.1° to 30°. On the other hand, the inner peripheral surface of the sealing member 5 of the wiring hole 8 is inclined at an angle θ2 of 1 to 45 with respect to the center line 8b of the hole. Further, as shown in FIG. 5, in the wiring hole 8 The inner peripheral surface of the sealing member 5 forms irregularities along the periodic direction along the periodicity of the interference pattern. The pitch P of the unevenness is 0.5 μm to 20 μm. Further, the height H of the convex portion in the unevenness is 0.5 μm to 5 μm. In addition, the periodic irregularities may be in the entire range of the inner peripheral surface of the sealing member 5 formed in the wiring hole 8, and may be formed only in a part of the field. In addition, as shown in FIG. 6, the interface between the first glass substrate 3 and the sealing member 5 is partially peeled off along the inner peripheral surface of the wiring hole 8. The width Y of the peeled interface is 0.1 μm to 50 μm. Further, by peeling, the dimension Z of the interface opening in the thickness direction is 0.1 μm to 20 μm.

Hereinafter, the main effects and effects of the above-described method of forming the wiring holes will be described.

In the liquid crystal panel 1 obtained by the above-described method for forming a wiring hole, the wiring hole 8 is formed by the interface between the first glass substrate 3 and the sealing member 5, and the first glass substrate 3 side and the sealing member 5 are formed. The sides are reversed from each other. Further, in the inner peripheral surface of the sealing member 5 of the wiring hole 8, irregularities are periodically formed in the thickness direction. For this reason, when the wiring hole 8 is plated, the conductive paste or the like is filled, and the conductive material is introduced into the wiring hole 8, the inner peripheral surface of the wiring hole 8 and the conductive material are easily caught. Firmly fix both.

Here, the method of forming the wiring hole of the present invention is not limited to the one described in the above embodiment. As a modification of the above-described embodiment, the optical axis of the pulsed laser may be inclined with respect to the thickness direction of the first glass substrate and the second glass substrate, and the pulse Ray may be performed. Irradiation of the shot. Further, the polarized light of the pulsed laser may be used as linear polarized light, elliptically polarized light, azimuth polarization, radial polarization, or the like, and polarized light other than circularly polarized light.

Further, as a modification of the above-described embodiment, it is possible to re-irradiate another pulse laser from an arbitrary direction with respect to the pulse laser irradiated from the first glass substrate side of the liquid crystal panel, or to make the sealing member The pulsed laser irradiated from the side of the first glass substrate interferes with the pulsed laser beam that is re-irradiated. Also in such a case, the inner peripheral surface of the sealing member for the wiring hole can be formed with irregularities along the periodicity of the interference pattern.

Furthermore, in the above-described embodiment, the wiring hole is formed in the liquid crystal panel, and the electronic device according to the method for forming the wiring hole of the present invention can be applied, and is not limited to the liquid crystal panel. In the present method, another electronic device having a structure in which two glass substrates arranged in opposite directions are interposed between each other with a spacer member made of a resin is used, and the same can be applied to the formation of the wiring hole. Happening. As an electronic device to which the present invention can be applied, for example, an organic electroluminescence panel, a touch panel, or the like can be exemplified.

1‧‧‧LCD panel

3‧‧‧First glass substrate

4‧‧‧Second glass substrate

5‧‧‧ Sealing member

6‧‧‧Metal wiring

7‧‧‧LCD

8‧‧‧ wiring holes

8a‧‧‧ hole bottom

8b‧‧‧ center line

D‧‧‧Deep

Θ1‧‧‧ tilt angle

Θ2‧‧‧ tilt angle

Claims (9)

A method for forming a wiring hole is a method for forming a wiring hole for an electronic device, wherein the electronic device includes a first glass substrate, a second glass substrate disposed to face the first glass substrate, and a use medium a spacer member comprising a resin interposed between the two substrates, wherein the electronic device emits a pulsed laser from a substrate side of one of the two substrates to form the wiring hole, and the wiring hole is The one of the substrate and the spacer member are penetrated in the thickness direction, and the bottom of the other substrate has a hole bottom. The method of forming a wiring hole according to claim 1, wherein a depth of the wiring hole formed in the other substrate is 50% or less with respect to a thickness of the other substrate. A method of forming a wiring hole according to claim 1 or 2, wherein a laser having a wavelength of 8.5 μm to 14 μm is used as the pulsed laser, and a reflectance of 5% or more with respect to a wavelength of 8.5 μm to 14 μm is used. The substrate serves as the other substrate. The method of forming a wiring hole according to any one of claims 1 to 3, wherein an interface between the first glass substrate and the spacer member is partially peeled off along an inner peripheral surface of the wiring hole. An electronic device comprising: a first glass substrate; a second glass substrate disposed opposite to the first glass substrate; and a resin structure interposed between the two substrates a spacer for forming a wiring hole that penetrates one of the substrates and the spacer member in the thickness direction, and has a hole in the thickness of the other substrate The diameter of the wiring hole is contracted by moving to the bottom side of the hole in one of the substrates, and is enlarged in the spacer member as it moves to the bottom side of the hole. The electronic device according to claim 5, wherein the depth of the wiring hole formed in the other substrate is 50% or less with respect to the thickness of the other substrate. The electronic device according to claim 5 or 6, wherein the inclination angle of the inner peripheral surface of the wiring hole with respect to the center line of the hole is 0.1 to 30 in one of the substrates, and The partition member is 1° to 45°. The electronic device according to any one of claims 5 to 7, wherein the inner peripheral surface of the spacer member of the wiring hole has periodic irregularities formed in the thickness direction. The electronic device according to any one of claims 5 to 8, wherein the interface between the first glass substrate and the spacer member is peeled off along an inner peripheral surface of the wiring hole.