TW201730093A - Reactive sealing gas for selective adaptation of the internal cavity pressure - Google Patents

Abstract

A method for producing a micromechanical component with a substrate and with a cap, which is connected to the substrate and encloses with the substrate a first cavity, is proposed, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity, wherein in a first method step, an access opening, which connects the first cavity to a surrounding space of the micromechanical component, is formed in the substrate or in the cap, wherein in a second method step, the first pressure and/or the first chemical composition is/are set in the first cavity, wherein in a third method step, the access opening is sealed by introducing energy or heat into an absorbent part of the substrate or of the cap with the aid of a laser, wherein in a fourth method step, a reactive gas for further setting the first pressure and/or the first chemical composition is introduced into the first cavity.

Description

Reactive closed gas for selective adaptation of the internal pressure of the cavity

A micromechanical assembly and method for producing the micromechanical assembly.

The invention is based on the method according to the preamble of claim 1 of the patent application, which is known from WO 2015/120939 A1. If a specific internal pressure in the cavity of the micromechanical component is required, or if a gas mixture having a specific chemical composition is to be enclosed in the cavity, typically during the capping of the micromechanical component or on the substrate wafer The internal pressure or the chemical composition is set during the bonding operation between the cover wafers. During capping, for example, the cover is attached to the substrate such that the cover encloses the cavity with the substrate. By setting the chemical composition of the atmosphere or pressure and/or gas mixture present in the surrounding space during capping, a particular internal pressure and/or specific chemical composition can thus be set in the cavity.

The internal pressure in the cavity of the micromechanical component can be specifically set by the method known from WO 2015/120939 A1. By this method, it is especially possible to produce a micromechanical component having a first cavity, possibly setting a first pressure and a first chemical composition in the first cavity (which is different from the second pressure and the second when capping) chemical components).

In the case of a method for specifically setting the internal pressure in a cavity of a micromechanical component according to WO 2015/120939 A1, in a cover or cover wafer or substrate or sensor wafer A narrow access channel to the cavity. Subsequently, the cavity is filled by the desired gas and the desired internal pressure by means of the access channel. Finally, the area around the channel is picked up by local heating using a laser, and the substrate material is partially liquefied and hermetically closed the access channel as it solidifies.

The quality of the rate-of-rotation is extremely sensitive depending on the lumen pressure. In addition, as far as the life of the rotation rate sensor is concerned, the most stable quality is necessary for its high offset performance, which is due to the deviation of the quality from the value used in determining the calibration parameters during calibration. Offset of the device. In order to achieve the highest possible and stable quality over the life of the rotation rate sensor, it is important to stabilize or maintain the internal pressure of the rotation rate sensor cavity within the life of the rotation rate sensor. In the case of high quality (ie, low lumen pressure) rotation rate sensors, there is typically a significant increase in internal pressure after the HT storage period (the period of storage at relatively high temperatures), For example) generated by outgassing or gas diffusion into the cavity.

Other methods for selectively setting the internal pressure in the cavity of the micromechanical component are known from US 8,546,928 B2, US 2015/0158720 A1 and US Pat. No. 8,513,747 B1. A method for determining the rate of leakage is known from US 7,739,900 B2.

It is an object of the present invention to provide a method for producing a micromechanical component that is mechanically robust and has a long service life compared to the prior art in a simple and inexpensive manner compared to the prior art. It is also an object of the present invention to provide a micromechanical assembly that is compact, mechanically robust, and has a long service life as compared to the prior art. According to the invention, this applies in particular to micromechanical components having a (first) cavity. By means of the method according to the invention and the micromechanical component according to the invention, it is also possible to further realize that the first pressure and the first chemical composition can be set in the first cavity and A second mechanical component of the second pressure and the second chemical composition is set in the second cavity. The method is intended to, for example, be used to generate a first pressure enclosure in the first cavity and a second pressure enclosing the second cavity (the first pressure is intended to be different from the second pressure). Component. This is the case, for example, whenever a first sensor unit for rotational rate measurement and a second sensor unit for acceleration measurement are to be integrated into the micromechanical assembly. For example, here the first cavity and the second cavity are separated from each other only by the joint mesh. In particular, it is an object of the present invention to enable high quality within the life of a micromechanical component.

This object is achieved by providing in a fourth method step the introduction of a reaction gas for further setting the first pressure and/or the first chemical composition into the first cavity.

This provides a method for producing a micromechanical component in a simple and inexpensive manner, wherein particularly in the case where the first cavity is a cavity of a rotation rate sensor, the first pressure in the first cavity can be within the lifetime The first pressure is further reduced by maintaining substantially constant or stable, or wherein after the temporary setting of the first pressure. This is done, for example, by degassing the material within the first cavity over a lifetime or by gas diffusion (eg, via a substrate or cover or a joint frame or joint mesh between the first cavity and the second cavity) a small amount of gas entering the first cavity reacts due to the reactive gas or reacts with the gas enclosed in the cavity prior to or prior to closing the opening and in this way maintains the total internal pressure of the cavity substantially constant or reduced Small and realized. In this way, it may be possible, for example, to ignore the different damping factors of different types of gases, for example, the damping of the rotation rate sensor and thus the quality remains unchanged in the first approximation.

A further advantage of the method according to the invention is that by means of the reaction gas it is possible to counteract that the internal pressure occurring in the cavity during or after the conventional joining process does not correspond to the pressure of the enclosure during the joining.

According to the invention, alternatively or additionally, in a fourth method step, a gas-gathering agent for further setting the first pressure and/or the first chemical composition is introduced into the first cavity. According to the present invention, it is also provided that the reaction gas substantially contains a gas collector.

In connection with the present invention, the term air entraining agent is understood to mean a chemically reactive material for the purpose of maintaining a vacuum for as long as possible. According to the present invention, the material is provided in a solid state or in a liquid state or in a gaseous state. For example, the gas molecules are directly chemically bonded to the atoms of the gas collector material on the surface of the gas collector. Alternatively or additionally, however, it is also provided that the gas molecules are firmly held on the gas accumulating material by adsorption. In this way, gas molecules are "captured" in or on the surface of the gas generant material. In conjunction with the present invention, there should be a distinction between the activated gassing agent and the unactivated gassing agent, and the activated gassing agent has a higher rate of capture than the unactivated gassing agent. The rate of capture is understood herein to mean, for example, the number of gas molecules trapped in or on the surface of the gas generant material per unit time (eg, per second). Further, according to the present invention, there should be a difference between the reversible air entraining agent and the irreversible air entraining agent. According to the invention, the reversible air entraining agent comprises at least partially reversible or predominantly reversible gas accumulator material, and the irreversible gas entraining agent comprises at least partially irreversible or predominantly irreversible gas accumulator material. However, it is also provided according to the invention that both the reversible air entraining agent and the irreversible air entraining agent comprise at least partially reversible air entrainer material and at least partially irreversible air entrainer material, respectively. According to the invention, a reversible air entrainer material is understood to mean substantially capturing or absorbing gas molecules in or on the surface of the gas generant material during a first time point or during a first time period, and at a second time point Or a gassing material that substantially releases or discharges trapped gas molecules to or from the surface of the gas accumulator material during the second time period. According to the invention, "substantially trapped or absorbed" is understood to mean, for example, that the rate of capture is greater than the rate of release and that the first sum of the rate of adsorption and the rate of absorption is greater than the rate of desorption. According to this issue It is to be understood that "substantially released or released" is understood to mean, for example, that the rate of capture is less than the rate of release and that the first sum is less than the rate of desorption. The rate of adsorption is understood herein to mean, for example, the number of gas molecules trapped on the surface of the collector material per unit time (eg, per second). The rate of absorption is understood herein to mean, for example, the number of gas molecules trapped on the surface of the collector material or in the volume of the collector material per unit time (eg, per second). The rate of release or desorption is understood herein to mean, for example, release or release to or from the surface of the collector material per unit time (eg, per second). The number of gas molecules. According to the present invention, the reversible air entraining agent can be substantially regenerated or converted into an initial state having high absorption readiness and/or adsorption readiness. According to the invention, absorption readiness or adsorption readiness is understood to mean providing a high absorption rate or adsorption rate in the presence of corresponding gas molecules.

According to the invention, a particle is preferably understood to mean a collection of atoms or atoms, such as one molecule or several molecules. In connection with the present invention, the particles are in a gaseous, liquid or solid state, or are part of a gas phase, a liquid phase or a solid phase, and comprise at least one phase boundary surface with a space surrounding them. In particular, in accordance with the present invention, a particle is understood to mean a body that is small on the scale of the micromechanical component, that is, a body having a range of up to 1/10 of the maximum range of the micromechanical component.

In connection with the present invention, the term "micromechanical component" is intended to be understood to mean that the term encompasses both micromechanical components and microelectromechanical components.

The invention is preferably intended to produce a micromechanical component having a cavity or a micromechanical component having a cavity. However, the invention is, for example, also intended to have two cavities or to have more than two cavities (i.e., three, four, five, six or more than six) Micromechanical component of the cavity).

Preferably, the access opening is closed by the use of a laser to introduce energy or heat into the substrate or cover to absorb this energy or a portion of this heat. Preferably, energy or heat is continuously introduced herein, for example, together in separate absorbent portions of the substrate or cover of the plurality of micromechanical components on the wafer. However, it is also alternatively provided, for example, by using several laser beams or laser devices to simultaneously introduce energy or heat into the respective absorptive portions of the substrate or cover of the plurality of micromechanical components. Alternatively, it is also provided according to the invention to close the access opening by means of an oxide reseal process or an oxide resealing process. Here, the oxide reclosing process or the oxide reclosing process is, for example, an alternative closed process or a laser reclose process or a laser reclose process, and wherein the subsequent openings of the cavity are hermetically sealed by an oxide cap The ground cover is closed and the oxide cover is grown under low ambient pressure.

Advantageous improvements and developments of the present invention can be derived from the description of the appended claims and the description of the drawings.

According to a preferred development, the cover and the substrate are provided to enclose the second cavity, the second pre-pressure is in the second cavity, and the second gas mixture having the second chemical composition is enclosed in the second cavity. in.

According to a preferred development, in the fifth method step, at least one bond is produced between at least one first particle A of the reactive gas and at least one second particle B of the other gas, in particular, at least A chemical bond. This advantageously makes it possible for the second particles B, which have, for example, entered another gas of the first cavity after the opening of the opening, can be bonded by means of reactive gases.

According to a preferred development, the following situation is provided based on at least one first particle The interaction between A and the electrons of at least one second particle B, in particular, electrostatic interaction produces at least one bond. In this way, a chemical bond between the at least one first particle A and the at least one second particle B is advantageously made possible.

According to a preferred development, it is provided that a new particle C is produced by means of a bond such that the chemical composition of the new particle C is in the following manner: AB _X or AB or A _X B, where x > 1. In this manner, it is advantageous to stabilize the internal pressure or the first pressure during the life of the micromechanical component and/or to selectively set the quality of the internal pressure or rotation rate sensor during the bonding process at a low pressure and/or It is possible to produce high quality systems and/or highly sensitive and selective gas sensors by using standard bonding processes.

According to a preferred development, new particles C are provided in such a way that the new particles C are in a solid state or in a liquid state or in a gaseous state. In the case where the new particles C are in a solid state or in a liquid state, it is advantageously possible, for example, that the micromechanical component can be used as an extremely sensitive gas sensor in which the reactant gas reacts with another gas. A solid is formed and in this way no longer contributes to the internal gas pressure of the cavity.

This change in pressure can be established very accurately based on changes in the quality of the micromechanical components. Depending on the probability of reaction of the enclosed gas or reactive gas, the resulting gas sensor is selective for a particular gaseous species. Moreover, in the case where the new particles C are in a solid state or in a liquid state, it is advantageous, for example, to produce a high quality system by means of a standard bonding process, which is new in the solid state or in a liquid state. Particle C is not substantially Promote the first pressure. Where the new particle C is in a gaseous state of aggregation, for example, it may be advantageous to stabilize the first pressure within the lifetime of the micromechanical component and/or selectively set the first pressure or rate of rotation sensing during the bonding process The quality of the device is under low pressure.

According to a preferred development, the following situation is provided, the other gas comprising hydrogen. In this way, it is advantageously possible to make it possible, in particular in the case of residual gas analysis, in the case of hydrogen found in the cavity or in the first cavity, if a reactive blocking gas or a reaction gas which reacts with hydrogen is used to set this pressure Then, the quality can be specifically set by pressure during the joining. In this manner, hydrogen released during or after the engagement is bonded by the cavity or reactive gas or reactive gas in the first cavity, and the internal pressure is maintained, for example, at a value set during the bonding. By means of this method, if the reaction gas reacts with the released hydrogen to form a non-gaseous end product, the quality of the system can also be raised to a high level.

According to a preferred development, the following situation is provided, the fourth method step being carried out before the third method step. In this way, it is advantageously made possible to introduce a reaction gas into the first cavity before closing the access opening.

According to a preferred development, the following situation is provided, after which the fifth method step is carried out. In this way, it is advantageously possible to create a bond in the first cavity.

According to a further development, the following situation is provided, after which the fifth method step is carried out. In this way, it is advantageously possible to make the first pressure substantially stable or reduceable over the life of the micromechanical component with the access opening closed.

Another subject of the present invention is a micromechanical assembly having a substrate and having a cover attached to the substrate and enclosing the first cavity with the substrate, the first pressure prevailing in the first cavity and having a first chemical composition The gas mixture is enclosed in the first cavity, and the substrate or cover comprises a closed access And an opening for enclosing the first pressure and/or the first chemical composition of the reaction gas in the first cavity. In this way, it is advantageous to provide a compact, mechanically robust and low cost micromechanical assembly with a set first pressure. The stated advantages of the method according to the invention also apply correspondingly to the micromechanical component according to the invention.

According to a preferred development, a new situation is provided for at least one bond (in particular, by at least one chemical bond) between at least one first particle A of the reactive gas and at least one second particle B of the other gas The particles are enclosed in the first cavity.

According to a preferred development, the chemical composition of the new particles is provided as follows: AB _X or AB or A _X B, where x > 1.

According to a preferred development, the cover and the substrate enclose a second cavity, the second pressure prevails in the second cavity, and the second gas mixture having the second chemical composition is enclosed in the second cavity . In this way, it is advantageous to provide a compact, mechanically robust and low cost micromechanical assembly having a set first pressure and a second pressure.

According to a preferred development, the first situation is provided, the first pressure being lower than the second pressure, the first sensor unit for the rotation rate measurement being disposed in the first cavity and the second sensing for the acceleration measurement The unit is disposed in the second cavity. In this way, it is advantageous to provide a mechanically robust micro-rotation rate measurement and acceleration measurement with optimal operating conditions for both the first sensor unit and the second sensor unit. Mechanical components.

Another subject of the invention is a micromechanical component for use as a gas sensor The micromechanical component comprises a film.

According to a preferred development, the film is disposed between the first cavity and the surrounding space of the micromechanical component. According to a preferred development, it is provided that the film is formed to be semi-permeable. According to a preferred development, it is provided that the film is formed to be impermeable to the first particle and permeable to the second particle.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows, in a schematic representation, a micromechanical assembly having an open access opening in accordance with an embodiment of the present invention.

Figure 2 shows in a schematic representation a micromechanical assembly according to Figure 1 with a closed access opening.

Figure 3 shows a schematic representation generated micromechanical component according to an embodiment of a method of embodiment given by way of example of the present invention.

Figure 4 shows, in a schematic representation, a micromechanical assembly of another embodiment, given by way of example, in accordance with the present invention.

In the various figures, the same parts are always provided with the same reference, and therefore are generally referred to or referred to only once in each case.

In FIG 1 and FIG 2, shows a schematic of one embodiment of a micro embodiment given by way of example of the present invention is a mechanical assembly of said micromechanical component 1 has an open access opening 11 and is taken in FIG. 1 in FIG. 2 has a closed access opening 11. Here, the micromechanical component 1 includes a substrate 3 and a cover 7. The substrate 3 and the cover 7 are preferably airtightly connected to each other and enclose the first cavity 5 together. For example, the micromechanical assembly 1 is formed in such a manner that the substrate 3 and the cover 7 additionally enclose the second cavity. However, the second cavity is not shown in Figure 1 or Figure 2 .

For example, a first pressure prevailing in the first cavity 5 (detail, in the acess opening of the case 11 is closed), as represented in FIG. Additionally, a first gas mixture having a first chemical composition is enclosed in the first cavity 5. Also, for example, a second pressure prevails in the second cavity, and a second gas mixture having a second chemical composition is enclosed in the second cavity. Preferably, the access opening 11 is disposed in the substrate 3 or in the cover 7. In the case of the exemplary embodiment referred to herein, the access opening 11 is configured in the cover 7 by way of example. However, as an alternative to this, it is also possible to provide the access opening 11 in the substrate 3 according to the invention.

For example, a situation is provided in which the first pressure in the first cavity 5 is lower than the second pressure in the second cavity. For example, the following case also, FIG. 1 or FIG. 2 are not represented in the measured rotation rate for a first micro-mechanical sensor unit disposed in the first cavity 5, and 2 in FIG. 1 or FIG. A second micromechanical sensor unit for acceleration measurement, not shown, is disposed in the second cavity.

In Fig. 3 , a method for producing a micromechanical component 1 according to an embodiment of the present invention, which is given by way of example, is shown in a schematic representation. Here, in a first method step 101, the first cavity 5 is connected to the surrounding space 9 of the micromechanical component 1 and in particular a narrow access opening 11 is formed in the substrate 3 or in the cover 7. Figure 1 shows by way of example, after the first method step 101 a micro-mechanical components. In addition, in a second method step 102, a first pressure and/or a first chemical composition is set in the first cavity 5, and the first cavity 5 is filled by the desired gas and the desired internal pressure by means of the access channel. In addition, for example, in a third method step 103, the access opening 11 is closed by introducing energy or heat into the absorptive portion of the substrate 3 or cover 7 by means of a laser. For example, it is alternatively provided that in the third method step 103, only the area around the channel is preferably taken up by laser local heating and the access channel is hermetically sealed. In this way, it is advantageously also possible to provide the method according to the invention by means of an energy source for closing the access opening 11 in addition to the laser. Figure 2 shows, by way of example, a micromechanical component 1 after a third method step 103.

At a time after the third method step 103, mechanical stress can occur in the lateral region 15 of the cover 7 facing away from the surface of the cavity 5 by means of an example in FIG. 2 and occurring perpendicular to the transverse region 15 to micro The depth of projection on the surface of the mechanical component 1, that is, along the access opening 11 and in the direction of the first cavity 5. These mechanical stresses (in particular, local mechanical stresses) are particularly prevalent in the material zone 13 of the cover 7 (which is converted into a liquid state of aggregation in a third method step 103 and into a solid state of aggregation after a third method step 103). And closing and at the vicinity of the boundary surface between the access opening 11) and the residual region of the cover 7, which is still in a solid state of aggregation during the third method step 103. The material region 13 of the closure opening 11 of the cover 7 in FIG. 2 should be considered to be only schematically or schematically represented, in particular with regard to its lateral extent or shaping (in detail, parallel to the surface extension), And especially with respect to its extent or configuration extending perpendicular to the lateral extent (in detail, perpendicular to the surface).

In Fig. 4 , a micromechanical assembly according to another embodiment of the invention, given by way of example, is shown in a schematic representation.

For example, in a fourth method step, a reaction gas 801 (shown schematically in FIG. 4 ) for further setting the first pressure and/or the first chemical composition is introduced into the first cavity 5. Also provided, for example, in the fifth method step, at least one bond, in particular at least one chemical bond, is produced between at least one first particle A of the reactive gas 801 and at least one second particle B of the other gas 803. For example, it is provided herein that at least one bond is generated based on an interaction between at least one electron of at least one first particle A and at least one second particle B, in particular, electrostatic interaction. In addition, it is also possible, for example, to provide new particles C by means of a bond such that the chemical composition of the new particles C is in the following way: AB _X or AB or A _X B, where x > 1. Finally, for example, the following is provided to create new particles C in such a way that the new particles C are in a solid state of aggregation or in a liquid state of aggregation or in a gaseous state of aggregation.

By way of example in FIG. 4 as indicated, for further setting a first pressure and / or the chemical composition of the first reaction gas 801 to the first enclosed cavity 5. For example, a new particle produced by at least one bond between at least one first particle A of the reactive gas 801 and at least one second particle B of another gas 803 (in detail, by at least one chemical bond) is provided herein. C is enclosed in the first cavity 5.

By way of example, it is contemplated in accordance with the present invention to control the internal cavity pressure or first pressure in the first cavity 5 by means of a chemical reaction of a blocking gas or reactive gas 801 with another component, such as another gas 803. This is especially contemplated for various purposes in accordance with the present invention; depending on the target, different requirements apply to the reactant or reaction gas 801 and another gas 803 and the reaction product or a new phase comprising the new particle C.

For example, imagine the following goals:

Goal 1: Stabilize internal pressure over the life

Goal 2: Specific setting of the internal pressure/rotation rate sensor quality during the bonding process at low pressure

Goal 3: Produce a high quality system by using a standard bonding process

Goal 4: Highly sensitive and selective gas sensor

About goal 1:

In FIG. 4 , various sources of gas or other gas 803 are shown by way of example, and other gases 803 can change the internal pressure of the cavity or the first pressure of the first cavity 5, for example, over the life of the micromechanical component 1. These other gases 803 may, for example, come from within the cavity, such as outgassing, or, for example, externally penetrate into the cavity or first cavity 5, such as a gas diffusion or small leak path. Here, another gas 803 includes, for example, outgassing or gas diffusion into the first cavity 5. For example, the following case is provided in which the reaction gas 801 is selected such that the reaction gas 801 is in the lifetime such that the total number of gas particles after the reaction is equal to the number of particles of the reaction gas 801 or the first particles before the reaction The gas either reacts with other gases 803 that otherwise appear in the cavity or first cavity 5. This is especially possible because, in the case of an ideal gas, the total number of particles acts to define the pressure which is intended to remain constant over the lifetime. For example, the following situation is provided, the reaction or reaction equation is A+B->AB or A+x×B->AB _X , where AB and AB _X are in a gaseous state or in a gaseous state of aggregation. For example, a case is also provided in which the number of gas particles enclosed in the first cavity 5 after the reaction substantially corresponds to the initial number or the number of gas particles of the reaction gas 801 in the first cavity 5 before the reaction. .

About goal 2:

During and/or after engagement, for example, there is outgassing which leaves a different pressure or first pressure in the cavity or first cavity 5 that is different from that set during the bonding process or during the bonding process The pressure in the surrounding space 9. Here, another gas 803 includes, for example, outgas during the bonding process. For example, the outgassing amount fluctuates relatively sharply during the process or bonding process, which may have the effect that the quality of the micromechanical component 1 varies over a wide range of values. In the case of selective encapsulation of the reactive gas 801, a low partial pressure (e.g., target quality) that is preferred for high quality is defined or set. The outgas during or after the joining process is, for example, completely bonded by the reaction gas 801. In order to be able to achieve the highest possible quality, for example, the following conditions are provided, the partial pressure of the reaction gas is as low as possible, but the reaction gas also has sufficient absorption capacity for outgassing. In order to be able to satisfy two requirements, for example, the reaction gas particles or the first particles A are caused to cause the reaction gas particles or the first particles A to absorb a plurality of gassing material particles or a plurality of second particles B. The gas particles or react with the second particles B. For example, the reaction or reaction equation is provided as A+x×B->AB _X , where AB and AB _X are in a gaseous state or in a gaseous state of aggregation. For example, x>=1 is provided here. For example, it is also provided that the number of gas particles enclosed in the first cavity 5 after the reaction substantially corresponds to the initial number or the number of gas particles of the reaction gas 801 in the first cavity 5 before the reaction.

About goal 3:

During and/or after engagement, for example, there is outgassing which leaves a different pressure or first pressure in the cavity or first cavity 5 that is different from being set during the bonding process or prevailing during the bonding process The pressure in the surrounding space 9. Here, another gas 803 includes, for example, outgas during the bonding process. This, for example, results in a quality that is significantly lower than the process pressure that would actually be produced during the bonding. In the case of selective encapsulation of the reactive gas 801, the partial pressure, for example, is optimized to the extent that the amount of outgassing particles or the amount of second particles is consumed as completely as possible by the reaction. In other words, for example, as much as possible of the second particles are reacted with the first particles during the reaction. For example, in particular, in order to produce as low a pressure as possible or as high a quality as possible of the amount of reaction gas remaining or the number of first particles, a plurality of gas particles or a plurality of seconds capable of bonding the outgassing gas are used. The reaction gas 801 of the particles. Thus, for example, the gas particles or the second particles from the outgassing are bonded as completely as possible and precipitate, for example in the form of solid substances. In other words, the new particle C is in a solid state. This advantageously achieves that the first particles and the second particles no longer contribute to the gas pressure or the first pressure. In order to be able to achieve the highest possible quality, for example, the partial pressure of the reaction gas 801 after the reaction is as low as possible, or lower than the partial pressure of the reaction gas 801 in the first cavity 5 before the reaction. The partial pressure of the other gas 803 in a cavity 5 (before and/or after the reaction) is lower than the partial pressure of the reaction gas 801 in the second cavity and/or the surrounding space 9, or lower than the second air. The partial pressure of the gas and other gas 803 in the surrounding space 9. For example, however, it is also provided that the reactive gas 801 enclosed during the bonding has sufficient absorption capacity for outgassing or other gases 803. In order to be able to satisfy two requirements, for example, the reaction gas particles or the first particles A are provided in such a manner that the reaction gas particles or the first particles absorb a plurality of gas releasing substance particles or a plurality of second particles B and outgassing. The gas particles react with or with the second particles. For example, the following is provided, the reaction or reaction equation is A+x×B->AB _X , where AB and AB _X are solid or in a solid state. For example, x>=1 is provided here. For example, the following is also provided such that the amount of gas particles remaining in the first cavity 5 after the reaction is minimized such that the amount of gas of the reactive gas 801 matches the amount of another gas 803 that is released during the joining. . For example, a state in which the reaction gas 801 and/or another gas is substantially completely converted into a solid matter is provided herein.

About goal 4:

For example, the rotation rate sensor uses a quality measurement to make the sensor empty. A highly sensitive measurement of the internal pressure of the chamber or the first pressure of the first cavity 5 is made possible. Here, another gas 803 contains, for example, a gas to be detected. If, for example, gas or another gas 803 entering the cavity or first cavity 5 causes the total internal pressure or first pressure to change, this or pressure change can be measured with very high precision. If, for example, the sensor is provided with a film that is only permeable to the gas to be detected or another gas 803, the incoming gas or another gas 803 can be directly measured by means of rising pressure or by means of reduced quality. To. The following is provided, for example, in the case of entering a gas or another gas 803 such that the final product or the product comprising at least one new particle C precipitates in the form of a solid material and encloses in the cavity or first cavity 5 The reaction gas 801 is reacted. This advantageously makes it possible to reduce the pressure or the first pressure and improve the quality. Lower pressures are advantageous compared to higher pressures, especially since pressure measurements may be more accurate at lower pressures. In other words, compared with the rising pressure, the advantage is that the higher the quality, the more sensitive the pressure measurement is. In addition, for example, the reaction gas 801 is only reacted with another gas 803, or a bond may be generated only between at least one first particle and at least one second particle. In other words, for example, it is provided that the selection of the reaction gas 801 ensures that the reaction gas 801 reacts only with a specific gas species or with another gas 803. This means, for example, that even if other gaseous substances or third gases enter the cavity or the first cavity 5 undesirably, only the gaseous substances or another gas to be detected causes internal pressure in the first cavity 5. Or the first pressure is reduced or the quality is improved. In this way, it is advantageously possible for the sensor to be selective with respect to the gaseous substance to be detected or with respect to the other gas 803. In particular, in this way it is ensured that the sensor is protected by both the film and the reactive gas.

For example, it is possible to simultaneously occur by selectively timing two cancellation effects (specifically, the pressure increases due to the entry of another gas 803 into the first cavity 5 and the pressure is reduced due to the formation of new particles C) To detect another gas 803. This is advantageously possible, even in the first When the three gases enter the cavity 5 and/or the third particles of the third gas react with the first particles of the reactive gas 801, the third particles involved in the reaction no longer contribute to the first pressure or the third gas The same applies to the effect of partial pressure.

In addition, for example, a reset is also performed after the reaction gas 801 is completely saturated. This advantageously makes it possible for the sensor or micromechanical component 1 to be used for detection repeatedly or over a long period of time. For example, a case is provided in which the sensor is heated when the reset is performed. In other words, the temperature of the micromechanical component 1 rises during resetting, especially compared to room temperature. For example, the temperature of the micromechanical component is increased to a temperature in the range between 100 °C and 500 °C. For example, by heating the sensor, the final product or new particles are again broken down into two reactants or first particles A and second particles B. For example, the following is provided where the gas to be detected or another gas 803 is again driven out through the film. For example, additionally or alternatively, after the reaction between the reaction gas 801 and another gas 803 is carried out, another reaction gas 801 is introduced into the first cavity 5, or again after the fifth method step. Or the fourth method step is performed multiple times. In other words, the renewal of the reaction gas 801 is performed. For example, a connection is provided for this purpose, the connector or the like being connected to the rotation rate sensor cavity or the first cavity 5.

For example, as many reactive gas particles or first particles as possible are also provided to react with the detection gas particles or the second particles or to generate bonds. This advantageously achieves a particularly high sensitivity of the sensor.

For example, the reaction or reaction equation is provided as x x A + B -> A _X B, where A _X B and AB are solid or in a solid state. For example, x>=1 is provided here. For example, it is also provided that the reaction or reaction equation is A _X B->(heat)->A+x×B when heated or when reset or when resetting is performed. For example, it is also provided that the reaction gas 801 reacts with another gas 803 and thus the total pressure or the first pressure in the first cavity 5 is effectively reduced.

Claims (11)

A method for producing a micromechanical component (1) having a substrate (3) and having a cover (7) connected to the substrate (3) and to the substrate (3) enclosing a first cavity (5), a first pressure prevailing in the first cavity (5), and having a first chemical composition, the first gas mixture is enclosed In the first cavity (5), wherein in a first method step (101), the first cavity (5) is connected to a connection of a space (9) around one of the micromechanical components (1) An opening (11) is formed in the substrate (3) or the cover (7), wherein in a second method step (102), the first pressure and/or is set in the first cavity (5) The first chemical composition, wherein in a third method step (103), the energy or heat is introduced into the substrate (3) or the absorbent portion of the cover (7) by means of a laser. The access opening (11) is characterized in that, in a fourth method step, a reaction gas (801) for further setting the first pressure and/or the first chemical composition is introduced into the first cavity (5) Medium. The method of claim 1, wherein in a fifth method step, at least one first particle (A) of the reactive gas (801) and at least one second particle of another gas (803) ( B) produces at least one bond, in particular, at least one chemical bond. The method of claim 1 or 2, wherein the at least one bond is based on an interaction between the electrons of the at least one first particle (A) and the at least one second particle (B), In other words, electrostatic interactions occur. The method of any one of the items 1 to 3, wherein the new particle is produced by means of the bond such that the chemical composition of a new particle (C) is the following ): ABX or AB or AXB, where x>1. The method of any one of clauses 1 to 4, wherein the new particle (C) is produced in a solid state or in a liquid state or in a gaseous state. Particle (C). A micromechanical component (1) having a substrate (3) and having a cover (7) connected to the substrate (3) and enclosing a first cavity with the substrate (3) 5) a first pressure is prevailing in the first cavity (5), and a first gas mixture having a chemical composition is enclosed in the first cavity (5), the substrate (3) or the The cover (7) includes a closed access opening (11), characterized in that a reaction gas (801) for further setting the first pressure and/or the first chemical composition is enclosed in the first cavity (5) Medium. The micromechanical component (1) of claim 6, wherein the at least one first particle (A) of the reactive gas (801) and the at least one second particle (B) of the other gas (803) are between At least one of the bonds produces a new particle (C) enclosed in the first cavity (5), the at least one bond being in particular at least one chemical bond. Such as the micromechanical component (1) of claim 6 or 7, wherein the new particle The chemical composition of (C) is ABX or AB or AXB, where x>1. The micromechanical component (1) of claim 6 to 8, wherein the cover (7) and the substrate (3) enclose a second cavity, and a second pressure prevails in the second cavity And a second gas mixture having a second chemical composition is enclosed in the second cavity. The micromechanical component (1) of claim 6 to 9, wherein the first pressure is lower than the second pressure, and one of the first sensor units for the rotation rate measurement is disposed in the first A second sensor unit in the cavity (5) and for acceleration measurement is disposed in the second cavity. A use of a micromechanical component (1) according to one of claims 6 to 10 as a gas sensor, the micromechanical component (1) comprising a film.