TW201728726A - Adhesive sheet for fixing polishing pad having a substrate, a polishing pad side adhesive layer and a fixed plate side adhesive layer - Google Patents

Adhesive sheet for fixing polishing pad having a substrate, a polishing pad side adhesive layer and a fixed plate side adhesive layer Download PDF

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Publication number
TW201728726A
TW201728726A TW105138825A TW105138825A TW201728726A TW 201728726 A TW201728726 A TW 201728726A TW 105138825 A TW105138825 A TW 105138825A TW 105138825 A TW105138825 A TW 105138825A TW 201728726 A TW201728726 A TW 201728726A
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Taiwan
Prior art keywords
adhesive
weight
polishing pad
adhesive layer
less
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TW105138825A
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Chinese (zh)
Inventor
Hiroyuki Watanabe
Hiroyuki Tsubaki
Shuuhei Yamamoto
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Nitto Denko Corp
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Publication of TW201728726A publication Critical patent/TW201728726A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/22Lapping pads for working plane surfaces characterised by a multi-layered structure
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00Presence of polyester
    • C09J2467/006Presence of polyester in the substrate

Abstract

The present invention provides an adhesive sheet having a substrate, a first adhesive layer disposed on the first side of the aforementioned substrate (polishing pad side adhesive layer) and a second adhesive layer disposed on the second side of the aforementioned substrate (fixed plate side adhesive layer) for fixing polishing pad. The adhesive agent forming both of the aforementioned first and second adhesive layers is an acrylic acid-based adhesive agent, wherein, at least the acrylic acid-based adhesive agent forming the aforementioned second adhesive layer is an adhesive agent S, and the adhesive agent S contains 3 parts or more by weight and 40 parts or less by weight of polymerized rosin-based tackifying resin relative to 100 parts by weight of acrylic polymer.

Description

研磨墊固定用黏著片材Adhesive sheet for polishing pad fixing

本發明係關於一種用於固定研磨墊之黏著片材。 本申請案係基於2015年11月30日提出之日本專利申請2015-234111號及2016年8月26日提出之日本專利申請2016-165638號而主張優先權,將該等申請之全部內容作為參考併入本說明書中。The present invention relates to an adhesive sheet for fixing a polishing pad. The present application claims priority based on Japanese Patent Application No. 2015-234111, filed on Nov. 30, 2015, the entire disclosure of Into this specification.

液晶用玻璃或矽晶片、硬碟等之高表面光滑性一般而言係藉由研磨而實現。上述研磨中使用之研磨墊通常使用雙面黏著帶安裝固定於研磨裝置之定盤上。作為揭示使用黏著片材作為研磨墊固定方法之先前技術之文獻,可列舉專利文獻1、2。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利申請公開2012-57135號公報 [專利文獻2]日本專利申請公開2012-102165號公報The high surface smoothness of glass or tantalum wafers for liquid crystals, hard disks, etc. is generally achieved by grinding. The polishing pad used in the above polishing is usually mounted on a fixing plate of a polishing apparatus using a double-sided adhesive tape. Patent Literatures 1 and 2 are listed as documents of the prior art which disclose the use of an adhesive sheet as a polishing pad fixing method. [Prior Art Document] [Patent Document 1] Japanese Patent Application Publication No. 2012-57135 (Patent Document 2) Japanese Patent Application Publication No. 2012-102165

[發明所欲解決之問題] 對於用於將研磨墊安裝固定於研磨裝置定盤(以下有時亦簡稱為「定盤」)上之黏著片材(研磨墊固定用黏著片材)要求具有對研磨墊及定盤二者良好接著之性能。另外,為了將由於使用而劣化之研磨墊自定盤剝離並更換為新的研磨墊,對於研磨墊固定用黏著片材要求具有容易將使用後之研磨墊自定盤剝離之性質。但是,就提高生產性、或降低成本等觀點而言,於存在進一步延長研磨墊之使用時間(耐用時間)而減少研磨墊之更換頻率之要求之狀況下,難以藉由先前之研磨墊固定用黏著片材來滿足上述要求。例如,為了於更長時間內可靠性良好地固定研磨墊,要求於不顯著損害上述剝離容易性之情況下能夠將研磨墊利用定盤更牢固地接著之黏著片材。 本發明係鑒於上述先前之事項而完成,其目的在於提供一種能夠將研磨墊牢固地固定於定盤之研磨墊固定用黏著片材。 [解決問題之技術手段] 根據本發明,提供一種研磨墊固定用黏著片材。該黏著片材以具備基材、設置於上述基材之第一面之第一黏著劑層及設置於上述基材之第二面之第二黏著劑層之雙面黏著片材之形式構成。上述第一黏著劑層之黏著面為將要黏貼於研磨墊之面。上述第二黏著劑層之黏著面為將要黏貼於研磨裝置定盤之面。構成上述第一黏著劑層之黏著劑(以下亦稱為「研磨墊側黏著劑」)為丙烯酸系黏著劑。構成上述第二黏著劑層之黏著劑(以下亦稱為「定盤側黏著劑」)亦為丙烯酸系黏著劑。而且,至少構成上述第二黏著劑層(定盤側黏著劑)之丙烯酸系黏著劑為黏著劑S。於一態樣中,該黏著劑S為相對於丙烯酸系聚合物100重量份含有3重量份以上且40重量份以下之聚合松香系增黏樹脂之丙烯酸系黏著劑。如此構成之黏著片材藉由具有由上述黏著劑S構成之第二黏著劑層(定盤側黏著劑層),可兼顧對定盤之良好之接著性及更換研磨墊時之作業性。另外,藉由用丙烯酸系黏著劑構成第一黏著劑層(墊側黏著劑層),可使上述第一黏著劑層良好地接著於研磨墊。因此,根據本發明,提供一種適合於將研磨墊固定於定盤之用途、並且亦適合於將研磨墊之使用時間延長之研磨墊固定用黏著片材。 於此所揭示之技術之較佳之一態樣中,上述黏著劑S中構成上述丙烯酸系聚合物之單體成分含有(甲基)丙烯酸正丁酯及於酯末端具有碳原子數6~9之烷基之(甲基)丙烯酸烷基酯。利用此種組成之黏著劑S,可適當地兼顧黏著力及保持力。另外,由於所述組成之黏著劑S亦適合於兼顧低溫黏著力及保持力,因此亦可較佳以第一黏著面及第二黏著面均由黏著劑S構成之態樣實施。 於此所揭示之技術之其他較佳之一態樣中,上述黏著劑S中構成上述丙烯酸系聚合物之單體成分含有40重量%以上且95重量%以下之(甲基)丙烯酸正丁酯。利用此種組成之黏著劑S,可適當地兼顧黏著力及保持力。另外,由於所述組成之黏著劑S亦適合於兼顧低溫黏著力及保持力,因此亦可較佳以第一黏著面及第二黏著面均由黏著劑S構成之態樣實施。 於此所揭示之技術之其他較佳之一態樣中,上述黏著劑S中構成上述丙烯酸系聚合物之單體成分含有1重量%以上且5重量%以下之含羧基之單體。此種組成之黏著劑S適合於兼顧低溫黏著力及保持力。因此,可較佳以第一黏著面及第二黏著面均由黏著劑S構成之態樣實施。 於此所揭示之技術之其他較佳之一態樣中,上述黏著劑S中構成上述丙烯酸系聚合物之單體成分含有含羥基之單體。此種組成之黏著劑S適合於兼顧低溫黏著力及保持力。因此,可較佳以第一黏著面及第二黏著面均由黏著劑S構成之態樣實施。 於此所揭示之技術可較佳以上述黏著劑S利用異氰酸酯系交聯劑進行交聯之態樣實施。利用此種組成之黏著劑S,可適當地兼顧黏著力及保持力。另外,由上述黏著劑S構成之黏著劑層傾向於對基材顯示出良好之錨固性。就防止將黏著片材與使用後之研磨墊一起自定盤剝離時之糊劑殘留等觀點而言,該方式較佳。 於此所揭示之黏著片材中,較佳為上述第一黏著劑層之黏著面(墊側黏著面)之低溫黏著力F1為上述第二黏著劑層之黏著面(定盤側黏著面)之黏著力F2之0.7倍以上(例如大於1.0倍)。就將黏著片材與使用後之研磨墊一起自定盤剝離時之作業性之觀點而言,以此方式構成較佳。於使用上述黏著片材固定之研磨墊為硬質之(例如硬質胺基甲酸酯系之)研磨墊之情形時、或為大面積之研磨墊等之情形時,該方式特別有意義。 於此所揭示之技術可較佳以構成上述第二黏著劑層之丙烯酸系黏著劑(定盤側黏著劑)及構成上述第一黏著劑層之丙烯酸系黏著劑(墊側黏著劑)均為黏著劑S之態樣實施。根據此種定盤側黏著劑及墊側黏著劑均為黏著劑S之態樣,具有伴隨著研磨墊之使用之黏著片材之變質於該黏著片材之兩面大致同樣地進行之傾向。就將黏著片材與使用後之研磨墊一起自定盤剝離時之作業性之觀點而言,該方式較佳。 於定盤側黏著劑及墊側黏著劑均為黏著劑S之態樣中,定盤側黏著劑與墊側黏著劑可為相同組成之黏著劑S,亦可為不同組成之黏著劑S。於此所揭示之技術可較佳以構成上述第一黏著劑層之丙烯酸系黏著劑及構成上述第二黏著劑層之丙烯酸系黏著劑為相同組成之黏著劑S之態樣實施。所述構成之黏著片材具有伴隨著研磨墊之使用之黏著片材之變質於該黏著片材之兩面同樣地進行之傾向。就將黏著片材與使用後之研磨墊一起自定盤剝離時之作業性之觀點而言,該方式較佳。 根據本說明書,提供一種研磨構件,其具備研磨墊及於此所揭示之任意一種黏著片材,並且該黏著片材之上述第一黏著劑層之黏著面(墊側黏著面)黏貼於上述研磨墊。利用所述構成之研磨構件,藉由將上述黏著片材之第二黏著劑層之黏著面(定盤側黏著面)黏貼於研磨裝置定盤,可將上述研磨墊牢固地固定於上述定盤。 上述研磨構件(附黏著片材之研磨墊)典型而言可藉由將於此所揭示之任意一種黏著片材之第一黏著面壓接於研磨墊而獲得。因此,根據本說明書,作為本發明之另一態樣,提供一種附黏著片材之研磨墊之製造方法,所述製造方法包括將於此所揭示之任意一種黏著片材之第一黏著面壓接於研磨墊(典型而言為於常溫例如未達40℃之溫度下進行壓接)。[Problems to be Solved by the Invention] An adhesive sheet (adhesive sheet for fixing a polishing pad) for mounting and fixing a polishing pad on a polishing apparatus fixing plate (hereinafter sometimes simply referred to as "fixing plate") is required to have a pair Both the polishing pad and the platen have good performance. Further, in order to peel off the polishing pad which is deteriorated by use and replace it with a new one, the adhesive sheet for polishing pad fixing is required to have a property of easily peeling the polishing pad after use. However, from the viewpoints of improving the productivity and reducing the cost, it is difficult to fix the polishing pad by the prior art in the case where the use time (durable time) of the polishing pad is further extended to reduce the replacement frequency of the polishing pad. Adhesive sheets are used to meet the above requirements. For example, in order to fix the polishing pad with good reliability for a longer period of time, it is required to adhere the sheet to the polishing pad more firmly by using the fixing plate without significantly impairing the ease of peeling. The present invention has been made in view of the above-described conventional matters, and an object thereof is to provide an adhesive sheet for fixing a polishing pad capable of firmly fixing a polishing pad to a fixed plate. [Technical means for solving the problem] According to the present invention, an adhesive sheet for fixing a polishing pad is provided. The adhesive sheet is configured to have a base material, a first adhesive layer provided on the first surface of the base material, and a double-sided adhesive sheet provided on the second adhesive layer on the second surface of the base material. The adhesive surface of the first adhesive layer is a surface to be adhered to the polishing pad. The adhesive surface of the second adhesive layer is to be adhered to the surface of the polishing device. The adhesive constituting the first adhesive layer (hereinafter also referred to as "polishing pad side adhesive") is an acrylic adhesive. The adhesive constituting the second adhesive layer (hereinafter also referred to as "fixing side adhesive") is also an acrylic adhesive. Further, at least the acrylic adhesive constituting the second adhesive layer (fixing side adhesive) is the adhesive S. In one aspect, the adhesive S is an acrylic adhesive containing 3 parts by weight or more and 40 parts by weight or less of the polymerized rosin-based tackifying resin based on 100 parts by weight of the acrylic polymer. The adhesive sheet thus constituted can have good adhesion to the fixing plate and workability in replacing the polishing pad by having the second adhesive layer (fixing side adhesive layer) composed of the above-mentioned adhesive S. Further, by forming the first adhesive layer (the pad side adhesive layer) with an acrylic adhesive, the first adhesive layer can be satisfactorily adhered to the polishing pad. Therefore, according to the present invention, there is provided an adhesive sheet for fixing a polishing pad which is suitable for use in fixing a polishing pad to a fixing plate and which is also suitable for extending the use time of the polishing pad. In a preferred aspect of the technology disclosed herein, the monomer component constituting the acrylic polymer in the adhesive S contains n-butyl (meth)acrylate and has a carbon number of 6 to 9 at the ester terminal. Alkyl alkyl (meth)acrylate. With the adhesive S of such a composition, the adhesive force and the holding force can be appropriately balanced. Further, since the adhesive S of the above composition is also suitable for the low-temperature adhesive force and the holding force, it is preferable to carry out the first adhesive surface and the second adhesive surface which are each composed of the adhesive S. In another preferred embodiment of the technique disclosed herein, the monomer component constituting the acrylic polymer in the adhesive S contains 40% by weight or more and 95% by weight or less of n-butyl (meth)acrylate. With the adhesive S of such a composition, the adhesive force and the holding force can be appropriately balanced. Further, since the adhesive S of the above composition is also suitable for the low-temperature adhesive force and the holding force, it is preferable to carry out the first adhesive surface and the second adhesive surface which are each composed of the adhesive S. In another preferred embodiment of the technique disclosed herein, the monomer component constituting the acrylic polymer in the adhesive S contains 1% by weight or more and 5% by weight or less of a carboxyl group-containing monomer. The adhesive S of such a composition is suitable for both low-temperature adhesion and retention. Therefore, it is preferable to carry out the aspect in which the first adhesive surface and the second adhesive surface are each composed of the adhesive S. In another preferred embodiment of the technology disclosed herein, the monomer component constituting the acrylic polymer in the adhesive S contains a hydroxyl group-containing monomer. The adhesive S of such a composition is suitable for both low-temperature adhesion and retention. Therefore, it is preferable to carry out the aspect in which the first adhesive surface and the second adhesive surface are each composed of the adhesive S. The technique disclosed herein can be preferably carried out in such a manner that the above-mentioned adhesive S is crosslinked by an isocyanate crosslinking agent. With the adhesive S of such a composition, the adhesive force and the holding force can be appropriately balanced. Further, the adhesive layer composed of the above-mentioned adhesive S tends to exhibit good anchoring property to the substrate. This method is preferable from the viewpoint of preventing the residual of the paste when the adhesive sheet is separated from the polishing pad after use. In the adhesive sheet disclosed herein, preferably, the low-temperature adhesive force F1 of the adhesive surface (pad side adhesive surface) of the first adhesive layer is the adhesive surface of the second adhesive layer (fixing side adhesive surface) The adhesion force F2 is 0.7 times or more (for example, more than 1.0 times). It is preferable in view of the workability in the case where the adhesive sheet is peeled off from the fixed disk together with the polishing pad after use. This method is particularly meaningful when the polishing pad fixed by the above adhesive sheet is a hard (for example, a hard amine based) polishing pad, or a large-area polishing pad or the like. In the technique disclosed herein, it is preferable that the acrylic adhesive (the fixing side adhesive) constituting the second adhesive layer and the acrylic adhesive (the pad side adhesive) constituting the first adhesive layer are both The embodiment of the adhesive S is implemented. According to the aspect in which the fixing side adhesive and the pad side adhesive are all the adhesive S, the adhesive sheet having the use of the polishing pad tends to be deformed substantially uniformly on both surfaces of the adhesive sheet. This method is preferable from the viewpoint of workability when the adhesive sheet is peeled off from the fixed disk together with the used polishing pad. In the aspect in which the fixing side adhesive and the side adhesive are all the adhesive S, the fixing side adhesive and the side adhesive may be the same composition of the adhesive S, or may be an adhesive S of different compositions. The technique disclosed herein can be preferably carried out in such a manner that the acrylic adhesive constituting the first adhesive layer and the acrylic adhesive constituting the second adhesive layer are the same composition of the adhesive S. The adhesive sheet of the above configuration tends to be deformed in the same manner on both surfaces of the adhesive sheet due to the deterioration of the adhesive sheet used with the polishing pad. This method is preferable from the viewpoint of workability when the adhesive sheet is peeled off from the fixed disk together with the used polishing pad. According to the present specification, there is provided an abrasive member comprising a polishing pad and any of the adhesive sheets disclosed herein, and an adhesive surface (pad side adhesive surface) of the first adhesive layer of the adhesive sheet is adhered to the polishing pad. According to the polishing member having the above configuration, the polishing pad can be firmly fixed to the fixing plate by adhering the bonding surface (fixing side adhesive surface) of the second adhesive layer of the adhesive sheet to the polishing device fixing plate. . The above-mentioned polishing member (the polishing pad to which the adhesive sheet is attached) can be obtained by crimping the first adhesive surface of any of the adhesive sheets disclosed herein to the polishing pad. Therefore, according to the present specification, as another aspect of the present invention, a method of manufacturing a polishing pad with an adhesive sheet comprising a first adhesive surface pressure of any of the adhesive sheets disclosed herein is provided. It is connected to a polishing pad (typically crimped at a temperature of, for example, less than 40 ° C at normal temperature).

以下,說明本發明之較佳之實施形態。再者,關於本說明書中特別提及之事項以外之對於本發明之實施必要的事項,本領域技術人員可基於本說明書中記載之關於發明之實施之教導及申請時之技術常識而理解。本發明可基於本說明書中揭示之內容及本領域中之技術常識來實施。再者,以下之附圖中,有時對實現相同作用之構件、部位附上相同之符號進行說明,有時省略或簡化重複之說明。另外,附圖中記載之實施形態為了清楚地說明本發明而進行模式化,並不準確地表示作為製品實際提供之黏著片材之尺寸或比例尺。 於本說明書中,「黏著劑」係指於室溫附近之溫度範圍內呈柔軟之固體(黏彈性體)之狀態,並且具有藉由壓力而簡單地接著於被接著體之性質之材料。於此所謂之黏著劑,如「C. A. Dahlquist,「Adhesion: Fundamental and Practice」, McLaren & Sons, (1966), 第143頁」所定義,一般而言,可為具有滿足複數拉伸彈性模數E*(1Hz)<107 達因/cm2 之性質之材料(典型而言為於25℃下具有上述性質之材料)。於此所揭示之技術中之黏著劑可理解為黏著劑組合物之固形物成分(不揮發成分)或黏著劑層之構成成分。 於本說明書中,黏著劑之「基礎聚合物」係指該黏著劑中所含之橡膠狀聚合物之主要成分。上述橡膠狀聚合物係指於室溫附近之溫度範圍內顯示橡膠彈性之聚合物。另外,於本說明書中,於未特別說明之情形時,「主要成分」係指含量超過50重量%之成分)。 於本說明書中,「丙烯酸系聚合物」係指含有源自一分子中具有至少一個(甲基)丙烯醯基之單體之單體單元作為構成該聚合物之單體單元之聚合物。以下,亦將一分子中具有至少一個(甲基)丙烯醯基之單體稱為「丙烯酸系單體」。因此,本說明書中之丙烯酸系聚合物被定義為含有源自丙烯酸系單體之單體單元之聚合物。作為丙烯酸系聚合物之典型例,可列舉該丙烯酸系聚合物之合成中使用之全部單體成分中丙烯酸系單體之比率大於50重量%之丙烯酸系聚合物。 另外,於本說明書中,「(甲基)丙烯醯基」概括地指丙烯醯基及甲基丙烯醯基。同樣地,「(甲基)丙烯酸酯」概括地指丙烯酸酯及甲基丙烯酸酯,「(甲基)丙烯酸」概括地指丙烯酸及甲基丙烯酸。 <黏著片材之應用對象> 於此所揭示之黏著片材具有於基材之兩面(第一面及第二面)上分別設置有第一黏著劑層及第二黏著劑層之雙面黏著片材之形態,其為藉由將上述第一黏著劑層之黏著面黏貼於研磨墊而構成研磨構件(附黏著片材之研磨墊)、或者用於將研磨墊固定於其他構件(典型而言為研磨裝置定盤)之黏著片材。此處,研磨墊係指研磨對象物之研磨中使用之構件,其為包括藉由於擠壓研磨對象物之同時進行相對運動而將研磨力應用於該研磨對象物之研磨墊(有時亦稱為研磨布)及支持研磨對象物之研磨墊(有時亦稱為背墊)二者之概念。於此所揭示之黏著片材可用於研磨布固定,亦可用於背墊固定。 作為於此所揭示之黏著片材之黏貼對象之研磨墊之材質,並無特別限制,例如可為:胺基甲酸酯泡沫(發泡聚胺基甲酸酯)系、聚烯烴泡沫(發泡聚烯烴)系以及其他發泡樹脂系研磨墊、或非發泡樹脂系研磨墊、不織布系研磨墊等。可為具有包含上述研磨墊之至少一層之積層構造之研磨墊。 於此所揭示之黏著片材可較佳用於胺基甲酸酯泡沫系研磨墊之固定。並無特別限制,可較佳將於此所揭示之黏著片材應用於例如密度0.3 g/cm3 ~1.2 g/cm3 (典型而言為0.4 g/cm3 ~1.0 g/cm3 )之胺基甲酸酯泡沫系研磨墊。 關於上述研磨墊之硬度(JIS K6400-2(2004)A法)並無特別限制。於此所揭示之黏著片材例如可較佳用於上述硬度為60~120 N(典型而言為70~100 N)程度之研磨墊(為胺基甲酸酯泡沫系研磨墊之情形時,亦稱為硬質胺基甲酸酯系研磨墊)之固定。再者,研磨墊可為於墊內固定有研磨粒之研磨墊。 於此所揭示之黏著片材之較佳之應用例如圖1所示。黏著片材1具備:基材15、配置於基材15之一個表面(第一面)之第一黏著劑層11、及配置於基材15之另一個表面(第二面)之第二黏著劑層12。第一黏著劑層11之黏著面(第一黏著面)11A黏貼於研磨墊30之背面30B。藉此,構成具備研磨墊30及黏貼於研磨墊30之黏著片材1之研磨構件(附黏著片材之研磨墊)90。第二黏著劑層12之黏著面(第二黏著面)12A黏貼於研磨裝置40所具備之研磨裝置定盤50之表面50A。以如此方式,經由黏著片材1將研磨墊30固定於研磨裝置定盤50。即,研磨構件90固定於研磨裝置定盤50。 使用如上所述之研磨墊30之研磨例如可藉由以下方式進行:於使旋轉軸A旋轉並且供給研磨液(未圖示)之狀態下,將研磨對象物(未圖示)擠壓至固定於研磨裝置定盤50上之研磨墊30之研磨面30A。另外,例如可藉由以下方式進行:藉由吸附等將研磨對象物(未圖示)之一個面保持於研磨墊30上,並將未圖示之研磨墊(研磨布)擠壓至該研磨對象物之另一個面。於使用特定時期後,將研磨墊30自研磨裝置定盤50上拆除(典型而言於研磨裝置定盤50與第二黏著面12A之間拆除),並更換為新的研磨墊。 <黏著片材之構造例> 於此所揭示之黏著片材(可為帶狀等長尺寸狀之形態)例如可為具有圖2所示之剖面構造之雙面黏著片材之形態。該雙面黏著片材1具備基材15及分別支持於基材15之兩面之第一黏著劑層11及第二黏著劑層12。更詳細而言,基材15之第一面15A及第二面15B(均為非剝離性)上分別設置有第一黏著劑層11及第二黏著劑層12。使用前(向被接著體上黏貼前)之雙面黏著片材1如圖2所示可為與正面21A及背面21B均為剝離面之剝離襯墊21重疊並捲繞成旋窩狀之形態。所述形態之雙面黏著片材1中,第二黏著劑層12之表面(第二黏著面12A)由剝離襯墊21之正面21A保護,第一黏著劑層11之表面(第一黏著面11A)由剝離襯墊21之背面21B保護。或者,亦可為第一黏著面11A及第二黏著面12A由兩片獨立之剝離襯墊分別保護之形態。 就提高生產性等觀點而言,於此所揭示之黏著片材較佳為具有適合於傾向於大型化之研磨墊或研磨裝置定盤之尺寸之尺寸的黏著片材。作為此種黏著片材,例如可列舉寬度為600 mm以上(典型而言為1050 mm以上)之黏著片材、黏貼於具有上述寬度之研磨墊之黏著片材。伴隨著研磨墊之大型化(寬幅化),降低研磨墊之更換頻率之要求傾向於變強,因此應用於此所揭示之技術之意義變大。黏著片材或黏貼有該黏著片材之研磨墊之寬度之上限並無特別限制,通常為3000 mm以下,典型而言為2500 mm以下。 <基材> 構成於此所揭示之黏著片材之基材並無特別限制,例如可適當選擇使用:聚乙烯(PE)膜、聚丙烯(PP)膜、乙烯-丙烯共聚物膜等聚烯烴系膜、聚對苯二甲酸乙二酯(PET)膜等聚酯膜、聚氯乙烯膜等塑膠膜;包含聚胺基甲酸酯泡沫、聚乙烯泡沫、聚氯丁二烯泡沫等發泡體之發泡體片材;由各種纖維狀物質(可為麻、棉等天然纖維、聚酯、維尼綸等合成纖維、乙酸酯纖維等半合成纖維等)單獨或混紡等而獲得之織布及不織布(為包括日本紙、道林紙(上質紙)等紙類之含義);鋁箔、銅箔等金屬箔;等。作為上述塑膠膜(典型而言指非多孔質塑膠膜,係與織布或不織布不同之概念),可使用未延伸膜及延伸(單軸延伸或雙軸延伸)膜之任意一種。可對基材實施底塗劑之塗佈、電暈放電處理等表面處理(典型而言為用以提高黏著劑對基材之錨固性之處理)。 就對研磨墊之黏貼作業性、或黏貼有黏著片材之研磨墊(附黏著片材之研磨墊,即研磨構件)之操作性等觀點考慮,可較佳採用塑膠膜作為基材。其中,作為較佳之塑膠膜,可列舉聚酯膜(典型而言為PET膜)。此處,上述研磨構件之操作性中包括例如將該研磨構件黏貼於定盤之作業性、或將使用後之研磨墊與黏著片材一起自定盤上拆除時之剝離作業性等。 基材之厚度可根據目的適當選擇,一般而言為約10 mm以上(典型而言為約25 mm以上,例如約50 mm以上)且約300 mm以下(典型而言為約250 mm以下,例如約200 mm以下)。於較佳之一態樣中,可較佳採用厚度為約50 mm以上且約100 mm以下之基材(例如塑膠膜,典型而言為PET膜)。使用此種厚度之基材之黏著片材利用該基材所具有之剛性,可成為容易黏貼於更大型之研磨墊之黏著片材。另外,黏貼有此種黏著片材之研磨墊(研磨構件)可成為即便為更大型亦具有良好之操作性之研磨構件。 <丙烯酸系黏著劑> 於此所揭示之黏著片材中,構成第一黏著劑層之黏著劑(墊側黏著劑)及構成第二黏著劑層之黏著劑(定盤側黏著劑)均為丙烯酸系黏著劑。此處,「丙烯酸系黏著劑」係指含有丙烯酸系聚合物作為基礎聚合物之黏著劑。墊側黏著劑之組成與定盤側黏著劑之組成可相同亦可不同。此處所揭示之黏著片材之典型態樣中,於該第一黏著劑層及第二黏著劑層中,至少第二黏著劑層(定盤側黏著劑層)由滿足特定條件之丙烯酸系黏著劑S構成。構成第一黏著劑層(墊側黏著劑層)之黏著劑及構成定盤側黏著劑層之黏著劑可均為黏著劑S。於該情形時,定盤側黏著劑與墊側黏著劑可為相同之黏著劑S,亦可為選自滿足黏著劑S之條件之黏著劑之不同黏著劑。 (丙烯酸系聚合物) 作為丙烯酸系聚合物,例如較佳含有(甲基)丙烯酸烷基酯作為主單體,並且可進而含有與該主單體具有共聚性之副單體之單體原料(單體成分)之聚合物。此處,主單體係指占上述單體原料中之單體組成之超過50重量%之成分。 作為(甲基)丙烯酸烷基酯,可較佳使用例如下述式(1)所表示之化合物。 CH2 =C(R1 )COOR2 (1) 此處,上述式(1)中之R1 為氫原子或甲基。另外,R2 為碳原子數1~20之烷基。以下,有時將此種碳原子數之範圍表示為「C1-20 」。就黏著劑之儲藏彈性模數等觀點考慮,較佳為R2 為C1-14 (例如C2-10 ,典型而言為C4-9 )之烷基之(甲基)丙烯酸烷基酯,更佳為R1 為氫原子且R2 為C4-9 之烷基之丙烯酸烷基酯(以下,亦簡稱為丙烯酸C4-9 烷基酯)。 作為R2 為C1-14 之烷基之(甲基)丙烯酸烷基酯,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸十四烷基酯等。該等(甲基)丙烯酸烷基酯可單獨使用一種或者組合使用兩種以上。作為較佳之(甲基)丙烯酸烷基酯,可列舉丙烯酸正丁酯(BA)及丙烯酸2-乙基己酯(2EHA)。 (甲基)丙烯酸烷基酯於用於合成丙烯酸系聚合物之全部單體成分中所占之比率較佳為約70重量%以上,更佳為約85重量%以上,進而較佳為約90重量%以上。(甲基)丙烯酸烷基酯之比率之上限並無特別限定,通常較佳為設定為約99.5重量%以下(例如約99重量%以下)。或者,丙烯酸系聚合物可為實質上僅將(甲基)丙烯酸烷基酯聚合而獲得之丙烯酸系聚合物。另外,於使用丙烯酸C4-8 烷基酯作為單體成分之情形時,該單體成分中所含之(甲基)丙烯酸烷基酯中丙烯酸C4-8 烷基酯之比率通常設定為約50重量%以上較為適當,較佳為約70重量%以上,更佳為約90重量%以上,進而較佳為約95重量%以上(典型而言為約99重量%~約100重量%)。 作為上述丙烯酸系聚合物之一較佳例,可列舉至少共聚有BA之丙烯酸系聚合物(即,全部單體成分中BA之含量大於0重量%之丙烯酸系聚合物)。含有此種BA共聚丙烯酸系聚合物作為基礎聚合物之黏著劑作為研磨墊固定用黏著劑可適當地兼顧黏著性及凝聚性。於此所揭示之技術可較佳以至少構成定盤側黏著劑層之黏著劑(黏著劑S)之基礎聚合物為BA共聚丙烯酸系聚合物之態樣實施。 上述BA共聚丙烯酸系聚合物中之BA之共聚比率例如可設定為全部單體成分之約30重量%以上,較佳為設定為約40重量%以上。就更適當地兼顧作為研磨墊固定用黏著劑之黏著性及凝聚性之觀點考慮,於較佳之一態樣中,BA共聚丙烯酸系聚合物中之BA之共聚比率可設定為全部單體成分之約50重量%以上(典型而言為約超過50重量%,例如約60重量%以上),亦可設定為約65重量%以上。另外,BA共聚丙烯酸系聚合物中之BA之共聚比率可為全部單體成分之100重量%,通常為約99.5重量%以下較為適當,較佳為約99重量%以下(典型而言為約98重量%以下,例如95重量%以下)。作為於此所揭示之技術之較佳之一態樣,可列舉至少構成定盤側黏著劑(黏著劑S)之基礎聚合物之單體成分含有約40重量%以上且約95重量%以下(例如約60重量%以上且約95重量%以下)之BA之態樣。另外,上述BA之共聚比率例如可為約60重量%以上且約90重量%以下。 作為於此所揭示之技術之另一較佳之態樣,可列舉至少構成定盤側黏著劑(黏著劑S)之基礎聚合物之單體成分含有BA及上式(1)中之R2 為C6-9 烷基之(甲基)丙烯酸烷基酯(即,(甲基)丙烯酸C6-9 烷基酯)之態樣。作為(甲基)丙烯酸C6-9 烷基酯,可較佳採用後述之玻璃轉移溫度(Tg)低於BA之(甲基)丙烯酸C6-9 烷基酯。作為此種(甲基)丙烯酸C6-9 烷基酯之具體例,可列舉2EHA及丙烯酸異壬酯。例如,較佳為上述單體成分含有BA及2EHA之組成之丙烯酸系聚合物。於所述組成之丙烯酸系聚合物中,2EHA之使用量通常設定為少於BA之量較為適當,例如,將BA與2EHA之合計量設為100重量%,其中2EHA之比率較佳為設定為約45重量%以下,典型而言為約40重量%以下,例如約35重量%以下,另外,較佳為設定為約5重量%以上,典型而言為約10重量%以上,例如約20重量%以上。 於含有BA及(甲基)丙烯酸C6-9 烷基酯之態樣中,該等之合計量於全部單體成分中所占之比率例如可設定為70重量%以上,典型而言為80重量%以上,較佳為85重量%以上,亦可為90重量%以上。另外,上述合計量於全部單體成分中所占之比率可為100重量%,典型而言為99.5重量%以下,較佳為99重量%以下,例如為98重量%以下。 於不顯著損害本發明之效果之範圍內,於此所揭示之技術中之丙烯酸系聚合物中可共聚有上述以外之單體(其他單體)。上述其他單體例如可出於調節丙烯酸系聚合物之玻璃轉移溫度(Tg)、調節黏著性能等目的而使用。例如,作為能夠提高黏著劑之凝聚力、或耐熱性之單體,可列舉含磺酸基之單體、含磷酸基之單體、含氰基之單體、乙烯基酯類、芳香族乙烯基化合物等。作為該等中之較佳例,可列舉乙烯基酯類。作為乙烯基酯類之具體例,可列舉:乙酸乙烯酯(VAc)、丙酸乙烯酯、月桂酸乙烯酯等。其中,較佳為VAc。 另外,作為能夠於丙烯酸系聚合物中引入可形成交聯基點之官能基、或者能夠有助於提高接著力之其他單體,可列舉含羥基(OH基)之單體、含羧基之單體、含酸酐基之單體、含醯胺基之單體、含胺基之單體、含醯亞胺基之單體、含環氧基之單體、(甲基)丙烯醯嗎啉、乙烯基醚類等。 作為於此所揭示之技術中之丙烯酸系聚合物之一較佳例,可列舉共聚有含羧基之單體作為上述其他單體之丙烯酸系聚合物。作為含羧基之單體,可例示:丙烯酸(AA)、甲基丙烯酸(MAA)、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、衣康酸、馬來酸、富馬酸、巴豆酸、異巴豆酸等。其中,作為較佳之含羧基之單體,可列舉AA及MAA。該等可單獨使用一種或組合使用兩種以上。 作為於此所揭示之技術中之丙烯酸系聚合物之另一較佳例,可列舉共聚有含羥基之單體作為上述其他單體之丙烯酸系聚合物。作為含羥基之單體之例,可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸4-羥基丁酯等(甲基)丙烯酸羥基烷基酯;聚丙二醇單(甲基)丙烯酸酯;N-羥基乙基(甲基)丙烯醯胺等。其中,作為較佳之含羥基之單體,可列舉烷基為碳原子數2~4之直鏈狀之(甲基)丙烯酸羥基烷基酯。作為較佳之具體例,可列舉丙烯酸2-羥基乙酯及丙烯酸4-羥基丁酯。如此共聚有含羥基之聚合物之丙烯酸系聚合物例如可較佳與後述之異氰酸酯系交聯劑組合使用。 上述「其他單體」可單獨使用一種或組合使用兩種以上。其他單體之合計含量並無特別限制。例如,可設定為全部單體成分之約40重量%以下(典型而言為約0.001重量%以上且約40重量%以下),通常更佳為設定為約30重量%以下(典型而言為約0.01重量%以上且約30重量%以下),例如可以設定為約10重量%以下(典型而言為約0.1重量%以上且約10重量%以下)。 於使用含羧基之單體作為上述其他單體之情形時,其含量並無特別限制,通常設定為全部單體成分之約0.1重量%以上(例如約0.2%重量%以上、典型而言為約0.5重量%以上、較佳為約1重量%以上)較為適當,另外,設定為約10重量%以下(例如約8重量%以下、典型而言為約5重量%以下、較佳為約4重量%以下)較為適當。於此所揭示之技術可較佳以下述態樣實施:至少構成定盤側黏著劑(黏著劑S)之基礎聚合物之單體成分含有約0.5重量%以上且約5重量%以下(更佳為約1重量%以上且約4重量%以下)之含羧基之單體。 於使用含羥基之單體作為上述其他單體之情形時,其含量並無特別限制,通常設定為全部單體成分之約0.001重量%以上(例如約0.01重量%以上、典型而言為約0.02重量%以上)較為適當,另外,設定為約10重量%以下(較佳為約5重量%以下、典型而言為約2重量%以下、例如約1重量%以下)較為適當。可將含羥基之單體之含量設定為全部單體成分之約0.5重量%以下(例如約0.2重量%以下、進而為約未達0.1重量%)。於此所揭示之技術可較佳以下述態樣實施:至少構成定盤側黏著劑(黏著劑S)之基礎聚合物之單體成分含有約0.01重量%以上且約1重量%以下(更佳為約0.02重量%以上且約0.2重量%以下)之含羥基之單體。 丙烯酸系聚合物之共聚組成以使該聚合物之玻璃轉移溫度(Tg)為約-15℃以下(典型而言為約-70℃以上且約-15℃以下)之方式進行設計較為適當,較佳為約-25℃以下(例如約-65℃以上且約-25℃以下),更佳為約-40℃以下(例如約-65℃以上且約-40℃以下)。就提高黏著劑之低溫下之黏著性、或對研磨墊之接著性之觀點考慮,較佳為將丙烯酸系聚合物之Tg調節為上述上限值以下。可藉由適當改變單體組成(即,用於該聚合物之合成之單體之種類、或使用量比)來調整丙烯酸系聚合物之Tg。 此處,丙烯酸系聚合物之Tg係指基於該聚合物之合成中使用之單體成分之組成,並利用Fox式求出之Tg。Fox式如下所示,係共聚物之Tg與將構成該共聚物之單體各自單獨聚合獲得之均聚物之玻璃轉移溫度Tgi之關係式。 1/Tg=Σ(Wi/Tgi) 再者,上述Fox式中,Tg表示共聚物之玻璃轉移溫度(單位:K),Wi表示該共聚物中之單體i之重量分率(重量基準之共聚比率),Tgi表示單體i之均聚物之玻璃轉移溫度(單位:K)。 作為Tg之計算中使用之均聚物之玻璃轉移溫度,使用公知資料中記載之值。例如,關於以下所列舉之單體,使用以下之值作為該單體之均聚物之玻璃轉移溫度。 丙烯酸2-乙基己酯         -70℃ 丙烯酸丁酯                    -55℃ 丙烯酸2-羥基乙酯         -15℃ 丙烯酸4-羥基丁酯         -40℃ 乙酸乙烯酯                    32℃ 丙烯酸                            106℃ 甲基丙烯酸                    228℃ 關於上述例示以外之單體之均聚物之玻璃轉移溫度,使用「Polymer Handbook」(聚合物手冊)(第3版,John Wiley & Sons, Inc, 1989年)中記載之數值。本文獻中記載有複數個種類之值之情形時,採用最高值。 關於上述Polymer Handbook中亦未記載其均聚物之玻璃轉移溫度之單體,使用藉由以下之測定方法獲得之值(參照日本專利申請公開2007-51271號公報)。具體而言,於具備溫度計、攪拌器、氮氣導入管及回流冷凝管之反應器中,投入100重量份單體、0.2重量份偶氮雙異丁腈及200重量份作為聚合溶劑之乙酸乙酯,一面使氮氣流通一面攪拌1小時。以此種方式將聚合體系內之氧氣除去,然後升溫至63℃並反應10小時。繼而,冷卻至室溫,獲得固形物成分濃度33重量%之均聚物溶液。繼而,將該均聚物溶液流延塗佈於剝離襯墊上並乾燥,從而製作厚度約2 mm之試驗樣品(片材狀之均聚物)。將該試驗樣品沖裁為直徑7.9 mm之圓盤狀,用平行板夾住,使用黏彈性試驗機(ARES,Rheometrics公司製造),一面施加頻率1 Hz之剪切應變,一面以5℃/分鐘之升溫速度於-70℃~150℃之溫度範圍內藉由剪切模式測定黏彈性,並將tanδ之峰頂溫度作為均聚物之Tg。 獲得丙烯酸系聚合物之方法並無特別限制,可適當採用溶液聚合法、乳液聚合法、塊狀聚合法、懸浮聚合法、光聚合法等作為丙烯酸系聚合物之合成方法而已知之各種聚合方法。例如,可較佳使用溶液聚合法。作為進行溶液聚合時之單體供給方法,可適當採用一次性供給全部單體原料之分批方式、連續供給(滴加)方式、分步供給(滴加)方式等。聚合溫度可根據使用之單體及溶劑之種類、聚合起始劑之種類等進行適當選擇,例如可設定為約20℃以上(典型而言為約40℃以上),另外,可設定為約170℃以下(典型而言為約140℃以下)。 溶液聚合中使用之溶劑(聚合溶劑)可自先前公知之有機溶劑中適當選擇。例如,可使用選自甲苯、二甲苯等芳香族化合物類(典型而言為芳香烴類);乙酸乙酯、乙酸丁酯等乙酸酯類;己烷、環己烷、甲基環己烷等脂肪族或脂環式烴類;1,2-二氯乙烷等鹵代烷烴類;異丙醇等低級醇類(例如,碳原子數1~4之一元醇類);第三丁基甲基醚等醚類;甲基乙基酮、丙酮等酮類;等中之任意一種溶劑、或兩種以上之混合溶劑。 聚合中使用之起始劑可根據聚合方法之種類自先前公知之聚合起始劑中適當選擇。例如可較佳使用2,2'-偶氮雙異丁腈(AIBN)等偶氮系聚合起始劑之一種或兩種以上。作為聚合起始劑之其他例,可列舉:過硫酸鉀等過硫酸鹽;過氧化苯甲醯、過氧化氫等過氧化物系起始劑;苯基取代乙烷等取代乙烷系起始劑;芳香族羰基化合物;等。作為聚合起始劑之其他例,可列舉:過氧化物與還原劑組合而成之氧化還原系起始劑。此種聚合起始劑可單獨使用一種或者組合使用兩種以上。聚合起始劑之使用量為通常之使用量即可,例如,相對於全部單體成分100重量份,可自約0.005重量份~約1重量份(典型而言為約0.01重量份~約1重量份)之範圍內選擇。 於此所揭示之技術中,丙烯酸系聚合物之重量平均分子量(Mw)並無特別限制,例如可為約10×104 以上且約500×104 以下。就適當地兼顧適合於研磨墊固定用途之黏著性及凝聚性之觀點考慮,丙烯酸系聚合物之Mw較佳為約20×104 以上(典型而言為約35×104 以上),另外,就塗佈性等觀點考慮,通常為約150×104 以下(典型而言為約100×104 以下、較佳為約未達70×104 、更佳為約65×104 以下、例如約60×104 以下)較為適當。此處,Mw係指利用GPC(凝膠滲透色譜法)獲得之標準聚苯乙烯換算之值。作為GPC裝置,例如可使用型號名「HLC-8320GPC」(柱:TSKgel GMH-H(S),東曹公司製造)。上述Mw可較佳應用於至少定盤側黏著劑(黏著劑S)之丙烯酸系聚合物。定盤側黏著劑之基礎聚合物及墊側黏著劑之丙烯酸系聚合物可均具有上述Mw。 (增黏樹脂) 於此所揭示之技術中之丙烯酸系黏著劑除了上述丙烯酸系聚合物(基礎聚合物)以外,可根據需要含有增黏樹脂。較佳為至少定盤側黏著劑(黏著劑S)含有增黏樹脂。定盤側黏著劑及墊側黏著劑可均含有增黏樹脂。於該情形時,定盤側黏著劑所含之增黏樹脂之種類及量與墊側黏著劑所含之增黏樹脂之種類及量可相同亦可不同。增黏樹脂之含量(於含有複數種增黏樹脂之情形時為該等之合計含量)並無特別限制。例如,相對於丙烯酸系聚合物100重量份,可設定為約3重量份以上(較佳為約5重量份以上、更佳為約9.5重量份以上、典型而言為約10重量份以上、例如約15重量份以上)。另外,增黏樹脂之含量通常相對於丙烯酸系聚合物100重量份,通常設定為約未達50重量份(典型而言為約45重量份以下、例如約43重量份以下)較為適當,較佳為設定為約40重量份以下(例如約未達40重量份),可設定為約35重量份以下。 作為增黏樹脂,可使用選自松香系樹脂、萜烯樹脂、改性萜烯樹脂、酚系樹脂、石油樹脂、苯乙烯系樹脂、香豆酮-茚樹脂、酮系樹脂等公知之各種增黏樹脂中之一種或兩種以上。 於此所謂之松香系樹脂之概念中包括松香類及松香衍生物樹脂二者。松香類樹脂之例中包括:脂松香、木松香、浮油松香等未改性松香(生松香);將該等未改性松香藉由氫化、歧化、聚合等改性而獲得之改性松香(氫化松香、歧化松香、聚合松香、其他化學修飾之松香等)。 松香衍生物樹脂典型而言為如上所述之松香類之衍生物。於此所謂之松香系樹脂之概念中包括未改性松香之衍生物及改性松香(包括氫化松香、歧化松香及聚合松香)之衍生物。 作為松香衍生物樹脂,例如可列舉:作為未改性松香與醇類之酯之未改性松香酯、作為改性松香(氫化松香、歧化松香、聚合松香等)與醇類之酯之改性松香酯等松香酯類;例如:將松香類用不飽和脂肪酸改性而獲得之不飽和脂肪酸改性松香類;例如:將松香酯類用不飽和脂肪酸改性而獲得之不飽和脂肪酸改性松香酯類;例如:對松香類或上述各種松香衍生物(包括松香酯類、不飽和脂肪酸改性松香類及不飽和脂肪酸改性松香酯類)之羧基進行還原處理而獲得之松香醇類;例如:松香類或上述各種松香衍生物之金屬鹽;將酚與松香類(未改性松香、改性松香、各種松香衍生物等)於酸催化劑下加成並進行熱聚合而獲得之松香酚樹脂;等。 萜烯樹脂之例中包括:a-蒎烯、b-蒎烯、d-檸檬烯、l-檸檬烯、雙戊烯等萜烯類(典型而言為單萜烯類)之聚合物。可為一種萜烯類之均聚物,亦可為兩種以上之萜烯類之共聚物。作為一種萜烯類之均聚物,可列舉:a-蒎烯聚合物、b-蒎烯聚合物、松油精聚合物等。 作為改性萜烯樹脂之例,可列舉將上述萜烯樹脂改性而獲得之改性萜烯樹脂。具體而言,可例示:苯乙烯改性萜烯樹脂、氫化萜烯樹脂等。 酚系樹脂之例中包括:萜烯酚樹脂、氫化萜烯酚樹脂及烷基酚樹脂。萜烯酚樹脂係包括萜烯類與酚化合物之共聚物(萜烯-酚共聚物樹脂)、與將萜烯類之均聚物或共聚物進行酚改性而獲得之樹脂(酚改性萜烯樹脂)二者之概念。氫化萜烯酚樹脂係指具有將此種萜烯酚樹脂氫化而獲得之結構之樹脂。烷基酚樹脂為由烷基酚與甲醛獲得之樹脂,可例示酚醛清漆型及可溶酚醛樹脂型。 關於於此所揭示之黏著片材,典型而言,至少定盤側黏著劑(黏著劑S)含有聚合松香系增黏樹脂。定盤側黏著劑及墊側黏著劑可均含有聚合松香系增黏樹脂。於此所謂之聚合松香系增黏樹脂之概念中包括作為未改性松香之聚合改性物之聚合松香及聚合松香衍生物。上述聚合松香衍生物之非限定性之例中包括:作為聚合松香與醇類之酯之聚合松香酯、將聚合松香用不飽和脂肪酸改性而獲得之不飽和脂肪酸改性聚合松香、將聚合松香酯用不飽和脂肪酸改性而獲得之不飽和脂肪酸改性聚合松香酯、對該等聚合松香類(包括聚合松香、聚合松香酯、不飽和脂肪酸改性聚合松香及不飽和脂肪酸改性聚合松香酯)之羧基進行還原處理而獲得之聚合松香醇類等。 於一態樣中,作為聚合松香系增黏樹脂,可較佳使用作為聚合松香與醇類之酯之聚合松香酯。作為上述醇類,例如可列舉:甲醇、乙醇等一元醇;乙二醇、二乙二醇、丙二醇等二元醇;甘油、三羥甲基乙烷、三羥甲基丙烷等三元醇;季戊四醇、二甘油等四元醇;二季戊四醇等六元醇;等。作為於此所揭示之技術中使用之聚合松香酯之一較佳例,可列舉聚合松香之季戊四醇酯。 作為於此所揭示之技術中之增黏樹脂,就適當地兼顧適合於研磨墊固定用途之黏著性及凝聚性之觀點考慮,軟化點為約60℃以上(典型而言為約80℃以上、較佳為約100℃以上、更佳為約110℃以上、例如約120℃以上)之增黏樹脂較為適當,另外,軟化點為約180℃以下(較佳為約160℃以下、更佳為約未達150℃、例如約未達140℃)之增黏樹脂較為適當。於較佳之一態樣中,可採用軟化點約未達130℃(典型而言為約100℃以上且約未達130℃、例如約120℃以上且約未達130℃)之增黏樹脂。於此所揭示之黏著片材可較佳以至少定盤側黏著劑(較佳為定盤側黏著劑及墊側黏著劑二者)含有具有上述軟化點之聚合松香系增黏樹脂(例如聚合松香酯)之態樣實施。再者,增黏樹脂之軟化點可基於JIS K2207規定之軟化點試驗方法(環球法)來測定。 於此所揭示之技術中之黏著劑S(即,至少構成定盤側黏著劑層、較佳為構成定盤側黏著劑層及墊側黏著劑層之黏著劑)相對於丙烯酸系聚合物100重量份,較佳為含有約3重量份以上之聚合松香系增黏樹脂。就獲得更高之黏著力(例如,對定盤之黏著力)之觀點考慮,相對於丙烯酸系聚合物100重量份之聚合松香系增黏樹脂之量較佳為約5重量份以上(例如7重量份以上),更佳為約9.5重量份以上(典型而言為約10重量份以上,例如約15重量份以上)。另外,就將使用後之研磨墊自定盤剝離時之作業性之觀點考慮,相對於丙烯酸系聚合物100重量份之聚合松香系增黏樹脂之量通常設定為約未達50重量份較為適當,較佳為約45重量份以下,更佳為約40重量份以下(例如約未達40重量份),可設定為約38重量份以下,可進而設定為約35重量份以下。於此所揭示之黏著片材可較佳以下述態樣實施:相對於丙烯酸系聚合物100重量份,黏著劑S含有約5重量份以上且約40重量份以下(更佳為約9.5重量份以上且約未達40重量份,例如約15重量份以上且約38重量份以下)之聚合松香系增黏樹脂。 將聚合松香系增黏樹脂之含量設定為上述範圍,就對研磨墊之接著性之觀點考慮亦可能較為有利。因此,於此所揭示之技術可較佳以下述態樣實施:定盤側黏著劑及墊側黏著劑均為黏著劑S,相對於丙烯酸系聚合物100重量份,上述黏著劑S含有上述量之聚合松香系增黏樹脂。 上述黏著劑S除了含有聚合松香系增黏樹脂以外可含有其他增黏樹脂。於該情形時,將黏著劑S中所含之全部增黏樹脂之約30重量%以上(較佳為約50重量%以上、更佳為約70重量%以上)設定為聚合松香系增黏樹脂較為適當。於此所揭示之技術可較佳以下述態樣實施:黏著劑S僅含有一種或兩種以上之(典型而言為一種)聚合松香系增黏樹脂作為增黏樹脂。 (交聯劑) 於此所揭示之技術中,用於形成黏著劑層之黏著劑組合物可根據需要含有交聯劑。即,構成黏著劑層之黏著劑可具有利用上述交聯劑進行交聯而獲得之構造。交聯劑之種類並無特別限制,可適當選擇使用先前公知之交聯劑。作為此種交聯劑,例如可列舉:異氰酸酯系交聯劑、環氧系交聯劑、噁唑啉系交聯劑、氮丙啶系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、尿素系交聯劑、金屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二亞胺系交聯劑、胺系交聯劑等。交聯劑可單獨使用一種,亦可組合使用兩種以上。交聯劑之使用量並無特別限制。例如,相對於丙烯酸系聚合物100重量份,可設定為約10重量份以下,較佳為可選自約0.001重量份以上(例如,約0.01重量份以上)、約10重量份以下(例如,約5重量份以下)之範圍內。 就適當地兼顧適合於研磨墊固定用途之黏著性及凝聚性之觀點、或對基材(特別為PET膜等塑膠膜基材)之錨固性之觀點考慮,可較佳採用異氰酸酯系交聯劑。例如,較佳為至少定盤側黏著劑(黏著劑S)為利用異氰酸酯系交聯劑進行交聯而獲得之黏著劑。 作為異氰酸酯系交聯劑,可較佳使用各種多官能異氰酸酯(係指每一分子中具有平均兩個以上異氰酸酯基之化合物,包括具有異氰脲酸酯結構之化合物)。作為多官能異氰酸酯,可使用選自一分子中具有兩個以上異氰酸酯基之各種異氰酸酯化合物(多異氰酸酯)之一種或兩種以上。作為所述多官能異氰酸酯之例,可列舉:脂肪族多異氰酸酯類、脂環族多異氰酸酯類、芳香族多異氰酸酯類等。 作為脂肪族多異氰酸酯類之具體例,可列舉:1,2-伸乙基二異氰酸酯;1,2-四亞甲基二異氰酸酯、1,3-四亞甲基二異氰酸酯、1,4-四亞甲基二異氰酸酯等四亞甲基二異氰酸酯;1,2-六亞甲基二異氰酸酯、1,3-六亞甲基二異氰酸酯、1,4-六亞甲基二異氰酸酯、1,5-六亞甲基二異氰酸酯、1,6-六亞甲基二異氰酸酯、2,5-六亞甲基二異氰酸酯等六亞甲基二異氰酸酯;2-甲基-1,5-戊二異氰酸酯、3-甲基-1,5-戊二異氰酸酯、賴胺酸二異氰酸酯等。 作為脂環族多異氰酸酯類之具體例,可列舉:異佛爾酮二異氰酸酯;1,2-環己基二異氰酸酯、1,3-環己基二異氰酸酯、1,4-環己基二異氰酸酯等環己基二異氰酸酯;1,2-環戊基二異氰酸酯、1,3-環戊基二異氰酸酯等環戊基二異氰酸酯;氫化苯二亞甲基二異氰酸酯、氫化甲苯二異氰酸酯、氫化二苯基甲烷二異氰酸酯、氫化四甲基二甲苯二異氰酸酯、4,4'-二環己基甲烷二異氰酸酯等。 作為芳香族多異氰酸酯類之具體例,可列舉:2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、2,4'-二苯基甲烷二異氰酸酯、2,2'-二苯基甲烷二異氰酸酯、4,4'-二苯醚二異氰酸酯、2-硝基聯苯-4,4'-二異氰酸酯、2,2'-二苯基丙烷-4,4'-二異氰酸酯、3,3'-二甲基二苯基甲烷-4,4'-二異氰酸酯、4,4'-二苯基丙烷二異氰酸酯、間苯二異氰酸酯、對苯二異氰酸酯、伸萘-1,4-二異氰酸酯、伸萘-1,5-二異氰酸酯、3,3'-二甲氧基聯苯-4,4'-二異氰酸酯、苯二亞甲基-1,4-二異氰酸酯、苯二亞甲基-1,3-二異氰酸酯等。 作為較佳之異氰酸酯系交聯劑,可例示每一分子平均具有三個以上異氰酸酯基之多官能異氰酸酯。所述三官能以上之異氰酸酯可為兩官能或三官能以上之異氰酸酯之多聚物(典型而言為二聚物或三聚物)、衍生物(例如,多元醇與兩分子以上之多官能異氰酸酯之加成反應產物)、聚合物等。例如可列舉:二苯基甲烷二異氰酸酯之二聚物或三聚物、六亞甲基二異氰酸酯之異氰脲酸酯形式(異氰脲酸酯結構之三聚物加成物)、三羥甲基丙烷與甲苯二異氰酸酯之反應產物、三羥甲基丙烷與六亞甲基二異氰酸酯之反應產物、多亞甲基多苯基異氰酸酯、聚醚多異氰酸酯、聚酯多異氰酸酯等多官能異氰酸酯。作為所述多官能異氰酸酯之市售品,可列舉旭化成化學公司製造之商品名「DURANATE TPA-100」、東曹公司製造之商品名「CORONATE L」、東曹公司製造之商品名「CORONATE HL」、東曹公司製造之商品名「CORONATE HK」、東曹公司製造之商品名「CORONATE HX」、東曹公司製造之商品名「CORONATE 2096」等。 於使用異氰酸酯系交聯劑之情形時,其使用量並無特別限制,例如相對於丙烯酸系聚合物100重量份可設定為約10重量份以下(較佳為約5重量份以下、例如約3重量份以下),另外,通常相對於丙烯酸系聚合物100重量份,設定為約0.01重量份以上(典型而言為約0.1重量份以上、較佳為約0.5重量份以上、更佳為約1重量份以上、例如約1.5重量份以上)較為適當。藉由於所述範圍內使用異氰酸酯系交聯劑,可實現特別性能平衡優異之研磨墊固定用黏著片材。 (其他成分) 於此所揭示之黏著劑根據需要可含有流平劑、交聯劑、交聯助劑、塑化劑、軟化劑、填充劑、著色劑(顏料、染料等)、防靜電劑、抗老化劑、紫外線吸收劑、抗氧化劑、光穩定劑等黏著劑領域中之普通之各種添加劑。關於此種各種添加劑,可利用常規方法使用先前公知之添加劑。 於較佳之一態樣中,上述黏著劑可為丙烯酸系聚合物與增黏樹脂之合計量占該黏著劑之總重量(即,由該黏著劑構成之黏著劑層之重量)之約90重量%以上(典型而言為約90重量%以上且100重量%以下)之組成。上述黏著劑中丙烯酸系聚合物與增黏樹脂之合計量可為該黏著劑之總重量之約95重量%以上(典型而言為約超過95重量%且100重量%以下、例如約97.5重量%以上且100%重量%以下)。 於較佳之一態樣中,上述黏著劑S可為丙烯酸系聚合物與聚合松香系增黏樹脂之合計量占該黏著劑S之總重量之約90重量%以上(典型而言為約90重量%以上且100重量%以下)之組成。上述黏著劑S中丙烯酸系聚合物與聚合松香系增黏樹脂之合計量可為該黏著劑S之總重量之約95%以上(典型而言為約超過95重量%且100重量%以下、例如約97.5%重量%以上且100重量%以下)。於此所揭示之黏著片材可較佳以具有由此種組成之黏著劑S構成之定盤側黏著劑層及墊側黏著劑層之形態實施。 (黏著劑層之形成) 於此所揭示之技術中,用於形成黏著劑層之黏著劑組合物之形態並無特別限制,例如可為於有機溶劑中含有上述組成之黏著劑(黏著成分)之形態(溶劑型)之黏著劑組合物、黏著劑分散於水性溶劑中之形態(水分散型,典型而言為水性乳液型)之黏著劑組合物、熱熔型黏著劑組合物等。就塗佈性及基材之選擇自由度等觀點考慮,可較佳採用溶劑型或水分散型之黏著劑組合物。就實現更高之黏著性能之觀點考慮,特別較佳為溶劑型黏著劑組合物。所述溶劑型黏著劑組合物典型而言製備成於有機溶劑中含有上述各成分之溶液形態。上述有機溶劑可自公知或慣用之有機溶劑(例如上述作為溶液聚合中使用之溶劑而例示之有機溶劑)中適當選擇。並無特別限制,通常將上述溶劑型黏著劑組合物製備成固形物成分(NV)為約30重量%以上(例如約40重量%以上)且約65重量%以下(例如約55重量%以下)較為適當。若NV過低,則製造成本容易提高,若NV過高,則有時塗佈性等操作性下降。 作為由黏著劑組合物獲得黏著片材之方法,可應用先前公知之各種方法。例如,可較佳採用將黏著劑組合物直接施加(典型而言為塗佈)於基材上並乾燥藉此形成黏著劑層之方法(直接法)。另外,亦可採用將上述黏著劑組合物施加於剝離性良好之表面(例如,剝離襯墊之表面、經脫模處理之支持基材背面等)上並乾燥藉此於該表面上形成黏著劑層、並將該黏著劑層轉印於基材上之方法(轉印法)。 黏著劑組合物之塗佈例如可使用凹版輥式塗佈機、反轉輥式塗佈機、輥式舔塗機、浸漬輥式塗佈機、刮棒塗佈機、刮刀塗佈機、噴塗機等公知或慣用之塗佈機進行。就促進交聯反應、提高製造效率等觀點考慮,較佳為於加熱下進行黏著劑組合物之乾燥。黏著劑層典型而言為連續形成,但是根據目的及用途亦可形成為點狀、條紋狀等規則或不規則之圖案。 黏著劑層之厚度並無特別限制,就發揮良好之黏著力之觀點考慮,較佳為約10 mm以上(更佳為約20 mm以上,典型而言為約30 mm以上,例如約40 mm以上)。另外,若黏著劑層之厚度過大,則具有保持力等下降之傾向。若考慮此種情況,則將黏著劑層之厚度設定為約300 mm以下(較佳為約150 mm以下,典型而言為約100 mm以下,例如約80 mm以下)較為適當。 第一黏著劑層(墊側黏著劑層)之厚度及第二黏著劑層(定盤側黏著劑層)之厚度可相同亦可不同。於較佳之一態樣中,為了使對研磨墊之黏著力成為更強之黏著力,可將第一黏著劑層之厚度設定為超過第二黏著劑層之厚度之至少0.6倍之厚度。即,可使第一黏著劑層之厚度(T1)相對於第二黏著劑層之厚度(T2)之比(T1/T2)大於0.6。上述厚度比(T1/T2)可設定為例如1.0以上(典型而言為大於1.0),較佳為1.2以上。就對墊及定盤二者良好地接著、並且避免黏著片材之厚度變得過大之觀點考慮,上述厚度之比(T1/T2)通常設定為5.0以下較為適當,較佳為設定為4.0以下(例如3.0以下)。 黏著劑層之凝膠分率並無特別限制,例如可為約1重量%以上且約60重量%以下。就更適當地兼顧作為研磨墊固定用黏著劑之黏著性及凝聚性之觀點考慮,上述凝膠分率通常較佳為約3重量%以上(更佳為約5重量%以上,典型而言為約10重量%以上,例如約20重量%以上),另外,較佳為約60重量%以下(更佳為約55重量%以下,例如約50重量%以下)。黏著劑之凝膠分率可根據例如丙烯酸系聚合物之組成或分子量、是否使用交聯劑以及其種類及使用量之選擇等進行調節。再者,凝膠分率之上限原則上為100重量%。 此處,黏著劑之凝膠分率系利用以下方式獲得:將重量W1之測定樣品包裹於四氟乙烯樹脂製多孔片中並於室溫下在乙酸乙酯中浸漬一週,然後乾燥該測定樣品並測量乙酸乙酯不溶解成分之重量W2,並將W1及W2代入下式中:凝膠分率[%]=W2/W1×100。作為上述四氟乙烯樹脂製多孔片,可使用日東電工公司製造之商品名「NITOFLON(註冊商標)NTF1122」或其等效品。 於較佳之一態樣中,可將構成第二黏著劑層之黏著劑(定盤側黏著劑)之凝膠分率G2調節為與構成第一黏著劑層之黏著劑(墊側黏著劑)之凝膠分率G1大致相等或其以上。例如,定盤側黏著劑之凝膠分率G2相對於墊側黏著劑之凝膠分率G1之比(G2/G1)可設定為0.8以上(例如0.9以上),較佳為1.0以上(典型而言為大於1.0),可為1.1以上(進而為1.2以上)。上述比(G2/G1)之上限並無特別限制,通常設定為5.0以下較為適當,較佳為設定為4.0以下(典型而言為3.0以下)。 <黏著片材之總厚度> 於此所揭示之技術中之黏著片材之總厚度(不包括剝離襯墊之黏著片材之厚度)並無特別限制。黏著片材之厚度可設定為例如約50 μm以上(典型而言為約75 μm以上,較佳為約100 μm以上,更佳為約120 μm以上),另外,可設定為例如約500 μm以下(典型而言為約450 μm以下,較佳為約400 μm以下,例如約350 μm以下)。具有上述總厚度之黏著片材可成為例如容易黏貼於更大型之研磨墊上之黏著片材。另外,於黏貼於更大型之研磨墊上使用之態樣中,可形成將研磨墊黏貼於定盤時、或將使用後之研磨墊與黏著片材一起自定盤剝離時之作業性良好之黏著片材。 <剝離襯墊> 作為於此所揭示之剝離襯墊,可使用慣用之剝離紙等,並無特別限制。例如,作為構成剝離襯墊之支持體用基材(剝離處理對象),可適當選擇使用各種樹脂膜類、紙類、布類、橡膠片材類、發泡體片材類、金屬箔、該等之複合物(例如,於紙之兩面積層有烯烴樹脂之積層構造之片材)等。剝離處理可使用公知或慣用之剝離處理劑(例如,聚矽氧系、含氟系、長鏈烷基系等剝離處理劑)利用常規方法進行。例如,可較佳採用用聚矽氧系剝離劑對於兩面積層有PE樹脂之道林紙進行處理而獲得之剝離襯墊。另外,可不對該基材之表面實施剝離處理之情況下將烯烴系樹脂(例如,PE、PP、乙烯-丙烯共聚物、PE/PP混合物)、含氟系聚合物(例如聚四氟乙烯、聚偏二氟乙烯)等低接著性基材作為剝離襯墊使用。或者,可使用對所述低接著性基材實施剝離處理後之基材。剝離襯墊之厚度就作業性等觀點考慮設定為約10 mm以上(例如約50 mm以上,典型而言為約60 mm以上)、約300 mm以下(例如約200 mm以下,典型而言為約160 mm以下)較為適當。 <黏著片材之特性> 於此所揭示之黏著片材之第二黏著劑層之黏著面(定盤側黏著面)之黏著力F2較佳為超過10 N/20 mm之值。就更牢固進行研磨墊向定盤之固定之觀點考慮,上述黏著力F2較佳為11 N/20 mm以上,更佳為12 N/20 mm以上(例如13 N/20 mm以上)。另外,就將使用後之研磨墊與黏著片材一起自定盤剝離時之作業性之觀點考慮,上述黏著力F2通常為30 N/20 mm以下較為適當,較佳為25 N/20 mm以下。對於黏著力F2而言,於23℃、50%RH之環境下,使2 kg之輥一次往返而將上述黏著面壓接於作為被接著體之不鏽鋼(SUS)板之表面,放置30分鐘,然後根據JIS Z0237,於剝離角度180度、拉伸速度300 mm/分鐘之條件下進行測定。更具體而言,按照後述之實施例中記載之方法進行測定。 於此所揭示之黏著片材之第一黏著劑層之黏著面(墊側黏著面)之低溫黏著力F1較佳為8 N/20 mm以上。低溫黏著力F1更高之黏著面對被接著體表面之密著性優異,因此一般情況下傾向於對研磨墊(例如,硬質聚胺基甲酸酯系研磨墊等胺基甲酸酯泡沫系研磨墊)顯示出更好之接著性。就所述觀點考慮,低溫黏著力F1較佳為10 N/20 mm以上,更佳為12 N/20 mm以上(例如14 N/20 mm以上)。低溫黏著力F1之上限並無特別限制,考慮到與其他黏著特性(例如保持力)之平衡,通常為30 N/20 mm以下較為適當,較佳為25 N/20 mm以下。除了將測定環境設定為-10℃以外,低溫黏著力F1以與黏著力F2之測定相同之方式進行測定。更具體而言,可按照後述之實施例中記載之方法進行測定。 於此所揭示之黏著片材可使上述低溫黏著力F1[N/20 mm]為上述黏著力F2[N/20 mm]之0.6倍以上(例如0.7倍以上)之方式構成。藉由以此種方式構成,可形成將黏著片材與研磨墊一起自定盤剝離時之作業性良好之黏著片材。例如,若與第一黏著面對研磨墊之黏著力相比,第二黏著面對定盤之黏著力過高,則將黏著片材與研磨墊一起自定盤剝離時,第一黏著面與研磨墊之間產生局部翹起,於該部分,剝離變得不穩定,可能有時於定盤上容易產生糊劑殘留。或者,即便自研磨墊之一端將該研磨墊與黏著片材一起自定盤開始剝離,亦可能有時於上述剝離操作之過程中,黏著片材自研磨墊脫離垂下而使剝離作業性降低。己有以使低溫黏著力F1大於上述黏著力F2之方式構成,藉此傾向於容易於使黏著片材之第一黏著面密著於研磨墊之狀態下將黏著片材與研磨墊一起自定盤剝離。於將被固定之研磨墊為硬質胺基甲酸酯系研磨墊、或為大面積之研磨墊之情形時,此種方式特別有意義。於此所揭示之技術之較佳之一態樣中,低溫黏著力F1[N/20 mm]相對於黏著力F2[N/20 mm]之比(F1/F2)可設定為0.8以上,更佳為1.0以上(典型而言為大於1.0、例如1.1以上),可為1.2以上。另外,低溫黏著力F1減去黏著力F2獲得之值(F1-F2)較佳為-5.0 N/20 mm以上,更佳為-3.0 N/20 mm以上,典型而言為大於1.0 N/20 mm,例如為3.0 N/20 mm以上。低溫黏著力F1及黏著力F2可根據例如黏著劑層之厚度、丙烯酸系聚合物之共聚組成(單體成分之組成或組成比)、丙烯酸系聚合物之重量平均分子量(Mw)、增黏樹脂之種類或使用量、是否使用交聯劑、使用交聯劑之情形時之交聯劑之種類或使用量、黏著劑層之凝膠分率等進行調節。 於此所揭示之黏著片材可較佳以定盤側黏著劑及墊側黏著劑均為黏著劑S之態樣實施。若使用此種黏著片材將研磨墊固定於研磨裝置定盤,則於研磨環境(例如,根據使用之研磨液之組成,酸性、鹼性、含金屬鹽、含氧化劑等之研磨液可與研磨墊固定用黏著片材接觸之環境)下,具有黏著片材之變質於該黏著片材之兩面大致同樣地進行之傾向。因此,例如如上所述以使低溫黏著力F1與黏著力F2滿足特定之關係之方式設計之黏著片材中,即便該黏著片材於研磨環境中變質,亦不易使上述F1與F2之相對關係被破壞。就容易對於各種研磨液實現將黏著片材與使用後之研磨墊一起自定盤剝離時之良好之作業性之觀點考慮,此種態樣較佳。於此所揭示之技術可較佳以下述態樣實施,例如,定盤側黏著劑及墊側黏著劑均為黏著劑S,並且相比於定盤側黏著劑層,墊側黏著劑較厚(例如,上述厚度比(T1/T2)大於1.0且為5.0以下)。 於此所揭示之黏著片材中,定盤側黏著劑與墊側黏著劑可為相同組成之黏著劑S,亦可為不同組成之黏著劑S。於較佳之一態樣中,可採用相同組成之黏著劑S作為定盤側黏著劑及墊側黏著劑。就將黏著片材與使用後之研磨墊一起自定盤剝離時之作業性之觀點考慮,此種構成之黏著片材較佳。此處,所謂定盤側黏著劑與墊側黏著劑為相同組成典型而言係指至少構成兩黏著劑之丙烯酸系聚合物之共聚組成、增黏樹脂之種類及使用量相同。於較佳之一態樣中,可設定為以下構成:兩黏著劑均含有交聯劑,並且該交聯劑之種類相同(更佳為交聯劑之使用量亦相同)。於基材之兩面具有由相同之黏著劑組合物形成之定盤側黏著劑及墊側黏著劑之黏著片材為定盤側黏著劑與墊側黏著劑為相同組成之黏著劑S之態樣之一個典型例。於此所揭示之技術例如可較佳以下述態樣實施:定盤側黏著劑及墊側黏著劑為相同組成之黏著劑S,並且相比於定盤側黏著劑層,墊側黏著劑較厚(例如,上述厚度比(T1/T2)大於1.0且為5.0以下)。 於較佳之一態樣之黏著片材中,至少定盤側黏著面(較佳為定盤側黏著面及墊側黏著面二者)具有1小時以上之保持力。根據具有上述保持力之黏著片材,傾向於能經受由研磨造成之應力從而更好地保持研磨墊於定盤上之良好之固定狀態。此處,上述保持力可利用下述保持力試驗進行評價:將黏著片材之評價對象之黏著面以寬度10 mm、長度20 mm之接著面積壓接於作為被接著體之酚樹脂板上,於40℃之環境下垂下並放置30分鐘,然後施加500 g之荷重並於相同環境下放置1小時。上述保持力試驗更具體而言可按照後述之實施例中記載之方法進行。上述保持力試驗中,更佳為施加上述荷重1小時後之黏著片材之偏移距離(mm)為6 mm以下(例如5 mm以下、典型而言為4 mm以下)之黏著片材。 <研磨構件> 於此所揭示之研磨構件(附黏著片材之研磨墊)典型而言可藉由以下方式獲得:將於此所揭示之任一黏著片材之第一黏著面壓接於研磨墊之背面。於此所揭示之黏著片材即便藉由於常溫下(例如,未加熱至約40℃或其以上之溫度)進行上述壓接,亦可適當地黏貼於上述研磨墊,從而構成於此所揭示之研磨構件。此於寬幅之(例如寬度600 mm以上、進而為1050 mm以上之)黏著片材或使用相應尺寸之研磨墊之研磨構件中特別有意義。 實施例 以下,對關於本發明之一些實施例進行說明,但無意將本發明限於實施例所示之方案。再者,以下說明中之「份」及「%」只要未特別說明,則為重量基準。 <實驗例1> (例1) 將作為單體成分之丙烯酸正丁酯(BA)70份、丙烯酸2-乙基己酯(2EHA)30份、丙烯酸(AA)3份及丙烯酸4-羥基丁酯(4HBA)0.05份、作為聚合起始劑之2,2'-偶氮雙異丁腈(AIBN)0.08份及作為聚合溶劑之甲苯150份投入具有攪拌器、溫度計、氮氣導入管、回流冷凝器及滴液漏斗之反應容器中,於65℃下進行8小時之溶液聚合從而獲得丙烯酸系聚合物P1之甲苯溶液。上述丙烯酸系聚合物P1之Mw為44×104 。 於上述丙烯酸系聚合物P1之甲苯溶液中,相對於其固形物成分100份,加入2份異氰酸酯系交聯劑(東曹公司製品,商品名「CORONATE L」),從而製備丙烯酸系黏著劑組合物A1。 準備厚度50 μm之PET膜作為基材。於該基材之第一面上塗佈黏著劑組合物A1,並進行乾燥處理,形成厚度50 mm之第一黏著劑層。於該第一黏著劑層上,貼合利用聚矽氧系剝離劑進行剝離處理之剝離襯墊(第一剝離襯墊)。繼而,另外準備與上述第一剝離襯墊相同構成之剝離襯墊(第二剝離襯墊),於該第二剝離襯墊之表面塗佈黏著劑組合物A1,並進行乾燥處理,從而形成厚度50 mm之第二黏著劑層,將該第二黏著劑層側表面積層(轉印)於上述PET膜基材之第二面(與第一面相反側之面)。以此方式製作例1之雙面黏著片材(作為基材之PET膜之兩面上具有厚度50 μm之第一黏著劑層及厚度50 μm之第二黏著劑層之黏著片材)。該黏著劑層之凝膠分率(利用上述方法獲得之測定值,下同)為52.5%。 (例2~例7) 於上述丙烯酸系聚合物P1之甲苯溶液中,相對於其固形物成分100份,加入如表1所示之量之增黏樹脂R1(荒川化學公司製造之聚合松香季戊四醇酯,商品名「Pensel D125」,軟化點125℃)及2份異氰酸酯系交聯劑(東曹公司製品,商品名「CORONATE L」),從而分別製備丙烯酸系黏著劑組合物A2~A7。除了使用黏著劑組合物A2~A7代替黏著劑組合物A1以外,以與例1相同之方式分別製作例2~例7之雙面黏著片材。黏著劑層之凝膠分率如下:例2為46.9%、例3為39.6%、例4為25.0%、例7為0.9%。 (例8) 將作為單體成分之BA 100份及AA 5份、作為聚合起始劑之過氧化苯甲醯0.2份及作為聚合溶劑之甲苯120份投入具備攪拌器、溫度計、氮氣導入管、回流冷凝器及滴液漏斗之反應容器中,於60℃下進行7小時之溶液聚合從而獲得丙烯酸系聚合物P2之甲苯溶液。上述丙烯酸系聚合物P2之Mw為55×104 。 於上述丙烯酸系聚合物P2之甲苯溶液中,相對於其固形物成分100份,加入30份增黏樹脂R1及2份異氰酸酯系交聯劑(東曹公司製品,商品名「CORONATE L」),從而製備丙烯酸系黏著劑組合物A8。除了使用黏著劑組合物A8代替黏著劑組合物A1以外,以與例1相同之方式製作例8之雙面黏著片材。黏著劑層之凝膠分率為1.6%。 (例9) 於上述丙烯酸系聚合物P1之甲苯溶液中,相對於其固形物成分100份,加入30份增黏樹脂R2(安原化學公司製造之萜烯酚樹脂,商品名「YS Polyster145」及2份異氰酸酯系交聯劑(東麗公司製品,商品名「CORONATE L」),從而製備丙烯酸系黏著劑組合物A9。除了使用黏著劑組合物A9代替黏著劑組合物A1以外,以與例1相同之方式製作例9之雙面黏著片材。黏著劑層之凝膠分率為40.0%。 (例10) 將作為基礎聚合物之天然橡膠(門尼黏度75)100份及苯乙烯-異戊二烯-苯乙烯嵌段共聚物(日本瑞翁公司製造,商品名「Quintac 3460C」)30份、增黏樹脂R3(日本瑞翁公司製造,馬來酸酐改性C5,C9樹脂,商品名「Quintone D-200」)40份、增黏樹脂R4(住友電木公司製造,苯酚改性松香,商品名「Sumilite PR12603N」)40份、酚系抗老化劑(大內新興化學工業公司製造,商品名「Noctec NS-6」)1份溶解於甲苯,然後加入3份異氰酸酯系交聯劑(東曹公司製品,商品名「CORONATE L」),從而製備橡膠系黏著劑組合物A10。除了使用黏著劑組合物A10代替黏著劑組合物A1以外,以與例1相同之方式製作例10之雙面黏著片材。 (評價) [黏著力] 將厚度25 mm之PET膜貼合於各例之雙面黏著片材之第一黏著面(第一黏著劑層之黏著面),將其切割為寬度20 mm、長度100 mm之尺寸而製作測定樣品。於23℃、50%RH之標準環境下,使上述測定樣品之第二黏著面(第二黏著劑層之黏著面)露出,使2 kg之輥一次往返而將該第二黏著面壓接於被接著體之表面。將其於相同環境下放置30分鐘,然後使用萬能拉伸壓縮試驗機(裝置名「拉伸壓縮試驗機TCM-1kNB」,美蓓亞公司製造),根據JIS Z0237,於剝離角度180度、拉伸速度300 mm/分鐘之條件下測定剝離強度。使用不鏽鋼板(SUS304板)作為被接著體。測定進行三次,並記錄其平均值。結果如表1所示。 [低溫黏著力] 上述黏著力測定中,將黏著片材壓接於被接著體之環境、壓接後進行保持之環境及進行剝離強度測定之環境均由上述標準環境變更為-10℃之環境。以其他方面與上述黏著力測定相同之方式測定低溫黏著力。結果如表1所示。 [剪切接著力] 將各例之雙面黏著片材切割為20 mm×20 mm之尺寸而製作測定樣品。於23℃、50%RH之環境下,將上述測定樣品之第一黏著面(第一黏著劑層之黏著面)與第二黏著面(第二黏著劑層之黏著面)各自積層於不鏽鋼板(SUS304BA板,30 mm×100 mm×0.4 mm厚)上,使5 kg之輥一次往返而進行壓接。將其於23℃、50%RH之標準環境下放置1小時,然後使用萬能拉伸壓縮試驗機(裝置名「拉伸壓縮試驗機TCM-1kNB」,美蓓亞公司製造),於拉伸速度50 mm/分鐘、剝離角度0度之條件下進行剝離,記錄此時之最大強度作為剪切接著力(N)。具體而言如圖3所示,將測定樣品100之第一黏著面100A及第二黏著面100B貼合於不鏽鋼板201、202上,並於上述條件下進行壓接。將其於上述溫度氛圍下放置1小時,然後以上述速度沿圖3中之箭頭方向(即剪切方向)拉伸不鏽鋼板201、202,測定20 mm×20 mm(400 mm2 )之黏貼面積下之剝離強度(N)。測定進行三次,並記錄其平均值。結果如表1所示。 [保持力] 將厚度25 mm之PET膜貼合於各例之雙面黏著片材之第一黏著面(第一黏著劑層之黏著面),然後將其切割為寬度10 mm,從而由各例之黏著片材分別製作3個試驗片。使2 kg之輥一次往返而將該等試樣片之第二黏著面以寬度10 mm、長度20 mm之接著面積壓接於作為被接著體之酚樹脂板上。將該酚樹脂板於40℃之環境下垂下並放置30分鐘,然後對試樣片之自由端施加500 g之荷重。根據JIS Z0237,於施加有該荷重之狀態下於40℃之環境下放置1小時。經過1小時後,3個試驗片中即便一個試樣片落下之情形亦判定為保持時間未達1小時(表1中表示為「落下」)。除此以外之情形時,對3個試驗片測定各個自最初之黏貼位置起之試驗片之偏移距離(mm),並求出該等之算術平均值。結果如表1所示。   [表1] 表1 如表1所示,於定盤側黏著劑及墊側黏著劑均為丙烯酸系黏著劑之例1~例9中,利用雙面具有含有適當之量之聚合松香系增黏樹脂之黏著劑層之例2~5及例8之黏著片材,獲得作為定盤側黏著劑適當之黏著力。該等黏著片材顯示出比例6、7、9、10之黏著片材更高之低溫黏著力,因此認為其對研磨墊顯示出更良好之接著性。 <實驗例2> (例11) 準備厚度50 μm之PET膜作為基材。於該基材之第一面塗佈黏著劑組合物A4,並進行乾燥處理,形成厚度60 μm之第一黏著劑層(墊側黏著劑層)。於該第一黏著劑層上,貼合利用聚矽氧系剝離劑進行剝離處理之剝離襯墊(第一剝離襯墊)。繼而,另外準備與上述第一剝離襯墊相同構成之剝離襯墊(第二剝離襯墊),於該第二剝離襯墊之表面塗佈黏著劑組合物A4,並進行乾燥處理,從而形成厚度40 μm之第二黏著劑層(定盤側黏著劑層),將該第二黏著劑層側表面積層(轉印)於上述PET膜基材之第二面(與第一面相反側之面)。以此種方式製作例11之雙面黏著片材。 (例12~例18) 作為用於形成墊側黏著劑層及定盤側黏著劑層之黏著劑組合物,分別使用如表2所示之黏著劑組合物。以其他方面與例11相同之方式分別製作例12~例18之雙面黏著片材。 (評價) [低溫黏著力(F1)] 將厚度25 μm之PET膜貼合於各例之雙面黏著片材之第二黏著面,並切割為寬度20 mm、長度100 mm之尺寸而製作測定樣品。於-10℃之環境下,使上述測定樣品之第一黏著面(墊側黏著劑層之表面)露出,使2 kg之輥一次往返而將該第一黏著面壓接於被接著體之表面。將其於相同環境下放置30分鐘,然後使用萬能拉伸壓縮試驗機(裝置名「拉伸壓縮試驗機,TCM-1kNB」,美蓓亞公司製造),根據JIS Z0237,於剝離角度180度、拉伸速度300 mm/分鐘之條件下測定剝離強度。使用不鏽鋼板(SUS304板)作為被接著體。進行測定三次,並記錄其平均值。結果如表2所示。 [黏著力(F2)] 將厚度25 μm之PET膜貼合於各例之雙面黏著片材之第一黏著面,並切割為寬度20 mm、長度100 mm之尺寸而製作測定樣品。於23℃、50%RH之標準環境下,使上述測定樣品之第二黏著面(定盤側黏著劑層之表面)露出,使2 kg之輥一次往返而將該第二黏著面壓接於被接著體之表面。將其於相同環境下放置30分鐘,然後使用萬能拉伸壓縮試驗機(裝置名「拉伸壓縮試驗機TCM-1kNB」,美蓓亞公司製造),根據JIS Z0237,於剝離角度180度、拉伸速度300 mm/分鐘之條件下測定剝離強度。使用不鏽鋼板(SUS304板)作為被接著體。進行測定三次,並記錄其平均值。結果如表2所示。 [表2] 表2 如表2所示,例11~例14之黏著片材顯示出作為定盤側黏著劑適合之黏著力F2,低溫黏著力F1亦良好。另外,該等黏著片材之低溫黏著力F1為黏著力F2之0.7倍以上,因此認為將使用該黏著片材固定之研磨墊與上述黏著片材一起自定盤剝離時顯示良好之作業性。另一方面,例15~例18之黏著片材為定盤側或研磨墊側之黏著力較低、或者定盤側與研磨墊側之黏著力欠缺平衡之黏著片材。 以上,對本發明之具體例進行詳細說明,但該等僅為例示,不限定申請專利範圍。申請專利範圍記載之技術中包括對以上例示之具體例進行各種變形、變更而獲得之技術方案。Hereinafter, preferred embodiments of the present invention will be described. Further, those matters necessary for the implementation of the present invention other than those specifically mentioned in the present specification can be understood by those skilled in the art based on the teachings of the invention and the technical common sense at the time of application. The present invention can be implemented based on the contents disclosed in the present specification and common technical knowledge in the art. In the following drawings, members and portions that perform the same functions are denoted by the same reference numerals, and overlapping descriptions may be omitted or simplified. Further, the embodiments described in the drawings are modeled to clearly illustrate the present invention, and do not accurately represent the size or scale of the adhesive sheet actually provided as a product. In the present specification, "adhesive" means a state of being a soft solid (viscose elastomer) in a temperature range around room temperature, and having a property of simply adhering to the properties of the adherend by pressure. The so-called adhesives, as defined in "CA Dahlquist, "Adhesion: Fundamental and Practice", McLaren & Sons, (1966), p. 143", in general, can have a complex tensile modulus E *(1Hz)<10 7 Dyne/cm 2 A material of a nature (typically a material having the above properties at 25 ° C). The adhesive in the art disclosed herein can be understood as a constituent of a solid component (nonvolatile component) or an adhesive layer of the adhesive composition. In the present specification, the "base polymer" of the adhesive means the main component of the rubbery polymer contained in the adhesive. The above rubbery polymer means a polymer exhibiting rubber elasticity in a temperature range around room temperature. In the present specification, the term "main component" means a component having a content of more than 50% by weight, unless otherwise specified. In the present specification, the "acrylic polymer" refers to a monomer containing a monomer unit derived from a monomer having at least one (meth)acryl fluorenyl group in one molecule as a monomer unit constituting the polymer. Hereinafter, a monomer having at least one (meth) acrylonitrile group in one molecule is also referred to as an "acrylic monomer". Therefore, the acrylic polymer in the present specification is defined as a polymer containing a monomer unit derived from an acrylic monomer. A typical example of the acrylic polymer is an acrylic polymer in which the ratio of the acrylic monomer in all the monomer components used in the synthesis of the acrylic polymer is more than 50% by weight. In addition, in the present specification, "(meth)acryl fluorenyl group" generally refers to an acryloyl group and a methacryl fluorenyl group. Similarly, "(meth)acrylate" generally refers to acrylate and methacrylate, and "(meth)acrylic" generally refers to acrylic acid and methacrylic acid. <Application of Adhesive Sheet> The adhesive sheet disclosed herein has a double-sided adhesive layer on which the first adhesive layer and the second adhesive layer are respectively disposed on both sides (the first side and the second side) of the substrate. a form of a sheet which is formed by adhering an adhesive surface of the first adhesive layer to a polishing pad to form an abrasive member (a polishing pad to which an adhesive sheet is attached) or for fixing the polishing pad to another member (typically Adhesive sheet for the grinding device. Here, the polishing pad refers to a member used for polishing the object to be polished, and is a polishing pad including a polishing force applied to the object to be polished by relative movement while pressing the object to be polished (sometimes also called It is the concept of both a polishing cloth and a polishing pad (sometimes called a back pad) that supports the object to be polished. The adhesive sheet disclosed herein can be used for fixing the polishing cloth or for fixing the back pad. The material of the polishing pad as the object to be adhered to the adhesive sheet disclosed herein is not particularly limited, and may be, for example, a urethane foam (foamed polyurethane) system or a polyolefin foam. Foamed polyolefin) and other foamed resin-based polishing pads, non-foamed resin-based polishing pads, non-woven fabric-based polishing pads, and the like. It may be a polishing pad having a laminate structure comprising at least one layer of the above polishing pad. The adhesive sheet disclosed herein can be preferably used for the fixing of a urethane foam-based polishing pad. There is no particular limitation, and the adhesive sheet disclosed herein can be preferably applied to, for example, a density of 0.3 g/cm. 3 ~1.2 g/cm 3 (typically 0.4 g/cm 3 ~1.0 g/cm 3 The urethane foam is a polishing pad. The hardness of the above polishing pad (JIS K6400-2 (2004) A method) is not particularly limited. The adhesive sheet disclosed herein can be preferably used, for example, in the case of the above-mentioned polishing pad having a hardness of 60 to 120 N (typically 70 to 100 N) (in the case of a urethane foam-based polishing pad). Also known as the fixation of a hard amine based polishing pad. Furthermore, the polishing pad may be a polishing pad in which abrasive grains are fixed in the pad. A preferred application of the adhesive sheet disclosed herein is shown in FIG. The adhesive sheet 1 includes a substrate 15 , a first adhesive layer 11 disposed on one surface (first surface) of the substrate 15 , and a second adhesive disposed on the other surface (second surface) of the substrate 15 . Agent layer 12. The adhesive surface (first adhesive surface) 11A of the first adhesive layer 11 is adhered to the back surface 30B of the polishing pad 30. Thereby, the polishing member (the polishing pad with the adhesive sheet) 90 including the polishing pad 30 and the adhesive sheet 1 adhered to the polishing pad 30 is formed. The adhesive surface (second adhesive surface) 12A of the second adhesive layer 12 is adhered to the surface 50A of the polishing apparatus fixing plate 50 provided in the polishing apparatus 40. In this manner, the polishing pad 30 is fixed to the polishing apparatus fixing plate 50 via the adhesive sheet 1. That is, the polishing member 90 is fixed to the polishing apparatus fixing plate 50. The polishing using the polishing pad 30 as described above can be performed, for example, by squeezing the object to be polished (not shown) to the fixed state while rotating the rotating shaft A and supplying the polishing liquid (not shown). The polishing surface 30A of the polishing pad 30 on the polishing apparatus fixing plate 50. Further, for example, it is possible to hold one surface of an object to be polished (not shown) on the polishing pad 30 by suction or the like, and press a polishing pad (abrasive cloth) (not shown) to the polishing. The other side of the object. After a particular period of use, the polishing pad 30 is removed from the polishing apparatus plate 50 (typically removed between the polishing device plate 50 and the second bonding surface 12A) and replaced with a new one. <Example of Structure of Adhesive Sheet> The adhesive sheet (which may be in the form of a strip-like dimension) disclosed herein may be, for example, a form of a double-sided adhesive sheet having a cross-sectional structure as shown in Fig. 2 . The double-sided adhesive sheet 1 includes a base material 15 and a first adhesive layer 11 and a second adhesive layer 12 which are respectively supported on both surfaces of the base material 15. More specifically, the first adhesive layer 11 and the second adhesive layer 12 are provided on the first surface 15A and the second surface 15B of the substrate 15 (both non-releasable). As shown in FIG. 2, the double-sided adhesive sheet 1 before use (before being adhered to the adherend) may be a form in which the release liner 21 which is a peeling surface on both the front surface 21A and the back surface 21B overlaps and is wound into a spiral shape. . In the double-sided adhesive sheet 1 of the above form, the surface (second adhesive surface 12A) of the second adhesive layer 12 is protected by the front surface 21A of the release liner 21, and the surface of the first adhesive layer 11 (first adhesive surface) 11A) is protected by the back surface 21B of the release liner 21. Alternatively, the first adhesive surface 11A and the second adhesive surface 12A may be separately protected by two separate release liners. From the viewpoint of improving productivity, the adhesive sheet disclosed herein is preferably an adhesive sheet having a size suitable for a size of a polishing pad or a polishing device having a large size. Examples of such an adhesive sheet include an adhesive sheet having a width of 600 mm or more (typically 1050 mm or more) and an adhesive sheet adhered to a polishing pad having the above width. With the increase in the size (width) of the polishing pad, the requirement to reduce the frequency of replacement of the polishing pad tends to become stronger, so that the significance of the technique disclosed herein becomes large. The upper limit of the width of the adhesive sheet or the polishing pad to which the adhesive sheet is adhered is not particularly limited, and is usually 3,000 mm or less, and typically 2,500 mm or less. <Substrate> The substrate constituting the adhesive sheet disclosed herein is not particularly limited, and for example, a polyolefin such as a polyethylene (PE) film, a polypropylene (PP) film or an ethylene-propylene copolymer film can be appropriately selected and used. A plastic film such as a polyester film such as a film or a polyethylene terephthalate (PET) film or a polyvinyl chloride film; and foaming such as polyurethane foam, polyethylene foam, and polychloroprene foam. a foam sheet obtained from a variety of fibrous materials (may be natural fibers such as hemp, cotton, polyester, synthetic fibers such as vinylon, semi-synthetic fibers such as acetate fibers, etc.) obtained separately or blended. Cloth and non-woven fabric (for the meaning of paper such as Japanese paper, Daolin paper (upper paper)); metal foil such as aluminum foil and copper foil; As the plastic film (generally, a non-porous plastic film which is different from the concept of woven or non-woven fabric), any of an unstretched film and an extended (uniaxially stretched or biaxially stretched) film can be used. The substrate may be subjected to a surface treatment such as coating of a primer, corona discharge treatment or the like (typically for improving the anchoring property of the adhesive to the substrate). A plastic film can be preferably used as the substrate from the viewpoints of the workability of the polishing pad or the operability of the polishing pad to which the adhesive sheet is adhered (the polishing pad to which the sheet is attached), that is, the polishing member. Among them, as a preferred plastic film, a polyester film (typically a PET film) can be cited. Here, the operability of the polishing member includes, for example, workability of adhering the polishing member to the fixing plate, or peeling workability when the polishing pad after use is removed from the fixing plate together with the adhesive sheet. The thickness of the substrate may be appropriately selected depending on the purpose, and is generally about 10 mm or more (typically about 25 mm or more, for example, about 50 mm or more) and about 300 mm or less (typically about 250 mm or less, for example, About 200 mm or less). In a preferred embodiment, a substrate having a thickness of about 50 mm or more and about 100 mm or less (for example, a plastic film, typically a PET film) can be preferably used. The adhesive sheet using the substrate of such a thickness can be an adhesive sheet which is easily adhered to a larger polishing pad by utilizing the rigidity of the substrate. Further, the polishing pad (abrasive member) to which such an adhesive sheet is adhered can be an abrasive member which has good handleability even when it is larger. <Acrylic Adhesive> In the adhesive sheet disclosed herein, the adhesive constituting the first adhesive layer (the pad side adhesive) and the adhesive constituting the second adhesive layer (the fixing side adhesive) are both Acrylic adhesive. Here, the "acrylic adhesive" means an adhesive containing an acrylic polymer as a base polymer. The composition of the pad side adhesive may be the same as or different from the composition of the fixing side adhesive. In a typical aspect of the adhesive sheet disclosed herein, at least the second adhesive layer (the fixing side adhesive layer) is made of an acrylic adhesive which satisfies specific conditions in the first adhesive layer and the second adhesive layer. Composition S. The adhesive constituting the first adhesive layer (the pad side adhesive layer) and the adhesive constituting the fixing side adhesive layer may all be the adhesive S. In this case, the fixing side adhesive and the pad side adhesive may be the same adhesive S, or may be different adhesives selected from the adhesives satisfying the conditions of the adhesive S. (Acrylic polymer) The acrylic polymer preferably contains, for example, an alkyl (meth)acrylate as a main monomer, and further contains a monomer raw material of a sub-monomer having copolymerization property with the main monomer ( Polymer of monomer component). Here, the main single system means a component which accounts for more than 50% by weight of the monomer composition in the above monomer raw material. As the alkyl (meth)acrylate, for example, a compound represented by the following formula (1) can be preferably used. CH 2 =C(R 1 )COOR 2 (1) Here, R in the above formula (1) 1 It is a hydrogen atom or a methyl group. In addition, R 2 It is an alkyl group having 1 to 20 carbon atoms. Hereinafter, the range of such a carbon number is sometimes expressed as "C" 1-20 "." From the viewpoint of the storage elastic modulus of the adhesive, etc., it is preferably R 2 For C 1-14 (eg C 2-10 , typically C 4-9 An alkyl (meth) acrylate, more preferably R 1 Is a hydrogen atom and R 2 For C 4-9 Alkyl acrylate (hereinafter also referred to as acrylic acid C) 4-9 Alkyl ester). As R 2 For C 1-14 Examples of the alkyl (meth) acrylate having an alkyl group include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and isopropyl (meth)acrylate. N-butyl (meth)acrylate, amyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (meth)acrylic acid Octyl ester, isooctyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, (methyl) Lauryl acrylate, tetradecyl (meth) acrylate, and the like. These alkyl (meth)acrylates may be used alone or in combination of two or more. Preferred examples of the alkyl (meth)acrylate include n-butyl acrylate (BA) and 2-ethylhexyl acrylate (2EHA). The ratio of the alkyl (meth)acrylate to all the monomer components used for the synthesis of the acrylic polymer is preferably about 70% by weight or more, more preferably about 85% by weight or more, still more preferably about 90%. More than weight%. The upper limit of the ratio of the alkyl (meth)acrylate is not particularly limited, but is usually preferably set to be about 99.5% by weight or less (for example, about 99% by weight or less). Alternatively, the acrylic polymer may be an acrylic polymer obtained by substantially polymerizing only an alkyl (meth)acrylate. In addition, in the use of acrylic acid C 4-8 In the case where an alkyl ester is used as a monomer component, acrylic acid C in an alkyl (meth)acrylate contained in the monomer component 4-8 The ratio of the alkyl ester is usually set to about 50% by weight or more, preferably about 70% by weight or more, more preferably about 90% by weight or more, still more preferably about 95% by weight or more (typically about 99%). Weight% to about 100% by weight). A preferred example of the acrylic polymer is an acrylic polymer having at least BA copolymerized therein (that is, an acrylic polymer having a BA content of more than 0% by weight in all monomer components). An adhesive containing such a BA copolymer acrylic polymer as a base polymer can be suitably used as an adhesive for polishing pad adhesion in combination with adhesion and cohesiveness. The technique disclosed herein can be preferably carried out in such a manner that at least the base polymer constituting the adhesive of the fixing side adhesive layer (adhesive S) is a BA copolymer acrylic polymer. The copolymerization ratio of BA in the above-mentioned BA copolymer acrylic polymer can be set to, for example, about 30% by weight or more of all the monomer components, and is preferably set to about 40% by weight or more. In view of the adhesion and cohesiveness of the adhesive for fixing the polishing pad, the copolymerization ratio of BA in the BA copolymer acrylic polymer can be set to all the monomer components. About 50% by weight or more (typically about 50% by weight, for example, about 60% by weight or more) may be set to about 65% by weight or more. Further, the copolymerization ratio of BA in the BA copolymer acrylic polymer may be 100% by weight of the total monomer component, usually about 99.5% by weight or less, preferably about 99% by weight or less (typically about 98%). Weight% or less, for example, 95% by weight or less). As a preferred aspect of the technology disclosed herein, the monomer component of at least the base polymer constituting the fixing side adhesive (adhesive S) is contained in an amount of about 40% by weight or more and about 95% by weight or less (for example, A state of BA of about 60% by weight or more and about 95% by weight or less. Further, the copolymerization ratio of the above BA may be, for example, about 60% by weight or more and about 90% by weight or less. As another preferred aspect of the technology disclosed herein, the monomer component of at least the base polymer constituting the fixing side adhesive (adhesive S) contains BA and R in the above formula (1). 2 For C 6-9 Alkyl alkyl (meth)acrylate (ie, (meth)acrylic acid C 6-9 The aspect of the alkyl ester). As (meth)acrylic acid C 6-9 As the alkyl ester, it is preferred to use a (meth)acrylic acid C having a glass transition temperature (Tg) lower than that of BA described later. 6-9 Alkyl ester. As such (meth)acrylic acid C 6-9 Specific examples of the alkyl esters include 2EHA and isodecyl acrylate. For example, an acrylic polymer containing a composition of BA and 2EHA as the monomer component is preferred. In the acrylic polymer of the composition, the amount of 2EHA used is usually set to be less than the amount of BA. For example, the total amount of BA and 2EHA is set to 100% by weight, and the ratio of 2EHA is preferably set to It is about 45% by weight or less, typically about 40% by weight or less, for example, about 35% by weight or less, and more preferably about 5% by weight or more, and typically about 10% by weight or more, for example, about 20% by weight. %the above. Contains BA and (meth)acrylic acid C 6-9 In the aspect of the alkyl ester, the ratio of the total amount of the monomer components may be, for example, 70% by weight or more, and typically 80% by weight or more, preferably 85% by weight or more. It can be 90% by weight or more. Further, the ratio of the total amount to the total monomer components may be 100% by weight, typically 99.5% by weight or less, preferably 99% by weight or less, and for example, 98% by weight or less. The monomer (other monomer) other than the above may be copolymerized in the acrylic polymer in the technology disclosed herein without significantly impairing the effects of the present invention. The above other monomer can be used, for example, for the purpose of adjusting the glass transition temperature (Tg) of the acrylic polymer, adjusting the adhesion property, and the like. For example, examples of the monomer capable of improving the cohesive force or heat resistance of the adhesive include a sulfonic acid group-containing monomer, a phosphate group-containing monomer, a cyano group-containing monomer, a vinyl ester, and an aromatic vinyl group. Compounds, etc. Preferred examples of these include vinyl esters. Specific examples of the vinyl esters include vinyl acetate (VAc), vinyl propionate, and vinyl laurate. Among them, VAc is preferred. Further, as a functional group capable of introducing a functional group capable of forming a crosslinking group into an acrylic polymer or capable of contributing to an increase in adhesion, a monomer having a hydroxyl group (OH group) and a monomer having a carboxyl group may be mentioned. , an acid anhydride group-containing monomer, a guanamine group-containing monomer, an amine group-containing monomer, a ruthenium group-containing monomer, an epoxy group-containing monomer, (meth) propylene morpholine, ethylene Ethers and the like. As a preferable example of one of the acrylic polymers in the technology disclosed herein, an acrylic polymer in which a carboxyl group-containing monomer is copolymerized as the other monomer may be mentioned. As the carboxyl group-containing monomer, acrylic acid (AA), methacrylic acid (MAA), carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, and fumar can be exemplified. Acid, crotonic acid, isocrotonic acid, etc. Among them, preferred examples of the carboxyl group-containing monomer include AA and MAA. These may be used alone or in combination of two or more. As another preferable example of the acrylic polymer in the technology disclosed herein, an acrylic polymer in which a hydroxyl group-containing monomer is copolymerized as the other monomer may be mentioned. Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, and (meth)acrylic acid. Hydroxyalkyl (meth)acrylate such as 2-hydroxybutyl ester or 4-hydroxybutyl (meth)acrylate; polypropylene glycol mono(meth)acrylate; N-hydroxyethyl(meth)acrylamide . Among them, a preferred hydroxyl group-containing monomer is a linear hydroxyalkyl (meth)acrylate having an alkyl group of 2 to 4 carbon atoms. Preferable specific examples include 2-hydroxyethyl acrylate and 4-hydroxybutyl acrylate. The acrylic polymer to which the hydroxyl group-containing polymer is copolymerized in this manner is preferably used in combination with an isocyanate crosslinking agent to be described later. The above "other monomers" may be used alone or in combination of two or more. The total content of the other monomers is not particularly limited. For example, it may be set to about 40% by weight or less (typically about 0.001% by weight or more and about 40% by weight or less) of all the monomer components, and more preferably set to about 30% by weight or less (typically about 0.01% by weight or more and about 30% by weight or less) may be, for example, about 10% by weight or less (typically about 0.1% by weight or more and about 10% by weight or less). When a monomer having a carboxyl group is used as the other monomer, the content thereof is not particularly limited, and is usually set to be about 0.1% by weight or more based on the entire monomer component (for example, about 0.2% by weight or more, and typically about 0.5% by weight or more, preferably about 1% by weight or more, more preferably, it is set to about 10% by weight or less (for example, about 8% by weight or less, typically about 5% by weight or less, preferably about 4% by weight). % below) is more appropriate. The technique disclosed herein can be preferably carried out in such a manner that at least the monomer component of the base polymer constituting the fixing side adhesive (adhesive S) contains about 0.5% by weight or more and about 5% by weight or less (more preferably It is a carboxyl group-containing monomer of about 1% by weight or more and about 4% by weight or less. In the case where a hydroxyl group-containing monomer is used as the other monomer, the content thereof is not particularly limited, and is usually set to about 0.001% by weight or more based on the entire monomer component (for example, about 0.01% by weight or more, and typically about 0.02). More preferably, it is more than 10% by weight or less (preferably about 5% by weight or less, typically about 2% by weight or less, for example, about 1% by weight or less). The content of the hydroxyl group-containing monomer can be set to about 0.5% by weight or less of the total monomer component (for example, about 0.2% by weight or less, and further about 0.1% by weight or less). The technique disclosed herein can be preferably carried out in such a manner that at least the monomer component of the base polymer constituting the fixing side adhesive (adhesive S) contains about 0.01% by weight or more and about 1% by weight or less (more preferably It is a hydroxyl group-containing monomer of about 0.02% by weight or more and about 0.2% by weight or less. The copolymerization composition of the acrylic polymer is suitably designed such that the glass transition temperature (Tg) of the polymer is about -15 ° C or less (typically about -70 ° C or more and about -15 ° C or less). It is preferably about -25 ° C or less (for example, about -65 ° C or more and about -25 ° C or less), more preferably about -40 ° C or less (for example, about -65 ° C or more and about -40 ° C or less). From the viewpoint of improving the adhesiveness at low temperature of the adhesive or the adhesion to the polishing pad, it is preferred to adjust the Tg of the acrylic polymer to be equal to or less than the above upper limit. The Tg of the acrylic polymer can be adjusted by appropriately changing the monomer composition (i.e., the kind of the monomer used for the synthesis of the polymer, or the amount ratio used). Here, the Tg of the acrylic polymer refers to the Tg obtained by the Fox equation based on the composition of the monomer component used in the synthesis of the polymer. The Fox formula is as follows, and is a relationship between the Tg of the copolymer and the glass transition temperature Tgi of the homopolymer obtained by separately polymerizing the monomers constituting the copolymer. 1/Tg=Σ(Wi/Tgi) Further, in the above Fox formula, Tg represents the glass transition temperature (unit: K) of the copolymer, and Wi represents the weight fraction of the monomer i in the copolymer (weight basis) Copolymerization ratio), Tgi represents the glass transition temperature (unit: K) of the homopolymer of monomer i. As the glass transition temperature of the homopolymer used in the calculation of Tg, the values described in the publicly known materials are used. For example, regarding the monomers listed below, the following values are used as the glass transition temperature of the homopolymer of the monomer. 2-ethylhexyl acrylate-70°C butyl acrylate-55°C 2-hydroxyethyl acrylate-15°C 4-hydroxybutyl acrylate-40°C Vinyl acetate 32°C Acrylic acid 106°C Methacrylic acid 228°C About the above example The glass transition temperature of the homopolymer of the monomer other than the monomer is the value described in "Polymer Handbook" (3rd edition, John Wiley & Sons, Inc, 1989). When a plurality of types of values are described in this document, the highest value is employed. In the above-mentioned Polymer Handbook, the monomer having a glass transition temperature of the homopolymer is not described, and the value obtained by the following measurement method is used (refer to Japanese Patent Laid-Open Publication No. 2007-51271). Specifically, 100 parts by weight of a monomer, 0.2 part by weight of azobisisobutyronitrile, and 200 parts by weight of ethyl acetate as a polymerization solvent are charged into a reactor equipped with a thermometer, a stirrer, a nitrogen gas introduction tube, and a reflux condenser. While stirring the nitrogen gas, it was stirred for 1 hour. The oxygen in the polymerization system was removed in this manner, and then the temperature was raised to 63 ° C and reacted for 10 hours. Then, the mixture was cooled to room temperature to obtain a homopolymer solution having a solid content concentration of 33% by weight. Then, the homopolymer solution was cast-coated on a release liner and dried to prepare a test sample (a sheet-like homopolymer) having a thickness of about 2 mm. The test sample was punched out into a disk shape of 7.9 mm in diameter, sandwiched by a parallel plate, and subjected to a shear strain of 1 Hz on one side using a viscoelasticity tester (ARES, manufactured by Rheometrics Co., Ltd.), and 5 ° C / minute on one side. The heating rate was measured in a shearing mode in a temperature range of -70 ° C to 150 ° C, and the peak top temperature of tan δ was taken as the Tg of the homopolymer. The method for obtaining the acrylic polymer is not particularly limited, and various polymerization methods known as a method for synthesizing an acrylic polymer can be suitably employed, such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a suspension polymerization method, or a photopolymerization method. For example, a solution polymerization method can be preferably used. As a monomer supply method at the time of solution polymerization, a batch method, a continuous supply (drop) method, a stepwise supply (drop) method, and the like for supplying all of the monomer raw materials at one time can be suitably employed. The polymerization temperature can be appropriately selected depending on the type of the monomer and solvent to be used, the type of the polymerization initiator, and the like, and can be, for example, about 20 ° C or higher (typically about 40 ° C or higher), and can be set to about 170. Below °C (typically below about 140 °C). The solvent (polymerization solvent) used in the solution polymerization can be appropriately selected from previously known organic solvents. For example, an aromatic compound selected from toluene and xylene (typically an aromatic hydrocarbon); an acetate such as ethyl acetate or butyl acetate; hexane, cyclohexane, methylcyclohexane or the like can be used. Aliphatic or alicyclic hydrocarbons; halogenated alkanes such as 1,2-dichloroethane; lower alcohols such as isopropyl alcohol (for example, one-carbon alcohols having 1 to 4 carbon atoms); third butyl methyl ether, etc. An ether; a ketone such as methyl ethyl ketone or acetone; or a solvent of any one or more, or a mixed solvent of two or more. The initiator to be used in the polymerization can be appropriately selected from previously known polymerization initiators depending on the kind of the polymerization method. For example, one type or two or more types of azo polymerization initiators such as 2,2'-azobisisobutyronitrile (AIBN) can be preferably used. Examples of other examples of the polymerization initiator include persulfate such as potassium persulfate; peroxide initiators such as benzamidine peroxide and hydrogen peroxide; and substituted ethane starting groups such as phenyl-substituted ethane. Agent; aromatic carbonyl compound; As another example of the polymerization initiator, a redox initiator which is a combination of a peroxide and a reducing agent can be mentioned. These polymerization initiators may be used alone or in combination of two or more. The polymerization initiator may be used in an amount conventionally used, for example, from about 0.005 parts by weight to about 1 part by weight (typically from about 0.01 part by weight to about 1%) per 100 parts by weight of the total monomer component. Select within the range of parts by weight. In the technique disclosed herein, the weight average molecular weight (Mw) of the acrylic polymer is not particularly limited and may be, for example, about 10×10. 4 Above and about 500×10 4 the following. The Mw of the acrylic polymer is preferably about 20×10 from the viewpoint of appropriately adjusting the adhesion and cohesiveness suitable for the fixing use of the polishing pad. 4 Above (typically about 35×10 4 The above), in addition, from the viewpoint of coating properties, etc., usually about 150 × 10 4 The following (typically about 100×10 4 The following, preferably less than about 70×10 4 More preferably about 65×10 4 Below, for example about 60×10 4 The following) is more appropriate. Here, Mw means a value in terms of standard polystyrene obtained by GPC (gel permeation chromatography). As the GPC device, for example, the model name "HLC-8320GPC" (column: TSKgel GMH-H (S), manufactured by Tosoh Corporation) can be used. The above Mw can be preferably applied to an acrylic polymer having at least a fixing side adhesive (adhesive S). The base polymer of the disk side adhesive and the acrylic polymer of the pad side adhesive may each have the above Mw. (Tackifying Resin) The acrylic adhesive in the technique disclosed herein may contain a tackifying resin as needed in addition to the above acrylic polymer (base polymer). It is preferred that at least the fixing side adhesive (adhesive S) contains a tackifying resin. The fixing side adhesive and the pad side adhesive may each contain a tackifying resin. In this case, the type and amount of the tackifying resin contained in the fixing side adhesive may be the same as or different from the type and amount of the tackifying resin contained in the mat side adhesive. The content of the tackifying resin (the total content of the tackifying resin in the case of containing a plurality of tackifying resins) is not particularly limited. For example, it may be set to about 3 parts by weight or more, preferably about 5 parts by weight or more, more preferably about 9.5 parts by weight or more, and typically about 10 parts by weight or more, for example, based on 100 parts by weight of the acrylic polymer. About 15 parts by weight or more). Further, the content of the tackifier resin is usually usually about 50 parts by weight or less (typically about 45 parts by weight or less, for example, about 43 parts by weight or less), preferably about 100 parts by weight of the acrylic polymer. To be set to about 40 parts by weight or less (for example, about 40 parts by weight or less), it may be set to about 35 parts by weight or less. As the tackifier resin, a known variety selected from the group consisting of a rosin-based resin, a terpene resin, a modified terpene resin, a phenol resin, a petroleum resin, a styrene resin, a coumarone-indene resin, and a ketone resin can be used. One or more of the adhesive resins. The concept of the so-called rosin-based resin includes both rosin and rosin derivative resins. Examples of the rosin-based resin include unmodified rosin (raw rosin) such as gum rosin, wood rosin, and tall oil rosin; and modified rosin obtained by modification of the unmodified rosin by hydrogenation, disproportionation, polymerization, or the like. (Hydrogenated rosin, disproportionated rosin, polymerized rosin, other chemically modified rosin, etc.). The rosin derivative resin is typically a rosin derivative as described above. The concept of the so-called rosin-based resin includes derivatives of unmodified rosin and derivatives of modified rosin (including hydrogenated rosin, disproportionated rosin, and polymerized rosin). Examples of the rosin derivative resin include an unmodified rosin ester which is an ester of unmodified rosin and an alcohol, and an ester of modified rosin (hydrogenated rosin, disproportionated rosin, polymerized rosin, etc.) and an alcohol. a rosin ester such as a rosin ester; for example, an unsaturated fatty acid-modified rosin obtained by modifying a rosin with an unsaturated fatty acid; for example, an unsaturated fatty acid-modified rosin obtained by modifying a rosin ester with an unsaturated fatty acid. An ester; for example, a rosin alcohol obtained by reducing a carboxyl group of a rosin or the above various rosin derivatives (including rosin esters, unsaturated fatty acid-modified rosins, and unsaturated fatty acid-modified rosin esters); for example : a rosin or a metal salt of the above various rosin derivatives; a rosin phenol resin obtained by adding phenol and rosin (unmodified rosin, modified rosin, various rosin derivatives, etc.) under an acid catalyst and thermally polymerizing ;Wait. Examples of the terpene resin include polymers of terpenes (typically monoterpenes) such as a-pinene, b-pinene, d-limonene, l-limonene, and dipentene. It may be a homopolymer of a terpene or a copolymer of two or more terpenes. Examples of the homopolymer of a terpene include an a-pinene polymer, a b-pinene polymer, a pine oil polymer, and the like. Examples of the modified terpene resin include a modified terpene resin obtained by modifying the above terpene resin. Specifically, a styrene-modified terpene resin, a hydrogenated terpene resin, or the like can be exemplified. Examples of the phenol resin include a terpene phenol resin, a hydrogenated terpene phenol resin, and an alkyl phenol resin. The terpene phenol resin includes a copolymer of a terpene and a phenol compound (terpene-phenol copolymer resin), and a resin obtained by phenol-modifying a homopolymer or a copolymer of a terpene (phenol-modified oxime) Alkenyl resin) The concept of both. The hydrogenated terpene phenol resin refers to a resin having a structure obtained by hydrogenating such a terpene phenol resin. The alkylphenol resin is a resin obtained from an alkylphenol and formaldehyde, and examples thereof include a novolak type and a resol type. With regard to the adhesive sheet disclosed herein, at least the fixing side adhesive (adhesive S) contains a polymerized rosin-based tackifying resin. The fixing side adhesive and the pad side adhesive may each contain a polymeric rosin-based tackifying resin. The concept of the polymerized rosin-based tackifying resin herein includes a polymerized rosin and a polymerized rosin derivative as a polymerization modified product of unmodified rosin. Non-limiting examples of the above polymerized rosin derivative include: a polymerized rosin ester which is an ester of a polymerized rosin and an alcohol, an unsaturated fatty acid-modified polymerized rosin obtained by modifying a polymerized rosin with an unsaturated fatty acid, and a polymerized rosin. An unsaturated fatty acid modified polymeric rosin ester obtained by modifying an ester with an unsaturated fatty acid, and a polymeric rosin (including a polymerized rosin, a polymerized rosin ester, an unsaturated fatty acid modified polymeric rosin, and an unsaturated fatty acid modified polymeric rosin ester) a polymerized rosin alcohol obtained by subjecting a carboxyl group to a reduction treatment. In one aspect, as the polymerized rosin-based tackifying resin, a polymerized rosin ester which is an ester of a polymerized rosin and an alcohol can be preferably used. Examples of the alcohols include monohydric alcohols such as methanol and ethanol; glycols such as ethylene glycol, diethylene glycol, and propylene glycol; and trihydric alcohols such as glycerin, trimethylolethane, and trimethylolpropane; a tetrahydric alcohol such as pentaerythritol or diglycerin; a hexahydric alcohol such as dipentaerythritol; and the like. A preferred example of one of the polymerized rosin esters used in the technology disclosed herein is a pentaerythritol ester of a polymerized rosin. As a tackifier resin in the technique disclosed herein, the softening point is about 60 ° C or higher (typically about 80 ° C or higher, from the viewpoint of being suitable for adhesion and cohesiveness of a polishing pad fixing application). Preferably, the tackifying resin is preferably about 100 ° C or higher, more preferably about 110 ° C or higher, for example, about 120 ° C or higher, and the softening point is about 180 ° C or lower (preferably about 160 ° C or lower, more preferably A tackifying resin of about 150 ° C, for example, less than about 140 ° C, is suitable. In a preferred embodiment, a tackifying resin having a softening point of less than about 130 ° C (typically about 100 ° C or more and about less than 130 ° C, for example, about 120 ° C or more and about less than 130 ° C) may be employed. The adhesive sheet disclosed herein preferably contains at least a fixed side adhesive (preferably both a fixed side adhesive and a side adhesive) a polymerized rosin-based tackifying resin having the above softening point (for example, polymerization). The aspect of the rosin ester) was implemented. Further, the softening point of the tackifying resin can be measured based on the softening point test method (ring and ball method) prescribed in JIS K2207. The adhesive S in the technique disclosed herein (i.e., the adhesive constituting at least the fixing side adhesive layer, preferably the fixing side adhesive layer and the pad side adhesive layer) is relative to the acrylic polymer 100. It is preferred to contain about 3 parts by weight or more of the polymerized rosin-based tackifying resin in parts by weight. The amount of the polymerized rosin-based tackifying resin relative to 100 parts by weight of the acrylic polymer is preferably about 5 parts by weight or more (for example, 7) from the viewpoint of obtaining higher adhesion (for example, adhesion to the fixing plate). More preferably, it is about 9.5 parts by weight or more (typically about 10 parts by weight or more, for example, about 15 parts by weight or more). In addition, the amount of the polymerized rosin-based tackifying resin relative to 100 parts by weight of the acrylic polymer is usually set to be less than about 50 parts by weight, from the viewpoint of workability in peeling off the self-aligned polishing pad after use. It is preferably about 45 parts by weight or less, more preferably about 40 parts by weight or less (for example, about 40 parts by weight or less), and may be set to about 38 parts by weight or less, and may be further set to about 35 parts by weight or less. The adhesive sheet disclosed herein can be preferably subjected to an aspect in which the adhesive S contains about 5 parts by weight or more and about 40 parts by weight or less (more preferably about 9.5 parts by weight) based on 100 parts by weight of the acrylic polymer. The above-mentioned and less than 40 parts by weight, for example, about 15 parts by weight or more and about 38 parts by weight or less of the polymerized rosin-based tackifying resin. When the content of the polymerized rosin-based tackifying resin is set to the above range, it may be advantageous from the viewpoint of the adhesion of the polishing pad. Therefore, the technique disclosed herein can be preferably carried out in such a manner that the fixing side adhesive and the pad side adhesive are both adhesives S, and the above-mentioned adhesive S contains the above amount with respect to 100 parts by weight of the acrylic polymer. The polymerized rosin is a tackifying resin. The above-mentioned adhesive S may contain other tackifying resins in addition to the polymerized rosin-based tackifying resin. In this case, about 30% by weight or more (preferably about 50% by weight or more, more preferably about 70% by weight or more) of all the tackifying resins contained in the adhesive S is set as a polymerized rosin-based tackifying resin. More appropriate. The technique disclosed herein can be preferably carried out in such a manner that the adhesive S contains only one or two or more (typically one) polymeric rosin-based tackifying resins as the tackifying resin. (Crosslinking Agent) In the technique disclosed herein, the adhesive composition for forming an adhesive layer may contain a crosslinking agent as needed. That is, the adhesive constituting the adhesive layer may have a structure obtained by crosslinking with the above-mentioned crosslinking agent. The type of the crosslinking agent is not particularly limited, and a conventionally known crosslinking agent can be appropriately selected and used. Examples of such a crosslinking agent include an isocyanate crosslinking agent, an epoxy crosslinking agent, an oxazoline crosslinking agent, an aziridine crosslinking agent, a melamine crosslinking agent, and a peroxide system. Crosslinking agent, urea-based crosslinking agent, metal alkoxide crosslinking agent, metal chelate crosslinking agent, metal salt crosslinking agent, carbodiimide crosslinking agent, amine crosslinking agent, etc. . The crosslinking agent may be used alone or in combination of two or more. The amount of the crosslinking agent used is not particularly limited. For example, it may be set to be about 10 parts by weight or less, preferably about 0.001 part by weight or more (for example, about 0.01 part by weight or more) or about 10 parts by weight or less (for example, with respect to 100 parts by weight of the acrylic polymer). Within a range of about 5 parts by weight or less. An isocyanate crosslinking agent is preferably used in view of the viewpoint of the adhesion and cohesiveness suitable for the fixing use of the polishing pad or the anchoring property of the substrate (especially a plastic film substrate such as a PET film). . For example, it is preferred that at least the fixing side adhesive (adhesive S) is an adhesive obtained by crosslinking with an isocyanate crosslinking agent. As the isocyanate crosslinking agent, various polyfunctional isocyanates (referred to as compounds having an average of two or more isocyanate groups per molecule, including compounds having an isocyanurate structure) can be preferably used. As the polyfunctional isocyanate, one or two or more kinds selected from various isocyanate compounds (polyisocyanates) having two or more isocyanate groups in one molecule can be used. Examples of the polyfunctional isocyanate include aliphatic polyisocyanates, alicyclic polyisocyanates, and aromatic polyisocyanates. Specific examples of the aliphatic polyisocyanate include 1,2-ethylidene diisocyanate, 1,2-tetramethylene diisocyanate, 1,3-tetramethylene diisocyanate, and 1,4-four. Tetramethylene diisocyanate such as methylene diisocyanate; 1,2-hexamethylene diisocyanate, 1,3-hexamethylene diisocyanate, 1,4-hexamethylene diisocyanate, 1,5- Hexamethylene diisocyanate, hexamethylene diisocyanate such as hexamethylene diisocyanate, 1,6-hexamethylene diisocyanate or 2,5-hexamethylene diisocyanate; 2-methyl-1,5-pentane diisocyanate, 3 -Methyl-1,5-pentane diisocyanate, lysine diisocyanate, and the like. Specific examples of the alicyclic polyisocyanate include isophorone diisocyanate; cyclohexyl group such as 1,2-cyclohexyl diisocyanate, 1,3-cyclohexyl diisocyanate, and 1,4-cyclohexyl diisocyanate; Diisocyanate; 1,2-cyclopentyl diisocyanate, cyclopentyl diisocyanate such as 1,3-cyclopentyl diisocyanate; hydrogenated benzene dimethylene diisocyanate, hydrogenated toluene diisocyanate, hydrogenated diphenylmethane diisocyanate Hydrogenated tetramethylxylene diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, and the like. Specific examples of the aromatic polyisocyanate include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and 2,4'-diphenylmethane. Diisocyanate, 2,2'-diphenylmethane diisocyanate, 4,4'-diphenyl ether diisocyanate, 2-nitrobiphenyl-4,4'-diisocyanate, 2,2'-diphenylpropane -4,4'-diisocyanate, 3,3'-dimethyldiphenylmethane-4,4'-diisocyanate, 4,4'-diphenylpropane diisocyanate, isophthalic diisocyanate, p-phenylene Isocyanate, naphthyl-1,4-diisocyanate, naphthalene-1,5-diisocyanate, 3,3'-dimethoxybiphenyl-4,4'-diisocyanate, benzenedimylene-1, 4-diisocyanate, benzene dimethylene-1,3-diisocyanate, and the like. As a preferable isocyanate type crosslinking agent, polyfunctional isocyanate which has an average of three or more isocyanate groups per molecule is illustrated. The trifunctional or higher isocyanate may be a difunctional or trifunctional or higher isocyanate polymer (typically a dimer or a trimer), a derivative (for example, a polyhydric alcohol and two or more polyfunctional isocyanates). Addition reaction product), polymer, and the like. For example, a dimer or a trimer of diphenylmethane diisocyanate, an isocyanurate form of hexamethylene diisocyanate (a trimer adduct of an isocyanurate structure), and a trihydroxy group are mentioned. A reaction product of methyl propane and toluene diisocyanate, a reaction product of trimethylolpropane and hexamethylene diisocyanate, a polyfunctional isocyanate such as polymethylene polyphenyl isocyanate, polyether polyisocyanate or polyester polyisocyanate. As a commercial item of the polyfunctional isocyanate, the product name "DURANATE TPA-100" manufactured by Asahi Kasei Chemical Co., Ltd., the product name "CORONATE L" manufactured by Tosoh Corporation, and the product name "CORONATE HL" manufactured by Tosoh Corporation are listed. The product name "CORONATE HK" manufactured by Tosoh Corporation, the trade name "CORONATE HX" manufactured by Tosoh Corporation, and the trade name "CORONATE 2096" manufactured by Tosoh Corporation. In the case of using an isocyanate crosslinking agent, the amount thereof to be used is not particularly limited, and for example, it may be set to about 10 parts by weight or less (preferably about 5 parts by weight or less, for example, about 3) based on 100 parts by weight of the acrylic polymer. In addition, it is usually about 0.01 part by weight or more (typically about 0.1 part by weight or more, preferably about 0.5 part by weight or more, more preferably about 1) per 100 parts by weight of the acrylic polymer. More preferably, the weight is more than, for example, about 1.5 parts by weight or more. By using an isocyanate-based crosslinking agent in the above range, it is possible to achieve an adhesive sheet for polishing pad fixing which is excellent in balance of special properties. (Other Ingredients) The adhesive disclosed herein may contain a leveling agent, a crosslinking agent, a crosslinking assistant, a plasticizer, a softener, a filler, a colorant (pigment, dye, etc.), an antistatic agent, as needed. Various additives in the field of adhesives such as anti-aging agents, ultraviolet absorbers, antioxidants, and light stabilizers. Regarding such various additives, previously known additives can be used by a conventional method. In one preferred embodiment, the adhesive may be a total amount of the acrylic polymer and the tackifying resin of about 90% by weight of the total weight of the adhesive (ie, the weight of the adhesive layer composed of the adhesive). A composition of % or more (typically about 90% by weight or more and 100% by weight or less). The total amount of the acrylic polymer and the tackifying resin in the above adhesive may be about 95% by weight or more based on the total weight of the adhesive (typically about 95% by weight and 100% by weight or less, for example, about 97.5 % by weight). Above and 100% by weight or less). In a preferred embodiment, the adhesive S may be a combination of an acrylic polymer and a polymeric rosin-based tackifying resin in an amount of about 90% by weight or more based on the total weight of the adhesive S (typically about 90% by weight). The composition of % or more and 100% by weight or less. The total amount of the acrylic polymer and the polymeric rosin-based tackifying resin in the adhesive S may be about 95% or more of the total weight of the adhesive S (typically about 95% by weight and 100% by weight or less, for example, About 97.5% by weight or more and 100% by weight or less). The adhesive sheet disclosed herein can be preferably embodied in the form of a fixing side adhesive layer and a pad side adhesive layer composed of the adhesive S of such a composition. (Formation of Adhesive Layer) In the technique disclosed herein, the form of the adhesive composition for forming the adhesive layer is not particularly limited, and for example, it may be an adhesive (adhesive component) containing the above composition in an organic solvent. The adhesive composition of the form (solvent type), the adhesive composition in which the adhesive is dispersed in an aqueous solvent (water-dispersible type, typically aqueous emulsion type), a hot-melt adhesive composition, and the like. From the viewpoints of coatability and freedom of selection of the substrate, a solvent-based or water-dispersible adhesive composition can be preferably used. A solvent-based adhesive composition is particularly preferred from the viewpoint of achieving higher adhesive properties. The solvent-based adhesive composition is typically prepared in the form of a solution containing the above components in an organic solvent. The above organic solvent can be appropriately selected from known or customary organic solvents (for example, the above-exemplified organic solvents as a solvent used in solution polymerization). The solvent-based adhesive composition is usually prepared to have a solid content (NV) of about 30% by weight or more (for example, about 40% by weight or more) and about 65% by weight or less (for example, about 55% by weight or less). More appropriate. When the NV is too low, the manufacturing cost is likely to be improved, and when the NV is too high, the workability such as coatability may be lowered. As a method of obtaining an adhesive sheet from an adhesive composition, various methods previously known can be applied. For example, a method of directly applying (typically coating) an adhesive composition to a substrate and drying it to form an adhesive layer (direct method) can be preferably employed. Further, the above-mentioned adhesive composition may be applied to a surface having good releasability (for example, a surface of a release liner, a back surface of a release substrate, etc.), and dried to form an adhesive on the surface. A method of transferring a layer of the adhesive onto a substrate (transfer method). For the application of the adhesive composition, for example, a gravure roll coater, a reverse roll coater, a roll coater, a dip roll coater, a bar coater, a knife coater, and a spray can be used. It is carried out by a known or conventional coating machine. From the viewpoint of promoting the crosslinking reaction and improving the production efficiency, it is preferred to dry the adhesive composition under heating. The adhesive layer is typically formed continuously, but may be formed into a regular or irregular pattern such as a dot or a stripe depending on the purpose and use. The thickness of the adhesive layer is not particularly limited, and is preferably about 10 mm or more (more preferably about 20 mm or more, and typically about 30 mm or more, for example, about 40 mm or more) from the viewpoint of exerting good adhesion. ). Further, when the thickness of the pressure-sensitive adhesive layer is too large, the holding force tends to decrease. In consideration of such a case, it is appropriate to set the thickness of the adhesive layer to about 300 mm or less (preferably about 150 mm or less, typically about 100 mm or less, for example, about 80 mm or less). The thickness of the first adhesive layer (the pad side adhesive layer) and the thickness of the second adhesive layer (the fixing side adhesive layer) may be the same or different. In a preferred aspect, the thickness of the first adhesive layer can be set to be at least 0.6 times the thickness of the second adhesive layer in order to provide a stronger adhesion to the polishing pad. That is, the ratio (T1/T2) of the thickness (T1) of the first adhesive layer to the thickness (T2) of the second adhesive layer can be made greater than 0.6. The thickness ratio (T1/T2) may be set to, for example, 1.0 or more (typically more than 1.0), preferably 1.2 or more. The thickness ratio (T1/T2) is usually set to 5.0 or less, and is preferably set to 4.0 or less, from the viewpoint that the pad and the platen are well adhered to each other and the thickness of the adhesive sheet is prevented from becoming excessive. (for example, 3.0 or less). The gel fraction of the adhesive layer is not particularly limited and may be, for example, about 1% by weight or more and about 60% by weight or less. The gel fraction is usually preferably about 3% by weight or more (more preferably about 5% by weight or more, and most preferably, from the viewpoint of adhesion and cohesiveness as an adhesive for fixing a polishing pad. It is about 10% by weight or more, for example, about 20% by weight or more, and preferably about 60% by weight or less (more preferably about 55% by weight or less, for example, about 50% by weight or less). The gel fraction of the adhesive can be adjusted depending on, for example, the composition or molecular weight of the acrylic polymer, whether or not a crosslinking agent is used, and the type and amount of use thereof. Furthermore, the upper limit of the gel fraction is in principle 100% by weight. Here, the gel fraction of the adhesive is obtained by wrapping a measurement sample of the weight W1 in a porous sheet made of tetrafluoroethylene resin and immersing it in ethyl acetate for one week at room temperature, and then drying the measurement sample. The weight W2 of the ethyl acetate insoluble component was measured, and W1 and W2 were substituted into the following formula: gel fraction [%] = W2 / W1 × 100. As the porous sheet made of the tetrafluoroethylene resin, a product name "NITOFLON (registered trademark) NTF1122" manufactured by Nitto Denko Corporation or its equivalent can be used. In a preferred aspect, the gel fraction G2 of the adhesive (the fixing side adhesive) constituting the second adhesive layer can be adjusted to be the adhesive (the pad side adhesive) constituting the first adhesive layer. The gel fraction G1 is approximately equal or higher. For example, the ratio (G2/G1) of the gel fraction G2 of the fixing side adhesive to the gel fraction G1 of the pad side adhesive can be set to 0.8 or more (for example, 0.9 or more), preferably 1.0 or more (typical). In the case of more than 1.0), it may be 1.1 or more (further than 1.2 or more). The upper limit of the ratio (G2/G1) is not particularly limited, and is usually set to 5.0 or less, and is preferably set to 4.0 or less (typically 3.0 or less). <Total Thickness of Adhesive Sheet> The total thickness of the adhesive sheet in the technique disclosed herein (the thickness of the adhesive sheet excluding the release liner) is not particularly limited. The thickness of the adhesive sheet can be set, for example, to about 50 μm or more (typically about 75 μm or more, preferably about 100 μm or more, more preferably about 120 μm or more), and can be set to, for example, about 500 μm or less. (Typically, it is about 450 μm or less, preferably about 400 μm or less, for example, about 350 μm or less). The adhesive sheet having the above total thickness can be, for example, an adhesive sheet which is easily adhered to a larger polishing pad. In addition, in the aspect of being applied to a larger polishing pad, it is possible to form a good workability when the polishing pad is adhered to the fixing plate, or when the polishing pad after use is peeled off from the fixing plate together with the adhesive sheet. Sheet. <Release liner> As the release liner disclosed herein, a conventional release paper or the like can be used without particular limitation. For example, as the substrate for the support (the object to be peeled off) constituting the release liner, various resin films, papers, cloths, rubber sheets, foam sheets, metal foils, and the like can be appropriately selected and used. A composite such as a sheet having a laminated structure of an olefin resin in a two-area layer of paper, or the like. The release treatment can be carried out by a conventional method using a known or conventional release treatment agent (for example, a release treatment agent such as a polyfluorene-based, fluorine-containing or long-chain alkyl group). For example, a release liner obtained by treating a forest paper having a PE resin in two areas with a polyfluorene-based release agent can be preferably used. Further, an olefin-based resin (for example, PE, PP, ethylene-propylene copolymer, PE/PP mixture) or a fluorine-containing polymer (for example, polytetrafluoroethylene, may be used without performing a release treatment on the surface of the substrate). A low adhesion substrate such as polyvinylidene fluoride is used as a release liner. Alternatively, a substrate after the release treatment of the low adhesion substrate may be used. The thickness of the release liner is set to be about 10 mm or more (for example, about 50 mm or more, typically about 60 mm or more) and about 300 mm or less (for example, about 200 mm or less, typically about 100 mm) from the viewpoint of workability and the like. More than 160 mm) is more appropriate. <Characteristics of Adhesive Sheet> The adhesive force F2 of the adhesive surface (fixing side adhesive surface) of the second adhesive layer of the adhesive sheet disclosed herein preferably exceeds 10 N/20 mm. The adhesion force F2 is preferably 11 N/20 mm or more, more preferably 12 N/20 mm or more (for example, 13 N/20 mm or more) from the viewpoint of more firmly fixing the polishing pad to the fixing plate. In addition, the adhesive force F2 is usually 30 N/20 mm or less, preferably 25 N/20 mm or less, from the viewpoint of workability when the polishing pad after use is separated from the adhesive sheet. . For the adhesive force F2, a 2 kg roller was reciprocated once in a 23 ° C, 50% RH environment, and the adhesive surface was pressure-bonded to the surface of a stainless steel (SUS) plate as a member to be placed, and left for 30 minutes. Then, the measurement was carried out under the conditions of a peeling angle of 180 degrees and a stretching speed of 300 mm/min in accordance with JIS Z0237. More specifically, the measurement was carried out in accordance with the method described in the examples below. The low-temperature adhesion force F1 of the adhesive surface (pad side adhesive surface) of the first adhesive layer of the adhesive sheet disclosed herein is preferably 8 N/20 mm or more. The adhesive having a higher low-temperature adhesion force F1 is excellent in adhesion to the surface of the adherend, and therefore tends to be a polishing pad (for example, a urethane foam such as a hard polyurethane-based polishing pad). The polishing pad) shows better adhesion. From the viewpoint of the above, the low-temperature adhesion force F1 is preferably 10 N/20 mm or more, more preferably 12 N/20 mm or more (for example, 14 N/20 mm or more). The upper limit of the low-temperature adhesion F1 is not particularly limited, and it is usually 30 N/20 mm or less, preferably 25 N/20 mm or less, in consideration of balance with other adhesive properties (for example, holding force). The low-temperature adhesion force F1 was measured in the same manner as the measurement of the adhesion force F2 except that the measurement environment was set to -10 °C. More specifically, the measurement can be carried out in accordance with the method described in the examples below. The adhesive sheet disclosed herein can be configured such that the low-temperature adhesive force F1 [N/20 mm] is 0.6 times or more (for example, 0.7 times or more) of the above-described adhesive force F2 [N/20 mm]. According to this configuration, it is possible to form an adhesive sheet which is excellent in workability when the adhesive sheet is peeled off from the polishing pad together with the polishing pad. For example, if the adhesion of the second adhesive surface to the fixing plate is too high compared to the adhesion of the first adhesive surface to the polishing pad, the first adhesive surface and the adhesive sheet are separated from the polishing pad by the self-aligning disk. Local warping occurs between the polishing pads, and in this portion, the peeling becomes unstable, and the paste residue may easily occur on the fixing plate. Alternatively, even if the polishing pad is peeled off from the fixing plate together with the adhesive sheet from one end of the polishing pad, the adhesive sheet may be detached from the polishing pad during the peeling operation, and the peeling workability may be lowered. It is configured such that the low-temperature adhesion force F1 is larger than the above-mentioned adhesion force F2, whereby it tends to be easy to customize the adhesive sheet together with the polishing pad while the first adhesive surface of the adhesive sheet is adhered to the polishing pad. Disc peeling. This is particularly useful when the polishing pad to be fixed is a hard urethane-based polishing pad or a large-area polishing pad. In a preferred aspect of the technology disclosed herein, the ratio of the low-temperature adhesion force F1 [N/20 mm] to the adhesion force F2 [N/20 mm] (F1/F2) can be set to 0.8 or more, more preferably It is 1.0 or more (typically more than 1.0, for example, 1.1 or more), and may be 1.2 or more. Further, the value obtained by subtracting the adhesive force F2 from the low-temperature adhesion force F1 (F1-F2) is preferably -5.0 N/20 mm or more, more preferably -3.0 N/20 mm or more, and typically more than 1.0 N/20. Mm, for example, 3.0 N/20 mm or more. The low-temperature adhesion force F1 and the adhesion force F2 may be, for example, the thickness of the adhesive layer, the copolymerization composition of the acrylic polymer (composition or composition ratio of the monomer component), the weight average molecular weight (Mw) of the acrylic polymer, and the tackifying resin. The type or amount of use, whether or not a crosslinking agent is used, the type or amount of the crosslinking agent used in the case of using a crosslinking agent, the gel fraction of the adhesive layer, and the like are adjusted. The adhesive sheet disclosed herein can be preferably embodied in such a manner that the fixing side adhesive and the side adhesive are all the adhesive S. If the polishing pad is fixed to the polishing device fixing plate by using such an adhesive sheet, the polishing liquid can be ground in an abrasive environment (for example, according to the composition of the polishing liquid used, acidic, alkaline, metal salt-containing, oxidizing agent, etc.) In the case where the adhesive sheet for pad fixation is in contact with the adhesive sheet, the adhesive sheet is deteriorated on both sides of the adhesive sheet in substantially the same manner. Therefore, for example, in the adhesive sheet designed such that the low-temperature adhesive force F1 and the adhesive force F2 satisfy a specific relationship as described above, even if the adhesive sheet is deteriorated in the polishing environment, it is difficult to make the relative relationship between the above F1 and F2. destroyed. It is easy to achieve a good workability in the case where the various types of polishing liquids are used to separate the adhesive sheet from the polishing pad after use, and this is preferable. The technique disclosed herein can be preferably carried out in the following manner. For example, the fixing side adhesive and the side adhesive are all adhesives S, and the side adhesive is thicker than the fixing side adhesive layer. (For example, the above thickness ratio (T1/T2) is more than 1.0 and 5.0 or less). In the adhesive sheet disclosed herein, the fixing side adhesive and the side adhesive may be the same composition of the adhesive S, or may be an adhesive S of a different composition. In a preferred embodiment, the same composition of the adhesive S can be used as the fixing side adhesive and the side adhesive. The adhesive sheet of such a configuration is preferable from the viewpoint of workability when the adhesive sheet is separated from the polishing pad after use. Here, the same composition of the fixing side adhesive and the mat side adhesive typically means that the copolymer composition of at least the acrylic polymer constituting the two adhesives is the same as the type and amount of the tackifying resin. In a preferred embodiment, the composition may be set such that both adhesives contain a crosslinking agent, and the types of the crosslinking agent are the same (more preferably, the crosslinking agent is used in the same amount). The adhesive sheet having the fixing side adhesive and the side adhesive formed on the both sides of the substrate by the same adhesive composition is the same as the adhesive S of the fixing side adhesive and the side adhesive. A typical example. The technique disclosed herein can be preferably carried out, for example, in such a manner that the fixing side adhesive and the pad side adhesive are the same composition of the adhesive S, and the pad side adhesive is more than the fixing side adhesive layer. Thick (for example, the above thickness ratio (T1/T2) is more than 1.0 and 5.0 or less). In a preferred embodiment of the adhesive sheet, at least the fixed side adhesive side (preferably both the fixed side adhesive side and the mat side adhesive side) has a holding force of 1 hour or more. According to the adhesive sheet having the above-described holding force, it tends to be able to withstand the stress caused by the grinding to better maintain the good fixing state of the polishing pad on the fixing plate. Here, the above-described holding force can be evaluated by the following holding force test: the adhesive surface of the evaluation target of the adhesive sheet is pressure-bonded to the phenol resin sheet as the adherend with a bonding area of 10 mm in width and 20 mm in length. It was allowed to stand under an environment of 40 ° C for 30 minutes, and then a load of 500 g was applied and left in the same environment for 1 hour. More specifically, the above-described holding force test can be carried out in accordance with the method described in the examples below. In the above-described holding force test, it is more preferable that the offset sheet (mm) of the adhesive sheet after the application of the load for 1 hour is 6 mm or less (for example, 5 mm or less, typically 4 mm or less). <Abrading Member> The polishing member (the polishing pad with an adhesive sheet) disclosed herein can be generally obtained by crimping the first adhesive face of any of the adhesive sheets disclosed herein to the polishing. The back of the mat. The adhesive sheet disclosed herein can be suitably adhered to the polishing pad by being subjected to the above-mentioned pressure bonding at normal temperature (for example, a temperature not heated to about 40 ° C or higher), thereby constituting the disclosed one. Grinding member. This is of particular interest in adhesive sheets of wide width (for example, widths of 600 mm or more and furthermore of 1050 mm or more) or abrasive members using correspondingly sized abrasive pads. EXAMPLES Hereinafter, some examples of the invention are described, but the invention is not intended to be limited to the examples shown in the examples. In addition, the "part" and "%" in the following description are weight basis unless otherwise specified. <Experimental Example 1> (Example 1) 70 parts of n-butyl acrylate (BA), 30 parts of 2-ethylhexyl acrylate (2EHA), 3 parts of acrylic acid (AA), and 4-hydroxybutyl acrylate were used as a monomer component. 0.05 parts of ester (4HBA), 0.08 parts of 2,2'-azobisisobutyronitrile (AIBN) as a polymerization initiator, and 150 parts of toluene as a polymerization solvent were charged with a stirrer, a thermometer, a nitrogen introduction tube, and reflux condensation. The reaction vessel of the apparatus and the dropping funnel was subjected to solution polymerization at 65 ° C for 8 hours to obtain a toluene solution of the acrylic polymer P1. The Mw of the above acrylic polymer P1 is 44×10 4 . In the toluene solution of the acrylic polymer P1, 2 parts of an isocyanate crosslinking agent (product of Tosoh Corporation, trade name "CORONATE L") was added to 100 parts of the solid content component to prepare an acrylic adhesive composition. A1. A PET film having a thickness of 50 μm was prepared as a substrate. The adhesive composition A1 was applied to the first side of the substrate and dried to form a first adhesive layer having a thickness of 50 mm. A release liner (first release liner) which was subjected to a release treatment using a polyoxynitride-based release agent was bonded to the first adhesive layer. Then, a release liner (second release liner) having the same configuration as the first release liner is separately prepared, and the adhesive composition A1 is applied onto the surface of the second release liner, and dried to form a thickness. A second adhesive layer of 50 mm is used to transfer (transfer) the second adhesive layer side surface layer to the second surface (surface opposite to the first surface) of the PET film substrate. In this manner, the double-sided adhesive sheet of Example 1 (adhesive sheet having a first adhesive layer having a thickness of 50 μm and a second adhesive layer having a thickness of 50 μm on both sides of the PET film as a substrate) was produced. The gel fraction of the adhesive layer (measured by the above method, the same below) was 52.5%. (Examples 2 to 7) In the toluene solution of the acrylic polymer P1, a tackifier resin R1 (a polymerized rosin pentaerythritol manufactured by Arakawa Chemical Co., Ltd.) was added to 100 parts of the solid content component. The esters were sold under the trade name "Pensel D125" (softening point: 125 ° C) and two parts of isocyanate-based crosslinking agent (product of Tosoh Corporation, trade name "CORONATE L") to prepare acrylic adhesive compositions A2 to A7, respectively. The double-sided adhesive sheets of Examples 2 to 7 were produced in the same manner as in Example 1 except that the adhesive compositions A2 to A7 were used instead of the adhesive composition A1. The gel fraction of the adhesive layer was as follows: Example 2 was 46.9%, Case 3 was 39.6%, Case 4 was 25.0%, and Case 7 was 0.9%. (Example 8) 100 parts of BA as a monomer component, 5 parts of AA, 0.2 parts of benzoyl peroxide as a polymerization initiator, and 120 parts of toluene as a polymerization solvent were placed in a stirrer, a thermometer, a nitrogen introduction tube, and In a reaction vessel of a reflux condenser and a dropping funnel, solution polymerization was carried out at 60 ° C for 7 hours to obtain a toluene solution of the acrylic polymer P2. The Mw of the above acrylic polymer P2 is 55 × 10 4 . In the toluene solution of the acrylic polymer P2, 30 parts of a tackifier resin R1 and 2 parts of an isocyanate crosslinking agent (product of Tosoh Corporation, trade name "CORONATE L") are added to 100 parts of the solid content component. Thus, an acrylic adhesive composition A8 was prepared. A double-sided adhesive sheet of Example 8 was produced in the same manner as in Example 1 except that the adhesive composition A8 was used instead of the adhesive composition A1. The gel fraction of the adhesive layer was 1.6%. (Example 9) In the toluene solution of the acrylic polymer P1, 30 parts of a tackifying resin R2 (a terpene phenol resin manufactured by Anwar Chemical Co., Ltd., trade name "YS Polyster 145") and 30 parts of the solid content component were added. Two parts of an isocyanate type crosslinking agent (product of Toray Industries, trade name "CORONATE L") was used to prepare an acrylic pressure-sensitive adhesive composition A9, except that the adhesive composition A9 was used instead of the adhesive composition A1. The double-sided adhesive sheet of Example 9 was produced in the same manner. The adhesive layer had a gel fraction of 40.0%. (Example 10) 100 parts of natural rubber (Mooney viscosity 75) as a base polymer and styrene-different Pentadiene-styrene block copolymer (manufactured by Nippon Co., Ltd., trade name "Quintac 3460C") 30 parts, tackifying resin R3 (manufactured by Nippon Co., Ltd., maleic anhydride modified C5, C9 resin, trade name 40 parts of "Quintone D-200", 40 parts of tackifying resin R4 (manufactured by Sumitomo Bakelite, phenol-modified rosin, trade name "Sumilite PR12603N"), phenolic anti-aging agent (manufactured by Ouchi Shinko Chemical Industry Co., Ltd.) The product name "Noctec NS-6") is dissolved in toluene, but Thereafter, 3 parts of an isocyanate-based crosslinking agent (product of Tosoh Corporation, trade name "CORONATE L") was added to prepare a rubber-based pressure-sensitive adhesive composition A10, except that the adhesive composition A10 was used instead of the adhesive composition A1. The double-sided adhesive sheet of Example 10 was produced in the same manner as in Example 1. (Evaluation) [Adhesion] A PET film having a thickness of 25 mm was attached to the first adhesive surface of the double-sided adhesive sheet of each example (first adhesive) The adhesive surface of the layer is cut into a size of 20 mm in width and 100 mm in length to prepare a measurement sample. The second adhesive surface of the above-mentioned measurement sample (second adhesive) is prepared under a standard environment of 23 ° C and 50% RH. The adhesive surface of the layer is exposed, and the 2 kg roller is reciprocated once and the second adhesive surface is crimped onto the surface of the object to be bonded. It is placed in the same environment for 30 minutes, and then the universal tensile compression tester (device) is used. The "stretch compression tester TCM-1kNB", manufactured by Meiya Company), was measured for peel strength at a peeling angle of 180 degrees and a tensile speed of 300 mm/min according to JIS Z0237. Stainless steel plate (SUS304 plate) was used. As the adherend, the measurement was performed three times and recorded. The results are shown in Table 1. [Low Temperature Adhesive Force] In the above adhesive force measurement, the adhesive sheet was pressure-bonded to the environment of the adherend, and the environment in which the adhesive was held and the peel strength were measured. The above standard environment was changed to an environment of -10 ° C. The low-temperature adhesion was measured in the same manner as the above-mentioned adhesion measurement. The results are shown in Table 1. [Shear adhesion force] The double-sided adhesive sheets of the respective examples were used. A measurement sample was prepared by cutting to a size of 20 mm × 20 mm. The first adhesive surface (adhesive surface of the first adhesive layer) and the second adhesive surface (adhesive surface of the second adhesive layer) of the above-mentioned measurement sample are laminated on a stainless steel plate at 23 ° C and 50% RH. (SUS304BA plate, 30 mm × 100 mm × 0.4 mm thick), the 5 kg roller was reciprocated once and for all. It was allowed to stand in a standard environment of 23 ° C and 50% RH for 1 hour, and then a universal tensile compression tester (device name "Tensile Compression Tester TCM-1kNB", manufactured by Meiya Company) was used at the stretching speed. Peeling was performed under conditions of 50 mm/min and a peeling angle of 0 degrees, and the maximum strength at this time was recorded as the shearing force (N). Specifically, as shown in FIG. 3, the first adhesive surface 100A and the second adhesive surface 100B of the measurement sample 100 are bonded to the stainless steel sheets 201 and 202, and pressure-bonded under the above conditions. It was allowed to stand under the above temperature atmosphere for 1 hour, and then the stainless steel sheets 201, 202 were stretched in the direction of the arrow in Fig. 3 (i.e., the shearing direction) at the above speed, and measured to be 20 mm × 20 mm (400 mm). 2 Peel strength (N) under the adhesive area. The assay was performed three times and the average was recorded. The results are shown in Table 1. [Retention] A PET film having a thickness of 25 mm was attached to the first adhesive face of the double-sided adhesive sheet of each example (adhesive side of the first adhesive layer), and then cut into a width of 10 mm, thereby For example, three test pieces were prepared for the adhesive sheets. The 2 kg rolls were reciprocated once, and the second adhesive faces of the test pieces were crimped to the phenol resin plate as the adherends with a backing area of 10 mm in width and 20 mm in length. The phenol resin sheet was suspended at 40 ° C for 30 minutes, and then a load of 500 g was applied to the free end of the sample piece. According to JIS Z0237, it was allowed to stand in an environment of 40 ° C for 1 hour while the load was applied. After one hour, even if one of the three test pieces fell, it was judged that the holding time was less than one hour (indicated as "drop" in Table 1). In other cases, the offset distance (mm) of each test piece from the initial pasting position was measured for each of the three test pieces, and the arithmetic mean of these was obtained. The results are shown in Table 1. [Table 1] Table 1 As shown in Table 1, in Examples 1 to 9 in which the fixing side adhesive and the pad side adhesive were acrylic adhesives, an adhesive layer containing a suitable amount of a polymerized rosin-based tackifying resin was used on both sides. The adhesive sheets of Examples 2 to 5 and Example 8 obtained appropriate adhesion as a fixing side adhesive. These adhesive sheets exhibited higher low-temperature adhesion of the adhesive sheets of the ratios 6, 7, 9, and 10, and thus were considered to exhibit a better adhesion to the polishing pad. <Experimental Example 2> (Example 11) A PET film having a thickness of 50 μm was prepared as a substrate. The adhesive composition A4 was applied to the first surface of the substrate and dried to form a first adhesive layer (pad side adhesive layer) having a thickness of 60 μm. A release liner (first release liner) which was subjected to a release treatment using a polyoxynitride-based release agent was bonded to the first adhesive layer. Then, a release liner (second release liner) having the same configuration as that of the first release liner is separately prepared, and the adhesive composition A4 is applied onto the surface of the second release liner, and dried to form a thickness. a 40 μm second adhesive layer (fixing side adhesive layer), the second adhesive layer side surface layer (transferred) on the second side of the PET film substrate (the opposite side to the first surface) ). The double-sided adhesive sheet of Example 11 was produced in this manner. (Examples 12 to 18) As the adhesive composition for forming the pad side adhesive layer and the fixing side adhesive layer, the adhesive compositions shown in Table 2 were used, respectively. The double-sided adhesive sheets of Examples 12 to 18 were produced in the same manner as in Example 11 except for other aspects. (Evaluation) [Low Temperature Adhesion (F1)] A PET film having a thickness of 25 μm was attached to the second adhesive surface of the double-sided adhesive sheet of each example, and cut into a size of 20 mm in width and 100 mm in length to prepare a measurement. sample. The first adhesive surface (the surface of the pad side adhesive layer) of the above-mentioned measurement sample is exposed in an environment of -10 ° C, and the 2 kg roller is reciprocated once to press the first adhesive surface to the surface of the adherend. . The mixture was allowed to stand in the same environment for 30 minutes, and then a universal tensile compression tester (device name "Tensile Compression Tester, TCM-1kNB", manufactured by Meiya Company) was used, and according to JIS Z0237, the peeling angle was 180 degrees. The peel strength was measured under the conditions of a tensile speed of 300 mm/min. A stainless steel plate (SUS304 plate) was used as the adherend. The measurement was performed three times, and the average value thereof was recorded. The results are shown in Table 2. [Adhesion (F2)] A PET film having a thickness of 25 μm was attached to the first adhesive face of the double-sided adhesive sheet of each example, and cut into a size of 20 mm in width and 100 mm in length to prepare a measurement sample. The second adhesive surface (the surface of the fixing side adhesive layer) of the above-mentioned measurement sample was exposed in a standard environment of 23 ° C and 50% RH, and the 2 kg roller was reciprocated once and the second adhesive surface was crimped to The surface of the body being pressed. Place it in the same environment for 30 minutes, and then use a universal tensile compression tester (device name "Tensile Compression Tester TCM-1kNB", manufactured by Meiya Company), according to JIS Z0237, at a peeling angle of 180 degrees, pull The peel strength was measured at a stretching speed of 300 mm/min. A stainless steel plate (SUS304 plate) was used as the adherend. The measurement was performed three times, and the average value thereof was recorded. The results are shown in Table 2. [Table 2] Table 2 As shown in Table 2, the adhesive sheets of Examples 11 to 14 showed an adhesive force F2 suitable as a fixing side adhesive, and the low-temperature adhesive force F1 was also good. Further, since the low-temperature adhesive force F1 of the adhesive sheet is 0.7 times or more the adhesive force F2, it is considered that the polishing pad fixed by the adhesive sheet exhibits good workability when it is peeled off from the fixed disk together with the above-mentioned adhesive sheet. On the other hand, the adhesive sheets of Examples 15 to 18 are adhesive sheets in which the adhesion force on the fixing plate side or the polishing pad side is low, or the adhesion between the fixing plate side and the polishing pad side is insufficient. The specific examples of the present invention have been described in detail above, but these are merely illustrative and are not intended to limit the scope of the application. The technology described in the scope of the patent application includes various modifications and changes to the specific examples described above.

1、2、3‧‧‧黏著片材
11‧‧‧第一黏著劑層
11A‧‧‧第一黏著面
12‧‧‧第二黏著劑層
12A‧‧‧第二黏著面
15‧‧‧基材
15A‧‧‧基材之第一面
15B‧‧‧基材之第二面
21、22‧‧‧剝離襯墊
21A‧‧‧正面
21B‧‧‧背面
30‧‧‧研磨墊
30A‧‧‧研磨面
30B‧‧‧背面
40‧‧‧研磨裝置
50‧‧‧研磨裝置定盤
50A‧‧‧研磨裝置定盤之表面
90‧‧‧研磨構件(附黏著片材之研磨墊)
100‧‧‧測定樣品
100A‧‧‧第一黏著面
100B‧‧‧第二黏著面
201、202‧‧‧不鏽鋼板
A‧‧‧旋轉軸
1, 2, 3 ‧ ‧ adhesive sheets
11‧‧‧First adhesive layer
11A‧‧‧First adhesive surface
12‧‧‧Second Adhesive Layer
12A‧‧‧Second Adhesive Surface
15‧‧‧Substrate
15A‧‧‧The first side of the substrate
15B‧‧‧ second side of the substrate
21, 22‧‧‧ peeling liner
21A‧‧‧ positive
21B‧‧‧Back
30‧‧‧ polishing pad
30A‧‧‧Grinding surface
30B‧‧‧Back
40‧‧‧ grinding device
50‧‧‧ grinding device fixing
50A‧‧‧ Surface of the grinding device
90‧‧‧Abrased components (polishing pads with adhesive sheets)
100‧‧‧Measurement sample
100A‧‧‧first adhesive surface
100B‧‧‧Second Adhesive Surface
201, 202‧‧‧ stainless steel plate
A‧‧‧Rotary axis

圖1為表示一實施形態之研磨墊固定用黏著片材及研磨構件之應用例之模式側面圖。 圖2為表示一實施形態之黏著片材之構成之模式剖面圖。 圖3為模式性地表示剪切接著力之測定方法之說明圖。Fig. 1 is a schematic side view showing an application example of an adhesive sheet for polishing pad and a polishing member according to an embodiment. Fig. 2 is a schematic cross-sectional view showing the structure of an adhesive sheet according to an embodiment. Fig. 3 is an explanatory view schematically showing a method of measuring the shearing force.

1‧‧‧黏著片材 1‧‧‧Adhesive sheet

11‧‧‧第一黏著劑層 11‧‧‧First adhesive layer

11A‧‧‧第一黏著面 11A‧‧‧First adhesive surface

12‧‧‧第二黏著劑層 12‧‧‧Second Adhesive Layer

12A‧‧‧第二黏著面 12A‧‧‧Second Adhesive Surface

15‧‧‧基材 15‧‧‧Substrate

30‧‧‧研磨墊 30‧‧‧ polishing pad

30A‧‧‧研磨面 30A‧‧‧Grinding surface

30B‧‧‧背面 30B‧‧‧Back

40‧‧‧研磨裝置 40‧‧‧ grinding device

50‧‧‧研磨裝置定盤 50‧‧‧ grinding device fixing

50A‧‧‧研磨裝置定盤之表面 50A‧‧‧ Surface of the grinding device

90‧‧‧研磨構件(附黏著片材之研磨墊) 90‧‧‧Abrased components (polishing pads with adhesive sheets)

A‧‧‧旋轉軸 A‧‧‧Rotary axis

Claims (10)

一種黏著片材,其為研磨墊固定用黏著片材,且 其具備:基材、設置於上述基材之第一面之第一黏著劑層、及設置於上述基材之第二面之第二黏著劑層, 上述第一黏著劑層之黏著面為將要黏貼於研磨墊之面,上述第二黏著劑層之黏著面為將要黏貼於研磨裝置定盤之面, 構成上述第一黏著劑層及上述第二黏著劑層之黏著劑均為丙烯酸系黏著劑, 至少構成上述第二黏著劑層之丙烯酸系黏著劑為黏著劑S, 上述黏著劑S相對於丙烯酸系聚合物100重量份含有3重量份以上且40重量份以下之聚合松香系增黏樹脂。An adhesive sheet which is an adhesive sheet for fixing a polishing pad, comprising: a substrate, a first adhesive layer provided on the first surface of the substrate, and a second surface provided on the substrate a second adhesive layer, wherein the adhesive surface of the first adhesive layer is to be adhered to the surface of the polishing pad, and the adhesive surface of the second adhesive layer is to be adhered to the surface of the polishing device to form the first adhesive layer The adhesive of the second adhesive layer is an acrylic adhesive, and at least the acrylic adhesive constituting the second adhesive layer is an adhesive S, and the adhesive S contains 3 parts by weight based on 100 parts by weight of the acrylic polymer. A polymerized rosin-based tackifying resin in an amount of not less than 40 parts by weight. 如請求項1之黏著片材,其中上述黏著劑S中構成上述丙烯酸系聚合物之單體成分含有(甲基)丙烯酸正丁酯及於酯末端具有碳原子數6~9之烷基之(甲基)丙烯酸烷基酯。The adhesive sheet according to claim 1, wherein the monomer component constituting the acrylic polymer in the adhesive S contains n-butyl (meth)acrylate and an alkyl group having 6 to 9 carbon atoms at the ester terminal ( Alkyl methacrylate. 如請求項1或2之黏著片材,其中上述黏著劑S中構成上述丙烯酸系聚合物之單體成分含有40重量%以上且95重量%以下之(甲基)丙烯酸正丁酯。The adhesive sheet according to claim 1 or 2, wherein the monomer component constituting the acrylic polymer in the adhesive S contains 40% by weight or more and 95% by weight or less of n-butyl (meth)acrylate. 如請求項1至3中任一項之黏著片材,其中上述黏著劑S中構成上述丙烯酸系聚合物之單體成分含有1重量%以上且5重量%以下之含羧基之單體。The adhesive sheet according to any one of claims 1 to 3, wherein the monomer component constituting the acrylic polymer in the adhesive S contains 1% by weight or more and 5% by weight or less of a carboxyl group-containing monomer. 如請求項1至4中任一項之黏著片材,其中上述黏著劑S中構成上述丙烯酸系聚合物之單體成分含有含羥基之單體。The adhesive sheet according to any one of claims 1 to 4, wherein the monomer component constituting the acrylic polymer in the adhesive S contains a hydroxyl group-containing monomer. 如請求項1至5中任一項之黏著片材,其中上述黏著劑S係藉由異氰酸酯系交聯劑進行交聯。The adhesive sheet according to any one of claims 1 to 5, wherein the above-mentioned adhesive S is crosslinked by an isocyanate crosslinking agent. 如請求項1至6中任一項之黏著片材,其中上述第一黏著劑層之黏著面之低溫黏著力F1比上述第二黏著劑層之黏著面之黏著力F2高。The adhesive sheet according to any one of claims 1 to 6, wherein the low-temperature adhesion force F1 of the adhesive surface of the first adhesive layer is higher than the adhesive force F2 of the adhesive surface of the second adhesive layer. 如請求項1至7中任一項之黏著片材,其中構成上述第二黏著劑層之丙烯酸系黏著劑及構成上述第一黏著劑層之丙烯酸系黏著劑均為上述黏著劑S。The adhesive sheet according to any one of claims 1 to 7, wherein the acrylic adhesive constituting the second adhesive layer and the acrylic adhesive constituting the first adhesive layer are all the adhesive S. 如請求項1至8中任一項之黏著片材,其中構成上述第一黏著劑層之丙烯酸系黏著劑及構成上述第二黏著劑層之丙烯酸系黏著劑為相同組成。The adhesive sheet according to any one of claims 1 to 8, wherein the acrylic adhesive constituting the first adhesive layer and the acrylic adhesive constituting the second adhesive layer have the same composition. 一種研磨構件,其包含: 研磨墊、及 如請求項1至9中任一項之黏著片材,其係上述第一黏著劑層之黏著面黏貼於上述研磨墊。An abrasive member comprising: a polishing pad, and the adhesive sheet according to any one of claims 1 to 9, wherein the adhesive surface of the first adhesive layer is adhered to the polishing pad.
TW105138825A 2015-11-30 2016-11-25 Adhesive sheet for fixing polishing pad having a substrate, a polishing pad side adhesive layer and a fixed plate side adhesive layer TW201728726A (en)

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