TW201726568A - Solution growth method, pedestal, and method for producing single crystal SiC - Google Patents

Solution growth method, pedestal, and method for producing single crystal SiC Download PDF

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TW201726568A
TW201726568A TW105141438A TW105141438A TW201726568A TW 201726568 A TW201726568 A TW 201726568A TW 105141438 A TW105141438 A TW 105141438A TW 105141438 A TW105141438 A TW 105141438A TW 201726568 A TW201726568 A TW 201726568A
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sic
seed crystal
susceptor
graphite
single crystal
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TW105141438A
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Norihito Yabuki
Junichi Uehara
Satoru Nogami
Satoshi Torimi
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Toyo Tanso Co
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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B19/00Liquid-phase epitaxial-layer growth
    • C30B19/02Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
    • C30B19/04Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux the solvent being a component of the crystal composition
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B19/00Liquid-phase epitaxial-layer growth
    • C30B19/12Liquid-phase epitaxial-layer growth characterised by the substrate
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/36Carbides

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

In this solution growth method, an epitaxial layer is grown on a SiC seed crystal with the SiC seed crystal, which comprises a single crystal SiC, being supported on a pedestal and being in contact with a solution that includes at least Si and C. At least the part of the pedestal that comes into contact with the SiC seed crystal is made of graphite. This prevents fine SiC crystals from being generated on the pedestal compared to when, for example, a SiC pedestal is used. Thus, growth of the epitaxial layer does not tend to be inhibited which allows the epitaxial layer to grow quickly.

Description

溶液生長法、基座、及單晶SiC之製造方法 Solution growth method, susceptor, and method for producing single crystal SiC

本發明主要關於一種進行溶液生長法而使單晶SiC生長之技術。 The present invention is mainly directed to a technique for growing a single crystal SiC by a solution growth method.

與Si等比較,SiC因為電性特性等優異,因而作為一種新穎之半導體材料,已受到矚目。於製造半導體元件時,首先使用由SiC組成之晶種(單晶SiC基板),製作SiC基板或SiC晶塊(bulk crystal)等。其中,作為使用晶種使單晶SiC生長之溶液生長法的方法之一,已知一種MSE法(亞穩態溶媒磊晶法)。 Compared with Si and the like, SiC has been attracting attention as a novel semiconductor material because of its excellent electrical properties and the like. In the production of a semiconductor element, a seed crystal (single crystal SiC substrate) composed of SiC is first used to produce a SiC substrate, a SiC bulk crystal, or the like. Among them, an MSE method (meta-stable solvent epitaxy method) is known as one of methods for growing a single crystal SiC by using a seed crystal.

專利文獻1揭示有一種採用MSE法使單晶SiC生長之方法。MSE法,係使用由單晶SiC組成之SiC晶種、自由能較SiC晶種高之餵碳基板、及Si熔體(melt)。並且,藉由使SiC晶種與餵碳基板對向配置,且使Si熔體位於其等之間,在真空下進行加熱,可使單晶SiC生長在SiC晶種的表面。 Patent Document 1 discloses a method of growing single crystal SiC by the MSE method. The MSE method uses a SiC seed crystal composed of single crystal SiC, a carbon-feeding substrate having a higher free energy than the SiC seed crystal, and a Si melt. Further, by arranging the SiC seed crystals opposed to the carbon-implanted substrate and placing the Si melt therebetween, heating under vacuum allows the single crystal SiC to grow on the surface of the SiC seed crystal.

專利文獻2揭示有一種採用昇華再結晶法使SiC晶種生長之方法。於專利文獻2中,記載有在使用昇華再結晶 法時被安裝於SiC晶種之基座(sub-mount)之形狀等。 Patent Document 2 discloses a method of growing SiC seed crystals by sublimation recrystallization. Patent Document 2 describes that sublimation recrystallization is used. The method is mounted on the shape of a sub-mount of the SiC seed crystal or the like.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

專利文獻1:日本特開2008-230946號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2008-230946

專利文獻2:日本特開2005-263539號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2005-263539

然而,於專利文獻1中,對進行MSE法時之基座之材料等,並無記載。此外,專利文獻2僅對進行昇華再結晶法時之基座有所記載,而對進行溶液生長法時之基座,並無記載。在此,周知於使用溶液生長法使單晶SiC生長之情況下,生長速度會根據基座之材料及形狀等之不同而變慢。 However, in Patent Document 1, there is no description of the material of the susceptor or the like in the case of performing the MSE method. Further, Patent Document 2 only describes the susceptor when performing the sublimation recrystallization method, and does not describe the susceptor when the solution growth method is performed. Here, in the case where the single crystal SiC is grown by the solution growth method, the growth rate is slowed depending on the material and shape of the susceptor.

本發明係鑑於以上之情狀而完成者,其主要目的,在於提供一種在進行溶液生長法時被安裝於SiC晶種,且可提高單晶SiC之生長速度的基座之構成。 The present invention has been made in view of the above circumstances, and a main object thereof is to provide a susceptor which is attached to an SiC seed crystal during a solution growth method and which can increase the growth rate of single crystal SiC.

(解決問題之技術手段及功效) (Technical means and effects of solving problems)

本發明所欲解決之問題,誠如以上之說明,下面對用以解決此問題之手段及其功效進行說明。 The problem to be solved by the present invention is as described above, and the means for solving the problem and the effects thereof will be described below.

根據本發明之第1觀點,提供一種溶液生長法,係於使由SiC組成之晶種支撐在基座的狀態且使至少包含Si及C之溶液接觸的狀態下,使磊晶層生長在該晶種上之方 法,其中,上述基座中的至少與上述晶種接觸之部分,係石墨製。 According to a first aspect of the present invention, a solution growth method is provided in which a crystal growth layer is grown in a state in which a seed crystal composed of SiC is supported on a susceptor and a solution containing at least Si and C is brought into contact with each other. Seed on the seed And a method in which at least the portion of the susceptor that is in contact with the seed crystal is made of graphite.

藉此,與譬如使用SiC製之基座的情況比較,變得不易在基座上產生SiC之微小的結晶。藉此,磊晶層之生長變得難被阻礙,因而可使磊晶層快速地生長。 Thereby, it is difficult to produce minute crystals of SiC on the susceptor as compared with the case of using a SiC base. Thereby, the growth of the epitaxial layer becomes difficult to be hindered, so that the epitaxial layer can be rapidly grown.

於上述之溶液生長法中,較佳為,上述基座之石墨部分之熱導率大於130W/(m.K)。 In the above solution growth method, it is preferred that the graphite portion of the susceptor has a thermal conductivity of more than 130 W/(m.K).

藉此,藉由使用熱導率高之石墨作為基座之材料,可防止晶種變為高溫。藉此,相較於SiC之分解,生長被優先進行,因而可使磊晶層快速地生長。 Thereby, by using graphite having a high thermal conductivity as a material of the susceptor, it is possible to prevent the seed crystal from becoming high temperature. Thereby, growth is preferentially performed as compared with the decomposition of SiC, so that the epitaxial layer can be rapidly grown.

於上述之溶液生長法中,較佳為,上述基座中的支撐上述晶種之面的面積,係與上述晶種相同或較該晶種大。 In the above solution growth method, it is preferable that an area of the surface of the susceptor supporting the seed crystal is the same as or larger than the seed crystal.

藉此,可有效率地使晶種之熱傳導至基座,因此可防止晶種變為高溫。藉此,相較於SiC之分解,生長被優先進行,因而可使磊晶層快速地生長。 Thereby, the heat of the seed crystal can be efficiently conducted to the susceptor, so that the seed crystal can be prevented from becoming high temperature. Thereby, growth is preferentially performed as compared with the decomposition of SiC, so that the epitaxial layer can be rapidly grown.

於上述之溶液生長法中,較佳為,上述溶液生長法,係一亞穩態溶媒磊晶法,即為、藉由於上述晶種與自由能較該晶種高且至少供給C之餵碳材料之間存在有Si熔體之狀態下進行加熱,使磊晶層生長在上述晶種之表面的方法。 In the above solution growth method, preferably, the solution growth method is a metastable solvent epitaxy method, that is, because the seed crystal and the free energy are higher than the seed crystal and at least the carbon supply of C is supplied. A method in which a material having a Si melt is heated between the materials to grow an epitaxial layer on the surface of the seed crystal.

藉此,不用加入溫度梯度等,可藉由自由能之差,使單晶SiC生長。 Thereby, the single crystal SiC can be grown by the difference in free energy without adding a temperature gradient or the like.

根據本發明之第2觀點,提供以下構成之基座。即、該基座係於使用溶液生長法使磊晶層生長在由SiC組成之 晶種時,支撐該晶種。此外,該基座的至少與上述晶種接觸之部分,係石墨製。 According to a second aspect of the present invention, a susceptor having the following configuration is provided. That is, the susceptor is grown by using a solution growth method to form an epitaxial layer composed of SiC. When the seed crystal is seeded, the seed crystal is supported. Further, at least a portion of the susceptor that is in contact with the seed crystal is made of graphite.

藉此,與譬如使用SiC製之基座的情況比較,變得不易在基座上產生SiC之微小的結晶。藉此,磊晶層之生長變得難被阻礙,因而可使磊晶層快速地生長。 Thereby, it is difficult to produce minute crystals of SiC on the susceptor as compared with the case of using a SiC base. Thereby, the growth of the epitaxial layer becomes difficult to be hindered, so that the epitaxial layer can be rapidly grown.

較佳為,於上述之基座中,石墨部分之熱導率大於130W/(m.K)。 Preferably, in the above susceptor, the thermal conductivity of the graphite portion is greater than 130 W/(m.K).

藉此,藉由使用熱導率高之石墨,可防止晶種變為高溫。藉此,相較於SiC之分解,生長被優先進行,因而可使磊晶層快速地生長。 Thereby, by using graphite having a high thermal conductivity, the seed crystal can be prevented from becoming high temperature. Thereby, growth is preferentially performed as compared with the decomposition of SiC, so that the epitaxial layer can be rapidly grown.

根據本發明之第3觀點,提供一種單晶SiC之製造方法,其包含以下之步驟:使由SiC組成之晶種支撐在基座上,該基座之與該晶種接觸的部分為石墨製;及於使至少包含Si及C之溶液接觸於被支撐在上述基座之上述晶種的狀態下,使磊晶層生長在該晶種上。 According to a third aspect of the present invention, a method for producing a single crystal SiC, comprising: supporting a seed crystal composed of SiC on a susceptor, wherein a portion of the susceptor in contact with the seed crystal is made of graphite And allowing the epitaxial layer to grow on the seed crystal in a state in which the solution containing at least Si and C is brought into contact with the seed crystal supported on the susceptor.

藉此,藉由使用石墨製之基座,磊晶層之生長速度變快,因而可有效率地製造單晶SiC。 Thereby, by using a susceptor made of graphite, the growth rate of the epitaxial layer is increased, so that single crystal SiC can be efficiently produced.

10‧‧‧高溫真空爐 10‧‧‧High temperature vacuum furnace

30‧‧‧坩堝 30‧‧‧坩埚

33‧‧‧基座 33‧‧‧Base

40‧‧‧SiC基板 40‧‧‧ SiC substrate

41‧‧‧SiC晶種 41‧‧‧SiC seed crystal

42‧‧‧Si板 42‧‧‧Si board

43‧‧‧餵碳基板(餵碳材料) 43‧‧‧Feed carbon substrate (feeding carbon material)

圖1為說明使用於本發明之SiC晶種之MSE生長的高溫真空爐之概要之圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the outline of a high temperature vacuum furnace used for MSE growth of SiC seed crystals of the present invention.

圖2為顯示藉由MSE法使SiC晶種生長時之構成例之示意圖。 Fig. 2 is a view showing a constitution example in which SiC seed crystals are grown by the MSE method.

圖3為以使用SiC製之基座進行MSE法之情況、與 使用石墨製之基座進行MSE法之情況,對基座的表面形狀進行比較之顯微鏡照片。 Figure 3 shows the MSE method using a SiC base, and A microscope photograph comparing the surface shape of the susceptor in the case of the MSE method using a graphite base.

圖4為對於使用熱導率不同之石墨製的基座進行MSE法之情況,顯示生長後之單晶SiC的表面形狀之圖。 Fig. 4 is a view showing the surface shape of the single crystal SiC after growth by performing the MSE method using a susceptor made of graphite having different thermal conductivity.

圖5為比較基座之大小與單晶SiC之生長速度的圖表。 Fig. 5 is a graph comparing the size of a susceptor with the growth rate of single crystal SiC.

其次,參照圖式,對本發明之實施形態進行說明。首先,參照圖1,對在本實施形態之加熱處理中使用之高溫真空爐10進行說明。 Next, an embodiment of the present invention will be described with reference to the drawings. First, a high-temperature vacuum furnace 10 used in the heat treatment of the present embodiment will be described with reference to Fig. 1 .

如圖1所示,高溫真空爐10具備主加熱室21、及預備加熱室22。主加熱室21可將至少表面由單晶SiC構成之SiC基板40(單晶SiC基板)或後述之SiC晶種41加熱為1000℃以上且2300℃以下之溫度。預備加熱室2係用以於以主加熱室21加熱之前對SiC基板40或SiC晶種41等進行預備加熱之空間。 As shown in FIG. 1, the high temperature vacuum furnace 10 is provided with the main heating chamber 21 and the preliminary heating chamber 22. The main heating chamber 21 can heat at least a SiC substrate 40 (single crystal SiC substrate) having a surface composed of single crystal SiC or a SiC seed crystal 41 to be described later to a temperature of 1000 ° C or more and 2300 ° C or less. The preliminary heating chamber 2 is a space for preliminary heating of the SiC substrate 40, the SiC seed crystal 41, and the like before the main heating chamber 21 is heated.

於主加熱室21連接有真空形成用閥23、惰性氣體注入用閥24、及真空計25。真空形成用閥23可調整主加熱室21之真空度。惰性氣體注入用閥24,可調整主加熱室21內之惰性氣體(譬如Ar氣體)之壓力。真空計25可測量主加熱室21內之真空度。 A vacuum forming valve 23, an inert gas injecting valve 24, and a vacuum gauge 25 are connected to the main heating chamber 21. The vacuum forming valve 23 adjusts the degree of vacuum of the main heating chamber 21. The inert gas injection valve 24 can adjust the pressure of an inert gas (such as Ar gas) in the main heating chamber 21. The vacuum gauge 25 measures the degree of vacuum in the main heating chamber 21.

於主加熱室21之內部具備加熱器26。此外,於主加熱室21之側壁及天花板固定有省略圖示之熱反射金屬 板,此熱反射金屬板,係被構成為使加熱器26之熱朝主加熱室21之中央部反射。藉此,可強烈且均勻地加熱SiC基板40,進而使SiC基板40昇溫至1000℃以上且2300℃以下之溫度。再者,作為加熱器26,譬如可使用電阻加熱式之加熱器或高頻感應加熱式之加熱器。 A heater 26 is provided inside the main heating chamber 21. In addition, heat-reflecting metal (not shown) is fixed to the side wall and the ceiling of the main heating chamber 21 The plate, the heat reflective metal plate, is configured to reflect the heat of the heater 26 toward the central portion of the main heating chamber 21. Thereby, the SiC substrate 40 can be heated strongly and uniformly, and the SiC substrate 40 can be heated to a temperature of 1000 ° C or more and 2300 ° C or less. Further, as the heater 26, for example, a resistance heating type heater or a high frequency induction heating type heater can be used.

此外,SiC基板40,係於收容在碳化鉭製之坩堝(收容容器)30之狀態下被加熱。坩堝30係載置於適宜之支撐台等上,且被構成為藉由此支撐台移動,至少能自預備加熱室移動至主加熱室。坩堝30具備可相互嵌合之上容器31及下容器32。 Further, the SiC substrate 40 is heated while being housed in a crucible (storage container) 30 made of carbon carbide. The 坩埚30 series is placed on a suitable support table or the like, and is configured to move at least from the preliminary heating chamber to the main heating chamber by the support table. The crucible 30 is provided with a container 31 and a lower container 32 that can be fitted to each other.

於加熱處理SiC基板40或SiC晶種41等時,首先,如圖1中的點劃線所示,將坩堝30配置於高溫真空爐10之預加熱室22,以適宜之溫度(譬如約800℃)進行預備加熱。其次,使坩堝30移動至被預先昇溫至設定溫度(譬如,約1800℃)之主加熱室21。然後,一面調整壓力等一面加熱SiC基板40。再者,也可省略預備加熱。 When the SiC substrate 40 or the SiC seed crystal 41 or the like is heat-treated, first, the crucible 30 is placed in the preheating chamber 22 of the high-temperature vacuum furnace 10 as indicated by a chain line in FIG. 1 at a suitable temperature (for example, about 800). °C) Perform preparatory heating. Next, the crucible 30 is moved to the main heating chamber 21 which is previously heated to a set temperature (for example, about 1800 ° C). Then, the SiC substrate 40 is heated while adjusting the pressure or the like. Further, the preliminary heating may be omitted.

接著,對使用溶液生長法之方法之一即MSE法,使單晶SiC(磊晶層)自SiC晶種生長而製作SiC基板的方法進行說明。圖2為顯示藉由MSE法使SiC晶種生長時之構成例之示意圖。 Next, a method of producing a SiC substrate by growing a single crystal SiC (epitaxial layer) from a SiC seed crystal using the MSE method which is one of the methods of the solution growth method will be described. Fig. 2 is a view showing a constitution example in which SiC seed crystals are grown by the MSE method.

如圖2所示,於坩堝30之內部配置有SiC晶種41、Si板42、及餵碳基板(餵碳材料)43。此外,SiC晶種41係藉由基座33支撐。 As shown in FIG. 2, an SiC seed crystal 41, a Si plate 42, and a carbon-feeding substrate (carbon-feeding material) 43 are disposed inside the crucible 30. Further, the SiC seed crystal 41 is supported by the susceptor 33.

SiC晶種41,係作為液相磊晶生長之基材(種子側)而 使用。SiC晶種41,譬如藉由切割加工(切斷加工)規定大小之4H-SiC而被製作。此外,也可取代4H-SiC,改用6H-SiC。於SiC晶種41之上方配置有Si板42。 SiC seed crystal 41 is used as a substrate for liquid phase epitaxial growth (seed side) use. The SiC seed crystal 41 is produced, for example, by cutting (cutting) 4H-SiC of a predetermined size. In addition, it is also possible to replace 4H-SiC and switch to 6H-SiC. A Si plate 42 is disposed above the SiC seed crystal 41.

Si板42係Si製之板狀構件。因Si之熔點約為1400℃,因此藉由在上述高溫真空爐10中進行加熱,Si板42會熔化而成為Si熔體。於Si板42之上方配置有餵碳基板43。 The Si plate 42 is a plate-shaped member made of Si. Since the melting point of Si is about 1400 ° C, the Si plate 42 is melted by heating in the above high temperature vacuum furnace 10 to become a Si melt. A carbon feeding substrate 43 is disposed above the Si plate 42.

餵碳基板43,係作為供給碳之原料即餵碳側而被使用。餵碳基板43,係自由能較SiC晶種41高之基板(譬如,多晶3C-SiC製之基板)。 The carbon substrate 43 is used as a carbon supply side, that is, a carbon supply side. The carbon substrate 43 is fed to a substrate having a higher energy than the SiC seed crystal 41 (for example, a substrate made of polycrystalline 3C-SiC).

若如上述配置SiC晶種41、Si板42、及餵碳基板43,且以譬如1800℃進行加熱,則配置於SiC晶種41與餵碳基板43之間的Si板42熔化而成為Si熔體。此Si熔體,係作為用以使碳移動之溶媒發揮作用。 When the SiC seed crystal 41, the Si plate 42, and the carbon-feeding substrate 43 are disposed as described above and heated at, for example, 1800 ° C, the Si plate 42 disposed between the SiC seed crystal 41 and the carbon-importing substrate 43 is melted to become a Si-melt. body. This Si melt acts as a solvent for moving carbon.

具體而言,根據SiC晶種41與餵碳基板43之自由能之差,於Si熔體產生濃度梯度,此濃度梯度成為驅動力,自餵碳基板43朝Si熔體溶析C。被取入至Si熔體之C,朝下側(SiC晶種41側)移動,且在此作為單晶SiC析出至SiC晶種41之表面。 Specifically, a concentration gradient is generated in the Si melt according to the difference in free energy between the SiC seed crystal 41 and the carbon-implanted substrate 43, and this concentration gradient becomes a driving force, and C is eluted from the carbon substrate 43 toward the Si melt. C which is taken into the Si melt moves toward the lower side (the SiC seed crystal 41 side), and is deposited as a single crystal SiC onto the surface of the SiC seed crystal 41.

根據以上說明,可在SiC晶種41之表面藉由MSE法生長單晶SiC。藉此,可製作微管(micropipe)或結晶缺陷少之原子級平坦之SiC基板40(單晶SiC)。藉由在此SiC基板上,進行利用CVD法(化學汽相沉積法)或溶液生長法(譬如MSE法)等而使磊晶層生長之步驟、植入離子之步 驟、及使離子活化之回火步驟(加熱步驟)等,而製造半導體元件。 According to the above description, single crystal SiC can be grown on the surface of the SiC seed crystal 41 by the MSE method. Thereby, a micropipe or an atomic-scale flat SiC substrate 40 (single crystal SiC) having few crystal defects can be produced. The step of growing the epitaxial layer by the CVD method (chemical vapor deposition method) or the solution growth method (such as the MSE method) or the step of implanting ions is performed on the SiC substrate. The semiconductor element is fabricated by a tempering step (heating step) or the like for activating the ions.

接著,參照圖3,對藉由MSE法使單晶SiC生長時之基座33之材料進行說明。圖3為對將SiC用於基座之情況與將石墨用於基座之情況進行比較的顯微鏡照片。 Next, a material of the susceptor 33 when the single crystal SiC is grown by the MSE method will be described with reference to FIG. 3. Fig. 3 is a photomicrograph comparing the case where SiC is used for a susceptor and the case where graphite is used for a susceptor.

圖3(a)為使用SiC製之基座33進行MSE法之情況下的該基座33之表面之顯微鏡照片。如圖3(a)所示,若使用SiC製之基座33,會在基座33上大量產生SiC之微小結晶。此微小之結晶,會阻礙單晶SiC之生長。 Fig. 3(a) is a photomicrograph of the surface of the susceptor 33 in the case where the MSE method is performed using the susceptor 33 made of SiC. As shown in FIG. 3(a), when the susceptor 33 made of SiC is used, minute crystals of SiC are generated in a large amount on the susceptor 33. This tiny crystal can hinder the growth of single crystal SiC.

圖3(b)為使用石墨製之基座33進行MSE法之情況下的該基座33之表面之顯微鏡照片。如圖3(b)所示,若使用石墨製之基座33,與圖3(a)比較,不易在基座33上產生SiC之微小結晶。因此,藉由不使用SiC製而使用石墨製之基座33,可提高進行MSE法之情況下之單晶SiC的生長速度。根據以上說明可知,作為基座33之材料,石墨比SiC更適合。 Fig. 3(b) is a photomicrograph of the surface of the susceptor 33 in the case where the MSE method is performed using the susceptor 33 made of graphite. As shown in Fig. 3(b), when the base 33 made of graphite is used, it is difficult to produce minute crystals of SiC on the susceptor 33 as compared with Fig. 3(a). Therefore, by using the susceptor 33 made of graphite without using SiC, the growth rate of the single crystal SiC in the case of performing the MSE method can be improved. As can be seen from the above description, graphite is more suitable as a material of the susceptor 33 than SiC.

接著,參照圖4,對藉由MSE法使單晶SiC生長時之基座33之熱導率進行說明。圖4為對於使用熱導率不同之石墨製的基座33進行MSE法之情況,顯示生長後之單晶SiC之表面形狀之圖。 Next, the thermal conductivity of the susceptor 33 when the single crystal SiC is grown by the MSE method will be described with reference to FIG. Fig. 4 is a view showing the surface shape of the single crystal SiC after growth by performing the MSE method using the susceptor 33 made of graphite having different thermal conductivity.

圖4(a)為顯示用於實驗之石墨之熱導率的表。石墨(1)之熱導率為120W/(m.K),石墨(2)之熱導率為130W/(m.K),石墨(3)之熱導率為140W/(m.K)。再者,本說明書中,熱導率係使用以下之方法測得。即,使用加工成直徑 10mm、厚度3mm之樣本,利用雷射閃光熱量常數量測裝置TC-9000(Ulvac公司製),求取熱擴散率,且根據熱容量、容積密度,算出室溫之熱導率。 Figure 4 (a) is a table showing the thermal conductivity of graphite used in the experiment. The thermal conductivity of graphite (1) is 120W/(m.K), the thermal conductivity of graphite (2) is 130W/(m.K), and the thermal conductivity of graphite (3) is 140W/(m.K). . Further, in the present specification, the thermal conductivity is measured by the following method. That is, using processed into diameter A sample of 10 mm and a thickness of 3 mm was obtained by using a laser flash heat quantity measuring device TC-9000 (manufactured by Ulvac Co., Ltd.) to obtain a thermal diffusivity, and the thermal conductivity at room temperature was calculated from the heat capacity and the bulk density.

圖4(b)為顯示使用石墨(2)製之基座33,於1900℃且13.3kPa之氬氣環境下進行MSE法而使單晶SiC生長之情況下的該單晶SiC之表面形狀之圖。於圖4(b)之顯微鏡照片中,可明確地確認與SiC晶種41相同之六邊形,因此可知單晶SiC幾乎不生長。 4(b) is a view showing the surface shape of the single crystal SiC in the case where the single crystal SiC is grown by the MSE method at 1900 ° C and 13.3 kPa in an argon atmosphere using a susceptor 33 made of graphite (2). Figure. In the microscope photograph of FIG. 4(b), the hexagonal shape similar to the SiC seed crystal 41 was clearly confirmed, and thus it was found that the single crystal SiC hardly grew.

圖4(c)為顯示使用石墨(3)製之基座33,且以與上述相同之條件使單晶SiC生長之情況下之該單晶SiC的表面形狀之圖。在圖4(c)之顯微鏡照片中,不能明確地確認六邊形,而成為帶有圓角之形狀,因而與圖4(b)比較,可知單晶SiC在生長中。此外,圖4(b)及圖4(c)的尺度係相同尺度,顯然圖4(b)之單晶SiC更大。根據以上說明,與將石墨(2)用於基座之情況比較,藉由將石墨(3)用於基座,可使單晶SiC快速地生長。 Fig. 4 (c) is a view showing the surface shape of the single crystal SiC in the case where the single crystal SiC is grown under the same conditions as described above using the susceptor 33 made of graphite (3). In the micrograph of Fig. 4(c), the hexagon is not clearly confirmed and has a shape with rounded corners, so that compared with Fig. 4(b), it is understood that single crystal SiC is growing. In addition, the scales of FIGS. 4(b) and 4(c) are the same scale, and it is apparent that the single crystal SiC of FIG. 4(b) is larger. According to the above description, the single crystal SiC can be rapidly grown by using the graphite (3) for the susceptor as compared with the case where the graphite (2) is used for the susceptor.

作為根據熱導率而產生上述差異之理由,可考慮為如下。即,石墨(3)與石墨(2)比較,因熱導率高,因而可有效率地將SiC晶種41之熱傳導至基座33而排出。因此,藉由使用石墨(3)製之基座33,可防止SiC晶種41變為高溫。藉此,相較於SiC之分解,生長被優先進行,因而可使單晶SiC快速地生長。 The reason why the above difference occurs depending on the thermal conductivity can be considered as follows. That is, graphite (3) has a high thermal conductivity as compared with graphite (2), so that the heat of the SiC seed crystal 41 can be efficiently conducted to the susceptor 33 and discharged. Therefore, by using the susceptor 33 made of graphite (3), the SiC seed crystal 41 can be prevented from becoming high temperature. Thereby, growth is preferentially performed as compared with the decomposition of SiC, so that single crystal SiC can be rapidly grown.

再者,雖省略石墨(1)之表面形狀之顯微鏡照片,但與石墨(2)相同,得到了單晶SiC之生長速度不充分之結 果。鑒於以上考慮,可認為藉由使用熱導率大於130W/(m.K)之石墨製之基座33進行MSE法,具有可良好地生長單晶SiC之可能性。再者,較佳為,基座33之熱導率為140W/(m.K)以上。 Further, although the micrograph of the surface shape of the graphite (1) is omitted, the same as the graphite (2), the knot growth rate of the single crystal SiC is insufficient. fruit. In view of the above considerations, it is considered that the MSE method is performed by using the susceptor 33 made of graphite having a thermal conductivity of more than 130 W/(m.K), and there is a possibility that the single crystal SiC can be favorably grown. Further, it is preferable that the susceptor 33 has a thermal conductivity of 140 W/(m.K) or more.

接著,參照圖5,對基座33之大小與單晶SiC之生長速度之關係進行說明。 Next, the relationship between the size of the susceptor 33 and the growth rate of the single crystal SiC will be described with reference to FIG. 5.

圖5為對以支撐SiC晶種41之面的面積較該SiC晶種41大之基座33、及較其小之基座33,在1900℃且13.3kPa之氬氣環境下進行MSE法而使單晶SiC生長之情況下的a軸方向之生長速度(進行相同時間MSE法之情況下的a軸方向之生長長度)進行比較之圖表。再者,a軸方向係顯示與SiC晶種41之厚度方向垂直之方向(水平方向)。由圖5之圖表可知,使用面積較SiC晶種41大之基座33之情況,相較於使用面積較SiC晶種41小之基座33之情況,生長速度變快。 5 shows the MSE method in an argon atmosphere at 1900 ° C and 13.3 kPa in a susceptor 33 having a larger area than the SiC seed crystal 41 and a smaller pedestal 33 than the SiC seed crystal 41. The growth rate in the a-axis direction in the case of growing single crystal SiC (the growth length in the a-axis direction in the case of the same time MSE method) is compared. Further, the a-axis direction shows a direction (horizontal direction) perpendicular to the thickness direction of the SiC seed crystal 41. As is apparent from the graph of Fig. 5, in the case where the susceptor 33 having a larger area than the SiC seed crystal 41 is used, the growth rate becomes faster as compared with the case where the susceptor 33 having a smaller area than the SiC seed crystal 41 is used.

作為根據基座33之尺寸而產生上述差異之理由,可考慮為如下。即,於基座33之尺寸大之情況下,自SiC晶種41之全面傳導熱,因此可防止SiC晶種41變為高溫。藉此,相較於SiC之分解,生長被優先進行,因而可使單晶SiC快速地生長。鑒於以上考慮,較佳為,基座33之尺寸(詳細為支撐SiC晶種41之面之面積),係設為與SiC晶種41之尺寸(詳細為被支撐於基座33之面之面積)相同,或較SiC晶種41之尺寸大。 The reason why the above difference occurs depending on the size of the susceptor 33 can be considered as follows. That is, in the case where the size of the susceptor 33 is large, heat is transmitted from the entire SiC seed crystal 41, so that the SiC seed crystal 41 can be prevented from becoming high temperature. Thereby, growth is preferentially performed as compared with the decomposition of SiC, so that single crystal SiC can be rapidly grown. In view of the above considerations, it is preferable that the size of the susceptor 33 (in detail, the area of the surface supporting the SiC seed crystal 41) is set to be the size of the SiC seed crystal 41 (in detail, the area supported by the surface of the susceptor 33). The same or larger than the size of the SiC seed crystal 41.

如以上說明,於本實施形態之溶液生長法中,於使由 單晶SiC組成之SiC晶種41支撐在基座33之狀態且使至少包含Si及C之溶液接觸之狀態下,使磊晶層生長在該SiC晶種41上。此外,基座33中的至少與SiC晶種41接觸之部分,係石墨製。 As described above, in the solution growth method of the present embodiment, The SiC seed crystal 41 composed of a single crystal SiC is supported in the state of the susceptor 33, and the epitaxial layer is grown on the SiC seed crystal 41 in a state where at least a solution containing Si and C is brought into contact. Further, at least a portion of the susceptor 33 that is in contact with the SiC seed crystal 41 is made of graphite.

藉此,與譬如使用SiC製之基座33之情況比較,變得不易在基座33上產生SiC之微小之結晶。因此,磊晶層之生長變得難被阻礙,從而可使磊晶層(單晶SiC)快速地生長。 Thereby, compared with the case where the susceptor 33 made of SiC is used, it becomes difficult to generate minute crystals of SiC on the susceptor 33. Therefore, the growth of the epitaxial layer becomes difficult to be hindered, so that the epitaxial layer (single crystal SiC) can be rapidly grown.

此外,於本實施形態之溶液生長法中,基座33之石墨部分之熱導率,係大於130W/(m.K)。 Further, in the solution growth method of the present embodiment, the thermal conductivity of the graphite portion of the susceptor 33 is more than 130 W/(m.K).

藉此,藉由使用熱導率高之石墨作為基座33之材料,可防止SiC晶種41變為高溫。藉此,相較於SiC之分解,生長被優先進行,因而可使磊晶層快速地生長。 Thereby, by using graphite having a high thermal conductivity as a material of the susceptor 33, the SiC seed crystal 41 can be prevented from becoming high temperature. Thereby, growth is preferentially performed as compared with the decomposition of SiC, so that the epitaxial layer can be rapidly grown.

此外,於本實施形態之溶液生長法中,基座33中的支撐SiC晶種41之面之面積,係與SiC晶種41相同或較該SiC晶種41大。 Further, in the solution growth method of the present embodiment, the area of the surface of the susceptor 33 supporting the SiC seed crystal 41 is the same as or larger than that of the SiC seed crystal 41.

藉此,可有效率地使SiC晶種41之熱傳導至基座33,因此可防止SiC晶種41變為高溫。藉此,相較於SiC之分解,生長被優先進行,因而可使磊晶層快速地生長。 Thereby, the heat of the SiC seed crystal 41 can be efficiently conducted to the susceptor 33, so that the SiC seed crystal 41 can be prevented from becoming high temperature. Thereby, growth is preferentially performed as compared with the decomposition of SiC, so that the epitaxial layer can be rapidly grown.

以上,對本發明之較適之實施形態進行了說明,但上述之構成,譬如可變更如下。 Although the preferred embodiments of the present invention have been described above, the above-described configurations can be changed as follows.

作為用以進行溶液生長法之機器,上述中已說明之裝置係一例而已,可適宜變更。譬如,也可使用上述高溫真 空爐10以外之加熱裝置、或使用與坩堝30不同之形狀或材料之容器。此外,基座33之形狀也任意,譬如,SiC晶種41之支撐面,可為圓形,也可為六邊形。 As the apparatus for performing the solution growth method, the apparatus described above is an example and can be appropriately changed. For example, you can also use the above high temperature. A heating device other than the empty furnace 10 or a container having a shape or material different from the crucible 30. Further, the shape of the susceptor 33 is also arbitrary. For example, the support surface of the SiC seed crystal 41 may be a circular shape or a hexagonal shape.

上述之實施形態中,基座33係由一種材料構成,但只要至少與SiC晶種41接觸之部分之材料(較佳為,為了進行熱傳導而需要之厚度),為石墨即可。 In the above embodiment, the susceptor 33 is made of a single material, but it is only required to have at least a portion of the material in contact with the SiC seed crystal 41 (preferably, a thickness required for heat conduction).

作為用以進行溶液生長法之環境(溫度、壓力、氣體環境),上述中已說明之情況,係一例而已,可適宜變更。 As an environment (temperature, pressure, and gas atmosphere) for performing the solution growth method, the above-described cases are merely examples, and can be appropriately changed.

SiC晶種41中的用於磊晶層之生長之面,係任意,可為Si面,也可為C面。 The surface for the growth of the epitaxial layer in the SiC seed crystal 41 is arbitrary, and may be a Si surface or a C surface.

上述之實施形態中,作為溶液生長法,採用了MSE法,但也可採用其他之溶液生長法(譬如,藉由設置溫度梯度而使溶液中之C等移動之方法)。即使為其他之溶液生長法,藉由使用石墨製之基座33,可變得不易於基座上產生SiC之微小結晶,因此可使磊晶層之生長速度上昇。 In the above embodiment, the MSE method is employed as the solution growth method, but other solution growth methods (for example, a method of moving C in a solution by setting a temperature gradient) may be employed. Even in other solution growth methods, by using the susceptor 33 made of graphite, it is difficult to generate minute crystals of SiC on the susceptor, so that the growth rate of the epitaxial layer can be increased.

10‧‧‧高溫真空爐 10‧‧‧High temperature vacuum furnace

21‧‧‧主加熱室 21‧‧‧Main heating room

22‧‧‧預備加熱室 22‧‧‧Preparation heating room

23‧‧‧真空形成用閥 23‧‧‧Vacuum forming valve

24‧‧‧惰性氣體注入用閥 24‧‧‧Inert gas injection valve

25‧‧‧真空計 25‧‧‧ Vacuum gauge

26‧‧‧加熱器 26‧‧‧heater

30‧‧‧坩堝 30‧‧‧坩埚

31‧‧‧上容器 31‧‧‧Upper container

32‧‧‧下容器 32‧‧‧Under container

40‧‧‧SiC基板 40‧‧‧ SiC substrate

Claims (7)

一種溶液生長法,係於使由SiC組成之晶種支撐在基座的狀態且使至少包含Si及C之溶液接觸的狀態下,使磊晶層生長在該晶種上之方法,其特徵在於:上述基座中的至少與上述晶種接觸之部分,係石墨製。 A solution growth method is a method for growing an epitaxial layer on a seed crystal in a state in which a seed crystal composed of SiC is supported on a susceptor and a solution containing at least Si and C is brought into contact with each other, characterized in that The portion of the susceptor that is in contact with the seed crystal is made of graphite. 如請求項1之溶液生長法,其中,上述基座之石墨部分之熱導率大於130W/(m.K)。 The solution growth method of claim 1, wherein the graphite portion of the susceptor has a thermal conductivity greater than 130 W/(m.K). 如請求項1之溶液生長法,其中,上述基座中的支撐上述晶種之面的面積,係與上述晶種相同或較該晶種大。 The solution growth method of claim 1, wherein an area of the surface of the susceptor supporting the seed crystal is the same as or larger than the seed crystal. 如請求項1之溶液生長法,其中,上述溶液生長法,係一亞穩態溶媒磊晶法,即為、藉由於上述晶種與自由能較該晶種高且至少供給C之餵碳材料之間存在有Si熔體之狀態下進行加熱,使磊晶層生長在上述晶種之表面的方法。 The solution growth method of claim 1, wherein the solution growth method is a metastable solvent epitaxy method, that is, a carbon feed material having a higher seed crystal and free energy than the seed crystal and supplying at least C There is a method in which a Si melt is heated to grow an epitaxial layer on the surface of the seed crystal. 一種基座,係於使用溶液生長法而使磊晶層生長在由SiC組成之晶種時,支撐該晶種,其特徵在於:至少與上述晶種接觸之部分,係石墨製。 A susceptor is a substrate which is supported by a solution growth method in which a crystal growth layer is grown on a seed crystal composed of SiC, and is characterized in that at least a portion in contact with the seed crystal is made of graphite. 如請求項5之基座,其中,石墨部分之熱導率大於130W/(m.K)。 The susceptor of claim 5, wherein the graphite portion has a thermal conductivity greater than 130 W/(m.K). 一種單晶SiC之製造方法,其包含以下之步驟:使由SiC組成之晶種支撐在基座上,該基座之與該晶種接觸的部分為石墨製;及 於使至少包含Si及C之溶液接觸於被支撐在上述基座之上述晶種的狀態下,使磊晶層生長在該晶種上。 A method for producing single crystal SiC, comprising the steps of: supporting a seed crystal composed of SiC on a susceptor, wherein a portion of the susceptor in contact with the seed crystal is made of graphite; The epitaxial layer is grown on the seed crystal in a state in which the solution containing at least Si and C is brought into contact with the seed crystal supported on the susceptor.
TW105141438A 2015-12-14 2016-12-14 Solution growth method, pedestal, and method for producing single crystal SiC TW201726568A (en)

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