TW201725218A - Electronic device sealing agent and electronic device manufacturing method - Google Patents
Electronic device sealing agent and electronic device manufacturing method Download PDFInfo
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- TW201725218A TW201725218A TW105130532A TW105130532A TW201725218A TW 201725218 A TW201725218 A TW 201725218A TW 105130532 A TW105130532 A TW 105130532A TW 105130532 A TW105130532 A TW 105130532A TW 201725218 A TW201725218 A TW 201725218A
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- Prior art keywords
- electronic device
- meth
- present
- sealing agent
- compound
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000007789 sealing Methods 0.000 title abstract description 53
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- 238000000034 method Methods 0.000 claims abstract description 44
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- 238000000576 coating method Methods 0.000 claims description 18
- 239000003505 polymerization initiator Substances 0.000 claims description 11
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- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 235000013847 iso-butane Nutrition 0.000 description 1
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 150000002921 oxetanes Chemical class 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
- 235000019786 weight gain Nutrition 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Chemical & Material Sciences (AREA)
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- Manufacturing & Machinery (AREA)
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Abstract
Description
本發明係關於一種電子裝置用密封劑，其能夠利用噴墨法容易地進行塗佈，且接著性優異，能夠抑制釋氣之產生，減少殘留應力。又，本發明係關於一種使用該電子裝置用密封劑之電子裝置之製造方法。 The present invention relates to a sealant for an electronic device which can be easily applied by an inkjet method and which is excellent in adhesion and can suppress generation of outgas and reduce residual stress. Further, the present invention relates to a method of manufacturing an electronic device using the sealing agent for an electronic device.
近年來，使用有機電致發光(以下，亦稱為有機EL)顯示元件或有機薄膜太陽電池元件等有機薄膜元件之電子裝置之研究不斷發展。有機薄膜元件可利用真空蒸鍍或溶液塗佈等簡便地進行製作，因此生產性亦優異。 In recent years, research into electronic devices using organic thin film elements such as organic electroluminescence (hereinafter also referred to as organic EL) display elements or organic thin film solar cell elements has been progressing. The organic thin film element can be easily produced by vacuum deposition or solution coating, and is therefore excellent in productivity.
有機EL顯示元件具有於相互對向之一對電極間夾著有機發光材料層之積層體構造，藉由自一電極注入電子並自另一電極注入電洞至該有機發光材料層，而於有機發光材料層內使電子與電洞結合而發光。由於有機EL顯示元件以上述方式進行自發光，因此與需要背光裝置之液晶顯示元件等相比具有視認性良好，可實現薄型化，並且能夠進行直流低電壓驅動之優點。 The organic EL display element has a laminated body structure in which an organic light-emitting material layer is sandwiched between a pair of opposite electrodes, and an electron is injected from one electrode and a hole is injected from the other electrode to the organic light-emitting material layer. The electrons are combined with the holes to emit light in the luminescent material layer. Since the organic EL display element emits light in the above-described manner, it is excellent in visibility, can be made thinner, and can be driven by DC low voltage, compared with a liquid crystal display element or the like requiring a backlight device.
有機薄膜太陽電池元件與使用無機半導體之太陽電池相比，於成本、大面積化、製造步驟之容易性等方面優異，提出有各種構成 者。具體而言，例如於非專利文獻1中，揭示出使用酞菁銅與苝系色素之積層膜之有機太陽電池元件。 The organic thin film solar cell element is superior in cost, large area, and ease of manufacturing steps, compared with a solar cell using an inorganic semiconductor, and various compositions are proposed. By. Specifically, for example, Non-Patent Document 1 discloses an organic solar cell element using a laminated film of copper phthalocyanine and an anthraquinone dye.
該等有機薄膜元件若有機層或電極暴露於外部氣體，則存在其性能急遽劣化之問題。因此，為了提高穩定性及耐久性，必須將有機薄膜元件密封而與大氣中之水分或氧隔絕。 When the organic layer or the electrode is exposed to an external gas, the organic thin film element has a problem that its performance is rapidly deteriorated. Therefore, in order to improve stability and durability, it is necessary to seal the organic thin film element from moisture or oxygen in the atmosphere.
作為密封有機薄膜元件之方法，以往一般為利用於內部設置有吸水劑之密封罐而密封之方法。然而，於利用密封罐密封之方法中，難以使電子裝置薄型化。因此，正進行不使用密封罐之有機薄膜元件之密封方法之開發。 As a method of sealing an organic thin film element, a method of sealing with a sealed can having a water absorbing agent inside is generally used. However, in the method of sealing with a sealed can, it is difficult to make the electronic device thin. Therefore, development of a sealing method for an organic thin film element that does not use a sealed can is being carried out.
於專利文獻1中，揭示出利用藉由CVD法形成之氮化矽膜與樹脂膜之積層膜將有機EL顯示元件之有機發光材料層與電極密封之方法。此處，樹脂膜具有防止因氮化矽膜之內部應力所導致之對有機層或電極之壓迫的作用。 Patent Document 1 discloses a method of sealing an organic light-emitting material layer of an organic EL display element and an electrode by using a laminated film of a tantalum nitride film and a resin film formed by a CVD method. Here, the resin film has an effect of preventing compression of the organic layer or the electrode due to internal stress of the tantalum nitride film.
於專利文獻1所揭示之利用氮化矽膜進行密封之方法中，存在如下情況，即因有機薄膜元件之表面之凹凸或異物之附著、由內部應力所致之裂痕之產生等，而導致於形成氮化矽膜時無法將有機薄膜元件完全被覆。若利用氮化矽膜進行之被覆不完全，則水分會通過氮化矽膜滲入至有機層內。 In the method of sealing by a tantalum nitride film disclosed in Patent Document 1, there is a case where irregularities on the surface of the organic thin film element, adhesion of foreign matter, generation of cracks due to internal stress, and the like are caused. When the tantalum nitride film is formed, the organic thin film element cannot be completely covered. If the coating by the tantalum nitride film is incomplete, moisture penetrates into the organic layer through the tantalum nitride film.
作為用以防止水分滲入至有機層內之方法，於專利文獻2中，揭示出交替地蒸鍍無機材料膜與樹脂膜之方法，於專利文獻3及專利文獻4中，揭示出於無機材料膜上形成樹脂膜之方法。 In the method of preventing the infiltration of moisture into the organic layer, Patent Document 2 discloses a method of alternately vapor-depositing an inorganic material film and a resin film, and Patent Document 3 and Patent Document 4 disclose an inorganic material film. A method of forming a resin film thereon.
作為形成樹脂膜之方法，有於利用噴墨法將低黏度之密封劑 塗佈於基材上之後，使該密封劑硬化之方法。若使用此種利用噴墨法之塗佈方法，則能夠高速且均勻地形成樹脂膜。然而，於為了適於利用噴墨法之塗佈而使密封劑變為低黏度之情形時，存在產生釋氣，或者交聯度過高，因由硬化收縮產生之殘留應力而產生接著性之下降或電子裝置之故障等問題。 As a method of forming a resin film, there is a low viscosity sealant by an inkjet method A method of hardening the sealant after being applied to a substrate. When such a coating method by an inkjet method is used, a resin film can be formed at a high speed and uniformly. However, in the case where the sealant is made to have a low viscosity in order to be suitable for coating by the inkjet method, there is a generation of outgas, or the degree of crosslinking is too high, and the adhesiveness due to the hardening shrinkage causes a decrease in adhesion. Or problems with the failure of the electronic device.
專利文獻1：日本特開2000-223264號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2000-223264
專利文獻2：日本特表2005-522891號公報 Patent Document 2: Japanese Patent Publication No. 2005-522891
專利文獻3：日本特開2001-307873號公報 Patent Document 3: Japanese Laid-Open Patent Publication No. 2001-307873
專利文獻4：日本特開2008-149710號公報 Patent Document 4: Japanese Laid-Open Patent Publication No. 2008-149710
非專利文獻1：Applied Physics Letters(1986, Vol. 48, P. 183) Non-Patent Document 1: Applied Physics Letters (1986, Vol. 48, P. 183)
本發明之目的在於提供一種電子裝置用密封劑，其能夠利用噴墨法容易地進行塗佈，且接著性優異，能夠抑制釋氣之產生，減少殘留應力。又，本發明之目的在於提供一種使用該電子裝置用密封劑之電子裝置之製造方法。 An object of the present invention is to provide a sealant for an electronic device which can be easily applied by an inkjet method and which is excellent in adhesion, and can suppress generation of outgas and reduce residual stress. Moreover, an object of the present invention is to provide a method of manufacturing an electronic device using the sealing agent for an electronic device.
本發明係一種電子裝置用密封劑，其係用於利用噴墨法之塗 佈者，且含有聚合性化合物與光自由基聚合起始劑，上述聚合性化合物含有：多官能(甲基)丙烯酸化合物，其於1分子中具有2個以上之(甲基)丙烯醯氧基，且於主鏈具有聚氧伸烷基骨架；以及單官能(甲基)丙烯酸化合物，其於1分子中具有1個(甲基)丙烯醯氧基及1個以上之陽離子聚合性基。 The present invention relates to an encapsulant for electronic devices, which is used for coating by an inkjet method A polymerizable compound and a photoradical polymerization initiator are contained, and the polymerizable compound contains a polyfunctional (meth)acrylic compound having two or more (meth)acryloxy groups in one molecule. Further, the main chain has a polyoxyalkylene group skeleton; and a monofunctional (meth)acrylic compound having one (meth)acryloxy group and one or more cationic polymerizable groups in one molecule.
以下，對本發明進行詳細敍述。 Hereinafter, the present invention will be described in detail.
本發明者等人發現：藉由將於1分子中具有2個以上之(甲基)丙烯醯氧基且於主鏈具有聚氧伸烷基骨架之多官能(甲基)丙烯酸化合物、以及於1分子中具有1個(甲基)丙烯醯氧基及1個以上之陽離子聚合性基之單官能(甲基)丙烯酸化合物組合用作用於電子裝置用密封劑之聚合性化合物，能夠利用噴墨法容易地塗佈所獲得之密封劑，且接著性優異，能夠抑制釋氣之產生，減少殘留應力，從而完成本發明。 The present inventors have found that a polyfunctional (meth)acrylic compound having two or more (meth)acryloxycarbonyl groups in one molecule and a polyoxyalkylene group in the main chain, and A combination of a monofunctional (meth)acrylic compound having one (meth)acryloxy group and one or more cationic polymerizable groups in one molecule is used as a polymerizable compound for a sealing agent for electronic devices, and inkjet can be used. The method is easy to apply the obtained sealant, and is excellent in adhesiveness, suppresses generation of outgas, and reduces residual stress, thereby completing the present invention.
本發明之電子裝置用密封劑含有聚合性化合物。 The sealing agent for electronic devices of the present invention contains a polymerizable compound.
上述聚合性化合物含有1分子中具有2個以上之(甲基)丙烯醯氧基且於主鏈具有聚氧伸烷基骨架之多官能(甲基)丙烯酸化合物(以下，亦稱為「本發明之多官能(甲基)丙烯酸化合物」)。藉由含有本發明之多官能(甲基)丙烯酸化合物，本發明之電子裝置用密封劑之利用噴墨法之塗佈性或成膜性優異。又，本發明之多官能(甲基)丙烯酸化合物亦具有使所獲得之電子裝置用密封劑之耐熱性提高之效果。 The polymerizable compound contains a polyfunctional (meth)acrylic compound having two or more (meth)acryloyloxy groups in one molecule and having a polyoxyalkylene group skeleton in the main chain (hereinafter, also referred to as "the present invention" Polyfunctional (meth)acrylic compound"). By using the polyfunctional (meth)acrylic compound of the present invention, the sealant for an electronic device of the present invention is excellent in coatability or film formability by an inkjet method. Moreover, the polyfunctional (meth)acrylic compound of the present invention also has an effect of improving the heat resistance of the obtained sealing agent for electronic devices.
再者，於本說明書中，上述「(甲基)丙烯醯基」係指丙烯醯基或甲基丙烯醯基，上述「(甲基)丙烯酸」係指丙烯酸或甲基丙烯酸。 In the present specification, the above "(meth)acryl fluorenyl group" means an acryl fluorenyl group or a methacryl fluorenyl group, and the above "(meth)acrylic acid" means acrylic acid or methacrylic acid.
本發明之多官能(甲基)丙烯酸化合物於主鏈具有聚氧伸烷基骨架。本發明之多官能(甲基)丙烯酸化合物具有之聚氧伸烷基骨架具有提 高利用噴墨法之本發明之電子裝置用密封劑之塗佈性之作用。又，上述聚氧伸烷基骨架亦具有以下效果，即減少使噴墨裝置之噴頭部分等所使用之接著劑或橡膠材料膨潤等對裝置之損害，或者提高對無機材料膜之潤濕性或塗佈後及硬化後之平坦性。 The polyfunctional (meth)acrylic compound of the present invention has a polyoxyalkylene skeleton in the main chain. The polyfunctional (meth)acrylic compound of the present invention has a polyoxyalkylene group having a The effect of the coatability of the sealant for electronic devices of the present invention which is highly utilized by the ink jet method. Further, the polyoxyalkylene group skeleton has an effect of reducing damage to the device by swelling of an adhesive or a rubber material used in a head portion of the ink jet device or the like, or improving wettability to an inorganic material film or Flatness after coating and after hardening.
本發明之多官能(甲基)丙烯酸化合物具有之聚氧伸烷基骨架就利用噴墨法之塗佈性或接著性或硬化物之柔軟性更優異之方面而言，較佳為氧伸烷基單元連續2~6個者。 The polyoxyalkylene group-containing compound of the present invention preferably has an oxygen-extended alkyl group in terms of coating property or adhesion of an inkjet method or softness of a cured product. The base unit is 2 to 6 consecutive.
作為構成本發明之多官能(甲基)丙烯酸化合物具有之上述聚氧伸烷基骨架之氧伸烷基單元，可列舉氧化乙烯單元、氧化丙烯單元等。 Examples of the oxygen-extended alkyl unit constituting the polyoxyalkylene group skeleton of the polyfunctional (meth)acrylic compound of the present invention include an ethylene oxide unit and an oxypropylene unit.
本發明之多官能(甲基)丙烯酸化合物就容易使所獲得之電子裝置用密封劑成為適於噴墨法之黏度等觀點而言，較佳為碳鏈之分支較少之結構，更佳為直鏈狀。 The polyfunctional (meth)acrylic compound of the present invention is preferable in that the obtained sealing agent for an electronic device is suitable for the viscosity of an inkjet method, and the like, and preferably has a structure in which a carbon chain has few branches, and more preferably Straight chain.
作為本發明之多官能(甲基)丙烯酸化合物，具體而言，例如可列舉：二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、四丙二醇二(甲基)丙烯酸酯、聚四亞甲基二醇二(甲基)丙烯酸酯等。 Specific examples of the polyfunctional (meth)acrylic compound of the present invention include diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, and tetraethylene glycol. (Meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, tetrapropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylic acid Ester and the like.
再者，於本說明書中，上述「(甲基)丙烯酸酯」係指丙烯酸酯或甲基丙烯酸酯。 In the present specification, the above "(meth) acrylate" means acrylate or methacrylate.
本發明之多官能(甲基)丙烯酸化合物之含量相對於聚合性化合物整體100重量份，較佳之下限為10重量份，較佳之上限為90重量份。藉由使本發明之多官能(甲基)丙烯酸化合物之含量為該範圍，所獲得之電子裝置用密封劑之利用噴墨法之塗佈性、減少對噴墨裝置之損害之效果、以 及提高對無機材料膜之潤濕性或塗佈後及硬化後之平坦性之效果更優異。本發明之多官能(甲基)丙烯酸化合物之含量之更佳之下限為40重量份，更佳之上限為70重量份。 The content of the polyfunctional (meth)acrylic compound of the present invention is preferably 10 parts by weight, more preferably 90 parts by weight, based on 100 parts by weight of the total of the polymerizable compound. When the content of the polyfunctional (meth)acrylic compound of the present invention is in this range, the coating property of the obtained sealing agent for electronic devices by the inkjet method is reduced, and the effect on damage to the inkjet device is reduced. And the effect of improving the wettability of the inorganic material film or the flatness after coating and hardening is more excellent. A more preferred lower limit of the content of the polyfunctional (meth)acrylic compound of the present invention is 40 parts by weight, and a more preferred upper limit is 70 parts by weight.
上述聚合性化合物含有1分子中具有1個(甲基)丙烯醯氧基及1個以上之陽離子聚合性基之單官能(甲基)丙烯酸化合物(以下，亦簡稱為「本發明之單官能(甲基)丙烯酸化合物」)。藉由含有本發明之單官能(甲基)丙烯酸化合物，本發明之電子裝置用密封劑可提高柔軟性，減少殘留應力，藉此接著性優異。又，由於本發明之單官能(甲基)丙烯酸化合物於分子內具有陽離子聚合性基，故而亦具有藉由捕獲原料中所含有之酸性成分、或因樹脂之分解所產生之酸而減少所獲得之電子裝置用密封劑之釋氣之效果。 The polymerizable compound contains a monofunctional (meth)acrylic compound having one (meth)acryloxy group and one or more cationic polymerizable groups in one molecule (hereinafter, also simply referred to as "the monofunctional (in the present invention) Methyl) acrylate compound"). By containing the monofunctional (meth)acrylic compound of the present invention, the sealing agent for an electronic device of the present invention can improve flexibility and reduce residual stress, and is excellent in adhesion. Further, since the monofunctional (meth)acrylic compound of the present invention has a cationically polymerizable group in the molecule, it is also obtained by reducing the acid component contained in the raw material or the acid generated by decomposition of the resin. The effect of the outgassing of the sealant for electronic devices.
作為本發明之單官能(甲基)丙烯酸化合物具有之陽離子聚合性基，例如可列舉：乙烯醚基、環氧基、氧雜環丁基、烯丙醚基、乙烯基、羥基等。 The cationically polymerizable group which the monofunctional (meth)acrylic compound of the present invention has may, for example, be a vinyl ether group, an epoxy group, an oxetanyl group, an allyl ether group, a vinyl group or a hydroxyl group.
作為本發明之單官能(甲基)丙烯酸化合物，具體而言，例如可列舉：(甲基)丙烯酸3,4-環氧環己基甲酯、(甲基)丙烯酸環氧丙酯、(甲基)丙烯酸4-羥基丁酯環氧丙醚、(甲基)丙烯酸2-(2-乙烯氧基乙氧基)乙酯、3-乙基-3-(甲基)丙烯醯氧基甲基氧雜環丁烷、(甲基)丙烯酸烯丙酯、甲氧基二乙二醇(甲基)丙烯酸酯、甲氧基三乙二醇(甲基)丙烯酸酯、乙氧基二乙二醇(甲基)丙烯酸酯、乙氧基三乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸2-(2-乙烯氧基乙氧基)乙酯等。 Specific examples of the monofunctional (meth)acrylic compound of the present invention include 3,4-epoxycyclohexylmethyl (meth)acrylate, glycidyl (meth)acrylate, and (methyl). ) 4-hydroxybutyl acrylate propylene diacrylate, 2-(2-vinyloxyethoxy)ethyl (meth) acrylate, 3-ethyl-3-(methyl) propylene methoxymethyl oxygen Heterocyclic butane, allyl (meth) acrylate, methoxy diethylene glycol (meth) acrylate, methoxy triethylene glycol (meth) acrylate, ethoxy diethylene glycol ( Methyl) acrylate, ethoxytriethylene glycol (meth) acrylate, 2-(2-vinyloxyethoxy)ethyl (meth) acrylate, and the like.
本發明之單官能(甲基)丙烯酸化合物之含量相對於聚合性 化合物整體100重量份，較佳之下限為10重量份，較佳之上限為90重量份。藉由使本發明之單官能(甲基)丙烯酸化合物之含量為該範圍，所獲得之電子裝置用密封劑之柔軟性、接著性、及低釋氣性更優異。本發明之單官能(甲基)丙烯酸化合物之含量之更佳之下限為20重量份，更佳之上限為50重量份。 The content of the monofunctional (meth)acrylic compound of the present invention relative to the polymerizability The total amount of the compound is 100 parts by weight, preferably 10 parts by weight, and preferably the upper limit is 90 parts by weight. When the content of the monofunctional (meth)acrylic compound of the present invention is in this range, the obtained sealing agent for an electronic device is more excellent in flexibility, adhesion, and low outgassing property. A more preferred lower limit of the content of the monofunctional (meth)acrylic compound of the present invention is 20 parts by weight, and a more preferred upper limit is 50 parts by weight.
本發明之多官能(甲基)丙烯酸化合物與本發明之單官能(甲基)丙烯酸化合物之含有比例按重量比計，較佳為多官能(甲基)丙烯酸化合物：單官能(甲基)丙烯酸化合物=7：3~3：7。藉由使本發明之多官能(甲基)丙烯酸化合物與本發明之單官能(甲基)丙烯酸化合物之含有比例成為該範圍，能夠使所獲得之電子裝置用密封劑之利用噴墨法之塗佈性、成膜性、耐熱性、接著性、柔軟性更優異。本發明之多官能(甲基)丙烯酸化合物與本發明之單官能(甲基)丙烯酸化合物之含有比例按重量比計，更佳為多官能(甲基)丙烯酸化合物：單官能(甲基)丙烯酸化合物=6：4~4：6。 The content ratio of the polyfunctional (meth)acrylic compound of the present invention to the monofunctional (meth)acrylic compound of the present invention is preferably a polyfunctional (meth)acrylic compound: monofunctional (meth)acrylic acid. Compound = 7:3~3:7. By setting the content ratio of the polyfunctional (meth)acrylic compound of the present invention to the monofunctional (meth)acrylic compound of the present invention in this range, the obtained sealing agent for electronic devices can be coated by an inkjet method. It is more excellent in cloth properties, film formability, heat resistance, adhesion, and flexibility. The content ratio of the polyfunctional (meth)acrylic compound of the present invention to the monofunctional (meth)acrylic compound of the present invention is preferably a polyfunctional (meth)acrylic compound: monofunctional (meth)acrylic acid. Compound = 6: 4 to 4: 6.
上述聚合性化合物除了本發明之多官能(甲基)丙烯酸化合物及本發明之單官能(甲基)丙烯酸化合物以外，亦可含有其他聚合性化合物以實現黏度調整或進一步提高接著性等。 In addition to the polyfunctional (meth)acrylic compound of the present invention and the monofunctional (meth)acrylic compound of the present invention, the polymerizable compound may contain other polymerizable compounds to achieve viscosity adjustment or further improve adhesion.
作為上述其他聚合性化合物，可列舉：除本發明之多官能(甲基)丙烯酸化合物及本發明之單官能(甲基)丙烯酸化合物以外之其他(甲基)丙烯酸化合物、環氧化合物、氧雜環丁烷化合物、或乙烯醚化合物等其他陽離子聚合性化合物等，但就低釋氣性等觀點而言，較佳為不含上述其他陽離子聚合性化合物。於含有上述其他陽離子聚合性化合物之情形時，上述其他陽離子聚合性化合物之含量相對於聚合性化合物整體100重量份，較佳之上限 為1重量份。 Examples of the other polymerizable compound include a (meth)acrylic compound, an epoxy compound, and an oxa compound other than the polyfunctional (meth)acrylic compound of the present invention and the monofunctional (meth)acrylic compound of the present invention. Although a cyclobutane compound or another cationically polymerizable compound, such as a vinyl ether compound, is preferable, it is preferable to contain the above-mentioned other cationically polymerizable compound from a viewpoint of low gas-release property. In the case of containing the above other cationically polymerizable compound, the content of the other cationically polymerizable compound is preferably an upper limit with respect to 100 parts by weight of the entire polymerizable compound. It is 1 part by weight.
作為上述其他(甲基)丙烯酸化合物，例如可列舉：(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸月桂酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯等。該等其他(甲基)丙烯酸化合物可單獨使用，亦可將2種以上組合使用。 Examples of the other (meth)acrylic compound include dicyclopentenyl (meth)acrylate, dicyclopentanyl (meth)acrylate, benzyl (meth)acrylate, and lauryl (meth)acrylate. 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, trishydroxy Methylpropane tri(meth)acrylate, and the like. These other (meth)acrylic compounds may be used singly or in combination of two or more.
作為上述環氧化合物，例如可列舉：雙酚A型環氧樹脂、雙酚E型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、雙酚O型環氧樹脂、2,2'-二烯丙基雙酚A型環氧樹脂、脂環式環氧樹脂、氫化雙酚型環氧樹脂、環氧丙烷加成雙酚A型環氧樹脂、間苯二酚型環氧樹脂、聯苯型環氧樹脂、硫醚型環氧樹脂、二苯醚型環氧樹脂、二環戊二烯型環氧樹脂、萘型環氧樹脂、苯酚酚醛清漆型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂、二環戊二烯酚醛清漆型環氧樹脂、聯苯酚醛清漆型環氧樹脂、萘酚酚醛清漆型環氧樹脂、環氧丙胺型環氧樹脂、烷基多元醇型環氧樹脂、橡膠改質型環氧樹脂、環氧丙酯化合物等。其中，較佳為脂環式環氧樹脂。 Examples of the epoxy compound include a bisphenol A epoxy resin, a bisphenol E epoxy resin, a bisphenol F epoxy resin, a bisphenol S epoxy resin, and a bisphenol O epoxy resin. 2,2'-Diallyl bisphenol A epoxy resin, alicyclic epoxy resin, hydrogenated bisphenol epoxy resin, propylene oxide addition bisphenol A epoxy resin, resorcinol type Epoxy resin, biphenyl type epoxy resin, thioether type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, phenol novolak type epoxy resin, O-cresol novolak type epoxy resin, dicyclopentadiene novolac type epoxy resin, biphenyl novolak type epoxy resin, naphthol novolac type epoxy resin, epoxidized epoxide type epoxy resin, alkyl group Polyol type epoxy resin, rubber modified epoxy resin, glycidyl ester compound, and the like. Among them, an alicyclic epoxy resin is preferred.
作為上述脂環式環氧樹脂中之市售者，例如可列舉：Celloxide 2000、Celloxide 2021P、Celloxide 2081、Celloxide 3000、Celloxide 8000、Cyclomer M100(均為DAICEL公司製造)、SANSOCIZER EPS(新日本理化工業公司製造)等。 As a commercial one of the above-mentioned alicyclic epoxy resins, Celloxide 2000, Celloxide 2021P, Celloxide 2081, Celloxide 3000, Celloxide 8000, Cyclomer M100 (all manufactured by DAICEL), SANSOCIZER EPS (New Japan Physical and Chemical Industry) Company manufacturing) and so on.
該等環氧化合物可單獨使用，亦可將2種以上組合使用。 These epoxy compounds may be used singly or in combination of two or more.
作為上述氧雜環丁烷化合物，例如可列舉：苯氧基甲基氧雜環丁烷、3-乙基-3-羥基甲基氧雜環丁烷、3-乙基-3-(苯氧甲基)氧雜環丁烷、 3-乙基-3-((2-乙基己氧基)甲基)氧雜環丁烷、3-乙基-3-((3-(三乙氧基矽基)丙氧基)甲基)氧雜環丁烷、3-乙基-3-(((3-乙基氧雜環丁烷-3-基)甲氧基)甲基)氧雜環丁烷、氧雜環丁基倍半矽氧烷、苯酚酚醛清漆氧雜環丁烷、1,4-雙(((3-乙基-3-氧雜環丁基)甲氧基)甲基)苯等。該等氧雜環丁烷化合物可單獨使用，亦可將2種以上組合使用。 Examples of the oxetane compound include phenoxymethyloxetane, 3-ethyl-3-hydroxymethyloxetane, and 3-ethyl-3-(phenoxy). Methyl)oxetane, 3-ethyl-3-((2-ethylhexyloxy)methyl)oxetane, 3-ethyl-3-((3-(triethoxyindolyl)propoxy)-methyl Oxycyclobutane, 3-ethyl-3-(((3-ethyloxetan-3-yl)methoxy)methyl)oxetane, oxetanyl Sesquiterpene oxide, phenol novolac oxetane, 1,4-bis((3-ethyl-3-oxetanyl)methoxy)methyl)benzene, and the like. These oxetane compounds may be used singly or in combination of two or more.
作為上述乙烯醚化合物，例如可列舉：苄基乙烯醚、環己烷二甲醇單乙烯醚、二環戊二烯乙烯醚、1,4-丁二醇二乙烯醚、環己烷二甲醇二乙烯醚、二乙二醇二乙烯醚、三乙二醇二乙烯醚、二丙二醇二乙烯醚、三丙二醇二乙烯醚等。該等乙烯醚化合物可單獨使用，亦可將2種以上組合使用。 Examples of the vinyl ether compound include benzyl vinyl ether, cyclohexane dimethanol monovinyl ether, dicyclopentadiene vinyl ether, 1,4-butanediol divinyl ether, and cyclohexane dimethanol divinyl ether. Ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, dipropylene glycol divinyl ether, tripropylene glycol divinyl ether, and the like. These vinyl ether compounds may be used singly or in combination of two or more.
上述其他聚合性化合物之含量相對於聚合性化合物整體100重量份，較佳之下限為1重量份，較佳之上限為20重量份。藉由使上述其他聚合性化合物之含量為該範圍，不會大量產生釋氣，或使應力緩和性變差，能夠發揮黏度調整或進一步提高接著性等效果。上述其他聚合性化合物之含量之更佳之下限為3重量份，更佳之上限為10重量份。 The content of the other polymerizable compound is preferably 1 part by weight, and preferably 20 parts by weight, based on 100 parts by weight of the total amount of the polymerizable compound. When the content of the other polymerizable compound is within this range, the outgas is not generated in a large amount, or the stress relaxation property is deteriorated, and the effect of adjusting the viscosity or further improving the adhesion can be exhibited. A more preferred lower limit of the content of the other polymerizable compound is 3 parts by weight, and a more preferred upper limit is 10 parts by weight.
再者，如上所述，於含有上述其他陽離子聚合性化合物之情形時，上述其他陽離子聚合性化合物之含量相對於聚合性化合物整體100重量份，較佳之上限為1重量份。 In the case where the other cationically polymerizable compound is contained, the content of the other cationically polymerizable compound is preferably 1 part by weight based on 100 parts by weight of the total of the polymerizable compound.
本發明之電子裝置用密封劑含有光自由基聚合起始劑。 The sealant for an electronic device of the present invention contains a photoradical polymerization initiator.
作為上述光自由基聚合起始劑，例如可列舉：二苯甲酮系化合物、苯乙酮系化合物、醯基氧化膦系化合物、二茂鈦系化合物、肟酯系化合物、安息香醚系化合物、苯偶醯、9-氧硫系化合物等。 Examples of the photoradical polymerization initiator include a benzophenone compound, an acetophenone compound, a fluorenyl phosphine oxide compound, a titanocene compound, an oxime ester compound, and a benzoin ether compound. Benzene oxime, 9-oxo sulphur A compound or the like.
作為上述光自由基聚合起始劑中之市售者，例如可列舉：IRGACURE 184、IRGACURE 369、IRGACURE 379、IRGACURE 651、IRGACURE 819、IRGACURE 907、IRGACURE 2959、IRGACURE OXE01、Lucirin TPO(均為BASF公司製造)、安息香甲醚、安息香乙醚、安息香異丙醚(均為東京化成工業公司製造)等。 As a commercial one of the above-mentioned photoradical polymerization initiators, for example, IRGACURE 184, IRGACURE 369, IRGACURE 379, IRGACURE 651, IRGACURE 819, IRGACURE 907, IRGACURE 2959, IRGACURE OXE01, Lucirin TPO (both are BASF Corporation) Manufactured, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether (all manufactured by Tokyo Chemical Industry Co., Ltd.), and the like.
上述光自由基聚合起始劑之含量相對於上述聚合性化合物100重量份，較佳之下限為0.5重量份，較佳之上限為20重量份。藉由使上述光自由基聚合起始劑之含量為該範圍，即便低黏度之本發明之電子裝置用密封劑於利用噴墨法進行塗佈後潤濕擴散而使與成為阻礙硬化之原因之氧接觸之面積變大，亦能夠充分地硬化，能夠抑制釋氣之產生並獲得均勻之硬化物。上述光自由基聚合起始劑之含量之更佳之下限為10重量份，更佳之上限為15重量份。 The content of the photoradical polymerization initiator is preferably 0.5 parts by weight, more preferably 20 parts by weight, based on 100 parts by weight of the polymerizable compound. When the content of the photoradical polymerization initiator is within this range, even if the sealing agent for an electronic device of the present invention having a low viscosity is wet-diffused after being applied by an inkjet method, the sealing agent becomes a cause of hindering hardening. When the area of the oxygen contact becomes large, it can be sufficiently hardened, and generation of outgas can be suppressed and a uniform cured product can be obtained. A more preferred lower limit of the content of the above photoradical polymerization initiator is 10 parts by weight, and a more preferred upper limit is 15 parts by weight.
本發明之電子裝置用密封劑亦可含有矽烷偶合劑。上述矽烷偶合劑具有使本發明之電子裝置用密封劑與基板等之接著性提高之作用。 The sealant for an electronic device of the present invention may further contain a decane coupling agent. The decane coupling agent has an effect of improving the adhesion between the sealing agent for an electronic device of the present invention and a substrate.
作為上述矽烷偶合劑，例如可列舉：3-胺基丙基三甲氧基矽烷、3-巰基丙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-異氰酸酯基丙基三甲氧基矽烷等。該等矽烷化合物可單獨使用，亦可併用2種以上。 Examples of the above decane coupling agent include 3-aminopropyltrimethoxydecane, 3-mercaptopropyltrimethoxydecane, 3-glycidoxypropyltrimethoxydecane, and 3-isocyanatepropylpropane. Trimethoxy decane and the like. These decane compounds may be used singly or in combination of two or more.
上述矽烷偶合劑之含量相對於上述聚合性化合物100重量份，較佳之下限為0.1重量份，較佳之上限為10重量份。藉由使上述矽烷偶合劑之含量為該範圍，能夠抑制剩餘之矽烷偶合劑滲出，並且發揮提高接著性之效果。上述矽烷偶合劑之含量之更佳之下限為0.5重量份，更佳之 上限為5重量份。 The content of the above decane coupling agent is preferably 0.1 part by weight, more preferably 10 parts by weight, based on 100 parts by weight of the polymerizable compound. When the content of the above decane coupling agent is within this range, the remaining decane coupling agent can be prevented from oozing out, and the effect of improving the adhesion can be exhibited. A lower limit of the content of the above decane coupling agent is preferably 0.5 parts by weight, more preferably The upper limit is 5 parts by weight.
本發明之電子裝置用密封劑亦可進而於不妨礙本發明之目的之範圍內含有表面改質劑。藉由含有上述表面改質劑，能夠對本發明之電子裝置用密封劑賦予塗膜之平坦性。 The sealant for an electronic device of the present invention may further contain a surface modifier in a range that does not impair the object of the present invention. By including the surface modifying agent, the flatness of the coating film can be imparted to the sealing agent for electronic devices of the present invention.
作為上述表面改質劑，例如可列舉界面活性劑或調平劑等。 Examples of the surface modifier include a surfactant, a leveling agent, and the like.
作為上述表面改質劑，例如可列舉聚矽氧系或氟系等之表面改質劑。 As the surface modifier, for example, a surface modifier such as a polyfluorene-based or fluorine-based one may be mentioned.
作為上述表面改質劑中之市售者，例如可列舉：BYK-340、BYK-345(均為BYK-Chemie Japan公司製造)、Surflon S-611(AGC清美化學公司製造)等。 For example, BYK-340, BYK-345 (all manufactured by BYK-Chemie Japan Co., Ltd.), Surflon S-611 (manufactured by AGC Seimi Chemical Co., Ltd.), and the like are mentioned as a commercially available person.
本發明之電子裝置用密封劑亦可含有有機溶劑以實現黏度調整等，但在用於有機EL顯示元件之情形時，存在因殘留之有機溶劑而導致有機發光材料層劣化，或產生釋氣等問題，因此較佳為不含有機溶劑。 The sealing agent for an electronic device of the present invention may contain an organic solvent to achieve viscosity adjustment or the like. However, when used in an organic EL display device, the organic light-emitting material layer may be deteriorated due to residual organic solvent, or outgassing may occur. The problem is therefore preferably free of organic solvents.
又，本發明之電子裝置用密封劑亦可視需要含有補強劑、軟化劑、塑化劑、黏度調整劑、紫外線吸收劑、抗氧化劑等公知之各種添加劑。 Further, the sealing agent for an electronic device of the present invention may optionally contain various additives such as a reinforcing agent, a softening agent, a plasticizer, a viscosity adjusting agent, an ultraviolet absorber, and an antioxidant.
作為製造本發明之電子裝置用密封劑之方法，例如可列舉使用勻相分散機、均質混合器、萬能混合機、行星式混合機、捏合機、三輥研磨機等混合機，將聚合性化合物、光自由基聚合起始劑、及視需要而添加之矽烷偶合劑等添加劑進行混合之方法等。 As a method of producing the sealant for an electronic device of the present invention, for example, a polymerizer can be used by using a mixer such as a homogeneous phase disperser, a homomixer, a universal mixer, a planetary mixer, a kneader, or a three-roll mill. A method of mixing an additive such as a photoradical polymerization initiator and a decane coupling agent added as needed.
本發明之電子裝置用密封劑之使用E型黏度計於25℃、100rpm之條件下測定之黏度的較佳之下限為5mPa‧s，較佳之上限為200mPa ‧s。藉由使上述電子裝置用密封劑之黏度為該範圍，利用噴墨法之塗佈性更優異。上述電子裝置用密封劑之黏度之更佳之下限為10mPa‧s，更佳之上限為80mPa‧s，進而較佳之上限為30mPa‧s。 The lower limit of the viscosity of the sealant for electronic device of the present invention measured by an E-type viscometer at 25 ° C and 100 rpm is 5 mPa ‧ , and the upper limit is preferably 200 mPa ‧s. When the viscosity of the sealing agent for an electronic device is within this range, the coating property by the inkjet method is more excellent. The lower limit of the viscosity of the above-mentioned sealing agent for electronic devices is preferably 10 mPa ‧ s, more preferably 80 mPa ‧ s, and even more preferably 30 mPa ‧ s.
再者，亦可於利用噴墨法進行塗佈時對本發明之電子裝置用密封劑進行加熱，降低黏度而塗佈。 Further, the coating agent for an electronic device of the present invention may be heated while being applied by an inkjet method to reduce the viscosity and apply.
本發明之電子裝置用密封劑之硬化物之波長380~800nm下之光之全光線穿透率的較佳之下限為80%。藉由使上述全光線穿透率為80%以上，所獲得之有機EL顯示元件等電子裝置之光學特性更優異。上述全光線穿透率之更佳之下限為85%。 A preferred lower limit of the total light transmittance of light at a wavelength of 380 to 800 nm of the cured product of the sealant for electronic devices of the present invention is 80%. By making the total light transmittance of 80% or more, the optical characteristics of an electronic device such as an organic EL display device obtained are more excellent. A lower limit of the above total light transmittance is 85%.
上述全光線穿透率例如可使用自動霧度計型號TC=III DPK(東京電色公司製造)等分光計進行測定。 The total light transmittance can be measured by, for example, a spectrometer such as an automatic haze meter type TC=III DPK (manufactured by Tokyo Denshoku Co., Ltd.).
本發明之電子裝置用密封劑較佳為對硬化物照射紫外線100小時後於400nm之穿透率在20μm之光程長中為85%以上。藉由使上述照射紫外線100小時後之穿透率為85%以上，透明性變高，發光之損耗變小，且顏色再現性更優異。上述照射紫外線100小時後之穿透率之更佳之下限為90%，進而較佳之下限為95%。 In the sealing agent for an electronic device of the present invention, it is preferred that the transmittance of the cured product after irradiation with ultraviolet rays for 100 hours is 85% or more in the optical path length of 20 μm. When the transmittance after the irradiation of the ultraviolet rays for 100 hours is 85% or more, the transparency is increased, the loss of light emission is small, and the color reproducibility is further improved. A lower limit of the better transmittance of the ultraviolet light after 100 hours of irradiation is 90%, and a lower limit is preferably 95%.
作為照射上述紫外線之光源，例如可使用氙氣燈、碳弧燈等以往公知之光源。 As a light source that irradiates the ultraviolet rays, for example, a conventionally known light source such as a xenon lamp or a carbon arc lamp can be used.
本發明之電子裝置用密封劑較佳為按照JIS Z 0208，使硬化物暴露於85℃、85%RH之環境下24小時所測定的100μm厚度之透濕度為100g/m2以下。藉由使上述透濕度為100g/m2以下，例如於用於作為電子裝置之有機EL顯示元件之製造之情形時，防止水分到達至有機發光材料層而 產生暗點之效果更優異。 The electronic device according to the present invention is preferably a sealing agent according to JIS Z 0208, the hardened exposed to 85 ℃, moisture permeability 100μm thickness measured 24 hours at 85% RH environment of 100g / m 2 or less. When the moisture permeability is 100 g/m 2 or less, for example, in the case of production of an organic EL display element as an electronic device, the effect of preventing moisture from reaching the organic light-emitting material layer to generate a dark spot is more excellent.
進而，本發明之電子裝置用密封劑較佳為使硬化物暴露於85℃、85%RH之環境下24小時之時，硬化物之含水率未達0.5%。藉由使上述硬化物之含水率未達0.5%，例如於用於作為電子裝置之有機EL顯示元件之製造之情形時，防止因硬化物中之水分所導致之有機發光材料層之劣化之效果更優異。上述硬化物之含水率之更佳之上限為0.3%。 Further, the sealing agent for an electronic device of the present invention preferably has a moisture content of the cured product of less than 0.5% when the cured product is exposed to an environment of 85 ° C and 85% RH for 24 hours. When the moisture content of the cured product is less than 0.5%, for example, in the case of production of an organic EL display element as an electronic device, the effect of deterioration of the organic light-emitting material layer due to moisture in the cured product is prevented. More excellent. The upper limit of the water content of the above cured product is preferably 0.3%.
作為上述含水率之測定方法，例如可列舉：按照JIS K 7251利用卡氏法而求出之方法、或按照JIS K 7209-2求出吸水後之重量增量等方法。 Examples of the method for measuring the water content include a method obtained by the Karlsfeld method according to JIS K 7251 or a method of obtaining a weight gain after water absorption in accordance with JIS K 7209-2.
本發明之電子裝置用密封劑可用於利用噴墨法之塗佈。 The sealant for an electronic device of the present invention can be used for coating by an inkjet method.
又，電子裝置之製造方法亦為本發明之一，該製造方法具有以下步驟：利用噴墨法將本發明之電子裝置用密封劑塗佈於基材；及藉由光照射使塗佈之電子裝置用密封劑硬化。 Further, a method of manufacturing an electronic device according to the present invention includes the steps of: applying an encapsulant for an electronic device of the present invention to a substrate by an inkjet method; and coating the coated electron by light irradiation The device is hardened with a sealant.
再者，使本發明之電子裝置用密封劑硬化時，除了光照射以外，亦可藉由加熱而使之硬化。 Further, when the sealing agent for an electronic device of the present invention is cured, it can be cured by heating in addition to light irradiation.
於將本發明之電子裝置用密封劑塗佈於基材之步驟中，本發明之電子裝置用密封劑可塗佈於基材之整個面，亦可塗佈於基材之一部分。例如，製造作為電子裝置之有機EL顯示元件之情形時，作為利用塗佈所形成之本發明之電子裝置用密封劑之密封部的形狀，只要為能夠保護具有有機發光材料層之積層體免受外部氣體之損害之形狀，則並無特別限定，可為將該積層體完全被覆之形狀，可於該積層體之周邊部形成封閉之圖案，亦可形成於該積層體之周邊部之一部分設置有開口部之形狀之圖案。 In the step of applying the sealing agent for an electronic device of the present invention to a substrate, the sealing agent for an electronic device of the present invention may be applied to the entire surface of the substrate or may be applied to one portion of the substrate. For example, in the case of manufacturing an organic EL display element as an electronic device, the shape of the sealing portion of the sealing agent for an electronic device of the present invention formed by coating is capable of protecting the laminated body having the organic light-emitting material layer from The shape of the damage of the external gas is not particularly limited, and the shape of the laminated body may be completely covered, and a closed pattern may be formed in the peripheral portion of the laminated body, or may be formed in one of the peripheral portions of the laminated body. A pattern having the shape of an opening.
於藉由光照射使上述電子裝置用密封劑硬化之情形時，本發 明之電子裝置用密封劑可藉由照射300nm~400nm之波長及300~3000mJ/cm2之累計光量之光而較佳地硬化。 In the case where the electronic device sealing agent is cured by light irradiation, the sealing agent for an electronic device of the present invention can be preferably irradiated with light having a wavelength of 300 nm to 400 nm and an integrated light amount of 300 to 3000 mJ/cm 2 . hardening.
作為用以將光照射至本發明之電子裝置用密封劑之光源，例如可列舉：低壓水銀燈、中壓水銀燈、高壓水銀燈、超高壓水銀燈、準分子雷射、化學燈、黑光燈、微波激發水銀燈、金屬鹵化物燈、鈉燈、鹵素燈、氙氣燈、LED燈、螢光燈、太陽光、電子束照射裝置等。該等光源可單獨使用，亦可併用2種以上。 Examples of the light source for irradiating light to the sealing agent for an electronic device of the present invention include a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultra high pressure mercury lamp, an excimer laser, a chemical lamp, a black lamp, and a microwave excited mercury lamp. , metal halide lamps, sodium lamps, halogen lamps, xenon lamps, LED lamps, fluorescent lamps, sunlight, electron beam irradiation devices, and the like. These light sources may be used singly or in combination of two or more.
該等光源係配合上述光自由基聚合起始劑之吸收波長而適當進行選擇。 These light sources are appropriately selected in accordance with the absorption wavelength of the photoradical polymerization initiator.
作為對本發明之電子裝置用密封劑照射光之手段，例如可列舉各種光源之同時照射、間隔時間差之逐次照射、同時照射與逐次照射之組合照射等，可使用任一照射手段。 The means for irradiating light to the sealing agent for an electronic device of the present invention may, for example, be a simultaneous irradiation of various light sources, a sequential irradiation of a time difference, a combined irradiation of a simultaneous irradiation and a sequential irradiation, or the like, and any irradiation means may be used.
藉由利用光照射使上述電子裝置用密封劑硬化之步驟所獲得之硬化物亦可進而由無機材料膜被覆。 The cured product obtained by the step of curing the electronic device with a sealant by light irradiation may be further coated with an inorganic material film.
作為構成上述無機材料膜之無機材料，可使用以往公知者，例如可列舉氮化矽(SiNx)或氧化矽(SiOx)等。上述無機材料膜可為由1層構成者，亦可為將多種層積層而成者。又，亦可交替地重複上述無機材料膜與由本發明之電子裝置用密封劑構成之樹脂膜而被覆上述積層體等。 As the inorganic material constituting the inorganic material film, a conventionally known one can be used, and examples thereof include cerium nitride (SiN x ) or cerium oxide (SiO x ). The inorganic material film may be composed of one layer, or may be formed by laminating a plurality of layers. Further, the above-mentioned inorganic material film and the resin film composed of the sealing agent for electronic devices of the present invention may be alternately repeated to cover the layered body or the like.
本發明之電子裝置之製造方法亦可具有使塗佈有本發明之電子裝置用密封劑之基材(以下，亦稱為「一基材」)與另一基材貼合之步驟。 The method for producing an electronic device of the present invention may have a step of bonding a substrate (hereinafter also referred to as "one substrate") to which the sealing agent for an electronic device of the present invention is applied, to another substrate.
於製造作為上述電子裝置之有機EL顯示元件之情形時，上述一基材可 為形成有具有有機發光材料層之積層體之基材，亦可為未形成該積層體之基材。 In the case of manufacturing an organic EL display element as the above electronic device, the above substrate may be The substrate on which the laminate having the organic light-emitting material layer is formed may be a substrate on which the laminate is not formed.
於上述一基材為未形成上述積層體之基材之情形時，於貼合上述另一基材時，以能夠保護上述積層體免受外部氣體之損害之方式塗佈本發明之電子裝置用密封劑即可。即，於貼合上述另一基材時成為上述積層體之位置之部位全面地進行塗佈，或者以將貼合上述另一基材時成為上述積層體之位置之部位完全收容之形狀形成封閉之圖案之密封劑部。 When the substrate is a substrate in which the laminate is not formed, when the other substrate is bonded, the electronic device of the present invention is applied so as to protect the laminate from external air. The sealant can be used. In other words, when the other substrate is bonded to the other substrate, the portion that is the position of the laminate is entirely coated, or the portion that is the position of the laminate when the other substrate is bonded is completely sealed. The sealant part of the pattern.
藉由光照射使上述電子裝置用密封劑硬化之步驟可於使上述一基材與上述另一基材貼合之步驟之前進行，亦可於使上述一基材與上述另一基材貼合之步驟之後進行。 The step of curing the electronic device sealing agent by light irradiation may be performed before the step of bonding the one substrate to the other substrate, or bonding the one substrate to the other substrate After the steps are carried out.
於在使上述一基材與上述另一基材貼合之步驟之前進行藉由光照射使上述電子裝置用密封劑硬化之步驟之情形時，本發明之電子裝置用密封劑較佳為光照射後至進行硬化反應而變得無法接著之可用時間為1分鐘以上。藉由使上述可用時間為1分鐘以上，不會於使上述一基材與上述另一基材貼合之前過度進行硬化，能夠獲得更高之接著強度。 In the case where the step of curing the electronic device sealing agent by light irradiation is performed before the step of bonding the one substrate to the other substrate, the sealing agent for an electronic device of the present invention is preferably light-irradiated. The usable time after the hardening reaction is completed and becomes impossible is 1 minute or more. When the usable time is 1 minute or longer, it is not excessively hardened before the above-mentioned one substrate is bonded to the other substrate, and a higher bonding strength can be obtained.
於使上述一基材與上述另一基材貼合之步驟中，使上述一基材與上述另一基材貼合之方法並無特別限定，較佳為於減壓環境下進行貼合。 In the step of bonding the one substrate to the other substrate, the method of bonding the one substrate to the other substrate is not particularly limited, and it is preferably bonded in a reduced pressure environment.
上述減壓環境下之真空度之較佳之下限為0.01kPa，較佳之上限為10kPa。藉由使上述減壓環境下之真空度為該範圍，不會因真空裝置之氣密性或真空泵之能力而使達成真空狀態耗費長時間，能夠更有效率地去除使上述一基材與上述另一基材貼合時之本發明之電子裝置用密封劑中之氣泡。 A preferred lower limit of the degree of vacuum in the above reduced pressure environment is 0.01 kPa, and a preferred upper limit is 10 kPa. By setting the degree of vacuum in the reduced pressure environment to this range, it takes a long time to achieve the vacuum state due to the airtightness of the vacuum device or the capacity of the vacuum pump, and it is possible to more efficiently remove the above-mentioned one substrate and the above. The air bubbles in the sealant for an electronic device of the present invention when the other substrate is bonded.
本發明之電子裝置用密封劑尤其可較佳地用作有機EL顯示元件用密封劑。 The sealant for an electronic device of the present invention is particularly preferably used as a sealant for an organic EL display device.
根據本發明，能夠提供一種電子裝置用密封劑，其能夠利用噴墨法容易地進行塗佈，且接著性優異，能夠抑制釋氣之產生，減少殘留應力。又，根據本發明，能夠提供一種使用該電子裝置用密封劑之電子裝置之製造方法。 According to the present invention, it is possible to provide a sealant for an electronic device which can be easily applied by an inkjet method and which is excellent in adhesion, and can suppress generation of outgas and reduce residual stress. Moreover, according to the present invention, it is possible to provide a method of manufacturing an electronic device using the sealing agent for an electronic device.
以下，揭示實施例對本發明更詳細地進行說明，但本發明不僅限定於該等實施例。 Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited to the examples.
按照表1、2中所記載之摻合比，使用勻相分散機型攪拌混合機(PRIMIX公司製造之「勻相分散機L型」)，以攪拌速度3000rpm均勻地將各材料攪拌混合，藉此製作實施例1~13、比較例1~4之各電子裝置用密封劑。 According to the blending ratios described in Tables 1 and 2, a homogeneous phase disperser type mixer (Purex Disperser L-type) manufactured by PRIMIX Co., Ltd. was used, and the materials were uniformly mixed and stirred at a stirring speed of 3000 rpm. The sealants for electronic devices of Examples 1 to 13 and Comparative Examples 1 to 4 were produced.
對實施例及比較例中所獲得之各電子裝置用密封劑進行以下之評價。將結果示於表1、2。 The following evaluations were performed on the sealing agents for electronic devices obtained in the examples and the comparative examples. The results are shown in Tables 1 and 2.
使用E型黏度計(東機產業公司製造之「VISCOMETER TV-22」)，對實施例及比較例中所獲得之各電子裝置用密封劑測定25℃、100rpm之條件下之黏度。 The viscosity of the sealing agent for each electronic device obtained in the examples and the comparative examples was measured at 25 ° C and 100 rpm using an E-type viscometer ("VISCOMETER TV-22" manufactured by Toki Sangyo Co., Ltd.).
使用噴墨噴出裝置(MicroJet公司製造之「NanoPrinter300」)以80微微升之液滴量將實施例及比較例中所獲得之各電子裝置用密封劑印刷於經鹼洗淨之無鹼玻璃(旭硝子公司製造之「AN100」)上，10分鐘後測定無鹼玻璃上之液滴之直徑。 Each of the electronic devices obtained in the examples and the comparative examples was printed on an alkali-washed alkali-free glass (Asahi Glass) using an inkjet ejecting apparatus ("NanoPrinter 300" manufactured by MicroJet Co., Ltd.) at a droplet amount of 80 μl. On the "AN100" manufactured by the company, the diameter of the droplet on the alkali-free glass was measured after 10 minutes.
將液滴之直徑為400μm以上之情況設為「○」，將液滴之直徑為200μm以上且未達400μm之情況設為「△」，將液滴之直徑未達200μm之情況設為「×」而評價潤濕擴散性。 The case where the diameter of the droplet is 400 μm or more is "○", and the case where the diameter of the droplet is 200 μm or more and less than 400 μm is "Δ", and the case where the diameter of the droplet is less than 200 μm is "X". The wettability was evaluated.
使用旋轉塗佈機將實施例及比較例中所獲得之各電子裝置用密封劑以10μm之厚度塗佈於無鹼玻璃(旭硝子公司製造之「AN100」)上，使用LED燈照射波長365nm之紫外線3000mJ/cm2而使電子裝置用密封劑硬化，從而獲得樹脂膜。按照JIS K 5600-5-6，對所獲得之樹脂膜進行切口間隔為1mm之交叉切割試驗。 The sealing agent for each electronic device obtained in the examples and the comparative examples was applied to an alkali-free glass ("AN100" manufactured by Asahi Glass Co., Ltd.) at a thickness of 10 μm using a spin coater, and ultraviolet rays having a wavelength of 365 nm were irradiated with an LED lamp. The electronic device was hardened with a sealant at 3000 mJ/cm 2 to obtain a resin film. The obtained resin film was subjected to a cross-cut test with a slit interval of 1 mm in accordance with JIS K 5600-5-6.
將進行過交叉切割試驗時之剝落為0%之情況設為「○」，將剝落超過0%且為10%以下之情況設為「△」，將剝落超過10%之情況設為「×」而評價接著性。 The case where the peeling was 0% in the cross-cut test was set to "○", the case where the peeling exceeded 0% and was 10% or less was set to "△", and the case where the peeling exceeded 10% was set to "×". And evaluate the continuation.
藉由利用頂空法之氣相層析對加熱實施例及比較例中所獲得之各電子 裝置用密封劑時之釋氣進行測定。將100mg之各電子裝置用密封劑放入至頂空(head space)用小瓶，使用LED燈照射波長365nm之紫外線1500mJ/cm2而使密封劑硬化，之後將小瓶密封，以100℃加熱100小時，並利用頂空法測定產生氣體。 The outgas of each of the sealing devices for electronic devices obtained in the examples and the comparative examples was measured by gas chromatography using a headspace method. 100mg of each electronic device placed in the sealing agent to a headspace (head space) by a vial, an LED 365nm wavelength light irradiation of ultraviolet 1500mJ / cm 2 curing the sealant, and then the vial was sealed and heated to 100 ℃ 100 hours And the headspace method is used to determine the generated gas.
將產生之氣體為300ppm以下之情況設為「○」，將超過300ppm且未達500ppm之情況設為「△」，將500ppm以上之情況設為「×」而評價低釋氣性。 The case where the gas generated was 300 ppm or less was set to "○", the case where the gas was more than 300 ppm and not more than 500 ppm was set to "Δ", and the case where the amount of gas was 500 ppm or more was set to "x", and the low outgassing property was evaluated.
將於玻璃基板(長度25mm、寬度25mm、厚度0.7mm)以1000Å之厚度成膜ITO電極而成者作為基板。以丙酮、鹼性水溶液、離子交換水、異丙醇分別對上述基板進行超音波洗淨15分鐘，之後以經煮沸之異丙醇洗淨10分鐘，進而，利用UV-臭氧清潔器(Japan Laser Electronics公司製造之「NL-UV253」)進行預處理。 A ITO electrode was formed by forming a ITO electrode with a thickness of 1000 Å on a glass substrate (length 25 mm, width 25 mm, thickness 0.7 mm) as a substrate. The substrate was ultrasonically washed with acetone, an alkaline aqueous solution, ion-exchanged water, and isopropyl alcohol for 15 minutes, and then washed with boiling isopropyl alcohol for 10 minutes, and further, a UV-ozone cleaner (Japan Laser) was used. "NL-UV253" manufactured by Electronics Co., Ltd. is pretreated.
其次，將該基板固定於真空蒸鍍裝置之基板夾，向無釉坩堝中加入200mg之N,N'-二(1-萘基)-N,N'-二苯基聯苯胺(α-NPD)，向另一不同之無釉坩堝中加入200mg之三(8-羥基喹啉)鋁(Alq3)，使真空腔室內減壓至1×10-4Pa。其後，對放入有α-NPD之坩堝進行加熱，使α-NPD以蒸鍍速度15/s沈積於基板，從而成膜膜厚600Å之電洞傳輸層。然後，對放入有Alq3之坩堝進行加熱，以15Å/s之蒸鍍速度成膜膜厚600Å之有機發光材料層。其後，將形成有電洞傳輸層及有機發光材料層之基板轉移至另一真空蒸鍍裝置，向該真空蒸鍍裝置內之鎢製電阻加熱舟中放入200mg之氟化鋰，向另一鎢 製舟中放入1.0g之鋁線。其後，使真空蒸鍍裝置之蒸鍍器內減壓至2×10-4Pa，以0.2Å/s之蒸鍍速度成膜5Å之氟化鋰，之後以20Å/s之速度成膜1000Å之鋁。利用氮氣使蒸鍍器內恢復至常壓，並將配置有10mm×10mm之具有有機發光材料層之積層體之基板取出。 Next, the substrate was fixed to a substrate holder of a vacuum evaporation apparatus, and 200 mg of N,N'-bis(1-naphthyl)-N,N'-diphenylbenzidine (α-NPD) was added to the unglazed crucible. ), 200 mg of tris(8-hydroxyquinoline)aluminum (Alq 3 ) was added to another different unglazed crucible, and the vacuum chamber was depressurized to 1 × 10 -4 Pa. Thereafter, the crucible to which the α-NPD is placed is heated to make the α-NPD at an evaporation rate of 15 /s is deposited on the substrate to form a hole transport layer having a film thickness of 600 Å. Then, the crucible in which Alq 3 was placed was heated, and an organic light-emitting material layer having a film thickness of 600 Å was formed at a deposition rate of 15 Å/s. Thereafter, the substrate on which the hole transport layer and the organic light-emitting material layer are formed is transferred to another vacuum vapor deposition apparatus, and 200 mg of lithium fluoride is placed in a tungsten-made resistance heating boat in the vacuum evaporation apparatus, and the other is A 1.0 g aluminum wire was placed in a tungsten boat. Thereafter, the inside of the vapor deposition apparatus of the vacuum evaporation apparatus was depressurized to 2 × 10 -4 Pa, and 5 Å of lithium fluoride was formed at a deposition rate of 0.2 Å / s, and then 1000 Å was formed at a rate of 20 Å / s. Aluminum. The inside of the vaporizer was returned to normal pressure with nitrogen gas, and a substrate having a laminate of 10 mm × 10 mm of an organic light-emitting material layer was taken out.
以覆蓋所獲得之配置有積層體之基板之該積層體整體之方式設置具有13mm×13mm之開口部之遮罩，利用電漿CVD法形成無機材料膜A。 A mask having an opening of 13 mm × 13 mm was provided so as to cover the entire laminated body of the substrate on which the laminate was obtained, and the inorganic material film A was formed by a plasma CVD method.
電漿CVD法係使用SiH4氣體及氮氣作為原料氣體，於將各個流量設為SiH4氣體10sccm、氮氣200sccm，將RF功率設為10W(頻率2.45GHz)，將腔室內溫度設為100℃，將腔室內壓力設為0.9Torr之條件下進行。 In the plasma CVD method, SiH 4 gas and nitrogen gas were used as raw material gases, and each flow rate was set to 10 sccm of SiH 4 gas, 200 sccm of nitrogen gas, the RF power was set to 10 W (frequency 2.45 GHz), and the chamber temperature was set to 100 ° C. The pressure in the chamber was set to 0.9 Torr.
所形成之無機材料膜A之厚度為約1μm。 The thickness of the formed inorganic material film A was about 1 μm.
對所獲得之基板，使用噴墨噴出裝置(MicroJet公司製造之「NanoPrinter300」)將實施例及比較例中所獲得之各電子裝置用密封劑圖案塗佈於基板。 To the obtained substrate, each of the electronic device sealant patterns obtained in the examples and the comparative examples was applied onto the substrate using an inkjet ejecting apparatus ("NanoPrinter 300" manufactured by MicroJet Co., Ltd.).
其後，使用LED燈，照射波長365nm之紫外線3000mJ/cm2而使電子裝置用密封劑硬化，從而形成樹脂保護膜。 Thereafter, an LED lamp was used to irradiate the ultraviolet ray of 365 nm at a wavelength of 3,000 mJ/cm 2 to cure the electronic device with a sealant to form a resin protective film.
於形成樹脂保護膜之後，以覆蓋該樹脂保護膜之整體之方式，設置具有12mm×12mm之開口部之遮罩，利用電漿CVD法形成無機材料膜B，從而獲得有機EL顯示元件。 After forming the resin protective film, a mask having an opening of 12 mm × 12 mm was provided so as to cover the entire resin protective film, and the inorganic material film B was formed by a plasma CVD method to obtain an organic EL display element.
電漿CVD法係於與上述「(利用無機材料膜A之被覆)」相同之條件下 進行。 The plasma CVD method is the same as the above "(with the coating of the inorganic material film A)" get on.
所形成之無機材料膜B之厚度為約1μm。 The thickness of the formed inorganic material film B was about 1 μm.
將所獲得之有機EL顯示元件暴露於溫度85℃、濕度85%之環境下100小時，之後施加3V之電壓，目視觀察有機EL顯示元件之發光狀態(暗點及像素周邊變暗之有無)。將無暗點或周邊變暗而均勻地發光之情況設為「○」，將確認出暗點或周邊變暗之情況設為「△」，將非發光部明顯擴大之情況設為「×」而評價有機EL顯示元件之顯示性能。 The obtained organic EL display device was exposed to an environment of a temperature of 85 ° C and a humidity of 85% for 100 hours, and then a voltage of 3 V was applied thereto, and the light-emitting state of the organic EL display element (dark dot and presence or absence of darkening of the pixel) was visually observed. When the dark spot or the periphery is darkened and the light is uniformly emitted, it is set to "○", and the dark spot or the periphery is darkened to be "△", and the non-light-emitting portion is enlarged to be "×". The display performance of the organic EL display element was evaluated.
根據本發明，能夠提供一種電子裝置用密封劑，其能夠利用噴墨法容易地進行塗佈，且接著性優異，能夠抑制釋氣之產生，減少殘留應力。又，根據本發明，能夠提供一種使用該電子裝置用密封劑之電子裝置之製造方法。 According to the present invention, it is possible to provide a sealant for an electronic device which can be easily applied by an inkjet method and which is excellent in adhesion, and can suppress generation of outgas and reduce residual stress. Moreover, according to the present invention, it is possible to provide a method of manufacturing an electronic device using the sealing agent for an electronic device.
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