TW201724956A - Electronic device - Google Patents
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- TW201724956A TW201724956A TW104143117A TW104143117A TW201724956A TW 201724956 A TW201724956 A TW 201724956A TW 104143117 A TW104143117 A TW 104143117A TW 104143117 A TW104143117 A TW 104143117A TW 201724956 A TW201724956 A TW 201724956A
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Abstract
Description
本發明是有關於一種電子裝置，且特別是有關於一種具有導熱片的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device having a thermally conductive sheet.
隨著科技的發展，使得例如是電腦運算主機或是智慧型手機內部的電子裝置的運算速度不斷地提升。此外，由於電子裝置運算速度的提升，電子裝置的發熱功率也隨之不斷升高。為了防止電子裝置溫度過高，而導致電子裝置發生暫時性或永久性的失效，電子裝置需有足夠的散熱能力，以使其正常運作。With the development of technology, the computing speed of electronic devices such as computer computing mainframes or smart phones has been continuously improved. In addition, due to the increase in the computing speed of the electronic device, the heating power of the electronic device also increases. In order to prevent the electronic device from being overheated and causing temporary or permanent failure of the electronic device, the electronic device needs to have sufficient heat dissipation capability to make it operate normally.
在目前一般的電子裝置的散熱方式中，電子裝置的元件多是以其承載基板例如是印刷線路板作為散熱途徑。然而，以承載基板作為散熱途徑常存在散熱效率不佳的問題或是元件的散熱方向僅侷限於二維傳導方向。此外，若是希望於電子裝置上達到較好的散熱效果，通常需於電子裝置的元件上貼附大面積或是高導熱性的散熱材料。但是，大面積或是高導熱性的散熱材料通常價格較為昂貴，進而增加整體電子裝置的材料與製作的成本。In the current heat dissipation method of an electronic device, the components of the electronic device are mostly based on a carrier substrate such as a printed circuit board. However, the use of the carrier substrate as a heat dissipation path often has a problem of poor heat dissipation efficiency or the heat dissipation direction of the component is limited to the two-dimensional conduction direction. In addition, if it is desired to achieve a better heat dissipation effect on the electronic device, it is usually necessary to attach a large area or a high thermal conductivity heat dissipating material to the components of the electronic device. However, large area or high thermal conductivity heat sink materials are generally more expensive, which in turn increases the cost of materials and fabrication of the overall electronic device.
本發明提供一種電子裝置，其可經由導熱片的配置，將本身元件所產生的熱量傳導至內殼體外，以增進散熱效果。The present invention provides an electronic device that can conduct heat generated by its own components to the outside of the inner casing via the configuration of the heat conductive sheet to enhance the heat dissipation effect.
本發明的電子裝置包括外殼體、線路板、內殼體、元件以及導熱片。線路板與內殼體配置於外殼體中，並且共同構成容置空間。元件配置於線路板上並且位於容置空間內。導熱片包括中央部以及延伸部。中央部位於容置空間中並且貼附於元件。延伸部由中央部的邊緣延伸至容置空間之外。The electronic device of the present invention includes an outer casing, a wiring board, an inner casing, an element, and a heat conductive sheet. The circuit board and the inner casing are disposed in the outer casing and together constitute an accommodation space. The component is disposed on the circuit board and located in the accommodating space. The thermally conductive sheet includes a central portion and an extension. The central portion is located in the accommodating space and attached to the component. The extension extends from the edge of the central portion to the outside of the accommodation space.
在本發明的一實施例中，上述的延伸部固定於內殼體的外表面。延伸部位於內殼體與外殼體之間。In an embodiment of the invention, the extension is fixed to an outer surface of the inner casing. The extension is located between the inner casing and the outer casing.
在本發明的一實施例中，上述的延伸部包括連接於中央部的相對兩側的第一延伸部以及第二延伸部。第一延伸部以及第二延伸部分別由中央部的邊緣延伸至容置空間之外。In an embodiment of the invention, the extension portion includes a first extension portion and a second extension portion connected to opposite sides of the central portion. The first extension portion and the second extension portion respectively extend from the edge of the central portion to outside the accommodation space.
在本發明的一實施例中，上述的延伸至內殼體之外的第一延伸部以及第二延伸部分別朝向同一方向彎折後固定於內殼體的外表面。In an embodiment of the invention, the first extension portion and the second extension portion extending outside the inner casing are respectively bent in the same direction and fixed to the outer surface of the inner casing.
在本發明的一實施例中，上述的內殼體包括第一內殼體以及第二內殼體。第一內殼體承載線路板。第二內殼體結合於第一內殼體，而在第二內殼體與線路板之間形成容置空間。延伸部穿過第一內殼體與第二內殼體的接合處而延伸至容置空間之外。In an embodiment of the invention, the inner casing includes a first inner casing and a second inner casing. The first inner casing carries the circuit board. The second inner casing is coupled to the first inner casing, and an accommodation space is formed between the second inner casing and the circuit board. The extension extends beyond the accommodating space through the junction of the first inner casing and the second inner casing.
在本發明的一實施例中，上述的第一內殼體與第二內殼體中的一個具有結合部。導熱片具有開孔，且結合部穿過開孔而與第一內殼體與第二內殼體中的另一個形成結構干涉。In an embodiment of the invention, one of the first inner casing and the second inner casing has a joint. The thermally conductive sheet has an opening, and the joint passes through the opening to form a structural interference with the other of the first inner casing and the second inner casing.
在本發明的一實施例中，結合部包括位於第一內殼體邊緣且朝向第二內殼體延伸的多個卡鉤。第二內殼體具有分別與卡鉤相互配合的多個凸塊。In an embodiment of the invention, the joint includes a plurality of hooks located at an edge of the first inner casing and extending toward the second inner casing. The second inner casing has a plurality of projections that respectively engage the hooks.
在本發明的一實施例中，上述的電子裝置還包括散熱膏。散熱膏配置於中央部與元件之間。In an embodiment of the invention, the electronic device further includes a thermal grease. The thermal grease is disposed between the central portion and the component.
在本發明的一實施例中，上述的電子裝置還包括散熱膏。散熱膏配置於延伸部與內殼體之間。In an embodiment of the invention, the electronic device further includes a thermal grease. The thermal grease is disposed between the extension and the inner casing.
在本發明的一實施例中，上述的導熱片的材料包括金屬或石墨。In an embodiment of the invention, the material of the thermal conductive sheet comprises metal or graphite.
基於上述，本發明的電子裝置具有導熱片，並且導熱片具有中央部以及延伸部。此外，導熱片的中央部貼附於電子裝置的元件上，而延伸部則由中央部的邊緣延伸至內殼體與線路板所構成的容置空間之外。因此，電子裝置的元件產生的熱量除可藉由元件的線路板傳導散熱之外，元件可進一步藉由導熱片將熱量傳導至容置空間之外，以進一步增進電子裝置的元件的散熱效果。Based on the above, the electronic device of the present invention has a thermally conductive sheet, and the thermally conductive sheet has a central portion and an extension. In addition, the central portion of the heat conductive sheet is attached to the component of the electronic device, and the extension portion extends from the edge of the central portion to the outside of the accommodating space formed by the inner casing and the circuit board. Therefore, the heat generated by the components of the electronic device can be dissipated by the circuit board of the component, and the component can further conduct heat to the outside of the accommodating space by the heat conducting sheet to further improve the heat dissipation effect of the components of the electronic device.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
圖1是依照本發明的一實施例的電子裝置的示意圖。圖2是圖1的電子裝置沿AA’線的剖面示意圖。圖3是圖1的電子裝置的部分構件的分解示意圖。請參考圖1、圖2以及圖3，電子裝置100包括外殼體180、線路板110、內殼體120、導熱片130以及元件140。如圖2的電子裝置100沿AA’線的剖面圖所示，本實施的線路板110及內殼體120皆配置於外殼體180中，並且內殼體120與線路板110共同構成容置空間170。此外，元件140可配置於線路板110上，並且位於容置空間170內。在本實施例中，線路板110例如是印刷電路板(printed circuit board；簡稱PCB)或是軟性印刷電路板(flexible printed circuit board；簡稱FPCB)，而元件140可為配置於印刷電路板上的各種功能晶片或是微電子元件。再者，本實施例的電子裝置100例如是迷你運動型攝像錄影機。1 is a schematic diagram of an electronic device in accordance with an embodiment of the present invention. Figure 2 is a cross-sectional view of the electronic device of Figure 1 taken along line AA'. 3 is an exploded perspective view of a portion of the components of the electronic device of FIG. 1. Referring to FIG. 1 , FIG. 2 and FIG. 3 , the electronic device 100 includes an outer casing 180 , a circuit board 110 , an inner casing 120 , a heat conducting sheet 130 , and an element 140 . As shown in the cross-sectional view of the electronic device 100 of FIG. 2 along the line AA', the circuit board 110 and the inner casing 120 of the present embodiment are disposed in the outer casing 180, and the inner casing 120 and the circuit board 110 together form an accommodation space. 170. In addition, the component 140 can be disposed on the circuit board 110 and located in the accommodating space 170. In this embodiment, the circuit board 110 is, for example, a printed circuit board (PCB) or a flexible printed circuit board (FPCB), and the component 140 can be disposed on the printed circuit board. Various functional chips or microelectronic components. Furthermore, the electronic device 100 of the present embodiment is, for example, a mini sports type video recorder.
如圖2及圖3所示，導熱片130包括中央部132以及延伸部134。中央部132位於容置空間170內並且貼附於元件140上。再者，延伸部134由中央部132的邊緣延伸至容置空間170之外。在本實施例中，導熱片130可由導熱銅箔、石墨片或是其他適合的導熱材料所構成。電子裝置100的元件140可經由導熱片130的中央部132以及延伸部134將熱量傳導至容置空間170之外。元件140的熱量除了可藉由線路板110沿平面方向傳遞之外，還可進一步利用導熱片130來增加元件140的散熱效果，以避免元件140由於過熱而發生故障的情形。此外，由於導熱片130可將元件140的熱量傳導至容置空間170之外，因此，元件140所產生的熱量不會因為內殼體120的阻擋而滯留於容置空間170中，而影響整體電子裝置100的運作。As shown in FIGS. 2 and 3, the thermally conductive sheet 130 includes a central portion 132 and an extension portion 134. The central portion 132 is located within the accommodating space 170 and attached to the component 140. Furthermore, the extension portion 134 extends from the edge of the central portion 132 to the outside of the accommodating space 170. In this embodiment, the thermal conductive sheet 130 may be composed of a thermally conductive copper foil, a graphite sheet or other suitable thermally conductive material. The component 140 of the electronic device 100 can conduct heat to the outside of the accommodating space 170 via the central portion 132 of the thermally conductive sheet 130 and the extension portion 134. In addition to the heat transfer of the component 140 in the planar direction by the circuit board 110, the heat conductive sheet 130 can be further utilized to increase the heat dissipation effect of the component 140 to avoid a failure of the component 140 due to overheating. In addition, since the heat conduction sheet 130 can conduct the heat of the element 140 to the outside of the accommodating space 170, the heat generated by the element 140 is not retained in the accommodating space 170 due to the blocking of the inner casing 120, thereby affecting the whole. The operation of the electronic device 100.
在本實施例中，導熱片130的延伸部134可包括第一延伸部134a與第二延伸部134b，其位於內殼體120與外殼體180之間。如圖2及圖3所示，導熱片130的第一延伸部134a與第二延伸部134b分別連接於中央部132的相對兩側，並且由中央部132的邊緣延伸至容置空間170之外。此外，延伸至容置空間170之外的第一延伸部134a及第二延伸部134b可分別朝相同的方向彎折，以將第一延伸部134a及第二延伸部134b固定於內殼體120的外表面120a上。因此，電子裝置100的元件140所產生的熱量不僅可以傳導至導熱片130中央部132，更可傳導至第一延伸部134a與第二延伸部134b。導熱片130彎折成一個立體的結構，以便在電子裝置100的有限體積內增加更多的散熱面積。In the present embodiment, the extension 134 of the thermally conductive sheet 130 may include a first extension 134a and a second extension 134b between the inner casing 120 and the outer casing 180. As shown in FIG. 2 and FIG. 3, the first extending portion 134a and the second extending portion 134b of the heat conducting sheet 130 are respectively connected to opposite sides of the central portion 132, and extend from the edge of the central portion 132 to the outside of the accommodating space 170. . In addition, the first extending portion 134 a and the second extending portion 134 b extending beyond the accommodating space 170 may be respectively bent in the same direction to fix the first extending portion 134 a and the second extending portion 134 b to the inner casing 120 . On the outer surface 120a. Therefore, the heat generated by the component 140 of the electronic device 100 can be conducted not only to the central portion 132 of the thermal conductive sheet 130 but also to the first extension portion 134a and the second extension portion 134b. The heat conductive sheet 130 is bent into a three-dimensional structure to add more heat dissipation area within the limited volume of the electronic device 100.
在本實施例中，電子裝置100的元件140所產生的熱量除可經由線路板110以及導熱片130的中央部132在元件140的二維方向(例如是圖3中的X方向及Y方向)上傳遞並散逸之外，還可藉由導熱片130的第一延伸部134a以及第二延伸部134b在不同角度上的彎折，將電子裝置100的元件140產生的熱量儘速傳導空氣中。In the present embodiment, the heat generated by the component 140 of the electronic device 100 can be in the two-dimensional direction of the component 140 via the circuit board 110 and the central portion 132 of the heat conductive sheet 130 (for example, the X direction and the Y direction in FIG. 3). In addition to being transferred and dissipated, the heat generated by the element 140 of the electronic device 100 can be conducted into the air as quickly as possible by bending the first extension portion 134a and the second extension portion 134b of the heat conductive sheet 130 at different angles.
進一步而言，本實施例的電子裝置100可藉由調整導熱片130的第一延伸部134a及第二延伸部134b的配置位置及配置方向來改變元件140產生的熱量的傳遞方向以及傳遞路徑，以將元件140產生的廢熱傳遞至空氣中，並且傳遞的方向可不侷限於二維平面方向。此外，由於本實施例的電子裝置100可將大部份元件140所產生的熱量經由導熱片130傳遞並且散逸至容置空間170之外。因此，元件140運作所產生的熱量對於線路板110上其他元件的運作的影響能夠減少。Further, the electronic device 100 of the embodiment can change the transmission direction and the transmission path of the heat generated by the component 140 by adjusting the arrangement position and the arrangement direction of the first extension portion 134a and the second extension portion 134b of the heat conductive sheet 130. The waste heat generated by the element 140 is transferred into the air, and the direction of the transfer may not be limited to the two-dimensional plane direction. In addition, the electronic device 100 of the present embodiment can transfer heat generated by most of the components 140 through the heat conductive sheet 130 and dissipate outside the accommodating space 170. Therefore, the effect of the heat generated by the operation of the component 140 on the operation of other components on the circuit board 110 can be reduced.
請再參考圖2，在本實施例中，導熱片130的中央部132與元件140之間以及第一及第二延伸部134a、134b與內殼體120之間可塗佈散熱膏190，以使熱量更快地由元件140傳遞至導熱片130的中央部132，並且傳導至第一及第二延伸部134a、134b。因此，元件140所產生的熱量能夠快速散逸至容置空間170之外。Referring to FIG. 2 again, in the embodiment, the thermal grease 190 may be coated between the central portion 132 of the thermal conductive sheet 130 and the component 140 and between the first and second extension portions 134a, 134b and the inner casing 120. Heat is transferred from element 140 to central portion 132 of thermally conductive sheet 130 more quickly and to first and second extensions 134a, 134b. Therefore, the heat generated by the component 140 can be quickly dissipated outside the accommodating space 170.
電子裝置100的內殼體120可包括第一內殼體122以及第二內殼體124。第一內殼體122可用來承載線路板110，而第二內殼體124則是結合於第一內殼體122，並且第二內殼體124與線路板110之間可形成上述的容置空間170。此外，電子裝置100的第一延伸部134a與第二延伸部134b可分別穿過第一內殼體122與第二內殼體 124的接合處，以向容置空間170之外延伸。第二內殼體124內可以配置電池(未繪示)等其他電子零件。當元件140的工作溫度越低，對於第二內殼體124內的電池的使用壽命以及電量的影響就越低。The inner casing 120 of the electronic device 100 may include a first inner casing 122 and a second inner casing 124. The first inner casing 122 can be used to carry the circuit board 110, and the second inner casing 124 is coupled to the first inner casing 122, and the above-mentioned accommodation can be formed between the second inner casing 124 and the circuit board 110. Space 170. In addition, the first extension portion 134a and the second extension portion 134b of the electronic device 100 can respectively pass through the joint of the first inner casing 122 and the second inner casing 124 to extend outside the accommodating space 170. Other electronic components such as batteries (not shown) may be disposed in the second inner casing 124. The lower the operating temperature of the component 140, the lower the impact on the useful life and charge of the battery within the second inner casing 124.
圖4A及圖4B是本發明一實施例的電子裝置的部分構件的組裝過程的示意圖。請參考圖4A，第一內殼體122與第二內殼體124的接合處具有結合部128。在本實施例中，結合部128可位於第一內殼體122上。此外。導熱片130可具有多個開孔135。在本實施例中，第一內殼體122的結合部128可穿過導熱片130的開孔135，而使導熱片130與第一內殼體122形成結構干涉。詳細而言，結合部128可包括卡鉤128a、128b、128c、128d，其位於第一內殼體122邊緣並且朝向第二內殼體124延伸。此外，第二內殼體124可具有分別與卡鉤128a、128b、128c、128d相互配合的多個凸塊129。當第二內殼體124組合於第一內殼體122時，凸塊129可分別卡合於卡鉤128a、128b、128c、128d中，使得第二內殼體124卡合並且固定於第一內殼體122。4A and 4B are schematic views showing an assembly process of a part of components of an electronic device according to an embodiment of the present invention. Referring to FIG. 4A, the joint of the first inner casing 122 and the second inner casing 124 has a joint portion 128. In the present embodiment, the joint portion 128 may be located on the first inner casing 122. Also. The heat conductive sheet 130 may have a plurality of openings 135. In the present embodiment, the joint portion 128 of the first inner casing 122 can pass through the opening 135 of the heat conductive sheet 130 to form a structural interference between the heat conductive sheet 130 and the first inner casing 122. In detail, the joint 128 may include hooks 128a, 128b, 128c, 128d that are located at the edge of the first inner casing 122 and that extend toward the second inner casing 124. In addition, the second inner casing 124 may have a plurality of bumps 129 that cooperate with the hooks 128a, 128b, 128c, 128d, respectively. When the second inner casing 124 is combined with the first inner casing 122, the bumps 129 can be respectively engaged in the hooks 128a, 128b, 128c, 128d, so that the second inner casing 124 is engaged and fixed to the first Inner housing 122.
在本發明的另一個未繪示的實施例中，結合部128也可位於第二內殼體124上，以使導熱片130的開孔135與第二內殼體124形成結構干涉。換言之，結合部128的卡鉤128a、128b、128c、128d也可配置於第二內殼體124上，並且將與卡鉤128a、128b、128c、128d相互配合的多個凸塊129設置於第一內殼體122上。本發明對於卡鉤128a、128b、128c、128d以及凸塊129的配置位置並不加以限制。In another unillustrated embodiment of the present invention, the joint portion 128 may also be located on the second inner casing 124 to cause the opening 135 of the heat conductive sheet 130 to form a structural interference with the second inner casing 124. In other words, the hooks 128a, 128b, 128c, 128d of the joint portion 128 can also be disposed on the second inner casing 124, and a plurality of bumps 129 that cooperate with the hooks 128a, 128b, 128c, 128d are disposed in the first An inner casing 122. The present invention does not limit the arrangement positions of the hooks 128a, 128b, 128c, 128d and the bumps 129.
導熱片130可藉由上述的開孔135與結合部128形成結構干涉而相對於第一內殼體122或第二內殼體124具有固定的相對位置，使得導熱片130的延伸部134在後續被彎折的過程中，不易自第一內殼體122或第二內殼體124上脫落或是於線路板110的平面方向上相對線路板產生滑動與位移。此外，在本實施例中，導熱片130的開孔135、第一內殼體122或第二內殼體124的卡鉤128a、128b、128c、128d以及凸塊129的配置數量與位置可隨實際電子裝置100的組裝需求做適當的調整。The heat conducting sheet 130 can have a fixed relative position with respect to the first inner casing 122 or the second inner casing 124 by the structural interference of the opening 135 and the joint portion 128, so that the extending portion 134 of the heat conducting sheet 130 is subsequently During the bending process, it is not easy to fall off from the first inner casing 122 or the second inner casing 124 or to slide and displace relative to the circuit board in the plane direction of the circuit board 110. In addition, in the embodiment, the number and position of the openings 135 of the heat conducting sheet 130, the hooks 128a, 128b, 128c, 128d and the bumps 129 of the first inner casing 122 or the second inner casing 124 may be The assembly requirements of the actual electronic device 100 are appropriately adjusted.
如圖4B所示，當導熱片130以及第二內殼體124裝設至第一內殼體122後，導熱片的130的第一延伸部134a及第二延伸部134b可沿圖4B中的箭頭方向朝第二內殼體124彎折，以使第一及第二延伸部134a、134b固定於第二內殼體124上。在本發明另一個未繪示的實施例中，導熱片130的第一以及第二延伸部134a、134b也可共同朝第一內殼體122的方向彎折，並且固定於第一內殼體122的表面。此外，第一延伸部134a與第二延伸部134b還可分別朝不同的方向彎折，且分別固定於第一內殼體122及第二內殼體124的表面。本發明對於第一延伸部134a及第二內殼體134b彎折的方式以及固定的位置並不加以限制。第一延伸部134a與第二延伸部134b可根據電子裝置100的元件140所需的熱量傳遞路徑進行彎折與配置。As shown in FIG. 4B, after the heat conducting sheet 130 and the second inner casing 124 are attached to the first inner casing 122, the first extending portion 134a and the second extending portion 134b of the heat conducting sheet 130 may be along the same as in FIG. 4B. The direction of the arrow is bent toward the second inner casing 124 to fix the first and second extensions 134a, 134b to the second inner casing 124. In another embodiment of the present invention, the first and second extensions 134a, 134b of the heat conductive sheet 130 may also be bent together in the direction of the first inner casing 122 and fixed to the first inner casing. The surface of 122. In addition, the first extending portion 134a and the second extending portion 134b are also respectively bent in different directions, and are respectively fixed to the surfaces of the first inner casing 122 and the second inner casing 124. The manner in which the first extension portion 134a and the second inner casing 134b are bent and the fixed position are not limited in the present invention. The first extension portion 134a and the second extension portion 134b may be bent and configured according to a heat transfer path required for the element 140 of the electronic device 100.
由於導熱片130的第一延伸部134a與第二延伸部134b可任意地彎折並配置於內殼體120與外殼體180之間，因此，導熱片130彎折成一個立體的結構，以便在電子裝置100的有限體積內增加更多的散熱面積。元件140運作所產生的熱量對於電子裝置100內的電池或其他元件的運作的影響能夠減少。Since the first extending portion 134a and the second extending portion 134b of the heat conducting sheet 130 are arbitrarily bent and disposed between the inner casing 120 and the outer casing 180, the heat conducting sheet 130 is bent into a three-dimensional structure so as to be More heat dissipation area is added to the limited volume of the electronic device 100. The effect of the heat generated by the operation of component 140 on the operation of the battery or other components within electronic device 100 can be reduced.
綜上所述，本發明的電子裝置具有導熱片，並且導熱片貼附於線路板的元件上。因此，元件所產生的熱量可經由導熱片傳遞至電子裝置內的容置空間之外。此外，導熱片的延伸部可固定於電子裝置的內殼體的表面上，以便在電子裝置的有限體積內增加更多的散熱面積。本發明的電子裝置藉由導熱片的配置，使得元件的熱量不僅可沿線路板的平面方向傳遞並散逸，元件還可將大部分所產生的熱量傳遞至導熱片，並且藉由導熱片將熱量傳遞至容置空間之外。因此，元件的熱量傳遞路徑可不侷限於二維平面。也因此，元件可藉由導熱片將熱量傳遞至三維空間中所欲傳遞的位置，以減少元件產生的熱量對於線路板上的其他元件所造成的影響。In summary, the electronic device of the present invention has a heat conductive sheet, and the heat conductive sheet is attached to the components of the circuit board. Therefore, the heat generated by the component can be transmitted to the outside of the accommodating space in the electronic device via the heat conductive sheet. In addition, the extension of the thermally conductive sheet may be fixed to the surface of the inner casing of the electronic device to add more heat dissipation area within the limited volume of the electronic device. The electronic device of the present invention allows the heat of the component to be transmitted and dissipated not only in the planar direction of the circuit board but also the heat generated by the component to the thermal conductive sheet, and the heat is transferred by the thermal conductive sheet. Passed outside the accommodating space. Therefore, the heat transfer path of the element may not be limited to a two-dimensional plane. Therefore, the component can transfer heat to the position to be transmitted in the three-dimensional space by the heat conductive sheet to reduce the influence of the heat generated by the component on other components on the circuit board.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧電子裝置
110‧‧‧線路板
120‧‧‧內殼體
120a‧‧‧外表面
122‧‧‧第一內殼體
124‧‧‧第二內殼體
128‧‧‧結合部
128a、128b、128c、128d‧‧‧卡鉤
129‧‧‧凸塊
130‧‧‧導熱片
132‧‧‧中央部
134‧‧‧延伸部
134a‧‧‧第一延伸部
134b‧‧‧第二延伸部
135‧‧‧開孔
140‧‧‧元件
170‧‧‧容置空間
180‧‧‧外殼體
190‧‧‧散熱膏100‧‧‧Electronic devices
110‧‧‧PCB
120‧‧‧ inner casing
120a‧‧‧Outer surface
122‧‧‧First inner casing
124‧‧‧Second inner casing
128‧‧‧Combination Department
128a, 128b, 128c, 128d‧‧‧ hooks
129‧‧‧Bumps
130‧‧‧thermal film
132‧‧‧Central Department
134‧‧‧Extension
134a‧‧‧First Extension
134b‧‧‧Second extension
135‧‧‧ openings
140‧‧‧ components
170‧‧‧ accommodating space
180‧‧‧ outer casing
190‧‧‧ Thermal grease
圖1是依照本發明的一實施例的電子裝置的示意圖。 圖2是圖1的電子裝置沿AA’線的剖面示意圖。 圖3是圖1的電子裝置的部分構件的分解示意圖。 圖4A及圖4B是本發明一實施例的電子裝置的部分構件的組裝過程的示意圖。1 is a schematic diagram of an electronic device in accordance with an embodiment of the present invention. Figure 2 is a cross-sectional view of the electronic device of Figure 1 taken along line AA'. 3 is an exploded perspective view of a portion of the components of the electronic device of FIG. 1. 4A and 4B are schematic views showing an assembly process of a part of components of an electronic device according to an embodiment of the present invention.
100‧‧‧電子裝置 100‧‧‧Electronic devices
110‧‧‧線路板 110‧‧‧PCB
120‧‧‧內殼體 120‧‧‧ inner casing
120a‧‧‧外表面 120a‧‧‧Outer surface
122‧‧‧第一內殼體 122‧‧‧First inner casing
124‧‧‧第二內殼體 124‧‧‧Second inner casing
130‧‧‧導熱片 130‧‧‧thermal film
132‧‧‧中央部 132‧‧‧Central Department
134‧‧‧延伸部 134‧‧‧Extension
134a‧‧‧第一延伸部 134a‧‧‧First Extension
134b‧‧‧第二延伸部 134b‧‧‧Second extension
135‧‧‧開孔 135‧‧‧ openings
140‧‧‧元件 140‧‧‧ components
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104143117A TWI595827B (en) | 2015-12-22 | 2015-12-22 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104143117A TWI595827B (en) | 2015-12-22 | 2015-12-22 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201724956A true TW201724956A (en) | 2017-07-01 |
| TWI595827B TWI595827B (en) | 2017-08-11 |
Family
ID=60048023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104143117A TWI595827B (en) | 2015-12-22 | 2015-12-22 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI595827B (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM512792U (en) * | 2015-07-30 | 2015-11-21 | Silverstone Technology Co Ltd | Box structure for data accessing device |
| TWM512873U (en) * | 2015-08-17 | 2015-11-21 | Hung-Nan Chen | Substrate structure of electronic elements |
-
2015
- 2015-12-22 TW TW104143117A patent/TWI595827B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI595827B (en) | 2017-08-11 |
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