TW201721909A - Light emitting device structure - Google Patents

Abstract

A light emitting device structure includes a light emitting device, a molding compound, a transparent substrate and a reflective layer. The light emitting device has an upper surface and a lower surface opposite to each other, a side surface connecting the upper and the lower surfaces and a first pad and a second pad located on the lower surface and separated from each other. The molding compound at least encapsulates the upper and the side surfaces of the light emitting device, and exposes the first and the second pads of the light emitting device. The transparent substrate is disposed above the upper surface of the light emitting device, and the molding compound is located between the transparent substrate and the light emitting device. The reflective layer directly covers the side surface of the light emitting device, wherein the molding compound encapsulates the reflective layer and exposes a bottom surface of the reflective layer.

Description

Light-emitting element structure

The present invention relates to a light-emitting element structure, and more particularly to a light-emitting element structure having a reflective layer.

In the conventional light-emitting diode structure, the white light-emitting diode structure emits white light because it emits blue light by using a blue light-emitting diode chip, and the blue light is converted into yellow light after passing through the fluorescent powder. The yellow light converted from the fluorescent powder is mixed with the unconverted blue light to form white light. Since the blue light emitted by the LED chip has a certain degree of directivity, the light intensity of the blue light which is deflected from the optical axis at a large angle is weak, so that the intensity of the yellow light deviating from the optical axis at a larger angle is greater than that of the blue light. Strength of. As a result, the light output of the light-emitting diode structure causes color unevenness and yellow circles and blue circles, thereby affecting the optical surface of the light-emitting diode structure.

The present invention provides a light-emitting element structure that exhibits better optical performance.

The light emitting device structure of the present invention comprises a light emitting component and an encapsulant Body, a light transmissive plate and a reflective layer. The light emitting element has an upper surface and a lower surface opposite to each other, a side surface connecting the upper surface and the lower surface, and a first pad and a second pad on the lower surface and separated from each other. The encapsulant covers at least the upper surface and the side surface of the light emitting element, and exposes the first pad and the second pad of the light emitting element. The light transmissive plate is disposed above the upper surface of the light emitting element, wherein the encapsulant is located between the light transmissive plate and the light emitting element. The reflective layer directly covers the side surface of the light emitting element, wherein the encapsulant encapsulates the reflective layer and exposes a bottom surface of the reflective layer.

In an embodiment of the invention, the bottom surface of the reflective layer is aligned with a first bottom surface of the first pad and a second bottom surface of the second pad.

In an embodiment of the invention, the reflective layer is aligned with a top surface of the bottom surface on the upper surface of the light emitting element.

In an embodiment of the invention, the encapsulant is further filled in a gap between the first pad and the second pad of the light emitting component.

In an embodiment of the invention, the reflective layer is further disposed on a lower surface of the encapsulant, and the bottom surface of the reflective layer is aligned with a first bottom surface of the first pad and a second bottom surface of the second pad. .

In an embodiment of the invention, a first peripheral surface of the encapsulant is aligned with a second peripheral surface of the reflective layer.

In an embodiment of the invention, the second surrounding surface of the reflective layer is aligned with a third peripheral surface of the light transmissive plate.

In an embodiment of the invention, the encapsulant comprises a resin colloid layer and a colloid layer doped with a phosphor. The resin colloid layer coats the reflective layer, and The colloid layer doped with the phosphor covers the upper surface of the light-emitting element, the top surface of the reflective layer, and an upper top surface of the resin colloid layer.

In an embodiment of the invention, the encapsulant comprises a transparent encapsulant or an encapsulant colloid doped with a phosphor.

In an embodiment of the invention, the reflective layer has a reflectivity of at least greater than 50%.

In an embodiment of the invention, the reflective layer comprises a silver layer, an aluminum layer or a Bragg reflection layer.

In an embodiment of the invention, the reflective layer is a reflective layer doped with a plurality of reflective particles.

Based on the above, since the light-emitting element structure of the present invention has a reflective layer, and the reflective layer is directly disposed on the side surface of the light-emitting element, the light flux of the light-emitting element in the forward direction can be increased and the light flux of the lateral light-emitting portion can be reduced. In this way, the light-emitting element structure of the present invention can improve color unevenness and blue circle and yellow circle phenomenon in addition to better light-emitting efficiency.

The above described features and advantages of the invention will be apparent from the following description.

100a, 100b, 100c, 100d‧‧‧ light-emitting element structure

110‧‧‧Lighting elements

112‧‧‧ upper surface

114‧‧‧ lower surface

116‧‧‧ side surface

118a‧‧‧first mat

118b‧‧‧second mat

120a, 120c‧‧‧Package colloid

120c1‧‧‧ resin colloid layer

120c2‧‧‧Compound layer doped with phosphor

122a‧‧‧ bottom surface

122c‧‧‧ top surface

124a‧‧‧First surrounding surface

130‧‧‧light board

132‧‧‧ Third surrounding surface

140a, 140b, 140d‧‧‧ reflection layer

142a, 142b‧‧‧ bottom

144a, 144b‧‧‧ top

146a‧‧‧ side

148b‧‧‧second surrounding surface

B1‧‧‧ first bottom surface

B2‧‧‧ second bottom surface

G‧‧‧ gap

1 is a cross-sectional view showing the structure of a light-emitting element according to an embodiment of the present invention.

2 is a cross-sectional view showing the structure of a light emitting device according to another embodiment of the present invention.

3 is a cross-sectional view showing the structure of a light emitting device according to another embodiment of the present invention.

4 is a cross-sectional view showing the structure of a light emitting device according to another embodiment of the present invention.

1 is a cross-sectional view showing the structure of a light-emitting element according to an embodiment of the present invention. Referring to FIG. 1, the light emitting device structure 100a of the present embodiment includes a light emitting device 110, an encapsulant 120a, a light transmissive plate 130, and a reflective layer 140a. The light emitting element 110 has an upper surface 112 and a lower surface 114 opposite to each other, a side surface 116 connecting the upper surface 112 and the lower surface 114, and a first pad 118a and a second connection on the lower surface 114 and separated from each other. Pad 118b. The encapsulant 120a covers at least the upper surface 112 and the side surface 116 of the light emitting element 110, and exposes the first pad 118a and the second pad 118b of the light emitting element 110. The light-transmitting plate 130 is disposed above the upper surface 112 of the light-emitting element 110, wherein the encapsulant 120a is located between the light-transmitting plate 130 and the light-emitting element 110. The reflective layer 140a directly covers the side surface 116 of the light emitting element 110, wherein the encapsulant 120a covers the reflective layer 140a and exposes a bottom surface 142a of the reflective layer 140a.

In detail, as shown in FIG. 1, the reflective layer 140a of the present embodiment directly and completely covers the side surface 116 of the light emitting element 110, and the reflective layer 140a is further extended. Covering the peripheral surfaces of the first pads 118a and the second pads 118b. The bottom surface 142a of the reflective layer 140a is substantially aligned with a first bottom surface B1 of the first pad 118a of the light emitting element 110 and a second bottom surface B2 of the second pad 118b. Here, the light-emitting element 110 is embodied as a light-emitting diode. The reflective layer 140a is aligned with the top surface 144a of the bottom surface 142a on the upper surface 112 of the light emitting element 110, and the lower bottom surface 122a of the encapsulant 120a is aligned with the first bottom surface B1 and the second surface 118b of the first pad 118a. The second bottom surface B2. That is, the first bottom surface B1 of the first pad 118a of the light-emitting element 110 of the present embodiment, the second bottom surface B2 of the second pad 118b, the bottom surface 142a of the reflective layer 140a, and the lower bottom surface 122a of the encapsulant 120a are substantially Being flush, that is, on the same plane, can save process time and cost, and can be more efficient in subsequent packaging or module design. Preferably, the reflective layer 140a of the present embodiment has a reflectivity of at least greater than 50%, wherein the reflective layer 140a is, for example, a silver layer, an aluminum layer, a Bragg reflection layer or other suitable reflective layer, and is not limited thereto. .

Furthermore, the encapsulant 120a of the present embodiment covers the upper surface 112 of the light-emitting element 110 and a side surface 146a and a top surface 144a of the reflective layer 140a, wherein the encapsulant 120a can be, for example, a transparent encapsulant or a phosphor-doped body. Encapsulation colloid. For example, in order to change the color of the light provided by the light-emitting element 110, an encapsulant doped with a phosphor may be selected, wherein the phosphor is, for example, yellow phosphor, red phosphor, green phosphor, blue. The color phosphor or yttrium aluminum garnet phosphor is still a technical solution that can be used in the present invention without departing from the scope of the present invention. In particular, the encapsulant 120a of the present embodiment is further filled in a gap G between the first pad 118a and the second pad 118b of the light emitting element 110, and can be insulated. A pad 118a and a second pad 118b and a protective light emitting element 110 are provided. In addition, the material of the light-transmitting plate 130 of the present embodiment is, for example, glass, acryl, glass fluorescent material, ceramic or sapphire, and thus the light-transmitting plate 130 may have light that guides the light emitted from the light-emitting element 110 and allows light to pass through. The function also makes the light-emitting element structure 100a as a whole stronger. The light-transmitting plate 130 is preferably glass, and the easy-cutting property makes the process easier.

Since the light emitting element structure 100a of the present embodiment has the reflective layer 140a, the reflective layer 140a is disposed directly on the side surface 116 of the light emitting element 110. Therefore, the reflective layer 140a can reflect the lateral light of the light-emitting element 110 to the forward direction, that is, the light flux of the forward light-emitting of the light-emitting element 110 can be increased, and the light flux of the lateral light-emitting of the light-emitting element 110 can be reduced. In this way, in addition to the better luminous efficiency, the light-emitting device structure 100a of the present embodiment can also improve the color unevenness and the yellow circle and the blue circle, and thus can have better light-emitting uniformity.

It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

2 is a cross-sectional view showing the structure of a light emitting device according to another embodiment of the present invention. Referring to FIG. 2, the light emitting device structure 100b of the present embodiment is similar to the light emitting device structure 100a of FIG. 1, but the main difference is that the reflective layer 140b of the present embodiment is further disposed on the lower bottom surface 122a of the encapsulant 120a. The bottom surface 142b of the reflective layer 140b is aligned with the first bottom surface B1 of the first pad 118a and the second bottom surface B2 of the second pad 118b. The top of the reflective layer 140b is opposite to the bottom surface 142b The face 144b is aligned with the upper surface 112 of the light emitting element 110. A first peripheral surface 124a of the encapsulant 120a is aligned with a second peripheral surface 148b of the reflective layer 140b, and a second peripheral surface 148b of the reflective layer 140b is aligned with a third peripheral surface 132 of the transparent plate 130.

As shown in FIG. 2, the reflective layer 140b of the present embodiment extends to the lower bottom surface 122a of the encapsulant 120a, and the reflective layer 140b connects the peripheral surfaces of the first pads 118a and the second pads 118b of the light emitting element 110. Therefore, if the material of the reflective layer 140b is made of a metal material, such as a silver layer, an aluminum layer or other suitable metal material, the reflective layer 140b can be regarded as an extension of the first pad 118a and the second pad 118b. That is to say, the light-emitting element 110 of the present embodiment can increase the contact area of the electrode through the design of the reflective layer 140b, that is, the light-emitting element 110 of the present embodiment can have a larger electrode area. Therefore, when a light-emitting module (not shown) is formed by assembling the light-emitting device structure 100b to an external circuit (not shown), the alignment accuracy during assembly can be effectively improved.

3 is a cross-sectional view showing the structure of a light emitting device according to another embodiment of the present invention. Referring to FIG. 3, the light emitting device structure 100c of the present embodiment is similar to the light emitting device structure 100b of FIG. 2, but the main difference between the two is that the encapsulant 120c of the present embodiment includes a resin colloid layer 120c1 and a doped The colloid layer 120c2 of the phosphor. The resin colloid layer 120c1 covers the reflective layer 140b, and the colloid layer 120c2 doped with the phosphor covers the upper surface 112 of the light-emitting element 110, the top surface 144b of the reflective layer 140b, and an upper top surface 122c of the resin colloid layer 120c1.

Here, the material of the resin colloid layer 120c1 is, for example, epoxy resin, eucalyptus A grease or white glue whose purpose is to assist in reflecting the lateral light of the light-emitting element 100. The colloid layer 120c2 doped with the phosphor is for changing the color of the light emitted by the light-emitting element 110, wherein the phosphor is, for example, yellow phosphor powder, red phosphor powder, green phosphor powder, blue phosphor powder. Or yttrium aluminum garnet fluorescing powder, but not limited to this.

4 is a cross-sectional view showing the structure of a light emitting device according to another embodiment of the present invention. Referring to FIG. 4, the light-emitting device structure 100d of the present embodiment is similar to the light-emitting device structure 100c of FIG. 3, but the main difference is that the reflective layer 140d of the present embodiment is a reflection doped with a plurality of reflective particles. The layer can have a better reflection effect. In particular, these reflective particles can be formed by sputtering, bombardment, collision, implantation, embedding, diffusion or reaction, but are not limited thereto.

In summary, since the light-emitting element structure of the present invention has a reflective layer and the reflective layer is directly disposed on the side surface of the light-emitting element, the light flux of the light-emitting element in the forward light-emission can be improved and the light flux of the lateral light-emitting portion can be reduced. . In this way, in addition to the better luminous efficiency, the light-emitting element structure of the present invention can also improve color unevenness and yellow circle and blue circle phenomenon.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100a‧‧‧Light element structure

110‧‧‧Lighting elements

112‧‧‧ upper surface

114‧‧‧ lower surface

116‧‧‧ side surface

118a‧‧‧first mat

118b‧‧‧second mat

120a‧‧‧Package colloid

122a‧‧‧ bottom surface

130‧‧‧light board

140a‧‧‧reflective layer

142a‧‧‧ bottom

144a‧‧‧ top

146a‧‧‧ side

B1‧‧‧ first bottom surface

B2‧‧‧ second bottom surface

G‧‧‧ gap

Claims (10)

A light-emitting element structure comprising: a light-emitting element having an upper surface and a lower surface opposite to each other, a side surface connecting the upper surface and the lower surface, and a first pad on the lower surface and separated from each other a second pad; a white glue layer covering the side surface of the light emitting element; a wavelength conversion layer disposed above the light emitting element; and a light transmissive layer disposed above the wavelength conversion layer Wherein the light emitting element structure comprises a plurality of flat side planes, and each of the flat side planes comprises the white glue layer and the light transmissive layer. A light-emitting element structure comprising: a light-emitting element having a first pad and a second pad on a lower surface of the light-emitting element; a white glue layer covering at least a side surface of the light-emitting element and exposing the a first pad and the second pad; a Bragg reflection layer disposed between the light emitting element and the white glue layer, and surrounding and contacting the side surface of the light emitting element; a wavelength conversion layer disposed on the light An element, the Bragg reflection layer and the white glue layer; and a light transmissive layer disposed above the light emitting element, the Bragg reflection layer and the white glue layer, wherein the light emitting element structure comprises a plurality of flat side planes And the flat side of each The surface includes at least the light transmissive layer and the white glue layer. The light-emitting element structure according to claim 1, further comprising a Bragg reflection layer directly covering the side surface of the light-emitting element. The light-emitting element structure of claim 2, wherein the white glue layer exposes a portion of the Bragg reflection layer. The light-emitting element structure of claim 1 or 2, wherein each of the side planes further comprises the wavelength conversion layer. The light emitting device structure of claim 2, wherein the light transmissive layer is disposed on the wavelength conversion layer. The light-emitting device structure of claim 1 or 2, wherein the white glue layer is further filled between the first pad and the second pad. The light-emitting device structure according to claim 1 or 2, wherein the wavelength conversion layer is disposed between the light-transmitting layer and the white rubber layer. A light-emitting element structure comprising: a light-emitting element having a lower surface and a first pad and a second pad coupled to the lower surface; a reflective wall surrounding and contacting a side surface of the light-emitting element; a wavelength conversion layer disposed above the light emitting element; and a light transmissive layer disposed above the wavelength conversion layer, wherein the light emitting element structure includes a plurality of flat side planes, and each of the flat side planes includes the reflection Wall and the light transmissive layer. A light emitting device structure comprising: a light emitting device having a lower surface and a first pad and a second pad coupled to the lower surface; a reflective wall surrounding the light emitting element and having a contact with the light emitting element a side surface; an encapsulant covering the light emitting element and the reflective wall, and exposing at least the first pad and the second pad of the light emitting element and a portion of the reflective wall; a wavelength conversion layer, And disposed on the light-emitting element, the reflective wall and the encapsulant; and a light transmissive layer disposed above the wavelength conversion layer, wherein the light-emitting element structure comprises a plurality of flat side planes, and each of the flat sides The plane includes the reflective wall and the light transmissive layer.