其次，對本發明之一實施形態進行說明。 圖1表示本發明之切斷裝置之一實施形態。切斷裝置20之主要構成具備XY載台21、噴嘴22、光傳輸系統23及雷射振盪器24。噴嘴22係於金屬製殼體內具備聚光透鏡的噴嘴，於殼體之旁側連接有用以將輔助氣體AG導入至噴嘴22的管22a。雷射振盪器24係CO2
雷射、YAG(Yttrium Aluminum Garnet，釔-鋁-石榴石)雷射、準分子雷射、銅蒸鍍雷射等雷射振盪器，於玻璃積層體之切斷時，較佳為使用CO2
雷射。 玻璃積層體10係於在玻璃板11之主面成膜樹脂層12而製造之複合體上以可剝離之狀態貼合有支持玻璃(載玻璃)13者。其中，本發明之切斷對象亦包含複合體。 於切斷玻璃積層體10之情形時，將玻璃積層體10載置於XY載台21上，於其上方配置噴嘴22。玻璃積層體10可將支持玻璃(載玻璃)13置於下側，亦可將玻璃板11置於下側而載置於XY載台21上。於噴嘴22內設置有聚光透鏡，該聚光透鏡使雷射光LB之焦點FS對準玻璃積層體10之所需之深度。繼而，藉由一面移動XY載台21一面照射雷射光LB，可將玻璃積層體10切斷。於照射雷射光LB時，藉由將輔助氣體AG同時吹送至切斷部位，可將熔融之樹脂或玻璃吹散，從而可防止切斷部因熔融玻璃等而再接著。再者，輔助氣體AG之種類並無特別限定，較佳為使用不燃性氣體，可使用氮氣、氬氣等。 圖2係表示將玻璃積層體切斷之情況的俯視圖。玻璃積層體10與XY載台21一同沿箭頭A方向搬送。自圖1之噴嘴22照射之雷射光LB所照射到之部分(雷射光照射區域15)沿玻璃積層體10上之切斷預定線14(假想線)移動，而進行玻璃積層體10之切斷。此處，藉由搬送玻璃積層體10，而使雷射光照射區域15之位置發生移位，取而代之，亦可採用將玻璃積層體10固定而使噴嘴22移動之構成。又，切斷預定線14並不限定於直線，可採用曲線、圓弧、虛線等任意之線。又，玻璃積層體10之形狀並不限定於矩形。 圖3(a)、(b)表示本發明之玻璃積層體之一實施形態。複合體10a具有於玻璃板11上成膜之包含特定結構之聚醯亞胺樹脂等之樹脂層12。樹脂層12之表面12b與玻璃板11之第1主面11a接觸，於相反側之表面12a不接觸其他材料。如圖3(c)所示，複合體10a藉由以樹脂層12之表面12a與支持玻璃13直接接觸之方式積層，而用於在玻璃板11上製造有機EL顯示面板或液晶顯示面板等電子裝置用構件的構件形成步驟。 關於玻璃積層體10，於下述構件形成步驟中，於玻璃板11之第2主面11b上形成TFT(Thin Film Transistor，薄膜電晶體)等電子裝置用構件。其後，形成有電子裝置用構件之玻璃積層體10被分離為支持玻璃13及複合體10a。所剝離之支持玻璃13可藉由積層新複合體而被再利用，亦可再利用於其他用途(使用於大型液晶電視之製造等)。 再者，樹脂層12被固定於玻璃板11上，複合體10a係以樹脂層12與支持玻璃13直接接觸之方式被可剝離地積層於支持玻璃13上，且兩者密接。於本發明中，「固定」與可剝離之「密接」於剝離強度(即，剝離所需之應力)上有差異，「固定」意指相對於「密接」而言，剝離強度較大。即，樹脂層12與玻璃板11之界面之剝離強度大於樹脂層12與支持玻璃13之界面之剝離強度。 更具體而言，玻璃板11與樹脂層12之界面具有剝離強度(x)，若對玻璃板11與樹脂層12之界面施加超過剝離強度(x)之剝離方向之應力，則玻璃板11與樹脂層12之界面發生剝離。樹脂層12與支持玻璃13之界面具有剝離強度(y)，若對樹脂層12與支持玻璃13之界面施加超過剝離強度(y)之剝離方向之應力，則樹脂層12與支持玻璃13之界面發生剝離。 於玻璃積層體10(亦意指下述帶電子裝置用構件之積層體)中，上述剝離強度(x)高於上述剝離強度(y)。因此，若對玻璃積層體10施加將支持玻璃13與玻璃板11剝離之方向之應力，則玻璃積層體10於樹脂層12與支持玻璃13之界面發生剝離，而被分離為複合體10a及支持玻璃13。 為了提高樹脂層12對玻璃板11之附著力，例如實施於玻璃板11上形成樹脂層12之方法(較佳為使藉由熱硬化而成為包含式(1)所表示之重複單元之聚醯亞胺樹脂之硬化性樹脂於玻璃板11上硬化，而形成特定之樹脂層12之方法)。藉由硬化時之接著力，可形成以較高之結合力與玻璃板11結合之樹脂層12。 另一方面，通常硬化後之樹脂層12對支持玻璃13之結合力低於上述硬化時所產生之結合力。因此，藉由於玻璃板11上形成樹脂層12，其後，於樹脂層12之面使支持玻璃13重疊，從而可製造剝離強度(x)、(y)滿足所需關係之玻璃積層體10。 其次，對構成複合體10a及玻璃積層體10之各層(支持玻璃13、玻璃板11、樹脂層12)進行詳細敍述。 [支持玻璃] 支持玻璃13之組成並無特別限制，例如可使用含有鹼金屬氧化物之玻璃(鈉鈣玻璃等)或無鹼玻璃等各種組成之玻璃。其中，就熱縮率較小之方面而言，較佳為無鹼玻璃。更具體而言，支持玻璃13之組成於本發明之效果更優異之方面而言，較佳為以氧化物基準之質量百分率表示，作為玻璃基本組成，為以下之範圍。 SiO2
：50～73% Al2
O3
：10.5～24% B2
O3
：0～5% MgO：0～10% CaO：0～14.5% SrO：0～24% BaO：0～13.5% MgO＋CaO＋SrO＋BaO：8～29.5% 進而，於本發明之效果更優異之方面而言，更佳為以下範圍。 SiO2
：53～70% Al2
O3
：15～22% B2
O3
：0.1～3% MgO：1～7% CaO：3～10% SrO：0～12% BaO：0～12% MgO＋CaO＋SrO＋BaO：10～25% 支持玻璃13之厚度並無特別限定，較佳為可利用現行之電子裝置用面板之生產線對玻璃積層體10進行處理之厚度。例如，用於當前之液晶顯示面板之玻璃板之厚度主要在0.4～1.2 mm之範圍內，尤其是0.7 mm或0.5 mm之情況較多。玻璃積層體10之厚度只要為與現行製程中所使用之玻璃板相同程度之厚度，則可容易地於現行生產線上流動，故而較佳。 例如，現行之生產線係以對厚度0.5 mm之基板進行處理之方式所設計者，於複合體10a之厚度為0.1 mm之情形時，較佳為使支持玻璃13之厚度為0.4 mm左右。又，若現行之生產線係以對厚度0.7 mm之玻璃板進行處理之方式加以設計，則假如複合體10a之厚度為0.2 mm，只要使支持玻璃13之厚度為0.5 mm左右即可。 本發明之複合體10a之用途並不限於有機EL顯示面板或液晶顯示面板，亦有太陽能發電面板等。因此，支持玻璃13之厚度並無限定，較佳為0.1～1.1 mm之厚度。進而，為了確保複合體10a之剛性，支持玻璃13之厚度較佳為較複合體10a厚。又，支持玻璃13之厚度較佳為0.3 mm以上，其厚度更佳為0.3～0.8 mm，進而較佳為0.4～0.7 mm。 支持玻璃13之表面可為經機械研磨或化學研磨處理之研磨面，或亦可為未經研磨處理之非蝕刻面(生坯面)。就生產性及成本之方面而言，較佳為非蝕刻面(生坯面)。 支持玻璃13具有第1主面及第2主面，又，其形狀並無限定，較佳為矩形。所謂矩形，係指實質上之矩形，亦可具有切角。支持玻璃13之大小並無限定，例如較佳為100～2,000 mm×100～2,000 mm，進而較佳為500～1,000 mm×500～1,000 mm。 [玻璃板] 玻璃板11之第1主面11a與樹脂層12接觸，於相反側之第2主面11b製作有電子裝置用構件。即，玻璃板11係用於形成下述電子裝置之基板。 玻璃板11之種類可為通常之類型，例如可列舉LCD(liquid crystal display，液晶顯示裝置)、OLED(Organic Light-Emitting Diode，有機發光二極體)等顯示裝置用之玻璃板等。玻璃板11之耐化學品性、耐透濕性優異，且玻璃板11之熱縮率低。作為熱縮率之指標，可使用JIS R 3102(1995年修訂)中規定之線膨脹係數。 若玻璃板11之線膨脹係數大，則由於構件形成步驟中大多伴隨加熱處理，因此，容易產生各種不良情況。例如，於在玻璃板11上形成TFT之情形時，若將於加熱下形成有TFT之玻璃板11冷卻，則有因玻璃板11之熱縮導致TFT之位置發生偏移之虞。 玻璃板11係將玻璃原料熔融並使熔融玻璃成形為板狀而獲得。作為其成形方法，只要為通常之方法即可，例如可使用浮式法、熔融法、流孔下引法、富可法、魯伯法等。又，厚度特別薄之玻璃板11係藉由將暫時先成形為板狀之玻璃加熱至可成形之溫度，並利用延伸等手段進行拉伸使之變薄之方法(再曳引法)進行成形而獲得。 玻璃板11之玻璃之種類並無特別限定，較佳為無鹼硼矽酸玻璃、硼矽酸玻璃、鈉鈣玻璃、高二氧化矽玻璃、其他之以氧化矽為主要成分之氧化物系玻璃。作為氧化物系玻璃，較佳為以氧化物換算計之氧化矽含量為40～90質量%之玻璃。玻璃板11之組成亦可與支持玻璃13相同。 玻璃板11中採用適於電子裝置用構件之種類或其製造步驟的玻璃。例如，由於鹼金屬成分之溶出容易對液晶產生影響，故而液晶面板用玻璃板包含實質上不含鹼金屬成分之玻璃(無鹼玻璃)(其中，通常包含鹼土金屬成分)。如此，玻璃板11之玻璃係基於所應用之裝置之種類及其製造步驟而適當選擇。 玻璃板11之厚度就玻璃板11之薄型化及/或輕量化之觀點而言，較佳為0.3 mm以下，更佳為0.15 mm以下，進而較佳為0.10 mm以下。於為0.3 mm以下之情形時，可對玻璃板11賦予良好之可撓性。於為0.15 mm以下之情形時，能夠將玻璃板11捲取為卷狀。其中，基於玻璃板11之製造較容易、玻璃板11之操作較容易等原因，玻璃板11之厚度較佳為0.03 mm以上。 再者，玻璃板11亦可由2層以上構成，於該情形時，形成各層之材料可為同種材料，亦可為異種材料。例如，亦可於玻璃板11之表面成膜有ITO(Indium Tin Oxides，氧化銦錫)等之透明導電膜等。又，於該情形時，「玻璃板11之厚度」意指全部層之合計厚度。 [樹脂層] 樹脂層12具有使玻璃板11與支持玻璃13在進行該等之分離操作之前相互密接之功能。樹脂層12之與支持玻璃13接觸之表面12a係可剝離地積層(密接)於支持玻璃13之第1主面。樹脂層12藉由弱結合力結合於支持玻璃13之第1主面，該界面之剝離強度(y)低於樹脂層12與玻璃板11之間之界面之剝離強度(x)。 即，於將玻璃板11與支持玻璃13分離時，於支持玻璃13之第1主面與樹脂層12之界面發生剝離，而於玻璃板11與樹脂層12之界面難以剝離。於本發明中，將能夠容易地將支持玻璃13自樹脂層12剝離之性質稱為「剝離性」。另一方面，玻璃板11之第1主面與樹脂層12以相對不易剝離之結合力結合。再者，樹脂層12與支持玻璃13之界面之結合力亦可於在玻璃積層體10之玻璃板11之面(第2主面12b)上形成電子裝置用構件前後發生變化(即，剝離強度(x)或剝離強度(y)可發生變化)。但是，即便於形成電子裝置用構件之後，剝離強度(y)仍低於剝離強度(x)。 認為樹脂層12與支持玻璃13以較弱之接著力或由凡得瓦力產生之結合力結合。認為於形成樹脂層12後在其表面積層支持玻璃13之情形、樹脂層12中之聚醯亞胺樹脂如不表現接著力般充分地醯亞胺化之情形均以由凡得瓦力產生之結合力結合。 但是，多數情況下樹脂層12中之聚醯亞胺樹脂具有某程度之較弱之接著力。認為即便於接著性極低之情形時，於製造玻璃積層體10後在其上形成電子裝置用構件時，藉由加熱操作等，而使樹脂層12中之聚醯亞胺接著於支持玻璃13，樹脂層12與支持玻璃13之層之間之結合力上升。視情況，亦可於積層前之樹脂層12之表面或積層前之支持玻璃13之第1主面進行減小兩者間之結合力之處理後進行積層。藉由於積層之面進行非接著性處理等，其後進行積層，而可減小樹脂層12與支持玻璃13之界面之結合力，從而可降低剝離強度(y)。 又，樹脂層12以接著力或黏著力等較強之結合力結合於玻璃板11之表面。例如，如上所述，藉由於玻璃板11上形成樹脂層12(較佳為使藉由熱硬化而成為包含式(1)所表示之重複單元之聚醯亞胺樹脂之硬化性樹脂於玻璃板11表面硬化)，從而可將經加熱硬化之聚醯亞胺樹脂之層接著於玻璃板11表面，而獲得較高之結合力。又，可實施使玻璃板11表面與樹脂層12之間產生較強之結合力之處理(例如使用偶合劑之處理)來提高玻璃板11表面與樹脂層12之間之結合力。 樹脂層12之厚度並無特別限定，較佳為0.1～100 μm，更佳為0.5～50 μm，進而較佳為1～30 μm。若樹脂層12之厚度為此種範圍，則即便存在於樹脂層12與支持玻璃13之間介存氣泡或異物之情況，亦可抑制玻璃板11之應變缺陷之產生。又，若樹脂層12之厚度過厚，則形成需要時間及材料，故而不經濟，亦存在耐熱性降低之情形。又，若樹脂層12之厚度過薄，則存在樹脂層12與支持玻璃13之密接性降低之情形。再者，樹脂層12亦可包含2層以上。於該情形時，「樹脂層12之厚度」意指全部層之合計厚度。 樹脂層12之支持玻璃13側表面之表面粗糙度Ra較佳為0～2.0 nm，更佳為0～1.0 nm，進而較佳為0.05～0.5 nm。若表面粗糙度Ra為上述範圍內，則複合體10a對支持玻璃13之密接性優異，而不易產生複合體10a之位置偏移。一般而言，使聚醯亞胺樹脂成形為層狀之方法有於製造熱塑性之聚醯亞胺樹脂之後擠壓成型之方法、或於將包含藉由熱硬化而成為聚醯亞胺樹脂之硬化性樹脂的溶液塗佈於基材上之後使其於基板表面硬化之方法。後者之方法容易獲得表面粗糙度Ra為上述範圍之樹脂層12，故而較佳。 此處，表面粗糙度Ra係藉由原子力顯微鏡(Pacific Nanotefchnology公司製造，Nano Scope IIIa；掃描速率(Scan Rate)1.0 Hz，抽樣線(Sample Lines)256，Off-line Modify Flatten order-2，Planefit order-2)測定(依據利用原子力顯微鏡之精細陶瓷薄膜之表面粗糙度測定方法 JIS R 1683：2007)。 樹脂層12之聚醯亞胺樹脂包含下述式(1)所表示之具有四羧酸類之殘基(X)及二胺類之殘基(A)之重複單元。再者，聚醯亞胺樹脂含有式(1)所表示之重複單元作為主成分(較佳為相對於總重複單元為95莫耳%以上)，但亦可包含其以外之其他重複單元(例如，下述式(2-1)或(2-2)所表示之重複單元)。再者，所謂四羧酸類之殘基(X)，係指自四羧酸類去除羧基後之四羧酸殘基，所謂二胺類之殘基(A)，係指自二胺類去除胺基後之二胺殘基。 [化1]式(1)中，X表示自四羧酸類去除羧基後之四羧酸殘基，X之總數之50莫耳%以上包含選自由以下之式(X1)～(X4)表示之基所組成之群中之至少1種基。其中，於複合體10a與支持玻璃13之剝離性或樹脂層12之耐熱性更優異之方面而言，較佳為X之總數之80～100莫耳%包含選自由以下之式(X1)～(X4)表示之基所組成之群中之至少1種基，更佳為X之總數之實質上全數(100莫耳%)包含選自由以下之式(X1)～(X4)表示之基所組成之群中之至少1種基。再者，於X之總數之未達50莫耳%包含選自由以下之式(X1)～(X4)表示之基所組成之群中之至少1種基之情形時，複合體10a與支持玻璃13之剝離性、及樹脂層12之耐熱性之至少一者較差。 又，「A」表示自二胺類去除胺基後之二胺殘基，表示「A」之總數之50莫耳%以上為選自由(A1)～(A7)表示之基所組成之群中之至少1種基。其中，於複合體10a與支持玻璃13之剝離性、或樹脂層12之耐熱性更優異之方面而言，較佳為「A」之總數之80～100莫耳%包含選自由以下之式(A1)～(A7)表示之基所組成之群中之至少1種基，更佳為「A」之總數之實質上全數(100莫耳%)包含選自由以下之式(A1)～(A7)表示之基所組成之群中之至少1種基。再者，於A之總數之未達50莫耳%包含選自由以下之式(A1)～(A7)表示之基所組成之群中之至少1種基之情形時，複合體10a與支持玻璃13之剝離性及樹脂層12之耐熱性之至少一者較差。 於複合體10a與支持玻璃13之剝離性、或樹脂層12之耐熱性更優異之方面而言，較佳為X之總數之80～100莫耳%包含選自由以下之式(X1)～(X4)表示之基所組成之群中之至少1種基，且「A」之總數之80～100莫耳%包含選自由以下之式(A1)～(A7)表示之基所組成之群中之至少1種基，更佳為X之總數之實質上全數(100莫耳%)包含選自由以下之式(X1)～(X4)表示之基所組成之群中之至少1種基，且A之總數之實質上全數(100莫耳%)包含選自由以下之式(A1)～(A7)表示之基所組成之群中之至少1種基。 [化2]其中，於複合體10a與支持玻璃13之剝離性、或樹脂層12之耐熱性更優異之方面而言，作為「X」，較佳為式(X1)所表示之基及式(X2)所表示之基，更佳為式(X1)所表示之基。 又，於複合體10a與支持玻璃13之剝離性、或樹脂層12之耐熱性更優異之方面而言，作為「A」，較佳為選自由式(A1)～(A4)表示之基所組成之群中之基，更佳為選自由式(A1)～(A3)表示之基所組成之群中之基。 作為包含式(X1)～(X4)所表示之基與式(A1)～(A7)所表示之基之較佳組合的聚醯亞胺樹脂，可列舉「X」為選自由式(X1)表示之基及式(X2)表示之基所組成之群中之基、且「A」為選自由式(A1)～(A5)表示之基所組成之群中之基的聚醯亞胺樹脂，其中，可較佳地列舉：X為式(X1)所表示之基、且「A」為式(A1)所表示之基的聚醯亞胺樹脂1、及「X」為式(X2)所表示之基、且A為式(A5)所表示之基的聚醯亞胺樹脂2。於聚醯亞胺樹脂1及聚醯亞胺樹脂2之情形時，於450℃之環境下之長期耐熱性之方面而言較佳，若為聚醯亞胺樹脂1，則於500℃之環境下之長期耐熱性之方面而言更佳。 又，於X為式(X4)所表示之基、且A為式(A6)及式(A7)所表示之基的組合之情形時，於透明性之方面而言較佳。 聚醯亞胺樹脂中之上述式(1)所表示之重複單元之重複數(n)並無特別限制，較佳為2以上之整數，於樹脂層12之耐熱性及塗膜之成膜性之方面而言，更佳為10～10,000，進而較佳為15～1,000。聚醯亞胺樹脂之分子量於塗佈性、耐熱性之方面而言，較佳為500～100,000。 於不損害耐熱性之範圍內，上述聚醯亞胺樹脂之四羧酸類之殘基(X)之總數之未達50莫耳%亦可為選自由下述例示之基所組成之群中之1種以上。又，亦可包含2種以上之下述所例示之基。 [化3]又，於不損害耐熱性之範圍內，上述聚醯亞胺樹脂之二胺類之殘基(A)之總數之未達50莫耳%亦可為選自由下述所例示之基所組成之群中之1種以上。又，亦可包含2種以上之下述所例示之基。 [化4]又，上述聚醯亞胺樹脂亦可於分子末端具有烷氧基矽烷基。 作為將烷氧基矽烷基導入至分子末端之方法，有使下述聚醯胺酸所具有之羧基或胺基與含環氧基之烷氧基矽烷或其部分縮聚物反應之方法。含環氧基之烷氧基矽烷例如可使分子中具有羥基之環氧化合物與烷氧基矽烷或其部分縮聚物反應而獲得。具有羥基之環氧化合物較佳為碳數15以下，例如可列舉環氧丙醇等。作為烷氧基矽烷，可列舉碳數為4以下之四烷氧基矽烷、或具有碳數為4以下之烷氧基及碳數為8以下之烷基的三烷氧基矽烷。具體而言，可列舉：四甲氧基矽烷、四乙氧基矽烷、四丙氧基矽烷等四烷氧基矽烷類、或甲基三甲氧基矽烷等三烷氧基矽烷等。較佳為分子中具有羥基之環氧化合物與烷氧基矽烷基的反應係於環氧化合物之羥基當量/烷氧基矽烷基當量＝0.001/1～0.5/1之範圍內進行反應。 進而，亦可使上述聚醯亞胺樹脂之分子末端之烷氧基矽烷基藉由加熱處理或水解，而設為經溶膠凝膠反應或脫醇縮合反應後之二氧化矽結構。於上述反應時，亦可添加烷氧基矽烷。作為烷氧基矽烷，可使用上述化合物。 藉由使分子末端成為二氧化矽結構，而實現耐熱性之提昇。又，能夠降低聚醯亞胺樹脂之線膨脹係數，即便於支持基材之厚度較薄之情形時，亦可減小附樹脂層之支持基材之翹曲。 樹脂層12中之聚醯亞胺樹脂之含量並無特別限制，於複合體10a與支持玻璃13之剝離性、或樹脂層12之耐熱性更優異之方面而言，相對於樹脂層總質量，較佳為50～100質量%，更佳為75～100質量%，進而較佳為90～100質量%。 樹脂層12中亦可視需要包含上述聚醯亞胺樹脂以外之其他成分(例如不阻礙耐熱性之填料等)。 作為不阻礙耐熱性之填料，可列舉纖維狀或板狀、鱗片狀、粒狀、不定形狀、破碎品等非纖維狀之填充劑，具體而言，例如可列舉PAN(polyacrylonitrile，聚丙烯腈)系或瀝青系之碳纖維、玻璃纖維、不鏽鋼纖維、鋁纖維或黃銅纖維等金屬纖維、石膏纖維、陶瓷纖維、石棉纖維、氧化鋯纖維、氧化鋁纖維、二氧化矽纖維、氧化鈦纖維、碳化矽纖維、岩絨、鈦酸鉀晶鬚、鈦酸鋇晶鬚、硼酸鋁晶鬚、氮化矽晶鬚、雲母、滑石、鋯石、二氧化矽、碳酸鈣、玻璃珠、玻璃薄片、玻璃微球、黏土、二硫化鉬、矽灰石、氧化鈦、氧化鋅、多磷酸鈣、石墨(graphite)、金屬粉、金屬薄片、金屬帶、金屬氧化物、碳粉末、石墨、碳薄片、鱗片狀碳、奈米碳管等。作為金屬粉、金屬薄片、金屬帶之金屬種類之具體例，可例示銀、鎳、銅、鋅、鋁、不鏽鋼、鐵、黃銅、鉻、錫等。 樹脂層12係藉由如下方式形成之聚醯亞胺樹脂之層，即，對玻璃板11上形成之藉由熱硬化而成為包含上述式(1)所表示之具有四羧酸類之殘基(X)及二胺類之殘基(A)之重複單元之聚醯亞胺樹脂的硬化性樹脂之層、或塗佈包含上述聚醯亞胺樹脂及溶劑之組合物而獲得之層，依序實施於60℃以上且未達250℃進行加熱之第1加熱處理、及於250℃以上且500℃以下進行加熱之第2加熱處理。 關於樹脂層12之製造方法，於後部分之玻璃積層體之製造方法中進行詳細敍述。 [玻璃積層體之製造方法] 作為本發明之玻璃積層體10之製造方法之第1態樣，使用下述硬化性樹脂於玻璃板11上形成樹脂層12，繼而，於樹脂層12上積層支持玻璃13，而製造玻璃積層體10。 認為若使硬化性樹脂於玻璃板11之表面硬化，則樹脂層12藉由硬化反應時與玻璃板11之表面之相互作用而與玻璃板11表面接著，從而樹脂層12與玻璃板11表面之剝離強度變高。因此，即便玻璃板11與支持玻璃13為包含相同材質者，亦可使樹脂層12與兩者間之剝離強度產生差異。 (樹脂層形成步驟) 樹脂層12係藉由如下方式形成之聚醯亞胺樹脂之層，即，對玻璃板上形成之藉由熱硬化而成為包含上述式(1)所表示之具有四羧酸類之殘基(X)及二胺類之殘基(A)之重複單元之聚醯亞胺樹脂的硬化性樹脂之層，依序實施於60℃以上且未達250℃進行加熱之第1加熱處理、及於250℃以上且500℃以下進行加熱之第2加熱處理。再者，四羧酸類之殘基(X)之總數之50莫耳%以上包含選自由上述式(X1)～(X4)表示之基所組成之群中之至少1種基，二胺類之殘基(A)之總數之50莫耳%以上包含選自由上述式(A1)～(A7)表示之基所組成之群中之至少1種基。 樹脂層形成步驟係藉由如下方式獲得樹脂層之步驟，即，對藉由熱硬化而成為包含上述式(1)所表示之具有四羧酸類之殘基(X)及二胺類之殘基(A)之重複單元之聚醯亞胺樹脂的硬化性樹脂之層，依序實施於60℃以上且未達250℃進行加熱之第1加熱處理、及於250℃以上且500℃以下進行加熱之第2加熱處理。如圖3(a)所示，於該步驟中，於玻璃板11之至少單面之表面上形成樹脂層12。 以下，將樹脂層形成步驟分為以下3個步驟進行說明。 步驟(1)：將藉由熱硬化而成為上述式(1)所表示之聚醯亞胺樹脂之硬化性樹脂塗佈於玻璃板11上而獲得塗膜之步驟 步驟(2)：於60℃以上且未達250℃對塗膜進行加熱之步驟 步驟(3)：進而於250℃以上且500℃以下對塗膜進行加熱而形成樹脂層之步驟 (塗膜形成步驟) 於本步驟中，將藉由熱硬化而成為具有上述式(1)所表示之重複單元之聚醯亞胺樹脂之硬化性樹脂塗佈於玻璃板11上，而獲得塗膜。再者，硬化性樹脂較佳為包含使四羧酸二酐與二胺類反應而獲得之聚醯胺酸，較佳為四羧酸二酐之至少一部包含選自由下述式(Y1)～(Y4)表示之化合物所組成之群中之至少1種四羧酸二酐，且二胺類之至少一部包含選自由下述式(B1)～(B7)表示之化合物所組成之群中之至少1種二胺類。 [化5][化6]再者，聚醯胺酸通常表示為包含以下式(2-1)及/或式(2-2)所表示之重複單元的結構式。再者，式(2-1)、式(2-2)中，X、A之定義如上所述。 [化7]四羧酸二酐與二胺類之反應條件並無特別限制，於可高效率地合成聚醯胺酸之方面而言，較佳為使其於-30～70℃(較佳為-20～40℃)下進行反應。四羧酸二酐與二胺類之混合比率並無特別限制，可列舉相對於二胺類1莫耳，使較佳為0.66～1.5莫耳、更佳為0.9～1.1莫耳、進而較佳為0.97～1.03莫耳之四羧酸二酐進行反應。 於四羧酸二酐與二胺類之反應時，亦可視需要使用有機溶劑。所使用之有機溶劑之種類並無特別限制，例如可使用N-甲基-2-吡咯啶酮、N,N-二甲基乙醯胺、N,N-二乙基乙醯胺、N,N-二甲基甲醯胺、N,N-二乙基甲醯胺、N-甲基己內醯胺、六甲基磷醯胺、四亞甲基碸、二甲基亞碸、間甲酚、苯酚、對氯苯酚、2-氯-4-羥基甲苯、二乙二醇二甲醚、三乙二醇二甲醚、四乙二醇二甲醚、二烷、γ-丁內酯、二氧戊環、環己酮、環戊酮等，亦可併用2種以上。 於上述反應時，亦可視需要併用選自由上述式(Y1)～(Y4)表示之化合物所組成之群中之四羧酸二酐以外之其他四羧酸二酐。 又，於上述反應時，亦可視需要併用選自由上述式(B1)～(B7)表示之化合物所組成之群中之二胺類以外之其他二胺類。 又，關於本步驟中使用之硬化性樹脂，除可使用使四羧酸二酐與二胺類反應而獲得之聚醯胺酸以外，亦可使用添加有可與聚醯胺酸反應之四羧酸二酐或二胺類者。若除聚醯胺酸以外，還添加四羧酸二酐或二胺類，則可使具有式(2-1)或式(2-2)所表示之重複單元的2個以上之聚醯胺酸分子經由四羧酸二酐或二胺類鍵結。 於聚醯胺酸之末端具有胺基之情形時，可添加四羧酸二酐，可以羧基相對於1莫耳聚醯胺酸成為0.9～1.1莫耳之方式進行添加。於聚醯胺酸之末端具有羧基之情形時，可添加二胺類，可以胺基相對於1莫耳聚醯胺酸成為0.9～1.1莫耳之方式進行添加。再者，於聚醯胺酸之末端具有羧基之情形時，亦可使用添加水或任意之醇而使末端之酸酐基開環者。 其後添加之四羧酸二酐更佳為式(Y1)～(Y4)所表示之化合物。其後添加之二胺類較佳為具有芳環之二胺類，更佳為式(B1)～(B7)所表示之化合物。 於其後添加四羧酸二酐類或二胺類之情形時，具有式(2-1)或式(2-2)所表示之重複單元的聚醯胺酸之聚合度(n)較佳為1～20。若聚合度(n)為此範圍，則即便硬化性樹脂溶液中之聚醯胺酸濃度為30質量%以上，亦可使硬化性樹脂溶液之黏度較低。 於本步驟中，亦可使用硬化性樹脂以外之成分。 例如，亦可使用溶劑。更具體而言，可使硬化性樹脂於溶劑中溶解而作為硬化性樹脂之溶液(硬化性樹脂溶液)使用。作為溶劑，尤其是就聚醯胺酸之溶解性之方面而言，較佳為有機溶劑。作為所使用之有機溶劑，可列舉於上述反應時所使用之有機溶劑。 再者，作為上述溶劑之較佳態樣之一，較佳為使用沸點(1大氣壓下)未達250℃之溶劑。若為該溶劑，則於第1加熱處理步驟中溶劑容易揮發，結果使膜之外觀更優異。再者，上述沸點之下限並無特別限制，於操作性之方面而言，較佳為60℃以上。 再者，於硬化性樹脂溶液中包含有機溶劑之情形時，只要為能夠良好地調整塗膜之厚度且塗佈性良好之量，則有機溶劑之含量並無特別限制，一般而言，相對於硬化性樹脂溶液總質量，較佳為10～99質量%，更佳為20～90質量%。 又，亦可視需要併用用以促進聚醯胺酸之脫水閉環的脫水劑或脫水閉環觸媒。例如，作為脫水劑，例如可使用乙酸酐、丙酸酐、三氟乙酸酐等酸酐。又，作為脫水閉環觸媒，例如可使用吡啶、三甲基吡啶、二甲基吡啶、三乙胺等三級胺。 於玻璃板11之表面上塗佈硬化性樹脂(或硬化性樹脂溶液)之方法並無特別限定，可使用公知之方法。例如可列舉噴塗法、模嘴塗佈法、旋轉塗佈法、浸漬塗佈法、輥塗法、棒式塗佈法、網版印刷法、凹版塗佈法等。 藉由上述處理而獲得之塗膜之厚度並無特別限制，以可獲得上述所需之厚度之樹脂層12之方式進行適當調整。 (步驟(2)：第1加熱處理步驟) 步驟(2)係於60℃以上且未達250℃對塗膜進行加熱之步驟。藉由實施本步驟，可防止溶劑之爆沸並且去除溶劑，難以形成發泡或橘皮狀之膜缺陷。 加熱處理之方法並無特別限制，可適當使用公知之方法(例如，將附塗膜之玻璃板靜置於加熱烘箱中進行加熱之方法)。 加熱溫度為60℃以上且未達250℃，於進一步抑制樹脂層之發泡之方面而言，較佳為600～150℃，更佳為60～120℃。尤佳為於加熱溫度之範圍內，於未達溶劑之沸點之溫度下進行加熱。 加熱時間並無特別限制，根據所使用之硬化性樹脂之結構適當選擇最佳之時間，就可進一步防止聚醯胺酸之解聚合之方面而言，較佳為5～60分鐘，更佳為10～30分鐘。 加熱環境並無特別限制，例如於大氣中之條件下、真空下或惰性氣體下實施。若於真空下實施，則即便於較低之溫度下進行加熱，亦可於更短時間內去除揮發成分，又，可進一步控制聚醯胺酸之解聚合，故而較佳。 又，第1加熱處理步驟亦可改變加熱溫度及加熱時間而階段性(2階段以上)地實施。 (步驟(3)：第2加熱處理步驟) 步驟(3)係對步驟(2)中經過加熱處理之塗膜於250℃以上且500℃以下進行加熱，而形成樹脂層之步驟。藉由實施本步驟，而使硬化性樹脂所包含之聚醯胺酸之閉環反應進行，從而形成所需之樹脂層。 加熱處理之方法並無特別限制，可適當使用公知之方法(例如，將附塗膜之玻璃板靜置於加熱烘箱中進行加熱之方法)。 加熱溫度為250℃以上且500℃以下，於殘留溶劑率降低並且醯亞胺化率進一步上升，複合體10a與支持玻璃13之剝離性或樹脂層12之耐熱性更優異之方面而言，較佳為350～500℃。 加熱時間並無特別限制，根據所使用之硬化性樹脂之結構等適當選擇最佳之時間，於殘留溶劑率降低並且醯亞胺化率進一步上升，複合體10a與支持玻璃13之剝離性或樹脂層12之耐熱性更優異之方面而言，較佳為15～120分鐘，更佳為30～60分鐘。 加熱環境並無特別限制，例如於大氣中之條件下、真空下或惰性氣體下實施。 藉由經由上述步驟(3)，而形成包含聚醯亞胺樹脂之樹脂層。 聚醯亞胺樹脂之醯亞胺化率並無特別限制，於複合體10a與支持玻璃13之剝離性或樹脂層12之耐熱性更優異之方面而言，較佳為99.0%以上，更佳為99.5%以上。 關於醯亞胺化率之測定方法，將對硬化性樹脂於氮氣環境下、350℃下加熱2時間之情形設為100%之醯亞胺化率，根據硬化性樹脂之IR(infrared，紅外線)光譜中源自醯亞胺羰基之波峰：約1,780 cm-1
之波峰強度相對於在第2加熱處理前後不變之波峰強度(例如，源自苯環之波峰：約1,500 cm-1
)之強度比，求出醯亞胺化率。 (積層步驟) 積層步驟係於在上述樹脂層形成步驟中所獲得之樹脂層12之面上積層支持玻璃13，而獲得依序具備支持玻璃13、樹脂層12及玻璃板11之玻璃積層體10之步驟。 於樹脂層12上積層支持玻璃13之方法並無特別限制，可採用公知之方法。例如可列舉於常壓環境下於樹脂層12之表面上重疊支持玻璃13之方法。再者，亦可視需要，於在樹脂層12之表面上重疊支持玻璃13後，使用輥或加壓機使支持玻璃13壓接於樹脂層12。藉由利用輥或加壓機之壓接，可相對容易地去除混入至樹脂層12與支持玻璃13之層之間的氣泡，故而較佳。 若藉由真空層壓法或真空加壓法進行壓接，則抑制氣泡之混入或確保良好之密接，故而更佳。藉由於真空下進行壓接，而即便於殘存有微小之氣泡之情形時，亦有氣泡不會因加熱成長，而不易導致產生支持玻璃13之應變缺陷之優點。又，藉由於真空加熱下進行壓接，而使氣泡更不易殘存。於積層支持玻璃13時，較佳為將支持玻璃13之接觸樹脂層12的表面充分地洗淨，於潔淨度較高之環境下進行積層。潔淨度越高，支持玻璃13之平坦性越良好，故而較佳。 再者，於積層支持玻璃13後，亦可視需要進行預退火處理(加熱處理)。藉由進行該預退火處理，所積層之支持玻璃13對於樹脂層12之密接性提昇，可設為適當之剝離強度(y)，於下述構件形成步驟時，不易產生電子裝置用構件之位置偏移等，從而電子裝置之生產性提昇。 預退火處理之條件根據所使用之樹脂層12之種類適當選擇最佳之條件，但就使支持玻璃13與樹脂層12之間之剝離強度(y)更適當之方面而言，較佳為於200℃以上(較佳為200～400℃)進行5分鐘以上(較佳為5～30分鐘)之加熱處理。 (玻璃積層體) 本發明之玻璃積層體10可用於各種用途，例如可列舉製造顯示裝置用面板、太陽電池、薄膜蓄電池、於表面形成有電路之半導體晶圓、液晶透鏡等電子零件的用途等。再者，於該用途中，玻璃積層體10多數情況下暴露於高溫條件(例如400℃以上)下(例如1小時以上)。 此處，所謂顯示裝置用面板，包含LCD、OLED、電子紙、電漿顯示面板、場發射面板、量子點LED面板、MEMS(Micro Electro Mechanical Systems，微機電系統)快門面板等。 再者，於上述內容中，對使用硬化性樹脂製造附樹脂層之支持基材之態樣進行了詳細敍述，但亦可使用塗佈包含上述聚醯亞胺樹脂及溶劑之組合物而獲得之層來製造複合體。更具體而言，亦可藉由於玻璃板上形成塗佈包含上述聚醯亞胺樹脂及溶劑之組合物而獲得之層(塗膜)，並依序進行於60℃以上且未達250℃進行加熱之第1加熱處理、及於250℃以上且500℃以下進行加熱之第2加熱處理，而製造複合體。 所使用之聚醯亞胺樹脂之種類如上所述。又，所使用之溶劑之種類並無特別限制，例如可列舉上述硬化性樹脂溶液中所含之溶劑。 (玻璃積層體之切斷方法) 對以上說明之玻璃積層體之切斷方法之構成例進行說明。 此處，將支持玻璃13作為第1玻璃板，將玻璃板11作為第2玻璃板。即，可將使第1玻璃板及較該第1玻璃板薄之第2玻璃板介隔樹脂層積層而成之積層體作為以上說明之玻璃積層體。 而且，本實施形態之玻璃積層體之切斷方法如使用圖1進行之說明般，具有對玻璃積層體照射雷射光之步驟。 而且，該雷射光之脈衝通量F[J/mm2
]及重疊率[%]L較佳為滿足下述式(A)及式(B)。 F≧3 ···式(A) F＞-0.09L＋11.8 ···式(B) 此處，L＝(D0－v/f)/D0＊100，D0表示上述雷射光之脈衝之聚光直徑(mm)，v表示切斷速度(mm/s)，f表示上述雷射光之振盪頻率(Hz)。 根據該玻璃積層體之切斷方法，可使樹脂層之切割殘留較先前減少。 [實施例] 圖4係表示自聚醯胺酸溶液之製造至積層體之切斷為止之一連串步驟之一例的流程圖。 ＜聚醯胺酸溶液之製造＞ 使對苯二胺(10.8 g，0.1 mol)溶解於N,N-二甲基乙醯胺(198.6 g)，並於室溫下進行攪拌。向其中歷時1分鐘添加BPDA(Biphenyl tetracarboxylic Dianhydride，聯苯四羧酸二酐)(29.4 g，0.1 mmol)，於室溫下攪拌2小時，而獲得包含具有上述式(2-1)及/或式(2-2)所表示之重複單元之聚醯胺酸的固形物成分濃度為20質量%之聚醯胺酸溶液(P1)(步驟S1)。 對該溶液之黏度進行測定，結果於20℃下為5,000厘泊。再者，黏度係使用Tokimec股份有限公司製造之DVL-BII型數位黏度計(B型黏度計)，對20℃下之旋轉黏度進行測定者。聚醯胺酸中所包含之式(2-1)及/或式(2-2)所表示之重複單元中的X係(X1)所表示之基，A係式(A1)所表示之基。 ＜玻璃積層體之製造＞ 首先，將板厚0.1 mm之玻璃板用純水洗淨後，進而進行UV清洗，使玻璃板淨化(步驟S2)。 其次，將聚醯胺酸溶液(P1)利用旋轉塗佈機(轉數：2,000 rpm，15秒)塗佈於玻璃板之第1主面上(步驟S3)，將包含聚醯胺酸之塗膜設置於玻璃板上(塗佈量2 g/m2
)。再者，上述聚醯胺酸係使式(Y1)所表示之化合物與式(B1)所表示之化合物反應而獲得之樹脂。 其次，於大氣中、60℃下將塗膜加熱15分鐘，繼而，在120℃下將塗膜加熱15分鐘後，進而，於350℃下將塗膜加熱15分鐘，而形成樹脂層(步驟S4)。所形成之樹脂層中包含有具有以下式(3)所表示之重複單元之聚醯亞胺樹脂(式(1)中之X包含(X1)所表示之基，A包含式(A1)所表示之基)。 [化8]再者，醯亞胺化率為99.7%。又，所形成之樹脂層表面之表面粗糙度Ra為0.2 nm。醯亞胺化率之測定方法及表面粗糙度Ra之測定方法係藉由上述方法實施。 其後，使支持玻璃13與複合體10a之樹脂層12於室溫下藉由真空加壓機貼合，而獲得玻璃積層體10(步驟S5)。 於所獲得之玻璃積層體10中，支持玻璃13及玻璃板11與樹脂層12不產生氣泡而密接，亦無應變狀缺陷，平滑性亦良好。再者，於玻璃積層體10中，玻璃板11與樹脂層12之界面剝離強度(x)高於樹脂層12與支持玻璃13之界面剝離強度(y)。 其次，對上述玻璃積層體10於大氣下、450℃下進行60分鐘加熱處理，並冷卻至室溫(步驟S6)，結果未見玻璃積層體10中之複合體10a與支持玻璃13之分離、或樹脂層12之發泡或變白等外觀上之變化。 其後，使用CO2
雷射，將上述加熱後之玻璃積層體切斷(步驟S7)。 (實施例1) 此處，對藉由改變切斷條件而獲得之實施例、比較例進行說明。 自支持玻璃13側，使雷射光LB相對於玻璃積層體10自正上方垂直地入射。此時，脈衝通量設為14.1 J/mm2
，重疊率設為25%。此處，所謂脈衝通量，係指用雷射光LB之脈衝平均能量除以脈衝面積而得者。重疊率L係由下述式4表示，若模式性地進行表示，則如圖5。 D0表示雷射光LB之脈衝之聚光直徑(mm)，v表示切斷速度(mm/s)，f表示雷射光LB之振盪頻率(Hz)。於形成脈衝之光點SP1之後，下一光點SP2形成於自SP1行進v/f[mm]之移動距離之位置。 L＝(D0－v/f)/D0＊100 ···式(4) 表1、2表示實施例，表3、4表示比較例。 [表1]
[表2]
[表3]
[表4]
各表中之符號意指下述含義。 ◎：斷裂操作容易且端面粗糙較小者 ○：雖需要斷裂操作但被切斷者 ×：無法切斷者 (註釋)此處所謂「斷裂操作」，係指對雷射照射後之玻璃積層體以人工方式施加負載，以雷射光照射部為邊界將玻璃積層體分離之操作。 作為玻璃板11，使用包含無鹼硼矽酸玻璃之玻璃板(長200 mm，寬200 mm，板厚0.1 mm，線膨脹係數38×10-7
/℃，旭硝子股份有限公司製造：商品名為「AN100」)。又，作為支持玻璃13，使用組成與玻璃板11相同之玻璃板，但大小及板厚與玻璃板11不同(長240 mm，寬240 mm，板厚0.5 mm)。 其他條件如下所述。切斷後之玻璃積層體10呈直徑為160 mm之圓形形狀。構成切斷後之玻璃積層體10的支持玻璃13之厚度為0.5 mm，玻璃板11之厚度為0.1 mm。輔助氣體AG之種類為N2
。輔助氣體AG之流量為50 l/min。雷射光LB之聚光直徑D0為0.3 mm。樹脂層12之厚度為23 μm。 關於以上之結果，於實施例1之條件下有充分之能量密度，藉由選擇適當之重疊率，而不會於雷射光照射部產生熔融玻璃等之熔合，從而可無需斷裂操作而將玻璃積層體切斷。 (實施例2～4) 實施例2～4係將實施例1中之脈衝通量及重疊率變更為表中所示之值，其他條件與實施例1相同。 (比較例1～8) 比較例1～8將實施例1中之脈衝通量及重疊率變更為表中所示之值，其他條件與實施例1相同。任一例均能量密度不足，雷射光根本未將玻璃積層體穿透，而玻璃積層體未斷開。 如上所述，可知雷射光之重疊率及脈衝通量之值之選擇對玻璃積層體能否切斷產生較大影響。 圖6表示表1、2之實施例、表3、4之比較例之脈衝通量與重疊率之關係。如該圖所示，大體上○或◎之結果集中於上部區域，×集中於下部區域。因此，可用1根直線將×所分佈之區域與◎及○所分佈之區域分離。若用公式表示該直線，則成為如下式，可知要切斷玻璃積層體，雷射光之脈衝通量F[J/mm2
]及重疊率[%]L較佳為滿足下述式5-1及式5-2。 F≧3 ···式(5-1) F＞-0.09L＋11.8 ···式(5-2) 以上，對本發明之實施形態及實施例進行了說明，但本發明並不限制於上述內容，於不脫離本發明之範圍內，可對上述實施形態及實施例施加各種變化及置換。 [產業上之可利用性] 如以上說明，本發明可容易地將先前之切斷較困難之包含玻璃板及樹脂層的玻璃積層體切斷。因此，本發明可應用於各種顯示裝置面板之製造。Next, an embodiment of the present invention will be described. Fig. 1 shows an embodiment of a cutting device of the present invention. The main configuration of the cutting device 20 includes an XY stage 21, a nozzle 22, an optical transmission system 23, and a laser oscillator 24. The nozzle 22 is a nozzle having a collecting lens in a metal case, and a tube 22a for introducing the assist gas AG into the nozzle 22 is connected to the side of the casing. Laser oscillator 24 series CO 2 Laser oscillators such as lasers, YAG (Yttrium Aluminum Garnet) lasers, excimer lasers, and copper vapor deposition lasers, preferably used in the cutting of glass laminates. 2 Laser. The glass laminate 10 is bonded to a composite body produced by forming a resin layer 12 on the main surface of the glass sheet 11, and a support glass (glass-loading) 13 is attached in a peelable state. Among them, the object to be cut of the present invention also includes a composite. When the glass laminate 10 is cut, the glass laminate 10 is placed on the XY stage 21, and the nozzle 22 is placed above it. The glass laminate 10 may have a support glass (glass-loading) 13 placed on the lower side, or the glass plate 11 may be placed on the lower side and placed on the XY stage 21. A condensing lens is disposed in the nozzle 22, and the condensing lens aligns the focal point FS of the laser beam LB with a desired depth of the glass laminate 10. Then, the glass laminate 10 can be cut by irradiating the laser light LB while moving the XY stage 21. When the laser beam LB is irradiated, the molten gas or the glass can be blown off by simultaneously blowing the assist gas AG to the cut portion, thereby preventing the cut portion from being re-attached by the molten glass or the like. Further, the type of the assist gas AG is not particularly limited, and it is preferable to use a nonflammable gas, and nitrogen gas, argon gas or the like can be used. Fig. 2 is a plan view showing a state in which a glass laminate is cut. The glass laminate 10 is conveyed together with the XY stage 21 in the direction of the arrow A. The portion (the laser light irradiation region 15) irradiated by the laser light LB irradiated from the nozzle 22 of Fig. 1 is moved along the line to cut 14 (imaginary line) on the glass laminate 10, and the glass laminate 10 is cut. . Here, the position of the laser light irradiation region 15 is displaced by transporting the glass laminate 10, and instead, the glass laminate 10 may be fixed to move the nozzle 22. Further, the line to cut 14 is not limited to a straight line, and any line such as a curve, an arc, or a broken line may be used. Further, the shape of the glass laminate 10 is not limited to a rectangular shape. 3(a) and 3(b) show an embodiment of the glass laminate of the present invention. The composite 10a has a resin layer 12 of a polyimine resin or the like having a specific structure formed on the glass plate 11. The surface 12b of the resin layer 12 is in contact with the first main surface 11a of the glass sheet 11, and the surface 12a on the opposite side is not in contact with other materials. As shown in FIG. 3(c), the composite 10a is laminated on the surface of the resin layer 12 in direct contact with the support glass 13, and is used for manufacturing an organic EL display panel or a liquid crystal display panel or the like on the glass plate 11. A member forming step of the member for the device. In the glass laminate 10, a member for an electronic device such as a TFT (Thin Film Transistor) is formed on the second main surface 11b of the glass sheet 11 in the following member forming step. Thereafter, the glass laminate 10 in which the members for electronic devices are formed is separated into the support glass 13 and the composite 10a. The peeled support glass 13 can be reused by laminating a new composite, and can be reused for other uses (used in the manufacture of large-sized liquid crystal televisions, etc.). Further, the resin layer 12 is fixed to the glass plate 11, and the composite 10a is peelably laminated on the support glass 13 so that the resin layer 12 is in direct contact with the support glass 13, and the two are in close contact with each other. In the present invention, "fixed" and peelable "adhesive" differ in peel strength (i.e., stress required for peeling), and "fixed" means that peeling strength is large with respect to "close contact". That is, the peeling strength of the interface between the resin layer 12 and the glass plate 11 is greater than the peeling strength of the interface between the resin layer 12 and the supporting glass 13. More specifically, the interface between the glass plate 11 and the resin layer 12 has a peeling strength (x), and when a stress exceeding the peeling strength (x) in the peeling direction is applied to the interface between the glass plate 11 and the resin layer 12, the glass plate 11 and The interface of the resin layer 12 is peeled off. The interface between the resin layer 12 and the support glass 13 has a peel strength (y), and if a stress exceeding the peeling strength (y) in the peeling direction is applied to the interface between the resin layer 12 and the support glass 13, the interface between the resin layer 12 and the support glass 13 Peeling occurred. In the glass laminate 10 (also referred to as a laminate having a member for an electronic device described below), the peel strength (x) is higher than the peel strength (y). Therefore, when the stress in the direction in which the support glass 13 and the glass plate 11 are peeled off is applied to the glass laminate 10, the glass laminate 10 is peeled off at the interface between the resin layer 12 and the support glass 13, and is separated into the composite 10a and supported. Glass 13. In order to increase the adhesion of the resin layer 12 to the glass plate 11, for example, a method of forming the resin layer 12 on the glass plate 11 (preferably, by heat hardening, a polyfluorene comprising a repeating unit represented by the formula (1)) The hardening resin of the imide resin is hardened on the glass plate 11 to form a specific resin layer 12). By the adhesive force at the time of hardening, the resin layer 12 bonded to the glass plate 11 with a high bonding force can be formed. On the other hand, the bonding strength of the resin layer 12 which is usually hardened to the support glass 13 is lower than the bonding force generated at the time of the above hardening. Therefore, the resin layer 12 is formed on the glass sheet 11, and thereafter, the support glass 13 is superposed on the surface of the resin layer 12, whereby the glass laminate 10 having the peel strength (x) and (y) satisfying the desired relationship can be produced. Next, each layer (support glass 13, glass plate 11, and resin layer 12) constituting the composite 10a and the glass laminate 10 will be described in detail. [Support Glass] The composition of the support glass 13 is not particularly limited, and for example, a glass of various compositions such as an alkali metal oxide-containing glass (soda lime glass) or an alkali-free glass can be used. Among them, in terms of a small heat shrinkage ratio, alkali-free glass is preferred. More specifically, the composition of the support glass 13 is preferably expressed by mass percentage based on the oxide in terms of the effect of the present invention, and is the following range as the basic composition of the glass. SiO 2 :50～73% Al 2 O 3 :10.5~24% B 2 O 3 0 to 5% MgO: 0 to 10% CaO: 0 to 14.5% SrO: 0 to 24% BaO: 0 to 13.5% MgO + CaO + SrO + BaO: 8 to 29.5% Further, in terms of the effect of the present invention being more excellent, Good for the following range. SiO 2 :53~70% Al 2 O 3 :15~22% B 2 O 3 : 0.1 to 3% MgO: 1 to 7% CaO: 3 to 10% SrO: 0 to 12% BaO: 0 to 12% MgO + CaO + SrO + BaO: 10 to 25% The thickness of the supporting glass 13 is not particularly limited, and is preferably available. The thickness of the glass laminate 10 processed by the current production line for panels for electronic devices. For example, the thickness of the glass plate used for the current liquid crystal display panel is mainly in the range of 0.4 to 1.2 mm, especially 0.7 mm or 0.5 mm. The thickness of the glass laminate 10 is preferably as long as it is the same thickness as the glass plate used in the current process, and can be easily flowed on the current production line. For example, in the case where the current production line is designed to treat a substrate having a thickness of 0.5 mm, when the thickness of the composite 10a is 0.1 mm, it is preferable that the thickness of the support glass 13 is about 0.4 mm. Further, if the current production line is designed to treat a glass plate having a thickness of 0.7 mm, if the thickness of the composite body 10a is 0.2 mm, the thickness of the support glass 13 may be about 0.5 mm. The use of the composite 10a of the present invention is not limited to an organic EL display panel or a liquid crystal display panel, and there are also solar power generation panels and the like. Therefore, the thickness of the support glass 13 is not limited, and is preferably 0.1 to 1.1 mm. Further, in order to secure the rigidity of the composite 10a, the thickness of the support glass 13 is preferably thicker than that of the composite 10a. Further, the thickness of the support glass 13 is preferably 0.3 mm or more, and the thickness thereof is more preferably 0.3 to 0.8 mm, further preferably 0.4 to 0.7 mm. The surface of the support glass 13 may be a mechanically or chemically polished surface, or may be an unetched non-etched surface (green surface). In terms of productivity and cost, a non-etched surface (green surface) is preferred. The support glass 13 has a first main surface and a second main surface, and its shape is not limited, and is preferably rectangular. The term "rectangular" means a substantially rectangular shape and may have a chamfered angle. The size of the support glass 13 is not limited, and is, for example, preferably 100 to 2,000 mm × 100 to 2,000 mm, and more preferably 500 to 1,000 mm × 500 to 1,000 mm. [Glass Plate] The first main surface 11a of the glass plate 11 is in contact with the resin layer 12, and the electronic device member is formed on the second main surface 11b on the opposite side. That is, the glass plate 11 is used to form a substrate of the following electronic device. The type of the glass plate 11 may be a normal type, and examples thereof include a glass plate for a display device such as an LCD (liquid crystal display) or an OLED (Organic Light-Emitting Diode). The glass plate 11 is excellent in chemical resistance and moisture permeability resistance, and the heat shrinkage rate of the glass plate 11 is low. As an index of the heat shrinkage rate, the coefficient of linear expansion specified in JIS R 3102 (1995 Revision) can be used. When the linear expansion coefficient of the glass plate 11 is large, since the heat treatment is often carried out in the member forming step, various defects are likely to occur. For example, in the case where a TFT is formed on the glass plate 11, if the glass plate 11 in which the TFT is formed under heating is cooled, there is a possibility that the position of the TFT is displaced due to heat shrinkage of the glass plate 11. The glass plate 11 is obtained by melting a glass raw material and shaping the molten glass into a plate shape. The molding method may be a usual method, and for example, a float method, a melting method, a flow down method, a rich method, a Luber method, or the like can be used. Further, the glass plate 11 having a particularly small thickness is formed by heating a glass which has been temporarily formed into a plate shape to a temperature at which it can be formed, and stretching it by means of stretching or the like (re-drawing method). And get. The type of the glass of the glass plate 11 is not particularly limited, and is preferably an alkali-free borosilicate glass, a borosilicate glass, a soda lime glass, a high cerium oxide glass, or another oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a cerium oxide content of 40 to 90% by mass in terms of oxide. The composition of the glass plate 11 can also be the same as that of the support glass 13. Glass for a type of member for an electronic device or a manufacturing step thereof is used in the glass plate 11. For example, since the elution of the alkali metal component easily affects the liquid crystal, the glass plate for a liquid crystal panel contains glass (alkali-free glass) which does not substantially contain an alkali metal component (the alkaline earth metal component is usually contained therein). Thus, the glass of the glass plate 11 is suitably selected based on the kind of apparatus used and the manufacturing process of it. The thickness of the glass plate 11 is preferably 0.3 mm or less, more preferably 0.15 mm or less, and still more preferably 0.10 mm or less from the viewpoint of thickness reduction and/or weight reduction of the glass plate 11. When it is 0.3 mm or less, the glass plate 11 can be imparted with good flexibility. When it is 0.15 mm or less, the glass plate 11 can be wound up in a roll shape. Among them, the thickness of the glass plate 11 is preferably 0.03 mm or more, because the glass plate 11 is easier to manufacture, the operation of the glass plate 11 is easier, and the like. Further, the glass plate 11 may be composed of two or more layers. In this case, the material forming each layer may be the same material or a different material. For example, a transparent conductive film such as ITO (Indium Tin Oxides) or the like may be formed on the surface of the glass plate 11. Moreover, in this case, "the thickness of the glass plate 11" means the total thickness of all layers. [Resin Layer] The resin layer 12 has a function of bringing the glass sheet 11 and the supporting glass 13 into close contact with each other before performing the separation operation. The surface 12a of the resin layer 12 that is in contact with the support glass 13 is peelably laminated (adhesively) to the first main surface of the support glass 13. The resin layer 12 is bonded to the first main surface of the support glass 13 by a weak bonding force, and the peel strength (y) of the interface is lower than the peel strength (x) of the interface between the resin layer 12 and the glass sheet 11. That is, when the glass plate 11 and the support glass 13 are separated, the interface between the first main surface of the support glass 13 and the resin layer 12 is peeled off, and the interface between the glass plate 11 and the resin layer 12 is hard to be peeled off. In the present invention, the property of easily peeling the support glass 13 from the resin layer 12 is referred to as "peelability". On the other hand, the first main surface of the glass sheet 11 and the resin layer 12 are bonded by a bonding force which is relatively difficult to peel off. Further, the bonding force between the resin layer 12 and the interface of the support glass 13 may be changed before and after the member for the electronic device is formed on the surface (the second main surface 12b) of the glass sheet 11 of the glass laminate 10 (that is, the peel strength) (x) or peel strength (y) may vary). However, even after forming the member for an electronic device, the peel strength (y) is still lower than the peel strength (x). It is considered that the resin layer 12 is combined with the support glass 13 with a weak adhesive force or a bonding force generated by van der Waals force. It is considered that the case where the glass layer 13 is supported on the surface layer after the formation of the resin layer 12, and the polyimine resin in the resin layer 12 is sufficiently ytterbium-imided without exhibiting force, is produced by van der Waals force. Combining forces. However, in most cases, the polyimide resin in the resin layer 12 has a somewhat weak adhesive force. It is considered that when the member for an electronic device is formed thereon after the glass laminate 10 is manufactured, the polyimine in the resin layer 12 is followed by the support glass 13 by a heating operation or the like. The bonding force between the resin layer 12 and the layer of the support glass 13 rises. Depending on the case, it is also possible to perform a process of reducing the bonding force between the surface of the resin layer 12 before the lamination or the first main surface of the support glass 13 before lamination, and then laminating. By performing non-adhesion treatment or the like on the surface of the laminate, lamination is performed thereafter, and the bonding force between the resin layer 12 and the support glass 13 can be reduced, whereby the peel strength (y) can be reduced. Further, the resin layer 12 is bonded to the surface of the glass sheet 11 by a strong bonding force such as an adhesive force or an adhesive force. For example, as described above, the resin layer 12 is formed on the glass plate 11 (preferably, a curable resin which is a polyimine resin containing a repeating unit represented by the formula (1) by thermal curing is applied to the glass plate. 11 surface hardening) whereby a layer of heat-hardened polyimide resin can be applied to the surface of the glass plate 11 to obtain a higher bonding force. Further, a treatment for causing a strong bonding force between the surface of the glass sheet 11 and the resin layer 12 (for example, a treatment using a coupling agent) can be performed to increase the bonding force between the surface of the glass sheet 11 and the resin layer 12. The thickness of the resin layer 12 is not particularly limited, but is preferably 0.1 to 100 μm, more preferably 0.5 to 50 μm, still more preferably 1 to 30 μm. When the thickness of the resin layer 12 is in such a range, even if air bubbles or foreign matter are present between the resin layer 12 and the support glass 13, the occurrence of strain defects of the glass plate 11 can be suppressed. Moreover, when the thickness of the resin layer 12 is too thick, it takes time and material to form, and it is uneconomical, and heat resistance may fall. Moreover, when the thickness of the resin layer 12 is too thin, the adhesiveness of the resin layer 12 and the support glass 13 may fall. Further, the resin layer 12 may also contain two or more layers. In this case, the "thickness of the resin layer 12" means the total thickness of all the layers. The surface roughness Ra of the side surface of the supporting glass 13 of the resin layer 12 is preferably 0 to 2.0 nm, more preferably 0 to 1.0 nm, still more preferably 0.05 to 0.5 nm. When the surface roughness Ra is within the above range, the composite 10a is excellent in adhesion to the support glass 13, and the positional deviation of the composite 10a is less likely to occur. In general, a method of forming a polyimide resin into a layer is a method of extrusion molding after manufacturing a thermoplastic polyimide resin, or hardening of a polyimide resin by thermal curing. A method in which a solution of a resin is applied to a substrate and then hardened on the surface of the substrate. The latter method is preferable because it is easy to obtain the resin layer 12 having the surface roughness Ra in the above range. Here, the surface roughness Ra is by atomic force microscopy (manufactured by Pacific Nanotefchnology, Nano Scope IIIa; Scan Rate 1.0 Hz, Sample Lines 256, Off-line Modify Flatten order-2, Planefit order -2) Measurement (method of measuring surface roughness of fine ceramic film by atomic force microscope JIS R 1683:2007). The polyimine resin of the resin layer 12 contains a repeating unit having a residue (X) of a tetracarboxylic acid and a residue (A) of a diamine represented by the following formula (1). Further, the polyimine resin contains a repeating unit represented by the formula (1) as a main component (preferably 95 mol% or more with respect to the total repeating unit), but may include other repeating units other than the repeating unit (for example, , a repeating unit represented by the following formula (2-1) or (2-2). Further, the residue (X) of the tetracarboxylic acid refers to a tetracarboxylic acid residue after removing a carboxyl group from a tetracarboxylic acid, and the residue (A) of a diamine refers to removal of an amine group from a diamine. The latter diamine residue. [Chemical 1] In the formula (1), X represents a tetracarboxylic acid residue obtained by removing a carboxyl group from a tetracarboxylic acid, and 50 mol% or more of the total number of X includes a group selected from the group consisting of the following formulas (X1) to (X4). At least one base in the group. In particular, in terms of the releasability of the composite 10a and the support glass 13 or the heat resistance of the resin layer 12, it is preferable that 80 to 100 mol% of the total number of X is selected from the following formula (X1) to (X4), at least one of the groups consisting of the groups represented by the group, and more preferably the substantially total number (100 mol%) of the total number of Xs is selected from the group consisting of the formulas (X1) to (X4) below At least one of the group consisting of. In addition, when the total number of Xs is less than 50% by mol including at least one group selected from the group consisting of the groups represented by the following formulas (X1) to (X4), the composite 10a and the supporting glass At least one of the peelability of 13 and the heat resistance of the resin layer 12 is inferior. Further, "A" represents a diamine residue obtained by removing an amine group from a diamine, and 50 mol% or more of the total number of "A" is selected from the group consisting of the groups represented by (A1) to (A7). At least one base. In particular, in terms of the releasability of the composite 10a and the support glass 13, or the heat resistance of the resin layer 12, it is preferable that 80 to 100 mol% of the total number of "A" is selected from the following formula ( At least one of the groups consisting of the groups represented by A1) to (A7), and more preferably the substantially total number (100% by mole) of the total number of "A" is selected from the following formulas (A1) to (A7) At least one of the groups consisting of the indicated groups. In addition, when less than 50 mol% of the total number of A includes at least one group selected from the group consisting of the groups represented by the following formulas (A1) to (A7), the composite body 10a and the supporting glass At least one of the peelability of 13 and the heat resistance of the resin layer 12 is inferior. In terms of the releasability of the composite 10a and the support glass 13, or the heat resistance of the resin layer 12, it is preferable that 80 to 100 mol% of the total number of Xs is selected from the following formula (X1) to (X1) X4) at least one of the groups consisting of the groups represented by the group, and 80 to 100 mol% of the total number of "A"s are selected from the group consisting of the groups represented by the following formulas (A1) to (A7) At least one of the groups, more preferably the total number (100 mol%) of the total number of X, includes at least one group selected from the group consisting of the groups represented by the following formulas (X1) to (X4), and The substantial total number (100 mol%) of the total number of A includes at least one group selected from the group consisting of the groups represented by the following formulas (A1) to (A7). [Chemical 2] In particular, the "X" is preferably a group represented by the formula (X1) and a formula (X2) in terms of the releasability of the composite 10a and the support glass 13, or the heat resistance of the resin layer 12. The basis of the representation is more preferably the base represented by the formula (X1). Moreover, it is preferable that "A" is selected from the bases represented by the formulas (A1) to (A4) in terms of the releasability of the composite 10a and the support glass 13, or the heat resistance of the resin layer 12. The group in the group of the composition is more preferably a group selected from the group consisting of the groups represented by the formulae (A1) to (A3). The polyimine resin containing a preferred combination of the group represented by the formulae (X1) to (X4) and the group represented by the formulae (A1) to (A7) is exemplified by the formula (X1). a polyimine resin represented by a group consisting of a group represented by the formula (X2) and a group "A" selected from the group consisting of groups represented by the formulae (A1) to (A5) In particular, the polyimine resin 1 in which X is a group represented by the formula (X1) and the "A" is a group represented by the formula (A1), and "X" are represented by the formula (X2). The base of the group represented by the formula (A5) is a polyimine resin 2 represented by the formula (A5). In the case of the polyimide resin 1 and the polyimide resin 2, it is preferable in terms of long-term heat resistance in an environment of 450 ° C, and in the environment of 500 ° C in the case of a polyimide resin 1 It is better in terms of long-term heat resistance. Further, in the case where X is a group represented by the formula (X4) and A is a combination of groups represented by the formula (A6) and the formula (A7), it is preferable in terms of transparency. The number of repetitions (n) of the repeating unit represented by the above formula (1) in the polyimine resin is not particularly limited, and is preferably an integer of 2 or more, and heat resistance of the resin layer 12 and film formability of the coating film. In terms of it, it is more preferably from 10 to 10,000, still more preferably from 15 to 1,000. The molecular weight of the polyimide resin is preferably from 500 to 100,000 in terms of coatability and heat resistance. The total number of residues (X) of the tetracarboxylic acid of the above polyimine resin may be less than 50 mol%, which may be selected from the group consisting of the groups exemplified below, insofar as the heat resistance is not impaired. More than one type. Further, two or more kinds of the groups exemplified below may be included. [Chemical 3] Further, the total number of the residues (A) of the diamines of the polyimine resin may be less than 50 mol%, which may be selected from the groups exemplified below, insofar as the heat resistance is not impaired. One or more of the group. Further, two or more kinds of the groups exemplified below may be included. [Chemical 4] Further, the polyimine resin may have an alkoxyalkyl group at the molecular terminal. As a method of introducing an alkoxyfluorenyl group to the terminal of a molecule, there is a method of reacting a carboxyl group or an amine group of the following polyaminic acid with an epoxy group-containing alkoxysilane or a partial polycondensate thereof. The epoxy group-containing alkoxysilane can be obtained, for example, by reacting an epoxy compound having a hydroxyl group in a molecule with an alkoxysilane or a partial polycondensate thereof. The epoxy compound having a hydroxyl group is preferably 15 or less carbon atoms, and examples thereof include glycidol and the like. Examples of the alkoxydecane include a tetraalkoxydecane having a carbon number of 4 or less, or a trialkoxydecane having an alkoxy group having 4 or less carbon atoms and an alkyl group having 8 or less carbon atoms. Specific examples thereof include tetraalkoxynonanes such as tetramethoxynonane, tetraethoxysilane, and tetrapropoxydecane, and trialkoxysilanes such as methyltrimethoxydecane. The reaction of the epoxy compound having a hydroxyl group in the molecule with the alkoxyalkyl group is preferably carried out in the range of the hydroxyl equivalent of the epoxy compound / alkoxyalkylene equivalent = 0.001/1 to 0.5/1. Further, the alkoxy fluorenyl group at the molecular end of the polyimine resin may be a cerium oxide structure obtained by a sol-gel reaction or a dealcoholization condensation reaction by heat treatment or hydrolysis. In the above reaction, an alkoxydecane may also be added. As the alkoxydecane, the above compounds can be used. The heat resistance is improved by making the molecular end into a ceria structure. Further, the linear expansion coefficient of the polyimide resin can be lowered, and even when the thickness of the support substrate is thin, the warpage of the support substrate with the resin layer can be reduced. The content of the polyimine resin in the resin layer 12 is not particularly limited, and is superior to the total quality of the resin layer in terms of the releasability of the composite 10a and the support glass 13 or the heat resistance of the resin layer 12. It is preferably 50 to 100% by mass, more preferably 75 to 100% by mass, still more preferably 90 to 100% by mass. The resin layer 12 may optionally contain other components than the above-mentioned polyimide resin (for example, a filler which does not inhibit heat resistance). Examples of the filler that does not inhibit heat resistance include non-fibrous fillers such as fibers, plates, scales, granules, irregular shapes, and crushed products. Specific examples thereof include PAN (polyacrylonitrile). Metal fibers such as carbon fiber, glass fiber, stainless steel fiber, aluminum fiber or brass fiber, gypsum fiber, ceramic fiber, asbestos fiber, zirconia fiber, alumina fiber, cerium oxide fiber, titanium oxide fiber, carbonization Tantalum fiber, rock wool, potassium titanate whisker, barium titanate whisker, aluminum borate whisker, tantalum nitride whisker, mica, talc, zircon, cerium oxide, calcium carbonate, glass beads, glass flakes, glass Microspheres, clay, molybdenum disulfide, ash, titanium oxide, zinc oxide, calcium polyphosphate, graphite, metal powder, metal flakes, metal strips, metal oxides, carbon powder, graphite, carbon flakes, Scale-like carbon, carbon nanotubes, etc. Specific examples of the metal type of the metal powder, the metal foil, and the metal strip include silver, nickel, copper, zinc, aluminum, stainless steel, iron, brass, chromium, tin, and the like. The resin layer 12 is a layer of a polyimide resin formed by the following method, that is, a resin having a tetracarboxylic acid represented by the above formula (1) by heat hardening formed on the glass plate 11 ( X) and a layer of a curable resin of a polyimine resin of a repeating unit of a residue of the diamine (A) or a layer obtained by coating a composition comprising the above polyimine resin and a solvent, in order The first heat treatment is performed at 60 ° C or higher and not at 250 ° C, and the second heat treatment is performed at 250 ° C or higher and 500 ° C or lower. The method for producing the resin layer 12 will be described in detail in the method for producing a glass laminate in the latter part. [Manufacturing Method of Glass Laminate] As a first aspect of the method for producing the glass laminate 10 of the present invention, the resin layer 12 is formed on the glass plate 11 by using the following curable resin, and then the layer is supported on the resin layer 12. The glass 13 is used to manufacture the glass laminate 10. It is considered that when the surface of the glass plate 11 is hardened by the curable resin, the resin layer 12 is bonded to the surface of the glass plate 11 by the interaction with the surface of the glass plate 11 during the hardening reaction, so that the surface of the resin layer 12 and the glass plate 11 The peel strength becomes high. Therefore, even if the glass plate 11 and the support glass 13 are made of the same material, the peeling strength of the resin layer 12 and the both may differ. (Resin Layer Forming Step) The resin layer 12 is a layer of a polyimide resin formed by a method of forming a tetracarboxylic acid represented by the above formula (1) by heat hardening formed on a glass plate. The layer of the curable resin of the polyimine resin of the repeating unit of the acid residue (X) and the residue of the diamine (A) is sequentially subjected to heating at 60 ° C or higher and less than 250 ° C. The heat treatment and the second heat treatment for heating at 250 ° C or higher and 500 ° C or lower. Further, 50 mol% or more of the total number of residues (X) of the tetracarboxylic acid includes at least one group selected from the group consisting of the groups represented by the above formulas (X1) to (X4), and the diamines 50 mol% or more of the total number of the residues (A) includes at least one group selected from the group consisting of the groups represented by the above formulas (A1) to (A7). The resin layer forming step is a step of obtaining a resin layer by the step of thermally curing the residue (X) having a tetracarboxylic acid represented by the above formula (1) and a diamine. The layer of the curable resin of the polyimine resin of the repeating unit of (A) is sequentially subjected to a first heat treatment at 60 ° C or higher and less than 250 ° C, and heating at 250 ° C or higher and 500 ° C or lower. The second heat treatment. As shown in FIG. 3(a), in this step, the resin layer 12 is formed on at least one surface of the glass sheet 11. Hereinafter, the resin layer forming step will be described in the following three steps. Step (1): Step (2) of obtaining a coating film by applying a curable resin of the polyimine resin represented by the above formula (1) to a glass plate 11 by thermosetting: at 60 ° C Step (3) of heating the coating film at a temperature of 250 ° C or higher and 500 ° C or lower to form a resin layer (coating film forming step). In this step, A curable resin which is a polyimine resin having a repeating unit represented by the above formula (1) by thermal curing is applied onto the glass plate 11 to obtain a coating film. Further, the curable resin preferably contains a polyamic acid obtained by reacting a tetracarboxylic dianhydride with a diamine, and preferably at least one of the tetracarboxylic dianhydrides is selected from the group consisting of the following formula (Y1) At least one of the tetracarboxylic dianhydrides in the group consisting of the compounds represented by the above-mentioned (Y4), and at least one of the diamines includes a group selected from the compounds represented by the following formulas (B1) to (B7) At least one diamine in the middle. [Chemical 5] [Chemical 6] Further, polyamic acid is usually represented by a structural formula containing a repeating unit represented by the following formula (2-1) and/or formula (2-2). Further, in the formulas (2-1) and (2-2), the definitions of X and A are as described above. [Chemistry 7] The reaction conditions of the tetracarboxylic dianhydride and the diamine are not particularly limited, and in terms of efficiently synthesizing the polyamic acid, it is preferably at -30 to 70 ° C (preferably -20 °). The reaction was carried out at 40 ° C). The mixing ratio of the tetracarboxylic dianhydride to the diamine is not particularly limited, and is preferably from 0.66 to 1.5 mol, more preferably from 0.9 to 1.1 mol, even more preferably 1 mol with respect to the diamine. The reaction is carried out for 0.97 to 1.03 mol of tetracarboxylic dianhydride. When reacting a tetracarboxylic dianhydride with a diamine, an organic solvent may also be used as needed. The type of the organic solvent to be used is not particularly limited, and for example, N-methyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-diethylacetamide, N, can be used. N-dimethylformamide, N,N-diethylformamide, N-methylcaprolactam, hexamethylphosphoniumamine, tetramethylene hydrazine, dimethyl hydrazine, m. Phenol, phenol, p-chlorophenol, 2-chloro-4-hydroxytoluene, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, two Alkane, γ-butyrolactone, dioxolane, cyclohexanone, cyclopentanone or the like may be used in combination of two or more kinds. In the above reaction, other tetracarboxylic dianhydrides other than the tetracarboxylic dianhydride selected from the group consisting of the compounds represented by the above formulas (Y1) to (Y4) may be used in combination. Further, in the above reaction, other diamines other than the diamines selected from the group consisting of the compounds represented by the above formulas (B1) to (B7) may be used in combination. Further, in addition to the polyamic acid obtained by reacting tetracarboxylic dianhydride with a diamine, a curable resin used in the present step may be added with a tetracarboxylic acid which is reactive with polylysine. Acid dianhydride or diamine. When tetracarboxylic dianhydride or diamine is added in addition to poly-proline, two or more polyamines having a repeating unit represented by formula (2-1) or formula (2-2) can be used. The acid molecules are bonded via a tetracarboxylic dianhydride or a diamine. When the terminal of the polyglycolic acid has an amine group, a tetracarboxylic dianhydride may be added, and the carboxyl group may be added in an amount of 0.9 to 1.1 moles per 1 mole of polyamic acid. When the terminal of the polyglycolic acid has a carboxyl group, a diamine may be added, and the amine group may be added in an amount of 0.9 to 1.1 moles per 1 mole of polyaminic acid. Further, in the case where the terminal of the polyglycolic acid has a carboxyl group, it is also possible to use a water or an arbitrary alcohol to open the acid anhydride group at the terminal. The tetracarboxylic dianhydride to be added thereafter is more preferably a compound represented by the formula (Y1) to (Y4). The diamine to be added thereafter is preferably a diamine having an aromatic ring, more preferably a compound represented by the formulae (B1) to (B7). When a tetracarboxylic dianhydride or a diamine is added thereafter, the degree of polymerization (n) of the polyamic acid having a repeating unit represented by the formula (2-1) or the formula (2-2) is preferably It is 1 to 20. When the degree of polymerization (n) is in this range, the viscosity of the curable resin solution can be made low even if the polyamine concentration in the curable resin solution is 30% by mass or more. In this step, components other than the curable resin may also be used. For example, a solvent can also be used. More specifically, the curable resin can be dissolved in a solvent to be used as a solution (curable resin solution) of a curable resin. As the solvent, in particular, in terms of solubility of polylysine, an organic solvent is preferred. The organic solvent to be used may, for example, be an organic solvent used in the above reaction. Further, as one of the preferable aspects of the above solvent, a solvent having a boiling point (at 1 atm) of less than 250 ° C is preferably used. In the case of the solvent, the solvent is easily volatilized in the first heat treatment step, and as a result, the appearance of the film is further improved. In addition, the lower limit of the above boiling point is not particularly limited, and is preferably 60 ° C or more in terms of workability. In the case where the organic solvent is contained in the curable resin solution, the content of the organic solvent is not particularly limited as long as the thickness of the coating film can be favorably adjusted and the coating property is good, and generally speaking, relative to The total mass of the curable resin solution is preferably from 10 to 99% by mass, more preferably from 20 to 90% by mass. Further, a dehydrating agent or a dehydration ring-closing catalyst for promoting the dehydration ring closure of polyamic acid may be used in combination as needed. For example, as the dehydrating agent, for example, an acid anhydride such as acetic anhydride, propionic anhydride or trifluoroacetic anhydride can be used. Further, as the dehydration ring-closing catalyst, for example, a tertiary amine such as pyridine, trimethylpyridine, lutidine or triethylamine can be used. A method of applying a curable resin (or a curable resin solution) to the surface of the glass plate 11 is not particularly limited, and a known method can be used. For example, a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method, a gravure coating method, and the like can be given. The thickness of the coating film obtained by the above treatment is not particularly limited, and is appropriately adjusted so as to obtain the resin layer 12 having the desired thickness. (Step (2): First heat treatment step) Step (2) is a step of heating the coating film at 60 ° C or higher and less than 250 ° C. By carrying out this step, it is possible to prevent the solvent from being bumped and to remove the solvent, and it is difficult to form a film defect of foaming or orange peel. The method of the heat treatment is not particularly limited, and a known method (for example, a method in which a glass plate to which a coating film is applied is placed in a heating oven for heating) can be suitably used. The heating temperature is 60 ° C or more and less than 250 ° C, and is preferably 600 to 150 ° C, more preferably 60 to 120 ° C in terms of further suppressing foaming of the resin layer. It is especially preferred to heat at a temperature below the boiling point of the solvent within the range of the heating temperature. The heating time is not particularly limited, and depending on the structure of the curable resin to be used, the optimum time is selected, and further, in terms of depolymerization of polyglycine, it is preferably 5 to 60 minutes, more preferably 10 to 30 minutes. The heating environment is not particularly limited, and is, for example, carried out under conditions in the atmosphere, under vacuum or under an inert gas. When it is carried out under vacuum, even if it is heated at a relatively low temperature, the volatile component can be removed in a shorter period of time, and the depolymerization of polyglycine can be further controlled, which is preferable. Further, the first heat treatment step may be carried out stepwise (two or more stages) by changing the heating temperature and the heating time. (Step (3): Second Heat Treatment Step) Step (3) is a step of forming a resin layer by heating the coating film subjected to the heat treatment in the step (2) at 250 ° C or higher and 500 ° C or lower. By carrying out this step, a ring closure reaction of the polyamic acid contained in the curable resin is carried out to form a desired resin layer. The method of the heat treatment is not particularly limited, and a known method (for example, a method in which a glass plate to which a coating film is applied is placed in a heating oven for heating) can be suitably used. When the heating temperature is 250° C. or higher and 500° C. or lower, the residual solvent ratio is lowered and the niobium imidization ratio is further increased, and the releasability of the composite 10a and the support glass 13 or the heat resistance of the resin layer 12 is superior. Good for 350 ~ 500 ° C. The heating time is not particularly limited, and the optimum time is appropriately selected depending on the structure of the curable resin to be used, etc., and the residual solvent ratio is lowered and the oxime imidization ratio is further increased, and the releasability or resin of the composite 10a and the support glass 13 is obtained. The layer 12 is preferably from 15 to 120 minutes, more preferably from 30 to 60 minutes, in terms of more excellent heat resistance. The heating environment is not particularly limited, and is, for example, carried out under conditions in the atmosphere, under vacuum or under an inert gas. A resin layer containing a polyimide resin is formed by the above step (3). The ruthenium imidation ratio of the polyimide resin is not particularly limited, and is preferably 99.0% or more, more preferably in terms of the releasability of the composite 10a and the support glass 13 or the heat resistance of the resin layer 12. It is 99.5% or more. The method for measuring the yield of hydrazine is set to 100% hydrazine imidization ratio in the case where the curable resin is heated at 350 ° C for 2 hours in a nitrogen atmosphere, and IR (infrared) according to the curable resin. The peak derived from the ruthenium carbonyl group in the spectrum: about 1,780 cm -1 The peak intensity is relative to the peak intensity that is constant before and after the second heat treatment (for example, a peak derived from a benzene ring: about 1,500 cm) -1 The intensity ratio of the yttrium is determined. (Laminating step) The laminating step is to laminate the supporting glass 13 on the surface of the resin layer 12 obtained in the resin layer forming step, and obtain the glass laminate 10 having the supporting glass 13, the resin layer 12, and the glass plate 11 in this order. The steps. The method of laminating the support glass 13 on the resin layer 12 is not particularly limited, and a known method can be employed. For example, a method of superposing the support glass 13 on the surface of the resin layer 12 under a normal pressure environment can be cited. Further, as needed, after the support glass 13 is superposed on the surface of the resin layer 12, the support glass 13 is pressure-bonded to the resin layer 12 by using a roll or a press machine. It is preferable that the air bubbles mixed between the resin layer 12 and the layer of the support glass 13 can be removed relatively easily by pressure bonding using a roll or a press machine. When the pressure bonding is performed by a vacuum lamination method or a vacuum press method, it is more preferable to suppress the incorporation of air bubbles or to ensure good adhesion. By crimping under vacuum, even in the case where minute bubbles remain, bubbles do not grow due to heating, and the advantages of strain defects of the supporting glass 13 are not easily caused. Moreover, by crimping under vacuum heating, bubbles are less likely to remain. When the glass 13 is laminated, it is preferable to sufficiently wash the surface of the contact resin layer 12 of the support glass 13 and laminate it in an environment with high cleanliness. The higher the degree of cleanliness, the better the flatness of the support glass 13 is. Further, after the laminated support glass 13 is used, a pre-annealing treatment (heat treatment) may be performed as needed. By performing the pre-annealing treatment, the adhesion of the laminated support glass 13 to the resin layer 12 is improved, and the peel strength (y) can be appropriately set. When the member forming step described below, the position of the member for the electronic device is less likely to occur. Offset, etc., so that the productivity of the electronic device is improved. The conditions of the pre-annealing treatment are appropriately selected depending on the type of the resin layer 12 to be used, but it is preferable that the peel strength (y) between the support glass 13 and the resin layer 12 is more appropriate. The heat treatment is carried out at 200 ° C or higher (preferably 200 to 400 ° C) for 5 minutes or longer (preferably 5 to 30 minutes). (Glass laminate) The glass laminate 10 of the present invention can be used for various applications, and examples thereof include the manufacture of a panel for a display device, a solar cell, a thin film battery, a semiconductor wafer having a circuit formed thereon, and an electronic component such as a liquid crystal lens. . Further, in this application, the glass laminate 10 is often exposed to high temperature conditions (for example, 400 ° C or higher) (for example, 1 hour or longer). Here, the panel for a display device includes an LCD, an OLED, an electronic paper, a plasma display panel, a field emission panel, a quantum dot LED panel, a MEMS (Micro Electro Mechanical Systems) shutter panel, and the like. Further, in the above, the aspect in which the support substrate with the resin layer is produced using the curable resin is described in detail, but it may be obtained by applying a composition comprising the above polyimine resin and a solvent. Layers to make composites. More specifically, a layer (coating film) obtained by coating a composition containing the above polyimine resin and a solvent may be formed on a glass plate, and sequentially performed at 60 ° C or higher and less than 250 ° C. The first heat treatment is performed, and the second heat treatment is performed at 250 ° C or higher and 500 ° C or lower to produce a composite. The type of the polyimide resin used is as described above. Further, the type of the solvent to be used is not particularly limited, and examples thereof include a solvent contained in the curable resin solution. (Method of Cutting Glass Laminate) A configuration example of the method of cutting the glass laminate described above will be described. Here, the support glass 13 is used as the first glass plate, and the glass plate 11 is used as the second glass plate. In other words, the laminate in which the first glass sheet and the second glass sheet which is thinner than the first glass sheet are laminated with a resin layer can be used as the glass laminate described above. Further, the method for cutting the glass laminate according to the present embodiment has a step of irradiating the glass laminate with laser light as described with reference to Fig. 1 . Moreover, the pulse flux of the laser light is F [J/mm 2 And the overlap ratio [%] L preferably satisfies the following formula (A) and formula (B). F≧3 ··· (A) F>-0.09L+11.8 · (B) Here, L=(D0-v/f)/D0*100, D0 represents the convergence of the above-mentioned laser light pulse The light diameter (mm), v represents the cutting speed (mm/s), and f represents the oscillation frequency (Hz) of the above-described laser light. According to the cutting method of the glass laminate, the cutting residue of the resin layer can be reduced as compared with the prior art. [Examples] Fig. 4 is a flow chart showing an example of a series of steps from the production of a polyproline solution to the cutting of a laminate. <Manufacture of Polyproline Solution> P-phenylenediamine (10.8 g, 0.1 mol) was dissolved in N,N-dimethylacetamide (198.6 g), and stirred at room temperature. BPDA (Biphenyl tetracarboxylic Dianhydride) (29.4 g, 0.1 mmol) was added thereto over 1 minute, and stirred at room temperature for 2 hours to obtain a formula (2-1) and/or having the above formula (2-1) and/or The polyamic acid solution (P1) having a solid content concentration of the polyamine of the repeating unit represented by the formula (2-2) of 20% by mass (step S1). The viscosity of the solution was measured and found to be 5,000 cps at 20 °C. Further, the viscosity was measured using a DVL-BII type digital viscometer (B type viscometer) manufactured by Tokimec Co., Ltd., and the rotational viscosity at 20 ° C was measured. The group represented by the X system (X1) in the repeating unit represented by the formula (2-1) and/or the formula (2-2) contained in the polyamic acid, and the group represented by the formula (A1) in the formula A (A1) . <Manufacturing of Glass Laminate> First, the glass plate having a thickness of 0.1 mm is washed with pure water, and then further subjected to UV cleaning to purify the glass plate (step S2). Next, the polyaminic acid solution (P1) was applied onto the first main surface of the glass plate by a spin coater (rotation number: 2,000 rpm, 15 seconds) (step S3), and the coating containing polylysine was applied. The film is placed on a glass plate (coating amount 2 g/m) 2 ). Further, the polyamic acid is a resin obtained by reacting a compound represented by the formula (Y1) with a compound represented by the formula (B1). Next, the coating film was heated in the air at 60 ° C for 15 minutes, and then the coating film was heated at 120 ° C for 15 minutes, and then the coating film was heated at 350 ° C for 15 minutes to form a resin layer (step S4). ). The formed resin layer contains a polyimine resin having a repeating unit represented by the following formula (3) (X in the formula (1) contains a group represented by (X1), and A contains a formula represented by the formula (A1) Base). [化8] Further, the oxime imidization ratio was 99.7%. Further, the surface roughness Ra of the surface of the formed resin layer was 0.2 nm. The method for measuring the imidization ratio and the method for measuring the surface roughness Ra are carried out by the above method. Thereafter, the support glass 13 and the resin layer 12 of the composite 10a are bonded together at room temperature by a vacuum press to obtain a glass laminate 10 (step S5). In the obtained glass laminate 10, the support glass 13 and the glass plate 11 and the resin layer 12 are in close contact with each other without generating bubbles, and there is no strain-like defect, and the smoothness is also good. Further, in the glass laminate 10, the interfacial peel strength (x) between the glass sheet 11 and the resin layer 12 is higher than the interfacial peel strength (y) of the resin layer 12 and the support glass 13. Then, the glass laminate 10 was heat-treated at 450 ° C for 60 minutes in the atmosphere, and cooled to room temperature (step S6). As a result, the separation of the composite 10a and the support glass 13 in the glass laminate 10 was not observed. Or a change in appearance such as foaming or whitening of the resin layer 12. Thereafter, use CO 2 The laser cuts the heated glass laminate (step S7). (Example 1) Here, examples and comparative examples obtained by changing the cutting conditions will be described. From the side of the support glass 13, the laser light LB is incident perpendicularly from the upper side with respect to the glass laminate 10. At this time, the pulse flux is set to 14.1 J/mm. 2 The overlap rate is set to 25%. Here, the pulse flux is obtained by dividing the pulse average energy of the laser light LB by the pulse area. The overlap ratio L is represented by the following formula 4, and is schematically shown in Fig. 5. D0 represents the light collecting diameter (mm) of the pulse of the laser light LB, v represents the cutting speed (mm/s), and f represents the oscillation frequency (Hz) of the laser light LB. After the pulse spot SP1 is formed, the next spot SP2 is formed at a position of the moving distance from SP1 to v/f [mm]. L = (D0 - v / f) / D0 * 100 (4) Tables 1 and 2 show examples, and Tables 3 and 4 show comparative examples. [Table 1] [Table 2] [table 3] [Table 4] The symbols in the respective tables mean the following meanings. ◎: The rupture operation is easy and the end surface roughness is small. ○: The rupture operation is required, but the cleavage is performed. ×: The person who cannot be cut (Note) The term "fracture operation" as used herein refers to the glass laminate after the laser irradiation. The load is applied manually, and the operation of separating the glass laminate with the laser light irradiation portion as a boundary. As the glass plate 11, a glass plate containing an alkali-free borosilicate glass (length 200 mm, width 200 mm, plate thickness 0.1 mm, linear expansion coefficient 38×10) was used. -7 /°C, manufactured by Asahi Glass Co., Ltd.: trade name "AN100"). Further, as the supporting glass 13, a glass plate having the same composition as that of the glass plate 11 was used, but the size and thickness were different from those of the glass plate 11 (length 240 mm, width 240 mm, plate thickness 0.5 mm). Other conditions are as follows. The cut glass laminate 10 has a circular shape with a diameter of 160 mm. The thickness of the support glass 13 constituting the cut glass laminate 10 was 0.5 mm, and the thickness of the glass plate 11 was 0.1 mm. The type of auxiliary gas AG is N 2 . The flow rate of the auxiliary gas AG is 50 l/min. The condensing diameter D0 of the laser light LB is 0.3 mm. The thickness of the resin layer 12 was 23 μm. With regard to the above results, under the conditions of Example 1, there is sufficient energy density, and by selecting an appropriate overlap ratio, fusion of molten glass or the like is not generated in the laser light irradiation portion, so that the glass can be laminated without a fracture operation. Body cut. (Examples 2 to 4) In Examples 2 to 4, the pulse flux and the overlap ratio in Example 1 were changed to the values shown in the table, and other conditions were the same as in Example 1. (Comparative Examples 1 to 8) In Comparative Examples 1 to 8, the pulse flux and the overlapping ratio in the first embodiment were changed to the values shown in the table, and other conditions were the same as in the first embodiment. In either case, the energy density is insufficient, and the laser light does not penetrate the glass laminate at all, and the glass laminate is not broken. As described above, it is understood that the selection of the overlap ratio of the laser light and the value of the pulse flux greatly affects whether or not the glass laminate can be cut. Fig. 6 shows the relationship between the pulse flux and the overlap ratio of the comparative examples of Tables 1 and 2 and Tables 3 and 4. As shown in the figure, the result of ○ or ◎ is mainly concentrated in the upper region, and × is concentrated in the lower region. Therefore, the area where x is distributed can be separated from the area where ◎ and ○ are distributed by one straight line. When the straight line is expressed by a formula, the following equation is obtained, and it is known that the glass laminated body is to be cut, and the pulse flux of the laser light is F [J/mm 2 ] and the overlap ratio [%] L preferably satisfy the following formula 5-1 and formula 5-2. F≧3 ··· (5-1) F>-0.09L+11.8 (5-2) The embodiments and examples of the present invention have been described above, but the present invention is not limited to the above. Various changes and substitutions may be made to the above-described embodiments and examples without departing from the scope of the invention. [Industrial Applicability] As described above, the present invention can easily cut a glass laminate including a glass plate and a resin layer which has been difficult to cut by the prior art. Therefore, the present invention is applicable to the manufacture of various display device panels.