TW201712800A - Sub-fin sidewall passivation in replacement channel FinFETs - Google Patents
Sub-fin sidewall passivation in replacement channel FinFETsInfo
- Publication number
- TW201712800A TW201712800A TW105115182A TW105115182A TW201712800A TW 201712800 A TW201712800 A TW 201712800A TW 105115182 A TW105115182 A TW 105115182A TW 105115182 A TW105115182 A TW 105115182A TW 201712800 A TW201712800 A TW 201712800A
- Authority
- TW
- Taiwan
- Prior art keywords
- sub
- fin
- fins
- sti
- replacement
- Prior art date
Links
- 238000002161 passivation Methods 0.000 title abstract 4
- 239000000463 material Substances 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000002955 isolation Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02183—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing tantalum, e.g. Ta2O5
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02186—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing titanium, e.g. TiO2
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02189—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing zirconium, e.g. ZrO2
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02192—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing at least one rare earth metal element, e.g. oxides of lanthanides, scandium or yttrium
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02194—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing more than one metal element
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Thin Film Transistor (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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PCT/US2015/037326 WO2016209219A1 (en) | 2015-06-24 | 2015-06-24 | Sub-fin sidewall passivation in replacement channel finfets |
WOPCT/US15/37326 | 2015-06-24 |
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TW201712800A true TW201712800A (en) | 2017-04-01 |
TWI727950B TWI727950B (zh) | 2021-05-21 |
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TW105115182A TWI727950B (zh) | 2015-06-24 | 2016-05-17 | 替代通道鰭式場效電晶體中之子鰭側壁鈍化 |
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EP (1) | EP3314661A4 (zh) |
KR (2) | KR102671542B1 (zh) |
CN (1) | CN107660311B (zh) |
TW (1) | TWI727950B (zh) |
WO (1) | WO2016209219A1 (zh) |
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WO2016209219A1 (en) | 2015-06-24 | 2016-12-29 | Intel Corporation | Sub-fin sidewall passivation in replacement channel finfets |
EP3353810A4 (en) | 2015-09-25 | 2019-05-01 | Intel Corporation | PASSIVATION OF TRANSISTOR CHANNEL RANGE INTERFACES |
US10083962B2 (en) * | 2016-09-02 | 2018-09-25 | International Business Machines Corporation | Fabrication of fin field effect transistors for complementary metal oxide semiconductor devices including separate n-type and p-type source/drains using a single spacer deposition |
US10541129B2 (en) | 2017-08-07 | 2020-01-21 | International Business Machines Corporation | Indium gallium arsenide surface passivation by sulfur vapor treatment |
US11164974B2 (en) * | 2017-09-29 | 2021-11-02 | Intel Corporation | Channel layer formed in an art trench |
US10847622B2 (en) * | 2017-11-13 | 2020-11-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming source/drain structure with first and second epitaxial layers |
US11145751B2 (en) * | 2018-03-29 | 2021-10-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure with doped contact plug and method for forming the same |
CN108336105B (zh) * | 2018-04-04 | 2019-02-15 | 武汉新芯集成电路制造有限公司 | 一种图像传感器及其器件邻近结构 |
US11175358B2 (en) * | 2018-06-22 | 2021-11-16 | Magarray, Inc. | Magnetic sensors with a mixed oxide passivation layer |
US11031395B2 (en) | 2018-07-13 | 2021-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming high performance MOSFETs having varying channel structures |
US10672643B2 (en) | 2018-08-22 | 2020-06-02 | International Business Machines Corporation | Reducing off-state leakage current in Si/SiGe dual channel CMOS |
US11532719B2 (en) * | 2018-12-17 | 2022-12-20 | Intel Corporation | Transistors on heterogeneous bonding layers |
KR20210048293A (ko) * | 2019-10-23 | 2021-05-03 | 삼성전자주식회사 | 집적회로 소자 및 그 제조 방법 |
US10867101B1 (en) * | 2020-02-24 | 2020-12-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Leakage reduction between two transistor devices on a same continuous fin |
US11594637B2 (en) * | 2020-03-27 | 2023-02-28 | Intel Corporation | Gate-all-around integrated circuit structures having fin stack isolation |
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WO2010032174A1 (en) * | 2008-09-16 | 2010-03-25 | Nxp B.V. | Fin field effect transistor (finfet) |
US7893492B2 (en) * | 2009-02-17 | 2011-02-22 | International Business Machines Corporation | Nanowire mesh device and method of fabricating same |
US9768305B2 (en) * | 2009-05-29 | 2017-09-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gradient ternary or quaternary multiple-gate transistor |
US8264032B2 (en) * | 2009-09-01 | 2012-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Accumulation type FinFET, circuits and fabrication method thereof |
US9287179B2 (en) * | 2012-01-19 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Composite dummy gate with conformal polysilicon layer for FinFET device |
US9171925B2 (en) | 2012-01-24 | 2015-10-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-gate devices with replaced-channels and methods for forming the same |
US9728464B2 (en) * | 2012-07-27 | 2017-08-08 | Intel Corporation | Self-aligned 3-D epitaxial structures for MOS device fabrication |
US8765563B2 (en) * | 2012-09-28 | 2014-07-01 | Intel Corporation | Trench confined epitaxially grown device layer(s) |
US8815685B2 (en) * | 2013-01-31 | 2014-08-26 | GlobalFoundries, Inc. | Methods for fabricating integrated circuits having confined epitaxial growth regions |
EP2775528B1 (en) | 2013-03-05 | 2019-07-17 | IMEC vzw | Passivated III-V or Ge fin-shaped field effect transistor |
US9299840B2 (en) | 2013-03-08 | 2016-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFETs and methods for forming the same |
US20140374838A1 (en) * | 2013-06-21 | 2014-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | FinFETs with Nitride Liners and Methods of Forming the Same |
US9287262B2 (en) * | 2013-10-10 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Passivated and faceted for fin field effect transistor |
US10128269B2 (en) * | 2013-11-08 | 2018-11-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Systems and methods for a semiconductor structure having multiple semiconductor-device layers |
US9178067B1 (en) * | 2014-04-25 | 2015-11-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for FinFET device |
US10418464B2 (en) * | 2015-06-12 | 2019-09-17 | Intel Corporation | Techniques for forming transistors on the same die with varied channel materials |
WO2016209219A1 (en) | 2015-06-24 | 2016-12-29 | Intel Corporation | Sub-fin sidewall passivation in replacement channel finfets |
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TWI727950B (zh) | 2021-05-21 |
CN107660311B (zh) | 2022-02-11 |
EP3314661A4 (en) | 2019-02-13 |
WO2016209219A1 (en) | 2016-12-29 |
EP3314661A1 (en) | 2018-05-02 |
KR102671542B1 (ko) | 2024-05-31 |
KR20180020261A (ko) | 2018-02-27 |
CN107660311A (zh) | 2018-02-02 |
KR20220120657A (ko) | 2022-08-30 |
US10510848B2 (en) | 2019-12-17 |
US20180151677A1 (en) | 2018-05-31 |
KR102427071B1 (ko) | 2022-08-01 |
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