TW201712698A - Over-current protection device - Google Patents

Over-current protection device Download PDF

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TW201712698A
TW201712698A TW104130630A TW104130630A TW201712698A TW 201712698 A TW201712698 A TW 201712698A TW 104130630 A TW104130630 A TW 104130630A TW 104130630 A TW104130630 A TW 104130630A TW 201712698 A TW201712698 A TW 201712698A
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polyolefin
polymer material
material layer
ptc
polyvinylidene fluoride
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TW104130630A
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TWI634569B (en
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陳繼聖
江長鴻
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富致科技股份有限公司
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Abstract

An over-current protection device includes first and second electrodes and a multilayered structure including first and second PTC polymer material layers. The first PTC polymer material layer includes a first polymer matrix and a particulate conductive filler. The second PTC polymer material layer includes a second polymer matrix and a particulate conductive filler. The second polymer matrix is made from a second polymer composition. One of the first and second polymer compositions contains polyvinylidene fluoride and polyolefin and the other of the first and second polymer compositions contains polyolefin or polyvinylidene fluoride.

Description

過電流保護裝置Overcurrent protection device

本發明是有關於一種過電流保護裝置,特別是指一種包含二PTC聚合物材料層的過電流保護裝置,其中一PTC聚合物材料層包括一由含有聚偏二氟乙烯(polyvinylidene fluoride,PVDF)及聚烯烴(polyolefin)的聚合組成物所製得的聚合物基材。 The present invention relates to an overcurrent protection device, and more particularly to an overcurrent protection device comprising a layer of two PTC polymer materials, wherein a layer of PTC polymer material comprises a layer containing polyvinylidene fluoride (PVDF). And a polymer substrate obtained by polymerizing a polyolefin.

正溫度係數(positive temperature coefficient,PTC)材料由於具有正溫度係數效應,因而適於作為保護裝置[例如保險絲(fuse)]。 Positive temperature coefficient (PTC) materials are suitable as protective devices [eg fuses] due to their positive temperature coefficient effect.

參閱圖1,一傳統的過電流保護裝置包含一PTC聚合物材料層81,及分別形成於該PTC聚合物材料層81兩相反面的第一電極82與第二電極83。該PTC聚合物材料層81包括一聚合物材料的聚合物基材及一導電微粒填料(圖未示)。該聚合物材料含有一結晶區(圖未示)與一非結晶區(圖未示)。該導電微粒填料分散於該聚合物基材之非結晶區,並於該第一電極82與該第二電極83間形成一用於電傳導的連續導電通路。該正溫度係數效應的現象是當該聚合物基材的溫度上升至其熔點時,於結晶區的晶體會開始 熔化,進而產生一新的非結晶區。當該新的非結晶區增加至能和原始非結晶區合併的範圍時,該導電微粒填料的導電通路會變成不連續且該PTC聚合物材料的電阻會大幅增加,因此導致於該第一電極82與該第二電極83間斷路。 Referring to FIG. 1, a conventional overcurrent protection device includes a PTC polymer material layer 81, and first electrodes 82 and second electrodes 83 respectively formed on opposite sides of the PTC polymer material layer 81. The PTC polymer material layer 81 comprises a polymeric substrate of a polymeric material and a conductive particulate filler (not shown). The polymer material contains a crystalline region (not shown) and an amorphous region (not shown). The conductive particulate filler is dispersed in the amorphous region of the polymer substrate, and a continuous conductive path for electrical conduction is formed between the first electrode 82 and the second electrode 83. The phenomenon of the positive temperature coefficient effect is that when the temperature of the polymer substrate rises to its melting point, the crystal in the crystal region starts. Melting, which in turn produces a new amorphous zone. When the new amorphous region is increased to a range that can be combined with the original amorphous region, the conductive path of the conductive particulate filler becomes discontinuous and the electrical resistance of the PTC polymer material is greatly increased, thereby resulting in the first electrode. 82 is disconnected from the second electrode 83.

該過電流保護裝置能藉由調整該聚合物基材的組成來調整操作溫度。然而,當該聚合物基材是由聚烯烴製成時,操作溫度只能於約-40℃至約85℃的範圍內。 The overcurrent protection device can adjust the operating temperature by adjusting the composition of the polymer substrate. However, when the polymeric substrate is made of a polyolefin, the operating temperature can only range from about -40 ° C to about 85 ° C.

為了達到更高且更廣的操作溫度範圍(例如於-40℃至125℃間),該聚合物基材可由聚偏二氟乙烯(PVDF)所製得。 To achieve a higher and wider operating temperature range (eg, between -40 ° C and 125 ° C), the polymeric substrate can be made from polyvinylidene fluoride (PVDF).

美國專利第5,451,919號揭示一於20℃時電阻率小於10ohm-cm的導電聚合組成物。該導電聚合組成物含有至少50vol%的聚偏二氟乙烯與1至20vol%的第二結晶性氟化聚合物。該導電聚合組成物經壓模(compression-molded)後形成一板塊(plaque)。該板塊的兩側被鎳箔電沉積層疊形成層板(laminate)。該層板藉由電子束經10Mrads的輻射量照射。該聚偏二氟乙烯的商品名為Kynar。然而,包含前述導電聚合物之過電流保護裝置的操作電壓(operating voltage)或崩壞電壓(breakdown voltage),根據熱失控測試(thermal runaway test),只能達到30Vdc。 U.S. Patent No. 5,451,919 discloses a conductive polymeric composition having a resistivity of less than 10 ohm-cm at 20 °C. The conductive polymer composition contains at least 50 vol% of polyvinylidene fluoride and 1 to 20 vol% of the second crystalline fluorinated polymer. The conductive polymer composition is compression-molded to form a plaque. Both sides of the plate are electrodeposited by nickel foil to form a laminate. The laminate was irradiated with an electron beam through a radiation amount of 10 Mrads. The polyvinylidene fluoride is marketed under the trade name Kynar. However, the operating voltage or the breakdown voltage of the overcurrent protection device including the foregoing conductive polymer can only reach 30 Vdc according to the thermal runaway test.

綜上所述,目前仍需同時提高過電流保護裝置的操作溫度及操作電壓。 In summary, it is still necessary to simultaneously increase the operating temperature and operating voltage of the overcurrent protection device.

因此,本發明之第一目的,即在提供一種具有高操作溫度與高操作電壓的過電流保護裝置。 Accordingly, a first object of the present invention is to provide an overcurrent protection device having a high operating temperature and a high operating voltage.

於是本發明過電流保護裝置包含第一電極、第二電極及一多層結構。該多層結構位於該第一電極與該第二電極間,且包括第一PTC聚合物材料層及第二PTC聚合物材料層,其中一PTC聚合物材料層堆疊於另一PTC聚合物材料層上並彼此黏合。該第一PTC聚合物材料層包括一第一聚合物基材及一分散於該第一聚合物基材中的微粒導電填料。該第一聚合物基材是由一第一聚合組成物所製得。該第二PTC聚合物材料層包括一第二聚合物基材及一分散於該第二聚合物基材中的微粒導電填料。該第二聚合物基材是由一第二聚合組成物所製得。該第一聚合組成物與該第二聚合組成物中的其中一者含有聚偏二氟乙烯及聚烯烴,另一者含有聚烯烴或聚偏二氟乙烯。當該第一聚合組成物與該第二聚合組成物中含有聚烯烴或聚偏二氟乙烯的一者含有聚烯烴時,其實質上不含有聚偏二氟乙烯;當該第一聚合組成物與該第二聚合組成物中含有聚烯烴或聚偏二氟乙烯的一者含有聚偏二氟乙烯時,其實質上不含有聚烯烴。 Therefore, the overcurrent protection device of the present invention comprises a first electrode, a second electrode and a multilayer structure. The multilayer structure is located between the first electrode and the second electrode, and includes a first PTC polymer material layer and a second PTC polymer material layer, wherein a PTC polymer material layer is stacked on another PTC polymer material layer And glued to each other. The first PTC polymer material layer includes a first polymer substrate and a particulate conductive filler dispersed in the first polymer substrate. The first polymeric substrate is made from a first polymeric composition. The second PTC polymer material layer includes a second polymer substrate and a particulate conductive filler dispersed in the second polymer substrate. The second polymeric substrate is made from a second polymeric composition. One of the first polymer composition and the second polymer composition contains polyvinylidene fluoride and polyolefin, and the other contains polyolefin or polyvinylidene fluoride. When the first polymerization composition and the second polymerization composition contain polyolefin or one of polyvinylidene fluoride containing polyolefin, it does not substantially contain polyvinylidene fluoride; when the first polymerization composition When one of the polyolefin or polyvinylidene fluoride contained in the second polymerization composition contains polyvinylidene fluoride, it does not substantially contain a polyolefin.

因此,本發明之另一目的,即在提供一種過電流保護裝置,該過電流保護裝置包含第一電極、第二電極及一多層結構。該多層結構位於該第一電極與該第二電極間,且包括第一PTC聚合物材料層及第二PTC聚合物材料層,其中一PTC聚合物材料層堆疊於另一PTC聚合物材料 層上並彼此黏合。該第一PTC聚合物材料層包括一第一聚合物基材及一分散於該第一聚合物基材中的微粒導電填料。該第一聚合物基材是由一含有聚偏二氟乙烯及聚烯烴的第一聚合組成物所製得,該聚偏二氟乙烯與該聚烯烴的重量比範圍為1:9至9:1。該第二PTC聚合物材料層包括一第二聚合物基材及一分散於該第二聚合物基材中的微粒導電填料。該第二聚合物基材是由一第二聚合組成物所製得,該第二聚合組成物含有聚烯烴及聚偏二氟乙烯中的至少其中一種。當該第二聚合組成物含有聚烯烴及聚偏二氟乙烯時,該第二聚合組成物的該聚偏二氟乙烯與該聚烯烴的重量比不於1:9至9:1的範圍內。該過電流保護裝置的跳脫表面溫度(trip surface temperature)範圍為110~150℃,崩壞電壓範圍為30~100V。 Accordingly, another object of the present invention is to provide an overcurrent protection device including a first electrode, a second electrode, and a multilayer structure. The multilayer structure is located between the first electrode and the second electrode, and includes a first PTC polymer material layer and a second PTC polymer material layer, wherein one PTC polymer material layer is stacked on another PTC polymer material Bonded on the layers and bonded to each other. The first PTC polymer material layer includes a first polymer substrate and a particulate conductive filler dispersed in the first polymer substrate. The first polymer substrate is prepared from a first polymerization composition comprising polyvinylidene fluoride and a polyolefin, and the weight ratio of the polyvinylidene fluoride to the polyolefin ranges from 1:9 to 9: 1. The second PTC polymer material layer includes a second polymer substrate and a particulate conductive filler dispersed in the second polymer substrate. The second polymeric substrate is prepared from a second polymeric composition comprising at least one of a polyolefin and polyvinylidene fluoride. When the second polymerization composition contains a polyolefin and polyvinylidene fluoride, the weight ratio of the polyvinylidene fluoride to the polyolefin of the second polymerization composition is not in the range of 1:9 to 9:1. . The overcurrent protection device has a trip surface temperature range of 110 to 150 ° C and a collapse voltage range of 30 to 100 V.

1、82‧‧‧第一電極 1, 82‧‧‧ first electrode

2、83‧‧‧第二電極 2, 83‧‧‧ second electrode

3‧‧‧多層結構 3‧‧‧Multilayer structure

31‧‧‧第一PTC聚合物材料層 31‧‧‧First PTC polymer material layer

32‧‧‧第二PTC聚合物材料層 32‧‧‧Second PTC polymer material layer

33‧‧‧第三PTC聚合物材料層 33‧‧‧ Third PTC polymer material layer

81‧‧‧PTC聚合物材料層 81‧‧‧ PTC polymer material layer

本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是一透視圖,說明傳統PTC過電流保護裝置;圖2是一透視圖,說明本發明PTC過電流保護裝置的一第一較佳實施例;圖3是一透視圖,說明本發明PTC過電流保護裝置的一第二較佳實施例;圖4是一關係圖,說明實施例2與比較例1-3的測試樣品之溫度與電阻的關係;及圖5是一關係圖,說明實施例2與比較例1-3的測試樣 品之溫度與衰退比例的關係。 Other features and advantages of the present invention will be apparent from the description of the drawings, wherein: FIG. 1 is a perspective view illustrating a conventional PTC overcurrent protection device; and FIG. 2 is a perspective view illustrating the PTC of the present invention. A first preferred embodiment of the overcurrent protection device; FIG. 3 is a perspective view showing a second preferred embodiment of the PTC overcurrent protection device of the present invention; and FIG. 4 is a related diagram illustrating the second embodiment and comparison The relationship between the temperature and the resistance of the test samples of Examples 1-3; and FIG. 5 is a relationship diagram illustrating the test samples of Example 2 and Comparative Example 1-3. The relationship between the temperature of the product and the proportion of the recession.

在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。 Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

參閱圖2,本發明過電流保護裝置之第一較佳實施例包含第一電極1與第二電極2,及一位於該第一電極1與該第二電極2間的多層結構3。該多層結構3包括第一PTC聚合物材料層31及第二PTC聚合物材料層32,其中一PTC聚合物材料層堆疊於另一PTC聚合物材料層上並彼此黏合。 Referring to FIG. 2, a first preferred embodiment of the overcurrent protection device of the present invention comprises a first electrode 1 and a second electrode 2, and a multilayer structure 3 between the first electrode 1 and the second electrode 2. The multilayer structure 3 includes a first PTC polymer material layer 31 and a second PTC polymer material layer 32, wherein a PTC polymer material layer is stacked on another PTC polymer material layer and bonded to each other.

該第一PTC聚合物材料層31包括一第一聚合物基材及一分散於該第一聚合物基材中的微粒導電填料,該第一聚合物基材是由一第一聚合組成物所製得 The first PTC polymer material layer 31 includes a first polymer substrate and a particulate conductive filler dispersed in the first polymer substrate, the first polymer substrate being composed of a first polymer composition be made of

該第二PTC聚合物材料層32包括一第二聚合物基材及一分散於該第二聚合物基材中的微粒導電填料。在本較佳實施例中,該第二聚合物基材是由一第二聚合組成物所製得。 The second PTC polymer material layer 32 includes a second polymer substrate and a particulate conductive filler dispersed in the second polymer substrate. In the preferred embodiment, the second polymeric substrate is made from a second polymeric composition.

在本較佳實施例中,該第一聚合組成物與該第二聚合組成物中的其中一者含有聚偏二氟乙烯及聚烯烴,另一者含有聚烯烴或聚偏二氟乙烯。當該第一聚合組成物與該第二聚合組成物中含有聚烯烴或聚偏二氟乙烯的一者含有聚烯烴時,其實質上不含有聚偏二氟乙烯;當該第一聚合組成物與該第二聚合組成物中含有聚烯烴或聚偏二氟乙烯的一者含有聚偏二氟乙烯時,其實質上不含有聚烯烴。 In the preferred embodiment, one of the first polymeric composition and the second polymeric composition comprises polyvinylidene fluoride and a polyolefin, and the other contains a polyolefin or polyvinylidene fluoride. When the first polymerization composition and the second polymerization composition contain polyolefin or one of polyvinylidene fluoride containing polyolefin, it does not substantially contain polyvinylidene fluoride; when the first polymerization composition When one of the polyolefin or polyvinylidene fluoride contained in the second polymerization composition contains polyvinylidene fluoride, it does not substantially contain a polyolefin.

較佳地,該第一聚合組成物與該第二聚合組成物各自還含有接枝聚烯烴(grafted polyolefin)。 Preferably, the first polymeric composition and the second polymeric composition each further comprise a grafted polyolefin.

較佳地,該第一聚合組成物與該第二聚合組成物中含有聚偏二氟乙烯及聚烯烴的一者,其聚偏二氟乙烯與聚烯烴的重量比範圍為1:9至9:1。 Preferably, the first polymer composition and the second polymer composition comprise one of polyvinylidene fluoride and a polyolefin, and the weight ratio of the polyvinylidene fluoride to the polyolefin ranges from 1:9 to 9. :1.

較佳地,根據ASTM D-1238,於溫度為230℃、裝載為12.5kg的條件下,所量測到該聚偏二氟乙烯的熔體流動速率(melt flow rate)範圍為0.5g/10min至30g/10min。 Preferably, according to ASTM D-1238, the melt flow rate of the polyvinylidene fluoride is measured to be in the range of 0.5 g/10 min under the conditions of a temperature of 230 ° C and a loading of 12.5 kg. Up to 30g/10min.

較佳地,該聚偏二氟乙烯的熔點範圍為140~180℃。 Preferably, the polyvinylidene fluoride has a melting point in the range of 140 to 180 °C.

較佳地,該第一聚合組成物與該第二聚合組成物的微粒導電填料為碳黑(carbon blake)。 Preferably, the particulate conductive filler of the first polymeric composition and the second polymeric composition is carbon blake.

較佳地,聚烯烴為聚乙烯。 Preferably, the polyolefin is polyethylene.

較佳地,以該第一PTC聚合物材料層的總重為100wt%計,該第一PTC聚合物材料層含有4.7~42.3wt%的聚偏二氟乙烯及4.7~42.3wt%的聚烯烴。 Preferably, the first PTC polymer material layer contains 4.7 to 42.3 wt% of polyvinylidene fluoride and 4.7 to 42.3 wt% of polyolefin based on 100 wt% of the total weight of the first PTC polymer material layer. .

較佳地,以該第二PTC聚合物材料層的總重為100wt%計,該第二PTC聚合物材料層含有23.5~45.0wt%的聚烯烴。 Preferably, the second PTC polymer material layer contains 23.5 to 45.0% by weight of the polyolefin based on 100% by weight of the total weight of the second PTC polymer material layer.

參閱圖3,本發明過電流保護裝置之第二較佳實施例包含第一電極1與第二電極2,及一位於該第一電極1與該第二電極2間的多層結構3。該多層結構3包括第一PTC聚合物材料層31、第二PTC聚合物材料層32及第三 PTC聚合物材料層33,其中一PTC聚合物材料層堆疊於另一PTC聚合物材料層上並彼此黏合。該第一PTC聚合物材料層31與該第二PTC聚合物材料層32和該第一較佳實施例相同。在本較佳實施例中,該第三PTC聚合物材料層33堆疊於該第一PTC聚合物材料層31相反於該第二PTC聚合物材料層32的一側,且包括一第三聚合物基材及一分散於該第三聚合物基材中的微粒導電填料,該第三聚合物基材是由一第三聚合組成物所製得。 Referring to FIG. 3, a second preferred embodiment of the overcurrent protection device of the present invention comprises a first electrode 1 and a second electrode 2, and a multilayer structure 3 between the first electrode 1 and the second electrode 2. The multilayer structure 3 includes a first PTC polymer material layer 31, a second PTC polymer material layer 32, and a third A layer of PTC polymer material 33 in which a layer of PTC polymer material is stacked on another layer of PTC polymer material and bonded to each other. The first PTC polymer material layer 31 is the same as the second PTC polymer material layer 32 and the first preferred embodiment. In the preferred embodiment, the third PTC polymer material layer 33 is stacked on the side of the first PTC polymer material layer 31 opposite to the second PTC polymer material layer 32, and includes a third polymer. a substrate and a particulate electrically conductive filler dispersed in the third polymeric substrate, the third polymeric substrate being prepared from a third polymeric composition.

在某些較佳實施例中,該第一聚合組成物含有聚偏二氟乙烯及聚烯烴,該第三聚合組成物含有聚烯烴或聚偏二氟乙烯。 In certain preferred embodiments, the first polymeric composition comprises polyvinylidene fluoride and a polyolefin, and the third polymeric composition comprises a polyolefin or polyvinylidene fluoride.

在某些較佳實施例中,該第一聚合組成物含有聚偏二氟乙烯或聚烯烴,該第三聚合組成物含有聚烯烴及聚偏二氟乙烯。 In certain preferred embodiments, the first polymeric composition comprises polyvinylidene fluoride or a polyolefin, and the third polymeric composition comprises a polyolefin and polyvinylidene fluoride.

本發明過電流保護裝置之第三較佳實施例的結構與該第一較佳實施例相似,其差別在於,在本較佳實施例中,該第一聚合組成物與該第二聚合組成物皆含有聚烯烴及聚偏二氟乙烯。該第一聚合組成物的該聚偏二氟乙烯與該聚烯烴的重量比範圍為1:9至9:1,且該第二聚合組成物的該聚偏二氟乙烯與該聚烯烴的重量比不於1:9至9:1的範圍內。 The structure of the third preferred embodiment of the overcurrent protection device of the present invention is similar to that of the first preferred embodiment, except that in the preferred embodiment, the first polymeric composition and the second polymeric composition All contain polyolefin and polyvinylidene fluoride. The weight ratio of the polyvinylidene fluoride to the polyolefin of the first polymeric composition ranges from 1:9 to 9:1, and the polyvinylidene fluoride of the second polymeric composition and the weight of the polyolefin The ratio is not in the range of 1:9 to 9:1.

每一較佳實施例的過電流保護裝置,其跳脫表面溫度範圍皆為110~150℃,崩壞電壓範圍皆為30~100V。 The overcurrent protection device of each of the preferred embodiments has a tripping surface temperature range of 110 to 150 ° C and a collapse voltage range of 30 to 100 V.

本發明將就以下實施例來作進一步說明,但應 瞭解的是,該實施例僅為例示說明之用,而不應被解釋為本發明實施之限制。 The invention will be further illustrated by the following examples, but It is to be understood that the examples are for illustrative purposes only and are not to be construed as limiting.

實施例Example

八種配方(聚合組成物)被用於製備下列實施例與比較例的PTC聚合物材料層(見表1)。 Eight formulations (polymeric compositions) were used to prepare the PTC polymer material layers of the following examples and comparative examples (see Table 1).

用於八種配方的材料包含:作為聚烯烴的HDPE(購自台灣塑膠工業股份有限公司;型號HDPE9002;重量平均分子量為150,000g/mole;根據ASTM D-1238,於溫度為230℃、裝載為12.5kg的條件下,熔體流動速率為45g/10min)、作為接枝聚烯烴的接枝HDPE(購自杜邦;型號MB100D;重量平均分子量為80,000g/mole;根據ASTM D-1238,於溫度為230℃、裝載為12.5kg的條件下,熔體流動速率為75g/10min)、作為微粒導電填料的碳黑(購自哥倫比亞化學公司;型號Raven 430UB;DBP/D為0.95;容積密度為0.53g/cm3),及PVDF(購自Arkema;型號Kynar 761;熔點170℃;於溫度為230℃、裝載為12.5kg的條件下,熔體流動速率為3.0g/10min) The materials used for the eight formulations included: HDPE as a polyolefin (purchased from Taiwan Plastics Co., Ltd.; model HDPE9002; weight average molecular weight 150,000 g/mole; according to ASTM D-1238, at 230 ° C, loaded as Grafted HDPE as a grafted polyolefin under the condition of 12.5 kg (45 g/10 min) (purchased from DuPont; model MB100D; weight average molecular weight 80,000 g/mole; according to ASTM D-1238, at temperature Carbon black as a particulate conductive filler at 230 ° C under a load of 12.5 kg, purchased from Columbia Chemical Company; model Raven 430UB; DBP/D 0.95; bulk density 0.53 g/cm 3 ), and PVDF (purchased from Arkema; model Kynar 761; melting point 170 ° C; at a temperature of 230 ° C, loading of 12.5 kg, melt flow rate of 3.0 g/10 min)

<實施例1(E1)><Example 1 (E1)>

一PTC聚合物材料的第一薄板(作為第一PTC聚合物材料層)是由配方(1)製備,該配方(1)包括1.175g的HDPE(購自台灣塑膠工業股份有限公司;型號HDPE9002;重量平均分子量為150,000g/mole;根據ASTM D-1238,於溫度為230℃、裝載為12.5kg的條件下,熔體流動速率為45g/10min)、1.175g的羧酸酐接枝(carboxylic acid anhydride grafted)HDPE聚乙烯(購自杜邦;型號MB100D;重量平均分子量為80,000g/mole;根據ASTM D-1238,於溫度為230℃、裝載為12.5kg的條件下,熔體流動速率為75g/10min)、21.15g的PVDF(購自Arkema;型號Kynar 761;熔點170℃;於溫度為230℃、裝載為12.5kg的條件下,熔體流動速率為3.0g/10min),及26.5g碳黑粒子[購自哥倫比亞化學公司;商品名稱Raven 430UB;平均粒徑82nm;DBP油-吸收(DBP-oil absorption)為75cc/100g;揮發物含量1.0wt%;導電度2.86×104m-1Ω-1]。配方(1)是 於Brabender混合器中進行混合。混合溫度為200℃,攪拌速率為30rpm,且混合時間為10分鐘。該經混合後的混合物經熱壓後形成一厚度為0.175mm之PTC聚合物材料的第一薄板(作為第一PTC聚合物材料層)。熱壓溫度為200℃,熱壓時間為4分鐘,且熱壓壓力為80kg/cm2A first sheet of PTC polymer material (as a first PTC polymer material layer) is prepared from Formulation (1) comprising 1.175 g of HDPE (purchased from Taiwan Plastics Industry Co., Ltd.; model HDPE9002; The weight average molecular weight is 150,000 g/mole; according to ASTM D-1238, at a temperature of 230 ° C, a loading of 12.5 kg, a melt flow rate of 45 g/10 min), 1.175 g of a carboxylic acid anhydride Grafted) HDPE polyethylene (purchased from DuPont; model MB100D; weight average molecular weight 80,000 g/mole; melt flow rate 75 g/10 min according to ASTM D-1238 at 230 ° C and 12.5 kg loading) ), 21.15 g of PVDF (purchased from Arkema; model Kynar 761; melting point 170 ° C; melt flow rate of 3.0 g/10 min at 230 ° C, loading of 12.5 kg), and 26.5 g of carbon black particles [purchased from Columbia Chemical Company; trade name Raven 430UB; average particle size 82nm; DBP-oil absorption is 75cc/100g; volatile content 1.0wt%; conductivity 2.86×10 4 m -1 Ω - 1 ]. Formulation (1) was mixed in a Brabender mixer. The mixing temperature was 200 ° C, the stirring rate was 30 rpm, and the mixing time was 10 minutes. The mixed mixture was subjected to hot pressing to form a first sheet (as a first PTC polymer material layer) of a PTC polymer material having a thickness of 0.175 mm. The hot pressing temperature was 200 ° C, the hot pressing time was 4 minutes, and the hot pressing pressure was 80 kg/cm 2 .

一PTC聚合物材料的第二薄板(作為第二PTC聚合物材料層)是由配方(7)製得,而其製備流程與條件與該PTC聚合物材料的第一薄板相似。 A second sheet of PTC polymer material (as a second layer of PTC polymer material) is prepared from Formulation (7) and is prepared in a similar manner to the first sheet of the PTC polymer material.

二分別作為第一電極層1與第二電極層2的銅箔板分別接於該第一PTC聚合物材料層與該第二PTC聚合物材料層之堆疊的兩相反側,且於200℃及80kg/cm2下熱壓4分鐘形成三明治結構的PTC層板(laminate)。該PTC層板被切成大小為8mm×8mm的測試樣品。該每一測試樣品皆被暴露於總劑量為50kGy的鈷-60源。 The copper foil sheets respectively serving as the first electrode layer 1 and the second electrode layer 2 are respectively connected to opposite sides of the stack of the first PTC polymer material layer and the second PTC polymer material layer, and at 200 ° C and The sandwiched PTC laminate was formed by hot pressing at 80 kg/cm 2 for 4 minutes. The PTC laminate was cut into test samples having a size of 8 mm x 8 mm. Each test sample was exposed to a cobalt-60 source with a total dose of 50 kGy.

實施例1的測試樣品於室溫下的平均電阻如表2所示。 The average resistance of the test sample of Example 1 at room temperature is shown in Table 2.

<實施例2至6、9與10(E2至E6、E9與E10)><Examples 2 to 6, 9 and 10 (E2 to E6, E9 and E10)>

實施例2至6、9與10(E2至E6、E9與E10)之測試樣品的製備流程與條件,除了該PTC聚合物材料的第一薄板與第二薄板所使用的配方之組成不同外,皆與該實施例1相似。 The preparation process and conditions of the test samples of Examples 2 to 6, 9 and 10 (E2 to E6, E9 and E10), except that the composition of the first sheet of the PTC polymer material and the second sheet were different, Both are similar to the embodiment 1.

E2至E6、E9與E10被用來形成PTC層板的配方如表2所示。實施例2至6、9與10之測試樣品的平均電阻顯示於表2中。 The formulations of E2 to E6, E9 and E10 used to form the PTC laminate are shown in Table 2. The average electrical resistance of the test samples of Examples 2 to 6, 9 and 10 is shown in Table 2.

<實施例7與8(E7與E8)><Examples 7 and 8 (E7 and E8)>

實施例7與8(E7與E8)之測試樣品的製備流程與條件,除了實施例7與8的該每一PTC層板還包括一PTC聚合物材料的第三薄板外,皆與該實施例1相似。 The preparation process and conditions of the test samples of Examples 7 and 8 (E7 and E8), except that each of the PTC laminates of Examples 7 and 8 further comprises a third sheet of PTC polymer material, 1 is similar.

實施例7與8之PTC層板的組成如表2所示。實施例7與8之測試樣品的平均電阻顯示於表2中。 The compositions of the PTC laminates of Examples 7 and 8 are shown in Table 2. The average resistance of the test samples of Examples 7 and 8 is shown in Table 2.

<比較例1至4(CE1至CE4)><Comparative Examples 1 to 4 (CE1 to CE4)>

比較例1至4(CE1至CE4)之測試樣品的製備流程與條件,除了該每一比較例只有一PTC聚合物材料層的薄板外,皆與該實施例1相似。 The preparation procedures and conditions of the test samples of Comparative Examples 1 to 4 (CE1 to CE4) were similar to those of Example 1 except that each of the comparative examples had only one sheet of the PTC polymer material layer.

比較例1至4之PTC層板的組成如表2所示。比較例1至4之測試樣品的平均電阻顯示於表2中。 The compositions of the PTC laminates of Comparative Examples 1 to 4 are shown in Table 2. The average resistance of the test samples of Comparative Examples 1 to 4 is shown in Table 2.

<比較例5(CE5)><Comparative Example 5 (CE5)>

比較例5(CE5)之第一薄板與第二薄板的製備流程與條件,除了該比較例5的第一薄板與第二薄板分別是由配方(7)與配方(8)所製得外,皆與該實施例1相似。由於該第二薄板是由含有PVDF及不含聚烯烴的配方(8)所製得,因而實質上不具有黏性。因此,該第一薄板與該第二薄板無法被層疊以形成PTC層板。 The preparation process and conditions of the first sheet and the second sheet of Comparative Example 5 (CE5), except that the first sheet and the second sheet of Comparative Example 5 were prepared by the formulation (7) and the formulation (8), respectively. Both are similar to the embodiment 1. Since the second sheet is made of a formulation (8) containing PVDF and no polyolefin, it is substantially non-tacky. Therefore, the first sheet and the second sheet cannot be laminated to form a PTC laminate.

<比較例6與7(CE6與CE7)><Comparative Examples 6 and 7 (CE6 and CE7)>

比較例6與7(CE6與CE7)之測試樣品的製備流程與條件,除了該PTC聚合物材料的第一薄板與第二薄板所使用的配方組合不同外,皆與該實施例1相似。 The preparation procedures and conditions of the test samples of Comparative Examples 6 and 7 (CE6 and CE7) were similar to those of Example 1 except that the first sheet of the PTC polymer material was different from the formulation used for the second sheet.

比較例6與7之PTC層板的組成如表2所示。 比較例6與7之測試樣品的平均電阻顯示於表2中。 The compositions of the PTC laminates of Comparative Examples 6 and 7 are shown in Table 2. The average resistance of the test samples of Comparative Examples 6 and 7 is shown in Table 2.

性能測試Performance Testing

不同溫度下的電阻Resistance at different temperatures

E1~E10與CE1~CE7各自有十個測試樣品被測試,用以決定E1~E10與CE1~CE7各自的測試樣品於25至185℃間的電阻。 Ten test samples of E1~E10 and CE1~CE7 were tested to determine the resistance of the test samples of E1~E10 and CE1~CE7 between 25 and 185 °C.

每個測試樣品的電阻測試是以2℃/min的固定速率,使每個測試樣品由初始溫度25℃逐步升溫至最終溫度185℃而完成。E1~E10與CE1~CE7中的每個測試樣品於室溫下的電阻都被記錄。電阻測試結果如表3所示,且E2 與CE1~CE3的測試樣品之溫度與電阻間的關係如圖4所示。於相同溫度下,當PTC層板的電阻越高,PTC層板的工作電壓(working voltage)也就越高。結果顯示相較於比較例1~7,實施例1~10能於較高的工作電壓下操作。例如,E2於140℃下具有24.58ohm的電阻,且於170℃下具有1313.05ohm的電阻,高於比較例1於140℃下具有18.98ohm的電阻,及於170℃下具有47.86ohm的電阻。 The resistance test of each test sample was completed at a fixed rate of 2 ° C/min, and each test sample was gradually heated from an initial temperature of 25 ° C to a final temperature of 185 ° C. The resistance of each test sample in E1~E10 and CE1~CE7 at room temperature was recorded. The resistance test results are shown in Table 3, and E2 The relationship between temperature and resistance of the test samples with CE1~CE3 is shown in Fig. 4. At the same temperature, the higher the resistance of the PTC laminate, the higher the working voltage of the PTC laminate. The results show that Examples 1 to 10 can be operated at a higher operating voltage than Comparative Examples 1 to 7. For example, E2 has a resistance of 24.58 ohms at 140 ° C and a resistance of 1313.05 ohm at 170 ° C, a resistance of 18.98 ohms at 140 ° C higher than that of Comparative Example 1, and a resistance of 47.86 ohms at 170 ° C.

熱衰退(thermal derating)測試Thermal derating test

E1~E10與CE1~CE7中的每一測試樣品皆進行熱衰退測試,用以決定E1~E10與CE1~CE7的熱衰退比例(於測試溫度下的操作電流/於25℃下的操作電流×100%)。熱衰退測試是藉由於-40℃、25℃、85℃與125℃下量測每一測試樣品的操作電流而完成。 Each test sample in E1~E10 and CE1~CE7 is subjected to thermal decay test to determine the thermal decay ratio of E1~E10 and CE1~CE7 (operating current at test temperature/operating current at 25 °C× 100%). The thermal decay test was performed by measuring the operating current of each test sample at -40 ° C, 25 ° C, 85 ° C, and 125 ° C.

熱衰退測試的結果如表3所示。E2與CE1~CE3的測試樣品之溫度與衰退比例間的關係如圖5所示。 The results of the thermal decay test are shown in Table 3. The relationship between the temperature of E2 and CE1~CE3 test samples and the decay ratio is shown in Fig. 5.

熱失控(thermal runaway)測試Thermal runaway test

E1~E10與CE1~CE7各自有五個測試樣品被用於熱失控測試。每一測試樣品的熱失控測試足以使每一測試樣品燒毀,其是於固定電流100A下,使該每一測試樣品由初始電壓20Vdc逐步增加至最終電壓至1000Vdc而完成。外加電壓是於每步驟5Vdc的增加量增加且每步驟的持續時間為2分鐘(即每一新的外加電壓持續2分鐘)。E1~E10與CE1~CE7的每一測試樣品之最大可忍受電壓(即崩壞電壓)皆被記錄。熱失控測試結果於表3中顯示。 Five test samples of E1~E10 and CE1~CE7 were used for thermal runaway test. The thermal runaway test of each test sample is sufficient to burn each test sample at a fixed current of 100 A, and the test sample is gradually increased from an initial voltage of 20 Vdc to a final voltage of 1000 Vdc. The applied voltage is an increase in the amount of 5 Vdc per step and the duration of each step is 2 minutes (ie, each new applied voltage lasts 2 minutes). The maximum tolerable voltage (ie, collapse voltage) of each test sample of E1~E10 and CE1~CE7 was recorded. Thermal runaway test results are shown in Table 3.

熱衰退測試結果(見表3)顯示,由於CE1的PTC聚合物材料層缺少PVDF,所以CE1之測試樣品於125℃下的操作電流接近0。只有一聚合物材料層的CE3與CE4之測試樣品於125℃下的操作電流也接近0。CE1、CE3與CE4的每一測試樣品只能於-40至85℃的操作溫度範圍間操作。 The results of the thermal decay test (see Table 3) show that the test current of the CE1 test sample at 125 ° C is close to zero due to the lack of PVDF in the PTC polymer material layer of CE1. Only the test sample of CE3 and CE4 of a polymer material layer had an operating current close to zero at 125 °C. Each test sample of CE1, CE3, and CE4 can only be operated between the operating temperature ranges of -40 to 85 °C.

該第一PTC聚合物材料層與該第二PTC聚合物材料層皆包含聚烯烴及PVDF的CE6與CE7,其測試樣品於125℃下的操作電流也接近0。CE6與CE7的每一測試樣品只能於-40至85℃的操作溫度範圍間操作。 Both the first PTC polymer material layer and the second PTC polymer material layer comprise CE6 and CE7 of polyolefin and PVDF, and the test current of the test sample at 125 ° C is also close to zero. Each test sample of CE6 and CE7 can only be operated between -40 and 85 °C operating temperature range.

E1~E10之測試樣品於125℃下的操作電流仍維 持在20%以上。E1~E10中的每一測試樣品(其中一PTC聚合物材料層含有PVDF)皆能於-40至125℃的操作溫度範圍間操作。 The operating current of the test samples of E1~E10 at 125 °C is still dimensional Hold at 20% or more. Each of the test samples E1 to E10 (one of which contains PVDF) has an operating temperature range of -40 to 125 °C.

熱失控測試結果(見表3)顯示E1~E10(90至100V)的崩壞電壓高於CE1~CE4(30至60V),說明本發明過電流保護裝置能於較高電壓下操作。 The thermal runaway test results (see Table 3) show that the collapse voltage of E1~E10 (90 to 100V) is higher than CE1~CE4 (30 to 60V), indicating that the overcurrent protection device of the present invention can operate at a higher voltage.

綜上所述,由於本發明的過電流保護裝置中包含第一PTC聚合物材料層與第二PTC聚合物材料層,且至少其中之一含有PVDF與聚烯烴,因而能減少前述先前技術的缺點,故確實能達成本發明之目的。 In summary, since the overcurrent protection device of the present invention includes the first PTC polymer material layer and the second PTC polymer material layer, and at least one of them contains PVDF and polyolefin, the disadvantages of the foregoing prior art can be reduced. Therefore, the object of the present invention can be achieved.

惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the equivalent equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still The scope of the invention is covered.

1‧‧‧第一電極 1‧‧‧first electrode

2‧‧‧第二電極 2‧‧‧second electrode

3‧‧‧多層結構 3‧‧‧Multilayer structure

31‧‧‧第一PTC聚合物材料層 31‧‧‧First PTC polymer material layer

32‧‧‧第二PTC聚合物材料層 32‧‧‧Second PTC polymer material layer

Claims (12)

一種過電流保護裝置,包含:第一電極與第二電極;及一多層結構,位於該第一電極與該第二電極間,且包括第一PTC聚合物材料層及第二PTC聚合物材料層,其中一PTC聚合物材料層堆疊於另一PTC聚合物材料層上並彼此黏合;其中,該第一PTC聚合物材料層包括一第一聚合物基材及一分散於該第一聚合物基材中的微粒導電填料,該第一聚合物基材是由一第一聚合組成物所製得;該第二PTC聚合物材料層包括一第二聚合物基材及一分散於該第二聚合物基材中的微粒導電填料,該第二聚合物基材是由一第二聚合組成物所製得;該第一聚合組成物與該第二聚合組成物中的其中一者含有聚偏二氟乙烯及聚烯烴,另一者含有聚烯烴或聚偏二氟乙烯;當該第一聚合組成物與該第二聚合組成物中含有聚烯烴或聚偏二氟乙烯的一者含有聚烯烴時,其實質上不含有聚偏二氟乙烯;當該第一聚合組成物與該第二聚合組成物中含有聚烯烴或聚偏二氟乙烯的一者含有聚偏二氟乙烯時,其實質上不含有聚烯烴。 An overcurrent protection device comprising: a first electrode and a second electrode; and a multilayer structure between the first electrode and the second electrode, and comprising a first PTC polymer material layer and a second PTC polymer material a layer, wherein a layer of PTC polymer material is stacked on another PTC polymer material layer and bonded to each other; wherein the first PTC polymer material layer comprises a first polymer substrate and a dispersion of the first polymer a particulate electrically conductive filler in the substrate, the first polymeric substrate being made from a first polymeric composition; the second PTC polymeric material layer comprising a second polymeric substrate and a second dispersed in the second a particulate electrically conductive filler in a polymeric substrate, the second polymeric substrate being prepared from a second polymeric composition; one of the first polymeric composition and the second polymeric composition comprising a polypyramid Difluoroethylene and polyolefin, the other contains polyolefin or polyvinylidene fluoride; when the first polymeric composition and the second polymeric composition contain polyolefin or polyvinylidene fluoride, one contains polyolefin When it is substantially free of polyvinylidene fluoride ; When the first polymeric composition and the second polymer composition containing a polyolefin or polyvinylidene fluoride containing one of polyvinylidene fluoride, which does not substantially contain a polyolefin. 如請求項1所述的過電流保護裝置,其中,該第一聚合組成物與該第二聚合組成物各自還含有接枝聚烯烴。 The overcurrent protection device according to claim 1, wherein the first polymerization composition and the second polymerization composition each further comprise a graft polyolefin. 如請求項1所述的過電流保護裝置,其中,該第一聚合組成物與該第二聚合組成物中含有聚偏二氟乙烯及聚烯烴的一者,其聚偏二氟乙烯與聚烯烴的重量比範圍為1:9至9:1。 The overcurrent protection device according to claim 1, wherein the first polymerization composition and the second polymerization composition comprise one of polyvinylidene fluoride and polyolefin, and polyvinylidene fluoride and polyolefin. The weight ratio ranges from 1:9 to 9:1. 如請求項1所述的過電流保護裝置,其中,根據ASTM D-1238,於溫度為230℃、裝載為12.5kg的條件下,所量測到該聚偏二氟乙烯的熔體流動速率範圍為0.5g/10min至30g/10min。 The overcurrent protection device according to claim 1, wherein the melt flow rate range of the polyvinylidene fluoride is measured according to ASTM D-1238 at a temperature of 230 ° C and a load of 12.5 kg. It is from 0.5 g/10 min to 30 g/10 min. 如請求項1所述的過電流保護裝置,其中,該聚偏二氟乙烯的熔點範圍為140~180℃。 The overcurrent protection device according to claim 1, wherein the polyvinylidene fluoride has a melting point in the range of 140 to 180 °C. 如請求項1所述的過電流保護裝置,其中,該第一聚合組成物與該第二聚合組成物的微粒導電填料為碳黑。 The overcurrent protection device of claim 1, wherein the particulate conductive filler of the first polymeric composition and the second polymeric composition is carbon black. 如請求項1所述的過電流保護裝置,其中,該第一聚合組成物與該第二聚合組成物各自的聚烯烴為聚乙烯。 The overcurrent protection device according to claim 1, wherein the polyolefin of the first polymerization composition and the second polymerization composition is polyethylene. 如請求項1所述的過電流保護裝置,其中,以該第一PTC聚合物材料層的總重為100wt%計,該第一PTC聚合物材料層含有4.7~42.3wt%的聚偏二氟乙烯及4.7~42.3wt%的聚烯烴。 The overcurrent protection device according to claim 1, wherein the first PTC polymer material layer contains 4.7 to 42.3 wt% of polyvinylidene fluoride based on 100 wt% of the total weight of the first PTC polymer material layer. Ethylene and 4.7 to 42.3 wt% of polyolefin. 如請求項1所述的過電流保護裝置,其中,以該第二PTC聚合物材料層的總重為100wt%計,該第二PTC聚合物材料層含有23.5~45.0wt%的聚烯烴。 The overcurrent protection device according to claim 1, wherein the second PTC polymer material layer contains 23.5 to 45.0% by weight of the polyolefin based on 100% by weight of the total weight of the second PTC polymer material layer. 如請求項1所述的過電流保護裝置,其中,該多層結構還包括一堆疊於該第一PTC聚合物材料層上的第三PTC聚合物材料層,該第三PTC聚合物材料層包括一第三聚 合物基材及一分散於該第三聚合物基材中的微粒導電填料,該第三聚合物基材是由一第三聚合組成物所製得,該第一聚合組成物含有聚偏二氟乙烯及聚烯烴,該第三聚合組成物含有聚烯烴或聚偏二氟乙烯。 The overcurrent protection device of claim 1, wherein the multilayer structure further comprises a third PTC polymer material layer stacked on the first PTC polymer material layer, the third PTC polymer material layer comprising Third gathering a substrate and a particulate conductive filler dispersed in the third polymer substrate, the third polymer substrate being prepared from a third polymer composition comprising a polydisperse Fluorine and polyolefin, the third polymer composition contains polyolefin or polyvinylidene fluoride. 如請求項1所述的過電流保護裝置,其中,該多層結構還包括一堆疊於該第一PTC聚合物材料層上的第三PTC聚合物材料層,該第三PTC聚合物材料層包括一第三聚合物基材及一分散於該第三聚合物基材中的微粒導電填料,該第三聚合物基材是由一第三聚合組成物所製得,該第一聚合組成物含有聚偏二氟乙烯或聚烯烴,該第三聚合組成物含有聚烯烴及聚偏二氟乙烯。 The overcurrent protection device of claim 1, wherein the multilayer structure further comprises a third PTC polymer material layer stacked on the first PTC polymer material layer, the third PTC polymer material layer comprising a third polymer substrate and a particulate conductive filler dispersed in the third polymer substrate, the third polymer substrate being prepared from a third polymer composition, the first polymer composition comprising a poly Part of vinylidene fluoride or polyolefin, the third polymeric composition comprising polyolefin and polyvinylidene fluoride. 一種過電流保護裝置,包含:第一電極與第二電極;及一多層結構,位於該第一電極與該第二電極間,且包括第一PTC聚合物材料層及第二PTC聚合物材料層,其中一PTC聚合物材料層堆疊於另一PTC聚合物材料層上並彼此黏合;其中,該第一PTC聚合物材料層包括一第一聚合物基材及一分散於該第一聚合物基材中的微粒導電填料,該第一聚合物基材是由一含有聚偏二氟乙烯及聚烯烴的第一聚合組成物所製得,該聚偏二氟乙烯與該聚烯烴的重量比範圍為1:9至9:1;該第二PTC聚合物材料層包括一第二聚合物基材及一分散於該第二聚合物基材中的微粒導電填料,該第 二聚合物基材是由一第二聚合組成物所製得,該第二聚合組成物含有聚烯烴及聚偏二氟乙烯中的至少其中一種;當該第二聚合組成物含有聚烯烴及聚偏二氟乙烯時,該第二聚合組成物的該聚偏二氟乙烯與該聚烯烴的重量比不於1:9至9:1的範圍內;及該過電流保護裝置的跳脫表面溫度範圍為110~150℃,崩壞電壓範圍為30~100V。 An overcurrent protection device comprising: a first electrode and a second electrode; and a multilayer structure between the first electrode and the second electrode, and comprising a first PTC polymer material layer and a second PTC polymer material a layer, wherein a layer of PTC polymer material is stacked on another PTC polymer material layer and bonded to each other; wherein the first PTC polymer material layer comprises a first polymer substrate and a dispersion of the first polymer a particulate electrically conductive filler in a substrate, the first polymeric substrate being prepared from a first polymeric composition comprising polyvinylidene fluoride and a polyolefin, the weight ratio of the polyvinylidene fluoride to the polyolefin The range of 1:9 to 9:1; the second PTC polymer material layer comprises a second polymer substrate and a particulate conductive filler dispersed in the second polymer substrate, the first The second polymer substrate is prepared from a second polymer composition comprising at least one of a polyolefin and polyvinylidene fluoride; when the second polymer composition comprises a polyolefin and a poly In the case of vinylidene fluoride, the weight ratio of the polyvinylidene fluoride to the polyolefin of the second polymer composition is not in the range of 1:9 to 9:1; and the surface temperature of the overcurrent protection device The range is 110~150°C, and the collapse voltage range is 30~100V.
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