TW201711779A - Laser processing apparatus - Google Patents

Laser processing apparatus Download PDF

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TW201711779A
TW201711779A TW105121654A TW105121654A TW201711779A TW 201711779 A TW201711779 A TW 201711779A TW 105121654 A TW105121654 A TW 105121654A TW 105121654 A TW105121654 A TW 105121654A TW 201711779 A TW201711779 A TW 201711779A
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lens portion
workpiece
reflected
distance
laser processing
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TW105121654A
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TWI610747B (en
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成振宇
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Eo科技股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

Provided is a laser processing apparatus. The laser processing apparatus includes: a light source configured to emit a processing beam for laser processing to a processed object; a focusing optical system configured to focus the processing beam; and a an auto-focusing unit configured to adjust a position of the focusing optical system so that a focusing beam of the processing beam is formed in the processed object. The auto-focusing unit includes: a first beam splitter disposed between the focusing optical system and the light source and configured to reflect at least a part of reflected light reflected from the processed object; a first lens unit configured to focus the reflected light reflected from the first beam splitter; and a first optical sensor disposed in a direction in which the reflected light is focused from the first lens unit and configured to measure an energy density of the reflected light focused by the first lens unit.

Description

雷射處理裝置Laser processing device

本發明揭示一種雷射加工裝置,且揭示一種對雷射束聚焦至加工物的位置進行調節的技術。The present invention discloses a laser processing apparatus and discloses a technique for adjusting the position at which a laser beam is focused to a workpiece.

通常,雷射加工製程是指向加工對象物的表面掃描雷射束而對加工對象物表面的形狀或物理性質等進行加工的製程。加工對象物可有多個例,且其形狀可為2D平面形狀。作為雷射加工的例,可包括雷射標記、雷射切割或雷射刻槽(grooving)製程等。Generally, a laser processing process is a process of processing a laser beam onto a surface of a workpiece to process a shape or a physical property of a surface of the object to be processed. The object to be processed may have a plurality of cases, and its shape may be a 2D planar shape. As an example of laser processing, a laser marking, a laser cutting or a laser grooving process, etc. may be included.

為了提高雷射加工的精確度,重要的是良好地調節自光源出射的雷射束的聚光點的位置。另外,為了調節雷射束的聚光點位置,應測定雷射束的聚光點形成至加工物上的哪一位置。In order to improve the accuracy of laser processing, it is important to well adjust the position of the condensed spot of the laser beam emerging from the light source. In addition, in order to adjust the position of the spot of the laser beam, it is determined at which position on the workpiece the spot of the laser beam is formed.

於先前的雷射加工裝置中,為了間接地獲知雷射束的聚光點,與將雷射光聚光的聚光透鏡並列設置有用以測定加工對象物的表面高度的測定部。此種雷射加工裝置一面對加工對象物的表面進行掃描,一面藉由測定部對加工對象物的表面高度進行測定,根據以此方式測定到的表面高度而以聚光透鏡與加工對象物表面的距離變得固定的方式驅動聚光透鏡。藉此,即便加工對象物的表面凹凸不平,亦可始終使雷射光的聚光點位於加工對象物的表面而執行雷射加工作業。In the conventional laser processing apparatus, in order to indirectly acquire the light collecting point of the laser beam, a measuring unit for measuring the surface height of the object to be processed is provided in parallel with the collecting lens that collects the laser light. When the laser processing apparatus scans the surface of the object to be processed, the height of the surface of the object to be processed is measured by the measuring unit, and the condensing lens and the object to be processed are used according to the surface height measured in this manner. The concentrating lens is driven in such a manner that the distance of the surface becomes fixed. Thereby, even if the surface of the object to be processed is uneven, the laser light collecting point can be always performed by positioning the light collecting point of the laser light on the surface of the object to be processed.

然而,於如上所述的先前的雷射加工裝置中,聚光透鏡與測定部彼此相隔固定間隔而設置,故而會因載置加工對象物的平台振動等而加工對象物的實際表面高度與藉由測定部測定到的表面高度之間產生誤差,因此雷射光的聚光點位置會脫離所意欲的位置。However, in the conventional laser processing apparatus as described above, since the condensing lens and the measuring unit are provided at a fixed interval from each other, the actual surface height of the object to be processed and the borrowing due to the vibration of the stage on which the object to be processed is placed. An error occurs between the heights of the surfaces measured by the measuring unit, so that the position of the spot of the laser light is separated from the intended position.

作為其他例,亦有追蹤加工束於加工物反射的反射束的路徑而倒推加工束的聚光點位置的方法。然而,於該情形時,會因加工物的厚度變化、位於雷射束路徑上的掃描儀或透鏡等驅動光學系統的誤差而無法獲知聚光點位置,或即便獲知聚光點位置,可靠性亦降低。As another example, there is a method of tracking the position of the focused spot of the processed beam by tracking the path of the reflected beam reflected by the processed object. However, in this case, the position of the condensed spot cannot be known due to the variation of the thickness of the workpiece, the error of the driving optical system such as a scanner or a lens located on the path of the laser beam, or even if the position of the condensed spot is known, reliability Also reduced.

[發明欲解決的課題] 根據例示性的實施例,提供一種包括自動調整雷射加工束的聚光點位置的自動聚焦裝置的雷射加工裝置。 [解決課題的手段][Problem to be Solved by the Invention] According to an exemplary embodiment, a laser processing apparatus including an autofocus device that automatically adjusts a position of a focused spot of a laser beam is provided. [Means for solving the problem]

於一觀點中,提供一種雷射加工裝置,包括:光源,其向加工物出射用於雷射加工的加工束;聚光光學系統,其將上述加工束聚光; 自動對焦單元,其對上述聚光光學系統的位置進行調節,以使上述加工束的聚光點形成至上述加工物的內部,上述自動對焦單元包括:第一分束器,其設置至上述聚光光學系統與光源之間,反射自上述加工對象物反射的反射光中的至少一部分;第一透鏡部,其將自上述第一分束器反射的上述反射光聚焦;以及第一光感測器,其自上述第一透鏡部設置於上述反射光聚焦的方向上,對藉由上述第一透鏡部聚焦的上述反射光的能量密度進行測定。In one aspect, a laser processing apparatus includes: a light source that emits a processing beam for laser processing to a workpiece; a collecting optical system that condenses the processing beam; and an autofocus unit that Positioning the concentrating optical system to adjust a condensing point of the processed beam to the inside of the processed object, the autofocus unit comprising: a first beam splitter disposed between the concentrating optical system and the light source And reflecting at least a portion of the reflected light reflected from the processing object; the first lens portion focusing the reflected light reflected from the first beam splitter; and the first photo sensor from the first The lens portion is provided in a direction in which the reflected light is focused, and measures an energy density of the reflected light focused by the first lens portion.

可根據由上述第一光感測器測定到的上述反射光的能量密度而確定上述聚光光學系統的位置。The position of the concentrating optical system can be determined based on the energy density of the reflected light measured by the first photosensor.

上述第一透鏡部與上述第一光感測器之間的距離可根據上述加工束的聚光點形成至上述加工物內部的深度而改變。The distance between the first lens portion and the first photosensor may be changed according to the depth at which the condensed spot of the processed beam is formed to the inside of the workpiece.

上述加工束的聚光點形成至上述加工物內部的深度越大,則上述第一透鏡部與上述第一光感測器之間的距離可設定地越大。The greater the depth at which the condensed spot of the processed beam is formed into the inside of the workpiece, the larger the distance between the first lens portion and the first photosensor can be set.

上述第一透鏡部與上述第一光感測器之間的距離可根據上述加工物內部的折射率而改變。The distance between the first lens portion and the first photosensor may be changed according to the refractive index inside the workpiece.

上述第一透鏡部可包括兩個凸透鏡及設置至上述兩個凸透鏡之間的凹透鏡。The first lens portion may include two convex lenses and a concave lens disposed between the two convex lenses.

於上述第一透鏡部中,上述兩個凸透鏡與上述凹透鏡的位置可根據上述加工束的聚光點形成至上述加工物內部的深度而改變。In the first lens portion, the positions of the two convex lenses and the concave lens may be changed according to the depth at which the light collecting point of the processed beam is formed to the inside of the workpiece.

於上述第一透鏡部中,上述兩個凸透鏡與上述凹透鏡的位置可根據上述加工物內部的折射率而改變。In the first lens portion, the positions of the two convex lenses and the concave lens may be changed according to the refractive index inside the workpiece.

上述自動對焦單元可更包括第二分束器,上述第二分束器將自上述第一分束器反射的反射光分割成第一反射光及第二反射光。The autofocus unit may further include a second beam splitter, and the second beam splitter splits the reflected light reflected from the first beam splitter into the first reflected light and the second reflected light.

上述第一反射光入射至上述第一透鏡部,且上述自動對焦單元可包括:第二透鏡部,其供第二反射光入射;以及第二光感測器,其自上述第二透鏡部設置於上述第二反射光聚焦的方向上,對藉由上述第二透鏡部而聚焦的上述第二反射光的能量密度進行測定。The first reflected light is incident on the first lens portion, and the autofocus unit may include: a second lens portion for incident second reflected light; and a second photo sensor disposed from the second lens portion The energy density of the second reflected light focused by the second lens portion is measured in a direction in which the second reflected light is focused.

可根據由上述第一光感測器測定到的上述第一反射光的能量密度及由上述第二光感測器測定到的上述第二反射光的能量密度而確定上述聚光光學系統的位置。Determining the position of the concentrating optical system according to the energy density of the first reflected light measured by the first photosensor and the energy density of the second reflected light measured by the second photo sensor .

可根據上述第一反射光的能量密度與上述第二反射光的能量密度的差值而確定上述聚光光學系統的位置。The position of the concentrating optical system may be determined based on a difference between an energy density of the first reflected light and an energy density of the second reflected light.

上述第一透鏡部與上述第一光感測器之間的距離及上述第二透鏡部與上述第二光感測器之間的距離可根據上述加工束的聚光點形成至上述加工物內部的深度而改變。The distance between the first lens portion and the first photosensor and the distance between the second lens portion and the second photo sensor may be formed into the processed object according to the condensed spot of the processed beam The depth changes.

上述加工束的聚光點形成至上述加工物內部的深度越大,則上述第一透鏡部與上述第一光感測器之間的距離及上述第二透鏡部與上述第二光感測器之間的距離可設定地越大。The distance between the first lens portion and the first photosensor and the second lens portion and the second photo sensor are larger as the depth of the condensed spot of the processed beam is formed into the processed object The distance between them can be set larger.

上述第一透鏡部與上述第一光感測器之間的距離及上述第二透鏡部與上述第二光感測器之間的距離可根據上述加工物內部的折射率而改變。The distance between the first lens portion and the first photosensor and the distance between the second lens portion and the second photosensor may be changed according to the refractive index inside the workpiece.

上述第一透鏡部及上述第二透鏡部可分別包括兩個凸透鏡與設置至上述兩個凸透鏡之間的凹透鏡。The first lens portion and the second lens portion may respectively include two convex lenses and a concave lens provided between the two convex lenses.

於上述第一透鏡部及第二透鏡部各者中,上述兩個凸透鏡與上述凹透鏡的位置可根據上述加工束的聚光點形成至上述加工物內部的深度而改變。In each of the first lens portion and the second lens portion, the positions of the two convex lenses and the concave lens may be changed according to a depth at which the light collecting point of the processed beam is formed inside the workpiece.

於上述第一透鏡部及第二透鏡部各者中,上述兩個凸透鏡與上述凹透鏡的位置可根據上述加工物內部的折射率而改變。 [發明之效果]In each of the first lens portion and the second lens portion, the positions of the two convex lenses and the concave lens may be changed according to the refractive index inside the workpiece. [Effects of the Invention]

根據實施例,提供一種即便發生聚光光學系統的變動、加工物的厚度變化,亦可精確且穩定地檢測加工束的聚光點位置的聚光點檢測裝置。According to the embodiment, there is provided a concentrating point detecting device capable of accurately and stably detecting the position of the condensed spot of the processed beam even when the concentrating optical system is changed and the thickness of the processed product is changed.

於以下圖式中,相同的參照符號代表相同的構成要素,且於圖式中,為了說明的明確性及便利性,可誇張地表示各構成要素的尺寸。另一方面,以下所說明的實施例僅為示例,可根據這些實施例實現各種變形。In the following drawings, the same reference numerals denote the same constituent elements, and in the drawings, the dimensions of the respective constituent elements can be exaggerated for clarity and convenience of explanation. On the other hand, the embodiments described below are merely examples, and various modifications can be made according to the embodiments.

第一、第二等用語可用於說明各種構成要素,但構成要素不應受用語的限定。用語僅以自其他構成要素區分一個構成要素為目的而使用。The first and second terms can be used to describe various constituent elements, but the constituent elements should not be limited by the terms. The term is used only for the purpose of distinguishing one component from other components.

只要未於文中明確地表示其他含義,則單數的表達包括複數的表達。並且,於記載為某個部分“包括”某個構成要素時,只要無特別相反的記載,則意味著可更包括其他構成要素,而並非是指排除其他構成要素。As long as the other meanings are not explicitly indicated in the text, the singular expression includes the plural expression. In addition, when a part is "included" as a certain component, unless otherwise indicated, it means that it may include other components, and does not mean that other components are excluded.

並且,說明書中所記載的“…部”、“模組”等用語是指對至少一個功能或動作進行處理的單位。Further, terms such as "parts" and "modules" described in the specification refer to units that process at least one function or operation.

圖1是概略性地表示例示性的實施例的聚光點檢測裝置的圖。Fig. 1 is a view schematically showing a light collecting point detecting device of an exemplary embodiment.

參照圖1,自光源10出射的加工束L1可經由聚光光學系統20照射至加工物30。聚光光學系統20可將加工束L1聚光。於圖1中,例示性地表示聚光光學系統20包括一個透鏡,但並不限制於此。聚光光學系統20只要變更加工束L1的光路徑而將加工束L1聚光即可,亦可包括多個光學要素。並且,於圖1中,表示加工束L1的聚光點形成至加工物30的表面的例,但加工束L1的聚光點位置可根據雷射加工特性而改變。Referring to FIG. 1, the processed beam L1 emitted from the light source 10 can be irradiated to the workpiece 30 via the collecting optical system 20. The collecting optics 20 can condense the processed beam L1. In FIG. 1, the concentrating optical system 20 is exemplarily shown to include a lens, but is not limited thereto. The collecting optical system 20 may condense the processed beam L1 as long as the optical path of the processed beam L1 is changed, and may include a plurality of optical elements. Further, in Fig. 1, an example in which the condensed spot of the processed beam L1 is formed on the surface of the workpiece 30 is shown, but the position of the condensed spot of the processed beam L1 may be changed in accordance with the laser processing characteristics.

實施例的聚光點檢測裝置可檢測通過聚光光學系統20的加工束L1的聚光點距加工物30的表面的距離。若聚光點檢測裝置向使用者提供與加工束L1的聚光點距加工物30表面的距離相關的資訊,則使用者可基於上述聚光點的位置資訊而變更聚光光學系統20的設置。可手動實現聚光光學系統20的設置變更,亦可藉由實施例的聚光點檢測裝置而自動實現。雖未圖示,但於自動調節聚光光學系統20的位置的情形時,聚光點檢測裝置亦可包括對聚光光學系統的位置進行調節的驅動裝置。The condensing point detecting device of the embodiment can detect the distance of the condensing point of the processed beam L1 passing through the condensing optical system 20 from the surface of the workpiece 30. If the concentrating point detecting device provides the user with information on the distance of the condensing point of the processing beam L1 from the surface of the workpiece 30, the user can change the setting of the concentrating optical system 20 based on the position information of the condensing point. . The setting change of the collecting optics 20 can be manually realized, and can be automatically realized by the concentrating point detecting device of the embodiment. Although not shown, in the case where the position of the collecting optical system 20 is automatically adjusted, the collecting point detecting means may include a driving means for adjusting the position of the collecting optical system.

為了檢測加工束L1的聚光點位置,聚光點檢測裝置對自加工物30反射的反射束L2進行測定。聚光點檢測裝置可包括反射上述反射束L2中的至少一部分的第一分束器110。第一分束器110可將自加工物30反射的反射束L2全部反射,亦可僅反射一部分。並且,入射至第一分束器110的加工束L1可全部透射第一分束器110,亦可為一部分透射而入射至加工物30、另一部分反射。若自光源10出射的加工束L1與於加工物反射的反射束L2的波長不同,則第一分束器110亦可為僅對於反射束L2的波長反射光束,而對於加工束L1的波長使光束透射。於該情形時,能夠以反射特定波長的光束、使其他波長的光束透射的方式塗覆處理第一分束器110的表面。In order to detect the position of the condensed spot of the processed beam L1, the condensed spot detecting means measures the reflected beam L2 reflected from the processed object 30. The concentrating point detecting device may include a first beam splitter 110 that reflects at least a portion of the reflected beam L2. The first beam splitter 110 can totally reflect the reflected beam L2 reflected from the workpiece 30, or can reflect only a part. Further, the processed beam L1 incident on the first beam splitter 110 may all be transmitted through the first beam splitter 110, or may be partially transmitted and incident on the workpiece 30, and the other portion may be reflected. If the processed beam L1 emitted from the light source 10 and the reflected beam L2 reflected by the processed object have different wavelengths, the first beam splitter 110 may also reflect the light beam only for the wavelength of the reflected beam L2, and for the wavelength of the processed beam L1. The beam is transmitted. In this case, the surface of the first beam splitter 110 can be coated in such a manner as to reflect a light beam of a specific wavelength and transmit a light beam of other wavelengths.

聚光點檢測裝置可包括第一透鏡部132,上述第一透鏡部132將路徑因第一分束器110而變更的反射束L2聚焦(focusing)。第一透鏡部132可為可將反射束L2聚焦的光學元件。於圖1中,將第一透鏡部132表示為半凸透鏡,但實施例並不限制於此。第一透鏡部132只要可將反射束L2聚焦即可,可不同地變更第一透鏡部132所包括的透鏡形狀。並且,於圖1中,表示第一透鏡部132包括一個透鏡的例,但實施例並不限制於此。例如,第一透鏡部132可包括多個透鏡。不僅如此,如下所述,包括於第一透鏡部132的透鏡並不限定於凸透鏡,亦可包括凹透鏡。其中,第一透鏡部132可包括至少一個聚光透鏡,以便將通過第一透鏡部132的光束聚焦。The condensed light detecting device may include a first lens portion 132 that focuses the reflected beam L2 whose path is changed by the first beam splitter 110. The first lens portion 132 can be an optical element that can focus the reflected beam L2. In FIG. 1, the first lens portion 132 is shown as a semi-convex lens, but the embodiment is not limited thereto. The first lens portion 132 may be configured to focus the reflection beam L2, and the lens shape included in the first lens portion 132 may be changed differently. Further, in FIG. 1, an example in which the first lens portion 132 includes one lens is shown, but the embodiment is not limited thereto. For example, the first lens portion 132 may include a plurality of lenses. Moreover, as described below, the lens included in the first lens portion 132 is not limited to the convex lens, and may include a concave lens. Wherein, the first lens portion 132 may include at least one concentrating lens to focus the light beam passing through the first lens portion 132.

聚光點檢測裝置可包括對藉由第一透鏡部132而聚焦的反射束L2的能量密度進行測定的第一光感測器142。第一光感測器142可自第一透鏡部132設置於反射束L2聚焦的方向上。於圖1中,例示性地表示如下情形:第一光感測器142較第一透鏡部132的焦點距離f進一步遠離第一透鏡部132距離d0。然而,圖1所示的第一光感測器142的位置僅為示例,並不限制於此。例如,第一光感測器142亦可較第一透鏡部132的焦點距離f更小地遠離第一透鏡部132。The concentrating point detecting device may include a first photo sensor 142 that measures the energy density of the reflected beam L2 focused by the first lens portion 132. The first photo sensor 142 may be disposed from the first lens portion 132 in a direction in which the reflected beam L2 is focused. In FIG. 1 , a case where the focal length f of the first photo sensor 142 is further away from the first lens portion 132 by a distance d0 from the first lens portion 132 is exemplarily shown. However, the position of the first photo sensor 142 shown in FIG. 1 is merely an example and is not limited thereto. For example, the first photo sensor 142 may also be away from the first lens portion 132 by a smaller distance than the focal length f of the first lens portion 132.

第一光感測器142可對通過第一透鏡部132的反射束L2的能量密度進行測定。此處,所謂反射束L2的能量密度是指自反射束L2的入射面傳遞的單位面積能量。於反射束L2的聚光區域較窄的區域中,反射束L2的能量密度會較大;於反射束L2的入射面積較大的區域中,反射束L2的能量密度會相對較小。即,若第一光感測器142的位置接近通過第一透鏡部132的反射束L2的聚光點,則由第一光感測器142測定到的反射束L2的能量密度會較大。相反地,若第一光感測器142的位置遠離通過第一透鏡部132的反射束L2的聚光點,則由第一光感測器142測定到的反射束L2的能量密度會較小。The first photo sensor 142 can measure the energy density of the reflected beam L2 passing through the first lens portion 132. Here, the energy density of the reflected beam L2 means the energy per unit area transmitted from the incident surface of the reflected beam L2. In a region where the condensed area of the reflected beam L2 is narrow, the energy density of the reflected beam L2 is large; in the region where the incident area of the reflected beam L2 is large, the energy density of the reflected beam L2 is relatively small. That is, if the position of the first photo sensor 142 is close to the condensing point of the reflected beam L2 passing through the first lens portion 132, the energy density of the reflected beam L2 measured by the first photo sensor 142 is large. Conversely, if the position of the first photo sensor 142 is away from the condensing point of the reflected beam L2 passing through the first lens portion 132, the energy density of the reflected beam L2 measured by the first photo sensor 142 is small. .

圖2是圖1所示的聚光光學系統20與加工物30之間的距離發生變化的例的圖。FIG. 2 is a view showing an example in which the distance between the collecting optical system 20 and the workpiece 30 shown in FIG. 1 is changed.

參照圖2,加工物30與聚光光學系統20之間的距離變得大於圖1所示的距離。因此,通過聚光光學系統20的加工束L1的聚光點可形成至加工物30的表面上。因加工束L1的聚光點形成至加工物30的表面上而自加工物30的表面反射的反射束L2入射至聚光光學系統20的角度會發生變化。另外,因入射至聚光光學系統20的反射束L2的角度發生變化而反射束L2入射至第一分束器110的角度亦會發生變化。如圖2所示,若加工束L1的聚光點位於加工物30的表面上,則與圖1的情形不同,自第一分束器110反射的反射束L2的光束尺寸會逐漸變小。另外,因此而通過第一透鏡部132的反射束L2的聚光點與第一透鏡部132之間的距離f'會變得小於第一透鏡部132的焦點距離f。Referring to Fig. 2, the distance between the workpiece 30 and the collecting optics 20 becomes larger than the distance shown in Fig. 1. Therefore, the light collecting point of the processed beam L1 passing through the collecting optical system 20 can be formed onto the surface of the workpiece 30. The angle at which the reflected beam L2 reflected from the surface of the workpiece 30 is incident on the collecting optical system 20 changes due to the formation of the condensed spot of the processed beam L1 onto the surface of the workpiece 30. Further, the angle at which the reflected beam L2 is incident on the first beam splitter 110 also changes due to a change in the angle of the reflected beam L2 incident on the collecting optical system 20. As shown in FIG. 2, if the condensed spot of the processed beam L1 is located on the surface of the workpiece 30, unlike the case of FIG. 1, the beam size of the reflected beam L2 reflected from the first beam splitter 110 gradually becomes smaller. Further, therefore, the distance f' between the condensed spot of the reflected beam L2 passing through the first lens portion 132 and the first lens portion 132 becomes smaller than the focal length f of the first lens portion 132.

因反射束L2的聚光點與第一透鏡部132之間的距離f'變小而第一光感測器142與反射束L2的聚光點之間的距離d1會變得大於圖1所示的距離d0。因此,由第一光感測器142測定到的反射束L2的能量密度會減少。即,若於如圖1般配置第一光感測器142的狀態下,如圖2所示般以進一步遠離聚光光學系統20的方式配置加工物30的位置,則由第一光感測器142測定到的反射束L2的能量密度會減小。The distance d1 between the condensing point of the reflected beam L2 and the first lens portion 132 becomes smaller, and the distance d1 between the condensing point of the first photo sensor 142 and the reflected beam L2 becomes larger than that of FIG. The distance d0 shown. Therefore, the energy density of the reflected beam L2 measured by the first photo sensor 142 is reduced. In other words, when the first photosensor 142 is disposed as shown in FIG. 1, the position of the workpiece 30 is disposed further away from the collecting optical system 20 as shown in FIG. 2, and the first light is sensed. The energy density of the reflected beam L2 measured by the 142 is reduced.

圖3是圖1所示的聚光光學系統20與加工物30之間的距離發生變化的另一例的圖。FIG. 3 is a view showing another example of a change in the distance between the collecting optical system 20 and the workpiece 30 shown in FIG. 1.

參照圖3,加工物30與聚光光學系統20之間的距離變得小於圖1所示的距離。因此,通過聚光光學系統20的加工束L1於形成聚光點前,會於加工物30的表面反射。因此,於加工物30的表面反射的反射束L2入射至聚光光學系統20的角度會發生變化。另外,因入射至聚光光學系統20的反射束L2的角度發生變化而反射束L2入射至第一分束器110的角度亦會發生變化。如圖3所示,若於形成加工束L1的聚光點前,加工束L1於加工物30的表面反射,則於第一分束器110反射的反射束L2的光束尺寸會逐漸變大。另外,因此而通過第一透鏡部132的反射束L2的聚光點與第一透鏡部132之間的距離f''會變得大於第一透鏡部132的焦點距離f。Referring to Fig. 3, the distance between the workpiece 30 and the collecting optics 20 becomes smaller than the distance shown in Fig. 1. Therefore, the processed beam L1 passing through the collecting optical system 20 is reflected on the surface of the workpiece 30 before the condensed spot is formed. Therefore, the angle at which the reflected beam L2 reflected on the surface of the workpiece 30 is incident on the collecting optical system 20 changes. Further, the angle at which the reflected beam L2 is incident on the first beam splitter 110 also changes due to a change in the angle of the reflected beam L2 incident on the collecting optical system 20. As shown in FIG. 3, if the processed beam L1 is reflected on the surface of the workpiece 30 before the condensing point of the processed beam L1 is formed, the beam size of the reflected beam L2 reflected by the first beam splitter 110 gradually becomes larger. Further, therefore, the distance f′′ between the light collecting point of the reflected beam L2 passing through the first lens portion 132 and the first lens portion 132 becomes larger than the focal length f of the first lens portion 132 .

因反射束L2的聚光點與第一透鏡部132之間的距離f''變大而第一光感測器142與反射束L2的聚光點之間的距離d2會變得小於圖1所示的距離d0。因此,由第一光感測器142測定到的反射束L2的能量密度會增加。即,若於如圖1般配置第一光感測器142的狀態下,加工物30與聚光光學系統20之間的距離變大,則由第一光感測器142測定到的反射束L2的能量密度會增加。The distance d' between the condensed spot of the reflected beam L2 and the first lens portion 132 becomes larger, and the distance d2 between the condensed point of the first photo sensor 142 and the reflected beam L2 becomes smaller than that of FIG. The distance d0 shown. Therefore, the energy density of the reflected beam L2 measured by the first photo sensor 142 is increased. That is, if the distance between the workpiece 30 and the collecting optical system 20 becomes large in a state where the first photo sensor 142 is disposed as shown in FIG. 1, the reflected beam measured by the first photo sensor 142 is used. The energy density of L2 will increase.

如參照圖1至圖3進行的說明,因聚光光學系統20與加工物30之間的距離發生變化而由第一光感測器142測定到的反射束L2的能量密度會發生變化。即,可根據由第一光感測器142測定到的反射束L2的能量密度而確定聚光光學系統20的位置。因此,根據由第一光感測器142測定到的反射束L2的能量密度可知加工束L1的聚光點是否準確地形成於加工物30的表面、是否形成於高於加工物30的表面的位置或加工束L1於形成聚光點前是否於加工物30反射。As described with reference to FIGS. 1 to 3, the energy density of the reflected beam L2 measured by the first photo sensor 142 changes due to a change in the distance between the collecting optical system 20 and the workpiece 30. That is, the position of the collecting optical system 20 can be determined based on the energy density of the reflected beam L2 measured by the first photo sensor 142. Therefore, based on the energy density of the reflected beam L2 measured by the first photo sensor 142, it is known whether or not the condensed spot of the processed beam L1 is accurately formed on the surface of the workpiece 30, and is formed at a higher surface than the surface of the workpiece 30. Whether the position or processing beam L1 is reflected by the workpiece 30 before forming the condensing point.

於圖1中,表示第一光感測器142的位置相距第一透鏡部132的距離為較第一透鏡部132的焦點距離更遠的情形,但實施例並不限制於此。In FIG. 1, the position of the first photo sensor 142 is farther from the first lens portion 132 than the focal length of the first lens portion 132, but the embodiment is not limited thereto.

例如,第一光感測器142與第一透鏡部132之間的距離可小於第一透鏡部132的焦點距離。即,於加工束L1的聚光點形成至加工物30的表面的狀態下,通過第一透鏡部132的反射束L2的聚光點可較第一透鏡部132更遠離第一光感測器142。於該情形時,與圖1不同,若反射束L2的聚光點接近第一透鏡部132,則由第一光感測器142測定到的能量密度會變大。並且,若反射束L2的聚光點遠離第一透鏡部132,則由第一光感測器142測定到的能量密度會變小。即,若加工物30遠離聚光光學系統20,則由第一光感測器142測定到的能量密度會增加,若加工物30接近聚光光學系統20,則由第一光感測器142測定到的能量密度會減小。因此,可根據由第一光感測器142測定到的反射束L2的能量密度而確定聚光光學系統的位置。For example, the distance between the first photo sensor 142 and the first lens portion 132 may be smaller than the focal length of the first lens portion 132. That is, in a state where the condensed spot of the processed beam L1 is formed to the surface of the workpiece 30, the condensed spot of the reflected beam L2 passing through the first lens portion 132 may be further away from the first photo sensor than the first lens portion 132. 142. In this case, unlike FIG. 1, when the condensed spot of the reflected beam L2 approaches the first lens portion 132, the energy density measured by the first photo sensor 142 becomes large. Further, when the condensed spot of the reflected beam L2 is away from the first lens portion 132, the energy density measured by the first photo sensor 142 becomes small. That is, if the workpiece 30 is away from the collecting optics 20, the energy density measured by the first photo sensor 142 is increased. If the workpiece 30 is close to the collecting optics 20, the first photo sensor 142 is used. The measured energy density will decrease. Therefore, the position of the collecting optical system can be determined based on the energy density of the reflected beam L2 measured by the first photo sensor 142.

於圖1至圖3中,利用於加工物30的上部表面反射的反射光檢測聚光點的位置,但實施例並不限制於此。圖4是表示圖1所示的實施例的變形例的圖。In FIGS. 1 to 3, the position of the light-converging point is detected by the reflected light reflected from the upper surface of the workpiece 30, but the embodiment is not limited thereto. Fig. 4 is a view showing a modification of the embodiment shown in Fig. 1;

參照圖4,第一透鏡部132可將於加工物30的下表面Sb反射的反射光L2聚光。於加工物30的上表面Su的透光率較高的情形時,在加工物30的上表面Su反射的反射光Lu的強度較弱而難以用於檢測聚光點。並且,若於加工物30的上表面Su反射的反射光Lu通過第一分束器110而擴散,則難以於第一透鏡部132聚光。於該情形時,藉由第一透鏡部132將如圖4所示般透射至加工物30的內部而於加工物30的下表面Sd反射的反射光L2聚光,藉此聚光點檢測裝置可檢測聚光光學系統20的聚光點。Referring to FIG. 4, the first lens portion 132 may condense the reflected light L2 reflected from the lower surface Sb of the workpiece 30. When the light transmittance of the upper surface Su of the workpiece 30 is high, the intensity of the reflected light Lu reflected on the upper surface Su of the workpiece 30 is weak, and it is difficult to detect the light collecting point. Further, when the reflected light Lu reflected on the upper surface Su of the workpiece 30 is diffused by the first beam splitter 110, it is difficult to collect the first lens portion 132. In this case, the reflected light L2 reflected on the lower surface Sd of the workpiece 30 is condensed by the first lens portion 132 as shown in FIG. 4 and transmitted to the inside of the workpiece 30, whereby the condensed spot detecting device The condensing point of the concentrating optical system 20 can be detected.

圖5是概略性地表示其他例示性的實施例的聚光點檢測裝置的圖。Fig. 5 is a view schematically showing a light collecting point detecting device of another exemplary embodiment.

參照圖5,聚光點檢測裝置可更包括將反射束L2分割成第一反射束L21與第二反射束L22的第二分束器120。如參照圖1至圖4進行的說明,由第二分束器120分割的光束中的第一反射束L21可入射至第一透鏡部132。聚光點檢測裝置可包括供第二反射束L22入射的第二透鏡部134及對藉由第二透鏡部而聚焦的第二反射光的能量密度進行測定的第二光感測器144。Referring to FIG. 5, the concentrating point detecting device may further include a second beam splitter 120 that divides the reflected beam L2 into a first reflected beam L21 and a second reflected beam L22. As explained with reference to FIGS. 1 to 4, the first reflected beam L21 of the light beams split by the second beam splitter 120 may be incident on the first lens portion 132. The concentrating point detecting device may include a second lens portion 134 for injecting the second reflected beam L22 and a second photo sensor 144 for measuring the energy density of the second reflected light focused by the second lens portion.

如圖5,若第二分束器120分割反射束L2,則隨著加工物30與聚光光學系統20之間的距離發生變化而由第一光感測器142測定到的第一反射束的能量密度及由第二光感測器144測定到的第二反射束的能量密度會一同發生變化。第一光感測器142較第一透鏡部132的焦點距離更遠離第一透鏡部132。相反地,第二光感測器144能夠以較第二透鏡部134的焦點距離更接近第二透鏡部134的方式設置。如上所述,若確定第一光感測器及第二光感測器144的位置,則與聚光光學系統20與加工物30之間的距離變化對應地由第一光感測器及第二光感測器144測定到的能量密度的變化感度會變高。因聚光光學系統20與加工物30之間的距離發生變化而由第一光感測器142與第二光感測器144測定到的光束的能量密度朝不同方向發生變化,故而可容易地觀察到第一光感測器142的測定值與第二光感測器144的測定值之間的差異變化。於圖5中,表示第一光感測器142較第一透鏡部132的焦點距離更遠離第一透鏡部132,且第二光感測器144較第二透鏡部134的焦點距離更接近第二透鏡部134的情形,但實施例亦包括相反的情形。As shown in FIG. 5, if the second beam splitter 120 splits the reflected beam L2, the first reflected beam measured by the first photo sensor 142 changes as the distance between the workpiece 30 and the collecting optics 20 changes. The energy density and the energy density of the second reflected beam measured by the second photo sensor 144 vary together. The first photo sensor 142 is farther away from the first lens portion 132 than the focal length of the first lens portion 132. Conversely, the second photo sensor 144 can be disposed in such a manner that the focal length of the second lens portion 134 is closer to the second lens portion 134. As described above, if the positions of the first photo sensor and the second photo sensor 144 are determined, the distance between the concentrating optical system 20 and the workpiece 30 is changed by the first photo sensor and the corresponding The sensitivity of the change in the energy density measured by the two-photo sensor 144 becomes high. Since the energy density of the light beam measured by the first photo sensor 142 and the second photo sensor 144 changes in different directions due to a change in the distance between the collecting optical system 20 and the workpiece 30, it is easy to easily A change in the difference between the measured value of the first photo sensor 142 and the measured value of the second photo sensor 144 is observed. In FIG. 5, the first photo sensor 142 is further away from the first lens portion 132 than the first lens portion 132, and the second photo sensor 144 is closer to the second lens portion 134 than the second lens portion 134. The case of the second lens portion 134, but the embodiment also includes the opposite case.

圖6是概略性地表示其他例示性的實施例的聚光點檢測裝置的圖。Fig. 6 is a view schematically showing a light collecting point detecting device of another exemplary embodiment.

參照圖6,聚光點檢測裝置可更包括變更第二反射束L22的路徑的鏡面122。如圖6所示,若改變第二反射束L22的路徑,則可將第一透鏡部132及第二透鏡部134構成至相同方向。另外,因第一反射束L21及第二反射束L22沿相同方向行進而可進一步縮小聚光點檢測裝置的設置空間。如圖6,若設置兩個以上的光感測器142、144,則可藉由對由光感測器142、144測定到的光能密度進行比較而抵消除聚光光學系統20與加工物30之間的距離變化以外因雜訊等其他原因引起的測定值變化。Referring to FIG. 6, the concentrating point detecting device may further include a mirror surface 122 that changes a path of the second reflected beam L22. As shown in FIG. 6, when the path of the second reflected beam L22 is changed, the first lens portion 132 and the second lens portion 134 can be formed in the same direction. Further, since the first reflected beam L21 and the second reflected beam L22 travel in the same direction, the installation space of the light collecting point detecting device can be further reduced. As shown in FIG. 6, if two or more photo sensors 142 and 144 are provided, the concentrating optical system 20 and the processed object can be eliminated by comparing the optical energy densities measured by the photo sensors 142 and 144. A change in the measured value due to other causes such as noise other than the change in distance between 30.

與圖5不同,於圖6中表示第一光感測器142與第一透鏡部132之間的距離l1大於第一透鏡部132的焦點距離f1,且第二光感測器144與第二透鏡部134之間的距離l2亦大於第二透鏡部134的焦點距離f2的情形,但實施例亦可包括其他例。例如,可為第一光感測器142與第一透鏡部132之間的距離l1小於第一透鏡部132的焦點距離f1,且第二光感測器144與第二透鏡部134之間的距離l2亦小於第二透鏡部134的焦點距離f2。另外,作為其他例,亦可為第一光感測器142與第一透鏡部132之間的距離l1大於第一透鏡部132的焦點距離f1,相反地,第二光感測器144與第二透鏡部134之間的距離l2小於第二透鏡部134的焦點距離f2。作為其他例,亦可為第一光感測器142與第一透鏡部132之間的距離l1小於第一透鏡部132的焦點距離f1,相反地,第二光感測器144與第二透鏡部134之間的距離l2大於第二透鏡部134的焦點距離f2。Different from FIG. 5, the distance l1 between the first photo sensor 142 and the first lens portion 132 is greater than the focal length f1 of the first lens portion 132, and the second photo sensor 144 and the second are shown in FIG. The distance l2 between the lens portions 134 is also larger than the focal length f2 of the second lens portion 134, but the embodiment may include other examples. For example, the distance l1 between the first photo sensor 142 and the first lens portion 132 may be smaller than the focal length f1 of the first lens portion 132, and between the second photo sensor 144 and the second lens portion 134. The distance l2 is also smaller than the focal length f2 of the second lens portion 134. In addition, as another example, the distance l1 between the first photo sensor 142 and the first lens portion 132 may be greater than the focal length f1 of the first lens portion 132, and conversely, the second photo sensor 144 and the second The distance l2 between the two lens portions 134 is smaller than the focal length f2 of the second lens portion 134. As another example, the distance l1 between the first photo sensor 142 and the first lens portion 132 may be smaller than the focal length f1 of the first lens portion 132, and conversely, the second photo sensor 144 and the second lens. The distance l2 between the portions 134 is greater than the focal length f2 of the second lens portion 134.

圖7是概略性地表示其他例示性的實施例的聚光點檢測裝置的圖。Fig. 7 is a view schematically showing a light collecting point detecting device of another exemplary embodiment.

參照圖7,與圖5相同,可為第一光感測器142與第一透鏡部132之間的距離l1大於第一透鏡部132的焦點距離f1,第二光感測器144與第二透鏡部134之間的距離l2小於第二透鏡部134的焦點距離f2。如上所述,若距離l1與焦點距離f1之間的關係以及距離l2與焦點距離f2之間的關係彼此相反,則隨著聚光光學系統20與加工物30之間的距離發生變化而由第一光感測器142及第二光感測器144測定到的測定值會朝向不同方向發生變化。藉此,如下所述,可進一步明確地確認由第一光感測器142及第二光感測器144測定到的測定值。Referring to FIG. 7, as in FIG. 5, the distance l1 between the first photo sensor 142 and the first lens portion 132 may be greater than the focal length f1 of the first lens portion 132, and the second photo sensor 144 and the second The distance l2 between the lens portions 134 is smaller than the focal length f2 of the second lens portion 134. As described above, if the relationship between the distance l1 and the focal length f1 and the relationship between the distance l2 and the focal length f2 are opposite to each other, the distance between the collecting optical system 20 and the workpiece 30 changes. The measured values measured by one of the photo sensor 142 and the second photo sensor 144 may change in different directions. Thereby, the measured values measured by the first photo sensor 142 and the second photo sensor 144 can be more clearly confirmed as follows.

圖8是表示圖7所示的聚光光學系統20與加工物30之間的距離發生變化的例的圖。FIG. 8 is a view showing an example in which the distance between the collecting optical system 20 and the workpiece 30 shown in FIG. 7 is changed.

參照圖8,加工物30與聚光光學系統20之間的距離變得大於圖7所示的距離。因此,通過聚光光學系統20的加工束L1的聚光點可形成至加工物30的表面上。因加工束L1的聚光點形成至加工物30的表面上而於加工物30的表面反射的反射束L2入射至聚光光學系統20的角度會發生變化。另外,因入射至聚光光學系統20的反射束L2的角度發生變化而反射束L2入射至第一分束器110的角度亦會發生變化。並且,反射束L2入射至第二分束器120的角度亦會發生變化。如圖7所示,若加工束L1的聚光點位於加工物30的表面上,則與圖7的情形不同,由第二分束器110分割的第一反射束L21與第二反射束L22的光束尺寸會逐漸變小。另外,因此而第一反射束L21的聚光點與第一透鏡部132之間的距離f1'會變得小於第一透鏡部132的焦點距離f1。並且,第二反射束L22的聚光點與第二透鏡部134之間的距離f2'會變得小於第二透鏡部134的焦點距離f2。Referring to Fig. 8, the distance between the workpiece 30 and the collecting optics 20 becomes larger than the distance shown in Fig. 7. Therefore, the light collecting point of the processed beam L1 passing through the collecting optical system 20 can be formed onto the surface of the workpiece 30. The angle at which the reflected beam L2 reflected on the surface of the workpiece 30 is incident on the surface of the workpiece 30 due to the condensed spot of the processed beam L1 is incident on the collecting optical system 20 changes. Further, the angle at which the reflected beam L2 is incident on the first beam splitter 110 also changes due to a change in the angle of the reflected beam L2 incident on the collecting optical system 20. Further, the angle at which the reflected beam L2 is incident on the second beam splitter 120 also changes. As shown in FIG. 7, if the condensed spot of the processed beam L1 is located on the surface of the workpiece 30, the first reflected beam L21 and the second reflected beam L22 divided by the second beam splitter 110 are different from the case of FIG. The beam size will gradually become smaller. Further, therefore, the distance f1 ′ between the condensed spot of the first reflected beam L21 and the first lens portion 132 becomes smaller than the focal length f1 of the first lens portion 132 . Further, the distance f2' between the condensed spot of the second reflected beam L22 and the second lens portion 134 becomes smaller than the focal length f2 of the second lens portion 134.

第一反射束L21的聚光點與第一透鏡部132之間的距離f1'以及第一光感測器142與第一反射束L21的聚光點之間的距離t1'可變得大於圖7所示的距離t1。相反地,第二光感測器144與第二反射束L22的聚光點之間的距離t2'可變得小於圖7所示的距離t2。因此,若加工物30與聚光光學系統20之間的距離變小,則由第一光感測器142測定到的第一反射束L21的能量密度變小,相反地,由第二光感測器144測定到的第二反射束L22的能量密度會變大。The distance f1 ′ between the condensed spot of the first reflected beam L21 and the first lens portion 132 and the distance t1 ′ between the condensed point of the first photo sensor 142 and the first reflected beam L21 may become larger than the map. The distance t1 shown in 7. Conversely, the distance t2' between the second light sensor 144 and the light collecting point of the second reflected beam L22 may become smaller than the distance t2 shown in FIG. Therefore, if the distance between the workpiece 30 and the collecting optics 20 becomes smaller, the energy density of the first reflected beam L21 measured by the first photo sensor 142 becomes smaller, and conversely, the second light sensation The energy density of the second reflected beam L22 measured by the detector 144 becomes large.

圖9是表示圖7所示的聚光光學系統20與加工物30之間的距離發生變化的另一例的圖。FIG. 9 is a view showing another example of a change in the distance between the collecting optical system 20 and the workpiece 30 shown in FIG. 7.

參照圖9,加工物30與聚光光學系統20之間的距離變得小於圖7所示的距離。因此,通過聚光光學系統20的加工束L1於形成聚光點前,會於加工物30的表面反射。加工束L1於形成聚光點前在加工物30的表面反射而於加工物30的表面反射的反射束L2入射至聚光光學系統20的角度會發生變化。另外,因入射至聚光光學系統20的反射束L2的角度發生變化而反射束L2入射至第一分束器110的角度亦會發生變化。並且,反射束L2入射至第二分束器120的角度亦會發生變化。如圖8所示,加工束L1於形成聚光點前在加工物30的表面反射,則與圖7的情形不同,由第二分束器110分割的第一反射束L21與第二反射束L22的光束尺寸會逐漸變大。另外,因此而第一反射束L21的聚光點與第一透鏡部132之間的距離f1'會變得大於第一透鏡部132的焦點距離f1。並且,第二反射束L22的聚光點與第二透鏡部134之間的距離f2'會變得大於第二透鏡部134的焦點距離f2。Referring to Fig. 9, the distance between the workpiece 30 and the collecting optics 20 becomes smaller than the distance shown in Fig. 7. Therefore, the processed beam L1 passing through the collecting optical system 20 is reflected on the surface of the workpiece 30 before the condensed spot is formed. The angle at which the processed beam L1 is reflected on the surface of the workpiece 30 before the condensed spot is formed and the reflected beam L2 reflected on the surface of the workpiece 30 is incident on the collecting optical system 20 changes. Further, the angle at which the reflected beam L2 is incident on the first beam splitter 110 also changes due to a change in the angle of the reflected beam L2 incident on the collecting optical system 20. Further, the angle at which the reflected beam L2 is incident on the second beam splitter 120 also changes. As shown in FIG. 8, the processed beam L1 is reflected on the surface of the workpiece 30 before forming the condensed spot, and unlike the case of FIG. 7, the first reflected beam L21 and the second reflected beam are divided by the second beam splitter 110. The beam size of the L22 will gradually increase. Further, therefore, the distance f1' between the condensed spot of the first reflected beam L21 and the first lens portion 132 becomes larger than the focal length f1 of the first lens portion 132. Further, the distance f2' between the light collecting point of the second reflected beam L22 and the second lens portion 134 becomes larger than the focal length f2 of the second lens portion 134.

第一反射束L21的聚光點與第一透鏡部132之間的距離f1’以及第一光感測器142與第一反射束L21的聚光點之間的距離t1''可變得小於圖7所示的距離t1。相反地,第二光感測器144與第二反射束L22的聚光點之間的距離t2''可變得大於圖7所示的距離t2。因此,若加工物30與聚光光學系統20之間的距離變大,則由第一光感測器142測定到的第一反射束L21的能量密度變大,相反地,由第二光感測器144測定到的第二反射束L22的能量密度會變小。The distance f1' between the light collecting point of the first reflected beam L21 and the first lens portion 132 and the distance t1'' between the first light sensor 142 and the light collecting point of the first reflected beam L21 may become smaller than The distance t1 shown in Fig. 7. Conversely, the distance t2'' between the second light sensor 144 and the light collecting point of the second reflected beam L22 may become larger than the distance t2 shown in FIG. Therefore, if the distance between the workpiece 30 and the collecting optical system 20 becomes large, the energy density of the first reflected beam L21 measured by the first photo sensor 142 becomes large, and conversely, the second light sensation The energy density of the second reflected beam L22 measured by the detector 144 becomes small.

圖10是表示由第一光感測器142測定到的第一反射束L21的能量密度與第二反射束L22的能量密度的變化的曲線圖。於圖10中,橫軸表示聚光光學系統20與加工物30之間的距離變化。於橫軸上,0點表示加工束L1的聚光點形成至加工物30的表面的時點。於橫軸上,“-”值是指聚光光學系統20與加工物30之間的距離變得小於0點位置,“+”值是指聚光光學系統20與加工物30之間的距離變得大於0點位置。並且,縱軸表示光束的能量密度。於圖9中,S1曲線圖表示由第一光感測器142測定到的第一反射束L21的能量密度,S2曲線圖表示由第二光感測器144測定到的第二反射束L22的能量密度。並且,S1-S2表示第一光感測器142的測定值與第二光感測器的測定值之間的差。FIG. 10 is a graph showing changes in the energy density of the first reflected beam L21 and the energy density of the second reflected beam L22 measured by the first photo sensor 142. In FIG. 10, the horizontal axis represents the change in the distance between the collecting optical system 20 and the workpiece 30. On the horizontal axis, 0 point indicates the time point at which the condensed spot of the processed beam L1 is formed to the surface of the workpiece 30. On the horizontal axis, the "-" value means that the distance between the collecting optics 20 and the workpiece 30 becomes less than 0 o'clock, and the "+" value refers to the distance between the collecting optics 20 and the workpiece 30. It becomes larger than 0 o'clock. Also, the vertical axis represents the energy density of the light beam. In FIG. 9, the S1 graph represents the energy density of the first reflected beam L21 measured by the first photo sensor 142, and the S2 graph represents the second reflected beam L22 measured by the second photo sensor 144. Energy Density. Further, S1-S2 represents the difference between the measured value of the first photo sensor 142 and the measured value of the second photo sensor.

參照圖10,隨著聚光光學系統20與加工物30之間的距離變小而由第一光感測器142測定到的第一反射束L21的能量密度變小,相反地,由第二光感測器144測定到的第二反射束L22的能量密度會變大。並且,隨著聚光光學系統20與加工物30之間的距離變大,由第一光感測器142測定到的第一反射束L21的能量密度變大,相反地,由第二光感測器144測定到的第二反射束L22的能量密度會變小。如圖9所示,由第一光感測器142及第二光感測器144測定到的第一反射束L21及第二反射束L22的能量密度依存於聚光光學系統20與加工物30之間的距離。因此,可根據第一反射束L21及第二反射束L22的能量密度測定值而確定聚光光學系統20相對於加工物30的相對位置。Referring to Fig. 10, as the distance between the collecting optical system 20 and the workpiece 30 becomes smaller, the energy density of the first reflected beam L21 measured by the first photo sensor 142 becomes smaller, and conversely, by the second The energy density of the second reflected beam L22 measured by the photo sensor 144 becomes large. Further, as the distance between the collecting optical system 20 and the workpiece 30 becomes larger, the energy density of the first reflected beam L21 measured by the first photo sensor 142 becomes larger, and conversely, the second light sensation The energy density of the second reflected beam L22 measured by the detector 144 becomes small. As shown in FIG. 9 , the energy densities of the first reflected beam L21 and the second reflected beam L22 measured by the first photo sensor 142 and the second photo sensor 144 are dependent on the collecting optics 20 and the processed object 30 . the distance between. Therefore, the relative position of the collecting optical system 20 with respect to the workpiece 30 can be determined based on the energy density measurement values of the first reflected beam L21 and the second reflected beam L22.

例示性地,為了確定聚光光學系統20的位置,可觀察第一反射束L21的能量密度測定值與第二反射束L22的能量密度測定值之間的差。觀察曲線圖S1-S2可知,隨著橫軸值自橫軸的0點發生變化而縱軸值敏感地發生變化。其原因在於,曲線圖S1及曲線圖S2分別相對於橫軸朝向不同方向發生變化。即,如圖7至圖9所示,若不同地配置第一光感測器142與第二光感測器144的位置,則隨著加工物30與聚光光學系統20之間的距離發生變化而第一光感測器142的測定值與第二光感測器144的測定值朝向不同方向發生變化,故而可容易地確認第一光感測器142的測定值與第二光感測器144的測定值之間的差值。Illustratively, in order to determine the position of the collecting optical system 20, the difference between the measured value of the energy density of the first reflected beam L21 and the measured value of the energy density of the second reflected beam L22 can be observed. Observing the graphs S1-S2, it can be seen that the vertical axis value is sensitively changed as the horizontal axis value changes from the zero point of the horizontal axis. The reason for this is that the graph S1 and the graph S2 change in different directions with respect to the horizontal axis, respectively. That is, as shown in FIGS. 7 to 9, if the positions of the first photo sensor 142 and the second photo sensor 144 are differently arranged, the distance between the workpiece 30 and the collecting optics 20 occurs. The measured value of the first photo sensor 142 and the measured value of the second photo sensor 144 are changed in different directions, so that the measured value of the first photo sensor 142 and the second photo sensing can be easily confirmed. The difference between the measured values of 144.

於圖10中,例示性地表示第一光感測器142的測定值與第二光感測器144的測定值的曲線圖S1-S2,但實施例並不限制於此。例如,亦可根據第一光感測器142的測定值與第二光感測器144的測定值之間的比率而確定聚光光學系統20的位置。除此之外,對第一光感測器142的測定值與第二光感測器144的測定值進行比較的方法可於對業者而言較為容易的水準下實現各種變更。In FIG. 10, a graph S1-S2 of the measured value of the first photo sensor 142 and the measured value of the second photo sensor 144 is exemplarily shown, but the embodiment is not limited thereto. For example, the position of the collecting optics 20 may also be determined based on the ratio between the measured value of the first photo sensor 142 and the measured value of the second photo sensor 144. In addition, the method of comparing the measured value of the first photo sensor 142 with the measured value of the second photo sensor 144 can achieve various changes at a level that is easier for the operator.

如圖5至圖9所示,若聚光點檢測裝置將反射束分割成兩個以上,則於檢測加工束的聚光點時,可除聚光光學系統20與加工物30之間的距離以外排除其他雜訊因素。例如,如圖1至圖4所示,於聚光點檢測裝置僅包括第一光感測器142的情形時,由第一光感測器142測定到的反射束L2的能量密度除聚光光學系統20與加工物30之間的距離以外,亦會因其他雜訊因素而發生變化。例如,由第一光感測器142測定到的反射束L2的能量密度會因由光源10出射的加工束L1的強度變化、雷射束行進路徑上的異物、加工物30的反射度差異等而發生變化。然而,如圖5至圖8所示,將反射束L2分割成兩個以上而觀察由第一光感測器142測定到的第一反射束L21的能量密度與由第二光感測器144測定到的第二反射束L22的能量密度的差異可知,可抵消上述的雜訊因素。As shown in FIGS. 5 to 9, if the condensed spot detecting device divides the reflected beam into two or more, the distance between the concentrating optical system 20 and the workpiece 30 can be removed when detecting the condensed spot of the processed beam. Exclude other noise factors. For example, as shown in FIG. 1 to FIG. 4, when the concentrating point detecting device includes only the first photo sensor 142, the energy density of the reflected beam L2 measured by the first photo sensor 142 is divided by the condensing light. In addition to the distance between the optical system 20 and the workpiece 30, it also changes due to other noise factors. For example, the energy density of the reflected beam L2 measured by the first photo sensor 142 may vary depending on the intensity of the processed beam L1 emitted from the light source 10, the foreign matter on the path of the laser beam travel, the difference in reflectance of the workpiece 30, and the like. A change has occurred. However, as shown in FIGS. 5 to 8, the reflected beam L2 is divided into two or more to observe the energy density of the first reflected beam L21 measured by the first photo sensor 142 and by the second photo sensor 144. The difference in energy density of the measured second reflected beam L22 can be used to cancel the above-mentioned noise factor.

圖11及圖12是表示圖5所示的聚光光學系統20的變形例的圖。11 and 12 are views showing a modification of the collecting optical system 20 shown in Fig. 5.

參照圖11,聚光光學系統20可包括多個透鏡22、24、26。於圖11中,表示聚光光學系統20包括兩個凸透鏡24、26及一個凹透鏡22的情形,但實施例並不限制於此。可變更可包括於聚光光學系統20的透鏡種類及個數。並且,參照圖12,聚光光學系統20亦可包括變更加工束L1的路徑與尺寸的掃描儀21、23、及改變加工束L1的尺寸的透鏡25。如圖12所示,聚光光學系統20可不將加工束L1聚光至加工物30,進一步增大加工束L1的尺寸而形成平行光來發射。於該情形時,實施例的聚光點檢測裝置可用於診斷入射至加工物30的加工束L1的尺寸及加工束L1是否成為平行光等。Referring to FIG. 11, the collecting optical system 20 may include a plurality of lenses 22, 24, 26. In Fig. 11, the case where the collecting optical system 20 includes the two convex lenses 24, 26 and one concave lens 22 is shown, but the embodiment is not limited thereto. The type and number of lenses that can be included in the collecting optical system 20 can be changed. Further, referring to Fig. 12, the collecting optical system 20 may include scanners 21 and 23 that change the path and size of the processed beam L1, and a lens 25 that changes the size of the processed beam L1. As shown in FIG. 12, the collecting optical system 20 can condense the processed beam L1 to the workpiece 30, further increase the size of the processed beam L1 to form parallel light for emission. In this case, the condensing point detecting device of the embodiment can be used to diagnose the size of the processed beam L1 incident on the workpiece 30 and whether the processed beam L1 becomes parallel light or the like.

圖13是概略性地表示其他例示性的實施例的聚光點檢測裝置的圖。Fig. 13 is a view schematically showing a light collecting point detecting device of another exemplary embodiment.

參照圖13,聚光點檢測裝置可更包括變更第二反射束L22的進行方向的第3分束器123及向第3分束器123出射測定用光束L3的測定用光源150。於圖5所示的實施例中,利用加工束L1於加工物30反射的情形,於圖13中,可加強該情形而由測定用光源150連同加工束L1一併出射入射至加工物30的測定用光束L3。於該情形時,若不同地設定測定用光束L3的波長與加工束L1的波長,則可更有效地構成第一分束器110。第一分束器110以使加工束L1全部透射而僅選擇性地反射測定用光束L3的方式構成,可提高出射加工束L1的光源10的能量效率。第一分束器110可將測定用光束L3全部反射,亦可僅反射測定用光束L3的一部分而使剩餘光束透射。Referring to Fig. 13, the concentrating point detecting device may further include a third beam splitter 123 that changes the direction in which the second reflected beam L22 is traveling, and a measuring light source 150 that emits the measuring beam L3 to the third beam splitter 123. In the embodiment shown in FIG. 5, in the case where the processed beam L1 is reflected by the workpiece 30, in FIG. 13, the situation can be enhanced and the measurement light source 150 is emitted together with the processed beam L1 to be incident on the workpiece 30. The measuring light beam L3. In this case, if the wavelength of the measurement light beam L3 and the wavelength of the processed beam L1 are set differently, the first beam splitter 110 can be configured more efficiently. The first beam splitter 110 is configured such that all of the processed beam L1 is transmitted and only the measurement light beam L3 is selectively reflected, and the energy efficiency of the light source 10 that emits the processed beam L1 can be improved. The first beam splitter 110 can totally reflect the measurement light beam L3, or can reflect only a part of the measurement light beam L3 and transmit the remaining light beam.

於圖5至圖9中,由第二分束器120分割的第一反射束L21與第二反射束L22分別於第一透鏡部132及第二透鏡部134聚焦。然而,於將反射束L2分割成兩個的情形時,聚光點檢測裝置亦可僅包括一個透鏡部。In FIGS. 5 to 9, the first reflected beam L21 and the second reflected beam L22 divided by the second beam splitter 120 are focused on the first lens portion 132 and the second lens portion 134, respectively. However, in the case where the reflected beam L2 is divided into two, the condensed spot detecting device may include only one lens portion.

圖14是概略性地表示其他例示性的實施例的聚光點檢測裝置的圖。Fig. 14 is a view schematically showing a light collecting point detecting device of another exemplary embodiment.

參照圖14,第一透鏡部132可設置至第一分束器110與第二分束器120之間。另外,第二分束器120可將由第一透鏡部132聚焦的反射束L2分割成第一反射束L21與第二反射束L22。並且,聚光點檢測裝置可包括轉換第二反射束L22的方向的鏡面122。雖未圖示,但亦可省略鏡面122的構成。如圖14所示,若將第一透鏡部132設置至第一分束器110與第二分束器120之間,則無需為了聚焦第二反射束L22而另外包括第二透鏡部134。因此,聚光點檢測裝置的構成會進一步變簡單。Referring to FIG. 14, the first lens portion 132 may be disposed between the first beam splitter 110 and the second beam splitter 120. In addition, the second beam splitter 120 may divide the reflected beam L2 focused by the first lens portion 132 into the first reflected beam L21 and the second reflected beam L22. Also, the condensed spot detecting means may include a mirror surface 122 that converts the direction of the second reflected beam L22. Although not shown, the configuration of the mirror surface 122 may be omitted. As shown in FIG. 14, if the first lens portion 132 is disposed between the first beam splitter 110 and the second beam splitter 120, it is not necessary to additionally include the second lens portion 134 in order to focus the second reflected beam L22. Therefore, the configuration of the concentrating point detecting device is further simplified.

以上,參照圖1至圖14,對例示性的實施例的聚光點檢測裝置進行了說明。根據上述實施例,將於加工物30反射的反射束L2聚焦,並測定所聚焦的反射束L2的能量密度,藉此可檢測加工束L1形成聚光點的位置。於該情形時,測定所聚焦的反射束L2的能量密度,而並非測定反射束L2的路徑本身,故而即便發生聚光光學系統20的應變、加工物30的位置變動等,亦可穩定地檢測加工束L1的聚光點位置。並且,若藉由第二分束器110將反射束L2分割成第一反射束L21與第二反射束L22,則除加工物30與聚光光學系統20之間的距離變化以外,可抵消其他雜訊因素。並且,藉由適當地調節第一光感測器142與第二光感測器144的位置,可使由第一光感測器142測定到的測定值與由第二光感測器144測定到的測定值的差異隨聚光光學系統20與加工物30之間的距離變化敏感地改變。The concentrating point detecting device of the exemplary embodiment has been described above with reference to Figs. 1 to 14 . According to the above embodiment, the reflected beam L2 reflected by the workpiece 30 is focused, and the energy density of the focused reflected beam L2 is measured, whereby the position at which the processed beam L1 forms the focused spot can be detected. In this case, the energy density of the focused reflected beam L2 is measured, and the path of the reflected beam L2 is not measured. Therefore, even if the strain of the collecting optical system 20 or the positional variation of the processed object 30 occurs, the detection can be stably performed. The spot position of the bundle L1 is processed. Moreover, if the reflected beam L2 is divided into the first reflected beam L21 and the second reflected beam L22 by the second beam splitter 110, the distance between the processed object 30 and the collecting optical system 20 can be offset, and the other can be offset. Noise factor. Moreover, by appropriately adjusting the positions of the first photo sensor 142 and the second photo sensor 144, the measured value measured by the first photo sensor 142 can be determined by the second photo sensor 144. The difference in the measured values obtained varies sensitively with the change in the distance between the collecting optics 20 and the workpiece 30.

以上,對例示性的實施例的聚光點檢測裝置進行了說明。以下,對包括聚光點檢測裝置的雷射加工裝置進行說明。如圖1至圖14所示,雷射加工裝置可包括聚光點檢測裝置、光源10及聚光光學系統20而構成。可根據由光感測器測定到的反射束的能量密度而確定聚光光學系統20的位置。聚光光學系統20的位置可手動調節,亦可藉由聚光點檢測裝置而自動調節。於自動調節聚光光學系統20的位置的情形時,圖1至圖14所示的聚光點檢測裝置可作為自動對焦單元而作動。The concentrating point detecting device of the exemplary embodiment has been described above. Hereinafter, a laser processing apparatus including a light collecting point detecting device will be described. As shown in FIGS. 1 to 14, the laser processing apparatus may include a light collecting point detecting device, a light source 10, and a collecting optical system 20. The position of the collecting optics 20 can be determined based on the energy density of the reflected beam measured by the photo sensor. The position of the collecting optics 20 can be manually adjusted or automatically adjusted by the concentrating point detecting device. In the case where the position of the collecting optical system 20 is automatically adjusted, the light collecting point detecting device shown in Figs. 1 to 14 can be operated as an autofocus unit.

於圖1至圖14中,表示將加工束L1的聚光點形成至加工物30的表面的對準(targeting)情況,但實施例並不限制於此。實施例的雷射加工裝置亦可利用聚光點檢測裝置於加工物30的內部形成加工束L1的聚光點。In FIGS. 1 to 14, the case where the condensed spot of the processed beam L1 is formed to the surface of the workpiece 30 is shown, but the embodiment is not limited thereto. The laser processing apparatus of the embodiment can also form a condensed spot of the processed beam L1 inside the workpiece 30 by using the condensed spot detecting device.

圖15是例示性的實施例的雷射加工裝置於加工物30內部形成加工束L1的聚光點的例的圖。Fig. 15 is a view showing an example in which the laser processing apparatus of the exemplary embodiment forms a light collecting point of the processed beam L1 inside the workpiece 30.

參照圖15,實施例的雷射加工裝置可包括:光源10,其向加工物30出射用於雷射加工的加工束L1;聚光光學系統20,其將加工束L1聚光;及自動對焦單元,其對上述聚光光學系統的位置進行調節,以使加工束L1的聚光點形成至上述加工物的內部。上述自動對焦單元可如上述聚光點檢測裝置般實現。於圖15中,作為自動對焦單元的實施例而表示圖7至圖9所示的聚光點檢測裝置,但實施例並不限制於此。可包括於雷射加工裝置的自動對焦單元可應用參照圖1至圖14而進行說明的所有實施例。Referring to Fig. 15, the laser processing apparatus of the embodiment may include a light source 10 that emits a processed beam L1 for laser processing to the workpiece 30, a collecting optical system 20 that condenses the processed beam L1, and an autofocus And a unit that adjusts a position of the concentrating optical system to form a condensed spot of the processed beam L1 to the inside of the processed object. The above autofocus unit can be implemented as the above-described concentrating point detecting device. In Fig. 15, the condensed spot detecting device shown in Figs. 7 to 9 is shown as an embodiment of the autofocus unit, but the embodiment is not limited thereto. All of the embodiments described with reference to Figs. 1 through 14 can be applied to the autofocus unit that can be included in the laser processing apparatus.

通過聚光光學系統20的加工束L1中的至少一部分可行進至加工物30的內部。另外,加工束L1中的其他部分可於加工物30的表面反射。為了使加工束L1於加工物30的內部形成聚光點P,聚光光學系統20與加工物30之間的距離可小於圖5所示的距離。自動對焦單元的第一光感測器142及第二光感測器144可分別測定第一反射束L21及第二反射束L22的能量密度。自動對焦單元可基於由第一光感測器142及第二光感測器144測定到的能量密度而對聚光光學系統20的位置進行調節,以使加工束L1的聚光點P形成至加工物30的內部。At least a portion of the processed bundle L1 passing through the collecting optics 20 can travel to the inside of the workpiece 30. Additionally, other portions of the processed beam L1 may be reflected at the surface of the workpiece 30. In order for the processed beam L1 to form the condensed spot P inside the workpiece 30, the distance between the concentrating optical system 20 and the workpiece 30 may be smaller than the distance shown in FIG. The first photo sensor 142 and the second photo sensor 144 of the autofocus unit can measure the energy density of the first reflected beam L21 and the second reflected beam L22, respectively. The autofocus unit may adjust the position of the collecting optics 20 based on the energy density measured by the first photo sensor 142 and the second photo sensor 144 to form the converging point P of the processed beam L1 to The inside of the workpiece 30.

圖16是放大表示於圖15所示的加工物30內部形成加工束L1的聚光點P的圖。FIG. 16 is an enlarged view of the light-converging point P in which the processed beam L1 is formed inside the workpiece 30 shown in FIG. 15.

參照圖16,入射於加工物30的加工束L1的一部分被反射而作為反射束L2返回,其他部分成為向加工物30的內部行進的透射束L1'而可於加工物30的內部形成聚光點P。此時,反射束L2形成聚光點的高度d1與於加工物的內部形成聚光點P的深度d2之間可滿足如下數式。Referring to Fig. 16, a part of the processed beam L1 incident on the workpiece 30 is reflected and returned as the reflected beam L2, and the other portion becomes a transmitted beam L1' that travels inside the workpiece 30 to form a condensed light inside the workpiece 30. Point P. At this time, the following equation can be satisfied between the height d1 at which the reflected beam L2 forms a condensed spot and the depth d2 at which the condensed spot P is formed inside the workpiece.

[數式1][Expression 1]

d2=n*d1D2=n*d1

此處,n表示加工物30內部的折射率。並且,加工物30外部的折射率假設為空氣的折射率即1。因此,上述數式1僅為示例,實施例並非必須限制於此。由於加工物30與加工物30外部的折射率不同,故而根據斯奈爾定律,反射束L2的反射角與透射束L1'的透射角會發生變化。因此,反射束L2於加工物的內部形成聚光點P的深度d2會大於形成聚光點的高度d1。Here, n represents the refractive index inside the workpiece 30. Further, the refractive index outside the workpiece 30 is assumed to be 1, that is, the refractive index of air. Therefore, the above formula 1 is merely an example, and the embodiment is not necessarily limited thereto. Since the refractive index of the workpiece 30 and the outside of the workpiece 30 are different, according to Snell's law, the reflection angle of the reflection beam L2 and the transmission angle of the transmission beam L1' change. Therefore, the depth d2 at which the reflection beam L2 forms the converging point P inside the workpiece is larger than the height d1 at which the converging point is formed.

實際上,由自動聚焦裝置的光感測器142、144檢測到的能量密度與反射束L2對應。因此,由自動聚焦裝置的光感測器142、144檢測到的能量密度值會依存於反射束L2的聚光點高度d1。然而,反射束L2的聚光點高度d1與於加工物的內部形成聚光點P的深度d2之間可滿足如上所述的數式1。因此,實施例的雷射加工裝置為了於加工物30的內部形成加工束L1的聚光點,不僅考慮由自動對焦單元的光感測器142、144測定到的能量密度,而且亦可一同考慮折射率。即,可根據由第一光感測器142及第二光感測器144測定到的第一反射束L21及第二反射束L22的能量密度與加工物30的折射率而確定聚光光學系統20的位置。In fact, the energy density detected by the photo sensors 142, 144 of the autofocus device corresponds to the reflected beam L2. Therefore, the energy density value detected by the photosensors 142, 144 of the autofocus device depends on the spot height d1 of the reflected beam L2. However, between the condensing point height d1 of the reflected beam L2 and the depth d2 at which the inside of the workpiece forms the condensing point P, the formula 1 as described above can be satisfied. Therefore, in order to form the condensed spot of the processed beam L1 in the inside of the workpiece 30, the laser processing apparatus of the embodiment considers not only the energy density measured by the photosensors 142, 144 of the autofocus unit but also the same. Refractive index. That is, the concentrating optical system can be determined according to the energy density of the first reflected beam L21 and the second reflected beam L22 measured by the first photo sensor 142 and the second photo sensor 144 and the refractive index of the workpiece 30. 20 location.

圖17是表示於其他例示性的實施例的雷射加工裝置中,隨著聚光點於加工物30內部的位置發生變化而變更第一光感測器142的位置的例的圖。FIG. 17 is a view showing an example in which the position of the first photosensor 142 is changed as the position of the condensing point changes inside the workpiece 30 in the laser processing apparatus according to another exemplary embodiment.

參照圖17,加工束L1的聚光點P1、P2、P3形成至上述加工物內部的深度越深,則第一透鏡部132與第一光感測器142之間的距離亦會越大。如圖17,於構成第一透鏡部132與第一光感測器142時,當第一光感測器142於通過第一透鏡部132的反射束的聚光點附近發生位置變化時,第一光感測器142的測定值的變化率會最大。然而,若使加工束L1的聚光點P1、P2、P3的形成深度變大,則通過第一透鏡部132的反射束的聚光點位置會發生變化。因此,若隨著加工束L1的聚光點P1、P2、P3的目標部位發生變化而變更第一光感測器142的位置,則可更容易地確認加工束L1的聚光點P1、P2、P3是否到達目標部位。Referring to Fig. 17, the deeper the depths of the condensed spots P1, P2, P3 of the processed beam L1 to the inside of the workpiece, the greater the distance between the first lens portion 132 and the first photo sensor 142. As shown in FIG. 17, when the first lens portion 132 and the first photo sensor 142 are configured, when the first photo sensor 142 changes position near the condensing point of the reflected beam passing through the first lens portion 132, The rate of change of the measured value of a photo sensor 142 is maximized. However, when the formation depth of the condensed points P1, P2, and P3 of the processed beam L1 is increased, the position of the condensed spot of the reflected beam passing through the first lens portion 132 changes. Therefore, when the position of the first photo sensor 142 is changed as the target portion of the condensed points P1, P2, and P3 of the processed beam L1 changes, the condensed spots P1 and P2 of the processed beam L1 can be more easily confirmed. Whether P3 reaches the target site.

例如,於加工束L1的聚光點P1形成至加工物30的表面時,通過第一透鏡部132的反射束L21a的聚光點會相對更接近第一透鏡部132。因此,第一光感測器142的位置K1亦可設定為接近第一透鏡部132。作為其他例,於加工束L1的聚光點P2形成至加工物30的內部時,通過第一透鏡部132的反射束L21b的聚光點會相對遠離第一透鏡部132。因此,第一光感測器142的位置K2亦會較上述位置K1更遠離第一透鏡部132。作為其他例,於加工束L1的聚光點P3形成至加工物30內部的更深處時,通過第一透鏡部132的反射束L21c的聚光點會相對遠離第一透鏡部132。因此,第一光感測器142的位置K3亦會較上述位置K1、K2更遠離第一透鏡部132。For example, when the condensing point P1 of the processed beam L1 is formed to the surface of the workpiece 30, the condensed point of the reflected beam L21a passing through the first lens portion 132 is relatively closer to the first lens portion 132. Therefore, the position K1 of the first photo sensor 142 can also be set to be close to the first lens portion 132. As another example, when the condensing point P2 of the processed beam L1 is formed inside the workpiece 30, the condensed point of the reflected beam L21b passing through the first lens portion 132 is relatively distant from the first lens portion 132. Therefore, the position K2 of the first photo sensor 142 is also farther away from the first lens portion 132 than the above position K1. As another example, when the condensing point P3 of the processed beam L1 is formed deeper inside the workpiece 30, the condensed point of the reflected beam L21c passing through the first lens portion 132 is relatively far from the first lens portion 132. Therefore, the position K3 of the first photo sensor 142 is also further away from the first lens portion 132 than the above positions K1, K2.

圖18是表示於其他例示性的實施例的雷射加工裝置中,隨著聚光點P1、P2、P3於加工物30內部的位置發生變化而變更第一光感測器142及第二光感測器144的位置的例的圖。18 is a view showing a laser processing apparatus according to another exemplary embodiment in which the first photosensor 142 and the second light are changed as the positions of the condensing points P1, P2, and P3 change within the workpiece 30. A diagram of an example of the position of the sensor 144.

參照圖18,與圖17所示的第一透鏡部132相同,第二光感測器144的位置K1、K2、K3亦會隨著加工束L1的聚光點P3的深度變深而更遠離第二透鏡部134。Referring to Fig. 18, as with the first lens portion 132 shown in Fig. 17, the positions K1, K2, and K3 of the second photo sensor 144 are further apart as the depth of the converging point P3 of the processed beam L1 becomes deeper. The second lens portion 134.

例如,於加工束L1的聚光點P1形成至加工物30的表面時,通過第二透鏡部134的第二反射束L22a的聚光點會相對接近第二透鏡部134。因此,第二光感測器144的位置J1亦可設定為接近第二透鏡部134。作為其他例,於加工束L1的聚光點P2形成至加工物30的內部時,通過第二透鏡部134的反射束L22b的聚光點會相對遠離第二透鏡部134。因此,第二光感測器144的位置J2亦會較上述位置J1更遠離第二透鏡部134。作為其他例,於加工束L1的聚光點P3形成至加工物30內部的更深處時,通過第一透鏡部132的反射束L22c的聚光點會相對遠離第二透鏡部134。因此,第二光感測器144的位置J3亦會較上述位置J1、J2更遠離第二透鏡部134。For example, when the condensing point P1 of the processed beam L1 is formed to the surface of the workpiece 30, the condensed point of the second reflected beam L22a passing through the second lens portion 134 is relatively close to the second lens portion 134. Therefore, the position J1 of the second photo sensor 144 can also be set to be close to the second lens portion 134. As another example, when the condensing point P2 of the processed beam L1 is formed inside the workpiece 30, the condensed point of the reflected beam L22b passing through the second lens portion 134 is relatively far from the second lens portion 134. Therefore, the position J2 of the second photo sensor 144 is also farther away from the second lens portion 134 than the above position J1. As another example, when the condensing point P3 of the processed beam L1 is formed deeper inside the workpiece 30, the condensed point of the reflected beam L22c passing through the first lens portion 132 is relatively far from the second lens portion 134. Therefore, the position J3 of the second photo sensor 144 is also farther away from the second lens portion 134 than the above positions J1, J2.

圖19是表示於其他例示性的實施例的雷射加工裝置中,隨著聚光點於加工物30內部的位置發生變化而變更第一透鏡部142的位置的例的圖。FIG. 19 is a view showing an example in which the position of the first lens portion 142 is changed as the position of the condensing point changes inside the workpiece 30 in the laser processing apparatus according to another exemplary embodiment.

參照圖19,即便加工束L1形成聚光點P1、P2、P3的深度發生變化,藉由調節第一透鏡部132的位置,亦可幾乎固定地保持通過第一透鏡部132的反射束L21a、L21b、L21c形成聚光點的位置。Referring to Fig. 19, even if the depth at which the processed beam L1 forms the condensed points P1, P2, and P3 changes, by adjusting the position of the first lens portion 132, the reflected beam L21a passing through the first lens portion 132 can be almost fixedly held, L21b and L21c form a position of a light collecting point.

例如,於加工束L1的聚光點P1形成至加工物30的表面時,第一透鏡部132的位置A1會相對接近第一分束器110。作為其他例,於加工束L1的聚光點P2形成至加工物30的內部時,第一透鏡部132的位置A2會較上述位置A1相對遠離第一分束器110。作為其他例,若加工束L1的聚光點P3形成至加工物30內部的深度變大,則第一透鏡部132的位置A3會較上述位置A1、A2更遠離第一分束器110。For example, when the condensing point P1 of the processed beam L1 is formed to the surface of the workpiece 30, the position A1 of the first lens portion 132 is relatively close to the first beam splitter 110. As another example, when the condensing point P2 of the processed beam L1 is formed inside the workpiece 30, the position A2 of the first lens portion 132 is relatively farther from the first beam splitter 110 than the above position A1. As another example, when the depth of the concentrated spot P3 of the processed beam L1 is increased to the inside of the workpiece 30, the position A3 of the first lens portion 132 is further away from the first beam splitter 110 than the positions A1 and A2.

如上所述,藉由變更第一透鏡部132的位置,即便加工束L1的聚光點的目標位置發生變化,亦可不改變第一光感測器142的位置。As described above, by changing the position of the first lens portion 132, the position of the first photo sensor 142 is not changed even if the target position of the condensed spot of the processed beam L1 changes.

圖20是表示於其他例示性的實施例的雷射加工裝置中,隨著聚光點P1、P2、P3於加工物30內部的位置發生變化而變更第一透鏡部132及第二透鏡部134的位置的例的圖。FIG. 20 is a view showing a laser processing apparatus according to another exemplary embodiment in which the first lens portion 132 and the second lens portion 134 are changed as the positions of the light collecting points P1, P2, and P3 change inside the workpiece 30. Diagram of the example of the location.

參照圖20,即便加工束L1形成聚光點P1、P2、P3的深度發生變化,藉由調節第一透鏡部132的位置,亦可幾乎固定地保持通過第二透鏡部134的反射束L22a、L22b、L22c形成聚光點的位置。Referring to Fig. 20, even if the depth at which the processed beam L1 forms the condensed points P1, P2, P3 changes, by adjusting the position of the first lens portion 132, the reflected beam L22a passing through the second lens portion 134 can be almost fixedly held, L22b and L22c form a position of a light collecting point.

例如,於加工束L1的聚光點P1形成至加工物30的表面時,第二透鏡部134的位置B1會相對接近鏡面122。作為其他例,於加工束L1的聚光點P2形成至加工物30的內部時,第二透鏡部134的位置B2會較上述位置B1相對遠離鏡面122。作為其他例,若加工束L1的聚光點P3形成至加工物30內部的深度變大,則第一透鏡部132的位置B3會較上述位置B1、B2更遠離第一分束器110。For example, when the condensing point P1 of the processed beam L1 is formed to the surface of the workpiece 30, the position B1 of the second lens portion 134 is relatively close to the mirror surface 122. As another example, when the condensing point P2 of the processed beam L1 is formed inside the workpiece 30, the position B2 of the second lens portion 134 is relatively far from the mirror surface 122 from the above position B1. As another example, when the depth of the concentrated spot P3 of the processed beam L1 is increased to the inside of the workpiece 30, the position B3 of the first lens portion 132 is further away from the first beam splitter 110 than the positions B1 and B2.

如上所述,藉由變更第二透鏡部134的位置,即便加工束L1的聚光點P1、P2、P3的目標位置發生變化,亦可不改變第二光感測器144的位置。As described above, by changing the position of the second lens portion 134, the position of the second photo sensor 144 is not changed even if the target position of the light collecting points P1, P2, and P3 of the processed beam L1 changes.

圖21是表示圖19所示的第一透鏡部132的變形例的圖。FIG. 21 is a view showing a modification of the first lens portion 132 shown in FIG. 19.

參照圖21,第一透鏡部132可包括多個透鏡。第一透鏡部132可藉由對包括於第一透鏡部132的透鏡132a、132b、132c之間的距離進行調節而固定地保持通過第一透鏡部132的反射束L21a、L21b、L21c的聚光點位置。例如,第一透鏡部132可包括兩個凸透鏡132a、132c及設置至兩個凸透鏡132a、132c之間的凹透鏡132b。第一透鏡部132可調節透鏡之間的距離h1、h2。例如,隨著加工束L1形成聚光點P1、P2、P3的深度變大,入射至第一透鏡部132的反射束L21a、L21b、L21c的尺寸會變大。因此,第一透鏡部132可為加工束L1形成聚光點P1、P2、P3的深度越大,則使第一凸透鏡132a與凹透鏡132b之間的距離h1越大,且使凹透鏡132b與第二凸透鏡132b之間的距離h2越小。Referring to FIG. 21, the first lens portion 132 may include a plurality of lenses. The first lens portion 132 can fixedly condense the reflected beams L21a, L21b, L21c passing through the first lens portion 132 by adjusting the distance between the lenses 132a, 132b, 132c included in the first lens portion 132. Point location. For example, the first lens portion 132 may include two convex lenses 132a, 132c and a concave lens 132b disposed between the two convex lenses 132a, 132c. The first lens portion 132 can adjust the distances h1, h2 between the lenses. For example, as the depth at which the processed beam L1 forms the condensed points P1, P2, and P3 becomes larger, the sizes of the reflected beams L21a, L21b, and L21c incident on the first lens portion 132 become larger. Therefore, the greater the depth at which the first lens portion 132 can form the condensed points P1, P2, P3 for the processed beam L1, the larger the distance h1 between the first convex lens 132a and the concave lens 132b, and the concave lens 132b and the second lens The smaller the distance h2 between the convex lenses 132b.

於圖21中,表示第一透鏡部132包括兩個凸透鏡132a、132c及一個凹透鏡132b的例,但實施例並不限制於此。例如,亦可於可由業者容易地變更的水準下變更可包括於第一透鏡部132的透鏡種類及個數。In FIG. 21, an example in which the first lens portion 132 includes two convex lenses 132a and 132c and one concave lens 132b is shown, but the embodiment is not limited thereto. For example, the type and number of lenses that can be included in the first lens portion 132 can be changed at a level that can be easily changed by the operator.

圖22是表示圖20所示的第一透鏡部132及第二透鏡部134的變形例的圖。FIG. 22 is a view showing a modification of the first lens portion 132 and the second lens portion 134 shown in FIG. 20 .

參照圖22,第一透鏡部132及第二透鏡部134可包括多個透鏡。第一透鏡部132可藉由對包括於第一透鏡部132的透鏡132a、132b、132c之間的距離進行調節而固定地保持通過第一透鏡部132的反射束L21a、L21b、L21c的聚光點位置。並且,第二透鏡部134可藉由對包括於第二透鏡部134的透鏡134a、134b、134c之間的距離進行調節而固定地保持通過第二透鏡部134的反射束L22a、L22b、L22c的聚光點位置。Referring to FIG. 22, the first lens portion 132 and the second lens portion 134 may include a plurality of lenses. The first lens portion 132 can fixedly condense the reflected beams L21a, L21b, L21c passing through the first lens portion 132 by adjusting the distance between the lenses 132a, 132b, 132c included in the first lens portion 132. Point location. Further, the second lens portion 134 can fixedly hold the reflected beams L22a, L22b, L22c passing through the second lens portion 134 by adjusting the distance between the lenses 134a, 134b, 134c included in the second lens portion 134. Spot position.

例如,第一透鏡部132可包括兩個凸透鏡132a、132c、及設置至兩個凸透鏡132a、132c之間的凹透鏡132b。相同地,第二透鏡部134亦可包括兩個凸透鏡134a、134c及設置至兩個凸透鏡134a、134c之間的凹透鏡134b。For example, the first lens portion 132 may include two convex lenses 132a, 132c, and a concave lens 132b disposed between the two convex lenses 132a, 132c. Similarly, the second lens portion 134 may also include two convex lenses 134a, 134c and a concave lens 134b disposed between the two convex lenses 134a, 134c.

第一透鏡部132可調節透鏡之間的距離h1、h2。例如,隨著加工束L1形成聚光點P1、P2、P3的深度變大,入射至第一透鏡部132的反射束L21a、L21b、L21c的尺寸會變大。因此,第一透鏡部132可為加工束L1形成聚光點P1、P2、P3的深度越大,則使第一凸透鏡132a與凹透鏡132b之間的距離h1越大,且使凹透鏡132b與第二凸透鏡132b之間的距離越小。The first lens portion 132 can adjust the distances h1, h2 between the lenses. For example, as the depth at which the processed beam L1 forms the condensed points P1, P2, and P3 becomes larger, the sizes of the reflected beams L21a, L21b, and L21c incident on the first lens portion 132 become larger. Therefore, the greater the depth at which the first lens portion 132 can form the condensed points P1, P2, P3 for the processed beam L1, the larger the distance h1 between the first convex lens 132a and the concave lens 132b, and the concave lens 132b and the second lens The smaller the distance between the convex lenses 132b.

第二透鏡部134亦可調節透鏡之間的距離h3、h4。例如,隨著加工束L1形成聚光點P1、P2、P3的深度變大,入射至第二透鏡部134的反射束L22a、L22b、L22c的尺寸會變大。因此,第二透鏡部134可為加工束L1形成聚光點P1、P2、P3的深度越大,則使第三凸透鏡132a與凹透鏡132b之間的距離h3越大,且使凹透鏡132b與第四凸透鏡132b之間的距離h4越小。The second lens portion 134 can also adjust the distances h3, h4 between the lenses. For example, as the depth at which the processed beam L1 forms the condensed points P1, P2, and P3 becomes larger, the sizes of the reflected beams L22a, L22b, and L22c incident on the second lens portion 134 become larger. Therefore, the greater the depth at which the second lens portion 134 forms the condensed points P1, P2, P3 for the processed beam L1, the larger the distance h3 between the third convex lens 132a and the concave lens 132b, and the concave lens 132b and the fourth lens The smaller the distance h4 between the convex lenses 132b.

於圖22中,表示第一透鏡部132及第二透鏡部134分別包括兩個凸透鏡132a、132c、134a、134c及一個凹透鏡132b、134b的例,但實施例並不限制於此。例如,可於可由業者容易地變更的水準下變更可包括於第一透鏡部132及第二透鏡部134的透鏡種類及個數。In FIG. 22, an example in which the first lens portion 132 and the second lens portion 134 respectively include two convex lenses 132a, 132c, 134a, and 134c and one concave lens 132b, 134b is shown, but the embodiment is not limited thereto. For example, the types and the number of lenses that can be included in the first lens portion 132 and the second lens portion 134 can be changed at a level that can be easily changed by the manufacturer.

以上,參照圖15至圖22,對例示性的實施例的雷射加工裝置進行了說明。根據實施例,雷射加工裝置可利用自動對焦單元於加工物30內部的所期望的部位形成加工束L1的聚光點。並且,即便加工物的聚光點位置發生變化,亦可藉由改變透鏡部或光感測器的位置而穩定地檢測加工束L1的聚光點位置。The laser processing apparatus of the exemplary embodiment has been described above with reference to Figs. 15 to 22 . According to an embodiment, the laser processing apparatus can form a condensed spot of the processed beam L1 at a desired portion inside the workpiece 30 using the autofocus unit. Further, even if the position of the condensed spot of the workpiece changes, the position of the condensed spot of the processed beam L1 can be stably detected by changing the position of the lens portion or the photo sensor.

於以上說明中,具體地記載有多個事項,但這些事項並不限定發明的範圍,而應解釋為較佳的實施例的示例。因此,本發明的範圍不應由所說明的實施例界定,而應由申請專利範圍中所記載的技術思想界定。In the above description, a plurality of items are specifically described, but these matters are not intended to limit the scope of the invention, but should be construed as an example of a preferred embodiment. Therefore, the scope of the invention should not be limited by the illustrated embodiments, but should be defined by the technical idea recited in the claims.

10‧‧‧光源
20‧‧‧聚光光學系統
21、23‧‧‧掃描儀
22、132b、134b‧‧‧凹透鏡
24、26、132a、132c、134a、134c‧‧‧凸透鏡
25‧‧‧透鏡
30‧‧‧加工物
110‧‧‧第一分束器
120‧‧‧第二分束器
122‧‧‧鏡面
123‧‧‧第3分束器
132‧‧‧第一透鏡部
134‧‧‧第二透鏡部
142‧‧‧第一光感測器
144‧‧‧第二光感測器
150‧‧‧測定用光源
A1、A2、A3、B1、B2、B3、J1、J2、J3、K1、K2、K3‧‧‧位置
d0‧‧‧距離
d1‧‧‧距離/高度
d2‧‧‧距離/深度
f、f1、f2‧‧‧焦點距離
f'、f''、f1'、f2'、h1、h2、h3、h4、l1、l2、t1、t1'、t1''、t2、t2'、t2''‧‧‧距離
L1‧‧‧加工束
L1'‧‧‧透射束
L2、L21a、L21b、L21c、L22a、L22b、L22c‧‧‧反射束
L3‧‧‧測定用光束
L21‧‧‧第一反射束
L22‧‧‧第二反射束
Lu‧‧‧反射光
P、P1、P2、P3‧‧‧聚光點
Sd‧‧‧下表面
Su‧‧‧上表面
10‧‧‧Light source
20‧‧‧Concentrating optical system
21, 23‧‧‧ Scanner
22, 132b, 134b‧‧‧ concave lens
24, 26, 132a, 132c, 134a, 134c‧‧ ‧ convex lens
25‧‧‧ lens
30‧‧‧Processing
110‧‧‧First beam splitter
120‧‧‧Second beam splitter
122‧‧‧Mirror
123‧‧‧3rd beam splitter
132‧‧‧First lens section
134‧‧‧second lens section
142‧‧‧First light sensor
144‧‧‧Second light sensor
150‧‧‧Measurement light source
A1, A2, A3, B1, B2, B3, J1, J2, J3, K1, K2, K3‧‧‧ position
D0‧‧‧ distance
D1‧‧‧Distance/Height
D2‧‧‧Distance/depth
f, f1, f2‧‧‧ focus distance
f', f'', f1', f2', h1, h2, h3, h4, l1, l2, t1, t1', t1'', t2, t2', t2''‧‧‧ distance
L1‧‧‧Processing bundle
L1'‧‧‧ Transmission beam
L2, L21a, L21b, L21c, L22a, L22b, L22c‧‧‧ reflection beam
L3‧‧‧Measurement beam
L21‧‧‧First reflection beam
L22‧‧‧second reflection beam
Lu‧‧‧ reflected light
P, P1, P2, P3‧‧‧ spotlights
Sd‧‧‧ lower surface
Su‧‧‧ upper surface

圖1是概略性地表示例示性的實施例的聚光點檢測裝置的圖。 圖2是表示圖1所示的聚光光學系統與加工物之間的距離發生變化的例的圖。 圖3是表示圖1所示的聚光光學系統與加工物之間的距離發生變化的另一例的圖。 圖4是表示圖1所示的實施例的變形例的圖。 圖5是概略性地表示其他例示性的實施例的聚光點檢測裝置的圖。 圖6是概略性地表示其他例示性的實施例的聚光點檢測裝置的圖。 圖7是概略性地表示其他例示性的實施例的聚光點檢測裝置的圖。 圖8是表示圖7所示的聚光光學系統與加工物之間的距離發生變化的例的圖。 圖9是表示圖7所示的聚光光學系統與加工物之間的距離發生變化的另一例的圖。 圖10是表示由第一光感測器測定到的第一反射束的能量密度及第二反射束的能量密度的變化的曲線圖。 圖11及圖12是表示圖7所示的聚光光學系統的變形例的圖。 圖13是概略性地表示其他例示性的實施例的聚光點檢測裝置的圖。 圖14是概略性地表示其他例示性的實施例的聚光點檢測裝置的圖。 圖15是表示例示性的實施例的雷射加工裝置於加工物內部形成加工束L1的聚光點的例的圖。 圖16是放大表示於圖15所示的加工物內部形成加工束的聚光點的圖。 圖17是表示於其他例示性的實施例的雷射加工裝置中,隨著聚光點於加工物內部的位置發生變化而變更第一光感測器的位置的例的圖。 圖18是表示於其他例示性的實施例的雷射加工裝置中,隨著聚光點於加工物內部的位置發生變化而變更第一光感測器及第二光感測器的位置的例的圖。 圖19是表示於其他例示性的實施例的雷射加工裝置中,隨著聚光點於加工物內部的位置發生變化而變更第一透鏡部的位置的例的圖。 圖20是表示於其他例示性的實施例的雷射加工裝置中,隨著聚光點於加工物內部的位置發生變化而變更第一透鏡部及第二透鏡部的位置的例的圖。 圖21是表示圖19所示的第一透鏡部的變形例的圖。 圖22是表示圖20所示的第一透鏡部及第二透鏡部的變形例的圖。Fig. 1 is a view schematically showing a light collecting point detecting device of an exemplary embodiment. FIG. 2 is a view showing an example in which the distance between the collecting optical system and the workpiece shown in FIG. 1 is changed. Fig. 3 is a view showing another example of a change in the distance between the collecting optical system shown in Fig. 1 and a workpiece. Fig. 4 is a view showing a modification of the embodiment shown in Fig. 1; Fig. 5 is a view schematically showing a light collecting point detecting device of another exemplary embodiment. Fig. 6 is a view schematically showing a light collecting point detecting device of another exemplary embodiment. Fig. 7 is a view schematically showing a light collecting point detecting device of another exemplary embodiment. FIG. 8 is a view showing an example in which the distance between the collecting optical system and the workpiece shown in FIG. 7 is changed. FIG. 9 is a view showing another example of a change in the distance between the collecting optical system and the workpiece shown in FIG. 7. Fig. 10 is a graph showing changes in the energy density of the first reflected beam and the energy density of the second reflected beam measured by the first photosensor. 11 and 12 are views showing a modification of the collecting optical system shown in Fig. 7. Fig. 13 is a view schematically showing a light collecting point detecting device of another exemplary embodiment. Fig. 14 is a view schematically showing a light collecting point detecting device of another exemplary embodiment. Fig. 15 is a view showing an example in which a laser beam of a processing beam L1 is formed inside a workpiece by a laser processing apparatus according to an exemplary embodiment. Fig. 16 is an enlarged view showing a light collecting point where a processed beam is formed inside the workpiece shown in Fig. 15; FIG. 17 is a view showing an example in which the position of the first photosensor is changed as the position of the condensing point changes inside the workpiece in the laser processing apparatus according to another exemplary embodiment. FIG. 18 is a view showing an example in which the positions of the first photosensor and the second photosensor are changed as the position of the condensing point changes inside the workpiece in the laser processing apparatus according to another exemplary embodiment. Figure. FIG. 19 is a view showing an example in which the position of the first lens portion is changed as the position of the condensing point changes inside the workpiece in the laser processing apparatus according to another exemplary embodiment. FIG. 20 is a view showing an example in which the positions of the first lens portion and the second lens portion are changed as the position of the condensing point changes inside the workpiece in the laser processing apparatus according to another exemplary embodiment. Fig. 21 is a view showing a modification of the first lens portion shown in Fig. 19; Fig. 22 is a view showing a modification of the first lens portion and the second lens portion shown in Fig. 20;

10‧‧‧光源 10‧‧‧Light source

20‧‧‧聚光光學系統 20‧‧‧Concentrating optical system

30‧‧‧加工物 30‧‧‧Processing

110‧‧‧第一分束器 110‧‧‧First beam splitter

132‧‧‧第一透鏡部 132‧‧‧First lens section

142‧‧‧第一光感測器 142‧‧‧First light sensor

d0‧‧‧距離 D0‧‧‧ distance

f‧‧‧焦點距離 f‧‧‧Focus distance

L1‧‧‧加工束 L1‧‧‧Processing bundle

L2‧‧‧反射束 L2‧‧‧ reflection beam

Claims (16)

一種雷射加工裝置,包括: 光源,其向加工物出射用於雷射加工的加工束; 聚光光學系統,其將所述加工束聚光; 自動對焦單元,其對所述聚光光學系統的位置進行調節,以使所述加工束的聚光點形成至所述加工物內部; 所述自動對焦單元包括: 第一分束器,其設置至所述聚光光學系統與所述光源之間,反射自所述加工對象物反射的反射光中的至少一部分; 第一透鏡部,其將自所述第一分束器反射的所述反射光聚焦;以及 第一光感測器,其自所述第一透鏡部設置於所述反射光聚焦的方向上,對藉由所述第一透鏡部而聚焦的所述反射光的能量密度進行測定。A laser processing apparatus comprising: a light source that emits a processing beam for laser processing to a workpiece; a collecting optical system that condenses the processing beam; an autofocus unit that faces the collecting optical system Positioning is adjusted to form a condensed spot of the processed beam into the workpiece; the autofocus unit includes: a first beam splitter disposed to the concentrating optical system and the light source At least a portion of the reflected light reflected from the processing object; a first lens portion that focuses the reflected light reflected from the first beam splitter; and a first photo sensor, The energy density of the reflected light focused by the first lens portion is measured from the first lens portion disposed in a direction in which the reflected light is focused. 如申請專利範圍第1項所述的雷射加工裝置,其中根據由所述第一光感測器測定到的所述反射光的能量密度而確定所述聚光光學系統的位置。The laser processing apparatus according to claim 1, wherein the position of the light collecting optical system is determined based on an energy density of the reflected light measured by the first photo sensor. 如申請專利範圍第1項所述的雷射加工裝置,其中所述第一透鏡部與所述第一光感測器之間的距離根據所述加工束的聚光點形成至所述加工物內部的深度而改變。The laser processing apparatus of claim 1, wherein a distance between the first lens portion and the first photo sensor is formed to the workpiece according to a condensed spot of the processed beam The depth of the interior changes. 如申請專利範圍第1項所述的雷射加工裝置,其中所述加工束的聚光點形成至所述加工物內部的深度越大,則所述第一透鏡部與所述第一光感測器之間的距離越大。The laser processing apparatus according to claim 1, wherein the first lens portion and the first light sensation are formed such that a depth of the condensed spot of the processed beam is formed to a depth inside the workpiece The greater the distance between the detectors. 如申請專利範圍第1項所述的雷射加工裝置,其中所述第一透鏡部與所述第一光感測器之間的距離根據所述加工物內部的折射率而改變。The laser processing apparatus of claim 1, wherein a distance between the first lens portion and the first photosensor changes according to a refractive index inside the workpiece. 如申請專利範圍第1項所述的雷射加工裝置,其中所述第一透鏡部包括兩個凸透鏡及設置至所述兩個凸透鏡之間的凹透鏡。The laser processing apparatus of claim 1, wherein the first lens portion includes two convex lenses and a concave lens disposed between the two convex lenses. 如申請專利範圍第6項所述的雷射加工裝置,其中於所述第一透鏡部中,所述兩個凸透鏡與所述凹透鏡的位置根據所述加工束的聚光點形成至所述加工物內部的深度而改變。The laser processing apparatus according to claim 6, wherein in the first lens portion, positions of the two convex lenses and the concave lens are formed to the processing according to a condensed spot of the processed beam The depth of the object changes. 如申請專利範圍第1項所述的雷射加工裝置,其中所述自動對焦單元更包括第二分束器,所述第二分束器將於所述第一分束器反射的所述反射光分割成第一反射光與第二反射光。The laser processing apparatus of claim 1, wherein the autofocus unit further comprises a second beam splitter, the second beam splitter to reflect the reflection reflected by the first beam splitter The light is split into first reflected light and second reflected light. 如申請專利範圍第8項所述的雷射加工裝置,其中所述第一反射光入射至所述第一透鏡部,且所述自動對焦單元包括: 第二透鏡部,其供所述第二反射光入射;以及 第二光感測器,其自所述第二透鏡部設置於所述第二反射光聚焦的方向上,對藉由所述第二透鏡部而聚焦的所述第二反射光的能量密度進行測定。The laser processing apparatus of claim 8, wherein the first reflected light is incident on the first lens portion, and the autofocus unit comprises: a second lens portion for the second a reflected light incident; and a second photo sensor disposed from the second lens portion in a direction in which the second reflected light is focused, and the second reflection focused by the second lens portion The energy density of light is measured. 如申請專利範圍第9項所述的雷射加工裝置,其中根據由所述第一光感測器測定到的所述第一反射光的能量密度及由所述第二光感測器測定到的所述第二反射光的能量密度而確定所述聚光光學系統的位置。The laser processing apparatus of claim 9, wherein the energy density of the first reflected light measured by the first photosensor and determined by the second photosensor is The energy density of the second reflected light determines the position of the collecting optics. 如申請專利範圍第9項所述的雷射加工裝置,其中根據所述第一反射光的能量密度與所述第二反射光的能量密度的差值而確定所述聚光光學系統的位置。The laser processing apparatus of claim 9, wherein the position of the light collecting optical system is determined according to a difference between an energy density of the first reflected light and an energy density of the second reflected light. 如申請專利範圍第9項所述的雷射加工裝置,其中所述第一透鏡部與所述第一光感測器之間的距離及所述第二透鏡部與所述第二光感測器之間的距離根據所述加工束的聚光點形成至所述加工物內部的深度而改變。The laser processing apparatus of claim 9, wherein a distance between the first lens portion and the first photo sensor and the second lens portion and the second light sensing The distance between the devices varies depending on the depth at which the condensed spot of the processed beam is formed to the inside of the workpiece. 如申請專利範圍第10項所述的雷射加工裝置,其中所述加工束的聚光點形成至所述加工物內部的深度越大,則所述第一透鏡部與所述第一光感測器之間的距離及所述第二透鏡部與所述第二光感測器之間的距離越大。The laser processing apparatus of claim 10, wherein the first lens portion and the first light sensation are formed such that a depth of the condensed spot of the processed beam is formed to a depth inside the workpiece The distance between the detectors and the distance between the second lens portion and the second photo sensor are larger. 如申請專利範圍第1項所述的雷射加工裝置,其中所述第一透鏡部與所述第一光感測器之間的距離及所述第二透鏡部與所述第二光感測器之間的距離根據所述加工物內部的折射率而改變。The laser processing apparatus of claim 1, wherein a distance between the first lens portion and the first photo sensor and the second lens portion and the second light sensing The distance between the devices varies depending on the refractive index inside the workpiece. 如申請專利範圍第1項所述的雷射加工裝置,其中所述第一透鏡部與所述第二透鏡部分別包括兩個凸透鏡及設置至所述兩個凸透鏡之間的凹透鏡。The laser processing apparatus according to claim 1, wherein the first lens portion and the second lens portion respectively include two convex lenses and a concave lens disposed between the two convex lenses. 如申請專利範圍第15項所述的雷射加工裝置,其中於所述第一透鏡部及所述第二透鏡部各者中,所述兩個凸透鏡與所述凹透鏡的位置根據所述加工束的聚光點形成至所述加工物內部的深度而改變。The laser processing apparatus according to claim 15, wherein in the first lens portion and the second lens portion, positions of the two convex lenses and the concave lens are according to the processed beam The spotting point changes to a depth inside the workpiece.
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