TWI617384B - Focusing point detecting device - Google Patents

Focusing point detecting device Download PDF

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Publication number
TWI617384B
TWI617384B TW105121656A TW105121656A TWI617384B TW I617384 B TWI617384 B TW I617384B TW 105121656 A TW105121656 A TW 105121656A TW 105121656 A TW105121656 A TW 105121656A TW I617384 B TWI617384 B TW I617384B
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reflected
reflected beam
lens portion
light sensor
light
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TW105121656A
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TW201710007A (en
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成振宇
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Eo科技股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

本發明揭示一種聚光點檢測裝置。所述裝置包括:雷射光源,經設置以射出加工束;第一分束器,設置至光源與對上述加工束進行聚光的聚光光學系統之間,且經設置以反射自加工對象物反射的反射束中的至少一部分;第一透鏡部,經設置以對自上述第一分束器反射的上述反射束進行聚焦;及第一光感測器,自上述透鏡部設置於上述反射束聚焦的方向上,經設置以對藉由上述第一透鏡部而聚焦的上述反射束的能量密度進行測定。 The invention discloses a light spot detection device. The device includes: a laser light source configured to emit a processing beam; a first beam splitter provided between the light source and a condensing optical system for condensing the processing beam; and configured to reflect a self-processing object At least a part of the reflected reflected beam; a first lens portion provided to focus the reflected beam reflected from the first beam splitter; and a first light sensor provided to the reflected beam from the lens portion The focusing direction is set to measure the energy density of the reflected beam focused by the first lens unit.

Description

聚光點檢測裝置 Condensing point detection device

本發明揭示一種聚光點檢測裝置,且揭示一種對雷射束聚焦至加工物的位置進行調節的技術。 The invention discloses a light spot detection device and a technology for adjusting the position where a laser beam is focused on a processed object.

通常,雷射加工製程是指向加工對象物的表面掃描雷射束而對加工對象物表面的形狀或物理性質等進行加工的製程。加工對象物可有多個例,且其形狀可為二維平面形狀。作為雷射加工的例,可包括雷射標記、雷射切割及雷射刻槽(grooving)製程等。 Generally, a laser processing process is a process in which a laser beam is scanned toward the surface of a processing object, and the shape, physical properties, and the like of the surface of the processing object are processed. There may be many examples of the object to be processed, and the shape may be a two-dimensional planar shape. Examples of laser processing include laser marking, laser cutting, and laser grooving processes.

為了提高雷射加工的精確度,重要的是良好地調節自光源出射的雷射束的聚光點的位置。另外,為了調節雷射束的聚光點位置,應測定雷射束的聚焦點形成至加工物上的哪一位置。 In order to improve the accuracy of laser processing, it is important to well adjust the position of the light-condensing point of the laser beam emitted from the light source. In addition, in order to adjust the position of the focusing point of the laser beam, it is necessary to determine to which position the focused point of the laser beam is formed on the workpiece.

於先前的雷射加工裝置中,為了間接地獲知雷射束的聚光點,與將雷射光聚光的聚光透鏡並列設置有用以測定加工對象物的表面高度的測定部。此種雷射加工裝置一面對加工對象物的表面進行掃描,一面藉由測定部對加工對象物的表面高度進行測定,根據以此方式測定到的表面高度而以聚光透鏡與加工對象物表面的距離變得固定的方式驅動聚光透鏡。藉此,即便加工對象物 的表面凹凸不平,亦可始終使雷射光的聚光點位於加工對象物的表面而執行雷射加工作業。 In the conventional laser processing apparatus, in order to indirectly know the condensing point of the laser beam, a measurement unit for measuring the surface height of the object to be processed is provided in parallel with the condenser lens that condenses the laser light. This type of laser processing device scans the surface of a processing object while measuring the surface height of the processing object by a measuring unit, and uses a condenser lens and the processing object based on the surface height measured in this way. The condenser lens is driven in such a way that the distance of the surface becomes fixed. As a result, even the object to be processed The uneven surface of the laser beam can also be used to perform laser processing by always concentrating the spot of the laser light on the surface of the object to be processed.

然而,於如上所述的先前的雷射加工裝置中,聚光透鏡與測定部彼此相隔固定距離而設置,故而會因載置加工對象物的平台振動等而加工對象物的實際表面高度與藉由測定部測定到的表面高度之間產生誤差,因此雷射光的聚光點位置會脫離所意欲的位置。 However, in the conventional laser processing apparatus as described above, the condenser lens and the measurement unit are provided at a fixed distance from each other, and therefore the actual surface height and Since an error occurs between the surface heights measured by the measurement unit, the position of the light-condensing point of the laser light is deviated from a desired position.

作為其他示例,亦有追蹤加工束於加工物反射的反射束的路徑而倒推加工束的聚光點位置的方法。然而,於該情形時,會因加工物的厚度變化、位於雷射束路徑上的掃描儀或透鏡等驅動光學系統的誤差而無法獲知聚光點位置,或即便獲知聚光點位置,可靠性亦降低。 As another example, there is also a method of tracking the path of the reflected beam reflected by the processed beam on the processed beam, and inferring the position of the focal point of the processed beam. However, in this case, due to changes in the thickness of the workpiece and errors in the drive optical system such as a scanner or lens located on the laser beam path, the position of the focusing point cannot be known, or even if the position of the focusing point is known, the reliability Also reduced.

根據例示性的實施例,提供一種檢測雷射加工束的聚光點位置的聚光點檢測裝置。 According to an exemplary embodiment, a condensing point detection device that detects a condensing point position of a laser processing beam is provided.

於一觀點中,提供一種聚光點檢測裝置,其檢測雷射加工束的聚光點位置,上述聚光點檢測裝置包括:第一分束器,設置至出射上述加工束的雷射光源與對上述加工束進行聚光的聚光光學系統之間,反射自上述加工對象物反射 的反射束中的至少一部分;第一透鏡部,對自上述第一分束器反射的上述反射束進行聚焦;及第一光感測器,自上述第一透鏡部設置於上述反射束聚焦的方向上,對藉由上述第一透鏡部聚焦的上述反射束的能量密度進行測定。 In one aspect, a light spot detection device is provided that detects a position of a light spot of a laser processing beam. The light spot detection device includes: a first beam splitter, a laser light source configured to emit the processing beam, and Reflection between the light collecting optical system for condensing the processing beam from the processing object At least a part of the reflected beam; a first lens unit for focusing the reflected beam reflected from the first beam splitter; and a first light sensor provided from the first lens unit for focusing the reflected beam. In the direction, the energy density of the reflected beam focused by the first lens unit is measured.

可根據由上述第一光感測器測定到的上述反射束的能量密度而確定上述聚光光學系統的位置。 The position of the condensing optical system can be determined based on the energy density of the reflected beam measured by the first light sensor.

上述聚光點檢測裝置可更包括第二分束器,上述第二分束器將自第一分束器反射的反射束分割成第一反射束及第二反射束。 The focusing point detection device may further include a second beam splitter, and the second beam splitter divides the reflected beam reflected from the first beam splitter into a first reflected beam and a second reflected beam.

上述第一反射束入射至上述第一透鏡部,上述聚光點檢測裝置可包括:第二透鏡部,供上述第二反射束入射;及第二光感測器,自上述第二透鏡部設置於上述第二反射束聚焦的方向上,對藉由上述第二透鏡部聚焦的上述第二反射束的能量密度進行測定。 The first reflected beam is incident on the first lens portion, and the condensing point detection device may include a second lens portion for the second reflected beam to be incident; and a second light sensor provided from the second lens portion. An energy density of the second reflected beam focused by the second lens section is measured in a direction in which the second reflected beam is focused.

可根據由上述第一光感測器測定到的上述第一反射束的能量密度、及由上述第二光感測器測定到的上述第二反射束的能量密度而確定上述聚光光學系統的位置。 The concentration of the light collecting optical system can be determined based on the energy density of the first reflected beam measured by the first light sensor and the energy density of the second reflected beam measured by the second light sensor. position.

可根據上述第一反射束的能量密度與上述第二反射束的能量密度的差值確定上述聚光光學系統的位置。 The position of the condensing optical system may be determined according to a difference between the energy density of the first reflected beam and the energy density of the second reflected beam.

上述第一光感測器能夠以較上述第一透鏡部的焦距遠 離上述第一透鏡部的方式設置,上述第二光感測器以較上述第二透鏡部的焦距接近上述第二透鏡部的方式設置。 The first light sensor can have a longer focal length than the first lens portion. The second light sensor is disposed away from the first lens portion, and the second light sensor is disposed closer to the second lens portion than a focal length of the second lens portion.

上述第一光感測器能夠以較上述第一透鏡部的焦距接近上述第一透鏡部的方式設置,上述第二光感測器以較上述第二透鏡部的焦距遠離上述第二透鏡部的方式設置。 The first light sensor may be disposed closer to the first lens portion than the focal length of the first lens portion, and the second light sensor may be farther from the second lens portion than the second lens portion. Way setting.

上述聚光點檢測裝置可更包括:第三分束器,變更由上述第二分束器分割所得的第二反射束的行進方向;及測定用光源,向上述第三分束器出射測定用光束。 The condensing point detection device may further include: a third beam splitter that changes a traveling direction of the second reflected beam obtained by the second beam splitter; and a measurement light source that emits measurement light to the third beam splitter. beam.

上述第一分束器可反射上述測定用光束於上述加工對象物反射的反射束中的至少一部分。 The first beam splitter may reflect at least a part of a reflected beam reflected by the measurement beam on the object to be processed.

自上述測定用光源出射的測定用光束的波長與自上述雷射光源出射的光的波長不同,上述第一分束器可使自上述雷射光源出射的光透射,且使自上述測定用光源出射的測定用光束反射。 The wavelength of the measurement beam emitted from the measurement light source is different from the wavelength of the light emitted from the laser light source. The first beam splitter can transmit light emitted from the laser light source and transmit the light from the measurement light source. The emitted measurement beam is reflected.

上述聚光點檢測裝置可更包括第二分束器,上述第二分束器將藉由上述第一透鏡部聚焦的上述反射束分割成第一反射束及第二反射束。 The condensing point detection device may further include a second beam splitter, and the second beam splitter divides the reflected beam focused by the first lens portion into a first reflected beam and a second reflected beam.

上述第一光感測器設置至上述第一反射束的行進路徑,可對上述第一反射束的能量密度進行測定。 The first light sensor is provided to a travel path of the first reflected beam, and can measure an energy density of the first reflected beam.

上述聚光點檢測裝置可更包括第二光感測器,上述第二 光感測器設置至上述第二反射束的行進路徑,對上述第二反射束的能量密度進行測定。 The above-mentioned light spot detection device may further include a second light sensor. A light sensor is provided to a travel path of the second reflected beam, and measures an energy density of the second reflected beam.

可根據由上述第一光感測器測定到的上述第一反射束的能量密度、及由上述第二光感測器測定到的上述第二反射束的能量密度確定上述聚光光學系統的位置。 The position of the condensing optical system can be determined based on the energy density of the first reflected beam measured by the first light sensor and the energy density of the second reflected beam measured by the second light sensor. .

根據實施例,提供一種即便發生聚光光學系統的變動、加工物的厚度變化,亦可精確且穩定地檢測加工束的聚光點位置的聚光點檢測裝置。 According to an embodiment, there is provided a condensing point detection device that can accurately and stably detect the position of a condensing point of a processed beam even if a condensing optical system changes and a thickness of a processed object changes.

10‧‧‧光源 10‧‧‧ light source

20‧‧‧聚光光學系統 20‧‧‧ Condensing optical system

21、23‧‧‧掃描儀 21, 23‧‧‧ scanner

22‧‧‧凹透鏡 22‧‧‧ concave lens

24、26‧‧‧凸透鏡 24, 26‧‧‧ convex lens

25‧‧‧透鏡 25‧‧‧ lens

30‧‧‧加工物 30‧‧‧Processed

110‧‧‧第一分束器 110‧‧‧first beam splitter

120‧‧‧第二分束器 120‧‧‧Second Beamsplitter

122‧‧‧鏡面 122‧‧‧Mirror

123‧‧‧第三分束器 123‧‧‧third beam splitter

132‧‧‧第一透鏡部 132‧‧‧First lens section

134‧‧‧第二透鏡部 134‧‧‧Second lens section

142‧‧‧第一光感測器 142‧‧‧The first light sensor

144‧‧‧第二光感測器 144‧‧‧Second light sensor

150‧‧‧測定用光源 150‧‧‧light source for measurement

d0、f'、f"、f1'、f2'、11、12、t1、t1'、t1"、t2、t2'、t2"‧‧‧距離 d0, f ', f ", f1', f2 ', 11, 12, t1, t1', t1", t2, t2 ', t2 "‧‧‧ distance

d1‧‧‧距離/高度 d1‧‧‧distance / height

d2‧‧‧距離/深度 d2‧‧‧distance / depth

f、f1、f2‧‧‧焦距 f, f1, f2‧‧‧ focal length

f1"‧‧‧距離 f1 "‧‧‧distance

f2"‧‧‧距離 f2 "‧‧‧distance

L1‧‧‧加工束 L1‧‧‧Processing beam

L1'‧‧‧透射束 L1'‧‧‧ transmitted beam

L2‧‧‧反射束 L2‧‧‧Reflected Beam

L3‧‧‧測定用光束 L3‧‧‧Beam for measurement

L21‧‧‧第一反射束 L21‧‧‧First reflected beam

L22‧‧‧第二反射束 L22‧‧‧Second reflected beam

Lu‧‧‧反射光 Lu‧‧‧Reflected light

P‧‧‧聚光點 P‧‧‧concentrating point

Sd‧‧‧下表面 Sd‧‧‧ lower surface

Su‧‧‧上表面 Su‧‧‧ Top surface

圖1是概略性地表示例示性的實施例的聚光點檢測裝置的圖。 FIG. 1 is a diagram schematically showing a light spot detection device according to an exemplary embodiment.

圖2是表示圖1所示的聚光光學系統與加工物之間的距離發生變化的例的圖。 FIG. 2 is a diagram illustrating an example in which a distance between a condensing optical system and a processed object shown in FIG. 1 changes.

圖3是表示圖1所示的聚光光學系統與加工物之間的距離發生變化的另一例的圖。 FIG. 3 is a diagram showing another example in which the distance between the condensing optical system and the processed object shown in FIG. 1 changes.

圖4是表示圖1所示的實施例的變形例的圖。 FIG. 4 is a diagram showing a modified example of the embodiment shown in FIG. 1.

圖5是概略性地表示另一例示性的實施例的聚光點檢測裝置的圖。 FIG. 5 is a diagram schematically showing a light spot detection device according to another exemplary embodiment.

圖6是概略性地表示另一例示性的實施例的聚光點檢測裝置的圖。 FIG. 6 is a diagram schematically showing a light spot detection device according to another exemplary embodiment.

圖7是概略性地表示另一例示性的實施例的聚光點檢測裝置的圖。 FIG. 7 is a diagram schematically showing a light spot detection device according to another exemplary embodiment.

圖8是表示圖7所示的聚光光學系統與加工物之間的距離發生變化的例的圖。 FIG. 8 is a diagram showing an example in which the distance between the condensing optical system and the processed object shown in FIG. 7 changes.

圖9是表示圖7所示的聚光光學系統與加工物之間的距離發生變化的另一例的圖。 FIG. 9 is a diagram showing another example in which the distance between the condensing optical system and the processed object shown in FIG. 7 changes.

圖10是表示由第一光感測器測定到的第一反射束的能量密度及第二反射束的能量密度的變化的曲線圖。 FIG. 10 is a graph showing changes in the energy density of the first reflected beam and the energy density of the second reflected beam measured by the first light sensor.

圖11及圖12是表示圖7所示的聚光光學系統的變形例的圖。 11 and 12 are diagrams showing a modification example of the condensing optical system shown in FIG. 7.

圖13是概略性地表示另一例示性的實施例的聚光點檢測裝置的圖。 FIG. 13 is a diagram schematically showing a light spot detection device according to another exemplary embodiment.

圖14是概略性地表示另一例示性的實施例的聚光點檢測裝置的圖。 FIG. 14 is a diagram schematically showing a light spot detection device according to another exemplary embodiment.

圖15是表示例示性的實施例的雷射加工裝置於加工物的內部形成加工束L1的聚光點的例的圖。 FIG. 15 is a diagram showing an example in which the laser processing apparatus of the exemplary embodiment forms a light-condensing point of the processing beam L1 inside the processed object.

圖16是放大表示於圖15所示的加工物的內部形成加工束的聚光點的圖。 FIG. 16 is an enlarged view showing a condensing point of a processing beam formed inside the processed product shown in FIG. 15.

於以下圖式中,相同的參照符號代表相同的構成要素,且於圖式中,為了說明的明確性及便利性,可誇張地表示各構成要素的尺寸。另一方面,以下所說明的實施例僅為示例,可根據這些 實施例實現各種變形。 In the following drawings, the same reference symbols represent the same constituent elements, and in the drawings, the dimensions of each constituent element may be exaggerated for clarity and convenience of explanation. On the other hand, the embodiments described below are merely examples, The embodiment realizes various modifications.

第一、第二等用語可用於說明各種構成要素,但構成要素不應受用語的限定。用語僅以自其他構成要素區分一個構成要素為目的而使用。 The first and second terms can be used to describe various constituent elements, but the constituent elements should not be limited by the terms. The term is used only for the purpose of distinguishing one constituent element from the other constituent elements.

只要未於文中明確地表示其他含義,則單數的表達包括複數的表達。並且,於記載為某個部分“包括”某個構成要素時,只要無特別相反的記載,則意味著可更包括其他構成要素,而並非是指排除其他構成要素。 As long as other meanings are not clearly indicated in the text, expressions in the singular include expressions in the plural. In addition, when it is described that a certain part “includes” a certain constituent element, as long as there is no particularly contrary description, it means that other constituent elements may be further included instead of excluding other constituent elements.

並且,說明書中所記載的“...部”、“模組”等用語是指對至少一個功能或動作進行處理的單位。 In addition, terms such as "... section" and "module" described in the specification refer to a unit that processes at least one function or operation.

圖1是概略性地表示例示性的實施例的聚光點檢測裝置的圖。 FIG. 1 is a diagram schematically showing a light spot detection device according to an exemplary embodiment.

參照圖1,自光源10出射的加工束L1可經由聚光光學系統20照射至加工物30。聚光光學系統20可對加工束L1進行聚光。於圖1中,例示性地表示聚光光學系統20包括一個透鏡,但並不限制於此。聚光光學系統20只要變更加工束L1的光路徑而將加工束L1聚光即可,亦可包括多個光學要素。並且,於圖1中,表示加工束L1的聚光點形成至加工物30的表面的例,但加工束L1的聚光點位置可根據雷射加工特性而改變。 Referring to FIG. 1, the processing beam L1 emitted from the light source 10 may be irradiated to the processed object 30 via the condensing optical system 20. The condensing optical system 20 can condense the processing beam L1. In FIG. 1, it is exemplarily shown that the condensing optical system 20 includes one lens, but it is not limited thereto. The condensing optical system 20 only needs to change the light path of the processing beam L1 to condense the processing beam L1, and may include a plurality of optical elements. In addition, FIG. 1 shows an example in which the light-condensing point of the processing beam L1 is formed on the surface of the workpiece 30, but the position of the light-condensing point of the processing beam L1 can be changed according to the laser processing characteristics.

實施例的聚光點檢測裝置可檢測通過聚光光學系統20的加工束L1的聚光點距加工物30的表面的距離。若聚光點檢測裝置向使用者提供與加工束L1的聚光點距加工物30表面的距離 相關的資訊,則使用者可基於上述聚光點位置資訊而變更聚光光學系統20的設置。可手動實現聚光光學系統20的設置變更,亦可藉由實施例的聚光點檢測裝置而自動實現。雖未圖示,但於自動調節聚光光學系統20的位置的情形時,聚光點檢測裝置亦可包括對聚光光學系統的位置進行調節的驅動裝置。 The condensing point detection device of the embodiment can detect the distance between the condensing point of the processing beam L1 passing through the concentrating optical system 20 and the surface of the processed object 30. If the focusing point detection device provides the user with the distance from the focusing point of the processing beam L1 to the surface of the processed object 30 For related information, the user can change the setting of the condensing optical system 20 based on the position information of the condensing point. The setting change of the condensing optical system 20 can be realized manually, or can be automatically realized by the condensing point detection device of the embodiment. Although not shown, when the position of the condensing optical system 20 is automatically adjusted, the condensing point detection device may include a driving device that adjusts the position of the condensing optical system.

為了檢測加工束L1的聚光點位置,聚光點檢測裝置對自加工物30反射的反射束L2進行測定。聚光點檢測裝置可包括反射上述反射束L2中的至少一部分的第一分束器110。第一分束器110可將自加工物30反射的反射束L2全部反射,亦可僅反射一部分。並且,入射至第一分束器110的加工束L1可全部透射第一分束器110,亦可為一部分透射而入射至加工物30、另一部分反射。若自光源10出射的加工束L1與自加工物反射的反射束L2的波長不同,則第一分束器110亦可為僅針對反射束L2的波長反射光束,針對加工束L1的波長而使光束透射。於該情形時,能夠以反射特定波長的光束、使其他波長的光束透射的方式塗覆處理第一分束器110的表面。 In order to detect the spot position of the processing beam L1, the spot detection device measures the reflected beam L2 reflected from the processed object 30. The condensing point detection device may include a first beam splitter 110 that reflects at least a part of the above-mentioned reflected beam L2. The first beam splitter 110 may reflect all or a portion of the reflected beam L2 reflected from the processed object 30. In addition, the processing beam L1 incident on the first beam splitter 110 may be transmitted through the first beam splitter 110 in whole, or may be incident on the processed object 30 for part transmission and reflected on the other part. If the wavelength of the processed beam L1 emitted from the light source 10 and the reflected beam L2 reflected from the processed object are different, the first beam splitter 110 may reflect the beam only for the wavelength of the reflected beam L2 and the wavelength of the processed beam L1 The light beam is transmitted. In this case, the surface of the first beam splitter 110 can be coated and processed so as to reflect a light beam of a specific wavelength and transmit light beams of other wavelengths.

聚光點檢測裝置可包括第一透鏡部132,上述第一透鏡部132將路徑因第一分束器110而變更的反射束L2聚焦(focusing)。第一透鏡部132可為可將反射束L2聚焦的光學元件。於圖1中,將第一透鏡部132表示為半凸透鏡,但實施例並不限制於此。第一透鏡部132只要可將反射束L2聚焦即可,可不同地變更第一透鏡部132所包括的透鏡形狀。並且,於圖1中,表示 第一透鏡部132包括一個透鏡的例,但實施例並不限制於此。例如,第一透鏡部132可包括多個透鏡。不僅如此,如下所述,包括於第一透鏡部132的透鏡並不限定於凸透鏡,亦可包括凹透鏡。其中,第一透鏡部132可包括至少一個聚光透鏡,以便將通過第一透鏡部132的光束聚焦。 The condensing point detection device may include a first lens portion 132 that focuses the reflected beam L2 whose path is changed by the first beam splitter 110. The first lens portion 132 may be an optical element that can focus the reflected beam L2. In FIG. 1, the first lens portion 132 is shown as a semi-convex lens, but the embodiment is not limited thereto. The first lens portion 132 is only required to be able to focus the reflected beam L2, and the shape of the lens included in the first lens portion 132 may be variously changed. In addition, in FIG. 1, The first lens portion 132 includes an example of a lens, but the embodiment is not limited thereto. For example, the first lens portion 132 may include a plurality of lenses. Furthermore, as described below, the lens included in the first lens portion 132 is not limited to a convex lens, and may include a concave lens. The first lens portion 132 may include at least one condenser lens, so as to focus a light beam passing through the first lens portion 132.

聚光點檢測裝置可包括對藉由第一透鏡部132而聚焦的反射束L2的能量密度進行測定的第一光感測器142。第一光感測器142可自第一透鏡部132設置於反射束L2聚焦的方向上。於圖1中,例示性地表示如下情形:第一光感測器142較第一透鏡部132的焦距f進一步遠離第一透鏡部132距離d0。然而,圖1所示的第一光感測器142的位置僅為示例,並不限制於此。例如,第一光感測器142亦可較第一透鏡部132的焦距f更小地遠離第一透鏡部132。 The condensing point detection device may include a first light sensor 142 that measures an energy density of the reflected beam L2 focused by the first lens portion 132. The first light sensor 142 may be disposed from the first lens portion 132 in a direction in which the reflected beam L2 is focused. In FIG. 1, a case is exemplarily shown in which the first light sensor 142 is further away from the first lens portion 132 by a distance d0 than the focal length f of the first lens portion 132. However, the position of the first light sensor 142 shown in FIG. 1 is merely an example, and is not limited thereto. For example, the first light sensor 142 may be further away from the first lens portion 132 than the focal length f of the first lens portion 132.

第一光感測器142可對通過第一透鏡部132的反射束L2的能量密度進行測定。此處,所謂反射束L2的能量密度是指自反射束L2的入射面傳遞的單位面積能量。於反射束L2的聚光區域較窄的區域中,反射束L2的能量密度相對較大,於反射束L2的入射面積較大的區域中,反射束L2的能量密度會相對較小。即,若第一光感測器142的位置接近通過第一透鏡部132的反射束L2的聚光點,則由第一光感測器142測定到的反射束L2的能量密度較大。相反地,若第一光感測器142的位置遠離通過第一透鏡部132的反射束L2的聚光點,則由第一光感測器142測定到的反射 束L2的能量密度會較小。 The first light sensor 142 can measure the energy density of the reflected beam L2 passing through the first lens portion 132. Here, the energy density of the reflected beam L2 refers to energy per unit area transmitted from the incident surface of the reflected beam L2. The energy density of the reflected beam L2 is relatively large in a region where the condensing area of the reflected beam L2 is narrow, and the energy density of the reflected beam L2 is relatively small in a region where the incident area of the reflected beam L2 is large. That is, if the position of the first light sensor 142 is close to the light-condensing point of the reflected beam L2 passing through the first lens section 132, the energy density of the reflected beam L2 measured by the first light sensor 142 is large. Conversely, if the position of the first light sensor 142 is far from the light-condensing point of the reflected beam L2 passing through the first lens portion 132, the reflection measured by the first light sensor 142 The energy density of the beam L2 will be smaller.

圖2是表示圖1所示的聚光光學系統20與加工物30之間的距離發生變化的例的圖。 FIG. 2 is a diagram showing an example in which the distance between the condensing optical system 20 and the workpiece 30 shown in FIG. 1 changes.

參照圖2,加工物30與聚光光學系統20之間的距離變得大於圖1所示的距離。因此,通過聚光光學系統20的加工束L1的聚光點可形成至加工物30的表面上。因加工束L1的聚光點形成至加工物30的表面上而自加工物30的表面反射的反射束L2入射至聚光光學系統20的角度會發生變化。另外,因入射至聚光光學系統20的反射束L2的角度發生變化而反射束L2入射至第一分束器110的角度亦會發生變化。如圖2所示,若加工束L1的聚光點位於加工物30的表面上,則與圖1的情形不同,自第一分束器110反射的反射束L2的光束尺寸會逐漸變小。另外,因此而通過第一透鏡部132的反射束L2的聚光點與第一透鏡部132之間的距離f'會變得小於第一透鏡部132的焦距f。 Referring to FIG. 2, the distance between the processed object 30 and the condensing optical system 20 becomes larger than the distance shown in FIG. 1. Therefore, the light-condensing point of the processing beam L1 by the light-concentrating optical system 20 can be formed on the surface of the processed object 30. The angle at which the reflected beam L2 reflected from the surface of the processed object 30 is incident on the light-concentrating optical system 20 due to the light-condensing point of the processed beam L1 being formed on the surface of the processed object 30. In addition, as the angle of the reflected beam L2 incident on the condenser optical system 20 changes, the angle of the reflected beam L2 incident on the first beam splitter 110 also changes. As shown in FIG. 2, if the condensing point of the processing beam L1 is located on the surface of the processed object 30, unlike the case of FIG. 1, the beam size of the reflected beam L2 reflected from the first beam splitter 110 gradually becomes smaller. In addition, the distance f ′ between the condensing point of the reflected beam L2 passing through the first lens portion 132 and the first lens portion 132 becomes smaller than the focal length f of the first lens portion 132.

因反射束L2的聚光點與第一透鏡部132之間的距離f'變小而第一光感測器142與反射束L2的聚光點之間的距離d1會變得大於圖1所示的距離d0。因此,由第一光感測器142測定到的反射束L2的能量密度會減少。即,若於如圖1般配置第一光感測器142的狀態下,如圖2所示般進一步遠離聚光光學系統20的方式配置加工物30的位置,則由第一光感測器142測定到的反射束L2的能量密度會減少。 As the distance f ′ between the light-condensing point of the reflected beam L2 and the first lens portion 132 becomes smaller, the distance d1 between the first light sensor 142 and the light-condensing point of the reflected beam L2 becomes larger than that shown in FIG. 1. Shown distance d0. Therefore, the energy density of the reflected beam L2 measured by the first light sensor 142 is reduced. That is, if the first light sensor 142 is arranged as shown in FIG. 1 and the position of the processed object 30 is further distant from the condensing optical system 20 as shown in FIG. 2, the first light sensor is used. The energy density of the reflected beam L2 measured at 142 decreases.

圖3是表示圖1所示的聚光光學系統20與加工物30之 間的距離發生變化的另一例的圖。 FIG. 3 is a view showing one of the condensing optical system 20 and the processed object 30 shown in FIG. 1. Another example of the change in the distance between the two.

參照圖3,加工物30與聚光光學系統20之間的距離變得小於圖1所示的距離。因此,通過聚光光學系統20的加工束L1於形成聚光點前,會於加工物30的表面反射。因此,於加工物30的表面反射的反射束L2入射至聚光光學系統20的角度會發生變化。另外,因入射至聚光光學系統20的反射束L2的角度發生變化而反射束L2入射至第一分束器110的角度亦會發生變化。如圖3所示,若於形成加工束L1的聚光點前,加工束L1於加工物30的表面反射,則於第一分束器110反射的反射束L2的光束尺寸會逐漸變大。另外,因此而通過第一透鏡部132的反射束L2的聚光點與第一透鏡部132之間的距離f"會變得大於第一透鏡部132的焦距f。 Referring to FIG. 3, the distance between the processed object 30 and the condensing optical system 20 becomes smaller than the distance shown in FIG. 1. Therefore, the processing beam L1 passing through the light-concentrating optical system 20 is reflected on the surface of the processed object 30 before the light-condensing point is formed. Therefore, the angle at which the reflected beam L2 reflected on the surface of the workpiece 30 enters the condenser optical system 20 changes. In addition, as the angle of the reflected beam L2 incident on the condenser optical system 20 changes, the angle of the reflected beam L2 incident on the first beam splitter 110 also changes. As shown in FIG. 3, if the processing beam L1 is reflected on the surface of the processed object 30 before the light collecting point of the processing beam L1 is formed, the beam size of the reflected beam L2 reflected by the first beam splitter 110 will gradually increase. In addition, the distance f "between the light-condensing point of the reflected beam L2 passing through the first lens portion 132 and the first lens portion 132 becomes larger than the focal length f of the first lens portion 132.

因反射束L2的聚光點與第一透鏡部132之間的距離f"變大而第一光感測器142與反射束L2的聚光點之間的距離d2會變得小於圖1所示的距離d0。因此,由第一光感測器142測定到的反射束L2的能量密度會增加。即,若於如圖1般配置第一光感測器142的狀態下,加工物30與聚光光學系統20之間的距離變大,則由第一光感測器142測定到的反射束L2的能量密度會增加。 As the distance f "between the focusing point of the reflected beam L2 and the first lens portion 132 becomes larger, the distance d2 between the first light sensor 142 and the focusing point of the reflected beam L2 becomes smaller than that shown in FIG. 1. Therefore, the energy density of the reflected beam L2 measured by the first light sensor 142 increases. That is, if the first light sensor 142 is disposed as shown in FIG. 1, the processed object 30 As the distance from the condenser optical system 20 increases, the energy density of the reflected beam L2 measured by the first light sensor 142 increases.

如參照圖1至圖3進行的說明,因聚光光學系統20與加工物30之間的距離發生變化而由第一光感測器142測定到的反射束L2的能量密度會發生變化。即,可根據由第一光感測器142 測定到的反射束L2的能量密度而確定聚光光學系統20的位置。因此,根據由第一光感測器142測定到的反射束L2的能量密度可知加工束L1的聚光點是否準確地形成於加工物30的表面、是否形成於高於加工物30的表面的位置、或加工束L1於形成聚光點前是否於加工物30反射。 As described with reference to FIGS. 1 to 3, the energy density of the reflected beam L2 measured by the first light sensor 142 changes due to a change in the distance between the condensing optical system 20 and the workpiece 30. That is, the first light sensor 142 The measured energy density of the reflected beam L2 determines the position of the condensing optical system 20. Therefore, based on the energy density of the reflected beam L2 measured by the first light sensor 142, it can be known whether the condensing point of the processing beam L1 is accurately formed on the surface of the processed object 30, and whether it is formed on a surface higher than the surface of the processed object 30 The position, or whether the processing beam L1 is reflected at the processing object 30 before forming a light-condensing point.

於圖1中,表示較第一透鏡部132的焦距更遠地設定第一光感測器142的位置距第一透鏡部132的距離的情形,但實施例並不限制於此。 In FIG. 1, the distance between the position of the first light sensor 142 and the first lens portion 132 is set farther than the focal length of the first lens portion 132, but the embodiment is not limited thereto.

例如,第一光感測器142與第一透鏡部132之間的距離可小於第一透鏡部132的焦距。即,於加工束L1的聚光點形成至加工物30的表面的狀態下,通過第一透鏡部132的反射束L2的聚光點可較第一透鏡部132更遠離第一光感測器142。於該情形時,與圖1不同,若反射束L2的聚光點接近第一透鏡部132,則由第一光感測器142測定到的能量密度會變大。並且,若反射束L2的聚光點遠離第一透鏡部132,則由第一光感測器142測定到的能量密度會變小。即,若加工物30遠離聚光光學系統20,則由第一光感測器142測定到的能量密度會增加,若加工物30接近聚光光學系統20,則由第一光感測器142測定到的能量密度會減少。因此,可根據由第一光感測器142測定到的反射束L2的能量密度而確定聚光光學系統的位置。 For example, a distance between the first light sensor 142 and the first lens portion 132 may be smaller than a focal length of the first lens portion 132. That is, in a state where the light-condensing point of the processing beam L1 is formed on the surface of the workpiece 30, the light-condensing point of the reflected beam L2 passing through the first lens portion 132 can be farther from the first light sensor than the first lens portion 132. 142. In this case, unlike FIG. 1, if the condensing point of the reflected beam L2 is close to the first lens portion 132, the energy density measured by the first light sensor 142 will increase. In addition, if the condensing point of the reflected beam L2 is far from the first lens portion 132, the energy density measured by the first light sensor 142 becomes small. That is, if the processed object 30 is far from the condensing optical system 20, the energy density measured by the first light sensor 142 increases. If the processed object 30 is close to the condensing optical system 20, the first light sensor 142 is used. The measured energy density will decrease. Therefore, the position of the condensing optical system can be determined based on the energy density of the reflected beam L2 measured by the first light sensor 142.

於圖1至圖3中,利用於加工物30的上部表面反射的反射束檢測聚光點的位置,但實施例並不限制於此。圖4是表示 圖1所示的實施例的變形例的圖。 In FIGS. 1 to 3, the position of the light-condensing point is detected using a reflected beam reflected on the upper surface of the processed object 30, but the embodiment is not limited thereto. Figure 4 shows FIG. 1 is a diagram showing a modification of the embodiment shown in FIG. 1.

參照圖4,第一透鏡部132可將於加工物30的下表面Sd反射的反射束L2聚光。於加工物30的上表面Su的透光率較高的情形時,在加工物30的上表面Su反射的反射束Lu的強度較弱而難以用於檢測聚光點。並且,若於加工物30的上表面Su反射的反射束Lu通過第一分束器110而擴散,則難以於第一透鏡部132聚光。於該情形時,藉由第一透鏡部132將如圖4所示般透射至加工物30的內部而於加工物30的下表面Sd反射的反射束L2聚光,藉此聚光點檢測裝置可檢測聚光光學系統20的聚光點。 Referring to FIG. 4, the first lens portion 132 may condense the reflected beam L2 reflected on the lower surface Sd of the processed object 30. When the light transmittance of the upper surface Su of the processed object 30 is high, the intensity of the reflected beam Lu reflected on the upper surface Su of the processed object 30 is weak and it is difficult to detect the light-condensing point. In addition, if the reflected beam Lu reflected on the upper surface Su of the processed object 30 is diffused by the first beam splitter 110, it is difficult for the first lens portion 132 to collect light. In this case, as shown in FIG. 4, the first lens portion 132 condenses the reflected beam L2 that is transmitted to the inside of the processed object 30 and reflected on the lower surface Sd of the processed object 30, thereby condensing the spot detection device. The light-condensing point of the light-concentrating optical system 20 can be detected.

圖5是概略性地表示另一例示性的實施例的聚光點檢測裝置的圖。 FIG. 5 is a diagram schematically showing a light spot detection device according to another exemplary embodiment.

參照圖5,聚光點檢測裝置可更包括將反射束L2分割成第一反射束L21與第二反射束L22的第二分束器120。如參照圖1至圖4進行的說明,由第二分束器120分割所得的光束中的第一反射束L21可入射至第一透鏡部132。聚光點檢測裝置可包括:第二透鏡部134,供第二反射束L22入射;及第二光感測器144,對藉由第二透鏡部而聚焦的第二反射束的能量密度進行測定。 Referring to FIG. 5, the condensing point detection device may further include a second beam splitter 120 that divides the reflected beam L2 into a first reflected beam L21 and a second reflected beam L22. As described with reference to FIGS. 1 to 4, the first reflected beam L21 among the light beams split by the second beam splitter 120 may be incident on the first lens portion 132. The condensing point detection device may include: a second lens portion 134 for the second reflected beam L22 to enter; and a second light sensor 144 that measures an energy density of the second reflected beam focused by the second lens portion. .

如圖5,若第二分束器120分割反射束L2,則隨著加工物30與聚光光學系統20之間的距離發生變化而由第一光感測器142測定到的第一反射束的能量密度、及由第二光感測器144測定到的第二反射束的能量密度會一同發生變化。第一光感測器142較 第一透鏡部132的焦距更遠離第一透鏡部132。相反地,第二光感測器144能夠以較第二透鏡部134的焦距更接近第二透鏡部134的方式設置。如上所述,若確定第一光感測器及第二光感測器144的位置,則與聚光光學系統20與加工物30之間的距離變化對應地由第一光感測器及第二光感測器144測定到的能量密度的變化感度會變高。因聚光光學系統20與加工物30之間的距離發生變化而由第一光感測器142與第二光感測器144測定到的光束的能量密度朝不同方向發生變化,故而可容易地觀察到第一光感測器142的測定值與第二光感測器144的測定值之間的差異變化。於圖5中,表示第一光感測器142較第一透鏡部132的焦距更遠離第一透鏡部132,且第二光感測器144較第二透鏡部134的焦距更接近第二透鏡部134的情形,但實施例亦包括相反的情形。 As shown in FIG. 5, if the second beam splitter 120 divides the reflected beam L2, the first reflected beam measured by the first light sensor 142 changes as the distance between the processed object 30 and the condenser optical system 20 changes. And the energy density of the second reflected beam measured by the second light sensor 144 will change together. The first light sensor 142 is The focal length of the first lens portion 132 is further away from the first lens portion 132. Conversely, the second light sensor 144 can be provided closer to the second lens portion 134 than the focal length of the second lens portion 134. As described above, if the positions of the first light sensor and the second light sensor 144 are determined, the first light sensor and the first light sensor correspond to changes in the distance between the condenser optical system 20 and the processed object 30. The sensitivity of change in energy density measured by the two-light sensor 144 becomes higher. The energy density of the light beam measured by the first light sensor 142 and the second light sensor 144 changes in different directions because the distance between the condensing optical system 20 and the processed object 30 changes, so it can be easily changed. A change in the difference between the measurement value of the first light sensor 142 and the measurement value of the second light sensor 144 was observed. In FIG. 5, the focal length of the first light sensor 142 is farther from the first lens portion 132 than the first lens portion 132, and the focal length of the second light sensor 144 is closer to the second lens than the second lens portion 134. 134, but the embodiment also includes the opposite case.

圖6是概略性地表示另一例示性的實施例的聚光點檢測裝置的圖。 FIG. 6 is a diagram schematically showing a light spot detection device according to another exemplary embodiment.

參照圖6,聚光點檢測裝置可更包括變更第二反射束L22的路徑的鏡面122。如圖6所示,若改變第二反射束L22的路徑,則可將第一透鏡部132及第二透鏡部134構成至相同方向。另外,因第一反射束L21及第二反射束L22沿相同方向行進而可進一步縮小聚光點檢測裝置的設置空間。如圖6,若設置兩個以上的光感測器142、144,則可藉由對由光感測器142、144測定到的光能量密度進行比較而抵消除聚光光學系統20與加工物30之間的距離變化以外因雜訊等其他原因引起的測定值變化。 Referring to FIG. 6, the light spot detection device may further include a mirror surface 122 that changes a path of the second reflected beam L22. As shown in FIG. 6, if the path of the second reflected beam L22 is changed, the first lens portion 132 and the second lens portion 134 can be configured to the same direction. In addition, since the first reflected beam L21 and the second reflected beam L22 travel in the same direction, the installation space of the light spot detection device can be further reduced. As shown in FIG. 6, if two or more light sensors 142 and 144 are provided, the light condensing optical system 20 and the processed object can be eliminated by comparing the light energy densities measured by the light sensors 142 and 144. In addition to the change in the distance between 30, the measured value changes due to noise and other reasons.

與圖5不同,於圖6中表示第一光感測器142與第一透鏡部132之間的距離11大於第一透鏡部132的焦距f1,且第二光感測器144與第二透鏡部134之間的距離12亦大於第二透鏡部134的焦距f2的情形,但實施例亦可包括其他例。例如,可為第一光感測器142與第一透鏡部132之間的距離11小於第一透鏡部132的焦距f1,且第二光感測器144與第二透鏡部134之間的距離12亦小於第二透鏡部134的焦距f2。另外,作為其他例,亦可為第一光感測器142與第一透鏡部132之間的距離11大於第一透鏡部132的焦距f1,相反地,第二光感測器144與第二透鏡部134之間的距離12小於第二透鏡部134的焦距f2。作為其他例,亦可為第一光感測器142與第一透鏡部132之間的距離11小於第一透鏡部132的焦距f1,相反地,第二光感測器144與第二透鏡部134之間的距離12大於第二透鏡部134的焦距f2。 Different from FIG. 5, the distance 11 between the first light sensor 142 and the first lens portion 132 is greater than the focal length f1 of the first lens portion 132, and the second light sensor 144 and the second lens are shown in FIG. 6. The distance 12 between the parts 134 is also larger than the focal length f2 of the second lens part 134, but the embodiment may include other examples. For example, the distance 11 between the first light sensor 142 and the first lens portion 132 may be smaller than the focal length f1 of the first lens portion 132, and the distance between the second light sensor 144 and the second lens portion 134. 12 is also smaller than the focal length f2 of the second lens portion 134. In addition, as another example, the distance 11 between the first light sensor 142 and the first lens portion 132 may be greater than the focal length f1 of the first lens portion 132. Conversely, the second light sensor 144 and the second light sensor 144 The distance 12 between the lens portions 134 is smaller than the focal length f2 of the second lens portion 134. As another example, the distance 11 between the first light sensor 142 and the first lens portion 132 may be smaller than the focal length f1 of the first lens portion 132. Conversely, the second light sensor 144 and the second lens portion The distance 12 between 134 is larger than the focal length f2 of the second lens portion 134.

圖7是概略性地表示另一例示性的實施例的聚光點檢測裝置的圖。 FIG. 7 is a diagram schematically showing a light spot detection device according to another exemplary embodiment.

參照圖7,與圖5相同,可為第一光感測器142與第一透鏡部132之間的距離11大於第一透鏡部132的焦距f1,第二光感測器144與第二透鏡部134之間的距離12小於第二透鏡部134的焦距f2。如上所述,若距離11與焦距f1之間的關係、與距離12與焦距f2之間的關係彼此相反,則隨著聚光光學系統20與加工物30之間的距離發生變化而由第一光感測器142及第二光感測器144測定到的測定值會朝向不同方向發生變化。藉此,如下所述, 可進一步明確地確認由第一光感測器142及第二光感測器144測定到的測定值的差異。 Referring to FIG. 7, as in FIG. 5, the distance 11 between the first light sensor 142 and the first lens portion 132 may be greater than the focal length f1 of the first lens portion 132, and the second light sensor 144 and the second lens The distance 12 between the portions 134 is smaller than the focal length f2 of the second lens portion 134. As described above, if the relationship between the distance 11 and the focal distance f1 and the relationship between the distance 12 and the focal distance f2 are opposite to each other, as the distance between the condenser optical system 20 and the processed object 30 changes, the first The measurement values measured by the light sensor 142 and the second light sensor 144 change in different directions. With this, as described below, The difference between the measured values measured by the first light sensor 142 and the second light sensor 144 can be confirmed more clearly.

圖8是表示圖7所示的聚光光學系統20與加工物30之間的距離發生變化的例的圖。 FIG. 8 is a diagram showing an example in which the distance between the condensing optical system 20 and the workpiece 30 shown in FIG. 7 changes.

參照圖8,加工物30與聚光光學系統20之間的距離變得大於圖7所示的距離。因此,通過聚光光學系統20的加工束L1的聚光點可形成至加工物30的表面上。因加工束L1的聚光點形成至加工物30的表面上而於加工物30的表面反射的反射束L2入射至聚光光學系統20的角度會發生變化。另外,因入射至聚光光學系統20的反射束L2的角度發生變化而反射束L2入射至第一分束器110的角度亦會發生變化。並且,反射束L2入射至第二分束器120的角度亦會發生變化。如圖8所示,若加工束L1的聚光點位於加工物30的表面上,則與圖7的情形不同,由第二分束器120分割所得的第一反射束L21與第二反射束L22的光束尺寸會逐漸變小。另外,因此而第一反射束L21的聚光點與第一透鏡部132之間的距離f1'會變得小於第一透鏡部132的焦距f1。並且,第二反射束L22的聚光點與第二透鏡部134之間的距離f2'會變得小於第二透鏡部134的焦距f2。 Referring to FIG. 8, the distance between the processed object 30 and the condensing optical system 20 becomes larger than the distance shown in FIG. 7. Therefore, the light-condensing point of the processing beam L1 by the light-concentrating optical system 20 can be formed on the surface of the processed object 30. The angle of incidence of the reflection beam L2 reflected on the surface of the processed object 30 due to the light-condensing point of the processed beam L1 formed on the surface of the processed object 30 changes. In addition, as the angle of the reflected beam L2 incident on the condenser optical system 20 changes, the angle of the reflected beam L2 incident on the first beam splitter 110 also changes. In addition, the angle at which the reflected beam L2 is incident on the second beam splitter 120 also changes. As shown in FIG. 8, if the light-condensing point of the processing beam L1 is located on the surface of the processing object 30, unlike in the case of FIG. 7, the first reflected beam L21 and the second reflected beam obtained by the second beam splitter 120 are divided. The beam size of L22 will gradually decrease. In addition, the distance f1 ′ between the light-condensing point of the first reflected beam L21 and the first lens portion 132 becomes smaller than the focal length f1 of the first lens portion 132. In addition, a distance f2 ′ between the light-condensing point of the second reflected beam L22 and the second lens portion 134 becomes smaller than a focal length f2 of the second lens portion 134.

第一反射束L21的聚光點與第一透鏡部132之間的距離f1'、第一光感測器142與第一反射束L21的聚光點之間的距離t1'可變得大於圖7所示的距離t1。相反地,第二光感測器144與第二反射束L22的聚光點之間的距離t2'可變得小於圖7所示的距離 t2。因此,若加工物30與聚光光學系統20之間的距離變小,則由第一光感測器142測定到的第一反射束L21的能量密度變少,相反地,由第二光感測器144測定到的第二反射束L22的能量密度會變大。 The distance f1 'between the light-condensing point of the first reflected beam L21 and the first lens portion 132, and the distance t1' between the first light sensor 142 and the light-condensing point of the first reflected beam L21 can become larger than the figure. The distance t1 shown in 7. Conversely, the distance t2 ′ between the second light sensor 144 and the light-condensing point of the second reflected beam L22 may become smaller than the distance shown in FIG. 7 t2. Therefore, if the distance between the processed object 30 and the condenser optical system 20 becomes smaller, the energy density of the first reflected beam L21 measured by the first light sensor 142 becomes smaller. The energy density of the second reflected beam L22 measured by the detector 144 increases.

圖9是表示圖7所示的聚光光學系統20與加工物30之間的距離發生變化的另一例的圖。 FIG. 9 is a diagram showing another example in which the distance between the condensing optical system 20 and the workpiece 30 shown in FIG. 7 changes.

參照圖9,加工物30與聚光光學系統20之間的距離變得小於圖7所示的距離。因此,通過聚光光學系統20的加工束L1於形成聚光點前,會於加工物30的表面反射。加工束L1於形成聚光點前在加工物30的表面反射而於加工物30的表面反射的反射束L2入射至聚光光學系統20的角度會發生變化。另外,因入射至聚光光學系統20的反射束L2的角度發生變化而反射束L2入射至第一分束器110的角度亦會發生變化。並且,反射束L2入射至第二分束器120的角度亦會發生變化。如圖9所示,若加工束L1於形成聚光點前在加工物30的表面反射,則與圖7的情形不同,由第二分束器120分割所得的第一反射束L21與第二反射束L22的光束尺寸會逐漸變大。另外,因此而第一反射束L21的聚光點與第一透鏡部132之間的距離f1"會變得大於第一透鏡部132的焦距f1。並且,第二反射束L22的聚光點與第二透鏡部134之間的距離f2"會變得大於第二透鏡部134的焦距f2。 Referring to FIG. 9, the distance between the processed object 30 and the condensing optical system 20 becomes smaller than the distance shown in FIG. 7. Therefore, the processing beam L1 passing through the light-concentrating optical system 20 is reflected on the surface of the processed object 30 before the light-condensing point is formed. Before the processing beam L1 is reflected on the surface of the processed object 30 before the light-condensing point is formed, the angle at which the reflected beam L2 reflected on the surface of the processed object 30 enters the focusing optical system 20 changes. In addition, as the angle of the reflected beam L2 incident on the condenser optical system 20 changes, the angle of the reflected beam L2 incident on the first beam splitter 110 also changes. In addition, the angle at which the reflected beam L2 is incident on the second beam splitter 120 also changes. As shown in FIG. 9, if the processing beam L1 is reflected on the surface of the processing object 30 before forming a light-condensing point, unlike the case of FIG. 7, the first reflected beam L21 and the second reflection beam split by the second beam splitter 120 are different. The beam size of the reflected beam L22 becomes gradually larger. In addition, therefore, the distance f1 "between the focusing point of the first reflected beam L21 and the first lens portion 132 becomes larger than the focal length f1 of the first lens portion 132. Further, the focusing point of the second reflected beam L22 and A distance f2 ″ between the second lens portions 134 becomes larger than a focal length f2 of the second lens portion 134.

第一反射束L21的聚光點與第一透鏡部132之間的距離f1'、第一光感測器142與第一反射束L21的聚光點之間的距離t1" 可變得小於圖7所示的距離t1。相反地,第二光感測器144與第二反射束L22的聚光點之間的距離t2"可變得大於圖7所示的距離t2。因此,若加工物30與聚光光學系統20之間的距離變大,則由第一光感測器142測定到的第一反射束L21的能量密度變大,相反地,由第二光感測器144測定到的第二反射束L22的能量密度會變小。 Distance f1 'between the light-condensing point of the first reflected beam L21 and the first lens portion 132, and distance t1 "between the first light sensor 142 and the light-condensing point of the first reflected beam L21 It may become smaller than the distance t1 shown in FIG. 7. Conversely, the distance t2 ″ between the second light sensor 144 and the light-condensing point of the second reflected beam L22 may become larger than the distance t2 shown in FIG. 7. Therefore, if the processed object 30 and the light-concentrating optical system 20 As the distance between them increases, the energy density of the first reflected beam L21 measured by the first light sensor 142 increases. On the contrary, the energy density of the second reflected beam L22 measured by the second light sensor 144 increases. The energy density will become smaller.

圖10是表示由第一光感測器142測定到的第一反射束L21的能量密度及第二反射束L22的能量密度的變化的曲線圖。於圖10中,橫軸表示聚光光學系統20與加工物30之間的距離變化。於橫軸上,0點表示加工束L1的聚光點形成至加工物30的表面的時點。於橫軸上,“-”值是指聚光光學系統20與加工物30之間的距離變得小於0點位置,“+”值是指聚光光學系統20與加工物30之間的距離變得大於0點位置。並且,縱軸表示光束的能量密度。於圖10中,S1曲線圖表示由第一光感測器142測定到的第一反射束L21的能量密度,S2曲線圖表示由第二光感測器144測定到的第二反射束L22的能量密度。並且,S1-S2表示第一光感測器142的測定值與第二光感測器的測定值之間的差。 FIG. 10 is a graph showing changes in the energy density of the first reflected beam L21 and the energy density of the second reflected beam L22 measured by the first light sensor 142. In FIG. 10, the horizontal axis represents a change in the distance between the condenser optical system 20 and the processed object 30. On the horizontal axis, 0 point indicates the time point at which the light-condensing point of the processing beam L1 is formed to the surface of the processed object 30. On the horizontal axis, the "-" value means that the distance between the condensing optical system 20 and the processed object 30 becomes smaller than the 0 point position, and the "+" value means the distance between the condensing optical system 20 and the processed object 30 It becomes greater than 0 point position. The vertical axis represents the energy density of the light beam. In FIG. 10, the S1 curve represents the energy density of the first reflected beam L21 measured by the first light sensor 142, and the S2 curve represents the energy density of the second reflected beam L22 measured by the second light sensor 144. Energy Density. In addition, S1 to S2 represent the difference between the measurement value of the first light sensor 142 and the measurement value of the second light sensor.

參照圖10,隨著聚光光學系統20與加工物30之間的距離變小而由第一光感測器142測定到的第一反射束L21的能量密度變小,相反地,由第二光感測器144測定到的第二反射束L22的能量密度會變大。並且,隨著聚光光學系統20與加工物30之間的距離變大,由第一光感測器142測定到的第一反射束L21的 能量密度變大,相反地,由第二光感測器144測定到的第二反射束L22的能量密度會變小。如圖9所示,由第一光感測器142及第二光感測器144測定到的第一反射束L21及第二反射束L22的能量密度依存於聚光光學系統20與加工物30之間的距離。因此,可根據第一反射束L21及第二反射束L22的能量密度測定值而確定聚光光學系統20相對於加工物30的相對位置。 Referring to FIG. 10, as the distance between the condenser optical system 20 and the processed object 30 becomes smaller, the energy density of the first reflected beam L21 measured by the first light sensor 142 becomes smaller. The energy density of the second reflected beam L22 measured by the light sensor 144 becomes larger. In addition, as the distance between the condenser optical system 20 and the processed object 30 increases, the distance of the first reflected beam L21 measured by the first light sensor 142 is increased. The energy density becomes larger, and conversely, the energy density of the second reflected beam L22 measured by the second light sensor 144 becomes smaller. As shown in FIG. 9, the energy densities of the first reflected beam L21 and the second reflected beam L22 measured by the first light sensor 142 and the second light sensor 144 depend on the condensing optical system 20 and the processed object 30. the distance between. Therefore, the relative position of the condensing optical system 20 with respect to the workpiece 30 can be determined based on the energy density measurement values of the first reflected beam L21 and the second reflected beam L22.

例示性地,為了確定聚光光學系統20的位置,可觀察第一反射束L21的能量密度測定值與第二反射束L22的能量密度測定值之間的差。觀察曲線圖S1-S2可知,隨著橫軸值自橫軸的0點發生變化而縱軸值敏感地發生變化。其原因在於,曲線圖S1及曲線圖S2分別相對於橫軸朝向不同方向發生變化。即,如圖7至圖9所示,若不同地配置第一光感測器142與第二光感測器144的位置,則隨著加工物30與聚光光學系統20之間的距離發生變化而第一光感測器142的測定值與第二光感測器144的測定值朝向不同方向發生變化,故而可容易地確認第一光感測器142的測定值與第二光感測器144的測定值之間的差值。 Illustratively, in order to determine the position of the condensing optical system 20, the difference between the measured value of the energy density of the first reflected beam L21 and the measured value of the energy density of the second reflected beam L22 may be observed. Observing the graphs S1-S2, it can be seen that as the horizontal axis value changes from 0 point on the horizontal axis, the vertical axis value changes sensitively. The reason is that the graphs S1 and S2 are changed in different directions with respect to the horizontal axis, respectively. That is, as shown in FIGS. 7 to 9, if the positions of the first light sensor 142 and the second light sensor 144 are differently arranged, the distance between the processed object 30 and the light-concentrating optical system 20 occurs. The measurement value of the first light sensor 142 and the measurement value of the second light sensor 144 change in different directions, so the measurement value of the first light sensor 142 and the second light sensor can be easily confirmed. The difference between the measured values of the controller 144.

於圖10中,例示性地表示第一光感測器142的測定值與第二光感測器144的測定值的曲線圖S1-S2,但實施例並不限制於此。例如,亦可根據第一光感測器142的測定值與第二光感測器144的測定值之間的比率而確定聚光光學系統20的位置。除此之外,對第一光感測器142的測定值與第二光感測器144的測定值進行比較的方法可於對業者而言較為容易的水準下實現各種變 更。 In FIG. 10, graphs S1-S2 showing the measured values of the first light sensor 142 and the measured values of the second light sensor 144 are illustrated, but the embodiment is not limited thereto. For example, the position of the condensing optical system 20 may also be determined based on a ratio between a measurement value of the first light sensor 142 and a measurement value of the second light sensor 144. In addition, the method of comparing the measured value of the first light sensor 142 with the measured value of the second light sensor 144 can achieve various changes at a level that is relatively easy for the practitioner. more.

如圖5至圖9所示,若聚光點檢測裝置將反射束分割成兩個以上,則於檢測加工束的聚光點時,可除聚光光學系統20與加工物30之間的距離以外排除其他雜訊因素。例如,如圖1至圖4所示,於聚光點檢測裝置僅包括第一光感測器142的情形時,由第一光感測器142測定到的反射束L2的能量密度除聚光光學系統20與加工物30之間的距離以外,亦會因其他雜訊因素而發生變化。例如,由第一光感測器142測定到的反射束L2的能量密度會因由光源10出射的加工束L1的強度變化、雷射束行進路徑上的異物、加工物30的反射度差異等而發生變化。然而,如圖5至圖8所示,將反射束L2分割成兩個以上而觀察由第一光感測器142測定到的第一反射束L21的能量密度、與由第二光感測器144測定到的第二反射束L22的能量密度的差異可知,可抵消上述雜訊因素。 As shown in FIG. 5 to FIG. 9, if the focused spot detection device divides the reflected beam into two or more, the distance between the focused optical system 20 and the processed object 30 can be removed when detecting the focused spot of the processed beam. Exclude other noise factors. For example, as shown in FIG. 1 to FIG. 4, when the light spot detection device includes only the first light sensor 142, the energy density of the reflected beam L2 measured by the first light sensor 142 is divided by the light. In addition to the distance between the optical system 20 and the processed object 30, other noise factors also change. For example, the energy density of the reflected beam L2 measured by the first light sensor 142 may be caused by a change in the intensity of the processing beam L1 emitted from the light source 10, a foreign object on the laser beam traveling path, a difference in the reflectance of the processed object 30, and the like. Changed. However, as shown in FIG. 5 to FIG. 8, the reflected beam L2 is divided into two or more and the energy density of the first reflected beam L21 measured by the first light sensor 142 and the second light sensor are observed. It can be seen that the difference in energy density of the second reflected beam L22 measured by 144 can offset the above-mentioned noise factor.

圖11及圖12是表示圖5所示的聚光光學系統20的變形例的圖。 11 and 12 are diagrams showing a modification example of the condensing optical system 20 shown in FIG. 5.

參照圖11,聚光光學系統20可包括多個透鏡22、24、26。於圖11中,表示聚光光學系統20包括兩個凸透鏡24、26及一個凹透鏡22的情形,但實施例並不限制於此。可變更可包括於聚光光學系統20的透鏡種類及個數。並且,參照圖12,聚光光學系統20亦可包括變更加工束L1的路徑與尺寸的掃描儀21、23、及改變加工束L1的尺寸的透鏡25。如圖12所示,聚光光學系統 20可不將加工束L1聚光至加工物30,進一步增大加工束L1的尺寸而形成平行光來發射。於該情形時,實施例的聚光點檢測裝置可用於診斷入射至加工物30的加工束L1的尺寸及加工束L1是否成為平行光等。 11, the condensing optical system 20 may include a plurality of lenses 22, 24, 26. FIG. 11 shows a case where the condensing optical system 20 includes two convex lenses 24 and 26 and one concave lens 22, but the embodiment is not limited thereto. The type and number of lenses that can be included in the condenser optical system 20 can be changed. Further, referring to FIG. 12, the condensing optical system 20 may include scanners 21 and 23 that change the path and size of the processing beam L1, and a lens 25 that changes the size of the processing beam L1. As shown in Fig. 12, the condenser optical system 20 may not focus the processing beam L1 to the processed object 30, and further increase the size of the processing beam L1 to form parallel light for emission. In this case, the light spot detection device of the embodiment can be used to diagnose the size of the processing beam L1 incident on the processing object 30 and whether the processing beam L1 becomes parallel light or the like.

圖13是概略性地表示另一例示性的實施例的聚光點檢測裝置的圖。 FIG. 13 is a diagram schematically showing a light spot detection device according to another exemplary embodiment.

參照圖13,聚光點檢測裝置可更包括:第三分束器123,變更第二反射束L22的行進方向;及測定用光源150,向第三分束器123出射測定用光束L3。於圖5所示的實施例中,利用加工束L1於加工物30反射的情形,於圖13中,可加強該情形而由測定用光源150連同加工束L1一併出射入射至加工物30的測定用光束L3。於該情形時,若不同地設定測定用光束L3的波長與加工束L1的波長,則可更有效地構成第一分束器110。第一分束器110以使加工束L1全部透射而僅選擇性地反射測定用光束L3的方式構成,可提高出射加工束L1的光源10的能量效率。第一分束器110可將測定用光束L3全部反射,亦可僅反射測定用光束L3的一部分而使剩餘光束透射。 Referring to FIG. 13, the condensing point detection device may further include a third beam splitter 123 that changes a traveling direction of the second reflected beam L22, and a measurement light source 150 that emits a measurement beam L3 to the third beam splitter 123. In the embodiment shown in FIG. 5, the reflection of the processing beam L1 on the processed object 30 is used. In FIG. 13, this situation can be strengthened and the light source 150 for measurement together with the processing beam L1 is incident on the processed object 30. Measurement beam L3. In this case, if the wavelength of the measurement beam L3 and the wavelength of the processing beam L1 are set differently, the first beam splitter 110 can be configured more efficiently. The first beam splitter 110 is configured to transmit all of the processing beam L1 and selectively reflect only the measurement beam L3, and can improve the energy efficiency of the light source 10 emitting the processing beam L1. The first beam splitter 110 may reflect the entire measurement beam L3 or may reflect only a part of the measurement beam L3 and transmit the remaining beam.

於圖5至圖9中,由第二分束器120分割所得的第一反射束L21與第二反射束L22分別於第一透鏡部132及第二透鏡部134聚焦。然而,於將反射束L2分割成兩個的情形時,聚光點檢測裝置亦可僅包括一個透鏡部。 In FIGS. 5 to 9, the first reflected beam L21 and the second reflected beam L22 divided by the second beam splitter 120 are focused on the first lens portion 132 and the second lens portion 134, respectively. However, when the reflected beam L2 is divided into two, the condensing point detection device may include only one lens portion.

圖14是概略性地表示另一例示性的實施例的聚光點檢 測裝置的圖。 FIG. 14 is a light spot inspection that schematically shows another exemplary embodiment. Figure of the test device.

參照圖14,第一透鏡部132可設置至第一分束器110與第二分束器120之間。另外,第二分束器120可將由第一透鏡部132聚焦的反射束L2分割成第一反射束L21與第二反射束L22。並且,聚光點檢測裝置可包括轉換第二反射束L22的方向的鏡面122。雖未圖示,但亦可省略鏡面122的構成。如圖14所示,若將第一透鏡部132設置至第一分束器110與第二分束器120之間,則無需為了聚焦第二反射束L22而另外包括第二透鏡部134。因此,聚光點檢測裝置的構成會進一步變簡單。 Referring to FIG. 14, the first lens portion 132 may be disposed between the first beam splitter 110 and the second beam splitter 120. In addition, the second beam splitter 120 may divide the reflected beam L2 focused by the first lens portion 132 into a first reflected beam L21 and a second reflected beam L22. And, the condensing point detection device may include a mirror surface 122 that converts the direction of the second reflected beam L22. Although not shown, the configuration of the mirror surface 122 may be omitted. As shown in FIG. 14, if the first lens portion 132 is provided between the first beam splitter 110 and the second beam splitter 120, it is not necessary to additionally include a second lens portion 134 in order to focus the second reflected beam L22. Therefore, the configuration of the light spot detection device is further simplified.

以上,對例示性的實施例的聚光點檢測裝置進行了說明。以下,對包括聚光點檢測裝置的雷射加工裝置進行說明。如圖1至圖14所示,雷射加工裝置能夠以包括聚光點檢測裝置、光源10及聚光光學系統20的方式構成。可根據由光感測器測定到的反射束的能量密度確定聚光光學系統20的位置。聚光光學系統20的位置可手動調節,亦可藉由聚光點檢測裝置而自動調節。於自動調節聚光光學系統20的位置的情形時,圖1至圖14所示的聚光點檢測裝置可作為自動聚焦單元而作動。 The condensing point detection device of the exemplary embodiment has been described above. Hereinafter, a laser processing apparatus including a spot detection device will be described. As shown in FIG. 1 to FIG. 14, the laser processing apparatus can be configured to include a condensing point detection device, a light source 10, and a condensing optical system 20. The position of the condensing optical system 20 can be determined based on the energy density of the reflected beam measured by the light sensor. The position of the condensing optical system 20 can be adjusted manually or automatically by a condensing point detection device. When the position of the condensing optical system 20 is automatically adjusted, the condensing point detection device shown in FIGS. 1 to 14 can be operated as an autofocus unit.

於圖1至圖14中,表示將加工束L1的聚光點形成至加工物30的表面的對準(targeting)情況,但實施例並不限制於此。實施例的雷射加工裝置亦可利用聚光點檢測裝置於加工物30的內部形成加工束L1的聚光點。 In FIGS. 1 to 14, the case where the focusing point of the processing beam L1 is formed to the surface of the processed object 30 is shown, but the embodiment is not limited thereto. The laser processing device of the embodiment may also use a light spot detection device to form a light spot of the processing beam L1 inside the processed object 30.

圖15是表示例示性的實施例的雷射加工裝置於加工物 30內部形成加工束L1的聚光點的例的圖。 FIG. 15 shows a laser processing apparatus and a processed object showing an exemplary embodiment; FIG. 30 is a diagram showing an example of a light-condensing spot of the processing beam L1 inside.

參照圖15,實施例的雷射加工裝置可包括:光源10,向加工物30出射用於雷射加工的加工束L1;聚光光學系統20,對加工束L1進行聚光;及自動聚焦單元,對上述聚光光學系統的位置進行調節,以使加工束L1的聚光點形成至上述加工物的內部。上述自動聚焦單元可如上述聚光點檢測裝置般實現。於圖15中,作為自動聚焦單元的實施例而表示圖7至圖9所示的聚光點檢測裝置,但實施例並不限制於此。可包括於雷射加工裝置的自動聚焦單元可應用參照圖1至圖14而進行說明的所有實施例。 Referring to FIG. 15, the laser processing apparatus of the embodiment may include: a light source 10 that emits a processing beam L1 for laser processing toward the processing object 30; a condensing optical system 20 that focuses the processing beam L1; and an autofocus unit Adjusting the position of the above-mentioned condensing optical system so that the light-condensing point of the processing beam L1 is formed to the inside of the processed object. The above-mentioned auto-focusing unit can be implemented like the above-mentioned light spot detection device. In FIG. 15, the focus point detection device shown in FIGS. 7 to 9 is shown as an embodiment of the autofocus unit, but the embodiment is not limited thereto. The autofocus unit that can be included in the laser processing apparatus can be applied to all the embodiments described with reference to FIGS. 1 to 14.

通過聚光光學系統20的加工束L1中的至少一部分可行進至加工物30的內部。另外,加工束L1中的其他部分可於加工物30的表面反射。為了使加工束L1於加工物30的內部形成聚光點P,聚光光學系統20與加工物30之間的距離可小於圖5所示的距離。自動聚焦單元的第一光感測器142及第二光感測器144可分別測定第一反射束L21及第二反射束L22的能量密度。自動聚焦單元基於由第一光感測器142及第二光感測器144測定到的能量密度而對聚光光學系統20的位置進行調節,以使加工束L1的聚光點P形成至加工物30的內部。 At least a part of the processing beam L1 that has passed through the condensing optical system 20 may enter the inside of the processed object 30. In addition, other parts of the processing beam L1 may be reflected on the surface of the processed object 30. In order for the processing beam L1 to form a condensing point P inside the processed object 30, the distance between the condensing optical system 20 and the processed object 30 may be smaller than the distance shown in FIG. 5. The first light sensor 142 and the second light sensor 144 of the autofocus unit can measure the energy densities of the first reflected beam L21 and the second reflected beam L22, respectively. The autofocus unit adjusts the position of the condensing optical system 20 based on the energy densities measured by the first light sensor 142 and the second light sensor 144 so that the condensing point P of the processing beam L1 is formed to processing.物 30 的 内。 The interior of the thing 30.

圖16是放大表示於圖15所示的加工物30內部形成加工束L1的聚光點P的圖。 FIG. 16 is an enlarged view showing a light-condensing point P forming a processing beam L1 inside the workpiece 30 shown in FIG. 15.

參照圖16,入射於加工物30的加工束L1的一部分被反射而作為反射束L2返回,其他部分成為向加工物30的內部行 進的透射束L1'而可於加工物30的內部形成聚光點P。此時,反射束L2形成聚光點的高度d1與於加工物的內部形成聚光點P的深度d2之間可滿足如下式。 Referring to FIG. 16, a part of the processing beam L1 incident on the processed object 30 is reflected and returned as a reflected beam L2, and the other part is directed toward the inner portion of the processed object 30. The transmitted light beam L1 ′ can form a light-condensing point P inside the processed object 30. At this time, the following formula can be satisfied between the height d1 at which the reflection beam L2 forms a light-condensing point and the depth d2 at which the light-concentration point P is formed inside the processed object.

[式1]d2=n×d1 [Formula 1] d2 = n × d1

此處,n表示加工物30內部的折射率。並且,加工物30外部的折射率假設為空氣的折射率即1。因此,上述式1僅為示例,實施例並非必須限制於此。由於加工物30與加工物30外部的折射率不同,故而根據斯奈爾定律,反射束L2的反射角與透射束L1'的透射角會發生變化。因此,反射束L2於加工物的內部形成聚光點P的深度d2會大於形成聚光點的高度d1。 Here, n represents the refractive index inside the processed object 30. The refractive index outside the processed object 30 is assumed to be 1, which is the refractive index of air. Therefore, the above formula 1 is merely an example, and the embodiment is not necessarily limited thereto. Since the refractive index outside the processed object 30 is different from that of the processed object 30, according to Snell's law, the reflection angle of the reflected beam L2 and the transmission angle of the transmitted beam L1 'change. Therefore, the depth d2 at which the reflection beam L2 forms the light-condensing point P inside the processed object is greater than the height d1 at which the light-condensing point is formed.

實際上,由自動聚焦裝置的光感測器142、144檢測到的能量密度與反射束L2對應。因此,由自動聚焦裝置的光感測器142、144檢測到的能量密度值會依存於反射束L2的聚光點高度d1。然而,反射束L2的聚光點高度d1與於加工物的內部形成聚光點P的深度d2之間可滿足如上所述的式1。因此,實施例的雷射加工裝置為了於加工物30的內部形成加工束L1的聚光點,不僅考慮由自動聚焦單元的光感測器142、144測定到的能量密度,而且亦可一同考慮折射率。即,可根據由第一光感測器142及第二光感測器144測定到的第一反射束L21及第二反射束L22的能量密度、與加工物30的折射率而確定聚光光學系統20的位置。 Actually, the energy density detected by the light sensors 142, 144 of the autofocus device corresponds to the reflected beam L2. Therefore, the energy density value detected by the photo sensors 142 and 144 of the auto-focusing device will depend on the condensing point height d1 of the reflected beam L2. However, between the height d1 of the light-condensing point of the reflected beam L2 and the depth d2 forming the light-condensing point P inside the workpiece, Expression 1 described above can be satisfied. Therefore, in order to form the light-condensing point of the processing beam L1 inside the workpiece 30, the laser processing apparatus of the embodiment not only considers the energy density measured by the photo sensors 142 and 144 of the autofocus unit, but also considers the energy density. Refractive index. That is, the condensing optics can be determined based on the energy densities of the first reflected beam L21 and the second reflected beam L22 measured by the first light sensor 142 and the second light sensor 144 and the refractive index of the processed object 30. The location of the system 20.

以上,參照圖1至圖16,對例示性的實施例的聚光點檢 測裝置進行了說明。根據上述實施例,對自加工物30反射的反射束L2進行聚焦,測定聚焦的反射束L2的能量密度,藉此可檢測加工束L1形成聚光點的位置。於該情形時,並非測定反射束L2的路徑本身,而是測定聚焦的反射束L2的能量密度,故而即便發生聚光光學系統20的應變、加工物30的位置變動等,亦可穩定地檢測加工束L1的聚光點位置。並且,若藉由第二分束器120將反射束L2分割成第一反射束L21及第二反射束L22,則除加工物30與聚光光學系統20之間的距離變化以外,可抵消其他雜訊因素。並且,藉由適當地調節第一光感測器142與第二光感測器144的位置,可使由第一光感測器142測定到的測定值與由第二光感測器144測定到的測定值的差異隨聚光光學系統20與加工物30之間的距離變化敏感地改變。 In the above, referring to FIG. 1 to FIG. 16, the spot inspection of the exemplary embodiment is described. The test device is explained. According to the above embodiment, the reflected beam L2 reflected from the processed object 30 is focused, and the energy density of the focused reflected beam L2 is measured, whereby the position where the processing beam L1 forms a light-condensing point can be detected. In this case, instead of measuring the path of the reflected beam L2 itself, the energy density of the focused reflected beam L2 is measured. Therefore, it is possible to stably detect the strain of the condensing optical system 20 and the positional change of the workpiece 30. Condensing spot position of the processing beam L1. In addition, if the reflected beam L2 is divided into the first reflected beam L21 and the second reflected beam L22 by the second beam splitter 120, in addition to the change in the distance between the processed object 30 and the condensing optical system 20, other factors can be offset. Noise factor. In addition, by appropriately adjusting the positions of the first light sensor 142 and the second light sensor 144, the measured value measured by the first light sensor 142 and the second light sensor 144 can be measured. The difference in the measured values obtained changes sensitively with the change in the distance between the condenser optical system 20 and the workpiece 30.

於以上說明中,具體地記載有多個事項,但這些事項並不限定發明的範圍,而應解釋為較佳的實施例的示例。因此,本發明的範圍不應由所說明的實施例界定,而應由申請專利範圍中所記載的技術思想界定。 In the above description, a plurality of matters are specifically described, but these matters do not limit the scope of the invention, but should be interpreted as examples of preferred embodiments. Therefore, the scope of the present invention should not be defined by the illustrated embodiments, but should be defined by the technical ideas recorded in the scope of the patent application.

10‧‧‧光源 10‧‧‧ light source

20‧‧‧聚光光學系統 20‧‧‧ Condensing optical system

30‧‧‧加工物 30‧‧‧Processed

110‧‧‧第一分束器 110‧‧‧first beam splitter

132‧‧‧第一透鏡部 132‧‧‧First lens section

142‧‧‧第一光感測器 142‧‧‧The first light sensor

d0‧‧‧距離 d0‧‧‧distance

f‧‧‧焦距 f‧‧‧ focal length

L1‧‧‧加工束 L1‧‧‧Processing beam

L2‧‧‧反射束 L2‧‧‧Reflected Beam

Claims (15)

一種聚光點檢測裝置,其檢測雷射加工束的聚光點位置,所述聚光點檢測裝置包括:第一分束器,設置至出射所述加工束的雷射光源與對所述加工束進行聚光的聚光光學系統之間,反射自加工對象物反射的反射束中的至少一部分;第一透鏡部,對自所述第一分束器反射的所述反射束進行聚焦;以及第一光感測器,自所述第一透鏡部設置於所述反射束聚焦的方向上,對藉由所述第一透鏡部聚焦的所述反射束的能量密度進行測定,其中入射到所述第一光傳感器的入射光束與自所述第一透鏡部聚焦的所述反射束的比例根據所述聚光點的所述位置而變化。 A condensing point detection device for detecting the position of a condensing point of a laser processing beam, the condensing point detection device includes a first beam splitter, a laser light source provided to emit the processing beam, and processing the processing point. At least a part of the reflected beam reflected from the processing object is reflected between the condensing optical systems for condensing the beam; the first lens unit focuses the reflected beam reflected from the first beam splitter; and A first light sensor configured to measure an energy density of the reflected beam focused by the first lens portion from the first lens portion disposed in a direction in which the reflected beam is focused, and incident on the A ratio of an incident light beam of the first photosensor to the reflected beam focused from the first lens portion changes according to the position of the light-condensing point. 如申請專利範圍第1項所述的聚光點檢測裝置,其中根據由所述第一光感測器測定到的所述反射束的能量密度而測定所述聚光光學系統的位置。 The condensing point detection device according to item 1 of the scope of the patent application, wherein the position of the condensing optical system is determined based on the energy density of the reflected beam measured by the first light sensor. 如申請專利範圍第1項所述的聚光點檢測裝置,其更包括第二分束器,所述第二分束器將自所述第一分束器反射的反射束分割成第一反射束及第二反射束。 The condensing point detection device according to item 1 of the patent application scope, further comprising a second beam splitter that divides the reflected beam reflected from the first beam splitter into a first reflection Beam and second reflected beam. 如申請專利範圍第3項所述的聚光點檢測裝置,其中所述第一反射束入射至所述第一透鏡部,所述聚光點檢測裝置包括:第二透鏡部,供所述第二反射束 入射;及第二光感測器,自所述第二透鏡部設置於所述第二反射束聚焦的方向上,對藉由所述第二透鏡部聚焦的所述第二反射束之能量密度進行測定。 The condensing point detection device according to item 3 of the scope of patent application, wherein the first reflected beam is incident on the first lens portion, and the condensing point detection device includes a second lens portion for the first Two reflection beam Incident; and a second light sensor disposed from the second lens portion in a direction in which the second reflected beam is focused, to an energy density of the second reflected beam focused by the second lens portion Perform the measurement. 如申請專利範圍第4項所述的聚光點檢測裝置,其中根據由所述第一光感測器測定到的所述第一反射束的能量密度、及由所述第二光感測器測定到的所述第二反射束的能量密度而測定所述聚光光學系統的位置。 The condensing point detection device according to item 4 of the scope of patent application, wherein according to the energy density of the first reflected beam measured by the first light sensor and the second light sensor The position of the condensing optical system is measured by measuring the energy density of the second reflected beam. 如申請專利範圍第5項所述的聚光點檢測裝置,其中根據所述第一反射束的能量密度與所述第二反射束的能量密度的差值測定所述聚光光學系統的位置。 The condensing point detection device according to item 5 of the scope of patent application, wherein the position of the condensing optical system is determined based on a difference between the energy density of the first reflected beam and the energy density of the second reflected beam. 如申請專利範圍第4項所述的聚光點檢測裝置,其中所述第一光感測器以較所述第一透鏡部的焦距遠離所述第一透鏡部的方式設置,所述第二光感測器以較所述第二透鏡部的焦距接近所述第二透鏡部的方式設置。 The condensing point detection device according to item 4 of the scope of patent application, wherein the first light sensor is disposed away from the first lens portion with a focal length longer than the focal length of the first lens portion, and the second The light sensor is provided so as to be closer to the second lens portion than a focal length of the second lens portion. 如申請專利範圍第4項所述的聚光點檢測裝置,其中所述第一光感測器以較所述第一透鏡部的焦距接近所述第一透鏡部的方式設置,所述第二光感測器以較所述第二透鏡部的焦距遠離所述第二透鏡部的方式設置。 The condensing point detection device according to item 4 of the scope of patent application, wherein the first light sensor is disposed closer to the first lens portion than a focal length of the first lens portion, and the second The light sensor is disposed farther from the second lens portion than the second lens portion. 如申請專利範圍第4項所述的聚光點檢測裝置,其更包括:第三分束器,變更由所述第二分束器分割所得的所述第二反射 束的行進方向;以及測定用光源,向所述第三分束器出射測定用光束。 The condensing point detection device according to item 4 of the scope of patent application, further comprising: a third beam splitter that changes the second reflection obtained by the second beam splitter. A traveling direction of the beam; and a light source for measurement, which emits the light beam for measurement to the third beam splitter. 如申請專利範圍第9項所述的聚光點檢測裝置,其中所述第一分束器反射所述測定用光束於所述加工對象物反射的反射束中的至少一部分。 The condensing point detection device according to item 9 of the scope of the patent application, wherein the first beam splitter reflects at least a part of a reflected beam reflected by the measurement beam on the processing object. 如申請專利範圍第9項所述的聚光點檢測裝置,其中自所述測定用光源出射的測定用光束的波長與自所述雷射光源出射的光的波長不同,所述第一分束器使自所述雷射光源出射的光透射,且使自所述測定用光源出射的測定用光束反射。 According to the condensing point detection device according to item 9 of the scope of application for a patent, wherein a wavelength of a measurement beam emitted from the measurement light source is different from a wavelength of light emitted from the laser light source, the first beam splitting The device transmits light emitted from the laser light source, and reflects a measurement light beam emitted from the measurement light source. 如申請專利範圍第1項所述的聚光點檢測裝置,其更包括第二分束器,所述第二分束器將藉由所述第一透鏡部而聚焦的所述反射束分割成第一反射束及第二反射束。 The condensing point detection device according to item 1 of the scope of patent application, further comprising a second beam splitter that divides the reflected beam focused by the first lens section into The first reflected beam and the second reflected beam. 如申請專利範圍第12項所述的聚光點檢測裝置,其中所述第一光感測器設置至所述第一反射束的行進路徑,對所述第一反射束的能量密度進行測定。 The condensing point detection device according to item 12 of the scope of the patent application, wherein the first light sensor is set to a travel path of the first reflected beam to measure an energy density of the first reflected beam. 如申請專利範圍第13項所述的聚光點檢測裝置,其更包括第二光感測器,所述第二光感測器設置至所述第二反射束的行進路徑,對所述第二反射束的能量密度進行測定。 The condensing point detection device according to item 13 of the scope of the patent application, further comprising a second light sensor, the second light sensor is set to a travel path of the second reflected beam, and The energy density of the two reflected beams was measured. 如申請專利範圍第14項所述的聚光點檢測裝置,其中根據由所述第一光感測器測定到的所述第一反射束的能量密度、及由所述第二光感測器測定到的所述第二反射束的能量密度而測 定所述聚光光學系統的位置。 The condensing point detection device according to item 14 of the scope of application for a patent, wherein according to the energy density of the first reflected beam measured by the first light sensor and the second light sensor Measured by measuring the energy density of the second reflected beam The position of the condensing optical system is determined.
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