TW201709560A - Package structure and method of manufacture thereof - Google Patents

Abstract

Provided is a package structure, comprising: a light-permeating member having a fluorescent layer formed thereon, a light-emitting element disposed on the fluorescent layer, and a reflective layer covering the light-emitting element, wherein the reflective layer has a inclined plane with respect to a side surface of the light-emitting member to facilitate light reflection. The invention further provides a method for manufacturing the package structure as described above.

Description

Package structure and its manufacturing method

The invention relates to a package, in particular to a light-emitting package and a method of manufacturing the same.

Light Emitting Diode (LED) has many advantages such as long life, small size, high shock resistance and low power consumption. Therefore, it is widely used in electronic products that require illumination. Therefore, it is industrially and The use of electronic products and home appliances is becoming more and more popular.

1 is a cross-sectional view of a conventional LED package. The LED package 1 includes a substrate 10 and LED elements 12 disposed on the substrate 10. The LED elements 12 are electrically connected in a flip chip manner. The substrate 10; the phosphor layer 13 is formed on the substrate 10 and covers the LED element 12; and the silicone 14 covers the phosphor layer 13.

However, in the conventional LED package, the phosphor powder layer cannot be uniformly distributed on the surface of the LED element, and the thickness control of the phosphor powder layer is not easy, resulting in poor color uniformity of the LED element, and the LED is There is also a light leakage problem on the active surface of the component, and the heat generated by the LED component cannot be effectively transmitted to the outside, and the LED package does not have a reflective layer, which causes problems such as luminous efficacy and poor light shape of the LED package.

Therefore, how to overcome the problems in the prior art has become a problem that is currently being solved.

In view of the above-mentioned deficiencies of the prior art, the present invention provides a package structure comprising: a light transmissive member having a phosphor layer; a light emitting element having opposite first and second surfaces, and adjacent to the first surface and the a side surface of the second surface, and the first surface is bonded to the phosphor layer; and the reflective layer covers the second surface and the side surface of the light emitting element, and the reflective layer has a slope corresponding to the side surface of the light emitting element.

In the above package structure, a coating layer is formed between the side surface of the light emitting element and the reflective layer.

The invention provides a method for fabricating a package structure, comprising: combining a plurality of light-emitting elements on a light-transmitting member having a phosphor layer, wherein the light-emitting element has a first surface bonded to the phosphor layer, opposite to the first surface a second surface, and a side surface adjacent to the first surface and the second surface, and the second surface has a reflective material; forming a coating layer to cover the light-emitting elements, and the coating Forming a plurality of trenches between the light-emitting elements; and forming a reflective layer on the cladding layer and the trenches to allow the reflective layer to cover the second of the light-emitting components Surface and side.

In the above method, the reflective material is a non-transparent adhesive.

In the foregoing method, after the forming of the reflective layer, a singulation process is performed along the trenches.

In the above package structure and method of manufacturing the same, the cladding layer is a light transmissive material.

The invention also provides a method for fabricating a package structure, comprising: combining a plurality of light-emitting elements on a light-transmitting member having a phosphor layer, and the light-emitting element has a first surface bonded to the phosphor layer, opposite to the first surface a second surface, and a side surface adjacent to the first surface and the second surface; forming a plurality of trenches in the phosphor layer, wherein the trenches are located between the light emitting elements; and forming a reflective layer in the light transmissive layer And in the trenches, the reflective layer covers the second surface and the side surface of the light-emitting elements.

In the foregoing method, after the forming of the reflective layer, a singulation process is performed along the trenches.

In the above package structure and method, the light transmissive member is glass, transparent glue or a combination of the glass and the transparent glue; the light emitting element is a light emitting diode; the reflective layer is a non-transparent glue.

In the above package structure and method, the circuit layer is formed on the reflective layer, and the circuit layer is electrically connected to the contact pads disposed on the second surface of the light-emitting element.

In the above package structure and method, the phosphor layer and the light transmissive member may be replaced by a single layer of phosphor layer.

In the above package structure, a plurality of (two or more) light-emitting elements may be included, and a plurality of light-emitting elements may be electrically connected through the circuit layer.

It can be seen that the package structure of the present invention and the manufacturing method thereof cover the side surface of the light-emitting element by the reflective layer and the cladding layer, so that the fluorescent layer does not cover the side surface of the light-emitting element, thereby avoiding the light-emitting element. Thermal degradation caused by heat to improve luminous efficiency. Furthermore, the heat generated by the phosphor layer The light transmissive member can also be transmitted to the outside to maintain the luminous efficiency of the phosphor layer. In addition, the present invention provides a luminescent layer by uniformly arranging a luminescent layer on the light-transmitting member to uniformly distribute the luminescent particles on the light-transmitting member. In addition, the sidewalls of the trenches are inclined, so that the reflective layer has a slope to facilitate reflection of light, and the light source exit angle can be adjusted by adjusting the depth or angle of the trench.

1‧‧‧LED package

10‧‧‧Substrate

12‧‧‧LED components

13‧‧‧Fluorescent powder layer

14‧‧‧矽胶

2,3,4,5,6‧‧‧Package structure

20‧‧‧Transparent parts

21,21’‧‧‧Fluorescent layer

22‧‧‧Lighting elements

22a‧‧‧ first surface

22b‧‧‧ second surface

22c‧‧‧ side

220‧‧‧Contact pads

23‧‧‧reflective layer

23'‧‧‧Reflecting material

23a‧‧‧Bevel

24‧‧‧Cladding

240‧‧‧ trench

25‧‧‧Line layer

S‧‧‧ cutting path

1 is a cross-sectional view of a conventional LED package; FIGS. 2A to 2E are cross-sectional views showing a first embodiment of a method for fabricating a package structure of the present invention, wherein FIG. 2B' is a diagram corresponding to FIG. 2B 3A to 3E are cross-sectional views showing a second embodiment of the method of fabricating the package structure of the present invention; and Figs. 4 to 6 are schematic cross-sectional views showing other embodiments of the package structure of the present invention.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The qualifications are not technically meaningful, and any modification of the structure, change of the proportional relationship or adjustment of the size does not affect the work that can be produced by the present invention. Both the effects and the achievable objectives should still fall within the scope of the technical contents disclosed in the present invention. In the meantime, the terms "upper" and "one" as used in the specification are merely for convenience of description, and are not intended to limit the scope of the invention, and the relative relationship is changed or adjusted. Without substantial changes to the technical content, it is also considered to be within the scope of the invention.

2A to 2E are schematic cross-sectional views showing a first embodiment of the manufacturing method of the package structure 2 of the present invention.

As shown in FIG. 2A, a light transmissive member 20 having a phosphor layer 21 is provided, and a plurality of light emitting elements 22 are bonded to the phosphor layer 21 of the light transmissive member 20.

In this embodiment, the light-emitting element 22 is a light-emitting diode having a first surface 22a and a second surface 22b opposite to each other, and a side surface 22c adjacent to the first surface 22a and the second surface 22b for The light-emitting element 22 is coupled to the phosphor layer 21 through the first surface 22a, such that the phosphor layer 21 is located between the first surface 22a of the light-emitting element 22 and the light-transmitting member 20, and the light-emitting element 22 The second surface 22b has a plurality of contact pads 220. In addition, the light-emitting element 22 can be a flip-chip light-emitting diode or a general light-emitting diode.

Furthermore, a reflective material 23' is formed on the second surface 22b, and the reflective material 23' is exposed outside the contact pad 220, wherein the reflective material 23' is, for example, a non-transparent adhesive (such as white). Glue) to avoid light leakage problems.

Moreover, the light transmissive member 20 is, for example, glass, or a transparent glue (such as transparent silicone), or a combination of the glass and a transparent glue, and the fluorescent layer 21 is spray-coating the fluorescent particles. The method is formed on the light transmissive member 20, or the fluorescent particles are combined with a film and attached to the light transmissive member 20 in advance. Therefore, the fluorescent particles are uniformly disposed on the light transmissive member 20.

In addition, the manner in which the light-emitting element 22 is disposed may be as follows, but is not limited to the methods.

The first method: placing a single light-emitting element 22 on the phosphor layer 21 of the light-transmitting member 20 one by one.

The second method: the array of the plurality of light-emitting elements 22 is arranged on a carrier (not shown), and then the carrier and the light-transmitting member 20 having the fluorescent layer 21 are pressed together, so that the light-emitting elements 22 are combined On the phosphor layer 21.

The third method: the array of the plurality of light-emitting elements 22 is arranged on a fixture (not shown) by vacuum adsorption, and the light-emitting elements 22 are coupled to the phosphor layer 21 of the light-transmitting member 20, and then broken. Vacuum and remove the fixture.

As shown in FIG. 2B, a cladding layer 24 is formed on the phosphor layer 21, so that the cladding layer 24 covers the side surface 22c of the light emitting element 22 and a portion of the second surface 22b, and the contact pads 220 are externally disposed. The cladding layer 24 is exposed, and a plurality of trenches 240 are formed on the surface of the cladding layer 24, and the trenches 240 are located between the side surfaces 22c of the light-emitting elements 22, as shown in the figure. For example, it is inverted V-shaped, and the light source exit angle can be adjusted by adjusting the depth or angle of the inverted V-shaped groove. Further, the groove 240 is formed, for example, by cutting the cladding layer 24.

In this embodiment, the coating layer 24 is a light transmissive material, such as a transparent adhesive layer (such as a transparent silicone) that does not contain a fluorescent material, and the coating layer 24 is filled or molded. Former.

In addition, referring to FIG. 2B', the depth of the trench 240 may also extend to the phosphor layer 21 or even to the light transmissive member 20. In the present invention, the adjustment can be The depth or angle of the groove to adjust the angle at which the light source exits. In addition, in order to improve the process reliability, the cutting tool can be cut into two different materials at the same time, and the portion of the groove 240 extending to the light transmitting member 20 can also be formed in FIG. 2A in advance, and then the cladding layer 24 is formed and located. The portion of the trench 240 in the layer 24 of the cladding layer.

As shown in FIG. 2C, the second embodiment is illustrated in FIG. 2B, and then a reflective layer 23 is formed on the cladding layer 24 and the trenches 240. The reflective layer 23 can be completely covered by the package. The cover layer 24, the phosphor layer 21, and the portion of the light transmissive member 20 are partially covered, and a portion of the reflective layer 23 is removed by, for example, grinding to expose the contact layer 220 of the light emitting element 22 to the reflective layer 23. In this embodiment, the reflective layer 23 is a non-transparent adhesive such as white glue.

As shown in FIG. 2D, a wiring layer 25 is selectively formed on the reflective layer 23, and the wiring layer 25 is connected to the contact pads 220 of the second surface 22b of the light-emitting element 22.

As shown in FIG. 2E, a singulation process is performed along the dicing path s as shown in FIG. 2D (ie, along the trenches 240) to produce a plurality of illuminating package structures 2.

The method of the present embodiment covers the side surface 22c of the light-emitting element 22 by the reflective layer 23 and the cladding layer 24, so that the phosphor layer 21 does not cover the side surface 22c of the light-emitting element 22, thereby avoiding the light-emitting element. 22 Thermal degradation caused by heat to improve luminous efficiency. Furthermore, the heat generated by the phosphor layer 21 can also be transmitted to the outside through the light transmissive member 20 to maintain the luminous efficiency of the phosphor layer 21. In addition, the present invention allows the phosphor particles to be evenly distributed on the light transmissive member 20 by first providing the phosphor layer 21 on the light transmissive member 20. In turn, the luminous efficiency is improved. In addition, the sidewalls of the trenches 240 are inclined, so that the reflective layer 23 has a slope 23a to facilitate reflection of light, and the light source exit angle can be adjusted by adjusting the depth or angle of the trench 240.

3A to 3E are cross-sectional views showing a second embodiment of the manufacturing method of the package structure 3 of the present invention. This embodiment is substantially the same as the first embodiment. The main difference is that the process steps are reduced, so the same process portion will not be described again.

As shown in FIG. 3A, a light transmissive member 20 having a phosphor layer 21 is provided, and a plurality of light emitting elements 22 are combined with the phosphor layer 21 of the light transmissive member 20.

In the present embodiment, it is not necessary to form a reflective material on the second surface of the light-emitting element as in the first embodiment.

As shown in FIG. 3B, a plurality of trenches 240 are formed in the light transmissive member 20 between the light emitting elements 22. In the embodiment, the trenches 240 are formed in a cutting manner.

As shown in FIG. 3C, a reflective layer 23 covering the light-emitting element 22 and filling the trenches 240 is formed on the light-transmitting member 20, and the reflective layer 23 is removed by, for example, grinding, and the light is exposed. Contact pad 220 of component 22.

As shown in FIG. 3D, a circuit layer 25 is selectively formed on the reflective layer 23, and the circuit layer 25 is electrically connected to the contact pads 220 of the light-emitting element 22.

As shown in FIG. 3E, a singulation process is performed along the cutting path s as shown in FIG. 3D (ie, along the trenches 240) to obtain a plurality of luminescent seals. The structure 3 is configured such that the sidewalls of the trenches 240 are inclined, and the reflective layer 23 has a slope 23a to effectively reflect light.

The present invention provides a package structure 2, 3 comprising a light transmissive member 20, a phosphor layer 21, a light emitting element 22, and a reflective layer 23.

The light transmissive member 20 is, for example, glass, transparent glue, or a combination of glass and transparent glue; the phosphor layer 21 is formed on the light transmissive member 20.

The light-emitting element 22 is a light-emitting diode having a first surface 22a and a second surface 22b opposite to each other, and a side surface 22c adjacent to the first surface 22a and the second surface 22b, wherein the light-emitting element 22 The first surface 22a is disposed on the phosphor layer 21, and the light emitting element 22 is provided with a plurality of contact pads 220 on the second surface 22b thereof.

The reflective layer 23 is a non-transparent adhesive, and is formed on the transparent member 20 such that the reflective layer 23 covers the second surface 22b and the side surface 22c of the light-emitting element 22, and exposes the contact pad 220. Reflective layer 23.

In one embodiment, the package structure 2 includes a cladding layer 24 formed between the side surface 22c of the light emitting element 22 and the reflective layer 23. The coating layer 24 is made of a light transmissive material, such as a transparent adhesive layer (such as a transparent silicone) that does not contain a fluorescent material.

In one embodiment, the package structure 2, 3 includes a circuit layer 25 formed on the reflective layer 23, and is electrically connected to the contact pads 220 of the light-emitting element 22.

Please refer to FIG. 4 and FIG. 5, which are schematic cross-sectional views showing another embodiment of the package structure of the present invention.

As shown in the figure, the package structure 4, 5 of the embodiment and the foregoing package structure 2, 3 are substantially the same, and the main difference is that the package structure 4, 5 of the present embodiment replaces the phosphor layer 21 and the light-transmitting member 20 of the package structures 2, 3 with a single layer of the phosphor layer 21'.

Please refer to FIG. 6 , which is a cross-sectional view showing still another embodiment of the package structure of the present invention.

As shown in the figure, the package structure 6 of the present embodiment is substantially the same as the package structure. The main difference is that the package structure 6 of the embodiment includes a plurality of (two or more) light-emitting elements 22, and the The light-emitting elements 22 are electrically connected through the wiring layer 25.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

2‧‧‧Package structure

20‧‧‧Transparent parts

21‧‧‧Fluorescent layer

22‧‧‧Lighting elements

22a‧‧‧ first surface

22b‧‧‧ second surface

22c‧‧‧ side

220‧‧‧Contact pads

23‧‧‧reflective layer

23'‧‧‧Reflecting material

23a‧‧‧Bevel

24‧‧‧Cladding

25‧‧‧Line layer

Claims (30)

A package structure includes: a phosphor layer; at least one light emitting element having opposite first and second surfaces, and a side adjacent to the first surface and the second surface for bonding through the first surface And a reflective layer covering the second surface and the side surface of the light-emitting element, and the reflective layer has a slope corresponding to a side surface of the light-emitting element. The package structure of claim 1, further comprising a light transmissive member, wherein the phosphor layer is bonded to the light transmissive member. The package structure of claim 2, wherein the light transmissive member is glass, transparent glue, or a combination of glass and transparent glue. The package structure of claim 2, wherein the reflective layer covers a side of the phosphor layer and a side of the light transmissive member. The package structure of claim 1, wherein the reflective layer covers a side of the phosphor layer. The package structure of claim 1, wherein the light-emitting element is a light-emitting diode. The package structure of claim 1, wherein the reflective layer is a non-transparent glue. The package structure according to claim 1, further comprising a coating layer formed between a side surface of the light emitting element and the reflective layer. The package structure of claim 8, wherein the coating layer is a light transmissive material. The package structure of claim 1, further comprising a circuit layer formed on the reflective layer and electrically connected to the light emitting element. The package structure of claim 10, wherein the package structure comprises a plurality of the light-emitting elements, and the circuit layer is electrically connected to the plurality of light-emitting elements. A method for fabricating a package structure, comprising: combining a plurality of light-emitting elements on a phosphor layer, wherein the light-emitting element has a first surface that is bonded to the phosphor layer, a second surface opposite to the first surface, and adjacent to the first a surface and a side surface of the second surface, and the second surface has a reflective material; a coating layer is formed on the fluorescent layer to cover the light-emitting element; and the cladding layer is formed in the coating layer a plurality of trenches between the light-emitting elements; and a reflective layer on the cladding layer and the trenches to allow the reflective layer to cover the second surface and the side surfaces of the light-emitting elements. The method of fabricating a package structure according to claim 12, wherein the phosphor layer is bonded to a light transmissive member. The method for manufacturing a package structure according to claim 13, wherein the light transmissive member is glass, transparent glue, or a combination of glass and transparent glue. The method of fabricating the package structure of claim 13, wherein the trench extends to the phosphor layer and the light transmissive member. The method for manufacturing a package structure as described in claim 12, The trench extends to the phosphor layer. The method of fabricating a package structure according to claim 12, wherein the light-emitting element is a light-emitting diode. The method for manufacturing a package structure according to claim 12, wherein the coating layer is a light transmissive material. The method of fabricating a package structure according to claim 12, wherein the reflective material is a non-transparent glue. The method of fabricating a package structure according to claim 12, wherein the reflective layer is a non-transparent glue. The method for fabricating a package structure according to claim 12, further comprising forming a wiring layer on the reflective layer, and the circuit layer is electrically connected to the light emitting element. The method for manufacturing a package structure according to claim 12, further comprising forming a singulation process along the trenches after forming the reflective layer. A method for fabricating a package structure includes: combining a plurality of light-emitting elements on a phosphor layer, and the light-emitting element has a first surface that is bonded to the phosphor layer, a second surface opposite to the first surface, and adjacent to the first a surface and a side surface of the second surface; forming a plurality of trenches in the phosphor layer, wherein the trench is located between the light emitting elements; and forming a reflective layer on the phosphor layer and the trenches, So that the reflective layer covers the second surface and the side surface of the light-emitting elements. The method of fabricating a package structure according to claim 23, wherein the phosphor layer is bonded to a light transmissive member. The method for manufacturing a package structure according to claim 24, wherein the light transmissive member is glass, transparent glue, or a combination of glass and transparent glue. The method of fabricating a package structure according to claim 24, wherein the groove extends to the light transmissive member. The method of fabricating a package structure according to claim 23, wherein the light-emitting element is a light-emitting diode. The method of fabricating a package structure according to claim 23, wherein the reflective layer is a non-transparent glue. The method for fabricating a package structure according to claim 23, further comprising forming a wiring layer on the reflective layer, and the circuit layer is electrically connected to the light emitting element. The method for manufacturing a package structure according to claim 23, further comprising forming a singulation process along the trenches after forming the reflective layer.