TW201708783A - Heat dissipation device and heat dissipation device manufacturing method - Google Patents

Abstract

A heat dissipation device and a heat dissipation device manufacturing method are disclosed. The heat dissipation device including a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.

Description

Heat sink and method of manufacturing same

The invention relates to a heat dissipating device and a manufacturing method, in particular to a heat dissipating device which has the advantages of saving material and controlling the depth of the accommodating hole and maintaining the flatness of the top side and the bottom side of the substrate, thereby effectively achieving the uniform temperature. And manufacturing methods.

In recent years, with the rapid development of the information, communication and optoelectronic industries, electronic products are gradually becoming higher-order and lighter. With the demand for high speed, high frequency and miniaturization, the heat density of electronic components is getting higher and higher, so the heat dissipation efficiency It has become an important factor in determining the stability of electronic products; it is one of the widely used thermal conductive components in electronic products due to its high efficiency of heat conduction. The heat pipe or the heat conductive sheet is mainly vaporized by a closed vacuum copper tube or copper sheet having a capillary layer sintered on the wall thereof, and the working fluid in the tube absorbs a heat source (such as CUP or the like) at the evaporation end, and the vapor at the heated end is The condensation end is condensed into a liquid by heat dissipation (for example, by fins and fans, etc.) and is returned to the evaporation end by the capillary force of the capillary layer to form a closed cycle.

A heat sink mainly includes a base having an opposite first side and a second side, and a first S-shaped groove is formed on the first side of the base, as disclosed in the Patent Publication No. 097202791; An S-shaped heat pipe is disposed correspondingly in the S-shaped groove; and a plurality of heat sinks are disposed on the first side of the base; wherein: the first side of the base is further provided with at least one U-shaped recess a slot, the opening of the U-shaped groove facing an opening of the two openings of the S-shaped groove to close an opening portion of the S-shaped groove; and the heat sink further comprising at least one U-shaped heat pipe The U-shaped heat pipe is correspondingly disposed in the U-shaped groove, wherein the S-shaped heat pipe and the U-shaped heat pipe can quickly conduct heat accumulated in the center of the base to the edge of the base. In the prior art, when the S-shaped groove and the U-shaped groove of the base are formed, the depth of the S-shaped groove and the U-shaped groove is difficult to control and there is a tolerance problem, and the S-shaped groove and the U-shaped concave are formed. When the groove processing is formed, the stress release causes the base to be horizontally different from the back surface of the S-shaped groove 111 and the U-shaped groove (ie, the side of the base opposite the bottom plate), thereby causing the base to correspond to the S-shaped concave. The problem of the heat sink and the heat generating component (such as a central processing unit or a graphics processor) cannot be effectively attached to the front surface of the groove and the U-shaped groove and the back surface of the S-shaped groove and the U-shaped groove, respectively. In addition, the base is overweight due to the use of more copper material on the pedestal.

As described above, the prior art has the following disadvantages:

1. The weight is too heavy.

2. Expendable materials.

3. The groove has tolerance problems.

4. The back of the base has a poor horizontality (or poor flatness).

Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Therefore, in order to effectively solve the above problems, the main object of the present invention is to provide a compression and deformation in a receiving hole in a substrate through at least one heat pipe, so that the heat pipe and the substrate are tightly integrated, Effectively avoid heat sinks that cause poor flatness on the front and back of the substrate.

Another object of the present invention is to provide a heat sink which can reduce the amount of materials used to achieve cost savings and, in turn, effectively achieve a temperature equalization effect.

Another object of the present invention is to provide a compression and deformation tight fit in a receiving hole in a substrate through at least one heat pipe, so that the heat pipe and the substrate are tightly integrated to effectively avoid the positive and flat sides of the substrate. Poor heat sink manufacturing method.

Another object of the present invention is to provide a heat sink manufacturing method that can reduce the amount of materials used to achieve cost savings, and thereby effectively achieve a uniform temperature effect.

In order to achieve the above object, the present invention provides a heat dissipating device, the heat dissipating device comprising a substrate and at least one heat pipe, the substrate having at least one receiving hole, a top side and a bottom side, wherein the receiving hole is formed by the top side The heat pipe is disposed in a state opposite to the receiving hole, and the heat pipe has a first side, a second side opposite to the first side, a third side, and a relative a fourth side of the third side, the first side and the second side are respectively flush adjacent to the top side and the bottom side of the substrate, and the third and fourth sides are pressed and deformed to be in close contact with each other in the corresponding receiving hole On the wall, the substrate and the heat pipe are tightly integrated; through the design of the device of the invention, the front and back flatness of the control substrate can be effectively achieved, and the problem of reducing the material and solving the problem of excessive weight can be achieved, and further The effect of achieving the average temperature.

The present invention further provides a method for manufacturing a heat dissipating device, firstly providing a substrate and at least one heat pipe, the substrate having at least one receiving hole, the receiving hole penetrating through a top side and a bottom side of the substrate, and placing the heat pipe in a relative The hole is disposed in the hole, and the height of the heat pipe is higher than the top side of the substrate, and a gap is formed between the heat pipe and the opposite inner walls of the receiving hole, and then a mold is provided, and the die is included The upper stamper applies a pressing process to one side of the heat pipe adjacent to the top side of the substrate, so that both sides of the heat pipe are deformed by extrusion and laterally expanded to fill the gap and adhere to the corresponding receiving hole. The two opposite inner walls allow the substrate to be tightly integrated with the heat pipe; through the design of the method of the present invention, the front and back flatness of the control substrate can be effectively achieved, and the problem of reducing the material and solving the problem of overweight can be achieved. In addition, the effect of even temperature can be achieved.

1‧‧‧heating device

11‧‧‧Substrate

111‧‧‧ accommodating holes

112‧‧‧Interference Department

113‧‧‧ top side

114‧‧‧ bottom side

13‧‧‧heat pipe

131‧‧‧ first side

132‧‧‧ second side

133‧‧‧ third side

134‧‧‧ fourth side

135‧‧‧heat absorption section

136‧‧‧heating section

137‧‧‧ chamber

138‧‧‧Capillary structure

14‧‧‧ gap

2‧‧‧heating components

3‧‧‧Mold

31‧‧‧Upper stamper

32‧‧‧lower die

4‧‧‧ radiator

41‧‧‧Heat fins

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view showing a first preferred embodiment of the present invention.

Fig. 2A is a perspective view showing the combination of the first preferred embodiment of the present invention.

Figure 2B is a cross-sectional view showing the combination of the first preferred embodiment of the present invention.

Fig. 3A is a perspective view showing another combination of the first preferred embodiment of the present invention.

Fig. 3B is a perspective view showing another combination of the first preferred embodiment of the present invention.

Figure 4 is another exploded perspective view showing the first preferred embodiment of the present invention.

Figure 5 is an exploded perspective view showing a second preferred embodiment of the present invention.

Figure 5A is a cross-sectional view showing the combination of the second preferred embodiment of the present invention.

Figure 6 is a flow chart showing a third preferred embodiment of the present invention.

Fig. 7A is a view showing the heat pipe of the third preferred embodiment of the present invention placed in the substrate.

Fig. 7B is a schematic cross-sectional view showing the heat pipe of the third preferred embodiment of the present invention placed in the substrate.

Fig. 7C is a view showing the mold of the third preferred embodiment of the present invention for pressing a heat pipe in a substrate.

Figure 8 is a flow chart showing a fourth preferred embodiment of the present invention.

Figure 9 is a flow chart showing the fifth preferred embodiment of the present invention.

Fig. 10A is a view showing the heat pipe provided in the circular shape of the fifth preferred embodiment of the present invention being prepared to be placed in the corresponding substrate.

Fig. 10B is a view showing the circular shaped heat pipe of the fifth preferred embodiment of the present invention placed in the substrate.

Fig. 10C is a schematic cross-sectional view showing the circularly shaped heat pipe of the fifth preferred embodiment of the present invention placed in the substrate.

Fig. 10D is a view showing the upper and lower molds of the fifth preferred embodiment of the present invention for compressing a circularly shaped heat pipe in the substrate.

Fig. 11 is a schematic view showing the heat pipe provided with the circular shape of the present invention being prepared to be placed in a substrate corresponding to the interference portion.

Fig. 12 is a schematic view showing, in another aspect of the present invention, the circularly shaped heat pipe in the substrate is sequentially rolled to the heat dissipating device after the rolling has been completed.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

The present invention provides a heat sink and a method of manufacturing the same. Referring to Figures 1, 2A and 2B, there are shown schematic views of the exploded and combined perspective and combined cross-section of the first preferred embodiment of the present invention. The heat dissipating device 1 includes a substrate 11 and at least one heat pipe 13. The substrate 11 is made of a metal material (such as copper), and the substrate 11 has at least one receiving hole 111. The receiving hole 111 is formed by the substrate. The top side 113 of the 11 is inserted through the bottom side 114 of the substrate 11, and the shape of the receiving hole 111 in the preferred embodiment is described in a meandering shape (such as an S shape), but is not limited thereto. When implemented, the shape of the receiving hole 111 may also be linear (as shown in FIG. 3A) or diagonal (as shown in FIG. 3B) or other shapes (such as U-shape or arbitrary geometric shape). The heat pipe 13 is tightly disposed in the opposite hole 111. The preferred embodiment is illustrated by a single heat pipe 13, and the shape of the heat pipe 13 is selected as an S-shaped heat pipe 13 to correspond. The shape in which the aforementioned accommodation hole 111 is matched is S-shaped, but is not limited thereto. In the specific implementation, the shape of the heat pipe 13 can also be selected as a heat pipe 13 of another shape (such as a U-shaped heat pipe), and the number of the receiving holes 111 and the heat pipe 13 is not limited to the above number, and the third AA can also be designed. 3B shows that a plurality of accommodating holes 111 (such as four accommodating holes 111) are formed on the substrate 11, and a plurality of heat pipes 13 (such as four heat pipes 13) match the accommodating holes 111, and The heat pipe 13 is tightly received in the corresponding receiving hole 111.

The heat pipe 13 has a first side 131, a second side 132 opposite to the first side 131, a third side 133, a fourth side 134 opposite the third side 133, a heat absorption section 135, and a heat dissipation unit. Section 136, the heat pipe 13 has a chamber 137, the inner wall of the chamber 137 is formed with a capillary structure 138 (such as sintered powder or mesh or groove), and the chamber 137 is filled with a working fluid; The first and second sides 131, 132 of the heat pipe 13 are flat, and the heat pipe 13 is firstly processed by mechanical processing (pressing or extrusion processing or rolling or forging processing). The side 131 (or the first and second sides 131, 132) is processed such that the first and second sides 131, 132 are flush (or flat) adjacent to the top side 113 and the bottom side 114 of the substrate 11, respectively. The third and fourth sides 133, 134 of the heat pipe 13 are deformed by the extrusion and laterally expanded and adhered to the opposite inner walls of the corresponding receiving holes 111, so that the substrate 11 and the heat pipe 13 are tightly coupled to each other. The heat sink 1 is constructed. Therefore, the third and fourth sides 133 and 134 of the heat pipe 13 are pressed and deformed to be tightly integrated with the substrate 11 so that the top side 113 and the bottom side 114 of the substrate 11 can be made horizontally. In addition to reducing the amount of material, the components that additionally support the fixed heat pipe 13 can be omitted (for example, it is customary to have a loose heat pipe on the upper bottom plate, and the bottom plate is connected to the bottom plate to support the fixed heat pipe).

2A, 2B, and 4, the heat absorbing section 135 of the heat pipe 13 of the preferred embodiment is located at the center of the substrate 11, and the second side 132 of the heat absorbing section 135 is attached to a heat generating component. 2 (such as a central processing unit or a graphics processor), because the top side 113 (or front side) and the bottom side 114 (or back side) of the substrate 11 are horizontal, the bottom side 114 of the substrate 11 and the second side of the heat pipe 13 The side 132 is at the same horizontal plane, so that the bottom side 114 of the substrate 11 and the second side 132 of the heat pipe 13 can be flattened to the heat generating component 2, and the heat radiating section 136 of the heat pipe 13 in the receiving hole 111 is The method of extending the heat absorbing section 135 to the edge of the adjacent substrate 11 is described, but is not limited thereto. In a specific implementation, the user can design the first and second of the heat absorbing section 135 according to the heat source requirement. The sides 131, 132 are simultaneously attached with a heating element 2 (such as a central processing unit and a graphics processor). In addition, the first side 131 of the heat pipe 13 can be connected to a heat sink 4 having a plurality of heat dissipation fins 41, and one side of the heat sink 4 is flat and corresponds to the first side 131 of the heat pipe 13 and the substrate 11. The top side 113 is in contact with each other, so that the second side 132 of the heat pipe 13 conducts the absorbed heat to the heat dissipating section 136 and the heat sink 4 on the first side 131 to dissipate heat externally, and a part of the heat is also caused by the third side. The four sides 133, 134 are transmitted to the opposite inner walls of the closely-arranged receiving holes 111, so that the heat can be uniformly and quickly transmitted to the entire substrate 11 to achieve the uniform temperature effect, so that the heat sink 4 can be quickly absorbed throughout. The heat on the substrate 11 dissipates heat to the outside.

Therefore, through the design of the heat dissipating device 1 of the present invention, the flatness of the top side 113 and the bottom side 114 of the control substrate 11 is effectively achieved (ie, the front and back sides of the substrate 11 are horizontal), and the material is effectively reduced to save. The effect of cost, as well as the problem of solving the problem of overweight of the conventional pedestal, and thus the effect of uniform temperature. In addition, the present invention utilizes the accommodating hole 111 to directly penetrate the substrate 11, so that the problem of controlling the depth and having tolerances when forming the groove is effectively solved.

Referring to Figures 5 and 5A, there is shown a schematic exploded perspective view of a second preferred embodiment of the present invention. The structure and the connection relationship of the preferred embodiment are the same as those of the first preferred embodiment. Therefore, the difference between the two is that the receiving hole 111 has at least one interference portion 112. The interference portion 112 is described as a convex portion in the preferred embodiment, but is not limited thereto. In the specific implementation, the interference portion 112 may also be selected as a rough surface or an embossing or a concave portion or the aforementioned convex portion. Or a combination of any one or more of a concave portion and a convex portion, wherein the rough surface may be a small flank or a small convex surface or a small particle surface. The interference portion 112 is formed on at least one inner wall of the accommodating hole 111. In the preferred embodiment, the convex portion (bump, ridge or arbitrary geometric shape) is used as the interference portion 112, at least A continuous and/or spaced and/or staggered pattern of protrusions is formed on at least one inner wall surface of the receiving hole 111 (as shown in FIGS. 5 and 5A), and the interference portion 112 and the opposite portion The three sides 133 or the fourth side 134 are in interference with each other to increase the frictional force (or the gripping force); and in another embodiment, the interference portion 112 is a long convex portion from the receiving portion. The receiving hole 111 at the front end of the hole 111 continuously extends from the center of the inner wall to the center of the inner wall of the receiving hole 111 at the rear end of the receiving hole 111, and the interference portion 112 is opposite to the third side 133. Or the fourth side 134 interferes with the interference to increase the tight friction (or grip). Therefore, the interference between the substrate 11 and the heat pipe 13 can be enhanced by the interference generated by the interference portion 112. Therefore, the interference portion 112 formed on the opposite inner walls of the receiving hole 111 can be arbitrarily matched according to user requirements. Choose the design and combine it with Chen Ming.

Please refer to FIG. 6 for a schematic flow chart showing a third preferred embodiment of the present invention, and reference is made to the drawings of FIGS. 1, 2A, 2B, and 7C. The preferred embodiment of the present invention is the method for manufacturing the heat dissipating device 1 of the first preferred embodiment. The method for manufacturing the heat dissipating device 1 includes the following steps:

(S10) A substrate 11 and at least one heat pipe 13 are provided. The substrate 11 has at least one receiving hole 111 extending through the top side 113 and the bottom side 114 of the substrate 11, and the heat pipe 13 is placed on the substrate A gap 14 is formed between the heat pipe 13 and the opposite inner walls of the accommodating hole 111 (ie, the accommodating hole 111 is disposed at a height higher than the top side 113 of the substrate 11 The diameter of the hole 111 is larger than the diameter of the heat pipe 13);

Providing a substrate 11 made of a metal material (such as copper or aluminum) and at least one heat pipe 13 having at least one receiving hole 111, the receiving hole 111 being opposed to the top side 113 of the substrate 11 The bottom side 114 is penetrated, and the heat pipe 13 is placed in the accommodating hole 111 (FIG. 7A). The height of the heat pipe 13 is higher than the top side 113 of the substrate 11. The width of the heat pipe 13 is smaller than the accommodating. Between the heat pipe 13 and the opposite inner walls of the accommodating hole 111, a slit 14 is formed. In other words, the heat pipe 13 is loosely accommodated in the accommodating hole 111. 7B)). The shape of the accommodating hole 111 in the preferred embodiment is described in a meandering shape (such as an S shape), but is not limited thereto. When the specific time is implemented, the shape of the accommodating hole 111 may also be selected as a straight line. Shape (3A is shown) or diagonal (3B shown) or other shape (such as U-shape or geometry), and the shape and number of the heat pipe 13 match the shape and number of the receiving holes 111. Therefore, by using the accommodating hole 111 directly through the substrate 11 by the method of the present invention, it is possible to effectively solve the problem that the depth and the tolerance are required when forming the groove. The heat pipe 13 in the preferred embodiment is a flat heat pipe 13 which is pre-formed and has an S shape. The shape of the heat receiving hole 13 is S-shaped to match the shape of the receiving hole 111. However, the present invention is not limited thereto. The shape of the heat pipe 13 may also be selected as a heat pipe 13 of another shape (such as a U-shaped heat pipe).

(S11) A mold 3 is provided, and an upper die 31 included in the mold 3 is subjected to compression processing on one side of the heat pipe 13 adjacent to the top side 113 of the substrate 11, so that both sides of the heat pipe 13 are subjected to compression processing. The extrusion deformation and lateral expansion fill the gap and abut against the opposite inner walls of the corresponding receiving holes 111, so that the substrate 11 and the heat pipe 13 are tightly coupled and integrated.

A mold 3 is provided, wherein the mold 3 includes an upper die 31 for pressing a side of the heat pipe 13 adjacent to the top side 113 of the substrate 11 (ie, the first side 131 of the heat pipe 13), and the heat pipe is pressed The two sides of the 13 (ie, the third, fourth sides 133, 134 of the heat pipe 13) are deformed by extrusion and laterally expanded to fill the gap 14, thereby allowing the third and fourth sides 133, 134 of the heat pipe 13 to be closely attached to The two opposite inner walls in the hole 111 are accommodated so that the substrate 11 and the heat pipe 13 are tightly coupled to integrally form the heat sink 1. Therefore, the above method can solve the problem that the back surface of the pedestal is poor due to processing problems, and the problem of the conventionally consuming material and the excessive weight can be improved.

After the step S11, the side of the heat pipe 13 adjacent to the top side 113 of the substrate 11 (ie, the first side 131 of the heat pipe 13) is subjected to milling processing or planing to make the top of the substrate 11 The side 113 is flat (or flush) to one side of the heat pipe 13.

In addition, referring to FIG. 4, the second side 132 of the heat pipe 13 (ie, the second side 132 of the heat absorption section 135) can be attached to a heat generating component 2 (such as a central processing unit or a graphics processor). The top side 113 and the bottom side 114 of the substrate 11 are horizontal, and the bottom side 114 of the substrate 11 is at the same level as the second side 132 of the heat pipe 13, so that the bottom side 114 of the substrate 11 and the second side of the heat pipe 13 The flat surface of the heat pipe 13 of the heat pipe 13 in the accommodating hole 111 is extended to the edge adjacent to the substrate 11 for explanation, but is not limited. In this case, in the specific implementation, the user can design the first and second sides 131 and 132 of the heat absorption section to be respectively disposed with a heating element 2 (such as a central processing unit and a graphics processor) according to the requirements of the heat-dissipating source. . In addition, the first side 131 of the heat pipe 13 can be connected to a heat sink 4 having a plurality of heat dissipation fins 41, and one side of the heat sink 4 is flat and corresponds to the first side 131 of the heat pipe 13 and the substrate 11. The top side 113 is attached.

Therefore, the method for constructing the heat dissipating device 1 by closely bonding the substrate 11 and the heat pipe 13 of the present invention can effectively control the front and back flatness of the substrate 11 and effectively reduce the material, and further achieve the effect of uniform temperature.

Please refer to FIG. 8 for a schematic flow chart showing a fourth preferred embodiment of the present invention, supplemented by reference to FIGS. 5 and 5A. The preferred embodiment of the present invention is the method for manufacturing the heat dissipating device 1 of the second preferred embodiment. The method for manufacturing the heat dissipating device 1 includes the following steps:

(S20) A substrate 11 and at least one heat pipe 13 are provided. The substrate 11 has at least one accommodating hole 111 extending through the top side 113 and the bottom side 114 of the substrate 11, and the accommodating hole 111 is formed. At least one interference portion 112 is formed on at least one inner wall, and the heat pipe 13 is placed in the accommodating hole 111, and the height of the heat pipe 13 is higher than the top side 113 of the substrate 11, the heat pipe 13 is a gap 14 is formed between the opposite inner walls of the receiving hole 111;

Providing a substrate 11 made of a metal material (such as copper or aluminum) and at least one heat pipe 13 having at least one receiving hole 111, the receiving hole 111 being opposed to the top side 113 of the substrate 11 The bottom side 114 is penetrated, and at least one inner wall of the receiving hole 111 is formed with at least one interference portion 112, and the interference portion 112 can be a convex portion (as shown in FIG. 5) or a long convex portion (such as Figure 11), but it is not limited to this. In a specific implementation, the interference portion 112 may also be mechanically formed into a rough surface or an embossing or a concave portion or a concave portion, or a combination thereof, wherein the rough surface may be a small tooth. The surface or the small convex surface or the small particle surface, and the interference portion 112 may also be selected to form the interference portion 112. The interference portion 112 is a concave portion (or a convex portion or a concave portion or a concave portion) integrally formed in the receiving portion 112. An inner wall of the hole 111 or the interference portion 112 may be changed to a plurality of interference portions 112 formed on an inner wall of the receiving hole 111. The heat pipe 13 in the preferred embodiment is a flat heat pipe 13 which has been pre-formed, but is not limited thereto. In a specific implementation, the heat pipe 13 may also be optionally provided as a circular shaped heat pipe 13 (as shown in FIG. 11).

Then, the heat pipe 13 is placed in the accommodating hole 111. The height of the heat pipe 13 is higher than the top side 113 of the substrate 11. The width of the heat pipe 13 is smaller than the width of the accommodating hole 111, and the heat pipe 13 is A gap 14 is formed between the two opposite inner walls of the accommodating hole 111. In other words, the heat pipe 13 is loosely accommodated in the accommodating hole 111. The shape of the accommodating hole 111 in the preferred embodiment is described in a meandering shape (such as an S shape), but is not limited thereto. When the specific time is implemented, the shape of the accommodating hole 111 may also be selected as a straight line. The shape (as shown in FIG. 3A) or the diagonal shape (as shown in FIG. 3B), and the shape and number of the heat pipe 13 match the shape and number of the receiving holes 111. Therefore, by using the accommodating hole 111 directly through the substrate 11 by the method of the present invention, it is possible to effectively solve the problem that the depth and the tolerance are required when forming the groove.

(S21) A mold 3 is provided, and the upper mold 31 included in the mold 3 is subjected to compression processing on one side of the heat pipe 13 adjacent to the top side 113 of the substrate 11, so that one side of the heat pipe 13 is subjected to compression processing. Extrusion deformation and lateral expansion fill the gap 14 and interfere with the interference portion 112 of an inner wall of the receiving hole 111, while the other side of the heat pipe 13 is deformed by extrusion and laterally expanded. The slit 14 is in close contact with the other inner wall of the receiving hole 111, so that the substrate 11 and the heat pipe 13 are tightly coupled and integrated.

A mold 3 is provided, and an upper mold 31 (as shown in FIG. 7C) included in the mold 3 is adjacent to the heat pipe 13 side adjacent to the top side 113 of the substrate 11 (ie, the first side 131 or the second side of the heat pipe 13) Side 132) is subjected to compression processing. In the specific implementation, as shown in FIG. 10D, the mold 3 is also modified to include the upper stamper 31 and a lower stamper 32 opposite to the upper stamper 31, respectively, through the upper stamper 31 and the lower stamper 32, respectively. The side of the heat pipe 13 adjacent to the top side of the substrate 11 and the other side of the heat pipe 13 adjacent to the bottom side of the substrate 11 are simultaneously subjected to compression processing. The processing method of the mold 3 which is preferably implemented in the preferred embodiment is a stamping processing method, but the invention is not limited thereto. In the specific implementation, the extrusion processing or the rolling processing or the forging processing may be selected. Chen Ming.

Then, one side of the heat pipe 13 (such as the third side 133) is deformed by extrusion and laterally expanded to fill the gap 14 and interfere with the interference portion 112 of the inner wall of the receiving hole 111. At the same time, the other side of the heat pipe 13 (such as the fourth side 134) is also deformed by extrusion and laterally expanded to fill the gap 14 so that the third and fourth sides 133, 134 of the heat pipe 13 are closely attached to the opposite side. The two opposite inner walls of the receiving hole 111 are arranged such that the substrate 11 and the heat pipe 13 are tightly coupled to form the heat dissipating device 1. One side of the heat pipe 13 of the preferred embodiment is the first side 131, but is not limited thereto. Therefore, the interference is generated by the interference portion 112 to increase the pressing force (or the gripping force), thereby enhancing the effect of the tightness of the substrate 11 and the heat pipe 13.

In addition, in the specific implementation, when the plurality of interference portions 112 are formed on the opposite inner walls of the accommodating hole 111 and are subjected to compression processing, both sides of the heat pipe 13 are subjected to extrusion deformation and lateral expansion. The slit 14 is in interference with the plurality of interference portions 112 of the opposite inner walls of the receiving hole 111, so that the substrate 11 and the heat pipe 13 are tightly coupled and integrated, so that interference is generated through the plurality of interference portions 112 to increase the pressure. The frictional force (or gripping force) is used to enhance the effect of the tightness of the substrate 11 and the heat pipe 13.

After the step S21, the top side 113 of the substrate 11 and the side adjacent to the heat pipe 13 are further subjected to press working or milling processing or planing, so that the top side 113 of the substrate 11 is flattened by the heat pipe 13 One side (ie the first side 131).

Therefore, the method for constructing the heat dissipating device 1 by the substrate 11 and the heat pipe 13 of the present invention is closely combined, so that the front and back flatness of the substrate 11 can be effectively controlled, and the cost can be saved, and the effect of uniform temperature can be achieved.

Referring to FIG. 9, a flow chart showing a fifth preferred embodiment of the present invention is shown, and reference is made to FIGS. 2A, 2B, and 10D. The steps S40 and S41 of the manufacturing method of the preferred embodiment are substantially the same as the steps S10 and S11 of the fourth preferred embodiment, so the same portions are not described in detail, and the step S40 of the preferred embodiment is mainly The flat heat pipe of step S10 is modified into a circularly shaped heat pipe, and the mold of the foregoing step S11 is modified to include an upper die 31 and a lower die 32. That is, the manufacturing method of the preferred embodiment includes the following steps:

(S40) providing the substrate 11 and at least one circularly shaped heat pipe 13 (FIG. 10A) having at least one receiving hole 111 extending through the top side 113 and the bottom side of the substrate 11. 114, the heat pipe 13 is placed in the accommodating hole 111 (FIG. 10B), and the height of the heat pipe 13 is higher than the top side 113 of the substrate 11, and the heat pipe 13 and the accommodating hole 111 are opposite to the accommodating hole 111. The gap 14 is formed between the two opposite inner walls (Fig. 10C). The heat pipe 13 of the preferred embodiment is a circularly shaped and S-shaped heat pipe 13 to match the shape of the receiving hole 111. The shape is explained, but it is not limited to this. In a specific implementation, the heat pipe 13 may also be optionally provided as a flat heat pipe 13 that has been pre-formed (as shown in FIG. 7A), and the shape of the heat pipe 13 may also be a heat pipe 13 of other shapes (such as a U-shaped heat pipe). ).

(S41) The mold 3 is provided, and the upper mold 31 and the lower mold 32 (as shown in FIG. 10D) included in the mold 3 respectively face one side and the phase of the heat pipe 13 adjacent to the top side 113 of the substrate 11. The other side of the heat pipe 13 adjacent to the bottom side of the substrate 11 is simultaneously subjected to compression processing, so that both sides of the heat pipe 13 are deformed by extrusion and laterally expanded to fill the gap 14 and closely adhere to the corresponding hole. The two opposite inner walls of the 111 (Fig. 2B) are such that the substrate 11 and the heat pipe 13 are tightly coupled and integrated. Therefore, the above-described method of the present invention can solve the conventional problem of poor flatness of the back surface of the susceptor due to processing problems, and further improve the problem of conventionally consuming materials and excessive weight. The processing method of the mold 3 in the preferred embodiment is described as a stamping processing method, but is not limited thereto. In the specific implementation, extrusion processing or rolling processing (Fig. 12) or forging processing may be selected. Other ways, together with Chen Ming.

After the step S41, the one side and the other side of the heat pipe 13 adjacent to the top side 113 and the bottom side 114 of the substrate 11 (ie, the first and second sides 131, 132 of the heat pipe 13) are further subjected to press working. Or milling or planing, such that the top side 113 and the bottom side 114 of the substrate 11 respectively cut one side and the other side of the heat pipe 13.

Therefore, the method for constructing the heat dissipating device 1 by closely bonding the substrate 11 and the heat pipe 13 of the present invention can effectively control the front and back flatness of the substrate 11 and effectively reduce the material, and further achieve the effect of uniform temperature.

As described above, the present invention has the following advantages:

1. The top side and the bottom side of the substrate may not be damaged, so that the flatness of the top side and the bottom side of the substrate is good.

2. Can reduce the use of materials to achieve cost savings.

3. Has a uniform temperature effect.

It is to be understood that the above-described methods, shapes, configurations, and devices of the present invention are intended to be included within the scope of the present invention.

1‧‧‧heating device

11‧‧‧Substrate

113‧‧‧ top side

114‧‧‧ bottom side

13‧‧‧heat pipe

135‧‧‧heat absorption section

136‧‧‧heating section

Claims (16)

A heat sink includes:
a substrate having at least one receiving hole, a top side and a bottom side, the receiving hole is penetrated from the top side through the bottom side;
At least one heat pipe, the fastening device is disposed opposite to the receiving hole, and the heat pipe has a first side, a second side opposite to the first side, a third side, and a third side opposite to the third side On the four sides, the first side and the second side are respectively adjacent to the top side and the bottom side of the substrate, and the third and fourth sides are pressed and deformed to be closely attached to the opposite inner walls of the corresponding receiving holes, so that The substrate is tightly integrated with the heat pipe. The heat dissipation device of claim 1, wherein the accommodating hole has at least one interference portion formed on at least one inner wall of the accommodating hole, and the interference portion is opposite to the third portion The side or fourth side is interfering with the interference, which serves to increase the tight friction. The heat dissipating device of claim 2, wherein the interference portion is a rough surface or an embossing or a convex portion or a concave portion or a concave portion or a convex portion, or a combination thereof. The heat dissipating device according to claim 1, wherein the receiving hole has a shape of a linear shape, a diagonal shape or a meander shape. The heat dissipating device of claim 1, wherein the first and second sides of the heat pipe are respectively attached to the plurality of heat generating components. The heat dissipating device of claim 1, wherein the second side of the heat pipe is opposite to a heat generating component, and the first side of the heat pipe is connected to a heat sink. The heat sink according to claim 1, wherein the substrate is made of a metal material. A method for manufacturing a heat dissipating device includes providing a substrate and at least one heat pipe, the substrate having at least one receiving hole, the receiving hole penetrating through a top side and a bottom side of the substrate, and placing the heat pipe opposite to the receiving a hole in the hole, and the height of the heat pipe is higher than a top side of the substrate, a gap is formed between the heat pipe and two opposite inner walls opposite to the receiving hole; and a die is provided to the upper die of the die One side of the heat pipe adjacent to the top side of the substrate is subjected to compression processing, so that both sides of the heat pipe are deformed by extrusion and laterally expanded to fill the gap and closely adhere to the two corresponding holes. The substrate is tightly coupled to the heat pipe on the inner wall. The method for manufacturing a heat sink according to claim 8, wherein a mold is provided, and a step of pressing the one side of the heat pipe adjacent to the top side of the substrate is performed by an upper mold included in the mold The method further includes providing the mold, wherein the upper mold and the lower mold included in the mold respectively are on one side of the heat pipe adjacent to the top side of the substrate and the other side of the heat pipe adjacent to the bottom side of the substrate Apply compression processing. The method for manufacturing a heat sink according to claim 8 , wherein a mold is provided, and an upper mold included in the mold applies pressure to one side of the heat pipe adjacent to the top side of the substrate, The two sides of the heat pipe are squeezed and deformed to fill the gap and adhere to the opposite inner walls corresponding to the corresponding holes, so that the substrate and the heat pipe are tightly integrated and integrated, and further includes One side of the substrate adjacent to the heat pipe is subjected to press working or milling processing or planing, so that the top side of the substrate is flattened on one side of the heat pipe. The heat sink manufacturing method according to claim 9, wherein the mold is provided, wherein the upper mold and the lower mold included in the mold respectively face one side of the heat pipe adjacent to the top side of the substrate The other side of the heat pipe adjacent to the bottom side of the substrate is simultaneously subjected to compression processing, so that both sides of the heat pipe are deformed by extrusion and laterally expanded to fill the gap and closely adhere to the two corresponding holes. After the step of integrally bonding the substrate and the heat pipe to the inner wall, the method further comprises pressing or milling the side and the other side of the heat pipe adjacent to the top side and the bottom side of the substrate. Or planing, so that the top side and the bottom side of the substrate respectively cut one side and the other side of the heat pipe. The heat sink manufacturing method of claim 8, wherein at least one inner wall of the receiving hole is formed with at least one interference portion. The heat sink manufacturing method according to claim 12, wherein the interference portion is a rough surface or an embossing or a convex portion or a concave portion or a concave portion or a convex portion, or a combination thereof. The method for manufacturing a heat sink according to claim 8, wherein the shape of the receiving hole is linear or oblique or zigzag. The method for manufacturing a heat sink according to claim 8, wherein the first and second sides of the heat pipe are respectively attached to the plurality of heat generating components. The heat sink manufacturing method of claim 8, wherein the first side of the heat pipe is butted to a heat sink, and the second side of the heat pipe is opposite to the heat generating component.