TW201704760A - Method of manufacturing current sensing resistor - Google Patents

Abstract

Disclosed is a method of manufacturing a current sensing resistor, and more particularly, is a method of manufacturing a current sensing resistor, which is capable of preventing the oxidation of a resistor element and a connection piece, reducing errors, and enabling precise sensing because both the bonding of the resistor element and the connection piece and the bonding of a sensing terminal are performed in a vacuum or inert gas atmosphere.

Description

Method of manufacturing current sensing resistor

The present invention relates to a method of fabricating a current sensing resistor, and more particularly to a method of fabricating a current sensing resistor that avoids oxidation of a resistor element and a connector, reduces errors, and because The combination of the resistor element and the connector and the combination of a sensing terminal are implemented in a vacuum environment or an inert gas environment to achieve accurate sensing.

In general, a shunt resistor for sensing current, when measuring a DC charging current, is used as a division resistor, and preferably has a division resistor A low resistance value below 1 Ω to avoid a voltage drop and energy loss.

The shunt resistor can include, for example, a precision non-conductive fixed coil (PRN) resistor, a non-conductive ultra-mini coil (SMW) resistor, a non-conductive metal plate resistor (MPR), and a current sensing resistor. (CSR), or a high power CSR.

In these examples, the high-power CSR is used to accurately sense the voltage, current, and temperature of the vehicle battery, as well as to estimate the state of charge, life, and start-up capability of the battery, and to transmit battery status information to the electronic control unit (ECU) ) to allow the various devices connected to the battery to operate correctly.

In the meantime, a method of manufacturing a current sensing resistor is disclosed in Korean Patent Registration No. 10-1461829 filed by the applicant of the present invention. More particularly, the method of fabricating a current sensing resistor disclosed in the registered patent includes: providing a resistor element, a first connector, and a second connector, and the first connector and the The second connecting members are respectively coupled to opposite ends of the resistor element (step S1); pressing a sensing terminal having a substrate and a sensing protrusion, and then bending the sensing protrusion upward from the substrate ( Step S2): bonding the substrate to the upper surface of the first connecting member and the upper surface of the second connecting member (step S3). Step S1 is carried out using an electron beam of 100,000 to 150,000 volts (V) in a vacuum environment of at least 10 ^-5 Torr.

In the registered patent, although the soldering element and the resistor element are soldered to each other, since the soldering system is implemented in a vacuum environment, oxidation does not occur, but since the soldering of the sensing terminal is via a conventional bonding method ( For example, using a hot plate for heating or a reflow soldering, the connector may be exposed to outside air and may be oxidized.

Accordingly, the present invention has been made in view of the problems of the prior art described above, and an object of the present invention is to provide a method of manufacturing a current sensing resistor capable of preventing oxidation and reduction of a resistor element and a connector. The error, and because the combination of the resistor element and the connecting member (step S1) and a sensing terminal (step S4) are implemented in a vacuum environment or an inert gas environment, accurate sensing can be achieved.

According to an aspect of the present invention, the above object and other objects can be attained by providing a method of manufacturing a current sensing terminal, the current sensing terminal being configured such that a pair of connecting members each having a perforation are coupled to a An opposite end of the resistor element, and a sensing terminal coupled to each of the connecting members, the method comprising: soldering the resistor element and the connecting members to each other in a vacuum environment or an inert gas environment to form a a bonding structure; applying a solder to each of the connecting members of the bonding structure; disposing the sensing terminal at a soldering portion of the bonding structure; and soldering the bonding structure by heating in a vacuum environment or an inert gas atmosphere The bonding structure has a bonding structure on which the sensing terminal is disposed, wherein the step of soldering and the step of soldering are performed in a vacuum environment or an inert gas environment, thereby avoiding oxidation of the resistor element and the connecting member.

In the step of disposing, the bonding structure and the sensing terminal are coupled to the lower heating plate and the upper heating plate, and when the electric power is applied to the lower heating plate and the upper heating plate, the lower heating plate and the upper portion The heating plate dissipates heat energy, and the step of soldering can be performed by applying electric power to the lower heating plate and the upper heating plate in a vacuum environment or an inert gas atmosphere.

In the step of disposing, the bonding structure and the sensing terminal can be fixed by a clamp, the clamp can be located between the bonding structure and the upper heating plate, and the clamping device has a terminal insertion hole and a connecting member A fixing boss for fixing the sensing terminal, the connecting fixing protrusion for fixing the bonding structure by engaging the through hole.

The upper heating plate may have a terminal fixing protrusion on one of the bottom surfaces thereof, the terminal fixing protrusion for fixing the sensing terminal by being inserted into the terminal insertion hole together with the sensing terminal.

The step of disposing may include: disposing the bonding structure on the lower heating plate; stacking the bonding structure on the jig such that the connecting member fixing protrusion is fitted to the through hole; inserting the sensing terminal into the terminal Inserting a hole to be placed over the solder; and stacking the jig above the upper heating plate such that the terminal fixing protrusion is inserted into the terminal insertion hole.

The lower heating plate and the upper heating plate may form a carbon heating element, and the jig may be formed of a metal material.

The lower heating plate and the upper heating plate can accommodate a plurality of bonding structures, and the clamping device can fix the bonding structures and the plurality of sensing terminals, wherein the bonding structure and the sensing terminal are the lower heating plate and the upper The heating plate and the jig are controlled so as to be integrally soldered to each other.

Hereinafter, embodiments of the invention will be described in detail with reference to the drawings.

1 is a perspective view of a current sensing resistor in accordance with the present invention.

Referring to FIG. 1, the current sensing resistor 100 is used to sense a battery current and includes a pair of connectors 120, a resistor element 110, and a pair of sensing terminals 130.

The connector 120 can have a flat plate shape. Each of the connectors 120 may be formed of a conductive material (eg, copper) and may have a through hole 123 for electrical connection.

The resistor element 110 is located between the connectors 120 and is used to cause a voltage drop. The resistor element 110 can be formed of a low resistance material having a particular resistance value greater than the connectors 120, and more particularly comprising copper (Cu), manganese (Mn), nickel (Ni) ) alloys are formed.

Each of the sensing terminals 130 has a substrate 131 and a sensing protrusion 133, and the sensing protrusion 133 is integrally formed with the substrate to be bent upward from the substrate 131.

The respective steps of a method of fabricating a current sensing resistor in accordance with the present invention will be described in detail below.

2 is a flow chart illustrating a method of fabricating the current sensing resistor in accordance with the present invention. 3 is a diagram illustrating the use of an electron beam for soldering a connector and a resistor element in a vacuum chamber in accordance with the present invention. 4 is a perspective view showing the application of solder to the connector in accordance with the present invention.

Referring to FIGS. 1 through 4, a method of fabricating the current sensing resistor according to the present invention may generally include: soldering the resistor element 110 and the connectors 120 to each other in a vacuum environment or an inert gas environment to form a bonding structure 101 (step S1), a solder 125 is applied to each of the connecting members 120 of the bonding structure 101 (step S2), the sensing terminal 130 is disposed on the solder 125 (step S3), and The bonding structure 101 is heated in a vacuum environment or an inert gas atmosphere to solder the bonding structure 101 having the sensing terminal 130 disposed thereon (step S4).

In step S1, as shown in FIG. 3, the resistor element 110 and the connector 120 are bonded to each other via, for example, electron beam welding in a vacuum environment or an inert gas atmosphere to form the bonding structure 101.

The electron beam welding is carried out in a vacuum chamber maintained at a vacuum pressure of 10 ^-5 Torr, so that the resistor element 110 and the connectors 120 can be preferably avoided. Oxidation. Furthermore, since an emitted electron beam instantaneously applies high density energy (for example, 100 kw/mm ² ), the electron beam welding preferably results in very small welding deformation.

Meanwhile, since the soldering system in step S4 is implemented in a vacuum environment or an inert gas atmosphere similar to the step S1, oxidation of the resistor element 110 and the connecting member 120 can be more effectively avoided during soldering.

FIG. 5 is a perspective view showing the bonding structure and the sensing terminal according to the present invention, wherein the bonding structure and the sensing terminal are fixed via a heating plate and a clamp.

Referring to FIG. 5, step S3 includes using the lower heating plate 200 and the upper heating plate 210 to position the bonding structure 101 and the sensing terminal 130, and fixing the sensing terminal 130 using a clamp 230.

The lower heating plate 200 and the upper heating plate 210 may form a carbon heating element, wherein when power is applied to the carbon heating element, the carbon heating element dissipates heat energy via electrical resistance.

The lower heating plate 200 includes a bottom surface 201. The joint structure 101 is disposed on the bottom surface 201, and a stepped portion 203 is provided around the bottom surface 201 to limit the moving range of the joint structure 101, and a The edge portion 205 is provided around the step portion 203.

A plurality of bonding structures 101 are received on the bottom surface 201 of the lower heating plate 200, and the jig 230 is disposed to fix the bonding structures 101 and the plurality of sensing terminals 130. Thus, the bonding structure 101 and the sensing terminal 130 are controlled by the lower heating plate 200, the upper heating plate 210, and the clamp 230. Accordingly, in the step S4 which will be described below, the controlled bonding structure and the sensing terminal are integrally soldered to each other, which is advantageous for mass production.

The upper heating plate 210 has a flat shape corresponding to the lower heating plate 200, and an edge region of the upper heating plate 210 is in contact with an edge portion 205 of the lower heating plate 200, so that when electric power is applied to the lower heating plate 200 and When the upper plate 210 is heated, the lower heating plate 200 and the upper heating plate 210 generate heat by conduction.

Referring to FIG. 6B, the clamp 230 is configured to fix the joint structure 101 and the sensing terminal 130, and has a terminal insertion hole 231 and a connector fixing protrusion 233. The respective sensing terminals 130 are inserted into the terminals. In the hole 231, the connector fixing convex portion 233 is provided to be fitted to the respective through hole 123.

Each of the terminal insertion holes 231 has a square shape corresponding to the base 131 of the sensing terminal 130. The base 131 of the sensing terminal 130 has a square plate shape to prevent the sensing terminal 130 inserted therein from moving.

Each of the connector fixing protrusions 233 is formed on a lower surface of the jig 230 and is used to fix the connector 120 by being inserted into the through hole 123. The connector fixing convex portion 233 may have a semicircular shape to be inserted into one side of the through hole 123, and one side of the through hole 123 has a circular shape.

Unlike the upper heating plate 210 and the lower heating plate 200, the jig 230 may be formed of a metal material. This is because the jig 230 formed of a metal material (for example, aluminum) has excellent thermal conductivity and ensures easy soldering, and unlike the carbon heating element, the high strength of the jig 230 formed by the metal material, even if it is used for a period of time It will not cause wear or deformation for a long time.

At the same time, the upper heating plate 210 has a terminal fixing convex portion 211 on its lower surface.

The terminal fixing protrusion 211 is inserted into the terminal insertion hole 231 together with the sensing terminal 130 for pressing and fixing the bottom surface 201 and the sensing protrusion 133 of the sensing terminal 130.

6A to 6C are cross-sectional views showing the sequence of step S3 according to the present invention, and Fig. 6D is a cross-sectional view showing step S4 according to the present invention.

Referring to FIG. 6A, a bonding structure 101 to which the solder 125 is applied in step S2 is disposed on the lower heating plate 200.

Referring to FIG. 6B, the jig 230 is stacked on the bonding structure 101 such that the connector fixing protrusion 233 formed on the lower surface of the jig 230 fits the through hole 123 of the connector 120, and the terminal insertion hole 231 is located in the solder. Above 125. Then, the sensing terminal 130 is inserted into the terminal insertion hole 231 formed in the jig 230.

Referring to FIGS. 5 and 6C, once the upper heating plate 210 has been stacked on the jig 230 such that the terminal fixing convex portion 211 is inserted into the terminal insertion hole 231, temporary coupling is completed. Here, when a fixing pin 215 is fitted through a hole 213 and a recess 207, a plurality of coupling structures 101 are integrally controlled, and the hole 213 is formed on one side of the upper heating plate 210, and the recess 207 is formed in the One side of the lower heating plate 200.

Referring to FIG. 6D, a plurality of current sensing resistors 100a fixed by the lower heating plate 200, the upper heating plate 210, and the clamp 230 are disposed in the vacuum chamber 250. After a vacuum is formed inside the vacuum chamber 250, power is applied to the lower heating plate 200 and the upper heating plate 210 to achieve soldering using heat energy radiated from the lower heating plate 200 and the upper heating plate 210. .

In summary, the method of manufacturing a current sensing resistor of the present invention can avoid oxidation of a resistor component and a connector, and because the resistor component is soldered to the connector (step S1) and the sense The soldering of the measuring terminals (step S4) is carried out in a vacuum environment or an inert gas environment to reduce errors, and accurate sensing is achieved due to the reduction of errors.

Although the exemplary embodiments of the present invention have been disclosed for illustrative purposes, it will be understood by those of ordinary skill in the art Various modifications, additions and substitutions under the spirit are possible.

Therefore, the scope of the invention should be limited and limited by the embodiments described herein, and the scope of the invention should be

100‧‧‧current sensing resistor
100a‧‧‧current sensing resistor
101‧‧‧Combination structure
110‧‧‧Resistor components
120‧‧‧Connecting parts
123‧‧‧Perforation
125‧‧‧ solder
130‧‧‧Sensor terminal
131‧‧‧Base
133‧‧‧Sensing protrusions
200‧‧‧ Lower heating plate
201‧‧‧ bottom surface
203‧‧‧step part
205‧‧‧Edge section
207‧‧‧ dent
210‧‧‧Upper heating plate
211‧‧‧ terminal fixing convex
213‧‧‧ hole
215‧‧‧ fixed needle
230‧‧‧ fixture
231‧‧‧Terminal insertion hole
233‧‧‧Connector fixing projection
250‧‧‧vacuum chamber
S1~S4‧‧‧ steps

The above-mentioned objects, features, and other objects, features and advantages of the present invention will be more clearly understood from . 2 is a flow chart illustrating a method of fabricating the current sensing resistor in accordance with the present invention. [Fig. 3] A diagram illustrating the use of an electron beam for soldering a connector and a resistor element in a vacuum chamber in accordance with the present invention. Fig. 4 is a perspective view showing the application of solder to the connector in accordance with the present invention. FIG. 5 is a perspective view showing a joint structure and a sensing terminal according to the present invention, wherein the joint structure and the sensing terminal are fixed via a heating plate and a clamp. 6A to 6C are cross-sectional views illustrating the sequence of step S3 in accordance with the present invention. Fig. 6D is a cross-sectional view showing the step S4 according to the present invention.

S1~S4‧‧‧ steps

Claims (7)

A method of fabricating a current sensing terminal, the current sensing terminal being configured such that a pair of connectors each having a perforation are coupled to opposite ends of a resistor element, and a sensing terminal is coupled to each of the a connecting member, the method comprising: welding the resistor element and the connecting members to each other in a vacuum environment or an inert gas environment to form a bonding structure; applying a solder to each of the connecting members of the bonding structure; The sensing terminal is disposed at a soldering portion of the bonding structure; and soldering the bonding structure having the sensing terminal disposed thereon by heating the bonding structure in a vacuum environment or an inert gas environment, wherein the bonding Both the step and the soldering step are carried out in a vacuum environment or an inert gas atmosphere, thereby avoiding oxidation of the resistor element and the connectors. The method of claim 1, wherein in the step of disposing, the bonding structure and the sensing terminal are coupled to a lower heating plate and an upper heating plate, and when electric power is applied to the lower heating plate and the upper heating In the case of the plate, the lower heating plate and the upper heating plate dissipate heat energy, and wherein the step of soldering is performed by applying electric power to the lower heating plate and the upper heating plate in a vacuum environment or an inert gas atmosphere. The method of claim 2, wherein in the step of disposing, the bonding structure and the sensing terminal are fixed by a clamp, and wherein the fixture is located between the bonding structure and the upper heating plate And the fixture has a terminal insertion hole for fixing the sensing terminal, and a connector fixing protrusion for fixing the bonding structure by engaging the through hole. The method of claim 3, wherein the upper heating plate has a terminal fixing protrusion on a bottom surface thereof, the terminal fixing protrusion being used to be inserted into the terminal insertion hole together with the sensing terminal. The sensing terminal is fixed. The method of claim 4, wherein the step of disposing comprises: disposing the bonding structure on the lower heating plate; stacking the bonding structure on the jig such that the connecting member fixing protrusion is fitted to the through hole; The sensing terminal is inserted into the terminal insertion hole to be placed over the solder; and the jig is stacked on the upper heating plate such that the terminal fixing protrusion is inserted into the terminal insertion hole. The method of claim 3, wherein the lower heating plate and the upper heating plate form a carbon heating element, and wherein the holder is formed of a metallic material. The method of claim 3, wherein the lower heating plate and the upper heating plate receive a plurality of bonding structures, and the clamping device fixes the bonding structure and the plurality of sensing terminals, whereby the bonding structure and the sensing terminal The lower heating plate, the upper heating plate, and the jig are controlled to be integrally welded to each other.