TW201704408A - Adhesive tape and method for producing adhesive tape - Google Patents

Adhesive tape and method for producing adhesive tape Download PDF

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Publication number
TW201704408A
TW201704408A TW105115023A TW105115023A TW201704408A TW 201704408 A TW201704408 A TW 201704408A TW 105115023 A TW105115023 A TW 105115023A TW 105115023 A TW105115023 A TW 105115023A TW 201704408 A TW201704408 A TW 201704408A
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adhesive tape
adhesive layer
adhesive
weight
gel fraction
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TW105115023A
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Chinese (zh)
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Jia-Mo Guo
Katsunori Toyoshima
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Sekisui Chemical Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02Vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06Copolymers with styrene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02Homopolymers or copolymers of hydrocarbons
    • C09J125/04Homopolymers or copolymers of styrene
    • C09J125/08Copolymers of styrene
    • C09J125/10Copolymers of styrene with conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers

Abstract

The purpose of the present invention is to provide: an adhesive tape which has excellent heat resistance and is not susceptible to increase of the adhesive force even after a long period of time or at high temperatures; and a method for producing this adhesive tape. The present invention is an adhesive tape having a base layer and an adhesive layer, and wherein the adhesive layer contains a styrene elastomer and has a gel fraction of 70% by weight or more.

Description

黏著帶及黏著帶之製造方法 Adhesive tape and adhesive tape manufacturing method

本發明係關於一種耐熱性優異,且隨時間經過或於高溫下黏著力亦不易增強之黏著帶、及該黏著帶之製造方法。 The present invention relates to an adhesive tape which is excellent in heat resistance and which is not easily cured by adhesion over time or at a high temperature, and a method of producing the adhesive tape.

黏著帶由於可簡便地進行接合,故而用於各種產業領域。於建築領域中,養護片材之暫時固定、內飾材料之貼合等中使用黏著帶,於汽車領域中,片材、感測器等內飾零件之固定、側飾條、側窗遮陽簾等外飾零件之固定等中使用黏著帶,於電氣電子領域中,模組組裝、對模組之殼體之貼合等中使用黏著帶。又,作為用以暫時保護例如光學裝置、金屬板、經塗裝之金屬板、樹脂板、玻璃板等構件之表面之表面保護材料,亦使用黏著帶。 Adhesive tapes are used in various industrial fields because they can be easily joined. In the field of construction, adhesive tape is used for temporary fixing of maintenance sheets, bonding of interior materials, etc. In the automotive field, fixings of interior parts such as sheets and sensors, side trims, side window shades Adhesive tapes are used in the fixing of exterior parts, etc. In the field of electrical and electronic applications, adhesive tapes are used for assembly of modules, bonding of housings of modules, and the like. Further, as a surface protective material for temporarily protecting the surface of a member such as an optical device, a metal plate, a coated metal plate, a resin plate, or a glass plate, an adhesive tape is also used.

對於黏著帶,根據其用途而要求拉伸強度等機械性能或適當之黏著力等各種性能。例如,於暴露於高溫環境下之用途中,於該高溫環境下黏著力亦不會降低之較高之耐熱性較為重要。又,於作為表面保護材料之用途中,要求隨時間經過或於高溫下亦不存在接著增強之情況,可不殘留糊劑而剝離之性能(低黏著增強性)等。 For the adhesive tape, various properties such as mechanical properties such as tensile strength or appropriate adhesion are required depending on the use. For example, in applications exposed to high temperatures, high heat resistance is not important in the high temperature environment. Further, in the use as a surface protective material, it is required that the film may not be adhered with time or at a high temperature, and the resin may be peeled off without leaving a paste (low adhesion enhancing property).

作為耐熱性或低黏著增強性優異之黏著帶,已知有含有聚矽 氧系黏著劑組成物作為黏著成分之黏著帶等(例如專利文獻1等)。然而,習知之耐熱性優異之黏著帶通常藉由將於適當之有機溶劑中溶解有黏著成分之溶液塗敷於基材上並使之乾燥而形成黏著劑層的所謂塗敷法而製造。藉由此種塗敷法所製造之黏著帶存在於黏著劑層中殘留有機溶劑而發生糊劑殘留之問題。 As an adhesive tape excellent in heat resistance or low adhesion enhancement, it is known to contain polybenzazole. The oxygen-based adhesive composition is used as an adhesive tape for an adhesive component (for example, Patent Document 1). However, conventionally known adhesive tapes having excellent heat resistance are usually produced by a so-called coating method in which a solution in which an adhesive component is dissolved in a suitable organic solvent is applied to a substrate and dried to form an adhesive layer. The adhesive tape produced by such a coating method has a problem that residual organic resin is left in the adhesive layer to cause paste residue.

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

專利文獻1:日本特開2003-96429號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2003-96429

本發明人等研究使用苯乙烯系彈性體作為構成黏著帶之黏著劑層之黏著成分。含有苯乙烯系彈性體之黏著劑層可發揮較高之初始黏著性,並且可藉由擠出層壓、擠出塗覆等積層法或擠出成形法等而成形,故而可不使用有機溶劑而容易地製造黏著帶。然而,含有苯乙烯系彈性體之黏著劑層存在耐熱性較差,隨時間經過或於高溫下發生接著增強之問題。 The present inventors have studied the use of a styrene-based elastomer as an adhesive component of an adhesive layer constituting an adhesive tape. The adhesive layer containing a styrene-based elastomer can exhibit high initial adhesion, and can be formed by a lamination method such as extrusion lamination or extrusion coating, or an extrusion molding method, and the like, so that no organic solvent can be used. Easy to make adhesive tape. However, the adhesive layer containing a styrene-based elastomer has a problem of poor heat resistance, and subsequent reinforcement occurs over time or at a high temperature.

本發明係鑒於上述現狀,其目的在於提供一種耐熱性優異且隨時間經過或於高溫下黏著力亦不易增強之黏著帶、及該黏著帶之製造方法。 The present invention has been made in view of the above circumstances, and an object thereof is to provide an adhesive tape which is excellent in heat resistance and which is not easily cured with an adhesive force over time or at a high temperature, and a method of producing the adhesive tape.

本發明係一種黏著帶,具有基材層及黏著劑層,上述黏著劑層含有苯乙烯系彈性體,且上述黏著劑層之凝膠分率為70重量%以上。 The present invention relates to an adhesive tape comprising a base material layer and an adhesive layer, wherein the adhesive layer contains a styrene-based elastomer, and the adhesive layer has a gel fraction of 70% by weight or more.

以下詳述本發明。 The invention is described in detail below.

本發明人等進行努力研究,結果發現:將含有苯乙烯系彈性體之黏著劑層之凝膠分率調整為70重量%以上之黏著帶之耐熱性優異,且具有隨時間經過或於高溫下黏著力亦不易增強之低黏著增強性,從而完成本發明。 As a result of intensive studies, the inventors of the present invention have found that an adhesive tape having a gel fraction of a styrene-based elastomer adjusted to have a gel fraction of 70% by weight or more is excellent in heat resistance and has a tendency to pass over time or at a high temperature. The adhesiveness is also not easily enhanced with low adhesion enhancement, thereby completing the present invention.

本發明之黏著帶具有基材層及黏著劑層。 The adhesive tape of the present invention has a substrate layer and an adhesive layer.

上述黏著劑層含有苯乙烯系彈性體。藉由使用苯乙烯系彈性體作為黏著成分,可藉由不使用有機溶劑之擠出成形法而製造具有優異之初始黏著性之黏著帶。 The above adhesive layer contains a styrene-based elastomer. By using a styrene-based elastomer as an adhesive component, an adhesive tape having excellent initial adhesion can be produced by an extrusion molding method without using an organic solvent.

為了使本發明之黏著帶之黏著劑層之凝膠分率為70重量%以上,較佳為使用具有聚合性雙鍵之苯乙烯系彈性體作為成為原料之苯乙烯系彈性體。可使用具有聚合性雙鍵之苯乙烯系彈性體作為苯乙烯系彈性體,藉由擠出成形法等而形成黏著劑層後,使該具有雙鍵之苯乙烯系彈性體進行交聯,藉此將黏著劑層之凝膠分率調整為70重量%以上。 In order to make the adhesive fraction of the adhesive layer of the adhesive tape of the present invention 70% by weight or more, a styrene-based elastomer having a polymerizable double bond is preferably used as the styrene-based elastomer to be used as a raw material. A styrene-based elastomer having a polymerizable double bond can be used as the styrene-based elastomer, and an adhesive layer can be formed by an extrusion molding method or the like, and then the styrene-based elastomer having a double bond can be crosslinked. This adjusts the gel fraction of the adhesive layer to 70% by weight or more.

作為上述具有聚合性雙鍵之苯乙烯系彈性體,並無特別限定,例如可列舉:苯乙烯-異戊二烯嵌段共聚物(SI)、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(SIS)、苯乙烯-丁二烯嵌段共聚物(SB)、苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)、部分氫化苯乙烯-乙烯丁烯-苯乙烯嵌段共聚物(部分氫化SEBS)、部分氫化苯乙烯-乙烯丙烯-苯乙烯嵌段共聚物(部分氫化SEPS)等。 The styrene-based elastomer having a polymerizable double bond is not particularly limited, and examples thereof include a styrene-isoprene block copolymer (SI) and a styrene-isoprene-styrene block. Copolymer (SIS), styrene-butadiene block copolymer (SB), styrene-butadiene-styrene block copolymer (SBS), partially hydrogenated styrene-ethylene butylene-styrene block Copolymer (partially hydrogenated SEBS), partially hydrogenated styrene-ethylene propylene-styrene block copolymer (partially hydrogenated SEPS), and the like.

上述黏著劑層亦可含有上述具有聚合性雙鍵之苯乙烯系彈性體以外之其他樹脂作為原料。 The pressure-sensitive adhesive layer may contain, as a raw material, another resin other than the styrene-based elastomer having a polymerizable double bond.

作為上述其他樹脂,並無特別限定,可列舉:氫化苯乙烯-乙烯丁烯-苯乙烯嵌段共聚物(氫化SEBS)、氫化苯乙烯-乙烯丙烯-苯乙烯嵌段共聚物(氫化SEPS)等不具有聚合性雙鍵之苯乙烯系彈性體;或間規1,2-聚丁二烯(RB)等具有聚合性雙鍵之非苯乙烯系彈性體;或聚乙烯(PE)、聚丁烯、乙烯-丙烯共聚物、乙烯-丁烯共聚物、丙烯-丁烯共聚物等不具有聚合性雙鍵之烯烴系樹脂等。 The other resin is not particularly limited, and examples thereof include hydrogenated styrene-ethylene butylene-styrene block copolymer (hydrogenated SEBS), hydrogenated styrene-ethylene propylene-styrene block copolymer (hydrogenated SEPS), and the like. a styrene-based elastomer having no polymerizable double bond; or a non-styrene-based elastomer having a polymerizable double bond such as syndiotactic 1,2-polybutadiene (RB); or polyethylene (PE) or polybutylene An olefin-based resin having no polymerizable double bond, such as an olefin, an ethylene-propylene copolymer, an ethylene-butene copolymer, or a propylene-butene copolymer.

於上述黏著劑層含有其他樹脂之情形時,較佳為上述具有聚合性雙鍵之苯乙烯系彈性體於彈性體整體中所占之含量為60重量%以上。藉由將上述具有聚合性雙鍵之苯乙烯系彈性體之含量設為60重量%以上,可更容易地將黏著劑層之凝膠分率調整為70重量%以上。上述具有聚合性雙鍵之苯乙烯系彈性體之含量更佳為70重量%以上,亦可為100重量%。 In the case where the pressure-sensitive adhesive layer contains another resin, the content of the styrene-based elastomer having a polymerizable double bond in the entire elastomer is preferably 60% by weight or more. By setting the content of the styrene-based elastomer having the polymerizable double bond to 60% by weight or more, the gel fraction of the pressure-sensitive adhesive layer can be more easily adjusted to 70% by weight or more. The content of the styrene-based elastomer having a polymerizable double bond is more preferably 70% by weight or more, and may be 100% by weight.

上述黏著劑層可進而含有黏著賦予劑。 The above adhesive layer may further contain an adhesion-imparting agent.

上述黏著賦予劑並無特別限定,例如可列舉:脂肪族共聚物、芳香族共聚物、脂肪族芳香族共聚物、脂環式共聚物等石油系樹脂;薰草哢-茚系樹脂;萜烯系樹脂;萜酚系樹脂;聚合松脂等松脂系樹脂;(烷基)苯酚系樹脂;二甲苯系樹脂等。 The adhesion-imparting agent is not particularly limited, and examples thereof include petroleum-based resins such as aliphatic copolymers, aromatic copolymers, aliphatic aromatic copolymers, and alicyclic copolymers; and kumquat-anthraquinone resins; terpenes; Resin; phenolic resin; rosin resin such as polymeric rosin; (alkyl) phenol resin; xylene resin.

上述黏著賦予劑之氫化率並無特別限定,可使用未氫化物、部分氫化物及完全氫化物等中之任一者。 The hydrogenation rate of the above-mentioned adhesion-imparting agent is not particularly limited, and any of an unhydrided product, a partially hydrogenated product, and a completely hydrogenated product can be used.

又,亦可使用作為與聚烯烴樹脂之混合物而市售之黏著賦予劑。該等黏著賦予劑可單獨使用,亦可併用2種以上。 Further, an adhesion-imparting agent commercially available as a mixture with a polyolefin resin can also be used. These adhesion-imparting agents may be used singly or in combination of two or more.

上述黏著賦予劑之含量並無特別限定,相對於上述彈性體成分100重量份之較佳之上限為50重量份。若上述黏著賦予劑之含量超過50 重量份,則有黏著賦予劑自黏著劑層滲出之情況。上述黏著賦予劑之含量之更佳之上限為40重量份。 The content of the above-mentioned adhesion-imparting agent is not particularly limited, and a preferred upper limit of 100 parts by weight of the above elastomer component is 50 parts by weight. If the content of the above adhesion-imparting agent exceeds 50 In the case of parts by weight, there is a case where the adhesion-imparting agent oozes out from the adhesive layer. A more preferable upper limit of the content of the above adhesion-imparting agent is 40 parts by weight.

關於上述黏著劑層,於下述將黏著劑層之凝膠分率調整為70重量%以上時進行光照射之情形時,較佳為含有光聚合起始劑。 In the case where the above-mentioned adhesive layer is subjected to light irradiation when the gel fraction of the adhesive layer is adjusted to 70% by weight or more, it is preferred to contain a photopolymerization initiator.

上述光聚合起始劑並無特別限定,例如可較佳地使用二苯甲酮系化合物、苯乙酮系化合物、醯基氧化膦系化合物、二茂鈦系化合物、肟酯系化合物、安息香醚系化合物、9-氧硫等。 The photopolymerization initiator is not particularly limited, and for example, a benzophenone compound, an acetophenone compound, a mercaptophosphine oxide compound, a titanocene compound, an oxime ester compound, and a benzoin ether can be preferably used. Compound, 9-oxosulfur Wait.

上述黏著劑層亦可於不阻礙本發明之效果之範圍內含有脫模劑。藉由含有脫模劑,例如於用於作為表面保護材料之用途時,可進一步防止剝離時之糊劑殘留。作為上述脫模劑,並無特別限定,可使用習知公知之脫模劑。 The above adhesive layer may contain a release agent in a range that does not inhibit the effects of the present invention. When the release agent is contained, for example, for use as a surface protective material, the residue of the paste at the time of peeling can be further prevented. The release agent is not particularly limited, and a conventionally known release agent can be used.

於上述黏著劑層含有脫模劑之情形時,脫模劑相對於上述彈性體成分100重量份之含量之較佳之上限為0.5重量份。若上述脫模劑之含量超過0.5重量份,則有脫模劑自黏著劑層滲出,污染被黏著體之表面之情況。 When the adhesive layer contains a release agent, the upper limit of the content of the release agent relative to 100 parts by weight of the elastomer component is preferably 0.5 part by weight. When the content of the above-mentioned release agent exceeds 0.5 part by weight, the release agent may bleed out from the adhesive layer to contaminate the surface of the adherend.

上述黏著劑層亦可視需要含有軟化劑、抗氧化劑、接著增強防止劑等習知公知之添加劑。 The above-mentioned adhesive layer may optionally contain a conventionally known additive such as a softening agent, an antioxidant, and a reinforcing agent.

上述黏著劑層之凝膠分率為70重量%以上。藉由將上述黏著劑層之凝膠分率設為70重量%以上,本發明之黏著帶可發揮較高之耐熱性,並且可發揮隨時間經過或於高溫下黏著力亦不易增強之低黏著增強性。上述黏著劑層之凝膠分率更佳為75重量%以上,進而較佳為80重量%以上。上述黏著劑層之凝膠分率之上限並無特別限定,為了確保良好之初始黏著力,上述黏著劑層之凝膠分率較佳為98重量%以下。 The gel fraction of the above adhesive layer is 70% by weight or more. By setting the gel fraction of the above adhesive layer to 70% by weight or more, the adhesive tape of the present invention can exhibit high heat resistance and can exhibit low adhesion which is not easily enhanced by adhesion over time or at a high temperature. Enhancement. The gel fraction of the above adhesive layer is more preferably 75% by weight or more, still more preferably 80% by weight or more. The upper limit of the gel fraction of the pressure-sensitive adhesive layer is not particularly limited, and the gel fraction of the pressure-sensitive adhesive layer is preferably 98% by weight or less in order to secure a good initial adhesion.

再者,凝膠分率係如以下般進行測定。首先,自黏著帶僅取出黏著劑層,剪裁為50mm×100mm左右之平面長方形形狀而製作試片,將試片於甲苯中於23℃浸漬24小時,然後自甲苯中取出,於110℃之條件下乾燥1小時。測定乾燥後之試片之重量,使用下述式(1)算出凝膠分率。再者,於試片沒有積層用以保護黏著劑層之脫模膜。 Further, the gel fraction was measured as follows. First, the adhesive tape was taken out from the adhesive tape, and cut into a rectangular shape of about 50 mm × 100 mm to prepare a test piece. The test piece was immersed in toluene at 23 ° C for 24 hours, and then taken out from the toluene at 110 ° C. Dry for 1 hour. The weight of the test piece after drying was measured, and the gel fraction was calculated using the following formula (1). Further, the test piece was not laminated to protect the release film of the adhesive layer.

凝膠分率(重量%)=(W2/W1)×100 (1) Gel fraction (% by weight) = (W2/W1) × 100 (1)

(W1:浸漬前之試片之重量,W2:浸漬、乾燥後之試片之重量) (W1: weight of the test piece before immersion, W2: weight of the test piece after immersion and drying)

再者,於無法確保充分之樣品量之情形時,可將自黏著帶僅取出黏著劑層,剪裁為5mm×10mm左右之平面長方形形狀之試片供於凝膠分率之測定。 Further, when it is not possible to ensure a sufficient sample amount, the self-adhesive tape can be taken out only by the adhesive layer, and cut into a rectangular rectangular test piece of about 5 mm × 10 mm to measure the gel fraction.

上述黏著劑層之儲存彈性模數E'成為1.0×105Pa時之溫度較佳為130℃以上。藉此,於貼附於被黏著體時,可進一步抑制隨時間經過或於高溫下發生接著增強。上述黏著劑層之儲存彈性模數E'成為1.0×105Pa時之溫度更佳為135℃以上。 The temperature at which the storage elastic modulus E' of the pressure-sensitive adhesive layer is 1.0 × 10 5 Pa is preferably 130 ° C or higher. Thereby, when attached to the adherend, it is possible to further suppress the subsequent reinforcement from occurring over time or at a high temperature. The temperature at which the storage elastic modulus E' of the above-mentioned adhesive layer is 1.0 × 10 5 Pa is more preferably 135 ° C or higher.

上述黏著劑層於150℃之儲存彈性模數E'較佳為6.0×105Pa以上。藉此,於貼附於被黏著體時,可進一步抑制隨時間經過或於高溫下發生接著增強。 The storage elastic modulus E' of the above adhesive layer at 150 ° C is preferably 6.0 × 10 5 Pa or more. Thereby, when attached to the adherend, it is possible to further suppress the subsequent reinforcement from occurring over time or at a high temperature.

再者,上述黏著劑層之儲存彈性模數E'例如可使用DVA-200(IT Meter.and ℃ontrol公司製造)等黏彈性譜儀,於定速升溫拉伸模式之10℃/分鐘、10Hz之條件下測定上述黏著劑層之動態黏彈性譜而求出。 Further, the storage elastic modulus E' of the above-mentioned adhesive layer can be, for example, a viscoelastic spectrometer such as DVA-200 (manufactured by IT Meter. and ° Control Co., Ltd.), and 10 ° C/min, 10 Hz in a constant-speed heating mode. The dynamic viscoelastic spectrum of the above adhesive layer was measured under the conditions.

作為將上述黏著劑層之儲存彈性模數E'成為1.0×105Pa時之溫度調整為130℃以上之方法、及將150℃之儲存彈性模數E'調整為6.0×105 Pa以上之方法,並無特別限定,例如可列舉使黏著劑層進行交聯之方法等。 The method of adjusting the temperature at which the storage elastic modulus E' of the pressure-sensitive adhesive layer is 1.0 × 10 5 Pa to 130 ° C or higher, and adjusting the storage elastic modulus E' at 150 ° C to 6.0 × 10 5 Pa or more The method is not particularly limited, and examples thereof include a method of crosslinking an adhesive layer.

上述黏著劑層之厚度只要根據用途而適當設定即可,並無特別限定,較佳之下限為2μm,較佳之上限為30μm。若上述黏著劑層之厚度未達2μm,則有無法發揮充分之初始黏著力之情況,若超過30μm,則有黏著力變大,不適於例如必需表面保護材料等之剝離之用途之情況。上述黏著劑層之厚度之更佳之下限為3μm,更佳之上限為20μm。 The thickness of the pressure-sensitive adhesive layer is not particularly limited as long as it is appropriately set depending on the application, and a preferred lower limit is 2 μm, and a preferred upper limit is 30 μm. When the thickness of the pressure-sensitive adhesive layer is less than 2 μm, sufficient initial adhesion may not be exhibited. When the thickness of the pressure-sensitive adhesive layer exceeds 30 μm, the adhesive strength is increased, which is not suitable for applications such as peeling of a surface protective material. A more preferable lower limit of the thickness of the above adhesive layer is 3 μm, and a more preferable upper limit is 20 μm.

上述基材層並無特別限定,較佳為含有聚烯烴樹脂。 The base material layer is not particularly limited, and preferably contains a polyolefin resin.

上述聚烯烴樹脂並無特別限定,可使用習知公知之聚烯烴樹脂,例如可列舉:聚丙烯(PP)、聚乙烯(PE)等。 The polyolefin resin is not particularly limited, and a conventionally known polyolefin resin can be used, and examples thereof include polypropylene (PP) and polyethylene (PE).

作為上述聚丙烯,例如可列舉:均聚丙烯、無規聚丙烯、嵌段聚丙烯等。 Examples of the polypropylene include homopolypropylene, atactic polypropylene, and block polypropylene.

作為上述聚乙烯,例如可列舉:高壓法低密度聚乙烯、直鏈狀低密度聚乙烯、高密度聚乙烯等。 Examples of the polyethylene include high pressure low density polyethylene, linear low density polyethylene, and high density polyethylene.

其中,於下述將黏著劑層之凝膠分率調整為70重量%以上時進行電子束照射之情形時,較佳為由嵌段聚丙烯及/或聚乙烯所構成之基材層。由嵌段聚丙烯及/或聚乙烯所構成之基材層即便照射電子束亦不易脆化,可維持較高之拉伸強度。 In the case where the electron beam irradiation is carried out when the gel fraction of the adhesive layer is adjusted to 70% by weight or more, the base material layer composed of block polypropylene and/or polyethylene is preferable. The base material layer composed of the block polypropylene and/or polyethylene is less likely to be embrittled even when irradiated with an electron beam, and can maintain high tensile strength.

上述基材層可於無損本發明之效果之範圍內含有防靜電劑、脫模劑、抗氧化劑、耐候劑、結晶成核劑等添加劑;聚烯烴、聚酯、聚醯胺、彈性體等樹脂改質劑。 The base material layer may contain an antistatic agent, a mold release agent, an antioxidant, a weathering agent, a crystallization nucleating agent or the like in a range that does not impair the effects of the present invention; a resin such as a polyolefin, a polyester, a polyamide or an elastomer; Modifier.

上述基材層之厚度只要根據用途而適當設定即可,並無特別限定,較佳之下限為25μm,較佳之上限為200μm。若上述基材層之厚度 未達25μm,則有黏著帶之韌性較弱而操作性較差之情況,若超過200μm,則有於捲取成輥狀而保存時殘留捲痕之情況。上述基材層之厚度之更佳之下限為30μm,更佳之上限為150μm。 The thickness of the base material layer is not particularly limited as long as it is appropriately set depending on the application, and a preferred lower limit is 25 μm, and a preferred upper limit is 200 μm. If the thickness of the above substrate layer When the thickness is less than 25 μm, the adhesiveness of the adhesive tape is weak and the handleability is poor. When the thickness is more than 200 μm, the roll may be wound into a roll and the wound may remain. A more preferred lower limit of the thickness of the substrate layer is 30 μm, and a more preferred upper limit is 150 μm.

本發明之黏著帶較佳為於表面經電暈處理之塑膠膜之該經電暈處理之面上貼合黏著帶,於40℃放置24小時後剝離黏著帶時,貼合前後之塑膠膜之經電暈處理之表面之表面張力的變化率為35%以下。若被黏著體之表面被污染而表面張力降低,則有於剝離黏著帶後之被黏著體之表面塗佈接著劑或硬塗劑等時,產生微小之塗佈不均,於組裝於製品時產生亮度或色不均不良之情況。上述表面張力之變化率例如可藉由調整添加至黏著劑層中之脫模劑等之添加量等而調整。 Preferably, the adhesive tape of the present invention is adhered to the corona-treated surface of the corona-treated plastic film on the surface, and after being placed at 40 ° C for 24 hours, the adhesive tape is peeled off, and the plastic film before and after bonding is applied. The rate of change in surface tension of the surface subjected to corona treatment was 35% or less. When the surface of the adherend is contaminated and the surface tension is lowered, when an adhesive or a hard coating agent is applied to the surface of the adherend after peeling off the adhesive tape, minute coating unevenness occurs, and when it is assembled in the product, A situation in which brightness or color unevenness is poor. The rate of change of the surface tension can be adjusted, for example, by adjusting the amount of addition of a release agent or the like added to the adhesive layer.

製造本發明之黏著帶之方法並無特別限定,例如可列舉於製備於上述基材層上積層有未調整凝膠分率之未調整黏著劑層之積層體後,調整該未調整黏著劑層之凝膠分率之方法等。 The method for producing the adhesive tape of the present invention is not particularly limited. For example, the unadjusted adhesive layer may be adjusted after the laminate having the unadjusted adhesive layer having an unadjusted gel fraction laminated on the base material layer. The method of gel fraction and the like.

又,黏著帶之製造方法亦為本發明之一,該黏著帶之製造方法係製造具有基材層及含有苯乙烯系彈性體之黏著劑層,上述黏著劑層之凝膠分率為70重量%以上之黏著帶的方法,且具有下述步驟:製備於上述基材層上積層有未調整凝膠分率之未調整之黏著劑層的積層體;及對上述積層體之未調整凝膠分率之未調整之黏著劑層照射活性能量線,使上述黏著劑層之凝膠分率為70重量%以上。 Moreover, the manufacturing method of the adhesive tape is also one of the inventions, and the manufacturing method of the adhesive tape is the adhesive layer which has the base material layer and the styrene-type elastomer, and the adhesive layer has the gel fraction of 70 weight. a method of adhesive tape of more than %, and having the steps of: preparing a laminate having an unadjusted adhesive layer having an unadjusted gel fraction on the substrate layer; and an unadjusted gel to the laminate The unadjusted adhesive layer of the fraction is irradiated with the active energy ray so that the gel fraction of the adhesive layer is 70% by weight or more.

作為製備上述積層體之方法,例如可列舉:將上述基材層及黏著劑層之各材料供給至多層之擠出機而成形之共擠出成形法;或於預先藉由T模成形或吹脹成形所獲得之基材層上,藉由擠出層壓、擠出塗覆等 公知之積層法來積層未調整黏著劑層之方法;或於將各層獨立地製成膜後,藉由乾式層壓而積層所獲得之各膜之方法等。其中,就生產性之方面而言,較佳為共擠出成形法。 As a method of preparing the above-mentioned laminated body, for example, a coextrusion molding method in which each of the base material layer and the pressure-sensitive adhesive layer is supplied to a plurality of extruders is used, or a T-die is formed or blown in advance. On the substrate layer obtained by expansion molding, by extrusion lamination, extrusion coating, etc. A method of laminating an unadjusted adhesive layer by a known lamination method, or a method of laminating the respective layers obtained by dry lamination after separately forming the layers. Among them, in terms of productivity, a coextrusion molding method is preferred.

調整上述凝膠分率之方法並無特別限定,於上述未調整黏著劑層含有上述具有聚合性雙鍵之苯乙烯系彈性體之情形時,可列舉藉由照射電子束或光等活性能量線而使該具有聚合性雙鍵之苯乙烯系彈性體進行交聯之方法。其中,就無須併用光聚合起始劑、以及反應速度較快而可以短時間達成初始之凝膠分率之方面而言,較佳為照射電子束之方法。 The method of adjusting the gel fraction is not particularly limited. When the unadjusted adhesive layer contains the styrene elastomer having a polymerizable double bond, an active energy ray such as an electron beam or light may be irradiated. Further, the styrene-based elastomer having a polymerizable double bond is crosslinked. Among them, a method of irradiating an electron beam is preferred in that it is not necessary to use a photopolymerization initiator in combination and a reaction rate is high and the initial gel fraction can be achieved in a short time.

作為上述照射電子束之方法,並無特別限定,例如可列舉使用NHV Corporation公司製造之區域光束方式之Curetron R等市售之電子束照射裝置,對上述積層體之未調整黏著劑層照射光之方法。 The method of irradiating the electron beam is not particularly limited, and for example, a commercially available electron beam irradiation apparatus such as Curetron R manufactured by NHV Corporation, Inc., can be used to irradiate the unadjusted adhesive layer of the laminate. method.

上述電子束照射之條件只要根據上述具有聚合性雙鍵之苯乙烯系彈性體之種類或含量等而適當設定即可,較佳為加速電壓50~1000kV、劑量0.5~10Mrad左右之條件。 The conditions of the electron beam irradiation may be appropriately set according to the type or content of the styrene-based elastomer having the polymerizable double bond, and the like, and the acceleration voltage is preferably from 50 to 1000 kV and the dose is from about 0.5 to 10 Mrad.

本發明之黏著帶由於可藉由擠出成形法等不使用有機溶劑之製造方法而容易地製造,故而可解決殘存有機溶劑之問題。又,藉由將黏著劑層之凝膠分率調整為70重量%以上,可發揮耐熱性、及隨時間經過或於高溫下黏著力亦不易增強之低黏著增強性。 Since the adhesive tape of the present invention can be easily produced by a production method in which an organic solvent is not used, such as an extrusion molding method, the problem of residual organic solvent can be solved. Moreover, by adjusting the gel fraction of the adhesive layer to 70% by weight or more, it is possible to exhibit heat resistance and low adhesion enhancement which is not easily enhanced with adhesion over time or at a high temperature.

本發明之黏著帶可尤佳地用於暴露於高溫環境下之用途。又,即便設定為相對較高之初始黏著力,隨時間經過或於高溫下亦不會發生接著增強,可不殘留糊劑而剝離,故而亦可較佳地用作表面保護材料。例如,稜鏡片(亦稱為亮度提昇膜)、擴散膜等液晶顯示器用光學構件於表面具有凹 凸形狀,但若為本發明之黏著帶,則即便以較高之初始黏著力貼附於此種凹凸形狀之表面,隨時間經過或於高溫下黏著力亦不易增強,故而可不殘留糊劑而容易地剝離。 The adhesive tape of the present invention is particularly useful for applications exposed to high temperature environments. Further, even if it is set to a relatively high initial adhesive force, it does not increase with time or at a high temperature, and it can be peeled off without leaving a paste, so that it can be preferably used as a surface protective material. For example, an optical member for a liquid crystal display such as a ruthenium sheet (also referred to as a brightness enhancement film) or a diffusion film has a concave surface on the surface. a convex shape, but if it is the adhesive tape of the present invention, even if it adheres to the surface of such uneven shape with a high initial adhesive force, the adhesive force is not easily enhanced over time or at a high temperature, so that the paste does not remain. Easily peeled off.

根據本發明,可提供一種耐熱性優異且隨時間經過或於高溫下黏著力亦不易增強之黏著帶、及該黏著帶之製造方法。 According to the present invention, it is possible to provide an adhesive tape which is excellent in heat resistance and which is not easily cured with adhesion over time or at a high temperature, and a method of producing the adhesive tape.

以下,列舉實施例更詳細地說明本發明之態樣,但本發明並非僅限定於該等實施例。 Hereinafter, the aspects of the present invention will be described in more detail by way of examples, but the invention is not limited to the examples.

(實施例1) (Example 1)

作為黏著劑層之原料,相對於作為具有聚合性雙鍵之苯乙烯系彈性體之表1所示之樹脂A 100重量份,調配黏著賦予劑(商品名「Arkon P125」,荒川化學工業公司製造,脂環族飽和烴樹脂)5重量份及抗氧化劑(商品名「IRGANOX 1010」,BASF公司製造)1重量份,獲得用以形成黏著劑層之黏著劑組成物。 As a raw material of the adhesive layer, an adhesive-imparting agent (trade name "Arkon P125", manufactured by Arakawa Chemical Industries Co., Ltd.) was prepared in an amount of 100 parts by weight of the resin A shown in Table 1 as a styrene-based elastomer having a polymerizable double bond. 5 parts by weight of an alicyclic saturated hydrocarbon resin and 1 part by weight of an antioxidant (trade name "IRGANOX 1010", manufactured by BASF Corporation) were used to obtain an adhesive composition for forming an adhesive layer.

作為基材層之原料,混合嵌段聚丙烯(商品名「J715M」,普瑞曼聚合物公司製造)80重量份與低密度聚乙烯(商品名「L2340」,旭化成公司製造)20重量份。 80 parts by weight of a block polypropylene (trade name "J715M", manufactured by Prehmann Polymer Co., Ltd.) and 20 parts by weight of low density polyethylene (trade name "L2340", manufactured by Asahi Kasei Co., Ltd.) were mixed as a raw material of the base material layer.

藉由T模法進行共擠出成形,獲得基材層之厚度為55μm,未交聯黏著劑層之厚度為5μm之積層體。 Co-extrusion molding was carried out by a T-die method to obtain a laminate having a thickness of the substrate layer of 55 μm and a thickness of the uncrosslinked adhesive layer of 5 μm.

自所獲得之積層體之未交聯黏著劑層側,使用電子束照射裝置(商品名「區域光束方式,Curetron R」,NHV Corporation公司製造),於加速電壓500kV、劑量5Mrad之條件下照射電子束。對電子束照射後之黏著帶之黏著劑層測定凝膠分率,結果為75重量%。 From the side of the uncrosslinked adhesive layer of the obtained laminate, an electron beam irradiation apparatus (trade name "Caretron R", manufactured by NHV Corporation) was used to irradiate electrons at an acceleration voltage of 500 kV and a dose of 5 Mrad. bundle. The gel fraction of the adhesive layer of the adhesive tape after the electron beam irradiation was measured and found to be 75% by weight.

又,針對電子束照射後之黏著帶之黏著劑層,使用黏彈性譜儀(IT Meter.and Control公司製造,DVA-200),於定速升溫拉伸模式之10℃/分鐘、10Hz之條件下測定動態黏彈性譜而求出儲存彈性模數E',結果儲存彈性模數E'成為1.0×105Pa時之溫度為145℃以上,150℃之儲存彈性模數E'為8×105Pa。 Further, for the adhesive layer of the adhesive tape after the electron beam irradiation, a viscoelastic spectrometer (manufactured by IT Meter. and Control, DVA-200) was used, and the conditions of 10 ° C/min and 10 Hz in the constant temperature heating mode were employed. The dynamic viscoelastic spectrum was measured to determine the storage elastic modulus E'. As a result, the storage elastic modulus E' became 1.0×10 5 Pa at a temperature of 145° C. or higher, and the storage elastic modulus E′ at 150° C. was 8×10. 5 Pa.

(實施例2~6、比較例1~6、參考例1) (Examples 2 to 6, Comparative Examples 1 to 6, Reference Example 1)

使黏著劑層及基材層之原料、電子束之照射條件如表1及表2所示,除此以外,以與實施例1相同之方式獲得黏著帶。 The adhesive tape was obtained in the same manner as in Example 1 except that the materials of the adhesive layer and the substrate layer and the irradiation conditions of the electron beam were as shown in Table 1 and Table 2.

再者,使用伸乙基雙硬脂醯胺(日油公司製造,商品名「Alflow H50F」)作為脫模劑。 Further, as the release agent, exoethyl bis-lipidamine (manufactured by NOF Corporation, trade name "Alflow H50F") was used.

<評價> <evaluation>

對實施例、比較例及參考例中所獲得之黏著帶進行以下之評價。將結果示於表2。 The adhesive tapes obtained in the examples, comparative examples, and reference examples were subjected to the following evaluations. The results are shown in Table 2.

(1)初始黏著力之評價 (1) Evaluation of initial adhesion

準備稜鏡片(無光澤面為算術平均粗糙度Ra(JIS B 0601-1994)為0.32μm之丙烯酸膜之擴散膜)作為被黏著體。以覆蓋被黏著體之無光澤面之方式,貼附25mm寬之黏著帶,製作試片。貼附係藉由於23℃及相對濕度50%RH之環境下,使用2kg之壓接橡膠輥,以300mm/分鐘之速度進行壓合而進行。將所獲得之試片於23℃及相對濕度50%RH之環境下放置30分鐘。放置後,依據JIS Z0237,自被黏著體以拉伸速度300mm/分鐘沿180°方向剝離黏著帶,測定初始黏著力。又,以下述基準判定初始黏著力。 A crepe sheet (a diffusion film of an acrylic film having an arithmetic mean roughness Ra (JIS B 0601-1994) of 0.32 μm) was prepared as an adherend. A 25 mm wide adhesive tape was attached to cover the matte side of the adherend to prepare a test piece. The attachment was carried out by pressing at a speed of 300 mm/min using a 2 kg pressure-bonding rubber roller in an environment of 23 ° C and a relative humidity of 50% RH. The obtained test piece was allowed to stand in an environment of 23 ° C and a relative humidity of 50% RH for 30 minutes. After the placement, the adhesive tape was peeled off from the adherend at a stretching speed of 300 mm/min in the direction of 180° in accordance with JIS Z0237, and the initial adhesive force was measured. Further, the initial adhesion was determined based on the following criteria.

◎:0.15N/25mm以上且未達0.3N/25mm ◎: 0.15N/25mm or more and less than 0.3N/25mm

○:0.1N/25mm以上且未達0.15N/25mm、或0.3N/25mm以上且未達0.4N/25mm ○: 0.1 N/25 mm or more and less than 0.15 N/25 mm, or 0.3 N/25 mm or more and less than 0.4 N/25 mm

×:未達0.1N/25mm或0.4N/25mm以上 ×: not up to 0.1N/25mm or 0.4N/25mm or more

(2)黏著增強率之評價 (2) Evaluation of adhesion enhancement rate

準備稜鏡片(無光澤面為算術平均粗糙度Ra(JIS B 0601-1994)為0.32μm之丙烯酸膜之擴散膜)作為被黏著體。以覆蓋被黏著體之無光澤面之方式,貼附25mm寬之黏著帶,製作試片。貼附係藉由於23℃及相對濕度50%RH之環境下,使用2kg之壓接橡膠輥,以300mm/分鐘之速度進行層壓而進行。將所獲得之試片於50℃之溫度環境下放置168小時。放置後,將試片取出至室溫,進而放置60分鐘後,依據JIS Z0237,自被黏著體以拉 伸速度300mm/分鐘沿180°方向剝離黏著帶,測定經時黏著力。 A crepe sheet (a diffusion film of an acrylic film having an arithmetic mean roughness Ra (JIS B 0601-1994) of 0.32 μm) was prepared as an adherend. A 25 mm wide adhesive tape was attached to cover the matte side of the adherend to prepare a test piece. The attachment was carried out by laminating at a speed of 300 mm/min using a 2 kg pressure-bonding rubber roller in an environment of 23 ° C and a relative humidity of 50% RH. The obtained test piece was allowed to stand at a temperature of 50 ° C for 168 hours. After being placed, the test piece is taken out to room temperature, and after being left for 60 minutes, it is pulled from the adherend according to JIS Z0237. The adhesive tape was peeled off at a stretching speed of 300 mm/min in the direction of 180°, and the adhesiveness over time was measured.

使用藉由上述式(1)所獲得之初始黏著力及經時黏著力,藉由下式算出自初始黏著力至經時黏著力之變化率(黏著增強率)。 Using the initial adhesive force and the time-dependent adhesive force obtained by the above formula (1), the rate of change from the initial adhesive force to the temporal adhesive force (adhesion enhancement ratio) was calculated by the following formula.

變化率(黏著增強率)(%)=(經時黏著力/初始黏著力)×100 Rate of change (adhesion enhancement rate) (%) = (time-dependent adhesion / initial adhesion) × 100

又,以下述基準判定經時黏著力。 Further, the temporal adhesion was determined based on the following criteria.

◎:150%以下 ◎: 150% or less

○:超過150%且未達200% ○: more than 150% and less than 200%

×:200%以上 ×: 200% or more

(3)耐熱性之評價 (3) Evaluation of heat resistance

將所製作之黏著帶貼附於不鏽鋼板,對接著面施加200g之負載,測定120℃之保持時間。又,以下述基準判定耐熱性。 The prepared adhesive tape was attached to a stainless steel plate, and a load of 200 g was applied to the adhesive surface, and the holding time of 120 ° C was measured. Further, heat resistance was determined based on the following criteria.

◎:30分鐘以上 ◎: 30 minutes or more

○:超過5分鐘且未達30分鐘 ○: more than 5 minutes and less than 30 minutes

×:5分鐘以下 ×: 5 minutes or less

(4)剝離後之被黏著體表面之表面張力之評價 (4) Evaluation of the surface tension of the surface of the adherend after peeling

於室溫23℃、相對濕度50%之條件下,使用2kg之壓接橡膠輥,以300mm/min之速度將所製作之黏著帶貼附於經電暈處理之聚對苯二甲酸乙二酯(PET)膜。於該狀態下於40℃之烘箱中放置24小時。取出至室溫並放置60分鐘後,剝離黏著帶。 The adhesive tape prepared was attached to the corona treated polyethylene terephthalate at a rate of 300 mm/min at a temperature of 23 ° C and a relative humidity of 50% using a 2 kg crimping rubber roller. (PET) film. It was placed in an oven at 40 ° C for 24 hours in this state. After taking out to room temperature and leaving it for 60 minutes, the adhesive tape was peeled off.

使用潤濕張力試驗用混合液,基於JIS K6768所規定之方法測定貼附前及剝離後之PET膜之表面之表面張力,藉由下述式算出表面張力降低率,按照以下之基準進行評價。 The surface tension of the surface of the PET film before and after the peeling was measured by the method specified in JIS K6768 using the mixed liquid for the wetting tension test, and the surface tension reduction rate was calculated by the following formula and evaluated according to the following criteria.

表面張力降低率=(1-(剝離後之表面張力/貼附前之表面張力))×100 Surface tension reduction rate = (1 - (surface tension after peeling / surface tension before attachment)) × 100

○:表面張力降低率為35%以下 ○: The surface tension reduction rate is 35% or less

×:表面張力降低率超過35% ×: The surface tension reduction rate exceeds 35%

(5)拉伸強度之評價 (5) Evaluation of tensile strength

將所製作之黏著帶切割10mm,使用Tensilon萬能試驗機(商品名「RTF-1210」,A&D公司製造)以300mm/分鐘之速度測定拉伸強度。又,以下述基準判定拉伸強度。 The prepared adhesive tape was cut to 10 mm, and the tensile strength was measured at a speed of 300 mm/min using a Tensilon universal testing machine (trade name "RTF-1210", manufactured by A&D Co., Ltd.). Further, the tensile strength was determined based on the following criteria.

◎:40MPa以上 ◎: 40MPa or more

○:30MPa以上且未達40MPa ○: 30 MPa or more and less than 40 MPa

×:未達30MPa ×: less than 30 MPa

[產業上之可利用性] [Industrial availability]

根據本發明,可提供一種耐熱性優異且隨時間經過或於高溫下黏著力亦不易增強之黏著帶、及該黏著帶之製造方法。 According to the present invention, it is possible to provide an adhesive tape which is excellent in heat resistance and which is not easily cured with adhesion over time or at a high temperature, and a method of producing the adhesive tape.

Claims (5)

一種黏著帶,具有基材層及黏著劑層,其特徵在於:上述黏著劑層含有苯乙烯系彈性體,且上述黏著劑層之凝膠分率為70重量%以上。 An adhesive tape comprising a base material layer and an adhesive layer, wherein the adhesive layer contains a styrene-based elastomer, and the adhesive layer has a gel fraction of 70% by weight or more. 如申請專利範圍第1項之黏著帶,其中,黏著劑層於150℃之儲存彈性模數E'為6.0×105Pa以上。 The adhesive tape of claim 1, wherein the adhesive layer has a storage elastic modulus E' of 6.0 × 10 5 Pa or more at 150 °C. 如申請專利範圍第1或2項之黏著帶,其中,於表面經電暈處理之塑膠膜的上述經電暈處理之面上貼合黏著帶,於40℃放置24小時後剝離黏著帶時,貼合前後之上述塑膠膜之經電暈處理之表面之表面張力的變化率為35%以下。 The adhesive tape of claim 1 or 2, wherein the adhesive tape is attached to the corona-treated surface of the corona-treated plastic film, and the adhesive tape is peeled off after being left at 40 ° C for 24 hours. The rate of change in surface tension of the corona-treated surface of the above-mentioned plastic film before and after bonding was 35% or less. 如申請專利範圍第1、2或3項之黏著帶,其中,基材層係由嵌段聚丙烯及/或聚乙烯所構成。 The adhesive tape of claim 1, 2 or 3, wherein the substrate layer is composed of block polypropylene and/or polyethylene. 一種黏著帶之製造方法,其係製造具有基材層及含有苯乙烯系彈性體之黏著劑層且上述黏著劑層之凝膠分率為70重量%以上之黏著帶之方法,其特徵在於具有下述步驟:製備於上述基材層上積層有未調整凝膠分率之未調整之黏著劑層的積層體;及對上述積層體之未調整凝膠分率之未調整之黏著劑層照射活性能量線,使上述黏著劑層之凝膠分率為70重量%以上。 A method for producing an adhesive tape, comprising: a method of producing an adhesive tape having a base layer and an adhesive layer containing a styrene elastomer and having a gel fraction of 70% by weight or more of the adhesive layer, wherein a step of: preparing a laminate having an unadjusted adhesive layer having an unadjusted gel fraction on the substrate layer; and adjusting the unadjusted gel fraction of the laminate to an unadjusted adhesive layer The active energy ray has a gel fraction of the above adhesive layer of 70% by weight or more.
TW105115023A 2015-05-15 2016-05-13 Adhesive tape and method for producing adhesive tape TW201704408A (en)

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