TW201702934A - Frame for fingerprint identification plate and manufacturing method thereof, and light guide structure using the frame comprising a frame having a hollow portion, a plurality of light emitting diodes and a light guide plate - Google Patents

Abstract

Provided are a frame for fingerprint identification plate and a manufacturing method thereof, and a light guide structure using the frame. The light guide structure comprises a frame having a hollow portion, a plurality of light emitting diodes and a light guide plate. After a hybrid material mixed with a plastic material and a metal material is used for injection molding, the frame is carved with textures by a laser direct structuring process and is formed with a plurality of conductive portions on the textures of the frame by electroplating or chemical plating, such that the frame with conductive textures is formed. The plurality of light emitting diodes are adhesively fixed to the conductive portions of the frame by a SMT process, such that light projected by the light emitting diodes can be projected into the light guide plate. Accordingly, the frame is formed by the laser direct structuring process in association with electroplating, such that the frame can be minimized and achieve the thinning requirement of the electronic device when being used in the electronic device.

Description

Frame for fingerprint identification board, manufacturing method thereof, and light guiding structure using the same

The invention relates to a frame for a fingerprint identification board, a manufacturing method thereof, and a light guiding structure using the same, in particular to an electronic device, which can be placed by a finger and provided for collecting fingerprints. A frame body requiring brightness, a method of manufacturing the same, and a light guiding structure using the frame body.

Electronic devices, such as smart phones, laptops, flash drives, and more like smart door locks, often need to store important information such as personal letters or photos, or to unlock, burglar, and so on.

Most of the early electronic devices used password settings to prevent malicious or deliberate stealing of important data or to prevent thieves from invading. However, in order to avoid password forgetting, the general user often uses the important number such as the birthday of himself or his family to set the password when using the password setting. In this way, it is easy for the person concerned to use various methods to obtain the password, which is important. The leakage of information.

Therefore, in order to improve the functionality of theft prevention, today's electronic devices have gradually adopted the effect of fingerprint recognition. The advantage of fingerprint recognition is that others can't copy it, which can greatly improve the effect of confidentiality. As shown in Figure 1, today's smart phone A has become a necessity for life. Most users will use the smart phone A to send and receive mail or store personal data.

Therefore, most of the existing smart phone As are introduced with the function of fingerprint recognition, thereby emphasizing the effect of theft prevention. For example, the smart phone A is provided with a fingerprint identification area B, so that the user can read the fingerprint to achieve the unlocking effect, and then log in to the smart phone A.

The existing fingerprint identifier is mainly provided with an image capturing device on the circuit board, and a light guiding plate is disposed above the image capturing device, and a light emitting diode is disposed on a side of the light guiding plate to utilize the light emitting diode The released light is introduced into the light guide plate, so that when the user places the finger on the fingerprint recognition area, the light guide plate can be used to increase the brightness of the finger, so that the image capturing device can read the fingerprint on the finger, and then Perform a fingerprint comparison.

However, in the existing fingerprint recognizer, most of the light-emitting diodes and the image capturing device are simultaneously disposed on the circuit board, which causes the process of the process to be cumbersome and increases the manufacturing cost.

Another existing fingerprint identifier integrates the image capturing device, the light guide plate and the light-emitting diode together, and then fixes it on the circuit board. However, the overall structure design and volume of this type of fingerprint reader are quite large. Therefore, when it is mounted on a smart phone, the smart phone is too large to meet the slim and portable effect.

In this way, how to provide a fingerprint identification plate light guiding structure and a manufacturing method thereof for use in an electronic device, which can be placed by a finger and provide brightness required for fingerprint collection, and which can satisfy the volume and thickness, is The technical means to be solved and its main purpose.

In view of the above problems, the present invention is a light-guiding structure of a fingerprint identification board and a manufacturing method thereof, and particularly relates to an application to an electronic device, which can be placed by a finger and provides a fingerprint collection. Fingerprint identification plate light guiding structure of required brightness and manufacturing method thereof.

In order to achieve the above object, the light guide structure of the fingerprint identification board of the present invention and the manufacturing method thereof comprise a frame body having a hollow portion, a plurality of light emitting diodes and a light guide plate. Wherein, the frame system is formed by injection molding a mixed material of a mixed material of a plastic material and a metal material, and then the texture is engraved on the frame by Laser Direct Structuring, and then the grain of the frame is electroplated or electrolessly plated. Forming a plurality of conductive portions thereon to form a frame having a conductive line; and then bonding the plurality of light-emitting diodes to the conductive portion of the frame by the SMT process to cause the light emitted by the light-emitting diodes Can be projected into the light guide plate.

Therefore, the frame body is formed by the laser engraving process and the electroplating method, so that the frame body can be minimized, and when it is applied to an electronic device, the requirements for thinning and thinning of the electronic device can be met.

A‧‧‧Smart Phone

B‧‧‧ fingerprint identification area

10‧‧‧ Fingerprinting plate light guiding structure

20‧‧‧ boards

30‧‧‧Image capture device

40‧‧‧protection board

50‧‧‧ frame

501‧‧‧First grain

502‧‧‧Second lines

503‧‧‧The third grain

504‧‧‧fourth grain

51‧‧‧ upper surface

52‧‧‧ lower surface

53‧‧‧ Hollow

54‧‧‧Electrical Department

541‧‧‧First Conductive Department

542‧‧‧Second Conductive Department

543‧‧‧First Guide

544‧‧‧Second Guide

545‧‧‧ first joint

546‧‧‧second junction

55‧‧‧Steps

56‧‧‧Boss

57‧‧‧through hole

60‧‧‧Lighting diode

70‧‧‧Light guide

71‧‧‧Protruding

S1‧‧‧ Injection molding step

S2‧‧ ‧ laser engraving step

S3‧‧‧Metal forming steps

S4‧‧‧Lighting diode installation steps

S5‧‧‧Light guide plate installation steps

Figure 1 is a perspective view of a conventional smart phone.

Fig. 2 is a cross-sectional view showing the state of use of the light guiding structure of the present invention.

Figure 3 is a perspective view of the light guiding structure of the present invention.

Figure 4 is an exploded perspective view of the light guiding structure of the present invention.

Figure 5 is a flow chart showing the manufacture of the light guiding structure of the present invention.

Fig. 6A is a perspective view showing the frame of the present invention after injection molding.

Figure 6B is a perspective view of the frame of the present invention after laser engraving.

FIG. 6C is a schematic perspective view of the frame body after the plating of the present invention is completed.

Figure 6D is a perspective view of the back of the frame after the plating of the frame of the present invention is completed.

Figure 7 is a schematic view of the back of the light guiding structure of the present invention.

Figure 8 is a front elevational view of the light guiding structure of the present invention.

Figure 9 is a schematic cross-sectional view of Figure 8.

Fig. 10 is a partially enlarged schematic view of Fig. 9.

As shown in FIG. 2, the present invention relates to a frame for a fingerprint recognition board, a manufacturing method thereof, and a light guiding structure using the same, the light guiding structure being disposed on a circuit board and used for Covering an image capture device.

The embodiment is a main implementation of the smart phone. The fingerprint light guide structure 10 is disposed on the circuit board 20 and covers the image capturing device 30. The fingerprint light guiding plate structure 10 is provided. Further, a protection board 40 is further disposed, so that the fingerprint recognition board light guiding structure 10 is fixed between the circuit board 20 and the protection board 40. In this embodiment, the protection board 40 can be made of glass, plastic or any see-through material. production.

As shown in FIGS. 3 and 4, the light guiding structure includes a frame 50, a plurality of laterally emitting light emitting diodes 60, and a light guide plate 70.

Referring to FIG. 5 and FIGS. 6A to 6D, the frame 50 is formed by injection molding combined with Laser Direct Structuring, and the molding method comprises the following steps: injection molding step S1: mixing plastic The material and the mixed material of the metal material are integrally molded by injection molding to form a frame 50 having a hollow portion 53, and the frame body 50 has an upper surface 51 and a lower surface 52. The laser engraving step S2: forming a plurality of first lines 501 and a plurality of second lines 502 spaced apart from each other on the frame 50 by laser engraving to melt the plastic materials on the first lines 501 and the second lines 502 And activating the first lines 501 and the second lines The metal material on the road 502, and the first lines 501 and the second lines 502 extend from the upper surface 51 of the frame 50 to the lower surface 52, respectively. And a metal forming step S3: plating or electroless plating the activated metal material on the frame 50 to form a metal layer in the first grain 501 and the second grain 502 on the frame 50, thereby forming the frame 50 A plurality of first conductive portions 541 and second conductive portions 542 are formed, and each of the first conductive portions 541 and each of the second conductive portions 542 form a set of conductive portions 54.

In the above-mentioned injection molding step, the frame body 50 is further recessed downwardly from the upper surface 51 to form a step portion 55, so that the plurality of first lines 501 and the second lines 502 in the laser engraving step are formed on the step portion 66. .

In the laser engraving step, a third grain 503 and a fourth grain 504 are formed on the upper surface 51 of the frame 50, wherein the third grain 503 is used to connect the plurality of first lines 501. The four-grain road 504 is used to connect the plurality of second lines 502.

In the metal forming step, the third grain 503 and the fourth grain 504 are further formed with the same metal layer as the first grain 501 and the second grain 502, and the third grain 503 is formed into the first guiding portion 543. The four-grain path 504 forms the second guiding portion 544, so that the plurality of first conductive portions 541 are electrically connected to each other, and the plurality of second conductive portions 542 are connected to each other in series.

The frame 50 formed by the foregoing steps has an upper surface 51 and a lower surface 52 corresponding to the upper surface 51. A hollow portion 53 is formed at the center, and at least one pair of conductive portions 54 are formed on the frame 50, each of which is formed. The conductive portion 54 includes a first conductive portion 541 and a second conductive portion 542 which are spaced apart from each other. In the embodiment, a plurality of pairs of conductive portions 54 are formed on the frame 50, and each of the pair of conductive portions 54 is formed. One conductive portion 541 is connected in series to each other, and the second conductive portions 542 are also connected in series to each other.

In the embodiment, the frame body 50 is recessed downwardly from the upper surface 51 to form a stepped portion 55. The stepped portion 55 is annularly disposed outside the hollow portion 53 and further from the step portion 55 toward the hollow portion 53. A boss 56 is formed in the direction, and the boss 56 is annularly disposed in the hollow portion 53. The first conductive portion 541 and the second conductive portion 542 of the conductive portions 54 are disposed on the step portion 55.

Further, as shown in FIGS. 6C, 6D, and 7 , the frame body 50 is further formed with a plurality of through holes 57 in the direction of the lower surface 52 of the step portion 55 to pass the portion of the first conductive portion 541 and the second conductive portion 542 . The surface of the through hole 57 extends to the lower surface 52 to form at least a first contact 545 and a second contact 546, so that the frame 50 can pass through the first contact 545 and the second contact 546. The circuit boards 20 are electrically connected to each other and to the circuit board 20.

In a practical application, the first conductive portion 541 and the second conductive portions 542 can be independent, and respectively extend to the lower surface 52 of the frame 50 to form a plurality of first contacts 545 and second contacts 546; Alternatively, the first conductive portions 542 and the second conductive portions 542 may be connected in series. The number of first contacts 545 and second contacts 546 may be adjusted depending on the design of the circuit board 20.

As shown in the second, third, and fifth embodiments, the present invention further provides a manufacturing step of the light guiding structure of the fingerprint identification board, which comprises the steps of the manufacturing process of the frame 50, and further includes the following steps: the LED mounting step S4: Mainly after the frame 50 is formed, a plurality of laterally-emitting light-emitting diodes 60 are provided, and each of the laterally-emitting light-emitting diodes 60 is adhered and fixed to the frame 50 by SMT. The light-emitting diodes 60 are electrically connected to each of the first conductive portions 541 and each of the second conductive portions 542; and the light guide plate mounting step S5: providing a light guide plate 70, the light guide plate The light-emitting diodes 60 are mounted on the frame 50 and surround the side edges of the light guide plate 70 with respect to the upper portion of the hollow portion 53.

In this embodiment, the laterally-emitting light-emitting diodes 60 are disposed in the step portion 55 of the frame 50, so that each of the laterally-emitting light-emitting diodes 60 corresponds to the pair of conductive portions 54. The first conductive portion 541 and the second conductive portion 542 of each pair of conductive portions 54 are electrically connected to each other, so that the laterally-emitting light-emitting diodes 60 can be electrically connected to the circuit board 20, and the frame is turned to the frame. Light is projected into the hollow portion 53 of the body 50.

The light guide plate 70 is disposed on the boss 56 of the frame 50 and located above the hollow portion 53 so that the plurality of laterally emitting light-emitting diodes 60 are disposed around the periphery of the light guide plate 70, thereby causing the lateral direction. The light emitted by the light-emitting LEDs 60 enters the light guide plate 70, and is refracted in the light guide plate 70, thereby achieving the effect of illuminating the light guide plate 70, thereby forming a light guide applied to the fingerprint recognition plate. structure.

In addition, at the four end edges of the light guide plate 70, a protruding portion 71 is further protruded outwardly, and the protruding portions 71 respectively cover the step portion 55 of the frame 50. The protruding portions 71 of each of the diagonal corners have a shape corresponding to each other, and are further fixed to the frame body 50 through the protruding portions 71.

Please refer to the figures 2, 8, 9 and 10 again. Since the central portion of the frame 50 has a hollow portion 53, the frame 50 is fixed to the circuit board through the first contact 545 and the second contact 546 at the bottom. When 20 is up, the frame 50 can be effectively covered on the outside of the image capturing device 30.

The laterally-emitting light-emitting diode 60 is disposed in the step portion 55 of the frame 50 and is disposed around the periphery of the light guide plate 70. Therefore, the light projected by the laterally-emitting light-emitting diodes 60 can be efficiently entered into the light guide plate 70, thereby uniformly illuminating the light guide plate 70.

When the finger is placed on the light guide plate 70 or is disposed above the light guide plate 70 via the protective plate 40, the light guide plate 70 can be uniformly illuminated through the laterally-emitting light-emitting diodes 60, thereby further illuminating the image. The capturing device 30 can more clearly capture the fingerprint lines on the finger, thereby improving the recognition effect.

In addition, since the laterally-emitting light-emitting diodes 60 are integrated into the frame 50, the fingerprint identification plate light guiding structure 10 of the present invention can be directly fixed on the circuit board 20, and the electronic device is reduced. The assembly process greatly reduces costs. Furthermore, the image capturing device 30 is independently disposed on the circuit board 20 and covered by the fingerprint identification plate light guiding structure 10 of the present invention, thereby simplifying the volume of the electronic device and achieving the purpose of slimming the electronic device. .

In actual assembly, the frame 50 can be separately mounted on the circuit board 20, and then the light guide plate 70 is mounted under the protection board 40, and the circuit board 20 and the protection board 40 are disposed at a position relative to the frame 50. The assembly is performed, so that the image capturing device 30 can be effectively mounted at the central position of the hollow portion 53, so that the image capturing device 30 can collect the fingerprint more efficiently, thereby providing an assembly. The correct fingerprint identification plate light guiding structure 10.

10‧‧‧ Fingerprinting plate light guiding structure

50‧‧‧ frame

60‧‧‧Lighting diode

70‧‧‧Light guide

Claims (10)

A manufacturing method of a frame for a fingerprint identification plate, comprising: an injection molding step: integrally molding a mixed material of a plastic material and a metal material in an injection molding manner to form a frame having a hollow portion, and The frame body has an upper surface and a lower surface; a laser engraving step: forming a plurality of first lines and a plurality of second lines spaced apart from each other by using a laser engraving method, and activating the plurality of first lines and the plurality of a metal material in the second grain, and the plurality of first lines and the plurality of second lines respectively extend from the upper surface of the frame to the lower surface; a metal forming step: the metal activated on the frame The material is plated or electrolessly plated to form a metal layer in the first grain and the second grain on the frame, and further a plurality of first conductive portions and second conductive portions spaced apart from each other are formed on the frame. The manufacturing method of the frame for a fingerprint recognition board according to claim 1, wherein in the injection molding step, the frame body further has a stepped portion recessed downward from the upper surface, so that the laser engraving step The first plurality of lines and the plurality of second lines are formed on the step portion. The method for manufacturing a frame for a fingerprint identification board according to claim 2, wherein in the laser engraving step, a third texture and a fourth texture are respectively formed on the upper surface of the frame, wherein The third line is used for connecting a plurality of the first lines, and the fourth line is used for connecting the plurality of second lines. The method for manufacturing a frame for a fingerprint recognition board according to claim 3, wherein the third texture and the fourth texture are further formed with the first texture and the first in the metal forming step The same metal layer of the two lines makes the third line form a first metal connecting portion, and the fourth line forms a second metal connecting portion. A manufacturing method of a light guiding structure comprising the frame of claim 1, further comprising the steps of: installing a light emitting diode: providing a plurality of light emitting diodes, wherein the light emitting diodes are disposed on the frame body, so that Each of the light emitting diodes is electrically connected to each of the first conductive portions and each of the second conductive portions; and the light guide plate mounting step: providing a light guide plate, and mounting the light guide plate on the frame body, Above the hollow portion, the light emitting diodes are surrounded by side edges of the light guide plate. The method of manufacturing a light guiding structure according to claim 5, wherein in the injection molding step, the frame body further has a stepped portion recessed downward from the upper surface, so that the plurality of the laser engraving steps are A grain and a plurality of the second lines are formed on the step. The method of manufacturing the light guiding structure of claim 6, wherein in the laser engraving step, a third grain and a fourth grain are further formed on the upper surface of the frame, wherein the third line is And a plurality of the first lines for connecting the plurality of second lines. The method for manufacturing a light guiding structure according to claim 7, wherein the third grain and the fourth grain are further formed with the same metal as the first grain and the second grain in the metal forming step. a layer, the third grain forming a first metal connecting portion, the fourth grain forming a second metal connecting portion A light guiding structure comprising the frame of claim 1 further comprising: a plurality of light emitting diodes disposed on the frame, wherein each of the light emitting diodes and each of the first conductive portions and each of the first The two conductive portions are electrically connected; a light guide plate is mounted on the frame body, and the light emitting diodes surround the side edges of the light guide plate with respect to the upper portion of the hollow portion. The light guiding structure of claim 9, wherein the frame further has a stepped portion recessed downward from the upper surface, and the plurality of first conductive portions and the plurality of second conductive portions are disposed on the stepped portion.