TW201644113A - Method of manufacturing a waterproof enclosure and sealing an electronic device with the waterproof enclosure - Google Patents

Abstract

Method of manufacturing a waterproof enclosure sealing an electronic device with the waterproof enclosure includes forming a rectangular waterproof upper member and a rectangular waterproof lower member; pressing the upper member on three adhesive members which in turn press the lower member; punching holes on four edges of the upper and lower members; heating three edges of the upper and lower members to fasten the upper and lower members together; placing an electronic device in the upper and lower members by inserting the electronic device through an open edge of the upper and lower members; heating the open edge to seal the electronic device in the upper and lower members; and cutting the edges of the upper and lower members containing the holes.

Description

Electronic component waterproof covering kit manufacturing method

The invention relates to a method for manufacturing a cloth covering sleeve, in particular to a method for manufacturing an electronic component waterproof covering kit.

There is a method for manufacturing an electronic component waterproof covering kit, which is connected by a sewing method between two sets of glue, and then a rubber strip is added to the connecting stitch to achieve a waterproof effect, and the finished product is not beautiful. Aesthetically, because it is suitable for medical high-precision electronic components, it requires printing and related instructions to monitor the various postures of the bedridden in bed, so that the entire set of electronic components can be more waterproof. Since the entire module must have a width of at least 50 cm*100 cm or more, for a general heat sealer, when a small batch is produced, it is impossible to customize a large machine to make it, but the glue is easy to heat seal. However, the material is not good, the durability is not good, and the waterproofing is not good. Therefore, the structure and the method of the prior art affect the overall usability and promotion, in order to provide items that are more in line with actual needs. The inventors conducted research and development to solve various problems that are easily caused by conventional use.

The main object of the present invention is to provide a method for manufacturing an electronic component waterproof covering kit, which utilizes a better material and an intermediate heat sealing method of the rubber strip, but does not need to use a special large machine, and only uses a small machine to cooperate with the mold fixture. The setting can complete the effect of heat sealing. To the production of a fully waterproof product that improves quality.

In order to achieve the above object, the method of the present invention is as follows: the first step of the manufacturing process is to cut off the outer surface by applying a layer of waterproof glue or waterproof film to the upper and lower sets of the cloth, and the second step is required to be dense between the two sets. In the third step, a strip of glue is attached, and the third step is to sequentially circulate the left and right sides of the two sets of overlapping sets, and the fourth step is to sequentially perform two positioning holes for the two sets by using a small heating machine. The fifth step is to insert the electronic components from the two sets into a bag-like opening side, and the sixth step is to carry out the two sets in sequence with a small heating machine. The action of heat sealing and pressing between the two positioning holes on the opening side, so that the waterproof covering kit of the complete waterproof sealing is completed; the seventh step can cut and remove the positioning holes that need not be left. The article finished by the method of the present invention is its finished product.

〔this invention〕

In order to enable the reviewing committee to better understand the techniques, means, and effects of the present invention in order to achieve the intended purpose, the preferred embodiments of the present invention will be described in detail with reference to the drawings. And the advantages, when you can get a deep and specific understanding.

The first figure is an exploded perspective view of the present invention.

The second figure is a perspective view of the present invention when it is ready to be combined.

The third figure is a perspective view of the combination of the present invention.

The fourth figure is a top view of the setting of the special manufacturing method of the present invention.

The fifth figure is a top view of the coated electronic component of the present invention as a finished product.

As shown in the first to fifth figures, the electronic component waterproof cover of the present invention is The manufacturing method is the first step of cutting the outer cover by applying a layer of waterproof glue or waterproof film to the upper and lower sets of the cloth. The second step is to glue a glue between the two sets except for the close fit. The strip (such as the first to the second figure), the third step is to sequentially circulate the left and right sides of the two sets of overlapping sets (such as the fourth figure), the fourth step is to use the two sets of small The heating machine sequentially performs the action of sealing and sealing the two positioning holes along the strip, and the fifth step is to insert the electronic components into the bag-like opening side of the two sets (as shown in the third figure). In the sixth step, the small-sized heating machine is sequentially used to perform the heat sealing and pressing operation between the two positioning holes on the open side of the two sets, so that the waterproof covering kit of the complete waterproof sealing is completed; the seventh step can not be positioned. The hole is cut and removed (as shown in the fifth figure). The cloth kit can be a natural fiber cloth, a artificial fiber cloth or a resin cloth; the waterproof rubber strip is a polyurethane (PU). The heating machine refers to a high frequency heating machine or an ultrasonic heating machine.

In view of the above structure, the present invention uses the positioning hole setting to enable the small machine to perform the processing process, that is, the cost can be reduced, but also because of the positioning hole, the two sets are tightened to make the degree of thermal expansion the same. When the sealing is heated, the shrinkage rate is the same, and a straight line can be formed. This improves the sealing degree of the finished product to the leakproof requirement of the complete sealing, so that all the electronic components inside can be better protected, and at the same time, High-quality fabrics are coated to enhance better comfort and water resistance, so they provide excellent ease of use and are a completely different mechanism.

The above description of the preferred embodiments of the present invention is not intended to limit the scope of the present invention, and the scope of the invention should be limited to the following claims. And the approximate structure should be included in the present invention.

Claims (4)

The manufacturing method of the electronic component waterproof covering kit is as follows: the first step is to cut a pair of waterproof glue or waterproof film on the outer surface to cut the upper two sets of cloth, and the second step needs to be tightly combined between the two sets. A strip of glue is attached to the place, and the third step is to sequentially punch out the positioning holes of the two sets of overlapping sets, and the fourth step is to sequentially perform the two sets of holes between the two sets by using a small heating machine. The heat-pressing action along the strip is the fifth step of inserting the electronic component into the bag-like opening side of the two components, and the sixth step is to sequentially open the two sets of the device with a small heating machine. The action of heat sealing and pressing between the two positioning holes on the side, so that the waterproof bag sheathing member with complete waterproof sealing is completed. The method for manufacturing the electronic component waterproof covering kit according to the first aspect of the patent application, wherein the seventh step further comprises cutting and removing the positioning hole that does not need to be left. The method for manufacturing an electronic component waterproof coating kit according to claim 1, wherein the fabric kit can be a natural fiber cloth, a artificial fiber cloth or a resin cloth; and the waterproof rubber strip is polyurethane (PU). The method for manufacturing an electronic component waterproof coating kit according to claim 1, wherein the heating machine refers to a high frequency heating machine or an ultrasonic heating machine.