TW201644030A - Circuit board of composite multilayer circuits and manufacturing method thereof - Google Patents

Abstract

A circuit board of composite multilayer circuits and manufacturing method thereof are provided with at least two sets of circuits on a ceramic substrate, which can respectively supply power to two LEDs sets of different color temperatures, wherein the traces of the two circuit sets are crisscrossed with each other. The LEDs of the first color temperature LED set and the LEDs of the second color temperature LED set are arranged adjacent to each other, and one of the circuit sets is embedded inside the surface layer of the ceramic substrate.

Description

Composite multilayer circuit substrate and manufacturing method thereof

The invention relates to a composite multilayer circuit substrate and a manufacturing method thereof, in particular to a circuit on which two sets of LEDs respectively capable of supplying different color temperature LEDs are provided, wherein one set of circuits is embedded in the surface layer of the substrate, and the first group The LED of the color temperature LED and the LED of the second group of color temperature LEDs are arranged adjacently, so that the light emitted by the overall LED is more uniform and soft.

The light-emitting diode is a kind of high-power light-emitting electronic product. As LED electronic products become increasingly miniaturized, the heat dissipation function of the LED circuit board is a big test.

With the increasing use of LEDs, people's requirements for LED light color have also been relatively improved. Traditional single color temperature LEDs have been unable to meet the requirements of users. The industry has developed applications for setting different color temperature LEDs on one substrate to enhance light color. .

As shown in FIG. 1 , it is seen that two sets of different color temperature LEDs are disposed on a substrate, and a plurality of LEDs of the first group of color temperatures are collectively set to become a first color temperature LED group 100, and the second group of color temperatures is A plurality of LEDs are collectively disposed to form a second color temperature LED group 200. The circuits of the two groups of color temperature LED groups 100 and 200 are connected to a positive electrode 101, 201 and a negative electrode 102, 202. And constitute a single loop.

However, it is customary to provide two sets of different color temperature LEDs on a substrate. Although there are respective loops, since each color temperature LED group is separately disposed, that is, the first color temperature LED group 100 is disposed on one side of the substrate, the second The color temperature LED group 200 is disposed on the other side of the substrate. As a result of the separate setting, when two groups of different color temperature LEDs emit light at the same time, there are two sets of distinct light colors, which are easy to cause dazzling visual deviation. .

In addition, the low resistance of copper makes it an important material between the connecting element and the component. However, for high-density, high-power LEDs, when the metal wires enter the miniaturization field, a small line width causes a high resistance, which causes an increase in heat generation and a problem of reducing the uniformity of the light of the LED. Both LTCC and HTCC technologies use thick film printing technology to complete the circuit production. Thick film printing itself is limited by the tension of the screen. The surface of the circuit is rough, which is easy to cause uneven alignment and excessive tolerance. Although DBC prepares metal lines by lithography process, its copper thickness can only be limited to 150~300μm due to its limited process capability, while the resolution of metal lines is only between 150~300μm (in aspect ratio). 1:1 is the standard).

In view of the shortcomings of the prior art mentioned above, the inventors have been engaged in the manufacturing experience and technology accumulation of various light-emitting diodes, and have carefully studied various solutions for the above-mentioned problems, and finally developed and designed after continuous research, experiment and improvement. A novel composite multilayer loop electric circuit of the invention The invention of the substrate and the method of manufacturing the same, in order to eliminate the defects caused by the prior art.

The composite multilayer circuit substrate of the present invention and the manufacturing method thereof are those in which the LEDs of different color temperature circuits are adjacently arranged by using microgroove etching, 3D metallized copper wire and cross copper wire technology in the substrate.

According to the composite multilayer circuit circuit board of the present invention and the manufacturing method thereof, the front cross copper wire is embedded in the surface layer of the substrate, and the rear line is fabricated by an easy insulation and high reflection process, thereby improving the yield, which is the second time of the present invention. First, the purpose.

The composite multilayer circuit substrate and the manufacturing method thereof according to the invention are both insulated (>1014 ohm-cm) and high thermal conductivity (K>160 W/mK), and have thermal expansion coefficient, lattice constant and the like and GaN, SiC Close to the aluminum nitride substrate, and then use the DPC film process to reduce the metal line width (<0.15mm) and the spacing between the lines, the surface of the aluminum nitride substrate and the micro-groove structure is formed by etching, and the copper wire is buried inside. In order to achieve better heat dissipation characteristics, it is the second object of the present invention.

According to the composite multilayer circuit substrate of the present invention and the method of manufacturing the same, the aluminum nitride substrate is etched by using a plasma, and the gas ions after the reaction are irradiated to the ceramic substrate to achieve a better line aspect ratio. It is a further object of the invention.

The composite multilayer circuit substrate and the manufacturing method thereof according to the present invention are developed by using dry etching to develop an ultra-high heat-dissipating aluminum nitride substrate. It is a better choice for both line quality and cost, and is another object of the present invention.

The composite multilayer circuit circuit board and the manufacturing method thereof according to the invention, combined with the micro-groove etching circuit design and the metallized copper plating circuit technology, the self-aligning manner of the mask layer, the deep technology and the deep through the substrate In-slot metallization technology, self-aligned copper plating technology, planarization technology, high thermal conductivity insulating material film coating technology, cross copper wire technology and other technologies are combined to complete the fabrication of multi-layer metallized copper-plated substrates for subsequent composite multilayer circuits. The fabrication of the circuit substrate is another object of the present invention.

According to the composite multilayer circuit circuit board and the manufacturing method thereof, the DPC metallized copper wire process technology is adopted, and the thin copper is plated by vacuum sputtering of the thin film process, and then the line is completed by the yellow light lithography process, so the wire diameter is 10 ~50μm, even finer, and high surface flatness (<0.3μm), line alignment accuracy error value is only +/-1%, avoiding shrinkage ratio, screen mesh, surface flatness, high manufacturing cost ... and other problems, also solve the problem of the sintering shrinkage ratio of LTCC/HTCC and the screen-mesh problem of the thick film process, which is another object of the present invention.

For the sake of the examination, the reviewer can make a further understanding and understanding of the purpose, shape, structure and function of the present invention. The embodiment is combined with the diagram and is described in detail as follows:

100‧‧‧First color temperature LED group

200‧‧‧Second color temperature LED group

101, 201‧‧‧ positive

102, 202‧‧‧ negative

300‧‧‧The first group of color temperature LED circuits

400‧‧‧Second group of color temperature LED circuits

31, 41‧‧‧ positive

32, 42‧‧‧ negative

3a, 3b, 3c‧‧‧ first color temperature LED

4a, 4b, 4c‧‧‧ second color temperature LED

500‧‧‧Aluminum nitride substrate

501‧‧‧Linear groove

502‧‧‧ copper wire

600‧‧‧High thermal insulation

700‧‧‧Second high thermal insulation

801, 802‧‧‧ solder pads

Figure 1 is a schematic view showing the configuration of using two sets of color temperature circuits on a substrate.

2 is a schematic view showing the arrangement of two sets of color temperature circuits using the composite multilayer circuit circuit board of the present invention.

3A to 3G are schematic flow charts showing the manufacturing steps of the method for manufacturing the composite multilayer circuit circuit board of the present invention.

The composite multilayer circuit circuit substrate of the present invention, as shown in FIG. 2, is provided on a ceramic substrate with at least two sets of circuits respectively providing LEDs of different color temperatures, respectively, a first group of color temperature LED circuits 300 and a second group of color temperatures. The LED circuit 400, the two sets of color temperature LED circuits 300, 400 are each connected to a positive electrode 31, 41 and a negative electrode 32, 42, and each constitutes a single circuit. Moreover, the lines of the first group of color temperature LED circuits 300 and the second group of color temperature LED circuits 400 are interlaced.

As shown, the first set of color temperature LED circuits 300 are connected to a plurality of first color temperature LEDs 3a, 3b, 3c, ..., and the second set of color temperature LED circuits 400 are connected to a plurality of second color temperature LEDs 4a, 4b, 4c, .... Since the circuits of the first group of color temperature LED circuits 300 and the second group of color temperature LED circuits 400 are interlaced, a portion of the first color temperature LEDs 3a, 3b, 3c, ... and the second color temperature LEDs 4a, 4b, 4c... are Adjacently disposed, the first color temperature LEDs 3a, 3b, 3c, ... and the second color temperature LEDs 4a, 4b, 4c are arranged adjacent to each other at the mixing interval.

Thereby, when the first color temperature LEDs 3a, 3b, 3c, ... and the second color temperature LEDs 4a, 4b, 4c, ... are simultaneously illuminated, the first color temperature LED light is transmitted through The uniform mixing of the second color temperature LED light makes the overall emitted light color more uniform and soft.

The manufacturing method of the composite multilayer circuit circuit substrate of the invention is combined with the micro-groove etching circuit and the metallized copper plating circuit technology, and is fabricated by self-aligning of the mask layer, which firstly takes the aluminum nitride substrate as a front The cleaning process is carried out, and then the special metal film manufacturing technology-vacuum coating method is used to sputter and bond the copper metal composite layer on the aluminum nitride substrate, and then the photoresist is exposed by yellow light lithography, exposure, development, etching, and film removal processes are completed. The thickness of the line is increased by electroplating/electroless plating, and the metallization circuit is completed after the photoresist is removed. The manufacturing steps include: selecting an aluminum nitride substrate 500 as shown in FIG. 3A; forming a linear trench 501 on the aluminum nitride substrate 500 by a substrate deep etching technique, and applying a metal in the trench to the linear trench 501 The etched depth of the linear trench 501 is 30-50 μm, and the metallization thickness in the trench is 0.4-0.6 μm, as shown in FIG. 3B; plating in the linear trench 501 by self-aligned copper plating technique Copper, forming a copper wire 502, and then flattening the surface by a planarization technique, wherein the copper plating depth is 30-40 μm, and the roughness of the planarization technique is less than 3.0 μm, thereby completing the fabrication of the first group of color temperature LED circuits. As shown in FIG. 3C, a high thermal conductive insulating layer 600 covering the first group of color temperature LED circuits 300 is formed on the upper surface of the substrate 500 by a high thermal conductive insulating material coating technology. The material of the high thermal conductive insulating layer 600 may be Alumina, its thickness is 5-25 μm, as shown in FIG. 3D; above the high thermal conductive insulating layer 600, a second set of color temperature LED circuits 400 intersecting with the lines of the first set of color temperature LED circuits 300 are fabricated by a cross copper wire technique, the second The color temperature LED circuit 400 has a thickness of 30-40 μm as shown in FIG. 3E; then, a high thermal conductive insulating material coating technology is applied over the second group of color temperature LED circuits 400 to form the second group of color temperature LED circuits 400. The second high thermal conductive insulating layer 700, which may be alumina, has a thickness of 35-65 μm as shown in FIG. 3F; finally, the surface of the second high thermal conductive insulating layer 700 is further made of metal. High-reflection coating technology, vapor deposition to form a nickel-silver reflective layer, nickel-silver reflective layer thickness of 0.19-2.01 μm, and fabrication of pads 801, 802 using self-aligned eutectic pad technology, as shown in Figure 3G.

The composite multilayer circuit circuit board of the present invention and the manufacturing method thereof, by embedding one of the first group of color temperature LED circuits or the second group of color temperature LED circuits in the surface layer of the substrate, and the other circuit is formed on the surface of the substrate In this way, the LEDs of different color temperatures can be arranged adjacent to each other, and the mixture is mixed, so that the light emitted by the whole is more evenly and flexibly combined. Of course, it is also possible to form a majority of color temperature LED circuits on the substrate by using these methods.

In summary, the composite multilayer circuit board and the manufacturing method thereof of the present invention have an unprecedented innovative structure, which is not found in any publication, and there is no similar product on the market. Its novelty should be undoubted. In addition, the unique features and functions of the present invention are far from comparable to the conventional ones, so it is indeed more progressive than the conventional ones, and the patent application is in accordance with the provisions of the application requirements of the invention patents of the Chinese Patent Law.

The above description is only the best embodiment of the present invention, but the structural features of the present invention are not limited thereto, and any change or modification that can be easily considered by those skilled in the art can be covered. In the following patent scope of this case.

300‧‧‧The first group of color temperature LED circuits

3a, 3b, 3c‧‧‧ first color temperature LED

400‧‧‧Second group of color temperature LED circuits

4a, 4b, 4c‧‧‧ second color temperature LED

31, 41‧‧‧ positive

32, 42‧‧‧ negative

Claims (4)

A composite multilayer circuit circuit board is provided with at least two sets of circuits on a ceramic substrate, which can respectively provide conduction of a first color temperature LED group and a second color temperature LED group, wherein the two sets of circuits are connected to a positive electrode and A negative circuit and each constitute a single loop; wherein the lines of the two sets of circuits are mutually staggered, and the LEDs of the first color temperature LED group and the LEDs of the second color temperature LED group are disposed adjacent to each other. The composite multilayer circuit circuit substrate of claim 1, wherein the two sets of circuits are a first group of color temperature LED circuits and a second group of color temperature LED circuits, the first group of color temperature LED circuits and the second group of color temperature LED circuits The lines are staggered, and one of the first group of color temperature LED circuits or the second group of color temperature LED circuits is embedded inside the surface layer of the substrate. A manufacturing method of a composite multilayer circuit circuit substrate according to claim 1, wherein the manufacturing step comprises: selecting an aluminum nitride substrate; forming a linear groove on the aluminum nitride substrate by a substrate deep etching technique, and forming a linear groove The trench is subjected to in-slot metallization technology; copper is plated in the linear trench by self-aligned copper plating technology to form a copper wire, and then the surface is flattened by planarization technology; and the substrate is formed on the substrate by a high thermal conductive insulating material coating technology. Upper surface to form a highly thermally conductive insulating layer covering the first set of color temperature LED circuits; On the high thermal conductive insulating layer, a second group of color temperature LED circuits intersecting the lines of the first group of color temperature LED circuits by using a cross-copper wire technology; and a high thermal conductive insulating material coating technology over the second group of color temperature LED circuits to form a cover The second high thermal conductive insulating layer of the second color temperature LED circuit; finally, the surface of the second high thermal conductive insulating layer is plated with a silver layer by a metal high reflective plating technique, and the solder pad is fabricated using a self-aligned eutectic pad technology. The method for manufacturing a composite multilayer circuit substrate according to claim 3, wherein the substrate has an etching depth of 30-50 μm; the in-slot metallization thickness is 0.4-0.6 μm; the copper plating depth is 30-40 μm; and planarization The roughness of the technology is less than 3.0 μm; the thickness of the high thermal conductive insulating layer is 5-25 μm; the thickness of the second color temperature circuit is 30-40 μm; the thickness of the second high thermal conductive insulating layer is 35-65 μm; the thickness of the reflective layer It is 0.19-2.01 μm.