TW201640069A - Heat radiator improvement with pressing-jointed heat radiating fins - Google Patents
Heat radiator improvement with pressing-jointed heat radiating fins Download PDFInfo
- Publication number
- TW201640069A TW201640069A TW105127182A TW105127182A TW201640069A TW 201640069 A TW201640069 A TW 201640069A TW 105127182 A TW105127182 A TW 105127182A TW 105127182 A TW105127182 A TW 105127182A TW 201640069 A TW201640069 A TW 201640069A
- Authority
- TW
- Taiwan
- Prior art keywords
- groove
- stamping
- base
- fins
- heat sink
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Abstract
Description
本發明係關於一種散熱器散熱鰭片的沖壓結合方法,其係配合一具有沖壓斜面的沖壓沖頭進行沖壓結合,利用該沖壓沖頭的沖壓斜面同時局部涵蓋散熱鰭片的反折部及溝槽側壁,使溝槽側壁產生移動變形而壓住反折部。The invention relates to a stamping and bonding method for a heat dissipating fin of a radiator, which is combined with a stamping punch having a punching bevel, and the stamping bevel of the punching punch partially covers the reflexing portion and the groove of the fin The side wall of the groove causes the side wall of the groove to move and deform to press the reflex portion.
習知散熱器的散熱鰭片與底座的結合,除了傳統的焊接結合技術外,亦有利用沖壓方式,將散熱鰭片先插植於底座的預設溝槽或夾持凸座,再以沖壓沖頭進行沖壓,而使散熱鰭片被夾持結合於底座的溝槽(或夾持凸座),例如美國發明專利第5014776號案,就是使兩側的溝槽側壁產生沖壓推擠變形,進而可夾持散熱鰭片,以達到散熱鰭片與底座的結合目的。The combination of the heat sink fins and the base of the conventional heat sink, in addition to the traditional welding and bonding technology, also uses a stamping method to insert the heat sink fins into the preset grooves or clamping protrusions of the base, and then press The punch is stamped so that the heat sink fins are clamped to the groove (or the clamp boss) of the base. For example, in the case of the US Patent No. 5014776, the sidewalls of the grooves on both sides are subjected to stamping and pushing deformation. In turn, the heat sink fins can be clamped to achieve the purpose of combining the heat sink fins with the base.
上述先前專利技術,只是利用溝槽兩側的擠壓變形而達到夾持散熱片根部的目的,但夾持作用力都集中在溝槽開口兩側的變形位置,僅具有兩個點狀的夾持力,因此,夾持效果不佳,不易確保其穩定結合,不僅各散熱片可能發生參差不齊的不等高現象,而且散熱片容易發生搖動或脫落情形。The above prior patent technology only uses the extrusion deformation on both sides of the groove to achieve the purpose of clamping the root of the heat sink, but the clamping force is concentrated on the deformation position on both sides of the groove opening, and only has two dot-shaped clips. Holding force, therefore, the clamping effect is not good, it is not easy to ensure its stable combination, not only the fins may have uneven height unequal phenomenon, but also the heat sink is easy to shake or fall off.
本發明之主要目的,乃在於提供一種散熱器散熱鰭片的沖壓結合方法,係包括一底座、複數個散熱鰭片及沖壓沖頭,為預先在底座表面開設複數個可供各散熱鰭片對應插植的相鄰溝槽,且各散熱鰭片的插植端均設有一反折部,而將散熱鰭片插入底座溝槽後,再利用一沖壓沖頭對準插植的反折部位進行沖壓,特別是利用該沖壓沖頭具有一可同時局部涵蓋反折部及溝槽側壁的沖壓斜面,於沖壓後使反折部於溝槽內下壓產生變形而迫緊結合於溝槽,且沖壓斜面因同時沖壓推擠溝槽側壁而產生移動變形,使該移動變形的溝槽側壁可向下壓住反折部,以確保散熱鰭片的結合更為穩固。The main purpose of the present invention is to provide a stamping and bonding method for a heat sink fin, which comprises a base, a plurality of heat radiating fins and a punching punch, which are provided in advance for a plurality of heat sink fins on the surface of the base. Inserting adjacent grooves, and inserting ends of the heat dissipating fins are respectively provided with a reverse folding portion, and inserting the heat dissipating fins into the groove of the base, and then using a punching punch to align with the refolding portion of the inserted plant Stamping, in particular, the punching punch has a stamping bevel which can partially cover the reverse folding portion and the side wall of the groove at the same time, and after pressing, the folding portion is pressed down in the groove to deform and is tightly coupled to the groove, and The punched bevel is moved and deformed by pushing the side wall of the groove at the same time, so that the side wall of the groove which is deformed by the movement can press down on the reflexed portion to ensure that the combination of the fins is more stable.
本發明之次要目的,乃在於提供一種散熱器散熱鰭片的沖壓結合方法,其中,各散熱鰭片係於反折部的選定間距分別沖設複數個沖壓凸片,各沖壓凸片可呈朝上側傾的外翻形狀,並於通過沖壓沖頭的沖壓斜面施以沖壓後,使移動變形的溝槽側壁可向外延伸而向下壓住沖壓凸片,並卡住溝槽內壁,以形成穩固卡住,且反折部的其餘部份則受到擠壓變形,並填滿於底座的溝槽,因此使散熱鰭片與底座的結合更為穩固。A secondary object of the present invention is to provide a stamping and bonding method for a heat sink fin of a heat sink, wherein each heat sink fin is formed with a plurality of stamping tabs at a selected pitch of the reverse folding portion, and each stamping tab can be The outwardly inclined shape of the eversion, and after being punched by the punched bevel of the punching punch, the side wall of the groove which is moved and deformed can extend outwardly to press down the punching tab and catch the inner wall of the groove. The formation is firmly stuck, and the rest of the folding portion is crushed and deformed, and fills the groove of the base, thereby making the combination of the heat dissipation fin and the base more stable.
茲依附圖實施例將本發明的沖壓結合方法及其他作用、目的詳細說明如下:The stamping bonding method and other functions and purposes of the present invention are described in detail below with reference to the accompanying drawings:
如第一圖至第七圖所示,本發明所揭散熱器散熱鰭片的沖壓結合方法,係包括一底座1、複數個散熱鰭片2及沖壓沖頭3,而其沖壓結合方法如下:As shown in the first to seventh figures, the stamping and bonding method for the heat sink fins of the present invention comprises a base 1, a plurality of heat radiating fins 2 and a punching punch 3, and the stamping and bonding method is as follows:
(1)、係預先在底座表面開設複數個可供各散熱鰭片對應插植的相鄰溝槽;(1) pre-existing a plurality of adjacent grooves on the surface of the base for each of the heat dissipation fins;
(2)、各散熱鰭片的插植端均設有一反折部;(2), each of the fins of the heat sink fins are provided with a reversed portion;
(3)、將各散熱鰭片反折部匹配插入底座的溝槽;(3) matching the recessed portions of the heat dissipation fins into the grooves of the base;
(4)、使用沖壓沖頭對準插植後的反折部位進行沖壓(如第五圖),該沖壓沖頭3具有一可同時局部涵蓋反折部21及溝槽11側壁的沖壓斜面31;(4) stamping (for example, the fifth figure) using a punching punch to align the inserted folding portion, the punching punch 3 having a punching inclined surface 31 which can partially cover the reverse folding portion 21 and the side wall of the groove 11 at the same time. ;
(5)、於沖壓沖頭3沖壓後,係使反折部21於溝槽11內下壓產生變形增大而迫緊結合於溝槽11,且沖壓斜面31係同時同步沖壓推擠溝槽11側壁而產生移動變形,使該移動變形的溝槽側壁111向下壓住反折部21(如第六、七圖),以達到散熱鰭片2與底座1的穩固結合。(5) After the punching punch 3 is punched, the folding portion 21 is pressed down in the groove 11 to increase the deformation and is tightly coupled to the groove 11, and the punching inclined surface 31 simultaneously presses and pushes the groove. The side wall is deformed by movement, so that the groove side wall 111 of the movement deformation is pressed down against the folding portion 21 (such as the sixth and seventh figures) to achieve a firm coupling of the heat dissipation fin 2 and the base 1.
上述的複數個散熱鰭片2,其形狀或大小係可不拘,但於插植端均設有一反折部21,並可進一步於該反折部21的選定間距分別沖設複數個呈外翻狀的沖壓凸片211(如第一至五圖),再將該反折部21匹配植入底座1的溝槽11。The plurality of heat dissipating fins 2 may be of a shape or size, but a folding portion 21 is provided at the insertion end, and a plurality of eversions may be further set at the selected spacing of the reflexing portion 21 A stamping tab 211 (such as the first to fifth figures) is formed, and the folded portion 21 is matched to the groove 11 of the base 1.
上述具有沖壓凸片211的反折部21,係於沖壓後,使移動變形後的溝槽側壁111向下壓住反折部21的沖壓凸片211,並卡住溝槽11的內壁,以確保散熱鰭片2與底座1的結合絕不會發生搖動或脫落。The reversed portion 21 having the punching tab 211 is formed by pressing the deformed groove sidewall 111 downward against the stamping tab 211 of the folding portion 21 and jamming the inner wall of the groove 11. In order to ensure that the combination of the heat dissipation fin 2 and the base 1 is never shaken or dropped.
上述散熱鰭片2的沖壓凸片211,其係可呈朝上側傾的外翻形狀,於通過沖壓沖頭3的沖壓後,係使移動變形的溝槽側壁111形成向外延伸,並壓住反折部21沖壓凸片211,反折部21的其餘部份則發生擠壓變形,並填滿於底座1溝槽11,故散熱鰭片2與底座1的溝槽11結合更為穩固。The punching tab 211 of the heat dissipating fin 2 may be in an everted shape that is inclined upward, and after being punched by the punching punch 3, the grooved side wall 111 of the mobile deformation is formed to extend outward and is pressed. The folded portion 21 punches the tab 211, and the remaining portion of the folded portion 21 is crushed and deformed, and is filled in the groove 11 of the base 1, so that the heat radiating fin 2 is more stably combined with the groove 11 of the base 1.
如第八圖所示,所述底座1溝槽11的寬度A係略大於散熱鰭片2反折部21的厚度B,但反折部21的厚度B再加上沖壓凸片211C外翻邊壁的寬度C,則相同於溝槽11的寬度A,亦即:A=B+C。As shown in the eighth figure, the width A of the groove 11 of the base 1 is slightly larger than the thickness B of the folded portion 21 of the heat dissipation fin 2, but the thickness B of the folded portion 21 plus the outwardly turned edge of the stamping tab 211C The width C of the wall is the same as the width A of the groove 11, that is, A=B+C.
如第九、十圖所揭實施例,本發明係可與一個以上的熱導管4形成緊配嵌合,以組成一附有熱導管的散熱器,其係可於本發明底座1a的另一端面開設一個以上的嵌槽12a,用以適配嵌入熱導管4,使熱導管4具有平整貼底面41,並外露結合於底座1a的底端面,或所述的熱導管4亦可適當彎折,並貫穿複數散熱片2,以完成一附有熱導管的散熱器緊配組合。As disclosed in the ninth and tenth embodiments, the present invention can be closely fitted with more than one heat pipe 4 to form a heat sink with a heat pipe, which can be another of the base 1a of the present invention. The end surface defines one or more slots 12a for fitting the heat pipe 4 so that the heat pipe 4 has a flat bottom surface 41 and is exposed to the bottom end surface of the base 1a, or the heat pipe 4 can be appropriately bent. And through the plurality of fins 2 to complete a heat sink tight assembly with a heat pipe.
如第十一、十二圖所示另一實施例,本發明的底座1b,係亦可實施為圓形座體,並於該圓形底座1b的周壁面開設複數軸向相鄰的溝槽11b,以供對應插植各散熱鰭片2b,依同理實施,使各散熱片2b可呈輻射方向而穩固插植結合於圓形底座1b的周壁面。As shown in the eleventh and twelfth embodiments, the base 1b of the present invention can also be implemented as a circular base, and a plurality of axially adjacent grooves are formed on the peripheral wall surface of the circular base 1b. 11b, for corresponding insertion of each of the heat dissipation fins 2b, according to the same implementation, so that each of the heat sinks 2b can be stably implanted and bonded to the peripheral wall surface of the circular base 1b.
本發明所述的散熱片2,其形狀、大小或堆疊排列形態,係可視不同需要而做任意變化,其中的沖壓凸片211係可省略不設,即如第十三圖的再一實施例,各散熱片2係可直接利用反折部21對應插植於底座1的溝槽11,再以沖壓沖頭3對準插植的反折部位進行沖壓(如第十四圖至第十六圖所示),該沖壓沖頭3的沖壓斜面31係同時局部涵蓋反折部21及溝槽側壁111,故沖壓後可使反折部21於溝槽11內下壓產生變形增大而迫緊結合於溝槽11,且以移動變形的溝槽側壁111向下壓住反折部21,以完成散熱鰭片2與底座1的穩固結合。是以,附圖實施例僅係揭露本發明的技術方法,但並非用以限定本案的範圍,如涉及等效應用或簡易增減變更,仍應視為屬於本案的技術範圍。The shape, size, or stacking arrangement of the heat sink 2 of the present invention may be arbitrarily changed according to different needs, and the stamping tab 211 may be omitted, that is, another embodiment as in the thirteenth diagram. Each of the fins 2 can be directly inserted into the groove 11 of the base 1 by using the folding portion 21, and then punched by the punching punch 3 to align the inserted folding portion (such as the fourteenth to sixteenth As shown in the figure, the stamping bevel 31 of the punching punch 3 partially covers the folded portion 21 and the groove sidewall 111 at the same time, so that after the pressing, the folding portion 21 can be pressed down in the groove 11 to cause deformation and increase. The groove 11 is tightly coupled to the groove 11 and the groove portion 111 of the groove is pressed downward to press the reverse portion 21 to complete the firm connection of the heat dissipation fin 2 to the base 1. Therefore, the embodiment of the drawings merely discloses the technical method of the present invention, but is not intended to limit the scope of the present invention. For example, the equivalent application or the simple increase or decrease of the change should be regarded as the technical scope of the present invention.
綜上所述,本發明所為散熱器散熱鰭片的沖壓結合方法,關於散熱片與底座的插入結合方法,其所使用的方法與習知散熱器已有不同,特別是配合具有沖壓斜面的沖壓沖頭而造成移動變形的溝槽側壁延伸壓住反折部的頂端,確保各散熱片均能完全插入底座溝槽,而獲穩固結合效果,應已符合進步要件,為此提出申請,敬請 依法審查賜准專利,實感德便。In summary, the present invention is a stamping and bonding method for a heat sink fin of a heat sink, and a method for inserting and bonding a heat sink to a base has a method different from that of a conventional heat sink, in particular, a stamping having a stamped bevel. The side wall of the groove which causes the movement deformation is pressed against the top end of the reflexing portion, ensuring that each fin can be completely inserted into the groove of the base, and the solid combination effect is satisfied, and the application is required, for which application is required According to the law, the patent is granted, and it is really sensible.
1‧‧‧底座
2‧‧‧散熱鰭片
11‧‧‧溝槽
21‧‧‧反折部
211‧‧‧沖壓凸片
3‧‧‧沖壓沖頭
31‧‧‧沖壓斜面
111‧‧‧溝槽側壁
A‧‧‧溝槽寬度
B‧‧‧反折部厚度
C‧‧‧沖壓凸片外翻寬度
4‧‧‧熱導管
41‧‧‧平整貼底面
1a‧‧‧底座
12a‧‧‧嵌槽
1b‧‧‧圓形底座
11b‧‧‧溝槽
2b‧‧‧散熱鰭片1‧‧‧Base
2‧‧‧Heat fins
11‧‧‧ trench
21‧‧‧Reflexion
211‧‧‧ stamping tab
3‧‧‧ Stamping punch
31‧‧‧Pressing bevel
111‧‧‧ trench sidewall
A‧‧‧ groove width
B‧‧‧Reflexed section thickness
C‧‧‧ Stamping tab valgus width
4‧‧‧heat pipe
41‧‧‧Flat bottom
1a‧‧‧Base
12a‧‧‧Inlay
1b‧‧‧round base
11b‧‧‧ trench
2b‧‧‧heat fins
第一圖為本發明於沖壓結合前的立體示意圖。 第二圖為本發明散熱鰭片的立體圖。 第三圖為本發明散熱鰭片的局部放大圖。 第四圖為本發明散熱鰭片的另一角度局部放大圖。 第五圖為本發明進行沖壓時的狀態示意圖。 第六圖為本發明完成沖壓時的狀態示意圖。 第七圖為本發明沖壓沖頭退出後的完成狀態示意圖。 第八圖為本發明散熱鰭片於插入底座前的示意圖。 第九圖係本發明實施為一附有熱導管散熱器的組合正視圖。 第十圖為第九圖實施例的組合立體圖。 第十一圖為本發明底座實施為圓形座體的組合上視圖。 第十二圖為第十一圖實施例的組合立體圖。 第十三圖為本發明另一實施例於沖壓結合前的立體示意圖。 第十四圖為第十三圖實施例進行沖壓時的狀態示意圖。 第十五圖為第十三圖實施例完成沖壓時的狀態示意圖。 第十六圖為第十三圖實施例沖壓沖頭退出後的完成狀態示意圖。The first figure is a three-dimensional schematic view of the invention before stamping. The second figure is a perspective view of the heat sink fin of the present invention. The third figure is a partial enlarged view of the heat sink fin of the present invention. The fourth figure is a partial enlarged view of another angle of the heat dissipation fin of the present invention. The fifth figure is a schematic view of the state at the time of stamping of the present invention. The sixth figure is a schematic view of the state at the time of completion of stamping of the present invention. The seventh figure is a schematic view of the completed state of the stamping punch of the present invention after exiting. The eighth figure is a schematic view of the heat sink fin of the present invention before being inserted into the base. The ninth drawing is a front view of a combination of a heat pipe heat sink attached to the present invention. Figure 11 is a combined perspective view of the ninth embodiment. The eleventh figure is a combined top view of the base of the present invention implemented as a circular seat. Figure 12 is a combined perspective view of the eleventh embodiment. Figure 13 is a perspective view of another embodiment of the present invention before stamping. Fig. 14 is a view showing a state in which the embodiment of the thirteenth embodiment is stamped. The fifteenth drawing is a schematic view showing the state at the time of completion of stamping in the embodiment of the thirteenth embodiment. Figure 16 is a schematic view showing the completed state of the stamping punch after the withdrawal of the embodiment of the thirteenth embodiment.
1‧‧‧底座 1‧‧‧Base
2‧‧‧散熱鰭片 2‧‧‧Heat fins
11‧‧‧溝槽 11‧‧‧ trench
21‧‧‧反折部 21‧‧‧Reflexion
3‧‧‧沖壓沖頭 3‧‧‧ Stamping punch
31‧‧‧沖壓斜面 31‧‧‧Pressing bevel
111‧‧‧溝槽側壁 111‧‧‧ trench sidewall
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012100298882A CN102538558B (en) | 2012-02-10 | 2012-02-10 | Radiator of punch combined radiating fins |
??201210029888.2 | 2012-02-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201640069A true TW201640069A (en) | 2016-11-16 |
TWI667444B TWI667444B (en) | 2019-08-01 |
Family
ID=46346077
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101119702A TWI571609B (en) | 2012-02-10 | 2012-06-01 | Stamping combined with heat sink fins improved |
TW101210553U TWM441112U (en) | 2012-02-10 | 2012-06-01 | Heat sink improvement combined with heat sink fin by stamping |
TW105127182A TWI667444B (en) | 2012-02-10 | 2012-06-01 | Stamping bonding method for heat sink fins |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101119702A TWI571609B (en) | 2012-02-10 | 2012-06-01 | Stamping combined with heat sink fins improved |
TW101210553U TWM441112U (en) | 2012-02-10 | 2012-06-01 | Heat sink improvement combined with heat sink fin by stamping |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130206381A1 (en) |
JP (1) | JP3178082U (en) |
KR (1) | KR200472236Y1 (en) |
CN (1) | CN102538558B (en) |
DE (1) | DE202012102368U1 (en) |
TW (3) | TWI571609B (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102873217B (en) * | 2012-10-11 | 2014-09-03 | 东莞汉旭五金塑胶科技有限公司 | Automatic assembly method of heat attaching pipe radiator and device thereof |
CN103234378B (en) * | 2013-04-23 | 2015-09-30 | 东莞汉旭五金塑胶科技有限公司 | Waveform radiating fin and radiator thereof |
CN103673730B (en) * | 2013-11-18 | 2016-05-18 | 东莞汉旭五金塑胶科技有限公司 | The combined improved structure of heat radiation plate and radiating seat |
JP6564274B2 (en) * | 2015-08-20 | 2019-08-21 | 昭和電工株式会社 | heatsink |
CN105258539B (en) * | 2015-10-09 | 2018-07-31 | 东莞汉旭五金塑胶科技有限公司 | Radiator |
CN106885141B (en) * | 2015-12-15 | 2023-06-23 | 四川新力光源股份有限公司 | LED light source strip for module lamp box |
CN106890886B (en) * | 2017-02-16 | 2019-06-25 | 惠州智科实业有限公司 | A kind of production method of heat-conducting base |
CN109883236B (en) * | 2019-03-15 | 2020-08-14 | 惠州汉旭五金塑胶科技有限公司 | High-efficiency radiator with punched and combined radiating fins |
CN110149786A (en) * | 2019-06-17 | 2019-08-20 | 鑫佰图科技(惠州)有限公司 | A kind of assemble method of the radiating fin of radiator |
CN110388845A (en) * | 2019-08-13 | 2019-10-29 | 惠州汉旭五金塑胶科技有限公司 | The punch riveting structure of radiating fin |
CN110553532A (en) * | 2019-09-27 | 2019-12-10 | 惠州汉旭五金塑胶科技有限公司 | Double-sided blown-up plate riveting structure and method |
US11786959B2 (en) * | 2019-10-21 | 2023-10-17 | Huizhou Hanxu Hardware & Plastic Technology Co., Ltd. | Double-sided expanded plate riveting structure and method |
CN112916744B (en) * | 2019-12-05 | 2024-03-08 | 中兴通讯股份有限公司 | Method for manufacturing radiator |
CN111589917B (en) * | 2020-05-25 | 2021-03-26 | 深圳市维鼎精密五金有限公司 | Fin structure and stamping processing equipment thereof |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5932213B2 (en) * | 1981-06-22 | 1984-08-07 | 岩井金属工業株式会社 | How to fix fins on heat sink |
DE3814145C2 (en) * | 1988-04-27 | 1998-07-23 | Hess Joachim | Device for supplying or removing heat |
US5038858A (en) * | 1990-03-13 | 1991-08-13 | Thermalloy Incorporated | Finned heat sink and method of manufacture |
US5542176A (en) * | 1992-09-21 | 1996-08-06 | Hideaki Serizawa | Radiation plate and method of producing the same |
TW376171U (en) * | 1998-11-24 | 1999-12-01 | Foxconn Prec Components Co Ltd | Radiating device |
JP3552047B2 (en) * | 2000-10-25 | 2004-08-11 | 古河電気工業株式会社 | Heat sink, manufacturing method thereof, and pressing jig |
US6742581B2 (en) * | 2001-11-21 | 2004-06-01 | Fujikura Ltd. | Heat sink and fin module |
KR100508206B1 (en) * | 2003-01-30 | 2005-08-17 | 주식회사 쏠리테크 | Method for Manufacturing Plate-fin Type Heat Sink |
CN2651939Y (en) * | 2003-04-17 | 2004-10-27 | 陈世明 | Radiator of superconductive electronic element |
US6995981B2 (en) * | 2003-04-18 | 2006-02-07 | Hon Hai Precision Inc. Co., Ltd. | Heat sink assembly with combined parallel fins |
US6776224B1 (en) * | 2003-05-30 | 2004-08-17 | Shin Ming Chen | Heating dissipating device for electronic elements |
US20050211416A1 (en) * | 2003-10-17 | 2005-09-29 | Kenya Kawabata | Heat sink with fins and a method for manufacturing the same |
US7726385B2 (en) * | 2004-02-23 | 2010-06-01 | International Business Machines Corporation | Heat dissipation interface for semiconductor chip structures |
US8020608B2 (en) * | 2004-08-31 | 2011-09-20 | Hewlett-Packard Development Company, L.P. | Heat sink fin with stator blade |
US7304851B2 (en) * | 2005-06-21 | 2007-12-04 | Yuh-Cheng Chemical Ltd. | Heat sink and its fabrication method |
TWM283222U (en) * | 2005-06-24 | 2005-12-11 | Amulaire Thermal Technology In | Heat dissipating device having thinner heat fins |
CN2857218Y (en) * | 2005-07-05 | 2007-01-10 | 美商旭扬热传股份有限公司 | Radiator having thin fins |
US7721790B2 (en) * | 2006-10-31 | 2010-05-25 | Foxconn Technology Co., Ltd. | Heat sink |
JP3140755U (en) * | 2008-01-21 | 2008-04-10 | 水谷電機工業株式会社 | Corrugated fin type radiator |
KR200447710Y1 (en) * | 2008-02-04 | 2010-02-11 | 충-시엔 후앙 | Improved radiator with heating pipes |
TW200825356A (en) * | 2008-02-04 | 2008-06-16 | chong-xian Huang | Improvement on heat exchanger having a heat pipe |
TWM363192U (en) * | 2009-04-17 | 2009-08-11 | chong-xian Huang | Heat dissipating device |
KR200454183Y1 (en) * | 2009-04-23 | 2011-06-20 | 충-시엔 후앙 | Heat sink with radially arranged radiation fins |
TWM419386U (en) * | 2011-09-01 | 2011-12-21 | Huang-Lung Yang | Heat sink fin and base Pressing assembly structure |
CN202547471U (en) * | 2012-02-10 | 2012-11-21 | 东莞汉旭五金塑胶科技有限公司 | Heat radiator with stamped and combined heat radiating fins |
-
2012
- 2012-02-10 CN CN2012100298882A patent/CN102538558B/en active Active
- 2012-06-01 TW TW101119702A patent/TWI571609B/en active
- 2012-06-01 TW TW101210553U patent/TWM441112U/en unknown
- 2012-06-01 TW TW105127182A patent/TWI667444B/en active
- 2012-06-18 JP JP2012003659U patent/JP3178082U/en not_active Expired - Fee Related
- 2012-06-20 US US13/527,603 patent/US20130206381A1/en not_active Abandoned
- 2012-06-27 DE DE202012102368U patent/DE202012102368U1/en not_active Expired - Lifetime
- 2012-07-05 KR KR2020120005889U patent/KR200472236Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20130206381A1 (en) | 2013-08-15 |
JP3178082U (en) | 2012-08-30 |
KR20130004979U (en) | 2013-08-20 |
CN102538558A (en) | 2012-07-04 |
DE202012102368U1 (en) | 2012-08-23 |
KR200472236Y1 (en) | 2014-04-10 |
TWI667444B (en) | 2019-08-01 |
TW201333411A (en) | 2013-08-16 |
TWI571609B (en) | 2017-02-21 |
CN102538558B (en) | 2013-07-24 |
TWM441112U (en) | 2012-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI667444B (en) | Stamping bonding method for heat sink fins | |
TWI558972B (en) | A combination of heat sinks and heat sinks | |
JP3153318U (en) | Heat exhaust | |
JP3144103U (en) | Radiating member and radiator having the heat radiating member | |
JP3170757U (en) | Heat dissipation device | |
US9016353B2 (en) | Heat sink clip and method for forming the same | |
TW201442611A (en) | Waved radiating fin and radiator comprising same | |
TWI708039B (en) | High-efficiency radiator with stamping and radiating fins | |
TWI731479B (en) | Stamping and riveting structure of radiating fin | |
US20150052731A1 (en) | Heat sink structure and method of manufacturing same | |
TWM445162U (en) | Assembly structure of cooling fin and base | |
CN202547471U (en) | Heat radiator with stamped and combined heat radiating fins | |
US20200326142A1 (en) | High-efficiency heat sink | |
TWI468638B (en) | Radiator fin and base stamping combination method | |
TWI526665B (en) | Radiator with radiating fins | |
JP3172747U (en) | Radiator and its radiation piece | |
KR200465921Y1 (en) | Heat sink module | |
JP3142959U (en) | Heat dissipation fins for cooling electronic equipment | |
JP3161397U (en) | Heat exhaust | |
JP3120171U (en) | A heat dissipation module that can be quickly coupled | |
TWM492432U (en) | Closely fitted and combined heat dissipation fin and heat conduction pipe | |
TW201135178A (en) | Heat dissipation device | |
TW200803704A (en) | Method of fabricating direct-assembled heat dissipation apparatus for heat transfer | |
TWM457084U (en) | Heat dissipating device | |
TWI476574B (en) | Heat dissipation device and method of manufacturing same |