TW201635571A - Photoelectric conversion element and photoelectric conversion device including the same - Google Patents

Photoelectric conversion element and photoelectric conversion device including the same Download PDF

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TW201635571A
TW201635571A TW104142129A TW104142129A TW201635571A TW 201635571 A TW201635571 A TW 201635571A TW 104142129 A TW104142129 A TW 104142129A TW 104142129 A TW104142129 A TW 104142129A TW 201635571 A TW201635571 A TW 201635571A
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layer
photoelectric conversion
electrode layer
power generation
conversion element
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Yoshitaka Sugita
Seiki TERAJI
Kazunori Kawamura
Hiroto Nishii
Tomohiro Kurata
Taichi Watanabe
Yusuke Yamamoto
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Nitto Denko Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/072Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
    • H01L31/0749Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/541CuInSe2 material PV cells

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
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  • Life Sciences & Earth Sciences (AREA)
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  • Photovoltaic Devices (AREA)

Abstract

To provide a photoelectric conversion element having excellent characteristics and a photoelectric conversion device including the same. The photoelectric conversion element of a roughly tabular shape includes: a substrate, a first electrode layer, a power generation layer, and a second electrode layer in this order. The second electrode layer is formed so that a side thereof is positioned inside of a side face position of the power generation layer over an entire circumference.

Description

光電轉換元件及使用其之光電轉換裝置 Photoelectric conversion element and photoelectric conversion device using same 技術領域 Technical field

本發明有關於一種具良好特性之光電轉換元件及電連接該等後使用的光電轉換裝置。 The present invention relates to a photoelectric conversion element having good characteristics and a photoelectric conversion device used after electrically connecting the same.

背景技術 Background technique

以往,已知的光電轉換裝置係具有複數具基板、第1電極層、發電層、第2電極層之光電轉換元件,於相鄰之光電轉換元件之緣部間彼此疊合的狀態下利用焊料等電連接者(參照例如,專利文獻1)。此藉由電連接複數光電轉換元件,可得實用之電壓。 In the related art, a photoelectric conversion device having a plurality of substrates, a first electrode layer, a power generation layer, and a second electrode layer is used, and solder is used in a state in which the edges of adjacent photoelectric conversion elements are overlapped with each other. The isoelectric connector (see, for example, Patent Document 1). This makes it possible to obtain a practical voltage by electrically connecting a plurality of photoelectric conversion elements.

然而,使用如此之光電轉換裝置的光電轉換元件通常具有圖7(a)所示之構造,包含發電層3之各層均極薄地形成。因此,如圖7(b)所示,於發電層3之端部短缺時,第2電極層4容易朝反白箭頭之方向彎曲,第2電極層4與第1電極層2接觸,造成光電轉換元件短路。又,光電轉換元件之製造中或製造後,因導電塵橫跨地附著於第1電極層2與第2電極層4,亦將導致光電轉換元件短路。即便具有1個經產生短路之光電轉換元件,仍將產生光電轉換裝置全體電壓 下降,故光電轉換元件中短路之產生於光電轉換裝置中亦將成為大問題。 However, the photoelectric conversion element using such a photoelectric conversion device generally has the configuration shown in Fig. 7(a), and each layer including the power generation layer 3 is extremely thin. Therefore, as shown in FIG. 7(b), when the end portion of the power generation layer 3 is short, the second electrode layer 4 is easily bent in the direction of the reverse white arrow, and the second electrode layer 4 is in contact with the first electrode layer 2, resulting in photoelectricity. The conversion element is shorted. Further, during or after the production of the photoelectric conversion element, the conductive dust adheres to the first electrode layer 2 and the second electrode layer 4, and the photoelectric conversion element is also short-circuited. Even if there is one photoelectric conversion element that generates a short circuit, the entire voltage of the photoelectric conversion device will be generated. As it falls, the occurrence of a short circuit in the photoelectric conversion element also becomes a big problem in the photoelectric conversion device.

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1:日本專利特開2012-134342號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2012-134342

發明概要 Summary of invention

本發明有鑑於如此情事而作成,目的在於提供光電轉換元件及使用其之光電轉換裝置,該光電轉換元件可有效地防止起因於發電層端部產生之短缺或細微之導電塵附著的短路。 The present invention has been made in view of such circumstances, and an object thereof is to provide a photoelectric conversion element and a photoelectric conversion device using the same, which can effectively prevent a short circuit caused by a shortage of a power generation layer end portion or a fine conductive dust adhesion.

為達成前述目的,本發明以下述光電轉換元件作為第1要旨:一種略為板狀並至少依序具有基板、第1電極層、發電層、第2電極層的光電轉換元件,且前述第2電極層之側面整個周圍形成為較前述發電層之側面位於更內側之位置。 In order to achieve the above object, the present invention has the following first aspect of the invention: a photoelectric conversion element having a substantially plate shape and having at least a substrate, a first electrode layer, a power generation layer, and a second electrode layer, and the second electrode The entire circumference of the side of the layer is formed to be located further inside than the side surface of the power generation layer.

並且,本發明以下述光電轉換裝置作為第2要旨:具有複數光電轉換元件,且係使該等光電轉換元件相鄰之緣部彼此疊合而電連接的光電轉換裝置,前述各光電轉換元件係第1要旨之光電轉換元件,即略為板狀並至少依序具有基板、第1電極層、發電層、第2電極層,前述第2電極層之側面整個周圍形成為較前述發電層之側面位於更內側之 位置。 In the present invention, a photoelectric conversion device having a photoelectric conversion device having a plurality of photoelectric conversion elements and having adjacent edges of the photoelectric conversion elements superposed on each other and electrically connected thereto, each of the photoelectric conversion elements described above The photoelectric conversion element according to the first aspect has a substantially plate shape and has at least a substrate, a first electrode layer, a power generation layer, and a second electrode layer, and the entire surface of the side surface of the second electrode layer is formed to be located closer to the side surface of the power generation layer. More inside position.

換言之,本發明人等為得到高品質之光電轉換裝置,反覆檢討各種可有效防止造成該電壓下降之光電轉換元件短路的方法。結果,發現藉由加工積層有各層之光電轉換元件的側面部分,可得到優異之短路防止效果,而完成本發明。 In other words, the present inventors have repeatedly reviewed various methods for effectively preventing short-circuiting of the photoelectric conversion element causing the voltage drop in order to obtain a high-quality photoelectric conversion device. As a result, it has been found that an excellent short-circuit prevention effect can be obtained by processing the side portions of the photoelectric conversion elements in which the layers are laminated, and the present invention has been completed.

再者,本發明中之略板狀係以目視程度可見全體為板狀之意。因此,不需全體具有均一之厚度,只要作為全體來看為板狀之概念即可。 Further, in the present invention, the outline of the plate is visible to the extent that it is plate-shaped. Therefore, it is not necessary to have a uniform thickness as a whole, and it is only necessary to consider the concept of a plate as a whole.

換言之,本發明之光電轉換元件係略為板狀並至少依序具有基板、第1電極層、發電層、第2電極層的光電轉換元件,且前述第2電極層之側面整個周圍形成為較前述發電層之側面配置在更內側之位置。因此,即使於發電層之端部產生短缺,仍不易產生第2電極層端部朝第1電極層側彎曲的空間,可有效地防止第2電極層與第1電極層接觸。藉此,本發明之光電轉換元件可有效地防止短路。又,本發明之光電轉換元件因形成為更加長第1電極層之側面與第2電極層之側面的最短距離,故即使於光電轉換元件之製造中等產生導電塵,導電塵橫跨第1電極層與第2電極層地附著的可能性低,不會輕易地短路。 In other words, the photoelectric conversion element of the present invention has a plate-like shape and has at least a substrate, a first electrode layer, a power generation layer, and a second photoelectric conversion element, and the entire surface of the second electrode layer is formed in the same manner as described above. The side of the power generation layer is disposed at the inner side. Therefore, even if a shortage occurs at the end portion of the power generation layer, a space in which the end portion of the second electrode layer is bent toward the first electrode layer side is less likely to occur, and the second electrode layer can be effectively prevented from coming into contact with the first electrode layer. Thereby, the photoelectric conversion element of the present invention can effectively prevent a short circuit. Further, since the photoelectric conversion element of the present invention is formed to have the shortest distance between the side surface of the first electrode layer and the side surface of the second electrode layer, conductive dust is generated across the first electrode even in the production of the photoelectric conversion element. The layer is less likely to adhere to the second electrode layer and is not easily short-circuited.

其中,前述發電層之側面整個周圍形成為較前述第1電極層之側面位於更內側之位置時,因可更加增長第1電極層側面至第2電極層側面的最短距離,故將更不易產生 光電轉換元件之短路。 When the entire circumference of the side surface of the power generation layer is located further inward than the side surface of the first electrode layer, the shortest distance from the side surface of the first electrode layer to the side surface of the second electrode layer can be further increased, so that it is less likely to be generated. Short circuit of the photoelectric conversion element.

此外,若以絕緣性被覆材被覆前述第1電極層側面、發電層側面及第2電極層側面整個周圍,即使自外部對光電轉換元件施加衝撃,仍可確實地防止第1電極層與第2電極層接觸,故將更不易產生光電轉換元件之短路。 In addition, when the entire surface of the first electrode layer, the side surface of the power generation layer, and the side surface of the second electrode layer are covered with the insulating coating material, even if the photoelectric conversion element is externally applied, the first electrode layer and the second electrode layer can be reliably prevented. Since the electrode layers are in contact, the short circuit of the photoelectric conversion element is less likely to occur.

並且,使用包含聚醯亞胺之絕緣性膠帶,作為被覆前述側面整個周圍的絕緣性被覆材時,因只要進行貼附之簡單作業即可被覆側面整個周圍,故光電轉換元件不會受到於被覆側面整個周圍時因增加多餘步驟所造成的損害。又,因包含聚醯亞胺之絕緣性膠帶的加工性優異,故即使光電轉換元件之側面形狀複雜,仍可使其正確地對應,尺寸精準度優異。此外,包含聚醯亞胺之絕緣性膠帶因具充分之耐熱性,故對於將光電轉換元件裝填至光電轉換裝置時的熱衝撃亦具有充分之耐性,不會損及作為絕緣性被覆材之形狀。 In addition, when an insulating tape containing polyimide is used as the insulating coating material covering the entire periphery of the side surface, the entire surface of the side surface can be covered by a simple operation of attaching, so that the photoelectric conversion element is not covered by the coating. Damage to the entire circumference of the side due to the addition of extra steps. Moreover, since the insulating tape containing the polyimide is excellent in workability, even if the side surface shape of the photoelectric conversion element is complicated, it can be accurately matched, and the dimensional accuracy is excellent. Further, since the insulating tape containing polyimine has sufficient heat resistance, it is sufficiently resistant to thermal charging when the photoelectric conversion element is loaded into the photoelectric conversion device, and does not impair the shape as an insulating coating material. .

又,使用由包含乙烯乙酸乙烯酯共聚物樹脂及胺甲酸乙酯樹脂之至少一者的熱可塑性樹脂組成物所構成者,作為被覆前述側面整個周圍的絕緣性被覆材時,因該等係作為密封光電轉換裝置之密封材所廣泛使用的組成物,藉由使用與密封材相同種類之組成物作為絕緣性被覆材,可提高密封材與絕緣性被覆材的親和性,可得製品可靠性更為優異之光電轉換裝置。 In addition, when a thermoplastic resin composition containing at least one of an ethylene vinyl acetate copolymer resin and an urethane resin is used, as an insulating coating material covering the entire periphery of the side surface, By using a composition which is widely used as a sealing material for a photoelectric conversion device as an insulating coating material by using the same type of composition as the sealing material, the affinity between the sealing material and the insulating coating material can be improved, and the reliability of the product can be improved. It is an excellent photoelectric conversion device.

此外,使用由包含聚乙烯之接著劑所構成者,作為被覆前述側面整個周圍的絕緣性被覆材時,於其硬化前 只要利用前述接著劑配置其他之光電轉換元件,即可於維持絕緣性之狀態下,固定相鄰之光電轉換元件。如此之光電轉換裝置因非常耐彎曲等機械性衝撃,可得更優異之製品可靠性。 Further, when an insulating coating material covering the entire circumference of the side surface is used as a member comprising an adhesive containing polyethylene, it is used before curing. When the other photoelectric conversion elements are disposed by the above-described adhesive, the adjacent photoelectric conversion elements can be fixed while maintaining the insulating property. Such a photoelectric conversion device can be more excellent in product reliability because it is mechanically resistant to bending and the like.

並且,使用藉由包含選自於由SiOx、AlOx、MgOx及ZrOx所構成群組中之至少1個的無機系氧化物所形成者,作為被覆前述側面整個周圍的絕緣性被覆材時,可提高光電轉換元件對濕度及溫度等外部環境變化的耐久性。因此,使用如此之光電轉換元件的光電轉換裝置可得更優異之製品可靠性。 In addition, when an insulating coating material including at least one selected from the group consisting of SiOx, AlOx, MgOx, and ZrOx is used, it can be improved as an insulating coating material covering the entire circumference of the side surface. The durability of the photoelectric conversion element to changes in external environment such as humidity and temperature. Therefore, a photoelectric conversion device using such a photoelectric conversion element can obtain more excellent product reliability.

此外,一種光電轉換裝置,具有複數光電轉換元件,且係使該等光電轉換元件相鄰之緣部彼此疊合而電連接者,前述各光電轉換元件略為板狀並至少依序具有基板、第1電極層、發電層、第2電極層,前述第2電極層之側面整個周圍形成為較前述發電層之側面位於更內側之位置,依據前述光電轉換裝置可有效地防止起因於光電轉換元件之短路的電壓下降,並可以低成本作成具優異性能之光電轉換裝置。 Further, a photoelectric conversion device having a plurality of photoelectric conversion elements, wherein the adjacent edge portions of the photoelectric conversion elements are superposed on each other and electrically connected, each of the photoelectric conversion elements being slightly plate-shaped and having a substrate at least in sequence In the first electrode layer, the power generation layer, and the second electrode layer, the entire circumference of the side surface of the second electrode layer is formed to be located further inside than the side surface of the power generation layer, and the photoelectric conversion device can be effectively prevented from being caused by the photoelectric conversion element. The voltage of the short circuit is lowered, and the photoelectric conversion device having excellent performance can be manufactured at low cost.

1‧‧‧基板 1‧‧‧Substrate

2‧‧‧第1電極層 2‧‧‧1st electrode layer

3‧‧‧發電層 3‧‧‧Power generation layer

3a‧‧‧光吸收層 3a‧‧‧Light absorbing layer

3b‧‧‧緩衝層 3b‧‧‧buffer layer

4‧‧‧第2電極層 4‧‧‧2nd electrode layer

5‧‧‧絕緣性被覆材 5‧‧‧Insulating coverings

6‧‧‧焊料 6‧‧‧ solder

L,L1,L2,L3‧‧‧長度 L, L 1 , L 2 , L 3 ‧‧‧ length

W‧‧‧寬度 W‧‧‧Width

圖1係模式地顯示本發明之一實施形態之光電轉換元件的截面圖。 Fig. 1 is a cross-sectional view schematically showing a photoelectric conversion element according to an embodiment of the present invention.

圖2係模式地顯示自上方所見之前述光電轉換元件之狀態的平面圖。 Fig. 2 is a plan view schematically showing the state of the aforementioned photoelectric conversion element as seen from above.

圖3係模式地顯示本發明之其他實施形態之光電轉換 元件的截面圖。 3 is a schematic view showing photoelectric conversion of another embodiment of the present invention A cross-sectional view of the component.

圖4係模式地顯示本發明之其他實施形態之光電轉換元件的截面圖。 Fig. 4 is a cross-sectional view schematically showing a photoelectric conversion element according to another embodiment of the present invention.

圖5係部分地顯示本發明之一實施形態之光電轉換裝置的立體圖。 Fig. 5 is a perspective view partially showing a photoelectric conversion device according to an embodiment of the present invention.

圖6係部分地顯示前述光電轉換裝置之光電轉換元件之連接狀態的截面圖。 Fig. 6 is a cross-sectional view partially showing the connection state of the photoelectric conversion elements of the aforementioned photoelectric conversion device.

圖7(a)係模式地顯示以往之光電轉換元件的截面圖,圖7(b)係顯示於以往之光電轉換元件產生短路之一例的說明圖。 Fig. 7(a) is a cross-sectional view schematically showing a conventional photoelectric conversion element, and Fig. 7(b) is an explanatory view showing an example in which a conventional photoelectric conversion element is short-circuited.

用以實施發明之形態 Form for implementing the invention

以下,說明用以實施本發明之形態。 Hereinafter, the form for carrying out the invention will be described.

<光電轉換元件> <Photoelectric Conversion Element>

圖1係模式地顯示由本發明之一實施形態所得之光電轉換元件的截面圖。該光電轉換元件係依序積層有基板1、第1電極層2、由光吸收層3a與緩衝層3b所構成之發電層3、第2電極層4的CIGS太陽電池單元,如圖2所示,第2電極層4之側面整個周圍形成為較發電層3(光吸收層3a及緩衝層3b)側面位於內側長度L1之位置。並且,於該CIGS太陽電池單元自第2電極層4側照射光時,因於光吸收層3a與緩衝層3b之界面形成pn接合,可產生電流。再者,於光吸收層3a內形成pn接合時,緩衝層3b並非必要。以下詳細地說明該CIGS太陽電池單元。再者,圖1中,各部分係模式地顯示者,實 際厚度、大小等均不同(以下圖式中亦相同)。又,某層之側面較某層之側面「位於更內側之位置」,係指由上往下看光電轉換元件時(平面圖中),某層側面之配置係較其下層側面之配置位於更靠光電轉換元件之中心側之意。 Fig. 1 is a cross-sectional view schematically showing a photoelectric conversion element obtained by an embodiment of the present invention. The photoelectric conversion element is formed by sequentially stacking a substrate 1, a first electrode layer 2, a power generation layer 3 composed of a light absorbing layer 3a and a buffer layer 3b, and a CIGS solar cell unit of the second electrode layer 4, as shown in FIG. The entire circumference of the side surface of the second electrode layer 4 is formed at a position closer to the inner length L 1 than the side surface of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b). Further, when the CIGS solar battery unit emits light from the second electrode layer 4 side, a pn junction is formed at the interface between the light absorbing layer 3a and the buffer layer 3b, and an electric current can be generated. Further, when the pn junction is formed in the light absorbing layer 3a, the buffer layer 3b is not necessary. The CIGS solar battery unit will be described in detail below. In addition, in Fig. 1, each part is displayed in a mode, and the actual thickness, size, and the like are different (the same applies to the following figures). Moreover, the side of a certain layer is located at a position further on the side of a certain layer, which means that when the photoelectric conversion element is viewed from the top down (in plan view), the arrangement of the side of a certain layer is located closer to the arrangement of the side of the lower layer. The meaning of the center side of the photoelectric conversion element.

換言之,該CIGS太陽電池單元使用寬度W=10mm、長度L=100mm、厚度50μm之不鏽鋼箔(SUS)作為基板1,於基板1上形成有由鉬(Mo)所構成的厚度500nm之第1電極層2。並且,於前述第1電極層2上形成有發電層3,該發電層3依序具有:由具Cu、In、Ga、Se4種元素之黃銅礦型結晶構造之化合物半導體所構成的光吸收層3a(厚度2000nm)、由CdS層(厚度50nm,未圖示)與ZnO層(厚度70nm,未圖示)所構成之緩衝層3b(回到圖1)。此外,於發電層3(緩衝層3b)上形成有由ITO所構成的厚度200nm之第2電極層4,其側面整個周圍形成為較發電層3(光吸收層3a及緩衝層3b)之側面位於內側長度L1(此例為L1=50μm)之位置。 In other words, the CIGS solar cell unit uses a stainless steel foil (SUS) having a width W of 10 mm, a length L of 100 mm, and a thickness of 50 μm as the substrate 1, and a first electrode having a thickness of 500 nm made of molybdenum (Mo) is formed on the substrate 1. Layer 2. Further, the power generation layer 3 is formed on the first electrode layer 2, and the power generation layer 3 sequentially has light absorption composed of a compound semiconductor having a chalcopyrite crystal structure having Cu, In, Ga, and Se elements. The layer 3a (thickness: 2000 nm), the buffer layer 3b composed of a CdS layer (thickness: 50 nm, not shown) and a ZnO layer (thickness: 70 nm, not shown) (return to Fig. 1). Further, a second electrode layer 4 having a thickness of 200 nm made of ITO is formed on the power generation layer 3 (buffer layer 3b), and the entire circumference of the side surface is formed to be the side of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b). It is located at the inner length L 1 (in this case, L 1 = 50 μm).

依據前述構造之CIGS太陽電池單元,因第2電極層4之側面整個周圍係較發電層3之側面位於內側長度L1=50μm之位置,故即使於發電層3之端部產生短缺,仍幾無第2電極層4之端部可朝第1電極層2側彎曲的空間,第2電極層4與第1電極層2接觸的疑慮少。藉此,該CIGS太陽電池單元不會輕易地短路。又,該CIGS太陽電池單元中,因第2電極層4之側面至第1電極層2之側面的最短距離變得更長,故於CIGS太陽電池單元之製造中或製造後,導電塵橫跨第1電極層2與第2電極層4地附著的可能性極低,不會輕易地短 路。如此,前述CIGS太陽電池單元可長期地發揮優異之性能。 According to the CIGS solar cell unit of the above configuration, since the entire circumference of the side surface of the second electrode layer 4 is located at the inner side length L 1 = 50 μm than the side surface of the power generation layer 3, even if there is a shortage at the end portion of the power generation layer 3, There is no space in which the end portion of the second electrode layer 4 can be bent toward the first electrode layer 2 side, and there is little concern that the second electrode layer 4 is in contact with the first electrode layer 2 . Thereby, the CIGS solar cell unit is not easily short-circuited. Further, in the CIGS solar battery unit, since the shortest distance from the side surface of the second electrode layer 4 to the side surface of the first electrode layer 2 becomes longer, the conductive dust crosses during or after the manufacture of the CIGS solar battery unit. The possibility of adhesion between the first electrode layer 2 and the second electrode layer 4 is extremely low, and it is not easily short-circuited. Thus, the aforementioned CIGS solar battery unit can exhibit excellent performance for a long period of time.

再者,前述實施形態中,第2電極層4之側面整個周圍係較發電層3之側面位於內側50μm(L1=50μm)之位置,但第2電極層4之側面位置並未受此所限制。然而,前述L1以5~1000μm為佳。即,L1小於5μm時,若典型之無塵室(ISO14644)中存在的0.1~5μm粉塵具導電性,將有該粉塵橫跨第1電極層2與第2電極層4地附著而產生短路的疑慮。又,L1大於1000μm時,未受第2電極層4覆蓋而露出之發電層3的部分過大,將被水分或其他雜質侵入,而有降低光電轉換特性的傾向。 Further, in the above-described embodiment, the entire circumference of the side surface of the second electrode layer 4 is located 50 μm (L 1 = 50 μm) on the inner side of the side surface of the power generation layer 3, but the side position of the second electrode layer 4 is not affected by this. limit. However, the aforementioned L 1 is preferably 5 to 1000 μm. In other words, when L 1 is less than 5 μm, if 0.1 to 5 μm of dust existing in a typical clean room (ISO 14644) is electrically conductive, the dust adheres across the first electrode layer 2 and the second electrode layer 4 to cause a short circuit. Doubt. In addition, when L 1 is more than 1000 μm, the portion of the power generation layer 3 that is not covered by the second electrode layer 4 and is exposed is excessively large, and is invaded by moisture or other impurities, and the photoelectric conversion property tends to be lowered.

並且,前述實施形態中,雖使用不鏽鋼箔(SUS)作為基板1,但此以外,亦可視需要之目的或設計,自玻璃基板、金屬基板、樹脂基板等中使用適當者。前述玻璃基板可舉例如:藍板玻璃、鹼金屬元素之含量極低之低鹼玻璃(高應變點玻璃)、不含鹼金屬元素之無鹼玻璃等。 Further, in the above-described embodiment, a stainless steel foil (SUS) is used as the substrate 1. However, it may be used from a glass substrate, a metal substrate, a resin substrate or the like as needed for the purpose or design. Examples of the glass substrate include a blue plate glass, a low alkali glass (high strain point glass) having an extremely low content of an alkali metal element, and an alkali-free glass containing no alkali metal element.

又,於以輥對輥方式或步進輥方式製造前述CIGS太陽電池單元時,以前述基板1為長片狀並具可撓性為佳。再者,前述「長片狀」係指長度方向長度為寬度方向長度之10倍以上者,以使用30倍以上者較佳。 Further, when the CIGS solar battery unit is manufactured by a roll-to-roll method or a stepping roll method, it is preferable that the substrate 1 has a long sheet shape and has flexibility. In addition, the "long sheet shape" means that the length in the longitudinal direction is 10 times or more the length in the width direction, and it is preferable to use 30 times or more.

並且,前述實施形態中,將基板1之厚度作為50μm,但亦可使用該厚度以外之基板。但,基板1之厚度以30μm以上200μm以下之範圍為佳,較佳者係50μm以上100μm以下之範圍。即,厚度過厚時,將失去CIGS太陽電 池單元之可撓性,彎曲時所施加之應力變大,有對其內部構造造成損害的疑慮,反之,若過薄,於製造CIGS太陽電池單元時,基板1屈曲而有CIGS太陽電池單元之製品不良率上升的傾向。 Further, in the above embodiment, the thickness of the substrate 1 is 50 μm, but a substrate other than the thickness may be used. However, the thickness of the substrate 1 is preferably in the range of 30 μm or more and 200 μm or less, and more preferably in the range of 50 μm or more and 100 μm or less. That is, when the thickness is too thick, the CIGS solar power will be lost. The flexibility of the cell unit, the stress applied during bending becomes large, and there is a concern that damage to its internal structure. Conversely, if it is too thin, when the CIGS solar cell unit is manufactured, the substrate 1 is bucked and there is a CIGS solar cell unit. The tendency of product defect rate to rise.

又,前述實施形態中,雖使用鉬(Mo)作為第1電極層2之形成材料,但亦可使用其以外之W、Cr、Ti等。並且,第1電極層2可為單層,亦可為複層。又,其厚度(複層時係各層厚度之合計)以50nm以上1000nm以下為佳。 Further, in the above embodiment, molybdenum (Mo) is used as the material for forming the first electrode layer 2, but other than W, Cr, Ti, or the like may be used. Further, the first electrode layer 2 may be a single layer or a multiple layer. Further, the thickness (the total thickness of each layer in the case of a double layer) is preferably 50 nm or more and 1000 nm or less.

並且,前述實施形態中,雖將形成於前述第1電極層2上之光吸收層3a的厚度設為2000nm,但亦可以其以外之厚度形成。但,光吸收層3a之厚度以1.0μm以上3.0μm以下之範圍為佳,以1.5μm以上2.5μm以下之範圍較佳。厚度過薄時,光吸收量變少,有CIGS太陽電池單元之性能下降的傾向,反之,過厚時,光吸收層3a之形成所需的時間增加,有生產性差的傾向。 Further, in the above-described embodiment, the thickness of the light absorbing layer 3a formed on the first electrode layer 2 is 2,000 nm, but may be formed to have a thickness other than the thickness. However, the thickness of the light absorbing layer 3a is preferably in the range of 1.0 μm or more and 3.0 μm or less, and more preferably in the range of 1.5 μm or more and 2.5 μm or less. When the thickness is too small, the amount of light absorption decreases, and the performance of the CIGS solar cell unit tends to decrease. On the other hand, when it is too thick, the time required for formation of the light absorbing layer 3a increases, and productivity tends to be poor.

又,前述光吸收層3a中Cu、In、Ga之組成比,以滿足0.7<Cu/(Ga+In)<0.95(莫耳比)之式為佳。若滿足該式,將可更加阻止前述光吸收層3a內過剩地吸收Cu(2-x)Se,且可使層全體為僅Cu不足的狀態。又,前述光吸收層3a中,同屬元素之Ga與In比,以於0.10<Ga/(Ga+In)<0.60(莫耳比)的範圍為佳。 Further, the composition ratio of Cu, In, and Ga in the light absorbing layer 3a is preferably such that 0.7<Cu/(Ga+In)<0.95 (mole ratio) is satisfied. When this formula is satisfied, Cu( 2- x)Se is excessively prevented from being absorbed in the light absorbing layer 3a, and the entire layer can be in a state in which only Cu is insufficient. Further, in the light absorbing layer 3a, the ratio of Ga to In of the same element is preferably in the range of 0.10 < Ga / (Ga + In) < 0.60 (mole ratio).

並且,前述實施形態中,形成於前述光吸收層3a上之緩衝層3b雖具有形成於基板1側之CdS層(厚度50nm,未圖示)與ZnO層(厚度70nm,未圖示),但緩衝層3h之形成 材料除了CdS、ZnO以外,亦可使用ZnMgO、Zn(OH)2、In2O3、In2S3、該等之混晶的Zn(O,S,OH)等。又,於使用可與前述光吸收層3a作pn結合的高電阻之n型半導體等時,亦可將緩衝層3b作為單層。又,緩衝層3b之厚度,於單層及複層之任一情況中,均以30nm以上200nm以下為佳。 Further, in the above-described embodiment, the buffer layer 3b formed on the light absorbing layer 3a has a CdS layer (thickness: 50 nm, not shown) and a ZnO layer (thickness: 70 nm, not shown) formed on the substrate 1 side, but In addition to CdS and ZnO, a material for forming the buffer layer 3h may be ZnMgO, Zn(OH) 2 , In 2 O 3 , In 2 S 3 , or a mixed crystal of Zn(O, S, OH). Further, when a high-resistance n-type semiconductor or the like which can be pn-bonded to the light absorbing layer 3a is used, the buffer layer 3b can also be used as a single layer. Further, the thickness of the buffer layer 3b is preferably 30 nm or more and 200 nm or less in either of the single layer and the double layer.

此外,前述實施形態中,形成於前述緩衝層3b上之第2電極層4的形成材料雖使用ITO,但亦可使用其他之ZnO、In2O3、SnO2等透光率高的材料。又,前述實施形態中,將第2電極層4之厚度設為200nm,但亦可形成為其以外之厚度。但,由透光性及導電性之觀點來看,第2電極層4之厚度以100nm以上2000nm以下為佳。 Further, in the above-described embodiment, ITO is used as the material for forming the second electrode layer 4 formed on the buffer layer 3b, but other materials having a high light transmittance such as ZnO, In 2 O 3 or SnO 2 may be used. Further, in the above embodiment, the thickness of the second electrode layer 4 is set to 200 nm, but may be formed to have a thickness other than the thickness. However, the thickness of the second electrode layer 4 is preferably 100 nm or more and 2000 nm or less from the viewpoint of light transmittance and conductivity.

又,第2電極層4之形成材料,以提高導電性為目的、或調整能帶排列為目的,以使用於第2電極層4之材料含有少量摻雜材料者為佳。如此之摻雜材料,可舉例如:Al:ZnO(AZO)、B:ZnO(BZO)、Ga:ZnO(GZO)、Sn:In2O3(ITO)、F:SnO2(FTO)、Zn:In2O3、Ti:In2Oe、Zr:In2O3、W:In2O3Further, the material for forming the second electrode layer 4 is preferably for the purpose of improving conductivity or for adjusting the energy band arrangement, and it is preferable that the material used for the second electrode layer 4 contains a small amount of dopant material. Examples of such a doping material include Al:ZnO (AZO), B:ZnO (BZO), Ga:ZnO (GZO), Sn:In 2 O 3 (ITO), F:SnO 2 (FTO), and Zn. : In 2 O 3 , Ti: In 2 Oe, Zr: In 2 O 3 , W: In 2 O 3 .

再者,雖未於前述實施形態中使用,但於來自基板1之雜質有對CIGS太陽電池單元造成不良影響的疑慮時,以於基板1上設置雜質擴散防止層為佳。如此之雜質擴散防止層的形成材料,可使用Cr、SiO2、Al2O3、TiN、TiO2、Ni、NiCr、Co等。由效果與成本均衡的觀點來看,其厚度以50nm以上1000nm以下為佳。並且,雜質擴散防止層亦可不形成於基板1上而形成於第1電極層2上。 Further, although it is not used in the above embodiment, it is preferable to provide an impurity diffusion preventing layer on the substrate 1 when there is a concern that the impurities from the substrate 1 adversely affect the CIGS solar cell. As the material for forming the impurity diffusion preventing layer, Cr, SiO 2 , Al 2 O 3 , TiN, TiO 2 , Ni, NiCr, Co or the like can be used. From the viewpoint of balance of effects and cost, the thickness is preferably 50 nm or more and 1000 nm or less. Further, the impurity diffusion preventing layer may be formed on the first electrode layer 2 without being formed on the substrate 1.

如此之CIGS太陽電池單元,可以例如以下之方法製造。即,準備長片狀之基板1,並於其表面形成第1電極層2,於其上形成光吸收層3a,將其切斷成預定之尺寸後,於前述光吸收層3a上依序積層緩衝層3b、第2電極層4。接著,對前述第2電極層4,以機械雕刻去除第2電極層4之側面(端面)至預定位置的內側區域。藉此,可得第2電極層4之側面整個周圍係較發電層3(光吸收層3a、緩衝層3b)之側面位於更內側之位置的CIGS太陽電池單元。以下,於各層之各形成步驟中詳細地說明該製法。 Such a CIGS solar cell unit can be manufactured, for example, in the following manner. In other words, the long-sheet-shaped substrate 1 is prepared, and the first electrode layer 2 is formed on the surface thereof, and the light-absorbing layer 3a is formed thereon, and is cut into a predetermined size, and then sequentially laminated on the light-absorbing layer 3a. Buffer layer 3b and second electrode layer 4. Next, the side surface (end surface) of the second electrode layer 4 is mechanically engraved to the inner region of the predetermined position at the second electrode layer 4. Thereby, the entire circumference of the side surface of the second electrode layer 4 can be obtained as a CIGS solar battery cell located further inward than the side surface of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b). Hereinafter, the production method will be described in detail in each formation step of each layer.

[至第1電極層2之形成] [Formation of the first electrode layer 2]

準備由長片狀之SUS所構成的基板1,藉由輥對輥方式一面搬運基板1,一面於其表面利用濺鍍法形成由厚度500nm之Mo所構成的第1電極層2。 The substrate 1 made of a long sheet of SUS was prepared, and the substrate 1 was transferred by a roll-to-roll method, and the first electrode layer 2 made of Mo having a thickness of 500 nm was formed on the surface thereof by sputtering.

[光吸收層3a之形成] [Formation of Light Absorbing Layer 3a]

前述第1電極層2上於保持基板1為420℃之狀態下,依序以固相狀態積層硒化鎵與硒化銦,形成具銦、鎵及硒之層(α)。並且,於保持基板1之溫度為420℃的狀態下,於前述層(α)上積層硒化銅,形成具銅與硒之層(β)。於基板1上對積層有第1電極層2、層(α)及層(β)的積層體,供給微量之Se蒸氣,並將基板1之溫度設為650℃,保持該狀態15分鐘。藉此,前述層(β)將成為液相狀態,該層(β)中之銅於層(α)中擴散並成長成結晶。接著,於將基板1之溫度保持在650℃之狀態下,供給微量之Se蒸氣,並一面逐漸增加Ga之蒸鍍量,一面蒸鍍In、Ga、Se,形成厚度2000nm的CIGS層。並 且,於該CIGS層上蒸鍍NaF,之後,將基板1之溫度設為420℃,藉由保持該狀態10分鐘,使Na朝CIGS層之粒界擴散,形成光吸收層3a。 On the first electrode layer 2, in a state where the holding substrate 1 is 420 ° C, gallium selenide and indium selenide are sequentially deposited in a solid phase state to form a layer (α) having indium, gallium, and selenium. Further, in a state where the temperature of the substrate 1 is maintained at 420 ° C, copper selenide is laminated on the layer (α) to form a layer (β) having copper and selenium. On the substrate 1, a layer of Se vapor was supplied to the laminate in which the first electrode layer 2, the layer (α), and the layer (β) were laminated, and the temperature of the substrate 1 was set to 650 ° C, and the state was maintained for 15 minutes. Thereby, the layer (β) is in a liquid phase state, and copper in the layer (β) diffuses in the layer (α) and grows into crystals. Then, while maintaining the temperature of the substrate 1 at 650 ° C, a small amount of Se vapor was supplied, and while the vapor deposition amount of Ga was gradually increased, In, Ga, and Se were vapor-deposited to form a CIGS layer having a thickness of 2000 nm. and Further, NaF was deposited on the CIGS layer, and then the temperature of the substrate 1 was set to 420 ° C. By maintaining this state for 10 minutes, Na was diffused toward the grain boundary of the CIGS layer to form the light absorbing layer 3a.

再者,本發明中,固相係指該溫度中為固體狀態之相,液相係指該溫度中為液體狀態之相之意。又,氣相係指該溫度中為氣體狀態之相之意。 Further, in the present invention, the solid phase means a phase which is solid at the temperature, and the liquid phase means a phase which is a liquid state at the temperature. Further, the gas phase means the phase which is a gaseous state at this temperature.

[緩衝層3b之形成] [Formation of Buffer Layer 3b]

藉由前述輥對輥方式形成第1電極層2及光吸收層3a,一面將捲取成輥狀之基板1再次捲出,一面使用切斷裝置將其切斷成預定長度,得到預定尺寸之積層體(基板1+第1電極層2+光吸收層3a)。並且,於該積層體之光吸收層3a上,藉由溶液成長法(CBD法)形成CdS層(厚度50nm),更於該CdS層上藉由濺鍍法形成ZnO層(厚度70nm),形成由CdS層與ZnO層所構成的緩衝層3b。 When the first electrode layer 2 and the light absorbing layer 3a are formed by the above-described roll-to-roll method, the substrate 1 wound into a roll shape is again wound up, and is cut into a predetermined length by a cutting device to obtain a predetermined size. Laminate (substrate 1 + first electrode layer 2+ light absorbing layer 3a). Further, on the light absorbing layer 3a of the laminate, a CdS layer (thickness: 50 nm) is formed by a solution growth method (CBD method), and a ZnO layer (thickness: 70 nm) is formed on the CdS layer by sputtering. A buffer layer 3b composed of a CdS layer and a ZnO layer.

[第2電極層4之形成步驟] [Step of Forming Second Electrode Layer 4]

於前述緩衝層3b上藉由濺鍍法形成由ITO所構成之第2電極層4(厚度200nm)。接著,使用機械雕刻器去除自該側面(端部)起至內側50μm區域內的第2電極層4,藉此,第2電極層4之側面整個周圍將形成為位於自發電層3(光吸收層3a、緩衝層3b)之側面往內側長度L1=50μm之位置。再者,亦可使用與第1電極層2相同之方法於該第2電極層4上形成柵極形狀等萃取電極(未圖示)。如此,可得CIGS太陽電池單元。 A second electrode layer 4 (thickness: 200 nm) made of ITO was formed on the buffer layer 3b by sputtering. Next, the second electrode layer 4 in the region of 50 μm from the side (end portion) is removed by using a mechanical engraver, whereby the entire circumference of the side surface of the second electrode layer 4 is formed to be located in the self-generating layer 3 (light absorption) The side of the layer 3a and the buffer layer 3b) has a length L 1 = 50 μm toward the inner side. Further, an extraction electrode (not shown) such as a gate electrode may be formed on the second electrode layer 4 by the same method as the first electrode layer 2. In this way, a CIGS solar cell unit is available.

依據該方法,因可以通用之蒸鍍裝置(輥對輥方 式)連續形成可有效防止短路產生之優異的CIGS太陽電池單元,故可期待製造之效率化與低成本化。 According to this method, a vapor deposition device (roller-to-roller) Since the CIGS solar cell unit which can effectively prevent the occurrence of a short circuit is continuously formed, it is expected that the manufacturing efficiency and cost can be reduced.

再者,前述實施形態中,藉由輥對輥形成至光吸收層3a,但亦可藉由調整基板1尺寸等,一片一片地形成。又,均藉由濺鍍法形成第1電極層2,但亦可使用蒸鍍法、噴墨法、電鍍法等形成。 Further, in the above embodiment, the roller pair roller is formed to the light absorbing layer 3a, but it may be formed one by one by adjusting the size of the substrate 1 or the like. Further, the first electrode layer 2 is formed by sputtering, but it may be formed by a vapor deposition method, an inkjet method, a plating method, or the like.

此外,前述實施形態中,對光吸收層3a添加Na係使用NaF進行,但亦可使用Na2Se、Na2S等其他Na化合物進行。又,前述實施形態中,對光吸收層3a添加Na係藉由蒸鍍NaF之後退火方法進行,但亦可於形成光吸收層3a前,使NaF蒸鍍於第1電極層2上等方法進行。 Further, in the above embodiment, Na is added to the light absorbing layer 3a by NaF, but it may be carried out using other Na compounds such as Na 2 Se or Na 2 S. Further, in the above-described embodiment, Na is added to the light absorbing layer 3a by a vapor deposition NaF annealing method, but a method of depositing NaF on the first electrode layer 2 before forming the light absorbing layer 3a may be performed. .

並且,前述實施形態中,藉由溶液成長法(CBD法)形成CdS層,並藉由濺鍍法形成ZnO層,但該等層亦可藉由其以外之方法形成,又,亦可於真空中、大氣中及水溶液中之任一者中形成。例如,於真空中進行之方法,除了濺鍍法以外,可舉例如:分子束磊晶法、電子束蒸鍍法、電阻加熱蒸鍍法、電漿CVD法、有機金屬蒸鍍法等。又,於水溶液中進行之方法,可舉CBD法、電鍍法等為例。 Further, in the above embodiment, the CdS layer is formed by a solution growth method (CBD method), and the ZnO layer is formed by a sputtering method, but the layers may be formed by other methods, or may be vacuum Formed in any of medium, atmospheric, and aqueous solutions. For example, the method of performing in a vacuum may be, for example, a molecular beam epitaxy method, an electron beam evaporation method, a resistance heating vapor deposition method, a plasma CVD method, or an organic metal vapor deposition method, in addition to the sputtering method. Further, a method of performing the solution in an aqueous solution may be exemplified by a CBD method, a plating method, or the like.

此外,前述實施形態中,藉由使用機械雕刻器去除自第2電極層4之側面(端部)至50μm內側的區域,藉此第2電極層4之側面整個周圍會形成為較發電層3(光吸收層3a、緩衝層3b)之側面位於內側長度L1=50μm之位置,亦可使用其以外之方法。如此之方法可使用例如:使用金屬掩模、光阻蝕刻等,預先使第2電極層4不會形成於發電層3之端部 至50μm內側。 Further, in the above embodiment, the region from the side surface (end portion) of the second electrode layer 4 to the inner side of 50 μm is removed by using a mechanical engraver, whereby the entire circumference of the side surface of the second electrode layer 4 is formed as the power generation layer 3 The side faces of the light absorbing layer 3a and the buffer layer 3b are located at the inner side length L 1 = 50 μm, and other methods may be used. In such a method, for example, the second electrode layer 4 is not formed on the end portion of the power generation layer 3 to the inside of 50 μm in advance using a metal mask, photoresist etching or the like.

又,前述實施形態中,藉由濺鍍法形成第2電極層4,但其以外亦可藉由真空蒸鍍法、有機金屬氣相成長法等形成。 Further, in the above embodiment, the second electrode layer 4 is formed by a sputtering method, but may be formed by a vacuum deposition method, an organometallic vapor phase growth method, or the like.

於圖3顯示前述實施形態之其他形態。其中,發電層3(光吸收層3a、緩衝層3b)之側面整個周圍形成為較其下之第1電極層2側面位於更內側之位置,就此點係與圖1所示之CIGS太陽電池單元相異。其他構造則係與圖1所示之CIGS太陽電池單元相同,故省略其說明。該CIGS太陽電池單元可例如以下地製造。即,形成至第2電極層4後,藉由機械雕刻器削除第2電極層4之側面(端面)至100μm內側的區域,去除該區域內之第2電極層4(L1)。接著,再藉由機械雕刻器削除去除而顯現的發電層3(光吸收層3a、緩衝層3b)之側面(端面)至50μm內側的區域,去除該領域內之發電層3(光吸收層3a、緩衝層3b)(L2)。藉此,第2電極層4之側面整個周圍係較發電層3(光吸收層3a、緩衝層3b)之側面位於內側長度L3=50μm之位置,且發電層3(光吸收層3a、緩衝層3b)之側面整個周圍係較第1電極層2之側面位於內側長度L2=50μm之位置。 Fig. 3 shows another embodiment of the above embodiment. Wherein, the entire circumference of the side surface of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b) is formed to be located further inward than the side surface of the first electrode layer 2 below, and this point is the CIGS solar battery unit shown in FIG. Different. The other structure is the same as the CIGS solar cell unit shown in Fig. 1, and the description thereof will be omitted. The CIGS solar cell unit can be manufactured, for example, as follows. That is, after the second electrode layer 4 is formed, the side surface (end surface) of the second electrode layer 4 is removed by a mechanical engraver to a region inside the 100 μm, and the second electrode layer 4 (L 1 ) in the region is removed. Then, the side surface (end surface) of the power generation layer 3 (light absorbing layer 3a, buffer layer 3b) which is removed by the mechanical engraving is removed to the inner side of 50 μm, and the power generation layer 3 (light absorbing layer 3a) in the field is removed. , buffer layer 3b) (L 2 ). Thereby, the entire circumference of the side surface of the second electrode layer 4 is located closer to the inner side length L 3 = 50 μm than the side surface of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b), and the power generation layer 3 (the light absorbing layer 3a, the buffer) The entire circumference of the side surface of the layer 3b) is located at the inner side length L 2 = 50 μm than the side surface of the first electrode layer 2.

依據前述其他實施形態之CIGS太陽電池單元,除了有達成圖1CIGS太陽電池單元之效果以外,將更進一步增長第2電極層4之側面至第1電極層2之側面的最短距離,故可更有效地抑制短路產生。 According to the CIGS solar battery unit of the other embodiment, in addition to the effect of achieving the CIGS solar cell unit of FIG. 1, the shortest distance from the side surface of the second electrode layer 4 to the side surface of the first electrode layer 2 is further increased, so that it can be more effective. Ground suppression of short circuit generation.

再者,前述其他實施形態中,第2電極層4之側面 整個周圍係較發電層3(光吸收層3a、緩衝層3b)之側面位於內側50μm(L3=50μm)之位置,且發電層3(光吸收層3a、緩衝層3b)之側面整個周圍係較第1電極層2之側面位於內側50μm(L2=50μm)之位置,但並未受限於此。 In the other embodiment, the entire side surface of the second electrode layer 4 is located on the inner side of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b) at a position of 50 μm (L 3 = 50 μm) on the inner side, and the power generation layer. 3 (the light absorbing layer 3a and the buffer layer 3b) is located on the inner side of the first electrode layer 2 at a position 50 μm (L 2 = 50 μm) on the inner side, but is not limited thereto.

更於圖4顯示其他實施形態。發電層3(光吸收層3a、緩衝層3b)之側面整個周圍形成為較其下之第1電極層2側面位於更內側之位置,基板1、第1電極層2、發電層3及第2電極層4全部之側面整個周圍則被絕緣性被覆材5被覆。其他構造因與圖1或圖3所示之CIGS太陽電池單元相同,故省略其說明。該CIGS太陽電池單元可藉由例如,製作圖3所示之CIGS太陽電池單元,再以具聚醯亞胺之絕緣性膠帶被覆其側面而得到。 Further embodiments are shown in Fig. 4. The entire circumference of the side surface of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b) is formed to be located further inside than the side surface of the first electrode layer 2 below, and the substrate 1, the first electrode layer 2, the power generation layer 3, and the second layer are formed. The entire circumference of all the side faces of the electrode layer 4 is covered with the insulating coating material 5. The other structure is the same as that of the CIGS solar battery unit shown in Fig. 1 or Fig. 3, and the description thereof will be omitted. The CIGS solar cell unit can be obtained, for example, by fabricating a CIGS solar cell unit as shown in Fig. 3 and coating the side surface thereof with an insulating tape having polyimide.

依據前述之其他實施形態之CIGS太陽電池單元,可具圖1及圖3所示之CIGS太陽電池單元的效果,且可穩固地保持第2電極層4之側面至第1電極層2之側面的最短距離為長的狀態,故可更加抑制短路產生。 According to the CIGS solar battery unit of the other embodiments described above, the effect of the CIGS solar battery unit shown in FIGS. 1 and 3 can be obtained, and the side surface of the second electrode layer 4 can be stably held to the side of the first electrode layer 2. Since the shortest distance is in a long state, the occurrence of a short circuit can be further suppressed.

因容易裝著而以使用前述具聚醯亞胺之絕緣性膠帶為佳,該等可舉日東電工社製之聚醯亞胺膠帶(No.360UL)為例。 It is preferable to use the above-mentioned insulating tape having a polyimide, for example, by using the polyimine tape (No. 360 UL) manufactured by Nitto Denko Corporation as an example.

再者,本發明中,「絕緣性」係電絕緣性之意。又,「含有」、「具有」、「包含」某成分,係亦包含僅含有該成分的情形之旨趣。 Further, in the present invention, "insulating property" means electrical insulation. In addition, the "containing", "having", and "including" components also include the purpose of including only the component.

並且,前述其他之實施形態中,絕緣性被覆材5係使用具聚醯亞胺之絕緣性膠帶,但除了具聚醯亞胺之絕 緣性膠帶以外,亦可使用其他至少不會使第1電極層2與第2電極層4直接相接地覆蓋該等側面的具絕緣性者。 Further, in the other embodiments described above, the insulating coating material 5 is made of an insulating tape having a polyimide, but in addition to the polyimide. In addition to the edge tape, it is also possible to use other insulation which does not cause the first electrode layer 2 and the second electrode layer 4 to directly face each other to cover the side faces.

絕緣性被覆材5為可被覆前述第1電極層2與第2電極層4側面之具絕緣性者,可舉含有乙烯乙酸乙烯酯共聚物樹脂及胺甲酸乙酯樹脂之至少一者的熱可塑性樹脂組成物為例。即,乙烯乙酸乙烯酯共聚合樹脂係作為密封光電轉換裝置之密封材所通用的組成物,藉由使用與被覆材及密封材同種類之組成物,可提高與光電轉換裝置之密封材的親和性,可得製品可靠性優異之光電轉換裝置。又,使用含有胺甲酸乙酯樹脂之接著劑作為絕緣性被覆材5時,僅透過接著劑配置其他光電轉換元件,即可於維持有絕緣性之狀態下,固定相鄰之光電轉換元件,故對彎曲等機械衝撃變高,可得製品可靠性優異之光電轉換裝置,而為佳。又,使用由無機系氧化物(包含選自於由SiOx、AlOx、MgOx及ZrOx所構成群組中之至少1者)所構成之層所形成者作為絕緣性被覆材5時,可提高對濕度及溫度等外部環境變化之耐久性,成為製品可靠性優異者,而為佳。 The insulating coating material 5 is insulating from the side surface of the first electrode layer 2 and the second electrode layer 4, and may include thermoplasticity of at least one of an ethylene vinyl acetate copolymer resin and an urethane resin. The resin composition is exemplified. In other words, the ethylene vinyl acetate copolymer resin is a composition common to the sealing material for sealing a photoelectric conversion device, and by using the same type of composition as the coating material and the sealing material, the affinity with the sealing material of the photoelectric conversion device can be improved. The photoelectric conversion device excellent in product reliability is obtained. In addition, when an adhesive containing a urethane resin is used as the insulating coating material 5, the other photoelectric conversion elements are disposed only through the adhesive, and the adjacent photoelectric conversion elements can be fixed while maintaining the insulating property. It is preferable to increase the mechanical punching such as bending to obtain a photoelectric conversion device excellent in product reliability. In addition, when an insulating coating material 5 is formed using a layer composed of an inorganic oxide (including at least one selected from the group consisting of SiOx, AlOx, MgOx, and ZrOx), the humidity can be improved. It is preferable that the durability of the external environment such as the temperature is excellent, and the product is excellent in reliability.

前述乙烯乙酸乙烯酯共聚物樹脂可舉Ultrapearl PV(Sanvic社製)、EVASOFT(Bridgestone社製)為例。 The ethylene vinyl acetate copolymer resin is exemplified by Ultraraparl PV (manufactured by Sanvic) and EVASOFT (manufactured by Bridgestone).

前述含有胺甲酸乙酯樹脂之接著劑,由耐水性之點來看以使用胺甲酸乙酯-矽基系接著劑為佳,其可舉Konishi社製之#05140為例。 The above-mentioned urethane-containing resin-containing adhesive is preferably an urethane-based thiol-based adhesive from the viewpoint of water resistance, and may be exemplified by #05140 manufactured by Konishi Co., Ltd.

此外,由無機系氧化物(包含選自於由SiOx、AlOx、MgOx及ZrOx所構成群組中之至少1者)所構成之層,可以蒸 鍍法、濺鍍法、電漿CVD法等真空製程、溶膠凝膠法等溼製程形成。並且,該等無機系酸化物可為單一材料作成之單層,亦可為積層種類相異者之複數層。又,可為組合複數材料後之層,亦可為積層該等層之複數層。 Further, the layer composed of an inorganic oxide (including at least one selected from the group consisting of SiOx, AlOx, MgOx, and ZrOx) can be steamed. A wet process such as a plating method, a sputtering method, a plasma CVD method, or the like, a sol-gel method or the like is formed. Further, the inorganic acid compounds may be a single layer made of a single material, or may be a plurality of layers of different types of laminates. Further, it may be a layer in which a plurality of materials are combined, or a plurality of layers in which the layers are laminated.

又,前述其他之實施形態中,絕緣性被覆材5配置成被覆基板1至第2電極層4的所有層之側面,但並不受此為限。但,如此被覆所有層之側面時,可防止水分等侵入基板1至第2電極層4所有層之端面,更加提高絕緣性,而為佳。 Further, in the other embodiment, the insulating coating material 5 is disposed so as to cover the side surfaces of all the layers of the substrate 1 to the second electrode layer 4, but is not limited thereto. However, when the side faces of all the layers are covered as described above, it is preferable to prevent moisture or the like from intruding into the end faces of all the layers of the substrate 1 to the second electrode layer 4, and to further improve the insulating property.

<光電轉換裝置> <Photoelectric conversion device>

接著,於圖5顯示本發明之光電轉換裝置的概要。一種具有複數前述實施形態中所得之CIGS太陽電池單元,且係使其相鄰之緣部彼此疊合而電連接的CIGS太陽電池模組。該CIGS太陽電池模組為電串聯連接複數CIGS太陽電池單元之狀態,可得實用之電壓。 Next, an outline of the photoelectric conversion device of the present invention is shown in Fig. 5 . A CIGS solar cell module having a plurality of CIGS solar cell units obtained in the above embodiments and having their adjacent edge portions superposed on each other and electrically connected. The CIGS solar cell module is electrically connected in series to a plurality of CIGS solar cell units, and a practical voltage can be obtained.

前述CIGS太陽電池單元之電聯接,可藉由下例實現,如圖6所示,透過焊料6重疊一邊之CIGS太陽電池單元的第1電極層2之緣部,與另一邊之CIGS太陽電池單元的第2電極層4之緣部。再者,亦可於CIGS太陽電池單元與焊料6之間夾持有導電膜。通常,以具耐候性之密封薄膜等全面地密封電連接有CIGS太陽電池單元群的CIGS太陽電池模組。 The electrical connection of the CIGS solar cell unit can be realized by the following example. As shown in FIG. 6, the edge of the first electrode layer 2 of the CIGS solar cell unit on one side of the solder 6 is overlapped, and the CIGS solar cell unit on the other side. The edge of the second electrode layer 4. Further, a conductive film may be sandwiched between the CIGS solar cell unit and the solder 6. Generally, a CIGS solar battery module in which a CIGS solar battery unit group is electrically connected is integrally sealed with a weather-resistant sealing film or the like.

如此所得之CIGS太陽電池模組中因各CIGS太陽電池單元不會短路,故不會產生電壓下降,可長時間保持 優異之性能。 In the CIGS solar cell module thus obtained, since the CIGS solar cell units are not short-circuited, there is no voltage drop and can be maintained for a long time. Excellent performance.

接著,一併說明實施例與比較例。但,本發明並未受其所限定。 Next, the examples and comparative examples will be described together. However, the invention is not limited thereto.

實施例 Example

[實施例1] [Example 1]

首先,準備不鏽鋼箔SUS430(大小10×100mm、厚度50μm)之基板1,於其上積層由Mo所構成之厚度500nm的第1電極層2。接著,將形成有第1電極層2之基板1搬入真空蒸鍍裝置內,於保持420℃之基板溫度的狀態下,於第1電極層2上依序積層有硒化鎵(厚度400nm)、硒化銦(厚度1000nm),形成具有硒、鎵及銦之層(α)。接著,於保持420℃之基板溫度的狀態下,於前述層(α)上積層硒化銅(厚度600nm),形成具有銅與硒之層(β)。供給微量Se蒸氣並加熱積層有該等層(α)與層(β)之積層體,保持基板溫度為650℃之狀態15分鐘,使結晶成長,然後,供給微量Se蒸氣並於保持基板溫度為650℃之狀態下,一面逐漸地增加Ga之蒸鍍量,一面蒸鍍In、Ga、Se,形成CIGS層(厚度2000nm)。 First, a substrate 1 of a stainless steel foil SUS430 (10 x 100 mm in size and 50 μm in thickness) was prepared, and a first electrode layer 2 made of Mo and having a thickness of 500 nm was laminated thereon. Then, the substrate 1 on which the first electrode layer 2 was formed was placed in a vacuum vapor deposition apparatus, and gallium selenide (thickness: 400 nm) was sequentially deposited on the first electrode layer 2 while maintaining the substrate temperature of 420 ° C. Indium selenide (thickness 1000 nm) forms a layer (α) having selenium, gallium and indium. Next, copper selenide (thickness: 600 nm) was laminated on the layer (α) while maintaining the substrate temperature of 420 ° C to form a layer (β) having copper and selenium. A small amount of Se vapor was supplied, and a laminate in which the layers (α) and (β) were laminated was heated, and the substrate temperature was maintained at 650 ° C for 15 minutes to grow crystals. Then, a small amount of Se vapor was supplied and the substrate temperature was maintained. In a state of 650 ° C, while gradually increasing the vapor deposition amount of Ga, In, Ga, and Se were vapor-deposited to form a CIGS layer (thickness: 2000 nm).

接著,冷卻形成有前述CIGS層之積層體,保持基板溫度為400℃,並使用設定在750℃之NaF蒸鍍源,於CIGS層上真空蒸鍍NaF,之後,加熱使基板溫度為420℃,藉由保持該基板溫度10分鐘,使Na擴散於CIGS層之粒界,形成光吸收層3a。 Next, the laminated body in which the CIGS layer was formed was cooled, the substrate temperature was maintained at 400 ° C, and NaF was vacuum-deposited on the CIGS layer using a NaF vapor deposition source set at 750 ° C, and then the substrate temperature was 420 ° C by heating. The light absorbing layer 3a was formed by diffusing Na at the grain boundary of the CIGS layer by maintaining the substrate temperature for 10 minutes.

並且,於前述光吸收層3a上,依序積層具CdS層(厚度50nm)與ZnO層(厚度70nm)之緩衝層3b、由ITO所構成 之第2電極層4(厚度200nm)。之後,以機械雕刻去除前述第2電極層4之側面(端面)至50μm內側的區域,去除該區域內之第2電極層4,第2電極層4之側面整個周圍形成為較發電層3(光吸收層3a、緩衝層3b)之側面位於內側50μm之位置,製造CIGS太陽電池單元。 Further, on the light absorbing layer 3a, a buffer layer 3b having a CdS layer (thickness: 50 nm) and a ZnO layer (thickness: 70 nm) is laminated in this order, and is composed of ITO. The second electrode layer 4 (thickness: 200 nm). Thereafter, the side surface (end surface) of the second electrode layer 4 is removed by mechanical engraving to a region inside the 50 μm, and the second electrode layer 4 in the region is removed, and the entire circumference of the side surface of the second electrode layer 4 is formed as the power generation layer 3 ( The side faces of the light absorbing layer 3a and the buffer layer 3b) were located at an inner side of 50 μm to manufacture a CIGS solar battery unit.

[實施例2] [Embodiment 2]

除了第2電極層4之側面整個周圍形成為較發電層3(光吸收層3a、緩衝層3b)之側面位於內側500μm之位置以外,與實施例1同樣地製作,製造CIGS太陽電池單元。 A CIGS solar battery cell was produced in the same manner as in Example 1 except that the entire circumference of the side surface of the second electrode layer 4 was formed at a position of 500 μm on the inner side of the side surface of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b).

[實施例3] [Example 3]

此外,除了對發電層3(光吸收層3a、緩衝層3b)之側面(端面)至20μm內側之區域照射Nd:YAG雷射光,去除該區域內之發電層3(光吸收層3a、緩衝層3b)以外,與實施例1同樣地製作,製造CIGS太陽電池單元。即,第2電極層4之側面整個周圍係較發電層3(光吸收層3a、緩衝層3b)之側面位於內側30μm之位置,且發電層3(光吸收層3a、緩衝層3b)之側面整個周圍係較第1電極層2之側面位於內側20μm(參照圖3)之位置。 Further, in addition to irradiating Nd:YAG laser light to the side surface (end surface) of the power generation layer 3 (light absorbing layer 3a, buffer layer 3b) to the inner side of 20 μm, the power generation layer 3 (light absorbing layer 3a, buffer layer) in the region is removed. A CIGS solar battery unit was produced in the same manner as in Example 1 except for 3b). In other words, the entire circumference of the side surface of the second electrode layer 4 is located at a position 30 μm inside from the side surface of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b), and the side of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b) The entire periphery is located 20 μm (see FIG. 3) on the inner side of the side surface of the first electrode layer 2.

[實施例4~10] [Examples 4 to 10]

除了以後述表1所示之絕緣性被覆材被覆基板1、第1電極層2、發電層3及第2電極層4其全部側面整個周圍以外,與實施例3同樣地製作,製造CIGS太陽電池單元。 A CIGS solar cell was produced in the same manner as in Example 3 except that the entire surface of the insulating coating material covering substrate 1, the first electrode layer 2, the power generating layer 3, and the second electrode layer 4 shown in Table 1 below was prepared. unit.

[比較例1] [Comparative Example 1]

除了未去除第2電極層4之側面(端面)至50μm內側區域 內的第2電極層4以外,與實施例1同樣地製作,製造CIGS太陽電池單元。即,比較例1之CIGS太陽電池單元中,第2電極層4之側面與發電層3(光吸收層3a、緩衝層3b)之側面於平面來看位於相同位置地形成。 Except that the side surface (end surface) of the second electrode layer 4 is not removed to the inner area of 50 μm A CIGS solar battery cell was produced in the same manner as in Example 1 except that the second electrode layer 4 was used. That is, in the CIGS solar battery cell of Comparative Example 1, the side faces of the second electrode layer 4 and the side faces of the power generation layer 3 (the light absorbing layer 3a and the buffer layer 3b) are formed at the same position in plan view.

[比較例2] [Comparative Example 2]

除了僅去除相鄰之CIGS太陽電池單元重疊之2邊、第2電極層4之側面(端面)至50μm內側區域內的第2電極層4,而剩下之2邊則未進行第2電極層4的去除以外,與實施例1同樣地製作,製造CIGS太陽電池單元。即,該CIGS太陽電池單元中第2電極層4之側面整個周圍並未位於較發電層3之側面位置內側。 Except for removing only the two sides of the adjacent CIGS solar cell unit, the side surface (end surface) of the second electrode layer 4, and the second electrode layer 4 in the inner region of 50 μm, and the remaining two sides are not subjected to the second electrode layer. A CIGS solar cell unit was produced in the same manner as in Example 1 except that the removal of 4 was carried out. That is, the entire circumference of the side surface of the second electrode layer 4 in the CIGS solar cell unit is not located inside the side position of the power generation layer 3.

遵照下述順序分別測量前述實施例1~10及比較例1、2之CIGS太陽電池單元黑暗中之逆向飽和電流。又,使用焊料將前述實施例1~10及比較例1、2之CIGS太陽電池單元3個一組地電連接,製造各自對應之CIGS太陽電池模組。並且,以具可撓性及耐候性之透光性的覆蓋薄膜(三菱樹脂化學社製,VIEW-BARRIER)被覆該等CIGS太陽電池模組之全體。遵照下述順序分別進行該CIGS太陽電池模組之可靠性試驗(DH)。於後述表1一併顯示該等之結果。 The reverse saturation currents in the darkness of the CIGS solar cell units of the above Examples 1 to 10 and Comparative Examples 1 and 2 were measured in the following order. Further, the CIGS solar battery cells of the above-described Examples 1 to 10 and Comparative Examples 1 and 2 were electrically connected by a pair of solders to produce respective CIGS solar battery modules. In addition, the entire CIGS solar cell module was covered with a cover film (VIEW-BARRIER, manufactured by Mitsubishi Plastics Chemical Co., Ltd.) having flexibility and weather resistance. The reliability test (DH) of the CIGS solar cell module was performed in the following order. The results of these are shown together in Table 1 below.

[黑暗中之逆向飽和電流] [Reverse saturation current in the dark]

黑暗中之逆向飽和電流的測量可如以下地進行。即,於黑暗之環境氣體中溫度調節至25℃之測量台上裝設CIGS太陽電池單元,一面拂掠電壓一面測量其電流,將施加有-5V之負偏壓時的電流值紀錄為CIGS太陽電池單元黑暗中 之逆向飽和電流值。 The measurement of the reverse saturation current in the dark can be performed as follows. That is, the CIGS solar cell unit is mounted on a measuring platform whose temperature is adjusted to 25 ° C in a dark ambient gas, and the current is measured while sweeping the voltage, and the current value when a negative bias of -5 V is applied is recorded as the CIGS sun. Battery unit in the dark Reverse saturation current value.

[可靠性試驗(DH)] [Reliability Test (DH)]

可靠性試驗係使用ESPEC社之高溫恆濕試驗機(PL-3J),將CIGS太陽電池模組暴露於保持在85℃、濕度85%之環境氣體中1000小時。並且,將經過1000小時後之光電轉換效率對開始試驗前之轉換效率的比為90%以上者評定為合格(○標記),低於90%者評定為不合格(×標記)。 The reliability test was performed by using ESPEC's high temperature and humidity tester (PL-3J) to expose the CIGS solar cell module to an ambient gas maintained at 85 ° C and a humidity of 85% for 1000 hours. Further, the ratio of the photoelectric conversion efficiency after 1000 hours to the conversion efficiency before the start of the test was 90% or more, and it was judged as the pass (○ mark), and the case where the ratio was less than 90% was evaluated as the unacceptable (X mark).

又,表1所示之絕緣性被覆材係使用以下者。 Moreover, the insulating coating material shown in Table 1 uses the following.

*1:聚醯亞胺膠帶(日東電工社製,No.360UL) *1: Polyimide tape (made by Nitto Denko Corporation, No.360UL)

*2:乙烯乙酸乙烯酯共聚物樹脂組成物(Sanvic社製, Ultrapearl PV) *2: ethylene vinyl acetate copolymer resin composition (manufactured by Sanvic) Ultrapearl PV)

*3:胺甲酸乙酯-矽基系接著劑(Konishi社製,#05140) *3: Ethyl urethane-sulfonium-based adhesive (Konishi Co., Ltd., #05140)

由前述結果,可知相對於實施例1~10之全部中,CIGS太陽電池模組的可靠性試驗(DH)為合格,比較例1、2均不合格。又,實施例中經絕緣性被覆材被覆基板1、第1電極層2、發電層3及第2電極層4全部之側面整個周圍的實施例5~10之CIGS太陽電池單元,特別是黑暗中之逆向飽和電流值低,可得優異之短路防止效果。 From the above results, it was found that the reliability test (DH) of the CIGS solar cell module was acceptable to all of Examples 1 to 10, and both of Comparative Examples 1 and 2 failed. Further, in the examples, the CIGS solar battery cells of Examples 5 to 10 covering the entire side surfaces of the substrate 1, the first electrode layer 2, the power generation layer 3, and the second electrode layer 4 were covered with an insulating coating material, particularly in the dark. The reverse saturation current value is low, and an excellent short-circuit prevention effect can be obtained.

再者,本發明中以CIGS太陽電池單元為例作為光電轉換元件進行說明,但使用其他方式之太陽電池單元亦可得到相同的效果。 Further, in the present invention, a CIGS solar battery unit will be described as an example of a photoelectric conversion element, but the same effect can be obtained by using another type of solar battery unit.

前述實施例中,顯示本發明中之具體形態,但前述實施例僅為例示,並非限定地解釋者。習於此藝者所知之各種變形均於本發明範圍內。 In the foregoing embodiments, the specific embodiments of the present invention are shown, but the foregoing embodiments are merely illustrative and not restrictive. Various modifications known to those skilled in the art are within the scope of the invention.

產業上之可利用性 Industrial availability

本發明之光電轉換元件因可有效地防止短路,故可以低成本達成高轉換效率。又,具該光電轉換元件之光電轉換裝置適用於要求長時間發揮高規格的光電轉換裝置。 Since the photoelectric conversion element of the present invention can effectively prevent short-circuiting, high conversion efficiency can be achieved at low cost. Further, the photoelectric conversion device having the photoelectric conversion element is suitable for a photoelectric conversion device which requires a high specification for a long period of time.

1‧‧‧基板 1‧‧‧Substrate

2‧‧‧第1電極層 2‧‧‧1st electrode layer

3‧‧‧發電層 3‧‧‧Power generation layer

3a‧‧‧光吸收層 3a‧‧‧Light absorbing layer

3b‧‧‧緩衝層 3b‧‧‧buffer layer

4‧‧‧第2電極層 4‧‧‧2nd electrode layer

L1‧‧‧長度 L 1 ‧‧‧ length

Claims (8)

一種光電轉換元件,該光電轉換元件之特徵在於:其略為板狀並至少依序具有基板、第1電極層、發電層、第2電極層,且前述第2電極層之側面整個周圍形成為較前述發電層之側面位於更內側之位置。 A photoelectric conversion element characterized in that it has a substantially plate shape and has at least a substrate, a first electrode layer, a power generation layer, and a second electrode layer, and the entire circumference of the side surface of the second electrode layer is formed. The side surface of the power generation layer is located at the inner side. 如請求項1之光電轉換元件,其略為板狀並至少依序具有基板、第1電極層、發電層、第2電極層,且前述發電層之側面整個周圍形成為位於較前述第1電極層之側面更內側之位置。 The photoelectric conversion element according to claim 1, which has a substantially plate shape and has at least a substrate, a first electrode layer, a power generation layer, and a second electrode layer, and the entire circumference of the side surface of the power generation layer is formed to be located closer to the first electrode layer. The side of the side is more inside. 如請求項1或2之光電轉換元件,其略為板狀並至少依序具有基板、第1電極層、發電層、第2電極層,且前述第1電極層之側面、發電層之側面及第2電極層之側面整個周圍被絕緣性被覆材所被覆。 The photoelectric conversion element according to claim 1 or 2, which has a substantially plate shape and has at least a substrate, a first electrode layer, a power generation layer, and a second electrode layer, and a side surface of the first electrode layer, a side surface of the power generation layer, and a surface The entire circumference of the side surface of the two electrode layers is covered with an insulating coating material. 如請求項3之光電轉換元件,其中被覆前述側面整個周圍的絕緣性被覆材係包含聚醯亞胺之絕緣性膠帶。 The photoelectric conversion element according to claim 3, wherein the insulating coating material covering the entire circumference of the side surface comprises an insulating tape of polyimine. 如請求項3之光電轉換元件,其中被覆前述側面整個周圍的絕緣性被覆材,係由包含乙烯乙酸乙烯酯共聚物樹脂及胺甲酸乙酯樹脂之至少一者的熱可塑性樹脂組成物所構成。 The photoelectric conversion element according to claim 3, wherein the insulating coating material covering the entire circumference of the side surface is composed of a thermoplastic resin composition containing at least one of an ethylene vinyl acetate copolymer resin and an urethane resin. 如請求項3之光電轉換元件,其中被覆前述側面整個周圍的絕緣性被覆材係由包含聚乙烯之接著劑所構成。 The photoelectric conversion element according to claim 3, wherein the insulating coating material covering the entire circumference of the side surface is made of an adhesive containing polyethylene. 如請求項3之光電轉換元件,其中被覆前述側面整個周圍的絕緣性被覆材係藉由無機系氧化物所形成者,該無 機系氧化物包含選自於由SiOx、AlOx、MgOx及ZrOx所構成群組中之至少1個。 The photoelectric conversion element according to claim 3, wherein the insulating coating material covering the entire circumference of the side surface is formed by an inorganic oxide, The organic oxide includes at least one selected from the group consisting of SiOx, AlOx, MgOx, and ZrOx. 一種光電轉換裝置,具有複數光電轉換元件,且係使該等光電轉換元件相鄰之緣部彼此疊合而電連接者,該光電轉換裝置之特徵在於:前述各光電轉換元件係如請求項1~7中任一項之光電轉換元件,其略為板狀並至少依序具有基板、第1電極層、發電層、第2電極層,且前述第2電極層之側面整個周圍形成為較前述發電層之側面位於更內側之位置。 A photoelectric conversion device having a plurality of photoelectric conversion elements, wherein the adjacent edges of the photoelectric conversion elements are superposed on each other and electrically connected, the photoelectric conversion device being characterized in that each of the photoelectric conversion elements is as claimed in claim 1 The photoelectric conversion element according to any one of the above-mentioned seventh aspect, which has a substantially plate shape and has at least a substrate, a first electrode layer, a power generation layer, and a second electrode layer, and the entire circumference of the side surface of the second electrode layer is formed to generate electricity The side of the layer is located on the inner side.
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