TW201627212A - Wafer cassette - Google Patents

Abstract

A wafer cassette of the present invention comprises a loading body including a plurality of first structures. Each of the first structures includes a base plate and a side plate. A plurality of elastic elements are separately disposed on each of the base plates. The first structures are configured to can be assembled into an assembled state. In the assembled state, the base plates and the side plates cooperatively define a loading space. Another wafer cassette of the present invention comprises a loading body and a plurality of buffer structures. The loading body includes a base plate and a plurality of side plates. The base plate and the side plates cooperatively define a loading space. Each of the buffer structures has a plurality of elastic elements. The buffer structures are detachably installed on the base plate via a connecting unit. The design of the present invention can facilitate the process of disassembling and assembling the first structures or the buffer structures. When one of the first structures and the buffer structures is broken, the broken one can be replaced without disassembling the entire wafer cassette. Hence, the present invention need not to replace the entire loading body, thereby reducing the manufacturing and equipment costs.

Description

Substrate carrier

The present invention relates to a substrate carrier, and more particularly to a substrate carrier for loading a wafer during the manufacture of a solar cell.

Referring to Figures 1 and 2, a substrate carrier 91 conventionally used for loading a wafer 900 generally includes a susceptor 911, a receiving space 912 defined by the pedestal 911 for receiving the wafer 900, and a plurality of bases 911. The buffer member 913 integrally formed and disposed at the bottom edge thereof is elastically swingable when the cushioning member 913 abuts against the wafer 900 to prevent the wafer 900 from being broken by collision.

The substrate carrier 91 is used for a loading machine in a solar cell process, and the loading machine is a machine for transporting a wafer 900, which comprises two blowing nozzles 92 facing the receiving space 912, a lifting device 93 movable up and down, and A handling device 94.

In use, the suction force of the conveying device 94 causes the upper wafer 900' to move up, but the upper plurality of wafers 900' are often attracted to each other by static electricity. Therefore, the blown nozzles 92 are blown toward the upper wafers 900' to separate the adsorbed wafers 900' from each other, so that the transporting device 94 sucks only the uppermost one. However, when the wafer 900' is moved up, it is often swayed by the gas to disturb the side wall of the pedestal 911, and the elastic swing of the buffer member 913 can be transmitted. The impact force is absorbed to slow the shaking of the wafer 900' and to avoid fragmentation due to collision.

In addition, when the wafer 900' is moved up and touches the sidewall of the pedestal 911, the edge of the wafer 900' is easily rubbed against the buffer member 913, thereby causing wear or even breakage of the surface of the buffer member 913, which is easy to be worn on the wafer. The 900' is damaged or even fragmented, and in order to avoid damage to the wafer 900, it is preferable to replace the entire substrate carrier 91 when the cushion member 913 is worn or broken, but there is a problem of an increase in cost.

Further, the substrate carrier 91 is formed by integrally injection molding the susceptor 911 and the cushioning member 913. However, since the cushioning member 913 is in the shape of an elongated strip during cooling after the ejection, the bending member is likely to be bent and deformed. As shown in FIG. 3, the forward tilting deformation of the cushioning member 913 closer to the center of the side surface of the base 911 is more obvious, because the cushioning member 913 is elongated and only a single end is connected to the edge of the bottom of the base 911, so that The buffer member 913 is not easily arranged vertically after the mold, and because the material cost is saved, the bottom of the base 911 is often made thinner (for example, 2 mm), so that the support of the elongated buffer member 913 at the bottom end is insufficient, resulting in insufficient support. The situation of tilt deformation is more serious.

Therefore, it can be seen that the buffer member 913 has a problem of leaning forward, so that the side of the wafer 900 cannot be biased against each of the buffer members 913 to disperse the force, and only the cushion that is most severely inclined is present. The piece 913 causes the edge of the wafer 900 to be easily broken due to uneven force. At the same time, the forward tilting problem of the cushioning member 913 also makes it easier for the operator to encounter the inclined cushioning member 913 when inserting and removing the wafer, which is inconvenient or even fragmented.

Accordingly, it is an object of the present invention to provide a substrate carrier that can be individually replaced with a partial structure to reduce equipment costs.

Thus, the first substrate carrier of the present invention comprises a carrier. The carrier includes a plurality of first structures that can be assembled with each other; each of the first structures includes a bottom plate and a side plate, and the bottom plate is provided with a plurality of elastic members adjacent to the side plates; the plurality of first structures can be assembled and positioned And a plurality of side plates surround a bearing space relative to the plurality of bottom plates.

The utility model has the advantages that the carrier is divided into the designs of the plurality of first structures. When the elastic component of one of the first structures is worn and broken, only the first structure needs to be replaced without eliminating the entire carrier, thereby reducing the cost.

The second substrate carrier of the present invention comprises a carrier and a plurality of buffer structures. The carrier includes a bottom plate and a plurality of side plates, and the plurality of side plates surround a bearing space relative to the bottom plate. Each of the side plates is provided with at least one of the plurality of buffer structures, each of the buffer structures having a plurality of elastic members, one end of the plurality of elastic members contacting the bottom plate, and the other end of each of the elastic members is between the top of each of the side plates and the top of each of the side plates The detachable positioning and mounting are performed by a combination unit, and each of the elastic members is bent to form an elastic reed near the coupling unit.

The utility model has the advantages that the other end of each of the elastic members and the top of each of the side plates are detachably positioned and assembled by a joint unit, and when the elastic member of one of the buffer structures is worn and broken, only the buffer structure needs to be replaced. Cost reduction can be achieved without eliminating the entire substrate carrier.

The third substrate carrier of the present invention comprises a carrier and a plurality of buffer structures. The carrier comprises a bottom plate and a plurality of side plates, the plurality of side plates being opposite A bearing space is enclosed in the bottom plate. Each of the buffer structures has a plurality of elastic elements, and the plurality of buffer structures are disposed on the bottom plate and corresponding to the plurality of side plates. The plurality of buffer structures and the bottom plate are detachably positioned and mounted by a joint unit, and the plurality of buffer structures are detachably disposed. One end of the elastic element is away from the bottom plate and does not contact the corresponding side plate.

The utility model has the advantages that the other end of each elastic element and the bottom plate are detachably positioned and mounted by a joint unit. When the elastic element of one of the buffer structures is worn and broken, the buffer structure only needs to be replaced without eliminating the entire substrate. Vehicles can reduce costs.

It is an object of the present invention to provide a substrate carrier which is structurally strong and which can reduce the chipping rate.

A fourth substrate carrier of the present invention comprises a carrier and a plurality of buffer structures. The carrier comprises a bottom plate and a plurality of side plates, and the plurality of side plates enclose a bearing space relative to the bottom plate. Each of the buffer structures is disposed on the bottom plate and adjacent to each of the side plates. Each of the buffer structures has a plurality of elastic members, and one of the plurality of elastic members extends away from the bottom plate. At least two of the plurality of elastic members are connected by a connecting portion, and the position of the connecting portion is not higher than 2/3 of the height of the plurality of elastic members.

The function is that at least two of the plurality of elastic members are connected by a connecting portion to avoid the forward tilting of the elastic members and form a coplanar arrangement, so that the sides of the wafer are evenly pressed against each elastic member uniformly. To reduce the fragmentation rate of the wafer and facilitate the take-up or placement of the wafer.

1‧‧‧Substrate carrier

11‧‧‧ Carrier

110‧‧‧ Carrying space

12‧‧‧ Shell

120‧‧‧ accommodating space

13‧‧‧First positioning unit

131‧‧‧First convex

132‧‧‧First recess

14‧‧‧Second positioning unit

141‧‧‧second convex

142‧‧‧Second recess

15‧‧‧buffer structure

151‧‧‧elastic reed

16‧‧‧Combination unit

161‧‧‧Combined convex

162‧‧‧ combined recess

2‧‧‧ first structure

201‧‧‧ bottom wall

202‧‧‧ side wall

3‧‧‧floor

31‧‧‧ corner

4‧‧‧ side panels

5‧‧‧Flexible components

51‧‧‧Flex rod

511‧‧‧ surface

52‧‧‧Bend

53‧‧‧Connecting Department

530‧‧‧through holes

71‧‧‧Blowing mouth

72‧‧‧lifting device

73‧‧‧Transportation device

8, 8'‧‧‧ wafer

D‧‧‧ spacing

H‧‧‧height

Other features and effects of the present invention will be described with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a conventional substrate carrier; FIG. 2 is a cross-sectional view showing a state in which a substrate carrier of FIG. 1 is loaded with a plurality of wafers; FIG. 3 is a plan view of the substrate carrier of FIG. FIG. 5 is a perspective view of the first embodiment; FIG. 6 is a plan view of the first embodiment; FIG. 7 is a top view of the first embodiment of FIG. Figure 8 is a cross-sectional view showing the state of use of the BB position of Figure 6 of the first embodiment; Figure 9 is a plan view of the second embodiment of the substrate carrier of the present invention; and Figure 10 is an exploded perspective view of the carrier of the second embodiment. Figure 11 is a perspective view showing a first structure of a third embodiment of the substrate carrier of the present invention; Figure 12 is a perspective view showing a first structure of a fourth embodiment of the substrate carrier of the present invention; and Figure 13 is a fifth embodiment of the substrate carrier of the present invention; Figure 14 is a perspective exploded view of a sixth embodiment of the substrate carrier of the present invention; Figure 15 is an exploded perspective view of a portion of the sixth embodiment; Figure 16 is a plan view of the sixth embodiment; Figure 17 is the CC position of Figure 16 of the sixth embodiment. Figure 18 is a cross-sectional view showing the DD position of Figure 6 of the sixth embodiment; Figure 19 is a partially exploded perspective view of the seventh embodiment of the substrate carrier of the present invention; and Figure 20 is the substrate carrier of the present invention. FIG. 21 is an exploded perspective view showing a ninth embodiment of the substrate carrier of the present invention; FIG. 22 is an exploded perspective view of the ninth embodiment; FIG. 23 is an exploded perspective view of the ninth embodiment; Top view Figure 24 is a cross-sectional view showing the EE position of Figure 23 of the ninth embodiment; Figure 25 is a partially exploded perspective view of the tenth embodiment of the substrate carrier of the present invention; and Figure 26 is an eleventh embodiment of the substrate carrier of the present invention. Figure 27 is an exploded perspective view of a twelfth embodiment of the substrate carrier of the present invention; Figure 28 is an exploded perspective view of a thirteenth embodiment of the substrate carrier of the present invention; and Figure 29 is a substrate of the present invention; An exploded perspective view of a fourteenth embodiment of the carrier.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIGS. 4, 5 and 6, a first embodiment of the substrate carrier 1 of the present invention comprises: a carrier 11, a housing 12, at least one first positioning unit 13, and at least one second positioning unit 14.

The carrier 11 comprises a plurality of first structures 2 which can be combined or combined with one another. Each of the first structures 2 includes a bottom plate 3 and a side plate 4, and the bottom plate 3 is provided with a plurality of elastic members 5 adjacent to the side plates 4. The plurality of first structures 2 can be assembled and arranged by the plurality of side plates 4 with respect to the plurality of bottom plates 3, and the elastic elements 5 of the plurality of first structures 2 are disposed around The load space 110 is inside.

The housing 12 has an accommodating space 120. The plurality of first structures 2 are disposed in the accommodating space 120 and are respectively positioned in the housing 12, wherein, in implementation, the housing 12 and the first structure 2 are rectangular or Similar to a rectangle, or it can be a square. Moreover, in a further implementation, the accommodating space 120 can be divided into four equal parts and the corresponding four first structures 2 can be combined in the accommodating space 120 of the outer casing 12.

Referring to FIGS. 5, 6, and 7, each of the side panels 4 and the outer casing 12 is positioned by at least one first positioning unit 13. Each of the first positioning units 13 includes a first protrusion 131 disposed on one of the side panel 4 and the outer casing 12, and a detachable one disposed on the other side of the side panel 4 and the outer casing 12. The first recess 132 is assembled from the first convex portion 131 from the ground.

In the embodiment, the first convex portion 131 is a bump and is disposed on the side plate 4; the first concave portion 132 is a hole for the first convex portion 131 to be positioned and disposed on the outer casing 12. In practice, as long as the first convex portion 131 and the first concave portion 132 can be detachably coupled to each other, the form of the first convex portion 131 and the first concave portion 132 need not be limited. In addition, the positions at which the first convex portion 131 and the first concave portion 132 are disposed are interchangeable, and are not limited to the examples of the embodiment.

The bottom plate 3 and the outer casing 12 are positioned by at least one second positioning unit 14. Each of the second positioning units 14 includes a second protrusion 141 disposed on one of the bottom plate 3 and the outer casing 12, and is disposed on the other of the bottom plate 3 and the outer casing 12 and detachably and the second convex portion 141 assembled second recess 142.

In this embodiment, the second convex portion 141 is a bump and is disposed on the bottom plate 3; the second concave portion 142 is a card hole for the second convex portion 141 to be inserted into the card, and is disposed on the outer casing 12. In practice, as long as the second convex portion 141 and the second concave portion 142 can be detachably coupled to each other, the form of the second convex portion 141 and the second concave portion 142 need not be limited. In addition, the positions at which the second convex portion 141 and the second concave portion 142 are disposed are interchangeable, and are not limited to the examples of the embodiment.

In this embodiment, the carrier 11 is assembled and fixed to the carrier 11 through the plurality of first positioning units 13 or/and the plurality of second positioning units 14 The housing 12 is disposed in the accommodating space 120. However, the carrier 11 and the housing 12 can be fixed in a tight fit manner. Therefore, the means for assembling and fixing the carrier 11 in the housing 12 is not limited to the embodiment disclosed in this embodiment. .

Each of the elastic members 5 has an elastic rod 51 (or an elastic rod) extending away from the bottom plate 3 and elastically swingable, and a bent portion 52 bent at an end of the elastic rod 51 away from the bottom plate 3. In the present embodiment, the elastic rod 51 of each elastic member 5 and the bent portion 52 are L-shaped as a whole. The elastic rod 51 and the bottom plate 3 may be integrally formed, and the elastic rod 51 has a rectangular cross section in the direction parallel to the bottom plate 3.

After the plurality of first structures 2 are combined to form the carrier 11, as shown in the top view of FIG. 6, the bottom plates 3 of the first structures 2 cooperate to form a substantially quadrangular plate body having four plates. In the corner 31, the distance d between the elastic members 5 near the corner 31 is gradually reduced. When the wafer is blown and separated and floated, the collision position of the wafer with the surrounding elastic member 5 often appears at the corner 31, so that it is close. When the pitch of the elastic members 5 at the corners 31 is narrowed or arranged more densely, the contact area of the force is increased, which is advantageous for alleviating the collision problem at the corners of the edge of the wafer.

Referring to Figures 4, 7, and 8, in this embodiment, the carrying space 110 of the substrate carrier 1 is used to accommodate a plurality of wafers 8, 8', and the substrate carrier 1 is placed on a loading machine. The material machine is a machine for transporting the wafers 8, 8' in the solar cell manufacturing process, and the loading machine comprises two nozzles 71 respectively for ejecting gas, one of which can be driven up and down to the substrate carrier 1 and can be used for the wafer 8 rising lifting device 72, and a handling device for absorbing the wafers 8, 8' and placing the wafers 8, 8' on a conveyor belt (not shown) 73. Wherein, the lifting device 72 positions the wafer 8 at the height of the two blowing nozzles 71, and blows the air through the blowing nozzle 71 to separate the upper wafers 8' from each other, and then sucks the uppermost wafer 8' by the conveying device 73 to complete the pickup. Actions.

When the above-mentioned upper wafers 8' are separated from each other by the air blowing, they are easily shaken left and right by the gas turbulence and contact the surrounding elastic members 5, but after long-term use, if the elastic rods 51 of the elastic members 5 are subjected to the edge of the wafer 8' When the cutting forms a score, a groove or even a break, the visually depleted elastic member 5 belongs to which first structure 2, and then the damaged first structure 2 can be replaced immediately, so as to avoid the direct manner as in the conventional manner. The problem of excessive cost is replaced by replacing the entire substrate carrier 1.

Further, in the present embodiment, the elastic bar 51 of each elastic member 5 is smaller in width near the bent portion 52 than the bottom plate 3, thereby enhancing the elasticity of the elastic member 5 near the tip end. In other words, through the design that the bottom-up width is gradually reduced (or the circumference is gradually smaller), the whole of the elastic rod 51 can be optimally matched between the structural strength and the elasticity, from which the elastic rod can be further raised. 51 elastic abutment effect. Further, the bent portion 52 is formed to face away from the bearing space 110.

In addition, in practice, the elastic member 5 is bent at the end of the elastic rod 51, that is, away from the bottom plate 3 to form the bent portion 52, so that the structural strength above the elastic rod 51 can be enhanced, and the design can also be compared with the above. The design of the elastic rod 51 is gradually reduced in width (or the circumference is gradually smaller).

In the present embodiment, the elastic rod 51 and the bottom plate 3 are integrally formed. In other embodiments, the elastic rod 51 of the elastic member 5 can be fixed to the bottom plate 3 in an inserting manner. At this time, the elastic rod 51 of the elastic member 5 is flat. It is preferable that the cross section in the direction of the bottom plate 3 is a non-circular shape such as a rectangular shape. If the elastic rod 51 is circular, the hole of the bottom plate 3 corresponding to the insertion is also required to be circular, so that the elastic rod 51 is easily rotated therein, thereby turning the bent portion 52 originally intended to be outwardly turned. In this case, the inconvenience of the pick-and-place sheet may be caused or even the impact of the wafers 8, 8' may be broken.

Referring to Figures 6, 7, and 8, in the present embodiment, the elastic member 5 has a rectangular cross section in the direction of the parallel bottom plate 3, and the elastic rod 51 of the elastic member 5 has a bearing space 110 facing the wafer 8, 8'. The surface 511 on the surface of the wafers 8 and 8' is abutted against the edges of the wafers 8 and 8' through the surfaces 511. The contact area of the wafers is increased to reduce the impact force to prevent the wafers 8, 8' from being broken or elastic. The surface 511 causes problems such as damage.

In the present embodiment, the spacing d between the elastic members 5 near the corners 31 is gradually reduced. This design allows the wafer 8' to be blown and floated apart, and the collision position of the wafer 8' with the surrounding elastic member 5 often occurs. At the corner 31, when the pitch d of the elastic member 5 near the corner 31 is reduced or arranged more densely, the contact area of the force is increased, which is advantageous for alleviating the collision problem at the edge of the edge of the wafer 8'.

4, 5, and 8, through the above design, the service life of the carrier 11 of the substrate carrier 1 can be improved, but if the elastic member 5 is worn or broken for a long time, the elastic member 5 can be damaged. The first structure 2 is replaced so as not to cause the wafers 8, 8' to be broken by the elastic members 5 due to non-replacement.

It can be seen from the above that the carrier 11 is designed as an innovative design combining several first structures 2, and can be bombed on a certain first structure 2. When the sexual component 5 is worn and broken, the first structure 2 can be replaced, and it is not necessary to eliminate the entire carrier 11 as in the conventional manner, which can reduce the cost.

Referring to Figures 9 and 10, a second embodiment of the substrate carrier 1 of the present invention is substantially the same as the first embodiment. The carrier 11 of the present embodiment radially divides a plurality of first structures 2, which are first The difference in the embodiment is that the number of the first structures 2 is different. In this embodiment, the number of the first structures 2 is eight, so that when the replacement is made, at least one-eighth of the entire carrier 11 can be replaced, and the ratio is relatively low, which is relatively cost-effective. . In addition, in practice, the carrier 11 of the present invention can be divided into several first structures 2, and the manner and number of divisions thereof are not limited to the above examples, as long as the spirit and purpose of the present invention are within the scope of the present disclosure. .

Referring to FIG. 11, the third embodiment of the substrate carrier of the present invention is substantially the same as the first embodiment, and the difference is that at least two of the plurality of elastic members 5 are connected by a connecting portion 53, wherein the connecting portion 53 is Connected between at least two elastic rods 51. The position of the connecting portion 53 is not higher than two-thirds (i.e., 2/3) of the height h of the elastic rod 51. More preferably, the position of the connecting portion 53 does not exceed the range of 1/2 to 2/3 of the height h of the elastic rod 51. Here, the height h described in the present embodiment is calculated from the surface of the bottom plate 3 to the tip end of the elastic rod 51.

The design of the connection between the elastic rods 51 through the connecting portion 53 allows the elastic member 5 of the first structure 2 produced by injection molding to be restrained in the mold or in the cooling process after the demolding to be vertical. The result of standing up, avoiding the problem of forward leaning derived from the traditional way. At the same time, such a design can also make the surfaces 511 of the plurality of elastic rods 51 all on the same plane. The force applied when the wafer is abutted can be more evenly dispersed, and the problem of fragmentation due to a single point of force or a small force area is reduced.

Further, the position of the connecting portion 53 is not too high, and when the upper wafer is separated and floated and touches the surrounding elastic rod 51, if the position of the connecting portion 53 is too high, the originally good elastic swing effect is affected. Therefore, the effect of the original wafer for cushioning is lowered, and therefore, the position of the connecting portion 53 is preferably 2/3 or less of the height h.

Further, if the position where the connecting portion 53 is provided is too low to approach the bottom plate 3, the tilt problem of the conventional design may occur, because the overall proportion of the elastic bar 51 located above the connecting portion 53 is too high, so that the tilt is also easy to occur. The problem of deformation, therefore, the position of the connecting portion 53 is not preferably lower than 1/2 of the height h of the elastic rod 51. However, if another connecting portion 53 is provided above the connecting portion 53 near the bottom plate 3, the mutual restraint between the two can avoid the problem of tilting as discussed herein.

Referring to Fig. 12, a fourth embodiment of the substrate carrier of the present invention is substantially the same as the third embodiment, and at least two of the plurality of elastic members 5 are connected by a connecting portion 53. The difference between the two is that the connecting portion 53 is extended to be connected to the bottom plate 3, wherein the system assumes an X shape.

Referring to FIG. 13, a fifth embodiment of the substrate carrier of the present invention is substantially the same as the fourth embodiment, and the difference is that the connecting portion 53 extends downward from the 2/3 position of the height h of the elastic bar 51 to the bottom plate 3. The whole portion is formed in a sheet shape, and the connecting portion 53 has at least one through hole 530. In the embodiment, as shown in FIG. 13, a plurality of through holes 530 are designed, which not only saves material cost but also saves material cost. Allows airflow that causes turbulence to flow through the through hole 530 flows out to slow the side-to-side slamming of the wafer. Moreover, the design of FIG. 13 can effectively improve the structural strength under the elastic member 5, thereby reducing the damage situation when the operator touches the elastic member 5 with the carrier 11 by hand, thereby prolonging the service life.

Referring to Figures 14, 15, 16, and 17, a sixth embodiment of the substrate carrier 1 of the present invention includes a carrier 11, a housing 12, at least a first positioning unit 13, at least a second positioning unit 14, and a plurality of buffers. Structure 15, and a plurality of combining units 16.

The carrier 11 includes a bottom plate 3 and a plurality of side plates 4. The plurality of side plates 4 surround a bearing space 110 with respect to the bottom plate 3. The buffer structure 15 surrounds the periphery of the bearing space 110. The housing 12 has an accommodating space 120. The carrier 11 is disposed in the accommodating space 120 and is positioned on the housing 12.

The side plate 4 and the outer casing 12 are positioned by the first positioning unit 13. The first positioning unit 13 includes a first convex portion 131 disposed on one of the side plate 4 and the outer casing 12, and a first portion affixed on the other side of the side plate 4 and the outer casing 12 and detachably connected to the first convex portion The first recess 132 is assembled by the portion 131.

In the embodiment, the first convex portion 131 is a bump and is disposed on the side plate 4; the first concave portion 132 is a card hole for the first convex portion 131 to be inserted into the card and disposed on the outer casing 12. In practice, as long as the first convex portion 131 and the first concave portion 132 can be detachably coupled to each other, the form of the first convex portion 131 and the first concave portion 132 need not be limited. In addition, the positions at which the first convex portion 131 and the first concave portion 132 are disposed are interchangeable, and are not limited to the examples of the embodiment.

The bottom plate 3 and the outer casing 12 are positioned by at least one second positioning unit 14. Each of the second positioning units 14 includes a bottom plate 3 and a housing 12 The second protrusion 141 on one of the two, and a second recess 142 disposed on the other of the bottom plate 3 and the outer casing 12 and detachably assembled with the second protrusion 141.

In this embodiment, the second convex portion 141 is a bump and is disposed on the bottom plate 3; the second concave portion 142 is a card hole for the second convex portion 141 to be inserted into the card and disposed on the outer casing 12. In practice, as long as the second convex portion 141 and the second concave portion 142 can be detachably coupled to each other, the form of the second convex portion 141 and the second concave portion 142 need not be limited. In addition, the positions at which the second convex portion 141 and the second concave portion 142 are disposed are interchangeable, and are not limited to the examples of the embodiment.

In this embodiment, the carrier 11 is assembled and fixed in the accommodating space 120 of the outer casing 12 through a plurality of first positioning units 13 and a plurality of second positioning units 14, but in practice, the two may be tight. The fixed form of the mating, so the means for fixing the carrier 11 in the outer casing 12 is not limited to the embodiment disclosed in the embodiment.

Each of the side plates 4 is provided with at least one of a plurality of buffer structures 15, and each of the buffer structures 15 has a plurality of elastic members 5, one end of which contacts the bottom plate 3 (see Fig. 17). The other end of each elastic member 5 and the top of each side plate 4 are detachably positioned and mounted by a coupling unit 16. Each of the elastic members 5 is bent to form an elastic spring 151 near the coupling unit 16, and even the elastic springs 151 are integrally connected to each other.

Each of the bonding units 16 includes a coupling protrusion 161 disposed on one of the buffer structure 15 and the side panel 4, and a coupling member 15 disposed on the other of the buffer structure 15 and the side panel 4 and detachably coupled to the protrusion The coupling recess 162 is assembled by the portion 161.

In this embodiment, the coupling protrusion 161 is a bump and is disposed on the buffer structure 15; the coupling recess 162 is a card hole, and the coupling protrusion 161 is inserted and positioned on the side plate 4. In practice, as long as the coupling protrusion 161 and the coupling recess 162 can be detachably coupled to each other, the form of the coupling protrusion 161 and the coupling recess 162 need not be limited. In addition, the arrangement positions of the coupling convex portion 161 and the coupling concave portion 162 are interchangeable, and are not limited to the examples of the embodiment.

Each of the elastic members 5 has an elastic rod 51 extending in a direction away from the bottom plate 3 and elastically swingable, and a bent portion 52 which is formed by bending the elastic rod 51 away from the end of the bottom plate 3 and connecting the elastic spring 151. In the present embodiment, the elastic rod 51 and the bent portion 52 of each elastic member 5 are L-shaped. Each of the elastic rods 51 has a rectangular cross section in the direction of the parallel bottom plate 3. The width of each of the elastic rods 51 near the bent portion 52 is smaller than the width of the bottom plate 3, and the width thereof can be replaced by the circumference.

The bottom plate 3 of the carrier 11 is a substantially quadrangular plate body having four corners 31 (see FIG. 16). The plurality of buffer structures 15 are assembled to the carrier 11 through the plurality of bonding units 16. The distance d between the elastic members 5 closer to the plurality of corners 31 is gradually reduced. This design allows the wafer to be blown and floated apart. Since the collision position of the wafer with the surrounding elastic member 5 often occurs at the corner 31, When the pitch of the elastic members 5 near the corners 31 is narrowed or arranged more densely, the contact area of the force is increased, which is advantageous for alleviating the collision problem at the corners of the wafer edges.

Referring to Figures 14, 16, 17, and 18, in this embodiment, the carrying space 110 of the substrate carrier 1 houses a plurality of wafers 8, 8', and the substrate carries The loader 1 is placed on a loading machine which is a machine for transporting the wafers 8, 8' in a solar cell manufacturing process, and the loader comprises two blow nozzles 71 respectively capable of ejecting gas, one movable up and down A lifting device 72 for inserting the substrate carrier 1 and allowing the wafer 8 to be upward, and a handling device 73 for absorbing the wafers 8, 8' and placing the wafers 8, 8' on a conveyor belt (not shown) . Wherein, the lifting device 72 raises the wafer 8 and is located at the height of the two blowing nozzles 71, and blows the wafers 8' located above through the blowing nozzles 71, and sucks the uppermost wafer 8 by the conveying device 73. 'To complete the pickup action.

When the upper wafers 8' are separated from each other by the air blowing, they are easily shaken left and right by the gas turbulence and contact the surrounding elastic members 5, wherein the elastic rods 51 are elastically subjected to the impact force when the wafer 8' is touched. The deformation of the rod 51 and the resilient reed 151 is designed to absorb to avoid cracking of the wafer 8' due to the impact. In addition, after long-term use, if the elastic rod 51 is cut by the edge of the wafer 8' to form a score, a groove or even a break, which of the buffer structures 15 the visually depleted elastic member 5 belongs to, and the damaged buffer structure is replaced. 15 can be, so that the conventional method of directly replacing the entire substrate carrier 1 can be avoided and the cost is too high.

Further, in the present embodiment, the width of the elastic rod 51 of each elastic member 5 near the bent portion 52 is smaller than that at the bottom plate 3, thereby enhancing the elasticity of the elastic member 5 near the tip end. In other words, through the design that the bottom-up width is gradually reduced (or the circumference is gradually smaller), the whole of the elastic rod 51 can be optimally matched between the structural strength and the elasticity, from which the elastic rod can be further raised. 51 elastic cushioning effect. And the above bend 52 is formed facing away from the bearing space 110.

In addition, in practice, the elastic member 5 is bent at the end of the elastic rod 51, that is, away from the bottom plate 3 to form the bent portion 52, so that the structural strength at the upper end of the elastic rod 51 can be enhanced, and the design can also be as described above. The elastic rods 51 have a decreasing width or a design with a smaller circumference.

In the present embodiment, the elastic member 5 has a rectangular cross section in the direction of the parallel bottom plate 3, and the elastic rod 51 of the elastic member 5 has a surface 511 facing the bearing space 110 and allowing the wafers 8, 8' to abut. By the surface 511, the edges of the wafers 8, 8' are abutted against each other, so that the contact area between the wafers 8 and 8' can be increased to reduce the surface 511 of the fragments or the elastic rods 51 which are generated by excessive stress during single point contact. Damage and other issues.

Further, in the present embodiment, the distance d between the elastic members 5 near the corner 31 is gradually reduced. This design allows the wafer 8' to be blown and floated apart, due to the collision position of the wafer 8' with the surrounding elastic member 5. It often appears at the corner 31, so that when the pitch d of the elastic member 5 near the corner 31 is reduced or arranged more densely, the force area here can be increased, which is advantageous for alleviating the collision problem at the edge of the edge of the wafer 8'.

Referring to Figures 15, 17, and 18, the service life of the carrier 11 of the substrate carrier 1 can be improved by the above design. However, if the elastic member 5 is worn or broken for a long time, the elastic member 5 can be damaged. The buffer structure 15 is replaced so as not to cause the wafers 8, 8' to be broken by the elastic member 5 due to non-replacement.

As can be seen from the above, the other end of each of the buffer structures 15 and the top of each of the side plates 4 in the embodiment are detachably positioned by a coupling unit 16 When the elastic member 5 on a certain buffer structure 15 is worn and broken, the buffer structure 15 can be replaced, and it is not necessary to eliminate the entire carrier 11 as in the conventional manner, which can reduce the cost.

Referring to FIG. 19, the seventh embodiment of the substrate carrier 1 of the present invention is substantially the same as the sixth embodiment. The difference between the two is that in each of the buffer structures 15, at least two of the plurality of elastic members 5 are connected by a connecting portion. 53 connections.

The connecting portion 53 is connected between at least two elastic rods 51. The position of the connecting portion 53 is not higher than two-thirds (i.e., 2/3) of the height h of the elastic rod 51. More preferably, the position of the connecting portion 53 does not exceed the range of 1/2 to 2/3 of the height h of the elastic rod 51. The height h described in this embodiment is calculated from the top end of the elastic rod 51 from the bottom end of the bottom plate 3 to the top end of the elastic rod 51.

The design of the connection between the elastic rods 51 through the connecting portion 53 allows the elastic member 5 of the first structure 2 produced by injection molding to be restrained and rendered during the cooling process in the mold or after demolding. The result of vertical erection avoids the traditional way of derivation. At the same time, the design of the surface 511 of the plurality of elastic rods 51 is located on the same plane, so that the force of the wafer when the abutting force is more evenly dispersed, and the fragment of the single point force or the force area is too small. problem.

Further, the position of the connecting portion 53 is not too high, and when the upper wafer is separated and floated and touches the surrounding elastic rod 51, if the position of the connecting portion 53 is too high, the deformation space above the elastic rod 51 is easily made small. In addition, the elastic swing effect of the elastic rod 51 is affected, thereby reducing the effect of the original wafer for cushioning. Therefore, the position of the connecting portion 53 is preferably 2/3 or less of the height h.

Moreover, if the position of the connecting portion 53 is too low to approach the bottom plate 3, the tilt problem of the conventional design may occur, because the overall proportion of the elastic bar 51 located above the connecting portion 53 is too high, and it is impossible to manufacture. Since the connecting portion 53 is surely restrained and the problem of oblique deformation is likely to occur, the position of the connecting portion 53 is not preferably lower than 1/2 of the height h of the elastic rod 51. However, if the connecting portion 53 is provided near the bottom plate 3 and the other connecting portions 53 are provided above the bottom plate 3, the problem of tilting as discussed herein can be avoided by the mutual restraint between the two.

Referring to Fig. 20, the eighth embodiment of the substrate carrier 1 of the present invention is substantially the same as the sixth embodiment. The difference between the two is that the carrier 11 includes a plurality of first structures 2 which can be combined or combined with each other. Each of the first structures 2 includes a bottom wall 201 and a side wall 202. After the plurality of first structures 2 are assembled, the bottom wall 201 of each of the first structures 2 constitutes the bottom plate 3, and each of the first structures The side walls 202 of the second side frame 2 constitute the side plates 4, and the plurality of buffer structures 15 are detachably positioned and mounted on the side walls 202 of each of the first structures 2 through the plurality of combining units 16.

Each of the side walls 202 of the first structure 2 and the outer casing 12 are respectively positioned by a first positioning unit 13 . In this embodiment, the first convex portion 131 of each of the first positioning units 13 is disposed on the side wall 202; the first concave portion 132 of each of the first positioning units 13 can be positioned by the first convex portion 131, and It is disposed on the outer casing 12.

The bottom wall 201 of each of the first structures 2 and the outer casing 12 are respectively positioned by a second positioning unit 14. In this embodiment, the second convex portion 141 of each of the second positioning units 14 is placed on the bottom wall 201; each of the second predetermined The second recess 142 of the bit unit 14 can be positioned by the second protrusion 141 and placed on the outer casing 12.

In this embodiment, the carrier 11 is designed as an innovative design combining a plurality of first structures 2, and the first structure 2 can be replaced when a certain first structure 2 is damaged, and the entire carrier 11 need not be eliminated as in the conventional manner. cut costs. The carrier 11 of the present invention can be divided into several first structures 2, and the manner and number of divisions thereof are not limited to the above examples of the embodiments, and the spirit and purpose of the present invention are within the scope of the present invention.

21, 22, 23, and 24, the ninth embodiment of the substrate carrier 1 of the present invention is substantially the same as the sixth embodiment, and the difference between the two is that the buffer structure 15 is mounted with the carrier 11 and the buffer structure 15 structure.

In the present embodiment, the buffer structure 15 is disposed on the bottom plate 3 and corresponding to the side plate 4, and the buffer structure 15 and the bottom plate 3 are detachably positioned and mounted by a joint unit 16. In this embodiment, the joint protrusion 161 of the joint unit 16 is a bump and is disposed on the buffer structure 15; the joint recess 162 of the joint unit 16 is a card hole for the joint protrusion 161 to be positioned and disposed on the bottom plate. 3 on. In practice, the arrangement positions of the coupling protrusion 161 and the coupling recess 162 are interchangeable, and are not limited to the examples of the embodiment.

Each of the cushioning structures 15 has a plurality of elastic members 5, one end of which extends away from the bottom plate 3 and has no contact with the corresponding side plates 4. Each of the elastic members 5 has an elastic rod 51 (or an elastic rod) extending away from the bottom plate 3 and elastically swingable, and a bent portion 52 bent at an end of the elastic rod 51 away from the bottom plate 3, bent The fold 52 enhances the structural strength at the top of the elastic rod 51.

The elastic rod 51 of each elastic member 5 is smaller in width near the bent portion 52 than the bottom plate 3, thereby increasing the elasticity of the elastic member 5 near the tip end, and the width from the bottom to the top is gradually reduced (or The design of the circumference is gradually reduced, so that the whole of the elastic rod 51 can be optimally matched between the structural strength and the elasticity, and the elastic abutment effect of the elastic rod 51 can be further improved. Further, the bent portion 52 is formed to face away from the bearing space 110.

In the present embodiment, the elastic member 5 has a rectangular cross section in the direction of the parallel bottom plate 3, and the elastic rod 51 has a surface 511 facing the bearing space 110 and allowing the wafers 8, 8' to abut. Through the surfaces 511, the edges of the wafers 8, 8' are abutted against each other, and the contact areas of the two are large, so that the impact force of the contact can be reduced to prevent the wafers 8, 8' from generating fragments or the surface of the elastic rods 51. 511 causes problems such as damage.

After the buffer structure 15 is assembled to the carrier 11 through the bonding unit 16, the spacing d between the elastic members 5 near the corner 31 is gradually reduced. This design allows the wafer to collide with the surrounding elastic member 5 when it is blown and separated. The position often appears at the corner 31, so that when the pitch of the elastic member 5 near the corner 31 is narrowed or arranged more densely, the contact area of the force is increased, which is advantageous for alleviating the collision problem at the corner of the wafer edge.

It is further explained that when at least one of the elastic members 5 on a certain buffer structure 15 is worn and broken due to use, the buffer structure 15 can be replaced, and it is not necessary to eliminate the entire carrier 11 as in the conventional manner, thereby reducing the cost.

Referring to FIG. 25, a tenth embodiment of the substrate carrier 1 of the present invention, Roughly the same as the ninth embodiment, the difference is that at least two of the plurality of elastic members 5 are connected by a connecting portion 53, wherein the connecting portion 53 is connected between at least two elastic rods 51. The position of the connecting portion 53 is not higher than two-thirds (2/3) of the height h of the elastic rod 51. More preferably, the position of the connecting portion 53 does not exceed the range of 1/2 to 2/3 of the height h of the elastic rod 51. The height h described in this embodiment is calculated from the top end of the elastic rod 51 from the bottom end of the bottom plate 3 to the top end of the elastic rod 51. The tip end of the elastic rod 51 referred to herein has the same meaning as the end referred to herein before and after.

The design of the connection between the elastic rods 51 through the connecting portion 53 allows the elastic member 5 of the first structure 2 produced by injection molding to be restrained in the mold or in the cooling process after the demolding to be vertical. The result of standing up, avoiding the problem of forward leaning derived from the traditional way. At the same time, the design of the surface 511 of the plurality of elastic rods 51 is located on the same plane, so that the force of the wafer when the abutting force is more evenly dispersed, and the fragment of the single point force or the force area is too small. problem. Further, the position of the connecting portion 53 is not too high, and when the upper wafer is separated and floated and touches the surrounding elastic rod 51, if the position of the connecting portion 53 is too high, the originally good elastic swing effect is affected. Therefore, the effect of the original wafer for cushioning is lowered, and therefore, the position of the connecting portion 53 is preferably 2/3 or less of the height h.

Further, if the position where the connecting portion 53 is provided is too low to approach the bottom plate 3, the tilt problem of the conventional design may occur, because the overall proportion of the elastic bar 51 located above the connecting portion 53 is too high, and the tilt is also easy to occur. The problem of deformation, therefore, the position of the connecting portion 53 should not be lower than the elasticity The bar 51 has a height h of 1/2. However, if another connecting portion 53 is provided above the connecting portion 53 near the bottom plate 3, the mutual restraint between the two can avoid the problem of tilting as discussed herein.

Referring to Fig. 26, the eleventh embodiment of the substrate carrier 1 of the present invention is substantially the same as the ninth embodiment, and the difference is that the carrier 11 includes a plurality of first structures 2 which can be combined or combined with each other. Each of the first structures 2 includes a bottom wall 201 and a side wall 202. After the plurality of first structures 2 are assembled, the bottom wall 201 of each of the first structures 2 constitutes the bottom plate 3, and each of the first structures The side walls 202 of the second side frame 2 constitute the side plates 4, and the plurality of buffer structures 15 are detachably positioned and mounted on the bottom wall 201 of each of the first structures 2 through the plurality of combining units 16.

Each of the side walls 202 of the first structure 2 and the outer casing 12 are respectively positioned by a first positioning unit 13 . In this embodiment, the first convex portion 131 of each of the first positioning units 13 is disposed on the side wall 202; the first concave portion 132 of each of the first positioning units 13 can be positioned by the first convex portion 131, and It is disposed on the outer casing 12.

The bottom wall 201 of each of the first structures 2 and the outer casing 12 are respectively positioned by a second positioning unit 14. In this embodiment, the second convex portion 141 of each of the second positioning units 14 is disposed on the bottom wall 201; the second concave portion 142 of each of the second positioning units 14 can be positioned by the second convex portion 141. And disposed on the outer casing 12.

In this embodiment, the carrier 11 is designed as an innovative design combining a plurality of first structures 2, and the first structure 2 can be replaced when a certain first structure 2 is worn, without eliminating the entire carrier 11 as in the conventional manner. Can drop low cost. The carrier 11 of the present invention can be divided into several first structures 2, and the manner and number of divisions thereof are not limited to the above examples of the embodiments, and the spirit and purpose of the present invention are within the scope of the present invention.

Referring to Fig. 27, a twelfth embodiment of the substrate carrier 1 of the present invention is substantially the same as the third embodiment (see Fig. 11), and the difference between the two is that the carrier 11 is integrally formed.

Referring to Fig. 28, a thirteenth embodiment of the substrate carrier 1 of the present invention is substantially the same as the fourth embodiment (see Fig. 12), and the difference between the two is that the carrier 11 is integrally formed.

Referring to Fig. 29, a fourteenth embodiment of the substrate carrier 1 of the present invention is substantially the same as the fifth embodiment (see Fig. 13), and the difference between the two is that the carrier 11 is integrally formed.

The various structures or components in the different embodiments of the present invention may be used and matched to each other, and are not limited to the embodiments listed in the present invention and their corresponding drawings. Therefore, it is difficult to enumerate all the embodiments in detail. In summary, as long as the features and designs mentioned in the specification and the drawings of the present invention can be combined in different forms, the same object of the present invention is achieved. effect.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

1‧‧‧Substrate carrier

11‧‧‧ Carrier

110‧‧‧ Carrying space

12‧‧‧ Shell

120‧‧‧ accommodating space

13‧‧‧First positioning unit

131‧‧‧First convex

132‧‧‧First recess

14‧‧‧Second positioning unit

141‧‧‧second convex

142‧‧‧Second recess

2‧‧‧ first structure

3‧‧‧floor

4‧‧‧ side panels

5‧‧‧Flexible components

51‧‧‧Flex rod

52‧‧‧Bend

Claims (19)

A substrate carrier comprising a carrier, the carrier comprising a plurality of first structures that can be assembled with each other; each of the first structures comprises a bottom plate and a side plate, wherein the bottom plate is provided with a plurality of elastic elements adjacent to the side plates; The first structures can be assembled and arranged by the plurality of side plates to surround a bearing space relative to the plurality of bottom plates. The substrate carrier of claim 1, further comprising a housing having an accommodating space, the plurality of first structures being disposed in the accommodating space and respectively positioned on the housing. The substrate carrier of claim 2, wherein each of the side panels and the outer casing are positioned by at least one first positioning unit. The substrate carrier of claim 1, further comprising a housing, wherein the plurality of first structures are disposed on the housing, and each of the bottom plates and the housing is positioned by at least one second positioning unit. The substrate carrier according to any one of claims 1 to 4, wherein at least two of the plurality of elastic members are connected by a connecting portion whose position is not higher than a height of the plurality of elastic members 2/3. The substrate carrier according to claim 5, wherein the position of the connecting portion does not exceed a range of 1/2 to 2/3 of the height of the plurality of elastic members. The substrate carrier of claim 5, wherein the connecting portion extends to the bottom plate. The substrate carrier of claim 7, wherein the connecting portion has at least one through hole. A substrate carrier comprising: a carrier includes a bottom plate and a plurality of side plates, wherein the plurality of side plates surround a bearing space with respect to the bottom plate; and a plurality of buffer structures, each side plate is provided with at least one of the plurality of buffer structures, and each buffering The structure has a plurality of elastic members, one end of the plurality of elastic members contacting the bottom plate, and the other end of each of the elastic members is detachably positioned and mounted by a joint unit between the tops of the side plates, wherein each of the elastic members is A resilient spring is formed adjacent to the bonding unit. The substrate carrier of claim 9, wherein each of the elastic springs is integrally formed with each other. The substrate carrier according to claim 9 or 10, wherein at least two of the plurality of elastic members are connected by a connecting portion, and the position of the connecting portion is not higher than 2/3 of the height of the plurality of elastic members. . The substrate carrier of claim 9 or 10, wherein the carrier is composed of a plurality of first structures that are mutually configurable. A substrate carrier comprising: a carrier comprising a bottom plate and a plurality of side plates, wherein the plurality of side plates surround a bearing space with respect to the bottom plate; and a plurality of buffer structures each having a plurality of elastic members, the number The buffer structure is disposed on the bottom plate and correspondingly adjacent to the plurality of side plates, and the plurality of buffer structures and the bottom plate are detachably positioned and mounted by a joint unit, and one end of the plurality of elastic members of each buffer structure Each of the side plates extends away from the bottom plate and has no contact. The substrate carrier of claim 13, wherein the plurality of elastic components At least two of them are connected by a joint, the position of which is not higher than 2/3 of the height of the plurality of elastic members. The substrate carrier of claim 13 or 14, wherein the carrier is composed of a plurality of first structures that are mutually configurable. A substrate carrier comprising: a carrier comprising a bottom plate and a plurality of side plates, wherein the plurality of side plates surround a bearing space with respect to the bottom plate; and a plurality of buffer structures, each of the buffer structures being disposed on the bottom plate and adjacent to each The side plate, and each of the buffer structures has a plurality of elastic members, one end of the plurality of elastic members extending away from the bottom plate; wherein at least two of the plurality of elastic members are connected by a connecting portion, the position of the connecting portion is not It is higher than 2/3 of the height of the plurality of elastic members. The substrate carrier according to claim 16, wherein the position of the connecting portion does not exceed a range of 1/2 to 2/3 of the height of the plurality of elastic members. The substrate carrier of claim 16, wherein the connecting portion extends to the bottom plate. The substrate carrier of any one of claims 16 to 18, wherein the connecting portion has at least one through hole.