TW201627212A - Wafer cassette - Google Patents

Wafer cassette Download PDF

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Publication number
TW201627212A
TW201627212A TW104102525A TW104102525A TW201627212A TW 201627212 A TW201627212 A TW 201627212A TW 104102525 A TW104102525 A TW 104102525A TW 104102525 A TW104102525 A TW 104102525A TW 201627212 A TW201627212 A TW 201627212A
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Taiwan
Prior art keywords
plate
elastic
structures
carrier
substrate carrier
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TW104102525A
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Chinese (zh)
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TWI545067B (en
Inventor
李天安
歐陽逸潔
巫智傑
吳姿慧
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茂迪股份有限公司
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Priority to TW104102525A priority Critical patent/TWI545067B/en
Publication of TW201627212A publication Critical patent/TW201627212A/en
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Publication of TWI545067B publication Critical patent/TWI545067B/en

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Abstract

A wafer cassette of the present invention comprises a loading body including a plurality of first structures. Each of the first structures includes a base plate and a side plate. A plurality of elastic elements are separately disposed on each of the base plates. The first structures are configured to can be assembled into an assembled state. In the assembled state, the base plates and the side plates cooperatively define a loading space. Another wafer cassette of the present invention comprises a loading body and a plurality of buffer structures. The loading body includes a base plate and a plurality of side plates. The base plate and the side plates cooperatively define a loading space. Each of the buffer structures has a plurality of elastic elements. The buffer structures are detachably installed on the base plate via a connecting unit. The design of the present invention can facilitate the process of disassembling and assembling the first structures or the buffer structures. When one of the first structures and the buffer structures is broken, the broken one can be replaced without disassembling the entire wafer cassette. Hence, the present invention need not to replace the entire loading body, thereby reducing the manufacturing and equipment costs.

Description

基板載具 Substrate carrier
本發明是有關於一種基板載具,特別是指一種太陽能電池的製造過程中用於裝載晶片的基板載具。 The present invention relates to a substrate carrier, and more particularly to a substrate carrier for loading a wafer during the manufacture of a solar cell.
參閱圖1、2,以往用於裝載晶片900的基板載具91通常包含一個基座911、一個由該基座911界定且供晶片900容置的承裝空間912,及數個與基座911一體成型並設於其底部邊緣的緩衝件913,於緩衝件913靠抵晶片900時可彈性擺動以避免晶片900因碰撞而破碎。 Referring to Figures 1 and 2, a substrate carrier 91 conventionally used for loading a wafer 900 generally includes a susceptor 911, a receiving space 912 defined by the pedestal 911 for receiving the wafer 900, and a plurality of bases 911. The buffer member 913 integrally formed and disposed at the bottom edge thereof is elastically swingable when the cushioning member 913 abuts against the wafer 900 to prevent the wafer 900 from being broken by collision.
基板載具91係用於太陽能電池製程中的上料機,上料機為搬運晶片900的機器,其包含兩個朝向承裝空間912的吹嘴92、一個可上下移動的抬升裝置93,及一個搬運裝置94。 The substrate carrier 91 is used for a loading machine in a solar cell process, and the loading machine is a machine for transporting a wafer 900, which comprises two blowing nozzles 92 facing the receiving space 912, a lifting device 93 movable up and down, and A handling device 94.
使用時,搬運裝置94的吸力可使上方的晶片900’上移,但上方的幾個晶片900’常因靜電而彼此吸附。因此,透過吹嘴92朝上方幾個晶片900’吹氣,使吸附的晶片900’彼此分離,以便搬運裝置94僅吸走最上方的一片。但,晶片900’上移時常因氣體擾流而左右晃動碰觸到基座911側壁,此時可透過緩衝件913的彈性擺動 來吸收衝擊力,以減緩晶片900’的晃動並避免因碰撞而破片。 In use, the suction force of the conveying device 94 causes the upper wafer 900' to move up, but the upper plurality of wafers 900' are often attracted to each other by static electricity. Therefore, the blown nozzles 92 are blown toward the upper wafers 900' to separate the adsorbed wafers 900' from each other, so that the transporting device 94 sucks only the uppermost one. However, when the wafer 900' is moved up, it is often swayed by the gas to disturb the side wall of the pedestal 911, and the elastic swing of the buffer member 913 can be transmitted. The impact force is absorbed to slow the shaking of the wafer 900' and to avoid fragmentation due to collision.
此外,因晶片900’上移且碰觸基座911側壁時,晶片900’的邊緣易與緩衝件913產生摩擦,進而使緩衝件913的表面產生磨損甚至斷裂,此磨損或斷裂處易對晶片900’產生傷害甚至破片,而為避免晶片900的損傷,最好是發現緩衝件913有磨損或是斷裂時,即進行整個基板載具91的更換,但如此將有成本增加的問題。 In addition, when the wafer 900' is moved up and touches the sidewall of the pedestal 911, the edge of the wafer 900' is easily rubbed against the buffer member 913, thereby causing wear or even breakage of the surface of the buffer member 913, which is easy to be worn on the wafer. The 900' is damaged or even fragmented, and in order to avoid damage to the wafer 900, it is preferable to replace the entire substrate carrier 91 when the cushion member 913 is worn or broken, but there is a problem of an increase in cost.
此外,基板載具91是以一體射出成型的方式來製作基座911與緩衝件913,但在射出後的冷卻過程中,因緩衝件913是細長條的形狀,故容易有彎曲變形的情形,如圖3所示,其中越靠近基座911側面中央處的緩衝件913的前傾變形越明顯,這是因緩衝件913為細長形且僅單一端連接於基座911底部的邊緣,致使脫模後不易使緩衝件913垂直排列,另外也因為節省材料的成本,基座911底部常製作的較薄(例如2mm),如此更使得這些細長形的緩衝件913其底端的支撐性不足,導致傾斜變形的情況更加嚴重。 Further, the substrate carrier 91 is formed by integrally injection molding the susceptor 911 and the cushioning member 913. However, since the cushioning member 913 is in the shape of an elongated strip during cooling after the ejection, the bending member is likely to be bent and deformed. As shown in FIG. 3, the forward tilting deformation of the cushioning member 913 closer to the center of the side surface of the base 911 is more obvious, because the cushioning member 913 is elongated and only a single end is connected to the edge of the bottom of the base 911, so that The buffer member 913 is not easily arranged vertically after the mold, and because the material cost is saved, the bottom of the base 911 is often made thinner (for example, 2 mm), so that the support of the elongated buffer member 913 at the bottom end is insufficient, resulting in insufficient support. The situation of tilt deformation is more serious.
由此可知,因緩衝件913有前傾的問題,將使晶片900的側邊無法抵靠在每一根緩衝件913上來分散受力,而出現僅是抵靠在傾斜最嚴重的那根緩衝件913,使晶片900邊緣易因受力不均而破裂。同時,緩衝件913的前傾問題也會使操作人員在放入和取出晶片時,更容易碰到傾斜的緩衝件913而有不便甚至破片的問題。 Therefore, it can be seen that the buffer member 913 has a problem of leaning forward, so that the side of the wafer 900 cannot be biased against each of the buffer members 913 to disperse the force, and only the cushion that is most severely inclined is present. The piece 913 causes the edge of the wafer 900 to be easily broken due to uneven force. At the same time, the forward tilting problem of the cushioning member 913 also makes it easier for the operator to encounter the inclined cushioning member 913 when inserting and removing the wafer, which is inconvenient or even fragmented.
因此,本發明之目的,在提供一種可單獨拆換局部結構而降低設備成本的基板載具。 Accordingly, it is an object of the present invention to provide a substrate carrier that can be individually replaced with a partial structure to reduce equipment costs.
於是,本發明第一種基板載具,包含一載體。該載體包括數個可相互組配的第一結構;各該第一結構包括一底板和一側板,該底板上靠近該側板處設有數個彈性元件;該數個第一結構可被組配定位並由該數個側板相對於該數個底板圍繞出一承載空間。 Thus, the first substrate carrier of the present invention comprises a carrier. The carrier includes a plurality of first structures that can be assembled with each other; each of the first structures includes a bottom plate and a side plate, and the bottom plate is provided with a plurality of elastic members adjacent to the side plates; the plurality of first structures can be assembled and positioned And a plurality of side plates surround a bearing space relative to the plurality of bottom plates.
其功效在於:將載體區分成數個第一結構的設計,當其中一個第一結構的彈性元件磨損、斷裂時,只需更換這個第一結構無需淘汰整個載體,可降低成本。 The utility model has the advantages that the carrier is divided into the designs of the plurality of first structures. When the elastic component of one of the first structures is worn and broken, only the first structure needs to be replaced without eliminating the entire carrier, thereby reducing the cost.
本發明第二種基板載具,包含一載體以及數個緩衝結構。該載體包括一底板和數個側板,該數個側板相對於該底板圍繞出一承載空間。每一側板設有該數個緩衝結構中之至少一個,每一緩衝結構有數個彈性元件,該數個彈性元件的一端接觸該底板,各該彈性元件的另一端與各該側板的頂部之間以一結合單元可拆離地定位安裝,各該彈性元件於靠近該結合單元處彎折形成一彈性簧片。 The second substrate carrier of the present invention comprises a carrier and a plurality of buffer structures. The carrier includes a bottom plate and a plurality of side plates, and the plurality of side plates surround a bearing space relative to the bottom plate. Each of the side plates is provided with at least one of the plurality of buffer structures, each of the buffer structures having a plurality of elastic members, one end of the plurality of elastic members contacting the bottom plate, and the other end of each of the elastic members is between the top of each of the side plates and the top of each of the side plates The detachable positioning and mounting are performed by a combination unit, and each of the elastic members is bent to form an elastic reed near the coupling unit.
其功效在於:各該彈性元件的另一端與各該側板的頂部之間以一結合單元可拆離地定位安裝,當其中一個緩衝結構上的彈性元件磨損、斷裂時,只需更換這個緩衝結構無需淘汰整個基板載具,可降低成本。 The utility model has the advantages that the other end of each of the elastic members and the top of each of the side plates are detachably positioned and assembled by a joint unit, and when the elastic member of one of the buffer structures is worn and broken, only the buffer structure needs to be replaced. Cost reduction can be achieved without eliminating the entire substrate carrier.
本發明第三種基板載具,包含一載體及數個緩衝結構。該載體包含一底板和數個側板,該數個側板相對 於該底板圍出一承載空間。每一緩衝結構有數個彈性元件,該數個緩衝結構設於該底板上並對應靠近該數個側板,該數個緩衝結構與該底板間以一結合單元可拆離地定位安裝,該數個彈性元件一端遠離底板且無接觸對應的側板。 The third substrate carrier of the present invention comprises a carrier and a plurality of buffer structures. The carrier comprises a bottom plate and a plurality of side plates, the plurality of side plates being opposite A bearing space is enclosed in the bottom plate. Each of the buffer structures has a plurality of elastic elements, and the plurality of buffer structures are disposed on the bottom plate and corresponding to the plurality of side plates. The plurality of buffer structures and the bottom plate are detachably positioned and mounted by a joint unit, and the plurality of buffer structures are detachably disposed. One end of the elastic element is away from the bottom plate and does not contact the corresponding side plate.
其功效在於:各該彈性元件的另一端與該底板之間以一結合單元可拆離地定位安裝,當其中一個緩衝結構的彈性元件磨損、斷裂時,只需更換這個緩衝結構無需淘汰整個基板載具,可降低成本。 The utility model has the advantages that the other end of each elastic element and the bottom plate are detachably positioned and mounted by a joint unit. When the elastic element of one of the buffer structures is worn and broken, the buffer structure only needs to be replaced without eliminating the entire substrate. Vehicles can reduce costs.
本發明之目的,即在提供一種結構強度佳且可降低破片率的基板載具。 It is an object of the present invention to provide a substrate carrier which is structurally strong and which can reduce the chipping rate.
本發明的第四種基板載具,包含一載體及數個緩衝結構。該載體包含一底板和數個側板,該數個側板相對於該底板圍出一承載空間。各該緩衝結構設於該底板上並靠近各該側板,各該緩衝結構有數個彈性元件,該數個彈性元件一端遠離該底板延伸。該數個彈性元件中之至少兩個以一連接部連接,連接部的位置不高於該數個彈性元件的高度的2/3。 A fourth substrate carrier of the present invention comprises a carrier and a plurality of buffer structures. The carrier comprises a bottom plate and a plurality of side plates, and the plurality of side plates enclose a bearing space relative to the bottom plate. Each of the buffer structures is disposed on the bottom plate and adjacent to each of the side plates. Each of the buffer structures has a plurality of elastic members, and one of the plurality of elastic members extends away from the bottom plate. At least two of the plurality of elastic members are connected by a connecting portion, and the position of the connecting portion is not higher than 2/3 of the height of the plurality of elastic members.
其功效在於:該數個彈性元件中之至少兩個以一連接部連接,以避免彈性元件的前傾並形成共平面排列,從而使晶片側邊均勻抵靠於每根彈性元件而均勻受力,以降低晶片的破片率並便於晶片的拿取或置入。 The function is that at least two of the plurality of elastic members are connected by a connecting portion to avoid the forward tilting of the elastic members and form a coplanar arrangement, so that the sides of the wafer are evenly pressed against each elastic member uniformly. To reduce the fragmentation rate of the wafer and facilitate the take-up or placement of the wafer.
1‧‧‧基板載具 1‧‧‧Substrate carrier
11‧‧‧載體 11‧‧‧ Carrier
110‧‧‧承載空間 110‧‧‧ Carrying space
12‧‧‧外殼 12‧‧‧ Shell
120‧‧‧容置空間 120‧‧‧ accommodating space
13‧‧‧第一定位單元 13‧‧‧First positioning unit
131‧‧‧第一凸部 131‧‧‧First convex
132‧‧‧第一凹部 132‧‧‧First recess
14‧‧‧第二定位單元 14‧‧‧Second positioning unit
141‧‧‧第二凸部 141‧‧‧second convex
142‧‧‧第二凹部 142‧‧‧Second recess
15‧‧‧緩衝結構 15‧‧‧buffer structure
151‧‧‧彈性簧片 151‧‧‧elastic reed
16‧‧‧結合單元 16‧‧‧Combination unit
161‧‧‧結合凸部 161‧‧‧Combined convex
162‧‧‧結合凹部 162‧‧‧ combined recess
2‧‧‧第一結構 2‧‧‧ first structure
201‧‧‧底壁 201‧‧‧ bottom wall
202‧‧‧側壁 202‧‧‧ side wall
3‧‧‧底板 3‧‧‧floor
31‧‧‧角落 31‧‧‧ corner
4‧‧‧側板 4‧‧‧ side panels
5‧‧‧彈性元件 5‧‧‧Flexible components
51‧‧‧彈性棒 51‧‧‧Flex rod
511‧‧‧表面 511‧‧‧ surface
52‧‧‧彎折部 52‧‧‧Bend
53‧‧‧連接部 53‧‧‧Connecting Department
530‧‧‧貫穿孔 530‧‧‧through holes
71‧‧‧吹嘴 71‧‧‧Blowing mouth
72‧‧‧抬升裝置 72‧‧‧lifting device
73‧‧‧搬運裝置 73‧‧‧Transportation device
8、8’‧‧‧晶片 8, 8'‧‧‧ wafer
d‧‧‧間距 D‧‧‧ spacing
h‧‧‧高度 H‧‧‧height
本發明之其他的特徵及功效,將於參照圖式的 實施方式中清楚地呈現,其中:圖1是以往基板載具之立體圖;圖2是圖1基板載具承載數個晶片的使用狀態剖視圖;圖3是圖1的基板載具之俯視圖;圖4是本發明基板載具之第一實施例之立體圖;圖5是第一實施例之立體分解圖;圖6是第一實施例之俯視圖;圖7是第一實施例之圖6的A-A位置的局部剖視圖;圖8是第一實施例之圖6的B-B位置的使用狀態剖視圖;圖9是本發明基板載具之第二實施例之俯視圖;圖10是第二實施例之載體之立體分解圖;圖11是本發明基板載具之第三實施例第一結構之立體圖;圖12是本發明基板載具之第四實施例第一結構之立體圖;圖13是本發明基板載具之第五實施例第一結構之立體圖;圖14是本發明基板載具之第六實施例之立體分解圖;圖15是第六實施例之局部的立體分解圖;圖16是第六實施例之俯視圖;圖17是第六實施例之圖16的C-C位置的局部剖視圖;圖18是第六實施例之圖16的D-D位置使用狀態剖視圖;圖19是本發明基板載具之第七實施例局部的立體分解圖;圖20是本發明基板載具之第八實施例之局部立體分解圖;圖21是本發明基板載具之第九實施例之立體分解圖;圖22是第九實施例之不完整的立體分解圖;圖23是第九實施例之俯視圖; 圖24是第九實施例之圖23的E-E位置使用狀態剖視圖;圖25是本發明基板載具之第十實施例之局部立體分解圖;圖26是本發明基板載具之第十一實施例局部立體分解圖;圖27是本發明基板載具之第十二實施例之立體分解圖;圖28是本發明基板載具之第十三實施例之立體分解圖;及圖29是本發明基板載具之第十四實施例之立體分解圖。 Other features and effects of the present invention will be described with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a conventional substrate carrier; FIG. 2 is a cross-sectional view showing a state in which a substrate carrier of FIG. 1 is loaded with a plurality of wafers; FIG. 3 is a plan view of the substrate carrier of FIG. FIG. 5 is a perspective view of the first embodiment; FIG. 6 is a plan view of the first embodiment; FIG. 7 is a top view of the first embodiment of FIG. Figure 8 is a cross-sectional view showing the state of use of the BB position of Figure 6 of the first embodiment; Figure 9 is a plan view of the second embodiment of the substrate carrier of the present invention; and Figure 10 is an exploded perspective view of the carrier of the second embodiment. Figure 11 is a perspective view showing a first structure of a third embodiment of the substrate carrier of the present invention; Figure 12 is a perspective view showing a first structure of a fourth embodiment of the substrate carrier of the present invention; and Figure 13 is a fifth embodiment of the substrate carrier of the present invention; Figure 14 is a perspective exploded view of a sixth embodiment of the substrate carrier of the present invention; Figure 15 is an exploded perspective view of a portion of the sixth embodiment; Figure 16 is a plan view of the sixth embodiment; Figure 17 is the CC position of Figure 16 of the sixth embodiment. Figure 18 is a cross-sectional view showing the DD position of Figure 6 of the sixth embodiment; Figure 19 is a partially exploded perspective view of the seventh embodiment of the substrate carrier of the present invention; and Figure 20 is the substrate carrier of the present invention. FIG. 21 is an exploded perspective view showing a ninth embodiment of the substrate carrier of the present invention; FIG. 22 is an exploded perspective view of the ninth embodiment; FIG. 23 is an exploded perspective view of the ninth embodiment; Top view Figure 24 is a cross-sectional view showing the EE position of Figure 23 of the ninth embodiment; Figure 25 is a partially exploded perspective view of the tenth embodiment of the substrate carrier of the present invention; and Figure 26 is an eleventh embodiment of the substrate carrier of the present invention. Figure 27 is an exploded perspective view of a twelfth embodiment of the substrate carrier of the present invention; Figure 28 is an exploded perspective view of a thirteenth embodiment of the substrate carrier of the present invention; and Figure 29 is a substrate of the present invention; An exploded perspective view of a fourteenth embodiment of the carrier.
在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。 Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.
參閱圖4、5、6,本發明基板載具1之一第一實施例,包含:一載體11、一外殼12、至少一第一定位單元13,以及至少一第二定位單元14。 Referring to FIGS. 4, 5 and 6, a first embodiment of the substrate carrier 1 of the present invention comprises: a carrier 11, a housing 12, at least one first positioning unit 13, and at least one second positioning unit 14.
該載體11包括數個可相互組配或稱組合的第一結構2。各該第一結構2包括一底板3和一側板4,該底板3上靠近該側板4處設有數個彈性元件5。該數個第一結構2可被組配定位並由該數個側板4相對於該數個底板3圍繞出一承載空間110,而該數個第一結構2的彈性元件5是圍繞地設置於該承載空間110內。 The carrier 11 comprises a plurality of first structures 2 which can be combined or combined with one another. Each of the first structures 2 includes a bottom plate 3 and a side plate 4, and the bottom plate 3 is provided with a plurality of elastic members 5 adjacent to the side plates 4. The plurality of first structures 2 can be assembled and arranged by the plurality of side plates 4 with respect to the plurality of bottom plates 3, and the elastic elements 5 of the plurality of first structures 2 are disposed around The load space 110 is inside.
該外殼12具有一容置空間120,該數個第一結構2設置於該容置空間120並分別定位於該外殼12內,其中,於實施上,該外殼12和第一結構2為矩形或類似矩形,或是可為正方形。而且於進一步的實施上,係可將容置空間120區分為四等分並將相對應的四個第一結構2組合於該外殼12的容置空間120中。 The housing 12 has an accommodating space 120. The plurality of first structures 2 are disposed in the accommodating space 120 and are respectively positioned in the housing 12, wherein, in implementation, the housing 12 and the first structure 2 are rectangular or Similar to a rectangle, or it can be a square. Moreover, in a further implementation, the accommodating space 120 can be divided into four equal parts and the corresponding four first structures 2 can be combined in the accommodating space 120 of the outer casing 12.
參閱圖5、6、7,各該側板4與該外殼12之間以至少一第一定位單元13來定位。每一第一定位單元13包括一設於該側板4與該外殼12的其中之一個上的第一凸部131,及一個設置於該側板4與該外殼12的其中之另一個上且可拆離地與該第一凸部131組裝的第一凹部132。 Referring to FIGS. 5, 6, and 7, each of the side panels 4 and the outer casing 12 is positioned by at least one first positioning unit 13. Each of the first positioning units 13 includes a first protrusion 131 disposed on one of the side panel 4 and the outer casing 12, and a detachable one disposed on the other side of the side panel 4 and the outer casing 12. The first recess 132 is assembled from the first convex portion 131 from the ground.
在本實施例中,第一凸部131為凸塊並設於側板4上;第一凹部132為卡孔而可供第一凸部131插卡定位並設於該外殼12上。在實施上,只要第一凸部131與第一凹部132能夠可拆離地相互結合即可,不需限制第一凸部131與第一凹部132的形式。另外,第一凸部131與第一凹部132的設置位置可互換,不限於本實施例的舉例。 In the embodiment, the first convex portion 131 is a bump and is disposed on the side plate 4; the first concave portion 132 is a hole for the first convex portion 131 to be positioned and disposed on the outer casing 12. In practice, as long as the first convex portion 131 and the first concave portion 132 can be detachably coupled to each other, the form of the first convex portion 131 and the first concave portion 132 need not be limited. In addition, the positions at which the first convex portion 131 and the first concave portion 132 are disposed are interchangeable, and are not limited to the examples of the embodiment.
底板3與外殼12間以至少一第二定位單元14定位。每一第二定位單元14包括一設於底板3與外殼12其中一個上的第二凸部141,及一設於底板3與外殼12其中另一個上且可拆離地與該第二凸部141組裝的第二凹部142。 The bottom plate 3 and the outer casing 12 are positioned by at least one second positioning unit 14. Each of the second positioning units 14 includes a second protrusion 141 disposed on one of the bottom plate 3 and the outer casing 12, and is disposed on the other of the bottom plate 3 and the outer casing 12 and detachably and the second convex portion 141 assembled second recess 142.
在本實施例中,第二凸部141為凸塊並設於底板3上;第二凹部142為卡孔而供第二凸部141插卡定位,並設於該外殼12上。在實施上,只要第二凸部141與第二凹部142能夠可拆離地相互結合即可,不需限制第二凸部141與第二凹部142的形式。另外,第二凸部141與第二凹部142的設置位置可互換,不限於本實施例的舉例。 In this embodiment, the second convex portion 141 is a bump and is disposed on the bottom plate 3; the second concave portion 142 is a card hole for the second convex portion 141 to be inserted into the card, and is disposed on the outer casing 12. In practice, as long as the second convex portion 141 and the second concave portion 142 can be detachably coupled to each other, the form of the second convex portion 141 and the second concave portion 142 need not be limited. In addition, the positions at which the second convex portion 141 and the second concave portion 142 are disposed are interchangeable, and are not limited to the examples of the embodiment.
在本實施例中,該載體11雖是透過該數個第一定位單元13或/及該數個第二定位單元14而組裝固定於該 外殼12的容置空間120內,不過在實施上,載體11和外殼12間也可採緊配合方式固定,所以載體11組裝固定於外殼12內的手段並不限於本實施例所揭露的態樣。 In this embodiment, the carrier 11 is assembled and fixed to the carrier 11 through the plurality of first positioning units 13 or/and the plurality of second positioning units 14 The housing 12 is disposed in the accommodating space 120. However, the carrier 11 and the housing 12 can be fixed in a tight fit manner. Therefore, the means for assembling and fixing the carrier 11 in the housing 12 is not limited to the embodiment disclosed in this embodiment. .
每一彈性元件5皆具有一個朝遠離該底板3方向延伸且可彈性擺動的彈性棒51(或稱彈性桿),以及一個位於彈性棒51遠離底板3的一端彎曲形成的彎折部52。在本實施例中,每一彈性元件5的彈性棒51與彎折部52整體呈L形。彈性棒51與底板3可為一體成型連接,彈性棒51於平行底板3方向的斷面呈矩形。 Each of the elastic members 5 has an elastic rod 51 (or an elastic rod) extending away from the bottom plate 3 and elastically swingable, and a bent portion 52 bent at an end of the elastic rod 51 away from the bottom plate 3. In the present embodiment, the elastic rod 51 of each elastic member 5 and the bent portion 52 are L-shaped as a whole. The elastic rod 51 and the bottom plate 3 may be integrally formed, and the elastic rod 51 has a rectangular cross section in the direction parallel to the bottom plate 3.
該數個第一結構2相互組配而構成該載體11後,如圖6俯視圖所示,各該第一結構2的底板3相互配合構成一個略呈四邊形的板體,該板體具有四個角落31,越靠近角落31處的彈性元件5間之間距d為漸減,此設計可供晶片受吹拂而分離漂浮時,晶片與周圍彈性元件5的碰撞位置常出現在角落31處,因此將靠近角落31處的彈性元件5的間距縮小或排列更為密集時,增加受力的接觸面積,有利於緩和晶片邊緣轉角處的碰撞問題。 After the plurality of first structures 2 are combined to form the carrier 11, as shown in the top view of FIG. 6, the bottom plates 3 of the first structures 2 cooperate to form a substantially quadrangular plate body having four plates. In the corner 31, the distance d between the elastic members 5 near the corner 31 is gradually reduced. When the wafer is blown and separated and floated, the collision position of the wafer with the surrounding elastic member 5 often appears at the corner 31, so that it is close. When the pitch of the elastic members 5 at the corners 31 is narrowed or arranged more densely, the contact area of the force is increased, which is advantageous for alleviating the collision problem at the corners of the edge of the wafer.
參閱圖4、7、8,本實施例在使用上,該基板載具1的承載空間110用於容裝數個晶片8、8’,基板載具1置放於一個上料機上,上料機為太陽能電池製造過程用於搬運晶片8、8’的機器,且上料機包含兩個分別可噴出氣體的吹嘴71、一個可上下移動地穿設該基板載具1且可使晶片8上升的抬升裝置72,以及一個可吸取晶片8、8’並將晶片8、8’放置於一個輸送帶(圖未示)上的搬運裝置 73。其中,該抬升裝置72使晶片8位於兩個吹嘴71的高度,並透過吹嘴71吹氣使上方的晶片8’彼此分離,再以搬運裝置73吸取最上方的晶片8’以完成取件的動作。 Referring to Figures 4, 7, and 8, in this embodiment, the carrying space 110 of the substrate carrier 1 is used to accommodate a plurality of wafers 8, 8', and the substrate carrier 1 is placed on a loading machine. The material machine is a machine for transporting the wafers 8, 8' in the solar cell manufacturing process, and the loading machine comprises two nozzles 71 respectively for ejecting gas, one of which can be driven up and down to the substrate carrier 1 and can be used for the wafer 8 rising lifting device 72, and a handling device for absorbing the wafers 8, 8' and placing the wafers 8, 8' on a conveyor belt (not shown) 73. Wherein, the lifting device 72 positions the wafer 8 at the height of the two blowing nozzles 71, and blows the air through the blowing nozzle 71 to separate the upper wafers 8' from each other, and then sucks the uppermost wafer 8' by the conveying device 73 to complete the pickup. Actions.
前述上方的晶片8’因受氣流吹拂而彼此分離時,易因氣體擾流而左右晃動並接觸到周圍的彈性元件5,但長期使用後,若彈性元件5的彈性棒51受到晶片8’邊緣之切削而形成刻痕、凹溝甚至斷裂時,可視耗損的彈性元件5是屬於哪一個第一結構2,再即時替換掉這個有損壞的第一結構2即可,以避免如傳統的方式直接替換掉整個基板載具1而有成本過高之問題。 When the above-mentioned upper wafers 8' are separated from each other by the air blowing, they are easily shaken left and right by the gas turbulence and contact the surrounding elastic members 5, but after long-term use, if the elastic rods 51 of the elastic members 5 are subjected to the edge of the wafer 8' When the cutting forms a score, a groove or even a break, the visually depleted elastic member 5 belongs to which first structure 2, and then the damaged first structure 2 can be replaced immediately, so as to avoid the direct manner as in the conventional manner. The problem of excessive cost is replaced by replacing the entire substrate carrier 1.
另外,在本實施例中,每一彈性元件5的彈性棒51於靠近彎折部52的寬度較靠近底板3的寬度為小,藉此提升彈性元件5鄰近頂端處的彈性。換句話說,透過這種由下而上寬度漸減(或稱周長漸小)的設計,可使彈性棒51的整體在結構強度與彈性之間達到最適當的搭配,從中可再提升彈性棒51的彈性抵接效果。而且上述彎折部52是朝背離該承載空間110方向所形成。 Further, in the present embodiment, the elastic bar 51 of each elastic member 5 is smaller in width near the bent portion 52 than the bottom plate 3, thereby enhancing the elasticity of the elastic member 5 near the tip end. In other words, through the design that the bottom-up width is gradually reduced (or the circumference is gradually smaller), the whole of the elastic rod 51 can be optimally matched between the structural strength and the elasticity, from which the elastic rod can be further raised. 51 elastic abutment effect. Further, the bent portion 52 is formed to face away from the bearing space 110.
另外,於實施上,彈性元件5在其彈性棒51的末端即遠離該底板3處彎曲形成該彎折部52,從而可增強彈性棒51上方處的結構強度,這樣的設計也可與上述的彈性棒51寬度漸減(或稱周長漸小)的設計互相搭配。 In addition, in practice, the elastic member 5 is bent at the end of the elastic rod 51, that is, away from the bottom plate 3 to form the bent portion 52, so that the structural strength above the elastic rod 51 can be enhanced, and the design can also be compared with the above. The design of the elastic rod 51 is gradually reduced in width (or the circumference is gradually smaller).
在本實施例中,彈性棒51與底板3為一體成型。在其他實施方式上,彈性元件5的彈性棒51可採插設方式固定於底板3上。此時,彈性元件5的彈性棒51於平 行該底板3方向的斷面呈非圓形例如矩形的設計為佳。此因若彈性棒51為圓形時,其對應插設的底板3孔洞也需圓形,如此易使彈性棒51於其中產生旋轉,進而使原本欲朝外設置的彎折部52轉而向內,如此將產生取放片之不便甚或導致晶片8、8’之撞擊而破裂。 In the present embodiment, the elastic rod 51 and the bottom plate 3 are integrally formed. In other embodiments, the elastic rod 51 of the elastic member 5 can be fixed to the bottom plate 3 in an inserting manner. At this time, the elastic rod 51 of the elastic member 5 is flat. It is preferable that the cross section in the direction of the bottom plate 3 is a non-circular shape such as a rectangular shape. If the elastic rod 51 is circular, the hole of the bottom plate 3 corresponding to the insertion is also required to be circular, so that the elastic rod 51 is easily rotated therein, thereby turning the bent portion 52 originally intended to be outwardly turned. In this case, the inconvenience of the pick-and-place sheet may be caused or even the impact of the wafers 8, 8' may be broken.
參閱圖6、7、8,在本實施例中,彈性元件5於平行底板3方向的斷面呈矩形,彈性元件5的彈性棒51具有一面向承載空間110且可供晶片8、8’抵靠的表面511,透過這些表面511以面的形式供晶片8、8’邊緣抵靠,兩者接觸面積較大而可減低碰觸衝擊力,以避免晶片8、8’產生破片或彈性棒51的表面511產生損傷等問題。 Referring to Figures 6, 7, and 8, in the present embodiment, the elastic member 5 has a rectangular cross section in the direction of the parallel bottom plate 3, and the elastic rod 51 of the elastic member 5 has a bearing space 110 facing the wafer 8, 8'. The surface 511 on the surface of the wafers 8 and 8' is abutted against the edges of the wafers 8 and 8' through the surfaces 511. The contact area of the wafers is increased to reduce the impact force to prevent the wafers 8, 8' from being broken or elastic. The surface 511 causes problems such as damage.
在本實施例中,靠近角落31處的彈性元件5之間的間距d為漸減,此設計可供晶片8’受吹拂而分離漂浮時,晶片8’與周圍彈性元件5的碰撞位置常出現在角落31處,因此將靠近角落31處的彈性元件5的間距d縮小或排列更為密集時,增加受力的接觸面積,有利於緩和晶片8’邊緣轉角處的碰撞問題。 In the present embodiment, the spacing d between the elastic members 5 near the corners 31 is gradually reduced. This design allows the wafer 8' to be blown and floated apart, and the collision position of the wafer 8' with the surrounding elastic member 5 often occurs. At the corner 31, when the pitch d of the elastic member 5 near the corner 31 is reduced or arranged more densely, the contact area of the force is increased, which is advantageous for alleviating the collision problem at the edge of the edge of the wafer 8'.
參閱圖4、5、8,透過以上的設計,可提高基板載具1的載體11的使用壽命,但若長時間使用下而彈性元件5仍出現磨損、斷裂時,可將彈性元件5損壞的那個第一結構2進行替換,以免因未更換而使晶片8、8’受到彈性元件5的影響而破裂。 4, 5, and 8, through the above design, the service life of the carrier 11 of the substrate carrier 1 can be improved, but if the elastic member 5 is worn or broken for a long time, the elastic member 5 can be damaged. The first structure 2 is replaced so as not to cause the wafers 8, 8' to be broken by the elastic members 5 due to non-replacement.
由上可知,本實施例將該載體11設計成由數個第一結構2組合的創新設計,可在某個第一結構2上的彈 性元件5磨損、斷裂時,更換這個第一結構2即可,無需如傳統方式淘汰整個載體11,可降低成本。 It can be seen from the above that the carrier 11 is designed as an innovative design combining several first structures 2, and can be bombed on a certain first structure 2. When the sexual component 5 is worn and broken, the first structure 2 can be replaced, and it is not necessary to eliminate the entire carrier 11 as in the conventional manner, which can reduce the cost.
參閱圖9、10,本發明基板載具1之第二實施例,其與第一實施例大致相同,本實施例的載體11呈放射狀地區分出數個第一結構2,其與第一實施例的差別在於第一結構2的數量不同。在本實施例中,第一結構2的數量為八個,如此之設計,可供替換時,最少只要替換整個載體11的八分之一的部份即可,比例較低,相對可節省成本。此外於實施上,本發明的載體11可區分成幾個第一結構2,其分割方式與數量並不限於本實施例以上之舉例,只要能符合本發明之精神與目的皆在本案保護範圍內。 Referring to Figures 9 and 10, a second embodiment of the substrate carrier 1 of the present invention is substantially the same as the first embodiment. The carrier 11 of the present embodiment radially divides a plurality of first structures 2, which are first The difference in the embodiment is that the number of the first structures 2 is different. In this embodiment, the number of the first structures 2 is eight, so that when the replacement is made, at least one-eighth of the entire carrier 11 can be replaced, and the ratio is relatively low, which is relatively cost-effective. . In addition, in practice, the carrier 11 of the present invention can be divided into several first structures 2, and the manner and number of divisions thereof are not limited to the above examples, as long as the spirit and purpose of the present invention are within the scope of the present disclosure. .
參閱圖11,本發明基板載具之第三實施例與第一實施例大致相同,兩者的差別在於該數個彈性元件5中之至少兩個以一連接部53連接,其中連接部53是連接於至少兩個彈性棒51之間。連接部53的位置不高於彈性棒51的高度h的三分之二(即2/3)。更佳地,連接部53的位置不超出彈性棒51的高度h的1/2~2/3的範圍外。其中,本實施例所述的高度h,是從底板3的表面起算到彈性棒51的頂端。 Referring to FIG. 11, the third embodiment of the substrate carrier of the present invention is substantially the same as the first embodiment, and the difference is that at least two of the plurality of elastic members 5 are connected by a connecting portion 53, wherein the connecting portion 53 is Connected between at least two elastic rods 51. The position of the connecting portion 53 is not higher than two-thirds (i.e., 2/3) of the height h of the elastic rod 51. More preferably, the position of the connecting portion 53 does not exceed the range of 1/2 to 2/3 of the height h of the elastic rod 51. Here, the height h described in the present embodiment is calculated from the surface of the bottom plate 3 to the tip end of the elastic rod 51.
承上,透過連接部53連接於彈性棒51之間的設計,可讓透過射出成型製作的第一結構2的彈性元件5於模具內或脫模後的冷卻過程中受到拘束而使其呈現垂直挺立的結果,避免傳統方式衍生的前傾問題。同時這樣的設計也可讓數根彈性棒51的表面511皆位於同一平面上, 可令晶片抵靠時的受力更均勻地分散,有效減少因單點受力或受力面積過小時的破片問題。 The design of the connection between the elastic rods 51 through the connecting portion 53 allows the elastic member 5 of the first structure 2 produced by injection molding to be restrained in the mold or in the cooling process after the demolding to be vertical. The result of standing up, avoiding the problem of forward leaning derived from the traditional way. At the same time, such a design can also make the surfaces 511 of the plurality of elastic rods 51 all on the same plane. The force applied when the wafer is abutted can be more evenly dispersed, and the problem of fragmentation due to a single point of force or a small force area is reduced.
另外,上述連接部53的位置也不宜太高,此因上方晶片分離飄浮而碰觸周圍的彈性棒51時,若連接部53的位置過高時,將使得本來良好的彈性擺動效果受到影響,從而使原本供晶片抵靠緩衝的效果降低,因此,連接部53的位置以高度h的2/3或以下為佳。 Further, the position of the connecting portion 53 is not too high, and when the upper wafer is separated and floated and touches the surrounding elastic rod 51, if the position of the connecting portion 53 is too high, the originally good elastic swing effect is affected. Therefore, the effect of the original wafer for cushioning is lowered, and therefore, the position of the connecting portion 53 is preferably 2/3 or less of the height h.
又,若連接部53設置的位置過低而接近底板3時,將可能產生原本傳統設計的傾斜問題,此係因位於連接部53上方的彈性棒51的整體比例過高,從而同樣容易發生傾斜變形的問題,因此,連接部53的位置不宜低於彈性棒51高度h的1/2。但,若靠近底板3處的連接部53的上方仍有設置其他的連接部53時,透過兩者間的相互拘束,則能避免掉此處所談及之傾斜問題。 Further, if the position where the connecting portion 53 is provided is too low to approach the bottom plate 3, the tilt problem of the conventional design may occur, because the overall proportion of the elastic bar 51 located above the connecting portion 53 is too high, so that the tilt is also easy to occur. The problem of deformation, therefore, the position of the connecting portion 53 is not preferably lower than 1/2 of the height h of the elastic rod 51. However, if another connecting portion 53 is provided above the connecting portion 53 near the bottom plate 3, the mutual restraint between the two can avoid the problem of tilting as discussed herein.
參閱圖12,本發明基板載具之第四實施例,與該第三實施例大致相同,該數個彈性元件5中之至少兩個以一連接部53連接。兩者的差別在於連接部53延伸連接到底板3處,其中係呈現X形。 Referring to Fig. 12, a fourth embodiment of the substrate carrier of the present invention is substantially the same as the third embodiment, and at least two of the plurality of elastic members 5 are connected by a connecting portion 53. The difference between the two is that the connecting portion 53 is extended to be connected to the bottom plate 3, wherein the system assumes an X shape.
參閱圖13,本發明基板載具之第五實施例,與該第四實施例大致相同,兩者差別在於連接部53由彈性棒51高度h的2/3位置處往下延伸到該底板3處,使整體呈現一個片體狀,且連接部53具有至少一個貫穿孔530,而於實施上如圖13所示,是設計有複數個貫穿孔530,此設計除可節省材料成本外,也可讓造成擾流之氣流自貫穿孔 530流出,以減緩晶片的左右晃動碰撞的情形。且圖13如此之設計也可有效提高彈性元件5下方的結構強度,從而可減少操作人員徒手拿取載體11而碰觸彈性元件5時的損壞情形,以延長使用壽命。 Referring to FIG. 13, a fifth embodiment of the substrate carrier of the present invention is substantially the same as the fourth embodiment, and the difference is that the connecting portion 53 extends downward from the 2/3 position of the height h of the elastic bar 51 to the bottom plate 3. The whole portion is formed in a sheet shape, and the connecting portion 53 has at least one through hole 530. In the embodiment, as shown in FIG. 13, a plurality of through holes 530 are designed, which not only saves material cost but also saves material cost. Allows airflow that causes turbulence to flow through the through hole 530 flows out to slow the side-to-side slamming of the wafer. Moreover, the design of FIG. 13 can effectively improve the structural strength under the elastic member 5, thereby reducing the damage situation when the operator touches the elastic member 5 with the carrier 11 by hand, thereby prolonging the service life.
參閱圖14、15、16、17,本發明基板載具1的第六實施例,包含一載體11、一外殼12、至少一第一定位單元13、至少一第二定位單元14、數個緩衝結構15,以及數個結合單元16。 Referring to Figures 14, 15, 16, and 17, a sixth embodiment of the substrate carrier 1 of the present invention includes a carrier 11, a housing 12, at least a first positioning unit 13, at least a second positioning unit 14, and a plurality of buffers. Structure 15, and a plurality of combining units 16.
載體11包括一底板3和數個側板4,數個側板4相對於底板3圍繞出一承載空間110,緩衝結構15圍繞設於承載空間110內的周圍。外殼12具有一容置空間120,載體11設於容置空間120並定位於該外殼12。 The carrier 11 includes a bottom plate 3 and a plurality of side plates 4. The plurality of side plates 4 surround a bearing space 110 with respect to the bottom plate 3. The buffer structure 15 surrounds the periphery of the bearing space 110. The housing 12 has an accommodating space 120. The carrier 11 is disposed in the accommodating space 120 and is positioned on the housing 12.
側板4與外殼12間以第一定位單元13來定位。第一定位單元13包括一設於側板4與外殼12的其中之一上的第一凸部131,及一設於側板4與外殼12的其中之另一上且可拆離地與第一凸部131組裝的第一凹部132。 The side plate 4 and the outer casing 12 are positioned by the first positioning unit 13. The first positioning unit 13 includes a first convex portion 131 disposed on one of the side plate 4 and the outer casing 12, and a first portion affixed on the other side of the side plate 4 and the outer casing 12 and detachably connected to the first convex portion The first recess 132 is assembled by the portion 131.
在本實施例中,第一凸部131為凸塊並設於側板4上;第一凹部132為卡孔而供第一凸部131插卡定位並設於外殼12上。實施上,只要第一凸部131與第一凹部132能夠可拆離地相互結合即可,不需限制第一凸部131與第一凹部132的形式。另外,第一凸部131與第一凹部132的設置位置可互換,不限於本實施例的舉例。 In the embodiment, the first convex portion 131 is a bump and is disposed on the side plate 4; the first concave portion 132 is a card hole for the first convex portion 131 to be inserted into the card and disposed on the outer casing 12. In practice, as long as the first convex portion 131 and the first concave portion 132 can be detachably coupled to each other, the form of the first convex portion 131 and the first concave portion 132 need not be limited. In addition, the positions at which the first convex portion 131 and the first concave portion 132 are disposed are interchangeable, and are not limited to the examples of the embodiment.
底板3與外殼12之間以至少一第二定位單元14來定位。每一第二定位單元14包括一設於底板3與外殼12 的其中之一上的第二凸部141,以及一個設於底板3與外殼12的其中之另一上且可拆離地與第二凸部141組裝的第二凹部142。 The bottom plate 3 and the outer casing 12 are positioned by at least one second positioning unit 14. Each of the second positioning units 14 includes a bottom plate 3 and a housing 12 The second protrusion 141 on one of the two, and a second recess 142 disposed on the other of the bottom plate 3 and the outer casing 12 and detachably assembled with the second protrusion 141.
在本實施例中,第二凸部141為凸塊並設於底板3上;第二凹部142為卡孔而供第二凸部141插卡定位並設於該外殼12上。在實施上,只要第二凸部141與第二凹部142能夠可拆離地相互結合即可,不需限制第二凸部141與第二凹部142的形式。另外,第二凸部141與第二凹部142的設置位置可互換,不限於本實施例的舉例。 In this embodiment, the second convex portion 141 is a bump and is disposed on the bottom plate 3; the second concave portion 142 is a card hole for the second convex portion 141 to be inserted into the card and disposed on the outer casing 12. In practice, as long as the second convex portion 141 and the second concave portion 142 can be detachably coupled to each other, the form of the second convex portion 141 and the second concave portion 142 need not be limited. In addition, the positions at which the second convex portion 141 and the second concave portion 142 are disposed are interchangeable, and are not limited to the examples of the embodiment.
在本實施例中,載體11雖透過數個第一定位單元13與數個第二定位單元14而組裝固定於外殼12的容置空間120內,但在實施上,兩者間也可為緊配合的固定形式,所以載體11固定於外殼12內的手段並不限於本實施例所揭露的態樣。 In this embodiment, the carrier 11 is assembled and fixed in the accommodating space 120 of the outer casing 12 through a plurality of first positioning units 13 and a plurality of second positioning units 14, but in practice, the two may be tight. The fixed form of the mating, so the means for fixing the carrier 11 in the outer casing 12 is not limited to the embodiment disclosed in the embodiment.
每一側板4設有數個緩衝結構15中之至少一個,且每一緩衝結構15具有數個彈性元件5,數個彈性元件5的一端接觸底板3(見圖17)。各彈性元件5的另一端與各側板4的頂部之間以一結合單元16可拆離地定位安裝。各彈性元件5於靠近結合單元16處彎折形成一彈性簧片151,甚至各彈性簧片151彼此間為一體成型連接。 Each of the side plates 4 is provided with at least one of a plurality of buffer structures 15, and each of the buffer structures 15 has a plurality of elastic members 5, one end of which contacts the bottom plate 3 (see Fig. 17). The other end of each elastic member 5 and the top of each side plate 4 are detachably positioned and mounted by a coupling unit 16. Each of the elastic members 5 is bent to form an elastic spring 151 near the coupling unit 16, and even the elastic springs 151 are integrally connected to each other.
每一結合單元16包括一設於緩衝結構15與側板4的其中之一上的結合凸部161,及一設於緩衝結構15與側板4的其中之另一上且可拆離地與結合凸部161組裝的結合凹部162。 Each of the bonding units 16 includes a coupling protrusion 161 disposed on one of the buffer structure 15 and the side panel 4, and a coupling member 15 disposed on the other of the buffer structure 15 and the side panel 4 and detachably coupled to the protrusion The coupling recess 162 is assembled by the portion 161.
在本實施例中,結合凸部161為凸塊並設於緩衝結構15上;結合凹部162為卡孔而供該結合凸部161插卡定位並設於該側板4上。在實施上,只要結合凸部161與結合凹部162能夠可拆離地相互結合即可,不需限制結合凸部161與結合凹部162的形式。另外,結合凸部161與結合凹部162的設置位置可互換,不限於本實施例的舉例。 In this embodiment, the coupling protrusion 161 is a bump and is disposed on the buffer structure 15; the coupling recess 162 is a card hole, and the coupling protrusion 161 is inserted and positioned on the side plate 4. In practice, as long as the coupling protrusion 161 and the coupling recess 162 can be detachably coupled to each other, the form of the coupling protrusion 161 and the coupling recess 162 need not be limited. In addition, the arrangement positions of the coupling convex portion 161 and the coupling concave portion 162 are interchangeable, and are not limited to the examples of the embodiment.
每一彈性元件5皆具有一個朝遠離底板3的方向延伸且可彈性擺動的彈性棒51,以及一個由彈性棒51遠離該底板3的一端彎曲形成且連接彈性簧片151的彎折部52。在本實施例中,每一彈性元件5的彈性棒51與彎折部52呈L形。每一彈性棒51於平行底板3方向的斷面呈矩形,每一彈性棒51於靠近彎折部52處的寬度較靠近該底板3處的寬度為小,其中之寬度可以周長來替換。 Each of the elastic members 5 has an elastic rod 51 extending in a direction away from the bottom plate 3 and elastically swingable, and a bent portion 52 which is formed by bending the elastic rod 51 away from the end of the bottom plate 3 and connecting the elastic spring 151. In the present embodiment, the elastic rod 51 and the bent portion 52 of each elastic member 5 are L-shaped. Each of the elastic rods 51 has a rectangular cross section in the direction of the parallel bottom plate 3. The width of each of the elastic rods 51 near the bent portion 52 is smaller than the width of the bottom plate 3, and the width thereof can be replaced by the circumference.
該載體11的底板3為一個略呈四邊形的板體,該板體具有四個角落31(見圖16),該數個緩衝結構15透過該數個結合單元16而組裝於該載體11後,越靠近該數個角落31處的彈性元件5間之間距d為漸減,此設計可供晶片受吹拂而分離漂浮時,因晶片與周圍彈性元件5的碰撞位置常出現在角落31處,所以將靠近角落31處的彈性元件5的間距縮小或排列更為密集時,增加受力的接觸面積,有利於緩和晶片邊緣轉角處的碰撞問題。 The bottom plate 3 of the carrier 11 is a substantially quadrangular plate body having four corners 31 (see FIG. 16). The plurality of buffer structures 15 are assembled to the carrier 11 through the plurality of bonding units 16. The distance d between the elastic members 5 closer to the plurality of corners 31 is gradually reduced. This design allows the wafer to be blown and floated apart. Since the collision position of the wafer with the surrounding elastic member 5 often occurs at the corner 31, When the pitch of the elastic members 5 near the corners 31 is narrowed or arranged more densely, the contact area of the force is increased, which is advantageous for alleviating the collision problem at the corners of the wafer edges.
參閱圖14、16、17、18,本實施例在使用上,基板載具1的承載空間110容裝有數個晶片8、8’,基板載 具1置放於一個上料機上,上料機為太陽能電池製造過程用於搬運晶片8、8’的機器,且上料機包含兩個分別可噴出氣體的吹嘴71、一個可上下移動地穿設該基板載具1且可使晶片8向上的抬升裝置72,以及一個可吸取晶片8、8’並將晶片8、8’放置於一個輸送帶(圖未示)上的搬運裝置73。其中,該抬升裝置72使晶片8上升並位於兩個吹嘴71的高度,並透過該吹嘴71吹氣使位於上方的晶片8’彼此分離,再以該搬運裝置73吸取最上方的晶片8’以完成取件的動作。 Referring to Figures 14, 16, 17, and 18, in this embodiment, the carrying space 110 of the substrate carrier 1 houses a plurality of wafers 8, 8', and the substrate carries The loader 1 is placed on a loading machine which is a machine for transporting the wafers 8, 8' in a solar cell manufacturing process, and the loader comprises two blow nozzles 71 respectively capable of ejecting gas, one movable up and down A lifting device 72 for inserting the substrate carrier 1 and allowing the wafer 8 to be upward, and a handling device 73 for absorbing the wafers 8, 8' and placing the wafers 8, 8' on a conveyor belt (not shown) . Wherein, the lifting device 72 raises the wafer 8 and is located at the height of the two blowing nozzles 71, and blows the wafers 8' located above through the blowing nozzles 71, and sucks the uppermost wafer 8 by the conveying device 73. 'To complete the pickup action.
前述上方的晶片8’因受氣流吹拂而彼此分離時,易因氣體擾流而左右晃動並接觸到周圍的彈性元件5,其中彈性棒51受晶片8’碰觸時的衝擊力,可經彈性棒51和彈性簧片151的形變設計來吸收,以避免晶片8’因碰撞衍生的破裂情形。此外,長期使用後,若彈性棒51受到晶片8’邊緣之切割而形成刻痕、凹溝甚至斷裂時,可視耗損的彈性元件5是屬於哪一個緩衝結構15,再替換掉有損壞的緩衝結構15即可,如此可避免傳統方式直接替換整個基板載具1而有成本過高之問題。 When the upper wafers 8' are separated from each other by the air blowing, they are easily shaken left and right by the gas turbulence and contact the surrounding elastic members 5, wherein the elastic rods 51 are elastically subjected to the impact force when the wafer 8' is touched. The deformation of the rod 51 and the resilient reed 151 is designed to absorb to avoid cracking of the wafer 8' due to the impact. In addition, after long-term use, if the elastic rod 51 is cut by the edge of the wafer 8' to form a score, a groove or even a break, which of the buffer structures 15 the visually depleted elastic member 5 belongs to, and the damaged buffer structure is replaced. 15 can be, so that the conventional method of directly replacing the entire substrate carrier 1 can be avoided and the cost is too high.
另外,在本實施例中,每一彈性元件5的彈性棒51於靠近彎折部52的寬度較靠近底板3處的寬度為小,藉此提升彈性元件5鄰近頂端處的彈性。換句話說,透過這種由下而上寬度漸減(或稱周長漸小)的設計,可使彈性棒51的整體在結構強度與彈性之間達到最適當的搭配,從中可再提升彈性棒51的彈性緩衝效果。而且上述彎折部 52是朝背離該承載空間110方向所形成。 Further, in the present embodiment, the width of the elastic rod 51 of each elastic member 5 near the bent portion 52 is smaller than that at the bottom plate 3, thereby enhancing the elasticity of the elastic member 5 near the tip end. In other words, through the design that the bottom-up width is gradually reduced (or the circumference is gradually smaller), the whole of the elastic rod 51 can be optimally matched between the structural strength and the elasticity, from which the elastic rod can be further raised. 51 elastic cushioning effect. And the above bend 52 is formed facing away from the bearing space 110.
另外,於實施上,彈性元件5在其彈性棒51的末端即遠離該底板3處彎曲形成該彎折部52,從而可增強彈性棒51上方末端處的結構強度,這樣的設計也可與上述的彈性棒51寬度漸減或稱周長漸小的設計互相搭配。 In addition, in practice, the elastic member 5 is bent at the end of the elastic rod 51, that is, away from the bottom plate 3 to form the bent portion 52, so that the structural strength at the upper end of the elastic rod 51 can be enhanced, and the design can also be as described above. The elastic rods 51 have a decreasing width or a design with a smaller circumference.
在本實施例中,彈性元件5於平行底板3方向的斷面呈矩形,彈性元件5的彈性棒51具有一個面向承載空間110且可供晶片8、8’靠抵的表面511。透過這些表面511以面的形式供晶片8、8’的邊緣抵靠,可使兩者間的接觸面積增加,以減低單點接觸時因應力過大所產生之破片或彈性棒51的表面511產生損傷等問題。 In the present embodiment, the elastic member 5 has a rectangular cross section in the direction of the parallel bottom plate 3, and the elastic rod 51 of the elastic member 5 has a surface 511 facing the bearing space 110 and allowing the wafers 8, 8' to abut. By the surface 511, the edges of the wafers 8, 8' are abutted against each other, so that the contact area between the wafers 8 and 8' can be increased to reduce the surface 511 of the fragments or the elastic rods 51 which are generated by excessive stress during single point contact. Damage and other issues.
進一步地,在本實施例中,靠近角落31處的彈性元件5間之間距d為漸減,此設計可供晶片8’受吹拂而分離漂浮時,因晶片8’與周圍彈性元件5的碰撞位置常出現在角落31處,故將靠近角落31處的彈性元件5的間距d縮小或排列更為密集時,可增加此處的受力面積,有利於緩和晶片8’邊緣轉角處的碰撞問題。 Further, in the present embodiment, the distance d between the elastic members 5 near the corner 31 is gradually reduced. This design allows the wafer 8' to be blown and floated apart, due to the collision position of the wafer 8' with the surrounding elastic member 5. It often appears at the corner 31, so that when the pitch d of the elastic member 5 near the corner 31 is reduced or arranged more densely, the force area here can be increased, which is advantageous for alleviating the collision problem at the edge of the edge of the wafer 8'.
參閱圖15、17、18,透過以上的設計,可提高基板載具1的載體11的使用壽命,但若長時間使用下而彈性元件5仍出現磨損、斷裂時,可將彈性元件5損壞的那個緩衝結構15進行替換,以免因未更換而使晶片8、8’受到彈性元件5的影響而破裂。 Referring to Figures 15, 17, and 18, the service life of the carrier 11 of the substrate carrier 1 can be improved by the above design. However, if the elastic member 5 is worn or broken for a long time, the elastic member 5 can be damaged. The buffer structure 15 is replaced so as not to cause the wafers 8, 8' to be broken by the elastic member 5 due to non-replacement.
由上可知,本實施例各該緩衝結構15的另一端與各該側板4的頂部之間以一結合單元16可拆離地定位安 裝,而當某個緩衝結構15上的彈性元件5磨損、斷裂時,更換這個緩衝結構15即可,無需如傳統方式淘汰整個載體11,可降低成本。 As can be seen from the above, the other end of each of the buffer structures 15 and the top of each of the side plates 4 in the embodiment are detachably positioned by a coupling unit 16 When the elastic member 5 on a certain buffer structure 15 is worn and broken, the buffer structure 15 can be replaced, and it is not necessary to eliminate the entire carrier 11 as in the conventional manner, which can reduce the cost.
參閱圖19,本發明基板載具1之第七實施例與第六實施例大致相同,兩者的差別在於每一緩衝結構15中,該數個彈性元件5中之至少兩個以一連接部53連接。 Referring to FIG. 19, the seventh embodiment of the substrate carrier 1 of the present invention is substantially the same as the sixth embodiment. The difference between the two is that in each of the buffer structures 15, at least two of the plurality of elastic members 5 are connected by a connecting portion. 53 connections.
連接部53是連接於至少兩個彈性棒51之間。連接部53的位置不高於彈性棒51的高度h的三分之二(即2/3)。更佳地,連接部53的位置不超出彈性棒51的高度h的1/2~2/3的範圍外。本實施例所述的高度h,是從彈性棒51鄰近該底板3之底端往上起算到彈性棒51的頂端。 The connecting portion 53 is connected between at least two elastic rods 51. The position of the connecting portion 53 is not higher than two-thirds (i.e., 2/3) of the height h of the elastic rod 51. More preferably, the position of the connecting portion 53 does not exceed the range of 1/2 to 2/3 of the height h of the elastic rod 51. The height h described in this embodiment is calculated from the top end of the elastic rod 51 from the bottom end of the bottom plate 3 to the top end of the elastic rod 51.
承上,透過連接部53連接於彈性棒51之間的設計,可讓透過射出成型製作的第一結構2的彈性元件5於模具內或脫模後的冷卻過程中,受到拘束而使其呈現垂直挺立的結果,避免傳統方式衍生的前傾問題。同時這樣的設計也可讓數根彈性棒51的表面511皆位於同一平面上,可令晶片抵靠時的受力更均勻地分散,有效減少因單點受力或受力面積過小時的破片問題。 The design of the connection between the elastic rods 51 through the connecting portion 53 allows the elastic member 5 of the first structure 2 produced by injection molding to be restrained and rendered during the cooling process in the mold or after demolding. The result of vertical erection avoids the traditional way of derivation. At the same time, the design of the surface 511 of the plurality of elastic rods 51 is located on the same plane, so that the force of the wafer when the abutting force is more evenly dispersed, and the fragment of the single point force or the force area is too small. problem.
另外,上述連接部53的位置也不宜太高,此因上方晶片分離飄浮而碰觸周圍的彈性棒51時,若連接部53的位置過高時,易使彈性棒51上方的形變空間變小,連帶影響了彈性棒51的彈性擺動效果,從而降低了原本供晶片抵靠緩衝的效果,因此,連接部53的位置以高度h的2/3或以下為佳。 Further, the position of the connecting portion 53 is not too high, and when the upper wafer is separated and floated and touches the surrounding elastic rod 51, if the position of the connecting portion 53 is too high, the deformation space above the elastic rod 51 is easily made small. In addition, the elastic swing effect of the elastic rod 51 is affected, thereby reducing the effect of the original wafer for cushioning. Therefore, the position of the connecting portion 53 is preferably 2/3 or less of the height h.
又,若連接部53設置的位置過低而接近底板3時,將可能產生原本傳統設計的傾斜問題,此係因位於連接部53上方的彈性棒51的整體比例過高,於製作上無法受到連接部53確實的拘束,而容易發生傾斜變形的問題,因此,連接部53的位置不宜低於彈性棒51高度h的1/2。但,若靠近底板3處有設置連接部53,且其上方也仍有設置其他連接部53時,透過兩者間的相互拘束,則能避免掉此處所談及之傾斜問題。 Moreover, if the position of the connecting portion 53 is too low to approach the bottom plate 3, the tilt problem of the conventional design may occur, because the overall proportion of the elastic bar 51 located above the connecting portion 53 is too high, and it is impossible to manufacture. Since the connecting portion 53 is surely restrained and the problem of oblique deformation is likely to occur, the position of the connecting portion 53 is not preferably lower than 1/2 of the height h of the elastic rod 51. However, if the connecting portion 53 is provided near the bottom plate 3 and the other connecting portions 53 are provided above the bottom plate 3, the problem of tilting as discussed herein can be avoided by the mutual restraint between the two.
參閱圖20,本發明基板載具1之第八實施例,與第六實施例大致相同,兩者的差別在於:該載體11包括數個可相互組配或稱組合的第一結構2。各該第一結構2包括一底壁201和一側壁202,該數個第一結構2可被組配定位後,各該第一結構2的底壁201構成該底板3,各該第一結構2的側壁202構成各該側板4,而該數個緩衝結構15分別透過該數個結合單元16而可拆離地定位安裝於各該第一結構2的側壁202上。 Referring to Fig. 20, the eighth embodiment of the substrate carrier 1 of the present invention is substantially the same as the sixth embodiment. The difference between the two is that the carrier 11 includes a plurality of first structures 2 which can be combined or combined with each other. Each of the first structures 2 includes a bottom wall 201 and a side wall 202. After the plurality of first structures 2 are assembled, the bottom wall 201 of each of the first structures 2 constitutes the bottom plate 3, and each of the first structures The side walls 202 of the second side frame 2 constitute the side plates 4, and the plurality of buffer structures 15 are detachably positioned and mounted on the side walls 202 of each of the first structures 2 through the plurality of combining units 16.
各該第一結構2的側壁202與該外殼12之間分別以一第一定位單元13來定位。在本實施例中,各該第一定位單元13的第一凸部131設於側壁202上;各該第一定位單元13的第一凹部132可供該第一凸部131插卡定位,並設於該外殼12上。 Each of the side walls 202 of the first structure 2 and the outer casing 12 are respectively positioned by a first positioning unit 13 . In this embodiment, the first convex portion 131 of each of the first positioning units 13 is disposed on the side wall 202; the first concave portion 132 of each of the first positioning units 13 can be positioned by the first convex portion 131, and It is disposed on the outer casing 12.
各該第一結構2的底壁201與該外殼12之間分別以一第二定位單元14來定位。在本實施例中,各該第二定位單元14的第二凸部141置於底壁201上;各該第二定 位單元14的第二凹部142可供該第二凸部141插卡定位,並置於該外殼12上。 The bottom wall 201 of each of the first structures 2 and the outer casing 12 are respectively positioned by a second positioning unit 14. In this embodiment, the second convex portion 141 of each of the second positioning units 14 is placed on the bottom wall 201; each of the second predetermined The second recess 142 of the bit unit 14 can be positioned by the second protrusion 141 and placed on the outer casing 12.
本實施例將該載體11設計成由數個第一結構2組合的創新設計,可在某第一結構2損壞時,更換這個第一結構2即可,無需如傳統方式淘汰整個載體11而可降低成本。本發明的載體11可區分成幾個第一結構2,其分割方式與數量並不限於本實施例以上之舉例,只要能符合本發明之精神與目的皆在本案保護範圍內。 In this embodiment, the carrier 11 is designed as an innovative design combining a plurality of first structures 2, and the first structure 2 can be replaced when a certain first structure 2 is damaged, and the entire carrier 11 need not be eliminated as in the conventional manner. cut costs. The carrier 11 of the present invention can be divided into several first structures 2, and the manner and number of divisions thereof are not limited to the above examples of the embodiments, and the spirit and purpose of the present invention are within the scope of the present invention.
參閱圖21、22、23、24,本發明基板載具1之第九實施例,與第六實施例大致相同,兩者的差別在於:緩衝結構15安裝載體11的位置,及緩衝結構15的構造。 21, 22, 23, and 24, the ninth embodiment of the substrate carrier 1 of the present invention is substantially the same as the sixth embodiment, and the difference between the two is that the buffer structure 15 is mounted with the carrier 11 and the buffer structure 15 structure.
在本實施例中,緩衝結構15設於該底板3上並對應靠近側板4,緩衝結構15與底板3之間以一結合單元16可拆離地定位安裝。在本實施例中,結合單元16的結合凸部161為凸塊並設於緩衝結構15上;結合單元16的結合凹部162為卡孔而供該結合凸部161插卡定位並設於該底板3上。在實施上,結合凸部161與結合凹部162的設置位置可互換,不限於本實施例的舉例。 In the present embodiment, the buffer structure 15 is disposed on the bottom plate 3 and corresponding to the side plate 4, and the buffer structure 15 and the bottom plate 3 are detachably positioned and mounted by a joint unit 16. In this embodiment, the joint protrusion 161 of the joint unit 16 is a bump and is disposed on the buffer structure 15; the joint recess 162 of the joint unit 16 is a card hole for the joint protrusion 161 to be positioned and disposed on the bottom plate. 3 on. In practice, the arrangement positions of the coupling protrusion 161 and the coupling recess 162 are interchangeable, and are not limited to the examples of the embodiment.
每一緩衝結構15具有數個彈性元件5,彈性元件5的一端遠離底板3延伸且無接觸所對應的側板4。每一彈性元件5皆具有一個朝遠離該底板3方向延伸且可彈性擺動的彈性棒51(或稱彈性桿),以及一個位於彈性棒51遠離底板3的一端彎曲形成的彎折部52,彎折部52可增強彈性棒51上方處的結構強度。 Each of the cushioning structures 15 has a plurality of elastic members 5, one end of which extends away from the bottom plate 3 and has no contact with the corresponding side plates 4. Each of the elastic members 5 has an elastic rod 51 (or an elastic rod) extending away from the bottom plate 3 and elastically swingable, and a bent portion 52 bent at an end of the elastic rod 51 away from the bottom plate 3, bent The fold 52 enhances the structural strength at the top of the elastic rod 51.
每一彈性元件5的彈性棒51於靠近彎折部52的寬度較靠近底板3的寬度為小,藉此提升彈性元件5鄰近頂端處的彈性,透過這種由下而上寬度漸減(或稱周長漸小)的設計,可使彈性棒51的整體在結構強度與彈性之間達到最適當的搭配,從中可再提升彈性棒51的彈性抵接效果。而且上述彎折部52是朝背離該承載空間110方向所形成。 The elastic rod 51 of each elastic member 5 is smaller in width near the bent portion 52 than the bottom plate 3, thereby increasing the elasticity of the elastic member 5 near the tip end, and the width from the bottom to the top is gradually reduced (or The design of the circumference is gradually reduced, so that the whole of the elastic rod 51 can be optimally matched between the structural strength and the elasticity, and the elastic abutment effect of the elastic rod 51 can be further improved. Further, the bent portion 52 is formed to face away from the bearing space 110.
在本實施例中,彈性元件5於平行底板3方向的斷面呈矩形,彈性棒51具有一個面向承載空間110且可供晶片8、8’抵靠的表面511。透過這些表面511以面的形式供晶片8、8’邊緣抵靠,且兩者接觸面積較大,可降低碰觸的衝擊力以避免所述晶片8、8’產生破片或彈性棒51的表面511產生損傷等問題。 In the present embodiment, the elastic member 5 has a rectangular cross section in the direction of the parallel bottom plate 3, and the elastic rod 51 has a surface 511 facing the bearing space 110 and allowing the wafers 8, 8' to abut. Through the surfaces 511, the edges of the wafers 8, 8' are abutted against each other, and the contact areas of the two are large, so that the impact force of the contact can be reduced to prevent the wafers 8, 8' from generating fragments or the surface of the elastic rods 51. 511 causes problems such as damage.
緩衝結構15透過結合單元16而組裝於載體11後,靠近角落31處的彈性元件5之間的間距d為漸減,此設計可供晶片受吹拂而分離漂浮時,晶片與周圍彈性元件5的碰撞位置常出現在角落31處,因此將靠近角落31處的彈性元件5的間距縮小或排列更為密集時,增加受力的接觸面積,有利於緩和晶片邊緣轉角處的碰撞問題。 After the buffer structure 15 is assembled to the carrier 11 through the bonding unit 16, the spacing d between the elastic members 5 near the corner 31 is gradually reduced. This design allows the wafer to collide with the surrounding elastic member 5 when it is blown and separated. The position often appears at the corner 31, so that when the pitch of the elastic member 5 near the corner 31 is narrowed or arranged more densely, the contact area of the force is increased, which is advantageous for alleviating the collision problem at the corner of the wafer edge.
進一步說明的是,當某個緩衝結構15上的其中至少一個彈性元件5因使用而磨損、斷裂時,更換這個緩衝結構15即可,無需如傳統方式淘汰整個載體11而可降低成本。 It is further explained that when at least one of the elastic members 5 on a certain buffer structure 15 is worn and broken due to use, the buffer structure 15 can be replaced, and it is not necessary to eliminate the entire carrier 11 as in the conventional manner, thereby reducing the cost.
參閱圖25,本發明基板載具1之第十實施例, 與第九實施例大致相同,兩者的差別在於該數個彈性元件5中之至少兩個以一連接部53連接,其中連接部53是連接於至少兩個彈性棒51之間。連接部53的位置不高於彈性棒51的高度h的三分之二(2/3)。更佳地,連接部53的位置不超出彈性棒51的高度h的1/2~2/3的範圍外。其中,本實施例所述的高度h,是從彈性棒51鄰近該底板3之底端往上起算到彈性棒51的頂端。此處所指的彈性棒51的頂端與本文前後處所指的末端的意思相同。 Referring to FIG. 25, a tenth embodiment of the substrate carrier 1 of the present invention, Roughly the same as the ninth embodiment, the difference is that at least two of the plurality of elastic members 5 are connected by a connecting portion 53, wherein the connecting portion 53 is connected between at least two elastic rods 51. The position of the connecting portion 53 is not higher than two-thirds (2/3) of the height h of the elastic rod 51. More preferably, the position of the connecting portion 53 does not exceed the range of 1/2 to 2/3 of the height h of the elastic rod 51. The height h described in this embodiment is calculated from the top end of the elastic rod 51 from the bottom end of the bottom plate 3 to the top end of the elastic rod 51. The tip end of the elastic rod 51 referred to herein has the same meaning as the end referred to herein before and after.
承上,透過連接部53連接於彈性棒51之間的設計,可讓透過射出成型製作的第一結構2的彈性元件5於模具內或脫模後的冷卻過程中受到拘束而使其呈現垂直挺立的結果,避免傳統方式衍生的前傾問題。同時這樣的設計也可讓數根彈性棒51的表面511皆位於同一平面上,可令晶片抵靠時的受力更均勻地分散,有效減少因單點受力或受力面積過小時的破片問題。另外,上述連接部53的位置也不宜太高,此因上方晶片分離飄浮而碰觸周圍的彈性棒51時,若連接部53的位置過高時,將使得本來良好的彈性擺動效果受到影響,從而使原本供晶片抵靠緩衝的效果降低,因此,連接部53的位置以高度h的2/3或以下為佳。 The design of the connection between the elastic rods 51 through the connecting portion 53 allows the elastic member 5 of the first structure 2 produced by injection molding to be restrained in the mold or in the cooling process after the demolding to be vertical. The result of standing up, avoiding the problem of forward leaning derived from the traditional way. At the same time, the design of the surface 511 of the plurality of elastic rods 51 is located on the same plane, so that the force of the wafer when the abutting force is more evenly dispersed, and the fragment of the single point force or the force area is too small. problem. Further, the position of the connecting portion 53 is not too high, and when the upper wafer is separated and floated and touches the surrounding elastic rod 51, if the position of the connecting portion 53 is too high, the originally good elastic swing effect is affected. Therefore, the effect of the original wafer for cushioning is lowered, and therefore, the position of the connecting portion 53 is preferably 2/3 or less of the height h.
又,若連接部53設置的位置過低而接近底板3時,將可能產生原本傳統設計的傾斜問題,此係因位於連接部53上方的彈性棒51的整體比例過高,而同樣容易發生傾斜變形的問題,因此,連接部53的位置不宜低於彈性 棒51高度h的1/2。但,若靠近底板3處的連接部53的上方仍有設置其他的連接部53時,透過兩者間的相互拘束,則能避免掉此處所談及之傾斜問題。 Further, if the position where the connecting portion 53 is provided is too low to approach the bottom plate 3, the tilt problem of the conventional design may occur, because the overall proportion of the elastic bar 51 located above the connecting portion 53 is too high, and the tilt is also easy to occur. The problem of deformation, therefore, the position of the connecting portion 53 should not be lower than the elasticity The bar 51 has a height h of 1/2. However, if another connecting portion 53 is provided above the connecting portion 53 near the bottom plate 3, the mutual restraint between the two can avoid the problem of tilting as discussed herein.
參閱圖26,本發明基板載具1之第十一實施例,與第九實施例大致相同,兩者的差別在於該載體11包括數個可相互組配或稱組合的第一結構2。各該第一結構2包括一底壁201和一側壁202,該數個第一結構2可被組配定位後,各該第一結構2的底壁201構成該底板3,各該第一結構2的側壁202構成該各該側板4,而該數個緩衝結構15分別透過該數個結合單元16而可拆離地定位安裝於各該第一結構2的底壁201上。 Referring to Fig. 26, the eleventh embodiment of the substrate carrier 1 of the present invention is substantially the same as the ninth embodiment, and the difference is that the carrier 11 includes a plurality of first structures 2 which can be combined or combined with each other. Each of the first structures 2 includes a bottom wall 201 and a side wall 202. After the plurality of first structures 2 are assembled, the bottom wall 201 of each of the first structures 2 constitutes the bottom plate 3, and each of the first structures The side walls 202 of the second side frame 2 constitute the side plates 4, and the plurality of buffer structures 15 are detachably positioned and mounted on the bottom wall 201 of each of the first structures 2 through the plurality of combining units 16.
各該第一結構2的側壁202與該外殼12之間分別以一第一定位單元13來定位。在本實施例中,各該第一定位單元13的第一凸部131設於側壁202上;各該第一定位單元13的第一凹部132可供該第一凸部131插卡定位,並設於該外殼12上。 Each of the side walls 202 of the first structure 2 and the outer casing 12 are respectively positioned by a first positioning unit 13 . In this embodiment, the first convex portion 131 of each of the first positioning units 13 is disposed on the side wall 202; the first concave portion 132 of each of the first positioning units 13 can be positioned by the first convex portion 131, and It is disposed on the outer casing 12.
各該第一結構2的底壁201與該外殼12之間分別以一第二定位單元14來定位。在本實施例中,各該第二定位單元14的第二凸部141設於底壁201上;各該第二定位單元14的第二凹部142可供該第二凸部141插卡定位,並設於該外殼12上。 The bottom wall 201 of each of the first structures 2 and the outer casing 12 are respectively positioned by a second positioning unit 14. In this embodiment, the second convex portion 141 of each of the second positioning units 14 is disposed on the bottom wall 201; the second concave portion 142 of each of the second positioning units 14 can be positioned by the second convex portion 141. And disposed on the outer casing 12.
本實施例將該載體11設計成由數個第一結構2組合的創新設計,可在某個第一結構2磨損時,更換這個第一結構2即可,無需如傳統方式淘汰整個載體11而可降 低成本。本發明的載體11可區分成幾個第一結構2,其分割方式與數量並不限於本實施例以上之舉例,只要能符合本發明之精神與目的皆在本案保護範圍內。 In this embodiment, the carrier 11 is designed as an innovative design combining a plurality of first structures 2, and the first structure 2 can be replaced when a certain first structure 2 is worn, without eliminating the entire carrier 11 as in the conventional manner. Can drop low cost. The carrier 11 of the present invention can be divided into several first structures 2, and the manner and number of divisions thereof are not limited to the above examples of the embodiments, and the spirit and purpose of the present invention are within the scope of the present invention.
參閱圖27,本發明基板載具1之一第十二實施例,與該第三實施例(見圖11)大致相同,兩者之間的差別在於:該載體11為一體成型。 Referring to Fig. 27, a twelfth embodiment of the substrate carrier 1 of the present invention is substantially the same as the third embodiment (see Fig. 11), and the difference between the two is that the carrier 11 is integrally formed.
參閱圖28,本發明基板載具1之一第十三實施例,與該第四實施例(見圖12)大致相同,兩者之間的差別在於:該載體11為一體成型。 Referring to Fig. 28, a thirteenth embodiment of the substrate carrier 1 of the present invention is substantially the same as the fourth embodiment (see Fig. 12), and the difference between the two is that the carrier 11 is integrally formed.
參閱圖29,本發明基板載具1之一第十四實施例,與該第五實施例(見圖13)大致相同,兩者之間的差別在於:該載體11為一體成型。 Referring to Fig. 29, a fourteenth embodiment of the substrate carrier 1 of the present invention is substantially the same as the fifth embodiment (see Fig. 13), and the difference between the two is that the carrier 11 is integrally formed.
本發明中的不同實施例之間的各種結構或構件上的設計,皆可相互流用與搭配,並不限於本發明中所列的實施例及其對應的圖示那樣而已,此係因篇幅有限,故較難將所有實施例詳列舉出,總之,只要本發明之說明書和圖示中曾經提到的特徵與設計,皆可進行不同形式的組配,同樣具有本發明所欲達到的目的與效果。 The various structures or components in the different embodiments of the present invention may be used and matched to each other, and are not limited to the embodiments listed in the present invention and their corresponding drawings. Therefore, it is difficult to enumerate all the embodiments in detail. In summary, as long as the features and designs mentioned in the specification and the drawings of the present invention can be combined in different forms, the same object of the present invention is achieved. effect.
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.
1‧‧‧基板載具 1‧‧‧Substrate carrier
11‧‧‧載體 11‧‧‧ Carrier
110‧‧‧承載空間 110‧‧‧ Carrying space
12‧‧‧外殼 12‧‧‧ Shell
120‧‧‧容置空間 120‧‧‧ accommodating space
13‧‧‧第一定位單元 13‧‧‧First positioning unit
131‧‧‧第一凸部 131‧‧‧First convex
132‧‧‧第一凹部 132‧‧‧First recess
14‧‧‧第二定位單元 14‧‧‧Second positioning unit
141‧‧‧第二凸部 141‧‧‧second convex
142‧‧‧第二凹部 142‧‧‧Second recess
2‧‧‧第一結構 2‧‧‧ first structure
3‧‧‧底板 3‧‧‧floor
4‧‧‧側板 4‧‧‧ side panels
5‧‧‧彈性元件 5‧‧‧Flexible components
51‧‧‧彈性棒 51‧‧‧Flex rod
52‧‧‧彎折部 52‧‧‧Bend

Claims (19)

  1. 一種基板載具,包含一載體,該載體包括數個可相互組配的第一結構;各該第一結構包括一底板和一側板,該底板上靠近該側板處設有數個彈性元件;該數個第一結構可被組配定位並由該數個側板相對於該數個底板圍繞出一承載空間。 A substrate carrier comprising a carrier, the carrier comprising a plurality of first structures that can be assembled with each other; each of the first structures comprises a bottom plate and a side plate, wherein the bottom plate is provided with a plurality of elastic elements adjacent to the side plates; The first structures can be assembled and arranged by the plurality of side plates to surround a bearing space relative to the plurality of bottom plates.
  2. 如請求項1所述的基板載具,還包含一外殼,該外殼具有一容置空間,該數個第一結構設置於該容置空間並分別定位於該外殼。 The substrate carrier of claim 1, further comprising a housing having an accommodating space, the plurality of first structures being disposed in the accommodating space and respectively positioned on the housing.
  3. 如請求項2所述的基板載具,其中,各該側板與該外殼之間以至少一第一定位單元來定位。 The substrate carrier of claim 2, wherein each of the side panels and the outer casing are positioned by at least one first positioning unit.
  4. 如請求項1所述的基板載具,還包含一外殼,該數個第一結構置設於該外殼上,且各該底板與該外殼之間以至少一第二定位單元來定位。 The substrate carrier of claim 1, further comprising a housing, wherein the plurality of first structures are disposed on the housing, and each of the bottom plates and the housing is positioned by at least one second positioning unit.
  5. 請求項1至4中任一項所述的基板載具,其中,該數個彈性元件中之至少兩個以一連接部連接,該連接部的位置不高於該數個彈性元件的高度的2/3。 The substrate carrier according to any one of claims 1 to 4, wherein at least two of the plurality of elastic members are connected by a connecting portion whose position is not higher than a height of the plurality of elastic members 2/3.
  6. 如請求項5所述的基板載具,其中,該連接部的位置不超出該數個彈性元件的高度的1/2~2/3的範圍外。 The substrate carrier according to claim 5, wherein the position of the connecting portion does not exceed a range of 1/2 to 2/3 of the height of the plurality of elastic members.
  7. 如請求項5所述的基板載具,其中,該連接部延伸連接到該底板。 The substrate carrier of claim 5, wherein the connecting portion extends to the bottom plate.
  8. 如請求項7所述的基板載具,其中,該連接部具有至少一個貫穿孔。 The substrate carrier of claim 7, wherein the connecting portion has at least one through hole.
  9. 一種基板載具,包含: 一載體,包括一底板和數個側板,該數個側板相對於該底板圍繞出一承載空間;及數個緩衝結構,每一側板設置有該數個緩衝結構中之至少一個,且每一緩衝結構具有數個彈性元件,該數個彈性元件的一端接觸該底板,各該彈性元件的另一端與各該側板的頂部之間以一結合單元可拆離地定位安裝,其中各該彈性元件於靠近該結合單元處彎折形成一彈性簧片。 A substrate carrier comprising: a carrier includes a bottom plate and a plurality of side plates, wherein the plurality of side plates surround a bearing space with respect to the bottom plate; and a plurality of buffer structures, each side plate is provided with at least one of the plurality of buffer structures, and each buffering The structure has a plurality of elastic members, one end of the plurality of elastic members contacting the bottom plate, and the other end of each of the elastic members is detachably positioned and mounted by a joint unit between the tops of the side plates, wherein each of the elastic members is A resilient spring is formed adjacent to the bonding unit.
  10. 如請求項9所述的基板載具,其中,各該彈性簧片彼此間為一體成型連接。 The substrate carrier of claim 9, wherein each of the elastic springs is integrally formed with each other.
  11. 如請求項9或10所述的基板載具,其中,該數個彈性元件中之至少兩個以一連接部連接,該連接部的位置不高於該數個彈性元件的高度的2/3。 The substrate carrier according to claim 9 or 10, wherein at least two of the plurality of elastic members are connected by a connecting portion, and the position of the connecting portion is not higher than 2/3 of the height of the plurality of elastic members. .
  12. 如請求項9或10所述的基板載具,其中,該載體係由數個可相互組配的第一結構所構成。 The substrate carrier of claim 9 or 10, wherein the carrier is composed of a plurality of first structures that are mutually configurable.
  13. 一種基板載具,包含:一載體,包含一底板和數個側板,該數個側板相對於該底板圍繞出一承載空間;及數個緩衝結構,每一緩衝結構具有數個彈性元件,該數個緩衝結構設於該底板上並對應靠近該數個側板,且該數個緩衝結構與該底板之間以一結合單元可拆離地定位安裝,每一緩衝結構的該數個彈性元件的一端遠離該底板延伸且無接觸所對應的各該側板。 A substrate carrier comprising: a carrier comprising a bottom plate and a plurality of side plates, wherein the plurality of side plates surround a bearing space with respect to the bottom plate; and a plurality of buffer structures each having a plurality of elastic members, the number The buffer structure is disposed on the bottom plate and correspondingly adjacent to the plurality of side plates, and the plurality of buffer structures and the bottom plate are detachably positioned and mounted by a joint unit, and one end of the plurality of elastic members of each buffer structure Each of the side plates extends away from the bottom plate and has no contact.
  14. 如請求項13所述的基板載具,其中,該數個彈性元件 中之至少兩個以一連接部連接,該連接部的位置不高於該數個彈性元件的高度的2/3。 The substrate carrier of claim 13, wherein the plurality of elastic components At least two of them are connected by a joint, the position of which is not higher than 2/3 of the height of the plurality of elastic members.
  15. 如請求項13或14所述的基板載具,其中,該載體係由數個可相互組配的第一結構所構成。 The substrate carrier of claim 13 or 14, wherein the carrier is composed of a plurality of first structures that are mutually configurable.
  16. 一種基板載具,包含:一載體,包含一底板和數個側板,該數個側板相對於該底板圍繞出一承載空間;及數個緩衝結構,各該緩衝結構設於該底板上並靠近各該側板,且各該緩衝結構具有數個彈性元件,該數個彈性元件的一端遠離該底板延伸;其中,該數個彈性元件中之至少兩個以一連接部連接,該連接部的位置不高於該數個彈性元件的高度的2/3。 A substrate carrier comprising: a carrier comprising a bottom plate and a plurality of side plates, wherein the plurality of side plates surround a bearing space with respect to the bottom plate; and a plurality of buffer structures, each of the buffer structures being disposed on the bottom plate and adjacent to each The side plate, and each of the buffer structures has a plurality of elastic members, one end of the plurality of elastic members extending away from the bottom plate; wherein at least two of the plurality of elastic members are connected by a connecting portion, the position of the connecting portion is not It is higher than 2/3 of the height of the plurality of elastic members.
  17. 如請求項16所述的基板載具,其中,該連接部的位置不超出該數個彈性元件的高度的1/2~2/3的範圍外。 The substrate carrier according to claim 16, wherein the position of the connecting portion does not exceed a range of 1/2 to 2/3 of the height of the plurality of elastic members.
  18. 如請求項16所述的基板載具,其中,該連接部延伸連接到該底板。 The substrate carrier of claim 16, wherein the connecting portion extends to the bottom plate.
  19. 如請求項16至18中任一項所述的基板載具,其中,該連接部具有至少一個貫穿孔。 The substrate carrier of any one of claims 16 to 18, wherein the connecting portion has at least one through hole.
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CN201419857Y (en) * 2009-04-30 2010-03-10 达运精密工业(苏州)有限公司 Carrying device
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