TW201625087A - Method of separating sheet for circuit substrate and device of separating sheet for circuit substrate - Google Patents

Method of separating sheet for circuit substrate and device of separating sheet for circuit substrate Download PDF

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TW201625087A
TW201625087A TW104143393A TW104143393A TW201625087A TW 201625087 A TW201625087 A TW 201625087A TW 104143393 A TW104143393 A TW 104143393A TW 104143393 A TW104143393 A TW 104143393A TW 201625087 A TW201625087 A TW 201625087A
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circuit board
sheet
holding member
air
floating
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TW104143393A
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Chinese (zh)
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TWI577254B (en
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Takashi Fukumoto
Hideaki Takahashi
Yasuo Niikura
Hidetoshi Kojima
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Ricoh Co Ltd
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Abstract

This invention provides a method of separating sheet for circuit substrate which may easily separate the sheet for circuit substrate and includes: a floating step as the first step, which uses the air jetted from an air nozzle device 300 as an air jetting means to float the sheet for laminated circuit substrate; and, a holding step as the second step after the floating step, which uses the conveyer 161 of a floating holding transport device 160 as a holding member to hold the floated sheet for circuit substrate, then completing the separation.

Description

電路基板用片分離方法及電路基板用片分離裝置 Sheet separation method for circuit board and sheet separation device for circuit board

本發明係關於一種電路基板用片分離方法及電路基板用片分離裝置。 The present invention relates to a sheet separation method for a circuit board and a sheet separation device for a circuit board.

可將半固化片(預浸片)分離輸送的半固化片裝置及方法(參照例如專利文獻1)係為習知者。 A prepreg device and method (see, for example, Patent Document 1) in which a prepreg (prepreg) can be separated and transported is a conventional one.

專利文獻1中揭示了一種以下的半固化片供應裝置及半固化片供應方法。即,在同文獻中,係利用由氣缸等轉動的吸附墊吸附、提起堆積的第一片半固化片的吸附部即端部(上方轉動),再利用由另一個氣缸上下的吸附墊吸附、提起第二片半固化片的端部。其次,同時水平移動兩邊的吸附墊,移動例如50mm左右,區分輸送需要的兩片半固化片。 Patent Document 1 discloses a prepreg supply device and a prepreg supply method. In other words, in the same literature, the end portion (upper rotation) of the adsorption portion of the first prepreg that is adsorbed and lifted by the adsorption pad that is rotated by the cylinder or the like is sucked and lifted by the adsorption pad on the upper and lower sides of the other cylinder. The ends of the two prepregs. Next, simultaneously move the adsorption pads on both sides horizontally, for example, about 50 mm, to distinguish the two prepregs required for transportation.

然而,在專利文獻1所記載的技術方面,要分離第一片的半固化片與第二片的半固化片,分別需要個別的吸附動作與上方轉動動作等,而不易進行半固化片的分離。 However, in the technique described in Patent Document 1, in order to separate the prepreg of the first sheet and the prepreg of the second sheet, an individual adsorption operation and an upward rotation operation are required, respectively, and the separation of the prepreg is not easy.

【先前技術文獻】 [Previous Technical Literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本特開2003-311769號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-311769

本發明係基於上述情況而完成,其目的在於提供一種無損電路基板用片的品質而可容易進行分離的電路基板用片分離方法。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a sheet separation method for a circuit board which can be easily separated without deteriorating the quality of a sheet for a circuit board.

為了達成上述目的,本發明為一種電路基板用片分離方法,具有:第一步驟,其係將層積的電路基板用片利用來自空氣噴出手段的空氣噴出使電路基板用片的端部浮起;以及第二步驟,其係在前述第一步驟之後,以保持(固持)構件保持(固持)前述浮起的電路基板用片,並使其分離。 In order to achieve the above object, the present invention provides a sheet separation method for a circuit board, comprising: a first step of ejecting a laminated circuit board sheet by air from an air ejecting means to float an end portion of the circuit board sheet; And a second step of holding (holding) the floating sheet for the circuit substrate and holding it apart after the first step.

藉由本發明,可提供一種無損電路基板用片的品質而可容易進行分離的電路基板用片分離方法。 According to the present invention, it is possible to provide a sheet separation method for a circuit board which can be easily separated without deteriorating the quality of the sheet for a circuit board.

1‧‧‧電路基板用片束、被輸送材料束 1‧‧‧Slices for circuit boards, bundles of materials to be transported

1A、1B、1C‧‧‧電路基板用片、被輸送材料 1A, 1B, 1C‧‧‧Chip for circuit board, material to be transported

20‧‧‧檢測感測器 20‧‧‧Detection sensor

130‧‧‧電路基板用片分離輸送裝置(電路基板用片分離裝置的一例) 130‧‧‧Slice separation and transport device for circuit boards (an example of a sheet separation device for circuit boards)

130A‧‧‧被輸送材料分離輸送裝置(被輸送材料分離裝置) 130A‧‧‧Conveyed material separation conveyor (conveyed material separation device)

136‧‧‧裝載台(準備手段) 136‧‧‧Loading station (preparation means)

137、137‧‧‧側面護欄 137, 137‧‧‧ side rails

138‧‧‧前端導向板 138‧‧‧ front-end guide plate

139‧‧‧終端護欄 139‧‧‧ terminal guardrail

160‧‧‧浮起保持輸送裝置(保持構件的一例) 160‧‧‧Floating and holding conveyor (an example of holding member)

160A、160B、160C‧‧‧浮起保持輸送裝置(第一保持構件~第三保持構件的一例) 160A, 160B, 160C‧‧‧ floating holding conveyor (an example of the first holding member to the third holding member)

160X‧‧‧浮起保持輸送裝置 160X‧‧‧Floating holding conveyor

161‧‧‧輸送帶(構成保持構件) 161‧‧‧Conveyor belt (constituting the holding member)

161a、161b、161c‧‧‧輸送帶 161a, 161b, 161c‧‧‧ conveyor belt

161Aa、161Ab、161Ac‧‧‧輸送帶 161Aa, 161Ab, 161Ac‧‧‧ conveyor belt

161Ba、161Bb、161Bc‧‧‧輸送帶 161Ba, 161Bb, 161Bc‧‧‧ conveyor belt

162‧‧‧驅動輥 162‧‧‧ drive roller

162a‧‧‧驅動軸 162a‧‧‧ drive shaft

163‧‧‧從動輥 163‧‧‧ driven roller

164‧‧‧吸引孔 164‧‧‧Attraction hole

165‧‧‧保持單元 165‧‧‧keeping unit

166‧‧‧保持區域 166‧‧‧Holding area

179‧‧‧供給感測器 179‧‧‧Supply sensor

300、300A、300B‧‧‧空氣噴射噴嘴裝置(空氣噴出手段、第一空氣噴出構件的一例) 300, 300A, 300B‧‧‧ air injection nozzle device (an example of the air ejection means and the first air ejection means)

310‧‧‧負壓空氣室 310‧‧‧Negative air chamber

320‧‧‧空氣室 320‧‧ Air Chamber

322‧‧‧浮起噴嘴(空氣噴出手段、第一空氣噴出構件的構造) 322‧‧‧Floating nozzle (air ejection means, structure of first air ejection member)

330‧‧‧浮起鼓風機 330‧‧‧Floating blower

370‧‧‧側面空氣噴嘴(空氣噴出手段、第二空氣噴出構件的構造) 370‧‧‧ Side air nozzle (air ejection means, structure of second air ejection means)

380‧‧‧側面鼓風機 380‧‧‧ side blower

390‧‧‧吸引鼓風機 390‧‧‧Attracting blower

Aa‧‧‧浮起空氣 Aa‧‧‧ floating air

Ac‧‧‧側面空氣 Ac‧‧‧ side air

X‧‧‧輸送方向(電路基板用片的輸送方向、被輸送材料的輸送方向的一例) X‧‧‧Transport direction (an example of the transport direction of the board for the circuit board and the transport direction of the material to be transported)

Y‧‧‧寬度方向(電路基板用片的輸送方向正交於電路基板用片的積層方向的方向、被輸送材料的輸送方向正交於被輸送材料的積層方向的方向的一例) Y‧‧‧ width direction (an example in which the direction in which the board for the circuit board is conveyed is orthogonal to the direction of the lamination direction of the sheet for the circuit board, and the direction in which the conveyed material is conveyed is orthogonal to the direction of lamination of the material to be conveyed)

Z‧‧‧上下方向(電路基板用片的積層方向、被輸送材料的積層方 向的一例) Z‧‧‧Up-and-down direction (the lamination direction of the board for circuit boards and the lamination of the material to be transported) An example of the direction)

S1‧‧‧準備步驟 S1‧‧‧Preparation steps

S2‧‧‧浮起步驟 S2‧‧‧Floating steps

S3‧‧‧保持步驟 S3‧‧‧ Keep the steps

S4‧‧‧分開步驟 S4‧‧‧ separate steps

S5‧‧‧輸送步驟 S5‧‧‧ delivery steps

第1圖為示意地顯示用於關於本發明實施形態1之電路基板用片分離輸送方法的電路基板用片分離輸送裝置外觀的立體圖。 Fig. 1 is a perspective view schematically showing the appearance of a sheet separation and transport device for a circuit board according to the sheet separation and transport method for a circuit board according to the first embodiment of the present invention.

第2圖為顯示關於實施形態1之電路基板用片分離輸送裝置的立體圖。 Fig. 2 is a perspective view showing a sheet separation and transport device for a circuit board according to the first embodiment.

第3圖為顯示關於實施形態1之電路基板用片分離輸送裝置的電路基板用片分離狀態的示意圖。 Fig. 3 is a schematic view showing a state in which a circuit board for a circuit board for a circuit board according to the first embodiment is separated.

第4圖為顯示關於實施形態1之電路基板用片分離輸送裝置的俯視圖。 Fig. 4 is a plan view showing a sheet separation and transport device for a circuit board according to the first embodiment.

第5圖為顯示由實施形態1的電路基板用片分離輸送裝置執行的主要步驟的流程圖。 Fig. 5 is a flow chart showing the main steps executed by the sheet separation and conveying device for a circuit board of the first embodiment.

第6圖(a)、(b)、(c)為顯示關於實施形態1之電路基板用片分離輸送裝置的動作轉移狀態的圖。 (a), (b), and (c) of FIG. 6 are views showing an operation transition state of the sheet separation and transport device for a circuit board according to the first embodiment.

第7圖(a)、(b)為顯示接著第6圖(c)之電路基板用片分離輸送裝置的動作轉移狀態的圖。 (a) and (b) of FIG. 7 are diagrams showing an operation transition state of the sheet separation and transport device for a circuit board subsequent to Fig. 6(c).

第8圖為示意地顯示用於關於實施形態2之被輸送材料分離輸送方法的被輸送材料分離輸送裝置的立體圖。 Fig. 8 is a perspective view schematically showing a material conveying and conveying apparatus for a conveyed material separation and conveying method according to the second embodiment.

第9圖為說明利用關於實施形態2之浮起保持輸送裝置吸附保持被輸送材料的動作的示意圖。 Fig. 9 is a schematic view for explaining the operation of adsorbing and holding the material to be conveyed by the floating holding conveyor of the second embodiment.

第10圖為顯示實施形態1或實施形態2之浮起保持輸送裝置等其他的 具體例的圖。 Fig. 10 is a view showing another embodiment of the floating holding device of the first embodiment or the second embodiment. A diagram of a specific example.

第11圖為說明利用關於實施形態3之浮起保持輸送裝置吸附保持被輸送材料的動作的示意圖。 Fig. 11 is a schematic view for explaining the operation of adsorbing and holding the material to be conveyed by the floating holding conveyor of the third embodiment.

第12圖為說明利用關於實施形態4之浮起保持輸送裝置吸附保持被輸送材料的動作的示意圖。 Fig. 12 is a schematic view for explaining the operation of adsorbing and holding the material to be conveyed by the floating holding conveyor of the fourth embodiment.

以下,參照圖詳細地說明包含實施例的本發明的實施形態。所有各實施形態等,關於具有相同功能及形狀等的構成要素(構件或構成零件)等,只要沒有混淆之虞,在說明一次之後,就附上相同符號,省略其說明。 Hereinafter, embodiments of the present invention including the embodiments will be described in detail with reference to the drawings. In the respective embodiments, the components (members, components, and the like) having the same functions, shapes, and the like are denoted by the same reference numerals, and the description thereof is omitted, unless otherwise.

(實施形態1) (Embodiment 1)

茲就關於本發明實施形態1的電路基板用片分離方法及電路基板用片輸送方法進行說明。第1圖顯示關於本發明實施形態1之電路基板用片分離方法及實施電路基板用片輸送方法的裝置的一實施形態。再者,作為本發明實施對象的第1圖所示的電路基板用片分離輸送裝置130並不限於圖示者,其對象亦包含具備分類功能或檢查功能等的各種裝置。電路基板用片分離輸送裝置130執行作為電路基板用片輸送裝置及構成電路基板用片輸送裝置的電路基板用片分離裝置。 A sheet separation method for a circuit board and a sheet conveying method for a circuit board according to the first embodiment of the present invention will be described. Fig. 1 shows an embodiment of a method for separating a sheet for a circuit board and a method for transporting a sheet for a circuit board according to the first embodiment of the present invention. In addition, the sheet separation conveying device 130 for a circuit board shown in Fig. 1 which is a target of the present invention is not limited to the one shown in the drawings, and includes various devices including a classification function, an inspection function, and the like. The sheet separation/transfer apparatus 130 for a circuit board performs a sheet separation apparatus for a circuit board as a sheet conveying apparatus for a circuit board and a sheet conveying apparatus for a circuit board.

本發明的分離、輸送對象物即電路基板用片中包含用於眾所周知之所有電路基板的片。例如,包含使碳纖維或玻璃纖維布之類的纖維狀加強材料浸漬混合有硬化劑、著色劑等添加物的熱固化性樹脂等,並進行加熱或乾燥而製成半固化狀態的片狀強化塑膠成形材料(半固化片)。此外,也包含對半固化片或樹脂片等施以銅箔或金箔等處理者。 The sheet for a circuit board which is an object to be separated and transported according to the present invention includes a sheet for all of the well-known circuit boards. For example, a thermosetting resin obtained by impregnating a fibrous reinforcing material such as carbon fiber or glass fiber cloth with an additive such as a curing agent or a coloring agent, and heating or drying to form a sheet-shaped reinforced plastic in a semi-cured state Forming material (prepreg). Further, a treatment such as a copper foil or a gold foil is applied to a prepreg or a resin sheet.

就電路基板用片的寬度尺寸而言,舉出一例,可使用約100mm~700mm左右的電路基板用片。此外,就厚度而言,可使用約0.02mm~0.2mm左右的電路基板用片。 As an example of the width dimension of the sheet for a circuit board, a sheet for a circuit board of about 100 mm to 700 mm can be used. Further, as the thickness, a sheet for a circuit board of about 0.02 mm to 0.2 mm can be used.

再者,前述電路基板用片的厚度僅是一例,當然可使用前述範圍以外的厚度的電路基板用片。 In addition, the thickness of the sheet for a circuit board is only an example, and it is needless to say that a sheet for a circuit board having a thickness other than the above range can be used.

此處,輸送方向X相當於電路基板用片的輸送方向。上下方向Z相當於電路基板用片的積層方向。寬度方向Y相當於電路基板用片的輸送方向X正交於電路基板用片的積層方向即上下方向Z的方向。 Here, the transport direction X corresponds to the transport direction of the board for a circuit board. The vertical direction Z corresponds to the lamination direction of the sheet for a circuit board. The width direction Y corresponds to a direction in which the transport direction X of the circuit board sheet is orthogonal to the stacking direction of the circuit board sheet, that is, the vertical direction Z.

茲利用第1圖至第4圖,就電路基板用片分離輸送裝置及構成電路基板用片分離輸送裝置的浮起保持輸送裝置進行說明。第1圖為示意地顯示電路基板用片分離輸送裝置的立體圖,第2圖為顯示電路基板用片分離輸送裝置的立體圖,第3圖為顯示電路基板用片分離輸送裝置的電路基板用片分離狀態的示意圖,第4圖為顯示電路基板用片分離輸送裝置的俯視圖。各圖中適當顯示的空白箭頭或實線箭頭表示空氣往各裝置的出入方向。 The sheet separation conveying device for a circuit board and the floating holding conveyor device constituting the sheet separation conveying device for a circuit board will be described with reference to FIGS. 1 to 4 . Fig. 1 is a perspective view schematically showing a sheet separation and transport device for a circuit board, Fig. 2 is a perspective view showing a sheet separation and transport device for a circuit board, and Fig. 3 is a view showing a circuit board for separating a circuit board for a circuit board. FIG. 4 is a plan view showing a sheet separation and transport device for a circuit board. A blank arrow or a solid arrow appropriately displayed in each figure indicates the direction in which air enters and exits each device.

如第2圖所示,電路基板用片束1為使複數片的電路基板用片成為積層狀態者。在電路基板用片分離輸送裝置130方面,電路基板用片束1以積層狀態裝載、配置於底板即裝載台136上。 As shown in FIG. 2, the sheet bundle 1 for a circuit board is a state in which a plurality of sheets for a circuit board are laminated. In the sheet separation/separation device 130 for a circuit board, the sheet bundle 1 for a circuit board is placed in a stacked state and placed on a loading table 136 which is a bottom plate.

裝載台136執行作為以積層狀態準備電路基板用片的準備手段。裝載台136利用電路基板用片裝載部驅動手段即升降機構可在上下方向Z移動。此外,電路基板用片分離輸送裝置130具備:作為電路基板用片檢測手段的檢測感測器20,其檢測電路基板用片束1的上面位置;以及電路基板用片位置控制手段,其控制升降機構的驅動並控制電路基板用片束1的上面位置。藉此,裝載台136上的電路基板用片束1的上面位在由檢測感測器20檢測出的預定高度位置,就經由後述的動作,將最上位的電路基板用片1A分離輸送。 The loading stage 136 performs a preparation means for preparing a sheet for a circuit board in a laminated state. The loading table 136 is movable in the vertical direction Z by the elevating mechanism which is a driving means for the board for the circuit board. Further, the chip separation/transport apparatus 130 for a circuit board includes a detection sensor 20 as a chip detection means for a circuit board, which detects an upper position of the sheet 1 for circuit board, and a sheet position control means for the circuit board, which controls the elevation The mechanism drives and controls the upper position of the sheet bundle 1 for the circuit board. As a result, the upper surface of the sheet substrate 1 on the loading stage 136 is positioned at a predetermined height position detected by the detecting sensor 20, and the uppermost circuit board sheet 1A is separated and transported via an operation to be described later.

在電路基板用片分離輸送裝置130上設有一對電路基板用片位置限制構件即側面護欄137、137、前端導向板138、終端護欄139。側面護欄137、137配置於裝載台136的電路基板用片寬度方向Y上的兩側,進行與配置的電路基板用片束1的輸送方向X交叉(正交)的電路基板用片的寬度方向Y上的定位。前端導向板138進行相當於電路基板用片束1的輸送方向X上的長度方向前端的定位。再者,終端護欄139進行相同之長度方向後端的定位。 A pair of side rails 137 and 137, a front end rail 138, and a terminal guard rail 139, which are the sheet position regulating members for the circuit board, are provided in the sheet separation conveying device 130 for a circuit board. The side rails 137 and 137 are disposed on both sides in the sheet width direction Y of the circuit board 136 of the loading table 136, and are oriented in the width direction of the circuit board sheet which is crossed (orthogonal) with the transport direction X of the circuit board sheet 1 to be placed. Positioning on Y. The distal end guide plate 138 performs positioning in the longitudinal direction corresponding to the transport direction X of the circuit board sheet bundle 1. Furthermore, the terminal guard rail 139 performs the same rear end positioning in the longitudinal direction.

以兩點鏈線顯示於第2圖的側面護欄137、137一邊(圖中左內側)的側面空氣噴嘴370執行作為對電路基板用片束1的側端部噴出、吹出側面空氣 Ac(參照第4圖)的分開用送風手段、空氣噴出手段即第二空氣噴出構件。如第4圖所示,側面空氣噴嘴370連接於執行作為產生側面空氣Ac之側面空氣產生的側面鼓風機380。 The side air nozzle 370 which is displayed on the side rails 137 and 137 of the second figure (the left inner side in the drawing) is ejected as a side end portion of the sheet for the circuit board 1 and blows out the side air. Ac (refer to Fig. 4) a separate air blowing means, and a second air ejecting means, which is an air ejecting means. As shown in Fig. 4, the side air nozzle 370 is connected to the side air blower 380 which is generated as side air which generates the side air Ac.

第2圖的電路基板用片分離輸送裝置130與第3圖的浮起保持輸送裝置160具備驅動輥162、從動輥163、輸送帶161及負壓空氣室310。驅動輥162以驅動軸162a旋轉驅動,從動輥163隨著以驅動輥162的驅動轉動的輸送帶161而旋轉。輸送帶161為開有多數個與負壓空氣室310連通的吸引孔的環狀帶構件。負壓空氣室310連接於第4圖所示的吸引鼓風機390,從外部的吸引鼓風機390吸引而維持負壓狀態,以輸送帶161的吸引孔吸引、吸附最上位的電路基板用片1A。吸引鼓風機390具有作為產生吸引用空氣之吸引用空氣產生手段的功能。 The sheet separation conveying device 130 for the circuit board of FIG. 2 and the floating holding conveyor device 160 of the third drawing include a driving roller 162, a driven roller 163, a conveying belt 161, and a negative pressure air chamber 310. The driving roller 162 is rotationally driven by the driving shaft 162a, and the driven roller 163 rotates with the conveying belt 161 that is driven to rotate by the driving roller 162. The conveyor belt 161 is an endless belt member having a plurality of suction holes that communicate with the negative pressure air chamber 310. The suction air chamber 310 is connected to the suction blower 390 shown in FIG. 4, and is sucked by the external suction blower 390 to maintain the negative pressure state, and sucks and sucks the uppermost circuit board sheet 1A by the suction holes of the conveyor belt 161. The suction blower 390 has a function as a suction air generating means for generating suction air.

如上述,浮起保持輸送裝置160的輸送帶161具有下述功能:作為將浮起的電路基板用片以空氣吸引的負壓吸附而保持並使其分離的保持構件、及輸送保持的電路基板用片的輸送手段。 As described above, the conveyance belt 161 of the floating-and-holding conveyance device 160 has a function of holding and separating the floating circuit board for suction of the circuit board by the suction of the air, and the circuit board for transport and holding. The means of transport using the tablets.

浮起保持輸送裝置160可以按照電路基板用片的尺寸而加大浮起保持輸送裝置160的尺寸,並且也可以使用複數個浮起保持輸送裝置160。 The floating holding conveyor 160 can increase the size of the floating holding conveyor 160 in accordance with the size of the sheet for the circuit board, and a plurality of floating holding conveyors 160 can also be used.

浮起保持輸送裝置160可以是在保持及分離電路基板用片完畢之後開始輸送的形態,也可以是在保持及分離完畢之前開始輸送的形態。 The floating holding conveyor 160 may be in a form in which transportation is started after the sheet for holding and separating the circuit board is completed, or may be in a state in which transportation is started before the holding and separation are completed.

此外,所謂保持,係指即使是浮起的電路基板用片的一部分也保持於浮起保持輸送裝置160上的狀態。 In addition, the term "holding" refers to a state in which a part of the sheet for a circuit board that is floated is held by the floating holding conveyor 160.

在與裝載的電路基板用片束1的前端對向的位置上空氣噴出手段也配置空氣噴射噴嘴裝置300。空氣噴射噴嘴裝置300上配置有從外部送來經加壓過的氣體即空氣(以下也稱為氣體)而儲存的空氣室320。此外,如第3圖、第4圖所示,空氣室320上設有兩個浮起噴嘴322。 The air ejection nozzle device 300 is also disposed at a position opposite to the tip end of the loaded sheet 1 for circuit board. The air injection nozzle device 300 is provided with an air chamber 320 that is supplied with air (hereinafter also referred to as gas) that has been pressurized from the outside. Further, as shown in FIGS. 3 and 4, two floating nozzles 322 are provided in the air chamber 320.

如上述,空氣噴射噴嘴裝置300執行作為使裝載、準備於裝載台136上的電路基板用片浮起的浮起手段。再者,空氣噴射噴嘴裝置300執行作為對裝載的電路基板用片噴出空氣使其浮起的空氣噴出手段及在與輸送方向X相反方向噴出空氣的第一空氣噴出構件。 As described above, the air ejection nozzle device 300 performs a floating means for floating the sheet for the circuit board loaded and prepared on the loading table 136. In addition, the air jet nozzle device 300 executes an air ejecting means that ejects air to the loaded circuit board piece and floats, and a first air ejecting member that ejects air in a direction opposite to the transport direction X.

噴出空氣的方向為與輸送方向X相反方向即可,不一定是平行,也可以 是斜向。 The direction in which the air is ejected is opposite to the direction of the transport direction X, and may not necessarily be parallel. It is oblique.

氣體即空氣中也包含消除了靜電的空氣或其他為使電路基板用片浮起、一片一片地分離而使用的氣體等。特別是含有碳纖維的電路基板用片由於積層狀態的電路基板用片彼此因靜電的作用密合著而不易分離,所以對積層狀態的電路基板用片束1噴射消除了靜電的空氣是有效的。 The gas, that is, the air, also contains air that has been eliminated from static electricity or other gas that is used to separate the pieces of the circuit board and to be separated one by one. In particular, since the sheet for a circuit board containing the carbon fiber is not easily separated by the electrostatic interaction between the sheets for the circuit board in the laminated state, it is effective to eject the static electricity-eliminating air to the sheet bundle 1 for the circuit board in the laminated state.

如第3圖、第4圖所示,浮起噴嘴322係朝電路基板用片束1前側的端部(以下也稱為前端部)噴射浮起空氣Aa,使電路基板用片從電路基板用片束1浮起。此外,也可以進一步設置例如移位片的機構,浮起噴嘴322噴到比電路基板用片束1的前端部更靠中央的位置上而使電路基板用片的端部浮起。再者,若以噴出的空氣為溫風,則也增加對電路基板用片的除濕效果,可更加有效地進行分離、分開。 As shown in FIG. 3 and FIG. 4, the floating nozzle 322 ejects the floating air Aa toward the front end portion (hereinafter also referred to as a front end portion) of the sheet bundle 1 for the circuit board, and the circuit board sheet is used for the circuit board. The bundle 1 floats. In addition, for example, a mechanism for shifting the sheet may be further provided, and the floating nozzle 322 is sprayed at a position closer to the center than the front end portion of the sheet bundle 1 for circuit board, and the end portion of the sheet for the circuit board is floated. In addition, when the air to be blown is warm air, the dehumidifying effect on the sheet for a circuit board is also increased, and separation and separation can be performed more effectively.

第5圖為顯示由使用本發明的電路基板用片分離方法及電路基板用片輸送方法之本實施形態的電路基板用片分離裝置及電路基板用片輸送裝置所執行的主要步驟的圖。第6圖、第7圖為說明電路基板用片輸送裝置的動作轉移的圖。 FIG. 5 is a view showing main steps performed by the sheet separation device for a circuit board and the sheet conveying device for a circuit board according to the embodiment of the present invention. Fig. 6 and Fig. 7 are views for explaining the transition of the operation of the sheet conveying device for a circuit board.

首先,使用第6圖(a),就上述的電路基板用片分離輸送裝置130的構造及動作進行補充說明。第6圖(a)所示的電路基板用片分離輸送裝置130係從空氣室320朝裝載於裝載台136上的電路基板用片束1的前端部噴射浮起空氣Aa,利用此風使其浮起到輸送帶161(電路基板用片保持部)的高度。 First, the structure and operation of the above-described sheet separation and transport device 130 for a circuit board will be additionally described using FIG. 6(a). The sheet separation/transport apparatus 130 for a circuit board shown in Fig. 6(a) ejects the floating air Aa from the air chamber 320 toward the tip end portion of the sheet bundle 1 for the circuit board mounted on the loading table 136, and uses the wind to The height of the conveyor belt 161 (the board holding portion for a circuit board) is floated.

然後,利用吸引鼓風機390的動作,使電路基板用片束1最上面的一片為輸送帶161所保持。保持於輸送帶161上的最上位的電路基板用片1A不一定只是一片,有時電路基板用片間也以密合的狀態保持著。因此,利用於該處以設於側面護欄137、137上的分開用送風手段即側面空氣噴嘴370噴射側面空氣,將保持於輸送帶161上的電路基板用片1A分開成成為一片。所謂分開,係使空氣從側面空氣噴出,以使電路基板用片間的密合力降低,輔助使易分離。 Then, by the operation of the suction blower 390, the uppermost one of the sheet bundles 1 for the circuit board is held by the conveyor belt 161. The uppermost circuit board sheet 1A held on the conveyor belt 161 is not necessarily one piece, and the circuit board sheets may be held in close contact with each other. Therefore, the side air is sprayed by the side air nozzle 370 which is a separate air blowing means provided on the side rails 137, 137, and the circuit board sheet 1A held by the conveyance belt 161 is divided into one piece. Separation means that air is ejected from the side air to reduce the adhesion between the sheets for the circuit board, thereby facilitating easy separation.

其後,電路基板用片1A利用輸送帶161的輸送,被輸送到下一個輸送目的地(例如下一個步驟),其後進行必要的處理。 Thereafter, the circuit board sheet 1A is transported to the next transport destination by the transport of the transport belt 161 (for example, the next step), and then necessary processing is performed.

在空氣室320與裝載於最上部位的電路基板用片束1之間配 置有電路基板用片阻擋構件177,防止最上位的電路基板用片1A以外的電路基板用片被輸送。此外,為了使因隨著供給電路基板用片而減少的電路基板用片的最上面位置與輸送帶161的距離h時常成為一定,設有檢測電路基板用片高度的檢測感測器20。檢測感測器20為反射型的光感測器。基於檢測感測器20的信號,利用電路基板用片裝載部驅動手段(升降機構)使裝載台136上升而進行調整。 Between the air chamber 320 and the sheet bundle 1 for the circuit board mounted on the uppermost portion The chip blocking member 177 for a circuit board is placed to prevent the uppermost circuit board sheet other than the circuit board 1A from being transported. In addition, the detection sensor 20 for detecting the height of the sheet for the circuit board is provided in order to keep the distance h between the uppermost position of the sheet for the circuit board and the sheet 161 to be reduced as the sheet for supplying the circuit board is constant. The detecting sensor 20 is a reflective type photo sensor. Based on the signal of the detecting sensor 20, the loading stage 136 is raised and adjusted by the sheet loading unit driving means (elevating mechanism) for the circuit board.

電路基板用片束1在裝載台136上為了對合電路基板用片尺寸,使前端面一致作為基準面。此外,在浮起保持輸送裝置160的輸送方向X上的下游處設有進行電路基板用片到達檢測的供給感測器179。 The sheet bundle 1 for a circuit board has a front end surface which serves as a reference surface for matching the sheet size of the circuit board on the loading table 136. Further, a supply sensor 179 for detecting the arrival of the pieces for the circuit board is provided downstream of the transport direction X of the floating holding conveyor 160.

其次,就電路基板用片分離輸送裝置130的動作、步驟,按順序進行說明。 Next, the operation and steps of the sheet separation and transport device 130 for a circuit board will be described in order.

(1)以積層狀態準備電路基板用片的準備步驟(步驟S1)例如如下進行。具體而言,電路基板用片束1由操作者裝載於裝載台136上,並且為了對合電路基板用片尺寸而進行設定,將其前端面碰到前端導向板138,使其一致作為基準面。此外,藉由操作側面護欄137、137及終端護欄139,使電路基板用片束1的側端面及後端面分別一致。再者,在準備步驟中,也可以例如利用機器人或專用裝置取代操作者等的人手,如上述進行電路基板用片束1的裝載動作或電路基板用片尺寸對合。 (1) The preparation step (step S1) of preparing a sheet for a circuit board in a laminated state is performed, for example, as follows. Specifically, the sheet bundle 1 for a circuit board is mounted on the loading table 136 by an operator, and is set to match the sheet size of the circuit board, and the front end surface thereof is brought into contact with the front end guide plate 138 so as to be aligned as a reference surface. . Further, by operating the side rails 137 and 137 and the terminal guard rail 139, the side end faces and the rear end faces of the sheet bundle 1 for circuit boards are aligned. In addition, in the preparation step, for example, a robot or a dedicated device may be used instead of the operator's hand, and the loading operation of the circuit board sheet bundle 1 or the circuit board sheet size may be performed as described above.

電路基板用片供給指令從第1圖的電路基板用片分離輸送裝置130的控制部送來時,就如第6圖(b)所示,空氣噴射噴嘴裝置300的空氣室320、包含側面空氣噴嘴370的分開用送風手段就作動。然後,開始噴射往電路基板用片各端部的空氣之作為第一步驟的浮起步驟(第5圖的步驟S2)。噴射來自空氣室320的浮起噴嘴322的浮起空氣Aa,並且從側面空氣噴嘴370噴射側面空氣Ac,使所準備的裝載台136上的最上部的電路基板用片1A、1B、1C浮起。藉此,改變最上部的電路基板用片1A、1B、1C彼此的接觸面積。 When the chip supply command for the circuit board is sent from the control unit of the chip separation/transfer device 130 for the circuit board of Fig. 1, as shown in Fig. 6(b), the air chamber 320 of the air injection nozzle device 300 includes the side air. The nozzles 370 are separated by a blowing means. Then, the floating step of the first step of ejecting the air to the respective end portions of the sheet for the circuit board is started (step S2 of FIG. 5). The floating air Aa from the floating nozzle 322 of the air chamber 320 is ejected, and the side air Ac is ejected from the side air nozzle 370, so that the uppermost circuit board on the prepared loading table 136 is floated by the sheets 1A, 1B, 1C. . Thereby, the contact area of the uppermost circuit board sheets 1A, 1B, and 1C is changed.

同時,開始保持浮起的電路基板用片之作為第二步驟的保持步驟(第5圖的步驟S3),輸送帶161的空氣吸引開始。藉此,最上位的電路基板用片1A浮起,如第6圖(b)所示,將最上位的電路基板用片1A吸附保 持於輸送帶161上。 At the same time, the holding step of the floating circuit board for the circuit as the second step (step S3 of FIG. 5) is started, and the air suction of the conveyor belt 161 starts. Thereby, the uppermost circuit board sheet 1A is floated, and as shown in FIG. 6(b), the uppermost circuit board sheet 1A is adhered. Hold on the conveyor belt 161.

再者,在第6圖(b)中,以括弧附加於空氣室320或輸送帶161的符號上的(AD)表示處於空氣室320的噴射驅動狀態、輸送帶161的吸引驅動狀態。此外,附加於輸送帶161的符號上的(ST)表示輸送帶161處於停止狀態。 In addition, in (b) of FIG. 6, (AD) in which the brackets are attached to the air chamber 320 or the conveyance belt 161 indicates the suction driving state of the air chamber 320 and the suction driving state of the conveyor belt 161. Further, (ST) attached to the symbol of the conveyor belt 161 indicates that the conveyor belt 161 is in a stopped state.

第5圖的步驟S4的「分開步驟」為分開輸送帶161所保持的電路基板用片的步驟,如上述,由包含側面空氣噴嘴370的分開用送風手段進行。 The "separation step" of the step S4 in Fig. 5 is a step of separating the sheets for the circuit board held by the conveyor belt 161, and as described above, the separation air blowing means including the side air nozzles 370 is performed.

(2)接著,如第6圖(c)所示,開始輸送帶161的驅動,進行輸送由輸送帶161所保持的電路基板用片1A的輸送步驟(第5圖的步驟S5)。 (2) Next, as shown in Fig. 6(c), the driving of the conveyance belt 161 is started, and the conveyance step of the sheet 1A for the circuit board held by the conveyance belt 161 is carried out (step S5 of Fig. 5).

再者,在第6圖(c)中,以括弧附加於輸送帶161的符號上的(AD)表示處於旋轉輸送驅動狀態。 Further, in Fig. 6(c), (AD) which is attached to the symbol of the conveyor belt 161 in parentheses indicates that it is in the rotational conveyance driving state.

(3)接著,如第7圖(a)所示,電路基板用片1A到達供給感測器179後,經過預定的時間後,電路基板用片1A脫離輸送帶161後,停止旋轉輸送驅動。 (3) Next, as shown in Fig. 7(a), after the circuit board sheet 1A reaches the supply sensor 179, after a predetermined period of time elapses, the circuit board sheet 1A is separated from the conveyor belt 161, and then the rotation conveyance drive is stopped.

(4)電路基板用片1A脫離輸送帶161的保持區域之後隨即,如第7圖(b)所示,下一片電路基板用片1A利用空氣噴射浮起,保持於輸送帶161上。 (4) Immediately after the sheet 1A for the circuit board is separated from the holding area of the conveyance belt 161, as shown in FIG. 7(b), the sheet 1A for the next circuit board is floated by air jet and held on the conveyance belt 161.

(5)依照所設定的電路基板用片供給間隔,重新開始輸送帶161的驅動,進行電路基板用片1A的供給。 (5) The drive of the conveyance belt 161 is restarted in accordance with the set supply interval for the circuit board, and the supply of the circuit board sheet 1A is performed.

(6)以後,藉由重複進行上述第6圖(b)至第7圖(b),依次輸送電路基板用片。 (6) Thereafter, by repeating the above-described FIGS. 6(b) to 7(b), the sheets for the circuit board are sequentially conveyed.

在前述的電路基板用片供給動作方面,關於空氣室320、分開用送風手段、吸引鼓風機390的空氣的風量,未進行記載。以某值固定空氣的風量時,電路基板用片的浮起量或分開狀態會隨著裝載的電路基板用片的厚度、重量或尺寸而不同。 In the above-described sheet supply operation for the circuit board, the air volume of the air chamber 320, the air supply means for separation, and the suction blower 390 are not described. When the air volume of the air is fixed at a certain value, the amount of floating or separation of the sheets for the circuit board differs depending on the thickness, weight, or size of the sheet for mounting the circuit board.

例如,若電路基板用片的浮起量少,則會導致不進給(不供給),相反地,若為電路基板用片過度浮起的狀態,則造成電路基板用片會密合,導致多片重疊供給。此外,若吸引鼓風機390的力量小,則無法良好地輸送電路基板用片,此也會成為不進給。 For example, when the amount of floating of the sheet for a circuit board is small, no feeding (no supply) is caused, and if the sheet for the circuit board is excessively floated, the sheet for the circuit board is in close contact with each other. Multiple pieces of overlapping supply. Further, if the force of the suction blower 390 is small, the sheet for the circuit board cannot be conveyed satisfactorily, and this will not be fed.

因此,為了適當地進行電路基板用片供給,要預先決定符合 裝載的電路基板用片的風量,使用者或操作者選擇了想要進行電路基板用片供給的電路基板用片時,使其自動地成為該風量。然後,風量依鼓風機的負載值進行調整。 Therefore, in order to properly supply the sheet for the circuit board, it is necessary to determine the match in advance. When the user or the operator selects a sheet for a circuit board to be supplied with a sheet for a circuit board, the user or the operator automatically selects the air volume of the sheet for the circuit board to be loaded. Then, the air volume is adjusted according to the load value of the blower.

使用有傷痕的電路基板用片製作的電路基板,在電氣特性(電阻值)上會產生不當缺陷。因此,要分離電路基板用片,有必須進行在所分離的電路基板用片的電氣特性(電阻值)上不產生缺陷的課題。 A circuit board made of a chip for a circuit board having a flaw causes an undue defect in electrical characteristics (resistance value). Therefore, in order to separate the sheets for a circuit board, it is necessary to prevent the occurrence of defects in the electrical characteristics (resistance values) of the separated sheets for the circuit board.

對於此課題,藉由實施形態1可得到下述效果。在實施形態1方面,係一種電路基板用片分離方法,具有:步驟S1等的準備步驟,其係以積層狀態準備電路基板用片束1等電路基板用片;步驟S2等的第一步驟(浮起步驟),其係將層積的電路基板用片利用來自空氣噴射噴嘴裝置300等空氣噴出手段、空氣噴出構件的空氣噴出使電路基板用片浮起;以及步驟S3等的第二步驟(保持步驟),其係以輸送帶161等保持構件保持浮起的電路基板用片,並使其分離。 With respect to this problem, the following effects can be obtained by the first embodiment. In the first embodiment, the method for preparing a circuit board for a circuit board includes a step of preparing a circuit board such as a sheet bundle 1 for a circuit board in a laminated state, and a first step of step S2 or the like ( In the floating step, the laminated circuit board sheet is ejected by the air ejecting means such as the air ejecting nozzle device 300 or the air ejecting member to eject the circuit board piece; and the second step of step S3 or the like is performed ( In the step of holding, the sheet for the circuit board which is held by the holding member such as the conveyance belt 161 is separated and separated.

藉由實施形態1,取得下述基本的效果:可提供一種無損電路基板用片的品質(不使電路基板用片帶有傷痕)而可容易進行電路基板用片分離的電路基板用片分離方法。使用有傷痕的電路基板用片製作的電路基板在電阻值等特性上會產生缺陷。然而,藉由實施形態1,可提供一種無損電路基板用片的品質(不使電路基板用片帶有傷痕)而可容易進行電路基板用片分離的電路基板用片分離方法,所以可防止此種電路基板的缺陷。此效果可解決有關電路基板用片分離的特有技術課題。 According to the first embodiment, the following basic effects can be obtained: a sheet separation method for a circuit board which can easily perform separation of a sheet for a circuit board without deteriorating the quality of the sheet for a circuit board (with no scratches on the sheet for a circuit board) . A circuit board produced using a sheet for a circuit board having a flaw has defects in characteristics such as resistance value. However, according to the first embodiment, it is possible to provide a method for separating a sheet for a circuit board which can easily perform the separation of the sheet for a circuit board without deteriorating the quality of the sheet for a circuit board (there is no scratch on the sheet for the circuit board). A defect in a circuit board. This effect solves the unique technical problem concerning the separation of the sheets for the circuit board.

在實施形態1方面,一種電路基板用片分離方法,其作為空氣噴出手段,係使用在與電路基板用片的輸送方向X等輸送方向相反方向噴出空氣的空氣噴射噴嘴裝置300等的第一空氣噴出構件以及在與輸送方向正交的寬度方向Y等寬度方向噴出空氣的側面空氣噴嘴370等的第二空氣噴出構件。 According to the first aspect of the invention, there is provided a method for separating a sheet for a circuit board, wherein the first air of the air jet nozzle device 300 that ejects air in a direction opposite to a transport direction such as a transport direction X of the circuit board sheet is used as the air ejecting means. The discharge member and the second air ejection member such as the side air nozzle 370 that ejects air in the width direction of the width direction Y orthogonal to the conveyance direction.

此外,在實施形態1方面,一種電路基板用片分離方法,其係在第二步驟中包含步驟S4等的分開步驟,該步驟S4等的分開步驟係第二空氣噴出構件分開電路基板用片。 According to a first aspect of the invention, there is provided a method for separating a circuit board, wherein the second step includes a separating step of step S4 or the like, and the separating step of step S4 or the like is a step of separating the circuit board for the second air ejecting member.

此外,在實施形態1方面,係一種電路基板用片分離方法,其在第二步 驟結束後,停止來自空氣噴出構件的空氣噴出。 Further, in the first embodiment, the present invention relates to a sheet separation method for a circuit board, which is in the second step. After the end of the step, the air from the air ejecting member is stopped.

此外,在實施形態1方面,係一種電路基板用片分離方法,該方法為輸送帶161等保持構件係以吸引空氣的負壓吸附保持浮起的電路基板用片。 Further, the first embodiment is a sheet separation method for a circuit board, which is a sheet for a circuit board in which a holding member such as a conveyance belt 161 is sucked and held by a suction of suction air.

此外,在實施形態1方面,係一種電路基板用片分離方法,其係升降控制裝載台,以使裝載於裝載電路基板用片後、將沿著電路基板用片的積層方向升降的裝載台136等裝載台上的電路基板用片的上面位置經常保持在一定位置。 Further, in the first embodiment, a sheet separation method for a circuit board is provided in which the loading and unloading control loading table is mounted on the loading table 136 which is mounted on the board for mounting the circuit board and is moved up and down along the lamination direction of the sheet for the circuit board. The upper position of the sheet for the circuit board on the loading platform is often kept at a certain position.

藉由實施形態1,可得到下述效果:可提供一種無損電路基板用片的品質(不使電路基板用片帶有傷痕)而可容易且確實地進行電路基板用片分離的電路基板用片分離方法。 According to the first embodiment, it is possible to provide a circuit board sheet which can easily and reliably perform separation of the circuit board sheets without deteriorating the quality of the circuit board sheet (with no scratches on the circuit board sheet). Separation method.

此外,在實施形態1方面,係一種使用電路基板用片分離裝置的電路基板用片輸送方法,其具有步驟S5等的輸送步驟,該步驟S5等的輸送步驟係輸送所保持的電路基板用片。 Further, in the first embodiment, the method for transporting a circuit board for a circuit board using a chip separation device for a circuit board includes a transport step of step S5 or the like, and the transport step of step S5 or the like is to transport the held circuit board for a circuit board. .

藉由實施形態1,可得到下述效果:可提供一種可確實地輸送被分離的電路基板用片的電路基板用片輸送方法。使用有傷痕的電路基板用片製作的電路基板在電阻值等特性上會產生缺陷。然而,藉由實施形態1,可提供一種無損電路基板用片的品質(不使電路基板用片帶有傷痕)而可容易進行電路基板用片分離的電路基板用片分離方法,所以可防止此種電路基板的缺陷。此效果可解決關於電路基板用片的特有技術課題。 According to the first embodiment, it is possible to obtain a film transfer method for a circuit board which can reliably convey the separated sheet for a circuit board. A circuit board produced using a sheet for a circuit board having a flaw has defects in characteristics such as resistance value. However, according to the first embodiment, it is possible to provide a method for separating a sheet for a circuit board which can easily perform the separation of the sheet for a circuit board without deteriorating the quality of the sheet for a circuit board (there is no scratch on the sheet for the circuit board). A defect in a circuit board. This effect can solve the specific technical problem of the sheet for a circuit board.

此外,在實施形態1方面,係一種關於電路基板用片分離輸送裝置130等電路基板用片分離裝置的技術構造,該電路基板用片分離輸送裝置130等電路基板用片分離裝置具有:裝載台136等準備手段,其係以積層狀態準備電路基板用片束1等電路基板用片;空氣噴射噴嘴裝置300等噴出空氣手段,其係對準備層積的電路基板用片噴出空氣,使其浮起;以及輸送帶161等保持構件,其係保持浮起的電路基板用片,使其分離。 Further, in the first embodiment, the chip separation device for a circuit board such as the chip separation/transfer device 130 for a circuit board has a technical structure, and the disk separation device for a circuit board such as the chip separation and transport device 130 for a circuit board has a loading table. A preparation means for preparing a circuit board such as a sheet bundle 1 for a circuit board in a laminated state, and an air blowing means such as an air jet nozzle device 300, which ejects air to a circuit board sheet to be laminated, and floats And a holding member such as a conveyor belt 161 that holds the floating circuit board for separation.

藉由實施形態1,可得到下述效果:可提供一種無損電路基板用片的品質而可容易進行電路基板用片分離的電路基板用片分離裝置。使用有傷痕的電路基板用片製作的電路基板在電阻值等特性上會產生缺陷。然 而,藉由實施形態1,可提供一種無損電路基板用片的品質(不使電路基板用片帶有傷痕)而可容易進行電路基板用片分離的電路基板用片分離裝置,所以可防止此種電路基板的缺陷。此效果可解決關於電路基板用片的特有技術課題。 According to the first embodiment, it is possible to provide a sheet separation device for a circuit board which can easily remove the quality of the sheet for a circuit board and can easily separate the sheet for the circuit board. A circuit board produced using a sheet for a circuit board having a flaw has defects in characteristics such as resistance value. Of course According to the first embodiment, it is possible to provide a chip separation device for a circuit board which can easily perform the separation of the substrate for the circuit board without deteriorating the quality of the sheet for the circuit board (the wafer for the circuit board is not scratched). A defect in a circuit board. This effect can solve the specific technical problem of the sheet for a circuit board.

(實施形態2) (Embodiment 2)

茲利用第8圖、第9圖,就關於本發明實施形態2之被輸送材料分離輸送裝置130A進行說明。第8圖為示意地顯示關於實施形態2之被輸送材料分離輸送裝置的立體圖,第9圖為說明利用第8圖之浮起保持輸送裝置吸附保持被輸送材料的動作的示意圖。 The transported material separation and transport device 130A according to the second embodiment of the present invention will be described with reference to Figs. 8 and 9 . Fig. 8 is a perspective view schematically showing the transported material separation and transport device of the second embodiment, and Fig. 9 is a schematic view for explaining the operation of adsorbing and holding the material to be transported by the floating holding transport device of Fig. 8.

實施形態2使用被輸送材料分離輸送裝置130A。 In the second embodiment, the transported material separation and transport device 130A is used.

被輸送材料包含可由本發明之被輸送材料分離輸送裝置分離輸送的薄板狀或片狀的構件,包含銅箔等金屬箔或施以電鍍處理等的電子電路基板材料、紙、特殊薄膜、塑膠膜、半固化片等電子電路基板用片等。此外,被輸送材料可由本發明之被輸送材料分離輸送裝置分離即可,未必限於薄板狀或片狀的構件。 The material to be conveyed includes a thin plate-like or sheet-like member that can be separated and transported by the transported material separation and transport device of the present invention, and includes a metal foil such as copper foil or an electronic circuit board material subjected to plating treatment, paper, a special film, a plastic film. A sheet for an electronic circuit board such as a prepreg or the like. Further, the material to be conveyed may be separated from the material to be transported by the transporting material of the present invention, and is not necessarily limited to a thin plate or a sheet member.

此處,就被輸送材料的尺寸(寬度尺寸×長度尺寸)進行說明。大尺寸為大約寬度尺寸700mm×長度尺寸700mm,中尺寸為大約寬度尺寸420mm×長度尺寸594mm,小尺寸為大約寬度尺寸210mm×長度尺寸297mm。 Here, the size (width dimension x length dimension) of the material to be conveyed will be described. The large size is about 700 mm in width width × 700 mm in length, the middle dimension is about 420 mm in width dimension × 594 mm in length dimension, and the small dimension is about 210 mm in width dimension and 297 mm in length dimension.

如第8圖所示,實施形態2之被輸送材料分離輸送裝置130A使用沿著寬度方向Y上設置的兩個空氣噴射噴嘴裝置300A、300B及兩個浮起保持輸送裝置160A、160B。浮起保持輸送裝置160A、160B在相對於被輸送材料的輸送方向X與前述被輸送材料的積層方向即高度方向Z的垂直方向即寬度方向Y上設於不同的位置即可,未必需要直線對準設置。以兩個空氣噴射噴嘴裝置300A、300B使被輸送材料在寬度方向Y上的浮起力增加,同時以兩個浮起保持輸送裝置160A、160B使被輸送材料在寬度方向Y上的吸附保持力增加。 As shown in Fig. 8, the conveyed material separation and conveyance device 130A of the second embodiment uses two air injection nozzle devices 300A and 300B and two floating and holding conveyors 160A and 160B provided along the width direction Y. The floating-and-holding conveyance devices 160A and 160B may be disposed at different positions in the width direction Y which is the vertical direction of the height direction Z of the conveyance direction of the material to be conveyed, that is, the conveyance direction of the material to be conveyed, and may not necessarily require a straight line pair. Pre-set. The floating force of the material to be conveyed in the width direction Y is increased by the two air ejection nozzle devices 300A, 300B, and the adsorption holding force of the material to be conveyed in the width direction Y is controlled by the two floating holding conveying devices 160A, 160B. increase.

兩個空氣噴射噴嘴裝置300A、300B分別與實施形態1之單一空氣噴射噴嘴裝置300的內部構造相同。空氣噴射噴嘴裝置300A、300B進行各個浮起鼓風機的通/斷控制,以便保持(固持)、分離由浮起保持輸 送裝置160A、160B浮起的被輸送材料後,停止空氣噴出。再者,在本實施形態方面,雖然顯示以吸引空氣的負壓吸附保持並使其分離的保持構件之例,但未必限於空氣,也包含靜電的吸附。 The two air injection nozzle devices 300A and 300B are the same as the internal structure of the single air injection nozzle device 300 of the first embodiment. The air injection nozzle devices 300A, 300B perform on/off control of each floating blower to maintain (hold) and separate from floating to maintain After the materials to be transported by the feeding devices 160A and 160B are floated, the air is stopped. Further, in the present embodiment, an example of a holding member that sucks and holds and suctions the suction air is shown, but it is not necessarily limited to air, and includes electrostatic adsorption.

兩個浮起保持輸送裝置160A、160B與實施形態1的浮起保持輸送裝置160的內部構造分別相同。浮起保持輸送裝置160A執行作為本發明的第一保持構件,浮起保持輸送裝置160B執行作為本發明的第二保持構件。 The internal structures of the two floating holding conveyors 160A and 160B and the floating holding conveyor 160 of the first embodiment are respectively the same. The floating holding conveying device 160A performs the first holding member as the present invention, and the floating holding conveying device 160B performs the second holding member as the present invention.

如第9圖所示,浮起保持輸送裝置160A與浮起保持輸送裝置160B沿著寬度方向Y而互相鄰接配置。如第9圖所示,浮起的被輸送材料1A保持於浮起保持輸送裝置160A的輸送帶161上後,吸附保持於浮起保持輸送裝置160B的輸送帶161上。關於被輸送材料1A吸附保持於浮起保持輸送裝置160A、浮起保持輸送裝置160B的各輸送帶161上的順序的控制方法,係進行各個吸引鼓風機390(參照第4圖)的通/斷控制,以便成為如上述的順序。接通的定時不同、相同都按該順序保持被輸送材料1A即可(在後述的實施形態2~4的控制方面也相同)。 As shown in Fig. 9, the floating holding conveyor 160A and the floating holding conveyor 160B are disposed adjacent to each other along the width direction Y. As shown in Fig. 9, the floating conveyed material 1A is held by the conveyance belt 161 of the floating holding conveyor 160A, and is adsorbed and held on the conveyance belt 161 of the floating holding conveyor 160B. The control method of the order in which the conveyed material 1A is adsorbed and held on each of the conveyance belts 161 of the floating holding conveyor 160A and the floating holding conveyor 160B is an on/off control of each suction blower 390 (see FIG. 4). In order to become the order as described above. The timing of turning on is the same as that of the material 1A to be conveyed in this order (the same applies to the control of the second to fourth embodiments to be described later).

如上述,藉由實施形態2,可提供一種無損被輸送材料的品質而可容易進行分離的被輸送材料分離方法及被輸送材料分離裝置。浮起的被輸送材料保持於浮起保持輸送裝置160A上後,保持於鄰接配置的浮起保持輸送裝置160B上。因此,保持於浮起保持輸送裝置160A上的被輸送材料可不發生撓曲或皺紋而保持於浮起保持輸送裝置160B上。因此,可無損被輸送材料的品質而容易進行分離。 As described above, according to the second embodiment, it is possible to provide a material to be transported method and a material to be transported which can be easily separated without impairing the quality of the material to be conveyed. After the floating conveyed material is held by the floating holding conveyor 160A, it is held by the floating holding conveyor 160B disposed adjacently. Therefore, the material to be conveyed held on the floating holding conveyor 160A can be held on the floating holding conveyor 160B without being bent or wrinkled. Therefore, the separation can be easily performed without deteriorating the quality of the material to be conveyed.

此處,先就本發明的「保持構件」進行定義。即,所謂「保持構件」,係指進行空氣吸引或輸送帶的驅動的一個單位。 Here, the "holding member" of the present invention is first defined. That is, the "holding member" means one unit that performs air suction or driving of the conveyor belt.

例如,如第10圖所示,在浮起保持輸送裝置160X方面,即使三個輸送帶161a、161b、161c構成保持單元165,若一體控制空氣吸引或輸送帶的驅動,則全體也作為一個「保持構件」。 For example, as shown in Fig. 10, in the case of the floating holding conveyor 160X, even if the three conveyor belts 161a, 161b, and 161c constitute the holding unit 165, if the air suction or the driving of the conveyor belt is integrally controlled, the whole is also used as a " Keep the components".

例如,如第9圖中以兩點鏈線所示,浮起保持輸送裝置160A具有三個輸送帶161Aa、161Ab、161Ac,浮起保持輸送裝置160B具有三個輸送帶161Ba、161Bb、161Bc。此情況,空氣吸引或輸送帶的驅動分別以浮起保持 輸送裝置160A、浮起保持輸送裝置160B的單位控制,所以浮起保持輸送裝置160A與浮起保持輸送裝置160B成為「保持構件」。 For example, as shown by the two-dot chain line in Fig. 9, the floating holding conveyor 160A has three conveyor belts 161Aa, 161Ab, 161Ac, and the floating holding conveyor 160B has three conveyor belts 161Ba, 161Bb, 161Bc. In this case, the air suction or the drive of the conveyor belt are respectively held by the float Since the unit of the conveying device 160A and the floating holding conveyor 160B is controlled, the floating holding conveyor 160A and the floating holding conveyor 160B become "holding members".

在本實施形態方面,係下述控制:浮起保持輸送裝置160A的輸送帶161Aa、161Ab、161Ac的浮起鼓風機成為接通,其後浮起保持輸送裝置160B的輸送帶161Ba、161Bb、161Bc的浮起鼓風機成為接通。然而,在本實施形態方面,被輸送材料保持於浮起保持輸送裝置160A上後,被輸送材料保持於浮起保持輸送裝置160B上亦可。因此,例如浮起保持輸送裝置160A與浮起保持輸送裝置160B在吸引力上有差異時,也有可能浮起鼓風機同時成為接通。 In the present embodiment, the floating blowers of the conveyor belts 161Aa, 161Ab, and 161Ac of the floating holding conveyor 160A are turned on, and thereafter, the conveyor belts 161Ba, 161Bb, and 161Bc of the transporting device 160B are floated and held. The floating blower is turned on. However, in the present embodiment, after the material to be conveyed is held by the floating holding conveyor 160A, the conveyed material may be held by the floating holding conveyor 160B. Therefore, for example, when the floating holding conveyor 160A and the floating holding conveyor 160B differ in attraction force, there is a possibility that the floating blower is simultaneously turned on.

在第10圖中,在浮起保持輸送裝置160X方面,係三個輸送帶161a、161b、161c構成保持單元165,利用一個吸引鼓風機進行空氣吸引,並且利用一個驅動馬達驅動三個輸送帶161a、161b、161c。 In Fig. 10, in terms of the floating holding conveyor 160X, three conveying belts 161a, 161b, 161c constitute a holding unit 165, air suction is performed by a suction blower, and three conveying belts 161a are driven by one driving motor, 161b, 161c.

在第10圖中,164表示貫穿輸送帶161a、161b、161c而開孔的吸引孔,166表示電路基板用片的保持區域。浮起保持輸送裝置160X顯示實施形態1的浮起保持輸送裝置160或實施形態2的浮起保持輸送裝置160A、160B等其他的具體例。 In Fig. 10, reference numeral 164 denotes a suction hole through which the conveyor belts 161a, 161b, and 161c are opened, and 166 denotes a holding region of the sheet for a circuit board. The floating holding conveyor 160X displays other specific examples such as the floating holding conveyor 160 of the first embodiment or the floating holding conveyors 160A and 160B of the second embodiment.

(實施形態3) (Embodiment 3)

茲利用第11圖,就實施形態3,以與實施形態2不同之點為中心而進行說明。第11圖為說明利用關於實施形態3之浮起保持輸送裝置吸附保持被輸送材料的動作的示意圖。 In the third embodiment, the third embodiment will be described with a focus on the difference from the second embodiment. Fig. 11 is a schematic view for explaining the operation of adsorbing and holding the material to be conveyed by the floating holding conveyor of the third embodiment.

實施形態3使用三個浮起保持輸送裝置160A、160B、160C。雖然對應於第三個浮起保持輸送裝置160C而通常配置有空氣噴射噴嘴裝置,但在第11圖中省略了其圖示。在實施形態3方面,使用三個浮起保持輸送裝置160A、160B、160C等可將被輸送材料分離而輸送。 In the third embodiment, three floating holding conveyors 160A, 160B, and 160C are used. Although the air jet nozzle device is generally disposed corresponding to the third floating holding conveyor 160C, the illustration thereof is omitted in FIG. In the third embodiment, the conveyed material can be separated and transported using the three floating holding conveyors 160A, 160B, 160C and the like.

三個浮起保持輸送裝置160A、160B、160C與實施形態1的單一浮起保持輸送裝置160的內部構造分別相同。在省略圖的三個空氣噴射噴嘴裝置方面,利用浮起保持輸送裝置160A、160B、160C保持(固持)分離浮起的被輸送材料後,進行各個浮起鼓風機的通/斷控制,以便停止空氣噴出。 The internal structures of the three floating holding conveyors 160A, 160B, and 160C and the single floating holding conveyor 160 of the first embodiment are respectively the same. In the case of omitting the three air-injecting nozzle devices of the drawing, the floating-and-holding conveying means 160A, 160B, 160C are used to hold (hold) the separated floating conveyed material, and then the on/off control of each floating blower is performed to stop the air. ejection.

浮起保持輸送裝置160B執行作為本發明的第一保持構件,浮起保持輸送裝置160C執行作為本發明的第二保持構件,浮起保持輸送裝置160A執行作為本發明的第三保持構件。 The floating holding conveying device 160B performs the first holding member as the present invention, the floating holding conveying device 160C performs the second holding member as the present invention, and the floating holding conveying device 160A performs the third holding member as the present invention.

如第11圖所示,浮起保持輸送裝置160B與浮起保持輸送裝置160C沿著寬度方向Y而互相鄰接配置。浮起保持輸送裝置160B設置於浮起保持輸送裝置160C與浮起保持輸送裝置160A之間。 As shown in Fig. 11, the floating holding conveyor 160B and the floating holding conveyor 160C are disposed adjacent to each other along the width direction Y. The floating holding conveyor 160B is disposed between the floating holding conveyor 160C and the floating holding conveyor 160A.

如第11圖所示,浮起的被輸送材料1A最初保持於浮起保持輸送裝置160B的輸送帶161上後,吸附保持於浮起保持輸送裝置160A與浮起保持輸送裝置160C的輸送帶161上。 As shown in Fig. 11, the floating conveyed material 1A is initially held on the conveyance belt 161 of the floating holding conveyor 160B, and is sucked and held by the conveyance belt 161 of the floating holding conveyor 160A and the floating holding conveyor 160C. on.

如上述,藉由實施形態3,可提供一種無損被輸送材料的品質而可容易進行分離的被輸送材料分離方法及被輸送材料分離裝置。浮起的被輸送材料保持於設置於浮起保持輸送裝置160A與浮起保持輸送裝置160C之間的浮起保持輸送裝置160B上後,保持於鄰接配置的浮起保持輸送裝置160A上。因此,保持於浮起保持輸送裝置160B上的被輸送材料可不發生撓曲或皺紋而保持於浮起保持輸送裝置160A上,其後保持於浮起保持輸送裝置160C上。因此,可無損被輸送材料的品質而容易進行分離。 As described above, according to the third embodiment, it is possible to provide a method of separating a conveyed material and a material to be transported which can be easily separated without impairing the quality of the material to be conveyed. The floating conveyed material is held by the floating holding conveyor 160B provided between the floating holding conveyor 160A and the floating holding conveyor 160C, and then held by the floating holding conveyor 160A disposed adjacent to each other. Therefore, the material to be conveyed held on the floating holding conveyor 160B can be held on the floating holding conveyor 160A without being bent or wrinkled, and thereafter held on the floating holding conveyor 160C. Therefore, the separation can be easily performed without deteriorating the quality of the material to be conveyed.

(實施形態4) (Embodiment 4)

不限於第11圖所示的實施形態3,也可以是第12圖所示的實施形態4。第12圖為說明利用關於實施形態4之由浮起保持輸送裝置吸附保持被輸送材料的動作的示意圖。 It is not limited to the third embodiment shown in Fig. 11, and may be the fourth embodiment shown in Fig. 12. Fig. 12 is a schematic view for explaining the operation of adsorbing and holding the material to be conveyed by the floating holding conveyor according to the fourth embodiment.

相較於實施形態3,實施形態4僅在改變利用三個浮起保持輸送裝置160A、160B、160C的輸送帶161吸附保持被輸送材料的順序此點有不同。在實施形態4方面,浮起保持輸送裝置160A執行作為本發明的第一保持構件,浮起保持輸送裝置160B執行作為本發明的第二保持構件,浮起保持輸送裝置160C執行作為本發明的第三保持構件。 Compared with the third embodiment, the fourth embodiment differs only in the order of changing the order in which the conveyance belts 161 by the three floating holding conveyors 160A, 160B, and 160C are sucked and held. In the fourth embodiment, the floating holding conveying device 160A executes the first holding member as the present invention, and the floating holding conveying device 160B executes the second holding member as the present invention, and the floating holding conveying device 160C executes as the first aspect of the present invention. Three holding members.

如第12圖所示,浮起保持輸送裝置160A與浮起保持輸送裝置160B沿著寬度方向Y而互相鄰接配置。浮起保持輸送裝置160B設置於浮起保持輸送裝置160A與浮起保持輸送裝置160C之間。 As shown in Fig. 12, the floating holding conveyor 160A and the floating holding conveyor 160B are disposed adjacent to each other along the width direction Y. The floating holding conveyor 160B is disposed between the floating holding conveyor 160A and the floating holding conveyor 160C.

如第12圖所示,浮起的被輸送材料1A最初保持於浮起保持輸送裝置 160A的輸送帶161上後,吸附保持於浮起保持輸送裝置160B的輸送帶161上。 As shown in Fig. 12, the floating conveyed material 1A is initially held in the floating holding conveyor After the conveyor belt 161 of 160A is placed, it is adsorbed and held on the conveyor belt 161 of the floating holding conveyor 160B.

如上述,藉由實施形態4,可提供一種無損被輸送材料的品質而可容易進行分離的被輸送材料分離方法及被輸送材料分離裝置。浮起的被輸送材料保持於浮起保持輸送裝置160A上後,保持於鄰接配置的浮起保持輸送裝置160B上。因此,保持於浮起保持輸送裝置160A上的被輸送材料可不發生撓曲或皺紋而保持於浮起保持輸送裝置160B上,其後保持於浮起保持輸送裝置160C上。因此,可無損被輸送材料的品質而容易進行分離。 As described above, according to the fourth embodiment, it is possible to provide a method of separating a conveyed material and a material to be transported which can be easily separated without impairing the quality of the material to be conveyed. After the floating conveyed material is held by the floating holding conveyor 160A, it is held by the floating holding conveyor 160B disposed adjacently. Therefore, the material to be conveyed held on the floating holding conveyor 160A can be held on the floating holding conveyor 160B without being bent or wrinkled, and thereafter held on the floating holding conveyor 160C. Therefore, the separation can be easily performed without deteriorating the quality of the material to be conveyed.

以上,雖然就本發明較佳的實施形態進行了說明,但本發明並不限於此種特定的實施形態,只要在上述的說明中未特別限定,在申請專利範圍所記載的本發明的宗旨的範圍內,就可進行各種變形、變更。例如,也可以是適當組合記載於上述實施形態或變化例等的技術事項者。 Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the specific embodiments, and the invention is not particularly limited as described in the claims. Various modifications and changes are possible within the scope. For example, it is also possible to appropriately combine the technical matters described in the above-described embodiment or modification.

適當記載於本發明實施形態中的效果只不過是列舉由本發明產生的最適宜的效果而已,本發明的效果並不限於記載於本發明實施形態中的效果。 The effects described as appropriate in the embodiments of the present invention are merely illustrative of the most preferable effects produced by the present invention, and the effects of the present invention are not limited to the effects described in the embodiments of the present invention.

S1‧‧‧準備步驟 S1‧‧‧Preparation steps

S2‧‧‧浮起步驟 S2‧‧‧Floating steps

S3‧‧‧保持步驟 S3‧‧‧ Keep the steps

S4‧‧‧分開步驟 S4‧‧‧ separate steps

S5‧‧‧輸送步驟 S5‧‧‧ delivery steps

Claims (18)

一種電路基板用片分離方法,具有:第一步驟,其係將層積的電路基板用片利用來自空氣噴出手段的空氣噴出使電路基板用片的端部浮起;以及第二步驟,其係在前述第一步驟之後,以保持構件保持前述浮起的電路基板用片,並使其分離。 A sheet separation method for a circuit board, comprising: a first step of ejecting a laminated circuit board sheet by air from an air ejecting means to float an end portion of the circuit board sheet; and a second step After the first step described above, the above-mentioned sheet for floating circuit board is held by the holding member and separated. 如申請專利範圍第1項所述之電路基板用片分離方法,其中具有:第三步驟,其係使前述電路基板用片輸送,而作為前述保持構件,係使用第一保持構件與第二保持構件,該等構件係在相對於前述電路基板用片的輸送方向與前述電路基板用片的積層方向的垂直方向上設於不同的位置,前述第一保持構件與前述第二保持構件相鄰接,前述保持構件被控制成將前述浮起的電路基板用片保持於前述第一保持構件上後,保持於前述第二保持構件上。 The method for separating a sheet for a circuit board according to claim 1, further comprising: a third step of transporting the sheet for the circuit board, and using the first holding member and the second holding as the holding member The member is provided at a different position in a direction perpendicular to a direction in which the sheet for the circuit board is conveyed in a direction perpendicular to a lamination direction of the sheet for a circuit board, and the first holding member is adjacent to the second holding member The holding member is controlled to hold the floating circuit board piece on the first holding member, and then hold the second holding member. 如申請專利範圍第1項所述之電路基板用片分離方法,其中在前述第二步驟中,作為前述保持構件,係使用第一保持構件、第二保持構件及第三保持構件,該等構件係在相對於前述電路基板用片的輸送方向與前述電路基板用片的積層方向的垂直方向上設於不同的位置,前述第一保持構件與前述第二保持構件相鄰接,前述第一保持構件設於前述第二保持構件與第三保持構件之間,前述保持構件被控制成將前述浮起的電路基板用片最初保持於前述第一保持構件上。 The sheet separation method for a circuit board according to claim 1, wherein in the second step, the holding member is a first holding member, a second holding member, and a third holding member, and the members are used. The first holding member and the second holding member are adjacent to each other in a direction perpendicular to a direction in which the sheet for the circuit board is conveyed in a direction perpendicular to a lamination direction of the sheet for a circuit board, and the first holding is performed The member is provided between the second holding member and the third holding member, and the holding member is controlled to initially hold the floating sheet for the circuit board on the first holding member. 如申請專利範圍第1項所述之電路基板用片分離方法,其中在前述第二步驟中,作為前述保持構件,係使用第一保持構件、第二保持構件及第三保持構件,該等構件係在相對於前述電路基板用片的輸送方向與前述電路基板用片的積層方向的垂直方向上設於不同的位置,前述第一保持構件與前述第二保持構件相鄰接, 前述第二保持構件設於前述第一保持構件與第三保持構件之間,前述保持構件被控制成將前述浮起的電路基板用片最初保持於前述第一保持構件上後,保持於前述第二保持構件上。 The sheet separation method for a circuit board according to claim 1, wherein in the second step, the holding member is a first holding member, a second holding member, and a third holding member, and the members are used. The first holding member and the second holding member are adjacent to each other in a direction perpendicular to a direction in which the sheet for the circuit board is conveyed in a direction perpendicular to a lamination direction of the sheet for the circuit board. The second holding member is provided between the first holding member and the third holding member, and the holding member is controlled to hold the floating circuit board for the first time on the first holding member, and then hold the first holding member Two holding members. 如申請專利範圍第1項至第4項中任一項所述之電路基板用片分離方法,其中作為前述空氣噴出手段,係使用對於前述電路基板用片的輸送方向下游的前端部噴出空氣的第一空氣噴出構件及對於前述電路基板用片的側部噴出空氣的第二空氣噴出構件。 The sheet separation method for a circuit board according to any one of the first to fourth aspect of the invention, wherein the air ejection means is configured to eject air to a tip end portion downstream of a conveyance direction of the sheet for a circuit board. a first air ejecting member and a second air ejecting member that ejects air to a side portion of the sheet for the circuit board. 如申請專利範圍第5項所述之電路基板用片分離方法,其中前述第一空氣噴出構件係在相對於前述輸送方向與前述電路基板用片的積層方向的垂直方向上設置複數個於不同的位置,前述第二空氣噴出構件係在前述輸送方向上設置複數個於不同的位置。 The method for separating a sheet for a circuit board according to the fifth aspect of the invention, wherein the first air ejecting member is provided in a plurality of different directions in a direction perpendicular to a direction in which the transport direction of the circuit board sheet is laminated. In the position, the second air ejecting member is disposed at a plurality of different positions in the transport direction. 如申請專利範圍第1項至第6項中任一項所述之電路基板用片分離方法,其中在前述第二步驟結束後,停止來自前述空氣噴出構件的空氣噴出。 The sheet separation method for a circuit board according to any one of the first to sixth aspect, wherein the air ejection from the air ejection member is stopped after the second step is completed. 如申請專利範圍第1項至第7項中任一項所述之電路基板用片分離方法,其中前述保持構件係以吸引空氣的負壓來吸附保持前述浮起的電路基板用片。 The sheet separation method for a circuit board according to any one of the preceding claims, wherein the holding member adsorbs and holds the floating sheet for a circuit board by a negative pressure of suction air. 如申請專利範圍第1項至第8項中任一項所述之電路基板用片分離方法,其中檢測裝載於裝載台上的電路基板用片的上面位置,升降控制前述裝載台,該裝載台係裝載電路基板用片,可沿著電路基板用片的積層方向升降。 The sheet separation method for a circuit board according to any one of the first to eighth aspect, wherein the upper surface of the sheet for a circuit board mounted on the loading table is detected, and the loading table is lifted and controlled. The sheet for mounting a circuit board can be moved up and down along the lamination direction of the sheet for a circuit board. 一種電路基板用片分離裝置,具有:空氣噴出手段,其係對層積的電路基板用片噴出空氣,使電路基板用片的端部浮起;以及保持構件,其係保持前述浮起的電路基板用片並使其分離。 A sheet separation device for a circuit board, comprising: an air ejection means for ejecting air to a laminated circuit board piece to float an end portion of the circuit board piece; and a holding member for holding the floating circuit The substrate is sheeted and separated. 如申請專利範圍第10項所述之電路基板用片分離裝置,其中前述保持構件具有第一保持構件與第二保持構件,該等構件係在相對於輸送前述電路基板用片的輸送方向與前述電路基板用片的積層方向的垂直方向上設於不同的位置,並且互相鄰接配置,前述保持構件被控制成將前述浮起的電路基板用片保持於前述第一保持構件上後,保持於前述第二保持構件上。 The sheet separating device for a circuit board according to claim 10, wherein the holding member has a first holding member and a second holding member, the members are in a conveying direction with respect to the sheet for conveying the circuit board, and the aforementioned The circuit board sheets are disposed at different positions in the vertical direction of the lamination direction, and are disposed adjacent to each other, and the holding member is controlled to hold the floating circuit board sheet on the first holding member, and then hold the same On the second holding member. 如申請專利範圍第10項所述之電路基板用片分離裝置,其中前述保持構件具有第一保持構件、第二保持構件及第三保持構件,該等構件係在相對於輸送前述電路基板用片的輸送方向與前述電路基板用片的積層方向的垂直方向上設於不同的位置,前述第一保持構件與前述第二保持構件相鄰接,前述第一保持構件設於前述第二保持構件與第三保持構件之間,前述保持構件被控制成將前述浮起的電路基板用片最初保持於前述第一保持構件上。 The sheet separation device for a circuit board according to claim 10, wherein the holding member has a first holding member, a second holding member, and a third holding member, and the members are for transporting the sheet for the circuit board. The transport direction is different from the vertical direction of the stacking direction of the circuit board sheet, the first holding member is adjacent to the second holding member, and the first holding member is provided on the second holding member Between the third holding members, the holding member is controlled to initially hold the floating sheet for the circuit board on the first holding member. 如申請專利範圍第10項所述之電路基板用片分離裝置,其中前述保持構件具有第一保持構件、第二保持構件及第三保持構件,該等構件係在相對於輸送前述電路基板用片的輸送方向與前述電路基板用片的積層方向的垂直方向上設於不同的位置,前述第一保持構件與前述第二保持構件相鄰接,前述第二保持構件設於前述第一保持構件與第三保持構件之間,前述保持構件被控制成將前述浮起的電路基板用片最初保持於前述第一保持構件上後,保持於前述第二保持構件上。 The sheet separation device for a circuit board according to claim 10, wherein the holding member has a first holding member, a second holding member, and a third holding member, and the members are for transporting the sheet for the circuit board. The transport direction is set at a different position from the vertical direction of the stacking direction of the circuit board sheet, the first holding member is adjacent to the second holding member, and the second holding member is provided on the first holding member and Between the third holding members, the holding member is controlled to be held by the second holding member after the floating sheet for the circuit board is initially held by the first holding member. 如申請專利範圍第10項至第13項中任一項所述之電路基板用片分離裝置,其中前述空氣噴出手段具有:第一空氣噴出構件,其係對於前述電路基板用片的輸送方向下游的前端部噴出空氣;以及 第二空氣噴出構件,其係對於前述電路基板用片的側部噴出空氣。 The sheet separating device for a circuit board according to any one of the preceding claims, wherein the air ejecting means includes: a first air ejecting member downstream of a conveying direction of the sheet for the circuit board The front end of the air is ejected; The second air ejecting member ejects air to the side portion of the sheet for the circuit board. 如申請專利範圍第14項所述之電路基板用片分離裝置,其中第一空氣噴出構件係在相對於前述輸送方向與前述電路基板用片的積層方向正交的方向上設置複數個於不同的位置,前述第二空氣噴出構件係在前述輸送方向上設置複數個於不同的位置。 The sheet separating device for a circuit board according to claim 14, wherein the first air ejecting member is provided in a plurality of different directions in a direction orthogonal to the laminating direction of the sheet for the circuit board with respect to the transport direction. In the position, the second air ejecting member is disposed at a plurality of different positions in the transport direction. 如申請專利範圍第10項至第15項中任一項所述之電路基板用片分離裝置,其中前述空氣噴出手段在利用前述保持構件保持分離前述浮起的電路基板用片後,停止空氣噴出。 The sheet separating device for a circuit board according to any one of the present invention, wherein the air ejecting means stops the air ejecting after the sheet for the circuit board is floated and separated by the holding member. . 如申請專利範圍第11項至第16項中任一項所述之電路基板用片分離裝置,其中前述保持構件係以吸引空氣的負壓來吸附保持前述浮起的電路基板用片。 The sheet separation device for a circuit board according to any one of the items of the present invention, wherein the holding member sucks and holds the floating sheet for a circuit board by suction of a negative pressure of air. 如申請專利範圍第10項至第17項中任一項所述之電路基板用片分離裝置,其中具有:裝載台,其係裝載前述電路基板用片,並可沿著電路基板用片的積層方向升降;裝載台驅動手段,其係驅動前述裝載台;檢測手段,其係檢測裝載於前述裝載台上的電路基板用片的上面位置;以及控制手段,其係基於來自前述檢測手段的信號,檢測裝載於前述裝載台上的電路基板用片的上面位置,並控制前述裝載台驅動手段。 The sheet separation device for a circuit board according to any one of the preceding claims, further comprising: a loading stage for loading the sheet for the circuit board, and stacking the sheet for the circuit board a direction lifting and lowering; a loading stage driving means for driving the loading stage; a detecting means for detecting an upper position of the circuit board piece mounted on the loading stage; and a control means for based on a signal from the detecting means The upper position of the sheet for the circuit board mounted on the loading stage is detected, and the loading stage driving means is controlled.
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