TW201622886A - Layered polishing pad and method for manufacturing same - Google Patents

Abstract

The purpose of the present invention is to provide a layered polishing pad capable of, in spite of a structure such that a back surface of a window (light-transmitting region) is adhered to double-side tape, performing accurate optical end point detection and such that the window is not readily peeled from the double-side tape, and a manufacturing method therefor. A method for manufacturing the layered polishing pad according to the present invention comprises: a step of fabricating an adhesive layered sheet by passing an un-adhered layered sheet comprising a polishing layer having a light-transmitting region in an opening portion A of a polishing region and a double-side tape having a hot melt adhesive layer on one side of a base material and a pressure-sensitive adhesive layer and mold-release sheet on the other side, the polishing layer and the double-side tape being layered such that the back surface of the polishing layer and the hot melt adhesive layer contact each other, between a pair of rolls of which the double-side tape side roll is a hot roll, thereby adhesively affixing the polishing region and the light-transmitting region to the hot melt adhesive layer of the double-side tape; and a step of peeling the mold-release sheet from the adhesive layered sheet and attaching a support layer having an opening portion B at a portion corresponding to the light-transmitting region to the exposed pressure-sensitive adhesive layer. A surface of the mold-release sheet that contacts the pressure-sensitive adhesive layer has an arithmetic mean roughness Ra of not more than 1 [mu]m.

Description

Laminated polishing pad and method of manufacturing same

The present invention relates to a laminated polishing pad used for planarizing a surface of a workpiece such as a semiconductor wafer by chemical mechanical polishing (CMP), and a method of manufacturing the same, and more particularly to A laminated polishing pad for detecting a window (light transmission region) such as a polishing condition by an optical means and a method of manufacturing the same.

When manufacturing a semiconductor device, a step of forming a conductive film on a surface of a semiconductor wafer (hereinafter also referred to as a wafer), forming a wiring layer by photolithography, etching, or the like, and a step of forming an interlayer insulating film on the wiring layer are performed. These steps cause the surface of the wafer to have irregularities including electrical conductors or insulators such as metals. In recent years, in order to increase the density of the semiconductor integrated circuit and to make the wiring finer and the multilayer wiring, it is important to flatten the unevenness on the surface of the wafer.

As a method of flattening the unevenness on the surface of the wafer, a CMP method is generally employed. CMP is a technique in which a slurry-like abrasive (hereinafter referred to as a slurry) in which abrasive grains are dispersed is used for polishing while the surface to be polished of the wafer is pressed against the polishing surface of the polishing pad.

There is a problem in determining the flatness of the wafer surface when such CMP is performed. That is, it is necessary to detect the point in time at which the desired surface characteristic or planar state is reached. Conventionally, the test wafer is periodically processed about the film thickness and the polishing rate of the oxide film, and after confirming the result, the wafer to be processed is polished.

However, the time and cost of processing the test wafer are wasted in the method, and the test wafer and the product wafer which have not been processed beforehand may have different grinding results due to the CMP-specific load effect, if the product is not actually processed. Wafers are difficult to accurately predict processing results.

Therefore, recently, in order to eliminate the above problems, it is desirable to have a method in which the time characteristics of the obtained surface characteristics and thickness can be detected in the field during the CMP process. There are various methods for such detection, and optical detection means become the mainstream in terms of measurement accuracy or spatial resolution of non-contact measurement.

The optical detecting means is a method of specifically irradiating a light beam through a window (light transmitting region) through a polishing pad to irradiate the wafer, and monitoring an interference signal generated by the reflection thereof, thereby detecting the polishing end point.

Various types of polishing pads used in the end point detection method of polishing using such optical means have been proposed. In the future, as for the high integration and miniaturization of semiconductor manufacturing, it is expected that the wiring width of the integrated circuit will become smaller and smaller. Therefore, a polishing pad capable of performing optical end point detection with high precision is required.

For example, Patent Document 1 proposes a polishing pad for performing chemical mechanical planarization of a semiconductor substrate, comprising: a polishing pad body having an opening formed at a center; and a window for performing a substrate on the substrate Optically measured and fixed in the aforementioned opening portion; the window has a surface below which light can be incident, and the lower surface is subjected to a laser ablation treatment to remove surface roughness present on the lower surface.

Further, Patent Document 2 proposes a chemical mechanical polishing pad which is provided with a non-polishing surface having a polishing surface opposite to the polishing surface, and has a light-transmitting region that optically passes from the polishing surface to the non-polishing surface. The surface roughness (Ra) of the non-polishing surface of the light-transmitting region is 10 μm or less, and the transmittance of the light-transmitting region to light having a wavelength of 633 nm is 12% to 70%.

Further, Patent Document 3 proposes a chemical mechanical polishing pad having a non-polishing surface having a polishing surface opposite to the polishing surface, and having a light-transmitting region that optically passes from the polishing surface to the non-polishing surface. The surface roughness (Ra) of the non-polishing surface in the optical region is smaller than the surface roughness (Ra) of the polishing surface.

Further, as a polishing pad for high-precision polishing, a polyurethane resin foam sheet is usually used. However, the polyurethane foam sheet is excellent in local planarization ability, but the cushioning property is insufficient, so that it is difficult to apply uniform pressure to the entire surface of the wafer. Therefore, usually produced from polyurethane resin A soft buffer layer is additionally provided on the back surface of the bubble sheet, and is used as a laminated polishing pad for polishing processing.

However, in the conventional laminated polishing pad, the polishing layer and the buffer layer are usually bonded by a double-sided tape, but there is a problem in that the slurry penetrates between the polishing layer and the buffer layer during polishing, and the durability of the double-sided tape is made. As the film is lowered, the polishing layer and the buffer layer become easily peeled off. In particular, when the polishing layer has a window, there is a problem that the slurry easily penetrates from the gap between the polishing layer and the window, and the window is easily peeled off from the double-sided tape.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2007-049163

Patent Document 2: Japanese Patent Laid-Open Publication No. 2008-073845

Patent Document 3: Japanese Patent Laid-Open Publication No. 2008-226911

An object of the present invention is to provide a laminated polishing pad having a structure in which a back surface of a window (light transmitting region) is followed by a double-sided tape, but the optical end point detection can be performed with high precision, and the manufacturing method thereof Not easy to peel off from double-sided tape.

The present inventors have made intensive studies to solve the above problems, and as a result, have found that the above object can be attained by the laminated polishing pad and the method for producing the same as described below.

That is, the present invention relates to a method of manufacturing a laminated polishing pad comprising the steps of: providing an abrasive layer having a light-transmitting region in the opening A of the polishing region, and having a hot-melt adhesive layer on one side of the substrate; A double-sided tape having a pressure-sensitive adhesive layer and a release sheet on the other side is laminated so that the back surface of the polishing layer is in contact with the hot-melt adhesive layer, so that the laminated laminated sheet is not passed through the double-sided tape side. The roller is a pair of rollers between the heat roller, and the polishing region and the light transmission region are then fixed to the hot-melt adhesive layer of the double-sided tape to form a step of laminating the laminate; and the release sheet is peeled off from the subsequent laminate And the step of attaching the support layer to the exposed pressure-sensitive adhesive layer, wherein the support layer has an opening B at a portion corresponding to the light-transmitting region; and the surface of the release sheet that is in contact with the pressure-sensitive adhesive layer The arithmetic mean roughness Ra is 1 μm or less.

Further, the present invention relates to a method of manufacturing a laminated polishing pad comprising the steps of: providing an abrasive layer having a light-transmitting region in an opening portion A of the polishing region, and having a hot-melt adhesive layer on one side of the substrate; A double-sided tape having a pressure-sensitive adhesive layer and a release sheet on the other side is laminated so that the back surface of the polishing layer is in contact with the hot-melt adhesive layer, so that the laminated laminated sheet is not passed through the double-sided tape side. The roller is a hot-melt adhesive between one of the rollers of the heat roller and the polishing region and the light transmission region are then fixed to the double-sided tape. a step of forming a subsequent laminated sheet; peeling off the release sheet from the subsequent laminated sheet, and providing a peeling protective member in a portion of the exposed pressure-sensitive adhesive layer corresponding to the light-transmitting region; and providing peeling protection a step of attaching the support layer to the pressure-sensitive adhesive layer of the member; and removing the support layer corresponding to the portion of the light-transmitting region and further removing the peeling protective member to form the opening portion B; and the release sheet and the peeling property The arithmetic mean roughness Ra of the surface of the protective member that is in contact with the pressure-sensitive adhesive layer is 1 μm or less.

Compared with the polishing pad exposed on the back side of the light transmission region, the polishing pad having the back surface of the light transmission region and the structure of the double-sided tape has a problem that the optical end point detection accuracy is extremely low. The inventors believe that the reason is that the light beam is absorbed or light-scattered due to the adhesive layer of the double-sided tape provided on the back surface of the light-transmitting region before the light beam enters the light-transmitting region. Then, the present inventors have conducted an intensive study and found that the release sheet and the releasable protective member having an arithmetic mean roughness Ra of 1 μm or less on the surface in contact with the pressure-sensitive adhesive layer as described above can be used. The surface roughness is transferred to the surface of the pressure-sensitive adhesive layer so that the arithmetic mean roughness Ra of the surface of the pressure-sensitive adhesive layer becomes 1 μm or less, whereby light scattering of the light beam in the surface of the pressure-sensitive adhesive layer is suppressed. Optical endpoint detection is performed with high precision.

Further, the manufacturing method of the present invention is characterized in that a double-sided tape having a hot-melt adhesive layer on one side of a substrate and a pressure-sensitive adhesive layer and a release sheet on the other side is used, and the polishing region and the light are transmitted. The regions are then fixed to the hot melt adhesive layer at the same time. If the polishing area and the light transmission area are respectively followed When it is fixed to the hot-melt adhesive layer, the subsequent properties of the hot-melt adhesive are degraded due to the two thermal processes, and the peeling is facilitated between the polishing region or the light-transmitting region and the hot-melt adhesive layer. As described above, since the heat applied to the hot-melt adhesive layer must be set once, a pressure-sensitive adhesive layer is provided on the other surface side of the substrate, and the support layer is laminated and fixed to the pressure-sensitive adhesive.

The roller on the side of the polishing layer preferably has an Asker-A hardness of 20 to 65 degrees at 23 °C. Therefore, even if it is assumed that there is a slight difference in surface height between the polishing region and the light-transmitting region, the step of the roller can be followed by the step, so that the polishing region and the light-transmitting region can be firmly adhered to the hot-melt adhesive. Floor. When the ASKER-A hardness is less than 20 degrees, the roll is too soft, so that the press-in pressure is dispersed and weakened, and then the tendency is insufficient. On the other hand, when the ASKER-A hardness exceeds 65 degrees, it is difficult to cause the roller to follow the step difference between the regions, and thus the interface portion between the polishing region and the light transmission region tends to be insufficient.

The roller on the side of the double-sided tape preferably has an arithmetic mean roughness Ra of the surface of 15 μm or less. When the arithmetic mean roughness Ra exceeds 15 μm, the surface roughness of the roller is transferred to the surface of the pressure-sensitive adhesive layer of the double-sided tape, and the surface of the pressure-sensitive adhesive layer is liable to cause light scattering of the light beam, thereby having an optical end point. The tendency to detect degradation is reduced.

Further, the difference in height between the polished region and the light-transmitting region in the laminated sheet is preferably 100 μm or less. If the surface height difference exceeds 100 μm, It is difficult to make the roller follow the step difference between the regions, and it is difficult to apply the pressing pressure of the roller to the end portion of the region having a low surface height. Therefore, it is difficult to firmly adhere the end portion to the hot-melt adhesive layer.

Further, the present invention relates to a multilayer polishing pad obtained by the above-described manufacturing method, and a method of manufacturing a semiconductor device including the step of polishing a surface of a semiconductor wafer using the above-described multilayer polishing pad.

According to the manufacturing method of the present invention, the polishing region and the light transmission region can be firmly adhered to the hot-melt adhesive layer of the double-sided tape in one subsequent step, thereby obtaining a layered polishing in which the polishing region and the light-transmitting region are not easily peeled off from the double-sided tape. pad. Further, the laminated polishing pad of the present invention has a structure in which the back surface of the light-transmitting region is followed by the double-sided tape, but since the surface of the pressure-sensitive adhesive layer of the double-sided tape has a very small surface roughness, it is not easy to sense the surface of the adhesive layer. The light beam is scattered, so that optical end point detection can be performed with high precision.

1‧‧‧Laminated polishing pad

2‧‧‧grinding platen

3‧‧‧Abrasive agent (slurry)

4‧‧‧Weared material (semiconductor wafer)

5‧‧‧Support table (grinding head)

6, 7‧‧‧ rotating shaft

8‧‧‧Abrasion area

9‧‧‧ Opening A

10‧‧‧Light transmission area

11‧‧‧Abrasive layer

12‧‧‧Substrate

13‧‧‧Hot melt adhesive layer

14‧‧‧ Pressure-sensitive adhesive layer

15‧‧‧ release film

16‧‧‧Double-sided tape

17‧‧‧Next layered film

18‧‧‧Support layer

19‧‧‧ Opening B

20‧‧‧ Opening part B of the back of the pressure-sensitive adhesive layer

21‧‧‧Removable protective members

FIG. 1 is a schematic configuration view showing an example of a polishing apparatus used for CMP polishing.

Fig. 2 is a schematic process view showing an example of a method for producing a laminated polishing pad of the present invention.

Fig. 3 is a schematic process view showing another example of the method for producing the laminated polishing pad of the present invention.

A method of manufacturing the laminated polishing pad of the present invention will be described with reference to Figs. 2 and 3 .

First, the light-transmitting region 10 is provided in the opening A9 of the polishing region 8 to form the polishing layer 11.

The polishing region 8 may be a foam or a non-foamed body, and is preferably a foam having fine bubbles. Examples of the material of the polishing region include a polyurethane resin, a polyester resin, a polyamide resin, an acrylic resin, a polycarbonate resin, and a halogen resin (polyvinyl chloride, polytetrafluoroethylene, and polyvinylidene fluoride). One or a mixture of two or more of ethylene, etc., polystyrene, an olefin resin (such as polyethylene or polypropylene), an epoxy resin, and a photosensitive resin. The polyurethane resin is excellent as a material for forming a polishing region because it is excellent in abrasion resistance and can easily obtain a polymer having desired physical properties by various changes in the composition of the raw material. The polishing region including the polyurethane resin foam will be described below.

The polyurethane resin contains an isocyanate component, a polyol component (high molecular weight polyol, a low molecular weight polyol), and a chain extender.

As the isocyanate component, a compound known in the field of polyurethanes can be used without particular limitation. The isocyanate component can be exemplified by 2,4-toluene Isocyanate, 2,6-toluene diisocyanate, 2,2'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate An aromatic diisocyanate such as p-phenylene diisocyanate, m-phenylene diisocyanate, p-xylene diisocyanate or m-xylene diisocyanate; ethyl diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, Aliphatic diisocyanate such as 1,6-hexamethylene diisocyanate; 1,4-cyclohexane diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, isophorone diisocyanate, norbornane diisocyanate An alicyclic diisocyanate. These may be used alone or in combination of two or more.

Examples of the high molecular weight polyol include those generally used in the technical field of polyurethanes. For example, a polyether polyol represented by polytetramethylene ether glycol or polyethylene glycol, a polyester polyol represented by polybutylene adipate, a polycaprolactone polyol, and a polycap. a polyester polycarbonate polyol exemplified by a reactant of a polyester diol such as a lactone and a alkylene carbonate, reacting an ethyl carbonate with a polyol, and reacting the obtained reaction mixture with an organic dicarboxylic acid. A polyester polycarbonate polyol obtained by a transesterification reaction of a polyvalent hydroxy compound and an aryl carbonate, or the like. These may be used alone or in combination of two or more.

As the polyol component, in addition to the above high molecular weight polyol, ethylene glycol, 1,2-propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1, may be used in combination. 4-butanediol, 2,3-butanediol, 1,6-hexanediol, neopentyl glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, Diethylene glycol, triethylene glycol Alcohol, 1,4-bis(2-hydroxyethoxy)benzene, trimethylolpropane, glycerol, 1,2,6-hexanetriol, pentaerythritol, tetramethylolcyclohexane, Methyl glucoside, sorbitol, mannitol, galactitol, sucrose, 2,2,6,6-tetrakis(hydroxymethyl)cyclohexanol, diethanolamine, N-methyldiethanolamine, and triethanolamine Low molecular weight polyol. Further, a low molecular weight polyamine such as ethylenediamine, toluenediamine, diphenylmethanediamine, or diethylenetriamine may be used in combination. Further, an alcoholamine such as monoethanolamine, 2-(2-aminoethylamino)ethanol or monopropanolamine may be used in combination. These low molecular weight polyols and low molecular weight polyamines may be used alone or in combination of two or more. The blending amount of the low molecular weight polyol or the low molecular weight polyamine or the like is not particularly limited, and can be appropriately determined depending on the characteristics required for the polishing pad (polishing layer 11) to be produced.

When the polyurethane resin foam is produced by the prepolymer method, the prepolymer is cured by using a chain extender. The chain extender is an organic compound having at least two active hydrogen groups, and the active hydrogen group may, for example, be a hydroxyl group, a primary or secondary amine group, a thiol group (SH) or the like. Specific examples thereof include 4,4'-methylenebis(o-chloroaniline) (MOCA), 2,6-dichloro-p-phenylenediamine, and 4,4'-methylenebis (2,3- Dichloroaniline), 3,5-bis(methylthio)-2,4-toluenediamine, 3,5-bis(methylthio)-2,6-toluenediamine, 3,5-diethyl Toluene-2,4-diamine, 3,5-diethyltoluene-2,6-diamine, trimethylene glycol-di-p-aminobenzoate, tetramethylene-di-pair Aminobenzoate, 4,4'-diamino-3,3',5,5'-tetraethyldiphenylmethane, 4,4'-diamino-3,3'-diisopropyl 5-,5'-dimethyldiphenylmethane, 4,4'-diamino-3,3',5,5'-tetraisopropyldiphenylmethane, 1,2-bis(2-amine Phenylthio)ethane, 4,4'-diamino-3,3'-di Ethyl-5,5'-dimethyldiphenylmethane, N,N'-di-t-butyl-4,4'-diaminodiphenylmethane, 3,3'-diethyl-4, 4'-Diaminodiphenylmethane, m-xylenediamine, N,N'-di-t-butyl-p-phenylenediamine, m-phenylenediamine, and p-xylenediamine Or a low molecular weight polyol, a low molecular weight polyamine as described above. These may be used alone or in combination of two or more.

The polyurethane foam can be produced by a known urethanation technique such as a melt method or a solution method, and is preferably produced by a melt method in consideration of cost, work environment, and the like.

The polyurethane foam may be produced by any one of a prepolymer method or a one shot method, but since the obtained polyurethane resin has excellent physical properties, it is superior. A prepolymer method in which an isocyanate-based terminal prepolymer is synthesized from an isocyanate component and a polyol component, and then reacted with a chain extender.

Examples of the method for producing the polyurethane foam include a method of adding hollow beads, a mechanical foaming method, a chemical foaming method, and the like.

More preferably, it is a mechanical foaming method using a polyfluorene-based surfactant which is a copolymer of a polyalkyl siloxane and a polyether.

Further, stabilizers such as antioxidants, lubricants, pigments, fillers, antistatic agents, and other additives may be added as needed.

The polyurethane foam may be either a closed cell type or a continuous cell type.

The production of the polyurethane foam may be a batch method in which the components are charged into a container and stirred, and the components and the non-reactive gas may be continuously supplied to the stirring device, stirred, and sent out. A continuous production method for producing a molded article by using a bubble dispersion.

Further, a method in which a prepolymer of a raw material of a polyurethane foam is added to a reaction container, and then a chain extender is added and stirred, and then poured into a mold of a specific size to form a lump, and The block is sliced using a planer or band saw-like microtome, or formed into a sheet shape at the stage of flowing into the mold. Further, the resin of the raw material may be melted and extruded from a T die to directly obtain a sheet-like polyurethane resin foam.

The polishing surface of the polishing region 8 that is in contact with the material to be polished preferably has a textured structure for holding and renewing the slurry. The polishing region including the foam has a large number of openings on the polishing surface, and has the function of holding and renewing the slurry. By forming the uneven structure on the polishing surface, the slurry can be more efficiently maintained and renewed, and can be prevented from being Destruction of the material to be polished caused by the adsorption of the material to be polished. The uneven structure is not particularly limited as long as it retains and renews the shape of the slurry, and examples thereof include an XY lattice groove, a concentric circular groove, and a through hole. A hole that is not penetrated, a polygonal column, a cylinder, a spiral groove, an eccentric circular groove, a radial groove, and a combination of the grooves. Further, the uneven structures are generally regular, but the groove pitch, the groove width, the groove depth, and the like may be changed in a certain range in order to maintain and renew the slurry.

The shape of the polishing region 8 is not particularly limited, and may be a circular shape or a long strip shape. The size of the polishing zone can be appropriately adjusted according to the polishing apparatus to be used. When the shape is round, the diameter is about 30 cm to 150 cm, and in the case of a long strip, the length is about 5 m to 15 m, and the width is about 60 cm to 250 cm.

The thickness of the polishing region 8 is not particularly limited, but is usually about 0.8 mm to 4 mm, preferably 1.2 mm to 2.5 mm.

The ASKER-D hardness of the polishing region 8 is not particularly limited, but is preferably about 40 to 65 degrees.

The means for forming the opening A9 in the polishing region 8 is not particularly limited, and examples thereof include a method of pressurizing or grinding with a cutting tool, and a method of using a laser such as a carbon dioxide laser to flow a raw material into a shape having an opening A. A method of forming a mold and hardening it, and the like. Furthermore, the size of the opening A is not particularly limited.

The planar shape of the opening A9 is not particularly limited, and for example, a circle can be cited. Shapes such as shapes, ovals, squares, rectangles, and polygons. In addition, the cross-sectional shape of the opening A is not particularly limited, and may be a shape that is narrowed from the polishing surface side toward the polishing back surface side in order to facilitate the temporary fixation of the light transmission region in the opening A.

The material for forming the light-transmitting region 10 is not particularly limited, and it is preferable to use a material which can perform optical end point detection with high precision in a polished state and has a light transmittance of 20% or more over the entire wavelength range of 600 nm to 700 nm. More preferably, the material has a light transmittance of 40% or more. Examples of such a material include a thermosetting resin such as a polyurethane resin, a polyester resin, a phenol resin, a urea resin, a melamine resin, an epoxy resin, and an acrylic resin; and a polyurethane Resin, polyester resin, polyamide resin, cellulose resin, acrylic resin, polycarbonate resin, halogen resin (polyvinyl chloride, polytetrafluoroethylene, polyvinylidene fluoride, etc.), polystyrene, And a thermoplastic resin such as an olefin resin (such as polyethylene or polypropylene); a rubber such as butadiene rubber or isoprene rubber; a photocurable resin which is cured by light such as ultraviolet rays or electron beams, and a photosensitive resin. These resins may be used singly or in combination of two or more.

The material for the light-transmitting region 10 is preferably of the same or larger grinding property as the material used for the polishing region. More preferably, it is a highly urethane resin which can suppress light scattering in the light-transmitting region caused by the trimming marks in the polishing.

The method of producing the light-transmitting region 10 is not particularly limited, and can be produced by a known method. For example, a method of using a band saw or a planer to make a block of a polyurethane resin into a specific thickness, a method of flowing a resin into a mold having a cavity of a specific thickness, and hardening the same can be employed. Or a method using a coating technique or a sheet forming technique, or the like.

The size of the light transmission region 10 is not particularly limited, and is preferably the same size as the opening A9 of the polishing region 8 or slightly smaller than the opening A9. The planar shape of the light transmission region is preferably the same shape as that of the opening A. The cross-sectional shape of the light-transmitting region is preferably the same as that of the opening A. Further, in order to easily fix the light-transmitting region in the opening A, the shape may be narrowed from the polishing surface side toward the polishing back side. .

The thickness of the light-transmitting region 10 is not particularly limited, and may be the same thickness as the thickness of the polishing region, or may be equal to or greater than the thickness of the polishing region, or may be equal to or less than the thickness of the polishing region. However, when the light transmission region is excessively thicker than the polishing region, there is a flaw in the polishing due to the protruding portion on the material to be polished. Further, the light-transmitting region is deformed by the stress applied during polishing, and the optical property is largely changed. Therefore, the accuracy of the optical end point detection of the polishing is lowered.

The ASKER-D hardness of the light transmitting region 10 is not particularly limited, and is preferably about 60 to 80 degrees.

The method of providing the light-transmitting region 10 in the opening A9 is not particularly limited, and examples thereof include (1) a method of embedding the light-transmitting region 10 in the opening A9; and (2) inserting the light-transmitting region 10 into the opening A9. And the method of bonding the surface of the polishing region 8 and the surface of the light-transmitting region 10 by a re-peelable adhesive tape; (3) the shape of the opening A9 and the light-transmitting region 10 is narrowed from the polishing surface side toward the polishing back surface side. A method of inserting the light-transmitting region 10 into the opening A9 and the like.

The difference in height between the polishing region and the light-transmitting region when the light-transmitting region 10 is provided in the opening A9 is preferably 100 μm or less, and more preferably 50 μm or less.

Thereafter, the polishing layer 11 and the double-sided tape 16 having the heat-fusible adhesive layer 13 on one side of the substrate 12 and the pressure-sensitive adhesive layer 14 and the release sheet 15 on the other surface are used as the back surface of the polishing layer 11. A layer is laminated in contact with the hot-melt adhesive layer 13, and a laminated sheet is not formed. Then, the roll that has not passed through the double-sided tape 16 is placed between the pair of rolls, and the polishing area 8 and the light-transmitting area 10 are then fixed to the hot-melt adhesive layer 13 of the double-sided tape 16 . Then, the laminated sheet 17 is produced.

Examples of the substrate 12 include polyester films such as polyethylene terephthalate film and polyethylene naphthalate film; polyolefin films such as polyethylene film and polypropylene film; and nylon films. Among these, it is preferred to use a polyester film which is excellent in heat resistance and excellent in water permeation resistance.

The surface of the substrate 12 may be subjected to an easy subsequent treatment such as corona treatment or plasma treatment.

The thickness of the substrate 12 is not particularly limited, and is preferably from 10 μm to 180 μm from the viewpoints of transparency, flexibility, rigidity, and the like.

The thickness of the hot-melt adhesive layer 13 and the pressure-sensitive adhesive layer 14 is not particularly limited, but is preferably 10 μm to 200 μm, and more preferably 25 μm to 125 μm.

The hot-melt adhesive which is a raw material of the hot-melt adhesive layer 13 can be used without any particular limitation, and is preferably an acrylic hot melt adhesive, a polyester hot melt adhesive, or an acrylonitrile and butadiene. The NBR (Nitrile Butadiene Rubber) is a hot melt adhesive.

The polyester-based hot-melt adhesive is preferably an epoxy resin containing at least a base polymer and an epoxy resin having two or more glycidyl groups in one molecule of a crosslinking component.

The polyester-based hot-melt adhesive may contain a known additive such as a softener such as an olefin resin, an adhesion-imparting agent, a filler, a stabilizer, and a coupling agent. Further, a known inorganic filler such as talc may be contained.

The polyester-based hot melt adhesive is at least mixed with the aforementioned poly by any method It is prepared by an ester resin, the above epoxy resin, or the like. For example, using a single-axis extruder, a bite-shaped parallel shaft biaxial extruder in the same direction, a parallel shaft biaxial extruder with different orientations, a biaxial extruder with different orientations, and a non-bite-type biaxial extrusion Extrusion forming, such as out-of-machine, incompletely occlusal twin-screw extruder, two-way kneading extruder, planetary gear extruder, transfer mixing extruder, ram extruder, and roll extruder The raw materials are mixed by a machine or a kneader.

The melting point of the polyester-based hot-melt adhesive is preferably from 80 ° C to 200 ° C, more preferably from 100 ° C to 130 ° C.

Further, the specific gravity of the polyester-based hot-melt adhesive is preferably from 1.1 to 1.3.

Further, the melt flow index (MI) of the polyester-based hot melt adhesive is preferably 16 g/10 min to 26 g/10 min at 150 ° C and a load of 2.16 kg.

The raw material of the pressure-sensitive adhesive layer 14 can be used without any particular limitation, and examples thereof include a rubber-based adhesive, an acrylic adhesive, a urethane-based adhesive, an ester-based adhesive, and EVA (Ethylene Vinyl). Acetate, ethylene/vinyl acetate), and the like.

The arithmetic mean roughness Ra of the surface of a general release sheet for a double-sided tape is about 2 μm to 3 μm, but is used in the present invention with a pressure-sensitive adhesive. The release sheet 15 having an arithmetic mean roughness Ra of 1 μm or less on the surface where the layers 14 are in contact with each other. The arithmetic mean roughness Ra of the surface of the release sheet 15 that is in contact with the pressure-sensitive adhesive layer 14 is preferably 0.5 μm or less, more preferably 0.2 μm or less, still more preferably 0.1 μm or less.

Examples of the release sheet 15 having an arithmetic mean roughness Ra of the surface of 1 μm or less include a polyester film such as a polyethylene terephthalate film or a polyethylene naphthalate film; a polyethylene film and polypropylene; A polyolefin film such as a film; a nylon film; a polyimide film.

In order to melt or soften the hot-melt adhesive layer 13, the roll on the double-sided tape side uses a heat roll. The roller on the side of the polishing layer may be a heat roller or a non-heat roller.

The ASKER-A hardness of the roller on the side of the polishing layer at 23 ° C is preferably from 20 to 65 degrees, more preferably from 40 to 55 degrees.

The arithmetic mean roughness Ra of the surface of the roll on the double-sided tape side is preferably 15 μm or less, more preferably 5 μm or less.

The gap between the rolls is preferably 300 μm to 1500 μm smaller than the thickness of the laminated sheet, and more preferably 700 μm to 1300 μm.

In the method for producing a laminated polishing pad of the present invention shown in FIG. 2, the release sheet 15 is peeled off from the subsequent laminated sheet 17 after the above, and the pressure is exposed. The support layer 18 is attached to the adhesive layer 18 to form a laminated polishing pad 1, and the support layer 18 has an opening B19 at a portion corresponding to the light-transmitting region 9.

The support layer 18 complements the characteristics of the abrasive region. As the support layer, a layer having a lower modulus of elasticity than the polishing region (buffer layer) may be used, or a layer having a higher modulus of elasticity than the region to be polished (highly elastic layer) may be used. The buffer layer is necessary for both planarity and uniformity of the compromise relationship in CMP. The term "planarity" refers to the flatness of the pattern portion when the material to be polished having fine irregularities generated during pattern formation is polished, and the uniformity refers to the uniformity of the entire material to be polished. The properties of the abrasive region are utilized to improve planarity, and the characteristics of the buffer layer are utilized to improve uniformity. When a soft abrasive region is used in order to suppress scratch generation in CMP, a high elastic layer is used to enhance the planarization characteristics of the polishing pad. Moreover, by using a highly elastic layer, excessive grinding of the edge portion of the material to be polished can be suppressed.

Examples of the buffer layer include a nonwoven fabric such as a polyester nonwoven fabric, a nylon nonwoven fabric, and an acrylic nonwoven fabric; a non-woven resin impregnated with a polyester nonwoven fabric impregnated with a polyurethane; a polyurethane foam and a polyethylene; A polymer resin foam such as foam; a rubber resin such as butadiene rubber or isoprene rubber; a photosensitive resin.

The thickness of the buffer layer is not particularly limited, but is preferably from 300 μm to 1800 μm, more preferably from 700 μm to 1400 μm.

Examples of the high elastic layer include a metal sheet, a resin film, and the like. Resin film such as Examples thereof include polyester films such as polyethylene terephthalate film and polyethylene naphthalate film; polyolefin films such as polyethylene film and polypropylene film; nylon film; and polyimine film.

The high elastic layer is preferably a resin film which has a dimensional change ratio of 1.2% or less after heating at 150 ° C for 30 minutes and before heating. More preferably, the resin film having a dimensional change ratio of 0.8% or less is preferably a resin film having a dimensional change ratio of 0.4% or less. Examples of the resin film having such characteristics include a polyethylene terephthalate film subjected to heat shrinkage treatment, a polyethylene naphthalate film, and a polyimide film.

The thickness of the high elastic layer is not particularly limited, and is preferably from 10 μm to 200 μm, more preferably from 15 μm to 55 μm, from the viewpoints of rigidity and dimensional stability upon heating.

The opening B19 is provided to transmit light. The opening B19 may be the same size as the opening A9, may be smaller than the opening A9, or may be larger than the opening A9.

The arithmetic mean roughness Ra of the opening portion B portion 20 on the back surface of the pressure-sensitive adhesive layer 14 is 1 μm or less, preferably 0.5 μm or less, more preferably 0.2 μm or less, and still more preferably 0.1 μm or less.

In addition, a single layer of the support layer 18 may be provided for laminating the polishing pad. An adhesive member (for example, an adhesive layer, a double-sided tape, or the like) attached to the polishing platen.

On the other hand, in the manufacturing method of the laminated polishing pad of the present invention shown in FIG. 3, the release sheet 15 is peeled off from the subsequent laminated sheet 17 after the above, and the corresponding light-transmitting region 10 of the exposed pressure-sensitive adhesive layer 14 is exposed. The peeling protection member 21 is provided in part.

The peelable protective member 21 covers a portion of the pressure-sensitive adhesive layer 14 corresponding to the light-transmitting region 10, and the arithmetic average roughness Ra of the surface in contact with the pressure-sensitive adhesive layer 14 is 1 μm or less. The arithmetic mean roughness Ra of the surface in contact with the pressure-sensitive adhesive layer 14 is preferably 0.5 μm or less, more preferably 0.2 μm or less, still more preferably 0.1 μm or less.

As the peelable protective member 21, it is preferable to use a resin sheet having heat resistance and releasability (for example, a fluororesin sheet, a polyoxymethylene resin sheet, a release-treated polyester film, and a laminate of the layers) Wait).

The size of the peelable protective member 21 is not particularly limited, and is preferably the same size as or smaller than the light transmitting region 10.

The thickness of the peelable protective member 21 is preferably 150 μm or less. If the thickness exceeds 150 μm, when the support layer 18 is attached to the pressure-sensitive adhesive layer 14 in the subsequent step, the edge portion of the peelable protective member 21 is generated. The step (space), the adhesion of the portion of the pressure-sensitive adhesive layer 14 to the support layer 18 is lowered.

Thereafter, the support layer 18 is attached to the pressure-sensitive adhesive layer 14 provided with the peelable protective member 21.

Further, an adhesive member (for example, an adhesive layer, a double-sided tape, or the like) for attaching the laminated polishing pad to the polishing platen may be provided on one side of the support layer 18.

Thereafter, the support layer 18 corresponding to the portion of the light-transmitting region 10 is removed, and the peeling protective member 21 is further removed to form an opening portion B19 through which light is transmitted, thereby producing a laminated polishing pad 1. When the adhesive member is provided, the adhesive member corresponding to the portion of the light-transmitting region 10 is also removed.

The method of removing the support layer 18 (and the adhesive member) is not particularly limited, and examples thereof include a method of cutting and removing using a cutter or the like, and a method of removing by laser processing.

In the manufacturing method of the present invention, the portion of the corresponding light-transmitting region 10 of the pressure-sensitive adhesive layer 14 is protected by the peeling protective member 21, so that when the support layer 18 (and the adhesive member) is removed, no scratches or portions are caused in the portion. Attach foreign matter. Further, the arithmetic mean roughness Ra of the opening portion B portion 20 on the back surface of the pressure-sensitive adhesive layer 14 can be adjusted to 1 μm or less. So there can be Effectively prevent the degradation of optical detection accuracy.

The arithmetic mean roughness Ra of the opening portion B portion 20 on the back surface of the pressure-sensitive adhesive layer 14 is 1 μm or less, preferably 0.5 μm or less, more preferably 0.2 μm or less, and still more preferably 0.1 μm or less.

The semiconductor element is manufactured by the step of polishing the surface of the semiconductor wafer using the above-described multilayer polishing pad. A semiconductor wafer is usually laminated with a wiring metal and an oxide film on a germanium wafer. The polishing method and the polishing apparatus for the semiconductor wafer are not particularly limited, and are performed, for example, by using a polishing apparatus such as the polishing platen 2, which supports the laminated polishing pad 1 and the support table (grinding). The head 5 is a semiconductor wafer 4; the mat is used for uniformly pressurizing the wafer; and the supply mechanism of the abrasive 3. The laminated polishing pad 1 is attached to the polishing platen 2 by, for example, bonding using an adhesive member such as a double-sided tape. The polishing platen 2 and the support table 5 are disposed such that the laminated polishing pad 1 supported by the polishing pad 2 and the semiconductor wafer 4 are opposed to each other, and each has a rotating shaft 6 and 7. Further, a pressurizing mechanism for pressing the semiconductor wafer 4 against the laminated polishing pad 1 is provided on the support table 5 side. At the time of polishing, the semiconductor wafer 4 is pressed against the laminated polishing pad 1 while the polishing platen 2 and the support table 5 are rotated, and the slurry is supplied while being polished. The slurry flow rate, the polishing load, the polishing platen rotation speed, and the wafer rotation speed are not particularly limited, and are appropriately adjusted.

Thereby, the protruding portion of the surface of the semiconductor wafer 4 is removed and ground into Flat. Thereafter, the semiconductor element is fabricated by performing dicing, bonding, packaging, or the like. The semiconductor element is used for an arithmetic processing device, a memory, or the like.

[Examples]

The invention is illustrated by the following examples, but the invention is not limited to the examples.

[Measurement, evaluation method]

(Measurement of arithmetic mean roughness)

According to JIS B0601-1994, the arithmetic mean roughness Ra (μm) of a PET (Polyethylene Terephthalate) release sheet, a peelable protective member, an acrylic pressure-sensitive adhesive layer, and a surface of a roll ) Perform the measurement.

(Measurement of ASKER-A hardness of the roller)

It is carried out in accordance with JIS K6253-1997. The ASKER-A hardness of the roll at 23 ° C was measured using a durometer (manufactured by Polymer Co., Ltd., ASKER-A type hardness meter).

(Evaluation of the state of the laminated polishing pad after 25 hours of grinding)

Using MIRRA (manufactured by AMAT) as a polishing device, and using the fabricated polishing pad, a wafer of 10,000 Å tungsten film was formed on a wafer of 8 Å to be polished for 60 seconds, and optical end point inspection was performed. . Then, the wafer was replaced and ground for 25 hours. Visual use The state of adhesion between the layers of the laminated polishing pad was observed.

In addition, as a polishing condition, a slurry was added at a flow rate of 150 ml/min during the polishing, and the slurry was added to a diluted solution obtained by diluting W2000 (manufactured by Cabot Co., Ltd.) twice with ultrapure water. % hydrogen peroxide water, the grinding load was 5 psi, the grinding platen rotation speed was set to 120 rpm, and the wafer rotation speed was set to 120 rpm. Further, before the polishing, the surface of the polishing pad was subjected to a trimming treatment for 20 seconds using a dresser (manufactured by SAESOL, DK45). Regarding the trimming conditions, the dressing load was set to 10 g/cm ² , the grinding platen rotation speed was set to 30 rpm, and the dresser rotation speed was set to 15 rpm.

(Measurement of peel strength)

The light-transmitting region was cut out from the laminated polishing pad which was produced, and the light-transmitting region and the double-sided tape were pulled at a peeling angle of 180° and a pulling speed of 300 mm/min, and the peeling strength at this time was measured (N/19.8 mm). ).

Example 1 [production of light transmission area]

100 parts by weight of a polyether-based prepolymer (manufactured by Uniroyal Co., Ltd., Adiprene L-325, NCO concentration: 2.22 meq/g) was previously adjusted to 70 ° C, and 4,4'-Asia adjusted to a temperature of 120 ° C was added thereto. Methyl bis(o-chloroaniline) (Iharacuamine MT, manufactured by Ihara Chemical Co., Ltd.) was 26 parts by weight and stirred for about 1 minute. Then, the mixed liquid was poured into a mold kept at 100 ° C, and post-cured at 100 ° C for 8 hours to prepare a polyurethane resin. Use a specific size Thomson knife The produced polyurethane resin was cut to produce a light transmission region (55.8 mm × 19.8 mm, thickness: 1.95 mm).

[Production of grinding area]

In the reaction vessel, a polyether-based prepolymer (manufactured by Uniroyal Co., Ltd., Adiprene L-325, NCO concentration: 2.22 meq/g) was used in an amount of 100 parts by weight, and a polyfluorene-based surfactant (manufactured by Goldschmidt Co., Ltd., B8465) 3 The weights were mixed and the temperature was adjusted to 80 °C. Stirring was carried out for about 4 minutes by using a stirring blade at a rotation speed of 900 rpm in a manner of incorporating bubbles into the reaction system. To this, 26 parts by weight of 4,4'-methylenebis(o-chloroaniline) (Iharacuamine MT, manufactured by Ihara Chemical Co., Ltd.) which was previously melted at 120 ° C was added. Then, after stirring was continued for about 1 minute, the reaction solution was poured into an open mold of a pan type. The time point at which the fluidity of the reaction solution disappeared was placed in an oven, and the mixture was hardened at 110 ° C for 6 hours to obtain a polyurethane foam block. The polyurethane foam block was sliced using a band saw type slicing machine (manufactured by Fecken Co., Ltd.) to obtain a polyurethane foam sheet (specific gravity: 0.86, D hardness: 52 degrees). Then, using a polishing machine (manufactured by Amitec Co., Ltd.), the surface of the sheet was polished to a specific thickness to prepare a sheet having an adjusted thickness precision (sheet thickness: 2.00 mm). The surface of the polished sheet was subjected to concentric circular groove processing using a groove processing machine (manufactured by Toho Steel Co., Ltd.) (groove width: 0.25 mm, groove depth: 0.80 mm, groove pitch: 1.5 mm). The sheet was punched out to a size of 51 cm in diameter, and then an opening portion A (56 mm × 20 mm) was formed at a position of 8.3 cm from the center of the punched sheet to prepare a polishing region.

[Production of laminated polishing pad]

A laminated polishing pad was produced by the method shown in FIG. First, a light transmitting region is embedded in the opening A of the polishing region to form a polishing layer. Next, the polishing layer and the double-sided tape were laminated to form a laminated sheet, and the double-sided tape had an acrylic hot-melt adhesive layer (thickness: 80 μm) on one side of the PET substrate and an acrylic feeling on the other side. The pressure-sensitive adhesive layer and the PET release sheet are passed through a pair of rolls, and the polishing region and the light-transmitting region are then fixed to the acrylic hot-melt adhesive layer of the double-sided tape, and then laminated. sheet. Further, the temperature of the roller on the side of the double-sided tape was adjusted to 120 °C.

Thereafter, the PET release sheet was peeled off from the subsequent laminated sheet, and a peelable protective member (a release-treated PET film, 55 mm × 18 mm, thickness: 100 μm) was attached to a portion of the corresponding light-transmitting region of the acrylic pressure-sensitive adhesive layer. Then, using a laminator, a support layer containing a foaming urethane (manufactured by Nippon Spring Co., Ltd., Nippalay EXT) was laminated on the acrylic pressure-sensitive adhesive layer, and the polishing layer, the double-sided tape, and the support layer were laminated. Crimp. Thereafter, the double-sided tape and the support layer are cut in accordance with the size of the polishing layer.

Then, using a laminating machine, a pressure-sensitive double-sided tape (manufactured by 3M Company, 442JA) was attached to the support layer, and the support layer corresponding to the light-transmitting region and the pressure-sensitive double-sided tape were cut and removed to further remove the peeling protection. The member is thereby formed into the opening portion B to form a laminated polishing pad.

Example 2~6

A laminated polishing pad was produced in the same manner as in Example 1 except that the conditions described in Table 1 were changed.

Example 7

A laminated polishing pad was produced by the method shown in FIG. First, the light-transmitting region is embedded in the opening A of the polishing region to form a polishing layer. Next, the polishing layer and the double-sided tape were laminated to form a laminated sheet, and the double-sided tape had an NBR-based hot-melt adhesive layer (thickness: 50 μm) on one side of the PET substrate and an acrylic feeling on the other side. The pressure-sensitive adhesive layer and the PET release sheet are passed through a pair of rolls, and the polishing region and the light-transmitting region are then fixed to the NBR-based hot-melt adhesive layer of the double-sided tape, and then laminated. sheet. Further, the temperature of the roller on the side of the double-sided tape was adjusted to 120 °C. Thereafter, a laminated polishing pad was produced in the same manner as in Example 1.

Comparative example 1 [Production of laminated polishing pad]

The polishing region is laminated with the double-sided tape to form an unlaminated sheet, and the unlaminated sheet is passed between a pair of rolls, and the polishing region is subsequently fixed to the acrylic hot-melt adhesive layer of the double-sided tape. Make a layer of the next layer. Further, the temperature of the roller on the side of the double-sided tape was adjusted to 120 °C. Thereafter, a light-transmitting region was embedded in the opening A of the polishing region following the laminated sheet, and the hot press was used at a pressurization temperature of 100 ° C, a pressurization pressure of 2 kg/cm ² , and a pressurization time of 10 seconds. The light-transmitting region is then fixed to the acrylic hot-melt adhesive layer of the double-sided tape. Then, a laminated polishing pad was produced in the same manner as in Example 1.

The laminated polishing pads of Examples 1 to 7 showed no peeling between the polishing layer and the double-sided tape even after polishing for 25 hours, and no abnormality occurred in the optical end point detection. Further, the peeling strength of the light-transmitting region and the double-sided tape is as high as 25 (N/19.8 mm) or more. On the other hand, in the multilayer polishing pad of Comparative Example 1, peeling occurred between the polishing layer and the double-sided tape after polishing for 10 hours, and the optical end point detection was abnormal due to peeling. Further, the peeling strength of the light-transmitting region and the double-sided tape was as low as 8 (N/19.8 mm). The reason for this is considered to be that the polishing region and the light-transmitting region are bonded to the hot-melt adhesive layer twice, and the subsequent properties of the hot-melt adhesive are lowered by the secondary heat history.

[Industrial availability]

The laminated polishing pad of the present invention can stably and efficiently perform optical materials such as lenses and mirrors, or glass substrates for hard disks, aluminum substrates, and general metal polishing processes, which require high surface flatness, with high polishing efficiency. Flattening processing. The multilayer polishing pad of the present invention is particularly suitable for use in a planarization step prior to further laminating a germanium wafer and an element on which an oxide layer, a metal layer or the like is formed, and forming the oxide layer or the metal layer.

1‧‧‧Laminated polishing pad

8‧‧‧Abrasion area

9‧‧‧ Opening A

10‧‧‧Light transmission area

11‧‧‧Abrasive layer

12‧‧‧Substrate

13‧‧‧Hot melt adhesive layer

14‧‧‧ Pressure-sensitive adhesive layer

15‧‧‧ release film

16‧‧‧Double-sided tape

17‧‧‧Next layered film

18‧‧‧Support layer

19‧‧‧ Opening B

20‧‧‧ Opening part B of the back of the pressure-sensitive adhesive layer

Claims (7)

A method for manufacturing a laminated polishing pad comprising the steps of: providing a polishing layer having a light transmitting region in an opening A of a polishing region, having a hot-melt adhesive layer on one side of the substrate, and having a pressure on the other surface The double-sided tape of the adhesive layer and the release sheet is laminated such that the back surface of the polishing layer is in contact with the hot-melt adhesive layer, so that the laminated laminated sheet is passed through the roll on the double-sided tape side as one of the heat rollers. Between the rolls, the polishing area and the light transmission area are then fixed to the hot-melt adhesive layer of the double-sided tape to form a step of laminating the sheet; and the release sheet is peeled off from the subsequent laminated sheet to expose the pressure a step of attaching a support layer to the support layer, wherein the support layer has an opening B at a portion corresponding to the light-transmitting region; and an arithmetic mean roughness Ra of the surface of the release sheet that is in contact with the pressure-sensitive adhesive layer is 1 μm or less . A method for manufacturing a laminated polishing pad comprising the steps of: providing a polishing layer having a light transmitting region in an opening A of a polishing region, having a hot-melt adhesive layer on one side of the substrate, and having a pressure on the other surface The double-sided tape of the adhesive layer and the release sheet is laminated such that the back surface of the polishing layer is in contact with the hot-melt adhesive layer, so that the laminated laminated sheet is passed through the roll on the double-sided tape side as one of the heat rollers. Between the rolls, the polishing area and the light transmission area are then fixed to the hot-melt adhesive layer of the double-sided tape to form a step of laminating the sheets; Removing the release sheet from the subsequent laminated sheet, and providing a peelable protective member to a portion of the exposed light-transmitting region of the exposed pressure-sensitive adhesive layer; and attaching the support layer to the pressure-sensitive adhesive layer provided with the peelable protective member a step of removing the support layer corresponding to the portion of the light-transmitting region and further removing the peeling protective member to form the opening portion B; and the release sheet and the peeling protective member are in contact with the pressure-sensitive adhesive layer The arithmetic mean roughness Ra of the surface is 1 μm or less. The method for producing a laminated polishing pad according to claim 1 or 2, wherein the roller of the polishing layer side has an Asker-A hardness of from 20 to 65 degrees at 23 °C. The method for producing a laminated polishing pad according to claim 1 or 2, wherein the surface of the roller on the double-sided tape side has an arithmetic mean roughness Ra of 15 μm or less. The method for producing a laminated polishing pad according to claim 1 or 2, wherein a difference in surface height between the polishing region and the light-transmitting region in the laminated sheet is not 100 μm or less. A laminated polishing pad obtained by the method for producing a laminated polishing pad according to any one of claims 1 to 5. A method of manufacturing a semiconductor device, comprising the step of polishing a surface of a semiconductor wafer using a build-up polishing pad as recited in claim 6.