TW201621075A - Self-cooling type movable tray for coating - Google Patents

Abstract

The present invention provides a self-cooling type movable tray for coating, which comprises a tray unit and a phase transformation material. A closed space is formed inside the tray unit. The phase transformation material is filled in the hermetic space of the tray unit. The phase transformation material can absorb thermal energy from the g tray unit for use as the latent heat required for melting a portion of the phase transformation material from a solid state into a liquid state, and the melting point of the phase transformation material is between 18 DEG C and 95 DEG C.

Description

Self-cooling mobile coating carrier

The invention relates to a coated carrier disk, in particular to a self-cooling mobile coating carrier disk.

At present, the application of vacuum sputtering technology is becoming more and more extensive. Among them, the In-line sputtering apparatus has been widely used because of its high speed, high output, excellent plating quality, and greatly reduced production cost. It is used in the process of coating a large number of coatings. Generally, the continuous sputtering apparatus sequentially comprises at least three regions: a feed cavity region, a coating cavity region, and an discharge cavity region; wherein a to-be-plated object is placed on a transfer unit. A carrier disk is transported between the cavity region or the cavity region, and a discharge finished product is printed on the surface of the material to be plated. However, in the continuous sputtering process, since the inside of the plating chamber region is irradiated with a high-energy ion body, the internal temperature of the coating chamber region is greatly increased. In particular, in order to shorten the coating time, those skilled in the art will also increase the amount of plating material splashed off the target by means of increasing the output power of the target. The foregoing practice makes it easier to further increase the temperature in the coating chamber region, so that the temperature of the carrier tray and the object to be plated is correspondingly increased. If the object to be plated is absorbed The high-temperature heat energy is not dissipated in time, and once the coating or even the coating thereon cannot be deformed by the high-temperature heat energy, the object to be plated is deformed and the quality of the coating is damaged.

Referring to FIG. 1 , in order to solve the heat dissipation problem, for example, the invention patent application No. I392756 of Taiwan discloses a sputtering carrying device 1 comprising a carrier for carrying a material to be plated (such as a substrate, not shown). 11. A metal tray 12 carrying the carrier 11 and a thermally conductive conveyor 13 for placing the metal tray 12. The metal tray 12 is formed with a plurality of serrated protrusions 121 on a surface facing the carrier 11. The carrier 11 is also formed with a plurality of grooves 111 corresponding to the serrations 121 of the metal tray 12 on a surface facing the metal tray 12. The groove 111 of the carrier 11 and the serrated protrusion 121 of the metal tray 12 are engaged with each other to form a large thermal contact area between the carrier 11 and the metal tray 12. Thereby, the plating object and a coating film deposited thereon (not shown) are used to conduct a high-temperature heat energy accumulated on the carrier 11, the object to be plated and the plating film during the sputtering process. To the metal tray 12, the high temperature heat energy of the metal tray 12 is carried away via the heat transfer belt 13. Although the metal tray 12 and the heat conduction belt 13 can be characterized by their high thermal conductivity, the high temperature heat energy can be taken away. However, since the heat capacity of the metal tray 12 and the heat conduction belt 13 itself is still insufficient, the heat transfer energy of the metal tray 12 and the heat conduction belt 13 from the carrier 11 is limited, thereby being limited. heat radiation.

According to the above description, how to further improve the heat capacity of the sputtering carrying device to effectively remove the high-temperature heat energy accumulated on the object to be plated and the plating film during the sputtering process and thereby improve the coating quality, is the technical field of The problem that the relevant technical personnel are to break through.

Accordingly, it is an object of the present invention to provide a self-cooling mobile carrier.

Thus, the self-cooling mobile carrier of the present invention comprises: a carrier unit, and a phase change substance. A sealed space is formed inside the carrier unit. The phase change substance is filled in the sealed space of the carrier unit. In the present invention, the phase change material is capable of absorbing a thermal energy from the carrier unit as at least a portion of the latent heat required to melt the phase change material from a solid to a liquid state, and the phase change material The melting point is between 18 ° C and 95 ° C.

The invention has the effect of absorbing the heat energy from the carrier unit by the phase-changing substance itself in the latent heat of the phase change process, and can carry away the high temperature accumulated on the object to be plated during the sputtering process. Thermal energy to enhance heat dissipation and thereby improve coating quality.

2‧‧‧Loading unit

20‧‧‧Confined space

21‧‧‧Base

211‧‧‧ base wall

212‧‧‧ wall

213‧‧‧First annular stop groove

214‧‧‧Bump

215‧‧‧Lock hole

216‧‧‧Second annular stop groove

217‧‧‧ bearing surface

218‧‧‧Limited bars

219‧‧‧ surface

22‧‧‧Closed

23‧‧‧First seal ring

24‧‧‧Locker

25‧‧‧Second seal ring

3‧‧‧ phase change substances

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is an exploded perspective view showing a sputtering method disclosed by the Taiwan Patent No. I392756 Approved Publication No. FIG. 2 is a perspective view of an embodiment of a self-cooling mobile coating carrier of the present invention; FIG. 3 is an exploded perspective view showing a carrier of the embodiment of the present invention; FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 2, illustrating the detailed relationship of the detailed components of the carrier unit and its details; FIG. 5 is a temperature versus time graph illustrating The embodiment of the present invention simulates a temperature change of a top surface, a bottom surface, the carrier unit and a phase change substance of a to-be-plated material in a sputtering process; FIG. 6 is a temperature versus time graph, illustrating the use of a The metal carrier simulates the temperature change of the top surface, the bottom surface of the object to be plated, and the top surface and a bottom surface of the metal carrier during the sputtering process.

Referring to Figures 2, 3 and 4, an embodiment of the self-cooling mobile carrier of the present invention is placed on a transport unit of a continuous vacuum coating system (not shown, such as a sputtering system). The embodiment is moved between the plurality of vacuum chambers of the continuous vacuum coating system by the transport unit. This embodiment of the invention comprises: a carrier unit 2, and a phase change substance 3 (not shown in Figures 2 and 3).

The carrier unit 2 includes a base 21, a plate 22, and a first sealing ring 23. The base 21 has a base wall 211 and a surrounding wall 212 surrounding a periphery of the base wall 211 to define a recess. The sealing plate 22 is disposed on a surface of the surrounding wall 212 to close the groove and define a sealed space 20. The phase change substance 3 is filled in the sealed space 20. A first annular leak stop groove 213 is formed on the surface of the surrounding wall 212. When the sealing plate 22 is covered on the surface of the surrounding wall 212, the first sealing ring 23 is sandwiched in the first annular leakage preventing groove 213.

In this embodiment of the present invention, the base 21 and the sealing plate 22 of the carrier unit 2 are made of an aluminum alloy, and the phase change material 3 can absorb a heat energy from the carrier unit 2 to As the latent heat required for the phase change material 3 to be melted into a liquid state from a solid state. Preferably, the phase change material 3 has a melting point of between 18 ° C and 95 ° C.

It is worth noting here that the carrier unit 2 is deformed in order to avoid volume expansion of the phase change substance 3 upon melting. Therefore, the sealed space 20 of the carrier unit 2 needs to be greater than or equal to the volume occupied by the phase change material 3 in the liquid state. It should be additionally noted that the heat storage capacity of the phase change material 3 in an endothermic process is between 134 kJ/kg and 250 kJ/kg, and the endothermic process includes The solid state melts into a phase transition of the liquid. The phase change material 3 is one selected from the group consisting of an organic material and an inorganic material.

More specifically, the organic material is a hydrocarbon, and the hydrocarbon is an alkane selected from C ₁₆ to C ₅₀ , such as a wax of a C ₃₀ to C ₅₀ alkane (wax) ). In general, the phase change material (i.e., the aforementioned C ₁₆ to C ₅₀ alkane) 3 occupies 80% to 90% of the sealed space 20 in the solid state.

Further, the inorganic material is selected from a composition containing a crystalline hydrates (M _n H ₂ O), or a molten salt. Specifically, the crystalline hydrated salt may be sodium sulfate decahydrate (Na ₂ SO ₄ ‧10H ₂ O), sodium acetate trihydrate (C ₂ H ₃ NaO ₂ ‧3H ₂ O), or ammonium aluminum sulfate dodecahydrate (NH ₄ Al(SO ₄ ) ₂ .12H ₂ O); the molten salt may be sodium nitrate (NaNO ₃ ) or potassium nitrate (KNO ₃ ). Preferably, an additive is added to the composition to reduce the amount of volume change produced by the crystalline hydrated salt during the melting process.

Further, it should be further noted here that in order to further prevent the phase change substance 3 from being unevenly distributed, the carrier unit 2 is locally deformed upon melting. In this embodiment of the invention, the carrier unit 2 further includes a plurality of locks 24 and a plurality of second seal rings 25. The base wall 211 of the base 21 has a plurality of protrusions 214 protruding from the surface 219 of the base wall 211 toward the sealing plate 22. Each of the protrusions 214 has a locking hole 215 and a second annular leakage groove 216 surrounding the locking hole 215. The locking members 24 are inserted through the sealing plate 22 to be respectively locked to the locking holes 215, so that the sealing plate 22 is coupled with the base 21, and the sealing plate 22 is used to seal the second sealing ring 25 Correspondingly, they are respectively clamped in the second annular leakage preventing grooves 216.

Specifically, in order to fill the phase change material 3 in the sealed space 20, the susceptor 21 must first be turned 180° so that the surface 219 of the base wall 211 faces upward, and the powder is preliminarily The phase change substance 3 is melted into the liquid state. Next, the liquid phase change material 3 is placed in the groove defined by the base wall 211 and the surrounding wall 212 to cover the surface 219 of the base wall 211. Further, the locks 24 are passed through the sealing plate 22, and are respectively locked to the locking holes 215, so that the sealing plate 22 is combined with the base 21, thereby causing the sealing plate 22 to be the first The sealing ring 23 is sandwiched in the first annular leakage preventing groove 213, and the second sealing rings 25 are respectively clamped in the second annular leakage preventing grooves 216. Finally, before the embodiment is placed in the conveying unit of the continuous vacuum coating system (not shown), the liquid phase change material 3 is cooled and solidified into the solid state. The continuous vacuum coating system is used as a carrier tray.

Further, in order to prevent a to-be-plated object (not shown) from being placed on the carrier unit 2, slippage occurs. Preferably, the base 21 further has a bearing surface 217 facing away from the surface 219 of the base 21, and the bearing surface 217 protrudes from the opposite side edges thereof toward the surface 219 of the base 21 Limit bar 218. When the tray unit 2 is driven by the conveying unit in the continuous vacuum coating system (not shown), the limiting strips 218 are used to place the object to be plated on the bearing surface 217 (Fig. Show) avoid slippage. However, it should be additionally noted herein that this embodiment of the invention is not limited to the use of the limit strips 218 to limit the movement of the object to be plated. In actual implementation, a thermal conductive tape may also be used on the bearing surface 217 to bond the object to be plated.

In order to further confirm the technical feature of the phase change material 3 employed in this embodiment of the present invention, it is possible to effectively utilize the latent heat of fusion required by itself in the phase change process to carry away the heat energy accumulated on the object to be plated. The applicant hereby uses this embodiment of the invention as a carrier disk to simulate a temperature versus time temperature profile during a sputtering process (see Figure 5). As shown in FIG. 5, the boundary condition of the temperature change graph is a temperature change of a top surface of the object to be plated when the object to be plated is placed on the embodiment for sputtering. The radiant heat flux of the sputter heat source is pushed back, and the phase change material 3 is simulated under the condition of n- 18 alkane (C ₁₈ H ₃₈ ). In addition, in order to compare the heat dissipation effect of this specific example of the present invention, the applicant also simulated the temperature change graph shown in FIG. 6 under the same boundary conditions. Fig. 6 differs from Fig. 5 in that Fig. 6 is modeled by a solid metal carrier composed of an aluminum alloy.

It should be added here that the high-temperature plasma generated during the sputtering process accumulates a large amount of high-temperature heat energy on the object to be plated, and the high-temperature heat energy is transmitted to the disk unit 2 via the carrier unit 2 The phase change substance 3 is directly absorbed by the phase change substance 3 as the heat required for the phase change substance 3 in the endothermic process. Since the endothermic process includes the phase change from the solid state to the liquid phase, and the phase change material 3 needs to absorb a large amount of latent heat for phase change, the heat absorbed by the endothermic process will be much greater than that of the metal carrier. The heat absorbed. Therefore, as shown in FIG. 5 and FIG. 6, the temperature rise of the object to be plated placed on the carrier disk of the embodiment of the present invention (the highest temperature is about 95 ° C) is significantly smaller than that placed on the metal carrier. The object to be plated (the highest temperature is about 120 ° C). It can be seen from the simulation results shown in FIG. 5 and FIG. 6 that the phase change substance 3 does further improve the heat dissipation effect on the object to be plated.

In summary, the self-cooling mobile carrier of the present invention absorbs thermal energy from the carrier unit 2 by the latent heat of fusion required by the phase change material 3 itself during the phase change process, and can be carried away in the sputtering process. The high-temperature heat energy accumulated on the object to be plated is used to enhance the heat dissipation effect and thereby improve the quality of the coating, so that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

2‧‧‧Loading unit

20‧‧‧Confined space

21‧‧‧Base

211‧‧‧ base wall

212‧‧‧ wall

213‧‧‧First annular stop groove

214‧‧‧Bump

215‧‧‧Lock hole

216‧‧‧Second annular stop groove

217‧‧‧ bearing surface

218‧‧‧Limited bars

219‧‧‧ surface

22‧‧‧Closed

23‧‧‧First seal ring

24‧‧‧Locker

25‧‧‧Second seal ring

3‧‧‧ phase change substances

Claims (10)

A self-cooling mobile coating carrier tray comprises: a carrier unit having a closed space formed therein; and a phase change substance filled in the sealed space of the carrier unit; wherein the phase change substance is capable of The carrier unit absorbs a thermal energy as at least a portion of the latent heat required to melt the phase change material from a solid state into a liquid state, and the phase change material has a melting point between 18 ° C and 95 ° C. The self-cooling mobile coating carrier according to claim 1, wherein the phase change substance is one selected from the group consisting of an organic material and an inorganic material. The self-cooling mobile coating carrier according to claim 2, wherein the organic material is a hydrocarbon, and the hydrocarbon is a monoalkyl selected from the group consisting of C ₁₆ to C ₅₀ . The self-cooling mobile coating carrier according to claim 2, wherein the inorganic material is selected from a composition containing a crystalline hydrated salt, or a molten salt. The self-cooling mobile coating carrier tray according to claim 1, wherein the sealing space of the carrier unit needs to be greater than or equal to the volume occupied by the phase change material in the liquid state. The self-cooling mobile coating carrier according to claim 1, wherein the phase change material occupies 80% to 90% of the sealed space in the solid state. The self-cooling mobile coating carrier tray according to claim 1, wherein the The carrier unit includes a base and a plate having a base wall and a surrounding wall surrounding a periphery of the base wall to define a groove, the cover plate is disposed on one of the surrounding walls The surface encloses the groove and defines the confined space. The self-cooling type mobile coated carrier tray according to claim 7, wherein the carrier unit further comprises a first sealing ring, and a surface of the surrounding wall is formed with a first annular leakage preventing groove, and the sealing plate is covered The first sealing ring is clamped in the first annular leak stop groove on the surface of the surrounding wall. The self-cooling mobile coated carrier tray of claim 8, wherein the carrier unit further comprises a plurality of locking members, and a plurality of second sealing rings, the base wall of the base having a plurality of surfaces from the base wall a protrusion protruding from the sealing plate, each of the protrusions has a locking hole, and a second annular leakage preventing groove surrounding the locking hole, the fasteners are penetrated through the sealing plate to respectively correspond to The sealing plate is locked to the locking holes, and the sealing plate is coupled to the base, and the sealing plate respectively clamps the second sealing rings into the second annular leakage preventing grooves. The self-cooling mobile coated carrier tray of claim 9, wherein the base further has a bearing surface facing away from the surface of the base, and the bearing surface faces away from the opposite side edges of the base The surface protrudes from the two limit bars.