TW201619544A - Manufacturing method of a lamp and the lamp - Google Patents

Abstract

A manufacturing method of a lamp includes the following steps: providing a lamp holder, the lamp holder includes a mounting bump, a surrounded surface towards to different directions is formed with on the mounting bump; forming an active layer on the surrounded surface; forming an patterned circuit layer with a predetermine circuit pattern on the active layer; and mounting a plurality of luminous elements on a plurality of predetermine positions toward to different directions of the patterned circuit layer of the mounting bump respectively, so as to the luminous elements can illuminate toward to different directions. The manufacturing method of the lamp is simply, a manufacturing time and costs can be reduced. Besides, The lamp is able to illuminate toward to multi directions to achieve multi directional lighting effects, and having good thermal conductivity and thermal efficiency.

Description

Lamp manufacturing method and the lamp

The invention relates to a method for manufacturing a lamp and the lamp, in particular to a method for manufacturing a lamp with multi-directional illumination and good heat dissipation and heat dissipation effect, and the lamp.

Referring to FIG. 1 , the conventional LED bulb 100 includes a lamp holder 10 , a circuit board 11 on the top of the lamp holder 10 , and a plurality of LEDs 12 electrically connected to the circuit board 11 . Since the light-emitting diodes 12 are disposed on the same plane of the circuit board 11, the light generated by the light-emitting diodes 12 is concentrated in the same direction, resulting in insufficient brightness of the light around the LED bulb 100 and uneven brightness of the overall illumination. The problem.

Referring to FIG. 2, the LED bulb 110 having multi-directional illumination includes a lamp holder (not shown), a plurality of circuit boards 13 assembled around the periphery of the lamp holder, and a plurality of LEDs 14. The circuit boards 13 are assembled into a polygonal structure, and each of the circuit boards 13 is electrically connected to a plurality of light-emitting diodes 14, whereby the LED light bulb 110 can illuminate light in multiple directions to achieve a multi-directional illumination effect. . Since the LED light bulb 110 is manufactured and assembled into the lamp holder, the assembly process is complicated and inconvenient, and it is time-consuming and labor-intensive. Furthermore, due to the heat of the circuit board 13 Since the conduction effect is poor and heat cannot be quickly dissipated, the light-emitting diode 14 is liable to cause an excessive temperature after a long period of use.

Referring to FIG. 3, the Chinese Patent No. CN101349412 discloses a light-emitting diode lamp 120 including a heat sink 15, a heat pipe 16, a first heat conduction element 17, a second heat conduction element 18, and a plurality of light-emitting modes. Group 19. When assembling the lamp 120, the first heat conduction element 17 and the heat sink 15 are respectively sleeved and fixed on the upper and lower ends of the heat pipe 16, and then the second heat conduction element 18 is assembled and fixed on the top end of the first heat conduction element 17. Next, the circuit board 191 of each of the light-emitting modules 19 is assembled and fixed to the first heat conduction element 17 or the second heat conduction element 18. Finally, each wire (not shown) is soldered to the corresponding circuit board 191, that is, the assembly of the lamp 120 is completed.

Since the luminaire 120 has a large number of components, the assembly process is complicated and inconvenient, and it is easy to work. Furthermore, since the heat conduction effect of the circuit board 191 is poor and heat cannot be quickly dissipated, the light-emitting diode 192 is liable to cause a problem of excessive temperature after a long period of use.

Accordingly, it is an object of the present invention to provide a method of manufacturing a luminaire which is simple in process and can reduce manufacturing man-hours and manufacturing costs.

Therefore, the manufacturing method of the luminaire of the present invention comprises the steps of: providing a lamp holder, the lamp holder comprising a mounting bump, the mounting bump forming a circumferential surface facing in different directions and insulating; forming on the circumferential surface An active material layer; Forming a circuit pattern layer having a predetermined circuit pattern on the active material layer, and a plurality of predetermined positions of the circuit pattern layer of the circuit pattern layer respectively mounted on the mounting bumps in different directions, so that the plurality of light emitting elements are respectively mounted on the mounting bump The light emitting elements can emit light in different directions.

Another object of the present invention is to provide a luminaire that can illuminate light in multiple directions to achieve a multi-directional illumination effect and has good heat conduction and heat dissipation efficiency.

Thus, the lamp of the present invention comprises a lamp holder, an active material layer, a circuit pattern layer, and a plurality of light-emitting elements.

The lamp holder includes a mounting bump, and the mounting bump forms a circumferential surface that is insulated in different directions; an active material layer is disposed on the circumferential surface of the mounting bump; and the circuit pattern layer is disposed on the active material layer And a predetermined circuit pattern, the circuit pattern layer includes a plurality of predetermined positions facing different directions; a plurality of light emitting elements are respectively mounted on the predetermined positions of the circuit pattern layer to enable the light emitting elements to emit light in different directions.

The effect of the present invention is that the manufacturing man-hour and the manufacturing cost can be effectively reduced because the number of constituent members is small and the process is simple. In addition, by mounting the outer surface of the bump and the circumferential surface of the insulating layer in different directions, after the light-emitting component is mounted, the plurality of light-emitting components can illuminate the light in different directions to achieve a multi-directional illumination effect. Moreover, the heat generated when each of the light-emitting elements operates can be dissipated through the circuit pattern layer. It can also dissipate heat through the lamp holder. The design of the above two heat dissipation paths makes the lamp have good heat conduction and heat dissipation efficiency.

200, 210‧‧‧ lamps

2‧‧‧ lamp holder

21‧‧‧ body

211‧‧‧ Heat sink fins

212‧‧‧ top surface

213‧‧‧ Stud

22‧‧‧ Mounting bumps

221‧‧‧ outer surface

222‧‧‧ side section

223‧‧‧ top face

224‧‧‧Slope section

225‧‧‧Upright section

226‧‧‧ Groove

227‧‧‧ screw holes

3‧‧‧Insulation

31‧‧‧Week

311‧‧‧ side section

312‧‧‧ top face

313‧‧‧Slope section

314‧‧‧Upright section

315‧‧‧ Groove

4‧‧‧Active material layer

41‧‧‧Active materials

411‧‧‧Partial active materials

5‧‧‧Circuit pattern layer

50‧‧‧Weld Department

51‧‧‧First metal pattern layer

52‧‧‧Second metal pattern layer

6‧‧‧Lighting elements

7‧‧‧Soft mask layer

71‧‧‧Prescribed pattern

8‧‧‧ nozzle

P‧‧‧Predetermined location

S1‧‧‧ provides lamp holder steps

S2‧‧‧Steps of forming an active material layer

S3‧‧‧Steps of forming a circuit pattern layer

S4‧‧‧Lighting element installation steps

S21‧‧‧Soft mask layer forming procedure

S22‧‧‧Active material coating procedure

S23‧‧‧Soft mask removal procedure

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a perspective view of a conventional light-emitting diode bulb, illustrating that a plurality of light-emitting diodes are disposed on the same plane of the circuit board. FIG. 2 is a perspective view of a conventional light-emitting diode bulb with multi-directional illumination, illustrating that a plurality of circuit boards are put together into a polygonal structure; FIG. 3 is a three-dimensional embodiment of the light-emitting diode lamp disclosed in the Chinese Patent No. CN101349412. 4 is a perspective view of a first embodiment of the lamp of the present invention; FIG. 5 is a flow chart of a manufacturing method of the first embodiment of the lamp of the present invention; and FIG. 6 is a partially enlarged view of the first embodiment of the lamp of the present invention, The mounting lug is a truncated pyramid; FIG. 7 is a partial enlarged view of the first embodiment of the lamp of the present invention, illustrating that the insulating layer is formed on the outer surface of the mounting bump; FIG. 8 is a partial view of the first embodiment of the lamp of the present invention; The enlarged view illustrates that the active material layer is formed on the insulating layer; FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 8, illustrating that the active material layer is formed on the insulating layer; FIG. 10 is the present invention. An enlarged view of a first embodiment of the tool, a circuit pattern layer formed on the active material layer; FIG. 11 is a sectional view taken along line 11-11 in FIG. 10 taken described a circuit pattern layer is formed on the active material layer; FIG. 12 is a cross-sectional view taken along line 12-12 of FIG. 4, illustrating that each of the light-emitting elements is soldered to the corresponding solder portion; and FIG. 13 is a second embodiment of the lamp of the present invention. Incomplete cross-sectional view, illustrating that the first metal pattern layer and the second metal pattern layer together form a circuit pattern layer; FIG. 14 is a flow chart of the step of forming an active material layer of the third embodiment of the lamp of the present invention; FIG. 15 is a lamp of the present invention; A partially enlarged view of the third embodiment, illustrating a soft mask layer attached to the insulating layer; FIG. 16 is a partial enlarged view of the third embodiment of the lamp of the present invention, illustrating the nozzle coating active material on the circumferential surface; 17 is a partial enlarged view of a third embodiment of the lamp of the present invention, illustrating removal of the soft mask layer from the circumferential surface of the insulating layer; FIG. 18 is a partial enlarged view of the fourth embodiment of the lamp of the present invention, illustrating that the mounting bump is Figure 19 is a cross-sectional view taken along line 19-19 of Figure 18; Figure 20 is a partial enlarged view of the fifth embodiment of the lamp of the present invention, illustrating the mounting bump as a hemisphere; Figure 21 is along Figure 20. Intercepted in line 21-21 Figure 22 is a fragmentary cross-sectional view of a sixth embodiment of the luminaire of the present invention illustrating the outer surface of the mounting tab recessed to form a plurality of grooves; Figure 23 is an incomplete cross-sectional view of a seventh embodiment of the luminaire of the present invention , indicating that the stud of the seat body is screwed into the screw hole of the mounting protrusion; Figure 24 is a plan view of an eighth embodiment of the lamp of the present invention, illustrating the lamp as a lamp; and Figure 25 is a cross-sectional view taken along line 25-25 of Figure 24.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

4 and FIG. 5, which is a first embodiment of the luminaire of the present invention. The luminaire 200 of the present embodiment is illustrated by using a bulb as an example, and FIG. 5 is a flow chart of the manufacturing method of the luminaire 200 of the embodiment, which includes the following Step: providing a lamp holder step S1, forming an active material layer step S2, forming a circuit pattern layer step S3, and a light-emitting element mounting step S4.

Referring to FIG. 4, FIG. 5, FIG. 6 and FIG. 7, in the step S1 of providing the lamp holder, the lamp holder 2 is made of a metal material with good heat conduction and heat dissipation effect, such as aluminum or copper. The socket 2 is formed by integral molding and includes a body 21 and a mounting boss 22. The base body 21 has a cylindrical shape which is gradually enlarged from the bottom to the top, and the side surface thereof includes a plurality of heat dissipation fins 211 which are annularly arranged and radially protruded and spaced apart from each other, and a top surface of the base body 21 forms a top surface. 212. The mounting protrusion 22 is protruded from the top surface 212 of the base body 21. The mounting protrusion 22 of the embodiment is a truncated pyramid. The mounting protrusion 22 includes an outer surface 221 facing in different directions, and the outer surface 221 includes a ring shape. The surrounding side surface portion 222 and a top surface portion 223 formed at the top end of the side surface portion 222 include a plurality of inclined surface segments 224 that are connected to each other.

Since the lamp holder 2 is made of a metal material in the embodiment, in the step S1 of providing the lamp holder, the outer surface 221 of the mounting bump 22 is further included. The position forms an insulating layer 3 as shown in FIG. In the present embodiment, the insulating layer 3 is formed into an epoxy layer by an electrophoretic deposition (ED) process. However, the manufacturing method and material of the insulating layer 3 are not limited to the above disclosure. The insulating layer 3 has a peripheral surface 31 that matches the shape of the outer surface 221 of the mounting bump 22 and faces in different directions. The peripheral surface 31 includes a side surface portion 311 that is annularly surrounded, and a top portion that is formed at the top end of the side surface portion 311. The face portion 312, the side portion 311 includes a plurality of bevel segments 313 that are connected to each other. The bevel segments 313 of the peripheral surface 31 are aligned with the corresponding bevel segments 224 of the mounting tabs 22, while the top surface portions 312 of the peripheral faces 31 are aligned with the top surface portions 223 of the mounting tabs 22. It should be noted that in other embodiments, the lamp holder 2 can also be made of an insulating material, and the surface of the lamp holder 2 can directly form the insulating circumferential surface 31 without separately forming an insulating layer 3 as in this example. In other words, in the present invention The insulating circumferential surface 31 may be applied to the surface of the insulating layer 3 of the mounting bump 22, or may be the surface of the insulating socket 2 itself, that is, the two layers of the insulating circumferential surface 31 and the mounting bump 22 are different. limit.

Referring to FIG. 5, FIG. 8, and FIG. 9, in the step of forming the active material layer S2, an active material layer 4 having a predetermined pattern is formed on the peripheral surface 31 of the insulating layer 3, and is transparently cured by, for example, ultraviolet light curing. The curing mode cures the active material layer 4. Specifically, the active material layer 4 of the present embodiment is in the form of an ink containing a catalytic metal source, an organic solvent and an adhesive, and the catalytic metal source is a group selected from the group consisting of: A combination of palladium, platinum, gold, silver, copper, and the aforementioned catalytic metal source. The ink constituting the active material layer 4 in this embodiment is selectively attached to the insulating layer 3 by screen printing so that the active material layer 4 has a corresponding FIG. A predetermined pattern of the pattern of the final circuit pattern layer 5 is shown.

It should be noted that in other embodiments, the ink of the active material layer 4 containing the catalytic metal source may also be coated on the insulating layer 3 by, for example, spraying, transfer or other suitable processes. Furthermore, in other embodiments, the active material layer 4 may be formed by other types and processes, for example, a material containing a catalytic metal source is attached to the insulating layer 3 by powder coating, or the lamp holder 2 is After immersing in a solution containing a catalytic metal source and taking it out after a predetermined period of time, the entire active material layer 4 is formed on the insulating layer 3, and then the excess portion is selectively removed by laser to form a predetermined pattern.

Referring to FIG. 5, FIG. 10 and FIG. 11, in the step S3 of forming a circuit pattern layer, a circuit pattern layer 5 having a predetermined circuit pattern is formed on the active material layer 4, and the circuit pattern layer 5 defines a plurality of predetermined positions. P, the circuit pattern layer 5 forms a pair of welded portions 50 spaced apart from each other in each predetermined position P for subsequent welding of the light-emitting elements 6. In the present embodiment, at least one of the predetermined positions P is a top surface portion 312 corresponding to the circumferential surface 31, and a plurality of predetermined positions P in the predetermined positions P correspond to the plurality of side portions 311, respectively. The bevel section 313 is exemplified by a bevel section 313 in which the two predetermined positions P correspond to the side surface portion 311. Thereby, a plurality of predetermined positions P respectively corresponding to the plurality of slope sections 313 are arranged along the circumferential direction of the side surface portion 311. The predetermined positions P can be oriented in different directions by the arrangement of the predetermined positions P of the circuit pattern layer 5 described above.

In the embodiment, the circuit pattern layer forming step S3 is performed by an electroless plating process, and the lamp holder 2 in which the insulating layer 3 and the active material layer 4 have been formed is formed. Immersed in the electroless plating solution, the metal ions in the electroless plating solution are first reduced to the metal crystal nucleus on the catalytic metal source of the active material layer 4, and the reduced metal crystal nuclei themselves become the electroless plating solution. The catalytic layer of the metal ions causes the reduction reaction to continue on the surface of the new crystal nucleus, and the circuit pattern layer 5 is formed on the active material layer 4 after a predetermined time. In the present embodiment, the circuit pattern layer 5 contains a metal material having a high heat transfer rate (K) and a low specific resistance (ρ), such as copper.

Specifically, in the present embodiment, the active material layer 4 having a predetermined pattern is formed on the insulating layer 3 in a predetermined pattern, and the subsequent circuit pattern layer 5 is selectively formed only on the active material layer. a predetermined pattern of 4 is formed to form a circuit pattern layer 5 having a predetermined circuit pattern; however, in other embodiments, the predetermined pattern may not be formed on the active material layer 4, and the active material layer 4 may be completely and completely completed. Formed on the insulating layer 3, after the circuit pattern layer 5 is completely formed on the active material layer 4, and then removed from the predetermined circuit pattern of the circuit pattern layer 5 by laser or other suitable means, together with The portion of the active material layer 4 below the predetermined pattern is such that the predetermined pattern of the active material layer 4 is substantially the same and overlaps the predetermined circuit pattern of the circuit pattern layer 5, and the purpose of selectively forming the circuit pattern layer 5 can also be achieved. .

It should be noted that, by forming the circuit pattern layer 5 through the active material layer 4 and the plating process, only the conductive line is formed on the peripheral surface 31 of the insulating layer 3 of the mounting bump 22 for the light-emitting element 6 to be mounted and guided. One of the methods, other processes that can directly form a conductive line on an insulating surface, such as the conventional Laser Direct Structuring (LDS) technology or His Molded Interconnect Device (MID) technology can also be applied to the present invention to form conductive lines. Specifically, the process of forming a conductive line directly on the insulating surface in the present invention means that it does not need to pass through an electronic circuit such as a printed circuit board (PCB) or a flexible circuit board (FPC), or an intermediary carrier of the component, that is, The conductive traces can be attached directly to the insulating surface.

Referring to FIG. 4, FIG. 5 and FIG. 12, in the light-emitting element mounting step S4, a plurality of light-emitting elements 6 are respectively soldered to the plurality of pairs of soldering portions 50, for example, by surface mount technology (SMT), so that the respective light-emitting elements are provided. The 6 bits are at the corresponding predetermined positions P, and at this time, the luminaire 200 of the present embodiment is fabricated. The light-emitting element 6 of the present embodiment is exemplified by a light-emitting diode. Of course, the light-emitting element 6 may be other types of light-emitting sources, and is not limited to the disclosure of the embodiment.

Referring to FIG. 5 and FIG. 13 , which is a second embodiment of the lamp of the present invention, the overall structure and manufacturing method of the lamp 200 are substantially the same as those of the first embodiment, except that the step S3 of forming the circuit pattern layer is after the electroless plating process. A plating process is also implemented.

The electroless plating process is as shown in the first embodiment, and a first metal pattern layer 51 is formed on the active material layer 4 by a catalytic metal source reduction reaction of the active material layer 4; and the plating process is performed by placing the first metal pattern layer 51 In a plating bath of the electroplating process, a second metal pattern layer 52 is further formed from the first metal pattern layer 51 such that the first metal pattern layer 51 and the second metal pattern layer 52 together form the circuit pattern layer 5. In this embodiment, the first metal pattern layer 51 and the second metal pattern layer 52 respectively contain copper and nickel, and contain nickel. The second metal pattern layer 52 further protects the first metal pattern layer 51 from oxidation. It should be noted that in other embodiments, the second metal pattern layer 52 may be formed by, for example, an electroless plating process, not limited to the plating process of this example.

5 and FIG. 14, which is a third embodiment of the luminaire of the present invention, the overall structure and manufacturing method of the luminaire 200 are substantially the same as those of the first embodiment, except that the step S2 of forming the active material layer of the present embodiment includes the following procedure. A soft mask layer forming program S21, an active material coating program S22, and a soft mask layer removing program S23.

Referring to FIG. 14 and FIG. 15, the soft mask layer forming program S21 is attached with a soft mask layer 7 on the insulating layer 3 having the peripheral surface 31. The soft mask layer 7 has a predetermined pattern partially exposed to the peripheral surface 31. 71.

Referring to FIGS. 14 and 16, the active material coating process S22 is to apply an active material 41 on the soft mask layer 7 so that a portion of the active material 411 is formed on the periphery of the predetermined pattern 71 exposed to the soft mask layer 7. On face 31. Specifically, in the present embodiment, the ink containing the catalytic metal source is applied by spray coating through a nozzle 8.

Referring to FIGS. 14 and 17, the soft mask layer removing program S23 removes the soft mask layer 7 from the peripheral surface 31 to leave a portion of the active material 411 on the peripheral surface 31, thereby forming an active material on the peripheral surface 31. Layer 4. The soft mask layer 7 used in this embodiment can make the process more flexible, and is not limited to a flat two-dimensional plane of the object to be plated, or a non-flat three-dimensional (3D) curved surface, active material layer. 4 is not limited to the existing lithography technology, but can only be implemented on a flat two-dimensional plane, resulting in the circuit pattern layer only Can be formed on a flat two-dimensional plane.

Referring to FIG. 18 and FIG. 19, a fourth embodiment of the luminaire of the present invention is generally the same as the first embodiment. The difference is that the mounting bump 22 of the embodiment is a polygonal corner post.

The side portion 222 of the mounting boss 22 includes a plurality of upstanding face segments 225 that are connected to each other, and each of the upright face segments 225 is perpendicular to the top face portion 223. The side portion 311 of the insulating layer 3 includes a plurality of upstanding face segments 314 that are connected to each other, and the upright face segments 314 of the side portions 311 are aligned with the corresponding upright face segments 225 of the mounting bumps 22. The plurality of predetermined positions P in the predetermined positions P are a plurality of upright surface segments 314 respectively corresponding to the side surface portions 311. This embodiment is an example in which two predetermined positions P correspond to one vertical surface portion 314 of the side surface portion 311. . Thereby, a plurality of predetermined positions P respectively corresponding to the plurality of upright face segments 314 are arranged along the circumferential direction of the side face portion 311.

Referring to FIG. 20 and FIG. 21, it is a fifth embodiment of the luminaire of the present invention. The overall structure and manufacturing method of the luminaire 200 are substantially the same as those of the first embodiment, except that the mounting bump 22 of the embodiment is a half sphere and is mounted. The outer surface 221 of the bump 22 and the peripheral surface 31 of the insulating layer 3 are each a semicircular surface.

Referring to FIG. 22, which is a sixth embodiment of the luminaire of the present invention, the overall structure and manufacturing method of the luminaire 200 are substantially the same as those of the first embodiment, except that the top surface portion 223 of the outer surface 221 of the mounting bump 22 of the present embodiment is different. And each of the slope segments 224 are respectively recessed to form at least one groove 226. The top surface portion 312 and the slope portion 313 of the circumferential surface 31 of the insulating layer 3 are respectively recessed to form at least one groove 315, and the positions of the grooves 315 are aligned with the corresponding grooves 226. . The predetermined positions P are respectively located in the grooves 315, and the light-emitting elements 6 are received in the corresponding grooves 315. Since the insulating layer 3 formed by the electro-coating process has a reflective effect, the light generated by the light-emitting element 6 can be reflected outside the recess 315, and therefore, the utilization of the light source can be effectively increased.

Referring to FIG. 23, which is a seventh embodiment of the luminaire of the present invention, the overall structure and manufacturing method of the luminaire 200 are substantially the same as those of the first embodiment, except that the mounting bump 22 of the luminaire 200 and the base 21 are detachable. The way to combine.

In this embodiment, the mounting bump 22 and the seat body 21 are both made of metal and separately fabricated. The base 21 includes a stud 213 protruding from the top surface 212. The bottom surface of the mounting lug 22 is recessed to form a screw hole 227 for the stud 213 to be screwed, whereby the mounting lug 22 is detachably locked in the seat. On body 21. By combining the mounting lug 22 and the seat body 21 in a releasable manner, it is possible to provide the manufacturer or the user with various mounting lugs 22 having different shapes, sizes or configurations of the light-emitting elements 6 selectively. The mounting brackets 22 can be replaced with the mounting lugs 22 of one of the fourth, fifth and sixth embodiments, whereby different types of lighting structures can be changed as needed.

It should be noted that the mounting lug 22 and the seat body 21 can also be combined by a snapping manner such as a hook and a card slot, which is not limited by the screw locking method disclosed in this embodiment.

Referring to FIG. 24 and FIG. 25, it is an eighth embodiment of the lamp of the present invention. The overall structure and manufacturing method of the lamp 210 are substantially the same as those of the first embodiment. The difference is that the luminaire 210 is a light tube.

The lamp holder 2 of the present embodiment is an elongated aluminum extruded member, the outer surface 221 of the mounting bump 22 is elongated and includes a top surface portion 223, and two long sides respectively obliquely connected to the top surface portion 223 Side portion 222. The peripheral surface 31 of the insulating layer 3 is elongated and includes a top surface portion 312, and two side portions 311 obliquely connected to the two long sides of the top surface portion 312, respectively. The top surface portion 312 of the peripheral surface 31 is aligned with the mounting bumps 22. The top surface portion 223 and the side surface portions 311 of the circumferential surface 31 are aligned with the corresponding side surface portions 222 of the mounting bumps 22. The predetermined positions P are disposed along the longitudinal direction of the circumferential surface 31 and correspond to the top surface portion 312 and the two side surface portions 311, respectively.

In summary, the luminaires 200 and 210 of the embodiments have fewer component components and a simple process, and thus can effectively reduce manufacturing man-hours and manufacturing costs compared with the prior art. In addition, by designing the outer surface 221 of the mounting bump 22 and the peripheral surface 31 of the insulating layer 3 in different directions, after the light-emitting element 6 is mounted, the plurality of light-emitting elements 6 can illuminate the light in different directions to achieve more Directional lighting effect. Moreover, the heat generated by the operation of each of the light-emitting elements 6 can dissipate heat through the circuit pattern layer 5, and can also dissipate heat through the lamp holder 2. The heat dissipation of the lamps 200 and 210 is ensured by the design of the two heat dissipation paths. The heat dissipation efficiency makes it possible to achieve the object of the present invention.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

200‧‧‧ lamps

2‧‧‧ lamp holder

21‧‧‧ body

211‧‧‧ Heat sink fins

212‧‧‧ top surface

3‧‧‧Insulation

312‧‧‧ top face

313‧‧‧Slope section

5‧‧‧Circuit pattern layer

6‧‧‧Lighting elements

P‧‧‧Predetermined location

Claims (19)

A method of manufacturing a lamp, comprising the steps of: providing a lamp holder, the lamp holder comprising a mounting bump, the mounting bump forming a circumferential surface that is insulated in different directions; forming an active material on the circumferential surface a layer; a circuit pattern layer having a predetermined circuit pattern formed on the active material layer; and a plurality of predetermined positions of the circuit pattern layer on the mounting bumps respectively oriented in different directions, such that a plurality of light emitting elements are respectively mounted on the active material layer The illuminating elements can emit light in different directions. The method of manufacturing a luminaire according to claim 1, wherein the step of forming the active material layer is to form the active material layer according to a predetermined pattern, and the step of forming the circuit pattern layer is based on the predetermined pattern of the active material layer The circuit pattern layer having the predetermined circuit pattern is formed thereon. The method of manufacturing a luminaire according to claim 1, wherein the step of forming the active material layer is to form a complete layer of the active material, and the step of forming the circuit pattern layer is to form a complete circuit on the active material layer. a pattern layer, and then removing a portion of the circuit pattern layer other than the predetermined circuit pattern and a portion other than the predetermined pattern of the active material layer such that the predetermined pattern of the active material layer is substantially the same and overlaps the circuit pattern layer The predetermined circuit pattern. The method of manufacturing the luminaire according to claim 2, wherein the step of forming the circuit pattern layer is performed by an electroless plating process, and an electroplating process performed after the electroless plating process, wherein the electroless plating process is performed on the active material Forming a first metal pattern layer, the plating process is further forming a second metal pattern layer from the first metal pattern layer, so that the first metal pattern layer and the second metal pattern layer together form the circuit pattern Floor. The method of manufacturing a luminaire according to claim 1, wherein the step of forming the active material layer comprises the following procedure: a soft mask layer forming process: forming a soft mask layer on the peripheral surface, the soft mask layer Having a predetermined pattern partially exposing the circumferential surface; an active material coating process: coating an active material on the soft mask layer to form a portion of the active material formed outside the predetermined pattern exposed to the soft mask layer a soft mask layer removing program: removing the soft mask layer from the peripheral surface to leave the portion of the active material on the peripheral surface, thereby forming the active material layer on the peripheral surface . The method of manufacturing a luminaire according to claim 1 or 5, wherein the active material layer is in an ink form containing a catalytic metal source, an organic solvent and an adhesive, and the active material coating process is The ink containing the catalytic metal source is applied by a spray coating method. The manufacturing method of the luminaire of claim 1, wherein the mounting bump is made of a metal material and includes an outer surface facing in different directions, and in the step of providing the socket, the outer surface position of the mounting bump An insulating layer is formed, the insulating layer having the circumferential surface that matches the shape of the outer surface. A lamp comprising: a lamp holder including a mounting bump, the mounting lug forming a direction a circumferential surface that is insulated in different directions; an active material layer disposed on the circumferential surface of the mounting bump; a circuit pattern layer disposed on the active material layer to have a predetermined circuit pattern, the circuit pattern layer including a plurality of a predetermined position facing the different directions; and a plurality of light-emitting elements respectively mounted at the predetermined positions of the circuit pattern layer to enable the light-emitting elements to emit light in different directions. The luminaire of claim 8, wherein the mounting bump is made of a metal material and includes an outer surface facing in different directions, and the outer surface of the mounting bump is formed with an insulating layer, the insulating layer having the outer layer The circumferential surface is matched with the surface shape. The luminaire of claim 8 or 9, wherein the peripheral surface includes an annular side portion that is aligned along a circumferential direction of the side portion. The luminaire of claim 10, wherein the side portion includes a plurality of bevel segments connected to each other, the predetermined positions respectively corresponding to the bevel segments. The luminaire of claim 10, wherein the side portion includes a plurality of upstanding face segments connected to each other, the predetermined positions respectively corresponding to the upright face segments. The luminaire of claim 10, wherein the peripheral surface further comprises a top surface formed at a top end of the side portion, and at least one predetermined position of the predetermined positions corresponds to the top surface portion. The luminaire of claim 8 or 9, wherein the luminaire is a tube, The circumferential surface is elongated and includes a top surface, and two side portions respectively obliquely connected to the two long sides of the top surface, the predetermined positions are disposed along the length direction of the circumferential surface and respectively corresponding to the top Face and face on both sides. The luminaire of claim 8 or 9, wherein the circumferential surface is recessed to form a plurality of grooves, and the predetermined positions are respectively disposed in the grooves. The luminaire of claim 8 or 9, wherein the socket further comprises a base, the mounting protrusion is protruded from the base, and the mounting protrusion and the base are made of metal, and the base is As a heat sink. The luminaire of claim 16 wherein the mounting tab and the base are combined in a releasable manner. A method of manufacturing a luminaire, comprising the steps of: providing a lamp holder, the lamp holder comprising a metal mounting bump; forming an insulating layer on an outer surface of the mounting bump, and defining an orientation with a surface of the illuminating layer a circumferential direction of the insulating layer in a different direction; a circuit pattern layer of a predetermined circuit pattern is directly formed on the circumferential surface; and a plurality of the circuit pattern layers of the plurality of light emitting elements respectively mounted on the mounting bump are oriented in different directions The predetermined position enables the light-emitting elements to emit light in different directions. A lamp comprising: a lamp holder comprising a metal mounting bump, and an insulating layer formed on a surface of the mounting bump, the surface of the insulating layer defining a circumferential surface that faces in different directions and is insulated; a circuit pattern layer directly attached to the circumferential surface of the mounting bump surface, the circuit pattern layer includes a plurality of predetermined positions facing different directions; and a plurality of light emitting elements respectively mounted on the circuit pattern layer The light-emitting elements are enabled to emit light in different directions at predetermined positions.