TW201618895A - Grinder and semiconductor strip grinder with the same - Google Patents

Abstract

The present invention presents a grinder and semiconductor strip grinder. The grinder comprises a drive motor, a grinding wheel to grind the semiconductor strip by driving the motor to rotate, and a housing unit for protecting the grinding wheel. The housing unit is formed in the way that a pivot shaft on one side rotates to be able to open it while replacing the grinding wheel, so that the molded layer formed on the cell substrate of the semiconductor strip is removed. Therefore, the effect of making the overall thickness of semiconductor strip thin is obtained.

Description

Grinding device and its suitable semiconductor strip grinder

The present invention relates to a semiconductor strip grinder, and more particularly to a grinding apparatus for reducing the thickness of a semiconductor strip by grinding a protective mold layer of a semiconductor strip and a semiconductor strip grinder to which the semiconductor is applied The strip is formed by arranging a plurality of unit substrates on which a semiconductor wafer is mounted and packaged on the upper surface of the base substrate.

Generally, a semiconductor package is manufactured by the following process. That is, a semiconductor wafer is first fabricated by forming a highly integrated circuit such as a transistor and a capacitor on a semiconductor substrate fabricated on a germanium material, and then attaching the semiconductor wafer to, for example, a lead frame. Or a strip material such as a printed circuit board, and electrically connecting the semiconductor wafer and the strip material to a wire or the like to electrically energize each other, and then molding with an epoxy resin to protect the semiconductor wafer from the external environment. .

The semiconductor package is packaged in a matrix arrangement on the strip material, and the individual packages in the strip material are cut and separated into individual pieces, thus separated into individual packages which are in accordance with predetermined quality standards. After sorting, it is loaded on a tray or the like and sent to a subsequent step.

The form completed by the molding step is called a semiconductor strip or a semiconductor material. The semiconductor strip includes a plurality of semiconductor packages. The cutting step is performed in order to separate the individual semiconductor packages from the semiconductor strip or semiconductor material.

First, the semiconductor strip can be mounted to a chuck table or a cutting station of the manufacturing apparatus. That is, the strips before the separation of the plurality of semiconductor packages can be mounted by the strip picker.

The semiconductor strip is cut into a single package, ie a unit package, by a cutting device. Specifically, the semiconductor strip is cut into a semiconductor package by relative movement between the cutting device and the vacuum chuck unit in a state of being mounted to the vacuum chuck unit.

After the cutting step is completed, the plurality of semiconductor packages are moved by the unit pickup or the package pickup for subsequent steps such as cleaning and drying.

The plurality of semiconductor packages that have been cleaned and dried are moved to the turntable by a turn table picker. At the turntable, visual inspection of the semiconductor package can be performed, and the semiconductor package that has finished inspection is sorted by the sorting pickup.

For example, Patent Document 1 and Patent Document 2 below disclose a semiconductor strip and an adsorption unit configuration of a semiconductor manufacturing apparatus.

Patent Document 1 describes a configuration of a substrate strip including: a base substrate having a rectangular shape; a plurality of unit substrates formed by dividing a base substrate; and a mold gate formed on a long side of the base substrate a part of a plurality of unit substrates; and a dummy which is formed on the base substrate and formed on the two short sides of the base substrate facing each other.

Patent Document 2 describes a configuration of an adsorption unit for a semiconductor manufacturing apparatus including: an adsorption pad for adsorbing a semiconductor strip or a plurality of semiconductor packages; and a body having a body for accommodating The adsorption pad accommodating portion of the adsorption pad is attached to the adsorption pad accommodating portion after being formed in a manner corresponding to the outer size of the adsorption pad accommodating portion.

Prior technical literature Patent literature

Patent Document 1: Korean Invention Patent Authorization Gazette No. 10-0872129 (announcement on December 8, 2008)

Patent Document 2: Korean Patent Publication No. 10-2014-0024627 (published on March 3, 2014)

However, in the prior art, since the semiconductor strip forms a protective molding layer on the periphery of the unit substrate in order to protect the unit substrates provided on the base substrate, the protective molding layer is formed not only on the left and right sides of the unit substrate, but also in the unit. Since the upper portion of the substrate is also formed, there is a problem that the overall thickness of the semiconductor strip becomes thick.

That is, in the prior art, since there is no semiconductor strip grinder capable of grinding the protective mold layer of the semiconductor strip, there is a semiconductor strip which can only be thickened by the thickness of the protective mold layer. problem.

In addition, in the past, when the semiconductor strip was ground, the cutting fluid was sprayed only on one side, so it was difficult to supply the entire surface of the grinding wheel and the semiconductor strip. The liquid is cut and the service life of the grinding wheel is shortened, so that the replacement cycle of the grinding wheel is short and the replacement work is inconvenient.

The present invention has been made in an effort to solve the above problems, and an object of the present invention is to provide a grinding apparatus and a semiconductor strip grinding machine to which the same is applied, which can remove a molding layer on an upper portion of a unit substrate of a semiconductor strip. The overall thickness of the semiconductor strip is made thin.

Another object of the present invention is to provide a grinding apparatus and a semiconductor strip grinding machine to which the same is applied, which can efficiently jet a cutting fluid to a grinding wheel and a semiconductor strip, thereby improving the precision of the grinding operation.

Another object of the present invention is to provide a grinding apparatus and a semiconductor strip grinder which can easily replace a grinding wheel.

The present invention provides a grinding apparatus for achieving the object as described above, the grinding apparatus according to the present invention comprising: a drive motor; a grinding wheel that grinds the semiconductor strip by rotation of the drive motor; and an outer casing The portion protects the grinding wheel, and the outer casing portion is formed to be openable by pivoting one side when the grinding wheel is replaced.

Further, in order to achieve the above object, the present invention provides a semiconductor strip grinder to which a grinding apparatus is applied, and a semiconductor strip grinder to which the grinding apparatus according to the present invention is applied is characterized in that it comprises: a grinding apparatus And removing the protective molding layer of the semiconductor strip; the vacuum chuck unit fixing and cleaning the semiconductor strip; the first picker loading the semiconductor strip sequentially to the vacuum chuck unit; the drying unit, It will dry the semiconductor strip ground by the grinding device; and the second pick And loading a semiconductor strip ground by the grinding device into the drying unit.

As described above, with the grinding apparatus according to the present invention and the semiconductor strip mill to which it is applied, since the molding layer formed on the upper portion of the unit substrate of the semiconductor strip is removed, it is possible to change the overall thickness of the semiconductor strip. Thin effect.

Moreover, according to the present invention, since the nozzles are provided on both sides of the grinding wheel and the injection pipes are provided on the front and rear sides, the effect of ejecting the cutting fluid as a whole from the grinding surfaces of the grinding wheel and the semiconductor strip from the front, rear, left and right side faces is obtained.

Therefore, according to the present invention, since the grinding wheel and the grinding surface of the semiconductor strip are effectively lubricated, it is possible to reduce the wear of the grinding wheel during the grinding operation, and to cool the grinding wheel, thereby prolonging the service life of the grinding wheel and improving the life of the grinding wheel. The effect of grinding accuracy.

Further, according to the present invention, since the drive shaft is fixed by the lock unit when the grinding wheel is replaced, an effect that the grinding wheel can be easily replaced can be obtained.

Further, according to the present invention, since the fitting state of the wheel housing is detected by the detecting unit and the driving motor is driven only in a state in which the wheel housing is fully engaged, it is possible to obtain a state in which it is not fully fitted. The damage or malfunction of the drive shaft caused by the drive of the drive motor prevents the prior effect.

10‧‧‧Semiconductor strip grinder

11‧‧‧Shell

12‧‧‧ base

20‧‧‧vacuum suction cup unit

21‧‧‧Sucker Workbench

22‧‧‧Y-axis robot

30‧‧‧First picker

30’‧‧‧Second Picker

40‧‧‧ grinding device

41‧‧‧ grinding wheel

42‧‧‧ Shell

43‧‧‧X-axis robot

44‧‧‧Z-axis robot

45‧‧‧Support board

46‧‧‧ Distance detection sensor

47‧‧‧ drive shaft

48‧‧‧Nozzles

50‧‧‧Drying unit

60‧‧‧Locking unit

61‧‧‧Locking plate

62‧‧‧ fixed plate

63‧‧‧With holes

64‧‧‧Fixed holes

65‧‧‧Extension

66‧‧‧Kakán

70‧‧‧Detection unit

110‧‧‧First Loading Department

111‧‧‧material box

112‧‧‧Box mobile robot

120‧‧‧Supply module

130‧‧‧Check module

131‧‧‧ visual orbit

132‧‧‧Visual Robot

140‧‧‧Second Loading Department

141‧‧‧Loading robot

411‧‧‧ drive wheel

412‧‧‧ Grinding Department

421‧‧‧ wheel housing

422‧‧ hood

423‧‧‧Motor housing

424‧‧‧ first casing

425‧‧‧ second casing

471‧‧‧Fixed cover

472‧‧‧Fixed protrusion

481‧‧‧Steam tube

482‧‧‧Spray hole

Figure 1 is a view of a grinding apparatus according to a preferred embodiment of the present invention A perspective view of a semiconductor strip mill.

2 is a top plan view of the semiconductor strip grinder of FIG. 1 after removal of the outer casing.

Figure 3 is a perspective view of a grinding apparatus in accordance with a preferred embodiment of the present invention.

4 is an explanatory view showing a state in which the wheel housing of the grinding device illustrated in FIG. 3 is opened.

5 and 6 are views showing an operation state of the lock plate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a grinding apparatus and a semiconductor strip grinder to which the same is applied according to a preferred embodiment of the present invention will be described in detail with reference to the drawings.

In the following description, "upper", "lower", "front", "rear", and other directional terms are defined on the basis of the state illustrated in the drawings.

1 is a perspective view of a semiconductor strip grinder to which a grinding apparatus according to a preferred embodiment of the present invention is applied, and FIG. 2 is a plan view of the semiconductor strip grinder of FIG. 1 after removing the outer casing.

As illustrated in FIGS. 1 and 2, a semiconductor strip grinder 10 to which a grinding apparatus according to a preferred embodiment of the present invention is applied includes a vacuum chuck unit 20 that fixes and cleans a semiconductor strip to remove a semiconductor strip. a protective molding layer of the tape; a first pickup 30 that sequentially loads the semiconductor strips to the vacuum chuck unit 20; and a grinding device 40 that will load the protective molding layer of the semiconductor strips of the vacuum chuck unit 20. Grinding and removing; drying unit 50, which performs the drying of the semiconductor strips ground by the grinding device 40 Drying; and a second picker 30' that loads the semiconductor strip ground by the grinding device 40 into the drying unit 50.

Also, the semiconductor strip grinder 10 to which the grinding apparatus according to the preferred embodiment of the present invention is applied can further include: a first loading portion 110 having a loading space loaded with a semiconductor strip to be subjected to a grinding operation A plurality of magazines 111 are loaded in the loading space; a supply module 120 supplies the semiconductor strips loaded in the cartridges 111 one by one to the grinding device 40 one by one; and an inspection module 130 that checks the end of the grinding operation The accuracy of the semiconductor strip; and a second loading portion 140 that carries the semiconductor strip that is inspected.

Thus, the present invention can provide each apparatus for performing various steps of grinding, washing, drying, inspection, and the like, and a storage tank and a pump for supplying cutting fluid, washing water or vacuum pressure required for each step, etc. .

A display panel that displays an operation state of each device and an operation panel for setting the operation of each device and controlling the operation can be provided on the front surface of the casing 11.

In this way, the present invention is configured as follows: a first loading unit, a drying unit, an inspection module, and a second loading unit are respectively disposed on both sides of the vacuum chuck unit, and the supply module and the first pickup and the second are utilized. The pickup performs the respective steps while sequentially moving the semiconductor strips along a straight line.

Thus, the present invention minimizes the moving distance of the entire process of removing the protective mold layer of the semiconductor strip, thereby improving the work speed and simplifying the internal configuration of the entire apparatus, thereby making it possible to maximize the space utilization.

In the present embodiment, the direction in which the semiconductor strips are sequentially moved along a straight line (X-axis direction) is referred to as "semiconductor strip transport direction".

The cartridge moving robot 112 that moves the cartridge 111 upward or downward can be disposed at the first loading portion 110, thereby moving the cartridge 111 loaded with the semiconductor strip to a predetermined position to load the semiconductor strip loaded on the cartridge 111. The belt is supplied to the side of the grinding device 40.

The inspection module 130 can include: a thickness inspection robot that checks the thickness of the semiconductor strip at the end of the grinding operation; receives the transfer of the semiconductor strip from the end of the grinding operation from the second pickup 30' and brings the semiconductor strip to the second A visual orbit 131 that is transported on the side of the loading unit 140; and a visual robot 132 that performs a visual inspection by capturing a semiconductor strip that is transported along the visual orbit 131.

The loading robot 141 can be disposed at the second loading portion 140, and the loading robot 141 moves the cartridge 111 upward or downward to load a semiconductor strip inside the empty cartridge 111 to which the semiconductor strip that has been completed to the inspection operation is to be loaded, and The loading end of the cartridge 111 is moved toward the loading space.

The vacuum chuck unit 20 functions to cause the semiconductor strip to follow a predetermined direction when the semiconductor strip is fixed and the semiconductor strip is moved to the lower portion of the grinding device 40 to perform a grinding operation, a cleaning operation, and a thickness inspection operation. Move only the predetermined distance.

To this end, the vacuum chuck unit 20 can include a chuck table 21 that forms a vacuum to fix the semiconductor strip in an adsorbed manner, and a Y-axis robot 22 that causes the chuck table 21 to be perpendicular to the transport direction of the semiconductor strip The direction of movement; a vacuum pump connected to the chuck table 21 and forming a vacuum to generate a suction force; and a washing water pump (not shown) that supplies the washing water to the chuck table 21.

The constitution of the grinding apparatus according to the preferred embodiment of the present invention will be described in detail below with reference to FIGS. 3 and 4.

3 is a perspective view of a grinding apparatus according to a preferred embodiment of the present invention, and FIG. 4 is an explanatory view showing a state in which the wheel housing of the grinding apparatus illustrated in FIG. 3 is opened.

The grinding apparatus 40 in accordance with a preferred embodiment of the present invention grinds the upper face of the semiconductor strip 200 to remove the protective molding layer, thereby minimizing the thickness of the semiconductor strip.

To this end, as illustrated in Figures 3 and 4, a grinding apparatus 40 in accordance with a preferred embodiment of the present invention includes: a drive motor; a grinding wheel 41 that grinds the semiconductor strip by rotation of the drive motor; a portion 42 that protects the grinding wheel 41; an X-axis robot 43 and a Z-axis robot 44 (refer to FIG. 2) that move the outer casing portion 42 toward the X-axis direction and the Z-axis direction, respectively; and a support plate 45 that connects the outer casing portions 42 and Z An axis robot 44; and a distance detecting sensor 46 that detects the distance between the grinding wheel 41 and the semiconductor strip.

The grinding wheel 41 can include a driving wheel 411 that rotates in cooperation with a spindle that transmits a driving force of the driving motor, that is, a driving shaft 47, and a grinding portion 412 that is attached to the periphery of the driving wheel 411 to grind the semiconductor strip .

The drive wheel 411 can be made of a light metal material such as aluminum.

The grinding portion 412 has a diameter of approximately 150 mm and a thickness of approximately 20 to 30 mm, and the grinding portion 412 can be disposed in the shape of a roll on the driving wheel 411 The periphery. Such a grinding portion 412 can be manufactured from a material having strength and hardness such as resin diamond or metal diamond.

When the grinding portion 412 is worn, the drive wheel 411 and the grinding portion 412 are integrally replaced or only the grinding portion 412 is replaced, whereby the accuracy of the grinding can be improved and the replacement of the grinding device 40 can be easily achieved.

The grinding device 40 can change the rotational speed of the grinding wheel 41 by the driving force of the drive motor. For example, in the present embodiment, the rotational speed of the grinding wheel 41 is approximately 3,000 rpm on average, and can be performed up to approximately 9,000 rpm.

Further, the grinding device 40 can be applied to a semiconductor strip having a width of, for example, approximately 62 mm/74 mm/95 mm and a length of, for example, approximately 220 mm/240 mm/250 mm, but is not limited thereto. Can be applied to a variety of strip sizes.

The distance detecting sensor 46 can be disposed in the outer casing portion 42 to detect the distance between the grinding wheel 41 and the semiconductor strip.

The distance detecting sensor 46 detects the height of the grinding device 40 when the grinding device 40 is initially installed, when the distance detecting sensor 46 is separated, when the grinding device 40 is replaced, when the chuck table 21 is replaced, and the distance detecting sensor The detection signal of 46 is transmitted to the control unit.

Thereby, the control unit controls the driving of the X-axis robot 43 and the Z-axis robot 44 by the signal detected by the distance detecting sensor 46, so that the protective molding layer of the semiconductor strip can be precisely ground. .

Here, the control unit can be controlled by the grinding device 40 in a state where the accuracy of the grinding is maintained at approximately ±0.01 mm with respect to the Z axis. The grinding operation is performed in the order of grinding.

On the other hand, in the present embodiment, as illustrated in FIG. 4, the outer casing portion 42 may be formed in a configuration that can be opened by pivoting so that the grinding wheel 41 can be easily replaced.

The details are as follows. The outer casing portion 42 can include a wheel housing 421 having a space in which the grinding wheel 41 is disposed, and a lower surface is formed with an opening to protrude the grinding wheel, and a cover 422 that is configured to be capable of opening or closing the front surface of the wheel housing 421. And a motor housing 423 that mates with a rear end portion of the wheel housing 421 and that is internally provided with a drive motor.

The motor housing 423 is formed in a substantially rectangular parallelepiped shape, and a space in which a drive motor is provided is formed inside, and can be engaged with the support plate 45 by a support member. A distance detecting sensor 46 can be disposed on one side of the motor housing 423.

The wheel housing 421 can include a first housing 424 and a second housing 425 that are split left and right to allow one side to pivot while being replaced when the grinding wheel 41 is replaced, and when mated Form a rectangular parallelepiped shape.

The first outer casing 424 forms a left side portion and a rear surface portion of the wheel housing 421, and the second outer casing 425 forms a right side portion of the wheel housing 421, and a space in which the grinding wheel 41 is disposed can be formed at a central portion of the first outer casing 424 and the second outer casing 425. As for the second outer casing 425, the upper left end portion thereof pivotally engages with the rear plate of the first outer casing 424 to perform a pivotal movement so as to be openable.

On the inner side of the lower end portions of the first outer casing 424 and the second outer casing 425, nozzles for jetting the cutting fluid to the grinding wheel 41 during the grinding operation can be provided. 48.

Here, each of the nozzles 48 can be disposed to be inclined only by a predetermined angle so as to eject the cutting fluid toward the lower end portion of the grinding wheel 41.

Further, a supply pipe for supplying cutting fluid can be connected to one side, for example, the right side of the second outer casing 425, and a pair of injection pipes 481 can be provided at the other lower side of the second outer casing 425, for example, the lower left end, and the pair of injection pipes 481 are provided with grinding wheels 41. The center is separated by a predetermined distance on the front and rear sides.

The pair of injection pipes 481 function to eject the cutting fluid on the front side and the rear side of the grinding wheel, respectively, and a plurality of injection holes 482 can be formed at a predetermined pitch on the lower surfaces of the pair of injection pipes 481.

As described above, according to the present invention, the nozzles are provided on both sides of the grinding wheel, and the injection pipes are provided on the front and rear sides, so that the cutting fluid can be ejected from the front, rear, left and right side faces toward the grinding wheel and the grinding surface of the semiconductor strip.

Therefore, the present invention efficiently discharges the cutting fluid by spraying the cutting fluid to the grinding surface of the grinding wheel and the semiconductor strip, thereby reducing the wear of the grinding wheel during the grinding operation, and cooling the grinding wheel, thereby prolonging the service life of the grinding wheel and improving the life of the grinding wheel. Grinding accuracy.

On the other hand, the wheel housing 421 can be provided with a locking unit 60 that locks in such a manner as to prevent the drive shaft 47 from rotating.

The locking unit 60 can include: a locking plate 61 disposed on the back panel of the first housing 424; and a fixing plate 62 that fixes the locking plate 61 to the first housing 424 in a horizontally movable manner.

The lock plate 61 functions to lock the drive shaft 47 when the replacement work of the grinding wheel 41 is performed.

For example, FIGS. 5 and 6 are operational state diagrams of the lock plate.

FIG. 5 illustrates a state in which the locking of the drive shaft is released, and FIG. 6 illustrates a state in which the lock plate is moved to lock the drive shaft.

In order to replace the grinding wheel 41, the fixed cover 471 to be engaged with the front end of the drive shaft 47 is separated, and the drive shaft 47 is freely rotated when the drive motor is not driven.

Here, a fixing protrusion 472 is provided at the front end portion of the drive shaft 47, and planes parallel to each other are formed at the upper end and the lower end of the fixing protrusion 472.

Therefore, the operator has to rotate the fixed cover 471 with the other hand in a state where the drive shaft 47 is fixed by one hand with a wrench, and the separation work of the fixed cover 471 is a very inconvenient and difficult. operation.

In order to solve such a problem, in the present embodiment, the lock plate 61 is formed in a substantially rectangular plate shape, and a fitting hole 63 is formed in a central portion of the lock plate 61, and the fitting hole 63 is formed in a circular shape to be in cross section with the drive shaft 47. Correspondingly, a fixing hole 64 can be formed on one side of the fitting hole 63 so as to communicate with the fitting hole 63, and the fixing hole 64 has a straight portion at the upper end and the lower end so as to correspond to the cross-sectional shape of the fixing protrusion 472.

Therefore, as illustrated in FIG. 5, the lock plate 61 is disposed on the left side in the case where the grinding device 40 is normally used so that the fitting hole 63 is located at the fixing protrusion 472.

As illustrated in Fig. 6, in the case where the grinding wheel 41 is replaced, if the lock plate 61 is moved toward the right side, the fixing hole 64 is located at the fixing protrusion 472, thereby locking the drive shaft 47 against rotation.

An extension portion 65 can be formed on both sides of such a locking plate 61, and The front end of the extending portion 65 formed on one side, for example, the right side, can be bent toward the front to form the dam 66.

The cardan 66 functions as a handle for moving the lock plate 61 to lock the drive shaft 47 when the grinding wheel 41 is replaced, and is locked to the second outer casing 425 during the assembly of the first outer casing 424 and the second outer casing 425 after the replacement of the grinding wheel 41. The inner surface is such that the locked state of the lock plate 61 with respect to the drive shaft 47 can be completely released.

A moving space is formed inside the fixing plate 62 so that the locking plate 61 can be moved in the horizontal direction, and an insertion groove into which the card 66 of the locking plate 61 is inserted can be formed at the right end of the fixing plate 62.

Also, a detecting unit 70 that detects the fitted state of the second outer casing 425 can be provided on the back panel of the first outer casing 424.

The detecting unit 70 can include a detecting switch that detects the cooperation of the first housing 424 and the second housing 425 and outputs an ON or OFF signal.

Therefore, the control unit judges the mating state of the first outer casing 424 and the second outer casing 425 based on the signal output from the detecting unit 70, and can drive the motor only in a state in which the first outer casing 424 and the second outer casing 425 are fully engaged. The motor is driven in a way that is controlled.

As such, in the present invention, since the drive shaft is locked by the lock plate, the fixed cover and the grinding wheel can be easily separated and replaced.

Moreover, the present invention can prevent the drive motor from being in the first outer casing and the second outer casing by forming a hook on the lock plate and providing a detecting switch for detecting the mating state of the first outer casing and the second outer casing on the wheel casing side. Damage or failure of the drive shaft caused by driving in a fully mated state.

According to the above-described process, the present invention provides the nozzle and the injection pipe on the front, rear, left and right sides of the grinding wheel, so that the cutting fluid can be sprayed as a whole toward the grinding wheel and the grinding surface of the semiconductor strip.

The invention made by the inventors of the present invention has been described in detail above. The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the invention.

In the above embodiment, the description has been made on the case where the nozzles are provided on both sides of the wheel casing and the injection pipes are provided on the front and rear sides of the grinding wheel, but the present invention is not necessarily limited thereto.

That is, the present invention can also variously change the arrangement positions of the nozzles and the injection pipes, for example, it is possible to provide nozzles only on one side or both sides of the wheel housing or to provide the injection pipes only on the front side or the rear side of the grinding wheel.

Industrial utilization

The present invention is applicable to a semiconductor strip mill technique in which a mold layer of an upper portion of a unit substrate of a semiconductor strip is ground and removed.

40‧‧‧ grinding device

42‧‧‧ Shell

45‧‧‧Support board

46‧‧‧ Distance detection sensor

70‧‧‧Detection unit

421‧‧‧ wheel housing

422‧‧ hood

423‧‧‧Motor housing

424‧‧‧ first casing

425‧‧‧ second casing

Claims (10)

A grinding device comprising: a drive motor; a grinding wheel that grinds the semiconductor strip by rotation of the drive motor; and an outer casing portion that protects the grinding wheel; the outer casing portion pivots one side when the grinding wheel is replaced It can be formed in an open manner. The grinding apparatus according to claim 1, further comprising: an X-axis robot and a Z-axis robot that move the outer casing portion toward the X-axis and the Z-axis direction, respectively; and a support plate that connects the outer casing portion and the Z-axis a robot; and a distance detecting sensor that detects a distance between the grinding wheel and the semiconductor strip. The grinding device according to claim 2, wherein the outer casing portion includes: a wheel housing having a space in which the grinding wheel is disposed, and an opening portion is formed on the lower surface to protrude the grinding wheel; and the cover is openable or Closing a front surface of the wheel housing; and a motor housing that mates with a rear end portion of the wheel housing and has a drive motor disposed therein; the wheel housing includes a first housing and a second housing, the first housing and the The second outer casing is divided to the left and right so as to be pivotable when the grinding wheel is replaced, and can be opened, and formed into a rectangular parallelepiped shape when mated shape. The grinding apparatus according to claim 3, wherein a nozzle for ejecting the cutting fluid to the grinding wheel during the grinding operation is provided on each of the inner side of the lower end portion of the first outer casing and the second outer casing. The grinding apparatus according to claim 4, wherein a supply pipe for supplying cutting fluid is connected to the second casing; and a pair of injection pipes are provided at a lower end of the second casing, the pair of injection pipes being centered on the grinding wheel The sides are separated by a predetermined distance; a plurality of injection holes for jetting the cutting fluid are formed in the pair of injection pipes, respectively. The grinding apparatus according to claim 3, further comprising a locking unit disposed on the wheel housing and locking in a manner of preventing rotation of a driving shaft provided to the driving motor; the locking unit comprising: a locking plate of the back panel of the first housing; and a fixing plate for fixing the locking panel to the first housing in a horizontally movable manner. The grinding device according to claim 6, wherein a fitting hole is formed in a central portion of the lock plate, the fitting hole being formed in a circular shape to correspond to a cross section of the drive shaft; A fixing hole is formed in a manner of communicating with the hole, and the fixing hole has a straight portion at the upper end and the lower end to correspond to a cross-sectional shape of the fixing protrusion formed at the upper end and the lower end with a plane parallel to each other, the fixing protrusion being disposed on the driving shaft Front end. The grinding device of claim 7, wherein an extension portion is formed on each side of the locking plate; A buckle is formed at a front end of the extending portion, and the yoke is locked to an inner side surface of the second outer casing when the first outer casing and the second outer casing are engaged to move the locking plate to a predetermined initial position. The grinding apparatus according to claim 3, wherein the first casing is provided with a detecting unit that detects a fitting state of the first casing and the second casing; and a control unit that controls driving of the grinding device, based on the detecting The detection result of the unit is controlled in such a manner that the drive motor is driven only in a state in which the first outer casing and the second outer casing are fully engaged. A semiconductor strip grinding machine to which a grinding apparatus is applied, comprising: a grinding apparatus having the constitution as recited in any one of claims 1 to 9, and grinding the protective molding layer of the semiconductor strip to remove a vacuum chuck unit that fixes and cleans the semiconductor strip; a first picker that sequentially loads the semiconductor strip to the vacuum chuck unit; a drying unit that will grind the semiconductor strip by the grinding device The belt is dried; and a second picker that loads the semiconductor strip that is ground at the grinding device into the drying unit.