TW201614188A - Method for controlling a distance between two objects, inspection apparatus and method - Google Patents

Method for controlling a distance between two objects, inspection apparatus and method

Info

Publication number
TW201614188A
TW201614188A TW104128216A TW104128216A TW201614188A TW 201614188 A TW201614188 A TW 201614188A TW 104128216 A TW104128216 A TW 104128216A TW 104128216 A TW104128216 A TW 104128216A TW 201614188 A TW201614188 A TW 201614188A
Authority
TW
Taiwan
Prior art keywords
distance
metrology target
sil
radiation
controlling
Prior art date
Application number
TW104128216A
Other languages
English (en)
Other versions
TWI588442B (zh
Inventor
Nitesh Pandey
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW201614188A publication Critical patent/TW201614188A/zh
Application granted granted Critical
Publication of TWI588442B publication Critical patent/TWI588442B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703—Gap setting, e.g. in proximity printer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW104128216A 2014-08-29 2015-08-27 用於控制兩物件間之距離之方法與檢測裝置及方法 TWI588442B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP14182858 2014-08-29

Publications (2)

Publication Number Publication Date
TW201614188A true TW201614188A (en) 2016-04-16
TWI588442B TWI588442B (zh) 2017-06-21

Family

ID=51429107

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104128216A TWI588442B (zh) 2014-08-29 2015-08-27 用於控制兩物件間之距離之方法與檢測裝置及方法

Country Status (3)

Country Link
US (1) US9982991B2 (zh)
TW (1) TWI588442B (zh)
WO (1) WO2016030227A1 (zh)

Cited By (4)

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CN107367524A (zh) * 2017-08-28 2017-11-21 桂林电子科技大学 一种近场热辐射实验测量装置
US10310389B2 (en) 2017-04-14 2019-06-04 Asml Netherlands B.V. Method of measuring, device manufacturing method, metrology apparatus, and lithographic system
US10352694B2 (en) 2017-04-18 2019-07-16 Industrial Technology Research Institute Contactless dual-plane positioning method and device
TWI683086B (zh) * 2017-06-21 2020-01-21 荷蘭商Ａｓｍｌ荷蘭公司 用於偵測基板表面變化的方法及裝置

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EP3221897A1 (en) 2014-09-08 2017-09-27 The Research Foundation Of State University Of New York Metallic gratings and measurement methods thereof
US9927722B2 (en) 2015-02-25 2018-03-27 Asml Netherlands B.V. Method and apparatus for inspection and metrology
NL2017505A (en) * 2015-10-09 2017-04-11 Asml Netherlands Bv Method and apparatus for inspection and metrology
US11243470B2 (en) 2016-09-12 2022-02-08 Asml Netherlands B.V. Method and apparatus for deriving corrections, method and apparatus for determining a property of a structure, device manufacturing method
KR102323045B1 (ko) 2016-09-12 2021-11-08 에이에스엠엘 네델란즈 비.브이. 구조체의 속성 결정 방법, 검사 장치 및 디바이스 제조 방법
TWI634391B (zh) * 2017-06-23 2018-09-01 台灣積體電路製造股份有限公司 噴嘴模組、微影裝置及其操作方法
US10508971B2 (en) * 2017-09-07 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Optical test system and method for determining size of gap between two substrates of optical element
CN108362228B (zh) * 2018-02-11 2020-10-30 西安知象光电科技有限公司 一种基于双光机的光刀光栅混合式三维测量装置及测量方法
CN114556223A (zh) * 2019-10-14 2022-05-27 Asml控股股份有限公司 量测标记结构和确定量测标记结构的方法
CN112880617A (zh) * 2021-01-12 2021-06-01 西北工业大学 一种基于谱估计的自由间隙实时监测方法
WO2023285322A1 (en) * 2021-07-16 2023-01-19 Asml Netherlands B.V. Metrology method and apparatus

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10310389B2 (en) 2017-04-14 2019-06-04 Asml Netherlands B.V. Method of measuring, device manufacturing method, metrology apparatus, and lithographic system
TWI663486B (zh) * 2017-04-14 2019-06-21 荷蘭商Ａｓｍｌ荷蘭公司 量測方法、器件製造方法、度量衡設備及微影系統
TWI693483B (zh) * 2017-04-14 2020-05-11 荷蘭商Ａｓｍｌ荷蘭公司 用於量測形成於基板上之結構的方法
US10656534B2 (en) 2017-04-14 2020-05-19 Asml Netherlands B.V. Method of measuring, device manufacturing method, metrology apparatus, and lithographic system
US10352694B2 (en) 2017-04-18 2019-07-16 Industrial Technology Research Institute Contactless dual-plane positioning method and device
TWI683086B (zh) * 2017-06-21 2020-01-21 荷蘭商Ａｓｍｌ荷蘭公司 用於偵測基板表面變化的方法及裝置
US11092902B2 (en) 2017-06-21 2021-08-17 Asml Netherlands B.V. Method and apparatus for detecting substrate surface variations
CN107367524A (zh) * 2017-08-28 2017-11-21 桂林电子科技大学 一种近场热辐射实验测量装置

Also Published As

Publication number Publication date
TWI588442B (zh) 2017-06-21
US9982991B2 (en) 2018-05-29
US20160061590A1 (en) 2016-03-03
WO2016030227A1 (en) 2016-03-03

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