TW201614035A - Method for manufacturing polishing composition - Google Patents
Method for manufacturing polishing compositionInfo
- Publication number
- TW201614035A TW201614035A TW104127504A TW104127504A TW201614035A TW 201614035 A TW201614035 A TW 201614035A TW 104127504 A TW104127504 A TW 104127504A TW 104127504 A TW104127504 A TW 104127504A TW 201614035 A TW201614035 A TW 201614035A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing composition
- undiluted
- water
- manufacturing
- composition solution
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 9
- 238000005498 polishing Methods 0.000 title abstract 9
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 239000000243 solution Substances 0.000 abstract 6
- 229920003169 water-soluble polymer Polymers 0.000 abstract 3
- 239000006061 abrasive grain Substances 0.000 abstract 2
- 150000007514 bases Chemical class 0.000 abstract 1
- 238000007865 diluting Methods 0.000 abstract 1
- 239000012895 dilution Substances 0.000 abstract 1
- 238000010790 dilution Methods 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014179162A JP6562605B2 (ja) | 2014-09-03 | 2014-09-03 | 研磨用組成物の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201614035A true TW201614035A (en) | 2016-04-16 |
Family
ID=55439341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104127504A TW201614035A (en) | 2014-09-03 | 2015-08-24 | Method for manufacturing polishing composition |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6562605B2 (ja) |
| TW (1) | TW201614035A (ja) |
| WO (1) | WO2016035250A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6960328B2 (ja) * | 2016-12-26 | 2021-11-05 | ニッタ・デュポン株式会社 | 研磨用組成物 |
| JP6951933B2 (ja) * | 2017-10-10 | 2021-10-20 | 花王株式会社 | シリコンウェーハ用仕上げ研磨液組成物 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006352043A (ja) * | 2005-06-20 | 2006-12-28 | Nitta Haas Inc | 半導体研磨用組成物 |
| JP2009231486A (ja) * | 2008-03-21 | 2009-10-08 | Kao Corp | シリコンウエハ用研磨液組成物 |
| JP5822356B2 (ja) * | 2012-04-17 | 2015-11-24 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| JP5995659B2 (ja) * | 2012-10-30 | 2016-09-21 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| JP2013034026A (ja) * | 2012-11-14 | 2013-02-14 | Fujimi Inc | 研磨用組成物及びそれを用いた半導体ウエハの製造方法 |
| JP6039419B2 (ja) * | 2012-12-28 | 2016-12-07 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
-
2014
- 2014-09-03 JP JP2014179162A patent/JP6562605B2/ja active Active
-
2015
- 2015-07-29 WO PCT/JP2015/003830 patent/WO2016035250A1/ja active Application Filing
- 2015-08-24 TW TW104127504A patent/TW201614035A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016035250A1 (ja) | 2016-03-10 |
| JP6562605B2 (ja) | 2019-08-21 |
| JP2016053114A (ja) | 2016-04-14 |
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