TW201612666A - Circuit module pick-and-place apparatus of mouse - Google Patents
Circuit module pick-and-place apparatus of mouseInfo
- Publication number
- TW201612666A TW201612666A TW103132114A TW103132114A TW201612666A TW 201612666 A TW201612666 A TW 201612666A TW 103132114 A TW103132114 A TW 103132114A TW 103132114 A TW103132114 A TW 103132114A TW 201612666 A TW201612666 A TW 201612666A
- Authority
- TW
- Taiwan
- Prior art keywords
- mouse
- circuit module
- pick
- wiring
- contouring
- Prior art date
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Position Input By Displaying (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
A circuit module pick-and-place apparatus of mouse, which is used to pick a circuit module comprising the circuit board and wire from a circuit module supply device of mouse, and assembling obtained circuit module within the mouse. It includes: a substrate, a master driver, a contouring clamp, a circuit board picker, and a wiring gripper; the contouring clamp, circuit board picker, and wiring gripper are mounted on substrate. The master driver and the substrate are connected for driving substrate to be moved to a transport height and a pick-and-place height. The contouring clamp with pick and place height, circuit board picker, and wiring gripper can perform pick-up and assembly operation of circuit module, wherein contouring clamp can further contour one section of internal wiring as a shape same as that of wiring path within the mouse. After molding, internal wiring is accurately assembled in predetermined wiring path inside the mouse.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103132114A TWI537694B (en) | 2014-09-17 | 2014-09-17 | Mouse circuit module pick and place device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103132114A TWI537694B (en) | 2014-09-17 | 2014-09-17 | Mouse circuit module pick and place device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201612666A true TW201612666A (en) | 2016-04-01 |
TWI537694B TWI537694B (en) | 2016-06-11 |
Family
ID=56360862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103132114A TWI537694B (en) | 2014-09-17 | 2014-09-17 | Mouse circuit module pick and place device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI537694B (en) |
-
2014
- 2014-09-17 TW TW103132114A patent/TWI537694B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI537694B (en) | 2016-06-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |