TW201612449A - LED headlight heat dissipation device - Google Patents

LED headlight heat dissipation device

Info

Publication number
TW201612449A
TW201612449A TW103132583A TW103132583A TW201612449A TW 201612449 A TW201612449 A TW 201612449A TW 103132583 A TW103132583 A TW 103132583A TW 103132583 A TW103132583 A TW 103132583A TW 201612449 A TW201612449 A TW 201612449A
Authority
TW
Taiwan
Prior art keywords
heat
casing
air
conducting unit
shaped
Prior art date
Application number
TW103132583A
Other languages
Chinese (zh)
Other versions
TWI579496B (en
Inventor
Ming-Hsien Tsai
Sen-Yung Lee
Han-Tao Chen
Original Assignee
Ming-Hsien Tsai
Sen-Yung Lee
Chen Han Taw
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ming-Hsien Tsai, Sen-Yung Lee, Chen Han Taw filed Critical Ming-Hsien Tsai
Priority to TW103132583A priority Critical patent/TWI579496B/en
Publication of TW201612449A publication Critical patent/TW201612449A/en
Application granted granted Critical
Publication of TWI579496B publication Critical patent/TWI579496B/en

Links

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The LED headlight heat dissipation device includes at least one metal-made heat-conducting unit mounted to at least one hole in the casing of the headlight. The at least one heat-conducting unit has a higher heat transfer coefficient than that of the casing. The at least one heat-conducting unit is in a form a plane, or is engaged with a hole, and has different shapes such as cup-shaped, rack-shaped, board-shaped or fin-shaped to increase the contact area between the casing and air in the headlight and the source of heat, so that the heat is brought out from the casing. The at least one heat-conducting unit is directly connected to the source of heat of the LEDs by an extension portion to directly transfer the heat of the source of heat to the at least one heat-conducting unit. A water-proof and air-permeable unit is mounted to openings of the at least one heat-conducting unit so that the air is permeable through the water-proof and air-permeable unit while water cannot enters into the casing. If the casing has holes in the top and the bottom, the hot air escapes from the holes in the top and the cold air is introduced form the holes in the bottom of the casing.
TW103132583A 2014-09-22 2014-09-22 Led headlight heat dissipation device TWI579496B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103132583A TWI579496B (en) 2014-09-22 2014-09-22 Led headlight heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103132583A TWI579496B (en) 2014-09-22 2014-09-22 Led headlight heat dissipation device

Publications (2)

Publication Number Publication Date
TW201612449A true TW201612449A (en) 2016-04-01
TWI579496B TWI579496B (en) 2017-04-21

Family

ID=56360811

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103132583A TWI579496B (en) 2014-09-22 2014-09-22 Led headlight heat dissipation device

Country Status (1)

Country Link
TW (1) TWI579496B (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3023762B2 (en) * 1994-11-28 2000-03-21 株式会社小糸製作所 Automotive lamp socket cover
TW200911607A (en) * 2007-09-12 2009-03-16 Kwang Yang Motor Co Heat dissipation structure for main front light of motorcycle
CN201611060U (en) * 2009-12-31 2010-10-20 光阳工业股份有限公司 Automobile lamp provided with heat dissipation device
CN203744084U (en) * 2014-03-21 2014-07-30 光阳工业股份有限公司 Vehicle lamp with waterproof and heat dissipation function

Also Published As

Publication number Publication date
TWI579496B (en) 2017-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees