TW201611990A - Method of manufacturing plastic card capable forming surface embossment - Google Patents

Method of manufacturing plastic card capable forming surface embossment

Info

Publication number
TW201611990A
TW201611990A TW103133882A TW103133882A TW201611990A TW 201611990 A TW201611990 A TW 201611990A TW 103133882 A TW103133882 A TW 103133882A TW 103133882 A TW103133882 A TW 103133882A TW 201611990 A TW201611990 A TW 201611990A
Authority
TW
Taiwan
Prior art keywords
embossment
top surface
layer
protection film
film
Prior art date
Application number
TW103133882A
Other languages
Chinese (zh)
Inventor
cheng-yi Ye
Original Assignee
Olive Trading Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olive Trading Co Ltd filed Critical Olive Trading Co Ltd
Priority to TW103133882A priority Critical patent/TW201611990A/en
Publication of TW201611990A publication Critical patent/TW201611990A/en

Links

Landscapes

  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

The present invention provides a method of manufacturing plastic card capable of forming surface embossment, including the steps of: using a first plasticized material (e.g., PVC material) to make a blank sheet and using the blank sheet as a middle material layer; printing customer-needed patterns and texts on the top surface of the middle material layer for form an ink layer; positioning a grain-making layer, which is composed of a transparent protection film and an embossing film, onto the top surface of the ink layer, wherein the transparent protection film is made of the first plasticized material and the embossing film is made of a second plasticized material (e.g., polyethylene terephthalate); performing hot pressing on the top surface of the grain-making layer to gradually melt the transparent protection film with lower heat resistance of the grain-making layer, wherein the transparent protection film is further deformed to fill the grain grooves at the bottom surface of the embossing film with higher heat resistance and is then laminated to a top surface of the ink layer; and finally, peeling off the embossing film after cooling to form corresponding embossment on the top surface of the protection film, thereby manufacturing a plastic card with surface embossment. Therefore, compared to a conventional method of making surfaces embossment by mold, the method of manufacturing plastic cards of this invention is more convenient that the manufacturer needs only to change embossing films with new grains during the manufacturing process, to change the configuration of the embossment in an easy and swift way without the need of spending extra time and money for making new molds, thereby effectively reducing manufacturing costs and enhancing working efficiency.
TW103133882A 2014-09-30 2014-09-30 Method of manufacturing plastic card capable forming surface embossment TW201611990A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103133882A TW201611990A (en) 2014-09-30 2014-09-30 Method of manufacturing plastic card capable forming surface embossment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103133882A TW201611990A (en) 2014-09-30 2014-09-30 Method of manufacturing plastic card capable forming surface embossment

Publications (1)

Publication Number Publication Date
TW201611990A true TW201611990A (en) 2016-04-01

Family

ID=56360710

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103133882A TW201611990A (en) 2014-09-30 2014-09-30 Method of manufacturing plastic card capable forming surface embossment

Country Status (1)

Country Link
TW (1) TW201611990A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810414B (en) * 2018-12-03 2023-08-01 日商Jx金屬股份有限公司 Corrosion Resistant CuZn Alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810414B (en) * 2018-12-03 2023-08-01 日商Jx金屬股份有限公司 Corrosion Resistant CuZn Alloy

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